(kicad_pcb
	(version 20240108)
	(generator "pcbnew")
	(generator_version "8.0")
	(general
		(thickness 1.6062)
		(legacy_teardrops no)
	)
	(paper "A4")
	(layers
		(0 "F.Cu" signal)
		(1 "In1.Cu" signal)
		(2 "In2.Cu" signal)
		(31 "B.Cu" signal)
		(32 "B.Adhes" user "B.Adhesive")
		(33 "F.Adhes" user "F.Adhesive")
		(34 "B.Paste" user)
		(35 "F.Paste" user)
		(36 "B.SilkS" user "B.Silkscreen")
		(37 "F.SilkS" user "F.Silkscreen")
		(38 "B.Mask" user)
		(39 "F.Mask" user)
		(40 "Dwgs.User" user "User.Drawings")
		(41 "Cmts.User" user "User.Comments")
		(42 "Eco1.User" user "User.Eco1")
		(43 "Eco2.User" user "User.Eco2")
		(44 "Edge.Cuts" user)
		(45 "Margin" user)
		(46 "B.CrtYd" user "B.Courtyard")
		(47 "F.CrtYd" user "F.Courtyard")
		(48 "B.Fab" user)
		(49 "F.Fab" user)
		(50 "User.1" user)
		(51 "User.2" user)
		(52 "User.3" user)
		(53 "User.4" user)
		(54 "User.5" user)
		(55 "User.6" user)
		(56 "User.7" user)
		(57 "User.8" user)
		(58 "User.9" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
				(color "White")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(color "Green")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 1"
				(type "prepreg")
				(thickness 0.2104)
				(material "FR4")
				(epsilon_r 4.4)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.0152)
			)
			(layer "dielectric 2"
				(type "core")
				(thickness 1.065)
				(material "FR4")
				(epsilon_r 4.6)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.0152)
			)
			(layer "dielectric 3"
				(type "prepreg")
				(thickness 0.2104)
				(material "FR4")
				(epsilon_r 4.4)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(color "Green")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
				(color "White")
			)
			(copper_finish "None")
			(dielectric_constraints yes)
		)
		(pad_to_mask_clearance 0)
		(solder_mask_min_width 0.13)
		(allow_soldermask_bridges_in_footprints no)
		(pcbplotparams
			(layerselection 0x00010fc_ffffffff)
			(plot_on_all_layers_selection 0x0000000_00000000)
			(disableapertmacros no)
			(usegerberextensions yes)
			(usegerberattributes yes)
			(usegerberadvancedattributes yes)
			(creategerberjobfile no)
			(dashed_line_dash_ratio 12.000000)
			(dashed_line_gap_ratio 3.000000)
			(svgprecision 4)
			(plotframeref no)
			(viasonmask no)
			(mode 1)
			(useauxorigin no)
			(hpglpennumber 1)
			(hpglpenspeed 20)
			(hpglpendiameter 15.000000)
			(pdf_front_fp_property_popups yes)
			(pdf_back_fp_property_popups yes)
			(dxfpolygonmode yes)
			(dxfimperialunits yes)
			(dxfusepcbnewfont yes)
			(psnegative no)
			(psa4output no)
			(plotreference yes)
			(plotvalue no)
			(plotfptext yes)
			(plotinvisibletext no)
			(sketchpadsonfab no)
			(subtractmaskfromsilk yes)
			(outputformat 1)
			(mirror no)
			(drillshape 0)
			(scaleselection 1)
			(outputdirectory "Outputs/Gerbers/")
		)
	)
	(net 0 "")
	(net 1 "/VCOM")
	(net 2 "GND")
	(net 3 "/VCCP1I")
	(net 4 "/VCCP2I")
	(net 5 "/VCCXI")
	(net 6 "VDDI")
	(net 7 "3V7")
	(net 8 "VBUS")
	(net 9 "/XTO")
	(net 10 "/XTI")
	(net 11 "CGND")
	(net 12 "/CONN_D-")
	(net 13 "/CONN_D+")
	(net 14 "VUSB_CONN")
	(net 15 "/HID1")
	(net 16 "/HID2")
	(net 17 "/HID0")
	(net 18 "/VOUTR")
	(net 19 "/~{SSPND}")
	(net 20 "/VOUTL")
	(net 21 "/USB_D+")
	(net 22 "/USB_D-")
	(net 23 "/VINR")
	(net 24 "/VINL")
	(net 25 "/ADJ")
	(net 26 "unconnected-(U1-DOUT-Pad25)")
	(net 27 "unconnected-(U1-DIN-Pad24)")
	(footprint "TestPoint:TestPoint_Pad_D1.0mm"
		(layer "F.Cu")
		(uuid "0bb80af8-d232-49e7-aaec-2d4f752aae37")
		(at 85.775 94.275)
		(descr "SMD pad as test Point, diameter 1.0mm")
		(tags "test point SMD pad")
		(property "Reference" "TP2"
			(at 0 -1.448 0)
			(layer "F.SilkS")
			(hide yes)
			(uuid "bec91c6c-54d8-4ff6-8bea-2ef39d980cbb")
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		(property "Footprint" "TestPoint:TestPoint_Pad_D1.0mm"
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			(unlocked yes)
			(layer "F.Fab")
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		(fp_text user "${REFERENCE}"
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			(layers "F.Cu" "F.Mask")
			(net 8 "VBUS")
			(pinfunction "1")
			(pintype "passive")
			(uuid "0bb398cb-0286-4e67-9b9b-b014fa4dae3d")
		)
	)
	(footprint "Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder"
		(layer "F.Cu")
		(uuid "18f90333-cbad-4b8d-a5b3-0601807f7656")
		(at 97.135 83.705)
		(descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "R2"
			(at 0 -1.17 0)
			(layer "F.SilkS")
			(hide yes)
			(uuid "93867b14-b59b-4f84-a1e7-2a33d339a9ea")
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		(property "Description" "Resistor, US symbol"
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			(layers "F.Cu" "F.Paste" "F.Mask")
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			)
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			)
		)
	)
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