(kicad_pcb (version 20171130) (host pcbnew "(5.1.6-rc1)") (general (thickness 1.6) (drawings 231) (tracks 25926) (zones 0) (modules 931) (nets 1127) ) (page A3) (title_block (comment 1 "Michał Gąska & Larry Doolittle") (comment 3 "Marble Dual FMC Carrier") ) (layers (0 F.Cu signal) (1 In1.Cu power hide) (2 In2.Cu signal) (3 In3.Cu power hide) (4 In4.Cu signal hide) (5 In5.Cu signal) (6 In6.Cu power hide) (31 B.Cu signal) (32 B.Adhes user hide) (33 F.Adhes user hide) (34 B.Paste user hide) (35 F.Paste user hide) (36 B.SilkS user) (37 F.SilkS user) (38 B.Mask user hide) (39 F.Mask user hide) (40 Dwgs.User user) (41 Cmts.User user) (42 Eco1.User user) (43 Eco2.User user) (44 Edge.Cuts user) (45 Margin user) (46 B.CrtYd user) (47 F.CrtYd user) (48 B.Fab user hide) (49 F.Fab user hide) ) (setup (last_trace_width 0.102) (user_trace_width 0.118) (user_trace_width 0.127) (user_trace_width 0.13) (user_trace_width 0.15) (user_trace_width 0.178) (user_trace_width 0.254) (user_trace_width 0.4) (user_trace_width 0.6) (trace_clearance 0.102) (zone_clearance 0.12) (zone_45_only no) (trace_min 0.1) (via_size 0.35) (via_drill 0.152) (via_min_size 0.35) (via_min_drill 0.152) (user_via 0.35 0.152) (user_via 0.35 0.152) (user_via 0.6 0.35) (uvia_size 0.508) (uvia_drill 0.127) (uvias_allowed no) (uvia_min_size 0.35) (uvia_min_drill 0.127) (edge_width 0.1) (segment_width 0.1) (pcb_text_width 0.3) (pcb_text_size 1.5 1.5) (mod_edge_width 0.15) (mod_text_size 0.5 0.5) (mod_text_width 0.1) (pad_size 5 5) (pad_drill 2.7) (pad_to_mask_clearance 0) (solder_mask_min_width 0.25) (aux_axis_origin 0 0) (visible_elements 7FFFFF7F) (pcbplotparams (layerselection 0x010fc_ffffffff) (usegerberextensions false) (usegerberattributes false) (usegerberadvancedattributes false) (creategerberjobfile false) (excludeedgelayer true) (linewidth 0.100000) (plotframeref false) (viasonmask false) (mode 1) (useauxorigin false) (hpglpennumber 1) (hpglpenspeed 20) (hpglpendiameter 15.000000) (psnegative false) (psa4output false) (plotreference true) (plotvalue true) (plotinvisibletext false) (padsonsilk false) (subtractmaskfromsilk false) (outputformat 1) (mirror false) (drillshape 0) (scaleselection 1) (outputdirectory "./PCB_layers")) ) (net 0 "") (net 1 GND) (net 2 +12V) (net 3 +3V3) (net 4 /FMC_2/FMC2_3P3VAUX) (net 5 +2V5) (net 6 +1V35) (net 7 "Net-(C30-Pad2)") (net 8 "Net-(C33-Pad2)") (net 9 /FPGA/FPGA_15_16/HDMI_5V) (net 10 "Net-(C38-Pad1)") (net 11 "Net-(C42-Pad2)") (net 12 +1V8) (net 13 "Net-(C47-Pad2)") (net 14 +1V0) (net 15 "Net-(C58-Pad1)") (net 16 "Net-(C59-Pad1)") (net 17 "Net-(C60-Pad1)") (net 18 /FMC_1/FMC1_3P3VAUX) (net 19 "Net-(C72-Pad2)") (net 20 "Net-(C75-Pad2)") (net 21 "Net-(C84-Pad2)") (net 22 "Net-(C87-Pad2)") (net 23 "Net-(C102-Pad1)") (net 24 "Net-(C93-Pad1)") (net 25 "Net-(C100-Pad1)") (net 26 "Net-(C101-Pad1)") (net 27 /ETH_PHY/CLK_25MHZ) (net 28 /WhiteRabbit/WR_DAC_OUT2) (net 29 /WhiteRabbit/WR_DAC_OUT1) (net 30 "Net-(C127-Pad1)") (net 31 "Net-(C128-Pad1)") (net 32 "Net-(C129-Pad1)") (net 33 "Net-(C132-Pad1)") (net 34 "Net-(C134-Pad2)") (net 35 "Net-(C135-Pad2)") (net 36 "Net-(C138-Pad2)") (net 37 /Power/Power_SW/PSS_XRP_LX1) (net 38 /Power/Power_SW/PSS_XRP_BST1) (net 39 /Power/Power_SW/PSS_XRP_LX2) (net 40 /Power/Power_SW/PSS_XRP_BST2) (net 41 /Power/Power_SW/PSS_XRP_LX3) (net 42 /Power/Power_SW/PSS_XRP_BST3) (net 43 /Power/Power_SW/PSS_XRP_LX4) (net 44 /Power/Power_SW/PSS_XRP_BST4) (net 45 /Power/Power_SW/XR77129ILB_F_VOUT1) (net 46 /Power/Power_SW/XR77129ILB_F_VOUT2) (net 47 /Power/Power_SW/XR77129ILB_F_VOUT3) (net 48 /Power/Power_SW/XR77129ILB_F_VOUT4) (net 49 "Net-(C162-Pad1)") (net 50 "Net-(C165-Pad1)") (net 51 "Net-(C167-Pad1)") (net 52 "Net-(C168-Pad1)") (net 53 "Net-(C171-Pad1)") (net 54 "Net-(C188-Pad2)") (net 55 /FPGA/DXP_0) (net 56 /EN_CON_JTAG) (net 57 "Net-(C199-Pad1)") (net 58 /FPGA/FPGA_PWR&MISC/VCCADC) (net 59 /FPGA/FPGA_PWR&MISC/GNDADC) (net 60 /FPGA/FPGA_REF_CLK0_N) (net 61 /FPGA/FPGA_MGT/MGT_CLK_0_P) (net 62 /FPGA/FPGA_REF_CLK0_P) (net 63 /FPGA/FPGA_MGT/MGT_CLK_0_N) (net 64 /FMC_2/FMC2_GBTCLK0_M2C_P) (net 65 /FPGA/FPGA_MGT/MGT_CLK_1_P) (net 66 /FMC_2/FMC2_GBTCLK0_M2C_N) (net 67 /FPGA/FPGA_MGT/MGT_CLK_1_N) (net 68 /AMC_connector/FCLKA_P) (net 69 /FMC_1/FMC1_GBTCLK0_M2C_P) (net 70 /AMC_connector/FCLKA_N) (net 71 /FMC_1/FMC1_GBTCLK0_M2C_N) (net 72 /FPGA/FPGA_REF_CLK1_N) (net 73 /FPGA/FPGA_REF_CLK1_P) (net 74 /FPGA/SFP_1_TX_P) (net 75 /FPGA/FPGA_MGT/MGT_TX_0_P) (net 76 /FPGA/SFP_1_TX_N) (net 77 /FPGA/SFP_2_TX_P) (net 78 /FPGA/FPGA_MGT/MGT_TX_1_P) (net 79 /FPGA/SFP_2_TX_N) (net 80 /FPGA/FPGA_MGT/MGT_TX_1_N) (net 81 /FPGA/SFP_3_TX_P) (net 82 /FPGA/SFP_3_TX_N) (net 83 /FPGA/FPGA_MGT/MGT_TX_2_N) (net 84 /FPGA/SFP_4_TX_P) (net 85 /FPGA/SFP_4_TX_N) (net 86 /FPGA/FPGA_MGT/MGT_TX_3_N) (net 87 /FPGA/SFP_1_RX_P) (net 88 /FPGA/SFP_1_RX_N) (net 89 /FPGA/FPGA_MGT/MGT_RX_0_N) (net 90 /FPGA/SFP_2_RX_P) (net 91 /FPGA/FPGA_MGT/MGT_RX_1_P) (net 92 /FPGA/SFP_2_RX_N) (net 93 /FPGA/FPGA_MGT/MGT_RX_1_N) (net 94 /FPGA/SFP_3_RX_P) (net 95 /FPGA/SFP_3_RX_N) (net 96 /FPGA/FPGA_MGT/MGT_RX_2_N) (net 97 /FPGA/SFP_4_RX_P) (net 98 /FPGA/FPGA_MGT/MGT_RX_3_P) (net 99 /FPGA/SFP_4_RX_N) (net 100 /FPGA/FPGA_MGT/MGT_RX_3_N) (net 101 "Net-(C350-Pad1)") (net 102 "Net-(C352-Pad1)") (net 103 "Net-(C353-Pad1)") (net 104 "Net-(C354-Pad1)") (net 105 /AMC_connector/PS0#) (net 106 /AMC_connector/PS1#) (net 107 /LPC_RST) (net 108 /MMC/ISP_RSTn) (net 109 /MMC/OVER_TEMP) (net 110 "Net-(D6-Pad4)") (net 111 "Net-(D6-Pad3)") (net 112 /ETH_PHY/POE_VC1) (net 113 /ETH_PHY/POE_VC2) (net 114 /ETH_PHY/POE_VC3) (net 115 /ETH_PHY/POE_VC4) (net 116 /FPGA/FPGA_15_16/TMDS2_P) (net 117 /FPGA/FPGA_15_16/TMDS1_P) (net 118 /FPGA/FPGA_15_16/TMDS1_N) (net 119 /FPGA/FPGA_15_16/TMDS2_N) (net 120 /FPGA/FPGA_15_16/TMDS0_P) (net 121 /FPGA/FPGA_15_16/TMDS_CLK_P) (net 122 /FPGA/FPGA_15_16/TMDS_CLK_N) (net 123 /FPGA/FPGA_15_16/TMDS0_N) (net 124 "Net-(D13-Pad4)") (net 125 /USB/USB_D_P) (net 126 /USB/USB_D_N) (net 127 /MMC/AT_DET) (net 128 /FMC_2/FMC2_CLK0_M2C_N) (net 129 /FMC_2/FMC2_CLK0_M2C_P) (net 130 /FMC2_PRSNT_M2C_L) (net 131 /FMC_2/FMC2_CLK1_M2C_N) (net 132 /FMC_2/FMC2_CLK1_M2C_P) (net 133 /FMC2_TMS) (net 134 /FMC2_TDO) (net 135 /FMC2_TDI) (net 136 /FMC2_TCK) (net 137 /FMC_2/FMC2_PG_C2M) (net 138 "Net-(J3-Pad9)") (net 139 /FPGA/SFP1_LOS) (net 140 /FPGA/SFP1_RS) (net 141 /FPGA/SFP1_DEF0) (net 142 /FPGA/SFP1_TX_DIS) (net 143 /FPGA/SFP1_TX_FAULT) (net 144 "Net-(J4-Pad19)") (net 145 "Net-(J4-Pad17)") (net 146 /FMC_1/FMC1_CLK0_M2C_N) (net 147 /FMC_1/FMC1_CLK0_M2C_P) (net 148 /FMC1_PRSNT_M2C_L) (net 149 /FMC_1/FMC1_CLK1_M2C_N) (net 150 /FMC_1/FMC1_CLK1_M2C_P) (net 151 /FMC1_TMS) (net 152 /FMC1_TDI) (net 153 /FMC1_TCK) (net 154 /FMC_1/FMC1_PG_C2M) (net 155 "Net-(J6-Pad9)") (net 156 /FPGA/SFP2_LOS) (net 157 /FPGA/SFP2_RS) (net 158 /FPGA/SFP2_DEF0) (net 159 /FPGA/SFP2_TX_DIS) (net 160 /FPGA/SFP2_TX_FAULT) (net 161 "Net-(J7-Pad9)") (net 162 /FPGA/SFP3_LOS) (net 163 /FPGA/SFP3_RS) (net 164 /FPGA/SFP3_DEF0) (net 165 /FPGA/SFP3_TX_DIS) (net 166 /FPGA/SFP3_TX_FAULT) (net 167 "Net-(J8-Pad9)") (net 168 /FPGA/SFP4_LOS) (net 169 /FPGA/SFP4_RS) (net 170 /FPGA/SFP4_DEF0) (net 171 /FPGA/SFP4_TX_DIS) (net 172 /FPGA/SFP4_TX_FAULT) (net 173 /MMC/I2C_PM_SDA) (net 174 /MMC/I2C_PM_SCL) (net 175 /JTAG/JTAG_TDI) (net 176 /JTAG/JTAG_TDO) (net 177 /JTAG/JTAG_TCK) (net 178 /JTAG/JTAG_TMS) (net 179 /PMOD/Pmod1_0) (net 180 /PMOD/Pmod1_2) (net 181 /PMOD/Pmod1_7) (net 182 /PMOD/Pmod1_5) (net 183 /PMOD/Pmod1_1) (net 184 /PMOD/Pmod1_3) (net 185 /PMOD/Pmod1_6) (net 186 /PMOD/Pmod1_4) (net 187 /PMOD/Pmod2_0) (net 188 /PMOD/Pmod2_2) (net 189 /PMOD/Pmod2_7) (net 190 /PMOD/Pmod2_5) (net 191 /PMOD/Pmod2_1) (net 192 /PMOD/Pmod2_3) (net 193 /PMOD/Pmod2_6) (net 194 /PMOD/Pmod2_4) (net 195 /MMC_TDI) (net 196 /MMC_TCK) (net 197 /MMC_TMS) (net 198 /FPGA/FPGA_15_16/HDMI_HPD) (net 199 "Net-(J15-Pad16)") (net 200 "Net-(J15-Pad15)") (net 201 "Net-(L13-Pad1)") (net 202 "Net-(L23-Pad1)") (net 203 "Net-(L35-Pad2)") (net 204 "Net-(L36-Pad2)") (net 205 "Net-(L37-Pad2)") (net 206 "Net-(L38-Pad2)") (net 207 "Net-(LD1-Pad2)") (net 208 "Net-(LD2-Pad2)") (net 209 "Net-(LD3-Pad1)") (net 210 "Net-(LD3-Pad2)") (net 211 "Net-(M1-Pad1)") (net 212 "Net-(M1-Pad3)") (net 213 "Net-(M2-Pad1)") (net 214 "Net-(M2-Pad3)") (net 215 /ETH_PHY/SD_OUT_P) (net 216 /AMC_connector/Rx0_N) (net 217 /AMC_connector/Rx0_P) (net 218 /AMC_connector/AMC_GA2) (net 219 /AMC_connector/AMC_En) (net 220 /AMC_connector/I2C_IPMB_SDA) (net 221 /ETH_PHY/SD_OUT_N) (net 222 /AMC_connector/AMC_GA0) (net 223 /AMC_connector/AMC_GA1) (net 224 /AMC_connector/I2C_IPMB_SCL) (net 225 /FPGA/PROG_B) (net 226 "Net-(Q1-Pad2)") (net 227 "Net-(Q1-Pad3)") (net 228 "Net-(Q1-Pad5)") (net 229 "Net-(Q22-Pad3)") (net 230 /EN_USB_JTAG) (net 231 "Net-(Q7-Pad2)") (net 232 "Net-(Q7-Pad4)") (net 233 /MMC/EN_FMC1_P12V) (net 234 "Net-(Q8-Pad3)") (net 235 /MMC/EN_FMC2_P12V) (net 236 /Power/Power_SW/PSS_XRP_GH1) (net 237 /Power/Power_SW/PSS_XRP_GL1) (net 238 /Power/Power_SW/PSS_XRP_GH2) (net 239 /Power/Power_SW/PSS_XRP_GL2) (net 240 /Power/Power_SW/PSS_XRP_GH3) (net 241 /Power/Power_SW/PSS_XRP_GL3) (net 242 /Power/Power_SW/PSS_XRP_GH4) (net 243 /Power/Power_SW/PSS_XRP_GL4) (net 244 "Net-(Q15-Pad2)") (net 245 "Net-(Q15-Pad3)") (net 246 "Net-(Q16-Pad5)") (net 247 "Net-(Q17-Pad3)") (net 248 /FPGA/FPGA_DONE) (net 249 "Net-(Q22-Pad2)") (net 250 "Net-(Q22-Pad5)") (net 251 "Net-(Q23-Pad5)") (net 252 /FPGA/DDR3_CAS) (net 253 /FPGA/DDR3_RAS) (net 254 /FPGA/DDR3_WE) (net 255 /SDRAM/DDR3_A1) (net 256 /SDRAM/DDR3_A3) (net 257 /SDRAM/DDR3_A5) (net 258 /SDRAM/DDR3_A7) (net 259 /SDRAM/DDR3_A9) (net 260 /SDRAM/DDR3_A11) (net 261 /SDRAM/DDR3_A13) (net 262 /SDRAM/DDR3_A15) (net 263 /SDRAM/DDR3_BA1) (net 264 /SDRAM/DDR3_A0) (net 265 /SDRAM/DDR3_A2) (net 266 /SDRAM/DDR3_A4) (net 267 /SDRAM/DDR3_A6) (net 268 /SDRAM/DDR3_A8) (net 269 /SDRAM/DDR3_A10) (net 270 /SDRAM/DDR3_A12) (net 271 /FPGA/DDR3_CK_P) (net 272 /FPGA/DDR3_CK_N) (net 273 /FPGA/DDR3_CKE) (net 274 /SDRAM/DDR3_A14) (net 275 /FPGA/DDR3_CS) (net 276 /FPGA/DDR3_ODT) (net 277 /FPGA/DDR3_RST_N) (net 278 /SDRAM/DDR3_BA0) (net 279 "Net-(R28-Pad1)") (net 280 /SDRAM/PGOOD) (net 281 "Net-(R30-Pad1)") (net 282 /FPGA/I2C_FPGA_SCL) (net 283 /FPGA/I2C_FPGA_SDA) (net 284 /FPGA/I2C_FPGA_SW_RST) (net 285 "Net-(R43-Pad1)") (net 286 "Net-(R44-Pad1)") (net 287 /FPGA/I2C_APP_SDA) (net 288 /ETH_PHY/MII_MDIO) (net 289 "Net-(R64-Pad1)") (net 290 "Net-(R65-Pad2)") (net 291 "Net-(R66-Pad2)") (net 292 "Net-(R67-Pad2)") (net 293 /FPGA/I2C_APP_SCL) (net 294 "Net-(R93-Pad2)") (net 295 "Net-(R94-Pad2)") (net 296 "Net-(R96-Pad2)") (net 297 "Net-(R97-Pad2)") (net 298 "Net-(R98-Pad2)") (net 299 "Net-(R99-Pad2)") (net 300 "Net-(R100-Pad2)") (net 301 "Net-(R101-Pad2)") (net 302 "Net-(R102-Pad2)") (net 303 /FPGA/CLK20_VCXO) (net 304 /SDRAM/DDR3_BA2) (net 305 "Net-(R109-Pad2)") (net 306 "Net-(R112-Pad2)") (net 307 "Net-(R113-Pad2)") (net 308 "Net-(R114-Pad2)") (net 309 "Net-(R115-Pad2)") (net 310 "Net-(R117-Pad2)") (net 311 "Net-(R118-Pad2)") (net 312 "Net-(R120-Pad2)") (net 313 "Net-(R121-Pad2)") (net 314 "Net-(R122-Pad2)") (net 315 "Net-(R123-Pad2)") (net 316 "Net-(R124-Pad2)") (net 317 "Net-(R125-Pad2)") (net 318 "Net-(R126-Pad2)") (net 319 /MMC/LPC_ISPn) (net 320 /FPGA/DXN_0) (net 321 /ALERT) (net 322 "Net-(R135-Pad2)") (net 323 "Net-(R136-Pad2)") (net 324 /MMC/MMC_TRST) (net 325 /FPGA/FPGA_RESETn) (net 326 /MMC/SW) (net 327 /MMC/HW_ID0) (net 328 /MMC/HW_ID1) (net 329 /MMC/HW_ID2) (net 330 "Net-(R148-Pad2)") (net 331 "Net-(R149-Pad2)") (net 332 "Net-(R150-Pad2)") (net 333 "Net-(R151-Pad2)") (net 334 "Net-(R152-Pad2)") (net 335 "Net-(R153-Pad2)") (net 336 "Net-(R154-Pad2)") (net 337 "Net-(R155-Pad2)") (net 338 "Net-(R156-Pad2)") (net 339 /Power/Power_SW/EN_1V2) (net 340 /MMC/HW_ID3) (net 341 /FPGA/FPGA_PWR&MISC/FPGA_INIT) (net 342 "Net-(R161-Pad1)") (net 343 /Power/Power_SW/EN_1V8) (net 344 "Net-(R168-Pad2)") (net 345 /THERM) (net 346 "Net-(R190-Pad2)") (net 347 "Net-(R191-Pad2)") (net 348 "Net-(R192-Pad2)") (net 349 "Net-(R193-Pad2)") (net 350 "Net-(R194-Pad2)") (net 351 "Net-(R195-Pad2)") (net 352 "Net-(R197-Pad2)") (net 353 /FPGA/EXP_INT) (net 354 "Net-(R200-Pad2)") (net 355 /FPGA/FPGA_13_14/CFG_PUDC) (net 356 /FPGA/FPGA_13_14/CFG_FCS) (net 357 /FPGA/FPGA_13_14/CFG_WP) (net 358 /FPGA/FPGA_13_14/CFG_D02) (net 359 "Net-(R210-Pad2)") (net 360 /FPGA/FPGA_13_14/CFG_D03) (net 361 /FPGA/FPGA_TDI) (net 362 /FPGA/FPGA_TDO) (net 363 /FPGA/FPGA_TMS) (net 364 /FPGA/FPGA_TCK) (net 365 /USB_TCK) (net 366 /USB_TDI_DO) (net 367 /USB_TMS) (net 368 /USB_TDO_DI) (net 369 /MMC_TDO) (net 370 /SDRAM/DDR3_DQ13) (net 371 /SDRAM/DDR3_DQ15) (net 372 /SDRAM/DDR3_DQ12) (net 373 /FPGA/DDR3_UDQS_N) (net 374 /SDRAM/DDR3_DQ14) (net 375 /SDRAM/DDR3_DQ11) (net 376 /SDRAM/DDR3_DQ9) (net 377 /FPGA/DDR3_UDQS_P) (net 378 /SDRAM/DDR3_DQ10) (net 379 /FPGA/DDR3_UDM) (net 380 /SDRAM/DDR3_DQ8) (net 381 /SDRAM/DDR3_DQ0) (net 382 /FPGA/DDR3_LDM) (net 383 /SDRAM/DDR3_DQ2) (net 384 /FPGA/DDR3_LDQS_P) (net 385 /SDRAM/DDR3_DQ1) (net 386 /SDRAM/DDR3_DQ3) (net 387 /SDRAM/DDR3_DQ6) (net 388 /FPGA/DDR3_LDQS_N) (net 389 /SDRAM/DDR3_DQ4) (net 390 /SDRAM/DDR3_DQ7) (net 391 /SDRAM/DDR3_DQ5) (net 392 /FPGA/FPGA_13_14/CFG_DIN) (net 393 /FPGA/FPGA_13_14/CFG_MOSI) (net 394 /FPGA/CCLK) (net 395 /ETH_PHY/MII_MDC) (net 396 /FPGA/Self_FPGA_TDI) (net 397 /FPGA/Self_FPGA_TCK) (net 398 /FPGA/Self_FPGA_TDO) (net 399 /FPGA/Self_FPGA_TMS) (net 400 /FPGA/CFG_WP_B) (net 401 /ETH_PHY/PHY_RSTn) (net 402 /FPGA/WR_DAC_DIN) (net 403 /FPGA/WR_DAC_SCLK) (net 404 /FPGA/WR_DAC2_SYNC) (net 405 /FPGA/WR_DAC1_SYNC) (net 406 "Net-(U23-Pad32)") (net 407 "Net-(U23-Pad33)") (net 408 "Net-(U23-Pad42)") (net 409 "Net-(U23-Pad46)") (net 410 /MMC/MMC_CONS_PROG_RxD) (net 411 /MMC/MMC_CONS_PROG_TxD) (net 412 /MMC/BOOT_MODE0) (net 413 /MMC/BOOT_MODE1) (net 414 /MMC/BOOT_MODE2) (net 415 /FPGA/FPGA_SCK) (net 416 /FPGA/FPGA_MOSI) (net 417 /FPGA/FPGA_SSEL) (net 418 /FPGA/FPGA_MISO) (net 419 /FPGA/FPGA_INT) (net 420 /FPGA/FPGA_XR_GPIO_0) (net 421 /FPGA/VCXO_EN) (net 422 /MMC/EN_PSU_CH) (net 423 /FMC_2/I2C_FMC2_SDA) (net 424 /FMC_2/I2C_FMC2_SCL) (net 425 /I2C_MUX/I2C_SFP1_SCL) (net 426 /I2C_MUX/I2C_SFP1_SDA) (net 427 /FMC_1/I2C_FMC1_SDA) (net 428 /FMC_1/I2C_FMC1_SCL) (net 429 /I2C_MUX/I2C_SFP2_SCL) (net 430 /I2C_MUX/I2C_SFP2_SDA) (net 431 /I2C_MUX/I2C_SFP3_SCL) (net 432 /I2C_MUX/I2C_SFP3_SDA) (net 433 /I2C_MUX/I2C_SFP4_SCL) (net 434 /I2C_MUX/I2C_SFP4_SDA) (net 435 /FPGA/I2C_HDMI_SCL) (net 436 /FPGA/I2C_HDMI_SDA) (net 437 /ESDSTRIP1) (net 438 /FPGA_RTS) (net 439 /FPGA_RxD) (net 440 /FPGA_TxD) (net 441 /FPGA/FPGA_MGT/MGT_TX_3_P) (net 442 /FPGA/FPGA_MGT/MGT_RX_2_P) (net 443 /FPGA/FPGA_MGT/MGT_RX_0_P) (net 444 /FPGA/FPGA_MGT/MGT_TX_2_P) (net 445 /FPGA/FPGA_MGT/MGT_TX_0_N) (net 446 "Net-(C39-Pad1)") (net 447 "Net-(C107-Pad1)") (net 448 "Net-(C106-Pad1)") (net 449 "Net-(C111-Pad1)") (net 450 "Net-(C114-Pad1)") (net 451 "Net-(C114-Pad2)") (net 452 "Net-(C120-Pad1)") (net 453 "Net-(C121-Pad1)") (net 454 "Net-(C123-Pad1)") (net 455 "Net-(D2-Pad2)") (net 456 "Net-(D14-Pad2)") (net 457 "Net-(Q6-Pad3)") (net 458 "Net-(R92-Pad2)") (net 459 "Net-(R103-Pad1)") (net 460 +12V_FMC2) (net 461 +3V3_CLEAN) (net 462 +12V_FMC1) (net 463 +1V8_USB) (net 464 +12V_AMC) (net 465 /MMC/Pmod3_0) (net 466 /MMC/Pmod3_2) (net 467 /MMC/Pmod3_7) (net 468 /MMC/Pmod3_5) (net 469 /MMC/Pmod3_1) (net 470 /MMC/Pmod3_3) (net 471 /MMC/Pmod3_6) (net 472 /MMC/Pmod3_4) (net 473 "Net-(LD4-Pad2)") (net 474 "Net-(LD5-Pad1)") (net 475 "Net-(LD5-Pad2)") (net 476 "Net-(LD6-Pad2)") (net 477 "Net-(LD7-Pad1)") (net 478 "Net-(LD7-Pad2)") (net 479 "Net-(LD8-Pad1)") (net 480 "Net-(LD8-Pad2)") (net 481 "Net-(LD9-Pad1)") (net 482 "Net-(LD9-Pad2)") (net 483 "Net-(LD10-Pad2)") (net 484 "Net-(Q9-Pad3)") (net 485 /FANFAIL) (net 486 VCCBRAM) (net 487 VTT_DDR3) (net 488 VCCAUX) (net 489 MGTAVCC) (net 490 MGTAVTT) (net 491 FMC2_LA_15_N) (net 492 FMC2_LA_15_P) (net 493 FMC2_LA_11_N) (net 494 FMC2_LA_11_P) (net 495 FMC2_LA_7_N) (net 496 FMC2_LA_7_P) (net 497 FMC2_LA_4_N) (net 498 FMC2_LA_4_P) (net 499 FMC2_LA_2_N) (net 500 FMC2_LA_2_P) (net 501 FMC2_LA_16_N) (net 502 FMC2_LA_16_P) (net 503 FMC2_LA_12_N) (net 504 FMC2_LA_12_P) (net 505 FMC2_LA_8_N) (net 506 FMC2_LA_8_P) (net 507 FMC2_LA_3_N) (net 508 FMC2_LA_3_P) (net 509 FMC2_LA_0_N) (net 510 FMC2_LA_0_P) (net 511 FMC2_LA_13_N) (net 512 FMC2_LA_13_P) (net 513 FMC2_LA_9_N) (net 514 FMC2_LA_9_P) (net 515 FMC2_LA_5_N) (net 516 FMC2_LA_5_P) (net 517 FMC2_LA_1_N) (net 518 FMC2_LA_1_P) (net 519 FMC2_LA_14_N) (net 520 FMC2_LA_14_P) (net 521 FMC2_LA_10_N) (net 522 FMC2_LA_10_P) (net 523 FMC2_LA_6_N) (net 524 FMC2_LA_6_P) (net 525 FMC1_LA_16_N) (net 526 FMC1_LA_16_P) (net 527 FMC1_LA_2_N) (net 528 FMC1_LA_4_N) (net 529 FMC2_LA_20_N) (net 530 FMC2_LA_20_P) (net 531 FMC2_LA_22_N) (net 532 FMC2_LA_21_N) (net 533 FMC2_LA_25_N) (net 534 FMC2_LA_25_P) (net 535 FMC2_LA_26_N) (net 536 FMC1_LA_14_N) (net 537 FMC1_LA_14_P) (net 538 FMC1_LA_2_P) (net 539 FMC1_LA_4_P) (net 540 FMC2_LA_19_N) (net 541 FMC2_LA_22_P) (net 542 FMC2_LA_23_N) (net 543 FMC2_LA_21_P) (net 544 FMC2_LA_27_N) (net 545 FMC2_LA_27_P) (net 546 FMC2_LA_26_P) (net 547 FMC1_LA_15_N) (net 548 FMC1_LA_15_P) (net 549 FMC2_LA_19_P) (net 550 FMC2_LA_24_N) (net 551 FMC2_LA_23_P) (net 552 FMC2_LA_29_N) (net 553 FMC2_LA_29_P) (net 554 FMC1_LA_13_N) (net 555 FMC1_LA_13_P) (net 556 FMC1_LA_3_N) (net 557 FMC2_LA_32_N) (net 558 FMC2_LA_32_P) (net 559 FMC2_LA_24_P) (net 560 FMC2_LA_17_N) (net 561 FMC2_LA_17_P) (net 562 FMC2_LA_28_N) (net 563 FMC1_LA_0_N) (net 564 FMC1_LA_1_N) (net 565 FMC1_LA_1_P) (net 566 FMC1_LA_3_P) (net 567 FMC2_LA_30_N) (net 568 FMC2_LA_18_N) (net 569 FMC2_LA_18_P) (net 570 FMC2_LA_28_P) (net 571 FMC1_LA_0_P) (net 572 FMC1_LA_5_N) (net 573 FMC1_LA_5_P) (net 574 FMC2_LA_33_N) (net 575 FMC2_LA_30_P) (net 576 FMC1_LA_7_N) (net 577 FMC2_LA_33_P) (net 578 FMC2_LA_31_N) (net 579 FMC2_LA_31_P) (net 580 FMC1_LA_12_N) (net 581 FMC1_LA_7_P) (net 582 FMC1_LA_11_N) (net 583 FMC1_LA_9_N) (net 584 FMC1_LA_6_N) (net 585 FMC1_LA_12_P) (net 586 FMC1_LA_8_N) (net 587 FMC1_LA_11_P) (net 588 FMC1_LA_9_P) (net 589 FMC1_LA_6_P) (net 590 FMC1_LA_30_P) (net 591 FMC1_LA_33_P) (net 592 FMC1_LA_32_N) (net 593 FMC1_LA_32_P) (net 594 FMC1_LA_8_P) (net 595 FMC1_LA_10_N) (net 596 FMC1_LA_10_P) (net 597 FMC1_LA_30_N) (net 598 FMC1_LA_28_P) (net 599 FMC1_LA_33_N) (net 600 FMC1_LA_31_P) (net 601 FMC1_LA_28_N) (net 602 FMC1_LA_31_N) (net 603 FMC1_LA_27_N) (net 604 FMC1_LA_27_P) (net 605 FMC1_LA_18_N) (net 606 FMC1_LA_18_P) (net 607 FMC1_LA_29_N) (net 608 FMC1_LA_29_P) (net 609 FMC1_LA_25_P) (net 610 FMC1_LA_17_P) (net 611 FMC1_LA_23_P) (net 612 FMC1_LA_21_P) (net 613 FMC1_LA_25_N) (net 614 FMC1_LA_26_P) (net 615 FMC1_LA_17_N) (net 616 FMC1_LA_24_N) (net 617 FMC1_LA_24_P) (net 618 FMC1_LA_23_N) (net 619 FMC1_LA_21_N) (net 620 FMC1_LA_19_P) (net 621 FMC1_LA_26_N) (net 622 FMC1_LA_22_N) (net 623 FMC1_LA_22_P) (net 624 FMC1_LA_20_N) (net 625 FMC1_LA_20_P) (net 626 FMC1_LA_19_N) (net 627 Tx_4_P) (net 628 Tx_4_N) (net 629 Tx_5_P) (net 630 Tx_5_N) (net 631 Tx_6_P) (net 632 Tx_6_N) (net 633 Tx_7_P) (net 634 Tx_7_N) (net 635 Rx_4_P) (net 636 Rx_4_N) (net 637 Rx_5_P) (net 638 Rx_5_N) (net 639 Rx_6_P) (net 640 Rx_6_N) (net 641 Rx_7_P) (net 642 Rx_7_N) (net 643 /SDRAM/VREF_DDR3) (net 644 /ETH_PHY/MDI3_N) (net 645 /ETH_PHY/MDI3_P) (net 646 /ETH_PHY/MDI2_N) (net 647 /ETH_PHY/MDI2_P) (net 648 /ETH_PHY/MDI1_P) (net 649 /ETH_PHY/MDI1_N) (net 650 /ETH_PHY/MDI0_N) (net 651 /ETH_PHY/MDI0_P) (net 652 /ESDSTRIP2) (net 653 /FMC_2/FMC2_FUSE) (net 654 /FMC_1/FMC1_FUSE) (net 655 +3V3P) (net 656 "Net-(R262-Pad2)") (net 657 "Net-(J4-Pad21)") (net 658 "Net-(R263-Pad2)") (net 659 "Net-(LD11-Pad2)") (net 660 "Net-(LD11-Pad1)") (net 661 "Net-(LD12-Pad2)") (net 662 "Net-(LD12-Pad1)") (net 663 +3V3_USB) (net 664 "Net-(LD13-Pad2)") (net 665 "Net-(LD13-Pad1)") (net 666 "Net-(LD14-Pad2)") (net 667 "Net-(LD14-Pad1)") (net 668 "Net-(LD15-Pad2)") (net 669 "Net-(LD15-Pad1)") (net 670 "Net-(C360-Pad1)") (net 671 "Net-(Q14-Pad1)") (net 672 "Net-(Q14-Pad2)") (net 673 "Net-(Q24-Pad1)") (net 674 "Net-(Q24-Pad3)") (net 675 "Net-(Q26-Pad2)") (net 676 "Net-(Q26-Pad5)") (net 677 "Net-(Q27-Pad2)") (net 678 "Net-(Q27-Pad5)") (net 679 "Net-(R274-Pad2)") (net 680 "Net-(C145-Pad1)") (net 681 "Net-(U4-Pad7)") (net 682 "Net-(U15-Pad8)") (net 683 /FMC1_TRST) (net 684 /FMC1_TDO) (net 685 /FMC2_TRST) (net 686 "Net-(U40-Pad3)") (net 687 /JTAG/FMC1_TDI_R) (net 688 /JTAG/FMC1_TDO_R) (net 689 /JTAG/FMC2_TDI_R) (net 690 /JTAG/FMC2_TDO_R) (net 691 +5V) (net 692 "Net-(C144-Pad1)") (net 693 "Net-(C357-Pad2)") (net 694 "Net-(R281-Pad1)") (net 695 "Net-(R283-Pad2)") (net 696 "Net-(R284-Pad1)") (net 697 "Net-(R285-Pad1)") (net 698 "Net-(C374-Pad1)") (net 699 /AMC_connector/Rx18_N) (net 700 /AMC_connector/Rx18_P) (net 701 /AMC_connector/TCLKA_P) (net 702 /AMC_connector/TCLKA_N) (net 703 /FPGA/FPGA_15_16/Rx18_SE) (net 704 /FMC2_PRSNT_Override) (net 705 "Net-(D17-Pad1)") (net 706 /FMC1_PRSNT_Override) (net 707 "Net-(D18-Pad1)") (net 708 /FMC_TDI) (net 709 /FMC_TCK) (net 710 /FMC_TMS) (net 711 /FMC_TDO) (net 712 /FMC_TRST) (net 713 /FPGA/FPGA_MGT/EXT_CLK_P) (net 714 /FPGA/FPGA_MGT/EXT_CLK_N) (net 715 /ETH_PHY/RGMII_RX_DV) (net 716 "Net-(R291-Pad1)") (net 717 /ETH_PHY/RGMII_RX_CLK) (net 718 "Net-(R292-Pad1)") (net 719 /ETH_PHY/RGMII_RXD0) (net 720 "Net-(R293-Pad1)") (net 721 /ETH_PHY/RGMII_RXD1) (net 722 "Net-(R294-Pad1)") (net 723 /ETH_PHY/RGMII_RXD2) (net 724 "Net-(R295-Pad1)") (net 725 /ETH_PHY/RGMII_RXD3) (net 726 "Net-(R296-Pad1)") (net 727 /ETH_PHY/RGMII_TX_EN) (net 728 /ETH_PHY/RGMII_TX_CLK) (net 729 /ETH_PHY/RGMII_TXD3) (net 730 /ETH_PHY/RGMII_TXD1) (net 731 /ETH_PHY/RGMII_TXD0) (net 732 /ETH_PHY/RGMII_TXD2) (net 733 "Net-(D10-Pad5)") (net 734 "Net-(D11-Pad5)") (net 735 "Net-(J1-Pad2)") (net 736 "Net-(J10-Pad4)") (net 737 "Net-(J11-Pad14)") (net 738 "Net-(J11-Pad12)") (net 739 "Net-(J14-Pad7)") (net 740 "Net-(J15-Pad13)") (net 741 "Net-(J15-Pad14)") (net 742 "Net-(P1-Padh1)") (net 743 "Net-(P1-Padc7)") (net 744 "Net-(P1-Padc6)") (net 745 "Net-(P1-Padc3)") (net 746 "Net-(P1-Padc2)") (net 747 "Net-(P2-Padh1)") (net 748 "Net-(P2-Padc7)") (net 749 "Net-(P2-Padc6)") (net 750 "Net-(P2-Padc3)") (net 751 "Net-(P2-Padc2)") (net 752 "Net-(P3-Pad230)") (net 753 /AMC_connector/Rx13_P) (net 754 "Net-(P3-Pad231)") (net 755 /AMC_connector/Tx20_P) (net 756 /AMC_connector/Tx19_N) (net 757 /AMC_connector/Tx20_N) (net 758 "Net-(P3-Pad220)") (net 759 /AMC_connector/Rx13_N) (net 760 /AMC_connector/Tx15_N) (net 761 /AMC_connector/AMC_TDI) (net 762 /AMC_connector/Tx14_N) (net 763 /AMC_connector/Tx13_N) (net 764 /AMC_connector/Tx11_N) (net 765 "Net-(P3-Pad223)") (net 766 /AMC_connector/AMC_TCK) (net 767 /AMC_connector/Tx8_P) (net 768 /AMC_connector/Tx14_P) (net 769 "Net-(P3-Pad240)") (net 770 "Net-(P3-Pad252)") (net 771 "Net-(P3-Pad219)") (net 772 "Net-(P3-Pad221)") (net 773 "Net-(P3-Pad225)") (net 774 "Net-(P3-Pad232)") (net 775 "Net-(P3-Pad270)") (net 776 /AMC_connector/Rx14_P) (net 777 "Net-(P3-Pad226)") (net 778 "Net-(P3-Pad229)") (net 779 /AMC_connector/Tx15_P) (net 780 /AMC_connector/Rx8_N) (net 781 "Net-(P3-Pad264)") (net 782 /AMC_connector/Rx9_N) (net 783 "Net-(P3-Pad248)") (net 784 /AMC_connector/Rx10_P) (net 785 "Net-(P3-Pad254)") (net 786 "Net-(P3-Pad262)") (net 787 "Net-(P3-Pad227)") (net 788 /AMC_connector/Tx9_P) (net 789 /AMC_connector/AMC_TMS) (net 790 /AMC_connector/Rx17_P) (net 791 /AMC_connector/Rx19_N) (net 792 "Net-(P3-Pad247)") (net 793 /AMC_connector/Rx11_N) (net 794 "Net-(P3-Pad258)") (net 795 "Net-(P3-Pad228)") (net 796 /AMC_connector/Rx8_P) (net 797 /AMC_connector/Rx15_P) (net 798 /AMC_connector/Rx12_N) (net 799 /AMC_connector/Tx10_P) (net 800 "Net-(P3-Pad263)") (net 801 /AMC_connector/Tx9_N) (net 802 "Net-(P3-Pad272)") (net 803 /AMC_connector/Tx17_N) (net 804 /AMC_connector/Rx17_N) (net 805 "Net-(P3-Pad256)") (net 806 /AMC_connector/TCLKD_N) (net 807 "Net-(P3-Pad267)") (net 808 "Net-(P3-Pad250)") (net 809 "Net-(P3-Pad222)") (net 810 /AMC_connector/Tx12_N) (net 811 "Net-(P3-Pad269)") (net 812 /AMC_connector/Tx18_N) (net 813 /AMC_connector/AMC_TRST) (net 814 /AMC_connector/Rx12_P) (net 815 /AMC_connector/Tx11_P) (net 816 "Net-(P3-Pad233)") (net 817 "Net-(P3-Pad271)") (net 818 "Net-(P3-Pad255)") (net 819 /AMC_connector/Tx8_N) (net 820 "Net-(P3-Pad261)") (net 821 /AMC_connector/Rx14_N) (net 822 /AMC_connector/Rx20_P) (net 823 "Net-(P3-Pad243)") (net 824 "Net-(P3-Pad244)") (net 825 "Net-(P3-Pad259)") (net 826 "Net-(P3-Pad274)") (net 827 "Net-(P3-Pad253)") (net 828 "Net-(P3-Pad273)") (net 829 "Net-(P3-Pad260)") (net 830 /AMC_connector/TCLKC_N) (net 831 /AMC_connector/TCLKD_P) (net 832 "Net-(P3-Pad266)") (net 833 /AMC_connector/Rx19_P) (net 834 /AMC_connector/Tx19_P) (net 835 /AMC_connector/Tx12_P) (net 836 "Net-(P3-Pad245)") (net 837 /AMC_connector/Rx10_N) (net 838 "Net-(P3-Pad249)") (net 839 /AMC_connector/Tx18_P) (net 840 /AMC_connector/Rx11_P) (net 841 /AMC_connector/Rx15_N) (net 842 "Net-(P3-Pad224)") (net 843 /AMC_connector/Tx13_P) (net 844 "Net-(P3-Pad239)") (net 845 /AMC_connector/Tx17_P) (net 846 "Net-(P3-Pad257)") (net 847 "Net-(P3-Pad246)") (net 848 /AMC_connector/Rx9_P) (net 849 "Net-(P3-Pad265)") (net 850 /AMC_connector/Rx20_N) (net 851 "Net-(P3-Pad251)") (net 852 /AMC_connector/AMC_TDO) (net 853 "Net-(P3-Pad234)") (net 854 /AMC_connector/Tx10_N) (net 855 "Net-(P3-Pad268)") (net 856 /AMC_connector/TCLKC_P) (net 857 "Net-(P3-Pad242)") (net 858 "Net-(P3-Pad241)") (net 859 "Net-(P3-Pad238)") (net 860 "Net-(P3-Pad237)") (net 861 "Net-(P3-Pad236)") (net 862 "Net-(P3-Pad235)") (net 863 "Net-(P3-Pad206)") (net 864 "Net-(P3-Pad216)") (net 865 "Net-(P3-Pad199)") (net 866 "Net-(P3-Pad210)") (net 867 "Net-(P3-Pad218)") (net 868 "Net-(P3-Pad208)") (net 869 "Net-(P3-Pad197)") (net 870 "Net-(P3-Pad202)") (net 871 "Net-(P3-Pad217)") (net 872 "Net-(P3-Pad207)") (net 873 "Net-(P3-Pad209)") (net 874 "Net-(P3-Pad213)") (net 875 "Net-(P3-Pad203)") (net 876 "Net-(P3-Pad201)") (net 877 "Net-(P3-Pad196)") (net 878 "Net-(P3-Pad200)") (net 879 "Net-(P3-Pad204)") (net 880 "Net-(P3-Pad198)") (net 881 "Net-(P3-Pad205)") (net 882 "Net-(P3-Pad172)") (net 883 "Net-(P3-Pad194)") (net 884 "Net-(P3-Pad182)") (net 885 /AMC_connector/Tx2_P) (net 886 "Net-(P3-Pad212)") (net 887 "Net-(P3-Pad191)") (net 888 "Net-(P3-Pad215)") (net 889 "Net-(P3-Pad187)") (net 890 "Net-(P3-Pad8)") (net 891 /AMC_connector/Rx3_N) (net 892 /AMC_connector/Tx3_N) (net 893 "Net-(P3-Pad192)") (net 894 /AMC_connector/Tx3_P) (net 895 /AMC_connector/Rx1_P) (net 896 "Net-(P3-Pad180)") (net 897 "Net-(P3-Pad178)") (net 898 "Net-(P3-Pad214)") (net 899 /AMC_connector/Tx1_N) (net 900 "Net-(P3-Pad189)") (net 901 "Net-(P3-Pad211)") (net 902 "Net-(P3-Pad190)") (net 903 "Net-(P3-Pad6)") (net 904 "Net-(P3-Pad183)") (net 905 "Net-(P3-Pad195)") (net 906 "Net-(P3-Pad175)") (net 907 "Net-(P3-Pad177)") (net 908 "Net-(P3-Pad171)") (net 909 /AMC_connector/Rx2_P) (net 910 "Net-(P3-Pad176)") (net 911 "Net-(P3-Pad184)") (net 912 /AMC_connector/TCLKB_N) (net 913 /AMC_connector/Tx1_P) (net 914 "Net-(P3-Pad174)") (net 915 /AMC_connector/Rx1_N) (net 916 "Net-(P3-Pad181)") (net 917 /AMC_connector/Tx2_N) (net 918 "Net-(P3-Pad173)") (net 919 "Net-(P3-Pad186)") (net 920 "Net-(P3-Pad185)") (net 921 /AMC_connector/Rx2_N) (net 922 "Net-(P3-Pad188)") (net 923 /AMC_connector/Rx3_P) (net 924 "Net-(P3-Pad179)") (net 925 /AMC_connector/TCLKB_P) (net 926 "Net-(P3-Pad193)") (net 927 "Net-(U1-PadAB8)") (net 928 "Net-(U1-PadAB7)") (net 929 "Net-(U1-PadAB6)") (net 930 "Net-(U1-PadAA8)") (net 931 "Net-(U1-PadY17)") (net 932 "Net-(U1-PadY8)") (net 933 "Net-(U1-PadY7)") (net 934 "Net-(U1-PadV22)") (net 935 "Net-(U1-PadU21)") (net 936 "Net-(U1-PadT21)") (net 937 "Net-(U1-PadT20)") (net 938 "Net-(U1-PadT3)") (net 939 "Net-(U1-PadR3)") (net 940 "Net-(U1-PadR2)") (net 941 "Net-(U1-PadP20)") (net 942 "Net-(U1-PadN15)") (net 943 "Net-(U1-PadL20)") (net 944 "Net-(U1-PadF4)") (net 945 "Net-(U1-PadE17)") (net 946 "Net-(U1-PadE14)") (net 947 "Net-(U1-PadB13)") (net 948 "Net-(U2-PadA1)") (net 949 "Net-(U2-PadA4)") (net 950 "Net-(U2-PadA5)") (net 951 "Net-(U2-PadA6)") (net 952 "Net-(U2-PadA7)") (net 953 "Net-(U2-PadA8)") (net 954 "Net-(U2-PadA9)") (net 955 "Net-(U2-PadA12)") (net 956 "Net-(U2-PadA14)") (net 957 "Net-(U2-PadB6)") (net 958 "Net-(U2-PadB7)") (net 959 "Net-(U2-PadB9)") (net 960 "Net-(U2-PadB10)") (net 961 "Net-(U2-PadB13)") (net 962 "Net-(U2-PadB14)") (net 963 "Net-(U2-PadC1)") (net 964 "Net-(U2-PadC6)") (net 965 "Net-(U2-PadC7)") (net 966 "Net-(U2-PadC8)") (net 967 "Net-(U2-PadC10)") (net 968 "Net-(U2-PadC13)") (net 969 "Net-(U2-PadC14)") (net 970 "Net-(U2-PadD1)") (net 971 "Net-(U2-PadD3)") (net 972 "Net-(U2-PadD7)") (net 973 "Net-(U2-PadD8)") (net 974 "Net-(U2-PadD9)") (net 975 "Net-(U2-PadD10)") (net 976 "Net-(U2-PadD12)") (net 977 "Net-(U2-PadD14)") (net 978 "Net-(U2-PadE3)") (net 979 "Net-(U2-PadE4)") (net 980 "Net-(U2-PadE5)") (net 981 "Net-(U2-PadE7)") (net 982 "Net-(U2-PadE8)") (net 983 "Net-(U2-PadE13)") (net 984 "Net-(U2-PadF1)") (net 985 "Net-(U2-PadF10)") (net 986 "Net-(U2-PadF12)") (net 987 "Net-(U2-PadF13)") (net 988 "Net-(U2-PadG4)") (net 989 "Net-(U2-PadG5)") (net 990 "Net-(U2-PadG11)") (net 991 "Net-(U2-PadG12)") (net 992 "Net-(U2-PadG14)") (net 993 "Net-(U2-PadH1)") (net 994 "Net-(U2-PadH2)") (net 995 "Net-(U2-PadH5)") (net 996 "Net-(U2-PadH10)") (net 997 "Net-(U2-PadH11)") (net 998 "Net-(U2-PadJ2)") (net 999 "Net-(U2-PadJ3)") (net 1000 "Net-(U2-PadJ4)") (net 1001 "Net-(U2-PadJ5)") (net 1002 "Net-(U2-PadK3)") (net 1003 "Net-(U2-PadK6)") (net 1004 "Net-(U2-PadK9)") (net 1005 "Net-(U2-PadK10)") (net 1006 "Net-(U2-PadK11)") (net 1007 "Net-(U2-PadK13)") (net 1008 "Net-(U2-PadK14)") (net 1009 "Net-(U2-PadL1)") (net 1010 "Net-(U2-PadL5)") (net 1011 "Net-(U2-PadL6)") (net 1012 "Net-(U2-PadL7)") (net 1013 "Net-(U2-PadL12)") (net 1014 "Net-(U2-PadL14)") (net 1015 "Net-(U2-PadM2)") (net 1016 "Net-(U2-PadM5)") (net 1017 "Net-(U2-PadM6)") (net 1018 "Net-(U2-PadM7)") (net 1019 "Net-(U2-PadM8)") (net 1020 "Net-(U2-PadM11)") (net 1021 "Net-(U2-PadN1)") (net 1022 "Net-(U2-PadN2)") (net 1023 "Net-(U2-PadN4)") (net 1024 "Net-(U2-PadN5)") (net 1025 "Net-(U2-PadN6)") (net 1026 "Net-(U2-PadN7)") (net 1027 "Net-(U2-PadN10)") (net 1028 "Net-(U2-PadN12)") (net 1029 "Net-(U2-PadP6)") (net 1030 "Net-(U2-PadP7)") (net 1031 "Net-(U2-PadP8)") (net 1032 "Net-(U2-PadP10)") (net 1033 "Net-(U2-PadP13)") (net 1034 "Net-(U3-PadJ1)") (net 1035 "Net-(U3-PadJ9)") (net 1036 "Net-(U3-PadL1)") (net 1037 "Net-(U3-PadL9)") (net 1038 "Net-(U4-Pad41)") (net 1039 "Net-(U4-Pad40)") (net 1040 "Net-(U4-Pad39)") (net 1041 "Net-(U4-Pad37)") (net 1042 "Net-(U4-Pad36)") (net 1043 "Net-(U4-Pad33)") (net 1044 "Net-(U4-Pad32)") (net 1045 "Net-(U4-Pad31)") (net 1046 "Net-(U4-Pad29)") (net 1047 "Net-(U4-Pad12)") (net 1048 "Net-(U4-Pad9)") (net 1049 "Net-(U5-Pad25)") (net 1050 "Net-(U12-Pad4)") (net 1051 "Net-(U12-Pad5)") (net 1052 "Net-(U13-Pad4)") (net 1053 "Net-(U15-Pad9)") (net 1054 "Net-(U15-Pad4)") (net 1055 "Net-(U15-Pad1)") (net 1056 "Net-(U18-Pad7)") (net 1057 "Net-(U18-Pad4)") (net 1058 "Net-(U20-Pad8)") (net 1059 "Net-(U20-Pad24)") (net 1060 "Net-(U20-Pad28)") (net 1061 "Net-(U20-Pad29)") (net 1062 "Net-(U20-Pad31)") (net 1063 "Net-(U20-Pad32)") (net 1064 "Net-(U21-Pad7)") (net 1065 "Net-(U23-Pad18)") (net 1066 "Net-(U23-Pad19)") (net 1067 "Net-(U23-Pad20)") (net 1068 "Net-(U23-Pad22)") (net 1069 "Net-(U23-Pad23)") (net 1070 "Net-(U23-Pad25)") (net 1071 "Net-(U23-Pad27)") (net 1072 "Net-(U23-Pad28)") (net 1073 "Net-(U23-Pad29)") (net 1074 "Net-(U23-Pad30)") (net 1075 "Net-(U23-Pad35)") (net 1076 "Net-(U23-Pad37)") (net 1077 "Net-(U23-Pad38)") (net 1078 "Net-(U23-Pad39)") (net 1079 "Net-(U23-Pad40)") (net 1080 "Net-(U23-Pad48)") (net 1081 "Net-(U23-Pad51)") (net 1082 "Net-(U23-Pad52)") (net 1083 "Net-(U23-Pad53)") (net 1084 "Net-(U23-Pad54)") (net 1085 "Net-(U30-Pad3)") (net 1086 "Net-(U30-Pad4)") (net 1087 "Net-(U30-Pad5)") (net 1088 "Net-(U30-Pad6)") (net 1089 "Net-(U30-Pad11)") (net 1090 "Net-(U30-Pad12)") (net 1091 "Net-(U30-Pad13)") (net 1092 "Net-(U35-Pad1)") (net 1093 "Net-(U35-Pad10)") (net 1094 "Net-(U35-Pad15)") (net 1095 "Net-(U36-Pad3)") (net 1096 "Net-(U37-Pad3)") (net 1097 "Net-(U39-Pad2)") (net 1098 "Net-(U39-Pad10)") (net 1099 "Net-(U39-Pad11)") (net 1100 "Net-(Y3-Pad5)") (net 1101 "Net-(P1-Padd35)") (net 1102 "Net-(P1-Padc34)") (net 1103 "Net-(P2-Padd35)") (net 1104 "Net-(P2-Padc34)") (net 1105 /Power/+12VS) (net 1106 "Net-(R259-Pad2)") (net 1107 "Net-(R261-Pad2)") (net 1108 /FPGA/FPGA_15_16/I2C_SDA) (net 1109 /FPGA/FPGA_15_16/I2C_SCL) (net 1110 "Net-(LD16-Pad2)") (net 1111 "Net-(LD16-Pad1)") (net 1112 "Net-(LD17-Pad2)") (net 1113 "Net-(LD17-Pad1)") (net 1114 /FPGA/SI570_CLK_P) (net 1115 /FPGA/SI570_CLK_N) (net 1116 "Net-(Y6-Pad1)") (net 1117 /SI570_OE) (net 1118 "Net-(B9-Pad1)") (net 1119 "Net-(B10-Pad1)") (net 1120 "Net-(R311-Pad2)") (net 1121 "Net-(R312-Pad2)") (net 1122 "Net-(R313-Pad1)") (net 1123 "Net-(U23-Pad47)") (net 1124 "Net-(U23-Pad49)") (net 1125 "Net-(C389-Pad2)") (net 1126 "Net-(R95-Pad1)") (net_class Default "This is the default net class." (clearance 0.102) (trace_width 0.102) (via_dia 0.35) (via_drill 0.152) (uvia_dia 0.508) (uvia_drill 0.127) (add_net +3V3P) (add_net +3V3_USB) (add_net +5V) (add_net /ALERT) (add_net /AMC_connector/AMC_En) (add_net /AMC_connector/AMC_GA0) (add_net /AMC_connector/AMC_GA1) (add_net /AMC_connector/AMC_GA2) (add_net /AMC_connector/AMC_TCK) (add_net /AMC_connector/AMC_TDI) (add_net /AMC_connector/AMC_TDO) (add_net /AMC_connector/AMC_TMS) (add_net /AMC_connector/AMC_TRST) (add_net /AMC_connector/FCLKA_N) (add_net /AMC_connector/FCLKA_P) (add_net /AMC_connector/I2C_IPMB_SCL) (add_net /AMC_connector/I2C_IPMB_SDA) (add_net /AMC_connector/PS0#) (add_net /AMC_connector/PS1#) (add_net /AMC_connector/Rx0_N) (add_net /AMC_connector/Rx0_P) (add_net /AMC_connector/Rx10_N) (add_net /AMC_connector/Rx10_P) (add_net /AMC_connector/Rx11_N) (add_net /AMC_connector/Rx11_P) (add_net /AMC_connector/Rx12_N) (add_net /AMC_connector/Rx12_P) (add_net /AMC_connector/Rx13_N) (add_net /AMC_connector/Rx13_P) (add_net /AMC_connector/Rx14_N) (add_net /AMC_connector/Rx14_P) (add_net /AMC_connector/Rx15_N) (add_net /AMC_connector/Rx15_P) (add_net /AMC_connector/Rx17_N) (add_net /AMC_connector/Rx17_P) (add_net /AMC_connector/Rx18_N) (add_net /AMC_connector/Rx18_P) (add_net /AMC_connector/Rx19_N) (add_net /AMC_connector/Rx19_P) (add_net /AMC_connector/Rx1_N) (add_net /AMC_connector/Rx1_P) (add_net /AMC_connector/Rx20_N) (add_net /AMC_connector/Rx20_P) (add_net /AMC_connector/Rx2_N) (add_net /AMC_connector/Rx2_P) (add_net /AMC_connector/Rx3_N) (add_net /AMC_connector/Rx3_P) (add_net /AMC_connector/Rx8_N) (add_net /AMC_connector/Rx8_P) (add_net /AMC_connector/Rx9_N) (add_net /AMC_connector/Rx9_P) (add_net /AMC_connector/TCLKA_N) (add_net /AMC_connector/TCLKA_P) (add_net /AMC_connector/TCLKB_N) (add_net /AMC_connector/TCLKB_P) (add_net /AMC_connector/TCLKC_N) (add_net /AMC_connector/TCLKC_P) (add_net /AMC_connector/TCLKD_N) (add_net /AMC_connector/TCLKD_P) (add_net /AMC_connector/Tx10_N) (add_net /AMC_connector/Tx10_P) (add_net /AMC_connector/Tx11_N) (add_net /AMC_connector/Tx11_P) (add_net /AMC_connector/Tx12_N) (add_net /AMC_connector/Tx12_P) (add_net /AMC_connector/Tx13_N) (add_net /AMC_connector/Tx13_P) (add_net /AMC_connector/Tx14_N) (add_net /AMC_connector/Tx14_P) (add_net /AMC_connector/Tx15_N) (add_net /AMC_connector/Tx15_P) (add_net /AMC_connector/Tx17_N) (add_net /AMC_connector/Tx17_P) (add_net /AMC_connector/Tx18_N) (add_net /AMC_connector/Tx18_P) (add_net /AMC_connector/Tx19_N) (add_net /AMC_connector/Tx19_P) (add_net /AMC_connector/Tx1_N) (add_net /AMC_connector/Tx1_P) (add_net /AMC_connector/Tx20_N) (add_net /AMC_connector/Tx20_P) (add_net /AMC_connector/Tx2_N) (add_net /AMC_connector/Tx2_P) (add_net /AMC_connector/Tx3_N) (add_net /AMC_connector/Tx3_P) (add_net /AMC_connector/Tx8_N) (add_net /AMC_connector/Tx8_P) (add_net /AMC_connector/Tx9_N) (add_net /AMC_connector/Tx9_P) (add_net /EN_CON_JTAG) (add_net /EN_USB_JTAG) (add_net /ESDSTRIP1) (add_net /ESDSTRIP2) (add_net /ETH_PHY/CLK_25MHZ) (add_net /ETH_PHY/MDI0_N) (add_net /ETH_PHY/MDI0_P) (add_net /ETH_PHY/MDI1_N) (add_net /ETH_PHY/MDI1_P) (add_net /ETH_PHY/MDI2_N) (add_net /ETH_PHY/MDI2_P) (add_net /ETH_PHY/MDI3_N) (add_net /ETH_PHY/MDI3_P) (add_net /ETH_PHY/MII_MDC) (add_net /ETH_PHY/MII_MDIO) (add_net /ETH_PHY/PHY_RSTn) (add_net /ETH_PHY/POE_VC1) (add_net /ETH_PHY/POE_VC2) (add_net /ETH_PHY/POE_VC3) (add_net /ETH_PHY/POE_VC4) (add_net /ETH_PHY/RGMII_RXD0) (add_net /ETH_PHY/RGMII_RXD1) (add_net /ETH_PHY/RGMII_RXD2) (add_net /ETH_PHY/RGMII_RXD3) (add_net /ETH_PHY/RGMII_RX_CLK) (add_net /ETH_PHY/RGMII_RX_DV) (add_net /ETH_PHY/RGMII_TXD0) (add_net /ETH_PHY/RGMII_TXD1) (add_net /ETH_PHY/RGMII_TXD2) (add_net /ETH_PHY/RGMII_TXD3) (add_net /ETH_PHY/RGMII_TX_CLK) (add_net /ETH_PHY/RGMII_TX_EN) (add_net /ETH_PHY/SD_OUT_N) (add_net /ETH_PHY/SD_OUT_P) (add_net /FANFAIL) (add_net /FMC1_PRSNT_M2C_L) (add_net /FMC1_PRSNT_Override) (add_net /FMC1_TCK) (add_net /FMC1_TDI) (add_net /FMC1_TDO) (add_net /FMC1_TMS) (add_net /FMC1_TRST) (add_net /FMC2_PRSNT_M2C_L) (add_net /FMC2_PRSNT_Override) (add_net /FMC2_TCK) (add_net /FMC2_TDI) (add_net /FMC2_TDO) (add_net /FMC2_TMS) (add_net /FMC2_TRST) (add_net /FMC_1/FMC1_3P3VAUX) (add_net /FMC_1/FMC1_CLK0_M2C_N) (add_net /FMC_1/FMC1_CLK0_M2C_P) (add_net /FMC_1/FMC1_CLK1_M2C_N) (add_net /FMC_1/FMC1_CLK1_M2C_P) (add_net /FMC_1/FMC1_FUSE) (add_net /FMC_1/FMC1_GBTCLK0_M2C_N) (add_net /FMC_1/FMC1_GBTCLK0_M2C_P) (add_net /FMC_1/FMC1_PG_C2M) (add_net /FMC_1/I2C_FMC1_SCL) (add_net /FMC_1/I2C_FMC1_SDA) (add_net /FMC_2/FMC2_3P3VAUX) (add_net /FMC_2/FMC2_CLK0_M2C_N) (add_net /FMC_2/FMC2_CLK0_M2C_P) (add_net /FMC_2/FMC2_CLK1_M2C_N) (add_net /FMC_2/FMC2_CLK1_M2C_P) (add_net /FMC_2/FMC2_FUSE) (add_net /FMC_2/FMC2_GBTCLK0_M2C_N) (add_net /FMC_2/FMC2_GBTCLK0_M2C_P) (add_net /FMC_2/FMC2_PG_C2M) (add_net /FMC_2/I2C_FMC2_SCL) (add_net /FMC_2/I2C_FMC2_SDA) (add_net /FMC_TCK) (add_net /FMC_TDI) (add_net /FMC_TDO) (add_net /FMC_TMS) (add_net /FMC_TRST) (add_net /FPGA/CCLK) (add_net /FPGA/CFG_WP_B) (add_net /FPGA/CLK20_VCXO) (add_net /FPGA/DDR3_CK_N) (add_net /FPGA/DDR3_CK_P) (add_net /FPGA/DDR3_LDQS_N) (add_net /FPGA/DDR3_LDQS_P) (add_net /FPGA/DXN_0) (add_net /FPGA/DXP_0) (add_net /FPGA/EXP_INT) (add_net /FPGA/FPGA_13_14/CFG_D02) (add_net /FPGA/FPGA_13_14/CFG_D03) (add_net /FPGA/FPGA_13_14/CFG_DIN) (add_net /FPGA/FPGA_13_14/CFG_FCS) (add_net /FPGA/FPGA_13_14/CFG_MOSI) (add_net /FPGA/FPGA_13_14/CFG_PUDC) (add_net /FPGA/FPGA_13_14/CFG_WP) (add_net /FPGA/FPGA_15_16/HDMI_5V) (add_net /FPGA/FPGA_15_16/HDMI_HPD) (add_net /FPGA/FPGA_15_16/I2C_SCL) (add_net /FPGA/FPGA_15_16/I2C_SDA) (add_net /FPGA/FPGA_15_16/Rx18_SE) (add_net /FPGA/FPGA_15_16/TMDS0_N) (add_net /FPGA/FPGA_15_16/TMDS0_P) (add_net /FPGA/FPGA_15_16/TMDS1_N) (add_net /FPGA/FPGA_15_16/TMDS1_P) (add_net /FPGA/FPGA_15_16/TMDS2_N) (add_net /FPGA/FPGA_15_16/TMDS2_P) (add_net /FPGA/FPGA_15_16/TMDS_CLK_N) (add_net /FPGA/FPGA_15_16/TMDS_CLK_P) (add_net /FPGA/FPGA_DONE) (add_net /FPGA/FPGA_INT) (add_net /FPGA/FPGA_MGT/EXT_CLK_N) (add_net /FPGA/FPGA_MGT/EXT_CLK_P) (add_net /FPGA/FPGA_MGT/MGT_CLK_0_N) (add_net /FPGA/FPGA_MGT/MGT_CLK_0_P) (add_net /FPGA/FPGA_MGT/MGT_CLK_1_N) (add_net /FPGA/FPGA_MGT/MGT_CLK_1_P) (add_net /FPGA/FPGA_MGT/MGT_RX_0_N) (add_net /FPGA/FPGA_MGT/MGT_RX_0_P) (add_net /FPGA/FPGA_MGT/MGT_RX_1_N) (add_net /FPGA/FPGA_MGT/MGT_RX_1_P) (add_net /FPGA/FPGA_MGT/MGT_RX_2_N) (add_net /FPGA/FPGA_MGT/MGT_RX_2_P) (add_net /FPGA/FPGA_MGT/MGT_RX_3_N) (add_net /FPGA/FPGA_MGT/MGT_RX_3_P) (add_net /FPGA/FPGA_MGT/MGT_TX_0_N) (add_net /FPGA/FPGA_MGT/MGT_TX_0_P) (add_net /FPGA/FPGA_MGT/MGT_TX_1_N) (add_net /FPGA/FPGA_MGT/MGT_TX_1_P) (add_net /FPGA/FPGA_MGT/MGT_TX_2_N) (add_net /FPGA/FPGA_MGT/MGT_TX_2_P) (add_net /FPGA/FPGA_MGT/MGT_TX_3_N) (add_net /FPGA/FPGA_MGT/MGT_TX_3_P) (add_net /FPGA/FPGA_MISO) (add_net /FPGA/FPGA_MOSI) (add_net /FPGA/FPGA_PWR&MISC/FPGA_INIT) (add_net /FPGA/FPGA_REF_CLK0_N) (add_net /FPGA/FPGA_REF_CLK0_P) (add_net /FPGA/FPGA_REF_CLK1_N) (add_net /FPGA/FPGA_REF_CLK1_P) (add_net /FPGA/FPGA_RESETn) (add_net /FPGA/FPGA_SCK) (add_net /FPGA/FPGA_SSEL) (add_net /FPGA/FPGA_TCK) (add_net /FPGA/FPGA_TDI) (add_net /FPGA/FPGA_TDO) (add_net /FPGA/FPGA_TMS) (add_net /FPGA/FPGA_XR_GPIO_0) (add_net /FPGA/I2C_APP_SCL) (add_net /FPGA/I2C_APP_SDA) (add_net /FPGA/I2C_FPGA_SCL) (add_net /FPGA/I2C_FPGA_SDA) (add_net /FPGA/I2C_FPGA_SW_RST) (add_net /FPGA/I2C_HDMI_SCL) (add_net /FPGA/I2C_HDMI_SDA) (add_net /FPGA/PROG_B) (add_net /FPGA/SFP1_DEF0) (add_net /FPGA/SFP1_LOS) (add_net /FPGA/SFP1_RS) (add_net /FPGA/SFP1_TX_DIS) (add_net /FPGA/SFP1_TX_FAULT) (add_net /FPGA/SFP2_DEF0) (add_net /FPGA/SFP2_LOS) (add_net /FPGA/SFP2_RS) (add_net /FPGA/SFP2_TX_DIS) (add_net /FPGA/SFP2_TX_FAULT) (add_net /FPGA/SFP3_DEF0) (add_net /FPGA/SFP3_LOS) (add_net /FPGA/SFP3_RS) (add_net /FPGA/SFP3_TX_DIS) (add_net /FPGA/SFP3_TX_FAULT) (add_net /FPGA/SFP4_DEF0) (add_net /FPGA/SFP4_LOS) (add_net /FPGA/SFP4_RS) (add_net /FPGA/SFP4_TX_DIS) (add_net /FPGA/SFP4_TX_FAULT) (add_net /FPGA/SFP_1_RX_N) (add_net /FPGA/SFP_1_RX_P) (add_net /FPGA/SFP_1_TX_N) (add_net /FPGA/SFP_1_TX_P) (add_net /FPGA/SFP_2_RX_N) (add_net /FPGA/SFP_2_RX_P) (add_net /FPGA/SFP_2_TX_N) (add_net /FPGA/SFP_2_TX_P) (add_net /FPGA/SFP_3_RX_N) (add_net /FPGA/SFP_3_RX_P) (add_net /FPGA/SFP_3_TX_N) (add_net /FPGA/SFP_3_TX_P) (add_net /FPGA/SFP_4_RX_N) (add_net /FPGA/SFP_4_RX_P) (add_net /FPGA/SFP_4_TX_N) (add_net /FPGA/SFP_4_TX_P) (add_net /FPGA/SI570_CLK_N) (add_net /FPGA/SI570_CLK_P) (add_net /FPGA/Self_FPGA_TCK) (add_net /FPGA/Self_FPGA_TDI) (add_net /FPGA/Self_FPGA_TDO) (add_net /FPGA/Self_FPGA_TMS) (add_net /FPGA/VCXO_EN) (add_net /FPGA/WR_DAC1_SYNC) (add_net /FPGA/WR_DAC2_SYNC) (add_net /FPGA/WR_DAC_DIN) (add_net /FPGA/WR_DAC_SCLK) (add_net /FPGA_RTS) (add_net /FPGA_RxD) (add_net /FPGA_TxD) (add_net /I2C_MUX/I2C_SFP1_SCL) (add_net /I2C_MUX/I2C_SFP1_SDA) (add_net /I2C_MUX/I2C_SFP2_SCL) (add_net /I2C_MUX/I2C_SFP2_SDA) (add_net /I2C_MUX/I2C_SFP3_SCL) (add_net /I2C_MUX/I2C_SFP3_SDA) (add_net 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(add_net FMC1_LA_17_P) (add_net FMC1_LA_18_N) (add_net FMC1_LA_18_P) (add_net FMC1_LA_19_N) (add_net FMC1_LA_19_P) (add_net FMC1_LA_1_N) (add_net FMC1_LA_1_P) (add_net FMC1_LA_20_N) (add_net FMC1_LA_20_P) (add_net FMC1_LA_21_N) (add_net FMC1_LA_21_P) (add_net FMC1_LA_22_N) (add_net FMC1_LA_22_P) (add_net FMC1_LA_23_N) (add_net FMC1_LA_23_P) (add_net FMC1_LA_24_N) (add_net FMC1_LA_24_P) (add_net FMC1_LA_25_N) (add_net FMC1_LA_25_P) (add_net FMC1_LA_26_N) (add_net FMC1_LA_26_P) (add_net FMC1_LA_27_N) (add_net FMC1_LA_27_P) (add_net FMC1_LA_28_N) (add_net FMC1_LA_28_P) (add_net FMC1_LA_29_N) (add_net FMC1_LA_29_P) (add_net FMC1_LA_2_N) (add_net FMC1_LA_2_P) (add_net FMC1_LA_30_N) (add_net FMC1_LA_30_P) (add_net FMC1_LA_31_N) (add_net FMC1_LA_31_P) (add_net FMC1_LA_32_N) (add_net FMC1_LA_32_P) (add_net FMC1_LA_33_N) (add_net FMC1_LA_33_P) (add_net FMC1_LA_3_N) (add_net FMC1_LA_3_P) (add_net FMC1_LA_4_N) (add_net FMC1_LA_4_P) (add_net FMC1_LA_5_N) (add_net FMC1_LA_5_P) (add_net FMC1_LA_6_N) (add_net FMC1_LA_6_P) (add_net FMC1_LA_7_N) (add_net FMC1_LA_7_P) (add_net FMC1_LA_8_N) (add_net FMC1_LA_8_P) (add_net FMC1_LA_9_N) (add_net FMC1_LA_9_P) (add_net FMC2_LA_0_N) (add_net FMC2_LA_0_P) (add_net FMC2_LA_10_N) (add_net FMC2_LA_10_P) (add_net FMC2_LA_11_N) (add_net FMC2_LA_11_P) (add_net FMC2_LA_12_N) (add_net FMC2_LA_12_P) (add_net FMC2_LA_13_N) (add_net FMC2_LA_13_P) (add_net FMC2_LA_14_N) (add_net FMC2_LA_14_P) (add_net FMC2_LA_15_N) (add_net FMC2_LA_15_P) (add_net FMC2_LA_16_N) (add_net FMC2_LA_16_P) (add_net FMC2_LA_17_N) (add_net FMC2_LA_17_P) (add_net FMC2_LA_18_N) (add_net FMC2_LA_18_P) (add_net FMC2_LA_19_N) (add_net FMC2_LA_19_P) (add_net FMC2_LA_1_N) (add_net FMC2_LA_1_P) (add_net FMC2_LA_20_N) (add_net FMC2_LA_20_P) (add_net FMC2_LA_21_N) (add_net FMC2_LA_21_P) (add_net FMC2_LA_22_N) (add_net FMC2_LA_22_P) (add_net FMC2_LA_23_N) (add_net FMC2_LA_23_P) (add_net FMC2_LA_24_N) (add_net FMC2_LA_24_P) (add_net FMC2_LA_25_N) (add_net FMC2_LA_25_P) (add_net FMC2_LA_26_N) (add_net FMC2_LA_26_P) (add_net FMC2_LA_27_N) (add_net FMC2_LA_27_P) (add_net FMC2_LA_28_N) (add_net FMC2_LA_28_P) (add_net FMC2_LA_29_N) (add_net FMC2_LA_29_P) (add_net FMC2_LA_2_N) (add_net FMC2_LA_2_P) (add_net FMC2_LA_30_N) (add_net FMC2_LA_30_P) (add_net FMC2_LA_31_N) (add_net FMC2_LA_31_P) (add_net FMC2_LA_32_N) (add_net FMC2_LA_32_P) (add_net FMC2_LA_33_N) (add_net FMC2_LA_33_P) (add_net FMC2_LA_3_N) (add_net FMC2_LA_3_P) (add_net FMC2_LA_4_N) (add_net FMC2_LA_4_P) (add_net FMC2_LA_5_N) (add_net FMC2_LA_5_P) (add_net FMC2_LA_6_N) (add_net FMC2_LA_6_P) (add_net FMC2_LA_7_N) (add_net FMC2_LA_7_P) (add_net FMC2_LA_8_N) (add_net FMC2_LA_8_P) (add_net FMC2_LA_9_N) (add_net FMC2_LA_9_P) (add_net "Net-(B10-Pad1)") (add_net "Net-(B9-Pad1)") (add_net "Net-(C100-Pad1)") (add_net "Net-(C101-Pad1)") (add_net "Net-(C102-Pad1)") (add_net "Net-(C106-Pad1)") (add_net "Net-(C107-Pad1)") (add_net "Net-(C111-Pad1)") (add_net "Net-(C114-Pad1)") (add_net "Net-(C114-Pad2)") (add_net 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(fp_line (start 6.35 -0.737) (end 6.604 -1.245) (layer F.Fab) (width 0.1)) (fp_line (start 6.604 -1.245) (end 8.636 -1.245) (layer F.Fab) (width 0.1)) (fp_line (start 8.636 -1.245) (end 8.89 -0.737) (layer F.Fab) (width 0.1)) (fp_line (start 8.89 0.737) (end 8.89 -0.737) (layer F.Fab) (width 0.1)) (fp_line (start 8.636 1.245) (end 8.89 0.737) (layer F.Fab) (width 0.1)) (fp_line (start 6.604 1.245) (end 8.636 1.245) (layer F.Fab) (width 0.1)) (fp_line (start 6.35 0.737) (end 6.604 1.245) (layer F.Fab) (width 0.1)) (fp_line (start 7.303 -0.318) (end 7.938 -0.318) (layer F.Fab) (width 0.1)) (fp_line (start 7.938 0.318) (end 7.938 -0.318) (layer F.Fab) (width 0.1)) (fp_line (start 7.303 0.318) (end 7.938 0.318) (layer F.Fab) (width 0.1)) (fp_line (start 7.303 0.318) (end 7.303 -0.318) (layer F.Fab) (width 0.1)) (pad 3 thru_hole circle (at 5.08 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 173 /MMC/I2C_PM_SDA) (solder_mask_margin 0.102)) (pad 2 thru_hole circle (at 2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 174 /MMC/I2C_PM_SCL) (solder_mask_margin 0.102)) (pad 1 thru_hole circle (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 455 "Net-(D2-Pad2)") (solder_mask_margin 0.102)) (pad 4 thru_hole circle (at 7.62 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/SAMTEC_MTLW-104-07-L-S-250.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5F3FA22A) (at 237.6424 96.7232 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF13/5F44DEF8) (attr smd) (fp_text reference R95 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 27 /ETH_PHY/CLK_25MHZ) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1126 "Net-(R95-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer F.Cu) (tedit 5CAC9F75) (tstamp 5F3F2542) (at 243.9416 101.4222 180) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF13/5F4664BC) (attr smd) (fp_text reference C389 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.9 0.45) (end -0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start 0.9 0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 180) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 1125 "Net-(C389-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 180) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer F.Cu) (tedit 5CAC9F75) (tstamp 5F3F06F4) (at 234.7 97) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF13/5F46CFC5) (attr smd) (fp_text reference C114 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0402_2.2NF_50V_10%_X7R (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.9 0.45) (end -0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start 0.9 0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 451 "Net-(C114-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 450 "Net-(C114-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:641119-2 (layer F.Cu) (tedit 5ED75796) (tstamp 5ED8FC97) (at 281.2 200.2 180) (descr "CONN HEADER VERT 2POS 3.96MM") (path /5C16BF8E/5EDDE66C) (fp_text reference J17 (at 5.7 -1.3 90) (layer F.SilkS) (effects (font (size 2 2) (thickness 0.4))) ) (fp_text value TE_641119-2 (at 0 5.08) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -2.6924 -3.5) (end 2.6924 -3.5) (layer F.SilkS) (width 0.762)) (fp_line (start -4.1656 4.064) (end -4.1656 -4.064) (layer F.SilkS) (width 0.12)) (fp_line (start 4.2164 4.064) (end -4.1656 4.064) (layer F.SilkS) (width 0.12)) (fp_line (start 4.2164 -4.064) (end 4.2164 4.064) (layer F.SilkS) (width 0.12)) (fp_line (start -4.1656 -4.064) (end 4.2164 -4.064) (layer F.SilkS) (width 0.12)) (fp_line (start -3.9624 -3.81) (end -3.9624 3.81) (layer F.CrtYd) (width 0.12)) (fp_line (start 3.9624 -3.81) (end -3.9624 -3.81) (layer F.CrtYd) (width 0.12)) (fp_line (start 3.9624 3.81) (end 3.9624 -3.81) (layer F.CrtYd) (width 0.12)) (fp_line (start -3.9624 3.81) (end 3.9624 3.81) (layer F.CrtYd) (width 0.12)) (fp_line (start -2.6416 4.064) (end -1.8796 4.826) (layer F.SilkS) (width 0.12)) (fp_line (start -1.8796 4.826) (end -1.1176 4.064) (layer F.SilkS) (width 0.12)) (pad 2 thru_hole circle (at 2 0.75 180) (size 3.048 3.048) (drill 1.778) (layers *.Cu *.Mask) (net 31 "Net-(C128-Pad1)")) (pad 1 thru_hole rect (at -1.9812 0.75 180) (size 3.048 3.048) (drill 1.778) (layers *.Cu *.Mask) (net 1 GND)) ) (module Marble:SOP65P490X110-8N (layer B.Cu) (tedit 5CACB92A) (tstamp 5ED594AC) (at 215.37924 175.42508 180) (descr "SOP, 0.65mm pitch; 8 pin, 3.00mm W X 3.00mm L X 1.10mm H body, IPC Medium Density") (path /5C907554/5CAAC367/5F22FB10) (attr smd) (fp_text reference U47 (at 0.20568 2.50188 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value TCA9517DGKR (at 0 -2.826 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -3.2 -1.8) (end 3.2 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.2 -1.8) (end 3.2 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.2 1.8) (end 3.2 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.2 -1.8) (end -3.2 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 1.4) (end -1.4 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.3) (end -1.3 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.2) (end -1.2 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.1) (end -1.1 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1) (end -1 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.9) (end -0.9 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.8) (end -0.8 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.7) (end -0.7 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.6) (end -0.6 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.5) (end -0.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -1.5) (end -1.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.5) (end 1.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -1.5) (end 1.5 -1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.125 0.5) (end -0.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 0.7) (end -0.325 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 0.9) (end -0.525 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 1.1) (end -0.725 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 1.3) (end -0.925 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 -1.5) (end -1.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 1.5) (end 1.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start 1.125 -1.5) (end 1.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 -1.5) (end 1.125 -1.5) (layer B.SilkS) (width 0.2)) (fp_circle (center -2.7 1.7) (end -2.575 1.7) (layer B.SilkS) (width 0.25)) (pad 8 smd rect (at 2.2 0.975 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.2 0.325 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 353 /FPGA/EXP_INT) (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.2 -0.325 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 284 /FPGA/I2C_FPGA_SW_RST) (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.2 -0.975 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 1122 "Net-(R313-Pad1)") (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.2 -0.975 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.2 -0.325 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 1120 "Net-(R311-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.2 0.325 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 1121 "Net-(R312-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -2.2 0.975 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model SOP65P490X110-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/SOP65P490X110-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5ED57C9A) (at 212.48116 177.85588 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5F714FB0) (attr smd) (fp_text reference R313 (at 0 1.526 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 248 /FPGA/FPGA_DONE) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1122 "Net-(R313-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5ED57C89) (at 219.69476 175.52924 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5F658556) (attr smd) (fp_text reference R312 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1121 "Net-(R312-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5ED57C78) (at 220.472 177.68316 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5F656A7D) (attr smd) (fp_text reference R311 (at 0 1.526 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1120 "Net-(R311-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5ED4D857) (at 211.80044 174.7774 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5CAAC367/5F23457C) (attr smd) (fp_text reference C388 (at 0 1.376 270) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5ED4D849) (at 219.43568 174.11192 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5CAAC367/5F232DA9) (attr smd) (fp_text reference C387 (at 0 1.376 270) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:HOLE2.7_PAD5.0 (layer F.Cu) (tedit 5ED15351) (tstamp 5ED6F1AC) (at 287.574 148.160446) (descr "Plated Through Hole: Hole Dia.=2.7mm Pad Dia.=5.0mm") (path /5F05A5A0) (fp_text reference B13 (at -4.5634 -3.333) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value PLATED_HOLE2.7_PAD5.0 (at 0 3.602) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 5 5) (drill 2.95) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C49A6) (at 269.5448 159.8676 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA59/5DAE5428) (attr smd) (fp_text reference R62 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_5K1_1%_0.0625W_100PPM (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 288 /ETH_PHY/MII_MDIO) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C54FB) (at 269.56766 164.1221 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA59/5DAB73E5) (attr smd) (fp_text reference R64 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_5K1_1%_0.0625W_100PPM (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 289 "Net-(R64-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5ED252B5) (at 141.2 164.1) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5ED66DC6) (attr smd) (fp_text reference R310 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 173 /MMC/I2C_PM_SDA) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5ED252A4) (at 141.2 165.5) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5ED7D454) (attr smd) (fp_text reference R309 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 174 /MMC/I2C_PM_SCL) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:OSC_SILICON-LAB_SI570" locked (layer B.Cu) (tedit 0) (tstamp 5ECEF67D) (at 229.37216 99.72548) (descr "Oscillator Si570 Series, 8 pins, 5x7mm") (path /5C16BF13/5F7A252A) (attr smd) (fp_text reference Y6 (at 4.318 -2.70764) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value OSC_10-280MHZ_SILICON-LAB_Si570BBC000121DG (at 0 -4.901) (layer B.Fab) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start -2.6 -2.54) (end -2.1 -2.54) (layer Cmts.User) (width 0.1)) (fp_line (start -2.1 -2.54) (end -2.1 -2.04) (layer Cmts.User) (width 0.1)) (fp_line (start -2.1 -2.54) (end -1.6 -2.54) (layer Cmts.User) (width 0.1)) (fp_line (start -2.1 -3.04) (end -2.1 -2.54) (layer Cmts.User) (width 0.1)) (fp_line (start -2.6 0) (end -2.1 0) (layer Cmts.User) (width 0.1)) (fp_line (start -2.1 0) (end -2.1 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -2.1 0) (end -1.6 0) (layer Cmts.User) (width 0.1)) (fp_line (start -2.1 -0.5) (end -2.1 0) (layer Cmts.User) (width 0.1)) (fp_line (start -2.6 2.54) (end -2.1 2.54) (layer Cmts.User) (width 0.1)) (fp_line (start -2.1 2.54) (end -2.1 3.04) (layer Cmts.User) (width 0.1)) (fp_line (start -2.1 2.54) (end -1.6 2.54) (layer Cmts.User) (width 0.1)) (fp_line (start -2.1 2.04) (end -2.1 2.54) (layer Cmts.User) (width 0.1)) (fp_line (start 1.6 -2.54) (end 2.1 -2.54) (layer Cmts.User) (width 0.1)) (fp_line (start 2.1 -2.54) (end 2.1 -2.04) (layer Cmts.User) (width 0.1)) (fp_line (start 2.1 -2.54) (end 2.6 -2.54) (layer Cmts.User) (width 0.1)) (fp_line (start 2.1 -3.04) (end 2.1 -2.54) (layer Cmts.User) (width 0.1)) (fp_line (start 1.6 0) (end 2.1 0) (layer Cmts.User) (width 0.1)) (fp_line (start 2.1 0) (end 2.1 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 2.1 0) (end 2.6 0) (layer Cmts.User) (width 0.1)) (fp_line (start 2.1 -0.5) (end 2.1 0) (layer Cmts.User) (width 0.1)) (fp_line (start 1.6 2.54) (end 2.1 2.54) (layer Cmts.User) (width 0.1)) (fp_line (start 2.1 2.54) (end 2.1 3.04) (layer Cmts.User) (width 0.1)) (fp_line (start 2.1 2.54) (end 2.6 2.54) (layer Cmts.User) (width 0.1)) (fp_line (start 2.1 2.04) (end 2.1 2.54) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 -2.853) (end 0 -2.853) (layer Cmts.User) (width 0.1)) (fp_line (start 0 -2.853) (end 0 -2.353) (layer Cmts.User) (width 0.1)) (fp_line (start 0 -2.853) (end 0.5 -2.853) (layer Cmts.User) (width 0.1)) (fp_line (start 0 -3.353) (end 0 -2.853) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 2.853) (end 0 2.853) (layer Cmts.User) (width 0.1)) (fp_line (start 0 2.853) (end 0 3.353) (layer Cmts.User) (width 0.1)) (fp_line (start 0 2.853) (end 0.5 2.853) (layer Cmts.User) (width 0.1)) (fp_line (start 0 2.353) (end 0 2.853) (layer Cmts.User) (width 0.1)) (fp_line (start -3.425 -3.875) (end -3.425 3.875) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.425 -3.875) (end 3.425 -3.875) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.425 -3.875) (end 3.425 3.875) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.425 3.875) (end 3.425 3.875) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.5 -3.2) (end -2.5 3.2) (layer B.Fab) (width 0.1)) (fp_line (start -2.2 3.5) (end 2.2 3.5) (layer B.Fab) (width 0.1)) (fp_line (start 2.5 -3.2) (end 2.5 3.2) (layer B.Fab) (width 0.1)) (fp_line (start -2.2 -3.5) (end 2.2 -3.5) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.75) (end 0.65 1.75) (layer B.SilkS) (width 0.2)) (fp_line (start -0.65 -1.75) (end -0.65 1.75) (layer B.SilkS) (width 0.2)) (fp_line (start 0.65 -1.75) (end 0.65 1.75) (layer B.SilkS) (width 0.2)) (fp_line (start -0.65 -1.75) (end 0.65 -1.75) (layer B.SilkS) (width 0.2)) (fp_circle (center -3.875 2.625) (end -3.75 2.625) (layer B.SilkS) (width 0.25)) (fp_circle (center -1.7 2.55) (end -1.3 2.55) (layer B.Fab) (width 0.1)) (fp_arc (start -2.2 -3.2) (end -2.5 -3.2) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start -2.2 3.2) (end -2.2 3.5) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start 2.2 3.2) (end 2.5 3.2) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start 2.2 -3.2) (end 2.2 -3.5) (angle 90) (layer B.Fab) (width 0.1)) (pad 1 smd rect (at -2.1 2.54) (size 2.15 1.7) (layers B.Cu B.Paste B.Mask) (net 1116 "Net-(Y6-Pad1)")) (pad 2 smd rect (at -2.1 0) (size 2.15 1.7) (layers B.Cu B.Paste B.Mask) (net 1117 /SI570_OE)) (pad 4 smd rect (at 2.1 -2.54) (size 2.15 1.7) (layers B.Cu B.Paste B.Mask) (net 1114 /FPGA/SI570_CLK_P)) (pad 3 smd rect (at -2.1 -2.54) (size 2.15 1.7) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 5 smd rect (at 2.1 0) (size 2.15 1.7) (layers B.Cu B.Paste B.Mask) (net 1115 /FPGA/SI570_CLK_N)) (pad 6 smd rect (at 2.1 2.54) (size 2.15 1.7) (layers B.Cu B.Paste B.Mask) (net 461 +3V3_CLEAN)) (pad 8 smd rect (at 0 -2.853 270) (size 1.545 1.3) (layers B.Cu B.Paste B.Mask) (net 293 /FPGA/I2C_APP_SCL)) (pad 7 smd rect (at 0 2.853 270) (size 1.545 1.3) (layers B.Cu B.Paste B.Mask) (net 287 /FPGA/I2C_APP_SDA)) (model ${CERN}/OSC_SILICON-LAB_SI570.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5ECEDC85) (at 225.27768 99.10572 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF13/5F7A4756) (attr smd) (fp_text reference R308 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1117 /SI570_OE) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5ECE38C8) (at 234.2896 105.50144) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5F999C8A) (attr smd) (fp_text reference C386 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1115 /FPGA/SI570_CLK_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 63 /FPGA/FPGA_MGT/MGT_CLK_0_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5ECE38BA) (at 234.2896 104.72928) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5F985F02) (attr smd) (fp_text reference C385 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1114 /FPGA/SI570_CLK_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 61 /FPGA/FPGA_MGT/MGT_CLK_0_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5ECE38AC) (at 229.73792 104.52608 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5F7C6625) (attr smd) (fp_text reference C384 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N locked (layer B.Cu) (tedit 5CAC9F75) (tstamp 5ECE389E) (at 228.854 104.775 270) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF13/5F7EAAD1) (attr smd) (fp_text reference C383 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_1UF_16V_10%_X5R (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (pad 2 smd rect (at 0.45 0 270) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 270) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5ED1BA3B) (at 269.7 155.6) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5EEB6FB0) (attr smd) (fp_text reference R307 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1112 "Net-(LD17-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5ED1BA2A) (at 267.25 155.6 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5EE533ED) (attr smd) (fp_text reference R306 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1110 "Net-(LD16-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:LED_KINGBRIGHT_KPH-1608CGCK (layer F.Cu) (tedit 5ECADA53) (tstamp 5ECD73A2) (at 269.8 154.3) (descr "SMT Green LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm") (path /5C907554/5CAAC367/5EDFE75C) (attr smd) (fp_text reference LD17 (at 5.0534 0.6654) (layer F.SilkS) (effects (font (size 2 2) (thickness 0.4))) ) (fp_text value LED_KINGBRIGHT_KPH-1608CGCK (at 0 1.676) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -1.7 0) (end -1.575 0) (layer F.SilkS) (width 0.25)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 -0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 1.225 0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 -0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.075 -0.4) (end 0.075 -0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.075 0.4) (end 0.075 0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -1.475 0.65) (end 1.475 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 0.65) (end -1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 -0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.475 0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.825 0) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 1112 "Net-(LD17-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.825 0) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 1113 "Net-(LD17-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/LED_KINGBRIGHT_KPH-1608CGCK_Part1.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/LED_KINGBRIGHT_KPH-1608CGCK_Part2.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:LED_KINGBRIGHT_KPH-1608CGCK (layer F.Cu) (tedit 5ECADA53) (tstamp 5ED15488) (at 266.1 154.3) (descr "SMT Green LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm") (path /5C907554/5CAAC367/5EDDD120) (attr smd) (fp_text reference LD16 (at -5.175 0.625) (layer F.SilkS) (effects (font (size 2 2) (thickness 0.4))) ) (fp_text value LED_KINGBRIGHT_KPH-1608CGCK (at 0 1.676) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -1.7 0) (end -1.575 0) (layer F.SilkS) (width 0.25)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 -0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 1.225 0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 -0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.075 -0.4) (end 0.075 -0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.075 0.4) (end 0.075 0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -1.475 0.65) (end 1.475 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 0.65) (end -1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 -0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.475 0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.825 0) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 1110 "Net-(LD16-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.825 0) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 1111 "Net-(LD16-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/LED_KINGBRIGHT_KPH-1608CGCK_Part1.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/LED_KINGBRIGHT_KPH-1608CGCK_Part2.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N locked (layer B.Cu) (tedit 5CACA158) (tstamp 5C6A03A6) (at 235.712 188.722 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DAF13F0) (attr smd) (fp_text reference C141 (at 0 2.176 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_22UF_25V_20%_X5R (at 0 -2.176 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (pad 2 smd rect (at 0.9 0 180) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5C69FE97) (at 197.104 198.247 270) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5BD31F9A/5C9B3966) (attr smd) (fp_text reference C62 (at 0 2.176 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_22UF_25V_20%_X5R (at 0 -2.176 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (pad 2 smd rect (at 0.9 0 270) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 270) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 462 +12V_FMC1) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5ECAEB65) (at 183.515 123.444 90) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5BD31F9F/5C7575B8) (attr smd) (fp_text reference C6 (at 0 2.176 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_22UF_25V_20%_X5R (at 0 -2.176 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (pad 2 smd rect (at 0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 460 +12V_FMC2) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:HOLE2.7_PAD5.0 (layer F.Cu) (tedit 5EB055AB) (tstamp 5EC94346) (at 243.374 175.96) (descr "Plated Through Hole: Hole Dia.=2.7mm Pad Dia.=5.0mm") (path /5ECD6329) (fp_text reference B12 (at -4.5634 -3.333) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value PLATED_HOLE2.7_PAD5.0 (at 0 3.602) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 5 5) (drill 2.95) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) ) (module Marble:HOLE2.7_PAD5.0 (layer F.Cu) (tedit 5EB055AB) (tstamp 5EC94341) (at 227.974 73.16) (descr "Plated Through Hole: Hole Dia.=2.7mm Pad Dia.=5.0mm") (path /5ECD5570) (fp_text reference B11 (at -4.5634 -3.333) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value PLATED_HOLE2.7_PAD5.0 (at 0 3.602) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 5 5) (drill 2.95) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) ) (module Marble:SAMTEC_FTSH-105-01-L-DV-K (layer F.Cu) (tedit 5EC7C5D2) (tstamp 5ECB72DD) (at 211.6963 83.8073) (descr "translated Allegro footprint") (path /5CA40231/5E9BF6F9) (attr smd) (fp_text reference J14 (at -6.3119 -2.1336 180) (layer F.SilkS) (effects (font (size 2 2) (thickness 0.4))) ) (fp_text value FTSH-105-01-L-DV-K (at 12.425 4.565) (layer F.Fab) (effects (font (size 1 1) (thickness 0.015))) ) (fp_circle (center -3.6 2.4) (end -3.458581 2.4) (layer F.SilkS) (width 0.127)) (fp_line (start -3.425 3.7) (end -3.425 -3.7) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.425 3.7) (end -3.425 3.7) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.425 -3.7) (end 3.425 3.7) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.425 -3.7) (end 3.425 -3.7) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.54 2.54) (end 2.54 1.715) (layer F.Fab) (width 0.127)) (fp_line (start -2.54 2.54) (end 2.54 2.54) (layer F.Fab) (width 0.127)) (fp_line (start -2.54 1.715) (end -2.54 2.54) (layer F.Fab) (width 0.127)) (fp_line (start 2.54 -2.54) (end 2.54 -1.715) (layer F.Fab) (width 0.127)) (fp_line (start -2.54 -2.54) (end 2.54 -2.54) (layer F.Fab) (width 0.127)) (fp_line (start -2.54 -1.715) (end -2.54 -2.54) (layer F.Fab) (width 0.127)) (fp_line (start -2.54 -1.715) (end -3.175 -1.715) (layer F.Fab) (width 0.127)) (fp_line (start 2.54 -1.715) (end -2.54 -1.715) (layer F.Fab) (width 0.127)) (fp_circle (center -3.6 2.4) (end -3.458581 2.4) (layer F.Fab) (width 0.127)) (fp_line (start 3.175 -1.715) (end 2.54 -1.715) (layer F.Fab) (width 0.127)) (fp_line (start 3.175 1.715) (end 3.175 -1.715) (layer F.Fab) (width 0.127)) (fp_line (start 2.54 1.715) (end 3.175 1.715) (layer F.Fab) (width 0.127)) (fp_line (start -2.54 1.715) (end 2.54 1.715) (layer F.Fab) (width 0.127)) (fp_line (start -3.175 1.715) (end -2.54 1.715) (layer F.Fab) (width 0.127)) (fp_line (start -3.175 -1.715) (end -3.175 1.715) (layer F.Fab) (width 0.127)) (fp_line (start 3.175 1.715) (end 3.175 -1.715) (layer F.SilkS) (width 0.127)) (fp_line (start -3.175 -1.715) (end -3.175 1.715) (layer F.SilkS) (width 0.127)) (pad 10 smd rect (at 2.54 -2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask) (net 107 /LPC_RST)) (pad 9 smd rect (at 2.54 2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 8 smd rect (at 1.27 -2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask) (net 195 /MMC_TDI)) (pad 7 smd rect (at 1.27 2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask) (net 739 "Net-(J14-Pad7)")) (pad 6 smd rect (at 0 -2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask) (net 369 /MMC_TDO)) (pad 5 smd rect (at 0 2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 4 smd rect (at -1.27 -2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask) (net 196 /MMC_TCK)) (pad 3 smd rect (at -1.27 2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 2 smd rect (at -2.54 -2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask) (net 197 /MMC_TMS)) (pad 1 smd rect (at -2.54 2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask) (net 655 +3V3P)) ) (module "ICs And Semiconductors SMD:LED_KINGBRIGHT_KPH-1608CGCK" (layer F.Cu) (tedit 0) (tstamp 5C629204) (at 221.4372 205.3336 90) (descr "SMT Green LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm") (path /5C16BF8E/5DB9B7E6/5C731472) (attr smd) (fp_text reference LD10 (at -3.937 0.1524 270) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value LED_KINGBRIGHT_KPH-1608CGCK (at 0 1.676 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.475 0.65) (end 1.475 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 0.65) (end -1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 -0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.475 0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.075 -0.4) (end 0.075 -0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.075 0.4) (end 0.075 0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.425 0) (end 0.425 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 -0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 1.225 0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 -0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_circle (center -1.7 0) (end -1.575 0) (layer F.SilkS) (width 0.25)) (pad 1 smd rect (at -0.825 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 2 smd rect (at 0.825 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 483 "Net-(LD10-Pad2)")) ) (module "ICs And Semiconductors SMD:LED_KINGBRIGHT_KPH-1608CGCK" (layer F.Cu) (tedit 0) (tstamp 5C6291DF) (at 218.4654 205.3336 90) (descr "SMT Green LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm") (path /5C16BF8E/5DB9B7E6/5C6088EF) (attr smd) (fp_text reference LD9 (at -3.3528 0.0254 270) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value LED_KINGBRIGHT_KPH-1608CGCK (at 0 1.676 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.475 0.65) (end 1.475 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 0.65) (end -1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 -0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.475 0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.075 -0.4) (end 0.075 -0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.075 0.4) (end 0.075 0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.425 0) (end 0.425 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 -0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 1.225 0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 -0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_circle (center -1.7 0) (end -1.575 0) (layer F.SilkS) (width 0.25)) (pad 1 smd rect (at -0.825 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 481 "Net-(LD9-Pad1)")) (pad 2 smd rect (at 0.825 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 482 "Net-(LD9-Pad2)")) ) (module "ICs And Semiconductors SMD:LED_KINGBRIGHT_KPH-1608CGCK" (layer F.Cu) (tedit 0) (tstamp 5C6291BA) (at 215.4174 205.3336 90) (descr "SMT Green LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm") (path /5C16BF8E/5DB9B7E6/5C608896) (attr smd) (fp_text reference LD8 (at -3.302 -0.0508 270) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value LED_KINGBRIGHT_KPH-1608CGCK (at 0 1.676 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.475 0.65) (end 1.475 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 0.65) (end -1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 -0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.475 0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.075 -0.4) (end 0.075 -0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.075 0.4) (end 0.075 0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.425 0) (end 0.425 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 -0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 1.225 0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 -0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_circle (center -1.7 0) (end -1.575 0) (layer F.SilkS) (width 0.25)) (pad 1 smd rect (at -0.825 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 479 "Net-(LD8-Pad1)")) (pad 2 smd rect (at 0.825 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 480 "Net-(LD8-Pad2)")) ) (module "ICs And Semiconductors SMD:LED_KINGBRIGHT_KPH-1608CGCK" (layer F.Cu) (tedit 0) (tstamp 5C61604B) (at 208.8896 205.4098 90) (descr "SMT Green LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm") (path /5C16BF8E/5DB9B7E6/5C5F3485) (attr smd) (fp_text reference LD7 (at -3.429 -0.0254 270) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value LED_KINGBRIGHT_KPH-1608CGCK (at 0 1.676 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.475 0.65) (end 1.475 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 0.65) (end -1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 -0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.475 0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.075 -0.4) (end 0.075 -0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.075 0.4) (end 0.075 0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.425 0) (end 0.425 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 -0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 1.225 0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 -0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_circle (center -1.7 0) (end -1.575 0) (layer F.SilkS) (width 0.25)) (pad 1 smd rect (at -0.825 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 477 "Net-(LD7-Pad1)")) (pad 2 smd rect (at 0.825 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 478 "Net-(LD7-Pad2)")) ) (module "ICs And Semiconductors SMD:LED_KINGBRIGHT_KPH-1608CGCK" (layer F.Cu) (tedit 0) (tstamp 5C629170) (at 205.4225 205.3971 90) (descr "SMT Green LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm") (path /5C16BF8E/5DB9B7E6/5C8E4A18) (attr smd) (fp_text reference LD6 (at -3.429 0.0254 270) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value LED_KINGBRIGHT_KPH-1608CGCK (at 0 1.676 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.475 0.65) (end 1.475 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 0.65) (end -1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 -0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.475 0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.075 -0.4) (end 0.075 -0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.075 0.4) (end 0.075 0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.425 0) (end 0.425 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 -0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 1.225 0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 -0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_circle (center -1.7 0) (end -1.575 0) (layer F.SilkS) (width 0.25)) (pad 1 smd rect (at -0.825 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 2 smd rect (at 0.825 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 476 "Net-(LD6-Pad2)")) ) (module "ICs And Semiconductors SMD:LED_KINGBRIGHT_KPH-1608CGCK" (layer F.Cu) (tedit 0) (tstamp 5C62914B) (at 202.2348 205.4098 90) (descr "SMT Green LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm") (path /5C16BF8E/5DB9B7E6/5C5DE2AF) (attr smd) (fp_text reference LD5 (at -3.7846 0.1524 270) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value LED_KINGBRIGHT_KPH-1608CGCK (at 0 1.676 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.475 0.65) (end 1.475 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 0.65) (end -1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 -0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.475 0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.075 -0.4) (end 0.075 -0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.075 0.4) (end 0.075 0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.425 0) (end 0.425 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 -0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 1.225 0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 -0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_circle (center -1.7 0) (end -1.575 0) (layer F.SilkS) (width 0.25)) (pad 1 smd rect (at -0.825 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 474 "Net-(LD5-Pad1)")) (pad 2 smd rect (at 0.825 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 475 "Net-(LD5-Pad2)")) ) (module "ICs And Semiconductors SMD:LED_KINGBRIGHT_KPH-1608CGCK" (layer F.Cu) (tedit 0) (tstamp 5C629126) (at 199.6948 205.3336 90) (descr "SMT Green LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm") (path /5C16BF8E/5DB9B7E6/5C849AD9) (attr smd) (fp_text reference LD4 (at -3.1242 0.1016 270) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value LED_KINGBRIGHT_KPH-1608CGCK (at 0 1.676 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.475 0.65) (end 1.475 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 0.65) (end -1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 -0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.475 0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.075 -0.4) (end 0.075 -0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.075 0.4) (end 0.075 0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.425 0) (end 0.425 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 -0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 1.225 0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 -0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_circle (center -1.7 0) (end -1.575 0) (layer F.SilkS) (width 0.25)) (pad 1 smd rect (at -0.825 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 2 smd rect (at 0.825 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 473 "Net-(LD4-Pad2)")) ) (module "ICs And Semiconductors SMD:LED_KINGBRIGHT_KPH-1608CGCK" (layer F.Cu) (tedit 0) (tstamp 5C6AF48B) (at 195.866401 208.620801 180) (descr "SMT Green LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm") (path /5C907554/5C417BCB/5D931079) (attr smd) (fp_text reference LD3 (at -0.032401 -1.407601) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value LED_KINGBRIGHT_KPH-1608CGCK (at 0 1.676) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.475 0.65) (end 1.475 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 0.65) (end -1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 -0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.475 0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.075 -0.4) (end 0.075 -0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.075 0.4) (end 0.075 0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.425 0) (end 0.425 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 -0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 1.225 0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 -0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_circle (center -1.7 0) (end -1.575 0) (layer F.SilkS) (width 0.25)) (pad 1 smd rect (at -0.825 0 180) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 209 "Net-(LD3-Pad1)")) (pad 2 smd rect (at 0.825 0 180) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 210 "Net-(LD3-Pad2)")) ) (module "ICs And Semiconductors SMD:LED_KINGBRIGHT_KPH-1608CGCK" (layer F.Cu) (tedit 0) (tstamp 5C6AF466) (at 196.6087 138.8364) (descr "SMT Green LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm") (path /5C16BF8E/5D982A9A) (attr smd) (fp_text reference LD2 (at 0.0127 -1.7526 180) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value LED_KINGBRIGHT_KPH-1608CGCK (at 0 1.676 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.475 0.65) (end 1.475 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 0.65) (end -1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 -0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.475 0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.075 -0.4) (end 0.075 -0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.075 0.4) (end 0.075 0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.425 0) (end 0.425 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 -0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 1.225 0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 -0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_circle (center -1.7 0) (end -1.575 0) (layer F.SilkS) (width 0.25)) (pad 1 smd rect (at -0.825 0) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 2 smd rect (at 0.825 0) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 208 "Net-(LD2-Pad2)")) ) (module "ICs And Semiconductors SMD:LED_KINGBRIGHT_KPH-1608CGCK" (layer F.Cu) (tedit 0) (tstamp 5C6AF441) (at 200.914 200.3298 270) (descr "SMT Green LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm") (path /5C16BF8E/5D97275B) (attr smd) (fp_text reference LD1 (at 3.2766 -0.0508 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value LED_KINGBRIGHT_KPH-1608CGCK (at 0 1.676 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.475 0.65) (end 1.475 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 0.65) (end -1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.475 -0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.475 0.65) (end 1.475 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.075 -0.4) (end 0.075 -0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.075 0.4) (end 0.075 0.4) (layer F.SilkS) (width 0.2)) (fp_line (start -0.425 0) (end 0.425 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 -0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 1.225 0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 -0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_circle (center -1.7 0) (end -1.575 0) (layer F.SilkS) (width 0.25)) (pad 1 smd rect (at -0.825 0 270) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 2 smd rect (at 0.825 0 270) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask) (net 207 "Net-(LD1-Pad2)")) ) (module "ICs And Semiconductors SMD:LED_KINGBRIGHT_KPH-1608CGCK" (layer B.Cu) (tedit 0) (tstamp 5CF60682) (at 136.2964 213.1822 90) (descr "SMT Green LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm") (path /5BCEDA39/5E74B863) (attr smd) (fp_text reference LD15 (at 0 1.676 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value LED_KINGBRIGHT_KPH-1608CGCK (at 0 -1.676 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.475 -0.65) (end 1.475 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.475 -0.65) (end -1.475 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.475 0.65) (end 1.475 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.475 -0.65) (end 1.475 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.075 0.4) (end 0.075 0.4) (layer B.SilkS) (width 0.2)) (fp_line (start -0.075 -0.4) (end 0.075 -0.4) (layer B.SilkS) (width 0.2)) (fp_line (start -0.425 0) (end 0.425 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.425 -0.4) (end 0.425 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.825 0) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 0) (end 0.425 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.825 0) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.425 -0.4) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 0.4) (end -0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 -0.4) (end -1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.225 -0.4) (end -0.425 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 1.225 -0.4) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 0.4) (end 1.225 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 -0.4) (end 0.425 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.425 -0.4) (end 1.225 -0.4) (layer Cmts.User) (width 0.1)) (fp_circle (center -1.7 0) (end -1.575 0) (layer B.SilkS) (width 0.25)) (pad 1 smd rect (at -0.825 0 90) (size 0.8 0.8) (layers B.Cu B.Paste B.Mask) (net 669 "Net-(LD15-Pad1)")) (pad 2 smd rect (at 0.825 0 90) (size 0.8 0.8) (layers B.Cu B.Paste B.Mask) (net 668 "Net-(LD15-Pad2)")) ) (module Marble:SOT95P280X145-5N (layer B.Cu) (tedit 5CACBC79) (tstamp 5EC671EB) (at 184.9882 118.8212 90) (descr "SOT, 0.95mm pitch; 5 pin, 1.60mm W X 2.90mm L X 1.45mm H body, IPC Medium Density") (path /5BD31F9F/5F1A53D5) (attr smd) (fp_text reference U44 (at 0 3.001 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value MIC2090-1YM5TR (at 0 -2.826 90) (layer B.Fab) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.6 1.75) (end -1.475 1.75) (layer B.SilkS) (width 0.25)) (fp_line (start -0.425 -1.45) (end -0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.425 1.45) (end 0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.425 -1.45) (end 0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.425 -1.45) (end 0.425 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.8 -1.45) (end -0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.45) (end 0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -1.45) (end 0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -1.45) (end 0.8 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.45) (end 0.2 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.55) (end 0.1 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.65) (end 0 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.75) (end -0.1 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.85) (end -0.2 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.95) (end -0.3 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.05) (end -0.4 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.15) (end -0.5 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.25) (end -0.6 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.35) (end -0.7 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -2.1 -1.8) (end -2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.1 1.8) (end 2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.1 -1.8) (end 2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.1 -1.8) (end 2.1 -1.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.3 0.95 90) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.3 0 90) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at -1.3 -0.95 90) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask) (net 1106 "Net-(R259-Pad2)") (solder_mask_margin 0.102)) (pad 4 smd rect (at 1.3 -0.95 90) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask) (net 653 /FMC_2/FMC2_FUSE) (solder_mask_margin 0.102)) (pad 5 smd rect (at 1.3 0.95 90) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask) (net 4 /FMC_2/FMC2_3P3VAUX) (solder_mask_margin 0.102)) (model ${CERN}/SOT95P280X145-5N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SOT95P280X145-5N (layer B.Cu) (tedit 5CACBC79) (tstamp 5EC6720D) (at 183.7944 192.278 90) (descr "SOT, 0.95mm pitch; 5 pin, 1.60mm W X 2.90mm L X 1.45mm H body, IPC Medium Density") (path /5BD31F9A/5ED8DEEB) (attr smd) (fp_text reference U45 (at 0 3.001 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value MIC2090-1YM5TR (at 0 -2.826 90) (layer B.Fab) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.6 1.75) (end -1.475 1.75) (layer B.SilkS) (width 0.25)) (fp_line (start -0.425 -1.45) (end -0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.425 1.45) (end 0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.425 -1.45) (end 0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.425 -1.45) (end 0.425 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.8 -1.45) (end -0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.45) (end 0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -1.45) (end 0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -1.45) (end 0.8 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.45) (end 0.2 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.55) (end 0.1 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.65) (end 0 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.75) (end -0.1 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.85) (end -0.2 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.95) (end -0.3 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.05) (end -0.4 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.15) (end -0.5 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.25) (end -0.6 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.35) (end -0.7 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -2.1 -1.8) (end -2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.1 1.8) (end 2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.1 -1.8) (end 2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.1 -1.8) (end 2.1 -1.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.3 0.95 90) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.3 0 90) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at -1.3 -0.95 90) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask) (net 1107 "Net-(R261-Pad2)") (solder_mask_margin 0.102)) (pad 4 smd rect (at 1.3 -0.95 90) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask) (net 654 /FMC_1/FMC1_FUSE) (solder_mask_margin 0.102)) (pad 5 smd rect (at 1.3 0.95 90) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask) (net 18 /FMC_1/FMC1_3P3VAUX) (solder_mask_margin 0.102)) (model ${CERN}/SOT95P280X145-5N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SOP65P490X110-8N (layer B.Cu) (tedit 5CACB92A) (tstamp 5ECCD22C) (at 197.6755 72.9361 180) (descr "SOP, 0.65mm pitch; 8 pin, 3.00mm W X 3.00mm L X 1.10mm H body, IPC Medium Density") (path /5C907554/5CAAC367/5EE8CD44) (attr smd) (fp_text reference U46 (at 0 2.951) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value TCA9517DGKR (at 0 -2.826) (layer B.Fab) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -2.7 1.7) (end -2.575 1.7) (layer B.SilkS) (width 0.25)) (fp_line (start -1.125 -1.5) (end 1.125 -1.5) (layer B.SilkS) (width 0.2)) (fp_line (start 1.125 -1.5) (end 1.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 1.5) (end 1.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 -1.5) (end -1.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 1.3) (end -0.925 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 1.1) (end -0.725 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 0.9) (end -0.525 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 0.7) (end -0.325 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 0.5) (end -0.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.5 -1.5) (end 1.5 -1.5) (layer B.Fab) (width 0.1)) (fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.5) (end 1.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -1.5) (end -1.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.5) (end -0.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.6) (end -0.6 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.7) (end -0.7 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.8) (end -0.8 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.9) (end -0.9 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1) (end -1 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.1) (end -1.1 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.2) (end -1.2 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.3) (end -1.3 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.4) (end -1.4 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -3.2 -1.8) (end -3.2 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.2 1.8) (end 3.2 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.2 -1.8) (end 3.2 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.2 -1.8) (end 3.2 -1.8) (layer B.CrtYd) (width 0.05)) (pad 8 smd rect (at 2.2 0.975 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.2 0.325 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 282 /FPGA/I2C_FPGA_SCL) (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.2 -0.325 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 283 /FPGA/I2C_FPGA_SDA) (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.2 -0.975 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 1122 "Net-(R313-Pad1)") (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.2 -0.975 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.2 -0.325 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 1108 /FPGA/FPGA_15_16/I2C_SDA) (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.2 0.325 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 1109 /FPGA/FPGA_15_16/I2C_SCL) (solder_mask_margin 0.102)) (pad 1 smd rect (at -2.2 0.975 180) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model SOP65P490X110-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/SOP65P490X110-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5ECCBA6C) (at 203.3651 73.1901 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5EF7A823) (attr smd) (fp_text reference R305 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1109 /FPGA/FPGA_15_16/I2C_SCL) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5ECCBA5B) (at 203.3651 74.2315 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5EF7A7F7) (attr smd) (fp_text reference R304 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1108 /FPGA/FPGA_15_16/I2C_SDA) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5ECC176A) (at 193.4464 71.9582 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5CAAC367/5F087A29) (attr smd) (fp_text reference C382 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5ECC175C) (at 202.0189 71.9582) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5CAAC367/5F0659CE) (attr smd) (fp_text reference C381 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5C8F6A4C) (at 293.624 159.2326 270) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C907554/5CAAC367/5F501BA6) (attr smd) (fp_text reference C103 (at 0 1.976 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.976 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 180) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 180) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:TestPoint_Pad_D1.0mm (layer F.Cu) (tedit 5EBDD6A4) (tstamp 5EBFAC6F) (at 149.3012 105.664) (descr "Through hole test point, diameter 1.0mm") (tags "test point") (path /5C16C03C/5EC72E04) (attr virtual) (fp_text reference TP11 (at -3.2512 0.381) (layer F.SilkS) (effects (font (size 1.2 1.2) (thickness 0.24))) ) (fp_text value TestPoint (at 0 1.75) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 1.1 0) (layer F.CrtYd) (width 0.05)) (fp_circle (center 0 0) (end 0.8 0) (layer B.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 0.8 0) (layer F.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 1.1 0) (layer B.CrtYd) (width 0.05)) (fp_text user %R (at 0 -1.5) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask) (net 663 +3V3_USB)) ) (module Marble:TestPoint_Pad_D1.0mm (layer F.Cu) (tedit 5EBDD6A4) (tstamp 5EBE279D) (at 219.202 184.3532) (descr "Through hole test point, diameter 1.0mm") (tags "test point") (path /5C16BF8E/5ED1928E) (attr virtual) (fp_text reference TP10 (at 1.016 1.8288) (layer F.SilkS) (effects (font (size 1.2 1.2) (thickness 0.24))) ) (fp_text value TestPoint (at 0 1.75) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 1.1 0) (layer F.CrtYd) (width 0.05)) (fp_circle (center 0 0) (end 0.8 0) (layer B.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 0.8 0) (layer F.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 1.1 0) (layer B.CrtYd) (width 0.05)) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask) (net 655 +3V3P)) ) (module Marble:TestPoint_Pad_D1.0mm (layer F.Cu) (tedit 5EBDD6A4) (tstamp 5EBE2793) (at 224.01276 103.6574) (descr "Through hole test point, diameter 1.0mm") (tags "test point") (path /5BD32060/5ECF58E8) (attr virtual) (fp_text reference TP9 (at 2.55524 0.9906) (layer F.SilkS) (effects (font (size 1.2 1.2) (thickness 0.24))) ) (fp_text value TestPoint (at 0 1.75) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 1.1 0) (layer F.CrtYd) (width 0.05)) (fp_circle (center 0 0) (end 0.8 0) (layer B.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 0.8 0) (layer F.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 1.1 0) (layer B.CrtYd) (width 0.05)) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask) (net 487 VTT_DDR3)) ) (module Marble:TestPoint_Pad_D1.0mm (layer F.Cu) (tedit 5EBDD6A4) (tstamp 5EBE2789) (at 239.1156 162.306) (descr "Through hole test point, diameter 1.0mm") (tags "test point") (path /5C16BF8E/5DB9B7E6/5EC8839F) (attr virtual) (fp_text reference TP8 (at -0.1016 -1.905) (layer F.SilkS) (effects (font (size 1.2 1.2) (thickness 0.24))) ) (fp_text value TestPoint (at 0 1.75) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 1.1 0) (layer F.CrtYd) (width 0.05)) (fp_circle (center 0 0) (end 0.8 0) (layer B.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 0.8 0) (layer F.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 1.1 0) (layer B.CrtYd) (width 0.05)) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask) (net 490 MGTAVTT)) ) (module Marble:TestPoint_Pad_D1.0mm (layer F.Cu) (tedit 5EBDD6A4) (tstamp 5EBE277F) (at 217.932 142.24) (descr "Through hole test point, diameter 1.0mm") (tags "test point") (path /5C16BF8E/5DB9B7E6/5EC72B65) (attr virtual) (fp_text reference TP7 (at 0 -1.5) (layer F.SilkS) (effects (font (size 1.2 1.2) (thickness 0.24))) ) (fp_text value TestPoint (at 0 1.75) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 1.1 0) (layer F.CrtYd) (width 0.05)) (fp_circle (center 0 0) (end 0.8 0) (layer B.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 0.8 0) (layer F.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 1.1 0) (layer B.CrtYd) (width 0.05)) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask) (net 488 VCCAUX)) ) (module Marble:TestPoint_Pad_D1.0mm (layer F.Cu) (tedit 5EBDD6A4) (tstamp 5EBE2EAA) (at 259.0292 161.1376) (descr "Through hole test point, diameter 1.0mm") (tags "test point") (path /5C16BF8E/5DB9B7E6/5ED8D8B0) (attr virtual) (fp_text reference TP6 (at -2.9972 0.2794) (layer F.SilkS) (effects (font (size 1.2 1.2) (thickness 0.24))) ) (fp_text value TestPoint (at 0 1.75) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 1.1 0) (layer F.CrtYd) (width 0.05)) (fp_circle (center 0 0) (end 0.8 0) (layer B.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 0.8 0) (layer F.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 1.1 0) (layer B.CrtYd) (width 0.05)) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask) (net 14 +1V0)) ) (module Marble:TestPoint_Pad_D1.0mm (layer F.Cu) (tedit 5EBDD6A4) (tstamp 5EBE2EA2) (at 213.614 90.678) (descr "Through hole test point, diameter 1.0mm") (tags "test point") (path /5C16BF8E/5DB9B7E6/5ED86CAA) (attr virtual) (fp_text reference TP5 (at 0 -1.651) (layer F.SilkS) (effects (font (size 1.2 1.2) (thickness 0.24))) ) (fp_text value TestPoint (at 0 1.75) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 1.1 0) (layer F.CrtYd) (width 0.05)) (fp_circle (center 0 0) (end 0.8 0) (layer B.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 0.8 0) (layer F.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 1.1 0) (layer B.CrtYd) (width 0.05)) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask) (net 3 +3V3)) ) (module Marble:TestPoint_Pad_D1.0mm (layer F.Cu) (tedit 5EBDD6A4) (tstamp 5EBE2E9A) (at 240.03 88.9) (descr "Through hole test point, diameter 1.0mm") (tags "test point") (path /5C16BF8E/5DB9B7E6/5ED7EA90) (attr virtual) (fp_text reference TP4 (at 0 -1.5) (layer F.SilkS) (effects (font (size 1.2 1.2) (thickness 0.24))) ) (fp_text value TestPoint (at 0 1.75) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 1.1 0) (layer F.CrtYd) (width 0.05)) (fp_circle (center 0 0) (end 0.8 0) (layer B.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 0.8 0) (layer F.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 1.1 0) (layer B.CrtYd) (width 0.05)) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask) (net 5 +2V5)) ) (module Marble:TestPoint_Pad_D1.0mm (layer F.Cu) (tedit 5EBDD6A4) (tstamp 5EBE2E92) (at 242.316 109.22) (descr "Through hole test point, diameter 1.0mm") (tags "test point") (path /5C16BF8E/5DB9B7E6/5ED7CF0D) (attr virtual) (fp_text reference TP3 (at 2.54 0) (layer F.SilkS) (effects (font (size 1.2 1.2) (thickness 0.24))) ) (fp_text value TestPoint (at 0 1.75) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 1.1 0) (layer F.CrtYd) (width 0.05)) (fp_circle (center 0 0) (end 0.8 0) (layer B.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 0.8 0) (layer F.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 1.1 0) (layer B.CrtYd) (width 0.05)) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask) (net 6 +1V35)) ) (module Marble:TestPoint_Pad_D1.0mm (layer F.Cu) (tedit 5EBDD6A4) (tstamp 5EBE2E8A) (at 257.302 184.404) (descr "Through hole test point, diameter 1.0mm") (tags "test point") (path /5C16BF8E/5ED180B0) (attr virtual) (fp_text reference TP2 (at -2.54 0) (layer F.SilkS) (effects (font (size 1.2 1.2) (thickness 0.24))) ) (fp_text value TestPoint (at 0 1.75) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 1.1 0) (layer F.CrtYd) (width 0.05)) (fp_circle (center 0 0) (end 0.8 0) (layer B.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 0.8 0) (layer F.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 1.1 0) (layer B.CrtYd) (width 0.05)) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask) (net 1105 /Power/+12VS)) ) (module Marble:TestPoint_Pad_D1.0mm (layer F.Cu) (tedit 5EBDD6A4) (tstamp 5EBE2E82) (at 224.028 201.168) (descr "Through hole test point, diameter 1.0mm") (tags "test point") (path /5C16BF8E/5ECE8EDE) (attr virtual) (fp_text reference TP1 (at -2.413 -0.254) (layer F.SilkS) (effects (font (size 1.2 1.2) (thickness 0.24))) ) (fp_text value TestPoint (at 0 1.75) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 1.1 0) (layer F.CrtYd) (width 0.05)) (fp_circle (center 0 0) (end 0.8 0) (layer B.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 0.8 0) (layer F.SilkS) (width 0.12)) (fp_circle (center 0 0) (end 1.1 0) (layer B.CrtYd) (width 0.05)) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text user %R (at 0 -1.5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask) (net 101 "Net-(C350-Pad1)")) ) (module Marble:RESC3216X80N (layer B.Cu) (tedit 5CACBBBA) (tstamp 5EBEAA4A) (at 255.016 196.85 90) (descr "Chip Resistor, EIA 1206, Metric 3216, Body 3.2x1.6mm, IPC Medium Density") (path /5C16BF8E/5EC3CCA4) (attr smd) (fp_text reference R303 (at 0 2.226 270) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R1206_0R082_1%_0.5W_100PPM (at 0 -2.226 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0.8) (end 0.5 0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 -0.8) (end 0.5 -0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.815) (end -1.6 0.815) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.815) (end 1.6 0.815) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.815) (end 1.6 0.815) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.815) (end 1.6 -0.815) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -2.4 -1.2) (end -2.4 1.2) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.4 1.2) (end 2.4 1.2) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.4 -1.2) (end 2.4 1.2) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.4 -1.2) (end 2.4 -1.2) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.5 0) (size 1.85 1.25) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 2 smd rect (at 1.5 0) (size 1.85 1.25) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model ${CERN}/RESC3216X80N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC3216X80N (layer B.Cu) (tedit 5CACBBBA) (tstamp 5EBEAA37) (at 257.81 196.85 90) (descr "Chip Resistor, EIA 1206, Metric 3216, Body 3.2x1.6mm, IPC Medium Density") (path /5C16BF8E/5EC3BF6F) (attr smd) (fp_text reference R302 (at 0 2.226 270) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R1206_0R082_1%_0.5W_100PPM (at 0 -2.226 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0.8) (end 0.5 0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 -0.8) (end 0.5 -0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.815) (end -1.6 0.815) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.815) (end 1.6 0.815) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.815) (end 1.6 0.815) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.815) (end 1.6 -0.815) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -2.4 -1.2) (end -2.4 1.2) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.4 1.2) (end 2.4 1.2) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.4 -1.2) (end 2.4 1.2) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.4 -1.2) (end 2.4 -1.2) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.5 0) (size 1.85 1.25) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 2 smd rect (at 1.5 0) (size 1.85 1.25) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model ${CERN}/RESC3216X80N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SOT65P280X145-8N (layer B.Cu) (tedit 5CACBB9F) (tstamp 5EC0334B) (at 250.444 197.485 180) (descr "SOT, 0.65mm pitch; 8 pin, 1.625mm W X 2.90mm L X 1.45mm H body, IPC Medium Density") (path /5C16BF8E/5EEFD270) (attr smd) (fp_text reference U43 (at 3.1242 -0.0254 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value INA219BIDCNT (at 0 -2.826) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.6 1.7) (end -1.475 1.7) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.425 -1.45) (end 0.425 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.425 -1.45) (end 0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.425 1.45) (end 0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.425 -1.45) (end -0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.8 1.35) (end -0.7 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.25) (end -0.6 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.15) (end -0.5 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.05) (end -0.4 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.95) (end -0.3 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.85) (end -0.2 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.75) (end -0.1 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.65) (end 0 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.55) (end 0.1 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.45) (end 0.2 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -1.45) (end 0.8 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -1.45) (end 0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.45) (end 0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -1.45) (end -0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -2.1 -1.8) (end 2.1 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.1 -1.8) (end 2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.1 1.8) (end 2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.1 -1.8) (end -2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 8 smd rect (at 1.3 0.975 180) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 7 smd rect (at 1.3 0.325 180) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 287 /FPGA/I2C_APP_SDA) (solder_mask_margin 0.102)) (pad 6 smd rect (at 1.3 -0.325 180) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 287 /FPGA/I2C_APP_SDA) (solder_mask_margin 0.102)) (pad 5 smd rect (at 1.3 -0.975 180) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 293 /FPGA/I2C_APP_SCL) (solder_mask_margin 0.102)) (pad 4 smd rect (at -1.3 -0.975 180) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 3 smd rect (at -1.3 -0.325 180) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.3 0.325 180) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -1.3 0.975 180) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model ${CERN}/SOT65P280X145-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5EBF7A73) (at 251.333 199.644 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF8E/5EEFD242) (attr smd) (fp_text reference C380 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC3216X80N (layer B.Cu) (tedit 5CACBBBA) (tstamp 5EBAFEF3) (at 260.604 196.85 90) (descr "Chip Resistor, EIA 1206, Metric 3216, Body 3.2x1.6mm, IPC Medium Density") (path /5C16BF8E/5EC1B35B) (attr smd) (fp_text reference R301 (at 0 2.226 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R1206_0R082_1%_0.5W_100PPM (at 0 -2.226 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0.8) (end 0.5 0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 -0.8) (end 0.5 -0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.815) (end -1.6 0.815) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.815) (end 1.6 0.815) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.815) (end 1.6 0.815) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.815) (end 1.6 -0.815) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -2.4 -1.2) (end -2.4 1.2) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.4 1.2) (end 2.4 1.2) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.4 -1.2) (end 2.4 1.2) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.4 -1.2) (end 2.4 -1.2) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.5 0) (size 1.85 1.25) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 2 smd rect (at 1.5 0) (size 1.85 1.25) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model ${CERN}/RESC3216X80N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1608X55N (layer B.Cu) (tedit 5CACA4D6) (tstamp 5CA4F80A) (at 280.9494 175.641 90) (descr "Chip Resistor, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5BCEDA59/5DAA9D8C) (attr smd) (fp_text reference R66 (at 0 1.776 270) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0603_4K99_1%_0.063W_50PPM (at 0 -1.776 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.4 -0.65) (end -1.4 0.65) (layer B.Fab) (width 0.1)) (fp_line (start -1.4 0.65) (end 1.4 0.65) (layer B.Fab) (width 0.1)) (fp_line (start 1.4 -0.65) (end 1.4 0.65) (layer B.Fab) (width 0.1)) (fp_line (start -1.4 -0.65) (end 1.4 -0.65) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0 90) (size 0.9 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0 90) (size 0.9 1) (layers B.Cu B.Paste B.Mask) (net 291 "Net-(R66-Pad2)") (solder_mask_margin 0.102)) (model ${CERN}/RESC1608X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5EB50A1F) (at 201.676 193.675 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD31F9A/5EBC4ACC) (attr smd) (fp_text reference R297 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_240R_1%_0.0625W_100PPM (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1102 "Net-(P1-Padc34)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5EB509B7) (at 201.676 195.453 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD31F9A/5ECB9FE8) (attr smd) (fp_text reference R298 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_240R_1%_0.0625W_100PPM (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1101 "Net-(P1-Padd35)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5EB508F8) (at 201.041 122.555 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD31F9F/5EDF3EEE) (attr smd) (fp_text reference R300 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_240R_1%_0.0625W_100PPM (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1103 "Net-(P2-Padd35)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5EB50891) (at 201.041 121.285 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD31F9F/5ED979B2) (attr smd) (fp_text reference R299 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_240R_1%_0.0625W_100PPM (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1104 "Net-(P2-Padc34)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 4 /FMC_2/FMC2_3P3VAUX) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:HDT0001 (layer F.Cu) (tedit 5EB38691) (tstamp 5C7CFD33) (at 152.6413 72.644) (descr HDT0001) (tags Switch) (path /5DAB8DC7) (attr smd) (fp_text reference S1 (at 4.8387 0) (layer F.SilkS) (effects (font (size 2 2) (thickness 0.4))) ) (fp_text value HDT0001 (at 0 -0.225) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.254))) ) (fp_line (start -0.8 -2.2) (end -0.8 -2.2) (layer F.SilkS) (width 0.2)) (fp_line (start -1 -2.2) (end -1 -2.2) (layer F.SilkS) (width 0.2)) (fp_line (start 1.75 -1.4) (end 1.75 1.4) (layer F.SilkS) (width 0.1)) (fp_line (start -1.75 -1.4) (end -1.75 1.4) (layer F.SilkS) (width 0.1)) (fp_line (start -2.75 2.85) (end -2.75 -3.3) (layer Dwgs.User) (width 0.1)) (fp_line (start 2.75 2.85) (end -2.75 2.85) (layer Dwgs.User) (width 0.1)) (fp_line (start 2.75 -3.3) (end 2.75 2.85) (layer Dwgs.User) (width 0.1)) (fp_line (start -2.75 -3.3) (end 2.75 -3.3) (layer Dwgs.User) (width 0.1)) (fp_line (start -1.75 1.4) (end -1.75 -1.4) (layer Dwgs.User) (width 0.2)) (fp_line (start 1.75 1.4) (end -1.75 1.4) (layer Dwgs.User) (width 0.2)) (fp_line (start 1.75 -1.4) (end 1.75 1.4) (layer Dwgs.User) (width 0.2)) (fp_line (start -1.75 -1.4) (end 1.75 -1.4) (layer Dwgs.User) (width 0.2)) (fp_arc (start -0.9 -2.2) (end -1 -2.2) (angle 180) (layer F.SilkS) (width 0.2)) (fp_arc (start -0.9 -2.2) (end -0.8 -2.2) (angle 180) (layer F.SilkS) (width 0.2)) (pad 1 smd rect (at -0.925 -1.575 90) (size 0.55 0.95) (layers F.Cu F.Paste F.Mask) (net 326 /MMC/SW)) (pad 2 smd rect (at 0.925 -1.575 90) (size 0.55 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 3 smd rect (at -0.925 1.575 90) (size 0.55 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 4 smd rect (at 0.925 1.575 90) (size 0.55 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 5 thru_hole circle (at -0.925 0 90) (size 0.42 0.42) (drill 0.84) (layers *.Cu *.Mask F.SilkS)) (pad 6 thru_hole circle (at 0.85 0 90) (size 0.33 0.33) (drill 0.66) (layers *.Cu *.Mask F.SilkS)) (model ${CERN}/SW_C&K_HDT0001.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:XTAL_TXC_7A locked (layer B.Cu) (tedit 5C617E30) (tstamp 5C70A11C) (at 145.9484 179.1716 270) (descr "2 Pins, 3.2x5mm, SMD Glass Seam Sealing Crystal, 7A Serie") (path /5BCEDA39/5CEAFF33) (attr smd) (fp_text reference Y5 (at 0.6604 -2.9464 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value XTAL_8MHZ_TXC_7A-8.000MAAE-T (at 0 -2.876 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start -2.7 1.2) (end -1 1.2) (layer Cmts.User) (width 0.1)) (fp_line (start -1 -1.2) (end -1 1.2) (layer Cmts.User) (width 0.1)) (fp_line (start -2.7 -1.2) (end -1 -1.2) (layer Cmts.User) (width 0.1)) (fp_line (start -2.7 -1.2) (end -2.7 1.2) (layer Cmts.User) (width 0.1)) (fp_line (start -2.35 0) (end -1.85 0) (layer Cmts.User) (width 0.1)) (fp_line (start -1.85 0) (end -1.85 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.85 -0.5) (end -1.85 0) (layer Cmts.User) (width 0.1)) (fp_line (start -1.85 0) (end -1.35 0) (layer Cmts.User) (width 0.1)) (fp_line (start 1 1.2) (end 2.7 1.2) (layer Cmts.User) (width 0.1)) (fp_line (start 2.7 -1.2) (end 2.7 1.2) (layer Cmts.User) (width 0.1)) (fp_line (start 1 -1.2) (end 2.7 -1.2) (layer Cmts.User) (width 0.1)) (fp_line (start 1 -1.2) (end 1 1.2) (layer Cmts.User) (width 0.1)) (fp_line (start 1.35 0) (end 1.85 0) (layer Cmts.User) (width 0.1)) (fp_line (start 1.85 0) (end 1.85 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 1.85 -0.5) (end 1.85 0) (layer Cmts.User) (width 0.1)) (fp_line (start 1.85 0) (end 2.35 0) (layer Cmts.User) (width 0.1)) (fp_line (start -2.3 1.6) (end 2.3 1.6) (layer B.SilkS) (width 0.2)) (fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer B.SilkS) (width 0.2)) (fp_line (start -2.4 -0.4) (end -2.4 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -2.5 0.5) (end -2.5 1.4) (layer B.Fab) (width 0.1)) (fp_line (start -2.3 1.6) (end 2.3 1.6) (layer B.Fab) (width 0.1)) (fp_line (start 2.5 0.5) (end 2.5 1.4) (layer B.Fab) (width 0.1)) (fp_line (start 2.4 -0.4) (end 2.4 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 2.5 -1.4) (end 2.5 -0.5) (layer B.Fab) (width 0.1)) (fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer B.Fab) (width 0.1)) (fp_line (start -2.5 -1.4) (end -2.5 -0.5) (layer B.Fab) (width 0.1)) (fp_line (start -2.1 1.4) (end 2.3 1.4) (layer B.Fab) (width 0.1)) (fp_line (start 2.3 -1.2) (end 2.3 1.4) (layer B.Fab) (width 0.1)) (fp_line (start -2.1 -1.4) (end 2.1 -1.4) (layer B.Fab) (width 0.1)) (fp_line (start -2.3 -1.2) (end -2.3 1.2) (layer B.Fab) (width 0.1)) (fp_line (start -2.95 1.85) (end 2.95 1.85) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.95 -1.85) (end 2.95 -1.85) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.95 -1.85) (end 2.95 1.85) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.95 -1.85) (end -2.95 1.85) (layer B.CrtYd) (width 0.05)) (fp_arc (start -2.1 1.2) (end -2.1 1.4) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start -2.1 -1.2) (end -2.3 -1.2) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start 2.1 -1.2) (end 2.1 -1.4) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start -2.5 -1.6) (end -2.3 -1.6) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start 2.5 -1.6) (end 2.5 -1.4) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start 2.5 -0.4) (end 2.4 -0.4) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start 2.5 0.4) (end 2.5 0.5) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start 2.5 1.6) (end 2.3 1.6) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start -2.5 1.6) (end -2.5 1.4) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start -2.5 0.4) (end -2.4 0.4) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start -2.5 -0.4) (end -2.5 -0.5) (angle 90) (layer B.Fab) (width 0.1)) (pad 2 smd rect (at 1.85 0 270) (size 1.7 2.4) (layers B.Cu B.Paste B.Mask) (net 24 "Net-(C93-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -1.85 0 270) (size 1.7 2.4) (layers B.Cu B.Paste B.Mask) (net 23 "Net-(C102-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/XTAL_TXC_7A.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:FAIRCHILD_FOD817DSD (layer F.Cu) (tedit 5C61807D) (tstamp 5C8F5390) (at 262.40486 191.516 180) (descr "SOIC, 2.54mm Pitch, 4 Pin, Body 6.5mm W X 4.6mm L X 4.6mm H") (path /5C16BF8E/5D59283C) (attr smd) (fp_text reference U41 (at -0.00254 -3.556) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value FOD817DSD (at 0 3.826) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -5.4 -2.8) (end 5.4 -2.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 5.4 2.8) (end 5.4 -2.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -5.4 2.8) (end 5.4 2.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -5.4 2.8) (end -5.4 -2.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.728 -2.334) (end -1.46 -2.334) (layer F.Fab) (width 0.1)) (fp_line (start -3.25 2.55) (end 3.25 2.55) (layer F.Fab) (width 0.1)) (fp_line (start 3.25 2.55) (end 3.25 -2.55) (layer F.Fab) (width 0.1)) (fp_line (start -3.25 -2.55) (end 3.25 -2.55) (layer F.Fab) (width 0.1)) (fp_line (start -3.25 2.55) (end -3.25 -2.55) (layer F.Fab) (width 0.1)) (fp_line (start -3.855 -1.425) (end -3.25 -1.425) (layer F.Fab) (width 0.1)) (fp_line (start -3.855 -1.425) (end -3.855 -1.905) (layer F.Fab) (width 0.1)) (fp_line (start -5.015 -1.905) (end -3.855 -1.905) (layer F.Fab) (width 0.1)) (fp_line (start -5.015 -0.635) (end -5.015 -1.905) (layer F.Fab) (width 0.1)) (fp_line (start -5.015 -0.635) (end -3.25 -0.635) (layer F.Fab) (width 0.1)) (fp_line (start -5.015 0.635) (end -3.25 0.635) (layer F.Fab) (width 0.1)) (fp_line (start -5.015 1.905) (end -5.015 0.635) (layer F.Fab) (width 0.1)) (fp_line (start -5.015 1.905) (end -3.855 1.905) (layer F.Fab) (width 0.1)) (fp_line (start -3.855 1.905) (end -3.855 1.425) (layer F.Fab) (width 0.1)) (fp_line (start -3.855 1.425) (end -3.25 1.425) (layer F.Fab) (width 0.1)) (fp_line (start 3.25 0.635) (end 5.015 0.635) (layer F.Fab) (width 0.1)) (fp_line (start 5.015 1.905) (end 5.015 0.635) (layer F.Fab) (width 0.1)) (fp_line (start 3.85 1.905) (end 5.015 1.905) (layer F.Fab) (width 0.1)) (fp_line (start 3.85 1.905) (end 3.855 1.425) (layer F.Fab) (width 0.1)) (fp_line (start 3.25 1.425) (end 3.855 1.425) (layer F.Fab) (width 0.1)) (fp_line (start 3.25 -0.635) (end 5.015 -0.635) (layer F.Fab) (width 0.1)) (fp_line (start 5.015 -0.635) (end 5.015 -1.905) (layer F.Fab) (width 0.1)) (fp_line (start 3.855 -1.905) (end 5.015 -1.905) (layer F.Fab) (width 0.1)) (fp_line (start 3.855 -1.425) (end 3.855 -1.905) (layer F.Fab) (width 0.1)) (fp_line (start 3.25 -1.425) (end 3.855 -1.425) (layer F.Fab) (width 0.1)) (fp_line (start -2.728 -2.334) (end -1.46 -2.334) (layer F.SilkS) (width 0.2)) (fp_line (start -3.25 -2.55) (end 3.25 -2.55) (layer F.SilkS) (width 0.2)) (fp_line (start 3.25 2.55) (end 3.25 -2.55) (layer F.SilkS) (width 0.2)) (fp_line (start -3.25 2.55) (end 3.25 2.55) (layer F.SilkS) (width 0.2)) (fp_line (start -3.25 2.55) (end -3.25 -2.55) (layer F.SilkS) (width 0.2)) (fp_line (start 0 0) (end 0 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start -5.15 2.02) (end -5.15 0.52) (layer Cmts.User) (width 0.1)) (fp_line (start -5.15 0.52) (end -3.85 0.52) (layer Cmts.User) (width 0.1)) (fp_line (start -3.85 2.02) (end -3.85 0.52) (layer Cmts.User) (width 0.1)) (fp_line (start -5.15 2.02) (end -3.85 2.02) (layer Cmts.User) (width 0.1)) (fp_line (start -5 1.27) (end -4.5 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -4.5 1.27) (end -4.5 0.77) (layer Cmts.User) (width 0.1)) (fp_line (start -4.5 1.27) (end -4 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -4.5 1.77) (end -4.5 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 3.85 2.02) (end 3.85 0.52) (layer Cmts.User) (width 0.1)) (fp_line (start 3.85 0.52) (end 5.15 0.52) (layer Cmts.User) (width 0.1)) (fp_line (start 5.15 2.02) (end 5.15 0.52) (layer Cmts.User) (width 0.1)) (fp_line (start 3.85 2.02) (end 5.15 2.02) (layer Cmts.User) (width 0.1)) (fp_line (start 4 1.27) (end 4.5 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 4.5 1.27) (end 4.5 0.77) (layer Cmts.User) (width 0.1)) (fp_line (start 4.5 1.27) (end 5 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 4.5 1.77) (end 4.5 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -5.15 -0.52) (end -5.15 -2.02) (layer Cmts.User) (width 0.1)) (fp_line (start -5.15 -2.02) (end -3.85 -2.02) (layer Cmts.User) (width 0.1)) (fp_line (start -3.85 -0.52) (end -3.85 -2.02) (layer Cmts.User) (width 0.1)) (fp_line (start -5.15 -0.52) (end -3.85 -0.52) (layer Cmts.User) (width 0.1)) (fp_line (start -5 -1.27) (end -4.5 -1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -4.5 -1.27) (end -4.5 -1.77) (layer Cmts.User) (width 0.1)) (fp_line (start -4.5 -1.27) (end -4 -1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -4.5 -0.77) (end -4.5 -1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 3.85 -0.52) (end 3.85 -2.02) (layer Cmts.User) (width 0.1)) (fp_line (start 3.85 -2.02) (end 5.15 -2.02) (layer Cmts.User) (width 0.1)) (fp_line (start 5.15 -0.52) (end 5.15 -2.02) (layer Cmts.User) (width 0.1)) (fp_line (start 3.85 -0.52) (end 5.15 -0.52) (layer Cmts.User) (width 0.1)) (fp_line (start 4 -1.27) (end 4.5 -1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 4.5 -1.27) (end 4.5 -1.77) (layer Cmts.User) (width 0.1)) (fp_line (start 4.5 -1.27) (end 5 -1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 4.5 -0.77) (end 4.5 -1.27) (layer Cmts.User) (width 0.1)) (fp_arc (start -2.094 -2.374) (end -2.728 -2.334) (angle -173) (layer F.SilkS) (width 0.2)) (fp_arc (start -2.094 -2.374) (end -2.728 -2.334) (angle -173) (layer F.Fab) (width 0.1)) (pad 1 smd rect (at -4.5 -1.27 180) (size 1.3 1.5) (layers F.Cu F.Paste F.Mask) (net 103 "Net-(C353-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -4.5 1.27 180) (size 1.3 1.5) (layers F.Cu F.Paste F.Mask) (net 686 "Net-(U40-Pad3)") (solder_mask_margin 0.102)) (pad 3 smd rect (at 4.5 1.27 180) (size 1.3 1.5) (layers F.Cu F.Paste F.Mask) (net 694 "Net-(R281-Pad1)") (solder_mask_margin 0.102)) (pad 4 smd rect (at 4.5 -1.27 180) (size 1.3 1.5) (layers F.Cu F.Paste F.Mask) (net 127 /MMC/AT_DET) (solder_mask_margin 0.102)) (model ${CERN}/FAIRCHILD_FOD817DSD.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:AG5300 (layer F.Cu) (tedit 5CB6FA84) (tstamp 5C8EEBD1) (at 255.9304 205.0034 180) (descr AG5300) (tags "Undefined or Miscellaneous") (path /5C16BF8E/5C359ECB) (fp_text reference U40 (at 13.3604 10.4394) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value AG5300 (at 0 0) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.254))) ) (fp_line (start -30.2 -9.2) (end 27.4 -9.2) (layer Dwgs.User) (width 0.1)) (fp_line (start 27.4 -9.2) (end 27.4 9.5) (layer Dwgs.User) (width 0.1)) (fp_line (start 27.4 9.5) (end -30.2 9.5) (layer Dwgs.User) (width 0.1)) (fp_line (start -30.2 9.5) (end -30.2 -9.2) (layer Dwgs.User) (width 0.1)) (fp_line (start -28.22 -2.1) (end -28.22 -2.1) (layer F.SilkS) (width 0.2)) (fp_line (start -28.22 -1.9) (end -28.22 -1.9) (layer F.SilkS) (width 0.2)) (fp_line (start -30.1 -2) (end -30.1 -9) (layer F.SilkS) (width 0.12)) (fp_line (start -30.1 -9) (end -27.56 -9) (layer F.SilkS) (width 0.12)) (fp_line (start -30.1 -9) (end -30.1 0.6) (layer F.SilkS) (width 0.12)) (fp_line (start -30.1 0.6) (end -5.9 0.6) (layer F.SilkS) (width 0.12)) (fp_line (start -5.9 0.6) (end -5.9 9) (layer F.SilkS) (width 0.12)) (fp_line (start -5.9 9) (end 13.1 9) (layer F.SilkS) (width 0.12)) (fp_line (start 13.1 9) (end 13.1 0.6) (layer F.SilkS) (width 0.12)) (fp_line (start 13.1 0.6) (end 27.1 0.6) (layer F.SilkS) (width 0.12)) (fp_line (start 27.1 0.6) (end 27.1 -9) (layer F.SilkS) (width 0.12)) (fp_line (start -29.6 -4.4) (end -30.1 -4.4) (layer F.SilkS) (width 0.12)) (fp_line (start -29.6 -4.4) (end 27.1 -4.4) (layer F.SilkS) (width 0.12)) (fp_line (start 27.1 -4.4) (end 27.1 -6) (layer F.SilkS) (width 0.12)) (fp_line (start 27.1 -6) (end -30.1 -6) (layer F.SilkS) (width 0.12)) (fp_line (start 27.1 -9) (end -27.56 -9) (layer F.SilkS) (width 0.12)) (fp_arc (start -28.22 -2) (end -28.22 -1.9) (angle 180) (layer F.SilkS) (width 0.2)) (fp_arc (start -28.22 -2) (end -28.22 -2.1) (angle 180) (layer F.SilkS) (width 0.2)) (pad 10 thru_hole circle (at 25.78 -2 270) (size 1.68 1.68) (drill 1.12) (layers *.Cu *.Mask F.SilkS) (net 1 GND)) (pad 9 thru_hole circle (at 23.24 -2 270) (size 1.68 1.68) (drill 1.12) (layers *.Cu *.Mask F.SilkS) (net 352 "Net-(R197-Pad2)")) (pad 8 thru_hole circle (at 20.7 -2 270) (size 1.68 1.68) (drill 1.12) (layers *.Cu *.Mask F.SilkS) (net 101 "Net-(C350-Pad1)")) (pad 7 thru_hole circle (at 18.16 -2 270) (size 1.68 1.68) (drill 1.12) (layers *.Cu *.Mask F.SilkS) (net 1 GND)) (pad 6 thru_hole circle (at -12.32 -2 270) (size 1.68 1.68) (drill 1.12) (layers *.Cu *.Mask F.SilkS)) (pad 5 thru_hole circle (at -14.86 -2 270) (size 1.68 1.68) (drill 1.12) (layers *.Cu *.Mask F.SilkS)) (pad 4 thru_hole circle (at -17.4 -2 270) (size 1.68 1.68) (drill 1.12) (layers *.Cu *.Mask F.SilkS)) (pad 3 thru_hole circle (at -19.94 -2 270) (size 1.68 1.68) (drill 1.12) (layers *.Cu *.Mask F.SilkS) (net 686 "Net-(U40-Pad3)")) (pad 2 thru_hole circle (at -22.48 -2 270) (size 1.68 1.68) (drill 1.12) (layers *.Cu *.Mask F.SilkS) (net 104 "Net-(C354-Pad1)")) (pad 1 thru_hole circle (at -25.02 -2 270) (size 1.68 1.68) (drill 1.12) (layers *.Cu *.Mask F.SilkS) (net 103 "Net-(C353-Pad1)")) (model ${CERN}/SILVERTEL_AG5300.stp (offset (xyz 0.35 2 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Marble:TEXAS_DRC(S-PVSON-N10)" (layer B.Cu) (tedit 5CB82C05) (tstamp 5C6F77CA) (at 221.2848 109.4867 180) (descr "SON, TEXAS DRC [S-PVSON-N10], 0.50mm Pitch, 10-pin, 3.00mm W X 3.00mm L X 1.00mm Height, [w/thermal tab 1.65 X 2.40 mm] ") (path /5BD32060/5BDAE091) (attr smd) (fp_text reference U31 (at 5.0348 -1.7633) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify right bottom mirror)) ) (fp_text value TPS51200DRC (at 0 0) (layer B.SilkS) hide (effects (font (size 1.524 1.524) (thickness 0.254)) (justify right bottom mirror)) ) (fp_line (start -1.4972 -1.4972) (end 1.5 -1.4972) (layer Cmts.User) (width 0.1)) (fp_line (start 1.5 -1.4972) (end 1.5 1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.4972 1.5) (end 1.5 1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.4972 -1.4972) (end -1.4972 1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.4972 0.499999) (end -0.465201 1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.4972 0.599999) (end -0.568401 1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.4972 0.700001) (end -0.671599 1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.4972 0.800001) (end -0.774799 1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.4972 0.900001) (end -0.877999 1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.4972 1.000001) (end -0.981199 1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.4972 1.1) (end -1.0844 1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.4972 1.2) (end -1.1876 1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.4972 1.3) (end -1.2908 1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.4972 1.4) (end -1.394 1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.465201 0) (end 0.499999 0) (layer Dwgs.User) (width 0.05)) (fp_line (start 0 -0.465201) (end 0 0.499999) (layer Dwgs.User) (width 0.05)) (fp_line (start -2.168799 -1.807601) (end -2.168799 1.849999) (layer Dwgs.User) (width 0.05)) (fp_line (start -2.168799 1.849999) (end 2.200001 1.849999) (layer Dwgs.User) (width 0.05)) (fp_line (start 2.200001 -1.807601) (end 2.200001 1.849999) (layer Dwgs.User) (width 0.05)) (fp_line (start -2.168799 -1.807601) (end 2.200001 -1.807601) (layer Dwgs.User) (width 0.05)) (fp_arc (start -2.3752 1.000001) (end -2.250199 1.000001) (angle -360) (layer B.SilkS) (width 0.25)) (pad 11 smd rect (at 0 0 90) (size 2.4 1.649999) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 1 smd rect (at -1.4972 1.000001 180) (size 0.850001 0.299999) (layers B.Cu B.Paste B.Mask) (net 281 "Net-(R30-Pad1)")) (pad 2 smd rect (at -1.4972 0.499999 180) (size 0.850001 0.299999) (layers B.Cu B.Paste B.Mask) (net 6 +1V35)) (pad 3 smd rect (at -1.4972 0 180) (size 0.850001 0.299999) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3)) (pad 4 smd rect (at -1.4972 -0.465201 180) (size 0.850001 0.299999) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 5 smd rect (at -1.4972 -0.981199 180) (size 0.850001 0.299999) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3)) (pad 6 smd rect (at 1.5 -0.981199 180) (size 0.850001 0.299999) (layers B.Cu B.Paste B.Mask) (net 643 /SDRAM/VREF_DDR3)) (pad 7 smd rect (at 1.5 -0.465201 180) (size 0.850001 0.299999) (layers B.Cu B.Paste B.Mask) (net 3 +3V3)) (pad 8 smd rect (at 1.5 0 180) (size 0.850001 0.299999) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 9 smd rect (at 1.5 0.499999 180) (size 0.850001 0.299999) (layers B.Cu B.Paste B.Mask) (net 280 /SDRAM/PGOOD)) (pad 10 smd rect (at 1.5 1.000001 180) (size 0.850001 0.299999) (layers B.Cu B.Paste B.Mask) (net 3 +3V3)) (model "${CERN}/TEXAS_DRC (S-PVSON-N10).stp" (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SON50P200X300X80-11N-R94X250 (layer B.Cu) (tedit 5C6181F9) (tstamp 5C6F7FDD) (at 151.892 204.9018 90) (descr "SON, 10-Leads, Body 2x3mm, Pitch 0.5mm, Thermal Pad 0.94x2.5mm, IPC Medium Density ") (path /5C16BF8E/5D7B77F7) (attr smd) (fp_text reference U18 (at -0.3482 1.858) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify right bottom mirror)) ) (fp_text value TPS62175DQC (at 0 0 90) (layer B.SilkS) hide (effects (font (size 1.524 1.524) (thickness 0.254)) (justify left bottom mirror)) ) (fp_line (start -1.0328 1.549999) (end -0.6766 1.549999) (layer B.SilkS) (width 0.2)) (fp_line (start 0.695 1.549999) (end 1.05 1.549999) (layer B.SilkS) (width 0.2)) (fp_line (start -1.0328 -1.548801) (end -0.6766 -1.548801) (layer B.SilkS) (width 0.2)) (fp_line (start 0.695 -1.548801) (end 1.05 -1.548801) (layer B.SilkS) (width 0.2)) (fp_line (start -1.0328 -1.548801) (end -1.0328 1.549999) (layer Cmts.User) (width 0.1)) (fp_line (start 1.05 -1.548801) (end 1.05 1.549999) (layer Cmts.User) (width 0.1)) (fp_line (start -1.0328 1.549999) (end 1.05 1.549999) (layer Cmts.User) (width 0.1)) (fp_line (start -1.0328 -1.548801) (end 1.05 -1.548801) (layer Cmts.User) (width 0.1)) (fp_line (start -1.601201 -1.756001) (end -1.601201 1.800001) (layer Dwgs.User) (width 0.05)) (fp_line (start 1.649999 -1.756001) (end 1.649999 1.800001) (layer Dwgs.User) (width 0.05)) (fp_line (start -1.601201 1.800001) (end 1.649999 1.800001) (layer Dwgs.User) (width 0.05)) (fp_line (start -1.601201 -1.756001) (end 1.649999 -1.756001) (layer Dwgs.User) (width 0.05)) (fp_line (start -0.465198 0) (end 0.499999 0) (layer Dwgs.User) (width 0.05)) (fp_line (start 0 -0.465201) (end 0 0.500002) (layer Dwgs.User) (width 0.05)) (fp_arc (start -0.207201 0.750001) (end 0.192799 0.750001) (angle -360) (layer Cmts.User) (width 0.1)) (fp_arc (start -1.4456 1.549999) (end -1.3956 1.549999) (angle -360) (layer B.SilkS) (width 0.2)) (pad 11 smd rect (at 0 0) (size 2.5 0.940001) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 6 smd rect (at 1.05 -0.981199) (size 0.299999 0.700001) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 7 smd rect (at 1.05 -0.465201) (size 0.299999 0.700001) (layers B.Cu B.Paste B.Mask) (net 1056 "Net-(U18-Pad7)")) (pad 8 smd rect (at 1.05 0) (size 0.299999 0.700001) (layers B.Cu B.Paste B.Mask) (net 33 "Net-(C132-Pad1)")) (pad 9 smd rect (at 1.05 0.500002) (size 0.299999 0.700001) (layers B.Cu B.Paste B.Mask) (net 201 "Net-(L13-Pad1)")) (pad 10 smd rect (at 1.05 1.000001) (size 0.299999 0.700001) (layers B.Cu B.Paste B.Mask) (net 33 "Net-(C132-Pad1)")) (pad 5 smd rect (at -1.0328 -0.981199) (size 0.299999 0.700001) (layers B.Cu B.Paste B.Mask) (net 305 "Net-(R109-Pad2)")) (pad 4 smd rect (at -1.0328 -0.465201) (size 0.299999 0.700001) (layers B.Cu B.Paste B.Mask) (net 1057 "Net-(U18-Pad4)")) (pad 3 smd rect (at -1.0328 0) (size 0.299999 0.700001) (layers B.Cu B.Paste B.Mask) (net 32 "Net-(C129-Pad1)")) (pad 2 smd rect (at -1.0328 0.500002) (size 0.299999 0.700001) (layers B.Cu B.Paste B.Mask) (net 32 "Net-(C129-Pad1)")) (pad 1 smd rect (at -1.0328 1.000001) (size 0.299999 0.700001) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (model ${CERN}/SON50P200X300X80-11N-R94X250.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SOIC127P600X175-8N (layer B.Cu) (tedit 5CACA62E) (tstamp 5C8F6A87) (at 289.814 161.2646 90) (descr "SOIC 8, Pitch 1.27mm - Body 4x5mm, IPC Medium Density") (path /5C907554/5CAAC367/5CB8EA95) (attr smd) (fp_text reference U12 (at 5.207 0.6604) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value MC78L05ACDR2G (at 0 -3.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -2.4 2.755) (end -2.275 2.755) (layer B.SilkS) (width 0.25)) (fp_circle (center -0.825 1.75) (end -0.325 1.75) (layer B.Fab) (width 0.1)) (fp_line (start -1.55 -2.5) (end 1.55 -2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 1.55 -2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 -2.5) (end -1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 2 -2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end 2 -2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end -2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -2.7 1.905) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 9 /FPGA/FPGA_15_16/HDMI_5V) (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.7 0.635) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.7 -0.635) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.7 -1.905) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1050 "Net-(U12-Pad4)") (solder_mask_margin 0.102)) (pad 8 smd rect (at 2.7 1.905) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.7 0.635) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.7 -0.635) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.7 -1.905) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1051 "Net-(U12-Pad5)") (solder_mask_margin 0.102)) (model ${CERN}/SOIC127P600X175-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SOT65P210X110-5N (layer B.Cu) (tedit 5CACBDDA) (tstamp 5C8EB1DB) (at 180.6194 150.5458 90) (descr "SOT353, SC70-5, SOT, 0.65mm Pitch, 5 pin, 1.25mm W X 2.00mm L X 1.10mm H, IPC Medium Density") (path /5C907554/5CC8CB69/5C4235B4) (attr smd) (fp_text reference U11 (at 2.8448 0.6096) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SN74LVC1G125DCKT (at 0 -2.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.3 1.35) (end -1.175 1.35) (layer B.SilkS) (width 0.25)) (fp_line (start -0.3 -1) (end -0.3 1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 1) (end 0.3 1) (layer B.SilkS) (width 0.2)) (fp_line (start 0.3 -1) (end 0.3 1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -1) (end 0.3 -1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.625 -1) (end -0.625 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 1) (end 0.625 1) (layer B.Fab) (width 0.1)) (fp_line (start 0.625 -1) (end 0.625 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 -1) (end 0.625 -1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0) (end 0.375 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.1) (end 0.275 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.2) (end 0.175 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.3) (end 0.075 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.4) (end -0.025 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.5) (end -0.125 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.6) (end -0.225 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.7) (end -0.325 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.8) (end -0.425 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.9) (end -0.525 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.85 -1.35) (end -1.85 1.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.85 1.35) (end 1.85 1.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.85 -1.35) (end 1.85 1.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.85 -1.35) (end 1.85 -1.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.1 0.65 90) (size 0.95 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.1 0 90) (size 0.95 0.4) (layers B.Cu B.Paste B.Mask) (net 357 /FPGA/FPGA_13_14/CFG_WP) (solder_mask_margin 0.102)) (pad 3 smd rect (at -1.1 -0.65 90) (size 0.95 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 4 smd rect (at 1.1 -0.65 90) (size 0.95 0.4) (layers B.Cu B.Paste B.Mask) (net 400 /FPGA/CFG_WP_B) (solder_mask_margin 0.102)) (pad 5 smd rect (at 1.1 0.65 90) (size 0.95 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model ${CERN}/SOT65P210X110-5N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SOT65P210X110-5N (layer B.Cu) (tedit 5CACBDDA) (tstamp 5C6F791F) (at 165.9001 153.3271 270) (descr "SOT353, SC70-5, SOT, 0.65mm Pitch, 5 pin, 1.25mm W X 2.00mm L X 1.10mm H, IPC Medium Density") (path /5CA40231/5E17F12A) (attr smd) (fp_text reference U10 (at 2.8448 0.6096) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value NC7SZ66P5X (at 0 -2.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.3 1.35) (end -1.175 1.35) (layer B.SilkS) (width 0.25)) (fp_line (start -0.3 -1) (end -0.3 1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 1) (end 0.3 1) (layer B.SilkS) (width 0.2)) (fp_line (start 0.3 -1) (end 0.3 1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -1) (end 0.3 -1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.625 -1) (end -0.625 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 1) (end 0.625 1) (layer B.Fab) (width 0.1)) (fp_line (start 0.625 -1) (end 0.625 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 -1) (end 0.625 -1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0) (end 0.375 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.1) (end 0.275 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.2) (end 0.175 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.3) (end 0.075 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.4) (end -0.025 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.5) (end -0.125 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.6) (end -0.225 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.7) (end -0.325 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.8) (end -0.425 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.9) (end -0.525 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.85 -1.35) (end -1.85 1.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.85 1.35) (end 1.85 1.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.85 -1.35) (end 1.85 1.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.85 -1.35) (end 1.85 -1.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.1 0.65 270) (size 0.95 0.4) (layers B.Cu B.Paste B.Mask) (net 687 /JTAG/FMC1_TDI_R) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.1 0 270) (size 0.95 0.4) (layers B.Cu B.Paste B.Mask) (net 688 /JTAG/FMC1_TDO_R) (solder_mask_margin 0.102)) (pad 3 smd rect (at -1.1 -0.65 270) (size 0.95 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 4 smd rect (at 1.1 -0.65 270) (size 0.95 0.4) (layers B.Cu B.Paste B.Mask) (net 707 "Net-(D18-Pad1)") (solder_mask_margin 0.102)) (pad 5 smd rect (at 1.1 0.65 270) (size 0.95 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model ${CERN}/SOT65P210X110-5N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SOT65P210X110-5N (layer B.Cu) (tedit 5CACBDDA) (tstamp 5C6F78B5) (at 165.9763 147.4851 270) (descr "SOT353, SC70-5, SOT, 0.65mm Pitch, 5 pin, 1.25mm W X 2.00mm L X 1.10mm H, IPC Medium Density") (path /5CA40231/5E17EE5A) (attr smd) (fp_text reference U7 (at -0.4851 2.4763) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value NC7SZ66P5X (at 0 -2.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.3 1.35) (end -1.175 1.35) (layer B.SilkS) (width 0.25)) (fp_line (start -0.3 -1) (end -0.3 1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 1) (end 0.3 1) (layer B.SilkS) (width 0.2)) (fp_line (start 0.3 -1) (end 0.3 1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -1) (end 0.3 -1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.625 -1) (end -0.625 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 1) (end 0.625 1) (layer B.Fab) (width 0.1)) (fp_line (start 0.625 -1) (end 0.625 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 -1) (end 0.625 -1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0) (end 0.375 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.1) (end 0.275 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.2) (end 0.175 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.3) (end 0.075 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.4) (end -0.025 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.5) (end -0.125 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.6) (end -0.225 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.7) (end -0.325 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.8) (end -0.425 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.625 0.9) (end -0.525 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.85 -1.35) (end -1.85 1.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.85 1.35) (end 1.85 1.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.85 -1.35) (end 1.85 1.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.85 -1.35) (end 1.85 -1.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.1 0.65 270) (size 0.95 0.4) (layers B.Cu B.Paste B.Mask) (net 689 /JTAG/FMC2_TDI_R) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.1 0 270) (size 0.95 0.4) (layers B.Cu B.Paste B.Mask) (net 690 /JTAG/FMC2_TDO_R) (solder_mask_margin 0.102)) (pad 3 smd rect (at -1.1 -0.65 270) (size 0.95 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 4 smd rect (at 1.1 -0.65 270) (size 0.95 0.4) (layers B.Cu B.Paste B.Mask) (net 705 "Net-(D17-Pad1)") (solder_mask_margin 0.102)) (pad 5 smd rect (at 1.1 0.65 270) (size 0.95 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model ${CERN}/SOT65P210X110-5N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SOP50P310X90-8N (layer B.Cu) (tedit 5CACB709) (tstamp 5C6F7893) (at 268.8336 162.0012) (descr "SOP, 0.50mm pitch; 8 pin, 2.30mm W X 2.00mm L X 0.90mm H body, PC Medium Density") (path /5BCEDA59/5C63B185) (attr smd) (fp_text reference U6 (at -1.82118 -2.25552) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value TXS0102DCUR (at 0 -2.326) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.7 1.4) (end -1.575 1.4) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 0) (end 0.2 1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.8 0.2) (end 0 1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.8 0.4) (end -0.2 1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.8 0.6) (end -0.4 1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.8 0.8) (end -0.6 1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.8 -1) (end -0.8 1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.8 1) (end 0.8 1) (layer B.SilkS) (width 0.2)) (fp_line (start 0.8 -1) (end 0.8 1) (layer B.SilkS) (width 0.2)) (fp_line (start -0.8 -1) (end 0.8 -1) (layer B.SilkS) (width 0.2)) (fp_line (start -1.15 -1) (end -1.15 1) (layer B.Fab) (width 0.1)) (fp_line (start -1.15 1) (end 1.15 1) (layer B.Fab) (width 0.1)) (fp_line (start 1.15 -1) (end 1.15 1) (layer B.Fab) (width 0.1)) (fp_line (start -1.15 -1) (end 1.15 -1) (layer B.Fab) (width 0.1)) (fp_line (start -1.15 0) (end -0.15 1) (layer B.Fab) (width 0.1)) (fp_line (start -1.15 0.1) (end -0.25 1) (layer B.Fab) (width 0.1)) (fp_line (start -1.15 0.2) (end -0.35 1) (layer B.Fab) (width 0.1)) (fp_line (start -1.15 0.3) (end -0.45 1) (layer B.Fab) (width 0.1)) (fp_line (start -1.15 0.4) (end -0.55 1) (layer B.Fab) (width 0.1)) (fp_line (start -1.15 0.5) (end -0.65 1) (layer B.Fab) (width 0.1)) (fp_line (start -1.15 0.6) (end -0.75 1) (layer B.Fab) (width 0.1)) (fp_line (start -1.15 0.7) (end -0.85 1) (layer B.Fab) (width 0.1)) (fp_line (start -1.15 0.8) (end -0.95 1) (layer B.Fab) (width 0.1)) (fp_line (start -1.15 0.9) (end -1.05 1) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -2.25 -1.3) (end -2.25 1.3) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.25 1.3) (end 2.25 1.3) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.25 -1.3) (end 2.25 1.3) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.25 -1.3) (end 2.25 -1.3) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.55 0.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (net 681 "Net-(U4-Pad7)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.55 0.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at -1.55 -0.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 4 smd rect (at -1.55 -0.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (net 395 /ETH_PHY/MII_MDC) (solder_mask_margin 0.102)) (pad 5 smd rect (at 1.55 -0.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (net 288 /ETH_PHY/MII_MDIO) (solder_mask_margin 0.102)) (pad 6 smd rect (at 1.55 -0.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (net 656 "Net-(R262-Pad2)") (solder_mask_margin 0.102)) (pad 7 smd rect (at 1.55 0.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 8 smd rect (at 1.55 0.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (net 289 "Net-(R64-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/SOP50P310X90-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:BGA96C80P9X16_900X1400X120 (layer F.Cu) (tedit 5CACBFAE) (tstamp 5C679459) (at 235.1786 116.078 270) (descr "BGA 0.8mm, Pitch, Square 96 Pin, 9 Columns x 16 Rows, Body 14mm X 9mm X 1.2mm H") (path /5BD32060/5C4F8488) (attr smd) (fp_text reference U3 (at -2.413 -10.6934 180) (layer F.SilkS) (effects (font (size 2.5 2.5) (thickness 0.5))) ) (fp_text value MT41K512M16HA-125_E (at 0 9.026 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -5.1 -6) (end -4.975 -6) (layer F.SilkS) (width 0.25)) (fp_line (start -5.08 7.999) (end -5.08 -8.001) (layer F.CrtYd) (width 0.05)) (fp_line (start -5.08 -8) (end 4.572 -8) (layer F.CrtYd) (width 0.05)) (fp_line (start 4.572 7.999) (end 4.572 -8.001) (layer F.CrtYd) (width 0.05)) (fp_line (start -5.08 8.001) (end 4.572 7.999) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -4.5 -6) (end -3.5 -7) (layer F.SilkS) (width 0.2)) (fp_line (start -4.5 -6.2) (end -3.7 -7) (layer F.SilkS) (width 0.2)) (fp_line (start -4.5 -6.4) (end -3.9 -7) (layer F.SilkS) (width 0.2)) (fp_line (start -4.5 -6.6) (end -4.1 -7) (layer F.SilkS) (width 0.2)) (fp_line (start -4.5 -6.8) (end -4.3 -7) (layer F.SilkS) (width 0.2)) (fp_line (start -4.5 7) (end -4.5 -7) (layer F.SilkS) (width 0.2)) (fp_line (start -4.5 -7) (end 4.5 -7) (layer F.SilkS) (width 0.2)) (fp_line (start 4.5 7) (end 4.5 -7) (layer F.SilkS) (width 0.2)) (fp_line (start -4.5 7) (end 4.5 7) (layer F.SilkS) (width 0.2)) (fp_line (start -4.5 -6) (end -3.5 -7) (layer F.Fab) (width 0.1)) (fp_line (start -4.5 -6.1) (end -3.6 -7) (layer F.Fab) (width 0.1)) (fp_line (start -4.5 -6.2) (end -3.7 -7) (layer F.Fab) (width 0.1)) (fp_line (start -4.5 -6.3) (end -3.8 -7) (layer F.Fab) (width 0.1)) (fp_line (start -4.5 -6.4) (end -3.9 -7) (layer F.Fab) (width 0.1)) (fp_line (start -4.5 -6.5) (end -4 -7) (layer F.Fab) (width 0.1)) (fp_line (start -4.5 -6.6) (end -4.1 -7) (layer F.Fab) (width 0.1)) (fp_line (start -4.5 -6.7) (end -4.2 -7) (layer F.Fab) (width 0.1)) (fp_line (start -4.5 -6.8) (end -4.3 -7) (layer F.Fab) (width 0.1)) (fp_line (start -4.5 -6.9) (end -4.4 -7) (layer F.Fab) (width 0.1)) (fp_line (start -4.5 7) (end -4.5 -7) (layer F.Fab) (width 0.1)) (fp_line (start -4.5 -7) (end 4.5 -7) (layer F.Fab) (width 0.1)) (fp_line (start 4.5 7) (end 4.5 -7) (layer F.Fab) (width 0.1)) (fp_line (start -4.5 7) (end 4.5 7) (layer F.Fab) (width 0.1)) (fp_text user T (at -4.967 6 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user J (at -4.967 0.4 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user R (at -4.967 5.2 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user P (at -4.967 4.4 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user N (at -4.967 3.6 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user B (at -4.967 -5.2 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user C (at -4.967 -4.4 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user D (at -4.967 -3.6 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user E (at -4.967 -2.8 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user F (at -4.967 -2 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user G (at -4.967 -1.2 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user H (at -4.967 -0.4 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user M (at -4.967 2.8 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user K (at -4.967 1.2 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user L (at -4.967 2 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user 9 (at 3.208 -7.475 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user 8 (at 2.408 -7.475 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user 7 (at 1.608 -7.475 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user 3 (at -1.592 -7.475 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user 2 (at -2.392 -7.475 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (fp_text user 1 (at -3.258 -7.475 90) (layer F.Fab) (effects (font (size 0.4 0.4) (thickness 0.15))) ) (pad A1 smd circle (at -3.2 -6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad A2 smd circle (at -2.4 -6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 370 /SDRAM/DDR3_DQ13) (solder_mask_margin 0.102)) (pad A3 smd circle (at -1.6 -6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 371 /SDRAM/DDR3_DQ15) (solder_mask_margin 0.102)) (pad A7 smd circle (at 1.6 -6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 372 /SDRAM/DDR3_DQ12) (solder_mask_margin 0.102)) (pad A8 smd circle (at 2.4 -6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad A9 smd circle (at 3.2 -6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad B1 smd circle (at -3.2 -5.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad B2 smd circle (at -2.4 -5.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad B3 smd circle (at -1.6 -5.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad B7 smd circle (at 1.6 -5.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 373 /FPGA/DDR3_UDQS_N) (solder_mask_margin 0.102)) (pad B8 smd circle (at 2.4 -5.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 374 /SDRAM/DDR3_DQ14) (solder_mask_margin 0.102)) (pad B9 smd circle (at 3.2 -5.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad C1 smd circle (at -3.2 -4.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad C2 smd circle (at -2.4 -4.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 375 /SDRAM/DDR3_DQ11) (solder_mask_margin 0.102)) (pad C3 smd circle (at -1.6 -4.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 376 /SDRAM/DDR3_DQ9) (solder_mask_margin 0.102)) (pad C7 smd circle (at 1.6 -4.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 377 /FPGA/DDR3_UDQS_P) (solder_mask_margin 0.102)) (pad C8 smd circle (at 2.4 -4.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 378 /SDRAM/DDR3_DQ10) (solder_mask_margin 0.102)) (pad C9 smd circle (at 3.2 -4.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad D1 smd circle (at -3.2 -3.6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad D2 smd circle (at -2.4 -3.6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad D3 smd circle (at -1.6 -3.6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 379 /FPGA/DDR3_UDM) (solder_mask_margin 0.102)) (pad D7 smd circle (at 1.6 -3.6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 380 /SDRAM/DDR3_DQ8) (solder_mask_margin 0.102)) (pad D8 smd circle (at 2.4 -3.6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad D9 smd circle (at 3.2 -3.6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad E1 smd circle (at -3.2 -2.8 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad E2 smd circle (at -2.4 -2.8 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad E3 smd circle (at -1.6 -2.8 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 381 /SDRAM/DDR3_DQ0) (solder_mask_margin 0.102)) (pad E7 smd circle (at 1.6 -2.8 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 382 /FPGA/DDR3_LDM) (solder_mask_margin 0.102)) (pad E8 smd circle (at 2.4 -2.8 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad E9 smd circle (at 3.2 -2.8 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad F1 smd circle (at -3.2 -2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad F2 smd circle (at -2.4 -2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 383 /SDRAM/DDR3_DQ2) (solder_mask_margin 0.102)) (pad F3 smd circle (at -1.6 -2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 384 /FPGA/DDR3_LDQS_P) (solder_mask_margin 0.102)) (pad F7 smd circle (at 1.6 -2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 385 /SDRAM/DDR3_DQ1) (solder_mask_margin 0.102)) (pad F8 smd circle (at 2.4 -2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 386 /SDRAM/DDR3_DQ3) (solder_mask_margin 0.102)) (pad F9 smd circle (at 3.2 -2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad G1 smd circle (at -3.2 -1.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad G2 smd circle (at -2.4 -1.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 387 /SDRAM/DDR3_DQ6) (solder_mask_margin 0.102)) (pad G3 smd circle (at -1.6 -1.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 388 /FPGA/DDR3_LDQS_N) (solder_mask_margin 0.102)) (pad G7 smd circle (at 1.6 -1.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad G8 smd circle (at 2.4 -1.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad G9 smd circle (at 3.2 -1.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad H1 smd circle (at -3.2 -0.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 643 /SDRAM/VREF_DDR3) (solder_mask_margin 0.102)) (pad H2 smd circle (at -2.4 -0.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad H3 smd circle (at -1.6 -0.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 389 /SDRAM/DDR3_DQ4) (solder_mask_margin 0.102)) (pad H7 smd circle (at 1.6 -0.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 390 /SDRAM/DDR3_DQ7) (solder_mask_margin 0.102)) (pad H8 smd circle (at 2.4 -0.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 391 /SDRAM/DDR3_DQ5) (solder_mask_margin 0.102)) (pad H9 smd circle (at 3.2 -0.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad J1 smd circle (at -3.2 0.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1034 "Net-(U3-PadJ1)") (solder_mask_margin 0.102)) (pad J2 smd circle (at -2.4 0.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad J3 smd circle (at -1.6 0.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 253 /FPGA/DDR3_RAS) (solder_mask_margin 0.102)) (pad J7 smd circle (at 1.6 0.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 271 /FPGA/DDR3_CK_P) (solder_mask_margin 0.102)) (pad J8 smd circle (at 2.4 0.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad J9 smd circle (at 3.2 0.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1035 "Net-(U3-PadJ9)") (solder_mask_margin 0.102)) (pad K1 smd circle (at -3.2 1.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 276 /FPGA/DDR3_ODT) (solder_mask_margin 0.102)) (pad K2 smd circle (at -2.4 1.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad K3 smd circle (at -1.6 1.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 252 /FPGA/DDR3_CAS) (solder_mask_margin 0.102)) (pad K7 smd circle (at 1.6 1.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 272 /FPGA/DDR3_CK_N) (solder_mask_margin 0.102)) (pad K8 smd circle (at 2.4 1.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad K9 smd circle (at 3.2 1.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 273 /FPGA/DDR3_CKE) (solder_mask_margin 0.102)) (pad L1 smd circle (at -3.2 2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1036 "Net-(U3-PadL1)") (solder_mask_margin 0.102)) (pad L2 smd circle (at -2.4 2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 275 /FPGA/DDR3_CS) (solder_mask_margin 0.102)) (pad L3 smd circle (at -1.6 2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 254 /FPGA/DDR3_WE) (solder_mask_margin 0.102)) (pad L7 smd circle (at 1.6 2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 269 /SDRAM/DDR3_A10) (solder_mask_margin 0.102)) (pad L8 smd circle (at 2.4 2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 279 "Net-(R28-Pad1)") (solder_mask_margin 0.102)) (pad L9 smd circle (at 3.2 2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1037 "Net-(U3-PadL9)") (solder_mask_margin 0.102)) (pad M1 smd circle (at -3.2 2.8 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad M2 smd circle (at -2.4 2.8 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 278 /SDRAM/DDR3_BA0) (solder_mask_margin 0.102)) (pad M3 smd circle (at -1.6 2.8 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 304 /SDRAM/DDR3_BA2) (solder_mask_margin 0.102)) (pad M7 smd circle (at 1.6 2.8 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 262 /SDRAM/DDR3_A15) (solder_mask_margin 0.102)) (pad M8 smd circle (at 2.4 2.8 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 643 /SDRAM/VREF_DDR3) (solder_mask_margin 0.102)) (pad M9 smd circle (at 3.2 2.8 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad N1 smd circle (at -3.2 3.6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad N2 smd circle (at -2.4 3.6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 256 /SDRAM/DDR3_A3) (solder_mask_margin 0.102)) (pad N3 smd circle (at -1.6 3.6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 264 /SDRAM/DDR3_A0) (solder_mask_margin 0.102)) (pad N7 smd circle (at 1.6 3.6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 270 /SDRAM/DDR3_A12) (solder_mask_margin 0.102)) (pad N8 smd circle (at 2.4 3.6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 263 /SDRAM/DDR3_BA1) (solder_mask_margin 0.102)) (pad N9 smd circle (at 3.2 3.6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad P1 smd circle (at -3.2 4.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad P2 smd circle (at -2.4 4.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 257 /SDRAM/DDR3_A5) (solder_mask_margin 0.102)) (pad P3 smd circle (at -1.6 4.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 265 /SDRAM/DDR3_A2) (solder_mask_margin 0.102)) (pad P7 smd circle (at 1.6 4.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 255 /SDRAM/DDR3_A1) (solder_mask_margin 0.102)) (pad P8 smd circle (at 2.4 4.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 266 /SDRAM/DDR3_A4) (solder_mask_margin 0.102)) (pad P9 smd circle (at 3.2 4.4 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad R1 smd circle (at -3.2 5.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad R2 smd circle (at -2.4 5.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 258 /SDRAM/DDR3_A7) (solder_mask_margin 0.102)) (pad R3 smd circle (at -1.6 5.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 259 /SDRAM/DDR3_A9) (solder_mask_margin 0.102)) (pad R7 smd circle (at 1.6 5.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 260 /SDRAM/DDR3_A11) (solder_mask_margin 0.102)) (pad R8 smd circle (at 2.4 5.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 267 /SDRAM/DDR3_A6) (solder_mask_margin 0.102)) (pad R9 smd circle (at 3.2 5.2 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad T1 smd circle (at -3.2 6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad T2 smd circle (at -2.4 6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 277 /FPGA/DDR3_RST_N) (solder_mask_margin 0.102)) (pad T3 smd circle (at -1.6 6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 261 /SDRAM/DDR3_A13) (solder_mask_margin 0.102)) (pad T7 smd circle (at 1.6 6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 274 /SDRAM/DDR3_A14) (solder_mask_margin 0.102)) (pad T8 smd circle (at 2.4 6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 268 /SDRAM/DDR3_A8) (solder_mask_margin 0.102)) (pad T9 smd circle (at 3.2 6 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/BGA96C80P9X16_900X1400X120.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5D03A187) (at 275.3614 163.3982 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA59/5D0062E3) (attr smd) (fp_text reference R296 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22R_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 725 /ETH_PHY/RGMII_RXD3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 726 "Net-(R296-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5D03A176) (at 276.1742 163.5252 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA59/5D006104) (attr smd) (fp_text reference R295 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_22R_1%_0.0625W_100PPM (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 723 /ETH_PHY/RGMII_RXD2) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 724 "Net-(R295-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5D03A165) (at 276.9616 163.5506 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA59/5D005EFD) (attr smd) (fp_text reference R294 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22R_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 721 /ETH_PHY/RGMII_RXD1) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 722 "Net-(R294-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5D03A154) (at 277.6982 163.5252 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA59/5D005C96) (attr smd) (fp_text reference R293 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_22R_1%_0.0625W_100PPM (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 719 /ETH_PHY/RGMII_RXD0) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 720 "Net-(R293-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5D03A143) (at 275.717 166.3192 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA59/5D0054DB) (attr smd) (fp_text reference R292 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22R_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 717 /ETH_PHY/RGMII_RX_CLK) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 718 "Net-(R292-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5D03A132) (at 278.2316 163.5506 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA59/5D001AE1) (attr smd) (fp_text reference R291 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22R_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 715 /ETH_PHY/RGMII_RX_DV) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 716 "Net-(R291-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5D02EDB4) (at 165.6588 182.3466 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5ED4B03D) (attr smd) (fp_text reference R290 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 712 /FMC_TRST) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 683 /FMC1_TRST) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5D02EDA3) (at 166.3192 180.5178 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5ED4B069) (attr smd) (fp_text reference R289 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 683 /FMC1_TRST) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 685 /FMC2_TRST) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5CDEFC8E) (at 198.5518 145.2118 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5CF23DD8) (attr smd) (fp_text reference R288 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 414 /MMC/BOOT_MODE2) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 697 "Net-(R285-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5CDEFC7D) (at 198.5772 143.6624 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5CEFEDF3) (attr smd) (fp_text reference R287 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 413 /MMC/BOOT_MODE1) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 696 "Net-(R284-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5CDEFC6C) (at 198.5518 142.1638 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5CEFEDC6) (attr smd) (fp_text reference R286 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 412 /MMC/BOOT_MODE0) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 695 "Net-(R283-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CDEFC5B) (at 198.501 145.3896 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5D0E75C1) (attr smd) (fp_text reference R285 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 697 "Net-(R285-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CDEFC4A) (at 198.5518 144.1958 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5D10ADB0) (attr smd) (fp_text reference R284 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 696 "Net-(R284-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CDEFC39) (at 198.5264 142.1384) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5D04D9B8) (attr smd) (fp_text reference R283 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 695 "Net-(R283-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CDEFC28) (at 198.5518 143.1036 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5D457EC6) (attr smd) (fp_text reference R282 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_5K1_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 341 /FPGA/FPGA_PWR&MISC/FPGA_INIT) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5CE1014D) (at 257.2258 187.5154 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5D933441) (attr smd) (fp_text reference R281 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 694 "Net-(R281-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CDFBC56) (at 166.5224 143.6624 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5F7F3D77) (attr smd) (fp_text reference R280 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 690 /JTAG/FMC2_TDO_R) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 134 /FMC2_TDO) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CDFBC45) (at 165.3032 143.637 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5F7F3D4B) (attr smd) (fp_text reference R279 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 689 /JTAG/FMC2_TDI_R) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 135 /FMC2_TDI) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CDFBC34) (at 165.0238 150.368 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5F7ED6DA) (attr smd) (fp_text reference R278 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 688 /JTAG/FMC1_TDO_R) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 684 /FMC1_TDO) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CDFBC23) (at 163.9316 151.9936 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5F7ED6AE) (attr smd) (fp_text reference R277 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 687 /JTAG/FMC1_TDI_R) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 152 /FMC1_TDI) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5D02EC12) (at 162.7886 145.7198) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5E6C4912) (attr smd) (fp_text reference R276 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 705 "Net-(D17-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 130 /FMC2_PRSNT_M2C_L) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CDCF3C5) (at 159.0294 165.5318 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5F7A2A7F) (attr smd) (fp_text reference R275 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 711 /FMC_TDO) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 690 /JTAG/FMC2_TDO_R) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CB28876) (at 174.117 85.3948 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5D00A0A2) (attr smd) (fp_text reference R274 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 679 "Net-(R274-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CA64CC9) (at 162.1536 125.2474 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5D1175B7) (attr smd) (fp_text reference R273 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_47K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 673 "Net-(Q24-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CA64CB8) (at 141.478 139.7762 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CFEC5BE) (attr smd) (fp_text reference R272 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CA64CA7) (at 144.8816 144.9832 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CDF0F2D) (attr smd) (fp_text reference R271 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 674 "Net-(Q24-Pad3)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CA64C96) (at 141.3764 145.7452 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CFD7948) (attr smd) (fp_text reference R270 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 670 "Net-(C360-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CA64C85) (at 147.2946 144.9832) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CF9226D) (attr smd) (fp_text reference R269 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_82K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 671 "Net-(Q14-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 674 "Net-(Q24-Pad3)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CF402A0) (at 136.2964 208.9912 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5E66E638) (attr smd) (fp_text reference R268 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 668 "Net-(LD15-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CF4028F) (at 128.397 208.661 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5E66E664) (attr smd) (fp_text reference R267 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 666 "Net-(LD14-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CF4027E) (at 140.2334 76.5048 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5E67FF87) (attr smd) (fp_text reference R266 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 664 "Net-(LD13-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CD1C3BE) (at 126.1618 96.012 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5DDC754E) (attr smd) (fp_text reference R265 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 661 "Net-(LD12-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CD1C3AD) (at 126.1872 101.219 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5DDD1576) (attr smd) (fp_text reference R264 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 659 "Net-(LD11-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CCFFB26) (at 148.7678 156.4894) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5DC932FA) (attr smd) (fp_text reference R263 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 658 "Net-(R263-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CC1A29A) (at 271.6276 160.0582 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA59/5DAB8B19) (attr smd) (fp_text reference R262 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 656 "Net-(R262-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CA74CB1) (at 181.1528 193.2051 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD31F9A/5CC0617B) (attr smd) (fp_text reference R261 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1107 "Net-(R261-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CA74CA0) (at 181.1528 191.2747 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD31F9A/5D27C16B) (attr smd) (fp_text reference R260 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 654 /FMC_1/FMC1_FUSE) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CA74C8F) (at 182.5879 119.9515 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD31F9F/5CC978F1) (attr smd) (fp_text reference R259 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1106 "Net-(R259-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CA74C7E) (at 182.5879 117.9703 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD31F9F/5D163CC6) (attr smd) (fp_text reference R258 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 653 /FMC_2/FMC2_FUSE) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C681D5A) (at 221.488 205.0034 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5C731446) (attr smd) (fp_text reference R257 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 483 "Net-(LD10-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6817AF) (at 220.218 205.0542 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5C6088C3) (attr smd) (fp_text reference R256 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 482 "Net-(LD9-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C65C171) (at 215.4174 205.0796 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5C65DC1B) (attr smd) (fp_text reference R255 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 678 "Net-(Q27-Pad5)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 12 +1V8) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C680C59) (at 214.3125 205.0669 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5C60886A) (attr smd) (fp_text reference R254 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 480 "Net-(LD8-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6806AE) (at 219.202 205.0542 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5C648A88) (attr smd) (fp_text reference R253 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 677 "Net-(Q27-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C680103) (at 208.8642 204.9272 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5C5F3459) (attr smd) (fp_text reference R252 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 478 "Net-(LD7-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C67FB58) (at 205.867 203.454 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5C8E4A4C) (attr smd) (fp_text reference R251 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 476 "Net-(LD6-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C67F5AD) (at 203.2762 205.1558 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5C6338F6) (attr smd) (fp_text reference R250 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 676 "Net-(Q26-Pad5)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C67F002) (at 202.2348 204.8764 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5C5DE283) (attr smd) (fp_text reference R249 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 475 "Net-(LD5-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C67EA57) (at 201.0156 204.8764 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5C8A1E9C) (attr smd) (fp_text reference R248 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 473 "Net-(LD4-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C67E4AC) (at 207.0862 205.1812 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5C61E75F) (attr smd) (fp_text reference R247 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 675 "Net-(Q26-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CA5CF7F) (at 169.1005 164.3634 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5D18F0EF) (attr smd) (fp_text reference R246 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 456 "Net-(D14-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C7CC6C7) (at 238.125 187.0456 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D02947C) (attr smd) (fp_text reference R245 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 422 /MMC/EN_PSU_CH) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 455 "Net-(D2-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC3216X65N (layer B.Cu) (tedit 5CACA4AC) (tstamp 5C60B145) (at 194.0052 210.4644 270) (descr "Chip Resistor, EIA 1206, Metric 3216, Body 3.2x1.6mm, IPC Medium Density") (path /5C726512) (attr smd) (fp_text reference R244 (at 0 2.176 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R1206_1M_1%_0.25W_100PPM (at 0 -2.176 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.5 -0.9) (end 0.5 -0.9) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 0.9) (end 0.5 0.9) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 0.8) (end 1.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.8) (end 1.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.8) (end 1.6 -0.8) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.8) (end -1.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -2.3 -1.15) (end 2.3 -1.15) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.3 1.15) (end 2.3 1.15) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.3 -1.15) (end 2.3 1.15) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.3 -1.15) (end -2.3 1.15) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.45 0 270) (size 1.15 1.8) (layers B.Cu B.Paste B.Mask) (net 437 /ESDSTRIP1) (solder_mask_margin 0.102)) (pad 2 smd rect (at 1.45 0 270) (size 1.15 1.8) (layers B.Cu B.Paste B.Mask) (net 652 /ESDSTRIP2) (solder_mask_margin 0.102)) (model ${CERN}/RESC3216X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC3216X65N (layer B.Cu) (tedit 5CACA4AC) (tstamp 5C60AB99) (at 198.0819 210.312 90) (descr "Chip Resistor, EIA 1206, Metric 3216, Body 3.2x1.6mm, IPC Medium Density") (path /5C72633B) (attr smd) (fp_text reference R243 (at 0 2.176 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R1206_1M_1%_0.25W_100PPM (at 0 -2.176 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.5 -0.9) (end 0.5 -0.9) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 0.9) (end 0.5 0.9) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 0.8) (end 1.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.8) (end 1.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.8) (end 1.6 -0.8) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.8) (end -1.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -2.3 -1.15) (end 2.3 -1.15) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.3 1.15) (end 2.3 1.15) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.3 -1.15) (end 2.3 1.15) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.3 -1.15) (end -2.3 1.15) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.45 0 90) (size 1.15 1.8) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at 1.45 0 90) (size 1.15 1.8) (layers B.Cu B.Paste B.Mask) (net 437 /ESDSTRIP1) (solder_mask_margin 0.102)) (model ${CERN}/RESC3216X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F7108) (at 162.0266 162.2044 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5EC0B008) (attr smd) (fp_text reference R242 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 151 /FMC1_TMS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 133 /FMC2_TMS) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F6B5D) (at 162.0266 161.163 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5E7ADC5E) (attr smd) (fp_text reference R241 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 153 /FMC1_TCK) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 136 /FMC2_TCK) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F65B2) (at 160.147 162.2044 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5EC06860) (attr smd) (fp_text reference R240 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 710 /FMC_TMS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 151 /FMC1_TMS) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F6007) (at 160.147 161.163 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5E7ADC31) (attr smd) (fp_text reference R239 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 709 /FMC_TCK) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 153 /FMC1_TCK) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F5A5C) (at 163.5379 149.9235 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5E7ADBD7) (attr smd) (fp_text reference R238 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 688 /JTAG/FMC1_TDO_R) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 689 /JTAG/FMC2_TDI_R) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F54B1) (at 162.814 152.019 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5E7ADC04) (attr smd) (fp_text reference R237 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 687 /JTAG/FMC1_TDI_R) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 708 /FMC_TDI) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5CA4B94B) (at 199.629699 138.801399 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5CBBBAA1) (attr smd) (fp_text reference R236 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 208 "Net-(LD2-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 460 +12V_FMC2) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6F495B) (at 202.3618 200.8124 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5CBACABF) (attr smd) (fp_text reference R235 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 207 "Net-(LD1-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 462 +12V_FMC1) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F43B0) (at 165.1508 156.4386 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD31F9A/5E9E074C) (attr smd) (fp_text reference R234 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 148 /FMC1_PRSNT_M2C_L) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F3E05) (at 164.5793 103.0859) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5E1E0825) (attr smd) (fp_text reference R233 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 176 /JTAG/JTAG_TDO) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 368 /USB_TDO_DI) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F385A) (at 164.5793 104.6353) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5E1E0852) (attr smd) (fp_text reference R232 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 178 /JTAG/JTAG_TMS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 367 /USB_TMS) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F32AF) (at 164.6174 106.9721) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5E1E07F8) (attr smd) (fp_text reference R231 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 175 /JTAG/JTAG_TDI) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 366 /USB_TDI_DO) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F2D04) (at 164.6174 108.4961) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5E1E087F) (attr smd) (fp_text reference R230 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 177 /JTAG/JTAG_TCK) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 365 /USB_TCK) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F2759) (at 173.4312 156.083 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5E1B1275) (attr smd) (fp_text reference R229 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 177 /JTAG/JTAG_TCK) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 364 /FPGA/FPGA_TCK) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F21AE) (at 169.1894 160.9598) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5E1AEA6C) (attr smd) (fp_text reference R228 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 178 /JTAG/JTAG_TMS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 363 /FPGA/FPGA_TMS) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8EB10A) (at 170.8531 151.5872 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CC8CB69/5F9EB93A) (attr smd) (fp_text reference R227 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 446 "Net-(C39-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8F6615) (at 284.52064 157.55112 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5F5CA88B) (attr smd) (fp_text reference R226 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_51R_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 116 /FPGA/FPGA_15_16/TMDS2_P) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8EB13A) (at 172.4279 137.5029 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CC8CB69/5F9D945C) (attr smd) (fp_text reference R225 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 10 "Net-(C38-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8EB16A) (at 171.4373 137.4902 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CC8CB69/5F9C6F63) (attr smd) (fp_text reference R224 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 10 "Net-(C38-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8EB19A) (at 176.8602 136.8298 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CC8CB69/5F9B4342) (attr smd) (fp_text reference R223 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 356 /FPGA/FPGA_13_14/CFG_FCS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C7C4479) (at 225.3996 154.991301 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CC8CB69/5F958ABD) (attr smd) (fp_text reference R222 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 355 /FPGA/FPGA_13_14/CFG_PUDC) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C7C3ECE) (at 225.3996 153.9748) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CC8CB69/5F9465E2) (attr smd) (fp_text reference R221 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 355 /FPGA/FPGA_13_14/CFG_PUDC) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8F6555) (at 283.22524 167.96004) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5F83F362) (attr smd) (fp_text reference R220 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 198 /FPGA/FPGA_15_16/HDMI_HPD) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 9 /FPGA/FPGA_15_16/HDMI_5V) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8F6675) (at 284.52064 158.5214 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5F62CBCC) (attr smd) (fp_text reference R219 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_51R_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 119 /FPGA/FPGA_15_16/TMDS2_N) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8F65B5) (at 283.22524 166.0144) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5F754E19) (attr smd) (fp_text reference R218 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 199 "Net-(J15-Pad16)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 9 /FPGA/FPGA_15_16/HDMI_5V) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8F6525) (at 283.21 165.0238) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5F754C50) (attr smd) (fp_text reference R217 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 200 "Net-(J15-Pad15)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 9 /FPGA/FPGA_15_16/HDMI_5V) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F1B48) (at 169.1894 162.1028) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5E1AC264) (attr smd) (fp_text reference R216 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 176 /JTAG/JTAG_TDO) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 362 /FPGA/FPGA_TDO) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F159D) (at 172.339 156.1084 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5E1A9A5B) (attr smd) (fp_text reference R215 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 175 /JTAG/JTAG_TDI) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 361 /FPGA/FPGA_TDI) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CA1BCBF) (at 169.2656 132.2578 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C9730DB) (attr smd) (fp_text reference R214 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 35 "Net-(C135-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 484 "Net-(Q9-Pad3)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F0A47) (at 208.6864 196.1642) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C9926D8) (attr smd) (fp_text reference R213 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 34 "Net-(C134-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 234 "Net-(Q8-Pad3)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6F049C) (at 239.468288 200.123817) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C51377F) (attr smd) (fp_text reference R212 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_82K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 229 "Net-(Q22-Pad3)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8F6585) (at 278.7396 157.52064) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5F64CF3F) (attr smd) (fp_text reference R211 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_51R_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 117 /FPGA/FPGA_15_16/TMDS1_P) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8EB3BF) (at 169.2402 136.779 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CC8CB69/5CDA6B6E) (attr smd) (fp_text reference R210 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 359 "Net-(R210-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 360 /FPGA/FPGA_13_14/CFG_D03) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8EB3EF) (at 178.3334 151.7142 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CC8CB69/5CDA6911) (attr smd) (fp_text reference R209 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 357 /FPGA/FPGA_13_14/CFG_WP) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 358 /FPGA/FPGA_13_14/CFG_D02) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8F6645) (at 278.7396 158.496) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5F66D2B5) (attr smd) (fp_text reference R208 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_51R_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 118 /FPGA/FPGA_15_16/TMDS1_N) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8F65E5) (at 279.2222 160.0708 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5F68D62E) (attr smd) (fp_text reference R207 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_51R_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 120 /FPGA/FPGA_15_16/TMDS0_P) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8F66A5) (at 278.257 160.07588 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5F6AD9A8) (attr smd) (fp_text reference R206 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_51R_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 123 /FPGA/FPGA_15_16/TMDS0_N) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6EFE8B) (at 185.4454 83.6422) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD31F9F/5EA24409) (attr smd) (fp_text reference R205 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 130 /FMC2_PRSNT_M2C_L) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6EF8E0) (at 152.146 104.648) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CD7284F) (attr smd) (fp_text reference R204 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 457 "Net-(Q6-Pad3)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CA1BCEF) (at 168.9862 126.1618 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C8C845B) (attr smd) (fp_text reference R203 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 484 "Net-(Q9-Pad3)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6EED8A) (at 208.6864 197.2056 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C899B82) (attr smd) (fp_text reference R202 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 234 "Net-(Q8-Pad3)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CA1BD1F) (at 167.4876 131.4958) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C8D7D39) (attr smd) (fp_text reference R201 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 235 /MMC/EN_FMC2_P12V) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6EE234) (at 150.368 109.728 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5E2298AF) (attr smd) (fp_text reference R200 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 354 "Net-(R200-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 230 /EN_USB_JTAG) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C7BCD3D) (at 282.9052 91.059 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5D662C0F) (attr smd) (fp_text reference R199 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 353 /FPGA/EXP_INT) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6EDC78) (at 229.2096 202.5396) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DFFD677) (attr smd) (fp_text reference R198 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 352 "Net-(R197-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6ED6CD) (at 229.1842 201.3966 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DFF3820) (attr smd) (fp_text reference R197 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 352 "Net-(R197-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 101 "Net-(C350-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6ED122) (at 256.0574 145.161 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D300F68) (attr smd) (fp_text reference R196 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 351 "Net-(R195-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6ECB77) (at 257.9878 144.78 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D300F39) (attr smd) (fp_text reference R195 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 351 "Net-(R195-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 680 "Net-(C145-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6EC5CC) (at 266.5984 175.5648 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DDB0FF7) (attr smd) (fp_text reference R194 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 350 "Net-(R194-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6EC021) (at 240.03 191.4144 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DD9BE3D) (attr smd) (fp_text reference R193 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 349 "Net-(R193-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 691 +5V) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6EBA76) (at 246.888 176.9364 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DD86C88) (attr smd) (fp_text reference R192 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 348 "Net-(R192-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6EB4CB) (at 240.075 176.575 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DD71ACC) (attr smd) (fp_text reference R191 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 347 "Net-(R191-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6EAF20) (at 235.7374 184.658) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DCDDB32) (attr smd) (fp_text reference R190 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 346 "Net-(R190-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5CA4B8A5) (at 205.6892 133.223 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DDDBB57) (attr smd) (fp_text reference R189 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 344 "Net-(R168-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6EA3CA) (at 208.1784 198.7042 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C88A4FD) (attr smd) (fp_text reference R188 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 233 /MMC/EN_FMC1_P12V) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E9E1F) (at 269.6464 127.2159 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC8AFE1/5C65B435) (attr smd) (fp_text reference R187 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 171 /FPGA/SFP4_TX_DIS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E9874) (at 269.6464 123.1519 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC8AFE1/5C65CC70) (attr smd) (fp_text reference R186 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 168 /FPGA/SFP4_LOS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E92C9) (at 269.621 99.4283 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC393D3/5C623D8F) (attr smd) (fp_text reference R185 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 159 /FPGA/SFP2_TX_DIS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E8D1E) (at 241.754288 203.425817 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C4E5C14) (attr smd) (fp_text reference R184 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 250 "Net-(Q22-Pad5)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 249 "Net-(Q22-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC3216X80N (layer B.Cu) (tedit 5CACBBBA) (tstamp 5CA1BD51) (at 179.3113 126.0221) (descr "Chip Resistor, EIA 1206, Metric 3216, Body 3.2x1.6mm, IPC Medium Density") (path /5C16BF8E/5E156EFB) (attr smd) (fp_text reference R183 (at 0 2.226) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R1206_0R082_1%_0.5W_100PPM (at 0 -2.226) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0.8) (end 0.5 0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 -0.8) (end 0.5 -0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.815) (end -1.6 0.815) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.815) (end 1.6 0.815) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.815) (end 1.6 0.815) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.815) (end 1.6 -0.815) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -2.4 -1.2) (end -2.4 1.2) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.4 1.2) (end 2.4 1.2) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.4 -1.2) (end 2.4 1.2) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.4 -1.2) (end 2.4 -1.2) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.5 0 270) (size 1.85 1.25) (layers B.Cu B.Paste B.Mask) (net 251 "Net-(Q23-Pad5)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 1.5 0 270) (size 1.85 1.25) (layers B.Cu B.Paste B.Mask) (net 460 +12V_FMC2) (solder_mask_margin 0.102)) (model ${CERN}/RESC3216X80N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC3216X80N (layer B.Cu) (tedit 5CACBBBA) (tstamp 5C6E81C6) (at 199.2376 193.2178 180) (descr "Chip Resistor, EIA 1206, Metric 3216, Body 3.2x1.6mm, IPC Medium Density") (path /5C16BF8E/5E1246EE) (attr smd) (fp_text reference R182 (at 0 2.226) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R1206_0R082_1%_0.5W_100PPM (at 0 -2.226) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0.8) (end 0.5 0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 -0.8) (end 0.5 -0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.815) (end -1.6 0.815) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.815) (end 1.6 0.815) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.815) (end 1.6 0.815) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.815) (end 1.6 -0.815) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -2.4 -1.2) (end -2.4 1.2) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.4 1.2) (end 2.4 1.2) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.4 -1.2) (end 2.4 1.2) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.4 -1.2) (end 2.4 -1.2) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.5 0 90) (size 1.85 1.25) (layers B.Cu B.Paste B.Mask) (net 246 "Net-(Q16-Pad5)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 1.5 0 90) (size 1.85 1.25) (layers B.Cu B.Paste B.Mask) (net 462 +12V_FMC1) (solder_mask_margin 0.102)) (model ${CERN}/RESC3216X80N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E7C19) (at 240.484288 204.695817 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C5044EB) (attr smd) (fp_text reference R181 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_47K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 249 "Net-(Q22-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E766E) (at 162.814 202.057 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C56D2EB) (attr smd) (fp_text reference R180 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_47K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 245 "Net-(Q15-Pad3)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6E70C3) (at 255.50114 189.96152) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C4B87F3) (attr smd) (fp_text reference R179 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 127 /MMC/AT_DET) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6EB0A9) (at 144.3228 169.1386 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5D05A99E/5D096E6B) (attr smd) (fp_text reference R178 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 109 /MMC/OVER_TEMP) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E656D) (at 219.5576 186.9948 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5D05A99E/5D08DCCB) (attr smd) (fp_text reference R177 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 214 "Net-(M2-Pad3)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E5FC2) (at 218.5416 186.9948 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5D05A99E/5D08AD42) (attr smd) (fp_text reference R176 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 232 "Net-(Q7-Pad4)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E5A17) (at 217.5256 186.9948 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5D05A99E/5D087DBA) (attr smd) (fp_text reference R175 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 212 "Net-(M1-Pad3)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E546C) (at 216.5096 186.9948 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5D05A99E/5D084E35) (attr smd) (fp_text reference R174 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 231 "Net-(Q7-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E4EC1) (at 220.5736 186.9948 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5D05A99E/5D081EB1) (attr smd) (fp_text reference R173 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 485 /FANFAIL) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E4916) (at 219.5576 197.4088 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5D05A99E/5D07EF2E) (attr smd) (fp_text reference R172 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 321 /ALERT) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E436B) (at 160.8582 204.7494 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C5FA1D5) (attr smd) (fp_text reference R171 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 244 "Net-(Q15-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E3DC0) (at 276.0218 138.8364 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C609031) (attr smd) (fp_text reference R170 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 693 "Net-(C357-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC0603X28N (layer F.Cu) (tedit 5CACA476) (tstamp 5C7B234C) (at 235.25772 106.2736) (descr "Chip Resistor, EIA 0201, Metric 0603, Body 0.6 x 0.3mm, IPC Medium Density") (path /5C907554/5DCA928C/5DCC9ABA) (attr smd) (fp_text reference R169 (at 0 -1.386) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0201_200R_1%_0.05W_200PPM (at 0 1.386) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0.15) (end -0.3 -0.15) (layer F.Fab) (width 0.1)) (fp_line (start -0.3 -0.15) (end 0.3 -0.15) (layer F.Fab) (width 0.1)) (fp_line (start 0.3 0.15) (end 0.3 -0.15) (layer F.Fab) (width 0.1)) (fp_line (start -0.3 0.15) (end 0.3 0.15) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.71 0.36) (end -0.71 -0.36) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.71 -0.36) (end 0.71 -0.36) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.71 0.36) (end 0.71 -0.36) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.71 0.36) (end 0.71 0.36) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.33 0) (size 0.46 0.42) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.33 0) (size 0.46 0.42) (layers F.Cu F.Paste F.Mask) (net 73 /FPGA/FPGA_REF_CLK1_P) (solder_mask_margin 0.102)) (model RESC0603X28N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6E3805) (at 209.7532 134.6708 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DC9E336) (attr smd) (fp_text reference R168 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 344 "Net-(R168-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 12 +1V8) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6E325A) (at 250.86056 188.19876 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DF846D8) (attr smd) (fp_text reference R167 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 339 /Power/Power_SW/EN_1V2) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E2CAF) (at 218.1987 86.2457 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5C683FF0) (attr smd) (fp_text reference R166 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 56 /EN_CON_JTAG) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CB18F8D) (at 291.465 176.403) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA59/5DB27C8B) (attr smd) (fp_text reference R165 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 657 "Net-(J4-Pad21)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8F66D5) (at 284.4292 161.925 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5F6CDD23) (attr smd) (fp_text reference R164 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_51R_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 121 /FPGA/FPGA_15_16/TMDS_CLK_P) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C7B014F) (at 194.9704 210.4898 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5F32C3FA) (attr smd) (fp_text reference R163 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 210 "Net-(LD3-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C7AFBA4) (at 196.7484 210.4898 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5F41F910) (attr smd) (fp_text reference R162 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_300R_1%_0.0625W_100PPM (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 248 /FPGA/FPGA_DONE) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C9F2DBD) (at 244.9576 140.1572 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5F49043B) (attr smd) (fp_text reference R161 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_100R_1%_0.1W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 342 "Net-(R161-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C7AF04E) (at 221.6658 117.3734 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5D3882C0) (attr smd) (fp_text reference R160 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 225 /FPGA/PROG_B) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C7AEAA3) (at 170.6626 181.2036 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5F3B7A1D) (attr smd) (fp_text reference R159 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 325 /FPGA/FPGA_RESETn) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 341 /FPGA/FPGA_PWR&MISC/FPGA_INIT) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A228) (at 155.956 173.3804 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CD47A29) (attr smd) (fp_text reference R158 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 340 /MMC/HW_ID3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6E1B48) (at 250.86056 189.12332 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DF6F05C) (attr smd) (fp_text reference R157 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 343 /Power/Power_SW/EN_1V8) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6E159D) (at 268.478 175.7426 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA59/5DAF2CF6) (attr smd) (fp_text reference R156 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_240R_1%_0.0625W_100PPM (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 338 "Net-(R156-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 144 "Net-(J4-Pad19)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A468) (at 168.529 180.721 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CBF4171) (attr smd) (fp_text reference R155 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_100R_1%_0.1W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 337 "Net-(R155-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 219 /AMC_connector/AMC_En) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6E0A47) (at 152.3238 191.389 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CCACFFA) (attr smd) (fp_text reference R154 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_100R_1%_0.1W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 336 "Net-(R154-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 137 /FMC_2/FMC2_PG_C2M) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C5AC4D7) (at 154.3558 191.389 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CC9DA21) (attr smd) (fp_text reference R153 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_100R_1%_0.1W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 335 "Net-(R153-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 154 /FMC_1/FMC1_PG_C2M) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A378) (at 147.9296 187.5536) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CC8E445) (attr smd) (fp_text reference R152 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_100R_1%_0.1W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 334 "Net-(R152-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 704 /FMC2_PRSNT_Override) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A198) (at 156.9974 173.355 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CC6F891) (attr smd) (fp_text reference R151 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_100R_1%_0.1W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 333 "Net-(R151-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 706 /FMC1_PRSNT_Override) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6DF39B) (at 151.3078 191.389 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CC602B7) (attr smd) (fp_text reference R150 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_100R_1%_0.1W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 332 "Net-(R150-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 218 /AMC_connector/AMC_GA2) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C5AC435) (at 157.4038 191.389 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CC50CE2) (attr smd) (fp_text reference R149 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_100R_1%_0.1W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 331 "Net-(R149-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 223 /AMC_connector/AMC_GA1) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C5AC405) (at 156.3878 191.389 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CC4170E) (attr smd) (fp_text reference R148 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_100R_1%_0.1W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 330 "Net-(R148-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 222 /AMC_connector/AMC_GA0) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A498) (at 152.7556 173.355 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CD3844A) (attr smd) (fp_text reference R147 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 329 /MMC/HW_ID2) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A258) (at 153.7462 173.355 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CD28E72) (attr smd) (fp_text reference R146 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 328 /MMC/HW_ID1) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A348) (at 168.529 179.705) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CCDB9F7) (attr smd) (fp_text reference R145 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 219 /AMC_connector/AMC_En) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A318) (at 154.7622 173.355 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CD19897) (attr smd) (fp_text reference R144 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 327 /MMC/HW_ID0) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A2B8) (at 168.529 182.753 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CCBC9D1) (attr smd) (fp_text reference R143 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 326 /MMC/SW) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A1C8) (at 168.529 181.737) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CCFA72E) (attr smd) (fp_text reference R142 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 325 /FPGA/FPGA_RESETn) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C8F6876) (at 284.43936 162.91052 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C907554/5CAAC367/5F6EE09D) (attr smd) (fp_text reference R141 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_51R_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 122 /FPGA/FPGA_15_16/TMDS_CLK_N) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6DC087) (at 153.3398 191.389 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CD94962) (attr smd) (fp_text reference R140 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 197 /MMC_TMS) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C5AC3D5) (at 155.3718 191.389 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CD85385) (attr smd) (fp_text reference R139 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 324 /MMC/MMC_TRST) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A438) (at 151.765 173.355 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CD75DA7) (attr smd) (fp_text reference R138 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 107 /LPC_RST) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A2E8) (at 147.9296 188.6966 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CD667CC) (attr smd) (fp_text reference R137 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 196 /MMC_TCK) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A3A8) (at 160.909 173.355 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CB96937) (attr smd) (fp_text reference R136 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 323 "Net-(R136-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 282 /FPGA/I2C_FPGA_SCL) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A288) (at 168.529 178.689 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CB76824) (attr smd) (fp_text reference R135 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 322 "Net-(R135-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 283 /FPGA/I2C_FPGA_SDA) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A3D8) (at 149.7584 173.355 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CB4782C) (attr smd) (fp_text reference R134 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 220 /AMC_connector/I2C_IPMB_SDA) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A1F8) (at 150.749 173.355 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CB47635) (attr smd) (fp_text reference R133 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 224 /AMC_connector/I2C_IPMB_SCL) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C70A408) (at 146.7612 182.9054) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA39/5CBD4ABC) (attr smd) (fp_text reference R132 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 24 "Net-(C93-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D8D84) (at 169.2402 158.5976) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5C696304) (attr smd) (fp_text reference R131 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 247 "Net-(Q17-Pad3)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D87D9) (at 221.5896 186.9948 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5D05A99E/5D07BC3B) (attr smd) (fp_text reference R130 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 345 /THERM) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D822E) (at 222.123 198.9582 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5D05A99E/5D09FEC4) (attr smd) (fp_text reference R129 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 54 "Net-(C188-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 320 /FPGA/DXN_0) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CB9959E) (at 161.036 128.651 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5D1059C1) (attr smd) (fp_text reference R128 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_47K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 319 /MMC/LPC_ISPn) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D76D8) (at 151.892 109.22) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CD562CB) (attr smd) (fp_text reference R127 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 230 /EN_USB_JTAG) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D712D) (at 155.702 107.442 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CD4807A) (attr smd) (fp_text reference R126 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 318 "Net-(R126-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D6B82) (at 152.654 106.172 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CD39E2A) (attr smd) (fp_text reference R125 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 317 "Net-(R125-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D65D7) (at 160.528 105.918 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CD2BBD7) (attr smd) (fp_text reference R124 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 316 "Net-(R124-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CB9956E) (at 157.4673 125.0823 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CD8F58E) (attr smd) (fp_text reference R123 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 315 "Net-(R123-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D5A81) (at 159.5628 110.5662 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CD1D989) (attr smd) (fp_text reference R122 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 314 "Net-(R122-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5CB9953E) (at 157.4673 127.1143 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CD81338) (attr smd) (fp_text reference R121 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 313 "Net-(R121-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D4F2B) (at 145.796 115.824 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CF2F685) (attr smd) (fp_text reference R120 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_12K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 312 "Net-(R120-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6EB31C) (at 146.304 132.588 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CED87DA) (attr smd) (fp_text reference R119 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 311 "Net-(R118-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6EB34C) (at 148.336 132.588 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CCE432C) (attr smd) (fp_text reference R118 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 311 "Net-(R118-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D3E2A) (at 144.4752 123.8504) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CD00A84) (attr smd) (fp_text reference R117 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 310 "Net-(R117-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D387F) (at 144.272 110.49 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CD0F140) (attr smd) (fp_text reference R116 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 306 "Net-(R112-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D32D4) (at 144.4625 124.9045) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CCF2839) (attr smd) (fp_text reference R115 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 309 "Net-(R115-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D2D29) (at 152.146 124.714 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CED809C) (attr smd) (fp_text reference R114 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 308 "Net-(R114-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 307 "Net-(R113-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D277E) (at 152.146 123.698 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CCE45F1) (attr smd) (fp_text reference R113 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 307 "Net-(R113-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D21D3) (at 144.272 109.474) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16C03C/5CED84D9) (attr smd) (fp_text reference R112 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 306 "Net-(R112-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 124 "Net-(D13-Pad4)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC3216X65N (layer B.Cu) (tedit 5CACA4AC) (tstamp 5C6D1C28) (at 281.5844 139.8016 90) (descr "Chip Resistor, EIA 1206, Metric 3216, Body 3.2x1.6mm, IPC Medium Density") (path /5C16BF8E/5CBE9736) (attr smd) (fp_text reference R111 (at 0 2.176 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R1206_0R47_1%_0.5W_600PPM (at 0 -2.176 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.5 -0.9) (end 0.5 -0.9) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 0.9) (end 0.5 0.9) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 0.8) (end 1.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.8) (end 1.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.8) (end 1.6 -0.8) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.8) (end -1.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -2.3 -1.15) (end 2.3 -1.15) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.3 1.15) (end 2.3 1.15) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.3 -1.15) (end 2.3 1.15) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.3 -1.15) (end -2.3 1.15) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.45 0 90) (size 1.15 1.8) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 2 smd rect (at 1.45 0 90) (size 1.15 1.8) (layers B.Cu B.Paste B.Mask) (net 464 +12V_AMC) (solder_mask_margin 0.102)) (model ${CERN}/RESC3216X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D167C) (at 149.3774 205.8162 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C6BEEF2) (attr smd) (fp_text reference R110 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_82K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 305 "Net-(R109-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6D10D1) (at 149.8346 204.2414 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C7E0B35) (attr smd) (fp_text reference R109 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_270K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 305 "Net-(R109-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 33 "Net-(C132-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C1937) (at 271.3355 198.4375) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C70BFEA) (attr smd) (fp_text reference R108 (at 0 1.526 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_82K_1%_0.0625W_100PPM (at 0 -1.526 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 227 "Net-(Q1-Pad3)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C1967) (at 273.6215 201.6125 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C775BA9) (attr smd) (fp_text reference R107 (at 0 1.526 270) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_1K_1%_0.0625W_100PPM (at 0 -1.526 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 228 "Net-(Q1-Pad5)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 226 "Net-(Q1-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6CFFD0) (at 232.7402 111.4806 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CF773F3) (attr smd) (fp_text reference R106 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 304 /SDRAM/DDR3_BA2) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6CFA25) (at 269.4178 85.2043 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BABAC65/5C64FA82) (attr smd) (fp_text reference R105 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 142 /FPGA/SFP1_TX_DIS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C1997) (at 273.685 203.1365) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF8E/5C7391C2) (attr smd) (fp_text reference R104 (at 0 1.526 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_47K_1%_0.0625W_100PPM (at 0 -1.526 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 226 "Net-(Q1-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C79AD70) (at 236.855 98.044 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF13/5D50A18A) (attr smd) (fp_text reference R103 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_100R_1%_0.1W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 303 /FPGA/CLK20_VCXO) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 459 "Net-(R103-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6CEEBE) (at 243.9416 102.4128 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF13/5CDAC5E6) (attr smd) (fp_text reference R102 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 302 "Net-(R102-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6CEEAD) (at 243.9416 103.4034 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF13/5CDAC2DE) (attr smd) (fp_text reference R101 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 301 "Net-(R101-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C79A785) (at 243.9416 98.4504 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF13/5D4E1748) (attr smd) (fp_text reference R100 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 300 "Net-(R100-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6CEE8B) (at 243.9416 99.441 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF13/5CDAB560) (attr smd) (fp_text reference R99 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 299 "Net-(R99-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6CEE7A) (at 243.9416 100.4316 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF13/5CDA9D77) (attr smd) (fp_text reference R98 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 298 "Net-(R98-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6CEE69) (at 234.7722 99.3394) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF13/5CDAA3A0) (attr smd) (fp_text reference R97 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 297 "Net-(R97-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6CEE58) (at 234.7722 98.3234) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF13/5CDAA0EE) (attr smd) (fp_text reference R96 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 296 "Net-(R96-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C79A13A) (at 240.8936 105.41 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF13/5D4E829E) (attr smd) (fp_text reference R94 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 295 "Net-(R94-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C799B8F) (at 222.885 97.5614 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF13/5D5502A2) (attr smd) (fp_text reference R93 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_240R_1%_0.0625W_100PPM (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 294 "Net-(R93-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 29 /WhiteRabbit/WR_DAC_OUT1) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C7995E4) (at 222.8342 93.0402 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF13/5D535071) (attr smd) (fp_text reference R92 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_240R_1%_0.0625W_100PPM (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 458 "Net-(R92-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 28 /WhiteRabbit/WR_DAC_OUT2) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6CE858) (at 269.6464 124.1679 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC8AFE1/5C65CC43) (attr smd) (fp_text reference R90 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 170 /FPGA/SFP4_DEF0) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6CE2AD) (at 269.6464 125.1839 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC8AFE1/5C65CC16) (attr smd) (fp_text reference R89 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 433 /I2C_MUX/I2C_SFP4_SCL) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6CDD02) (at 269.6464 126.1999 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC8AFE1/5C65CBE9) (attr smd) (fp_text reference R88 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 434 /I2C_MUX/I2C_SFP4_SDA) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6CD757) (at 269.6464 128.2319 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC8AFE1/5C65CBBC) (attr smd) (fp_text reference R87 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 172 /FPGA/SFP4_TX_FAULT) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6CD1AC) (at 269.6464 121.1199) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC8AFE1/5C662D45) (attr smd) (fp_text reference R86 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 167 "Net-(J8-Pad9)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6CCC01) (at 269.6464 122.1359) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC8AFE1/5C662D18) (attr smd) (fp_text reference R85 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 167 "Net-(J8-Pad9)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6CC656) (at 269.8496 112.7125 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC6DBF7/5C6752EC) (attr smd) (fp_text reference R84 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 165 /FPGA/SFP3_TX_DIS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C706050) (at 269.8496 108.6485 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC6DBF7/5C65F926) (attr smd) (fp_text reference R82 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 162 /FPGA/SFP3_LOS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6CB555) (at 269.8496 109.6645 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC6DBF7/5C65F8F9) (attr smd) (fp_text reference R81 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 164 /FPGA/SFP3_DEF0) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6CAFAA) (at 269.8496 110.6805 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC6DBF7/5C65F8CC) (attr smd) (fp_text reference R80 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 431 /I2C_MUX/I2C_SFP3_SCL) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6CA9FF) (at 269.8496 111.6965 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC6DBF7/5C65F89F) (attr smd) (fp_text reference R79 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 432 /I2C_MUX/I2C_SFP3_SDA) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6CA454) (at 269.8496 113.8555 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC6DBF7/5C65F872) (attr smd) (fp_text reference R78 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 166 /FPGA/SFP3_TX_FAULT) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C706080) (at 269.8496 106.3625) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC6DBF7/5C66DC10) (attr smd) (fp_text reference R77 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 161 "Net-(J7-Pad9)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C7060B0) (at 269.8496 107.5055) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC6DBF7/5C66DBE3) (attr smd) (fp_text reference R76 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 161 "Net-(J7-Pad9)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C8DA8) (at 269.621 94.6023 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC393D3/5C623CD4) (attr smd) (fp_text reference R74 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 156 /FPGA/SFP2_LOS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C87FD) (at 269.621 96.3803 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC393D3/5C623C13) (attr smd) (fp_text reference R73 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 158 /FPGA/SFP2_DEF0) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C8252) (at 269.621 97.3963 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC393D3/5C623B21) (attr smd) (fp_text reference R72 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 429 /I2C_MUX/I2C_SFP2_SCL) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C7CA7) (at 269.621 98.4123 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC393D3/5C6239C4) (attr smd) (fp_text reference R71 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 430 /I2C_MUX/I2C_SFP2_SDA) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C76FC) (at 269.621 100.4443 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC393D3/5C623610) (attr smd) (fp_text reference R70 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 160 /FPGA/SFP2_TX_FAULT) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C7151) (at 269.621 92.5703) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC393D3/5C6361FA) (attr smd) (fp_text reference R69 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 155 "Net-(J6-Pad9)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C6BA6) (at 269.621 93.5863) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CC393D3/5C623EEC) (attr smd) (fp_text reference R68 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 155 "Net-(J6-Pad9)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6C65FB) (at 269.494 175.7426 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA59/5DAEC4BD) (attr smd) (fp_text reference R67 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_240R_1%_0.0625W_100PPM (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 292 "Net-(R67-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 145 "Net-(J4-Pad17)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6C5AA6) (at 270.5608 175.768 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA59/5DB0685F) (attr smd) (fp_text reference R65 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_0R_JUMPER (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 290 "Net-(R65-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5D02D179) (at 166.3192 156.464 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5CA40231/5E71D768) (attr smd) (fp_text reference R63 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 707 "Net-(D18-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 148 /FMC1_PRSNT_M2C_L) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC0603X28N (layer F.Cu) (tedit 5CACA476) (tstamp 5C78E650) (at 235.3 103.9876) (descr "Chip Resistor, EIA 0201, Metric 0603, Body 0.6 x 0.3mm, IPC Medium Density") (path /5C907554/5DCA928C/5DCB78D4) (attr smd) (fp_text reference R61 (at 0 -1.386) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0201_200R_1%_0.05W_200PPM (at 0 1.386) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0.15) (end -0.3 -0.15) (layer F.Fab) (width 0.1)) (fp_line (start -0.3 -0.15) (end 0.3 -0.15) (layer F.Fab) (width 0.1)) (fp_line (start 0.3 0.15) (end 0.3 -0.15) (layer F.Fab) (width 0.1)) (fp_line (start -0.3 0.15) (end 0.3 0.15) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.71 0.36) (end -0.71 -0.36) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.71 -0.36) (end 0.71 -0.36) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.71 0.36) (end 0.71 -0.36) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.71 0.36) (end 0.71 0.36) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.33 0) (size 0.46 0.42) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.33 0) (size 0.46 0.42) (layers F.Cu F.Paste F.Mask) (net 72 /FPGA/FPGA_REF_CLK1_N) (solder_mask_margin 0.102)) (model RESC0603X28N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC0603X28N (layer B.Cu) (tedit 5CACA476) (tstamp 5C78E0A6) (at 240.1062 105.13568 90) (descr "Chip Resistor, EIA 0201, Metric 0603, Body 0.6 x 0.3mm, IPC Medium Density") (path /5C907554/5DCA928C/5DCA56EB) (attr smd) (fp_text reference R60 (at 0 1.386 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0201_200R_1%_0.05W_200PPM (at 0 -1.386 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 -0.15) (end -0.3 0.15) (layer B.Fab) (width 0.1)) (fp_line (start -0.3 0.15) (end 0.3 0.15) (layer B.Fab) (width 0.1)) (fp_line (start 0.3 -0.15) (end 0.3 0.15) (layer B.Fab) (width 0.1)) (fp_line (start -0.3 -0.15) (end 0.3 -0.15) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.71 -0.36) (end -0.71 0.36) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.71 0.36) (end 0.71 0.36) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.71 -0.36) (end 0.71 0.36) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.71 -0.36) (end 0.71 -0.36) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.33 0 90) (size 0.46 0.42) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.33 0 90) (size 0.46 0.42) (layers B.Cu B.Paste B.Mask) (net 62 /FPGA/FPGA_REF_CLK0_P) (solder_mask_margin 0.102)) (model RESC0603X28N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC0603X28N (layer B.Cu) (tedit 5CACA476) (tstamp 5C78DAFC) (at 239.3442 105.13568 90) (descr "Chip Resistor, EIA 0201, Metric 0603, Body 0.6 x 0.3mm, IPC Medium Density") (path /5C907554/5DCA928C/5DC80DBA) (attr smd) (fp_text reference R59 (at 0 1.386 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0201_200R_1%_0.05W_200PPM (at 0 -1.386 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 -0.15) (end -0.3 0.15) (layer B.Fab) (width 0.1)) (fp_line (start -0.3 0.15) (end 0.3 0.15) (layer B.Fab) (width 0.1)) (fp_line (start 0.3 -0.15) (end 0.3 0.15) (layer B.Fab) (width 0.1)) (fp_line (start -0.3 -0.15) (end 0.3 -0.15) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.71 -0.36) (end -0.71 0.36) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.71 0.36) (end 0.71 0.36) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.71 -0.36) (end 0.71 0.36) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.71 -0.36) (end 0.71 -0.36) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.33 0 90) (size 0.46 0.42) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.33 0 90) (size 0.46 0.42) (layers B.Cu B.Paste B.Mask) (net 60 /FPGA/FPGA_REF_CLK0_N) (solder_mask_margin 0.102)) (model RESC0603X28N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C78D552) (at 220.2688 90.9447 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5C16BF13/5D557101) (attr smd) (fp_text reference R58 (at 0 -1.526 270) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_240R_1%_0.0625W_100PPM (at 0 1.526 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 448 "Net-(C106-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6BFA0C) (at 168.783 86.36 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5A5FEE) (attr smd) (fp_text reference R44 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 286 "Net-(R44-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6BF461) (at 167.767 86.36 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5A40E6) (attr smd) (fp_text reference R43 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 285 "Net-(R43-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C5C0929) (at 174.117 84.328) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5A21E1) (attr smd) (fp_text reference R42 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 679 "Net-(R274-Pad2)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6BE90B) (at 166.751 86.36 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5EBDC1) (attr smd) (fp_text reference R41 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 284 /FPGA/I2C_FPGA_SW_RST) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C5C0D99) (at 171.577 86.36 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5EA1D3) (attr smd) (fp_text reference R40 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 283 /FPGA/I2C_FPGA_SDA) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C5C0DC9) (at 172.593 86.36 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5E9E49) (attr smd) (fp_text reference R39 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_2K2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 282 /FPGA/I2C_FPGA_SCL) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6BD80A) (at 269.4178 80.5053 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BABAC65/5C64C01E) (attr smd) (fp_text reference R38 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 139 /FPGA/SFP1_LOS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C701D0E) (at 269.4178 81.7753 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BABAC65/5C64BFF1) (attr smd) (fp_text reference R37 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 141 /FPGA/SFP1_DEF0) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6BCCB4) (at 269.4178 82.9183 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BABAC65/5C64BFC4) (attr smd) (fp_text reference R36 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 425 /I2C_MUX/I2C_SFP1_SCL) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6BC709) (at 269.4178 84.0613 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BABAC65/5C64BF97) (attr smd) (fp_text reference R35 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 426 /I2C_MUX/I2C_SFP1_SDA) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N locked (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6BC15E) (at 269.4178 86.3473 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BABAC65/5C64BF6A) (attr smd) (fp_text reference R34 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 143 /FPGA/SFP1_TX_FAULT) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6BBBB3) (at 269.4178 78.2193) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BABAC65/5C64825D) (attr smd) (fp_text reference R33 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_0R_JUMPER (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 138 "Net-(J3-Pad9)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6BB608) (at 269.4178 79.3623) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BABAC65/5C648230) (attr smd) (fp_text reference R32 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 138 "Net-(J3-Pad9)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6BB05D) (at 223.0628 106.5657 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CA9BFC8) (attr smd) (fp_text reference R31 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 281 "Net-(R30-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6BAAB2) (at 221.9198 106.5657 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CA840E4) (attr smd) (fp_text reference R30 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 281 "Net-(R30-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6BA507) (at 218.2368 108.4707 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CA83E91) (attr smd) (fp_text reference R29 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_10K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 280 /SDRAM/PGOOD) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5CA4D101) (at 233.4768 121.7168 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CA53C0B) (attr smd) (fp_text reference R28 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_240R_1%_0.0625W_100PPM (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 279 "Net-(R28-Pad1)") (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6B99B1) (at 232.0036 109.9312 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CFA020B) (attr smd) (fp_text reference R27 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 278 /SDRAM/DDR3_BA0) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6B9406) (at 225.933 113.4872) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CA3BA99) (attr smd) (fp_text reference R26 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_5K1_1%_0.0625W_100PPM (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 277 /FPGA/DDR3_RST_N) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C5F566C) (at 233.9848 109.9312 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CA23A96) (attr smd) (fp_text reference R25 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_5K1_1%_0.0625W_100PPM (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 276 /FPGA/DDR3_ODT) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6B88B0) (at 233.0196 109.9185 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5C9DBB96) (attr smd) (fp_text reference R24 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_5K1_1%_0.0625W_100PPM (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 275 /FPGA/DDR3_CS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B8305) (at 227.11156 117.81028) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CEF6AE4) (attr smd) (fp_text reference R23 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 274 /SDRAM/DDR3_A14) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6B7D5A) (at 234.4674 121.7168 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CF63D46) (attr smd) (fp_text reference R22 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 273 /FPGA/DDR3_CKE) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B77AF) (at 235.0897 116.13388 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CF51682) (attr smd) (fp_text reference R21 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 272 /FPGA/DDR3_CK_N) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B7204) (at 236.1057 116.13388 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CF3E9EE) (attr smd) (fp_text reference R20 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 271 /FPGA/DDR3_CK_P) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B6C59) (at 232.0798 116.1288 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CED242A) (attr smd) (fp_text reference R19 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 270 /SDRAM/DDR3_A12) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B66AE) (at 234.12958 116.13388 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CEAE025) (attr smd) (fp_text reference R18 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 269 /SDRAM/DDR3_A10) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B6103) (at 227.09632 118.81358) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CE89828) (attr smd) (fp_text reference R17 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 268 /SDRAM/DDR3_A8) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B5B58) (at 229.235 116.1288 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CE64DCF) (attr smd) (fp_text reference R16 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 267 /SDRAM/DDR3_A6) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C5F79DF) (at 231.1146 116.1288 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CE402DB) (attr smd) (fp_text reference R15 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 266 /SDRAM/DDR3_A4) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B5002) (at 229.6541 111.4298 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CE1B73D) (attr smd) (fp_text reference R14 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 265 /SDRAM/DDR3_A2) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B4A57) (at 230.6701 111.4806 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CDF1A92) (attr smd) (fp_text reference R13 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 264 /SDRAM/DDR3_A0) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C5F7D49) (at 232.62336 118.81104 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CF8BCF4) (attr smd) (fp_text reference R12 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 263 /SDRAM/DDR3_BA1) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B3F01) (at 233.172 116.1288 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CF08F59) (attr smd) (fp_text reference R11 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 262 /SDRAM/DDR3_A15) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6B3956) (at 225.933 114.4778) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CEE4746) (attr smd) (fp_text reference R10 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 261 /SDRAM/DDR3_A13) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B33AB) (at 228.2698 116.1288 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CEC027E) (attr smd) (fp_text reference R9 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 260 /SDRAM/DDR3_A11) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B2E00) (at 227.5332 114.4778) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CE9BD8B) (attr smd) (fp_text reference R8 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 259 /SDRAM/DDR3_A9) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B2855) (at 228.3714 111.6838 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CE775CF) (attr smd) (fp_text reference R7 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 258 /SDRAM/DDR3_A7) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer F.Cu) (tedit 5CA4E9B6) (tstamp 5C6B22AA) (at 230.9368 109.9312 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CE52902) (attr smd) (fp_text reference R6 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.5 0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 257 /SDRAM/DDR3_A5) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers F.Cu F.Paste F.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B1CFF) (at 231.5972 111.4933 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CE2DE7A) (attr smd) (fp_text reference R5 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 256 /SDRAM/DDR3_A3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B1754) (at 230.1748 116.1034 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5CE08CDD) (attr smd) (fp_text reference R4 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_40R2_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 255 /SDRAM/DDR3_A1) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B11A9) (at 233.7308 111.4806 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5D331738) (attr smd) (fp_text reference R3 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_51R_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 254 /FPGA/DDR3_WE) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B0BFE) (at 235.712 111.4806 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5D31EEA1) (attr smd) (fp_text reference R2 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_51R_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 253 /FPGA/DDR3_RAS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:RESC1005X40N (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6B0653) (at 234.7214 111.4806 270) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BD32060/5D343FBE) (attr smd) (fp_text reference R1 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_51R_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 252 /FPGA/DDR3_CAS) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 180) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SOTFL50P160X60-6N (layer B.Cu) (tedit 5CACA5F9) (tstamp 5CAE8983) (at 217.3478 205.0796 180) (descr "SOTFL (SOT666), 0.50mm, Pitch; 6 Pin, 1.20mm W X 1.60mm L X 0.60mm H Body, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5C608813) (attr smd) (fp_text reference Q27 (at 0.3478 1.8296) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BC847BV (at 0 -2.026) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.1 1.15) (end -0.975 1.15) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.8) (end 0 0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -0.6 -0.8) (end -0.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.8) (end 0.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start 0.6 -0.8) (end 0.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 -0.8) (end 0.6 -0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 -0.2) (end 0.4 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 -0.1) (end 0.3 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0) (end 0.2 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.1) (end 0.1 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.2) (end 0 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.3) (end -0.1 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.4) (end -0.2 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.5) (end -0.3 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.6) (end -0.4 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.7) (end -0.5 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.25 -1) (end -1.25 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.25 1) (end 1.25 1) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.25 -1) (end 1.25 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.25 -1) (end 1.25 -1) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.79 0.5 180) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at -0.79 0 180) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 677 "Net-(Q27-Pad2)") (solder_mask_margin 0.102)) (pad 3 smd rect (at -0.79 -0.5 180) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 481 "Net-(LD9-Pad1)") (solder_mask_margin 0.102)) (pad 4 smd rect (at 0.79 -0.5 180) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 5 smd rect (at 0.79 0 180) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 678 "Net-(Q27-Pad5)") (solder_mask_margin 0.102)) (pad 6 smd rect (at 0.79 0.5 180) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 479 "Net-(LD8-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/SOTFL50P160X60-6N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SOTFL50P160X60-6N (layer B.Cu) (tedit 5CACA5F9) (tstamp 5CAE8962) (at 205.0796 205.232 180) (descr "SOTFL (SOT666), 0.50mm, Pitch; 6 Pin, 1.20mm W X 1.60mm L X 0.60mm H Body, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5C5AEB93) (attr smd) (fp_text reference Q26 (at 1.5796 1.982) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BC847BV (at 0 -2.026) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.1 1.15) (end -0.975 1.15) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.8) (end 0 0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -0.6 -0.8) (end -0.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.8) (end 0.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start 0.6 -0.8) (end 0.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 -0.8) (end 0.6 -0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 -0.2) (end 0.4 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 -0.1) (end 0.3 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0) (end 0.2 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.1) (end 0.1 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.2) (end 0 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.3) (end -0.1 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.4) (end -0.2 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.5) (end -0.3 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.6) (end -0.4 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.7) (end -0.5 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.25 -1) (end -1.25 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.25 1) (end 1.25 1) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.25 -1) (end 1.25 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.25 -1) (end 1.25 -1) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.79 0.5 180) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at -0.79 0 180) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 675 "Net-(Q26-Pad2)") (solder_mask_margin 0.102)) (pad 3 smd rect (at -0.79 -0.5 180) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 477 "Net-(LD7-Pad1)") (solder_mask_margin 0.102)) (pad 4 smd rect (at 0.79 -0.5 180) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 5 smd rect (at 0.79 0 180) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 676 "Net-(Q26-Pad5)") (solder_mask_margin 0.102)) (pad 6 smd rect (at 0.79 0.5 180) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 474 "Net-(LD5-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/SOTFL50P160X60-6N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SOTFL50P160X60-6N (layer B.Cu) (tedit 5CACA5F9) (tstamp 5C6B008C) (at 239.722288 202.663817) (descr "SOTFL (SOT666), 0.50mm, Pitch; 6 Pin, 1.20mm W X 1.60mm L X 0.60mm H Body, IPC Medium Density") (path /5C16BF8E/5D642279) (attr smd) (fp_text reference Q22 (at -0.200288 -4.137417) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BC857BV (at 0 -2.026) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.1 1.15) (end -0.975 1.15) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.8) (end 0 0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -0.6 -0.8) (end -0.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.8) (end 0.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start 0.6 -0.8) (end 0.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 -0.8) (end 0.6 -0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 -0.2) (end 0.4 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 -0.1) (end 0.3 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0) (end 0.2 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.1) (end 0.1 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.2) (end 0 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.3) (end -0.1 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.4) (end -0.2 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.5) (end -0.3 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.6) (end -0.4 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.7) (end -0.5 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.25 -1) (end -1.25 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.25 1) (end 1.25 1) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.25 -1) (end 1.25 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.25 -1) (end 1.25 -1) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.79 0.5) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 101 "Net-(C350-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -0.79 0) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 249 "Net-(Q22-Pad2)") (solder_mask_margin 0.102)) (pad 3 smd rect (at -0.79 -0.5) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 229 "Net-(Q22-Pad3)") (solder_mask_margin 0.102)) (pad 4 smd rect (at 0.79 -0.5) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 5 smd rect (at 0.79 0) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 250 "Net-(Q22-Pad5)") (solder_mask_margin 0.102)) (pad 6 smd rect (at 0.79 0.5) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 249 "Net-(Q22-Pad2)") (solder_mask_margin 0.102)) (model ${CERN}/SOTFL50P160X60-6N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SOTFL50P160X60-6N (layer B.Cu) (tedit 5CACA5F9) (tstamp 5C6AFFAF) (at 161.29 202.3618 270) (descr "SOTFL (SOT666), 0.50mm, Pitch; 6 Pin, 1.20mm W X 1.60mm L X 0.60mm H Body, IPC Medium Density") (path /5C16BF8E/5D6CD6D5) (attr smd) (fp_text reference Q15 (at -0.200288 -4.137417 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BC857BV (at 0 -2.026 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.1 1.15) (end -0.975 1.15) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.8) (end 0 0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -0.6 -0.8) (end -0.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.8) (end 0.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start 0.6 -0.8) (end 0.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 -0.8) (end 0.6 -0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 -0.2) (end 0.4 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 -0.1) (end 0.3 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0) (end 0.2 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.1) (end 0.1 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.2) (end 0 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.3) (end -0.1 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.4) (end -0.2 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.5) (end -0.3 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.6) (end -0.4 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.7) (end -0.5 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.25 -1) (end -1.25 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.25 1) (end 1.25 1) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.25 -1) (end 1.25 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.25 -1) (end 1.25 -1) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.79 0.5 270) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 33 "Net-(C132-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -0.79 0 270) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 244 "Net-(Q15-Pad2)") (solder_mask_margin 0.102)) (pad 3 smd rect (at -0.79 -0.5 270) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 245 "Net-(Q15-Pad3)") (solder_mask_margin 0.102)) (pad 4 smd rect (at 0.79 -0.5 270) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 5 smd rect (at 0.79 0 270) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 244 "Net-(Q15-Pad2)") (solder_mask_margin 0.102)) (pad 6 smd rect (at 0.79 0.5 270) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 244 "Net-(Q15-Pad2)") (solder_mask_margin 0.102)) (model ${CERN}/SOTFL50P160X60-6N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:FAIRCHILD_MLP08P (layer B.Cu) (tedit 5CA4B8FC) (tstamp 5C6AFF6E) (at 261.5946 173.482) (descr "SON, 1.27mm Pitch; 8 Pin, 6.00mm W X 5.00mm L X 0.8mm H body, 2x Thermal Pad, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5CFBE065) (attr smd) (fp_text reference Q13 (at -0.254 -3.7084) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value FDMS7608S (at 0 -4.026) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -3.175 3.048) (end -3.05 3.048) (layer B.SilkS) (width 0.25)) (fp_line (start -1.66 -0.5) (end -1.66 0) (layer Cmts.User) (width 0.05)) (fp_line (start -1.66 0) (end -1.66 0.5) (layer Cmts.User) (width 0.05)) (fp_line (start -2.16 0) (end -1.66 0) (layer Cmts.User) (width 0.05)) (fp_line (start -1.66 0) (end -1.16 0) (layer Cmts.User) (width 0.05)) (fp_line (start -1.2 -2) (end -1.2 2) (layer Cmts.User) (width 0.05)) (fp_line (start -2.12 2) (end -1.2 2) (layer Cmts.User) (width 0.05)) (fp_line (start -2.12 -2) (end -2.12 2) (layer Cmts.User) (width 0.05)) (fp_line (start -2.12 -2) (end -1.2 -2) (layer Cmts.User) (width 0.05)) (fp_line (start 0.795 -0.5) (end 0.795 0) (layer Cmts.User) (width 0.05)) (fp_line (start 0.795 0) (end 0.795 0.5) (layer Cmts.User) (width 0.05)) (fp_line (start 0.295 0) (end 0.795 0) (layer Cmts.User) (width 0.05)) (fp_line (start 0.795 0) (end 1.295 0) (layer Cmts.User) (width 0.05)) (fp_line (start -0.54 -2) (end 2.13 -2) (layer Cmts.User) (width 0.05)) (fp_line (start 2.13 -2) (end 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(xyz 1 1 1)) (rotate (xyz 0 0 90)) ) ) (module Marble:FAIRCHILD_MLP08P (layer B.Cu) (tedit 5CA4B8FC) (tstamp 5C6AFE2A) (at 232.2322 180.594 270) (descr "SON, 1.27mm Pitch; 8 Pin, 6.00mm W X 5.00mm L X 0.8mm H body, 2x Thermal Pad, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5CF69C4D) (attr smd) (fp_text reference Q10 (at 1.906 -3.7678 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value FDMS7608S (at 0 -4.026 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -3.175 3.048) (end -3.05 3.048) (layer B.SilkS) (width 0.25)) (fp_line (start -1.66 -0.5) (end -1.66 0) (layer Cmts.User) (width 0.05)) (fp_line (start -1.66 0) (end -1.66 0.5) (layer Cmts.User) (width 0.05)) (fp_line (start -2.16 0) (end -1.66 0) (layer Cmts.User) (width 0.05)) (fp_line (start -1.66 0) (end -1.16 0) (layer Cmts.User) (width 0.05)) (fp_line (start -1.2 -2) (end -1.2 2) (layer Cmts.User) (width 0.05)) (fp_line (start -2.12 2) (end -1.2 2) (layer Cmts.User) (width 0.05)) (fp_line (start -2.12 -2) (end -2.12 2) (layer Cmts.User) (width 0.05)) (fp_line (start -2.12 -2) (end -1.2 -2) (layer Cmts.User) (width 0.05)) (fp_line (start 0.795 -0.5) (end 0.795 0) (layer Cmts.User) (width 0.05)) (fp_line (start 0.795 0) (end 0.795 0.5) (layer Cmts.User) (width 0.05)) (fp_line (start 0.295 0) (end 0.795 0) (layer Cmts.User) (width 0.05)) (fp_line (start 0.795 0) (end 1.295 0) (layer Cmts.User) (width 0.05)) (fp_line (start -0.54 -2) (end 2.13 -2) (layer Cmts.User) (width 0.05)) (fp_line (start 2.13 -2) (end 2.13 2) (layer Cmts.User) (width 0.05)) (fp_line (start -0.54 2) (end 2.13 2) (layer Cmts.User) (width 0.05)) (fp_line (start -0.54 -2) (end -0.54 2) (layer Cmts.User) (width 0.05)) (fp_line (start 2.9 0.31) (end 3.15 0.31) (layer Cmts.User) (width 0.05)) (fp_line (start 2.845 1.905) (end 2.845 1.405) (layer Cmts.User) (width 0.05)) (fp_line (start 2.845 1.905) (end 2.845 2.405) (layer Cmts.User) (width 0.05)) (fp_line (start 2.845 1.905) (end 3.345 1.905) (layer Cmts.User) (width 0.05)) (fp_line (start 2.345 1.905) (end 2.845 1.905) (layer Cmts.User) (width 0.05)) (fp_line (start 3.15 1.58) (end 3.15 2.23) (layer Cmts.User) (width 0.05)) (fp_line (start 2.52 2.23) (end 3.15 2.23) (layer Cmts.User) (width 0.05)) (fp_line (start 2.52 1.58) (end 2.52 2.23) (layer Cmts.User) (width 0.05)) (fp_line (start 2.52 1.58) (end 3.15 1.58) (layer Cmts.User) (width 0.05)) (fp_line (start 2.845 0.135) (end 2.845 0.635) (layer Cmts.User) (width 0.05)) (fp_line (start 2.845 0.635) (end 2.845 1.135) (layer Cmts.User) (width 0.05)) (fp_line (start 2.845 0.635) (end 3.345 0.635) (layer Cmts.User) (width 0.05)) (fp_line (start 2.345 0.635) (end 2.845 0.635) (layer Cmts.User) (width 0.05)) (fp_line (start 3.15 0.31) (end 3.15 0.96) (layer Cmts.User) (width 0.05)) (fp_line (start 2.52 0.96) (end 3.15 0.96) (layer Cmts.User) (width 0.05)) (fp_line (start 2.52 0.31) (end 3.15 0.31) (layer Cmts.User) (width 0.05)) (fp_line (start 2.845 -1.135) (end 2.845 -0.635) (layer Cmts.User) (width 0.05)) (fp_line (start 2.845 -0.635) (end 2.845 -0.135) (layer Cmts.User) (width 0.05)) (fp_line (start 2.845 -0.635) (end 3.345 -0.635) (layer Cmts.User) (width 0.05)) (fp_line (start 2.345 -0.635) (end 2.845 -0.635) (layer Cmts.User) (width 0.05)) (fp_line (start 3.15 -0.96) (end 3.15 -0.31) (layer Cmts.User) (width 0.05)) (fp_line (start 2.52 -0.31) (end 3.15 -0.31) (layer Cmts.User) (width 0.05)) (fp_line (start 2.52 -0.96) (end 3.15 -0.96) (layer Cmts.User) (width 0.05)) (fp_line (start 2.845 -2.405) (end 2.845 -1.905) (layer Cmts.User) (width 0.05)) (fp_line (start 2.845 -1.905) (end 2.845 -1.405) (layer Cmts.User) (width 0.05)) (fp_line (start 2.845 -1.905) (end 3.345 -1.905) (layer Cmts.User) (width 0.05)) (fp_line (start 2.345 -1.905) (end 2.845 -1.905) (layer Cmts.User) (width 0.05)) (fp_line (start 3.15 -2.23) (end 3.15 -1.58) (layer Cmts.User) (width 0.05)) (fp_line (start 2.52 -1.58) (end 3.15 -1.58) (layer Cmts.User) (width 0.05)) (fp_line (start 2.52 -2.23) (end 3.15 -2.23) (layer Cmts.User) (width 0.05)) (fp_line (start -2.845 1.405) (end -2.845 1.905) (layer Cmts.User) (width 0.05)) (fp_line (start -2.845 1.905) (end -2.845 2.405) (layer Cmts.User) (width 0.05)) (fp_line (start -3.345 1.905) (end -2.845 1.905) (layer Cmts.User) (width 0.05)) (fp_line (start -2.845 1.905) (end -2.345 1.905) (layer Cmts.User) (width 0.05)) (fp_line (start -3.15 1.58) (end -3.15 2.23) (layer Cmts.User) (width 0.05)) (fp_line (start -3.15 2.23) (end -2.52 2.23) (layer Cmts.User) (width 0.05)) (fp_line (start -2.52 2.23) (end -2.52 1.58) (layer Cmts.User) (width 0.05)) (fp_line (start -3.15 1.58) (end -2.52 1.58) (layer Cmts.User) (width 0.05)) (fp_line (start -2.845 0.135) (end -2.845 0.635) (layer Cmts.User) (width 0.05)) (fp_line (start -2.845 0.635) (end -2.845 1.135) (layer Cmts.User) (width 0.05)) (fp_line (start -3.345 0.635) (end -2.845 0.635) (layer Cmts.User) (width 0.05)) (fp_line (start -2.845 0.635) (end -2.345 0.635) (layer Cmts.User) (width 0.05)) (fp_line (start -3.15 0.31) (end -3.15 0.96) (layer Cmts.User) (width 0.05)) (fp_line (start -3.15 0.96) (end -2.52 0.96) (layer Cmts.User) (width 0.05)) (fp_line (start -2.52 0.31) (end -2.52 0.96) (layer Cmts.User) (width 0.05)) (fp_line (start -3.15 0.31) (end -2.52 0.31) (layer Cmts.User) (width 0.05)) (fp_line (start -2.845 -1.135) (end -2.845 -0.635) (layer Cmts.User) (width 0.05)) (fp_line (start -2.845 -0.635) (end -2.845 -0.135) (layer Cmts.User) (width 0.05)) (fp_line (start -3.345 -0.635) (end -2.845 -0.635) (layer Cmts.User) (width 0.05)) (fp_line (start -2.845 -0.635) (end -2.345 -0.635) (layer Cmts.User) (width 0.05)) (fp_line (start -3.15 -0.96) (end -3.15 -0.31) (layer Cmts.User) (width 0.05)) (fp_line (start -3.15 -0.31) (end -2.52 -0.31) (layer Cmts.User) (width 0.05)) (fp_line (start -2.52 -0.96) (end -2.52 -0.31) (layer Cmts.User) (width 0.05)) (fp_line (start -3.15 -0.96) (end -2.52 -0.96) (layer Cmts.User) (width 0.05)) (fp_line (start -2.845 -2.405) (end -2.845 -1.905) (layer Cmts.User) (width 0.05)) (fp_line (start -2.845 -1.405) (end -2.845 -1.905) (layer Cmts.User) (width 0.05)) (fp_line (start -3.345 -1.905) (end -2.845 -1.905) (layer Cmts.User) (width 0.05)) (fp_line (start -2.845 -1.905) (end -2.345 -1.905) (layer Cmts.User) (width 0.05)) (fp_line (start -3.15 -2.23) (end -3.15 -1.58) (layer Cmts.User) (width 0.05)) (fp_line (start -3.15 -1.58) (end -2.52 -1.58) (layer Cmts.User) (width 0.05)) (fp_line (start -2.52 -2.23) (end -2.52 -1.58) (layer Cmts.User) (width 0.05)) (fp_line (start -3.15 -2.23) (end -2.52 -2.23) (layer Cmts.User) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0) (layer Cmts.User) (width 0.05)) (fp_line (start 0 0) (end 0 0.5) (layer Cmts.User) (width 0.05)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.05)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.05)) (fp_line (start 2.52 0.96) (end 2.52 -2.23) (layer Cmts.User) (width 0.05)) (fp_line (start -2.17 -2.525) (end 2.17 -2.525) (layer B.SilkS) (width 0.2)) (fp_line (start -2.17 2.525) (end 2.17 2.525) (layer B.SilkS) (width 0.2)) (fp_line (start -3.025 2.525) (end 3.025 2.525) (layer B.Fab) (width 0.1)) (fp_line (start -3.025 -2.525) (end -3.025 2.525) (layer B.Fab) (width 0.1)) (fp_line (start -3.025 -2.525) (end 3.025 -2.525) (layer B.Fab) (width 0.1)) (fp_line (start 3.025 -2.525) (end 3.025 2.525) (layer B.Fab) (width 0.1)) (fp_line (start -3.4 -2.775) (end 3.4 -2.775) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.4 -2.775) (end 3.4 2.775) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.4 2.775) (end 3.4 2.775) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.4 -2.775) (end -3.4 2.775) (layer B.CrtYd) (width 0.05)) (pad 10 smd rect (at -1.66 0 270) (size 0.92 4) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102) (solder_paste_margin -0.35)) (pad 1 smd rect (at -2.845 1.905 270) (size 0.63 0.65) (layers B.Cu B.Paste B.Mask) (net 236 /Power/Power_SW/PSS_XRP_GH1) (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.845 0.635 90) (size 0.63 0.65) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.845 -0.635 270) (size 0.63 0.65) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.845 -1.905 270) (size 0.63 0.65) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.845 -1.905 270) (size 0.63 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.845 -0.635 270) (size 0.63 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.845 0.635 270) (size 0.63 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 8 smd rect (at 2.845 1.905 270) (size 0.63 0.65) (layers B.Cu B.Paste B.Mask) (net 237 /Power/Power_SW/PSS_XRP_GL1) (solder_mask_margin 0.102)) (pad 9 smd rect (at 0.795 0 270) (size 2.67 4) (layers B.Cu B.Paste B.Mask) (net 37 /Power/Power_SW/PSS_XRP_LX1) (solder_mask_margin 0.102) (solder_paste_margin -0.35)) (model ${CERN}/FAIRCHILD_MLP08P.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 90)) ) ) (module Marble:SOTFL50P160X60-6N (layer B.Cu) (tedit 5CACA5F9) (tstamp 5C6C1A28) (at 271.526 200.66) (descr "SOTFL (SOT666), 0.50mm, Pitch; 6 Pin, 1.20mm W X 1.60mm L X 0.60mm H Body, IPC Medium Density") (path /5C16BF8E/5D6FC4F0) (attr smd) (fp_text reference Q1 (at -0.026 2.09) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BC857BV (at 0 -2.026) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.1 1.15) (end -0.975 1.15) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.8) (end 0 0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -0.6 -0.8) (end -0.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.8) (end 0.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start 0.6 -0.8) (end 0.6 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 -0.8) (end 0.6 -0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 -0.2) (end 0.4 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 -0.1) (end 0.3 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0) (end 0.2 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.1) (end 0.1 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.2) (end 0 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.3) (end -0.1 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.4) (end -0.2 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.5) (end -0.3 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.6) (end -0.4 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.6 0.7) (end -0.5 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.25 -1) (end -1.25 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.25 1) (end 1.25 1) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.25 -1) (end 1.25 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.25 -1) (end 1.25 -1) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.79 0.5) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 31 "Net-(C128-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -0.79 0) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 226 "Net-(Q1-Pad2)") (solder_mask_margin 0.102)) (pad 3 smd rect (at -0.79 -0.5) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 227 "Net-(Q1-Pad3)") (solder_mask_margin 0.102)) (pad 4 smd rect (at 0.79 -0.5) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 5 smd rect (at 0.79 0) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 228 "Net-(Q1-Pad5)") (solder_mask_margin 0.102)) (pad 6 smd rect (at 0.79 0.5) (size 0.57 0.3) (layers B.Cu B.Paste B.Mask) (net 226 "Net-(Q1-Pad2)") (solder_mask_margin 0.102)) (model ${CERN}/SOTFL50P160X60-6N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:PB_TYCO_FSM2JSMA (layer F.Cu) (tedit 5C61837A) (tstamp 5C6AFCAD) (at 221.361 110.617) (descr "Body 6mm x 6mm, Surface Mount Tactile Switches, TYCO FSMJSMA Series") (path /5C907554/5C417BCB/5C6A56F0) (attr smd) (fp_text reference PB1 (at -4.445 0.127 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value PB_TYCO_FSM2JSMA (at 0 6.876) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 1.753 0) (layer F.SilkS) (width 0.2)) (fp_circle (center 2.248 -2.248) (end 2.629 -2.248) (layer F.SilkS) (width 0.2)) (fp_circle (center 2.248 2.248) (end 2.629 2.248) (layer F.SilkS) (width 0.2)) (fp_circle (center -2.248 -2.248) (end -1.867 -2.248) (layer F.SilkS) (width 0.2)) (fp_circle (center -2.248 2.248) (end -1.867 2.248) (layer F.SilkS) (width 0.2)) (fp_circle (center 0 0) (end 1.753 0) (layer F.Fab) (width 0.1)) (fp_circle (center 2.248 -2.248) (end 2.629 -2.248) (layer F.Fab) (width 0.1)) (fp_circle (center 2.248 2.248) (end 2.629 2.248) (layer F.Fab) (width 0.1)) (fp_circle (center -2.248 -2.248) (end -1.867 -2.248) (layer F.Fab) (width 0.1)) (fp_circle (center -2.248 2.248) (end -1.867 2.248) (layer F.Fab) (width 0.1)) (fp_line (start -3 3) (end -3 -3) (layer F.SilkS) (width 0.2)) (fp_line (start 3 3) (end 3 -3) (layer F.SilkS) (width 0.2)) (fp_line (start -3 -3) (end 3 -3) (layer F.SilkS) (width 0.2)) (fp_line (start -3 3) (end 3 3) (layer F.SilkS) (width 0.2)) (fp_line (start -3 3) (end -3 -3) (layer F.Fab) (width 0.1)) (fp_line (start 3 3) (end 3 -3) (layer F.Fab) (width 0.1)) (fp_line (start -3 -3) (end 3 -3) (layer F.Fab) (width 0.1)) (fp_line (start -3 3) (end 3 3) (layer F.Fab) (width 0.1)) (fp_line (start 3.25 5.85) (end 3.25 -5.85) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.25 5.85) (end -3.25 -5.85) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.25 -5.85) (end 3.25 -5.85) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.25 5.85) (end 3.25 5.85) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -2.25 -4.55 90) (size 2.1 1.4) (layers F.Cu F.Paste F.Mask) (net 225 /FPGA/PROG_B) (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.25 4.55 90) (size 2.1 1.4) (layers F.Cu F.Paste F.Mask) (net 225 /FPGA/PROG_B) (solder_mask_margin 0.102)) (pad 3 smd rect (at 2.25 -4.55 90) (size 2.1 1.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 4 smd rect (at 2.25 4.55 90) (size 2.1 1.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/PB_TYCO_FSM2JSMA.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:AMC-GF-2D-750-O274 (layer B.Cu) (tedit 5CB83EF5) (tstamp 5CF6DD41) (at 299.73664 104.69876) (path /5BD320D5/5BD3210B) (attr virtual) (fp_text reference P3 (at 0 0) (layer B.SilkS) hide (effects (font (size 1.524 1.524) (thickness 0.05)) (justify mirror)) ) (fp_text value CMP-0001-00058-2 (at 0 0) (layer B.SilkS) hide (effects (font (size 1.524 1.524) (thickness 0.05)) (justify mirror)) ) (pad 230 smd rect (at 0.7 -21 90) (size 0.48 1.7) (layers B.Cu B.Mask) (net 752 "Net-(P3-Pad230)")) (pad 118 smd rect (at -0.95 7.5 90) (size 0.48 1.2) (layers B.Cu B.Mask) (net 753 /AMC_connector/Rx13_P)) (pad 231 smd rect (at 0.7 -21.75 90) (size 0.48 1.7) (layers B.Cu B.Mask) (net 754 "Net-(P3-Pad231)")) (pad 163 smd rect (at -0.95 -26.25 90) (size 0.48 1.2) (layers B.Cu B.Mask) (net 755 /AMC_connector/Tx20_P)) (pad 156 smd rect (at -0.95 -21 90) (size 0.48 1.2) (layers B.Cu B.Mask) (net 756 /AMC_connector/Tx19_N)) (pad 162 smd rect (at -0.95 -25.5 90) (size 0.48 1.2) (layers B.Cu B.Mask) (net 757 /AMC_connector/Tx20_N)) (pad 220 smd rect (at 0.7 -1.5 90) (size 0.48 1.7) (layers B.Cu B.Mask) (net 758 "Net-(P3-Pad220)")) (pad 117 smd rect (at -0.95 8.25 90) (size 0.48 1.2) (layers B.Cu B.Mask) (net 759 /AMC_connector/Rx13_N)) (pad 132 smd rect (at -0.95 -3 90) (size 0.48 1.2) (layers B.Cu B.Mask) (net 760 /AMC_connector/Tx15_N)) (pad 169 smd rect (at -0.7625 -30.75 90) (size 0.48 1.575) (layers B.Cu B.Mask) (net 761 /AMC_connector/AMC_TDI)) (pad 126 smd rect (at -0.95 1.5 90) (size 0.48 1.2) (layers B.Cu B.Mask) (net 762 /AMC_connector/Tx14_N)) (pad 120 smd rect (at -0.95 6 90) (size 0.48 1.2) (layers B.Cu B.Mask) (net 763 /AMC_connector/Tx13_N)) (pad 113 smd rect (at 0 11.25 90) (size 0.48 3.1) (layers B.Cu B.Mask) (net 1 GND)) (pad 108 smd rect (at -0.95 15 90) (size 0.48 1.2) (layers B.Cu B.Mask) (net 764 /AMC_connector/Tx11_N)) (pad 223 smd rect (at 0.7 -12.75 90) (size 0.48 1.7) (layers B.Cu B.Mask) (net 765 "Net-(P3-Pad223)")) (pad 165 smd rect (at -0.7625 -27.75 90) (size 0.48 1.575) (layers B.Cu B.Mask) (net 766 /AMC_connector/AMC_TCK)) (pad 91 smd rect (at -0.95 27.75 90) (size 0.48 1.2) (layers B.Cu B.Mask) (net 767 /AMC_connector/Tx8_P)) (pad 161 smd rect (at 0 -24.75 90) (size 0.48 3.1) (layers 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270) (size 0.48 1.325) (layers F.Cu F.Mask) (net 867 "Net-(P3-Pad218)")) (pad 208 smd rect (at 0.7 26.25 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 868 "Net-(P3-Pad208)")) (pad 70 smd rect (at 0 20.25 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 79 smd rect (at 0 27 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 85 smd rect (at 0 31.5 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 197 smd rect (at 0.7 12.75 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 869 "Net-(P3-Pad197)")) (pad 202 smd rect (at 0.7 18.75 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 870 "Net-(P3-Pad202)")) (pad 72 smd rect (at 0 21.75 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 464 +12V_AMC)) (pad 217 smd rect (at 0.7 8.25 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 871 "Net-(P3-Pad217)")) (pad 207 smd rect (at 0.7 25.5 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 872 "Net-(P3-Pad207)")) (pad 209 smd rect (at 0.7 27.75 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 873 "Net-(P3-Pad209)")) (pad 213 smd rect (at 0.55 30 270) (size 0.48 2) (layers F.Cu F.Mask) (net 874 "Net-(P3-Pad213)")) (pad 64 smd rect (at 0 15.75 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 203 smd rect (at 0.7 19.5 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 875 "Net-(P3-Pad203)")) (pad 76 smd rect (at 0 24.75 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 201 smd rect (at 0.7 17.25 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 876 "Net-(P3-Pad201)")) (pad 196 smd rect (at 0.7 12 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 877 "Net-(P3-Pad196)")) (pad 67 smd rect (at 0 18 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 61 smd rect (at 0 13.5 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 200 smd rect (at 0.7 16.5 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 878 "Net-(P3-Pad200)")) (pad 204 smd rect (at 0.8875 21 270) (size 0.48 1.325) (layers F.Cu F.Mask) (net 879 "Net-(P3-Pad204)")) (pad 198 smd rect (at 0.7 14.25 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 880 "Net-(P3-Pad198)")) (pad 205 smd rect (at 0.7 23.25 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 881 "Net-(P3-Pad205)")) (pad 84 smd rect (at 0 30.75 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 464 +12V_AMC)) (pad 73 smd rect (at 0 22.5 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 57 smd rect (at 0 10.5 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 464 +12V_AMC)) (pad 65 smd rect (at -0.95 16.5 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 633 Tx_7_P)) (pad 68 smd rect (at -0.95 18.75 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 641 Rx_7_P)) (pad 56 smd rect (at -0.7625 9.75 270) (size 0.48 1.575) (layers F.Cu F.Mask) (net 224 /AMC_connector/I2C_IPMB_SCL)) (pad 37 smd rect (at 0 -4.5 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 49 smd rect (at 0 4.5 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 172 smd rect (at 0.7 -10.5 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 882 "Net-(P3-Pad172)")) (pad 45 smd rect (at -0.95 1.5 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 628 Tx_4_N)) (pad 17 smd rect (at -0.7625 -19.5 270) (size 0.48 1.575) (layers F.Cu F.Mask) (net 223 /AMC_connector/AMC_GA1)) (pad 7 smd rect (at 0 -27 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 194 smd rect (at 0.7 0.75 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 883 "Net-(P3-Pad194)")) (pad 54 smd rect (at -0.95 8.25 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 638 Rx_5_N)) (pad 182 smd rect (at 0.7 -24 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 884 "Net-(P3-Pad182)")) (pad 60 smd rect (at -0.95 12.75 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 632 Tx_6_N)) (pad 83 smd rect (at -1.1 30 270) (size 0.48 0.9) (layers F.Cu F.Mask) (net 105 /AMC_connector/PS0#)) (pad 5 smd rect (at -0.7625 -28.5 270) (size 0.48 1.575) (layers F.Cu F.Mask) (net 222 /AMC_connector/AMC_GA0)) (pad 74 smd rect (at -0.95 23.25 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 701 /AMC_connector/TCLKA_P)) (pad 1 smd rect (at 0 -31.5 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 29 smd rect (at -0.95 -10.5 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 885 /AMC_connector/Tx2_P)) (pad 52 smd rect (at 0 6.75 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 31 smd rect (at 0 -9 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 212 smd rect (at 0.7 3.75 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 886 "Net-(P3-Pad212)")) (pad 42 smd rect (at 0 -0.75 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 464 +12V_AMC)) (pad 191 smd rect (at 0.7 -7.5 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 887 "Net-(P3-Pad191)")) (pad 22 smd rect (at 0 -15.75 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 63 smd rect (at -0.95 15 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 640 Rx_6_N)) (pad 215 smd rect (at 0.7 6 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 888 "Net-(P3-Pad215)")) (pad 48 smd rect (at -0.95 3.75 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 636 Rx_4_N)) (pad 187 smd rect (at 0.7 -3.75 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 889 "Net-(P3-Pad187)")) (pad 2 smd rect (at 0 -30.75 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 464 +12V_AMC)) (pad 51 smd rect (at -0.95 6 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 630 Tx_5_N)) (pad 8 smd rect (at -0.7625 -26.25 270) (size 0.48 1.575) (layers F.Cu F.Mask) (net 890 "Net-(P3-Pad8)")) (pad 39 smd rect (at -0.95 -3 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 891 /AMC_connector/Rx3_N)) (pad 36 smd rect (at -0.95 -5.25 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 892 /AMC_connector/Tx3_N)) (pad 81 smd rect (at -0.95 28.5 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 70 /AMC_connector/FCLKA_N)) (pad 12 smd rect (at -0.95 -23.25 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 221 /ETH_PHY/SD_OUT_N)) (pad 62 smd rect (at -0.95 14.25 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 639 Rx_6_P)) (pad 13 smd rect (at 0 -22.5 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 80 smd rect (at -0.95 27.75 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 68 /AMC_connector/FCLKA_P)) (pad 192 smd rect (at 0.7 -8.25 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 893 "Net-(P3-Pad192)")) (pad 35 smd rect (at -0.95 -6 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 894 /AMC_connector/Tx3_P)) (pad 47 smd rect (at -0.95 3 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 635 Rx_4_P)) (pad 46 smd rect (at 0 2.25 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 23 smd rect (at -0.95 -15 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 895 /AMC_connector/Rx1_P)) (pad 180 smd rect (at 0.7 -21.75 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 896 "Net-(P3-Pad180)")) (pad 178 smd rect (at 0.8875 -19.5 270) (size 0.48 1.325) (layers F.Cu F.Mask) (net 897 "Net-(P3-Pad178)")) (pad 214 smd rect (at 0.7 5.25 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 898 "Net-(P3-Pad214)")) (pad 71 smd rect (at -0.7625 21 270) (size 0.48 1.575) (layers F.Cu F.Mask) (net 220 /AMC_connector/I2C_IPMB_SDA)) (pad 21 smd rect (at -0.95 -16.5 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 899 /AMC_connector/Tx1_N)) (pad 9 smd rect (at 0 -25.5 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 464 +12V_AMC)) (pad 189 smd rect (at 0.7 -5.25 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 900 "Net-(P3-Pad189)")) (pad 41 smd rect (at -0.7625 -1.5 270) (size 0.48 1.575) (layers F.Cu F.Mask) (net 219 /AMC_connector/AMC_En)) (pad 26 smd rect (at -0.7625 -12.75 270) (size 0.48 1.575) (layers F.Cu F.Mask) (net 218 /AMC_connector/AMC_GA2)) (pad 211 smd rect (at 0.7 3 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 901 "Net-(P3-Pad211)")) (pad 25 smd rect (at 0 -13.5 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 3 smd rect (at -1.1 -30 270) (size 0.48 0.9) (layers F.Cu F.Mask) (net 106 /AMC_connector/PS1#)) (pad 190 smd rect (at 0.7 -6 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 902 "Net-(P3-Pad190)")) (pad 40 smd rect (at 0 -2.25 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 44 smd rect (at -0.95 0.75 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 627 Tx_4_P)) (pad 6 smd rect (at -0.7625 -27.75 270) (size 0.48 1.575) (layers F.Cu F.Mask) (net 903 "Net-(P3-Pad6)")) (pad 183 smd rect (at 0.8875 -26.25 270) (size 0.48 1.325) (layers F.Cu F.Mask) (net 904 "Net-(P3-Pad183)")) (pad 195 smd rect (at 0.7 1.5 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 905 "Net-(P3-Pad195)")) (pad 175 smd rect (at 0.7 -15 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 906 "Net-(P3-Pad175)")) (pad 177 smd rect (at 0.7 -17.25 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 907 "Net-(P3-Pad177)")) (pad 27 smd rect (at 0 -12 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 464 +12V_AMC)) (pad 171 smd rect (at 0.8875 -1.5 270) (size 0.48 1.325) (layers F.Cu F.Mask) (net 908 "Net-(P3-Pad171)")) (pad 32 smd rect (at -0.95 -8.25 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 909 /AMC_connector/Rx2_P)) (pad 28 smd rect (at 0 -11.25 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 66 smd rect (at -0.95 17.25 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 634 Tx_7_N)) (pad 176 smd rect (at 0.7 -16.5 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 910 "Net-(P3-Pad176)")) (pad 184 smd rect (at 0.8875 -27.75 270) (size 0.48 1.325) (layers F.Cu F.Mask) (net 911 "Net-(P3-Pad184)")) (pad 78 smd rect (at -0.95 26.25 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 912 /AMC_connector/TCLKB_N)) (pad 20 smd rect (at -0.95 -17.25 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 913 /AMC_connector/Tx1_P)) (pad 34 smd rect (at 0 -6.75 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 174 smd rect (at 0.7 -14.25 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 914 "Net-(P3-Pad174)")) (pad 24 smd rect (at -0.95 -14.25 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 915 /AMC_connector/Rx1_N)) (pad 181 smd rect (at 0.7 -23.25 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 916 "Net-(P3-Pad181)")) (pad 14 smd rect (at -0.95 -21.75 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 217 /AMC_connector/Rx0_P)) (pad 10 smd rect (at 0 -24.75 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 59 smd rect (at -0.95 12 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 631 Tx_6_P)) (pad 15 smd rect (at -0.95 -21 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 216 /AMC_connector/Rx0_N)) (pad 75 smd rect (at -0.95 24 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 702 /AMC_connector/TCLKA_N)) (pad 19 smd rect (at 0 -18 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 4 smd rect (at 0 -29.25 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 655 +3V3P)) (pad 53 smd rect (at -0.95 7.5 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 637 Rx_5_P)) (pad 30 smd rect (at -0.95 -9.75 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 917 /AMC_connector/Tx2_N)) (pad 18 smd rect (at 0 -18.75 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 464 +12V_AMC)) (pad 43 smd rect (at 0 0 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 16 smd rect (at 0 -20.25 270) (size 0.48 3.1) (layers F.Cu F.Mask) (net 1 GND)) (pad 173 smd rect (at 0.8875 -12.75 270) (size 0.48 1.325) (layers F.Cu F.Mask) (net 918 "Net-(P3-Pad173)")) (pad 186 smd rect (at 0.7 -3 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 919 "Net-(P3-Pad186)")) (pad 50 smd rect (at -0.95 5.25 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 629 Tx_5_P)) (pad 185 smd rect (at 0.8875 -28.5 270) (size 0.48 1.325) (layers F.Cu F.Mask) (net 920 "Net-(P3-Pad185)")) (pad 33 smd rect (at -0.95 -7.5 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 921 /AMC_connector/Rx2_N)) (pad 69 smd rect (at -0.95 19.5 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 642 Rx_7_N)) (pad 188 smd rect (at 0.55 -30 270) (size 0.48 2) (layers F.Cu F.Mask) (net 922 "Net-(P3-Pad188)")) (pad 38 smd rect (at -0.95 -3.75 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 923 /AMC_connector/Rx3_P)) (pad 179 smd rect (at 0.7 -21 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 924 "Net-(P3-Pad179)")) (pad 11 smd rect (at -0.95 -24 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 215 /ETH_PHY/SD_OUT_P)) (pad 77 smd rect (at -0.95 25.5 270) (size 0.48 1.2) (layers F.Cu F.Mask) (net 925 /AMC_connector/TCLKB_P)) (pad 193 smd rect (at 0.7 -9.75 270) (size 0.48 1.7) (layers F.Cu F.Mask) (net 926 "Net-(P3-Pad193)")) ) (module Marble:SAMTEC_ASP-134603-01 locked (layer F.Cu) (tedit 5C6175A6) (tstamp 5EF3D568) (at 191.1477 107.1245 90) (descr "Connector VITA 57 (Low Pin Count version), 160 Female contacts in 4 row cdgh") (path /5BD31F9F/5CDF84F3) (attr smd) (fp_text reference P2 (at 1.9685 11.0363) (layer F.SilkS) (effects (font (size 2.5 2.5) (thickness 0.5))) ) (fp_text value SAMTEC_ASP-134603-01 (at 0 8.558 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 27.051 -5.855) (end 27.305 -6.109) (layer F.SilkS) (width 0.2)) (fp_line (start 25.2 -6.109) (end 27.305 -6.109) (layer F.SilkS) (width 0.2)) (fp_line (start -28.448 -6.236) (end -24.994 -6.236) (layer F.SilkS) (width 0.2)) (fp_line (start -28.448 -6.236) (end -28.067 -5.855) (layer F.SilkS) (width 0.2)) (fp_line (start -28.067 -5.855) (end -25.5 -5.855) (layer F.SilkS) (width 0.2)) (fp_line (start 27.051 -2.184) (end 27.051 -5.855) (layer F.SilkS) (width 0.2)) (fp_line (start 27.051 -2.184) (end 28.067 -2.184) (layer F.SilkS) (width 0.2)) (fp_line (start 28.067 1.959) (end 28.067 -2.184) (layer F.SilkS) (width 0.2)) (fp_line (start 27.051 5.855) (end 27.051 4.443) (layer F.SilkS) (width 0.2)) (fp_line (start 27.051 5.855) (end 27.305 6.109) (layer F.SilkS) (width 0.2)) (fp_line (start 27.305 6.109) (end 27.305 4.445) (layer F.SilkS) (width 0.2)) (fp_line (start 28.448 2.436) (end 28.448 -2.565) (layer F.SilkS) (width 0.2)) (fp_line (start 27.305 -2.565) (end 28.448 -2.565) (layer F.SilkS) (width 0.2)) (fp_line (start 27.305 -2.565) (end 27.305 -6.109) (layer F.SilkS) (width 0.2)) (fp_line (start 27.889 -2.845) (end 27.889 -6.617) (layer F.SilkS) (width 0.2)) (fp_line (start 27.889 -2.845) (end 28.727 -2.845) (layer F.SilkS) (width 0.2)) (fp_line (start 28.727 2.845) (end 28.727 -2.845) (layer F.SilkS) (width 0.2)) (fp_line (start 28.575 2.845) (end 28.727 2.845) (layer F.SilkS) (width 0.2)) (fp_line (start 27.889 6.617) (end 27.889 4.263) (layer F.SilkS) (width 0.2)) (fp_line (start -28.727 6.617) (end 27.889 6.617) (layer F.SilkS) (width 0.2)) (fp_line (start -28.727 6.617) (end -28.727 2.197) (layer F.SilkS) (width 0.2)) (fp_line (start -28.727 2.197) (end -27.889 2.197) (layer F.SilkS) (width 0.2)) (fp_line (start -27.889 2.197) (end -27.889 1.213) (layer F.SilkS) (width 0.2)) (fp_line (start -28.727 -2.197) (end -27.889 -2.197) (layer F.SilkS) (width 0.2)) (fp_line (start -28.727 -2.197) (end -28.727 -6.617) (layer F.SilkS) (width 0.2)) (fp_line (start -28.727 -6.617) (end 27.889 -6.617) (layer F.SilkS) (width 0.2)) (fp_line (start 25.2 6.109) (end 27.305 6.109) (layer F.SilkS) (width 0.2)) (fp_line (start -28.067 5.855) (end -25.5 5.855) 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F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad h11 smd circle (at 12.065 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 497 FMC2_LA_4_N) (solder_mask_margin 0.102)) (pad h10 smd circle (at 13.335 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 498 FMC2_LA_4_P) (solder_mask_margin 0.102)) (pad h9 smd circle (at 14.605 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad h8 smd circle (at 15.875 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 499 FMC2_LA_2_N) (solder_mask_margin 0.102)) (pad h7 smd circle (at 17.145 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 500 FMC2_LA_2_P) (solder_mask_margin 0.102)) (pad h6 smd circle (at 18.415 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad h5 smd circle (at 19.685 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 128 /FMC_2/FMC2_CLK0_M2C_N) (solder_mask_margin 0.102)) (pad h4 smd circle (at 20.955 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 129 /FMC_2/FMC2_CLK0_M2C_P) (solder_mask_margin 0.102)) (pad h3 smd circle (at 22.225 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad h2 smd circle (at 23.495 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 130 /FMC2_PRSNT_M2C_L) (solder_mask_margin 0.102)) (pad h1 smd circle (at 24.765 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 747 "Net-(P2-Padh1)") (solder_mask_margin 0.102)) (pad g40 smd circle (at -24.765 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g39 smd circle (at -23.495 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad g38 smd circle (at -22.225 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g37 smd circle (at -20.955 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 574 FMC2_LA_33_N) (solder_mask_margin 0.102)) (pad g36 smd circle (at -19.685 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 577 FMC2_LA_33_P) (solder_mask_margin 0.102)) (pad g35 smd circle (at -18.415 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g34 smd circle (at -17.145 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 578 FMC2_LA_31_N) (solder_mask_margin 0.102)) (pad g33 smd circle (at -15.875 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 579 FMC2_LA_31_P) (solder_mask_margin 0.102)) (pad g32 smd circle (at -14.605 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g31 smd circle (at -13.335 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 552 FMC2_LA_29_N) (solder_mask_margin 0.102)) (pad g30 smd circle (at -12.065 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 553 FMC2_LA_29_P) (solder_mask_margin 0.102)) (pad g29 smd circle (at -10.795 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g28 smd circle (at -9.525 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 533 FMC2_LA_25_N) (solder_mask_margin 0.102)) (pad g27 smd circle (at -8.255 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 534 FMC2_LA_25_P) (solder_mask_margin 0.102)) (pad g26 smd circle (at -6.985 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g25 smd circle (at -5.715 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 531 FMC2_LA_22_N) (solder_mask_margin 0.102)) (pad g24 smd circle (at -4.445 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 541 FMC2_LA_22_P) (solder_mask_margin 0.102)) (pad g23 smd circle (at -3.175 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g22 smd circle (at -1.905 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 529 FMC2_LA_20_N) (solder_mask_margin 0.102)) (pad g21 smd circle (at -0.635 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 530 FMC2_LA_20_P) (solder_mask_margin 0.102)) (pad g20 smd circle (at 0.635 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g19 smd circle (at 1.905 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 501 FMC2_LA_16_N) (solder_mask_margin 0.102)) (pad g18 smd circle (at 3.175 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 502 FMC2_LA_16_P) (solder_mask_margin 0.102)) (pad g17 smd circle (at 4.445 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g16 smd circle (at 5.715 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 503 FMC2_LA_12_N) (solder_mask_margin 0.102)) (pad g15 smd circle (at 6.985 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 504 FMC2_LA_12_P) (solder_mask_margin 0.102)) (pad g14 smd circle (at 8.255 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g13 smd circle (at 9.525 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 505 FMC2_LA_8_N) (solder_mask_margin 0.102)) (pad g12 smd circle (at 10.795 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 506 FMC2_LA_8_P) (solder_mask_margin 0.102)) (pad g11 smd circle (at 12.065 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g10 smd circle (at 13.335 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 507 FMC2_LA_3_N) (solder_mask_margin 0.102)) (pad g9 smd circle (at 14.605 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 508 FMC2_LA_3_P) (solder_mask_margin 0.102)) (pad g8 smd circle (at 15.875 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g7 smd circle (at 17.145 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 509 FMC2_LA_0_N) (solder_mask_margin 0.102)) (pad g6 smd circle (at 18.415 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 510 FMC2_LA_0_P) (solder_mask_margin 0.102)) (pad g5 smd circle (at 19.685 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g4 smd circle (at 20.955 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g3 smd circle (at 22.225 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 131 /FMC_2/FMC2_CLK1_M2C_N) (solder_mask_margin 0.102)) (pad g2 smd circle (at 23.495 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 132 /FMC_2/FMC2_CLK1_M2C_P) (solder_mask_margin 0.102)) (pad g1 smd circle (at 24.765 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d40 smd circle (at -24.765 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad d39 smd circle (at -23.495 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d38 smd circle (at -22.225 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad d37 smd circle (at -20.955 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d36 smd circle (at -19.685 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad d35 smd circle (at -18.415 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1103 "Net-(P2-Padd35)") (solder_mask_margin 0.102)) (pad d34 smd circle (at -17.145 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 685 /FMC2_TRST) (solder_mask_margin 0.102)) (pad d33 smd circle (at -15.875 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 133 /FMC2_TMS) (solder_mask_margin 0.102)) (pad d32 smd circle (at -14.605 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 4 /FMC_2/FMC2_3P3VAUX) (solder_mask_margin 0.102)) (pad d31 smd circle (at -13.335 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 134 /FMC2_TDO) (solder_mask_margin 0.102)) (pad d30 smd circle (at -12.065 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 135 /FMC2_TDI) (solder_mask_margin 0.102)) (pad d29 smd circle (at -10.795 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 136 /FMC2_TCK) (solder_mask_margin 0.102)) (pad d28 smd circle (at -9.525 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d27 smd circle (at -8.255 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 535 FMC2_LA_26_N) (solder_mask_margin 0.102)) (pad d26 smd circle (at -6.985 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 546 FMC2_LA_26_P) (solder_mask_margin 0.102)) (pad d25 smd circle (at -5.715 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d24 smd circle (at -4.445 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 542 FMC2_LA_23_N) (solder_mask_margin 0.102)) (pad d23 smd circle (at -3.175 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 551 FMC2_LA_23_P) (solder_mask_margin 0.102)) (pad d22 smd circle (at -1.905 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d21 smd circle (at -0.635 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 560 FMC2_LA_17_N) (solder_mask_margin 0.102)) (pad d20 smd circle (at 0.635 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 561 FMC2_LA_17_P) (solder_mask_margin 0.102)) (pad d19 smd circle (at 1.905 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d18 smd circle (at 3.175 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 511 FMC2_LA_13_N) (solder_mask_margin 0.102)) (pad d17 smd circle (at 4.445 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 512 FMC2_LA_13_P) (solder_mask_margin 0.102)) (pad d16 smd circle (at 5.715 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d15 smd circle (at 6.985 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 513 FMC2_LA_9_N) (solder_mask_margin 0.102)) (pad d14 smd circle (at 8.255 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 514 FMC2_LA_9_P) (solder_mask_margin 0.102)) (pad d13 smd circle (at 9.525 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d12 smd circle (at 10.795 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 515 FMC2_LA_5_N) (solder_mask_margin 0.102)) (pad d11 smd circle (at 12.065 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 516 FMC2_LA_5_P) (solder_mask_margin 0.102)) (pad d10 smd circle (at 13.335 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d9 smd circle (at 14.605 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 517 FMC2_LA_1_N) (solder_mask_margin 0.102)) (pad d8 smd circle (at 15.875 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 518 FMC2_LA_1_P) (solder_mask_margin 0.102)) (pad d7 smd circle (at 17.145 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d6 smd circle (at 18.415 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d5 smd circle (at 19.685 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 66 /FMC_2/FMC2_GBTCLK0_M2C_N) (solder_mask_margin 0.102)) (pad d4 smd circle (at 20.955 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 64 /FMC_2/FMC2_GBTCLK0_M2C_P) (solder_mask_margin 0.102)) (pad d3 smd circle (at 22.225 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d2 smd circle (at 23.495 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d1 smd circle (at 24.765 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 137 /FMC_2/FMC2_PG_C2M) (solder_mask_margin 0.102)) (pad c40 smd circle (at -24.765 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c39 smd circle (at -23.495 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad c38 smd circle (at -22.225 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c37 smd circle (at -20.955 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 460 +12V_FMC2) (solder_mask_margin 0.102)) (pad c36 smd circle (at -19.685 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c35 smd circle (at -18.415 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 460 +12V_FMC2) (solder_mask_margin 0.102)) (pad c34 smd circle (at -17.145 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1104 "Net-(P2-Padc34)") (solder_mask_margin 0.102)) (pad c33 smd circle (at -15.875 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c32 smd circle (at -14.605 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c31 smd circle (at -13.335 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 423 /FMC_2/I2C_FMC2_SDA) (solder_mask_margin 0.102)) (pad c30 smd circle (at -12.065 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 424 /FMC_2/I2C_FMC2_SCL) (solder_mask_margin 0.102)) (pad c29 smd circle (at -10.795 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c28 smd circle (at -9.525 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c27 smd circle (at -8.255 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 544 FMC2_LA_27_N) (solder_mask_margin 0.102)) (pad c26 smd circle (at -6.985 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 545 FMC2_LA_27_P) (solder_mask_margin 0.102)) (pad c25 smd circle (at -5.715 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c24 smd circle (at -4.445 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c23 smd circle (at -3.175 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 568 FMC2_LA_18_N) (solder_mask_margin 0.102)) (pad c22 smd circle (at -1.905 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 569 FMC2_LA_18_P) (solder_mask_margin 0.102)) (pad c21 smd circle (at -0.635 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c20 smd circle (at 0.635 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c19 smd circle (at 1.905 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 519 FMC2_LA_14_N) (solder_mask_margin 0.102)) (pad c18 smd circle (at 3.175 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 520 FMC2_LA_14_P) (solder_mask_margin 0.102)) (pad c17 smd circle (at 4.445 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c16 smd circle (at 5.715 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c15 smd circle (at 6.985 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 521 FMC2_LA_10_N) (solder_mask_margin 0.102)) (pad c14 smd circle (at 8.255 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 522 FMC2_LA_10_P) (solder_mask_margin 0.102)) (pad c13 smd circle (at 9.525 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c12 smd circle (at 10.795 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c11 smd circle (at 12.065 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 523 FMC2_LA_6_N) (solder_mask_margin 0.102)) (pad c10 smd circle (at 13.335 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 524 FMC2_LA_6_P) (solder_mask_margin 0.102)) (pad c9 smd circle (at 14.605 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c8 smd circle (at 15.875 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c7 smd circle (at 17.145 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 748 "Net-(P2-Padc7)") (solder_mask_margin 0.102)) (pad c6 smd circle (at 18.415 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 749 "Net-(P2-Padc6)") 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-3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad h29 smd circle (at -10.795 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 616 FMC1_LA_24_N) (solder_mask_margin 0.102)) (pad h28 smd circle (at -9.525 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 617 FMC1_LA_24_P) (solder_mask_margin 0.102)) (pad h27 smd circle (at -8.255 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad h26 smd circle (at -6.985 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 619 FMC1_LA_21_N) (solder_mask_margin 0.102)) (pad h25 smd circle (at -5.715 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 612 FMC1_LA_21_P) (solder_mask_margin 0.102)) (pad h24 smd circle (at -4.445 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad h23 smd circle (at -3.175 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 626 FMC1_LA_19_N) (solder_mask_margin 0.102)) (pad h22 smd circle (at -1.905 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 620 FMC1_LA_19_P) (solder_mask_margin 0.102)) (pad h21 smd circle (at -0.635 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad h20 smd circle (at 0.635 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 547 FMC1_LA_15_N) (solder_mask_margin 0.102)) (pad h19 smd circle (at 1.905 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 548 FMC1_LA_15_P) (solder_mask_margin 0.102)) (pad h18 smd circle (at 3.175 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad h17 smd circle (at 4.445 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 582 FMC1_LA_11_N) (solder_mask_margin 0.102)) (pad h16 smd circle (at 5.715 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 587 FMC1_LA_11_P) (solder_mask_margin 0.102)) (pad h15 smd circle (at 6.985 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad h14 smd circle (at 8.255 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 576 FMC1_LA_7_N) (solder_mask_margin 0.102)) (pad h13 smd circle (at 9.525 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 581 FMC1_LA_7_P) (solder_mask_margin 0.102)) (pad h12 smd circle (at 10.795 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad h11 smd circle (at 12.065 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 528 FMC1_LA_4_N) (solder_mask_margin 0.102)) (pad h10 smd circle (at 13.335 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 539 FMC1_LA_4_P) (solder_mask_margin 0.102)) (pad h9 smd circle (at 14.605 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad h8 smd circle (at 15.875 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 527 FMC1_LA_2_N) (solder_mask_margin 0.102)) (pad h7 smd circle (at 17.145 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 538 FMC1_LA_2_P) (solder_mask_margin 0.102)) (pad h6 smd circle (at 18.415 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad h5 smd circle (at 19.685 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 146 /FMC_1/FMC1_CLK0_M2C_N) (solder_mask_margin 0.102)) (pad h4 smd circle (at 20.955 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 147 /FMC_1/FMC1_CLK0_M2C_P) (solder_mask_margin 0.102)) (pad h3 smd circle (at 22.225 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad h2 smd circle (at 23.495 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 148 /FMC1_PRSNT_M2C_L) (solder_mask_margin 0.102)) (pad h1 smd circle (at 24.765 -3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 742 "Net-(P1-Padh1)") (solder_mask_margin 0.102)) (pad g40 smd circle (at -24.765 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g39 smd circle (at -23.495 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad g38 smd circle (at -22.225 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g37 smd circle (at -20.955 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 599 FMC1_LA_33_N) (solder_mask_margin 0.102)) (pad g36 smd circle (at -19.685 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 591 FMC1_LA_33_P) (solder_mask_margin 0.102)) (pad g35 smd circle (at -18.415 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g34 smd circle (at -17.145 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 602 FMC1_LA_31_N) (solder_mask_margin 0.102)) (pad g33 smd circle (at -15.875 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 600 FMC1_LA_31_P) (solder_mask_margin 0.102)) (pad g32 smd circle (at -14.605 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g31 smd circle (at -13.335 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 607 FMC1_LA_29_N) (solder_mask_margin 0.102)) (pad g30 smd circle (at -12.065 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 608 FMC1_LA_29_P) (solder_mask_margin 0.102)) (pad g29 smd circle (at -10.795 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g28 smd circle (at -9.525 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 613 FMC1_LA_25_N) (solder_mask_margin 0.102)) (pad g27 smd circle (at -8.255 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 609 FMC1_LA_25_P) (solder_mask_margin 0.102)) (pad g26 smd circle (at -6.985 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g25 smd circle (at -5.715 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 622 FMC1_LA_22_N) (solder_mask_margin 0.102)) (pad g24 smd circle (at -4.445 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 623 FMC1_LA_22_P) (solder_mask_margin 0.102)) (pad g23 smd circle (at -3.175 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g22 smd circle (at -1.905 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 624 FMC1_LA_20_N) (solder_mask_margin 0.102)) (pad g21 smd circle (at -0.635 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 625 FMC1_LA_20_P) (solder_mask_margin 0.102)) (pad g20 smd circle (at 0.635 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g19 smd circle (at 1.905 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 525 FMC1_LA_16_N) (solder_mask_margin 0.102)) (pad g18 smd circle (at 3.175 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 526 FMC1_LA_16_P) (solder_mask_margin 0.102)) (pad g17 smd circle (at 4.445 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g16 smd circle (at 5.715 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 580 FMC1_LA_12_N) (solder_mask_margin 0.102)) (pad g15 smd circle (at 6.985 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 585 FMC1_LA_12_P) (solder_mask_margin 0.102)) (pad g14 smd circle (at 8.255 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g13 smd circle (at 9.525 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 586 FMC1_LA_8_N) (solder_mask_margin 0.102)) (pad g12 smd circle (at 10.795 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 594 FMC1_LA_8_P) (solder_mask_margin 0.102)) (pad g11 smd circle (at 12.065 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g10 smd circle (at 13.335 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 556 FMC1_LA_3_N) (solder_mask_margin 0.102)) (pad g9 smd circle (at 14.605 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 566 FMC1_LA_3_P) (solder_mask_margin 0.102)) (pad g8 smd circle (at 15.875 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g7 smd circle (at 17.145 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 563 FMC1_LA_0_N) (solder_mask_margin 0.102)) (pad g6 smd circle (at 18.415 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 571 FMC1_LA_0_P) (solder_mask_margin 0.102)) (pad g5 smd circle (at 19.685 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g4 smd circle (at 20.955 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad g3 smd circle (at 22.225 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 149 /FMC_1/FMC1_CLK1_M2C_N) (solder_mask_margin 0.102)) (pad g2 smd circle (at 23.495 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 150 /FMC_1/FMC1_CLK1_M2C_P) (solder_mask_margin 0.102)) (pad g1 smd circle (at 24.765 -1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d40 smd circle (at -24.765 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad d39 smd circle (at -23.495 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d38 smd circle (at -22.225 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad d37 smd circle (at -20.955 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d36 smd circle (at -19.685 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad d35 smd circle (at -18.415 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1101 "Net-(P1-Padd35)") (solder_mask_margin 0.102)) (pad d34 smd circle (at -17.145 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 683 /FMC1_TRST) (solder_mask_margin 0.102)) (pad d33 smd circle (at -15.875 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 151 /FMC1_TMS) (solder_mask_margin 0.102)) (pad d32 smd circle (at -14.605 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 18 /FMC_1/FMC1_3P3VAUX) (solder_mask_margin 0.102)) (pad d31 smd circle (at -13.335 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 684 /FMC1_TDO) (solder_mask_margin 0.102)) (pad d30 smd circle (at -12.065 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 152 /FMC1_TDI) (solder_mask_margin 0.102)) (pad d29 smd circle (at -10.795 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 153 /FMC1_TCK) (solder_mask_margin 0.102)) (pad d28 smd circle (at -9.525 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d27 smd circle (at -8.255 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 621 FMC1_LA_26_N) (solder_mask_margin 0.102)) (pad d26 smd circle (at -6.985 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 614 FMC1_LA_26_P) (solder_mask_margin 0.102)) (pad d25 smd circle (at -5.715 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d24 smd circle (at -4.445 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 618 FMC1_LA_23_N) (solder_mask_margin 0.102)) (pad d23 smd circle (at -3.175 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 611 FMC1_LA_23_P) (solder_mask_margin 0.102)) (pad d22 smd circle (at -1.905 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d21 smd circle (at -0.635 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 615 FMC1_LA_17_N) (solder_mask_margin 0.102)) (pad d20 smd circle (at 0.635 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 610 FMC1_LA_17_P) (solder_mask_margin 0.102)) (pad d19 smd circle (at 1.905 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d18 smd circle (at 3.175 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 554 FMC1_LA_13_N) (solder_mask_margin 0.102)) (pad d17 smd circle (at 4.445 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 555 FMC1_LA_13_P) (solder_mask_margin 0.102)) (pad d16 smd circle (at 5.715 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d15 smd circle (at 6.985 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 583 FMC1_LA_9_N) (solder_mask_margin 0.102)) (pad d14 smd circle (at 8.255 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 588 FMC1_LA_9_P) (solder_mask_margin 0.102)) (pad d13 smd circle (at 9.525 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d12 smd circle (at 10.795 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 572 FMC1_LA_5_N) (solder_mask_margin 0.102)) (pad d11 smd circle (at 12.065 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 573 FMC1_LA_5_P) (solder_mask_margin 0.102)) (pad d10 smd circle (at 13.335 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d9 smd circle (at 14.605 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 564 FMC1_LA_1_N) (solder_mask_margin 0.102)) (pad d8 smd circle (at 15.875 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 565 FMC1_LA_1_P) (solder_mask_margin 0.102)) (pad d7 smd circle (at 17.145 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d6 smd circle (at 18.415 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d5 smd circle (at 19.685 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 71 /FMC_1/FMC1_GBTCLK0_M2C_N) (solder_mask_margin 0.102)) (pad d4 smd circle (at 20.955 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 69 /FMC_1/FMC1_GBTCLK0_M2C_P) (solder_mask_margin 0.102)) (pad d3 smd circle (at 22.225 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d2 smd circle (at 23.495 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad d1 smd circle (at 24.765 1.905 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 154 /FMC_1/FMC1_PG_C2M) (solder_mask_margin 0.102)) (pad c40 smd circle (at -24.765 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c39 smd circle (at -23.495 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad c38 smd circle (at -22.225 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c37 smd circle (at -20.955 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 462 +12V_FMC1) (solder_mask_margin 0.102)) (pad c36 smd circle (at -19.685 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c35 smd circle (at -18.415 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 462 +12V_FMC1) (solder_mask_margin 0.102)) (pad c34 smd circle (at -17.145 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1102 "Net-(P1-Padc34)") (solder_mask_margin 0.102)) (pad c33 smd circle (at -15.875 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c32 smd circle (at -14.605 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c31 smd circle (at -13.335 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 427 /FMC_1/I2C_FMC1_SDA) (solder_mask_margin 0.102)) (pad c30 smd circle (at -12.065 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 428 /FMC_1/I2C_FMC1_SCL) (solder_mask_margin 0.102)) (pad c29 smd circle (at -10.795 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c28 smd circle (at -9.525 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c27 smd circle (at -8.255 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 603 FMC1_LA_27_N) (solder_mask_margin 0.102)) (pad c26 smd circle (at -6.985 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 604 FMC1_LA_27_P) (solder_mask_margin 0.102)) (pad c25 smd circle (at -5.715 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c24 smd circle (at -4.445 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c23 smd circle (at -3.175 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 605 FMC1_LA_18_N) (solder_mask_margin 0.102)) (pad c22 smd circle (at -1.905 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 606 FMC1_LA_18_P) (solder_mask_margin 0.102)) (pad c21 smd circle (at -0.635 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c20 smd circle (at 0.635 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c19 smd circle (at 1.905 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 536 FMC1_LA_14_N) (solder_mask_margin 0.102)) (pad c18 smd circle (at 3.175 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 537 FMC1_LA_14_P) (solder_mask_margin 0.102)) (pad c17 smd circle (at 4.445 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c16 smd circle (at 5.715 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c15 smd circle (at 6.985 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 595 FMC1_LA_10_N) (solder_mask_margin 0.102)) (pad c14 smd circle (at 8.255 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 596 FMC1_LA_10_P) (solder_mask_margin 0.102)) (pad c13 smd circle (at 9.525 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c12 smd circle (at 10.795 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c11 smd circle (at 12.065 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 584 FMC1_LA_6_N) (solder_mask_margin 0.102)) (pad c10 smd circle (at 13.335 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 589 FMC1_LA_6_P) (solder_mask_margin 0.102)) (pad c9 smd circle (at 14.605 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c8 smd circle (at 15.875 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c7 smd circle (at 17.145 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 743 "Net-(P1-Padc7)") (solder_mask_margin 0.102)) (pad c6 smd circle (at 18.415 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 744 "Net-(P1-Padc6)") (solder_mask_margin 0.102)) (pad c5 smd circle (at 19.685 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c4 smd circle (at 20.955 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad c3 smd circle (at 22.225 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 745 "Net-(P1-Padc3)") (solder_mask_margin 0.102)) (pad c2 smd circle (at 23.495 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 746 "Net-(P1-Padc2)") (solder_mask_margin 0.102)) (pad c1 smd circle (at 24.765 3.175 90) (size 0.64 0.64) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/SAMTEC_ASP-134603-01.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer B.Cu) (tedit 5CACA443) (tstamp 5C6AF41C) (at 262.509 98.6663 90) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5CC393D3/5C61B225) (attr smd) (fp_text reference L42 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 90) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 90) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 20 "Net-(C75-Pad2)") (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer B.Cu) (tedit 5CACA443) (tstamp 5C6AEE71) (at 264.2616 95.2373 270) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5CC393D3/5C619A26) (attr smd) (fp_text reference L41 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 19 "Net-(C72-Pad2)") (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer B.Cu) (tedit 5CACA443) (tstamp 5C6AE860) (at 247.65 142.5194 270) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D0CDADB) (attr smd) (fp_text reference L34 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 489 MGTAVCC) (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer F.Cu) (tedit 5CACA443) (tstamp 5C6AE2B5) (at 255.9812 154.7368 180) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D0CD8A1) (attr smd) (fp_text reference L33 (at 0 -1.776) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 1.776) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -1.5 0.75) (end -1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.5 0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 180) (size 1 1) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 180) (size 1 1) (layers F.Cu F.Paste F.Mask) (net 486 VCCBRAM) (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC4516X180N (layer F.Cu) (tedit 5CACC6CF) (tstamp 5C6ADD0A) (at 261.8232 162.9918 90) (descr "Inductor, Chip; 4.50mm L X 1.60mm W X 1.80mm H, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D189CEC) (attr smd) (fp_text reference L32 (at 0 -2.176 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value IND1806_MURATA_BLM41PG600SN1L (at 0 2.176 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.95 -0.8) (end 0.95 -0.8) (layer F.SilkS) (width 0.2)) (fp_line (start -0.95 0.8) (end 0.95 0.8) (layer F.SilkS) (width 0.2)) (fp_line (start -2.25 0.8) (end -2.25 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start -2.25 -0.8) (end 2.25 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start 2.25 0.8) (end 2.25 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start -2.25 0.8) (end 2.25 0.8) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -2.921 -1.143) (end 2.921 -1.143) (layer F.CrtYd) (width 0.12)) (fp_line (start 2.921 -1.143) (end 2.921 1.143) (layer F.CrtYd) (width 0.12)) (fp_line (start 2.921 1.143) (end -2.921 1.143) (layer F.CrtYd) (width 0.12)) (fp_line (start -2.921 1.143) (end -2.921 -1.143) (layer F.CrtYd) (width 0.12)) (pad 1 smd rect (at -2 0 180) (size 1.8 1.4) (layers F.Cu F.Paste F.Mask) (net 48 /Power/Power_SW/XR77129ILB_F_VOUT4) (solder_mask_margin 0.102)) (pad 2 smd rect (at 2 0 180) (size 1.8 1.4) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (model INDC4516X180N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC4516X180N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC4516X180N (layer F.Cu) (tedit 5CACC6CF) (tstamp 5C6AD756) (at 251.4346 163.7284 90) (descr "Inductor, Chip; 4.50mm L X 1.60mm W X 1.80mm H, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D17509E) (attr smd) (fp_text reference L31 (at 0 -2.176 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value IND1806_MURATA_BLM41PG600SN1L (at 0 2.176 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.95 -0.8) (end 0.95 -0.8) (layer F.SilkS) (width 0.2)) (fp_line (start -0.95 0.8) (end 0.95 0.8) (layer F.SilkS) (width 0.2)) (fp_line (start -2.25 0.8) (end -2.25 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start -2.25 -0.8) (end 2.25 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start 2.25 0.8) (end 2.25 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start -2.25 0.8) (end 2.25 0.8) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -2.921 -1.143) (end 2.921 -1.143) (layer F.CrtYd) (width 0.12)) (fp_line (start 2.921 -1.143) (end 2.921 1.143) (layer F.CrtYd) (width 0.12)) (fp_line (start 2.921 1.143) (end -2.921 1.143) (layer F.CrtYd) (width 0.12)) (fp_line (start -2.921 1.143) (end -2.921 -1.143) (layer F.CrtYd) (width 0.12)) (pad 1 smd rect (at -2 0 180) (size 1.8 1.4) (layers F.Cu F.Paste F.Mask) (net 47 /Power/Power_SW/XR77129ILB_F_VOUT3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 2 0 180) (size 1.8 1.4) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model INDC4516X180N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC4516X180N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer B.Cu) (tedit 5CACA443) (tstamp 5C775BAB) (at 248.6533 147.4978 90) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5C907554/5C417BCB/5E21D86B) (attr smd) (fp_text reference L28 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 90) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 90) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 59 /FPGA/FPGA_PWR&MISC/GNDADC) (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer B.Cu) (tedit 5CACA443) (tstamp 5C775600) (at 250.3424 142.5448 270) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5C907554/5C417BCB/5E1FB71D) (attr smd) (fp_text reference L27 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 12 +1V8) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 58 /FPGA/FPGA_PWR&MISC/VCCADC) (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer F.Cu) (tedit 5CACA443) (tstamp 5C775055) (at 243.713 95.885) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5C16BF13/5E1D2864) (attr smd) (fp_text reference L26 (at 0 -1.776) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 1.776) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -1.5 0.75) (end -1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.5 0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0) (size 1 1) (layers F.Cu F.Paste F.Mask) (net 454 "Net-(C123-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0) (size 1 1) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer B.Cu) (tedit 5CACA443) (tstamp 5C6AD16F) (at 143.764 112.014) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5C16C03C/5CF95208) (attr smd) (fp_text reference L25 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 52 "Net-(C168-Pad1)") (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer B.Cu) (tedit 5CACA443) (tstamp 5C6ACBC4) (at 143.764 115.316) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5C16C03C/5CF86D58) (attr smd) (fp_text reference L24 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 51 "Net-(C167-Pad1)") (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:IND_WURTH_WE-PMCI_0806LR (layer B.Cu) (tedit 5C617CFC) (tstamp 5C6EB1AC) (at 151.5364 135.5852) (descr "SMD Power Molded Chip Inductor (WE-PMCI Series), Body 2.0x1.6mm") (path /5C16C03C/5CCDD1FD) (attr smd) (fp_text reference L23 (at 0 2.176) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND_2.2UH_20%_WURTH_WE-PMCI_74479276222C (at 0 -2.176) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start -1.2 0.9) (end -0.4 0.9) (layer Cmts.User) (width 0.1)) (fp_line (start -0.4 -0.9) (end -0.4 0.9) (layer Cmts.User) (width 0.1)) (fp_line (start -1.2 -0.9) (end -0.4 -0.9) (layer Cmts.User) (width 0.1)) (fp_line (start -1.2 -0.9) (end -1.2 0.9) (layer Cmts.User) (width 0.1)) (fp_line (start -1.3 0) (end -0.8 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.8 0) (end -0.8 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.8 -0.5) (end -0.8 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.8 0) (end -0.3 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.4 0.9) (end 1.2 0.9) (layer Cmts.User) (width 0.1)) (fp_line (start 1.2 -0.9) (end 1.2 0.9) (layer Cmts.User) (width 0.1)) (fp_line (start 0.4 -0.9) (end 1.2 -0.9) (layer Cmts.User) (width 0.1)) (fp_line (start 0.4 -0.9) (end 0.4 0.9) (layer Cmts.User) (width 0.1)) (fp_line (start 0.3 0) (end 0.8 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.8 0) (end 0.8 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0.8 -0.5) (end 0.8 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.8 0) (end 1.3 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.05 0.8) (end 0.05 0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -0.05 -0.8) (end 0.05 -0.8) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 0.8) (end 0.5 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.8) (end 0.5 -0.8) (layer B.Fab) (width 0.1)) (fp_line (start -1 -0.8) (end -1 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -1 -0.8) (end -0.5 -0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.8) (end -0.5 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -1 0.8) (end -0.5 0.8) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.8) (end 0.5 0.8) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.8) (end 1 -0.8) (layer B.Fab) (width 0.1)) (fp_line (start 1 -0.8) (end 1 0.8) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 0.8) (end 1 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -1.45 1.15) (end 1.45 1.15) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.45 -1.15) (end 1.45 1.15) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.45 -1.15) (end 1.45 -1.15) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.45 -1.15) (end -1.45 1.15) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.8 0) (size 0.8 1.8) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.8 0) (size 0.8 1.8) (layers B.Cu B.Paste B.Mask) (net 202 "Net-(L23-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/IND_WURTH_WE-PMCI_0806LR.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC4516X180N (layer F.Cu) (tedit 5CACC6CF) (tstamp 5C6AC055) (at 227.33 171.5262 180) (descr "Inductor, Chip; 4.50mm L X 1.60mm W X 1.80mm H, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D1601F7) (attr smd) (fp_text reference L22 (at 0 -2.176) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value IND1806_MURATA_BLM41PG600SN1L (at 0 2.176) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.95 -0.8) (end 0.95 -0.8) (layer F.SilkS) (width 0.2)) (fp_line (start -0.95 0.8) (end 0.95 0.8) (layer F.SilkS) (width 0.2)) (fp_line (start -2.25 0.8) (end -2.25 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start -2.25 -0.8) (end 2.25 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start 2.25 0.8) (end 2.25 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start -2.25 0.8) (end 2.25 0.8) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -2.921 -1.143) (end 2.921 -1.143) (layer F.CrtYd) (width 0.12)) (fp_line (start 2.921 -1.143) (end 2.921 1.143) (layer F.CrtYd) (width 0.12)) (fp_line (start 2.921 1.143) (end -2.921 1.143) (layer F.CrtYd) (width 0.12)) (fp_line (start -2.921 1.143) (end -2.921 -1.143) (layer F.CrtYd) (width 0.12)) (pad 1 smd rect (at -2 0 270) (size 1.8 1.4) (layers F.Cu F.Paste F.Mask) (net 46 /Power/Power_SW/XR77129ILB_F_VOUT2) (solder_mask_margin 0.102)) (pad 2 smd rect (at 2 0 270) (size 1.8 1.4) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model INDC4516X180N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC4516X180N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC4516X180N (layer F.Cu) (tedit 5CACC6CF) (tstamp 5C6ABAA1) (at 219.9386 180.5178 180) (descr "Inductor, Chip; 4.50mm L X 1.60mm W X 1.80mm H, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D08EC0F) (attr smd) (fp_text reference L21 (at 0 -2.176) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value IND1806_MURATA_BLM41PG600SN1L (at 0 2.176) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.95 -0.8) (end 0.95 -0.8) (layer F.SilkS) (width 0.2)) (fp_line (start -0.95 0.8) (end 0.95 0.8) (layer F.SilkS) (width 0.2)) (fp_line (start -2.25 0.8) (end -2.25 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start -2.25 -0.8) (end 2.25 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start 2.25 0.8) (end 2.25 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start -2.25 0.8) (end 2.25 0.8) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -2.921 -1.143) (end 2.921 -1.143) (layer F.CrtYd) (width 0.12)) (fp_line (start 2.921 -1.143) (end 2.921 1.143) (layer F.CrtYd) (width 0.12)) (fp_line (start 2.921 1.143) (end -2.921 1.143) (layer F.CrtYd) (width 0.12)) (fp_line (start -2.921 1.143) (end -2.921 -1.143) (layer F.CrtYd) (width 0.12)) (pad 1 smd rect (at -2 0 270) (size 1.8 1.4) (layers F.Cu F.Paste F.Mask) (net 45 /Power/Power_SW/XR77129ILB_F_VOUT1) (solder_mask_margin 0.102)) (pad 2 smd rect (at 2 0 270) (size 1.8 1.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (model INDC4516X180N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC4516X180N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:IND_BOURNS_SRP6540 (layer F.Cu) (tedit 5CA4B868) (tstamp 5C6AB4ED) (at 261.4422 173.6598 90) (descr "SMD Inductor Body Width 7.5mm Body Lenght 6.7mm Height 4mm") (path /5C16BF8E/5DB9B7E6/5D883F38) (attr smd) (fp_text reference L20 (at 0 -4.626 90) (layer F.SilkS) hide (effects 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0.05)) (fp_line (start 2.8 0) (end 2.8 -0.5) (layer Cmts.User) (width 0.05)) (fp_line (start 2.8 0.5) (end 2.8 0) (layer Cmts.User) (width 0.05)) (fp_line (start 2.3 0) (end 2.8 0) (layer Cmts.User) (width 0.05)) (fp_line (start 2.8 0) (end 3.3 0) (layer Cmts.User) (width 0.05)) (fp_line (start -2.8 0) (end -2.8 -0.5) (layer Cmts.User) (width 0.05)) (fp_line (start -2.8 0.5) (end -2.8 0) (layer Cmts.User) (width 0.05)) (fp_line (start -3.3 0) (end -2.8 0) (layer Cmts.User) (width 0.05)) (fp_line (start -2.8 0) (end -2.3 0) (layer Cmts.User) (width 0.05)) (fp_line (start -3.35 -3.35) (end 3.35 -3.35) (layer F.SilkS) (width 0.2)) (fp_line (start 3.55 -2.05) (end 3.55 -3.15) (layer F.SilkS) (width 0.2)) (fp_line (start -3.35 3.35) (end 3.35 3.35) (layer F.SilkS) (width 0.2)) (fp_line (start -3.55 3.15) (end -3.55 2.05) (layer F.SilkS) (width 0.2)) (fp_line (start -3.55 -2.05) (end -3.55 -3.15) (layer F.SilkS) (width 0.2)) (fp_line (start 3.55 3.15) (end 3.55 2.05) (layer F.SilkS) (width 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Cmts.User) (width 0.05)) (fp_line (start 2.8 0.5) (end 2.8 0) (layer Cmts.User) (width 0.05)) (fp_line (start 2.3 0) (end 2.8 0) (layer Cmts.User) (width 0.05)) (fp_line (start 2.8 0) (end 3.3 0) (layer Cmts.User) (width 0.05)) (fp_line (start -2.8 0) (end -2.8 -0.5) (layer Cmts.User) (width 0.05)) (fp_line (start -2.8 0.5) (end -2.8 0) (layer Cmts.User) (width 0.05)) (fp_line (start -3.3 0) (end -2.8 0) (layer Cmts.User) (width 0.05)) (fp_line (start -2.8 0) (end -2.3 0) (layer Cmts.User) (width 0.05)) (fp_line (start -3.35 -3.35) (end 3.35 -3.35) (layer F.SilkS) (width 0.2)) (fp_line (start 3.55 -2.05) (end 3.55 -3.15) (layer F.SilkS) (width 0.2)) (fp_line (start -3.35 3.35) (end 3.35 3.35) (layer F.SilkS) (width 0.2)) (fp_line (start -3.55 3.15) (end -3.55 2.05) (layer F.SilkS) (width 0.2)) (fp_line (start -3.55 -2.05) (end -3.55 -3.15) (layer F.SilkS) (width 0.2)) (fp_line (start 3.55 3.15) (end 3.55 2.05) (layer F.SilkS) (width 0.2)) (fp_line (start -3.35 -3.35) (end 3.35 -3.35) 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-3.55 3.15) (angle -90) (layer F.SilkS) (width 0.2)) (fp_arc (start 3.35 3.15) (end 3.35 3.35) (angle -90) (layer F.SilkS) (width 0.2)) (fp_arc (start 3.35 -3.15) (end 3.55 -3.15) (angle -90) (layer F.SilkS) (width 0.2)) (fp_arc (start -3.35 -3.15) (end -3.35 -3.35) (angle -90) (layer F.SilkS) (width 0.2)) (fp_arc (start -3.35 3.15) (end -3.55 3.15) (angle -90) (layer F.Fab) (width 0.1)) (fp_arc (start 3.35 3.15) (end 3.35 3.35) (angle -90) (layer F.Fab) (width 0.1)) (fp_arc (start 3.35 -3.15) (end 3.55 -3.15) (angle -90) (layer F.Fab) (width 0.1)) (fp_arc (start -3.35 -3.15) (end -3.35 -3.35) (angle -90) (layer F.Fab) (width 0.1)) (pad 1 smd rect (at -2.8 0 180) (size 2 3.4) (layers F.Cu F.Paste F.Mask) (net 39 /Power/Power_SW/PSS_XRP_LX2) (solder_mask_margin 0.102)) (pad 2 smd rect (at 2.8 0 180) (size 2 3.4) (layers F.Cu F.Paste F.Mask) (net 46 /Power/Power_SW/XR77129ILB_F_VOUT2) (solder_mask_margin 0.102)) (model IND_BOURNS_SRP6540.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/IND_BOURNS_SRP6540.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:IND_BOURNS_SRP6540 (layer F.Cu) (tedit 5CA4B868) (tstamp 5C6AA37D) (at 231.7242 180.594 180) (descr "SMD Inductor Body Width 7.5mm Body Lenght 6.7mm Height 4mm") (path /5C16BF8E/5DB9B7E6/5D7F2D5A) (attr smd) (fp_text reference L17 (at 0 -4.626) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value IND_2.2UH_20%_BOURNS_SRP6540 (at 0 4.626) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 0 0) (end 0 -0.5) (layer Cmts.User) (width 0.05)) (fp_line (start 0 0.5) (end 0 0) (layer Cmts.User) (width 0.05)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.05)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.05)) (fp_line (start 1.8 1.7) (end 3.8 1.7) (layer Cmts.User) (width 0.05)) (fp_line (start -3.8 1.7) (end -1.8 1.7) (layer Cmts.User) (width 0.05)) (fp_line (start -1.8 1.7) (end -1.8 -1.7) (layer Cmts.User) (width 0.05)) (fp_line (start -3.8 1.7) (end -3.8 -1.7) (layer Cmts.User) (width 0.05)) (fp_line (start 3.8 1.7) (end 3.8 -1.7) (layer Cmts.User) (width 0.05)) (fp_line (start 1.8 1.7) (end 1.8 -1.7) (layer Cmts.User) (width 0.05)) (fp_line (start -3.8 -1.7) (end -1.8 -1.7) (layer Cmts.User) (width 0.05)) (fp_line (start 1.8 -1.7) (end 3.8 -1.7) (layer Cmts.User) (width 0.05)) (fp_line (start 2.8 0) (end 2.8 -0.5) (layer Cmts.User) (width 0.05)) (fp_line (start 2.8 0.5) (end 2.8 0) (layer Cmts.User) (width 0.05)) (fp_line (start 2.3 0) (end 2.8 0) (layer Cmts.User) (width 0.05)) (fp_line (start 2.8 0) (end 3.3 0) (layer Cmts.User) (width 0.05)) (fp_line (start -2.8 0) (end -2.8 -0.5) (layer Cmts.User) (width 0.05)) (fp_line (start -2.8 0.5) (end -2.8 0) (layer Cmts.User) (width 0.05)) (fp_line (start -3.3 0) (end -2.8 0) (layer Cmts.User) (width 0.05)) (fp_line (start -2.8 0) (end -2.3 0) (layer Cmts.User) (width 0.05)) (fp_line (start -3.35 -3.35) (end 3.35 -3.35) (layer F.SilkS) (width 0.2)) (fp_line (start 3.55 -2.05) (end 3.55 -3.15) (layer F.SilkS) (width 0.2)) (fp_line (start -3.35 3.35) (end 3.35 3.35) (layer F.SilkS) (width 0.2)) (fp_line (start -3.55 3.15) (end -3.55 2.05) (layer F.SilkS) (width 0.2)) (fp_line (start -3.55 -2.05) (end -3.55 -3.15) (layer F.SilkS) (width 0.2)) (fp_line (start 3.55 3.15) (end 3.55 2.05) (layer F.SilkS) (width 0.2)) (fp_line (start -3.35 -3.35) (end 3.35 -3.35) (layer F.Fab) (width 0.1)) (fp_line (start 3.55 3.15) (end 3.55 -3.15) (layer F.Fab) (width 0.1)) (fp_line (start -3.35 3.35) (end 3.35 3.35) (layer F.Fab) (width 0.1)) (fp_line (start -3.55 3.15) (end -3.55 -3.15) (layer F.Fab) (width 0.1)) (fp_line (start -3.75 -1.65) (end -3.55 -1.65) (layer F.Fab) (width 0.1)) (fp_line (start -3.75 1.65) (end -3.75 -1.65) (layer F.Fab) (width 0.1)) (fp_line (start -3.75 1.65) (end -3.55 1.65) (layer F.Fab) (width 0.1)) (fp_line (start 3.55 -1.65) (end 3.75 -1.65) (layer F.Fab) (width 0.1)) (fp_line (start 3.75 1.65) (end 3.75 -1.65) (layer F.Fab) (width 0.1)) (fp_line (start 3.55 1.65) (end 3.75 1.65) (layer F.Fab) (width 0.1)) (fp_line (start -4.05 3.6) (end -4.05 -3.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -4.05 -3.6) (end 4.05 -3.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -4.05 3.6) (end 4.05 3.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 4.05 3.6) (end 4.05 -3.6) (layer F.CrtYd) (width 0.05)) (fp_arc (start -3.35 3.15) (end -3.55 3.15) (angle -90) (layer F.SilkS) (width 0.2)) (fp_arc (start 3.35 3.15) (end 3.35 3.35) (angle -90) (layer F.SilkS) (width 0.2)) (fp_arc (start 3.35 -3.15) (end 3.55 -3.15) (angle -90) (layer F.SilkS) (width 0.2)) (fp_arc (start -3.35 -3.15) (end -3.35 -3.35) (angle -90) (layer F.SilkS) (width 0.2)) (fp_arc (start -3.35 3.15) (end -3.55 3.15) (angle -90) (layer F.Fab) (width 0.1)) (fp_arc (start 3.35 3.15) (end 3.35 3.35) (angle -90) (layer F.Fab) (width 0.1)) (fp_arc (start 3.35 -3.15) (end 3.55 -3.15) (angle -90) (layer F.Fab) (width 0.1)) (fp_arc (start -3.35 -3.15) (end -3.35 -3.35) (angle -90) (layer F.Fab) (width 0.1)) (pad 1 smd rect (at -2.8 0 180) (size 2 3.4) (layers F.Cu F.Paste F.Mask) (net 37 /Power/Power_SW/PSS_XRP_LX1) (solder_mask_margin 0.102)) (pad 2 smd rect (at 2.8 0 180) (size 2 3.4) (layers F.Cu F.Paste F.Mask) (net 45 /Power/Power_SW/XR77129ILB_F_VOUT1) (solder_mask_margin 0.102)) (model IND_BOURNS_SRP6540.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/IND_BOURNS_SRP6540.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer B.Cu) (tedit 5CACA443) (tstamp 5C6A9DAD) (at 253.6317 138.43 180) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D0F77D2) (attr smd) (fp_text reference L16 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 180) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 680 "Net-(C145-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 180) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer F.Cu) (tedit 5CACA443) (tstamp 5C6A9802) (at 214.8078 140.208) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D0E2B7F) (attr smd) (fp_text reference L15 (at 0 -1.776) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 1.776) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -1.5 0.75) (end -1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.5 0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0) (size 1 1) (layers F.Cu F.Paste F.Mask) (net 12 +1V8) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0) (size 1 1) (layers F.Cu F.Paste F.Mask) (net 488 VCCAUX) (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC4516X180N (layer F.Cu) (tedit 5CACC6CF) (tstamp 5CF3C3DF) (at 264.8966 161.6202 90) (descr "Inductor, Chip; 4.50mm L X 1.60mm W X 1.80mm H, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5CF9305C) (attr smd) (fp_text reference L14 (at 0 -2.176 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value IND1806_MURATA_BLM41PG600SN1L (at 0 2.176 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.95 -0.8) (end 0.95 -0.8) (layer F.SilkS) (width 0.2)) (fp_line (start -0.95 0.8) (end 0.95 0.8) (layer F.SilkS) (width 0.2)) (fp_line (start -2.25 0.8) (end -2.25 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start -2.25 -0.8) (end 2.25 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start 2.25 0.8) (end 2.25 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start -2.25 0.8) (end 2.25 0.8) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -2.921 -1.143) (end 2.921 -1.143) (layer F.CrtYd) (width 0.12)) (fp_line (start 2.921 -1.143) (end 2.921 1.143) (layer F.CrtYd) (width 0.12)) (fp_line (start 2.921 1.143) (end -2.921 1.143) (layer F.CrtYd) (width 0.12)) (fp_line (start -2.921 1.143) (end -2.921 -1.143) (layer F.CrtYd) (width 0.12)) (pad 1 smd rect (at -2 0 180) (size 1.8 1.4) (layers F.Cu F.Paste F.Mask) (net 48 /Power/Power_SW/XR77129ILB_F_VOUT4) (solder_mask_margin 0.102)) (pad 2 smd rect (at 2 0 180) (size 1.8 1.4) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (model INDC4516X180N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC4516X180N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:IND_TDK_VLCF5020-1 (layer B.Cu) (tedit 0) (tstamp 5CC1E95E) (at 154.0764 200.025) (descr "SMD Inductor, 5mm L X 5mm W X 2mm H, TDK VLCF5020-1 Case") (path /5C16BF8E/5CD58952) (attr smd) (fp_text reference L13 (at -0.1016 -3.9624) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND_10UH_20%_TDK_VLCF5020-1 (at 0 -3.901) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.35 2.6) (end 0.35 2.6) (layer B.SilkS) (width 0.2)) (fp_line (start -0.35 -2.6) (end 0.35 -2.6) (layer B.SilkS) (width 0.2)) (fp_line (start -2.6 1.6) (end -1.6 2.6) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 2.6) (end 1.6 2.6) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 2.6) (end 2.6 1.6) (layer B.Fab) (width 0.1)) (fp_line (start 2.6 -1.6) (end 2.6 1.6) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -2.6) (end 2.6 -1.6) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -2.6) (end 1.6 -2.6) (layer B.Fab) (width 0.1)) (fp_line (start -2.6 -1.6) (end -1.6 -2.6) (layer B.Fab) (width 0.1)) (fp_line (start -2.6 -1.6) (end -2.6 1.6) (layer B.Fab) (width 0.1)) (fp_line (start 1.804 -2.85) (end 3 -1.654) (layer B.CrtYd) (width 0.1)) (fp_line (start 3 -1.654) (end 3 1.654) (layer B.CrtYd) (width 0.1)) (fp_line (start 1.804 2.85) (end 3 1.654) (layer B.CrtYd) (width 0.1)) (fp_line (start -3 1.654) (end -1.804 2.85) (layer B.CrtYd) (width 0.1)) (fp_line (start -3 -1.654) (end -3 1.654) (layer B.CrtYd) (width 0.1)) (fp_line (start -3 -1.654) (end -1.804 -2.85) (layer B.CrtYd) (width 0.1)) (fp_line (start -1.804 2.85) (end 1.804 2.85) (layer B.CrtYd) (width 0.1)) (fp_line (start -1.804 -2.85) (end 1.804 -2.85) (layer B.CrtYd) (width 0.1)) (fp_line (start 0 0) (end 0 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start -2.2 0) (end -1.7 0) (layer Cmts.User) (width 0.1)) (fp_line (start -1.7 0) (end -1.7 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.7 -0.5) (end -1.7 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.65 -2.45) (end -0.65 2.45) (layer Cmts.User) (width 0.1)) (fp_line (start -2.75 -1.55) (end -2.75 1.55) (layer Cmts.User) (width 0.1)) (fp_line (start -1.85 2.45) (end -0.65 2.45) (layer Cmts.User) (width 0.1)) (fp_line (start -2.75 1.55) (end -1.85 2.45) (layer Cmts.User) (width 0.1)) (fp_line (start -1.85 -2.45) (end -0.65 -2.45) (layer Cmts.User) (width 0.1)) (fp_line (start -2.75 -1.55) (end -1.85 -2.45) (layer Cmts.User) (width 0.1)) (fp_line (start 1.7 0) (end 2.2 0) (layer Cmts.User) (width 0.1)) (fp_line (start 1.7 0) (end 1.7 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 1.7 -0.5) (end 1.7 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.65 -2.45) (end 0.65 2.45) (layer Cmts.User) (width 0.1)) (fp_line (start 2.75 -1.55) (end 2.75 1.55) (layer Cmts.User) (width 0.1)) (fp_line (start 0.65 2.45) (end 1.85 2.45) (layer Cmts.User) (width 0.1)) (fp_line (start 1.85 2.45) (end 2.75 1.55) (layer Cmts.User) (width 0.1)) (fp_line (start 0.65 -2.45) (end 1.85 -2.45) (layer Cmts.User) (width 0.1)) (fp_line (start 1.85 -2.45) (end 2.75 -1.55) (layer Cmts.User) (width 0.1)) (fp_line (start -1.25 -0.5) (end -1.25 0) (layer Cmts.User) (width 0.1)) (fp_line (start -1.25 0) (end -0.75 0) (layer Cmts.User) (width 0.1)) (fp_line (start -1.25 0) (end -1.25 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 1.25 -0.5) (end 1.25 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.75 0) (end 1.25 0) (layer Cmts.User) (width 0.1)) (fp_line (start 1.25 0) (end 1.25 0.5) (layer Cmts.User) (width 0.1)) (pad 2 smd rect (at 1.25 0) (size 1.2 4.9) (layers B.Cu B.Paste B.Mask) (net 33 "Net-(C132-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -1.25 0) (size 1.2 4.9) (layers B.Cu B.Paste B.Mask) (net 201 "Net-(L13-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/IND_TDK_VLCF5020-1.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N locked (layer B.Cu) (tedit 5CACA443) (tstamp 5C770578) (at 232.0036 93.8784 90) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5C16BF13/5E1C501E) (attr smd) (fp_text reference L12 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 90) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 449 "Net-(C111-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 90) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N locked (layer B.Cu) (tedit 5CACA443) (tstamp 5C76FFCD) (at 227.0506 93.8918 270) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5C16BF13/5E1BE4CD) (attr smd) (fp_text reference L11 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 449 "Net-(C111-Pad1)") (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer B.Cu) (tedit 5CACA443) (tstamp 5C6EB20E) (at 143.256 136.144) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5C16C03C/5CFA36BD) (attr smd) (fp_text reference L10 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 124 "Net-(D13-Pad4)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 49 "Net-(C162-Pad1)") (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N locked (layer B.Cu) (tedit 5CACA443) (tstamp 5C70A4C8) (at 148.6154 184.4802 90) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5BCEDA39/5CEA0FDE) (attr smd) (fp_text reference L9 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 90) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 90) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 57 "Net-(C199-Pad1)") (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer B.Cu) (tedit 5CACA443) (tstamp 5C6A80E1) (at 262.6614 127.0254 90) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5CC8AFE1/5C662CEB) (attr smd) (fp_text reference L8 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 90) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 90) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 26 "Net-(C101-Pad1)") (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer B.Cu) (tedit 5CACA443) (tstamp 5C6A7B36) (at 264.7569 123.5329 270) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5CC8AFE1/5C662CC3) (attr smd) (fp_text reference L7 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 25 "Net-(C100-Pad1)") (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer B.Cu) (tedit 5CACA443) (tstamp 5C70450E) (at 262.7376 112.9665 90) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5CC6DBF7/5C66DBB6) (attr smd) (fp_text reference L6 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 90) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 90) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 22 "Net-(C87-Pad2)") (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer B.Cu) (tedit 5CACA443) (tstamp 5C6A6FE0) (at 264.8966 109.6645 270) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5CC6DBF7/5C66DB8E) (attr smd) (fp_text reference L5 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 21 "Net-(C84-Pad2)") (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N locked (layer B.Cu) (tedit 5CACA443) (tstamp 5C6A6A35) (at 278.4348 172.6057 270) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5BCEDA59/5D7296D0) (attr smd) (fp_text reference L4 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 13 "Net-(C47-Pad2)") (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer F.Cu) (tedit 5CACA443) (tstamp 5C6A648B) (at 269.8115 163.2331 270) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5BCEDA59/5D720FFA) (attr smd) (fp_text reference L3 (at 0 -1.776 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 1.776 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -1.5 0.75) (end -1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.5 0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 270) (size 1 1) (layers F.Cu F.Paste F.Mask) (net 12 +1V8) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 270) (size 1 1) (layers F.Cu F.Paste F.Mask) (net 11 "Net-(C42-Pad2)") (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer B.Cu) (tedit 5CACA443) (tstamp 5C6A5EE1) (at 262.763 84.2772 90) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5BABAC65/5C648203) (attr smd) (fp_text reference L2 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 90) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 90) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 8 "Net-(C33-Pad2)") (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:INDC1608X65N (layer B.Cu) (tedit 5CACA443) (tstamp 5C70275A) (at 264.5918 80.6323 270) (descr "Chip Inductor, 2-Leads, EIA 0603, Metric 1608, Body 1.6x0.8mm, IPC Medium Density") (path /5BABAC65/5C6481DB) (attr smd) (fp_text reference L1 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value IND0603_MURATA_BLM18SG121TN1D (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.75 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 7 "Net-(C30-Pad2)") (solder_mask_margin 0.102)) (model INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/INDC1608X65N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:10029449-111RLF (layer F.Cu) (tedit 5CA4C061) (tstamp 5C8F6AE1) (at 286.7152 162.2298 90) (path /5C907554/5CAAC367/5CBF72F4) (attr smd) (fp_text reference J15 (at 9.8298 0.3048 180) (layer F.SilkS) (effects (font (size 2 2) (thickness 0.4))) ) (fp_text value 10029449-111RLF (at 0 3.556 90) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.254))) ) (fp_line (start -7.5 8.5) (end -7.5 6.9) (layer F.SilkS) (width 0.1016)) (fp_line (start -7.5 9.5) (end -7.5 8.5) (layer Dwgs.User) (width 0.1016)) (fp_line (start 7.5 8.5) (end 7.5 9.5) (layer Dwgs.User) (width 0.1016)) (fp_line (start 7.5 6.9) (end 7.5 8.5) (layer F.SilkS) (width 0.1016)) (fp_line (start -7.5 9.5) (end 7.5 9.5) (layer Dwgs.User) (width 0.1016)) (fp_line (start -7.5 5) (end -7.5 1.95) (layer F.SilkS) (width 0.1016)) (fp_line (start 7.5 5) (end 7.5 1.95) (layer F.SilkS) (width 0.1016)) (fp_line (start 5 0) (end 7.5 0) (layer F.SilkS) (width 0.1016)) (fp_line (start -7.5 0) (end -4.5 0) (layer F.SilkS) (width 0.1016)) (fp_line (start -7.5 8.5) (end 7.5 8.5) (layer F.SilkS) (width 0.1016)) (pad 20 thru_hole circle (at -7.85 5.95 90) (size 1.778 1.778) (drill 1.3) (layers *.Cu *.Mask) (net 1 GND)) (pad 20 thru_hole circle (at 7.85 5.95 90) (size 1.778 1.778) (drill 1.3) (layers *.Cu *.Mask) (net 1 GND)) (pad 20 thru_hole circle (at 7.25 1 90) (size 1.778 1.778) (drill 1.3) (layers *.Cu *.Mask) (net 1 GND)) (pad 20 thru_hole circle (at -7.25 1 90) (size 1.778 1.778) (drill 1.3) (layers *.Cu *.Mask) (net 1 GND)) (pad 2 smd rect (at 4.25 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 3 smd rect (at 3.75 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 119 /FPGA/FPGA_15_16/TMDS2_N)) (pad 4 smd rect (at 3.25 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 117 /FPGA/FPGA_15_16/TMDS1_P)) (pad 5 smd rect (at 2.75 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 6 smd rect (at 2.25 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 118 /FPGA/FPGA_15_16/TMDS1_N)) (pad 7 smd rect (at 1.75 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 120 /FPGA/FPGA_15_16/TMDS0_P)) (pad 8 smd rect (at 1.25 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 9 smd rect (at 0.75 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 123 /FPGA/FPGA_15_16/TMDS0_N)) (pad 10 smd rect (at 0.25 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 121 /FPGA/FPGA_15_16/TMDS_CLK_P)) (pad 11 smd rect (at -0.25 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 12 smd rect (at -0.75 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 122 /FPGA/FPGA_15_16/TMDS_CLK_N)) (pad 13 smd rect (at -1.25 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 740 "Net-(J15-Pad13)")) (pad 14 smd rect (at -1.75 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 741 "Net-(J15-Pad14)")) (pad 15 smd rect (at -2.25 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 200 "Net-(J15-Pad15)")) (pad 16 smd rect (at -2.75 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 199 "Net-(J15-Pad16)")) (pad 17 smd rect (at -3.25 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 18 smd rect (at -3.75 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 9 /FPGA/FPGA_15_16/HDMI_5V)) (pad 1 smd rect (at 4.75 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 116 /FPGA/FPGA_15_16/TMDS2_P)) (pad 19 smd rect (at -4.25 0 90) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask) (net 198 /FPGA/FPGA_15_16/HDMI_HPD)) (model footprints/conn.3dshapes/10029449-111RLF.wrl (offset (xyz 0 -1.168399982452393 3.301999950408935)) (scale (xyz 0.395 0.395 0.395)) (rotate (xyz 270 0 0)) ) (model "C:/Users/Micha/Desktop/Projekty/AMC FMC/import z altiuma/10029449-111RLF.stp" (offset (xyz 0 -2.7 3.5)) (scale (xyz 1 1 1)) (rotate (xyz 180 0 0)) ) ) (module Marble:BELFUSE_0826-1X1T-80-F (layer F.Cu) (tedit 5C9C9418) (tstamp 5C8F5993) (at 274.7264 186.4868 270) (descr "1 Port, Orange Green/Yellow LEDs, RJ45 1000BaseT, PoE, Gigabit MagJack® Connector Module") (path /5BCEDA59/5DB81DF6) (fp_text reference J4 (at -0.3048 6.3754 90) (layer F.SilkS) (effects (font (size 2 2) (thickness 0.4))) ) (fp_text value BELFUSE_0826-1X1T-HS-F (at 0 6.166 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 5.075 -1.27) (end 5.525 -1.27) (layer Cmts.User) (width 0.1)) (fp_circle (center -5.59 -8.38) (end -5.14 -8.38) (layer Cmts.User) (width 0.1)) (fp_circle (center 5.59 -8.38) (end 6.04 -8.38) (layer Cmts.User) (width 0.1)) (fp_circle (center 6.095 1.27) (end 6.545 1.27) (layer Cmts.User) (width 0.1)) (fp_circle (center 6.095 3.81) (end 6.595 3.81) (layer Cmts.User) (width 0.1)) (fp_circle (center -6.095 3.81) (end -5.595 3.81) (layer Cmts.User) (width 0.1)) (fp_circle (center 6.095 1.27) (end 6.895 1.27) (layer Cmts.User) (width 0.1)) (fp_circle (center 3.555 3.81) (end 4.455 3.81) (layer Cmts.User) (width 0.1)) (fp_circle (center -3.555 3.81) (end -2.655 3.81) (layer Cmts.User) (width 0.1)) (fp_circle (center -6.095 3.81) (end -5.195 3.81) (layer Cmts.User) (width 0.1)) (fp_circle (center 6.095 3.81) (end 6.995 3.81) (layer Cmts.User) (width 0.1)) (fp_circle (center 8.065 -19.68) (end 8.85 -19.68) (layer Cmts.User) (width 0.1)) (fp_circle (center -8.065 -19.68) (end -7.28 -19.68) (layer Cmts.User) (width 0.1)) (fp_circle (center -6.35 -16.51) (end -4.725 -16.51) (layer Cmts.User) (width 0.1)) (fp_circle (center 6.35 -16.51) (end 7.975 -16.51) (layer Cmts.User) (width 0.1)) (fp_line (start 8.15 -21.233) (end 8.15 -27.435) (layer F.SilkS) (width 0.2)) (fp_line (start -8.15 2.765) (end -8.15 -15.638) (layer F.SilkS) (width 0.2)) (fp_line (start -8.15 -27.435) (end 8.15 -27.435) (layer F.SilkS) (width 0.2)) (fp_line (start 7.95 4.465) (end 7.95 2.765) (layer F.SilkS) (width 0.2)) (fp_line (start 7.101 4.465) (end 7.95 4.465) (layer F.SilkS) (width 0.2)) (fp_line (start -2.549 4.465) (end 2.55 4.465) (layer F.SilkS) (width 0.2)) (fp_line (start -7.95 4.465) (end -7.1 4.465) (layer F.SilkS) (width 0.2)) (fp_line (start -7.95 4.465) (end -7.95 2.765) (layer F.SilkS) (width 0.2)) (fp_line (start 6.685 2.765) (end 8.15 2.765) (layer F.SilkS) (width 0.2)) (fp_line (start 2.826 5.065) (end 6.826 5.065) (layer F.SilkS) (width 0.2)) (fp_line (start 2.826 5.065) (end 2.826 4.763) (layer F.SilkS) (width 0.2)) (fp_line (start -6.826 5.065) (end -2.826 5.065) (layer F.SilkS) (width 0.2)) (fp_line (start -6.826 5.065) (end -6.826 4.762) (layer F.SilkS) (width 0.2)) (fp_line (start 6.12 -20.222) (end 6.3 -27.435) (layer F.SilkS) (width 0.2)) (fp_line (start 3.3 -27.435) (end 3.48 -20.222) (layer F.SilkS) (width 0.2)) (fp_line (start 3.8 -27.435) (end 3.981 -20.201) (layer F.SilkS) (width 0.2)) (fp_line (start 5.619 -20.222) (end 5.8 -27.435) (layer F.SilkS) (width 0.2)) (fp_line (start -6.3 -27.435) (end -6.12 -20.222) (layer F.SilkS) (width 0.2)) (fp_line 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6 -27.435) (end 6.5 -27.435) (angle -90) (layer F.SilkS) (width 0.2)) (fp_arc (start 4.5 -27.435) (end 4.5 -27.935) (angle -90) (layer F.SilkS) (width 0.2)) (fp_arc (start -4.8 -20.222) (end -6.12 -20.222) (angle -180) (layer F.SilkS) (width 0.2)) (fp_arc (start -4.8 -20.222) (end -5.619 -20.222) (angle -179) (layer F.SilkS) (width 0.2)) (fp_arc (start 4.8 -20.222) (end 3.48 -20.222) (angle -180) (layer F.SilkS) (width 0.2)) (fp_arc (start 4.8 -20.222) (end 3.981 -20.201) (angle -179) (layer F.SilkS) (width 0.2)) (pad 14 thru_hole circle (at 5.59 -8.38 270) (size 1.2 1.2) (drill 0.6) (layers *.Cu *.Mask) (net 113 /ETH_PHY/POE_VC2) (solder_mask_margin 0.102)) (pad 16 thru_hole circle (at 5.59 -9.87 270) (size 1.2 1.2) (drill 0.6) (layers *.Cu *.Mask) (net 115 /ETH_PHY/POE_VC4) (solder_mask_margin 0.102)) (pad 13 thru_hole circle (at -5.59 -8.38 270) (size 1.2 1.2) (drill 0.6) (layers *.Cu *.Mask) (net 112 /ETH_PHY/POE_VC1) (solder_mask_margin 0.102)) (pad 15 thru_hole circle (at -5.59 -9.87 270) (size 1.2 1.2) (drill 0.6) (layers *.Cu *.Mask) (net 114 /ETH_PHY/POE_VC3) (solder_mask_margin 0.102)) (pad 9 thru_hole circle (at -2.035 1.27 270) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 644 /ETH_PHY/MDI3_N) (solder_mask_margin 0.102)) (pad 8 thru_hole circle (at -4.065 1.27 270) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 645 /ETH_PHY/MDI3_P) (solder_mask_margin 0.102)) (pad 7 thru_hole circle (at -6.095 1.27 270) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 15 "Net-(C58-Pad1)") (solder_mask_margin 0.102)) (pad 1 thru_hole circle (at -5.075 -1.27 270) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 16 "Net-(C59-Pad1)") (solder_mask_margin 0.102)) (pad 2 thru_hole circle (at -3.045 -1.27 270) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 646 /ETH_PHY/MDI2_N) (solder_mask_margin 0.102)) (pad 3 thru_hole circle (at -1.015 -1.27 270) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 647 /ETH_PHY/MDI2_P) (solder_mask_margin 0.102)) (pad 21 thru_hole circle (at -8.065 -19.685 270) (size 2.3 2.3) (drill 1.6) (layers *.Cu *.Mask) (net 657 "Net-(J4-Pad21)") (solder_mask_margin 0.102)) (pad 4 thru_hole circle (at 1.016 -1.27 270) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 648 /ETH_PHY/MDI1_P) (solder_mask_margin 0.102)) (pad 5 thru_hole circle (at 3.048 -1.27 270) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 649 /ETH_PHY/MDI1_N) (solder_mask_margin 0.102)) (pad 6 thru_hole circle (at 5.08 -1.27 270) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 17 "Net-(C60-Pad1)") (solder_mask_margin 0.102)) (pad 10 thru_hole circle (at 2.032 1.27 270) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 650 /ETH_PHY/MDI0_N) (solder_mask_margin 0.102)) (pad 11 thru_hole circle (at 4.064 1.27 270) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 651 /ETH_PHY/MDI0_P) (solder_mask_margin 0.102)) (pad 12 thru_hole circle (at 6.096 1.27 270) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 102 "Net-(C352-Pad1)") (solder_mask_margin 0.102)) (pad 17 thru_hole circle (at -6.096 3.81 270) (size 1.8 1.8) (drill 1.1) (layers *.Cu *.Mask) (net 145 "Net-(J4-Pad17)") (solder_mask_margin 0.102)) (pad 18 thru_hole circle (at -3.556 3.81 270) (size 1.8 1.8) (drill 1.1) (layers *.Cu *.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 19 thru_hole circle (at 3.556 3.81 270) (size 1.8 1.8) (drill 1.1) (layers *.Cu *.Mask) (net 144 "Net-(J4-Pad19)") (solder_mask_margin 0.102)) (pad 20 thru_hole circle (at 6.096 3.81 270) (size 1.8 1.8) (drill 1.1) (layers *.Cu *.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 22 thru_hole circle (at 8.065 -19.685 270) (size 2.3 2.3) (drill 1.6) (layers *.Cu *.Mask) (net 657 "Net-(J4-Pad21)") (solder_mask_margin 0.102)) (pad "" np_thru_hole circle (at -6.35 -16.51 270) (size 3.25 3.25) (drill 3.25) (layers *.Cu *.Mask)) (pad "" np_thru_hole circle (at 6.35 -16.51 270) (size 3.25 3.25) (drill 3.25) (layers *.Cu *.Mask)) (model ${CERN}/BELFUSE_0826-1X1T-80-F.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SOT190P230X110-4N (layer B.Cu) (tedit 5CACBDBC) (tstamp 5CD48418) (at 131.2164 116.3828 90) (descr "SOT143, SOT, 1.90mm Pitch; 4 Pin, 1.30mm W X 2.90mm L X 1.10mm H body, IPC Medium Density") (path /5C16C03C/5E04F663) (attr smd) (fp_text reference D13 (at 0 3.001 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value PRTR5V0U2X (at 0 -2.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.4 1.75) (end -1.275 1.75) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.325 -1.45) (end 0.325 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.325 -1.45) (end 0.325 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.325 1.45) (end 0.325 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.325 -1.45) (end -0.325 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.65 1.35) (end -0.55 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.25) (end -0.45 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.15) (end -0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.05) (end -0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.95) (end -0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.85) (end -0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.75) (end 0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.65) (end 0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.55) (end 0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.45) (end 0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end 0.65 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end -0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -1.9 -1.75) (end 1.9 -1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.9 -1.75) (end 1.9 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.9 1.75) (end 1.9 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.9 -1.75) (end -1.9 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 4 smd rect (at 1.15 0.95 90) (size 1 0.6) (layers B.Cu B.Paste B.Mask) (net 124 "Net-(D13-Pad4)") (solder_mask_margin 0.102)) (pad 3 smd rect (at 1.15 -0.95 90) (size 1 0.6) (layers B.Cu B.Paste B.Mask) (net 125 /USB/USB_D_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.15 -0.95 90) (size 1 0.6) (layers B.Cu B.Paste B.Mask) (net 126 /USB/USB_D_N) (solder_mask_margin 0.102)) (pad 1 smd rect (at -1.15 0.75) (size 1 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/SOT95P280X110-5N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 180)) ) ) (module Marble:DIOM5127X229N (layer F.Cu) (tedit 5CACB642) (tstamp 5C6A1B41) (at 224.0788 206.502 90) (descr "DO-214-AC/SMA Molded Diode, 2-Leads, Body 5.1x2.7mm, IPC Medium Density") (path /5C16BF8E/5CEB9676) (attr smd) (fp_text reference D12 (at -5.588 0.2032 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value SS16 (at 0 2.676 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -3.3 -1.325) (end -3.175 -1.325) (layer F.SilkS) (width 0.25)) (fp_line (start 2.65 1.4) (end 2.65 1.175) (layer F.SilkS) (width 0.2)) (fp_line (start -2.65 1.4) (end -2.65 1.175) (layer F.SilkS) (width 0.2)) (fp_line (start 2.65 -1.175) (end 2.65 -1.4) (layer F.SilkS) (width 0.2)) (fp_line (start -2.65 -1.175) (end -2.65 -1.4) (layer F.SilkS) (width 0.2)) (fp_line (start -2.65 1.4) (end 2.65 1.4) (layer F.SilkS) (width 0.2)) (fp_line (start -2.65 -1.4) (end 2.65 -1.4) (layer F.SilkS) (width 0.2)) (fp_line (start -2.64 1.395) (end 2.64 1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.64 -1.395) (end 2.64 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start 2.64 1.395) (end 2.64 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.64 1.395) (end -2.64 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -1.93 1.395) (end -1.93 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.025 1.395) (end -2.025 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.1 1.395) (end -2.1 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.175 1.395) (end -2.175 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.25 1.395) (end -2.25 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.325 1.395) (end -2.325 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.4 1.395) (end -2.4 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.475 1.395) (end -2.475 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.525 1.395) (end -2.525 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.6 1.395) (end -2.6 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start -3.4 1.65) (end 3.4 1.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.4 -1.65) (end 3.4 -1.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.4 1.65) (end 3.4 -1.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.4 1.65) (end -3.4 -1.65) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -2.05 0 180) (size 1.55 2.2) (layers F.Cu F.Paste F.Mask) (net 32 "Net-(C129-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 2.05 0 180) (size 1.55 2.2) (layers F.Cu F.Paste F.Mask) (net 101 "Net-(C350-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/DIOM5127X229N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SOT95P280X145-6N (layer B.Cu) (tedit 5CACBA0D) (tstamp 5C9C0637) (at 281.5082 162.3822 270) (descr "SOT23, 6-Leads, Body 1.6x3.0mm, Pitch 0.95mm, IPC Medium Density") (path /5C907554/5CAAC367/5C854FB3) (attr smd) (fp_text reference D11 (at 0 3.051 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value HDMIULC6-4SC6 (at 0 -2.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.65 1.8) (end -1.525 1.8) (layer B.SilkS) (width 0.25)) (fp_line (start 0.45 -1.55) (end 0.45 1.55) (layer B.SilkS) (width 0.2)) (fp_line (start -0.45 -1.55) (end -0.45 1.55) (layer B.SilkS) (width 0.2)) (fp_line (start -0.45 -1.55) (end 0.45 -1.55) (layer B.SilkS) (width 0.2)) (fp_line (start -0.45 1.55) (end 0.45 1.55) (layer B.SilkS) (width 0.2)) (fp_line (start -0.875 -1.525) (end 0.875 -1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 1.525) (end 0.875 1.525) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -1.525) (end 0.875 1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -1.525) (end -0.875 1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 1.425) (end -0.775 1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 1.325) (end -0.675 1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 1.225) (end -0.575 1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 1.125) (end -0.475 1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 1.025) (end -0.375 1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.925) (end -0.275 1.525) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start -2.15 -1.8) (end 2.15 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.15 -1.8) (end 2.15 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.15 1.8) (end 2.15 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.15 -1.8) (end -2.15 1.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.35 0.95 180) (size 0.6 1.05) (layers B.Cu B.Paste B.Mask) (net 120 /FPGA/FPGA_15_16/TMDS0_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.35 0 180) (size 0.6 1.05) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at -1.35 -0.95 180) (size 0.6 1.05) (layers B.Cu B.Paste B.Mask) (net 121 /FPGA/FPGA_15_16/TMDS_CLK_P) (solder_mask_margin 0.102)) (pad 4 smd rect (at 1.35 -0.95 180) (size 0.6 1.05) (layers B.Cu B.Paste B.Mask) (net 122 /FPGA/FPGA_15_16/TMDS_CLK_N) (solder_mask_margin 0.102)) (pad 5 smd rect (at 1.35 0 180) (size 0.6 1.05) (layers B.Cu B.Paste B.Mask) (net 734 "Net-(D11-Pad5)") (solder_mask_margin 0.102)) (pad 6 smd rect (at 1.35 0.95 180) (size 0.6 1.05) (layers B.Cu B.Paste B.Mask) (net 123 /FPGA/FPGA_15_16/TMDS0_N) (solder_mask_margin 0.102)) (model ${CERN}/SOT95P280X145-6N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:SOT95P280X145-6N (layer B.Cu) (tedit 5CACBA0D) (tstamp 5C8F67BE) (at 281.5082 157.8864 270) (descr "SOT23, 6-Leads, Body 1.6x3.0mm, Pitch 0.95mm, IPC Medium Density") (path /5C907554/5CAAC367/5C7A684D) (attr smd) (fp_text reference D10 (at 0 3.051 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value HDMIULC6-4SC6 (at 0 -2.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.65 1.8) (end -1.525 1.8) (layer B.SilkS) (width 0.25)) (fp_line (start 0.45 -1.55) (end 0.45 1.55) (layer B.SilkS) (width 0.2)) (fp_line (start -0.45 -1.55) (end -0.45 1.55) (layer B.SilkS) (width 0.2)) (fp_line (start -0.45 -1.55) (end 0.45 -1.55) (layer B.SilkS) (width 0.2)) (fp_line (start -0.45 1.55) (end 0.45 1.55) (layer B.SilkS) (width 0.2)) (fp_line (start -0.875 -1.525) (end 0.875 -1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 1.525) (end 0.875 1.525) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -1.525) (end 0.875 1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -1.525) (end -0.875 1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 1.425) (end -0.775 1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 1.325) (end -0.675 1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 1.225) (end -0.575 1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 1.125) (end -0.475 1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 1.025) (end -0.375 1.525) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.925) (end -0.275 1.525) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start -2.15 -1.8) (end 2.15 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.15 -1.8) (end 2.15 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.15 1.8) (end 2.15 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.15 -1.8) (end -2.15 1.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.35 0.95 180) (size 0.6 1.05) (layers B.Cu B.Paste B.Mask) (net 117 /FPGA/FPGA_15_16/TMDS1_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.35 0 180) (size 0.6 1.05) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at -1.35 -0.95 180) (size 0.6 1.05) (layers B.Cu B.Paste B.Mask) (net 116 /FPGA/FPGA_15_16/TMDS2_P) (solder_mask_margin 0.102)) (pad 4 smd rect (at 1.35 -0.95 180) (size 0.6 1.05) (layers B.Cu B.Paste B.Mask) (net 119 /FPGA/FPGA_15_16/TMDS2_N) (solder_mask_margin 0.102)) (pad 5 smd rect (at 1.35 0 180) (size 0.6 1.05) (layers B.Cu B.Paste B.Mask) (net 733 "Net-(D10-Pad5)") (solder_mask_margin 0.102)) (pad 6 smd rect (at 1.35 0.95 180) (size 0.6 1.05) (layers B.Cu B.Paste B.Mask) (net 118 /FPGA/FPGA_15_16/TMDS1_N) (solder_mask_margin 0.102)) (model ${CERN}/SOT95P280X145-6N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:DIOM5127X229N (layer F.Cu) (tedit 5CACB642) (tstamp 5C6A1A00) (at 267.44422 199.33158) (descr "DO-214-AC/SMA Molded Diode, 2-Leads, Body 5.1x2.7mm, IPC Medium Density") (path /5C16BF8E/5CE9B513) (attr smd) (fp_text reference D4 (at -5.588 0.2032) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value SS16 (at 0 2.676) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -3.3 -1.325) (end -3.175 -1.325) (layer F.SilkS) (width 0.25)) (fp_line (start 2.65 1.4) (end 2.65 1.175) (layer F.SilkS) (width 0.2)) (fp_line (start -2.65 1.4) (end -2.65 1.175) (layer F.SilkS) (width 0.2)) (fp_line (start 2.65 -1.175) (end 2.65 -1.4) (layer F.SilkS) (width 0.2)) (fp_line (start -2.65 -1.175) (end -2.65 -1.4) (layer F.SilkS) (width 0.2)) (fp_line (start -2.65 1.4) (end 2.65 1.4) (layer F.SilkS) (width 0.2)) (fp_line (start -2.65 -1.4) (end 2.65 -1.4) (layer F.SilkS) (width 0.2)) (fp_line (start -2.64 1.395) (end 2.64 1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.64 -1.395) (end 2.64 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start 2.64 1.395) (end 2.64 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.64 1.395) (end -2.64 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -1.93 1.395) (end -1.93 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.025 1.395) (end -2.025 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.1 1.395) (end -2.1 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.175 1.395) (end -2.175 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.25 1.395) (end -2.25 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.325 1.395) (end -2.325 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.4 1.395) (end -2.4 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.475 1.395) (end -2.475 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.525 1.395) (end -2.525 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.6 1.395) (end -2.6 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start -3.4 1.65) (end 3.4 1.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.4 -1.65) (end 3.4 -1.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.4 1.65) (end 3.4 -1.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.4 1.65) (end -3.4 -1.65) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -2.05 0 90) (size 1.55 2.2) (layers F.Cu F.Paste F.Mask) (net 32 "Net-(C129-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 2.05 0 90) (size 1.55 2.2) (layers F.Cu F.Paste F.Mask) (net 31 "Net-(C128-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/DIOM5127X229N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:DIOM5127X229N (layer F.Cu) (tedit 5CACB642) (tstamp 5C6A19C0) (at 280.924 72.0852) (descr "DO-214-AC/SMA Molded Diode, 2-Leads, Body 5.1x2.7mm, IPC Medium Density") (path /5BD320D5/5CAB1052) (attr smd) (fp_text reference D1 (at -5.588 0.2032) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value SS16 (at 0 2.676) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -3.3 -1.325) (end -3.175 -1.325) (layer F.SilkS) (width 0.25)) (fp_line (start 2.65 1.4) (end 2.65 1.175) (layer F.SilkS) (width 0.2)) (fp_line (start -2.65 1.4) (end -2.65 1.175) (layer F.SilkS) (width 0.2)) (fp_line (start 2.65 -1.175) (end 2.65 -1.4) (layer F.SilkS) (width 0.2)) (fp_line (start -2.65 -1.175) (end -2.65 -1.4) (layer F.SilkS) (width 0.2)) (fp_line (start -2.65 1.4) (end 2.65 1.4) (layer F.SilkS) (width 0.2)) (fp_line (start -2.65 -1.4) (end 2.65 -1.4) (layer F.SilkS) (width 0.2)) (fp_line (start -2.64 1.395) (end 2.64 1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.64 -1.395) (end 2.64 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start 2.64 1.395) (end 2.64 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.64 1.395) (end -2.64 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -1.93 1.395) (end -1.93 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.025 1.395) (end -2.025 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.1 1.395) (end -2.1 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.175 1.395) (end -2.175 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.25 1.395) (end -2.25 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.325 1.395) (end -2.325 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.4 1.395) (end -2.4 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.475 1.395) (end -2.475 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.525 1.395) (end -2.525 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start -2.6 1.395) (end -2.6 -1.395) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start -3.4 1.65) (end 3.4 1.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.4 -1.65) (end 3.4 -1.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.4 1.65) (end 3.4 -1.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.4 1.65) (end -3.4 -1.65) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -2.05 0 90) (size 1.55 2.2) (layers F.Cu F.Paste F.Mask) (net 105 /AMC_connector/PS0#) (solder_mask_margin 0.102)) (pad 2 smd rect (at 2.05 0 90) (size 1.55 2.2) (layers F.Cu F.Paste F.Mask) (net 106 /AMC_connector/PS1#) (solder_mask_margin 0.102)) (model ${CERN}/DIOM5127X229N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5CFE9BDA) (at 262.0264 137.8966 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5D20C95D) (attr smd) (fp_text reference C379 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 714 /FPGA/FPGA_MGT/EXT_CLK_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 67 /FPGA/FPGA_MGT/MGT_CLK_1_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5CFE9BCC) (at 262.0264 137.16 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5D1FB2CF) (attr smd) (fp_text reference C378 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 713 /FPGA/FPGA_MGT/EXT_CLK_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 65 /FPGA/FPGA_MGT/MGT_CLK_1_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5CFA7804) (at 267.4366 141.1224 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5CAAC367/5E258510) (attr smd) (fp_text reference C377 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5CF7AA78) (at 267.462 138.049 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5CAAC367/5DAF90BD) (attr smd) (fp_text reference C376 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5CE0F384) (at 281.7368 171.1452) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5BCEDA59/5CF58B53) (attr smd) (fp_text reference C375 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_100PF_50V_5%_C0G (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 698 "Net-(C374-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5CE0F374) (at 283.464 169.9768) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5BCEDA59/5CF72214) (attr smd) (fp_text reference C374 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_100PF_50V_5%_C0G (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 27 /ETH_PHY/CLK_25MHZ) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 698 "Net-(C374-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5CE306BF) (at 224.7392 116.3066 180) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5BD32060/5DA50D23) (attr smd) (fp_text reference C373 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 90) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 90) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5CE306AE) (at 236.982 111.8362) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5D9D6F97) (attr smd) (fp_text reference C372 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5CE306A0) (at 238.2774 120.9294 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5D9A9271) (attr smd) (fp_text reference C371 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5CE06270) (at 241.7572 114.427 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5D01F6B1) (attr smd) (fp_text reference C370 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5CD803E5) (at 226.6442 120.0912 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5CDF4335) (attr smd) (fp_text reference C369 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5CD803D7) (at 229.0826 108.4524 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5CDF41A3) (attr smd) (fp_text reference C368 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5CD803C9) (at 237.3884 111.0488 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5CDF3F35) (attr smd) (fp_text reference C367 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5CD803BB) (at 237.0328 116.1796 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5CDF3D77) (attr smd) (fp_text reference C366 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5CD803AD) (at 234.7722 108.331 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5CDF0D93) (attr smd) (fp_text reference C365 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5CE061E0) (at 241.3254 116.0272) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5BD32060/5D097270) (attr smd) (fp_text reference C364 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 270) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 270) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer F.Cu) (tedit 5CAC9F75) (tstamp 5CD9D939) (at 238.633 191.9224 180) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D09E04F) (attr smd) (fp_text reference C363 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.9 0.45) (end -0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start 0.9 0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 180) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 180) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 691 +5V) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer F.Cu) (tedit 5CAC9F75) (tstamp 5CD7399D) (at 241.0206 191.4144 270) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D042ACD) (attr smd) (fp_text reference C362 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.9 0.45) (end -0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start 0.9 0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 270) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 270) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 692 "Net-(C144-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer F.Cu) (tedit 5CACA05C) (tstamp 5CD4681E) (at 248.92 180.7972) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5CF2125F) (attr smd) (fp_text reference C361 (at 0 -1.776) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 1.776) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer F.Fab) (width 0.1)) (fp_line (start 0.825 0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end -0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.5 0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end -1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 90) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 90) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 692 "Net-(C144-Pad1)") (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5CA5AC1B) (at 138.8364 143.4726 90) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16C03C/5D0A6F51) (attr smd) (fp_text reference C360 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 670 "Net-(C360-Pad1)") (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C619DC7) (at 164.1348 154.178 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CA40231/5CDD667C) (attr smd) (fp_text reference C359 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C619DB7) (at 164.2364 148.0566 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CA40231/5CDD6461) (attr smd) (fp_text reference C358 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C6A115F) (at 283.591 139.8524 270) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF8E/5CDE0828) (attr smd) (fp_text reference C357 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 270) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 693 "Net-(C357-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 270) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 464 +12V_AMC) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C5B4F40) (at 162.052 119.126) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5C94B676) (attr smd) (fp_text reference C356 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C5B4F30) (at 160.528 119.126 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5C94B64A) (attr smd) (fp_text reference C355 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPR500-250X720X650 (layer F.Cu) (tedit 5C6180A3) (tstamp 5C8F543F) (at 262.5598 184.3532 180) (descr "Capacitor Radial, Pin spacing 5.0mm - Body With 2.5mm X Body Length 7.2mm X Body Height 6.5mm") (path /5C16BF8E/5D583070) (fp_text reference C354 (at 5.9436 0.127) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CPER_4.7NF_400V_5%_500-250X720X650 (at 0 2.351) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -3.6 1.25) (end 3.6 1.25) (layer F.Fab) (width 0.1)) (fp_line (start 3.6 1.25) (end 3.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -3.6 -1.25) (end 3.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -3.6 1.25) (end -3.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -3.6 1.25) (end -3.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -3.6 1.25) (end 3.6 1.25) (layer F.Fab) (width 0.1)) (fp_line (start 3.6 1.25) (end 3.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -3.6 -1.25) (end 3.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -3.6 -1.25) (end 3.6 -1.25) (layer F.SilkS) (width 0.2)) (fp_line (start -3.6 1.25) (end 3.6 1.25) (layer F.SilkS) (width 0.2)) (fp_line (start 3.6 1.25) (end 3.6 -1.25) (layer F.SilkS) (width 0.2)) (fp_line (start -3.6 1.25) (end -3.6 -1.25) (layer F.SilkS) (width 0.2)) (pad 1 thru_hole circle (at -2.5 0 180) (size 1.5 1.5) (drill 0.8) (layers *.Cu *.Mask) (net 104 "Net-(C354-Pad1)") (solder_mask_margin 0.102)) (pad 2 thru_hole circle (at 2.5 0 180) (size 1.5 1.5) (drill 0.8) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPR500-250X720X650.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPR500-250X720X650 (layer F.Cu) (tedit 5C6180A3) (tstamp 5C8F531F) (at 262.509 187.1218 180) (descr "Capacitor Radial, Pin spacing 5.0mm - Body With 2.5mm X Body Length 7.2mm X Body Height 6.5mm") (path /5C16BF8E/5D545FF8) (fp_text reference C353 (at 5.9436 0.127) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CPER_4.7NF_400V_5%_500-250X720X650 (at 0 2.351) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -3.6 1.25) (end 3.6 1.25) (layer F.Fab) (width 0.1)) (fp_line (start 3.6 1.25) (end 3.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -3.6 -1.25) (end 3.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -3.6 1.25) (end -3.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -3.6 1.25) (end -3.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -3.6 1.25) (end 3.6 1.25) (layer F.Fab) (width 0.1)) (fp_line (start 3.6 1.25) (end 3.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -3.6 -1.25) (end 3.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -3.6 -1.25) (end 3.6 -1.25) (layer F.SilkS) (width 0.2)) (fp_line (start -3.6 1.25) (end 3.6 1.25) (layer F.SilkS) (width 0.2)) (fp_line (start 3.6 1.25) (end 3.6 -1.25) (layer F.SilkS) (width 0.2)) (fp_line (start -3.6 1.25) (end -3.6 -1.25) (layer F.SilkS) (width 0.2)) (pad 1 thru_hole circle (at -2.5 0 180) (size 1.5 1.5) (drill 0.8) (layers *.Cu *.Mask) (net 103 "Net-(C353-Pad1)") (solder_mask_margin 0.102)) (pad 2 thru_hole circle (at 2.5 0 180) (size 1.5 1.5) (drill 0.8) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPR500-250X720X650.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A112B) (at 274 194.4) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C99244D) (attr smd) (fp_text reference C352 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 102 "Net-(C352-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5CA1BC91) (at 181.3814 129.159 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF8E/5CB310B2) (attr smd) (fp_text reference C351 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPAE830X1020N (layer F.Cu) (tedit 5CACBD98) (tstamp 5C6A110B) (at 233.1466 197.9168 180) (descr "Capacitor, Aluminium Electrolytric, 8.3mm L X 8.3mm W X 10.2mm H, IPC Medium Density") (path /5C16BF8E/5DFD5432) (attr smd) (fp_text reference C350 (at 0 -5.676) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CAE830-1020_470UF_16V_20% (at 0 5.676) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -4.775 -1.45) (end -4.65 -1.45) (layer F.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 4 0) (layer F.Fab) (width 0.1)) (fp_circle (center -4.775 -1.45) (end -4.65 -1.45) (layer F.Fab) (width 0.25)) (fp_line (start -4.15 2.15) (end -2.15 4.15) (layer F.SilkS) (width 0.2)) (fp_line (start -4.15 -2.15) (end -2.15 -4.15) (layer F.SilkS) (width 0.2)) (fp_line (start -4.15 2.15) (end -4.15 1.15) (layer F.SilkS) (width 0.2)) (fp_line (start -4.15 -1.15) (end -4.15 -2.15) (layer F.SilkS) (width 0.2)) (fp_line (start -2.15 4.15) (end 4.15 4.15) (layer F.SilkS) (width 0.2)) (fp_line (start -2.15 -4.15) (end 4.15 -4.15) (layer F.SilkS) (width 0.2)) (fp_line (start 4.15 4.15) (end 4.15 1.15) (layer F.SilkS) (width 0.2)) (fp_line (start 4.15 -1.25) (end 4.15 -4.15) (layer F.SilkS) (width 0.2)) (fp_line (start -2.15 -4.15) (end 4.15 -4.15) (layer F.Fab) (width 0.1)) (fp_line (start 4.15 4.15) (end 4.15 -4.15) (layer F.Fab) (width 0.1)) (fp_line (start -2.15 4.15) (end 4.15 4.15) (layer F.Fab) (width 0.1)) (fp_line (start -4.15 2.15) (end -4.15 -2.15) (layer F.Fab) (width 0.1)) (fp_line (start -4.15 -2.15) (end -2.15 -4.15) (layer F.Fab) (width 0.1)) (fp_line (start -4.15 2.15) (end -2.15 4.15) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -6.4 4.65) (end 6.4 4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -6.4 -4.65) (end 6.4 -4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 6.4 4.65) (end 6.4 -4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -6.4 4.65) (end -6.4 -4.65) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -3.7 0 180) (size 4.4 1.8) (layers F.Cu F.Paste F.Mask) (net 101 "Net-(C350-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 3.7 0 180) (size 4.4 1.8) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPAE830X1020N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer F.Cu) (tedit 5CACA05C) (tstamp 5C6A10EE) (at 264.4902 165.8366) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D519966) (attr smd) (fp_text reference C349 (at 0 -1.776) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 1.776) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer F.Fab) (width 0.1)) (fp_line (start 0.825 0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end -0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.5 0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end -1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 90) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 90) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 48 /Power/Power_SW/XR77129ILB_F_VOUT4) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer F.Cu) (tedit 5CACA05C) (tstamp 5C6A10DD) (at 254.4064 165.7858) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D4F0D75) (attr smd) (fp_text reference C348 (at 0 -1.776) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 1.776) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer F.Fab) (width 0.1)) (fp_line (start 0.825 0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end -0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.5 0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end -1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 90) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 90) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 47 /Power/Power_SW/XR77129ILB_F_VOUT3) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer F.Cu) (tedit 5CACA05C) (tstamp 5C6A10CC) (at 229.87 168.1988 90) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D4C7FD6) (attr smd) (fp_text reference C347 (at 0 -1.776 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 1.776 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer F.Fab) (width 0.1)) (fp_line (start 0.825 0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end -0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.5 0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end -1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 180) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 180) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 46 /Power/Power_SW/XR77129ILB_F_VOUT2) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X140N (layer F.Cu) (tedit 5CACA3C4) (tstamp 5C6A10BB) (at 226.441 177.292 90) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D35966D) (attr smd) (fp_text reference C346 (at 0 -2.026 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_47UF_6.3V_20%_X5R (at 0 2.026 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.05 0.675) (end 1.05 0.675) (layer F.Fab) (width 0.1)) (fp_line (start 1.05 0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 -0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 0.675) (end -1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.75 1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end -1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (pad 1 smd rect (at -0.9 0 180) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 45 /Power/Power_SW/XR77129ILB_F_VOUT1) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.9 0 180) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X140N (layer F.Cu) (tedit 5CACA3C4) (tstamp 5C6A10AA) (at 258.5974 163.322 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D34585E) (attr smd) (fp_text reference C345 (at 0 -2.026) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_47UF_6.3V_20%_X5R (at 0 2.026) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.05 0.675) (end 1.05 0.675) (layer F.Fab) (width 0.1)) (fp_line (start 1.05 0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 -0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 0.675) (end -1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.75 1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end -1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (pad 1 smd rect (at -0.9 0 270) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 48 /Power/Power_SW/XR77129ILB_F_VOUT4) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.9 0 270) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5C6A1099) (at 210.439 198.2978 270) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5D05A99E/5D044AE9) (attr smd) (fp_text reference C344 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 180) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 180) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5C6A1088) (at 216.3191 197.9676 270) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5D05A99E/5D041D3E) (attr smd) (fp_text reference C343 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 180) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 180) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768B43) (at 174.492763 89.654609 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5D62BB20) (attr smd) (fp_text reference C342 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X140N (layer F.Cu) (tedit 5CACA3C4) (tstamp 5C6A1067) (at 258.5974 165.7096 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D331A4A) (attr smd) (fp_text reference C341 (at 0 -2.026) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_47UF_6.3V_20%_X5R (at 0 2.026) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.05 0.675) (end 1.05 0.675) (layer F.Fab) (width 0.1)) (fp_line (start 1.05 0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 -0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 0.675) (end -1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.75 1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end -1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (pad 1 smd rect (at -0.9 0 270) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 48 /Power/Power_SW/XR77129ILB_F_VOUT4) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.9 0 270) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X140N (layer F.Cu) (tedit 5CACA3C4) (tstamp 5C6A1056) (at 258.6482 167.9956 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D7C1AB5) (attr smd) (fp_text reference C340 (at 0 -2.026) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_47UF_6.3V_20%_X5R (at 0 2.026) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.05 0.675) (end 1.05 0.675) (layer F.Fab) (width 0.1)) (fp_line (start 1.05 0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 -0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 0.675) (end -1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.75 1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end -1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (pad 1 smd rect (at -0.9 0 270) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 48 /Power/Power_SW/XR77129ILB_F_VOUT4) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.9 0 270) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768B13) (at 239.9538 152.4889) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E8EEBAF) (attr smd) (fp_text reference C339 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768B03) (at 236.0112 136.4742 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E8CB6D2) (attr smd) (fp_text reference C338 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768AF3) (at 240.9444 151.511 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E93554B) (attr smd) (fp_text reference C337 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768AE3) (at 235.4072 134.016 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E8A8208) (attr smd) (fp_text reference C336 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768AD3) (at 239.0394 145.5039 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E958A20) (attr smd) (fp_text reference C335 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768AC3) (at 238.4298 132.969 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E884D3B) (attr smd) (fp_text reference C334 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C9F162F) (at 245.0084 147.4978) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E97BEF6) (attr smd) (fp_text reference C333 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768AA3) (at 231.33812 129.78892 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E861871) (attr smd) (fp_text reference C332 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5C6A0FC1) (at 260.858 179.2986) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D50542F) (attr smd) (fp_text reference C331 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 270) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 270) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X140N (layer F.Cu) (tedit 5CACA3C4) (tstamp 5C6A0FB0) (at 254.2286 167.9702) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D7841B6) (attr smd) (fp_text reference C330 (at 0 -2.026) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_47UF_6.3V_20%_X5R (at 0 2.026) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.05 0.675) (end 1.05 0.675) (layer F.Fab) (width 0.1)) (fp_line (start 1.05 0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 -0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 0.675) (end -1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.75 1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end -1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (pad 1 smd rect (at -0.9 0 90) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 47 /Power/Power_SW/XR77129ILB_F_VOUT3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.9 0 90) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768A73) (at 251.6886 125.1458 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DC5C2A8) (attr smd) (fp_text reference C329 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 642 Rx_7_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 100 /FPGA/FPGA_MGT/MGT_RX_3_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768A63) (at 252.4506 125.1458 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DC37EDD) (attr smd) (fp_text reference C328 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 641 Rx_7_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 98 /FPGA/FPGA_MGT/MGT_RX_3_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768A53) (at 252.2474 110.7694 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DC13B10) (attr smd) (fp_text reference C327 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 640 Rx_6_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 96 /FPGA/FPGA_MGT/MGT_RX_2_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768A43) (at 252.984 110.7694 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DBEF747) (attr smd) (fp_text reference C326 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 639 Rx_6_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 442 /FPGA/FPGA_MGT/MGT_RX_2_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768A33) (at 253.0094 96.5708 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DBCB37E) (attr smd) (fp_text reference C325 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 638 Rx_5_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 93 /FPGA/FPGA_MGT/MGT_RX_1_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768A23) (at 253.746 96.5708 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DB94C8A) (attr smd) (fp_text reference C324 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 637 Rx_5_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 91 /FPGA/FPGA_MGT/MGT_RX_1_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768A13) (at 250.9774 82.3468 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DB7080D) (attr smd) (fp_text reference C323 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 636 Rx_4_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 89 /FPGA/FPGA_MGT/MGT_RX_0_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768A03) (at 251.7394 82.3468 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DB4C390) (attr smd) (fp_text reference C322 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 635 Rx_4_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 443 /FPGA/FPGA_MGT/MGT_RX_0_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C7689F3) (at 248.455453 123.710582 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DB27F11) (attr smd) (fp_text reference C321 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 634 Tx_7_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 86 /FPGA/FPGA_MGT/MGT_TX_3_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C5E79EE) (at 249.217453 123.710582 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DB03AA0) (attr smd) (fp_text reference C320 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 633 Tx_7_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 441 /FPGA/FPGA_MGT/MGT_TX_3_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C7689D3) (at 248.1072 109.474 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DADF62D) (attr smd) (fp_text reference C319 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 632 Tx_6_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 83 /FPGA/FPGA_MGT/MGT_TX_2_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C7689C3) (at 248.8692 109.474 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DABB1C2) (attr smd) (fp_text reference C318 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 631 Tx_6_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 444 /FPGA/FPGA_MGT/MGT_TX_2_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C7689B3) (at 249.1486 95.25 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DA96D53) (attr smd) (fp_text reference C317 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 630 Tx_5_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 80 /FPGA/FPGA_MGT/MGT_TX_1_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C7689A3) (at 249.9106 95.25 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DA728E6) (attr smd) (fp_text reference C316 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 629 Tx_5_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 78 /FPGA/FPGA_MGT/MGT_TX_1_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768993) (at 247.8786 81.0006 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DA4E47B) (attr smd) (fp_text reference C315 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 628 Tx_4_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 445 /FPGA/FPGA_MGT/MGT_TX_0_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768983) (at 248.6406 81.0006 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DA2A014) (attr smd) (fp_text reference C314 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 627 Tx_4_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 75 /FPGA/FPGA_MGT/MGT_TX_0_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768973) (at 251.6886 123.7234 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DC6E48F) (attr smd) (fp_text reference C313 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 99 /FPGA/SFP_4_RX_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 100 /FPGA/FPGA_MGT/MGT_RX_3_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768963) (at 252.4506 123.7234 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DC4A0C4) (attr smd) (fp_text reference C312 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 97 /FPGA/SFP_4_RX_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 98 /FPGA/FPGA_MGT/MGT_RX_3_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768953) (at 252.2474 109.3724 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DC25CF7) (attr smd) (fp_text reference C311 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 95 /FPGA/SFP_3_RX_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 96 /FPGA/FPGA_MGT/MGT_RX_2_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768943) (at 252.984 109.3724 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DC0192A) (attr smd) (fp_text reference C310 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 94 /FPGA/SFP_3_RX_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 442 /FPGA/FPGA_MGT/MGT_RX_2_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768933) (at 253.0094 95.1738 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DBDD563) (attr smd) (fp_text reference C309 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 92 /FPGA/SFP_2_RX_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 93 /FPGA/FPGA_MGT/MGT_RX_1_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768923) (at 253.746 95.1738 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DBA6ECA) (attr smd) (fp_text reference C308 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 90 /FPGA/SFP_2_RX_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 91 /FPGA/FPGA_MGT/MGT_RX_1_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C5E7BE0) (at 250.9774 80.9498 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DB82A4B) (attr smd) (fp_text reference C307 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 88 /FPGA/SFP_1_RX_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 89 /FPGA/FPGA_MGT/MGT_RX_0_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768903) (at 251.7394 80.9498 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DB5E5CE) (attr smd) (fp_text reference C306 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 87 /FPGA/SFP_1_RX_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 443 /FPGA/FPGA_MGT/MGT_RX_0_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C7688F3) (at 248.455453 125.069482 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DB3A14F) (attr smd) (fp_text reference C305 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 85 /FPGA/SFP_4_TX_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 86 /FPGA/FPGA_MGT/MGT_TX_3_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C7688E3) (at 249.217453 125.069482 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DB15CD8) (attr smd) (fp_text reference C304 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 84 /FPGA/SFP_4_TX_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 441 /FPGA/FPGA_MGT/MGT_TX_3_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C7688D3) (at 248.1072 110.871 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DAF1865) (attr smd) (fp_text reference C303 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 82 /FPGA/SFP_3_TX_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 83 /FPGA/FPGA_MGT/MGT_TX_2_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C7688C3) (at 248.8692 110.871 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DACD3F6) (attr smd) (fp_text reference C302 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 81 /FPGA/SFP_3_TX_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 444 /FPGA/FPGA_MGT/MGT_TX_2_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C7688B3) (at 249.1486 96.6724 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DAA8F87) (attr smd) (fp_text reference C301 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 79 /FPGA/SFP_2_TX_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 80 /FPGA/FPGA_MGT/MGT_TX_1_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C7688A3) (at 249.9106 96.6724 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DA84B1C) (attr smd) (fp_text reference C300 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 77 /FPGA/SFP_2_TX_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 78 /FPGA/FPGA_MGT/MGT_TX_1_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768893) (at 247.8786 82.423 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DA606AF) (attr smd) (fp_text reference C299 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 76 /FPGA/SFP_1_TX_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 445 /FPGA/FPGA_MGT/MGT_TX_0_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768883) (at 248.6406 82.423 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5DA3C248) (attr smd) (fp_text reference C298 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 74 /FPGA/SFP_1_TX_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 75 /FPGA/FPGA_MGT/MGT_TX_0_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C9EBB10) (at 235.712 105.4989 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5D7F7A11) (attr smd) (fp_text reference C297 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 73 /FPGA/FPGA_REF_CLK1_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 63 /FPGA/FPGA_MGT/MGT_CLK_0_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C9EBAB6) (at 235.712 104.7242 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5D69EC57) (attr smd) (fp_text reference C296 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 72 /FPGA/FPGA_REF_CLK1_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 61 /FPGA/FPGA_MGT/MGT_CLK_0_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768853) (at 260.604 137.8839) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5D7C1314) (attr smd) (fp_text reference C295 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 71 /FMC_1/FMC1_GBTCLK0_M2C_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 67 /FPGA/FPGA_MGT/MGT_CLK_1_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69A574) (at 262.0137 137.8839 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5D79CE85) (attr smd) (fp_text reference C294 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 70 /AMC_connector/FCLKA_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 67 /FPGA/FPGA_MGT/MGT_CLK_1_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768833) (at 260.604 137.16) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5D78AC40) (attr smd) (fp_text reference C293 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 69 /FMC_1/FMC1_GBTCLK0_M2C_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 65 /FPGA/FPGA_MGT/MGT_CLK_1_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69A5A1) (at 262.0137 137.1473 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5D7667B1) (attr smd) (fp_text reference C292 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 68 /AMC_connector/FCLKA_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 65 /FPGA/FPGA_MGT/MGT_CLK_1_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C9EBA89) (at 234.2896 105.4989) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5D809C5D) (attr smd) (fp_text reference C291 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 66 /FMC_2/FMC2_GBTCLK0_M2C_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 63 /FPGA/FPGA_MGT/MGT_CLK_0_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C9EBAE3) (at 234.2896 104.7242) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5D7E57C4) (attr smd) (fp_text reference C290 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 64 /FMC_2/FMC2_GBTCLK0_M2C_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 61 /FPGA/FPGA_MGT/MGT_CLK_0_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C7687F3) (at 260.604 137.8839) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5D7AF0CD) (attr smd) (fp_text reference C289 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 62 /FPGA/FPGA_REF_CLK0_P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 67 /FPGA/FPGA_MGT/MGT_CLK_1_N) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C7687E3) (at 260.604 137.1473) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5DCA928C/5D7789F8) (attr smd) (fp_text reference C288 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 60 /FPGA/FPGA_REF_CLK0_N) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 65 /FPGA/FPGA_MGT/MGT_CLK_1_P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer F.Cu) (tedit 5CACA158) (tstamp 5C7687D3) (at 246.7229 157.6705 270) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EF7D40E) (attr smd) (fp_text reference C287 (at 0 -1.976 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 1.976 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.6 0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end -1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.7 0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end -1.7 -0.95) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 270) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 270) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5C7687C2) (at 239.522 126.238 90) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EF36FF5) (attr smd) (fp_text reference C286 (at 0 1.976 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 -1.976 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer F.Cu) (tedit 5CACA158) (tstamp 5C7687B1) (at 244.6782 157.6578 270) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EF5A204) (attr smd) (fp_text reference C285 (at 0 -1.976 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 1.976 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.6 0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end -1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.7 0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end -1.7 -0.95) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 270) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 270) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5C7687A0) (at 243.6114 126.238 90) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EF13DED) (attr smd) (fp_text reference C284 (at 0 1.976 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 -1.976 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N locked (layer F.Cu) (tedit 5CACA193) (tstamp 5C76878F) (at 242.8494 157.607 270) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C907554/5C417BCB/5E039CE0) (attr smd) (fp_text reference C283 (at 0 -1.826 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 1.826 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.825 0.425) (end -0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start 0.825 0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -1.55 0.8) (end -1.55 -0.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.55 0.8) (end 1.55 -0.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N (layer B.Cu) (tedit 5CACA193) (tstamp 5C713BDE) (at 237.4646 126.3904 90) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C907554/5C417BCB/5DFF59ED) (attr smd) (fp_text reference C282 (at 0 1.826 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N locked (layer B.Cu) (tedit 5CACA193) (tstamp 5C76876D) (at 242.8494 157.607 270) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C907554/5C417BCB/5E017B66) (attr smd) (fp_text reference C281 (at 0 1.826 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N (layer B.Cu) (tedit 5CACA193) (tstamp 5C76875C) (at 241.5286 126.3904 90) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C907554/5C417BCB/5DFD3875) (attr smd) (fp_text reference C280 (at 0 1.826 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76874B) (at 236.855 139.4968) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E83DF5D) (attr smd) (fp_text reference C279 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5C76873B) (at 226.6442 126.4522 90) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EEF0B5D) (attr smd) (fp_text reference C278 (at 0 1.976 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 -1.976 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76872A) (at 230.9368 139.4714) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E81AA91) (attr smd) (fp_text reference C277 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer F.Cu) (tedit 5CACA158) (tstamp 5C714000) (at 249.0724 134.0358) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EECD957) (attr smd) (fp_text reference C276 (at 0 -1.976) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 1.976) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.6 0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end -1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.7 0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end -1.7 -0.95) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768709) (at 230.9876 138.4808) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E7F75C8) (attr smd) (fp_text reference C275 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5CB5189A) (at 249.5296 140.0302) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EEAA750) (attr smd) (fp_text reference C274 (at 0 1.976) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 -1.976) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C7686E8) (at 231.9528 137.541) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E7D4102) (attr smd) (fp_text reference C273 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5C7686D8) (at 235.6358 126.2634 90) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EE8754A) (attr smd) (fp_text reference C272 (at 0 1.976 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 -1.976 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C659524) (at 236.8042 137.4902) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E7B0C39) (attr smd) (fp_text reference C271 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5C7686B7) (at 228.6762 126.4412 90) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EE64347) (attr smd) (fp_text reference C270 (at 0 1.976 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 -1.976 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C65B6FF) (at 228.0666 137.5156 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E78D771) (attr smd) (fp_text reference C269 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5C768696) (at 230.8606 126.4412 90) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EE41143) (attr smd) (fp_text reference C268 (at 0 1.976 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 -1.976 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768685) (at 228.0158 139.4968 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E746DEC) (attr smd) (fp_text reference C267 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC3225X270N (layer F.Cu) (tedit 5CACB96D) (tstamp 5C768675) (at 249.198 140.462) (descr "Chip Capacitor, Body 3.2x2.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5F1EA59C) (attr smd) (fp_text reference C266 (at 0 -2.626) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC1210_100UF_6.3V_20%_X5R (at 0 2.626) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.55 -1.25) (end 0.55 -1.25) (layer F.SilkS) (width 0.2)) (fp_line (start -0.55 1.25) (end 0.55 1.25) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 1.25) (end 1.6 1.25) (layer F.Fab) (width 0.1)) (fp_line (start 1.6 1.25) (end 1.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 -1.25) (end 1.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 1.25) (end -1.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -2.35 1.6) (end -2.35 -1.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.35 -1.6) (end 2.35 -1.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.35 1.6) (end 2.35 -1.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.35 1.6) (end 2.35 1.6) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.5 0 90) (size 2.7 1.15) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 2 smd rect (at 1.5 0 90) (size 2.7 1.15) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC3225X270N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC3225X270N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC3225X270N (layer F.Cu) (tedit 5CACB96D) (tstamp 5C768661) (at 249.174 137.16) (descr "Chip Capacitor, Body 3.2x2.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5F1C7A3F) (attr smd) (fp_text reference C265 (at 0 -2.626) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC1210_100UF_6.3V_20%_X5R (at 0 2.626) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.55 -1.25) (end 0.55 -1.25) (layer F.SilkS) (width 0.2)) (fp_line (start -0.55 1.25) (end 0.55 1.25) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 1.25) (end 1.6 1.25) (layer F.Fab) (width 0.1)) (fp_line (start 1.6 1.25) (end 1.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 -1.25) (end 1.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 1.25) (end -1.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -2.35 1.6) (end -2.35 -1.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.35 -1.6) (end 2.35 -1.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.35 1.6) (end 2.35 -1.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.35 1.6) (end 2.35 1.6) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.5 0 90) (size 2.7 1.15) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 2 smd rect (at 1.5 0 90) (size 2.7 1.15) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC3225X270N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC3225X270N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76864D) (at 233.807 137.5156 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E76A2AC) (attr smd) (fp_text reference C264 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76863D) (at 228.4222 152.019 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E7232FB) (attr smd) (fp_text reference C263 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76862D) (at 222.9358 145.4785) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E695FFB) (attr smd) (fp_text reference C262 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76861D) (at 236.8042 149.5044 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E6FFE3B) (attr smd) (fp_text reference C261 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76860D) (at 231.394 150.9649 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E672B41) (attr smd) (fp_text reference C260 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C7685FD) (at 228.8794 132.4864) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E6DC97C) (attr smd) (fp_text reference C259 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C7685ED) (at 224.3836 149.8854 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E64F686) (attr smd) (fp_text reference C258 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C7685DD) (at 226.4156 145.9992 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E6B94BE) (attr smd) (fp_text reference C257 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C7685CD) (at 232.4227 144.0053 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E62C1CC) (attr smd) (fp_text reference C256 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer F.Cu) (tedit 5CACA158) (tstamp 5C7685BD) (at 214.757 133.1214 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EDB42B1) (attr smd) (fp_text reference C255 (at 0 -1.976) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 1.976) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.6 0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end -1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.7 0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end -1.7 -0.95) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer F.Cu) (tedit 5CACA158) (tstamp 5C7685AC) (at 214.7697 137.1854 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EE1D8AE) (attr smd) (fp_text reference C254 (at 0 -1.976) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 1.976) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.6 0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end -1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.7 0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end -1.7 -0.95) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer F.Cu) (tedit 5CACA158) (tstamp 5C76859B) (at 214.8332 151.2316 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5ED6DEB3) (attr smd) (fp_text reference C253 (at 0 -1.976) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 1.976) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.6 0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end -1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.7 0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end -1.7 -0.95) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5C76858A) (at 214.757 134.9502 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EDD74B0) (attr smd) (fp_text reference C252 (at 0 1.976) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 -1.976) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 180) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768579) (at 226.8982 136.4742) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E608D07) (attr smd) (fp_text reference C251 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768569) (at 224.9805 140.5382) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E57BA25) (attr smd) (fp_text reference C250 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768559) (at 230.4542 147.8534 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E5E584F) (attr smd) (fp_text reference C249 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768549) (at 236.347 143.6878 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E558571) (attr smd) (fp_text reference C248 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768539) (at 228.9429 143.4846) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E5C239A) (attr smd) (fp_text reference C247 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768529) (at 234.9246 148.5138) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E5350C0) (attr smd) (fp_text reference C246 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768519) (at 222.9104 134.7216) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E59EED8) (attr smd) (fp_text reference C245 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768509) (at 235.8898 146.4945 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E511C0E) (attr smd) (fp_text reference C244 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer F.Cu) (tedit 5CACA158) (tstamp 5C7684F9) (at 214.8332 153.2128 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5ED4A72E) (attr smd) (fp_text reference C243 (at 0 -1.976) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 1.976) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.6 0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end -1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.7 0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end -1.7 -0.95) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5C7684E8) (at 214.8205 151.2824 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5ED04021) (attr smd) (fp_text reference C242 (at 0 1.976) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 -1.976) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 180) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5C7684D7) (at 214.8205 153.2509 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5ED27534) (attr smd) (fp_text reference C241 (at 0 1.976) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 -1.976) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 180) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer F.Cu) (tedit 5CACA158) (tstamp 5C7684C6) (at 214.7697 135.2042 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EBCADC4) (attr smd) (fp_text reference C240 (at 0 -1.976) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 1.976) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.6 0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end -1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.7 0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end -1.7 -0.95) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC3225X270N (layer F.Cu) (tedit 5CACB96D) (tstamp 5C7684B5) (at 214.2236 148.5519 180) (descr "Chip Capacitor, Body 3.2x2.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5F1A3EF2) (attr smd) (fp_text reference C239 (at 0 -2.626) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC1210_100UF_6.3V_20%_X5R (at 0 2.626) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.55 -1.25) (end 0.55 -1.25) (layer F.SilkS) (width 0.2)) (fp_line (start -0.55 1.25) (end 0.55 1.25) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 1.25) (end 1.6 1.25) (layer F.Fab) (width 0.1)) (fp_line (start 1.6 1.25) (end 1.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 -1.25) (end 1.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 1.25) (end -1.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -2.35 1.6) (end -2.35 -1.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.35 -1.6) (end 2.35 -1.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.35 1.6) (end 2.35 -1.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.35 1.6) (end 2.35 1.6) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.5 0 270) (size 2.7 1.15) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 1.5 0 270) (size 2.7 1.15) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC3225X270N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC3225X270N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C7684A1) (at 242.9764 138.43) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5DE210A3) (attr smd) (fp_text reference C238 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer F.Cu) (tedit 5CACA158) (tstamp 5C768491) (at 214.9094 143.9672 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EC31992) (attr smd) (fp_text reference C237 (at 0 -1.976) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 1.976) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.6 0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end -1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.7 0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end -1.7 -0.95) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 488 VCCAUX) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C768480) (at 243.7638 141.0208) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5DE00C99) (attr smd) (fp_text reference C236 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer F.Cu) (tedit 5CACA158) (tstamp 5C768470) (at 214.9221 142.0495 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EC0F7FB) (attr smd) (fp_text reference C235 (at 0 -1.976) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 1.976) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.6 0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end -1.6 -0.85) (layer F.Fab) (width 0.1)) (fp_line (start 1.7 0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end -1.7 -0.95) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (net 488 VCCAUX) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76845F) (at 242.951 134.4676) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5DDE0892) (attr smd) (fp_text reference C234 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5C669AC9) (at 214.8459 142.9258 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5C417BCB/5EBED665) (attr smd) (fp_text reference C233 (at 0 1.976) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 -1.976) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 180) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 488 VCCAUX) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76843E) (at 243.4844 136.4996) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5DDC048A) (attr smd) (fp_text reference C232 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76842E) (at 232.3846 142.0114 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E351066) (attr smd) (fp_text reference C231 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 488 VCCAUX) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76841E) (at 243.1034 139.446) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5DDA007F) (attr smd) (fp_text reference C230 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76840E) (at 228.7778 141.478 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E32EF11) (attr smd) (fp_text reference C229 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 488 VCCAUX) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C7683FE) (at 241.9096 135.4836 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E2626E4) (attr smd) (fp_text reference C228 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C7683EE) (at 229.616 142.4432 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E30CDBD) (attr smd) (fp_text reference C227 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 488 VCCAUX) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C7683DE) (at 233.9594 142.4686 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E2EAC64) (attr smd) (fp_text reference C226 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 488 VCCAUX) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N locked (layer B.Cu) (tedit 5CACA193) (tstamp 5C7683CE) (at 247.1928 131.953 90) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C907554/5C417BCB/5DFB00C0) (attr smd) (fp_text reference C225 (at 0 1.826 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C7683BD) (at 234.315 139.065 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5DCDD7AD) (attr smd) (fp_text reference C224 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 58 /FPGA/FPGA_PWR&MISC/VCCADC) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 59 /FPGA/FPGA_PWR&MISC/GNDADC) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C7683AD) (at 235.9914 142.4686 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E2C8B0E) (attr smd) (fp_text reference C223 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 488 VCCAUX) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N (layer B.Cu) (tedit 5CACA193) (tstamp 5C76839D) (at 250.9266 145.7198 270) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C907554/5C417BCB/5DF8D914) (attr smd) (fp_text reference C222 (at 0 1.826 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 58 /FPGA/FPGA_PWR&MISC/VCCADC) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 59 /FPGA/FPGA_PWR&MISC/GNDADC) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76838C) (at 241.2238 140.4874) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5DD3E6BC) (attr smd) (fp_text reference C221 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 489 MGTAVCC) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76837C) (at 233.9594 141.6812) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5DD7F0C6) (attr smd) (fp_text reference C220 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 486 VCCBRAM) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76836C) (at 241.173 136.4996) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5DD1E2B7) (attr smd) (fp_text reference C219 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 489 MGTAVCC) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76835C) (at 235.9914 141.6812 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5DD5ECC1) (attr smd) (fp_text reference C218 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 486 VCCBRAM) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76834C) (at 237.8456 138.557 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5DCFDEAF) (attr smd) (fp_text reference C217 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 489 MGTAVCC) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76833C) (at 230.4288 141.605 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E2A6991) (attr smd) (fp_text reference C216 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 486 VCCBRAM) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C5C1301) (at 281.9908 91.2622 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5D62BAF4) (attr smd) (fp_text reference C215 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76831C) (at 174.4726 162.7632) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CA40231/5D5B2767) (attr smd) (fp_text reference C214 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C76830C) (at 174.6758 158.3436) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CA40231/5D61E5DC) (attr smd) (fp_text reference C213 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C7682FC) (at 174.6758 159.1564) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CA40231/5D5B273B) (attr smd) (fp_text reference C212 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C7682EC) (at 174.4726 163.5252) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CA40231/5D61E5B0) (attr smd) (fp_text reference C211 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C7682DC) (at 241.9604 105.1814 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D397DE0) (attr smd) (fp_text reference C210 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5C70A4F7) (at 149.3774 181.1274 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA39/5CE1FA54) (attr smd) (fp_text reference C209 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5C70A632) (at 158.0134 173.5836 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA39/5CE00A0E) (attr smd) (fp_text reference C208 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5C70A524) (at 149.352 182.0418 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA39/5CE1FA28) (attr smd) (fp_text reference C207 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5C70A605) (at 155.6766 189.2046 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA39/5CDF142A) (attr smd) (fp_text reference C206 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5C70A6B9) (at 149.7584 177.9524 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA39/5CE1F9FC) (attr smd) (fp_text reference C205 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5C70A551) (at 165.1 178.6128 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA39/5CDD2694) (attr smd) (fp_text reference C204 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5C70A5AB) (at 149.86 185.3946 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA39/5CE1F9D0) (attr smd) (fp_text reference C203 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5C70A65F) (at 158.9278 173.5836 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA39/5CDC30AC) (attr smd) (fp_text reference C202 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5C70A68C) (at 157.734 189.2046 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA39/5CE1F9A4) (attr smd) (fp_text reference C201 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5C70A6E6) (at 165.1254 180.4416 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA39/5CDB3ACD) (attr smd) (fp_text reference C200 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5C70A57E) (at 149.86 183.7238 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA39/5CE74B4F) (attr smd) (fp_text reference C199 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 57 "Net-(C199-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5C70A5D8) (at 165.3286 183.9722) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA39/5CE1F978) (attr smd) (fp_text reference C198 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N locked (layer B.Cu) (tedit 5CACC105) (tstamp 5C70A713) (at 159.7914 189.2046 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA39/5CDA44ED) (attr smd) (fp_text reference C197 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C768209) (at 235.3056 103.1494 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D391787) (attr smd) (fp_text reference C196 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5C6A071C) (at 253.5682 179.3494 180) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D4DC83C) (attr smd) (fp_text reference C195 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 90) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 90) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X140N (layer F.Cu) (tedit 5CACA3C4) (tstamp 5C6A070B) (at 231.902 174.0916 270) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D731628) (attr smd) (fp_text reference C194 (at 0 -2.026 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_47UF_6.3V_20%_X5R (at 0 2.026 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.05 0.675) (end 1.05 0.675) (layer F.Fab) (width 0.1)) (fp_line (start 1.05 0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 -0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 0.675) (end -1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.75 1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end -1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (pad 1 smd rect (at -0.9 0) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 46 /Power/Power_SW/XR77129ILB_F_VOUT2) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.9 0) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A06FA) (at 237.6932 87.2871) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CA40231/5CDD61EF) (attr smd) (fp_text reference C193 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 56 /EN_CON_JTAG) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A06EA) (at 251.587 182.9308 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5D05A99E/5D05D3F8) (attr smd) (fp_text reference C192 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6EB165) (at 145.9738 160.9598 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5D05A99E/5D0727E6) (attr smd) (fp_text reference C191 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C5C2199) (at 222.7453 186.8297 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5D05A99E/5D05A2DF) (attr smd) (fp_text reference C190 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C6A06BA) (at 222.0976 197.9168 180) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5D05A99E/5D054632) (attr smd) (fp_text reference C189 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_10NF_35V_10%_X7R (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 54 "Net-(C188-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 55 /FPGA/DXP_0) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C6A06AA) (at 222.0976 196.9008 180) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5D05A99E/5D0544A8) (attr smd) (fp_text reference C188 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_10NF_35V_10%_X7R (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 54 "Net-(C188-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 55 /FPGA/DXP_0) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A069A) (at 162.052 114.808) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CC2A122) (attr smd) (fp_text reference C187 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A068A) (at 156.972 105.156) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CC1BC39) (attr smd) (fp_text reference C186 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A067A) (at 162.052 110.49 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CC0D814) (attr smd) (fp_text reference C185 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A066A) (at 160.528 114.808 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CC2A0F6) (attr smd) (fp_text reference C184 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A065A) (at 156.972 105.918) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CC1BC0D) (attr smd) (fp_text reference C183 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A064A) (at 160.9217 110.5281 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CC0D7E8) (attr smd) (fp_text reference C182 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A063A) (at 162.0393 123.444) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CC383B7) (attr smd) (fp_text reference C181 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A062A) (at 160.528 123.444 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CC3838B) (attr smd) (fp_text reference C180 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5CB99663) (at 160.02 128.4224 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CC4664E) (attr smd) (fp_text reference C179 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5CB99636) (at 158.9913 128.3843 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CC46622) (attr smd) (fp_text reference C178 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A05FA) (at 157.734 115.824) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CB22ED8) (attr smd) (fp_text reference C177 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A05EA) (at 157.734 113.284) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CB3DB01) (attr smd) (fp_text reference C176 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A05DA) (at 145.669 113.4618 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5C9E9018) (attr smd) (fp_text reference C175 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 52 "Net-(C168-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C546FB1) (at 144.368 118.11 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CA38A46) (attr smd) (fp_text reference C174 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 51 "Net-(C167-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5C6A05BA) (at 156.21 122.174 270) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16C03C/5CA532C8) (attr smd) (fp_text reference C173 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 180) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 180) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 463 +1V8_USB) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N (layer B.Cu) (tedit 5CACA193) (tstamp 5C6EB136) (at 151.5618 133.35 180) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C16C03C/5CAABF7B) (attr smd) (fp_text reference C172 (at 0 1.826) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C6A0598) (at 140.97 124.206) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16C03C/5CF4CD14) (attr smd) (fp_text reference C171 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_22PF_50V_5%_C0G (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 53 "Net-(C171-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A0588) (at 151.892 121.158 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CB158E7) (attr smd) (fp_text reference C170 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A0578) (at 147.066 118.872 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CB3050C) (attr smd) (fp_text reference C169 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5C6A0568) (at 143.764 113.792 180) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16C03C/5C9E9044) (attr smd) (fp_text reference C168 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 90) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 90) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 52 "Net-(C168-Pad1)") (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5C546FDF) (at 143.764 116.84 180) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16C03C/5CA38A72) (attr smd) (fp_text reference C167 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 90) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 90) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 51 "Net-(C167-Pad1)") (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6EB0D8) (at 148.844 131.5212 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CA5329C) (attr smd) (fp_text reference C166 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C6A0536) (at 141.478 118.618 180) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16C03C/5CF4CCE8) (attr smd) (fp_text reference C165 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_22PF_50V_5%_C0G (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 50 "Net-(C165-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A0526) (at 149.352 109.728 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CA45D62) (attr smd) (fp_text reference C164 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A0516) (at 145.034 127.762 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16C03C/5CEC9873) (attr smd) (fp_text reference C163 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5C6EB106) (at 144.018 133.604 90) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16C03C/5CA45D8E) (attr smd) (fp_text reference C162 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 49 "Net-(C162-Pad1)") (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5C6A04F5) (at 244.8052 169.3164 270) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D4B3A9B) (attr smd) (fp_text reference C161 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 180) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 180) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X140N (layer F.Cu) (tedit 5CACA3C4) (tstamp 5C6A04E4) (at 224.3074 183.5912 270) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D31DC3D) (attr smd) (fp_text reference C160 (at 0 -2.026 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_47UF_6.3V_20%_X5R (at 0 2.026 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.05 0.675) (end 1.05 0.675) (layer F.Fab) (width 0.1)) (fp_line (start 1.05 0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 -0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 0.675) (end -1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.75 1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end -1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (pad 1 smd rect (at -0.9 0) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 45 /Power/Power_SW/XR77129ILB_F_VOUT1) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.9 0) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5C6A04D3) (at 238.5314 179.9082 270) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D461ED4) (attr smd) (fp_text reference C159 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 180) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 180) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X140N (layer F.Cu) (tedit 5CACA3C4) (tstamp 5C6A04C2) (at 264.287 168.021) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D7C1A89) (attr smd) (fp_text reference C158 (at 0 -2.026) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_47UF_6.3V_20%_X5R (at 0 2.026) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.05 0.675) (end 1.05 0.675) (layer F.Fab) (width 0.1)) (fp_line (start 1.05 0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 -0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 0.675) (end -1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.75 1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end -1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (pad 1 smd rect (at -0.9 0 90) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 48 /Power/Power_SW/XR77129ILB_F_VOUT4) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.9 0 90) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5C6A04B1) (at 260.9596 177.2412) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D9A6227) (attr smd) (fp_text reference C157 (at 0 1.976) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_22UF_25V_20%_X5R (at 0 -1.976) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X140N (layer F.Cu) (tedit 5CACA3C4) (tstamp 5C6A04A0) (at 249.047 167.8686 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D78418A) (attr smd) (fp_text reference C156 (at 0 -2.026) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_47UF_6.3V_20%_X5R (at 0 2.026) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.05 0.675) (end 1.05 0.675) (layer F.Fab) (width 0.1)) (fp_line (start 1.05 0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 -0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 0.675) (end -1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.75 1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end -1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (pad 1 smd rect (at -0.9 0 270) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 47 /Power/Power_SW/XR77129ILB_F_VOUT3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.9 0 270) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5CB09211) (at 253.3396 177.5968 180) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D967E61) (attr smd) (fp_text reference C155 (at 0 1.976) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_22UF_25V_20%_X5R (at 0 -1.976) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 180) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X140N (layer F.Cu) (tedit 5CACA3C4) (tstamp 5C6A047E) (at 232.0036 168.1988 90) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D7315FC) (attr smd) (fp_text reference C154 (at 0 -2.026 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_47UF_6.3V_20%_X5R (at 0 2.026 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.05 0.675) (end 1.05 0.675) (layer F.Fab) (width 0.1)) (fp_line (start 1.05 0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 -0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 0.675) (end -1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.75 1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end -1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (pad 1 smd rect (at -0.9 0 180) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 46 /Power/Power_SW/XR77129ILB_F_VOUT2) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.9 0 180) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5C6A046D) (at 243.0018 169.302 270) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D92A0C0) (attr smd) (fp_text reference C153 (at 0 1.976 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_22UF_25V_20%_X5R (at 0 -1.976 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 270) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 270) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X140N (layer F.Cu) (tedit 5CACA3C4) (tstamp 5C6A045C) (at 222.123 177.2666 90) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D2E0E7D) (attr smd) (fp_text reference C152 (at 0 -2.026 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0805_47UF_6.3V_20%_X5R (at 0 2.026 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.05 0.675) (end 1.05 0.675) (layer F.Fab) (width 0.1)) (fp_line (start 1.05 0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 -0.675) (end 1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start -1.05 0.675) (end -1.05 -0.675) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.75 1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end -1.75 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.575) (end 0 -0.575) (layer F.SilkS) (width 0.2)) (pad 1 smd rect (at -0.9 0 180) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 45 /Power/Power_SW/XR77129ILB_F_VOUT1) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.9 0 180) (size 1.45 1.15) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X140N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5C6A044B) (at 236.5248 179.5018 270) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D8ADF16) (attr smd) (fp_text reference C151 (at 0 1.976 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_22UF_25V_20%_X5R (at 0 -1.976 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 270) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 270) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer F.Cu) (tedit 5CAC9F75) (tstamp 5C6A043A) (at 250.40844 185.19902 90) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DAC786E) (attr smd) (fp_text reference C150 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.9 0.45) (end -0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start 0.9 0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 90) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 43 /Power/Power_SW/PSS_XRP_LX4) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 90) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 44 /Power/Power_SW/PSS_XRP_BST4) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer F.Cu) (tedit 5CAC9F75) (tstamp 5C6A042A) (at 246.38508 181.09438 180) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DAB35A7) (attr smd) (fp_text reference C149 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.9 0.45) (end -0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start 0.9 0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 180) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 41 /Power/Power_SW/PSS_XRP_LX3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 180) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 42 /Power/Power_SW/PSS_XRP_BST3) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer F.Cu) (tedit 5CAC9F75) (tstamp 5C6A041A) (at 243.92636 181.11978 180) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DA9F2E3) (attr smd) (fp_text reference C148 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.9 0.45) (end -0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start 0.9 0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 180) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 39 /Power/Power_SW/PSS_XRP_LX2) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 180) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 40 /Power/Power_SW/PSS_XRP_BST2) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer F.Cu) (tedit 5CAC9F75) (tstamp 5C6A040A) (at 239.75314 184.83834 270) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DA8B01C) (attr smd) (fp_text reference C147 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.9 0.45) (end -0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start 0.9 0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 270) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 37 /Power/Power_SW/PSS_XRP_LX1) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 270) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 38 /Power/Power_SW/PSS_XRP_BST1) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N (layer B.Cu) (tedit 5CACA193) (tstamp 5C6A03FA) (at 253.5809 136.3853) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DE9AC88) (attr smd) (fp_text reference C146 (at 0 1.826) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N (layer B.Cu) (tedit 5CACA193) (tstamp 5C6A03E9) (at 258.8514 142.2654) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DE5B501) (attr smd) (fp_text reference C145 (at 0 1.826) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 680 "Net-(C145-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer F.Cu) (tedit 5CACA05C) (tstamp 5CD45045) (at 238.6838 182.6768 180) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5CF08194) (attr smd) (fp_text reference C144 (at 0 -1.776) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 1.776) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer F.Fab) (width 0.1)) (fp_line (start 0.825 0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end -0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.5 0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end -1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 270) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 270) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 692 "Net-(C144-Pad1)") (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer F.Cu) (tedit 5CACA05C) (tstamp 5C6A03C8) (at 207.4164 135.6614 180) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DA22347) (attr smd) (fp_text reference C143 (at 0 -1.776) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 1.776) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer F.Fab) (width 0.1)) (fp_line (start 0.825 0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end -0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.5 0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end -1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 270) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 270) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 12 +1V8) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer F.Cu) (tedit 5CACA05C) (tstamp 5CA3877F) (at 209.0928 131.5212) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D9F9049) (attr smd) (fp_text reference C142 (at 0 -1.776) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 1.776) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer F.Fab) (width 0.1)) (fp_line (start 0.825 0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end -0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.5 0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end -1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 90) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 90) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer F.Cu) (tedit 5CAC9F75) (tstamp 5C6A0393) (at 243.91112 191.61252 270) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DADC0B9) (attr smd) (fp_text reference C140 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.9 0.45) (end -0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start 0.9 0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 270) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 270) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 30 "Net-(C127-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5C6A0383) (at 254.254 141.6304 90) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D300F0D) (attr smd) (fp_text reference C139 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer F.Cu) (tedit 5CAC9F75) (tstamp 5C6A0372) (at 242.443 191.1604) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DA37AF5) (attr smd) (fp_text reference C138 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0402_2.2NF_50V_10%_X7R (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.9 0.45) (end -0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start 0.9 0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 36 "Net-(C138-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer F.Cu) (tedit 5CAC9F75) (tstamp 5C6A0362) (at 239.9792 188.8236 270) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5DA8A88F) (attr smd) (fp_text reference C137 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.9 0.45) (end -0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start 0.9 0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 270) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 270) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A0352) (at 196.723 190.373 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF8E/5CB408C0) (attr smd) (fp_text reference C136 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5CA1BC64) (at 171.5516 132.7658 180) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF8E/5C9EFEB4) (attr smd) (fp_text reference C135 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 35 "Net-(C135-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C6A0332) (at 210.2104 194.1322 270) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF8E/5C9C1496) (attr smd) (fp_text reference C134 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 270) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 34 "Net-(C134-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 270) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A0322) (at 159.6644 202.7682 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF8E/5C654FBC) (attr smd) (fp_text reference C133 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 33 "Net-(C132-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N (layer B.Cu) (tedit 5CACA193) (tstamp 5C6A0312) (at 158.242 202.9968 270) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C16BF8E/5C682128) (attr smd) (fp_text reference C132 (at 0 1.826 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 33 "Net-(C132-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C6A0301) (at 280.42108 143.74114 180) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF8E/5C80ED53) (attr smd) (fp_text reference C131 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C6A02F1) (at 151.638 207.3656 180) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF8E/5C79494C) (attr smd) (fp_text reference C130 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 32 "Net-(C129-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer B.Cu) (tedit 5CACA05C) (tstamp 5C6A02E1) (at 151.4856 208.6864 180) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16BF8E/5C7A3EEE) (attr smd) (fp_text reference C129 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end -1.5 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 90) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 90) (size 1 0.95) (layers B.Cu B.Paste B.Mask) (net 32 "Net-(C129-Pad1)") (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C6C1909) (at 273.558 204.216) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF8E/5C81E3E8) (attr smd) (fp_text reference C128 (at 0 1.526 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 -1.526 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 31 "Net-(C128-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer F.Cu) (tedit 5CACA05C) (tstamp 5C6A02C0) (at 251.4092 186.92114) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D5D25A8) (attr smd) (fp_text reference C127 (at 0 -1.776) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 1.776) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer F.Fab) (width 0.1)) (fp_line (start 0.825 0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end -0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.5 0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end -1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 90) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 90) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 30 "Net-(C127-Pad1)") (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C767DC2) (at 240.6904 96.2152 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D39E483) (attr smd) (fp_text reference C126 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 454 "Net-(C123-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C767DB2) (at 239.2426 96.2406 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D38B133) (attr smd) (fp_text reference C125 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C767DA2) (at 234.9246 100.2792 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D384AE2) (attr smd) (fp_text reference C124 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer F.Cu) (tedit 5CAC9F75) (tstamp 5C767D92) (at 243.459 97.3836) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF13/5D48F134) (attr smd) (fp_text reference C123 (at 0 -1.526) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0402_1UF_16V_10%_X5R (at 0 1.526) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.9 0.45) (end -0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start 0.9 0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 454 "Net-(C123-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C767D82) (at 238.96574 105.34396 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D37E48C) (attr smd) (fp_text reference C122 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N (layer F.Cu) (tedit 5CACA193) (tstamp 5C767D72) (at 241.7572 93.3704 90) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C16BF13/5D3C52E3) (attr smd) (fp_text reference C121 (at 0 -1.826 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 1.826 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.825 0.425) (end -0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start 0.825 0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -1.55 0.8) (end -1.55 -0.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.55 0.8) (end 1.55 -0.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (net 453 "Net-(C121-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N (layer F.Cu) (tedit 5CACA193) (tstamp 5C767D61) (at 240.0554 93.3704 90) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C16BF13/5D3BEC82) (attr smd) (fp_text reference C120 (at 0 -1.826 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 1.826 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.825 0.425) (end -0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start 0.825 0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -1.55 0.8) (end -1.55 -0.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.55 0.8) (end 1.55 -0.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (net 452 "Net-(C120-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N locked (layer B.Cu) (tedit 5CACA193) (tstamp 5C767D50) (at 235.2548 93.8784 270) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C16BF13/5D34415F) (attr smd) (fp_text reference C119 (at 0 1.826 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N locked (layer B.Cu) (tedit 5CACA193) (tstamp 5C767D3F) (at 233.6038 93.8784 270) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C16BF13/5D33DB1B) (attr smd) (fp_text reference C118 (at 0 1.826 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C767D2E) (at 222.5802 98.7552) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D37124B) (attr smd) (fp_text reference C117 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C767D1E) (at 234.9246 101.6254 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D36AC00) (attr smd) (fp_text reference C116 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C767D0E) (at 223.266 89.154 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D3645B0) (attr smd) (fp_text reference C115 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N locked (layer B.Cu) (tedit 5CACA193) (tstamp 5C767CEE) (at 230.3526 93.853 90) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C16BF13/5D3373BF) (attr smd) (fp_text reference C113 (at 0 1.826 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 449 "Net-(C111-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C767CDD) (at 222.8342 94.869) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D35DF65) (attr smd) (fp_text reference C112 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N locked (layer B.Cu) (tedit 5CACA193) (tstamp 5C767CCD) (at 228.7016 93.853 90) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C16BF13/5D32A3F1) (attr smd) (fp_text reference C111 (at 0 1.826 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 449 "Net-(C111-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C767CBC) (at 219.075 92.3036 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D357697) (attr smd) (fp_text reference C110 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C767CAC) (at 223.3295 96.1898 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D377897) (attr smd) (fp_text reference C109 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 29 /WhiteRabbit/WR_DAC_OUT1) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C767C9C) (at 223.012 92.1004 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D3B8508) (attr smd) (fp_text reference C108 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 28 /WhiteRabbit/WR_DAC_OUT2) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C767C8C) (at 222.631 102.235 270) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF13/5D4CC6CD) (attr smd) (fp_text reference C107 (at 0 1.526 270) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_10NF_35V_10%_X7R (at 0 -1.526 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 270) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 270) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 447 "Net-(C107-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N (layer B.Cu) (tedit 5CACA193) (tstamp 5C767C7C) (at 222.0722 96.0628 270) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C16BF13/5D34A7AA) (attr smd) (fp_text reference C106 (at 0 1.826 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 448 "Net-(C106-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer F.Cu) (tedit 5CACA05C) (tstamp 5C6A014A) (at 238.6076 189.3824 270) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D56C93B) (attr smd) (fp_text reference C105 (at 0 -1.776 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 1.776 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer F.Fab) (width 0.1)) (fp_line (start 0.825 0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end -0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.5 0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end -1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC2012X135N (layer B.Cu) (tedit 5CACA158) (tstamp 5C8F6A1C) (at 293.624 163.2966 90) (descr "Chip Capacitor, Body 2.0x1.25mm, IPC Medium Density") (path /5C907554/5CAAC367/5F5232E1) (attr smd) (fp_text reference C104 (at 0 1.976 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0805_4.7UF_10V_10%_X5R (at 0 -1.976 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start 0 -0.575) (end 0 0.575) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -0.85) (end 1.6 -0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.6 -0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 0.85) (end 1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start -1.6 -0.85) (end -1.6 0.85) (layer B.Fab) (width 0.1)) (fp_line (start 1.7 -0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.7 -0.95) (end 1.7 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 0.95) (end 1.7 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -0.95) (end -1.7 0.95) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 90) (size 1.05 1.4) (layers B.Cu B.Paste B.Mask) (net 9 /FPGA/FPGA_15_16/HDMI_5V) (solder_mask_margin 0.102)) (model CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC2012X135N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N locked (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C70A76D) (at 148.4122 177.8508 90) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5BCEDA39/5CAA1FB0) (attr smd) (fp_text reference C102 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_100PF_50V_5%_C0G (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 90) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 27 /ETH_PHY/CLK_25MHZ) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 90) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 23 "Net-(C102-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A0107) (at 259.8674 126.3904 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CC8AFE1/5C662C91) (attr smd) (fp_text reference C101 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 26 "Net-(C101-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A00F7) (at 260.6294 124.2314 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CC8AFE1/5C662C65) (attr smd) (fp_text reference C100 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 25 "Net-(C100-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1608X87N (layer B.Cu) (tedit 5CACA0A0) (tstamp 5C6A00E7) (at 261.0739 127.0889 90) (descr "Chip Capacitor, Body 1.6x0.8mm IPC Medium Density") (path /5CC8AFE1/5C662DF6) (attr smd) (fp_text reference C99 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_10UF_6.3V_20%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.875 -0.475) (end -0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -0.475) (end 0.875 -0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.75) (end 1.55 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.75) (end -1.55 0.75) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.8 0 90) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 26 "Net-(C101-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.8 0 90) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPC1608X87N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A00D7) (at 259.8039 124.2314 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CC8AFE1/5C662C39) (attr smd) (fp_text reference C98 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 25 "Net-(C100-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C6A00C7) (at 261.7089 124.1679 90) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5CC8AFE1/5C662D9E) (attr smd) (fp_text reference C97 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_1UF_16V_10%_X5R (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 90) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 90) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 25 "Net-(C100-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1608X87N (layer B.Cu) (tedit 5CACA0A0) (tstamp 5C6A00B7) (at 263.1694 123.5329 270) (descr "Chip Capacitor, Body 1.6x0.8mm IPC Medium Density") (path /5CC8AFE1/5C662DCA) (attr smd) (fp_text reference C96 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_10UF_6.3V_20%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.875 -0.475) (end -0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -0.475) (end 0.875 -0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.75) (end 1.55 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.75) (end -1.55 0.75) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.8 0 270) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 25 "Net-(C100-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.8 0 270) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPC1608X87N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C6A00A7) (at 263.8679 120.4849 180) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5CC8AFE1/5C662D72) (attr smd) (fp_text reference C95 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_1UF_16V_10%_X5R (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A0097) (at 263.9949 121.4374 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CC8AFE1/5C662C0D) (attr smd) (fp_text reference C94 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N locked (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C70A79A) (at 145 183.5 270) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5BCEDA39/5CAD39BC) (attr smd) (fp_text reference C93 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_22PF_50V_5%_C0G (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 270) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 270) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 24 "Net-(C93-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N locked (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C70A740) (at 144.8054 175.4886 180) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5BCEDA39/5CFB3911) (attr smd) (fp_text reference C92 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_150PF_50V_5%_C0G (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 23 "Net-(C102-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C767B94) (at 221.6912 102.0826 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D3AB375) (attr smd) (fp_text reference C91 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 447 "Net-(C107-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C767B84) (at 222.377 96.139 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D350F58) (attr smd) (fp_text reference C90 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 448 "Net-(C106-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A0047) (at 259.8166 112.3315 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CC6DBF7/5C66DB5C) (attr smd) (fp_text reference C89 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 22 "Net-(C87-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A0037) (at 259.8166 110.2995 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CC6DBF7/5C66DB30) (attr smd) (fp_text reference C88 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 21 "Net-(C84-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1608X87N (layer B.Cu) (tedit 5CACA0A0) (tstamp 5C6A0027) (at 261.0866 112.9665 90) (descr "Chip Capacitor, Body 1.6x0.8mm IPC Medium Density") (path /5CC6DBF7/5C66DCC1) (attr smd) (fp_text reference C87 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_10UF_6.3V_20%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.875 -0.475) (end -0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -0.475) (end 0.875 -0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.75) (end 1.55 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.75) (end -1.55 0.75) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.8 0 90) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 22 "Net-(C87-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.8 0 90) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPC1608X87N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C6A0017) (at 260.5786 110.2995 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CC6DBF7/5C66DB04) (attr smd) (fp_text reference C86 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 21 "Net-(C84-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C6A0007) (at 261.5946 110.1725 90) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5CC6DBF7/5C66DC69) (attr smd) (fp_text reference C85 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_1UF_16V_10%_X5R (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 90) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 90) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 21 "Net-(C84-Pad2)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1608X87N (layer B.Cu) (tedit 5CACA0A0) (tstamp 5C69FFF7) (at 263.1186 109.6645 270) (descr "Chip Capacitor, Body 1.6x0.8mm IPC Medium Density") (path /5CC6DBF7/5C66DC95) (attr smd) (fp_text reference C84 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_10UF_6.3V_20%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.875 -0.475) (end -0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -0.475) (end 0.875 -0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.75) (end 1.55 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.75) (end -1.55 0.75) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.8 0 270) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 21 "Net-(C84-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.8 0 270) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPC1608X87N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C69FFE7) (at 263.7536 106.3625 180) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5CC6DBF7/5C66DC3D) (attr smd) (fp_text reference C83 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_1UF_16V_10%_X5R (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FFD7) (at 263.8806 107.3785 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CC6DBF7/5C66DAD8) (attr smd) (fp_text reference C82 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer F.Cu) (tedit 5CAC9F75) (tstamp 5C767AFC) (at 220.7514 102.1588 270) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF13/5D496090) (attr smd) (fp_text reference C81 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0402_1UF_16V_10%_X5R (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.9 0.45) (end -0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start 0.9 0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 270) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 270) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 447 "Net-(C107-Pad1)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C767AEC) (at 217.0938 100.4824) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C16BF13/5D31C883) (attr smd) (fp_text reference C80 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FFA7) (at 275.29028 163.68776 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5DA94C18) (attr smd) (fp_text reference C79 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C8EB082) (at 182.4228 149.8092 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5CC8CB69/5F8D811E) (attr smd) (fp_text reference C78 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FF87) (at 259.715 97.9043 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CC393D3/5C60DF84) (attr smd) (fp_text reference C77 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 20 "Net-(C75-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FF77) (at 260.477 95.8723 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CC393D3/5C60CB03) (attr smd) (fp_text reference C76 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 19 "Net-(C72-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1608X87N (layer B.Cu) (tedit 5CACA0A0) (tstamp 5C69FF67) (at 260.985 98.6663 90) (descr "Chip Capacitor, Body 1.6x0.8mm IPC Medium Density") (path /5CC393D3/5C639C63) (attr smd) (fp_text reference C75 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_10UF_6.3V_20%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.875 -0.475) (end -0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -0.475) (end 0.875 -0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.75) (end 1.55 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.75) (end -1.55 0.75) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.8 0 90) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 20 "Net-(C75-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.8 0 90) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPC1608X87N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FF57) (at 259.715 95.8723 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CC393D3/5C60B67D) (attr smd) (fp_text reference C74 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 19 "Net-(C72-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C69FF47) (at 261.493 95.8723 90) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5CC393D3/5C639788) (attr smd) (fp_text reference C73 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_1UF_16V_10%_X5R (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 90) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 90) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 19 "Net-(C72-Pad2)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1608X87N (layer B.Cu) (tedit 5CACA0A0) (tstamp 5C69FF37) (at 262.7376 95.2373 270) (descr "Chip Capacitor, Body 1.6x0.8mm IPC Medium Density") (path /5CC393D3/5C639A75) (attr smd) (fp_text reference C72 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_10UF_6.3V_20%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.875 -0.475) (end -0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -0.475) (end 0.875 -0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.75) (end 1.55 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.75) (end -1.55 0.75) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.8 0 270) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 19 "Net-(C72-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.8 0 270) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPC1608X87N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C69FF27) (at 265.7856 94.4753 270) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5CC393D3/5C6395EE) (attr smd) (fp_text reference C71 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_1UF_16V_10%_X5R (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 270) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 270) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FF17) (at 263.779 93.3323 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5CC393D3/5C606000) (attr smd) (fp_text reference C70 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1608X87N (layer B.Cu) (tedit 5CACA0A0) (tstamp 5C69FF07) (at 186.563 200.9521) (descr "Chip Capacitor, Body 1.6x0.8mm IPC Medium Density") (path /5BD31F9A/5C959A63) (attr smd) (fp_text reference C69 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_10UF_6.3V_20%_X5R (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.875 -0.475) (end -0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -0.475) (end 0.875 -0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.75) (end 1.55 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.75) (end -1.55 0.75) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.8 0) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.8 0) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPC1608X87N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1608X87N (layer B.Cu) (tedit 5CACA0A0) (tstamp 5C69FEF7) (at 186.5376 199.0471) (descr "Chip Capacitor, Body 1.6x0.8mm IPC Medium Density") (path /5BD31F9A/5C959A0B) (attr smd) (fp_text reference C68 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_10UF_6.3V_20%_X5R (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.875 -0.475) (end -0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -0.475) (end 0.875 -0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.75) (end 1.55 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.75) (end -1.55 0.75) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.8 0) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.8 0) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPC1608X87N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FEE7) (at 190.3857 199.7456 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD31F9A/5C959A37) (attr smd) (fp_text reference C67 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FED7) (at 190.6524 190.8048 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD31F9A/5C97020D) (attr smd) (fp_text reference C66 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 18 /FMC_1/FMC1_3P3VAUX) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FEC7) (at 191.4398 190.8048 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD31F9A/5C9701E1) (attr smd) (fp_text reference C65 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 18 /FMC_1/FMC1_3P3VAUX) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FEB7) (at 192.6463 199.5043 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD31F9A/5C99D0BC) (attr smd) (fp_text reference C64 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FEA7) (at 194.2465 201.9935) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD31F9A/5C99D090) (attr smd) (fp_text reference C63 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C69FE85) (at 196.0245 192.0875 90) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5BD31F9A/5C9B3992) (attr smd) (fp_text reference C61 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 90) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 90) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 462 +12V_FMC1) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FE75) (at 276.00402 194.16014 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C98B18F) (attr smd) (fp_text reference C60 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 17 "Net-(C60-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FE65) (at 277.64486 178.0032 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C983ED0) (attr smd) (fp_text reference C59 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 16 "Net-(C59-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FE55) (at 273.46148 178.04638 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C9398EF) (attr smd) (fp_text reference C58 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 15 "Net-(C58-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X95N (layer F.Cu) (tedit 5CACA05C) (tstamp 5C69FE45) (at 267.1572 169.037 90) (descr "Capacitor, non-Polarized, Chip; 1.65mm L X 0.85mm W X 0.95mm H,IPC Medium Density") (path /5BCEDA59/5C8E158D) (attr smd) (fp_text reference C57 (at 0 -1.776 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0603_4.7UF_25V_10%_X5R (at 0 1.776 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer F.Fab) (width 0.1)) (fp_line (start 0.825 0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end -0.825 -0.425) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 0.75) (end 1.5 0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.5 0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.75) (end 1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 0.75) (end -1.5 -0.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 2 smd rect (at 0.75 0 180) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.75 0 180) (size 1 0.95) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (model CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X95N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FE34) (at 273.79676 163.68776 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C825F9F) (attr smd) (fp_text reference C56 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FE24) (at 268.224 171.1452 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C81F2FD) (attr smd) (fp_text reference C55 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FE14) (at 281.1582 166.3954) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C8338FA) (attr smd) (fp_text reference C54 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FE04) (at 268.3764 168.5544 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C82CC4E) (attr smd) (fp_text reference C53 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FDF4) (at 277.67788 175.94834 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C863216) (attr smd) (fp_text reference C52 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 11 "Net-(C42-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FDE4) (at 274.09648 175.9712 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C841295) (attr smd) (fp_text reference C51 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 13 "Net-(C47-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FDD4) (at 281.178 169.1132) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C85C565) (attr smd) (fp_text reference C50 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 11 "Net-(C42-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FDC4) (at 276.94128 175.94834 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C83A5E3) (attr smd) (fp_text reference C49 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 13 "Net-(C47-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FDB4) (at 273.35988 175.9712 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C8558AD) (attr smd) (fp_text reference C48 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 11 "Net-(C42-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1608X87N locked (layer B.Cu) (tedit 5CACA0A0) (tstamp 5C7DC618) (at 276.8473 172.6184 270) (descr "Chip Capacitor, Body 1.6x0.8mm IPC Medium Density") (path /5BCEDA59/5C8D7402) (attr smd) (fp_text reference C47 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_10UF_6.3V_20%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.875 -0.475) (end -0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -0.475) (end 0.875 -0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.75) (end 1.55 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.75) (end -1.55 0.75) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.8 0 270) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 13 "Net-(C47-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.8 0 270) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPC1608X87N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FD94) (at 268.351 167.005 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C84EBFA) (attr smd) (fp_text reference C46 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 11 "Net-(C42-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FD84) (at 281.178 168.3512) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C847F44) (attr smd) (fp_text reference C45 (at 0 -1.376) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 11 "Net-(C42-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FD74) (at 271.4752 161.9504 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C93215B) (attr smd) (fp_text reference C44 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FD64) (at 284.226 173.1772 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C9232D4) (attr smd) (fp_text reference C43 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 12 +1V8) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1608X87N (layer B.Cu) (tedit 5CACA0A0) (tstamp 5C69FD54) (at 274.193 173.355 270) (descr "Chip Capacitor, Body 1.6x0.8mm IPC Medium Density") (path /5BCEDA59/5C8D008D) (attr smd) (fp_text reference C42 (at 0 1.776 270) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_10UF_6.3V_20%_X5R (at 0 -1.776 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.875 -0.475) (end -0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -0.475) (end 0.875 -0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.75) (end 1.55 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.75) (end -1.55 0.75) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.8 0 270) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 11 "Net-(C42-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.8 0 270) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPC1608X87N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FD44) (at 266.2174 162.1536 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA59/5C92AA27) (attr smd) (fp_text reference C41 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FD34) (at 169.799 86.36 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BCEDA3D/5C5F1928) (attr smd) (fp_text reference C40 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5CB8784A) (at 171.8437 151.4348 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5CC8CB69/5F90F107) (attr smd) (fp_text reference C39 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 446 "Net-(C39-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C8EB0AF) (at 170.5483 137.6807 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5CC8CB69/5F8FCC33) (attr smd) (fp_text reference C38 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 10 "Net-(C38-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C8F64F7) (at 283.7942 166.48684 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5CAAC367/5F882CA1) (attr smd) (fp_text reference C37 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 9 /FPGA/FPGA_15_16/HDMI_5V) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer F.Cu) (tedit 5CAC9F75) (tstamp 5C767850) (at 215.4174 102.2604 270) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5C16BF13/5D49CDB7) (attr smd) (fp_text reference C36 (at 0 -1.526 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0402_1UF_16V_10%_X5R (at 0 1.526 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.9 0.45) (end -0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start 0.9 0.45) (end 0.9 -0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.91 0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 270) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 270) (size 0.62 0.62) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FCE4) (at 259.7658 83.6803 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BABAC65/5C6481A9) (attr smd) (fp_text reference C35 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 8 "Net-(C33-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FCD4) (at 259.7658 81.3943 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BABAC65/5C64817D) (attr smd) (fp_text reference C34 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 7 "Net-(C30-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1608X87N (layer B.Cu) (tedit 5CACA0A0) (tstamp 5C69FCC4) (at 261.1628 84.3153 90) (descr "Chip Capacitor, Body 1.6x0.8mm IPC Medium Density") (path /5BABAC65/5C64830E) (attr smd) (fp_text reference C33 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_10UF_6.3V_20%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.875 -0.475) (end -0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -0.475) (end 0.875 -0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.75) (end 1.55 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.75) (end -1.55 0.75) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.8 0 90) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 8 "Net-(C33-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.8 0 90) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPC1608X87N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FCB4) (at 260.6548 81.3943 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BABAC65/5C648151) (attr smd) (fp_text reference C32 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 7 "Net-(C30-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C69FCA4) (at 261.5438 81.2673 90) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5BABAC65/5C6482B6) (attr smd) (fp_text reference C31 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_1UF_16V_10%_X5R (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 90) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 90) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 7 "Net-(C30-Pad2)") (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1608X87N (layer B.Cu) (tedit 5CACA0A0) (tstamp 5C69FC94) (at 262.9408 80.6323 270) (descr "Chip Capacitor, Body 1.6x0.8mm IPC Medium Density") (path /5BABAC65/5C6482E2) (attr smd) (fp_text reference C30 (at 0 1.776 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_10UF_6.3V_20%_X5R (at 0 -1.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.875 -0.475) (end -0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -0.475) (end 0.875 -0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.75) (end 1.55 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.75) (end -1.55 0.75) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.8 0 270) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 7 "Net-(C30-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.8 0 270) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPC1608X87N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C70288A) (at 264.0838 77.4573 180) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5BABAC65/5C64828A) (attr smd) (fp_text reference C29 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_1UF_16V_10%_X5R (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0 180) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C7028B7) (at 263.9568 78.4733 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BABAC65/5C648125) (attr smd) (fp_text reference C28 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N (layer B.Cu) (tedit 5CACA193) (tstamp 5C69FC64) (at 226.441 109.1946 90) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5BD32060/5CD70E8C) (attr smd) (fp_text reference C27 (at 0 1.826 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N (layer B.Cu) (tedit 5CACA193) (tstamp 5C69FC53) (at 223.5962 112.395 180) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5BD32060/5CD70C22) (attr smd) (fp_text reference C26 (at 0 1.826) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 487 VTT_DDR3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FC42) (at 220.32976 111.75492) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5CDD5242) (attr smd) (fp_text reference C25 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 643 /SDRAM/VREF_DDR3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C69FC32) (at 220.2688 107.0737) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5BD32060/5CD746C9) (attr smd) (fp_text reference C24 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_1UF_16V_10%_X5R (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FC22) (at 235.3183 109.9185 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5CD9A2F5) (attr smd) (fp_text reference C23 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 643 /SDRAM/VREF_DDR3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N (layer B.Cu) (tedit 5CACA193) (tstamp 5C69FC12) (at 224.3328 107.7722 90) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5BD32060/5CD7078D) (attr smd) (fp_text reference C22 (at 0 1.826 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FC01) (at 230.4034 120.7008) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5CD9978F) (attr smd) (fp_text reference C21 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FBF1) (at 236.2454 109.9439 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5CD9942E) (attr smd) (fp_text reference C20 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FBE1) (at 240.1824 114.1222 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5CD9908C) (attr smd) (fp_text reference C19 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer F.Cu) (tedit 5CACC105) (tstamp 5C69FBD1) (at 229.5906 110.0836 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5CD98DF3) (attr smd) (fp_text reference C18 (at 0 -1.376 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 1.376 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start 0.65 0.25) (end 0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.65 0.25) (end -0.65 -0.25) (layer F.Fab) (width 0.1)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.635 0.35) (end 0.635 -0.35) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end -0.635 -0.35) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FBC1) (at 235.6739 118.9482) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5CD98A69) (attr smd) (fp_text reference C17 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FBB1) (at 238.7854 111.379 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5CD987E8) (attr smd) (fp_text reference C16 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FBA1) (at 238.5568 119.0752 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5CD984C7) (attr smd) (fp_text reference C15 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C5FAC74) (at 240.6396 119.0244 270) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD32060/5CD97FF6) (attr smd) (fp_text reference C14 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 270) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1608X87N (layer B.Cu) (tedit 5CACA0A0) (tstamp 5C69FB81) (at 186.182 130.302) (descr "Chip Capacitor, Body 1.6x0.8mm IPC Medium Density") (path /5BD31F9F/5C84E991) (attr smd) (fp_text reference C13 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_10UF_6.3V_20%_X5R (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.875 -0.475) (end -0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -0.475) (end 0.875 -0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.75) (end 1.55 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.75) (end -1.55 0.75) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.8 0) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.8 0) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPC1608X87N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1608X87N (layer B.Cu) (tedit 5CACA0A0) (tstamp 5C606879) (at 186.182 131.9276) (descr "Chip Capacitor, Body 1.6x0.8mm IPC Medium Density") (path /5BD31F9F/5D673227) (attr smd) (fp_text reference C12 (at 0 1.776) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_10UF_6.3V_20%_X5R (at 0 -1.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.875 -0.475) (end -0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 -0.475) (end 0.875 -0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0.875 -0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start -0.875 0.475) (end 0.875 0.475) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.75) (end 1.55 -0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.75) (end 1.55 0.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.75) (end -1.55 0.75) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.8 0) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.8 0) (size 0.95 1) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/CAPC1608X87N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FB61) (at 190.5 129.7178 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD31F9F/5C6E6EE8) (attr smd) (fp_text reference C11 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FB51) (at 191.7954 120.523 90) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD31F9F/5D63AE1C) (attr smd) (fp_text reference C10 (at 0 1.376 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 4 /FMC_2/FMC2_3P3VAUX) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 90) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FB41) (at 193.5988 121.2342) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD31F9F/5D625236) (attr smd) (fp_text reference C9 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 4 /FMC_2/FMC2_3P3VAUX) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FB31) (at 192.7606 128.8796 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD31F9F/5D60F2D8) (attr smd) (fp_text reference C8 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C69FB21) (at 194.2338 131.9022) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5BD31F9F/5C76EED7) (attr smd) (fp_text reference C7 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_100NF_6.3V_10%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1005X55N (layer B.Cu) (tedit 5CAC9F75) (tstamp 5C69FAFF) (at 196.3293 126.2253) (descr "Chip Capacitor, Body 1.0x0.55mm, IPC Medium Density") (path /5BD31F9F/5C8FFE06) (attr smd) (fp_text reference C5 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0402_100NF_25V_10%_X5R (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.9 -0.45) (end -0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.9 -0.45) (end 0.9 0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.9 -0.45) (end 0.9 -0.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (pad 2 smd rect (at 0.45 0) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.45 0) (size 0.62 0.62) (layers B.Cu B.Paste B.Mask) (net 460 +12V_FMC2) (solder_mask_margin 0.102)) (model CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1005X55N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C767559) (at 239.0394 137.5156) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E23FC8A) (attr smd) (fp_text reference C4 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 489 MGTAVCC) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC0603X33N (layer B.Cu) (tedit 5CACC105) (tstamp 5C9F2574) (at 232.8418 140.5382 180) (descr "Chip Capacitor, Body 0.6x0.30mm, IPC Medium Density") (path /5C907554/5C417BCB/5E28483D) (attr smd) (fp_text reference C3 (at 0 1.376) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0201_470NF_4V_20%_X5R (at 0 -1.376) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.65 0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -0.25) (end 0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end 0.65 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.25) (end -0.65 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.635 -0.35) (end 0.635 -0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.635 -0.35) (end 0.635 0.35) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.635 -0.35) (end -0.635 0.35) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 486 VCCBRAM) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.35 0 180) (size 0.45 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC0603X33N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC3225X270N locked (layer F.Cu) (tedit 5CACB96D) (tstamp 5C767539) (at 256.286 158.242 270) (descr "Chip Capacitor, Body 3.2x2.5mm, IPC Medium Density") (path /5C907554/5C417BCB/5F1A47DF) (attr smd) (fp_text reference C2 (at 0 -2.626 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CC1210_100UF_6.3V_20%_X5R (at 0 2.626 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.55 -1.25) (end 0.55 -1.25) (layer F.SilkS) (width 0.2)) (fp_line (start -0.55 1.25) (end 0.55 1.25) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 1.25) (end 1.6 1.25) (layer F.Fab) (width 0.1)) (fp_line (start 1.6 1.25) (end 1.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 -1.25) (end 1.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 1.25) (end -1.6 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -2.35 1.6) (end -2.35 -1.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.35 -1.6) (end 2.35 -1.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.35 1.6) (end 2.35 -1.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.35 1.6) (end 2.35 1.6) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.5 0) (size 2.7 1.15) (layers F.Cu F.Paste F.Mask) (net 486 VCCBRAM) (solder_mask_margin 0.102)) (pad 2 smd rect (at 1.5 0) (size 2.7 1.15) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC3225X270N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC3225X270N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:CAPC1709X100N (layer B.Cu) (tedit 5CACA193) (tstamp 5C767525) (at 248.4374 144.8816) (descr "Capacitor,non-Polarized, Chip;1.65mm L X 0.85mm W X 1.00mm H, IPC Medium Density") (path /5C907554/5C417BCB/5DF6B79D) (attr smd) (fp_text reference C1 (at 0 1.826) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CC0603_22UF_6.3V_20%_X5R (at 0 -1.826) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.825 -0.425) (end -0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start 0.825 -0.425) (end 0.825 0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.825 -0.425) (end 0.825 -0.425) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.55 -0.8) (end -1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.55 -0.8) (end 1.55 0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.55 -0.8) (end 1.55 -0.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -0.8 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 489 MGTAVCC) (solder_mask_margin 0.102)) (pad 2 smd rect (at 0.8 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/CAPC1709X100N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Marble:HOLE2_SLOT11 (layer F.Cu) (tedit 5EB073AC) (tstamp 5EB0694D) (at 143.19632 72.745387) (descr "Slot: 2 mm high x 11 mm wide") (path /5EBE3B57) (fp_text reference B9 (at -6.357376 7.949266) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value SLOT_2_11 (at 0 3.602) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole oval (at 0 0) (size 11 2) (drill oval 10.6 1.6) (layers *.Cu *.Mask) (net 1118 "Net-(B9-Pad1)") (solder_mask_margin 0.102)) ) (module Marble:HOLE2.8_PAD0 (layer F.Cu) (tedit 5EB05B26) (tstamp 5CF06AC9) (at 125.146321 71.195387) (descr "Through Hole: Hole Dia.=2.8mm Pad Dia.=None") (path /5EBE33C9) (fp_text reference B10 (at 1.853679 3.988613) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value PLATED_HOLE2.8_PAD0 (at 0 3.602) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 2.8 2.8) (drill 2.8) (layers *.Cu *.Mask) (net 1119 "Net-(B10-Pad1)") (solder_mask_margin 0.102)) ) (module Marble:HOLE2.7_PAD5.0 (layer F.Cu) (tedit 5EB055AB) (tstamp 5C8D2FDD) (at 188.873824 208.660447) (descr "Plated Through Hole: Hole Dia.=2.7mm Pad Dia.=5.0mm") (path /5C94215D) (fp_text reference B3 (at -4.723824 1.651553) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value PLATED_HOLE2.7_PAD5.0 (at 0 3.602) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 5 5) (drill 2.95) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) ) (module Marble:HOLE2.7_PAD5.0 (layer F.Cu) (tedit 5EB055AB) (tstamp 5C6F6AD1) (at 134.273824 204.710447) (descr "Plated Through Hole: Hole Dia.=2.7mm Pad Dia.=5.0mm") (path /5C874F76) (fp_text reference B4 (at -4.860824 -0.367447) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value PLATED_HOLE2.7_PAD5.0 (at 0 3.602) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 5 5) (drill 2.95) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) ) (module Marble:HOLE2.7_PAD5.0 (layer F.Cu) (tedit 5EB055AB) (tstamp 5C6F6ADB) (at 188.873824 145.660447) (descr "Plated Through Hole: Hole Dia.=2.7mm Pad Dia.=5.0mm") (path /5C8A4093) (fp_text reference B6 (at -4.342824 -0.626447) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value PLATED_HOLE2.7_PAD5.0 (at 0 3.602) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 5 5) (drill 2.95) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) ) (module Marble:HOLE2.7_PAD5.0 (layer F.Cu) (tedit 5EB055AB) (tstamp 5EB08902) (at 134.273824 148.160446) (descr "Plated Through Hole: Hole Dia.=2.7mm Pad Dia.=5.0mm") (path /5C7E4108) (fp_text reference B2 (at -4.606824 1.445554) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value PLATED_HOLE2.7_PAD5.0 (at 0 3.602) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 5 5) (drill 2.95) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) ) (module Marble:HOLE2.7_PAD5.0 (layer F.Cu) (tedit 5EB05854) (tstamp 5EB088E1) (at 188.873824 138.660447) (descr "Plated Through Hole: Hole Dia.=2.7mm Pad Dia.=5.0mm") (path /5C942189) (fp_text reference B5 (at -4.469824 0.912553) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value PLATED_HOLE2.7_PAD5.0 (at 0 3.602) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 5 5) (drill 2.95) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) ) (module Marble:HOLE2.7_PAD5.0 (layer F.Cu) (tedit 5EB05848) (tstamp 5EB07AD4) (at 134.273824 134.710445) (descr "Plated Through Hole: Hole Dia.=2.7mm Pad Dia.=5.0mm") (path /5C942131) (fp_text reference B1 (at -2.701824 -3.392445) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value PLATED_HOLE2.7_PAD5.0 (at 0 3.602) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 5 5) (drill 2.95) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) ) (module Marble:HOLE2.7_PAD5.0 (layer F.Cu) (tedit 5EB05838) (tstamp 5EB07A06) (at 188.873824 75.660447) (descr "Plated Through Hole: Hole Dia.=2.7mm Pad Dia.=5.0mm") (path /5C9421B5) (fp_text reference B7 (at -4.342824 -0.730447) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value PLATED_HOLE2.7_PAD5.0 (at 0 3.602) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole circle (at 0 0) (size 5 5) (drill 2.95) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) ) 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(xy -8.679785 6.550705) (xy -8.693744 6.543807) (xy -8.703478 6.536337) (xy -8.708571 6.531428) (xy -8.717579 6.521622) (xy -8.72581 6.508908) (xy -8.733297 6.490113) (xy -8.740076 6.462068) (xy -8.746183 6.4216) (xy -8.751652 6.365538) (xy -8.756519 6.290711) (xy -8.760819 6.193947) (xy -8.764586 6.072076) (xy -8.767857 5.921925) (xy -8.770666 5.740323) (xy -8.773048 5.5241) (xy -8.775039 5.270084) (xy -8.776673 4.975103) (xy -8.777986 4.635985) (xy -8.779013 4.249561) (xy -8.779789 3.812658) (xy -8.780349 3.322105) (xy -8.780729 2.774731) (xy -8.780963 2.167364) (xy -8.781086 1.496833) (xy -8.781135 0.759967) (xy -8.781143 -0.018143) (xy -9.071428 -0.018143) (xy -9.071428 6.894285) (xy 9.107714 6.894285)) (layer B.SilkS) (width 0.01)) ) (module "ICs And Semiconductors SMD:SON50P300X300X80-9N-R175X248" (layer F.Cu) (tedit 5D089150) (tstamp 5CF85FE8) (at 270.0782 139.6238 90) (descr "SON, (DFN) 0.50mm,pitch; 8 pin,3.00mm W X 3.00mm L X 0.80mm H body (w/thermal tab 1.75 X2.48mm), IPC Medium Density") (path /5C907554/5CAAC367/5D20E21A) (attr smd) (fp_text reference U42 (at 1.143 2.7178 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value SN65MLVD2DRBT (at 0 2.826 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -2.4 -0.75) (end -2.275 -0.75) (layer F.SilkS) (width 0.25)) (fp_line (start 1.25 1.5) (end 1.5 1.5) (layer F.SilkS) (width 0.2)) (fp_line (start 1.5 1.5) (end 1.5 1.25) (layer F.SilkS) (width 0.2)) (fp_line (start -1.5 1.5) (end -1.25 1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.5 1.5) (end -1.5 1.25) (layer F.SilkS) (width 0.2)) (fp_line (start 1.25 -1.5) (end 1.5 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start 1.5 -1.25) (end 1.5 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.5 -1.5) (end -1.25 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.5 -1.25) (end -1.5 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.5 1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1)) (fp_line (start 1.5 1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 1.5) (end -1.5 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -0.5) (end -0.5 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -0.6) (end -0.6 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -0.7) (end -0.7 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -0.8) (end -0.8 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -0.9) (end -0.9 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1) (end -1 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1.1) (end -1.1 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1.2) (end -1.2 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1.3) (end -1.3 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1.4) (end -1.4 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -2.15 1.8) (end -2.15 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.15 -1.8) (end 2.15 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.15 1.8) (end 2.15 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.15 1.8) (end 2.15 1.8) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.5 -0.75 90) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask) (net 3 +3V3)) (pad 2 smd rect (at -1.5 -0.25 90) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 3 smd rect (at -1.5 0.25 90) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask) (net 703 /FPGA/FPGA_15_16/Rx18_SE)) (pad 4 smd rect (at -1.5 0.75 90) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 5 smd rect (at 1.5 0.75 90) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 6 smd rect (at 1.5 0.25 90) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask) (net 700 /AMC_connector/Rx18_P)) (pad 7 smd rect (at 1.5 -0.25 90) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask) (net 699 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-7.192861 -1.979986) (xy -7.500168 -2.223721) (xy -7.659828 -2.339831) (xy -7.882655 -2.506976) (xy -8.017869 -2.652035) (xy -8.093211 -2.834808) (xy -8.136421 -3.115099) (xy -8.164672 -3.428152) (xy -8.221315 -3.872721) (xy -8.301898 -4.207) (xy -8.382194 -4.369014) (xy -8.518347 -4.645494) (xy -8.515256 -4.698906) (xy -8.212687 -4.698906) (xy -8.11582 -4.528903) (xy -7.950508 -4.489683) (xy -7.803508 -4.610612) (xy -7.7724 -4.7752) (xy -7.835214 -4.973803) (xy -7.976665 -5.067838) (xy -8.126268 -5.030313) (xy -8.189978 -4.935109) (xy -8.212687 -4.698906) (xy -8.515256 -4.698906) (xy -8.501049 -4.944378) (xy -8.356064 -5.20398) (xy -8.109153 -5.362616) (xy -7.957947 -5.3848) (xy -7.681059 -5.301612)) (layer F.SilkS) (width 0.01)) (fp_poly (pts (xy -7.948681 -1.330553) (xy -7.731834 -1.105664) (xy -7.730849 -1.103908) (xy -7.655929 -0.810163) (xy -7.739879 -0.55736) (xy -7.938464 -0.380161) (xy -8.207454 -0.313225) (xy -8.502613 -0.391213) (xy -8.578482 -0.439724) (xy -8.718651 -0.641366) (xy -8.763 -0.8636) (xy -8.683161 -1.158359) (xy -8.482234 -1.343423) (xy -8.218111 -1.405314) (xy -7.948681 -1.330553)) (layer F.SilkS) (width 0.01)) ) (module AG5300_2:U.FL_Hirose_U.FL-R-SMT-1_Vertical (layer F.Cu) (tedit 5A1DBFC3) (tstamp 5CFBFE20) (at 276.5044 145.1356 270) (descr "Hirose U.FL Coaxial https://www.hirose.com/product/en/products/U.FL/U.FL-R-SMT-1%2810%29/") (tags "Hirose U.FL Coaxial") (path /5C907554/5DCA928C/5D0DE1FC) (attr smd) (fp_text reference J2 (at -2.2098 -1.1938) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value "HIROSE_U.FL-R-SMT-1(10)" (at 0.475 3.2 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -2.02 1) (end -2.02 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.32 1) (end -2.02 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.08 1.8) (end 2.28 1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.08 2.5) (end 2.08 1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.28 1.8) (end 2.28 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.32 1.8) (end -1.12 1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.12 2.5) (end -1.12 1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.08 2.5) (end -1.12 2.5) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.835 -1.35) (end 1.835 1.35) (layer F.SilkS) (width 0.12)) (fp_line (start -0.885 -0.76) (end -1.515 -0.76) (layer F.SilkS) (width 0.12)) (fp_line (start -0.885 1.4) (end -0.885 0.76) (layer F.SilkS) (width 0.12)) (fp_line (start -0.925 -0.3) (end -1.075 -0.15) (layer F.Fab) (width 0.1)) (fp_line (start 1.775 -1.3) (end 1.375 -1.3) (layer F.Fab) (width 0.1)) (fp_line (start 1.375 -1.5) (end 1.375 -1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 -1.5) (end 1.375 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start 1.775 -1.3) (end 1.775 1.3) (layer F.Fab) (width 0.1)) (fp_line (start 1.775 1.3) (end 1.375 1.3) (layer F.Fab) (width 0.1)) (fp_line (start 1.375 1.5) (end 1.375 1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 1.5) (end 1.375 1.5) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 -1.3) (end -0.825 -1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 -1.5) (end -0.425 -1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 -0.3) (end -0.825 -1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.925 -0.3) (end -0.825 -0.3) (layer F.Fab) (width 0.1)) (fp_line (start -1.075 0.3) (end -1.075 -0.15) (layer F.Fab) (width 0.1)) (fp_line (start -1.075 0.3) (end -0.825 0.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 0.3) (end -0.825 1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 1.3) (end -0.825 1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 1.5) (end -0.425 1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.885 -1.4) (end -0.885 -0.76) (layer F.SilkS) (width 0.12)) (fp_line (start 2.08 -1.8) (end 2.28 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.08 -1.8) (end 2.08 -2.5) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.32 -1) (end -1.32 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.08 -2.5) (end -1.12 -2.5) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.12 -1.8) (end -1.12 -2.5) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.32 -1.8) (end -1.12 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.32 1.8) (end -1.32 1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.32 -1) (end -2.02 -1) (layer F.CrtYd) (width 0.05)) (fp_text user %R (at 0.475 0) (layer F.Fab) (effects (font (size 0.6 0.6) (thickness 0.09))) ) (pad 2 smd rect (at 0.475 -1.475 270) (size 2.2 1.05) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 1 smd rect (at -1.05 0 270) (size 1.05 1) (layers F.Cu F.Paste F.Mask) (net 714 /FPGA/FPGA_MGT/EXT_CLK_N)) (pad 2 smd rect (at 0.475 1.475 270) (size 2.2 1.05) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (model ${KISYS3DMOD}/Connector_Coaxial.3dshapes/U.FL_Hirose_U.FL-R-SMT-1_Vertical.wrl (offset (xyz 0.4749999928262157 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module AG5300_2:U.FL_Hirose_U.FL-R-SMT-1_Vertical (layer F.Cu) (tedit 5A1DBFC3) (tstamp 5CF957CF) (at 276.5044 140.9954 90) (descr "Hirose U.FL Coaxial https://www.hirose.com/product/en/products/U.FL/U.FL-R-SMT-1%2810%29/") (tags "Hirose U.FL Coaxial") (path /5C907554/5DCA928C/5D0DF996) (attr smd) (fp_text reference J5 (at 2.8702 0.0508 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value "HIROSE_U.FL-R-SMT-1(10)" (at 0.475 3.2 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -2.02 1) (end -2.02 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.32 1) (end -2.02 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.08 1.8) (end 2.28 1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.08 2.5) (end 2.08 1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.28 1.8) (end 2.28 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.32 1.8) (end -1.12 1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.12 2.5) (end -1.12 1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.08 2.5) (end -1.12 2.5) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.835 -1.35) (end 1.835 1.35) (layer F.SilkS) (width 0.12)) (fp_line (start -0.885 -0.76) (end -1.515 -0.76) (layer F.SilkS) (width 0.12)) (fp_line (start -0.885 1.4) (end -0.885 0.76) (layer F.SilkS) (width 0.12)) (fp_line (start -0.925 -0.3) (end -1.075 -0.15) (layer F.Fab) (width 0.1)) (fp_line (start 1.775 -1.3) (end 1.375 -1.3) (layer F.Fab) (width 0.1)) (fp_line (start 1.375 -1.5) (end 1.375 -1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 -1.5) (end 1.375 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start 1.775 -1.3) (end 1.775 1.3) (layer F.Fab) (width 0.1)) (fp_line (start 1.775 1.3) (end 1.375 1.3) (layer F.Fab) (width 0.1)) (fp_line (start 1.375 1.5) (end 1.375 1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 1.5) (end 1.375 1.5) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 -1.3) (end -0.825 -1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 -1.5) (end -0.425 -1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 -0.3) (end -0.825 -1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.925 -0.3) (end -0.825 -0.3) (layer F.Fab) (width 0.1)) (fp_line (start -1.075 0.3) (end -1.075 -0.15) (layer F.Fab) (width 0.1)) (fp_line (start -1.075 0.3) (end -0.825 0.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.825 0.3) (end -0.825 1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 1.3) (end -0.825 1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.425 1.5) (end -0.425 1.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.885 -1.4) (end -0.885 -0.76) (layer F.SilkS) (width 0.12)) (fp_line (start 2.08 -1.8) (end 2.28 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.08 -1.8) (end 2.08 -2.5) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.32 -1) (end -1.32 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.08 -2.5) (end -1.12 -2.5) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.12 -1.8) (end -1.12 -2.5) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.32 -1.8) (end -1.12 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.32 1.8) (end -1.32 1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.32 -1) (end -2.02 -1) (layer F.CrtYd) (width 0.05)) (fp_text user %R (at 0.475 0) (layer F.Fab) (effects (font (size 0.6 0.6) (thickness 0.09))) ) (pad 2 smd rect (at 0.475 -1.475 90) (size 2.2 1.05) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 1 smd rect (at -1.05 0 90) (size 1.05 1) (layers F.Cu F.Paste F.Mask) (net 713 /FPGA/FPGA_MGT/EXT_CLK_P)) (pad 2 smd rect (at 0.475 1.475 90) (size 2.2 1.05) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (model ${KISYS3DMOD}/Connector_Coaxial.3dshapes/U.FL_Hirose_U.FL-R-SMT-1_Vertical.wrl (offset (xyz 0.4749999928262157 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOD2512X110N" (layer B.Cu) (tedit 5CACA40A) (tstamp 5D0275AE) (at 156.5656 169.9768 270) (descr "Small Outline Diode Flat Lead (SOD-323), 1.70mm W X 1.25mm L X 1.10mm H body, IPC Medium Density") (path /5CA40231/5E6615A5) (attr smd) (fp_text reference D18 (at 0 2.001 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BAT165 (at 0 -1.976 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.5 0.75) (end -1.375 0.75) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.85 0.65) (end 0.85 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.65) (end 0.85 -0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 -0.65) (end -0.5 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -0.65) (end -0.3 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.1 -0.65) (end -0.1 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.625) (end 0.85 -0.625) (layer B.Fab) (width 0.1)) (fp_line (start 0.85 -0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.75 -0.625) (end -0.75 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.625) (end -0.65 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.55 -0.625) (end -0.55 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.45 -0.625) (end -0.45 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.35 -0.625) (end -0.35 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.25 -0.625) (end -0.25 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.15 -0.625) (end -0.15 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -2 -0.95) (end 2 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 2 -0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 -0.95) (end -2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 1.3 0 270) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 706 /FMC1_PRSNT_Override) (solder_mask_margin 0.102)) (pad 1 smd rect (at -1.3 0 270) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 707 "Net-(D18-Pad1)") (solder_mask_margin 0.102)) (model "${CERN}/SOD2512X110N(SOD-323).stp" (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOD2512X110N" (layer B.Cu) (tedit 5CACA40A) (tstamp 5D02758F) (at 139.4714 174.0916 270) (descr "Small Outline Diode Flat Lead (SOD-323), 1.70mm W X 1.25mm L X 1.10mm H body, IPC Medium Density") (path /5CA40231/5E66157A) (attr smd) (fp_text reference D17 (at 0 2.001 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BAT165 (at 0 -1.976 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) 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1 GND) (solder_mask_margin 0.102)) (pad 31 thru_hole circle (at -3.4 -14.25 180) (size 1.65 1.65) (drill 0.95) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 32 thru_hole circle (at 1.6 -14.25 180) (size 1.65 1.65) (drill 0.95) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 4 thru_hole rect (at 4.1 -28.5 180) (size 2 2) (drill 1.05) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 thru_hole rect (at -5.9 -28.5 180) (size 2 2) (drill 1.05) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 thru_hole rect (at -15.9 -28.5 180) (size 2 2) (drill 1.05) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 thru_hole rect (at -25.9 -28.5 180) (size 2 2) (drill 1.05) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 41 thru_hole circle (at -8.1 14.25 90) (size 1.65 1.65) (drill 0.95) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 44 thru_hole circle (at -8.1 28.5 90) (size 1.65 1.65) (drill 0.95) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model TYCO_2007132-1.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/TYCO_2007132-1.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module AG5300_2:KSS241GLFS (layer B.Cu) (tedit 5CD15A80) (tstamp 5CD4599B) (at 292.4048 186.2836 90) (path /5BCEDA39/5CF2A4CC) (attr smd) (fp_text reference SW3 (at 3.4036 -4.3688 -90) (layer B.SilkS) (effects (font (size 2 2) (thickness 0.4)) (justify mirror)) ) (fp_text value KSS241GLFS (at 0 3 -90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1 0) (end 1 0) (layer B.Fab) (width 0.12)) (fp_line (start 0 1) (end 0 -1) (layer B.Fab) (width 0.12)) (fp_line (start -4 2) (end 4 2) (layer B.CrtYd) (width 0.12)) (fp_line (start 4 2) (end 4 -2) (layer B.CrtYd) (width 0.12)) (fp_line (start 4 -2) (end -4 -2) (layer B.CrtYd) (width 0.12)) (fp_line (start -4 -2) (end -4 2) (layer B.CrtYd) (width 0.12)) (pad 2 smd rect (at 2.95 0 90) (size 1.7 3.7) (layers B.Cu B.Paste B.Mask) (net 658 "Net-(R263-Pad2)")) (pad 1 smd rect (at -2.95 0 90) (size 1.7 3.7) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (model "C:/Users/Micha/Desktop/Projekty/AMC FMC/import z altiuma/KSS241GLFS.stp" (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz -90 0 -90)) ) ) (module logos3:ESD-Logo_13.2x12mm_SilkScreen (layer B.Cu) (tedit 0) (tstamp 5CD54FCE) (at 246.7356 85.4202 180) (descr "Electrostatic discharge Logo") (tags "Logo ESD") (attr virtual) (fp_text reference REF** (at 0 0 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value ESD-Logo_13.2x12mm_SilkScreen (at 0.75 0 180) (layer B.Fab) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_poly (pts (xy -3.355813 -0.582317) (xy -3.290763 -0.607473) (xy -3.191615 -0.657425) (xy -3.049253 -0.735752) (xy -3.038168 -0.741977) (xy -2.907053 -0.816952) (xy -2.796404 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-0.864253 -3.850199) (xy -0.68332 -4.163063) (xy -0.509719 -4.462734) (xy -0.346001 -4.744784) (xy -0.194719 -5.004782) (xy -0.058426 -5.238301) (xy 0.060326 -5.440909) (xy 0.158985 -5.608177) (xy 0.234999 -5.735676) (xy 0.285814 -5.818977) (xy 0.308879 -5.85365) (xy 0.309845 -5.85439) (xy 0.328085 -5.828329)) (layer F.SilkS) (width 0.01)) ) (module Pads:FIDUCIAL_TOP_S200-400 (layer F.Cu) (tedit 5CB8469A) (tstamp 5CCE9762) (at 147.3454 79.4512) (descr "Square Fiducial Target, Top Layer, 2.0mm, Top Solder 4.0mm, Keepout =4.0mm") (path /5CE2E544) (attr smd) (fp_text reference FTG1 (at 0 -3.84) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value FIDUCIAL_TARGET_C100-200 (at 0 3.829) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 smd rect (at 0 0 45) (size 2 2) (layers F.Cu F.Mask) (solder_mask_margin 1) (solder_paste_margin -0.9)) ) (module Pads:FIDUCIAL_TOP_S200-400 (layer F.Cu) (tedit 5CB8468F) (tstamp 5CCE9767) (at 287.147 174.9298) (descr "Square Fiducial Target, Top Layer, 2.0mm, Top Solder 4.0mm, Keepout =4.0mm") (path /5CE31A16) (attr smd) (fp_text reference FTG2 (at 3.5052 -2.159) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value FIDUCIAL_TARGET_C100-200 (at 0 3.829) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 smd rect (at 0 0 45) (size 2 2) (layers F.Cu F.Mask) (solder_mask_margin 1) (solder_paste_margin -0.9)) ) (module Pads:FIDUCIAL_BOT_S200-400 (layer F.Cu) (tedit 5CB846A4) (tstamp 5CCCDDF4) (at 282.321 80.8228) (descr "Scare Fiducial Target, Bottom Layer, 2.0mm, Bot Sloder 4.0mm, Keepout =4.0mm") (path /5CE3274F) (attr smd) (fp_text reference FTG4 (at -0.0254 4.9272) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value Pads:FIDUCIAL_BOT_S200-400 (at 0 3.829) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 smd rect (at 0 0 45) (size 2 2) (layers B.Cu B.Mask) (solder_mask_margin 1) (solder_paste_margin -1.01)) ) (module Pads:FIDUCIAL_BOT_S200-400 (layer F.Cu) (tedit 5CB846AD) (tstamp 5CCCDDEF) (at 143.0528 207.2894) (descr "Scare Fiducial Target, Bottom Layer, 2.0mm, Bot Sloder 4.0mm, Keepout =4.0mm") (path /5CE32256) (attr smd) (fp_text reference FTG3 (at -0.0528 5.4356) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value FIDUCIAL_TARGET_C100-200 (at 0 3.829) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 smd rect (at 0 0 45) (size 2 2) (layers B.Cu B.Mask) (solder_mask_margin 1) (solder_paste_margin -1.01)) ) (module "ICs And Semiconductors SMD_BGA:BGA180C80P14X14_1200X1200X120" locked (layer B.Cu) (tedit 5CB6E355) (tstamp 5C70AC26) (at 157.376001 181.639999) (descr "BGA, 0.80mm Pitch, Square; 180 Pin, 14 Columns X 14 Rows, Body 12.00mm X 12.00mm X 1.20mm H, IPC Medium Density") (path /5BCEDA39/5BDFEB43) (attr smd) (fp_text reference U2 (at 6.885799 -8.437399) (layer B.SilkS) (effects (font (size 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B.Mask) (net 985 "Net-(U2-PadF10)") (solder_mask_margin 0.102)) (pad F11 smd circle (at 2.8 1.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 326 /MMC/SW) (solder_mask_margin 0.102)) (pad F12 smd circle (at 3.6 1.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 986 "Net-(U2-PadF12)") (solder_mask_margin 0.102)) (pad F13 smd circle (at 4.4 1.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 987 "Net-(U2-PadF13)") (solder_mask_margin 0.102)) (pad F14 smd circle (at 5.2 1.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 709 /FMC_TCK) (solder_mask_margin 0.102)) (pad G1 smd circle (at -5.2 0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad G2 smd circle (at -4.4 0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 57 "Net-(C199-Pad1)") (solder_mask_margin 0.102)) (pad G3 smd circle (at -3.6 0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 334 "Net-(R152-Pad2)") (solder_mask_margin 0.102)) (pad G4 smd circle (at -2.8 0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 988 "Net-(U2-PadG4)") (solder_mask_margin 0.102)) (pad G5 smd circle (at -2 0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 989 "Net-(U2-PadG5)") (solder_mask_margin 0.102)) (pad G10 smd circle (at 2 0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 471 /MMC/Pmod3_6) (solder_mask_margin 0.102)) (pad G11 smd circle (at 2.8 0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 990 "Net-(U2-PadG11)") (solder_mask_margin 0.102)) (pad G12 smd circle (at 3.6 0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 991 "Net-(U2-PadG12)") (solder_mask_margin 0.102)) (pad G13 smd circle (at 4.4 0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad G14 smd circle (at 5.2 0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 992 "Net-(U2-PadG14)") (solder_mask_margin 0.102)) (pad H1 smd circle (at -5.2 -0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 993 "Net-(U2-PadH1)") (solder_mask_margin 0.102)) (pad H2 smd circle (at -4.4 -0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 994 "Net-(U2-PadH2)") (solder_mask_margin 0.102)) (pad H3 smd circle (at -3.6 -0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad H4 smd circle (at -2.8 -0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad H5 smd circle (at -2 -0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 995 "Net-(U2-PadH5)") (solder_mask_margin 0.102)) (pad H10 smd circle (at 2 -0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 996 "Net-(U2-PadH10)") (solder_mask_margin 0.102)) (pad H11 smd circle (at 2.8 -0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 997 "Net-(U2-PadH11)") (solder_mask_margin 0.102)) (pad H12 smd circle (at 3.6 -0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 325 /FPGA/FPGA_RESETn) (solder_mask_margin 0.102)) (pad H13 smd circle (at 4.4 -0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 415 /FPGA/FPGA_SCK) (solder_mask_margin 0.102)) (pad H14 smd circle (at 5.2 -0.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 417 /FPGA/FPGA_SSEL) (solder_mask_margin 0.102)) (pad J1 smd circle (at -5.2 -1.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 107 /LPC_RST) (solder_mask_margin 0.102)) (pad J2 smd circle (at -4.4 -1.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 998 "Net-(U2-PadJ2)") (solder_mask_margin 0.102)) (pad J3 smd circle (at -3.6 -1.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 999 "Net-(U2-PadJ3)") (solder_mask_margin 0.102)) (pad J4 smd circle (at -2.8 -1.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1000 "Net-(U2-PadJ4)") (solder_mask_margin 0.102)) (pad J5 smd circle (at -2 -1.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1001 "Net-(U2-PadJ5)") (solder_mask_margin 0.102)) (pad J10 smd circle (at 2 -1.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 419 /FPGA/FPGA_INT) (solder_mask_margin 0.102)) (pad J11 smd circle (at 2.8 -1.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 337 "Net-(R155-Pad2)") (solder_mask_margin 0.102)) (pad J12 smd circle (at 3.6 -1.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 418 /FPGA/FPGA_MISO) (solder_mask_margin 0.102)) (pad J13 smd circle (at 4.4 -1.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 416 /FPGA/FPGA_MOSI) (solder_mask_margin 0.102)) (pad J14 smd circle (at 5.2 -1.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad K1 smd circle (at -5.2 -2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad K2 smd circle (at -4.4 -2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 422 /MMC/EN_PSU_CH) (solder_mask_margin 0.102)) (pad K3 smd circle (at -3.6 -2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1002 "Net-(U2-PadK3)") (solder_mask_margin 0.102)) (pad K4 smd circle (at -2.8 -2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 24 "Net-(C93-Pad1)") (solder_mask_margin 0.102)) (pad K5 smd circle (at -2 -2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 109 /MMC/OVER_TEMP) (solder_mask_margin 0.102)) (pad K6 smd circle (at -1.2 -2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1003 "Net-(U2-PadK6)") (solder_mask_margin 0.102)) (pad K7 smd circle (at -0.4 -2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 340 /MMC/HW_ID3) (solder_mask_margin 0.102)) (pad K8 smd circle (at 0.4 -2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad K9 smd circle (at 1.2 -2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1004 "Net-(U2-PadK9)") (solder_mask_margin 0.102)) (pad K10 smd circle (at 2 -2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1005 "Net-(U2-PadK10)") (solder_mask_margin 0.102)) (pad K11 smd circle (at 2.8 -2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1006 "Net-(U2-PadK11)") (solder_mask_margin 0.102)) (pad K12 smd circle (at 3.6 -2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 712 /FMC_TRST) (solder_mask_margin 0.102)) (pad K13 smd circle (at 4.4 -2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1007 "Net-(U2-PadK13)") (solder_mask_margin 0.102)) (pad K14 smd circle (at 5.2 -2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1008 "Net-(U2-PadK14)") (solder_mask_margin 0.102)) (pad L1 smd circle (at -5.2 -2.8) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1009 "Net-(U2-PadL1)") (solder_mask_margin 0.102)) (pad L2 smd circle (at -4.4 -2.8) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 23 "Net-(C102-Pad1)") (solder_mask_margin 0.102)) (pad L3 smd circle (at -3.6 -2.8) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 220 /AMC_connector/I2C_IPMB_SDA) (solder_mask_margin 0.102)) (pad L4 smd circle (at -2.8 -2.8) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad L5 smd circle (at -2 -2.8) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1010 "Net-(U2-PadL5)") (solder_mask_margin 0.102)) (pad L6 smd circle (at -1.2 -2.8) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1011 "Net-(U2-PadL6)") (solder_mask_margin 0.102)) (pad L7 smd circle (at -0.4 -2.8) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1012 "Net-(U2-PadL7)") (solder_mask_margin 0.102)) (pad L8 smd circle (at 0.4 -2.8) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad L9 smd circle (at 1.2 -2.8) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad L10 smd circle (at 2 -2.8) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 322 "Net-(R135-Pad2)") (solder_mask_margin 0.102)) (pad L11 smd circle (at 2.8 -2.8) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad L12 smd circle (at 3.6 -2.8) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1013 "Net-(U2-PadL12)") (solder_mask_margin 0.102)) (pad L13 smd circle (at 4.4 -2.8) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad L14 smd circle (at 5.2 -2.8) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1014 "Net-(U2-PadL14)") (solder_mask_margin 0.102)) (pad M1 smd circle (at -5.2 -3.6) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 224 /AMC_connector/I2C_IPMB_SCL) (solder_mask_margin 0.102)) (pad M2 smd circle (at -4.4 -3.6) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1015 "Net-(U2-PadM2)") (solder_mask_margin 0.102)) (pad M3 smd circle (at -3.6 -3.6) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 329 /MMC/HW_ID2) (solder_mask_margin 0.102)) (pad M4 smd circle (at -2.8 -3.6) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 327 /MMC/HW_ID0) (solder_mask_margin 0.102)) (pad M5 smd circle (at -2 -3.6) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1016 "Net-(U2-PadM5)") (solder_mask_margin 0.102)) (pad M6 smd circle (at -1.2 -3.6) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1017 "Net-(U2-PadM6)") (solder_mask_margin 0.102)) (pad M7 smd circle (at -0.4 -3.6) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1018 "Net-(U2-PadM7)") (solder_mask_margin 0.102)) (pad M8 smd circle (at 0.4 -3.6) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1019 "Net-(U2-PadM8)") (solder_mask_margin 0.102)) (pad M9 smd circle (at 1.2 -3.6) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 233 /MMC/EN_FMC1_P12V) (solder_mask_margin 0.102)) (pad M10 smd circle (at 2 -3.6) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 173 /MMC/I2C_PM_SDA) (solder_mask_margin 0.102)) (pad M11 smd circle (at 2.8 -3.6) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1020 "Net-(U2-PadM11)") (solder_mask_margin 0.102)) (pad M12 smd circle (at 3.6 -3.6) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 472 /MMC/Pmod3_4) (solder_mask_margin 0.102)) (pad M13 smd circle (at 4.4 -3.6) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 319 /MMC/LPC_ISPn) (solder_mask_margin 0.102)) (pad M14 smd circle (at 5.2 -3.6) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 708 /FMC_TDI) (solder_mask_margin 0.102)) (pad N1 smd circle (at -5.2 -4.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1021 "Net-(U2-PadN1)") (solder_mask_margin 0.102)) (pad N2 smd circle (at -4.4 -4.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1022 "Net-(U2-PadN2)") (solder_mask_margin 0.102)) (pad N3 smd circle (at -3.6 -4.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 328 /MMC/HW_ID1) (solder_mask_margin 0.102)) (pad N4 smd circle (at -2.8 -4.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1023 "Net-(U2-PadN4)") (solder_mask_margin 0.102)) (pad N5 smd circle (at -2 -4.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1024 "Net-(U2-PadN5)") (solder_mask_margin 0.102)) (pad N6 smd circle (at -1.2 -4.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1025 "Net-(U2-PadN6)") (solder_mask_margin 0.102)) (pad N7 smd circle (at -0.4 -4.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1026 "Net-(U2-PadN7)") (solder_mask_margin 0.102)) (pad N8 smd circle (at 0.4 -4.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 669 "Net-(LD15-Pad1)") (solder_mask_margin 0.102)) (pad N9 smd circle (at 1.2 -4.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad N10 smd circle (at 2 -4.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1027 "Net-(U2-PadN10)") (solder_mask_margin 0.102)) (pad N11 smd circle (at 2.8 -4.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 174 /MMC/I2C_PM_SCL) (solder_mask_margin 0.102)) (pad N12 smd circle (at 3.6 -4.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1028 "Net-(U2-PadN12)") (solder_mask_margin 0.102)) (pad N13 smd circle (at 4.4 -4.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 711 /FMC_TDO) (solder_mask_margin 0.102)) (pad N14 smd circle (at 5.2 -4.4) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 658 "Net-(R263-Pad2)") (solder_mask_margin 0.102)) (pad P1 smd circle (at -5.2 -5.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 667 "Net-(LD14-Pad1)") (solder_mask_margin 0.102)) (pad P2 smd circle (at -4.4 -5.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 665 "Net-(LD13-Pad1)") (solder_mask_margin 0.102)) (pad P3 smd circle (at -3.6 -5.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 414 /MMC/BOOT_MODE2) (solder_mask_margin 0.102)) (pad P4 smd circle (at -2.8 -5.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad P5 smd circle (at -2 -5.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 235 /MMC/EN_FMC2_P12V) (solder_mask_margin 0.102)) (pad P6 smd circle (at -1.2 -5.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1029 "Net-(U2-PadP6)") (solder_mask_margin 0.102)) (pad P7 smd circle (at -0.4 -5.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1030 "Net-(U2-PadP7)") (solder_mask_margin 0.102)) (pad P8 smd circle (at 0.4 -5.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1031 "Net-(U2-PadP8)") (solder_mask_margin 0.102)) (pad P9 smd circle (at 1.2 -5.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 412 /MMC/BOOT_MODE0) (solder_mask_margin 0.102)) (pad P10 smd circle (at 2 -5.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1032 "Net-(U2-PadP10)") (solder_mask_margin 0.102)) (pad P11 smd circle (at 2.8 -5.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 413 /MMC/BOOT_MODE1) (solder_mask_margin 0.102)) (pad P12 smd circle (at 3.6 -5.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 323 "Net-(R136-Pad2)") (solder_mask_margin 0.102)) (pad P13 smd circle (at 4.4 -5.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 1033 "Net-(U2-PadP13)") (solder_mask_margin 0.102)) (pad P14 smd circle (at 5.2 -5.2) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (net 710 /FMC_TMS) (solder_mask_margin 0.102)) (model ${CERN}/BGA180C80P14X14_1200X1200X120.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOIC127P1030X265-16N" locked (layer B.Cu) (tedit 5CB6E3A8) (tstamp 5C8EB242) (at 173.7106 144.4498 270) (descr "SOIC 16, Pitch 1.27mm - Body 7.5x10.3mm, IPC Medium Density") (path /5C907554/5CC8CB69/5C40DA57) (attr smd) (fp_text reference U30 (at -2.7178 6.7056) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value S25FL128SAGMFIR01 (at 0 -6.526 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -5.4 5.25) (end -5.275 5.25) (layer B.SilkS) (width 0.25)) (fp_circle (center -2.325 4.15) (end -2.075 4.15) (layer B.SilkS) (width 0.5)) (fp_circle (center -2.75 4.15) (end -2.25 4.15) (layer B.Fab) (width 0.1)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -3.325 -5.15) (end -3.325 5.15) (layer B.SilkS) (width 0.2)) (fp_line (start -3.325 5.15) (end 3.325 5.15) (layer B.SilkS) (width 0.2)) (fp_line (start 3.325 -5.15) (end 3.325 5.15) (layer B.SilkS) (width 0.2)) (fp_line (start -3.325 -5.15) (end 3.325 -5.15) (layer B.SilkS) (width 0.2)) (fp_line (start -3.75 -5.15) (end -3.75 5.15) (layer B.Fab) (width 0.1)) (fp_line (start -3.75 5.15) (end 3.75 5.15) (layer B.Fab) (width 0.1)) (fp_line (start 3.75 -5.15) (end 3.75 5.15) (layer B.Fab) (width 0.1)) (fp_line (start -3.75 -5.15) (end 3.75 -5.15) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -5.9 -5.5) (end -5.9 5.5) (layer B.CrtYd) (width 0.05)) (fp_line (start -5.9 5.5) (end 5.9 5.5) (layer B.CrtYd) (width 0.05)) (fp_line (start 5.9 -5.5) (end 5.9 5.5) (layer B.CrtYd) (width 0.05)) (fp_line (start -5.9 -5.5) (end 5.9 -5.5) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -4.65 4.445 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 359 "Net-(R210-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -4.65 3.175 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 10 "Net-(C38-Pad1)") (solder_mask_margin 0.102)) (pad 3 smd rect (at -4.65 1.905 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 1085 "Net-(U30-Pad3)") (solder_mask_margin 0.102)) (pad 4 smd rect (at -4.65 0.635 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 1086 "Net-(U30-Pad4)") (solder_mask_margin 0.102)) (pad 5 smd rect (at -4.65 -0.635 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 1087 "Net-(U30-Pad5)") (solder_mask_margin 0.102)) (pad 6 smd rect (at -4.65 -1.905 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 1088 "Net-(U30-Pad6)") (solder_mask_margin 0.102)) (pad 7 smd rect (at -4.65 -3.175 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 356 /FPGA/FPGA_13_14/CFG_FCS) (solder_mask_margin 0.102)) (pad 8 smd rect (at -4.65 -4.445 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 392 /FPGA/FPGA_13_14/CFG_DIN) (solder_mask_margin 0.102)) (pad 9 smd rect (at 4.65 -4.445 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 357 /FPGA/FPGA_13_14/CFG_WP) (solder_mask_margin 0.102)) (pad 10 smd rect (at 4.65 -3.175 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 11 smd rect (at 4.65 -1.905 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 1089 "Net-(U30-Pad11)") (solder_mask_margin 0.102)) (pad 12 smd rect (at 4.65 -0.635 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 1090 "Net-(U30-Pad12)") (solder_mask_margin 0.102)) (pad 13 smd rect (at 4.65 0.635 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 1091 "Net-(U30-Pad13)") (solder_mask_margin 0.102)) (pad 14 smd rect (at 4.65 1.905 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 446 "Net-(C39-Pad1)") (solder_mask_margin 0.102)) (pad 15 smd rect (at 4.65 3.175 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 393 /FPGA/FPGA_13_14/CFG_MOSI) (solder_mask_margin 0.102)) (pad 16 smd rect (at 4.65 4.445 270) (size 2 0.6) (layers B.Cu B.Paste B.Mask) (net 394 /FPGA/CCLK) (solder_mask_margin 0.102)) (model ${CERN}/SOIC127P1030X265-16N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:QFN50P800X800X100-57N-S437" (layer F.Cu) (tedit 5CB45BD4) (tstamp 5C6F79EA) (at 275.09724 169.6466) (descr "QFN, 0.50mm Pitch, Square; 56 Pin, 8.00mm L X 8.00mm W X 1.00mm H Body (4.37mm X 4.37mm Thermal Tab), IPC Medium Density") (path /5BCEDA59/5C5FDF8C) (attr smd) (fp_text reference U4 (at -0.26924 -8.5598) (layer F.SilkS) (effects (font (size 2.5 2.5) (thickness 0.5))) ) (fp_text value 88E1512-XX-NNP2I000 (at 0 5.676) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -5 -3.25) (end -4.875 -3.25) (layer F.SilkS) (width 0.25)) (fp_circle (center -3 -3) (end -2.5 -3) (layer F.Fab) (width 0.1)) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -4 -3.75) (end -4 -3.8) (layer F.SilkS) (width 0.2)) (fp_line (start -4 -3.8) (end -3.8 -4) (layer F.SilkS) (width 0.2)) (fp_line (start -3.8 -4) (end -3.75 -4) (layer F.SilkS) (width 0.2)) (fp_line (start 4 -3.75) (end 4 -4) (layer F.SilkS) (width 0.2)) (fp_line (start 3.75 -4) (end 4 -4) (layer F.SilkS) (width 0.2)) (fp_line (start -4 4) (end -4 3.75) (layer F.SilkS) (width 0.2)) (fp_line (start -4 4) (end -3.75 4) (layer F.SilkS) (width 0.2)) (fp_line (start 4 4) (end 4 3.75) (layer F.SilkS) (width 0.2)) (fp_line (start 3.75 4) (end 4 4) (layer F.SilkS) (width 0.2)) (fp_line (start -4 4) (end -4 -4) (layer F.Fab) (width 0.1)) (fp_line (start -4 -4) (end 4 -4) (layer F.Fab) (width 0.1)) (fp_line (start 4 4) (end 4 -4) (layer F.Fab) (width 0.1)) (fp_line (start -4 4) (end 4 4) (layer F.Fab) (width 0.1)) (fp_line (start -4.65 4.65) (end -4.65 -4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -4.65 -4.65) (end 4.65 -4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 4.65 4.65) (end 4.65 -4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -4.65 4.65) (end 4.65 4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 57 smd rect (at 0 0) (size 4.37 4.37) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 56 smd roundrect (at -3.25 -3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 727 /ETH_PHY/RGMII_TX_EN) (solder_mask_margin 0.102)) (pad 55 smd roundrect (at -2.75 -3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 729 /ETH_PHY/RGMII_TXD3) (solder_mask_margin 0.102)) (pad 54 smd roundrect (at -2.25 -3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 732 /ETH_PHY/RGMII_TXD2) (solder_mask_margin 0.102)) (pad 53 smd roundrect (at -1.75 -3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 728 /ETH_PHY/RGMII_TX_CLK) (solder_mask_margin 0.102)) (pad 52 smd roundrect (at -1.25 -3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 51 smd roundrect (at -0.75 -3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 730 /ETH_PHY/RGMII_TXD1) (solder_mask_margin 0.102)) (pad 50 smd roundrect (at -0.25 -3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 731 /ETH_PHY/RGMII_TXD0) (solder_mask_margin 0.102)) (pad 49 smd roundrect (at 0.25 -3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 48 smd roundrect (at 0.75 -3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 726 "Net-(R296-Pad1)") (solder_mask_margin 0.102)) (pad 47 smd roundrect (at 1.25 -3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 724 "Net-(R295-Pad1)") (solder_mask_margin 0.102)) (pad 46 smd roundrect (at 1.75 -3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 718 "Net-(R292-Pad1)") (solder_mask_margin 0.102)) (pad 45 smd roundrect (at 2.25 -3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 722 "Net-(R294-Pad1)") (solder_mask_margin 0.102)) (pad 44 smd roundrect (at 2.75 -3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 720 "Net-(R293-Pad1)") (solder_mask_margin 0.102)) (pad 43 smd roundrect (at 3.25 -3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 716 "Net-(R291-Pad1)") (solder_mask_margin 0.102)) (pad 42 smd roundrect (at 3.95 -3.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 41 smd roundrect (at 3.95 -2.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1038 "Net-(U4-Pad41)") (solder_mask_margin 0.102)) (pad 40 smd roundrect (at 3.95 -2.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1039 "Net-(U4-Pad40)") (solder_mask_margin 0.102)) (pad 39 smd roundrect (at 3.95 -1.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1040 "Net-(U4-Pad39)") (solder_mask_margin 0.102)) (pad 38 smd roundrect (at 3.95 -1.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 11 "Net-(C42-Pad2)") (solder_mask_margin 0.102)) (pad 37 smd roundrect (at 3.95 -0.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1041 "Net-(U4-Pad37)") (solder_mask_margin 0.102)) (pad 36 smd roundrect (at 3.95 -0.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1042 "Net-(U4-Pad36)") (solder_mask_margin 0.102)) (pad 35 smd roundrect (at 3.95 0.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 11 "Net-(C42-Pad2)") (solder_mask_margin 0.102)) (pad 34 smd roundrect (at 3.95 0.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 698 "Net-(C374-Pad1)") (solder_mask_margin 0.102)) (pad 33 smd roundrect (at 3.95 1.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1043 "Net-(U4-Pad33)") (solder_mask_margin 0.102)) (pad 32 smd roundrect (at 3.95 1.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1044 "Net-(U4-Pad32)") (solder_mask_margin 0.102)) (pad 31 smd roundrect (at 3.95 2.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1045 "Net-(U4-Pad31)") (solder_mask_margin 0.102)) (pad 30 smd roundrect (at 3.95 2.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 291 "Net-(R66-Pad2)") (solder_mask_margin 0.102)) (pad 29 smd roundrect (at 3.95 3.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1046 "Net-(U4-Pad29)") (solder_mask_margin 0.102)) (pad 28 smd roundrect (at 3.25 3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 651 /ETH_PHY/MDI0_P) (solder_mask_margin 0.102)) (pad 27 smd roundrect (at 2.75 3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 650 /ETH_PHY/MDI0_N) (solder_mask_margin 0.102)) (pad 26 smd roundrect (at 2.25 3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 11 "Net-(C42-Pad2)") (solder_mask_margin 0.102)) (pad 25 smd roundrect (at 1.75 3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 13 "Net-(C47-Pad2)") (solder_mask_margin 0.102)) (pad 24 smd roundrect (at 1.25 3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 648 /ETH_PHY/MDI1_P) (solder_mask_margin 0.102)) (pad 23 smd roundrect (at 0.75 3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 649 /ETH_PHY/MDI1_N) (solder_mask_margin 0.102)) (pad 22 smd roundrect (at 0.25 3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 647 /ETH_PHY/MDI2_P) (solder_mask_margin 0.102)) (pad 21 smd roundrect (at -0.25 3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 646 /ETH_PHY/MDI2_N) (solder_mask_margin 0.102)) (pad 20 smd roundrect (at -0.75 3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 13 "Net-(C47-Pad2)") (solder_mask_margin 0.102)) (pad 19 smd roundrect (at -1.25 3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 11 "Net-(C42-Pad2)") (solder_mask_margin 0.102)) (pad 18 smd roundrect (at -1.75 3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 645 /ETH_PHY/MDI3_P) (solder_mask_margin 0.102)) (pad 17 smd roundrect (at -2.25 3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 644 /ETH_PHY/MDI3_N) (solder_mask_margin 0.102)) (pad 16 smd roundrect (at -2.75 3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 401 /ETH_PHY/PHY_RSTn) (solder_mask_margin 0.102)) (pad 15 smd roundrect (at -3.25 3.95 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 290 "Net-(R65-Pad2)") (solder_mask_margin 0.102)) (pad 14 smd roundrect (at -3.95 3.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 292 "Net-(R67-Pad2)") (solder_mask_margin 0.102)) (pad 13 smd roundrect (at -3.95 2.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 338 "Net-(R156-Pad2)") (solder_mask_margin 0.102)) (pad 12 smd roundrect (at -3.95 2.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1047 "Net-(U4-Pad12)") (solder_mask_margin 0.102)) (pad 11 smd roundrect (at -3.95 1.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 10 smd roundrect (at -3.95 1.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 9 smd roundrect (at -3.95 0.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1048 "Net-(U4-Pad9)") (solder_mask_margin 0.102)) (pad 8 smd roundrect (at -3.95 0.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 289 "Net-(R64-Pad1)") (solder_mask_margin 0.102)) (pad 7 smd roundrect (at -3.95 -0.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 681 "Net-(U4-Pad7)") (solder_mask_margin 0.102)) (pad 6 smd roundrect (at -3.95 -0.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 14 +1V0) (solder_mask_margin 0.102)) (pad 5 smd roundrect (at -3.95 -1.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 221 /ETH_PHY/SD_OUT_N) (solder_mask_margin 0.102)) (pad 4 smd roundrect (at -3.95 -1.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 215 /ETH_PHY/SD_OUT_P) (solder_mask_margin 0.102)) (pad 3 smd roundrect (at -3.95 -2.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 11 "Net-(C42-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd roundrect (at -3.95 -2.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 216 /AMC_connector/Rx0_N) (solder_mask_margin 0.102)) (pad 1 smd roundrect (at -3.95 -3.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 217 /AMC_connector/Rx0_P) (solder_mask_margin 0.102)) (model QFN50P800X800X100-57N-S437.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/QFN50P800X800X100-57N-S437.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD_BGA:BGA484C100P22X22_2300X2300X240" locked (layer F.Cu) (tedit 5CB45B72) (tstamp 5C678EC6) (at 232.918 141.986 270) (descr "BGA,1.00mm pitch,square;484 pin,22 columns X 22 rows,23.00mm X 23.00mm X 2.40mm H") (path /5C907554/5C417BCB/5C5BFA2D) (attr smd) (fp_text reference U1 (at -13.1318 -14.1732) (layer F.SilkS) (effects (font (size 2.5 2.5) (thickness 0.5))) ) (fp_text value XC7A100T-2FGG484C (at 0 14.526 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -12.1 -10.5) (end -11.975 -10.5) (layer F.SilkS) (width 0.25)) (fp_line (start -11.5 11.5) (end 0 11.5) (layer F.SilkS) (width 0.2)) (fp_line (start -11.5 11.5) (end -11.5 -11.5) (layer F.SilkS) (width 0.2)) (fp_line (start -11.5 -11.5) (end 11.5 -11.5) (layer F.SilkS) (width 0.2)) (fp_line (start 11.5 11.5) (end 11.5 -11.5) (layer F.SilkS) (width 0.2)) (fp_line (start 0 11.5) (end 11.5 11.5) (layer F.SilkS) (width 0.2)) (fp_line (start -11.5 -11.3) (end -11.3 -11.5) (layer F.SilkS) (width 0.2)) (fp_line (start -11.5 -11.1) (end -11.1 -11.5) (layer F.SilkS) (width 0.2)) (fp_line (start -11.5 -10.9) (end -10.9 -11.5) (layer F.SilkS) (width 0.2)) (fp_line (start -11.5 -10.7) (end -10.7 -11.5) (layer F.SilkS) (width 0.2)) (fp_line (start -11.5 -10.5) (end -10.5 -11.5) (layer F.SilkS) (width 0.2)) (fp_line (start -11.5 -10.5) (end -10.5 -11.5) (layer F.Fab) (width 0.1)) (fp_line (start -11.5 -10.6) (end -10.6 -11.5) (layer F.Fab) (width 0.1)) (fp_line (start -11.5 -10.7) (end -10.7 -11.5) (layer F.Fab) (width 0.1)) (fp_line (start -11.5 -10.8) (end -10.8 -11.5) (layer F.Fab) (width 0.1)) (fp_line (start -11.5 -10.9) (end -10.9 -11.5) (layer F.Fab) (width 0.1)) (fp_line (start -11.5 -11) (end -11 -11.5) (layer F.Fab) (width 0.1)) (fp_line (start -11.5 -11.1) (end -11.1 -11.5) (layer F.Fab) (width 0.1)) (fp_line (start -11.5 -11.2) (end -11.2 -11.5) (layer F.Fab) (width 0.1)) (fp_line (start -11.5 -11.3) (end -11.3 -11.5) (layer F.Fab) (width 0.1)) (fp_line (start -11.5 -11.4) (end -11.4 -11.5) (layer F.Fab) (width 0.1)) (fp_line (start 0 11.5) (end 11.5 11.5) (layer F.Fab) (width 0.1)) (fp_line (start 11.5 11.5) (end 11.5 -11.5) (layer F.Fab) (width 0.1)) (fp_line (start -11.5 -11.5) (end 11.5 -11.5) (layer F.Fab) (width 0.1)) (fp_line (start -11.5 11.5) (end -11.5 -11.5) (layer F.Fab) (width 0.1)) (fp_line (start -11.5 11.5) (end 0 11.5) (layer F.Fab) (width 0.1)) (fp_line (start 13.5 13.5) (end 13.5 -13.5) (layer F.CrtYd) (width 0.05)) (fp_line (start -13.5 -13.5) (end 13.5 -13.5) (layer F.CrtYd) (width 0.05)) (fp_line (start -13.5 13.5) (end -13.5 -13.5) (layer F.CrtYd) (width 0.05)) (fp_line (start -13.5 13.5) (end 13.5 13.5) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) 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(layers F.Cu F.Paste F.Mask) (net 505 FMC2_LA_8_N) (solder_mask_margin 0.102)) (pad Y1 smd circle (at -10.5 8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 521 FMC2_LA_10_N) (solder_mask_margin 0.102)) (pad W22 smd circle (at 10.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 554 FMC1_LA_13_N) (solder_mask_margin 0.102)) (pad W21 smd circle (at 9.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 555 FMC1_LA_13_P) (solder_mask_margin 0.102)) (pad W20 smd circle (at 8.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 146 /FMC_1/FMC1_CLK0_M2C_N) (solder_mask_margin 0.102)) (pad W19 smd circle (at 7.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 147 /FMC_1/FMC1_CLK0_M2C_P) (solder_mask_margin 0.102)) (pad W18 smd circle (at 6.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad W17 smd circle (at 5.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 528 FMC1_LA_4_N) (solder_mask_margin 0.102)) (pad W16 smd circle (at 4.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 531 FMC2_LA_22_N) (solder_mask_margin 0.102)) (pad W15 smd circle (at 3.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 541 FMC2_LA_22_P) (solder_mask_margin 0.102)) (pad W14 smd circle (at 2.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 559 FMC2_LA_24_P) (solder_mask_margin 0.102)) (pad W13 smd circle (at 1.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad W12 smd circle (at 0.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 560 FMC2_LA_17_N) (solder_mask_margin 0.102)) (pad W11 smd circle (at -0.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 561 FMC2_LA_17_P) (solder_mask_margin 0.102)) (pad W10 smd circle (at -1.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 542 FMC2_LA_23_N) (solder_mask_margin 0.102)) (pad W9 smd circle (at -2.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 438 /FPGA_RTS) (solder_mask_margin 0.102)) (pad W8 smd circle (at -3.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad W7 smd circle (at -4.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 511 FMC2_LA_13_N) (solder_mask_margin 0.102)) (pad W6 smd circle (at -5.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 504 FMC2_LA_12_P) (solder_mask_margin 0.102)) (pad W5 smd circle (at -6.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 503 FMC2_LA_12_N) (solder_mask_margin 0.102)) (pad W4 smd circle (at -7.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 128 /FMC_2/FMC2_CLK0_M2C_N) (solder_mask_margin 0.102)) (pad W3 smd circle (at -8.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad W2 smd circle (at -9.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 506 FMC2_LA_8_P) (solder_mask_margin 0.102)) (pad W1 smd circle (at -10.5 7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 522 FMC2_LA_10_P) (solder_mask_margin 0.102)) (pad V22 smd circle (at 10.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 934 "Net-(U1-PadV22)") (solder_mask_margin 0.102)) (pad V21 smd circle (at 9.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad V20 smd circle (at 8.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 563 FMC1_LA_0_N) (solder_mask_margin 0.102)) (pad V19 smd circle (at 7.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 564 FMC1_LA_1_N) (solder_mask_margin 0.102)) (pad V18 smd circle (at 6.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 565 FMC1_LA_1_P) (solder_mask_margin 0.102)) (pad V17 smd circle (at 5.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 539 FMC1_LA_4_P) (solder_mask_margin 0.102)) (pad V16 smd circle (at 4.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad V15 smd circle (at 3.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 567 FMC2_LA_30_N) (solder_mask_margin 0.102)) (pad V14 smd circle (at 2.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 568 FMC2_LA_18_N) (solder_mask_margin 0.102)) (pad V13 smd circle (at 1.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 569 FMC2_LA_18_P) (solder_mask_margin 0.102)) (pad V12 smd circle (at 0.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 364 /FPGA/FPGA_TCK) (solder_mask_margin 0.102)) (pad V11 smd circle (at -0.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad V10 smd circle (at -1.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 551 FMC2_LA_23_P) (solder_mask_margin 0.102)) (pad V9 smd circle (at -2.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 496 FMC2_LA_7_P) (solder_mask_margin 0.102)) (pad V8 smd circle (at -3.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 495 FMC2_LA_7_N) (solder_mask_margin 0.102)) (pad V7 smd circle (at -4.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 512 FMC2_LA_13_P) (solder_mask_margin 0.102)) (pad V6 smd circle (at -5.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad V5 smd circle (at -6.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 497 FMC2_LA_4_N) (solder_mask_margin 0.102)) (pad V4 smd circle (at -7.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 129 /FMC_2/FMC2_CLK0_M2C_P) (solder_mask_margin 0.102)) (pad V3 smd circle (at -8.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 499 FMC2_LA_2_N) (solder_mask_margin 0.102)) (pad V2 smd circle (at -9.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 507 FMC2_LA_3_N) (solder_mask_margin 0.102)) (pad V1 smd circle (at -10.5 6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad U22 smd circle (at 10.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 355 /FPGA/FPGA_13_14/CFG_PUDC) (solder_mask_margin 0.102)) (pad U21 smd circle (at 9.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 935 "Net-(U1-PadU21)") (solder_mask_margin 0.102)) (pad U20 smd circle (at 8.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 571 FMC1_LA_0_P) (solder_mask_margin 0.102)) (pad U19 smd circle (at 7.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad U18 smd circle (at 6.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 580 FMC1_LA_12_N) (solder_mask_margin 0.102)) (pad U17 smd circle (at 5.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 585 FMC1_LA_12_P) (solder_mask_margin 0.102)) (pad U16 smd circle (at 4.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 552 FMC2_LA_29_N) (solder_mask_margin 0.102)) (pad U15 smd circle (at 3.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 575 FMC2_LA_30_P) (solder_mask_margin 0.102)) (pad U14 smd circle (at 2.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad U13 smd circle (at 1.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 362 /FPGA/FPGA_TDO) (solder_mask_margin 0.102)) (pad U12 smd circle (at 0.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 341 /FPGA/FPGA_PWR&MISC/FPGA_INIT) (solder_mask_margin 0.102)) (pad U11 smd circle (at -0.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 695 "Net-(R283-Pad2)") (solder_mask_margin 0.102)) (pad U10 smd circle (at -1.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 696 "Net-(R284-Pad1)") (solder_mask_margin 0.102)) (pad U9 smd circle (at -2.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 697 "Net-(R285-Pad1)") (solder_mask_margin 0.102)) (pad U8 smd circle (at -3.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad U7 smd circle (at -4.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 440 /FPGA_TxD) (solder_mask_margin 0.102)) (pad U6 smd circle (at -5.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 498 FMC2_LA_4_P) (solder_mask_margin 0.102)) (pad U5 smd circle (at -6.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 509 FMC2_LA_0_N) (solder_mask_margin 0.102)) (pad U4 smd circle (at -7.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad U3 smd circle (at -8.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 500 FMC2_LA_2_P) (solder_mask_margin 0.102)) (pad U2 smd circle (at -9.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 508 FMC2_LA_3_P) (solder_mask_margin 0.102)) (pad U1 smd circle (at -10.5 5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 523 FMC2_LA_6_N) (solder_mask_margin 0.102)) (pad T22 smd circle (at 10.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad T21 smd circle (at 9.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 936 "Net-(U1-PadT21)") (solder_mask_margin 0.102)) (pad T20 smd circle (at 8.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 937 "Net-(U1-PadT20)") (solder_mask_margin 0.102)) (pad T19 smd circle (at 7.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 356 /FPGA/FPGA_13_14/CFG_FCS) (solder_mask_margin 0.102)) (pad T18 smd circle (at 6.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 583 FMC1_LA_9_N) (solder_mask_margin 0.102)) (pad T17 smd circle (at 5.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad T16 smd circle (at 4.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 553 FMC2_LA_29_P) (solder_mask_margin 0.102)) (pad T15 smd circle (at 3.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 562 FMC2_LA_28_N) (solder_mask_margin 0.102)) (pad T14 smd circle (at 2.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 570 FMC2_LA_28_P) (solder_mask_margin 0.102)) (pad T13 smd circle (at 1.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 363 /FPGA/FPGA_TMS) (solder_mask_margin 0.102)) (pad T12 smd circle (at 0.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad T11 smd circle (at -0.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad T10 smd circle (at -1.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad T9 smd circle (at -2.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad T8 smd circle (at -3.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad T7 smd circle (at -4.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad T6 smd circle (at -5.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 515 FMC2_LA_5_N) (solder_mask_margin 0.102)) (pad T5 smd circle (at -6.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 510 FMC2_LA_0_P) (solder_mask_margin 0.102)) (pad T4 smd circle (at -7.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 131 /FMC_2/FMC2_CLK1_M2C_N) (solder_mask_margin 0.102)) (pad T3 smd circle (at -8.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 938 "Net-(U1-PadT3)") (solder_mask_margin 0.102)) (pad T2 smd circle (at -9.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad T1 smd circle (at -10.5 4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 524 FMC2_LA_6_P) (solder_mask_margin 0.102)) (pad R22 smd circle (at 10.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 392 /FPGA/FPGA_13_14/CFG_DIN) (solder_mask_margin 0.102)) (pad R21 smd circle (at 9.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 360 /FPGA/FPGA_13_14/CFG_D03) (solder_mask_margin 0.102)) (pad R20 smd circle (at 8.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad R19 smd circle (at 7.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 572 FMC1_LA_5_N) (solder_mask_margin 0.102)) (pad R18 smd circle (at 6.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 588 FMC1_LA_9_P) (solder_mask_margin 0.102)) (pad R17 smd circle (at 5.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 582 FMC1_LA_11_N) (solder_mask_margin 0.102)) (pad R16 smd circle (at 4.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 527 FMC1_LA_2_N) (solder_mask_margin 0.102)) (pad R15 smd circle (at 3.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad R14 smd circle (at 2.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 525 FMC1_LA_16_N) (solder_mask_margin 0.102)) (pad R13 smd circle (at 1.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 361 /FPGA/FPGA_TDI) (solder_mask_margin 0.102)) (pad R12 smd circle (at 0.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad R11 smd circle (at -0.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 488 VCCAUX) (solder_mask_margin 0.102)) (pad R10 smd circle (at -1.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad R9 smd circle (at -2.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad R8 smd circle (at -3.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad R7 smd circle (at -4.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad R6 smd circle (at -5.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 516 FMC2_LA_5_P) (solder_mask_margin 0.102)) (pad R5 smd circle (at -6.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad R4 smd circle (at -7.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 132 /FMC_2/FMC2_CLK1_M2C_P) (solder_mask_margin 0.102)) (pad R3 smd circle (at -8.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 939 "Net-(U1-PadR3)") (solder_mask_margin 0.102)) (pad R2 smd circle (at -9.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 940 "Net-(U1-PadR2)") (solder_mask_margin 0.102)) (pad R1 smd circle (at -10.5 3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 261 /SDRAM/DDR3_A13) (solder_mask_margin 0.102)) (pad P22 smd circle (at 10.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 393 /FPGA/FPGA_13_14/CFG_MOSI) (solder_mask_margin 0.102)) (pad P21 smd circle (at 9.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 358 /FPGA/FPGA_13_14/CFG_D02) (solder_mask_margin 0.102)) (pad P20 smd circle (at 8.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 941 "Net-(U1-PadP20)") (solder_mask_margin 0.102)) (pad P19 smd circle (at 7.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 573 FMC1_LA_5_P) (solder_mask_margin 0.102)) (pad P18 smd circle (at 6.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad P17 smd circle (at 5.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 586 FMC1_LA_8_N) (solder_mask_margin 0.102)) (pad P16 smd circle (at 4.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 587 FMC1_LA_11_P) (solder_mask_margin 0.102)) (pad P15 smd circle (at 3.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 538 FMC1_LA_2_P) (solder_mask_margin 0.102)) (pad P14 smd circle (at 2.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 526 FMC1_LA_16_P) (solder_mask_margin 0.102)) (pad P13 smd circle (at 1.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad P12 smd circle (at 0.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 488 VCCAUX) (solder_mask_margin 0.102)) (pad P11 smd circle (at -0.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad P10 smd circle (at -1.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad P9 smd circle (at -2.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad P8 smd circle (at -3.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad P7 smd circle (at -4.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad P6 smd circle (at -5.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 265 /SDRAM/DDR3_A2) (solder_mask_margin 0.102)) (pad P5 smd circle (at -6.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 271 /FPGA/DDR3_CK_P) (solder_mask_margin 0.102)) (pad P4 smd circle (at -7.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 272 /FPGA/DDR3_CK_N) (solder_mask_margin 0.102)) (pad P3 smd circle (at -8.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad P2 smd circle (at -9.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 259 /SDRAM/DDR3_A9) (solder_mask_margin 0.102)) (pad P1 smd circle (at -10.5 2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 268 /SDRAM/DDR3_A8) (solder_mask_margin 0.102)) (pad N22 smd circle (at 10.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 604 FMC1_LA_27_P) (solder_mask_margin 0.102)) (pad N21 smd circle (at 9.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad N20 smd circle (at 8.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 611 FMC1_LA_23_P) (solder_mask_margin 0.102)) (pad N19 smd circle (at 7.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 619 FMC1_LA_21_N) (solder_mask_margin 0.102)) (pad N18 smd circle (at 6.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 612 FMC1_LA_21_P) (solder_mask_margin 0.102)) (pad N17 smd circle (at 5.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 594 FMC1_LA_8_P) (solder_mask_margin 0.102)) (pad N16 smd circle (at 4.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad N15 smd circle (at 3.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 942 "Net-(U1-PadN15)") (solder_mask_margin 0.102)) (pad N14 smd circle (at 2.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 556 FMC1_LA_3_N) (solder_mask_margin 0.102)) (pad N13 smd circle (at 1.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 566 FMC1_LA_3_P) (solder_mask_margin 0.102)) (pad N12 smd circle (at 0.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 225 /FPGA/PROG_B) (solder_mask_margin 0.102)) (pad N11 smd circle (at -0.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 486 VCCBRAM) (solder_mask_margin 0.102)) (pad N10 smd circle (at -1.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 55 /FPGA/DXP_0) (solder_mask_margin 0.102)) (pad N9 smd circle (at -2.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 320 /FPGA/DXN_0) (solder_mask_margin 0.102)) (pad N8 smd circle (at -3.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad N7 smd circle (at -4.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad N6 smd circle (at -5.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad N5 smd circle (at -6.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 260 /SDRAM/DDR3_A11) (solder_mask_margin 0.102)) (pad N4 smd circle (at -7.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 304 /SDRAM/DDR3_BA2) (solder_mask_margin 0.102)) (pad N3 smd circle (at -8.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 274 /SDRAM/DDR3_A14) (solder_mask_margin 0.102)) (pad N2 smd circle (at -9.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 267 /SDRAM/DDR3_A6) (solder_mask_margin 0.102)) (pad N1 smd circle (at -10.5 1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad M22 smd circle (at 10.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 603 FMC1_LA_27_N) (solder_mask_margin 0.102)) (pad M21 smd circle (at 9.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 623 FMC1_LA_22_P) (solder_mask_margin 0.102)) (pad M20 smd circle (at 8.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 618 FMC1_LA_23_N) (solder_mask_margin 0.102)) (pad M19 smd circle (at 7.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad M18 smd circle (at 6.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 609 FMC1_LA_25_P) (solder_mask_margin 0.102)) (pad M17 smd circle (at 5.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 401 /ETH_PHY/PHY_RSTn) (solder_mask_margin 0.102)) (pad M16 smd circle (at 4.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 601 FMC1_LA_28_N) (solder_mask_margin 0.102)) (pad M15 smd circle (at 3.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 598 FMC1_LA_28_P) (solder_mask_margin 0.102)) (pad M14 smd circle (at 2.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad M13 smd circle (at 1.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 625 FMC1_LA_20_P) (solder_mask_margin 0.102)) (pad M12 smd circle (at 0.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 488 VCCAUX) (solder_mask_margin 0.102)) (pad M11 smd circle (at -0.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad M10 smd circle (at -1.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 59 /FPGA/FPGA_PWR&MISC/GNDADC) (solder_mask_margin 0.102)) (pad M9 smd circle (at -2.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 59 /FPGA/FPGA_PWR&MISC/GNDADC) (solder_mask_margin 0.102)) (pad M8 smd circle (at -3.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad M7 smd circle (at -4.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad M6 smd circle (at -5.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 258 /SDRAM/DDR3_A7) (solder_mask_margin 0.102)) (pad M5 smd circle (at -6.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 255 /SDRAM/DDR3_A1) (solder_mask_margin 0.102)) (pad M4 smd circle (at -7.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad M3 smd circle (at -8.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 257 /SDRAM/DDR3_A5) (solder_mask_margin 0.102)) (pad M2 smd circle (at -9.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 263 /SDRAM/DDR3_BA1) (solder_mask_margin 0.102)) (pad M1 smd circle (at -10.5 0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 266 /SDRAM/DDR3_A4) (solder_mask_margin 0.102)) (pad L22 smd circle (at 10.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad L21 smd circle (at 9.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 622 FMC1_LA_22_N) (solder_mask_margin 0.102)) (pad L20 smd circle (at 8.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 943 "Net-(U1-PadL20)") (solder_mask_margin 0.102)) (pad L19 smd circle (at 7.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 717 /ETH_PHY/RGMII_RX_CLK) (solder_mask_margin 0.102)) (pad L18 smd circle (at 6.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 613 FMC1_LA_25_N) (solder_mask_margin 0.102)) (pad L17 smd circle (at 5.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad L16 smd circle (at 4.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 590 FMC1_LA_30_P) (solder_mask_margin 0.102)) (pad L15 smd circle (at 3.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 626 FMC1_LA_19_N) (solder_mask_margin 0.102)) (pad L14 smd circle (at 2.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 620 FMC1_LA_19_P) (solder_mask_margin 0.102)) (pad L13 smd circle (at 1.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 624 FMC1_LA_20_N) (solder_mask_margin 0.102)) (pad L12 smd circle (at 0.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 394 /FPGA/CCLK) (solder_mask_margin 0.102)) (pad L11 smd circle (at -0.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 486 VCCBRAM) (solder_mask_margin 0.102)) (pad L10 smd circle (at -1.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 59 /FPGA/FPGA_PWR&MISC/GNDADC) (solder_mask_margin 0.102)) (pad L9 smd circle (at -2.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 59 /FPGA/FPGA_PWR&MISC/GNDADC) (solder_mask_margin 0.102)) (pad L8 smd circle (at -3.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad L7 smd circle (at -4.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad L6 smd circle (at -5.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 264 /SDRAM/DDR3_A0) (solder_mask_margin 0.102)) (pad L5 smd circle (at -6.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 278 /SDRAM/DDR3_BA0) (solder_mask_margin 0.102)) (pad L4 smd circle (at -7.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 269 /SDRAM/DDR3_A10) (solder_mask_margin 0.102)) (pad L3 smd circle (at -8.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 270 /SDRAM/DDR3_A12) (solder_mask_margin 0.102)) (pad L2 smd circle (at -9.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad L1 smd circle (at -10.5 -0.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 273 /FPGA/DDR3_CKE) (solder_mask_margin 0.102)) (pad K22 smd circle (at 10.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 607 FMC1_LA_29_N) (solder_mask_margin 0.102)) (pad K21 smd circle (at 9.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 608 FMC1_LA_29_P) (solder_mask_margin 0.102)) (pad K20 smd circle (at 8.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad K19 smd circle (at 7.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 615 FMC1_LA_17_N) (solder_mask_margin 0.102)) (pad K18 smd circle (at 6.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 610 FMC1_LA_17_P) (solder_mask_margin 0.102)) (pad K17 smd circle (at 5.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 617 FMC1_LA_24_P) (solder_mask_margin 0.102)) (pad K16 smd circle (at 4.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 597 FMC1_LA_30_N) (solder_mask_margin 0.102)) (pad K15 smd circle (at 3.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad K14 smd circle (at 2.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 725 /ETH_PHY/RGMII_RXD3) (solder_mask_margin 0.102)) (pad K13 smd circle (at 1.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 719 /ETH_PHY/RGMII_RXD0) (solder_mask_margin 0.102)) (pad K12 smd circle (at 0.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 488 VCCAUX) (solder_mask_margin 0.102)) (pad K11 smd circle (at -0.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad K10 smd circle (at -1.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 58 /FPGA/FPGA_PWR&MISC/VCCADC) (solder_mask_margin 0.102)) (pad K9 smd circle (at -2.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 59 /FPGA/FPGA_PWR&MISC/GNDADC) (solder_mask_margin 0.102)) (pad K8 smd circle (at -3.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad K7 smd circle (at -4.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad K6 smd circle (at -5.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 256 /SDRAM/DDR3_A3) (solder_mask_margin 0.102)) (pad K5 smd circle (at -6.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad K4 smd circle (at -7.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 276 /FPGA/DDR3_ODT) (solder_mask_margin 0.102)) (pad K3 smd circle (at -8.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 254 /FPGA/DDR3_WE) (solder_mask_margin 0.102)) (pad K2 smd circle (at -9.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 384 /FPGA/DDR3_LDQS_P) (solder_mask_margin 0.102)) (pad K1 smd circle (at -10.5 -1.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 391 /SDRAM/DDR3_DQ5) (solder_mask_margin 0.102)) (pad J22 smd circle (at 10.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 600 FMC1_LA_31_P) (solder_mask_margin 0.102)) (pad J21 smd circle (at 9.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 702 /AMC_connector/TCLKA_N) (solder_mask_margin 0.102)) (pad J20 smd circle (at 8.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 701 /AMC_connector/TCLKA_P) (solder_mask_margin 0.102)) (pad J19 smd circle (at 7.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 606 FMC1_LA_18_P) (solder_mask_margin 0.102)) (pad J18 smd circle (at 6.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad J17 smd circle (at 5.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 616 FMC1_LA_24_N) (solder_mask_margin 0.102)) (pad J16 smd circle (at 4.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 727 /ETH_PHY/RGMII_TX_EN) (solder_mask_margin 0.102)) (pad J15 smd circle (at 3.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 728 /ETH_PHY/RGMII_TX_CLK) (solder_mask_margin 0.102)) (pad J14 smd circle (at 2.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 723 /ETH_PHY/RGMII_RXD2) (solder_mask_margin 0.102)) (pad J13 smd circle (at 1.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad J12 smd circle (at 0.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad J11 smd circle (at -0.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 486 VCCBRAM) (solder_mask_margin 0.102)) (pad J10 smd circle (at -1.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad J9 smd circle (at -2.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad J8 smd circle (at -3.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad J7 smd circle (at -4.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad J6 smd circle (at -5.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 252 /FPGA/DDR3_CAS) (solder_mask_margin 0.102)) (pad J5 smd circle (at -6.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 390 /SDRAM/DDR3_DQ7) (solder_mask_margin 0.102)) (pad J4 smd circle (at -7.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 253 /FPGA/DDR3_RAS) (solder_mask_margin 0.102)) (pad J3 smd circle (at -8.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad J2 smd circle (at -9.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 388 /FPGA/DDR3_LDQS_N) (solder_mask_margin 0.102)) (pad J1 smd circle (at -10.5 -2.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 385 /SDRAM/DDR3_DQ1) (solder_mask_margin 0.102)) (pad H22 smd circle (at 10.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 602 FMC1_LA_31_N) (solder_mask_margin 0.102)) (pad H21 smd circle (at 9.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad H20 smd circle (at 8.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 614 FMC1_LA_26_P) (solder_mask_margin 0.102)) (pad H19 smd circle (at 7.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 605 FMC1_LA_18_N) (solder_mask_margin 0.102)) (pad H18 smd circle (at 6.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 599 FMC1_LA_33_N) (solder_mask_margin 0.102)) (pad H17 smd circle (at 5.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 591 FMC1_LA_33_P) (solder_mask_margin 0.102)) (pad H16 smd circle (at 4.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad H15 smd circle (at 3.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 715 /ETH_PHY/RGMII_RX_DV) (solder_mask_margin 0.102)) (pad H14 smd circle (at 2.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 721 /ETH_PHY/RGMII_RXD1) (solder_mask_margin 0.102)) (pad H13 smd circle (at 1.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 729 /ETH_PHY/RGMII_TXD3) (solder_mask_margin 0.102)) (pad H12 smd circle (at 0.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 488 VCCAUX) (solder_mask_margin 0.102)) (pad H11 smd circle (at -0.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad H10 smd circle (at -1.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad H9 smd circle (at -2.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad H8 smd circle (at -3.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 14 +1V0) (solder_mask_margin 0.102)) (pad H7 smd circle (at -4.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad H6 smd circle (at -5.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad H5 smd circle (at -6.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 386 /SDRAM/DDR3_DQ3) (solder_mask_margin 0.102)) (pad H4 smd circle (at -7.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 383 /SDRAM/DDR3_DQ2) (solder_mask_margin 0.102)) (pad H3 smd circle (at -8.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 387 /SDRAM/DDR3_DQ6) (solder_mask_margin 0.102)) (pad H2 smd circle (at -9.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 389 /SDRAM/DDR3_DQ4) (solder_mask_margin 0.102)) (pad H1 smd circle (at -10.5 -3.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad G22 smd circle (at 10.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 181 /PMOD/Pmod1_7) (solder_mask_margin 0.102)) (pad G21 smd circle (at 9.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 184 /PMOD/Pmod1_3) (solder_mask_margin 0.102)) (pad G20 smd circle (at 8.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 621 FMC1_LA_26_N) (solder_mask_margin 0.102)) (pad G19 smd circle (at 7.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad G18 smd circle (at 6.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 592 FMC1_LA_32_N) (solder_mask_margin 0.102)) (pad G17 smd circle (at 5.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 593 FMC1_LA_32_P) (solder_mask_margin 0.102)) (pad G16 smd circle (at 4.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 730 /ETH_PHY/RGMII_TXD1) (solder_mask_margin 0.102)) (pad G15 smd circle (at 3.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 731 /ETH_PHY/RGMII_TXD0) (solder_mask_margin 0.102)) (pad G14 smd circle (at 2.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad G13 smd circle (at 1.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 732 /ETH_PHY/RGMII_TXD2) (solder_mask_margin 0.102)) (pad G12 smd circle (at 0.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad G11 smd circle (at -0.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 248 /FPGA/FPGA_DONE) (solder_mask_margin 0.102)) (pad G10 smd circle (at -1.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad G9 smd circle (at -2.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad G8 smd circle (at -3.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad G7 smd circle (at -4.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad G6 smd circle (at -5.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad G5 smd circle (at -6.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad G4 smd circle (at -7.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 277 /FPGA/DDR3_RST_N) (solder_mask_margin 0.102)) (pad G3 smd circle (at -8.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 381 /SDRAM/DDR3_DQ0) (solder_mask_margin 0.102)) (pad G2 smd circle (at -9.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 382 /FPGA/DDR3_LDM) (solder_mask_margin 0.102)) (pad G1 smd circle (at -10.5 -4.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 380 /SDRAM/DDR3_DQ8) (solder_mask_margin 0.102)) (pad F22 smd circle (at 10.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad F21 smd circle (at 9.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 185 /PMOD/Pmod1_6) (solder_mask_margin 0.102)) (pad F20 smd circle (at 8.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 418 /FPGA/FPGA_MISO) (solder_mask_margin 0.102)) (pad F19 smd circle (at 7.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 416 /FPGA/FPGA_MOSI) (solder_mask_margin 0.102)) (pad F18 smd circle (at 6.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 419 /FPGA/FPGA_INT) (solder_mask_margin 0.102)) (pad F17 smd circle (at 5.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad F16 smd circle (at 4.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 193 /PMOD/Pmod2_6) (solder_mask_margin 0.102)) (pad F15 smd circle (at 3.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 190 /PMOD/Pmod2_5) (solder_mask_margin 0.102)) (pad F14 smd circle (at 2.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 194 /PMOD/Pmod2_4) (solder_mask_margin 0.102)) (pad F13 smd circle (at 1.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 187 /PMOD/Pmod2_0) (solder_mask_margin 0.102)) (pad F12 smd circle (at 0.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +2V5) (solder_mask_margin 0.102)) (pad F11 smd circle (at -0.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad F10 smd circle (at -1.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 65 /FPGA/FPGA_MGT/MGT_CLK_1_P) (solder_mask_margin 0.102)) (pad F9 smd circle (at -2.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 489 MGTAVCC) (solder_mask_margin 0.102)) (pad F8 smd circle (at -3.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 342 "Net-(R161-Pad1)") (solder_mask_margin 0.102)) (pad F7 smd circle (at -4.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 489 MGTAVCC) (solder_mask_margin 0.102)) (pad F6 smd circle (at -5.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 61 /FPGA/FPGA_MGT/MGT_CLK_0_P) (solder_mask_margin 0.102)) (pad F5 smd circle (at -6.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad F4 smd circle (at -7.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 944 "Net-(U1-PadF4)") (solder_mask_margin 0.102)) (pad F3 smd circle (at -8.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 375 /SDRAM/DDR3_DQ11) (solder_mask_margin 0.102)) (pad F2 smd circle (at -9.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad F1 smd circle (at -10.5 -5.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 378 /SDRAM/DDR3_DQ10) (solder_mask_margin 0.102)) (pad E22 smd circle (at 10.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 180 /PMOD/Pmod1_2) (solder_mask_margin 0.102)) (pad E21 smd circle (at 9.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 182 /PMOD/Pmod1_5) (solder_mask_margin 0.102)) (pad E20 smd circle (at 8.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad E19 smd circle (at 7.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 398 /FPGA/Self_FPGA_TDO) (solder_mask_margin 0.102)) (pad E18 smd circle (at 6.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 397 /FPGA/Self_FPGA_TCK) (solder_mask_margin 0.102)) (pad E17 smd circle (at 5.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 945 "Net-(U1-PadE17)") (solder_mask_margin 0.102)) (pad E16 smd circle (at 4.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 189 /PMOD/Pmod2_7) (solder_mask_margin 0.102)) (pad E15 smd circle (at 3.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad E14 smd circle (at 2.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 946 "Net-(U1-PadE14)") (solder_mask_margin 0.102)) (pad E13 smd circle (at 1.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 421 /FPGA/VCXO_EN) (solder_mask_margin 0.102)) (pad E12 smd circle (at 0.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad E11 smd circle (at -0.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad E10 smd circle (at -1.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 67 /FPGA/FPGA_MGT/MGT_CLK_1_N) (solder_mask_margin 0.102)) (pad E9 smd circle (at -2.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad E8 smd circle (at -3.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 489 MGTAVCC) (solder_mask_margin 0.102)) (pad E7 smd circle (at -4.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad E6 smd circle (at -5.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 63 /FPGA/FPGA_MGT/MGT_CLK_0_N) (solder_mask_margin 0.102)) (pad E5 smd circle (at -6.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad E4 smd circle (at -7.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad E3 smd circle (at -8.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 262 /SDRAM/DDR3_A15) (solder_mask_margin 0.102)) (pad E2 smd circle (at -9.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 379 /FPGA/DDR3_UDM) (solder_mask_margin 0.102)) (pad E1 smd circle (at -10.5 -6.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 377 /FPGA/DDR3_UDQS_P) (solder_mask_margin 0.102)) (pad D22 smd circle (at 10.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 183 /PMOD/Pmod1_1) (solder_mask_margin 0.102)) (pad D21 smd circle (at 9.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 186 /PMOD/Pmod1_4) (solder_mask_margin 0.102)) (pad D20 smd circle (at 8.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 417 /FPGA/FPGA_SSEL) (solder_mask_margin 0.102)) (pad D19 smd circle (at 7.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 396 /FPGA/Self_FPGA_TDI) (solder_mask_margin 0.102)) (pad D18 smd circle (at 6.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad D17 smd circle (at 5.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 303 /FPGA/CLK20_VCXO) (solder_mask_margin 0.102)) (pad D16 smd circle (at 4.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 192 /PMOD/Pmod2_3) (solder_mask_margin 0.102)) (pad D15 smd circle (at 3.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 404 /FPGA/WR_DAC2_SYNC) (solder_mask_margin 0.102)) (pad D14 smd circle (at 2.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1113 "Net-(LD17-Pad1)") (solder_mask_margin 0.102)) (pad D13 smd circle (at 1.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad D12 smd circle (at 0.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad D11 smd circle (at -0.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 91 /FPGA/FPGA_MGT/MGT_RX_1_P) (solder_mask_margin 0.102)) (pad D10 smd circle (at -1.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 489 MGTAVCC) (solder_mask_margin 0.102)) (pad D9 smd circle (at -2.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 98 /FPGA/FPGA_MGT/MGT_RX_3_P) (solder_mask_margin 0.102)) (pad D8 smd circle (at -3.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad D7 smd circle (at -4.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 441 /FPGA/FPGA_MGT/MGT_TX_3_P) (solder_mask_margin 0.102)) (pad D6 smd circle (at -5.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 489 MGTAVCC) (solder_mask_margin 0.102)) (pad D5 smd circle (at -6.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 78 /FPGA/FPGA_MGT/MGT_TX_1_P) (solder_mask_margin 0.102)) (pad D4 smd circle (at -7.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad D3 smd circle (at -8.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad D2 smd circle (at -9.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 374 /SDRAM/DDR3_DQ14) (solder_mask_margin 0.102)) (pad D1 smd circle (at -10.5 -7.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 373 /FPGA/DDR3_UDQS_N) (solder_mask_margin 0.102)) (pad C22 smd circle (at 10.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1120 "Net-(R311-Pad2)") (solder_mask_margin 0.102)) (pad C21 smd circle (at 9.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad C20 smd circle (at 8.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 415 /FPGA/FPGA_SCK) (solder_mask_margin 0.102)) (pad C19 smd circle (at 7.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 399 /FPGA/Self_FPGA_TMS) (solder_mask_margin 0.102)) (pad C18 smd circle (at 6.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 179 /PMOD/Pmod1_0) (solder_mask_margin 0.102)) (pad C17 smd circle (at 5.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1111 "Net-(LD16-Pad1)") (solder_mask_margin 0.102)) (pad C16 smd circle (at 4.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad C15 smd circle (at 3.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 188 /PMOD/Pmod2_2) (solder_mask_margin 0.102)) (pad C14 smd circle (at 2.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 191 /PMOD/Pmod2_1) (solder_mask_margin 0.102)) (pad C13 smd circle (at 1.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 405 /FPGA/WR_DAC1_SYNC) (solder_mask_margin 0.102)) (pad C12 smd circle (at 0.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad C11 smd circle (at -0.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 93 /FPGA/FPGA_MGT/MGT_RX_1_N) (solder_mask_margin 0.102)) (pad C10 smd circle (at -1.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad C9 smd circle (at -2.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 100 /FPGA/FPGA_MGT/MGT_RX_3_N) (solder_mask_margin 0.102)) (pad C8 smd circle (at -3.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (pad C7 smd circle (at -4.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 86 /FPGA/FPGA_MGT/MGT_TX_3_N) (solder_mask_margin 0.102)) (pad C6 smd circle (at -5.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad C5 smd circle (at -6.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 80 /FPGA/FPGA_MGT/MGT_TX_1_N) (solder_mask_margin 0.102)) (pad C4 smd circle (at -7.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (pad C3 smd circle (at -8.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad C2 smd circle (at -9.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 372 /SDRAM/DDR3_DQ12) (solder_mask_margin 0.102)) (pad C1 smd circle (at -10.5 -8.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 6 +1V35) (solder_mask_margin 0.102)) (pad B22 smd circle (at 10.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 420 /FPGA/FPGA_XR_GPIO_0) (solder_mask_margin 0.102)) (pad B21 smd circle (at 9.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 703 /FPGA/FPGA_15_16/Rx18_SE) (solder_mask_margin 0.102)) (pad B20 smd circle (at 8.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 120 /FPGA/FPGA_15_16/TMDS0_P) (solder_mask_margin 0.102)) (pad B19 smd circle (at 7.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad B18 smd circle (at 6.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 122 /FPGA/FPGA_15_16/TMDS_CLK_N) (solder_mask_margin 0.102)) (pad B17 smd circle (at 5.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 121 /FPGA/FPGA_15_16/TMDS_CLK_P) (solder_mask_margin 0.102)) (pad B16 smd circle (at 4.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 402 /FPGA/WR_DAC_DIN) (solder_mask_margin 0.102)) (pad B15 smd circle (at 3.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 403 /FPGA/WR_DAC_SCLK) (solder_mask_margin 0.102)) (pad B14 smd circle (at 2.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad B13 smd circle (at 1.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 947 "Net-(U1-PadB13)") (solder_mask_margin 0.102)) (pad B12 smd circle (at 0.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad B11 smd circle (at -0.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (pad B10 smd circle (at -1.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 442 /FPGA/FPGA_MGT/MGT_RX_2_P) (solder_mask_margin 0.102)) (pad B9 smd circle (at -2.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (pad B8 smd circle (at -3.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 443 /FPGA/FPGA_MGT/MGT_RX_0_P) (solder_mask_margin 0.102)) (pad B7 smd circle (at -4.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (pad B6 smd circle (at -5.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 444 /FPGA/FPGA_MGT/MGT_TX_2_P) (solder_mask_margin 0.102)) (pad B5 smd circle (at -6.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 490 MGTAVTT) (solder_mask_margin 0.102)) (pad B4 smd circle (at -7.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 75 /FPGA/FPGA_MGT/MGT_TX_0_P) (solder_mask_margin 0.102)) (pad B3 smd circle (at -8.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad B2 smd circle (at -9.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 371 /SDRAM/DDR3_DQ15) (solder_mask_margin 0.102)) (pad B1 smd circle (at -10.5 -9.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 376 /SDRAM/DDR3_DQ9) (solder_mask_margin 0.102)) (pad A22 smd circle (at 10.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad A21 smd circle (at 9.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1121 "Net-(R312-Pad2)") (solder_mask_margin 0.102)) (pad A20 smd circle (at 8.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 123 /FPGA/FPGA_15_16/TMDS0_N) (solder_mask_margin 0.102)) (pad A19 smd circle (at 7.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 118 /FPGA/FPGA_15_16/TMDS1_N) (solder_mask_margin 0.102)) (pad A18 smd circle (at 6.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 117 /FPGA/FPGA_15_16/TMDS1_P) (solder_mask_margin 0.102)) (pad A17 smd circle (at 5.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad A16 smd circle (at 4.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 119 /FPGA/FPGA_15_16/TMDS2_N) (solder_mask_margin 0.102)) (pad A15 smd circle (at 3.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 116 /FPGA/FPGA_15_16/TMDS2_P) (solder_mask_margin 0.102)) (pad A14 smd circle (at 2.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1109 /FPGA/FPGA_15_16/I2C_SCL) (solder_mask_margin 0.102)) (pad A13 smd circle (at 1.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1108 /FPGA/FPGA_15_16/I2C_SDA) (solder_mask_margin 0.102)) (pad A12 smd circle (at 0.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad A11 smd circle (at -0.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad A10 smd circle (at -1.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 96 /FPGA/FPGA_MGT/MGT_RX_2_N) (solder_mask_margin 0.102)) (pad A9 smd circle (at -2.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad A8 smd circle (at -3.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 89 /FPGA/FPGA_MGT/MGT_RX_0_N) (solder_mask_margin 0.102)) (pad A7 smd circle (at -4.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad A6 smd circle (at -5.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 83 /FPGA/FPGA_MGT/MGT_TX_2_N) (solder_mask_margin 0.102)) (pad A5 smd circle (at -6.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad A4 smd circle (at -7.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 445 /FPGA/FPGA_MGT/MGT_TX_0_N) (solder_mask_margin 0.102)) (pad A3 smd circle (at -8.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad A2 smd circle (at -9.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad A1 smd circle (at -10.5 -10.5 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 370 /SDRAM/DDR3_DQ13) (solder_mask_margin 0.102)) (model BGA484C100P22X22_2300X2300X240.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/BGA484C100P22X22_2300X2300X240.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module AG5300_2:SOIC-8 locked (layer B.Cu) (tedit 5CB82100) (tstamp 5CC01B87) (at 256.159 142.9004 270) (path /5C16BF8E/5DB9B7E6/5D300F70) (attr smd) (fp_text reference U37 (at -1.524 -2.8702 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value NCP186AMX120TAG (at 0 0 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.016 -1.016) (end -1.016 1.016) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.016 -1.016) (end -1.016 -1.016) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.016 1.016) (end 1.016 -1.016) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.016 1.016) (end 1.016 1.016) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.889 0.889) (end 0.889 0.889) (layer B.SilkS) (width 0.12)) (fp_line (start 0.889 0.889) (end 0.889 -0.889) (layer B.SilkS) (width 0.12)) (fp_line (start 0.889 -0.889) (end -0.889 -0.889) (layer B.SilkS) (width 0.12)) (fp_line (start -0.889 -0.889) (end -0.889 0.889) (layer B.SilkS) (width 0.12)) (fp_circle (center -0.635 -1.143) (end -0.625 -1.143) (layer B.SilkS) (width 0.2)) (pad 9 smd rect (at 0 0 270) (size 1.444 0.44) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 8 smd rect (at -0.6 0.525 270) (size 0.26 0.35) (layers B.Cu B.Paste B.Mask) (net 3 +3V3)) (pad 1 smd rect (at -0.6 -0.525 270) (size 0.26 0.35) (layers B.Cu B.Paste B.Mask) (net 680 "Net-(C145-Pad1)")) (pad 7 smd rect (at -0.2 0.525 270) (size 0.26 0.35) (layers B.Cu B.Paste B.Mask) (net 3 +3V3)) (pad 2 smd rect (at -0.2 -0.525 270) (size 0.26 0.35) (layers B.Cu B.Paste B.Mask) (net 680 "Net-(C145-Pad1)")) (pad 6 smd rect (at 0.2 0.525 270) (size 0.26 0.35) (layers B.Cu B.Paste B.Mask) (net 339 /Power/Power_SW/EN_1V2)) (pad 3 smd rect (at 0.2 -0.525 270) (size 0.26 0.35) (layers B.Cu B.Paste B.Mask) (net 1096 "Net-(U37-Pad3)")) (pad 5 smd rect (at 0.6 0.525 270) (size 0.26 0.35) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 4 smd rect (at 0.6 -0.525 270) (size 0.26 0.35) (layers B.Cu B.Paste B.Mask) (net 351 "Net-(R195-Pad2)")) (model ${CERN}/ (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module AG5300_2:SOIC-8 (layer F.Cu) (tedit 5CB82100) (tstamp 5C6F85C6) (at 207.658201 133.330999) (path /5C16BF8E/5DB9B7E6/5DBB8221) (attr smd) (fp_text reference U36 (at -1.558201 -1.930999) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value NCP186AMX180TAG (at 0 0) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.016 1.016) (end -1.016 -1.016) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.016 1.016) (end -1.016 1.016) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.016 -1.016) (end 1.016 1.016) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.016 -1.016) (end 1.016 -1.016) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.889 -0.889) (end 0.889 -0.889) (layer F.SilkS) (width 0.12)) (fp_line (start 0.889 -0.889) (end 0.889 0.889) (layer F.SilkS) (width 0.12)) (fp_line (start 0.889 0.889) (end -0.889 0.889) (layer F.SilkS) (width 0.12)) (fp_line (start -0.889 0.889) (end -0.889 -0.889) (layer F.SilkS) (width 0.12)) (fp_circle (center -0.635 1.143) (end -0.625 1.143) (layer F.SilkS) (width 0.2)) (pad 9 smd rect (at 0 0) (size 1.444 0.44) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 8 smd rect (at -0.6 -0.525) (size 0.26 0.35) (layers F.Cu F.Paste F.Mask) (net 5 +2V5)) (pad 1 smd rect (at -0.6 0.525) (size 0.26 0.35) (layers F.Cu F.Paste F.Mask) (net 12 +1V8)) (pad 7 smd rect (at -0.2 -0.525) (size 0.26 0.35) (layers F.Cu F.Paste F.Mask) (net 5 +2V5)) (pad 2 smd rect (at -0.2 0.525) (size 0.26 0.35) (layers F.Cu F.Paste F.Mask) (net 12 +1V8)) (pad 6 smd rect (at 0.2 -0.525) (size 0.26 0.35) (layers F.Cu F.Paste F.Mask) (net 343 /Power/Power_SW/EN_1V8)) (pad 3 smd rect (at 0.2 0.525) (size 0.26 0.35) (layers F.Cu F.Paste F.Mask) (net 1095 "Net-(U36-Pad3)")) (pad 5 smd rect (at 0.6 -0.525) (size 0.26 0.35) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 4 smd rect (at 0.6 0.525) (size 0.26 0.35) (layers F.Cu F.Paste F.Mask) (net 344 "Net-(R168-Pad2)")) (model ${CERN}/ (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT95P284X122-5N" (layer F.Cu) (tedit 5CB45DD0) (tstamp 5C6F797B) (at 218.059 102.6414) (descr "SOT23 5, Pitch 0.95mm - Body 1.67x2.99mm, IPC Medium Density") (path /5C16BF13/5C2E75E7) (attr smd) (fp_text reference U13 (at -4.953 -1.1684) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value LP5951MF-3.0/NOPB (at 0 2.776) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -1.6 -1.8) (end -1.475 -1.8) (layer F.SilkS) (width 0.25)) (fp_line (start -0.35 1.5) (end -0.35 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -0.35 -1.5) (end 0.35 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start 0.35 1.5) (end 0.35 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -0.35 1.5) (end 0.35 1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -0.835 -0.895) (end -0.235 -1.495) (layer F.Fab) (width 0.1)) (fp_line (start -0.835 -0.995) (end -0.335 -1.495) (layer F.Fab) (width 0.1)) (fp_line (start -0.835 -1.095) (end -0.435 -1.495) (layer F.Fab) (width 0.1)) (fp_line (start -0.835 -1.195) (end -0.535 -1.495) (layer F.Fab) (width 0.1)) (fp_line (start -0.835 -1.295) (end -0.635 -1.495) (layer F.Fab) (width 0.1)) (fp_line (start -0.835 -1.395) (end -0.735 -1.495) (layer F.Fab) (width 0.1)) (fp_line (start -0.835 1.495) (end -0.835 -1.495) (layer F.Fab) (width 0.1)) (fp_line (start -0.835 -1.495) (end 0.835 -1.495) (layer F.Fab) (width 0.1)) (fp_line (start 0.835 1.495) (end 0.835 -1.495) (layer F.Fab) (width 0.1)) (fp_line (start -0.835 1.495) (end 0.835 1.495) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -2.1 1.75) (end -2.1 -1.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.1 -1.75) (end 2.1 -1.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.1 1.75) (end 2.1 -1.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.1 1.75) (end 2.1 1.75) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.3 -0.95) (size 1.1 0.6) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.3 0) (size 1.1 0.6) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at -1.3 0.95) (size 1.1 0.6) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 4 smd rect (at 1.3 0.95) (size 1.1 0.6) (layers F.Cu F.Paste F.Mask) (net 1052 "Net-(U13-Pad4)") (solder_mask_margin 0.102)) (pad 5 smd rect (at 1.3 -0.95) (size 1.1 0.6) (layers F.Cu F.Paste F.Mask) (net 447 "Net-(C107-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/SOT95P284X122-5N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:OSCCC320X500X160-4N" (layer F.Cu) (tedit 5CB45D5E) (tstamp 5C6F8642) (at 226.3394 98.9965) (descr "SMD Oscillator, Corner Convave, 4 pins, 5x3.2mm") (path /5C16BF13/5C2F3070) (attr smd) (fp_text reference Y2 (at 0.2286 4.1275) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value VM53S3-25.000-2.5/-30+75 (at 0 4.126) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -2.45 -2.15) (end -2.325 -2.15) (layer F.SilkS) (width 0.25)) (fp_circle (center -0.6 -1.5) (end -0.1 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -0.3 -2.5) (end 0.3 -2.5) (layer F.SilkS) (width 0.2)) (fp_line (start -0.3 2.5) (end 0.3 2.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 1.1) (end -1.6 -1.1) (layer F.SilkS) (width 0.2)) (fp_line (start 1.6 1.1) (end 1.6 -1.1) (layer F.SilkS) (width 0.2)) (fp_line (start -1.6 2.5) (end 1.6 2.5) (layer F.Fab) (width 0.1)) (fp_line (start 1.6 2.5) (end 1.6 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 -2.5) (end 1.6 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.6 2.5) (end -1.6 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2.2 3.1) (end 2.2 3.1) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.2 3.1) (end 2.2 -3.1) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.2 -3.1) (end 2.2 -3.1) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.2 3.1) (end -2.2 -3.1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (pad 4 smd rect (at 1.3 -2.15 90) (size 1.35 1.25) (layers F.Cu F.Paste F.Mask) (net 447 "Net-(C107-Pad1)") (solder_mask_margin 0.102)) (pad 3 smd rect (at 1.3 2.15 90) (size 1.35 1.25) (layers F.Cu F.Paste F.Mask) (net 450 "Net-(C114-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.3 2.15 90) (size 1.35 1.25) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -1.3 -2.15 90) (size 1.35 1.25) (layers F.Cu F.Paste F.Mask) (net 29 /WhiteRabbit/WR_DAC_OUT1) (solder_mask_margin 0.102)) (model ${CERN}/OSCCC320X500X160-4N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:QFN50P500X500X100-33N-S355" (layer F.Cu) (tedit 5CB45C73) (tstamp 5C6F804B) (at 239.2426 100.8126 90) (descr "QFN, (MO-220-VHHD-4) 0.50mm pitch,square; 8 pin X 8 pin, 5mm X 5mm X 1.00mm H body (w/thermal tab 3.5 X 3.5mm), IPC Medium Density") (path /5C16BF13/5C5B8FC6) (attr smd) (fp_text reference U20 (at 4.3688 -2.3368) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CDCM61004RHBT (at 0 4.176 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -3.5 -1.75) (end -3.375 -1.75) (layer F.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start 2.25 2.5) (end 2.5 2.5) (layer F.SilkS) (width 0.2)) (fp_line (start 2.5 2.5) (end 2.5 2.25) (layer F.SilkS) (width 0.2)) (fp_line (start -2.5 2.5) (end -2.25 2.5) (layer F.SilkS) (width 0.2)) (fp_line (start -2.5 2.5) (end -2.5 2.25) (layer F.SilkS) (width 0.2)) (fp_line (start 2.25 -2.5) (end 2.5 -2.5) (layer F.SilkS) (width 0.2)) (fp_line (start 2.5 -2.25) (end 2.5 -2.5) (layer F.SilkS) (width 0.2)) (fp_line (start -2.3 -2.5) (end -2.25 -2.5) (layer F.SilkS) (width 0.2)) (fp_line (start -2.5 -2.3) (end -2.3 -2.5) (layer F.SilkS) (width 0.2)) (fp_line (start -2.5 -2.25) (end -2.5 -2.3) (layer F.SilkS) (width 0.2)) (fp_line (start -2.5 -1.5) (end -1.5 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2.5 -1.6) (end -1.6 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2.5 -1.7) (end -1.7 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2.5 -1.8) (end -1.8 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2.5 -1.9) (end -1.9 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2.5 -2) (end -2 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2.5 -2.1) (end -2.1 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2.5 -2.2) (end -2.2 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2.5 -2.3) (end -2.3 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2.5 -2.4) (end -2.4 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2.5 2.5) (end 2.5 2.5) (layer F.Fab) (width 0.1)) (fp_line (start 2.5 2.5) (end 2.5 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2.5 -2.5) (end 2.5 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2.5 2.5) (end -2.5 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -3.15 3.15) (end 3.15 3.15) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.15 3.15) (end 3.15 -3.15) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.15 -3.15) (end 3.15 -3.15) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.15 3.15) (end -3.15 -3.15) (layer F.CrtYd) (width 0.05)) (pad 1 smd roundrect (at -2.45 -1.75 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 2 smd roundrect (at -2.45 -1.25 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 72 /FPGA/FPGA_REF_CLK1_N) (solder_mask_margin 0.102)) (pad 3 smd roundrect (at -2.45 -0.75 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 73 /FPGA/FPGA_REF_CLK1_P) (solder_mask_margin 0.102)) (pad 4 smd roundrect (at -2.45 -0.25 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 5 smd roundrect (at -2.45 0.25 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 60 /FPGA/FPGA_REF_CLK0_N) (solder_mask_margin 0.102)) (pad 6 smd roundrect (at -2.45 0.75 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 62 /FPGA/FPGA_REF_CLK0_P) (solder_mask_margin 0.102)) (pad 7 smd roundrect (at -2.45 1.25 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 295 "Net-(R94-Pad2)") (solder_mask_margin 0.102)) (pad 8 smd roundrect (at -2.45 1.75 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1058 "Net-(U20-Pad8)") (solder_mask_margin 0.102)) (pad 9 smd roundrect (at -1.75 2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 10 smd roundrect (at -1.25 2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 301 "Net-(R101-Pad2)") (solder_mask_margin 0.102)) (pad 11 smd roundrect (at -0.75 2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 302 "Net-(R102-Pad2)") (solder_mask_margin 0.102)) (pad 12 smd roundrect (at -0.25 2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1125 "Net-(C389-Pad2)") (solder_mask_margin 0.102)) (pad 13 smd roundrect (at 0.25 2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 298 "Net-(R98-Pad2)") (solder_mask_margin 0.102)) (pad 14 smd roundrect (at 0.75 2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 299 "Net-(R99-Pad2)") (solder_mask_margin 0.102)) (pad 15 smd roundrect (at 1.25 2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 300 "Net-(R100-Pad2)") (solder_mask_margin 0.102)) (pad 16 smd roundrect (at 1.75 2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 454 "Net-(C123-Pad1)") (solder_mask_margin 0.102)) (pad 17 smd roundrect (at 2.45 1.75 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 453 "Net-(C121-Pad1)") (solder_mask_margin 0.102)) (pad 18 smd roundrect (at 2.45 1.25 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 454 "Net-(C123-Pad1)") (solder_mask_margin 0.102)) (pad 19 smd roundrect (at 2.45 0.75 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 452 "Net-(C120-Pad1)") (solder_mask_margin 0.102)) (pad 20 smd roundrect (at 2.45 0.25 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 21 smd roundrect (at 2.45 -0.25 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 451 "Net-(C114-Pad2)") (solder_mask_margin 0.102)) (pad 22 smd roundrect (at 2.45 -0.75 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 23 smd roundrect (at 2.45 -1.25 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1126 "Net-(R95-Pad1)") (solder_mask_margin 0.102)) (pad 24 smd roundrect (at 2.45 -1.75 90) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1059 "Net-(U20-Pad24)") (solder_mask_margin 0.102)) (pad 25 smd roundrect (at 1.75 -2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 296 "Net-(R96-Pad2)") (solder_mask_margin 0.102)) (pad 26 smd roundrect (at 1.25 -2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 297 "Net-(R97-Pad2)") (solder_mask_margin 0.102)) (pad 27 smd roundrect (at 0.75 -2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 28 smd roundrect (at 0.25 -2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1060 "Net-(U20-Pad28)") (solder_mask_margin 0.102)) (pad 29 smd roundrect (at -0.25 -2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1061 "Net-(U20-Pad29)") (solder_mask_margin 0.102)) (pad 30 smd roundrect (at -0.75 -2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (pad 31 smd roundrect (at -1.25 -2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1062 "Net-(U20-Pad31)") (solder_mask_margin 0.102)) (pad 32 smd roundrect (at -1.75 -2.45 180) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1063 "Net-(U20-Pad32)") (solder_mask_margin 0.102)) (pad 33 smd rect (at 0 0 90) (size 3.55 3.55) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/QFN50P500X500X100-33N-S355.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:OSC_IQD_CFPV-45" (layer F.Cu) (tedit 5CB45CA6) (tstamp 5C6F865B) (at 228.0412 91.567 90) (descr "Oscillator, Side Concave, 2.54mm Pitch, 6 Pins, 5.00mm L X 7.00mm W X 1.70mm H, CFPV-45 Series") (path /5C16BF13/5C5E020D) (attr smd) (fp_text reference Y3 (at 3.937 -5.1562) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value OSC_20MHZ_IQD_LFVCXO026156 (at 0 4.876 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -3.1 -4.04) (end -2.975 -4.04) (layer F.SilkS) (width 0.25)) (fp_circle (center -1.5 -2.5) (end -1 -2.5) (layer F.Fab) (width 0.1)) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start -0.75 3.5) (end 0.75 3.5) (layer F.SilkS) (width 0.2)) (fp_line (start -0.75 -3.5) (end 0.75 -3.5) (layer F.SilkS) (width 0.2)) (fp_line (start -2.5 3.5) (end -2.5 -3.5) (layer F.Fab) (width 0.1)) (fp_line (start -2.5 -3.5) (end 2.5 -3.5) (layer F.Fab) (width 0.1)) (fp_line (start 2.5 3.5) (end 2.5 -3.5) (layer F.Fab) (width 0.1)) (fp_line (start -2.5 3.5) (end 2.5 3.5) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -3.35 3.85) (end -3.35 -3.85) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.35 -3.85) (end 3.35 -3.85) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.35 3.85) (end 3.35 -3.85) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.35 3.85) (end 3.35 3.85) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -2.1 -2.54 90) (size 2 1.8) (layers F.Cu F.Paste F.Mask) (net 28 /WhiteRabbit/WR_DAC_OUT2) (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.1 0 90) (size 2 1.8) (layers F.Cu F.Paste F.Mask) (net 421 /FPGA/VCXO_EN) (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.1 2.54 90) (size 2 1.8) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 4 smd rect (at 2.1 2.54 90) (size 2 1.8) (layers F.Cu F.Paste F.Mask) (net 459 "Net-(R103-Pad1)") (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.1 0 90) (size 2 1.8) (layers F.Cu F.Paste F.Mask) (net 1100 "Net-(Y3-Pad5)") (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.1 -2.54 90) (size 2 1.8) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (model ${CERN}/OSC_IQD_CFPV-45.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOP65P490X109-8N" (layer B.Cu) (tedit 5CACBCA7) (tstamp 5C6EB2BA) (at 144.6022 164.7698 90) (descr "SOP, 0.65mm pitch; 8 pin,3.00mm W X 3.00mm L X 1.09mm H bodyI, PC Medium Density") (path /5D05A99E/5D05AA1A) (attr smd) (fp_text reference U28 (at 0.2698 2.3978 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value LM75AIMM/NOPB (at 0 -2.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -2.7 1.7) (end -2.575 1.7) (layer B.SilkS) (width 0.25)) (fp_line (start -1.125 0.5) (end -0.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 0.7) (end -0.325 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 0.9) (end -0.525 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 1.1) (end -0.725 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 1.3) (end -0.925 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 -1.5) (end -1.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 1.5) (end 1.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start 1.125 -1.5) (end 1.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 -1.5) (end 1.125 -1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.5 1.4) (end -1.4 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.3) (end -1.3 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.2) (end -1.2 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.1) (end -1.1 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1) (end -1 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.9) (end -0.9 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.8) (end -0.8 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.7) (end -0.7 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.6) (end -0.6 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.5) (end -0.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -1.5) (end -1.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.5) (end 1.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -1.5) (end 1.5 -1.5) (layer B.Fab) (width 0.1)) (fp_line (start -3.2 -1.8) (end 3.2 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.2 -1.8) (end 3.2 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.2 1.8) (end 3.2 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.2 -1.8) (end -3.2 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 1 smd rect (at -2.2 0.975 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 173 /MMC/I2C_PM_SDA) (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.2 0.325 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 174 /MMC/I2C_PM_SCL) (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.2 -0.325 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 109 /MMC/OVER_TEMP) (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.2 -0.975 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.2 -0.975 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.2 -0.325 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.2 0.325 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 8 smd rect (at 2.2 0.975 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model ${CERN}/SOP65P490X109-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOP65P490X109-8N" (layer B.Cu) (tedit 5CACBCA7) (tstamp 5C5C1994) (at 250.22556 186.5376 90) (descr "SOP, 0.65mm pitch; 8 pin,3.00mm W X 3.00mm L X 1.09mm H bodyI, PC Medium Density") (path /5D05A99E/5D05B2F7) (attr smd) (fp_text reference U29 (at 0 2.951 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value LM75AIMM/NOPB (at 0 -2.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -2.7 1.7) (end -2.575 1.7) (layer B.SilkS) (width 0.25)) (fp_line (start -1.125 0.5) (end -0.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 0.7) (end -0.325 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 0.9) (end -0.525 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 1.1) (end -0.725 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 1.3) (end -0.925 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 -1.5) (end -1.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 1.5) (end 1.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start 1.125 -1.5) (end 1.125 1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.125 -1.5) (end 1.125 -1.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.5 1.4) (end -1.4 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.3) (end -1.3 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.2) (end -1.2 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.1) (end -1.1 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1) (end -1 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.9) (end -0.9 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.8) (end -0.8 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.7) (end -0.7 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.6) (end -0.6 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 0.5) (end -0.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -1.5) (end -1.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 1.5) (end 1.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.5 -1.5) (end 1.5 -1.5) (layer B.Fab) (width 0.1)) (fp_line (start -3.2 -1.8) (end 3.2 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.2 -1.8) (end 3.2 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.2 1.8) (end 3.2 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.2 -1.8) (end -3.2 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 1 smd rect (at -2.2 0.975 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 173 /MMC/I2C_PM_SDA) (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.2 0.325 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 174 /MMC/I2C_PM_SCL) (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.2 -0.325 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 109 /MMC/OVER_TEMP) (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.2 -0.975 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.2 -0.975 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.2 -0.325 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.2 0.325 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 8 smd rect (at 2.2 0.975 90) (size 1.5 0.45) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model ${CERN}/SOP65P490X109-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:QFN50P400X400X100-25N-S220" (layer B.Cu) (tedit 5CACBC93) (tstamp 5C6F7868) (at 169.037 81.788) (descr "QFN, 0.50mm Pitch, Square; 24 Pin, 4.00mm L X 4.00mm W X 1.00mm H body (w/thermal tab 2.2 X 2.2mm), IPC Medium Density") (path /5BCEDA3D/5C5DB690) (attr smd) (fp_text reference U5 (at 4.826 -4.191) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value TCA9548ARGER (at 0 -3.676) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -3 1.25) (end -2.875 1.25) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start 1.75 -2) (end 2 -2) (layer B.SilkS) (width 0.2)) (fp_line (start 2 -2) (end 2 -1.75) (layer B.SilkS) (width 0.2)) (fp_line (start -2 -2) (end -1.75 -2) (layer B.SilkS) (width 0.2)) (fp_line (start -2 -2) (end -2 -1.75) (layer B.SilkS) (width 0.2)) (fp_line (start 1.75 2) (end 2 2) (layer B.SilkS) (width 0.2)) (fp_line (start 2 1.75) (end 2 2) (layer B.SilkS) (width 0.2)) (fp_line (start -1.8 2) (end -1.75 2) (layer B.SilkS) (width 0.2)) (fp_line (start -2 1.8) (end -1.8 2) (layer B.SilkS) (width 0.2)) (fp_line (start -2 1.75) (end -2 1.8) (layer B.SilkS) (width 0.2)) (fp_line (start -2 1) (end -1 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.1) (end -1.1 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.2) (end -1.2 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.3) (end -1.3 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.4) (end -1.4 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.5) (end -1.5 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.6) (end -1.6 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.7) (end -1.7 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.8) (end -1.8 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.9) (end -1.9 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2) (end 2 -2) (layer B.Fab) (width 0.1)) (fp_line (start 2 -2) (end 2 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 2) (end 2 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2) (end -2 2) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -2.65 -2.65) (end 2.65 -2.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.65 -2.65) (end 2.65 2.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.65 2.65) (end 2.65 2.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.65 -2.65) (end -2.65 2.65) (layer B.CrtYd) (width 0.05)) (pad 1 smd roundrect (at -1.95 1.25) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 427 /FMC_1/I2C_FMC1_SDA) (solder_mask_margin 0.102)) (pad 2 smd roundrect (at -1.95 0.75) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 428 /FMC_1/I2C_FMC1_SCL) (solder_mask_margin 0.102)) (pad 3 smd roundrect (at -1.95 0.25) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 423 /FMC_2/I2C_FMC2_SDA) (solder_mask_margin 0.102)) (pad 4 smd roundrect (at -1.95 -0.25) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 424 /FMC_2/I2C_FMC2_SCL) (solder_mask_margin 0.102)) (pad 5 smd roundrect (at -1.95 -0.75) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 426 /I2C_MUX/I2C_SFP1_SDA) (solder_mask_margin 0.102)) (pad 6 smd roundrect (at -1.95 -1.25) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 425 /I2C_MUX/I2C_SFP1_SCL) (solder_mask_margin 0.102)) (pad 7 smd roundrect (at -1.25 -1.95 270) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 434 /I2C_MUX/I2C_SFP4_SDA) (solder_mask_margin 0.102)) (pad 8 smd roundrect (at -0.75 -1.95 270) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 433 /I2C_MUX/I2C_SFP4_SCL) (solder_mask_margin 0.102)) (pad 9 smd roundrect (at -0.25 -1.95 270) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 10 smd roundrect (at 0.25 -1.95 270) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 432 /I2C_MUX/I2C_SFP3_SDA) (solder_mask_margin 0.102)) (pad 11 smd roundrect (at 0.75 -1.95 270) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 431 /I2C_MUX/I2C_SFP3_SCL) (solder_mask_margin 0.102)) (pad 12 smd roundrect (at 1.25 -1.95 270) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 430 /I2C_MUX/I2C_SFP2_SDA) (solder_mask_margin 0.102)) (pad 13 smd roundrect (at 1.95 -1.25) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 429 /I2C_MUX/I2C_SFP2_SCL) (solder_mask_margin 0.102)) (pad 14 smd roundrect (at 1.95 -0.75) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 287 /FPGA/I2C_APP_SDA) (solder_mask_margin 0.102)) (pad 15 smd roundrect (at 1.95 -0.25) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 293 /FPGA/I2C_APP_SCL) (solder_mask_margin 0.102)) (pad 16 smd roundrect (at 1.95 0.25) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 436 /FPGA/I2C_HDMI_SDA) (solder_mask_margin 0.102)) (pad 17 smd roundrect (at 1.95 0.75) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 435 /FPGA/I2C_HDMI_SCL) (solder_mask_margin 0.102)) (pad 18 smd roundrect (at 1.95 1.25) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 679 "Net-(R274-Pad2)") (solder_mask_margin 0.102)) (pad 19 smd roundrect (at 1.25 1.95 270) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 282 /FPGA/I2C_FPGA_SCL) (solder_mask_margin 0.102)) (pad 20 smd roundrect (at 0.75 1.95 270) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 283 /FPGA/I2C_FPGA_SDA) (solder_mask_margin 0.102)) (pad 21 smd roundrect (at 0.25 1.95 270) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 22 smd roundrect (at -0.25 1.95 270) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 286 "Net-(R44-Pad1)") (solder_mask_margin 0.102)) (pad 23 smd roundrect (at -0.75 1.95 270) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 285 "Net-(R43-Pad1)") (solder_mask_margin 0.102)) (pad 24 smd roundrect (at -1.25 1.95 270) (size 0.9 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 284 /FPGA/I2C_FPGA_SW_RST) (solder_mask_margin 0.102)) (pad 25 smd rect (at 0 0) (size 2.2 2.2) (layers B.Cu B.Paste B.Mask) (net 1049 "Net-(U5-Pad25)") (solder_mask_margin 0.102)) (model ${CERN}/QFN50P400X400X100-25N-S220.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT95P280X145-5N" (layer B.Cu) (tedit 5CACBC79) (tstamp 5C6EB24F) (at 147.828 135.128 180) (descr "SOT, 0.95mm pitch; 5 pin, 1.60mm W X 2.90mm L X 1.45mm H body, IPC Medium Density") (path /5C16C03C/5C6DFD9F) (attr smd) (fp_text reference U22 (at 0.762 -2.667 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value TLV62565DBVT (at 0 -2.826 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.6 1.75) (end -1.475 1.75) (layer B.SilkS) (width 0.25)) (fp_line (start -0.425 -1.45) (end -0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.425 1.45) (end 0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.425 -1.45) (end 0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.425 -1.45) (end 0.425 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.8 -1.45) (end -0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.45) (end 0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -1.45) (end 0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -1.45) (end 0.8 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.45) (end 0.2 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.55) (end 0.1 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.65) (end 0 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.75) (end -0.1 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.85) (end -0.2 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.95) (end -0.3 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.05) (end -0.4 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.15) (end -0.5 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.25) (end -0.6 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.35) (end -0.7 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -2.1 -1.8) (end -2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.1 1.8) (end 2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.1 -1.8) (end 2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.1 -1.8) (end 2.1 -1.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.3 0.95 180) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask) (net 49 "Net-(C162-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.3 0 180) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at -1.3 -0.95 180) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask) (net 202 "Net-(L23-Pad1)") (solder_mask_margin 0.102)) (pad 4 smd rect (at 1.3 -0.95 180) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask) (net 49 "Net-(C162-Pad1)") (solder_mask_margin 0.102)) (pad 5 smd rect (at 1.3 0.95 180) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask) (net 311 "Net-(R118-Pad2)") (solder_mask_margin 0.102)) (model ${CERN}/SOT95P280X145-5N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:DIOM5226X262N" (layer B.Cu) (tedit 5CACBC61) (tstamp 5C6A1AC3) (at 280.1112 196.1896 180) (descr "DO-214-AC/SMA Diode, Molded Body; 5.21mm L X 2.605mm W X 2.62mm H, IPC Medium Density") (path /5C16BF8E/5C4A1633) (attr smd) (fp_text reference D8 (at 0 2.776 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SMAJ58A (at 0 -2.776 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -3.4 1.325) (end -3.275 1.325) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -2.6 -1.3) (end 2.6 -1.3) (layer B.SilkS) (width 0.2)) (fp_line (start -2.6 1.3) (end 2.6 1.3) (layer B.SilkS) (width 0.2)) (fp_line (start -2.605 -1.302) (end 2.605 -1.302) (layer B.Fab) (width 0.1)) (fp_line (start 2.605 -1.302) (end 2.605 1.302) (layer B.Fab) (width 0.1)) (fp_line (start -2.605 1.302) (end 2.605 1.302) (layer B.Fab) (width 0.1)) (fp_line (start -2.605 -1.302) (end -2.605 1.302) (layer B.Fab) (width 0.1)) (fp_line (start -2.605 -1.302) (end -2.605 1.302) (layer B.Fab) (width 0.1)) (fp_line (start -2.505 -1.302) (end -2.505 1.302) (layer B.Fab) (width 0.1)) (fp_line (start -2.405 -1.302) (end -2.405 1.302) (layer B.Fab) (width 0.1)) (fp_line (start -2.305 -1.302) (end -2.305 1.302) (layer B.Fab) (width 0.1)) (fp_line (start -2.205 -1.302) (end -2.205 1.302) (layer B.Fab) (width 0.1)) (fp_line (start -2.105 -1.302) (end -2.105 1.302) (layer B.Fab) (width 0.1)) (fp_line (start -2.005 -1.302) (end -2.005 1.302) (layer B.Fab) (width 0.1)) (fp_line (start -1.905 -1.302) (end -1.905 1.302) (layer B.Fab) (width 0.1)) (fp_line (start -3.55 -1.75) (end 3.55 -1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.55 -1.75) (end 3.55 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.55 1.75) (end 3.55 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.55 -1.75) (end -3.55 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 2.15 0 180) (size 2.3 1.55) (layers B.Cu B.Paste B.Mask) (net 110 "Net-(D6-Pad4)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -2.15 0 180) (size 2.3 1.55) (layers B.Cu B.Paste B.Mask) (net 111 "Net-(D6-Pad3)") (solder_mask_margin 0.102)) (model ${CERN}/DIOM5226X262N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Inductors SMD:INDC2012X145N" (layer B.Cu) (tedit 5CACBC0B) (tstamp 5C6AE871) (at 285.6 196.8) (descr "Chip Inductor, EIA 0805, Metric 2012, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5C42D98A) (attr smd) (fp_text reference L35 (at 0 2.026 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1k@100MHz (at 0 -2.026 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1 -0.625) (end 1 -0.625) (layer B.Fab) (width 0.1)) (fp_line (start 1 -0.625) (end 1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1 0.625) (end 1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1 -0.625) (end -1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.75 -1) (end 1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end -1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.525) (end 0 0.525) (layer B.SilkS) (width 0.2)) (pad 2 smd rect (at 0.9 0 270) (size 1.45 1.15) (layers B.Cu B.Paste B.Mask) (net 203 "Net-(L35-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 270) (size 1.45 1.15) (layers B.Cu B.Paste B.Mask) (net 111 "Net-(D6-Pad3)") (solder_mask_margin 0.102)) (model ${CERN}/INDC2012X145N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Inductors SMD:INDC2012X145N" (layer B.Cu) (tedit 5CACBC0B) (tstamp 5C6AE882) (at 274.6 196.8 180) (descr "Chip Inductor, EIA 0805, Metric 2012, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5C43E5E7) (attr smd) (fp_text reference L36 (at 0 2.026) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1k@100MHz (at 0 -2.026) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1 -0.625) (end 1 -0.625) (layer B.Fab) (width 0.1)) (fp_line (start 1 -0.625) (end 1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1 0.625) (end 1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1 -0.625) (end -1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.75 -1) (end 1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end -1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.525) (end 0 0.525) (layer B.SilkS) (width 0.2)) (pad 2 smd rect (at 0.9 0 90) (size 1.45 1.15) (layers B.Cu B.Paste B.Mask) (net 204 "Net-(L36-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 90) (size 1.45 1.15) (layers B.Cu B.Paste B.Mask) (net 110 "Net-(D6-Pad4)") (solder_mask_margin 0.102)) (model ${CERN}/INDC2012X145N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Inductors SMD:INDC2012X145N" (layer B.Cu) (tedit 5CACBC0B) (tstamp 5C6AE893) (at 283.8 202.8 180) (descr "Chip Inductor, EIA 0805, Metric 2012, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5C4333E3) (attr smd) (fp_text reference L37 (at 0 2.026 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1k@100MHz (at 0 -2.026 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1 -0.625) (end 1 -0.625) (layer B.Fab) (width 0.1)) (fp_line (start 1 -0.625) (end 1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1 0.625) (end 1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1 -0.625) (end -1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.75 -1) (end 1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end -1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.525) (end 0 0.525) (layer B.SilkS) (width 0.2)) (pad 2 smd rect (at 0.9 0 90) (size 1.45 1.15) (layers B.Cu B.Paste B.Mask) (net 205 "Net-(L37-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 90) (size 1.45 1.15) (layers B.Cu B.Paste B.Mask) (net 203 "Net-(L35-Pad2)") (solder_mask_margin 0.102)) (model ${CERN}/INDC2012X145N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Inductors SMD:INDC2012X145N" (layer B.Cu) (tedit 5CACBC0B) (tstamp 5C6AE8A4) (at 276.2 201.8 270) (descr "Chip Inductor, EIA 0805, Metric 2012, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5C43E5EF) (attr smd) (fp_text reference L38 (at 0 2.026 270) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1k@100MHz (at 0 -2.026 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1 -0.625) (end 1 -0.625) (layer B.Fab) (width 0.1)) (fp_line (start 1 -0.625) (end 1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1 0.625) (end 1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1 -0.625) (end -1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.75 -1) (end 1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end -1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.525) (end 0 0.525) (layer B.SilkS) (width 0.2)) (pad 2 smd rect (at 0.9 0 180) (size 1.45 1.15) (layers B.Cu B.Paste B.Mask) (net 206 "Net-(L38-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.45 1.15) (layers B.Cu B.Paste B.Mask) (net 204 "Net-(L36-Pad2)") (solder_mask_margin 0.102)) (model ${CERN}/INDC2012X145N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Inductors SMD:INDC2012X145N" (layer B.Cu) (tedit 5CACBC0B) (tstamp 5C6AE8B5) (at 280.86812 203.6318 270) (descr "Chip Inductor, EIA 0805, Metric 2012, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5C438CB6) (attr smd) (fp_text reference L39 (at 0 2.026 270) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1k@100MHz (at 0 -2.026 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1 -0.625) (end 1 -0.625) (layer B.Fab) (width 0.1)) (fp_line (start 1 -0.625) (end 1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1 0.625) (end 1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1 -0.625) (end -1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.75 -1) (end 1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end -1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.525) (end 0 0.525) (layer B.SilkS) (width 0.2)) (pad 2 smd rect (at 0.9 0 180) (size 1.45 1.15) (layers B.Cu B.Paste B.Mask) (net 103 "Net-(C353-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.45 1.15) (layers B.Cu B.Paste B.Mask) (net 205 "Net-(L37-Pad2)") (solder_mask_margin 0.102)) (model ${CERN}/INDC2012X145N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Inductors SMD:INDC2012X145N" (layer B.Cu) (tedit 5CACBC0B) (tstamp 5C6AE8C6) (at 278.36368 203.6318 270) (descr "Chip Inductor, EIA 0805, Metric 2012, Body 2.0x1.25mm, IPC Medium Density") (path /5C16BF8E/5C43E5F7) (attr smd) (fp_text reference L40 (at 0 2.026 270) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1k@100MHz (at 0 -2.026 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1 -0.625) (end 1 -0.625) (layer B.Fab) (width 0.1)) (fp_line (start 1 -0.625) (end 1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1 0.625) (end 1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1 -0.625) (end -1 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -1.75 -1) (end 1.75 -1) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.75 -1) (end 1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.75 1) (end 1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.75 -1) (end -1.75 1) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.525) (end 0 0.525) (layer B.SilkS) (width 0.2)) (pad 2 smd rect (at 0.9 0 180) (size 1.45 1.15) (layers B.Cu B.Paste B.Mask) (net 104 "Net-(C354-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.9 0 180) (size 1.45 1.15) (layers B.Cu B.Paste B.Mask) (net 206 "Net-(L38-Pad2)") (solder_mask_margin 0.102)) (model ${CERN}/INDC2012X145N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT65P280X145-8N" (layer B.Cu) (tedit 5CACBB9F) (tstamp 5C6F7A3A) (at 198.9582 189.2554 90) (descr "SOT, 0.65mm pitch; 8 pin, 1.625mm W X 2.90mm L X 1.45mm H body, IPC Medium Density") (path /5C16BF8E/5CFF49B6) (attr smd) (fp_text reference U17 (at 2.921 0.2286 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value INA219BIDCNT (at 0 -2.826 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.6 1.7) (end -1.475 1.7) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.425 -1.45) (end 0.425 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.425 -1.45) (end 0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.425 1.45) (end 0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.425 -1.45) (end -0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.8 1.35) (end -0.7 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.25) (end -0.6 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.15) (end -0.5 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.05) (end -0.4 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.95) (end -0.3 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.85) (end -0.2 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.75) (end -0.1 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.65) (end 0 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.55) (end 0.1 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.45) (end 0.2 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -1.45) (end 0.8 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -1.45) (end 0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.45) (end 0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -1.45) (end -0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -2.1 -1.8) (end 2.1 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.1 -1.8) (end 2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.1 1.8) (end 2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.1 -1.8) (end -2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 8 smd rect (at 1.3 0.975 90) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 7 smd rect (at 1.3 0.325 90) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 6 smd rect (at 1.3 -0.325 90) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 287 /FPGA/I2C_APP_SDA) (solder_mask_margin 0.102)) (pad 5 smd rect (at 1.3 -0.975 90) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 293 /FPGA/I2C_APP_SCL) (solder_mask_margin 0.102)) (pad 4 smd rect (at -1.3 -0.975 90) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 3 smd rect (at -1.3 -0.325 90) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.3 0.325 90) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 462 +12V_FMC1) (solder_mask_margin 0.102)) (pad 1 smd rect (at -1.3 0.975 90) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 246 "Net-(Q16-Pad5)") (solder_mask_margin 0.102)) (model ${CERN}/SOT65P280X145-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT65P280X145-8N" (layer B.Cu) (tedit 5CACBB9F) (tstamp 5CA1BD9A) (at 179.1716 130.2258 270) (descr "SOT, 0.65mm pitch; 8 pin, 1.625mm W X 2.90mm L X 1.45mm H body, IPC Medium Density") (path /5C16BF8E/5D74C702) (attr smd) (fp_text reference U32 (at 3.1242 -0.0254 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value INA219BIDCNT (at 0 -2.826 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.6 1.7) (end -1.475 1.7) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.425 -1.45) (end 0.425 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.425 -1.45) (end 0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.425 1.45) (end 0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.425 -1.45) (end -0.425 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.8 1.35) (end -0.7 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.25) (end -0.6 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.15) (end -0.5 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.05) (end -0.4 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.95) (end -0.3 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.85) (end -0.2 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.75) (end -0.1 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.65) (end 0 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.55) (end 0.1 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 0.45) (end 0.2 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -1.45) (end 0.8 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.8 -1.45) (end 0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 1.45) (end 0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.8 -1.45) (end -0.8 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -2.1 -1.8) (end 2.1 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.1 -1.8) (end 2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.1 1.8) (end 2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.1 -1.8) (end -2.1 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 8 smd rect (at 1.3 0.975 270) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 7 smd rect (at 1.3 0.325 270) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 6 smd rect (at 1.3 -0.325 270) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 287 /FPGA/I2C_APP_SDA) (solder_mask_margin 0.102)) (pad 5 smd rect (at 1.3 -0.975 270) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 293 /FPGA/I2C_APP_SCL) (solder_mask_margin 0.102)) (pad 4 smd rect (at -1.3 -0.975 270) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 3 smd rect (at -1.3 -0.325 270) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.3 0.325 270) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 460 +12V_FMC2) (solder_mask_margin 0.102)) (pad 1 smd rect (at -1.3 0.975 270) (size 1.1 0.45) (layers B.Cu B.Paste B.Mask) (net 251 "Net-(Q23-Pad5)") (solder_mask_margin 0.102)) (model ${CERN}/SOT65P280X145-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOP63P600X175-16N" (layer B.Cu) (tedit 5CACBB77) (tstamp 5C7CFE66) (at 220.5736 192.3288 270) (descr "SOP, 0.635mm pitch; 16 pin, 3.9mm W X 4.895mm L X 1.75mm H Body, IPC Medium Density") (path /5D05A99E/5D01B880) (attr smd) (fp_text reference U27 (at -0.1016 3.6068 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value MAX6639AEE+ (at 0 -3.771 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -3.2 2.95) (end -3.075 2.95) (layer B.SilkS) (width 0.25)) (fp_circle (center -0.6 1.45) (end -0.35 1.45) (layer B.SilkS) (width 0.5)) (fp_circle (center -0.95 1.448) (end -0.45 1.448) (layer B.Fab) (width 0.1)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -1.6 -2.45) (end -1.6 2.45) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 2.45) (end 1.6 2.45) (layer B.SilkS) (width 0.2)) (fp_line (start 1.6 -2.45) (end 1.6 2.45) (layer B.SilkS) (width 0.2)) (fp_line (start -1.6 -2.45) (end 1.6 -2.45) (layer B.SilkS) (width 0.2)) (fp_line (start -1.95 -2.448) (end -1.95 2.448) (layer B.Fab) (width 0.1)) (fp_line (start -1.95 2.448) (end 1.95 2.448) (layer B.Fab) (width 0.1)) (fp_line (start 1.95 -2.448) (end 1.95 2.448) (layer B.Fab) (width 0.1)) (fp_line (start -1.95 -2.448) (end 1.95 -2.448) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -3.725 -2.745) (end -3.725 2.745) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.725 2.745) (end 3.725 2.745) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.725 -2.745) (end 3.725 2.745) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.725 -2.745) (end 3.725 -2.745) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -2.7 2.223 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 231 "Net-(Q7-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.7 1.588 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 212 "Net-(M1-Pad3)") (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.7 0.953 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 232 "Net-(Q7-Pad4)") (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.7 0.318 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 214 "Net-(M2-Pad3)") (solder_mask_margin 0.102)) (pad 5 smd rect (at -2.7 -0.318 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 485 /FANFAIL) (solder_mask_margin 0.102)) (pad 6 smd rect (at -2.7 -0.953 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 345 /THERM) (solder_mask_margin 0.102)) (pad 7 smd rect (at -2.7 -1.588 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 109 /MMC/OVER_TEMP) (solder_mask_margin 0.102)) (pad 8 smd rect (at -2.7 -2.223 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 9 smd rect (at 2.7 -2.223 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 55 /FPGA/DXP_0) (solder_mask_margin 0.102)) (pad 10 smd rect (at 2.7 -1.588 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 11 smd rect (at 2.7 -0.953 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 54 "Net-(C188-Pad2)") (solder_mask_margin 0.102)) (pad 12 smd rect (at 2.7 -0.318 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 54 "Net-(C188-Pad2)") (solder_mask_margin 0.102)) (pad 13 smd rect (at 2.7 0.318 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 14 smd rect (at 2.7 0.953 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 321 /ALERT) (solder_mask_margin 0.102)) (pad 15 smd rect (at 2.7 1.588 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 173 /MMC/I2C_PM_SDA) (solder_mask_margin 0.102)) (pad 16 smd rect (at 2.7 2.223 270) (size 1.55 0.4) (layers B.Cu B.Paste B.Mask) (net 174 /MMC/I2C_PM_SCL) (solder_mask_margin 0.102)) (model ${CERN}/SOP63P600X175-16N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:QFN50P400X400X80-25N-S225" (layer B.Cu) (tedit 5CACB9F4) (tstamp 5C680E6E) (at 282.6512 95.5548 180) (descr "QFN,0.50mm pitch,square;6 pin X 6 pin,4mm X 4mm body (w/thermal tab 2.25 X 2.25 mm), IPC Medium Density") (path /5C907554/5D17325E) (attr smd) (fp_text reference U34 (at -2.7686 3.5052 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value PCA9555AHF (at 0 -3.676 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -2.95 1.25) (end -2.825 1.25) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start 1.75 -2) (end 2 -2) (layer B.SilkS) (width 0.2)) (fp_line (start 2 -2) (end 2 -1.75) (layer B.SilkS) (width 0.2)) (fp_line (start -2 -2) (end -1.75 -2) (layer B.SilkS) (width 0.2)) (fp_line (start -2 -2) (end -2 -1.75) (layer B.SilkS) (width 0.2)) (fp_line (start 1.75 2) (end 2 2) (layer B.SilkS) (width 0.2)) (fp_line (start 2 1.75) (end 2 2) (layer B.SilkS) (width 0.2)) (fp_line (start -1.8 2) (end -1.75 2) (layer B.SilkS) (width 0.2)) (fp_line (start -2 1.8) (end -1.8 2) (layer B.SilkS) (width 0.2)) (fp_line (start -2 1.75) (end -2 1.8) (layer B.SilkS) (width 0.2)) (fp_line (start -2 1) (end -1 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.1) (end -1.1 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.2) (end -1.2 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.3) (end -1.3 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.4) (end -1.4 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.5) (end -1.5 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.6) (end -1.6 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.7) (end -1.7 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.8) (end -1.8 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.9) (end -1.9 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2) (end 2 -2) (layer B.Fab) (width 0.1)) (fp_line (start 2 -2) (end 2 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 2) (end 2 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2) (end -2 2) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -2.65 -2.65) (end 2.65 -2.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.65 -2.65) (end 2.65 2.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.65 2.65) (end 2.65 2.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.65 -2.65) (end -2.65 2.65) (layer B.CrtYd) (width 0.05)) (pad 25 smd rect (at 0 0 90) (size 2.25 2.25) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd roundrect (at -1.95 1.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 143 /FPGA/SFP1_TX_FAULT) (solder_mask_margin 0.102)) (pad 2 smd roundrect (at -1.95 0.75 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 142 /FPGA/SFP1_TX_DIS) (solder_mask_margin 0.102)) (pad 3 smd roundrect (at -1.95 0.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 141 /FPGA/SFP1_DEF0) (solder_mask_margin 0.102)) (pad 4 smd roundrect (at -1.95 -0.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 139 /FPGA/SFP1_LOS) (solder_mask_margin 0.102)) (pad 5 smd roundrect (at -1.95 -0.75 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 172 /FPGA/SFP4_TX_FAULT) (solder_mask_margin 0.102)) (pad 6 smd roundrect (at -1.95 -1.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 171 /FPGA/SFP4_TX_DIS) (solder_mask_margin 0.102)) (pad 7 smd roundrect (at -1.25 -1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 170 /FPGA/SFP4_DEF0) (solder_mask_margin 0.102)) (pad 8 smd roundrect (at -0.75 -1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 168 /FPGA/SFP4_LOS) (solder_mask_margin 0.102)) (pad 9 smd roundrect (at -0.25 -1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 10 smd roundrect (at 0.25 -1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 166 /FPGA/SFP3_TX_FAULT) (solder_mask_margin 0.102)) (pad 11 smd roundrect (at 0.75 -1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 165 /FPGA/SFP3_TX_DIS) (solder_mask_margin 0.102)) (pad 12 smd roundrect (at 1.25 -1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 164 /FPGA/SFP3_DEF0) (solder_mask_margin 0.102)) (pad 13 smd roundrect (at 1.95 -1.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 162 /FPGA/SFP3_LOS) (solder_mask_margin 0.102)) (pad 14 smd roundrect (at 1.95 -0.75 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 160 /FPGA/SFP2_TX_FAULT) (solder_mask_margin 0.102)) (pad 15 smd roundrect (at 1.95 -0.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 159 /FPGA/SFP2_TX_DIS) (solder_mask_margin 0.102)) (pad 16 smd roundrect (at 1.95 0.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 158 /FPGA/SFP2_DEF0) (solder_mask_margin 0.102)) (pad 17 smd roundrect (at 1.95 0.75 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 156 /FPGA/SFP2_LOS) (solder_mask_margin 0.102)) (pad 18 smd roundrect (at 1.95 1.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 19 smd roundrect (at 1.25 1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 293 /FPGA/I2C_APP_SCL) (solder_mask_margin 0.102)) (pad 20 smd roundrect (at 0.75 1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 287 /FPGA/I2C_APP_SDA) (solder_mask_margin 0.102)) (pad 21 smd roundrect (at 0.25 1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 22 smd roundrect (at -0.25 1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 353 /FPGA/EXP_INT) (solder_mask_margin 0.102)) (pad 23 smd roundrect (at -0.75 1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 24 smd roundrect (at -1.25 1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/QFN50P400X400X80-25N-S225.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:QFN50P400X400X80-25N-S225" (layer B.Cu) (tedit 5CACB9F4) (tstamp 5C6F856A) (at 174.600762 93.42961 180) (descr "QFN,0.50mm pitch,square;6 pin X 6 pin,4mm X 4mm body (w/thermal tab 2.25 X 2.25 mm), IPC Medium Density") (path /5C907554/5D0D4F3C) (attr smd) (fp_text reference U39 (at 2.515762 3.51361 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value PCA9555AHF (at 0 -3.676 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -2.95 1.25) (end -2.825 1.25) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start 1.75 -2) (end 2 -2) (layer B.SilkS) (width 0.2)) (fp_line (start 2 -2) (end 2 -1.75) (layer B.SilkS) (width 0.2)) (fp_line (start -2 -2) (end -1.75 -2) (layer B.SilkS) (width 0.2)) (fp_line (start -2 -2) (end -2 -1.75) (layer B.SilkS) (width 0.2)) (fp_line (start 1.75 2) (end 2 2) (layer B.SilkS) (width 0.2)) (fp_line (start 2 1.75) (end 2 2) (layer B.SilkS) (width 0.2)) (fp_line (start -1.8 2) (end -1.75 2) (layer B.SilkS) (width 0.2)) (fp_line (start -2 1.8) (end -1.8 2) (layer B.SilkS) (width 0.2)) (fp_line (start -2 1.75) (end -2 1.8) (layer B.SilkS) (width 0.2)) (fp_line (start -2 1) (end -1 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.1) (end -1.1 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.2) (end -1.2 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.3) (end -1.3 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.4) (end -1.4 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.5) (end -1.5 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.6) (end -1.6 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.7) (end -1.7 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.8) (end -1.8 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 1.9) (end -1.9 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2) (end 2 -2) (layer B.Fab) (width 0.1)) (fp_line (start 2 -2) (end 2 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 2) (end 2 2) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2) (end -2 2) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -2.65 -2.65) (end 2.65 -2.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.65 -2.65) (end 2.65 2.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.65 2.65) (end 2.65 2.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.65 -2.65) (end -2.65 2.65) (layer B.CrtYd) (width 0.05)) (pad 25 smd rect (at 0 0 90) (size 2.25 2.25) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd roundrect (at -1.95 1.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1117 /SI570_OE) (solder_mask_margin 0.102)) (pad 2 smd roundrect (at -1.95 0.75 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1097 "Net-(U39-Pad2)") (solder_mask_margin 0.102)) (pad 3 smd roundrect (at -1.95 0.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 230 /EN_USB_JTAG) (solder_mask_margin 0.102)) (pad 4 smd roundrect (at -1.95 -0.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 56 /EN_CON_JTAG) (solder_mask_margin 0.102)) (pad 5 smd roundrect (at -1.95 -0.75 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 321 /ALERT) (solder_mask_margin 0.102)) (pad 6 smd roundrect (at -1.95 -1.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 485 /FANFAIL) (solder_mask_margin 0.102)) (pad 7 smd roundrect (at -1.25 -1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 345 /THERM) (solder_mask_margin 0.102)) (pad 8 smd roundrect (at -0.75 -1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 400 /FPGA/CFG_WP_B) (solder_mask_margin 0.102)) (pad 9 smd roundrect (at -0.25 -1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 10 smd roundrect (at 0.25 -1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1098 "Net-(U39-Pad10)") (solder_mask_margin 0.102)) (pad 11 smd roundrect (at 0.75 -1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1099 "Net-(U39-Pad11)") (solder_mask_margin 0.102)) (pad 12 smd roundrect (at 1.25 -1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 662 "Net-(LD12-Pad1)") (solder_mask_margin 0.102)) (pad 13 smd roundrect (at 1.95 -1.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 660 "Net-(LD11-Pad1)") (solder_mask_margin 0.102)) (pad 14 smd roundrect (at 1.95 -0.75 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 169 /FPGA/SFP4_RS) (solder_mask_margin 0.102)) (pad 15 smd roundrect (at 1.95 -0.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 163 /FPGA/SFP3_RS) (solder_mask_margin 0.102)) (pad 16 smd roundrect (at 1.95 0.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 157 /FPGA/SFP2_RS) (solder_mask_margin 0.102)) (pad 17 smd roundrect (at 1.95 0.75 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 140 /FPGA/SFP1_RS) (solder_mask_margin 0.102)) (pad 18 smd roundrect (at 1.95 1.25 180) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 19 smd roundrect (at 1.25 1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 293 /FPGA/I2C_APP_SCL) (solder_mask_margin 0.102)) (pad 20 smd roundrect (at 0.75 1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 287 /FPGA/I2C_APP_SDA) (solder_mask_margin 0.102)) (pad 21 smd roundrect (at 0.25 1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 22 smd roundrect (at -0.25 1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 353 /FPGA/EXP_INT) (solder_mask_margin 0.102)) (pad 23 smd roundrect (at -0.75 1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 24 smd roundrect (at -1.25 1.95 90) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/QFN50P400X400X80-25N-S225.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT95P237X112-3N" (layer B.Cu) (tedit 5CACB9D4) (tstamp 5CAE8941) (at 159.9692 197.6628 270) (descr "SOT, 0.95mm, pitch; 3 pin,1.30mm W X 2.92mm L X 1.12mm H body, IPC Medium Density") (path /5C16BF8E/5E3D2575) (attr smd) (fp_text reference Q25 (at -3.0988 0.3048) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value Si2315BDS-T1-E3 (at 0 -2.826 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.4 1.75) (end -1.275 1.75) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.3 -1.45) (end -0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.3 -1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -1.45) (end 0.3 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.65 -1.46) (end -0.65 1.46) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.46) (end 0.65 1.46) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -1.46) (end 0.65 1.46) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.46) (end 0.65 -1.46) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.46) (end 0.35 1.46) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.56) (end 0.25 1.46) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.66) (end 0.15 1.46) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.76) (end 0.05 1.46) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.86) (end -0.05 1.46) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.96) (end -0.15 1.46) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.06) (end -0.25 1.46) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.16) (end -0.35 1.46) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.26) (end -0.45 1.46) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.36) (end -0.55 1.46) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -1.95 -1.8) (end -1.95 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 1.8) (end 1.95 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.95 -1.8) (end 1.95 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 -1.8) (end 1.95 -1.8) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.15 0.95 270) (size 1.05 0.6) (layers B.Cu B.Paste B.Mask) (net 245 "Net-(Q15-Pad3)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.15 -0.95 270) (size 1.05 0.6) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 3 smd rect (at 1.15 0 270) (size 1.05 0.6) (layers B.Cu B.Paste B.Mask) (net 33 "Net-(C132-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/SOT95P240X110-3N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOP65P490X110-8N" (layer F.Cu) (tedit 5CACB92A) (tstamp 5C6F7A14) (at 218.44 93.9038 180) (descr "SOP, 0.65mm pitch; 8 pin, 3.00mm W X 3.00mm L X 1.10mm H body, IPC Medium Density") (path /5C16BF13/5C59700C) (attr smd) (fp_text reference U16 (at 4.826 1.1938 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value AD5662BRMZ-1 (at 0 2.826 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -2.7 -1.7) (end -2.575 -1.7) (layer F.SilkS) (width 0.25)) (fp_line (start -1.125 1.5) (end 1.125 1.5) (layer F.SilkS) (width 0.2)) (fp_line (start 1.125 1.5) (end 1.125 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.125 -1.5) (end 1.125 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.125 1.5) (end -1.125 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.125 -1.3) (end -0.925 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.125 -1.1) (end -0.725 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.125 -0.9) (end -0.525 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.125 -0.7) (end -0.325 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.125 -0.5) (end -0.125 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.5 1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1)) (fp_line (start 1.5 1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 1.5) (end -1.5 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -0.5) (end -0.5 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -0.6) (end -0.6 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -0.7) (end -0.7 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -0.8) (end -0.8 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -0.9) (end -0.9 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1) (end -1 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1.1) (end -1.1 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1.2) (end -1.2 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1.3) (end -1.3 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1.4) (end -1.4 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -3.2 1.8) (end -3.2 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.2 -1.8) (end 3.2 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.2 1.8) (end 3.2 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.2 1.8) (end 3.2 1.8) (layer F.CrtYd) (width 0.05)) (pad 8 smd rect (at 2.2 -0.975 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.2 -0.325 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 402 /FPGA/WR_DAC_DIN) (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.2 0.325 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 403 /FPGA/WR_DAC_SCLK) (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.2 0.975 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 404 /FPGA/WR_DAC2_SYNC) (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.2 0.975 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 458 "Net-(R92-Pad2)") (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.2 0.325 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 458 "Net-(R92-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.2 -0.325 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 448 "Net-(C106-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -2.2 -0.975 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (model SOP65P490X110-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/SOP65P490X110-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOP65P490X110-8N" (layer F.Cu) (tedit 5CACB92A) (tstamp 5C6F8007) (at 218.44 97.7138 180) (descr "SOP, 0.65mm pitch; 8 pin, 3.00mm W X 3.00mm L X 1.10mm H body, IPC Medium Density") (path /5C16BF13/5D741523) (attr smd) (fp_text reference U19 (at 5.08 1.1938 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value AD5662BRMZ-1 (at 0 2.826 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -2.7 -1.7) (end -2.575 -1.7) (layer F.SilkS) (width 0.25)) (fp_line (start -1.125 1.5) (end 1.125 1.5) (layer F.SilkS) (width 0.2)) (fp_line (start 1.125 1.5) (end 1.125 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.125 -1.5) (end 1.125 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.125 1.5) (end -1.125 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.125 -1.3) (end -0.925 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.125 -1.1) (end -0.725 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.125 -0.9) (end -0.525 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.125 -0.7) (end -0.325 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.125 -0.5) (end -0.125 -1.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.5 1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1)) (fp_line (start 1.5 1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 1.5) (end -1.5 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -0.5) (end -0.5 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -0.6) (end -0.6 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -0.7) (end -0.7 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -0.8) (end -0.8 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -0.9) (end -0.9 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1) (end -1 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1.1) (end -1.1 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1.2) (end -1.2 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1.3) (end -1.3 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -1.5 -1.4) (end -1.4 -1.5) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -3.2 1.8) (end -3.2 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.2 -1.8) (end 3.2 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.2 1.8) (end 3.2 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.2 1.8) (end 3.2 1.8) (layer F.CrtYd) (width 0.05)) (pad 8 smd rect (at 2.2 -0.975 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.2 -0.325 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 402 /FPGA/WR_DAC_DIN) (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.2 0.325 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 403 /FPGA/WR_DAC_SCLK) (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.2 0.975 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 405 /FPGA/WR_DAC1_SYNC) (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.2 0.975 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 294 "Net-(R93-Pad2)") (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.2 0.325 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 294 "Net-(R93-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.2 -0.325 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 448 "Net-(C106-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -2.2 -0.975 180) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 461 +3V3_CLEAN) (solder_mask_margin 0.102)) (model SOP65P490X110-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/SOP65P490X110-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:LED_AVAGO_HSMC-C120" (layer F.Cu) (tedit 5CACB8F4) (tstamp 5CF3D6A1) (at 128.397 213.106 90) (descr "Red Chip LED, 2-Leads, Body 1.7x1.1mm, Side Emitting Package") (path /5BCEDA39/5E66E5E1) (attr smd) (fp_text reference LD14 (at 0 2.54 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value LED_AVAGO_HSMC-C120 (at 0 2.051 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -1 0.8) (end -0.875 0.8) (layer F.SilkS) (width 0.25)) (fp_line (start -0.332 -0.8) (end 0.332 -0.8) (layer F.SilkS) (width 0.2)) (fp_line (start 0.2 0.15) (end 0.2 0.55) (layer Cmts.User) (width 0.05)) (fp_line (start -0.2 0.55) (end 0.2 0.55) (layer Cmts.User) (width 0.05)) (fp_line (start -0.2 0.55) (end -0.2 0.15) (layer Cmts.User) (width 0.05)) (fp_line (start -0.2 0.15) (end 0.2 0.15) (layer Cmts.User) (width 0.05)) (fp_line (start -1.4 0.35) (end -1.4 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -0.6 0.35) (end -0.6 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -1.4 0.35) (end -0.6 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -1.4 -0.35) (end -0.6 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start 1.4 0.35) (end 1.4 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -1 0) (end 1 0) (layer Cmts.User) (width 0.05)) (fp_line (start 0 0.35) (end 0 0) (layer Cmts.User) (width 0.05)) (fp_line (start 0.6 0.35) (end 0.6 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start 0.6 0.35) (end 1.4 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start 0.6 -0.35) (end 1.4 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -0.332 -0.8) (end 0.332 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start -0.85 -0.3) (end 0.85 -0.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.85 0.3) (end 0.85 0.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.85 0.3) (end -0.85 -0.3) (layer F.Fab) (width 0.1)) (fp_line (start 0.85 0.3) (end 0.85 -0.3) (layer F.Fab) (width 0.1)) (fp_line (start 1.65 0.8) (end 1.65 -1.05) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.65 0.8) (end -1.65 -1.05) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.65 0.8) (end 1.65 0.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.65 -1.05) (end 1.65 -1.05) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_arc (start 0 -0.3) (end -0.332 -0.8) (angle -56) (layer F.Fab) (width 0.1)) (fp_arc (start 0 -0.3) (end 0.6 -0.3) (angle -56) (layer F.Fab) (width 0.1)) (fp_arc (start 0 -0.3) (end -0.332 -0.8) (angle -11) (layer F.SilkS) (width 0.2)) (fp_arc (start 0 -0.3) (end 0.424 -0.724) (angle -11) (layer F.SilkS) (width 0.2)) (pad 3 smd rect (at 0 0.35 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.102)) (pad 2 smd rect (at 1 0 270) (size 0.8 0.7) (layers F.Cu F.Paste F.Mask) (net 666 "Net-(LD14-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -1 0 270) (size 0.8 0.7) (layers F.Cu F.Paste F.Mask) (net 667 "Net-(LD14-Pad1)") (solder_mask_margin 0.102)) (model LED_AVAGO_HSMC-C120.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/LED_AVAGO_HSMC-C120.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 180)) ) ) (module "ICs And Semiconductors SMD:LED_AVAGO_HSMC-C120" (layer F.Cu) (tedit 5CACB8F4) (tstamp 5CF3D67B) (at 134.239 71.882 90) (descr "Red Chip LED, 2-Leads, Body 1.7x1.1mm, Side Emitting Package") (path /5BCEDA39/5E67FF5B) (attr smd) (fp_text reference LD13 (at 0.0254 2.1336 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value LED_AVAGO_HSMC-C120 (at 0 2.051 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -1 0.8) (end -0.875 0.8) (layer F.SilkS) (width 0.25)) (fp_line (start -0.332 -0.8) (end 0.332 -0.8) (layer F.SilkS) (width 0.2)) (fp_line (start 0.2 0.15) (end 0.2 0.55) (layer Cmts.User) (width 0.05)) (fp_line (start -0.2 0.55) (end 0.2 0.55) (layer Cmts.User) (width 0.05)) (fp_line (start -0.2 0.55) (end -0.2 0.15) (layer Cmts.User) (width 0.05)) (fp_line (start -0.2 0.15) (end 0.2 0.15) (layer Cmts.User) (width 0.05)) (fp_line (start -1.4 0.35) (end -1.4 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -0.6 0.35) (end -0.6 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -1.4 0.35) (end -0.6 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -1.4 -0.35) (end -0.6 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start 1.4 0.35) (end 1.4 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -1 0) (end 1 0) (layer Cmts.User) (width 0.05)) (fp_line (start 0 0.35) (end 0 0) (layer Cmts.User) (width 0.05)) (fp_line (start 0.6 0.35) (end 0.6 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start 0.6 0.35) (end 1.4 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start 0.6 -0.35) (end 1.4 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -0.332 -0.8) (end 0.332 -0.8) (layer F.Fab) (width 0.1)) (fp_line (start -0.85 -0.3) (end 0.85 -0.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.85 0.3) (end 0.85 0.3) (layer F.Fab) (width 0.1)) (fp_line (start -0.85 0.3) (end -0.85 -0.3) (layer F.Fab) (width 0.1)) (fp_line (start 0.85 0.3) (end 0.85 -0.3) (layer F.Fab) (width 0.1)) (fp_line (start 1.65 0.8) (end 1.65 -1.05) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.65 0.8) (end -1.65 -1.05) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.65 0.8) (end 1.65 0.8) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.65 -1.05) (end 1.65 -1.05) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.3) (end 0 -0.3) (layer F.Fab) (width 0.05)) (fp_arc (start 0 -0.3) (end -0.332 -0.8) (angle -56) (layer F.Fab) (width 0.1)) (fp_arc (start 0 -0.3) (end 0.6 -0.3) (angle -56) (layer F.Fab) (width 0.1)) (fp_arc (start 0 -0.3) (end -0.332 -0.8) (angle -11) (layer F.SilkS) (width 0.2)) (fp_arc (start 0 -0.3) (end 0.424 -0.724) (angle -11) (layer F.SilkS) (width 0.2)) (pad 3 smd rect (at 0 0.35 270) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.102)) (pad 2 smd rect (at 1 0 270) (size 0.8 0.7) (layers F.Cu F.Paste F.Mask) (net 664 "Net-(LD13-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -1 0 270) (size 0.8 0.7) (layers F.Cu F.Paste F.Mask) (net 665 "Net-(LD13-Pad1)") (solder_mask_margin 0.102)) (model LED_AVAGO_HSMC-C120.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/LED_AVAGO_HSMC-C120.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 180)) ) ) (module "ICs And Semiconductors SMD:LED_AVAGO_HSMC-C120" (layer B.Cu) (tedit 5CACB8F4) (tstamp 5CD19836) (at 124.0282 94.996 270) (descr "Red Chip LED, 2-Leads, Body 1.7x1.1mm, Side Emitting Package") (path /5C907554/5DD902C1) (attr smd) (fp_text reference LD12 (at -3.048 -2.4003 270) (layer B.SilkS) (effects (font (size 2 2) (thickness 0.4)) (justify mirror)) ) (fp_text value LED_AVAGO_HSMC-C120 (at 0 -2.051 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1 -0.8) (end -0.875 -0.8) (layer B.SilkS) (width 0.25)) (fp_line (start -0.332 0.8) (end 0.332 0.8) (layer B.SilkS) (width 0.2)) (fp_line (start 0.2 -0.15) (end 0.2 -0.55) (layer Cmts.User) (width 0.05)) (fp_line (start -0.2 -0.55) (end 0.2 -0.55) (layer Cmts.User) (width 0.05)) (fp_line (start -0.2 -0.55) (end -0.2 -0.15) (layer Cmts.User) (width 0.05)) (fp_line (start -0.2 -0.15) (end 0.2 -0.15) (layer Cmts.User) (width 0.05)) (fp_line (start -1.4 -0.35) (end -1.4 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -0.6 -0.35) (end -0.6 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -1.4 -0.35) (end -0.6 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -1.4 0.35) (end -0.6 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start 1.4 -0.35) (end 1.4 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -1 0) (end 1 0) (layer Cmts.User) (width 0.05)) (fp_line (start 0 -0.35) (end 0 0) (layer Cmts.User) (width 0.05)) (fp_line (start 0.6 -0.35) (end 0.6 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start 0.6 -0.35) (end 1.4 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start 0.6 0.35) (end 1.4 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -0.332 0.8) (end 0.332 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 0.3) (end 0.85 0.3) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.3) (end 0.85 -0.3) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.3) (end -0.85 0.3) (layer B.Fab) (width 0.1)) (fp_line (start 0.85 -0.3) (end 0.85 0.3) (layer B.Fab) (width 0.1)) (fp_line (start 1.65 -0.8) (end 1.65 1.05) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.65 -0.8) (end -1.65 1.05) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.65 -0.8) (end 1.65 -0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.65 1.05) (end 1.65 1.05) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_arc (start 0 0.3) (end -0.332 0.8) (angle 56) (layer B.Fab) (width 0.1)) (fp_arc (start 0 0.3) (end 0.6 0.3) (angle 56) (layer B.Fab) (width 0.1)) (fp_arc (start 0 0.3) (end -0.332 0.8) (angle 11) (layer B.SilkS) (width 0.2)) (fp_arc (start 0 0.3) (end 0.424 0.724) (angle 11) (layer B.SilkS) (width 0.2)) (pad 3 smd rect (at 0 -0.35 90) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (solder_mask_margin 0.102)) (pad 2 smd rect (at 1 0 90) (size 0.8 0.7) (layers B.Cu B.Paste B.Mask) (net 661 "Net-(LD12-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -1 0 90) (size 0.8 0.7) (layers B.Cu B.Paste B.Mask) (net 662 "Net-(LD12-Pad1)") (solder_mask_margin 0.102)) (model LED_AVAGO_HSMC-C120.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/LED_AVAGO_HSMC-C120.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 180)) ) ) (module "ICs And Semiconductors SMD:LED_AVAGO_HSMC-C120" (layer B.Cu) (tedit 5CACB8F4) (tstamp 5CD19810) (at 124.079 100.1268 270) (descr "Red Chip LED, 2-Leads, Body 1.7x1.1mm, Side Emitting Package") (path /5C907554/5DD64C74) (attr smd) (fp_text reference LD11 (at 5.2324 -2.2225 270) (layer B.SilkS) (effects (font (size 2 2) (thickness 0.4)) (justify mirror)) ) (fp_text value LED_AVAGO_HSMC-C120 (at 0 -2.051 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1 -0.8) (end -0.875 -0.8) (layer B.SilkS) (width 0.25)) (fp_line (start -0.332 0.8) (end 0.332 0.8) (layer B.SilkS) (width 0.2)) (fp_line (start 0.2 -0.15) (end 0.2 -0.55) (layer Cmts.User) (width 0.05)) (fp_line (start -0.2 -0.55) (end 0.2 -0.55) (layer Cmts.User) (width 0.05)) (fp_line (start -0.2 -0.55) (end -0.2 -0.15) (layer Cmts.User) (width 0.05)) (fp_line (start -0.2 -0.15) (end 0.2 -0.15) (layer Cmts.User) (width 0.05)) (fp_line (start -1.4 -0.35) (end -1.4 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -0.6 -0.35) (end -0.6 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -1.4 -0.35) (end -0.6 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -1.4 0.35) (end -0.6 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start 1.4 -0.35) (end 1.4 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -1 0) (end 1 0) (layer Cmts.User) (width 0.05)) (fp_line (start 0 -0.35) (end 0 0) (layer Cmts.User) (width 0.05)) (fp_line (start 0.6 -0.35) (end 0.6 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start 0.6 -0.35) (end 1.4 -0.35) (layer Cmts.User) (width 0.05)) (fp_line (start 0.6 0.35) (end 1.4 0.35) (layer Cmts.User) (width 0.05)) (fp_line (start -0.332 0.8) (end 0.332 0.8) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 0.3) (end 0.85 0.3) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.3) (end 0.85 -0.3) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.3) (end -0.85 0.3) (layer B.Fab) (width 0.1)) (fp_line (start 0.85 -0.3) (end 0.85 0.3) (layer B.Fab) (width 0.1)) (fp_line (start 1.65 -0.8) (end 1.65 1.05) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.65 -0.8) (end -1.65 1.05) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.65 -0.8) (end 1.65 -0.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.65 1.05) (end 1.65 1.05) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.3 0) (end 0.3 0) (layer B.Fab) (width 0.05)) (fp_line (start 0 -0.3) (end 0 0.3) (layer B.Fab) (width 0.05)) (fp_arc (start 0 0.3) (end -0.332 0.8) (angle 56) (layer B.Fab) (width 0.1)) (fp_arc (start 0 0.3) (end 0.6 0.3) (angle 56) (layer B.Fab) (width 0.1)) (fp_arc (start 0 0.3) (end -0.332 0.8) (angle 11) (layer B.SilkS) (width 0.2)) (fp_arc (start 0 0.3) (end 0.424 0.724) (angle 11) (layer B.SilkS) (width 0.2)) (pad 3 smd rect (at 0 -0.35 90) (size 0.4 0.4) (layers B.Cu B.Paste B.Mask) (solder_mask_margin 0.102)) (pad 2 smd rect (at 1 0 90) (size 0.8 0.7) (layers B.Cu B.Paste B.Mask) (net 659 "Net-(LD11-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -1 0 90) (size 0.8 0.7) (layers B.Cu B.Paste B.Mask) (net 660 "Net-(LD11-Pad1)") (solder_mask_margin 0.102)) (model LED_AVAGO_HSMC-C120.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/LED_AVAGO_HSMC-C120.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 180)) ) ) (module "ICs And Semiconductors SMD:QFN40P140X180X55-10N" (layer B.Cu) (tedit 5CACB77C) (tstamp 5CB995E1) (at 159.7533 126.0983 270) (descr "QFN, 0.40mm Pitch, Rect.;10 Pin, 1.80mm L X 1.40mm W X 0.55mm H Body, IPC Medium Density") (path /5C16C03C/5C63BA6D) (attr smd) (fp_text reference U24 (at 1.0287 -3.4417) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SN74AVC2T245RSWR (at 0 -2.576 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.7 0.2) (end -1.575 0.2) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.7 -0.9) (end 0.7 -0.9) (layer B.Fab) (width 0.1)) (fp_line (start 0.7 -0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.9) (end -0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.8) (end -0.6 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.7) (end -0.5 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.6) (end -0.4 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.5) (end -0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.4) (end -0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.3) (end -0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.2) (end 0 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.1) (end 0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0) (end 0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.1) (end 0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -1.35 -1.55) (end 1.35 -1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.35 -1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 -1.55) (end -1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 10 smd roundrect (at -0.4 0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 9 smd roundrect (at 0 0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 315 "Net-(R123-Pad2)") (solder_mask_margin 0.102)) (pad 8 smd roundrect (at 0.4 0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 313 "Net-(R121-Pad2)") (solder_mask_margin 0.102)) (pad 7 smd roundrect (at 0.7 0.2 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 6 smd roundrect (at 0.7 -0.2 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 5 smd roundrect (at 0.4 -0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 319 /MMC/LPC_ISPn) (solder_mask_margin 0.102)) (pad 4 smd roundrect (at 0 -0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 673 "Net-(Q24-Pad1)") (solder_mask_margin 0.102)) (pad 3 smd roundrect (at -0.4 -0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd roundrect (at -0.7 -0.2 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd roundrect (at -0.65 0.2 270) (size 0.9 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (model ${CERN}/QFN40P140X180X55-10N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:QFN40P140X180X55-10N" (layer B.Cu) (tedit 5CACB77C) (tstamp 5C547A13) (at 161.29 121.666 270) (descr "QFN, 0.40mm Pitch, Rect.;10 Pin, 1.80mm L X 1.40mm W X 0.55mm H Body, IPC Medium Density") (path /5C16C03C/5C67270D) (attr smd) (fp_text reference U25 (at -0.762 -3.302) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SN74AVC2T245RSWR (at 0 -2.576 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.7 0.2) (end -1.575 0.2) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.7 -0.9) (end 0.7 -0.9) (layer B.Fab) (width 0.1)) (fp_line (start 0.7 -0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.9) (end -0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.8) (end -0.6 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.7) (end -0.5 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.6) (end -0.4 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.5) (end -0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.4) (end -0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.3) (end -0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.2) (end 0 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.1) (end 0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0) (end 0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.1) (end 0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -1.35 -1.55) (end 1.35 -1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.35 -1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 -1.55) (end -1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 10 smd roundrect (at -0.4 0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 9 smd roundrect (at 0 0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 409 "Net-(U23-Pad46)") (solder_mask_margin 0.102)) (pad 8 smd roundrect (at 0.4 0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 408 "Net-(U23-Pad42)") (solder_mask_margin 0.102)) (pad 7 smd roundrect (at 0.7 0.2 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 6 smd roundrect (at 0.7 -0.2 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 5 smd roundrect (at 0.4 -0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 410 /MMC/MMC_CONS_PROG_RxD) (solder_mask_margin 0.102)) (pad 4 smd roundrect (at 0 -0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 411 /MMC/MMC_CONS_PROG_TxD) (solder_mask_margin 0.102)) (pad 3 smd roundrect (at -0.4 -0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd roundrect (at -0.7 -0.2 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd roundrect (at -0.65 0.2 270) (size 0.9 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/QFN40P140X180X55-10N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:QFN40P140X180X55-10N" (layer B.Cu) (tedit 5CACB77C) (tstamp 5C6F8145) (at 161.29 107.95 270) (descr "QFN, 0.40mm Pitch, Rect.;10 Pin, 1.80mm L X 1.40mm W X 0.55mm H Body, IPC Medium Density") (path /5C16C03C/5C6A90E5) (attr smd) (fp_text reference U26 (at -2.032 -2.159) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SN74AVC2T245RSWR (at 0 -2.576 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.7 0.2) (end -1.575 0.2) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.7 -0.9) (end 0.7 -0.9) (layer B.Fab) (width 0.1)) (fp_line (start 0.7 -0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.9) (end -0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.8) (end -0.6 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.7) (end -0.5 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.6) (end -0.4 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.5) (end -0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.4) (end -0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.3) (end -0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.2) (end 0 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.1) (end 0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0) (end 0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.1) (end 0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -1.35 -1.55) (end 1.35 -1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.35 -1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 -1.55) (end -1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 10 smd roundrect (at -0.4 0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 9 smd roundrect (at 0 0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 316 "Net-(R124-Pad2)") (solder_mask_margin 0.102)) (pad 8 smd roundrect (at 0.4 0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 314 "Net-(R122-Pad2)") (solder_mask_margin 0.102)) (pad 7 smd roundrect (at 0.7 0.2 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 6 smd roundrect (at 0.7 -0.2 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 5 smd roundrect (at 0.4 -0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 365 /USB_TCK) (solder_mask_margin 0.102)) (pad 4 smd roundrect (at 0 -0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 366 /USB_TDI_DO) (solder_mask_margin 0.102)) (pad 3 smd roundrect (at -0.4 -0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd roundrect (at -0.7 -0.2 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 457 "Net-(Q6-Pad3)") (solder_mask_margin 0.102)) (pad 1 smd roundrect (at -0.65 0.2 270) (size 0.9 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (model ${CERN}/QFN40P140X180X55-10N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:QFN40P140X180X55-10N" (layer B.Cu) (tedit 5CACB77C) (tstamp 5C6F852E) (at 154.686 105.41) (descr "QFN, 0.40mm Pitch, Rect.;10 Pin, 1.80mm L X 1.40mm W X 0.55mm H Body, IPC Medium Density") (path /5C16C03C/5C6B6AA8) (attr smd) (fp_text reference U33 (at 0 -2.794) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SN74AVC2T245RSWR (at 0 -2.576) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.7 0.2) (end -1.575 0.2) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.7 -0.9) (end 0.7 -0.9) (layer B.Fab) (width 0.1)) (fp_line (start 0.7 -0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.9) (end -0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.8) (end -0.6 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.7) (end -0.5 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.6) (end -0.4 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.5) (end -0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.4) (end -0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.3) (end -0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.2) (end 0 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.1) (end 0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0) (end 0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.1) (end 0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -1.35 -1.55) (end 1.35 -1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.35 -1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 -1.55) (end -1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 10 smd roundrect (at -0.4 0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 9 smd roundrect (at 0 0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 317 "Net-(R125-Pad2)") (solder_mask_margin 0.102)) (pad 8 smd roundrect (at 0.4 0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 318 "Net-(R126-Pad2)") (solder_mask_margin 0.102)) (pad 7 smd roundrect (at 0.7 0.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 6 smd roundrect (at 0.7 -0.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 5 smd roundrect (at 0.4 -0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 367 /USB_TMS) (solder_mask_margin 0.102)) (pad 4 smd roundrect (at 0 -0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 368 /USB_TDO_DI) (solder_mask_margin 0.102)) (pad 3 smd roundrect (at -0.4 -0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd roundrect (at -0.7 -0.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 457 "Net-(Q6-Pad3)") (solder_mask_margin 0.102)) (pad 1 smd roundrect (at -0.65 0.2) (size 0.9 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/QFN40P140X180X55-10N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:QFN40P140X180X55-10N" (layer B.Cu) (tedit 5CACB77C) (tstamp 5C6F860C) (at 161.29 113.03 270) (descr "QFN, 0.40mm Pitch, Rect.;10 Pin, 1.80mm L X 1.40mm W X 0.55mm H Body, IPC Medium Density") (path /5C16C03C/5C6800D0) (attr smd) (fp_text reference U38 (at -0.762 -3.175) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SN74AVC2T245RSWR (at 0 -2.576 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.7 0.2) (end -1.575 0.2) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.7 -0.9) (end 0.7 -0.9) (layer B.Fab) (width 0.1)) (fp_line (start 0.7 -0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.9) (end -0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.8) (end -0.6 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.7) (end -0.5 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.6) (end -0.4 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.5) (end -0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.4) (end -0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.3) (end -0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.2) (end 0 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.1) (end 0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0) (end 0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.1) (end 0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -1.35 -1.55) (end 1.35 -1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.35 -1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 -1.55) (end -1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 10 smd roundrect (at -0.4 0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 9 smd roundrect (at 0 0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 406 "Net-(U23-Pad32)") (solder_mask_margin 0.102)) (pad 8 smd roundrect (at 0.4 0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 407 "Net-(U23-Pad33)") (solder_mask_margin 0.102)) (pad 7 smd roundrect (at 0.7 0.2 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 6 smd roundrect (at 0.7 -0.2 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 5 smd roundrect (at 0.4 -0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 439 /FPGA_RxD) (solder_mask_margin 0.102)) (pad 4 smd roundrect (at 0 -0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 440 /FPGA_TxD) (solder_mask_margin 0.102)) (pad 3 smd roundrect (at -0.4 -0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd roundrect (at -0.7 -0.2 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd roundrect (at -0.65 0.2 270) (size 0.9 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (model ${CERN}/QFN40P140X180X55-10N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:QFN40P140X180X55-10N" (layer B.Cu) (tedit 5CACB77C) (tstamp 5C60B96B) (at 161.29 117.348 270) (descr "QFN, 0.40mm Pitch, Rect.;10 Pin, 1.80mm L X 1.40mm W X 0.55mm H Body, IPC Medium Density") (path /5C16C03C/5C94B61E) (attr smd) (fp_text reference U15 (at -0.635 -3.048) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SN74AVC2T245RSWR (at 0 -2.576 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.7 0.2) (end -1.575 0.2) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.7 -0.9) (end 0.7 -0.9) (layer B.Fab) (width 0.1)) (fp_line (start 0.7 -0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.9) (end -0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.8) (end -0.6 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.7) (end -0.5 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.6) (end -0.4 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.5) (end -0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.4) (end -0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.3) (end -0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.2) (end 0 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.1) (end 0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0) (end 0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.1) (end 0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -1.35 -1.55) (end 1.35 -1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.35 -1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 -1.55) (end -1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 10 smd roundrect (at -0.4 0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 9 smd roundrect (at 0 0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1053 "Net-(U15-Pad9)") (solder_mask_margin 0.102)) (pad 8 smd roundrect (at 0.4 0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 682 "Net-(U15-Pad8)") (solder_mask_margin 0.102)) (pad 7 smd roundrect (at 0.7 0.2 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 6 smd roundrect (at 0.7 -0.2 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 5 smd roundrect (at 0.4 -0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 438 /FPGA_RTS) (solder_mask_margin 0.102)) (pad 4 smd roundrect (at 0 -0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1054 "Net-(U15-Pad4)") (solder_mask_margin 0.102)) (pad 3 smd roundrect (at -0.4 -0.9 180) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd roundrect (at -0.7 -0.2 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd roundrect (at -0.65 0.2 270) (size 0.9 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1055 "Net-(U15-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/QFN40P140X180X55-10N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:QFN40P140X180X55-10N" (layer B.Cu) (tedit 5CACB77C) (tstamp 5C6F78D9) (at 172.5168 158.8008) (descr "QFN, 0.40mm Pitch, Rect.;10 Pin, 1.80mm L X 1.40mm W X 0.55mm H Body, IPC Medium Density") (path /5CA40231/5D76517A) (attr smd) (fp_text reference U8 (at -1.8288 -2.3368) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SN74AVC2T245RSWR (at 0 -2.576) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.7 0.2) (end -1.575 0.2) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.7 -0.9) (end 0.7 -0.9) (layer B.Fab) (width 0.1)) (fp_line (start 0.7 -0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.9) (end -0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.8) (end -0.6 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.7) (end -0.5 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.6) (end -0.4 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.5) (end -0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.4) (end -0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.3) (end -0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.2) (end 0 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.1) (end 0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0) (end 0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.1) (end 0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -1.35 -1.55) (end 1.35 -1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.35 -1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 -1.55) (end -1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 10 smd roundrect (at -0.4 0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 9 smd roundrect (at 0 0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 396 /FPGA/Self_FPGA_TDI) (solder_mask_margin 0.102)) (pad 8 smd roundrect (at 0.4 0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 397 /FPGA/Self_FPGA_TCK) (solder_mask_margin 0.102)) (pad 7 smd roundrect (at 0.7 0.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 6 smd roundrect (at 0.7 -0.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 5 smd roundrect (at 0.4 -0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 177 /JTAG/JTAG_TCK) (solder_mask_margin 0.102)) (pad 4 smd roundrect (at 0 -0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 175 /JTAG/JTAG_TDI) (solder_mask_margin 0.102)) (pad 3 smd roundrect (at -0.4 -0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd roundrect (at -0.7 -0.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 247 "Net-(Q17-Pad3)") (solder_mask_margin 0.102)) (pad 1 smd roundrect (at -0.65 0.2) (size 0.9 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 3 +3V3) (solder_mask_margin 0.102)) (model ${CERN}/QFN40P140X180X55-10N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:QFN40P140X180X55-10N" (layer B.Cu) (tedit 5CACB77C) (tstamp 5C6F78FD) (at 172.4152 163.0172) (descr "QFN, 0.40mm Pitch, Rect.;10 Pin, 1.80mm L X 1.40mm W X 0.55mm H Body, IPC Medium Density") (path /5CA40231/5D76C9B3) (attr smd) (fp_text reference U9 (at 2.5908 -1.6637) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SN74AVC2T245RSWR (at 0 -2.576) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.7 0.2) (end -1.575 0.2) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.7 -0.9) (end 0.7 -0.9) (layer B.Fab) (width 0.1)) (fp_line (start 0.7 -0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.9) (end 0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.9) (end -0.7 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.8) (end -0.6 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.7) (end -0.5 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.6) (end -0.4 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.5) (end -0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.4) (end -0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.3) (end -0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.2) (end 0 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0.1) (end 0.1 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 0) (end 0.2 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -0.7 -0.1) (end 0.3 0.9) (layer B.Fab) (width 0.1)) (fp_line (start -1.35 -1.55) (end 1.35 -1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.35 -1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 1.55) (end 1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.35 -1.55) (end -1.35 1.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 10 smd roundrect (at -0.4 0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 9 smd roundrect (at 0 0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 398 /FPGA/Self_FPGA_TDO) (solder_mask_margin 0.102)) (pad 8 smd roundrect (at 0.4 0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 399 /FPGA/Self_FPGA_TMS) (solder_mask_margin 0.102)) (pad 7 smd roundrect (at 0.7 0.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 6 smd roundrect (at 0.7 -0.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 5 +2V5) (solder_mask_margin 0.102)) (pad 5 smd roundrect (at 0.4 -0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 178 /JTAG/JTAG_TMS) (solder_mask_margin 0.102)) (pad 4 smd roundrect (at 0 -0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 176 /JTAG/JTAG_TDO) (solder_mask_margin 0.102)) (pad 3 smd roundrect (at -0.4 -0.9 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd roundrect (at -0.7 -0.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 247 "Net-(Q17-Pad3)") (solder_mask_margin 0.102)) (pad 1 smd roundrect (at -0.65 0.2) (size 0.9 0.2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/QFN40P140X180X55-10N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOIC127P600X175-8N" (layer B.Cu) (tedit 5CACA62E) (tstamp 5C6C19D2) (at 267.335 200.025 270) (descr "SOIC 8, Pitch 1.27mm - Body 4x5mm, IPC Medium Density") (path /5C16BF8E/5D2D0F80) (attr smd) (fp_text reference Q2 (at -4.275 1.835 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SI4425DDY-T1-GE3 (at 0 -3.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -2.4 2.755) (end -2.275 2.755) (layer B.SilkS) (width 0.25)) (fp_circle (center -0.825 1.75) (end -0.325 1.75) (layer B.Fab) (width 0.1)) (fp_line (start -1.55 -2.5) (end 1.55 -2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 1.55 -2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 -2.5) (end -1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 2 -2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end 2 -2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end -2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -2.7 1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.7 0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.7 -0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.7 -1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 227 "Net-(Q1-Pad3)") (solder_mask_margin 0.102)) (pad 8 smd rect (at 2.7 1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 31 "Net-(C128-Pad1)") (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.7 0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 31 "Net-(C128-Pad1)") (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.7 -0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 31 "Net-(C128-Pad1)") (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.7 -1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 31 "Net-(C128-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/SOIC127P600X175-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOIC127P600X175-8N" (layer B.Cu) (tedit 5CACA62E) (tstamp 5C6AFD06) (at 287.2232 139.7508 270) (descr "SOIC 8, Pitch 1.27mm - Body 4x5mm, IPC Medium Density") (path /5C16BF8E/5D3D70B4) (attr smd) (fp_text reference Q3 (at -3.4544 3.8608) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SI4425DDY-T1-GE3 (at 0 -3.776 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -2.4 2.755) (end -2.275 2.755) (layer B.SilkS) (width 0.25)) (fp_circle (center -0.825 1.75) (end -0.325 1.75) (layer B.Fab) (width 0.1)) (fp_line (start -1.55 -2.5) (end 1.55 -2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 1.55 -2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 -2.5) (end -1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 2 -2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end 2 -2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end -2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -2.7 1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 464 +12V_AMC) (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.7 0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 464 +12V_AMC) (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.7 -0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 464 +12V_AMC) (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.7 -1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 693 "Net-(C357-Pad2)") (solder_mask_margin 0.102)) (pad 8 smd rect (at 2.7 1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.7 0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.7 -0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.7 -1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (model ${CERN}/SOIC127P600X175-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOIC127P600X175-8N" (layer B.Cu) (tedit 5CACA62E) (tstamp 5C6AFD22) (at 233.118288 199.615817 270) (descr "SOIC 8, Pitch 1.27mm - Body 4x5mm, IPC Medium Density") (path /5C16BF8E/5D30F7F4) (attr smd) (fp_text reference Q4 (at 0.180583 3.959488) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SI4425DDY-T1-GE3 (at 0 -3.776 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -2.4 2.755) (end -2.275 2.755) (layer B.SilkS) (width 0.25)) (fp_circle (center -0.825 1.75) (end -0.325 1.75) (layer B.Fab) (width 0.1)) (fp_line (start -1.55 -2.5) (end 1.55 -2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 1.55 -2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 -2.5) (end -1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 2 -2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end 2 -2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end -2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -2.7 1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.7 0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.7 -0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1105 /Power/+12VS) (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.7 -1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 229 "Net-(Q22-Pad3)") (solder_mask_margin 0.102)) (pad 8 smd rect (at 2.7 1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 101 "Net-(C350-Pad1)") (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.7 0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 101 "Net-(C350-Pad1)") (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.7 -0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 101 "Net-(C350-Pad1)") (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.7 -1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 101 "Net-(C350-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/SOIC127P600X175-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOIC127P600X175-8N" (layer F.Cu) (tedit 5CACA62E) (tstamp 5C6AFD7E) (at 222.25 196.088 180) (descr "SOIC 8, Pitch 1.27mm - Body 4x5mm, IPC Medium Density") (path /5D05A99E/5D559F89) (attr smd) (fp_text reference Q7 (at 0 3.683 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value STS8DN6LF6AG (at 0 3.776 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -2.4 -2.755) (end -2.275 -2.755) (layer F.SilkS) (width 0.25)) (fp_circle (center -0.825 -1.75) (end -0.325 -1.75) (layer F.Fab) (width 0.1)) (fp_line (start -1.55 2.5) (end 1.55 2.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.55 -2.5) (end 1.55 -2.5) (layer F.SilkS) (width 0.2)) (fp_line (start 1.55 2.5) (end 1.55 -2.5) (layer F.SilkS) (width 0.2)) (fp_line (start -1.55 2.5) (end -1.55 -2.5) (layer F.SilkS) (width 0.2)) (fp_line (start 2 2.5) (end 2 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2 2.5) (end 2 2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2 2.5) (end -2 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end 2 -2.5) (layer F.Fab) (width 0.1)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.75 2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.75 2.75) (end -3.75 -2.75) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -2.7 -1.905 270) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.7 -0.635 270) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (net 231 "Net-(Q7-Pad2)") (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.7 0.635 270) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.7 1.905 270) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (net 232 "Net-(Q7-Pad4)") (solder_mask_margin 0.102)) (pad 8 smd rect (at 2.7 -1.905 270) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (net 211 "Net-(M1-Pad1)") (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.7 -0.635 270) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (net 211 "Net-(M1-Pad1)") (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.7 0.635 270) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (net 213 "Net-(M2-Pad1)") (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.7 1.905 270) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (net 213 "Net-(M2-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/SOIC127P600X175-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOIC127P600X175-8N" (layer B.Cu) (tedit 5CACA62E) (tstamp 5C6AFFCB) (at 205.8924 192.8622 180) (descr "SOIC 8, Pitch 1.27mm - Body 4x5mm, IPC Medium Density") (path /5C16BF8E/5D111201) (attr smd) (fp_text reference Q16 (at 0.0508 3.6322 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SI4425DDY-T1-GE3 (at 0 -3.776 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -2.4 2.755) (end -2.275 2.755) (layer B.SilkS) (width 0.25)) (fp_circle (center -0.825 1.75) (end -0.325 1.75) (layer B.Fab) (width 0.1)) (fp_line (start -1.55 -2.5) (end 1.55 -2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 1.55 -2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 -2.5) (end -1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 2 -2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end 2 -2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end -2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -2.7 1.905 90) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.7 0.635 90) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.7 -0.635 90) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.7 -1.905 90) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 34 "Net-(C134-Pad2)") (solder_mask_margin 0.102)) (pad 8 smd rect (at 2.7 1.905 90) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 246 "Net-(Q16-Pad5)") (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.7 0.635 90) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 246 "Net-(Q16-Pad5)") (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.7 -0.635 90) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 246 "Net-(Q16-Pad5)") (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.7 -1.905 90) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 246 "Net-(Q16-Pad5)") (solder_mask_margin 0.102)) (model ${CERN}/SOIC127P600X175-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOIC127P600X175-8N" (layer B.Cu) (tedit 5CACA62E) (tstamp 5CA1BE5C) (at 172.846599 128.296799 90) (descr "SOIC 8, Pitch 1.27mm - Body 4x5mm, IPC Medium Density") (path /5C16BF8E/5D1DA1B3) (attr smd) (fp_text reference Q23 (at 4.598799 0.508401 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SI4425DDY-T1-GE3 (at 0 -3.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -2.4 2.755) (end -2.275 2.755) (layer B.SilkS) (width 0.25)) (fp_circle (center -0.825 1.75) (end -0.325 1.75) (layer B.Fab) (width 0.1)) (fp_line (start -1.55 -2.5) (end 1.55 -2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 1.55 -2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 -2.5) (end -1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 2 -2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end 2 -2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end -2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -2.7 1.905) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.7 0.635) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.7 -0.635) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 2 +12V) (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.7 -1.905) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 35 "Net-(C135-Pad2)") (solder_mask_margin 0.102)) (pad 8 smd rect (at 2.7 1.905) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 251 "Net-(Q23-Pad5)") (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.7 0.635) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 251 "Net-(Q23-Pad5)") (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.7 -0.635) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 251 "Net-(Q23-Pad5)") (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.7 -1.905) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 251 "Net-(Q23-Pad5)") (solder_mask_margin 0.102)) (model ${CERN}/SOIC127P600X175-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOIC127P600X175-8N" (layer B.Cu) (tedit 5CACA62E) (tstamp 5C6F7997) (at 218.1352 97.2312 90) (descr "SOIC 8, Pitch 1.27mm - Body 4x5mm, IPC Medium Density") (path /5C16BF13/5C21F363) (attr smd) (fp_text reference U14 (at -0.127 -3.6322 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value LM336M-2.5 (at 0 -3.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -2.4 2.755) (end -2.275 2.755) (layer B.SilkS) (width 0.25)) (fp_circle (center -0.825 1.75) (end -0.325 1.75) (layer B.Fab) (width 0.1)) (fp_line (start -1.55 -2.5) (end 1.55 -2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 1.55 -2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 -2.5) (end -1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 2 -2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end 2 -2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end -2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -2.7 1.905) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.7 0.635) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.7 -0.635) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.7 -1.905) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 8 smd rect (at 2.7 1.905) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 448 "Net-(C106-Pad1)") (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.7 0.635) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.7 -0.635) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.7 -1.905) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/SOIC127P600X175-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOIC127P600X175-8N" (layer B.Cu) (tedit 5CACA62E) (tstamp 5C6F8067) (at 148.336 125.222 270) (descr "SOIC 8, Pitch 1.27mm - Body 4x5mm, IPC Medium Density") (path /5C16C03C/5C74B2C9) (attr smd) (fp_text reference U21 (at 1.016 -4.699) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 93LC56B-I/SN (at 0 -3.776 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -2.4 2.755) (end -2.275 2.755) (layer B.SilkS) (width 0.25)) (fp_circle (center -0.825 1.75) (end -0.325 1.75) (layer B.Fab) (width 0.1)) (fp_line (start -1.55 -2.5) (end 1.55 -2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 1.55 -2.5) (end 1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start -1.55 -2.5) (end -1.55 2.5) (layer B.SilkS) (width 0.2)) (fp_line (start 2 -2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end 2 -2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 -2.5) (end -2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start -2 2.5) (end 2 2.5) (layer B.Fab) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer B.CrtYd) (width 0.05)) (pad 1 smd rect (at -2.7 1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 310 "Net-(R117-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.7 0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 309 "Net-(R115-Pad2)") (solder_mask_margin 0.102)) (pad 3 smd rect (at -2.7 -0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 308 "Net-(R114-Pad2)") (solder_mask_margin 0.102)) (pad 4 smd rect (at -2.7 -1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 307 "Net-(R113-Pad2)") (solder_mask_margin 0.102)) (pad 8 smd rect (at 2.7 1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 7 smd rect (at 2.7 0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1064 "Net-(U21-Pad7)") (solder_mask_margin 0.102)) (pad 6 smd rect (at 2.7 -0.635 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 5 smd rect (at 2.7 -1.905 180) (size 0.6 1.55) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/SOIC127P600X175-8N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT95P240X110-3N" (layer B.Cu) (tedit 5CACA582) (tstamp 5CA62B04) (at 150.4696 139.192 90) (descr "SOT23 3-Leads, Pitch 0.95mm, Body 1.3x2.9mm, IPC Medium Density") (path /5C16C03C/5CDF0F00) (attr smd) (fp_text reference Q24 (at 0.889 3.4544 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BSS138LT1G (at 0 -2.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.4 1.8) (end -1.275 1.8) (layer B.SilkS) (width 0.25)) (fp_line (start -0.3 -1.45) (end -0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.3 -1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -1.45) (end 0.3 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.65 1.35) (end -0.55 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.25) (end -0.45 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.15) (end -0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.05) (end -0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.95) (end -0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.85) (end -0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.75) (end 0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.65) (end 0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.55) (end 0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.45) (end 0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end 0.65 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end -0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -1.95 -1.75) (end 1.95 -1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.95 -1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 -1.75) (end -1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 1 smd rect (at -1.15 0.95 90) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 673 "Net-(Q24-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.15 -0.95 90) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at 1.15 0 90) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 674 "Net-(Q24-Pad3)") (solder_mask_margin 0.102)) (model ${CERN}/SOT95P240X110-3N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT95P240X110-3N" (layer B.Cu) (tedit 5CACA582) (tstamp 5CA629B4) (at 145.8976 142.2146) (descr "SOT23 3-Leads, Pitch 0.95mm, Body 1.3x2.9mm, IPC Medium Density") (path /5C16C03C/5CF10858) (attr smd) (fp_text reference Q18 (at -0.2286 -2.5146) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BSS138LT1G (at 0 -2.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.4 1.8) (end -1.275 1.8) (layer B.SilkS) (width 0.25)) (fp_line (start -0.3 -1.45) (end -0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.3 -1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -1.45) (end 0.3 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.65 1.35) (end -0.55 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.25) (end -0.45 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.15) (end -0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.05) (end -0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.95) (end -0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.85) (end -0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.75) (end 0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.65) (end 0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.55) (end 0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.45) (end 0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end 0.65 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end -0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -1.95 -1.75) (end 1.95 -1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.95 -1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 -1.75) (end -1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 1 smd rect (at -1.15 0.95) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 670 "Net-(C360-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.15 -0.95) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at 1.15 0) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 672 "Net-(Q14-Pad2)") (solder_mask_margin 0.102)) (model ${CERN}/SOT95P240X110-3N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT95P240X110-3N" (layer B.Cu) (tedit 5CACA582) (tstamp 5CA628E0) (at 150.4188 144.0688) (descr "SOT23 3-Leads, Pitch 0.95mm, Body 1.3x2.9mm, IPC Medium Density") (path /5C16C03C/5CEEEA7F) (attr smd) (fp_text reference Q14 (at 3.6322 -1.0668) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BSS138LT1G (at 0 -2.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.4 1.8) (end -1.275 1.8) (layer B.SilkS) (width 0.25)) (fp_line (start -0.3 -1.45) (end -0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.3 -1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -1.45) (end 0.3 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.65 1.35) (end -0.55 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.25) (end -0.45 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.15) (end -0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.05) (end -0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.95) (end -0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.85) (end -0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.75) (end 0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.65) (end 0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.55) (end 0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.45) (end 0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end 0.65 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end -0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -1.95 -1.75) (end 1.95 -1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.95 -1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 -1.75) (end -1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 1 smd rect (at -1.15 0.95) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 671 "Net-(Q14-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.15 -0.95) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 672 "Net-(Q14-Pad2)") (solder_mask_margin 0.102)) (pad 3 smd rect (at 1.15 0) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 108 /MMC/ISP_RSTn) (solder_mask_margin 0.102)) (model ${CERN}/SOT95P240X110-3N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT95P240X110-3N" (layer B.Cu) (tedit 5CACA582) (tstamp 5C5C35E5) (at 205.8924 197.9422 90) (descr "SOT23 3-Leads, Pitch 0.95mm, Body 1.3x2.9mm, IPC Medium Density") (path /5C16BF8E/5CC74B8D) (attr smd) (fp_text reference Q8 (at 1.0922 -2.6924 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BSS138LT1G (at 0 -2.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.4 1.8) (end -1.275 1.8) (layer B.SilkS) (width 0.25)) (fp_line (start -0.3 -1.45) (end -0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.3 -1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -1.45) (end 0.3 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.65 1.35) (end -0.55 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.25) (end -0.45 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.15) (end -0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.05) (end -0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.95) (end -0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.85) (end -0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.75) (end 0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.65) (end 0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.55) (end 0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.45) (end 0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end 0.65 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end -0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -1.95 -1.75) (end 1.95 -1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.95 -1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 -1.75) (end -1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 1 smd rect (at -1.15 0.95 90) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 233 /MMC/EN_FMC1_P12V) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.15 -0.95 90) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at 1.15 0 90) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 234 "Net-(Q8-Pad3)") (solder_mask_margin 0.102)) (model ${CERN}/SOT95P240X110-3N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT95P240X110-3N" (layer B.Cu) (tedit 5CACA582) (tstamp 5CA1BE03) (at 167.7416 128.9558) (descr "SOT23 3-Leads, Pitch 0.95mm, Body 1.3x2.9mm, IPC Medium Density") (path /5C16BF8E/5CC371BB) (attr smd) (fp_text reference Q9 (at -0.6096 -2.7178) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BSS138LT1G (at 0 -2.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.4 1.8) (end -1.275 1.8) (layer B.SilkS) (width 0.25)) (fp_line (start -0.3 -1.45) (end -0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.3 -1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -1.45) (end 0.3 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.65 1.35) (end -0.55 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.25) (end -0.45 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.15) (end -0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.05) (end -0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.95) (end -0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.85) (end -0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.75) (end 0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.65) (end 0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.55) (end 0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.45) (end 0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end 0.65 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end -0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -1.95 -1.75) (end 1.95 -1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.95 -1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 -1.75) (end -1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 1 smd rect (at -1.15 0.95) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 235 /MMC/EN_FMC2_P12V) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.15 -0.95) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at 1.15 0) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 484 "Net-(Q9-Pad3)") (solder_mask_margin 0.102)) (model ${CERN}/SOT95P240X110-3N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT95P240X110-3N" (layer B.Cu) (tedit 5CACA582) (tstamp 5C7788EA) (at 166.3065 167.6146) (descr "SOT23 3-Leads, Pitch 0.95mm, Body 1.3x2.9mm, IPC Medium Density") (path /5CA40231/5D1CAAEE) (attr smd) (fp_text reference Q5 (at 0 2.7559) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BSS138LT1G (at 0 -2.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.4 1.8) (end -1.275 1.8) (layer B.SilkS) (width 0.25)) (fp_line (start -0.3 -1.45) (end -0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.3 -1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -1.45) (end 0.3 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.65 1.35) (end -0.55 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.25) (end -0.45 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.15) (end -0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.05) (end -0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.95) (end -0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.85) (end -0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.75) (end 0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.65) (end 0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.55) (end 0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.45) (end 0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end 0.65 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end -0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -1.95 -1.75) (end 1.95 -1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.95 -1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 -1.75) (end -1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 1 smd rect (at -1.15 0.95) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 230 /EN_USB_JTAG) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.15 -0.95) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at 1.15 0) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 456 "Net-(D14-Pad2)") (solder_mask_margin 0.102)) (model ${CERN}/SOT95P240X110-3N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT95P240X110-3N" (layer B.Cu) (tedit 5CACA582) (tstamp 5C6AFD62) (at 161.3662 101.727 270) (descr "SOT23 3-Leads, Pitch 0.95mm, Body 1.3x2.9mm, IPC Medium Density") (path /5C16C03C/5D45F18B) (attr smd) (fp_text reference Q6 (at 0 2.7432 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BSS138LT1G (at 0 -2.776 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.4 1.8) (end -1.275 1.8) (layer B.SilkS) (width 0.25)) (fp_line (start -0.3 -1.45) (end -0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.3 -1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -1.45) (end 0.3 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.65 1.35) (end -0.55 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.25) (end -0.45 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.15) (end -0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.05) (end -0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.95) (end -0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.85) (end -0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.75) (end 0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.65) (end 0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.55) (end 0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.45) (end 0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end 0.65 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end -0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -1.95 -1.75) (end 1.95 -1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.95 -1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 -1.75) (end -1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 1 smd rect (at -1.15 0.95 270) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 56 /EN_CON_JTAG) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.15 -0.95 270) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at 1.15 0 270) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 457 "Net-(Q6-Pad3)") (solder_mask_margin 0.102)) (model ${CERN}/SOT95P240X110-3N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT95P240X110-3N" (layer B.Cu) (tedit 5CACA582) (tstamp 5C6AFFEB) (at 166.3954 163.6268 90) (descr "SOT23 3-Leads, Pitch 0.95mm, Body 1.3x2.9mm, IPC Medium Density") (path /5CA40231/5D50F1E9) (attr smd) (fp_text reference Q17 (at 2.7178 -0.7239 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BSS138LT1G (at 0 -2.776 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.4 1.8) (end -1.275 1.8) (layer B.SilkS) (width 0.25)) (fp_line (start -0.3 -1.45) (end -0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.3 -1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -1.45) (end 0.3 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.65 1.35) (end -0.55 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.25) (end -0.45 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.15) (end -0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.05) (end -0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.95) (end -0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.85) (end -0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.75) (end 0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.65) (end 0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.55) (end 0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.45) (end 0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end 0.65 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end -0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -1.95 -1.75) (end 1.95 -1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.95 -1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 -1.75) (end -1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 1 smd rect (at -1.15 0.95 90) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 456 "Net-(D14-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.15 -0.95 90) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at 1.15 0 90) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 247 "Net-(Q17-Pad3)") (solder_mask_margin 0.102)) (model ${CERN}/SOT95P240X110-3N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT95P240X110-3N" (layer B.Cu) (tedit 5CACA582) (tstamp 5ED7152F) (at 201.676 210.312 90) (descr "SOT23 3-Leads, Pitch 0.95mm, Body 1.3x2.9mm, IPC Medium Density") (path /5C907554/5C417BCB/5D220E28) (attr smd) (fp_text reference Q19 (at 2.562 0.324) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BSS138LT1G (at 0 -2.776 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.4 1.8) (end -1.275 1.8) (layer B.SilkS) (width 0.25)) (fp_line (start -0.3 -1.45) (end -0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.3 -1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -1.45) (end 0.3 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.65 1.35) (end -0.55 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.25) (end -0.45 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.15) (end -0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.05) (end -0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.95) (end -0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.85) (end -0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.75) (end 0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.65) (end 0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.55) (end 0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.45) (end 0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end 0.65 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end -0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -1.95 -1.75) (end 1.95 -1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.95 -1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 -1.75) (end -1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 1 smd rect (at -1.15 0.95 90) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 248 /FPGA/FPGA_DONE) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.15 -0.95 90) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at 1.15 0 90) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 209 "Net-(LD3-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/SOT95P240X110-3N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT95P240X110-3N" (layer B.Cu) (tedit 5CACA582) (tstamp 5CA5A7F7) (at 282.194 146.812) (descr "SOT23 3-Leads, Pitch 0.95mm, Body 1.3x2.9mm, IPC Medium Density") (path /5C907554/5CAAC367/5D2E864A) (attr smd) (fp_text reference Q20 (at -3.39852 -0.21844) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BSS138LT1G (at 0 -2.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.4 1.8) (end -1.275 1.8) (layer B.SilkS) (width 0.25)) (fp_line (start -0.3 -1.45) (end -0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.3 -1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -1.45) (end 0.3 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.65 1.35) (end -0.55 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.25) (end -0.45 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.15) (end -0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.05) (end -0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.95) (end -0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.85) (end -0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.75) (end 0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.65) (end 0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.55) (end 0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.45) (end 0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end 0.65 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end -0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -1.95 -1.75) (end 1.95 -1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.95 -1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 -1.75) (end -1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 1 smd rect (at -1.15 0.95) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.15 -0.95) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 435 /FPGA/I2C_HDMI_SCL) (solder_mask_margin 0.102)) (pad 3 smd rect (at 1.15 0) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 200 "Net-(J15-Pad15)") (solder_mask_margin 0.102)) (model ${CERN}/SOT95P240X110-3N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOT95P240X110-3N" (layer B.Cu) (tedit 5CACA582) (tstamp 5C8F6912) (at 282.194 150.4442) (descr "SOT23 3-Leads, Pitch 0.95mm, Body 1.3x2.9mm, IPC Medium Density") (path /5C907554/5CAAC367/5D309024) (attr smd) (fp_text reference Q21 (at -3.3909 -0.03302) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BSS138LT1G (at 0 -2.776) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.4 1.8) (end -1.275 1.8) (layer B.SilkS) (width 0.25)) (fp_line (start -0.3 -1.45) (end -0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start 0.3 -1.45) (end 0.3 1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -1.45) (end 0.3 -1.45) (layer B.SilkS) (width 0.2)) (fp_line (start -0.65 1.35) (end -0.55 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.25) (end -0.45 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.15) (end -0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.05) (end -0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.95) (end -0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.85) (end -0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.75) (end 0.05 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.65) (end 0.15 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.55) (end 0.25 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 0.45) (end 0.35 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end 0.65 -1.45) (layer B.Fab) (width 0.1)) (fp_line (start 0.65 -1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 1.45) (end 0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -1.45) (end -0.65 1.45) (layer B.Fab) (width 0.1)) (fp_line (start -1.95 -1.75) (end 1.95 -1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.95 -1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 1.75) (end 1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.95 -1.75) (end -1.95 1.75) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 1 smd rect (at -1.15 0.95) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 2 smd rect (at -1.15 -0.95) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 436 /FPGA/I2C_HDMI_SDA) (solder_mask_margin 0.102)) (pad 3 smd rect (at 1.15 0) (size 1.05 0.65) (layers B.Cu B.Paste B.Mask) (net 199 "Net-(J15-Pad16)") (solder_mask_margin 0.102)) (model ${CERN}/SOT95P240X110-3N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOD2512X110N" (layer B.Cu) (tedit 5CACA40A) (tstamp 5CA5D720) (at 140.8938 142.875 270) (descr "Small Outline Diode Flat Lead (SOD-323), 1.70mm W X 1.25mm L X 1.10mm H body, IPC Medium Density") (path /5C16C03C/5CDF0F59) (attr smd) (fp_text reference D16 (at 0 2.001 270) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BAT165 (at 0 -1.976 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.5 0.75) (end -1.375 0.75) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.85 0.65) (end 0.85 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.65) (end 0.85 -0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 -0.65) (end -0.5 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -0.65) (end -0.3 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.1 -0.65) (end -0.1 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.625) (end 0.85 -0.625) (layer B.Fab) (width 0.1)) (fp_line (start 0.85 -0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.75 -0.625) (end -0.75 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.625) (end -0.65 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.55 -0.625) (end -0.55 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.45 -0.625) (end -0.45 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.35 -0.625) (end -0.35 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.25 -0.625) (end -0.25 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.15 -0.625) (end -0.15 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -2 -0.95) (end 2 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 2 -0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 -0.95) (end -2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 1.3 0 270) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 670 "Net-(C360-Pad1)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -1.3 0 270) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (model "${CERN}/SOD2512X110N(SOD-323).stp" (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOD2512X110N" locked (layer B.Cu) (tedit 5CACA40A) (tstamp 5C70AAFA) (at 148.5138 167.6146 270) (descr "Small Outline Diode Flat Lead (SOD-323), 1.70mm W X 1.25mm L X 1.10mm H body, IPC Medium Density") (path /5BCEDA39/5CE5918E) (attr smd) (fp_text reference D3 (at 0 2.001 270) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BAT165 (at 0 -1.976 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.5 0.75) (end -1.375 0.75) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.85 0.65) (end 0.85 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.65) (end 0.85 -0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 -0.65) (end -0.5 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -0.65) (end -0.3 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.1 -0.65) (end -0.1 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.625) (end 0.85 -0.625) (layer B.Fab) (width 0.1)) (fp_line (start 0.85 -0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.75 -0.625) (end -0.75 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.625) (end -0.65 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.55 -0.625) (end -0.55 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.45 -0.625) (end -0.45 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.35 -0.625) (end -0.35 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.25 -0.625) (end -0.25 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.15 -0.625) (end -0.15 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -2 -0.95) (end 2 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 2 -0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 -0.95) (end -2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 1.3 0 270) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 107 /LPC_RST) (solder_mask_margin 0.102)) (pad 1 smd rect (at -1.3 0 270) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 108 /MMC/ISP_RSTn) (solder_mask_margin 0.102)) (model "${CERN}/SOD2512X110N(SOD-323).stp" (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOD2512X110N" (layer B.Cu) (tedit 5CACA40A) (tstamp 5C769946) (at 170.5356 167.4749 180) (descr "Small Outline Diode Flat Lead (SOD-323), 1.70mm W X 1.25mm L X 1.10mm H body, IPC Medium Density") (path /5CA40231/5D1A25F8) (attr smd) (fp_text reference D14 (at 0 2.001 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BAT165 (at 0 -1.976 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.5 0.75) (end -1.375 0.75) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.85 0.65) (end 0.85 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.65) (end 0.85 -0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 -0.65) (end -0.5 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -0.65) (end -0.3 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.1 -0.65) (end -0.1 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.625) (end 0.85 -0.625) (layer B.Fab) (width 0.1)) (fp_line (start 0.85 -0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.75 -0.625) (end -0.75 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.625) (end -0.65 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.55 -0.625) (end -0.55 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.45 -0.625) (end -0.45 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.35 -0.625) (end -0.35 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.25 -0.625) (end -0.25 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.15 -0.625) (end -0.15 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -2 -0.95) (end 2 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 2 -0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 -0.95) (end -2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 1.3 0 180) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 456 "Net-(D14-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -1.3 0 180) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 56 /EN_CON_JTAG) (solder_mask_margin 0.102)) (model "${CERN}/SOD2512X110N(SOD-323).stp" (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOD2512X110N" (layer B.Cu) (tedit 5CACA40A) (tstamp 5C769965) (at 219.9767 85.4075 90) (descr "Small Outline Diode Flat Lead (SOD-323), 1.70mm W X 1.25mm L X 1.10mm H body, IPC Medium Density") (path /5CA40231/5D0E1E9C) (attr smd) (fp_text reference D15 (at 0 2.001 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BAT165 (at 0 -1.976 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.5 0.75) (end -1.375 0.75) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.85 0.65) (end 0.85 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.65) (end 0.85 -0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 -0.65) (end -0.5 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -0.65) (end -0.3 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.1 -0.65) (end -0.1 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.625) (end 0.85 -0.625) (layer B.Fab) (width 0.1)) (fp_line (start 0.85 -0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.75 -0.625) (end -0.75 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.625) (end -0.65 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.55 -0.625) (end -0.55 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.45 -0.625) (end -0.45 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.35 -0.625) (end -0.35 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.25 -0.625) (end -0.25 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.15 -0.625) (end -0.15 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -2 -0.95) (end 2 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 2 -0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 -0.95) (end -2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 1.3 0 90) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -1.3 0 90) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 56 /EN_CON_JTAG) (solder_mask_margin 0.102)) (model "${CERN}/SOD2512X110N(SOD-323).stp" (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOD2512X110N" (layer B.Cu) (tedit 5CACA40A) (tstamp 5C7696D0) (at 228.219 187.3885 90) (descr "Small Outline Diode Flat Lead (SOD-323), 1.70mm W X 1.25mm L X 1.10mm H body, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D698D73) (attr smd) (fp_text reference D2 (at 0 2.001 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BAT165 (at 0 -1.976 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.5 0.75) (end -1.375 0.75) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.85 0.65) (end 0.85 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.65) (end 0.85 -0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 -0.65) (end -0.5 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -0.65) (end -0.3 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.1 -0.65) (end -0.1 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.625) (end 0.85 -0.625) (layer B.Fab) (width 0.1)) (fp_line (start 0.85 -0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.75 -0.625) (end -0.75 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.625) (end -0.65 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.55 -0.625) (end -0.55 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.45 -0.625) (end -0.45 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.35 -0.625) (end -0.35 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.25 -0.625) (end -0.25 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.15 -0.625) (end -0.15 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -2 -0.95) (end 2 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 2 -0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 -0.95) (end -2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 1.3 0 90) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 455 "Net-(D2-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -1.3 0 90) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 109 /MMC/OVER_TEMP) (solder_mask_margin 0.102)) (model "${CERN}/SOD2512X110N(SOD-323).stp" (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOD2512X110N" (layer B.Cu) (tedit 5CACA40A) (tstamp 5C6A1A1F) (at 243.967 192.4812) (descr "Small Outline Diode Flat Lead (SOD-323), 1.70mm W X 1.25mm L X 1.10mm H body, IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D6B7691) (attr smd) (fp_text reference D5 (at 0 2.001) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BAT165 (at 0 -1.976) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.5 0.75) (end -1.375 0.75) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.85 0.65) (end 0.85 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.65) (end 0.85 -0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 -0.65) (end -0.5 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -0.65) (end -0.3 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.1 -0.65) (end -0.1 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.625) (end 0.85 -0.625) (layer B.Fab) (width 0.1)) (fp_line (start 0.85 -0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.75 -0.625) (end -0.75 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.625) (end -0.65 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.55 -0.625) (end -0.55 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.45 -0.625) (end -0.45 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.35 -0.625) (end -0.35 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.25 -0.625) (end -0.25 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.15 -0.625) (end -0.15 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -2 -0.95) (end 2 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 2 -0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 -0.95) (end -2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 1.3 0) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 455 "Net-(D2-Pad2)") (solder_mask_margin 0.102)) (pad 1 smd rect (at -1.3 0) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (model "${CERN}/SOD2512X110N(SOD-323).stp" (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOD2512X110N" (layer B.Cu) (tedit 5CACA40A) (tstamp 5C6A1AE2) (at 276.4282 140.2842 180) (descr "Small Outline Diode Flat Lead (SOD-323), 1.70mm W X 1.25mm L X 1.10mm H body, IPC Medium Density") (path /5C16BF8E/5D6FF8E5) (attr smd) (fp_text reference D9 (at 0 2.001 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value BAT165 (at 0 -1.976 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.5 0.75) (end -1.375 0.75) (layer B.SilkS) (width 0.25)) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.85 0.65) (end 0.85 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.65) (end 0.85 -0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.5 -0.65) (end -0.5 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.3 -0.65) (end -0.3 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.1 -0.65) (end -0.1 0.65) (layer B.SilkS) (width 0.2)) (fp_line (start -0.85 -0.625) (end 0.85 -0.625) (layer B.Fab) (width 0.1)) (fp_line (start 0.85 -0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 0.625) (end 0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.85 -0.625) (end -0.85 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.75 -0.625) (end -0.75 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.65 -0.625) (end -0.65 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.55 -0.625) (end -0.55 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.45 -0.625) (end -0.45 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.35 -0.625) (end -0.35 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.25 -0.625) (end -0.25 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -0.15 -0.625) (end -0.15 0.625) (layer B.Fab) (width 0.1)) (fp_line (start -2 -0.95) (end 2 -0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 2 -0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 0.95) (end 2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start -2 -0.95) (end -2 0.95) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 1.3 0 180) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -1.3 0 180) (size 0.9 0.5) (layers B.Cu B.Paste B.Mask) (net 693 "Net-(C357-Pad2)") (solder_mask_margin 0.102)) (model "${CERN}/SOD2512X110N(SOD-323).stp" (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:QFN50P700X700X80-45N-S520" (layer F.Cu) (tedit 5CACA1FF) (tstamp 5CAD829A) (at 244.729 186.24042 90) (descr "QFN,0.50mm Pitch, Square; 44 Pin, 7.00mm L X 7.00mm W X 0.80mm H Body (W/Thermal Tab 5.2mm X 5.2mm), IPC Medium Density") (path /5C16BF8E/5DB9B7E6/5D32B439) (attr smd) (fp_text reference U35 (at 5.01142 -3.6322) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value XRP7724ILB-F (at 0 5.176 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -4.45 -2.5) (end -4.325 -2.5) (layer F.SilkS) (width 0.25)) (fp_circle (center -2.5 -2.5) (end -2 -2.5) (layer F.Fab) (width 0.1)) (fp_circle (center 0 0) (end 0.35 0) (layer F.Fab) (width 0.05)) (fp_line (start 3 3.5) (end 3.5 3.5) (layer F.SilkS) (width 0.2)) (fp_line (start 3.5 3.5) (end 3.5 3) (layer F.SilkS) (width 0.2)) (fp_line (start -3.5 3.5) (end -3 3.5) (layer F.SilkS) (width 0.2)) (fp_line (start -3.5 3.5) (end -3.5 3) (layer F.SilkS) (width 0.2)) (fp_line (start 3 -3.5) (end 3.5 -3.5) (layer F.SilkS) (width 0.2)) (fp_line (start 3.5 -3) (end 3.5 -3.5) (layer F.SilkS) (width 0.2)) (fp_line (start -3.1 -3.5) (end -3 -3.5) (layer F.SilkS) (width 0.2)) (fp_line (start -3.5 -3.1) (end -3.1 -3.5) (layer F.SilkS) (width 0.2)) (fp_line (start -3.5 -3) (end -3.5 -3.1) (layer F.SilkS) (width 0.2)) (fp_line (start -3.5 3.5) (end 3.5 3.5) (layer F.Fab) (width 0.1)) (fp_line (start 3.5 3.5) (end 3.5 -3.5) (layer F.Fab) (width 0.1)) (fp_line (start -3.5 -3.5) (end 3.5 -3.5) (layer F.Fab) (width 0.1)) (fp_line (start -3.5 3.5) (end -3.5 -3.5) (layer F.Fab) (width 0.1)) (fp_line (start -0.5 0) (end 0.5 0) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.5) (end 0 -0.5) (layer F.Fab) (width 0.05)) (fp_line (start -4.15 4.15) (end 4.15 4.15) (layer F.CrtYd) (width 0.05)) (fp_line (start 4.15 4.15) (end 4.15 -4.15) (layer F.CrtYd) (width 0.05)) (fp_line (start -4.15 -4.15) (end 4.15 -4.15) (layer F.CrtYd) (width 0.05)) (fp_line (start -4.15 4.15) (end -4.15 -4.15) (layer F.CrtYd) (width 0.05)) (pad 45 smd rect (at 0 0 90) (size 5.2 5.2) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd roundrect (at -3.35 -2.5 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1092 "Net-(U35-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd roundrect (at -3.35 -2 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd roundrect (at -3.35 -1.5 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 36 "Net-(C138-Pad2)") (solder_mask_margin 0.102)) (pad 4 smd roundrect (at -3.35 -1 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 30 "Net-(C127-Pad1)") (solder_mask_margin 0.102)) (pad 5 smd roundrect (at -3.35 -0.5 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 45 /Power/Power_SW/XR77129ILB_F_VOUT1) (solder_mask_margin 0.102)) (pad 6 smd roundrect (at -3.35 0 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 46 /Power/Power_SW/XR77129ILB_F_VOUT2) (solder_mask_margin 0.102)) (pad 7 smd roundrect (at -3.35 0.5 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 47 /Power/Power_SW/XR77129ILB_F_VOUT3) (solder_mask_margin 0.102)) (pad 8 smd roundrect (at -3.35 1 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 48 /Power/Power_SW/XR77129ILB_F_VOUT4) (solder_mask_margin 0.102)) (pad 9 smd roundrect (at -3.35 1.5 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 420 /FPGA/FPGA_XR_GPIO_0) (solder_mask_margin 0.102)) (pad 10 smd roundrect (at -3.35 2 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1093 "Net-(U35-Pad10)") (solder_mask_margin 0.102)) (pad 11 smd roundrect (at -3.35 2.5 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 173 /MMC/I2C_PM_SDA) (solder_mask_margin 0.102)) (pad 12 smd roundrect (at -2.5 3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 174 /MMC/I2C_PM_SCL) (solder_mask_margin 0.102)) (pad 13 smd roundrect (at -2 3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 343 /Power/Power_SW/EN_1V8) (solder_mask_margin 0.102)) (pad 14 smd roundrect (at -1.5 3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 339 /Power/Power_SW/EN_1V2) (solder_mask_margin 0.102)) (pad 15 smd roundrect (at -1 3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1094 "Net-(U35-Pad15)") (solder_mask_margin 0.102)) (pad 16 smd roundrect (at -0.5 3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 30 "Net-(C127-Pad1)") (solder_mask_margin 0.102)) (pad 17 smd roundrect (at 0 3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 18 smd roundrect (at 0.5 3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 44 /Power/Power_SW/PSS_XRP_BST4) (solder_mask_margin 0.102)) (pad 19 smd roundrect (at 1 3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 242 /Power/Power_SW/PSS_XRP_GH4) (solder_mask_margin 0.102)) (pad 20 smd roundrect (at 1.5 3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 43 /Power/Power_SW/PSS_XRP_LX4) (solder_mask_margin 0.102)) (pad 21 smd roundrect (at 2 3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 243 /Power/Power_SW/PSS_XRP_GL4) (solder_mask_margin 0.102)) (pad 22 smd roundrect (at 2.5 3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 350 "Net-(R194-Pad2)") (solder_mask_margin 0.102)) (pad 23 smd roundrect (at 3.35 2.5 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 692 "Net-(C144-Pad1)") (solder_mask_margin 0.102)) (pad 24 smd roundrect (at 3.35 2 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 42 /Power/Power_SW/PSS_XRP_BST3) (solder_mask_margin 0.102)) (pad 25 smd roundrect (at 3.35 1.5 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 240 /Power/Power_SW/PSS_XRP_GH3) (solder_mask_margin 0.102)) (pad 26 smd roundrect (at 3.35 1 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 41 /Power/Power_SW/PSS_XRP_LX3) (solder_mask_margin 0.102)) (pad 27 smd roundrect (at 3.35 0.5 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 241 /Power/Power_SW/PSS_XRP_GL3) (solder_mask_margin 0.102)) (pad 28 smd roundrect (at 3.35 0 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 348 "Net-(R192-Pad2)") (solder_mask_margin 0.102)) (pad 29 smd roundrect (at 3.35 -0.5 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 40 /Power/Power_SW/PSS_XRP_BST2) (solder_mask_margin 0.102)) (pad 30 smd roundrect (at 3.35 -1 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 238 /Power/Power_SW/PSS_XRP_GH2) (solder_mask_margin 0.102)) (pad 31 smd roundrect (at 3.35 -1.5 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 39 /Power/Power_SW/PSS_XRP_LX2) (solder_mask_margin 0.102)) (pad 32 smd roundrect (at 3.35 -2 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 239 /Power/Power_SW/PSS_XRP_GL2) (solder_mask_margin 0.102)) (pad 33 smd roundrect (at 3.35 -2.5 90) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 347 "Net-(R191-Pad2)") (solder_mask_margin 0.102)) (pad 34 smd roundrect (at 2.5 -3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 692 "Net-(C144-Pad1)") (solder_mask_margin 0.102)) (pad 35 smd roundrect (at 2 -3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 38 /Power/Power_SW/PSS_XRP_BST1) (solder_mask_margin 0.102)) (pad 36 smd roundrect (at 1.5 -3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 236 /Power/Power_SW/PSS_XRP_GH1) (solder_mask_margin 0.102)) (pad 37 smd roundrect (at 1 -3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 37 /Power/Power_SW/PSS_XRP_LX1) (solder_mask_margin 0.102)) (pad 38 smd roundrect (at 0.5 -3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 237 /Power/Power_SW/PSS_XRP_GL1) (solder_mask_margin 0.102)) (pad 39 smd roundrect (at 0 -3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 346 "Net-(R190-Pad2)") (solder_mask_margin 0.102)) (pad 40 smd roundrect (at -0.5 -3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 455 "Net-(D2-Pad2)") (solder_mask_margin 0.102)) (pad 41 smd roundrect (at -1 -3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 2 +12V) (solder_mask_margin 0.102)) (pad 42 smd roundrect (at -1.5 -3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 43 smd roundrect (at -2 -3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 349 "Net-(R193-Pad2)") (solder_mask_margin 0.102)) (pad 44 smd roundrect (at -2.5 -3.35 180) (size 1.05 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5) (net 692 "Net-(C144-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/QFN50P700X700X80-45N-S520.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6BFFB7) (at 163.703 83.566 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5ABFCC) (attr smd) (fp_text reference R45 (at 0 1.526 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 428 /FMC_1/I2C_FMC1_SCL) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C0562) (at 163.703 84.582 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5B01D9) (attr smd) (fp_text reference R46 (at 0 1.526 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 427 /FMC_1/I2C_FMC1_SDA) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C0B0D) (at 163.703 81.534 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5B20E3) (attr smd) (fp_text reference R47 (at 0 1.526 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 424 /FMC_2/I2C_FMC2_SCL) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C10B8) (at 163.703 82.55 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5B3FEA) (attr smd) (fp_text reference R48 (at 0 1.526 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 423 /FMC_2/I2C_FMC2_SDA) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C1663) (at 163.703 79.502 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5B5EF0) (attr smd) (fp_text reference R49 (at 0 1.526 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 425 /I2C_MUX/I2C_SFP1_SCL) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C1C0E) (at 163.703 80.518 180) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5B7DF9) (attr smd) (fp_text reference R50 (at 0 1.526 180) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 90) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 426 /I2C_MUX/I2C_SFP1_SDA) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C21B9) (at 168.021 77.47 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5B9D07) (attr smd) (fp_text reference R51 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 433 /I2C_MUX/I2C_SFP4_SCL) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C2764) (at 167.005 77.47 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5BBC14) (attr smd) (fp_text reference R52 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 434 /I2C_MUX/I2C_SFP4_SDA) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C2D0F) (at 170.053 77.47 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5BDB24) (attr smd) (fp_text reference R53 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 431 /I2C_MUX/I2C_SFP3_SCL) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C32BA) (at 169.037 77.47 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5BFA31) (attr smd) (fp_text reference R54 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 432 /I2C_MUX/I2C_SFP3_SDA) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C3865) (at 174.117 79.248) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5C193D) (attr smd) (fp_text reference R55 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 429 /I2C_MUX/I2C_SFP2_SCL) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C3E10) (at 171.069 77.47 90) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5C384C) (attr smd) (fp_text reference R56 (at 0 1.526 90) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 430 /I2C_MUX/I2C_SFP2_SDA) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C43BB) (at 174.117 81.28) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5C575C) (attr smd) (fp_text reference R57 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 293 /FPGA/I2C_APP_SCL) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6C9353) (at 174.117 80.264) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5C766B) (attr smd) (fp_text reference R75 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 655 +3V3P) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 287 /FPGA/I2C_APP_SDA) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6CC0AB) (at 174.117 83.312) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5C957B) (attr smd) (fp_text reference R83 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 435 /FPGA/I2C_HDMI_SCL) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Resistors SMD:RESC1005X40N" (layer B.Cu) (tedit 5CA4E9B6) (tstamp 5C6CEE03) (at 174.117 82.296) (descr "Chip Resistor, EIA 0402, Metric 1005, Body 1.0x0.5mm, IPC Medium Density") (path /5BCEDA3D/5C5CB48E) (attr smd) (fp_text reference R91 (at 0 1.526) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R0402_22K_1%_0.0625W_100PPM (at 0 -1.526) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 0.35 0) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer B.Fab) (width 0.1)) (fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 0.25) (end 0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.5 -0.25) (end -0.5 0.25) (layer B.Fab) (width 0.1)) (fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 0.46) (end 0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.91 -0.46) (end -0.91 0.46) (layer B.CrtYd) (width 0.05)) (fp_line (start 0 -0.5) (end 0 0.5) (layer B.Fab) (width 0.05)) (fp_line (start -0.5 0) (end 0.5 0) (layer B.Fab) (width 0.05)) (pad 2 smd rect (at 0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.47 0 270) (size 0.62 0.58) (layers B.Cu B.Paste B.Mask) (net 436 /FPGA/I2C_HDMI_SDA) (solder_mask_margin 0.102)) (model RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/RESC1005X40N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module 1888247-1:TE_1888247-1 (layer F.Cu) (tedit 0) (tstamp 5C83F762) (at 261.8232 82.296 90) (path /5BABAC65/5C831575) (attr smd) (fp_text reference J3 (at 5.3848 6.35 180) (layer F.SilkS) (effects (font (size 1.00069 1.00069) (thickness 0.15))) ) (fp_text value TYCO_1888247-1 (at -0.381 6.56645 90) (layer F.SilkS) hide (effects (font (size 1.00022 1.00022) (thickness 0.05))) ) (fp_poly (pts (xy -5.75601 -3.94) (xy -4.39 -3.94) (xy -4.39 4.34454) (xy -5.75601 4.34454)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39337 -2.88) (xy -3.85 -2.88) (xy -3.85 2.88221) (xy -4.39337 2.88221)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39144 2.88) (xy -3.99 2.88) (xy -3.99 4.34142) (xy -4.39144 4.34142)) (layer Dwgs.User) (width 0)) (fp_line (start -5.5 -3.7) (end 5.5 -3.7) (layer Eco2.User) (width 0.127)) (fp_line (start 5.5 -3.7) (end 5.5 3.7) (layer Eco2.User) (width 0.127)) (fp_line (start 5.5 3.7) (end -5.5 3.7) (layer Eco2.User) (width 0.127)) (fp_line (start -5.5 3.7) (end -5.5 -3.7) (layer Eco2.User) (width 0.127)) (fp_line (start -4.4 -3.7) (end -5.5 -3.7) (layer F.SilkS) (width 0.127)) (fp_line (start -5.5 -3.7) (end -5.5 -1) (layer F.SilkS) (width 0.127)) (fp_line (start 5.5 -3.7) (end 5.5 -1) (layer F.SilkS) (width 0.127)) (fp_line (start 4.6 3.7) (end 5.5 3.7) (layer F.SilkS) (width 0.127)) (fp_line (start 5.5 3.7) (end 5.5 1) (layer F.SilkS) (width 0.127)) (fp_line (start -4 3.7) (end -5.5 3.7) (layer F.SilkS) (width 0.127)) (fp_line (start -5.5 3.7) (end -5.5 1) (layer F.SilkS) (width 0.127)) (fp_circle (center -3.4 5.527) (end -3.3 5.527) (layer F.SilkS) (width 0.2)) (fp_line (start -6 -5.35) (end 6 -5.35) (layer Eco1.User) (width 0.05)) (fp_line (start 6 -5.35) (end 6 5.35) (layer Eco1.User) (width 0.05)) (fp_line (start 6 5.35) (end -6 5.35) (layer Eco1.User) (width 0.05)) (fp_line (start -6 5.35) (end -6 -5.35) (layer Eco1.User) (width 0.05)) (fp_line (start 4 -3.7) (end 5.5 -3.7) (layer F.SilkS) (width 0.127)) (fp_poly (pts (xy 3.99659 -3.94) (xy 4.39 -3.94) (xy 4.39 -2.88476) (xy 3.99659 -2.88476)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 4.39185 -3.94) (xy 5.75 -3.94) (xy 5.75 4.34183) (xy 4.39185 4.34183)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 3.85755 -2.88) (xy 4.39 -2.88) (xy 4.39 2.88565) (xy 3.85755 2.88565)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -5.75869 -3.94) (xy -4.39 -3.94) (xy -4.39 4.34656) (xy -5.75869 4.34656)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39482 -2.88) (xy -3.85 -2.88) (xy -3.85 2.88316) (xy -4.39482 2.88316)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39176 2.88) (xy -3.99 2.88) (xy -3.99 4.34174) (xy -4.39176 4.34174)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 3.99757 -3.94) (xy 4.39 -3.94) (xy 4.39 -2.88546) (xy 3.99757 -2.88546)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 4.39791 -3.94) (xy 5.75 -3.94) (xy 5.75 4.34782) (xy 4.39791 4.34782)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 3.85036 -2.88) (xy 4.39 -2.88) (xy 4.39 2.88027) (xy 3.85036 2.88027)) (layer Dwgs.User) (width 0)) (pad Hole np_thru_hole circle (at 4.8 0 90) (size 1.55 1.55) (drill 1.55) (layers *.Cu *.Mask F.SilkS)) (pad Hole np_thru_hole circle (at -4.8 0 90) (size 1.55 1.55) (drill 1.55) (layers *.Cu *.Mask F.SilkS)) (pad 20 smd rect (at -3.8 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 19 smd rect (at -3 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 76 /FPGA/SFP_1_TX_N)) (pad 18 smd rect (at -2.2 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 74 /FPGA/SFP_1_TX_P)) (pad 17 smd rect (at -1.4 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 16 smd rect (at -0.6 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 8 "Net-(C33-Pad2)")) (pad 15 smd rect (at 0.2 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 7 "Net-(C30-Pad2)")) (pad 14 smd rect (at 1 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 13 smd rect (at 1.8 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 87 /FPGA/SFP_1_RX_P)) (pad 12 smd rect (at 2.6 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 88 /FPGA/SFP_1_RX_N)) (pad 11 smd rect (at 3.4 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 10 smd rect (at 3.8 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 9 smd rect (at 3 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 138 "Net-(J3-Pad9)")) (pad 8 smd rect (at 2.2 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 139 /FPGA/SFP1_LOS)) (pad 7 smd rect (at 1.4 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 140 /FPGA/SFP1_RS)) (pad 6 smd rect (at 0.6 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 141 /FPGA/SFP1_DEF0)) (pad 5 smd rect (at -0.2 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 425 /I2C_MUX/I2C_SFP1_SCL)) (pad 4 smd rect (at -1 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 426 /I2C_MUX/I2C_SFP1_SDA)) (pad 3 smd rect (at -1.8 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 142 /FPGA/SFP1_TX_DIS)) (pad 2 smd rect (at -2.6 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 143 /FPGA/SFP1_TX_FAULT)) (pad 1 smd rect (at -3.4 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) ) (module 1888247-1:TE_1888247-1 (layer F.Cu) (tedit 0) (tstamp 5C841351) (at 261.8232 110.7948 90) (path /5CC6DBF7/5C8B7FD0) (attr smd) (fp_text reference J7 (at 5.0546 6.3246 180) (layer F.SilkS) (effects (font (size 1.00069 1.00069) (thickness 0.15))) ) (fp_text value TYCO_1888247-1 (at -3.22571 6.56645 90) (layer F.SilkS) hide (effects (font (size 1.00022 1.00022) (thickness 0.05))) ) (fp_poly (pts (xy -5.75601 -3.94) (xy -4.39 -3.94) (xy -4.39 4.34454) (xy -5.75601 4.34454)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39337 -2.88) (xy -3.85 -2.88) (xy -3.85 2.88221) (xy -4.39337 2.88221)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39144 2.88) (xy -3.99 2.88) (xy -3.99 4.34142) (xy -4.39144 4.34142)) (layer Dwgs.User) (width 0)) (fp_line (start -5.5 -3.7) (end 5.5 -3.7) (layer Eco2.User) (width 0.127)) (fp_line (start 5.5 -3.7) (end 5.5 3.7) (layer Eco2.User) (width 0.127)) (fp_line (start 5.5 3.7) (end -5.5 3.7) (layer Eco2.User) (width 0.127)) (fp_line (start -5.5 3.7) (end -5.5 -3.7) (layer Eco2.User) (width 0.127)) (fp_line (start -4.4 -3.7) (end -5.5 -3.7) (layer F.SilkS) (width 0.127)) (fp_line (start -5.5 -3.7) (end -5.5 -1) (layer F.SilkS) (width 0.127)) (fp_line (start 5.5 -3.7) (end 5.5 -1) (layer F.SilkS) (width 0.127)) (fp_line (start 4.6 3.7) (end 5.5 3.7) (layer F.SilkS) (width 0.127)) (fp_line (start 5.5 3.7) (end 5.5 1) (layer F.SilkS) (width 0.127)) (fp_line (start -4 3.7) (end -5.5 3.7) (layer F.SilkS) (width 0.127)) (fp_line (start -5.5 3.7) (end -5.5 1) (layer F.SilkS) (width 0.127)) (fp_circle (center -3.4 5.527) (end -3.3 5.527) (layer F.SilkS) (width 0.2)) (fp_line (start -6 -5.35) (end 6 -5.35) (layer Eco1.User) (width 0.05)) (fp_line (start 6 -5.35) (end 6 5.35) (layer Eco1.User) (width 0.05)) (fp_line (start 6 5.35) (end -6 5.35) (layer Eco1.User) (width 0.05)) (fp_line (start -6 5.35) (end -6 -5.35) (layer Eco1.User) (width 0.05)) (fp_line (start 4 -3.7) (end 5.5 -3.7) (layer F.SilkS) (width 0.127)) (fp_poly (pts (xy 3.99659 -3.94) (xy 4.39 -3.94) (xy 4.39 -2.88476) (xy 3.99659 -2.88476)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 4.39185 -3.94) (xy 5.75 -3.94) (xy 5.75 4.34183) (xy 4.39185 4.34183)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 3.85755 -2.88) (xy 4.39 -2.88) (xy 4.39 2.88565) (xy 3.85755 2.88565)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -5.75869 -3.94) (xy -4.39 -3.94) (xy -4.39 4.34656) (xy -5.75869 4.34656)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39482 -2.88) (xy -3.85 -2.88) (xy -3.85 2.88316) (xy -4.39482 2.88316)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39176 2.88) (xy -3.99 2.88) (xy -3.99 4.34174) (xy -4.39176 4.34174)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 3.99757 -3.94) (xy 4.39 -3.94) (xy 4.39 -2.88546) (xy 3.99757 -2.88546)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 4.39791 -3.94) (xy 5.75 -3.94) (xy 5.75 4.34782) (xy 4.39791 4.34782)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 3.85036 -2.88) (xy 4.39 -2.88) (xy 4.39 2.88027) (xy 3.85036 2.88027)) (layer Dwgs.User) (width 0)) (pad Hole np_thru_hole circle (at 4.8 0 90) (size 1.55 1.55) (drill 1.55) (layers *.Cu *.Mask F.SilkS)) (pad Hole np_thru_hole circle (at -4.8 0 90) (size 1.55 1.55) (drill 1.55) (layers *.Cu *.Mask F.SilkS)) (pad 20 smd rect (at -3.8 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 19 smd rect (at -3 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 82 /FPGA/SFP_3_TX_N)) (pad 18 smd rect (at -2.2 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 81 /FPGA/SFP_3_TX_P)) (pad 17 smd rect (at -1.4 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 16 smd rect (at -0.6 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 22 "Net-(C87-Pad2)")) (pad 15 smd rect (at 0.2 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 21 "Net-(C84-Pad2)")) (pad 14 smd rect (at 1 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 13 smd rect (at 1.8 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 94 /FPGA/SFP_3_RX_P)) (pad 12 smd rect (at 2.6 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 95 /FPGA/SFP_3_RX_N)) (pad 11 smd rect (at 3.4 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 10 smd rect (at 3.8 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 9 smd rect (at 3 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 161 "Net-(J7-Pad9)")) (pad 8 smd rect (at 2.2 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 162 /FPGA/SFP3_LOS)) (pad 7 smd rect (at 1.4 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 163 /FPGA/SFP3_RS)) (pad 6 smd rect (at 0.6 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 164 /FPGA/SFP3_DEF0)) (pad 5 smd rect (at -0.2 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 431 /I2C_MUX/I2C_SFP3_SCL)) (pad 4 smd rect (at -1 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 432 /I2C_MUX/I2C_SFP3_SDA)) (pad 3 smd rect (at -1.8 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 165 /FPGA/SFP3_TX_DIS)) (pad 2 smd rect (at -2.6 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 166 /FPGA/SFP3_TX_FAULT)) (pad 1 smd rect (at -3.4 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) ) (module 1888247-1:TE_1888247-1 (layer F.Cu) (tedit 0) (tstamp 5C841388) (at 261.8232 125.0696 90) (path /5CC8AFE1/5C88E13D) (attr smd) (fp_text reference J8 (at 5.3848 6.2738 180) (layer F.SilkS) (effects (font (size 1.00069 1.00069) (thickness 0.15))) ) (fp_text value TYCO_1888247-1 (at -3.22571 6.56645 90) (layer F.SilkS) hide (effects (font (size 1.00022 1.00022) (thickness 0.05))) ) (fp_poly (pts (xy -5.75601 -3.94) (xy -4.39 -3.94) (xy -4.39 4.34454) (xy -5.75601 4.34454)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39337 -2.88) (xy -3.85 -2.88) (xy -3.85 2.88221) (xy -4.39337 2.88221)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39144 2.88) (xy -3.99 2.88) (xy -3.99 4.34142) (xy -4.39144 4.34142)) (layer Dwgs.User) (width 0)) (fp_line (start -5.5 -3.7) (end 5.5 -3.7) (layer Eco2.User) (width 0.127)) (fp_line (start 5.5 -3.7) (end 5.5 3.7) (layer Eco2.User) (width 0.127)) (fp_line (start 5.5 3.7) (end -5.5 3.7) (layer Eco2.User) (width 0.127)) (fp_line (start -5.5 3.7) (end -5.5 -3.7) (layer Eco2.User) (width 0.127)) (fp_line (start -4.4 -3.7) (end -5.5 -3.7) (layer F.SilkS) (width 0.127)) (fp_line (start -5.5 -3.7) (end -5.5 -1) (layer F.SilkS) (width 0.127)) (fp_line (start 5.5 -3.7) (end 5.5 -1) (layer F.SilkS) (width 0.127)) (fp_line (start 4.6 3.7) (end 5.5 3.7) (layer F.SilkS) (width 0.127)) (fp_line (start 5.5 3.7) (end 5.5 1) (layer F.SilkS) (width 0.127)) (fp_line (start -4 3.7) (end -5.5 3.7) (layer F.SilkS) (width 0.127)) (fp_line (start -5.5 3.7) (end -5.5 1) (layer F.SilkS) (width 0.127)) (fp_circle (center -3.4 5.527) (end -3.3 5.527) (layer F.SilkS) (width 0.2)) (fp_line (start -6 -5.35) (end 6 -5.35) (layer Eco1.User) (width 0.05)) (fp_line (start 6 -5.35) (end 6 5.35) (layer Eco1.User) (width 0.05)) (fp_line (start 6 5.35) (end -6 5.35) (layer Eco1.User) (width 0.05)) (fp_line (start -6 5.35) (end -6 -5.35) (layer Eco1.User) (width 0.05)) (fp_line (start 4 -3.7) (end 5.5 -3.7) (layer F.SilkS) (width 0.127)) (fp_poly (pts (xy 3.99659 -3.94) (xy 4.39 -3.94) (xy 4.39 -2.88476) (xy 3.99659 -2.88476)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 4.39185 -3.94) (xy 5.75 -3.94) (xy 5.75 4.34183) (xy 4.39185 4.34183)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 3.85755 -2.88) (xy 4.39 -2.88) (xy 4.39 2.88565) (xy 3.85755 2.88565)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -5.75869 -3.94) (xy -4.39 -3.94) (xy -4.39 4.34656) (xy -5.75869 4.34656)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39482 -2.88) (xy -3.85 -2.88) (xy -3.85 2.88316) (xy -4.39482 2.88316)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39176 2.88) (xy -3.99 2.88) (xy -3.99 4.34174) (xy -4.39176 4.34174)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 3.99757 -3.94) (xy 4.39 -3.94) (xy 4.39 -2.88546) (xy 3.99757 -2.88546)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 4.39791 -3.94) (xy 5.75 -3.94) (xy 5.75 4.34782) (xy 4.39791 4.34782)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 3.85036 -2.88) (xy 4.39 -2.88) (xy 4.39 2.88027) (xy 3.85036 2.88027)) (layer Dwgs.User) (width 0)) (pad Hole np_thru_hole circle (at 4.8 0 90) (size 1.55 1.55) (drill 1.55) (layers *.Cu *.Mask F.SilkS)) (pad Hole np_thru_hole circle (at -4.8 0 90) (size 1.55 1.55) (drill 1.55) (layers *.Cu *.Mask F.SilkS)) (pad 20 smd rect (at -3.8 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 19 smd rect (at -3 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 85 /FPGA/SFP_4_TX_N)) (pad 18 smd rect (at -2.2 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 84 /FPGA/SFP_4_TX_P)) (pad 17 smd rect (at -1.4 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 16 smd rect (at -0.6 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 26 "Net-(C101-Pad1)")) (pad 15 smd rect (at 0.2 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 25 "Net-(C100-Pad1)")) (pad 14 smd rect (at 1 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 13 smd rect (at 1.8 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 97 /FPGA/SFP_4_RX_P)) (pad 12 smd rect (at 2.6 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 99 /FPGA/SFP_4_RX_N)) (pad 11 smd rect (at 3.4 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 10 smd rect (at 3.8 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 9 smd rect (at 3 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 167 "Net-(J8-Pad9)")) (pad 8 smd rect (at 2.2 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 168 /FPGA/SFP4_LOS)) (pad 7 smd rect (at 1.4 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 169 /FPGA/SFP4_RS)) (pad 6 smd rect (at 0.6 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 170 /FPGA/SFP4_DEF0)) (pad 5 smd rect (at -0.2 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 433 /I2C_MUX/I2C_SFP4_SCL)) (pad 4 smd rect (at -1 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 434 /I2C_MUX/I2C_SFP4_SDA)) (pad 3 smd rect (at -1.8 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 171 /FPGA/SFP4_TX_DIS)) (pad 2 smd rect (at -2.6 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 172 /FPGA/SFP4_TX_FAULT)) (pad 1 smd rect (at -3.4 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) ) (module 1888247-1:TE_1888247-1 (layer F.Cu) (tedit 0) (tstamp 5C85CD5F) (at 261.8232 96.5708 90) (path /5CC393D3/5C86C12C) (attr smd) (fp_text reference J6 (at 5.0546 6.1722 180) (layer F.SilkS) (effects (font (size 1.00069 1.00069) (thickness 0.15))) ) (fp_text value TYCO_1888247-1 (at -3.22571 6.56645 90) (layer F.SilkS) hide (effects (font (size 1.00022 1.00022) (thickness 0.05))) ) (fp_poly (pts (xy -5.75601 -3.94) (xy -4.39 -3.94) (xy -4.39 4.34454) (xy -5.75601 4.34454)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39337 -2.88) (xy -3.85 -2.88) (xy -3.85 2.88221) (xy -4.39337 2.88221)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39144 2.88) (xy -3.99 2.88) (xy -3.99 4.34142) (xy -4.39144 4.34142)) (layer Dwgs.User) (width 0)) (fp_line (start -5.5 -3.7) (end 5.5 -3.7) (layer Eco2.User) (width 0.127)) (fp_line (start 5.5 -3.7) (end 5.5 3.7) (layer Eco2.User) (width 0.127)) (fp_line (start 5.5 3.7) (end -5.5 3.7) (layer Eco2.User) (width 0.127)) (fp_line (start -5.5 3.7) (end -5.5 -3.7) (layer Eco2.User) (width 0.127)) (fp_line (start -4.4 -3.7) (end -5.5 -3.7) (layer F.SilkS) (width 0.127)) (fp_line (start -5.5 -3.7) (end -5.5 -1) (layer F.SilkS) (width 0.127)) (fp_line (start 5.5 -3.7) (end 5.5 -1) (layer F.SilkS) (width 0.127)) (fp_line (start 4.6 3.7) (end 5.5 3.7) (layer F.SilkS) (width 0.127)) (fp_line (start 5.5 3.7) (end 5.5 1) (layer F.SilkS) (width 0.127)) (fp_line (start -4 3.7) (end -5.5 3.7) (layer F.SilkS) (width 0.127)) (fp_line (start -5.5 3.7) (end -5.5 1) (layer F.SilkS) (width 0.127)) (fp_circle (center -3.4 5.527) (end -3.3 5.527) (layer F.SilkS) (width 0.2)) (fp_line (start -6 -5.35) (end 6 -5.35) (layer Eco1.User) (width 0.05)) (fp_line (start 6 -5.35) (end 6 5.35) (layer Eco1.User) (width 0.05)) (fp_line (start 6 5.35) (end -6 5.35) (layer Eco1.User) (width 0.05)) (fp_line (start -6 5.35) (end -6 -5.35) (layer Eco1.User) (width 0.05)) (fp_line (start 4 -3.7) (end 5.5 -3.7) (layer F.SilkS) (width 0.127)) (fp_poly (pts (xy 3.99659 -3.94) (xy 4.39 -3.94) (xy 4.39 -2.88476) (xy 3.99659 -2.88476)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 4.39185 -3.94) (xy 5.75 -3.94) (xy 5.75 4.34183) (xy 4.39185 4.34183)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 3.85755 -2.88) (xy 4.39 -2.88) (xy 4.39 2.88565) (xy 3.85755 2.88565)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -5.75869 -3.94) (xy -4.39 -3.94) (xy -4.39 4.34656) (xy -5.75869 4.34656)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39482 -2.88) (xy -3.85 -2.88) (xy -3.85 2.88316) (xy -4.39482 2.88316)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy -4.39176 2.88) (xy -3.99 2.88) (xy -3.99 4.34174) (xy -4.39176 4.34174)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 3.99757 -3.94) (xy 4.39 -3.94) (xy 4.39 -2.88546) (xy 3.99757 -2.88546)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 4.39791 -3.94) (xy 5.75 -3.94) (xy 5.75 4.34782) (xy 4.39791 4.34782)) (layer Dwgs.User) (width 0)) (fp_poly (pts (xy 3.85036 -2.88) (xy 4.39 -2.88) (xy 4.39 2.88027) (xy 3.85036 2.88027)) (layer Dwgs.User) (width 0)) (pad Hole np_thru_hole circle (at 4.8 0 90) (size 1.55 1.55) (drill 1.55) (layers *.Cu *.Mask F.SilkS)) (pad Hole np_thru_hole circle (at -4.8 0 90) (size 1.55 1.55) (drill 1.55) (layers *.Cu *.Mask F.SilkS)) (pad 20 smd rect (at -3.8 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 19 smd rect (at -3 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 79 /FPGA/SFP_2_TX_N)) (pad 18 smd rect (at -2.2 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 77 /FPGA/SFP_2_TX_P)) (pad 17 smd rect (at -1.4 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 16 smd rect (at -0.6 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 20 "Net-(C75-Pad2)")) (pad 15 smd rect (at 0.2 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 19 "Net-(C72-Pad2)")) (pad 14 smd rect (at 1 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 13 smd rect (at 1.8 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 90 /FPGA/SFP_2_RX_P)) (pad 12 smd rect (at 2.6 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 92 /FPGA/SFP_2_RX_N)) (pad 11 smd rect (at 3.4 -4.1 270) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 10 smd rect (at 3.8 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) (pad 9 smd rect (at 3 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 155 "Net-(J6-Pad9)")) (pad 8 smd rect (at 2.2 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 156 /FPGA/SFP2_LOS)) (pad 7 smd rect (at 1.4 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 157 /FPGA/SFP2_RS)) (pad 6 smd rect (at 0.6 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 158 /FPGA/SFP2_DEF0)) (pad 5 smd rect (at -0.2 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 429 /I2C_MUX/I2C_SFP2_SCL)) (pad 4 smd rect (at -1 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 430 /I2C_MUX/I2C_SFP2_SDA)) (pad 3 smd rect (at -1.8 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 159 /FPGA/SFP2_TX_DIS)) (pad 2 smd rect (at -2.6 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 160 /FPGA/SFP2_TX_FAULT)) (pad 1 smd rect (at -3.4 4.1 90) (size 0.5 2) (layers F.Cu F.Paste F.Mask) (net 1 GND)) ) (module Switches:PB_ALPS_SKHHLQA010 (layer F.Cu) (tedit 0) (tstamp 5CD1C51C) (at 128.3208 141.605) (descr "Body 6x6mm, Stem height 8.35mm, Horizontal Pushbutton Switch, ALPS Serie SKHH") (path /5BCEDA39/5DC8E1FA) (fp_text reference SW2 (at -0.8128 -5.969) (layer F.SilkS) (effects (font (size 2 2) (thickness 0.4))) ) (fp_text value SKHHLQA010 (at 0 5.602) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 0 0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.25 2.75) (end -1.25 2.25) (layer Cmts.User) (width 0.1)) (fp_line (start -1.75 2.25) (end -1.25 2.25) (layer Cmts.User) (width 0.1)) (fp_line (start -1.25 2.25) (end -0.75 2.25) (layer Cmts.User) (width 0.1)) (fp_line (start -1.25 2.25) (end -1.25 1.75) (layer Cmts.User) (width 0.1)) (fp_line (start -1.25 -1.75) (end -1.25 -2.25) (layer Cmts.User) (width 0.1)) (fp_line (start -1.75 -2.25) (end -1.25 -2.25) (layer Cmts.User) (width 0.1)) (fp_line (start -1.25 -2.25) (end -0.75 -2.25) (layer Cmts.User) (width 0.1)) (fp_line (start -1.25 -2.25) (end -1.25 -2.75) (layer Cmts.User) (width 0.1)) (fp_line (start 1.25 4) (end 1.25 3.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0.75 3.5) (end 1.25 3.5) (layer Cmts.User) (width 0.1)) (fp_line (start 1.25 3.5) (end 1.75 3.5) (layer Cmts.User) (width 0.1)) (fp_line (start 1.25 3.5) (end 1.25 3) (layer Cmts.User) (width 0.1)) (fp_line (start 1.25 -3) (end 1.25 -3.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0.75 -3.5) (end 1.25 -3.5) (layer Cmts.User) (width 0.1)) (fp_line (start 1.25 -3.5) (end 1.75 -3.5) (layer Cmts.User) (width 0.1)) (fp_line (start 1.25 -3.5) (end 1.25 -4) (layer Cmts.User) (width 0.1)) (fp_line (start -3.4 -3.1) (end -0.07 -3.1) (layer F.Fab) (width 0.1)) (fp_line (start -0.068 -1.9) (end -0.06 1.9) (layer F.Fab) (width 0.1)) (fp_line (start -0.07 -2.6) (end -0.07 -3.1) (layer F.Fab) (width 0.1)) (fp_line (start -0.07 3.1) (end -0.07 2.6) (layer F.Fab) (width 0.1)) (fp_line (start -3.4 3.1) (end -0.07 3.1) (layer F.Fab) (width 0.1)) (fp_line (start 0.23 2.6) (end 0.23 1.9) (layer F.Fab) (width 0.1)) (fp_line (start -1.4 2.6) (end 0.23 2.6) (layer F.Fab) (width 0.1)) (fp_line (start -1.4 2.6) (end -1.396 1.9) (layer F.Fab) (width 0.1)) (fp_line (start -1.396 1.9) (end 0.23 1.9) (layer F.Fab) (width 0.1)) (fp_line (start -1.4 -2.6) (end -1.396 -1.9) (layer F.Fab) (width 0.1)) (fp_line (start -1.396 -1.9) (end 0.23 -1.9) (layer F.Fab) (width 0.1)) (fp_line (start 0.23 -1.9) (end 0.23 -2.6) (layer F.Fab) (width 0.1)) (fp_line (start -1.4 -2.6) (end 0.23 -2.6) (layer F.Fab) (width 0.1)) (fp_line (start -5.9 -1.75) (end -4.12 -1.75) (layer F.Fab) (width 0.1)) (fp_line (start -9.413 -1.513) (end -5.9 -1.75) (layer F.Fab) (width 0.1)) (fp_line (start -9.6 1.313) (end -9.6 -1.313) (layer F.Fab) (width 0.1)) (fp_line (start -9.413 1.513) (end -5.9 1.748) (layer F.Fab) (width 0.1)) (fp_line (start -5.9 1.748) (end -4.12 1.748) (layer F.Fab) (width 0.1)) (fp_line (start -4.12 2.825) (end -3.8 2.825) (layer F.Fab) (width 0.1)) (fp_line (start -4.12 2.825) (end -4.12 1.475) (layer F.Fab) (width 0.1)) (fp_line (start -4.12 1.475) (end -3.8 1.475) (layer F.Fab) (width 0.1)) (fp_line (start -4.12 -1.475) (end -3.8 -1.475) (layer F.Fab) (width 0.1)) (fp_line (start -4.12 -1.475) (end -4.12 -2.825) (layer F.Fab) (width 0.1)) (fp_line (start -4.12 -2.825) (end -3.8 -2.825) (layer F.Fab) (width 0.1)) (fp_line (start 2.8 3.75) (end 2.8 3.35) (layer F.Fab) (width 0.1)) (fp_line (start 2.8 -3.35) (end 2.8 -3.75) (layer F.Fab) (width 0.1)) (fp_line (start -3.3 -3.75) (end 2.8 -3.75) (layer F.Fab) (width 0.1)) (fp_line (start -3.8 3.25) (end -3.8 -3.25) (layer F.Fab) (width 0.1)) (fp_line (start -3.3 3.75) (end 2.8 3.75) (layer F.Fab) (width 0.1)) (fp_line (start -3.3 3.35) (end 2.8 3.35) (layer F.Fab) (width 0.1)) (fp_line (start -3.4 3.25) (end -3.4 -3.25) (layer F.Fab) (width 0.1)) (fp_line (start -3.3 -3.35) (end 2.8 -3.35) (layer F.Fab) (width 0.1)) (fp_line (start 2.592 3.35) (end 2.8 3.35) (layer F.SilkS) (width 0.2)) (fp_line (start -3.3 3.75) (end -0.077 3.75) (layer F.SilkS) (width 0.2)) (fp_line (start 2.577 -3.75) (end 2.8 -3.75) (layer F.SilkS) (width 0.2)) (fp_line (start -0.77 -3.35) (end -0.092 -3.35) (layer F.SilkS) (width 0.2)) (fp_line (start -0.77 3.35) (end -0.092 3.35) (layer F.SilkS) (width 0.2)) (fp_line (start -3.4 3.1) (end -2.097 3.1) (layer F.SilkS) (width 0.2)) (fp_line (start -3.3 -3.35) (end -1.73 -3.35) (layer F.SilkS) (width 0.2)) (fp_line (start -3.4 -3.1) (end -2.097 -3.1) (layer F.SilkS) (width 0.2)) (fp_line (start -0.403 -3.1) (end -0.07 -3.1) (layer F.SilkS) (width 0.2)) (fp_line (start -0.068 -1.9) (end -0.06 1.9) (layer F.SilkS) (width 0.2)) (fp_line (start -0.07 -2.6) (end -0.07 -3.1) (layer F.SilkS) (width 0.2)) (fp_line (start -0.07 3.1) (end -0.07 2.6) (layer F.SilkS) (width 0.2)) (fp_line (start -0.403 3.1) (end -0.07 3.1) (layer F.SilkS) (width 0.2)) (fp_line (start 0.23 2.6) (end 0.23 1.9) (layer F.SilkS) (width 0.2)) (fp_line (start -0.102 2.6) (end 0.23 2.6) (layer F.SilkS) (width 0.2)) (fp_line (start -0.102 1.9) (end 0.23 1.9) (layer F.SilkS) (width 0.2)) (fp_line (start -0.102 -1.9) (end 0.23 -1.9) (layer F.SilkS) (width 0.2)) (fp_line (start 0.23 -1.9) (end 0.23 -2.6) (layer F.SilkS) (width 0.2)) (fp_line (start -0.102 -2.6) (end 0.23 -2.6) (layer F.SilkS) (width 0.2)) (fp_line (start -5.9 -1.75) (end -4.12 -1.75) (layer F.SilkS) (width 0.2)) (fp_line (start -9.413 -1.513) (end -5.9 -1.75) (layer F.SilkS) (width 0.2)) (fp_line (start -9.6 1.313) (end -9.6 -1.313) (layer F.SilkS) (width 0.2)) (fp_line (start -9.413 1.513) (end -5.9 1.748) (layer F.SilkS) (width 0.2)) (fp_line (start -5.9 1.748) (end -4.12 1.748) (layer F.SilkS) (width 0.2)) (fp_line (start -4.12 2.825) (end -3.8 2.825) (layer F.SilkS) (width 0.2)) (fp_line (start -4.12 2.825) (end -4.12 1.475) (layer F.SilkS) (width 0.2)) (fp_line (start -4.12 1.475) (end -3.8 1.475) (layer F.SilkS) (width 0.2)) (fp_line (start -4.12 -1.475) (end -3.8 -1.475) (layer F.SilkS) (width 0.2)) (fp_line (start -4.12 -1.475) (end -4.12 -2.825) (layer F.SilkS) (width 0.2)) (fp_line (start -4.12 -2.825) (end -3.8 -2.825) (layer F.SilkS) (width 0.2)) (fp_line (start 2.8 3.75) (end 2.8 3.35) (layer F.SilkS) (width 0.2)) (fp_line (start 2.8 -3.35) (end 2.8 -3.75) (layer F.SilkS) (width 0.2)) (fp_line (start -3.3 -3.75) (end -0.077 -3.75) (layer F.SilkS) (width 0.2)) (fp_line (start -3.8 3.25) (end -3.8 -3.25) (layer F.SilkS) (width 0.2)) (fp_line (start 2.577 3.75) (end 2.8 3.75) (layer F.SilkS) (width 0.2)) (fp_line (start -3.3 3.35) (end -1.73 3.35) (layer F.SilkS) (width 0.2)) (fp_line (start -3.4 3.25) (end -3.4 -3.25) (layer F.SilkS) (width 0.2)) (fp_line (start 2.592 -3.35) (end 2.8 -3.35) (layer F.SilkS) (width 0.2)) (fp_arc (start -3.3 -3.25) (end -3.3 -3.75) (angle -90) (layer F.SilkS) (width 0.2)) (fp_arc (start -3.3 -3.25) (end -3.3 -3.35) (angle -90) (layer F.SilkS) (width 0.2)) (fp_arc (start -3.3 3.25) (end -3.8 3.25) (angle -90) (layer F.SilkS) (width 0.2)) (fp_arc (start -3.3 3.25) (end -3.4 3.25) (angle -90) (layer F.SilkS) (width 0.2)) (fp_arc (start -9.4 1.313) (end -9.6 1.313) (angle -86) (layer F.SilkS) (width 0.2)) (fp_arc (start -9.4 -1.313) (end -9.413 -1.513) (angle -86) (layer F.SilkS) (width 0.2)) (fp_arc (start -3.3 -3.25) (end -3.3 -3.75) (angle -90) (layer F.Fab) (width 0.1)) (fp_arc (start -3.3 -3.25) (end -3.3 -3.35) (angle -90) (layer F.Fab) (width 0.1)) (fp_arc (start -3.3 3.25) (end -3.8 3.25) (angle -90) (layer F.Fab) (width 0.1)) (fp_arc (start -3.3 3.25) (end -3.4 3.25) (angle -90) (layer F.Fab) (width 0.1)) (fp_arc (start -9.4 1.313) (end -9.6 1.313) (angle -86) (layer F.Fab) (width 0.1)) (fp_arc (start -9.4 -1.313) (end -9.413 -1.513) (angle -86) (layer F.Fab) (width 0.1)) (pad 1 thru_hole circle (at -1.25 2.25) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 2 thru_hole circle (at -1.25 -2.25) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 658 "Net-(R263-Pad2)") (solder_mask_margin 0.102)) (pad 3 thru_hole circle (at 1.25 3.5) (size 2 2) (drill 1.3) (layers *.Cu *.Mask) (solder_mask_margin 0.102)) (pad 4 thru_hole circle (at 1.25 -3.5) (size 2 2) (drill 1.3) (layers *.Cu *.Mask) (solder_mask_margin 0.102)) (model PB_ALPS_SKHHLQA010.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/PB_ALPS_SKHHLQA010.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Connector_USB:USB_Micro-B_Amphenol_10103594-0001LF_Horizontal (layer B.Cu) (tedit 5A1DC0BD) (tstamp 5CD4822B) (at 126.2126 116.0018 90) (descr "Micro USB Type B 10103594-0001LF, http://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10103594.pdf") (tags "USB USB_B USB_micro USB_OTG") (path /5C16C03C/5BEB92E1) (attr smd) (fp_text reference J10 (at 5.7658 1.8034 180) (layer B.SilkS) (effects (font (size 2 2) (thickness 0.4)) (justify mirror)) ) (fp_text value 10103594-0001LF (at -0.025 -4.435 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -4.175 0.065) (end -4.175 1.615) (layer B.SilkS) (width 0.12)) (fp_line (start -4.175 0.065) (end -3.875 0.065) (layer B.SilkS) (width 0.12)) (fp_line (start -3.875 -2.735) (end -3.875 0.065) (layer B.SilkS) (width 0.12)) (fp_line (start 4.125 0.065) (end 4.125 1.615) (layer B.SilkS) (width 0.12)) (fp_line (start 3.825 0.065) (end 4.125 0.065) (layer B.SilkS) (width 0.12)) (fp_line (start 3.825 -2.735) (end 3.825 0.065) (layer B.SilkS) (width 0.12)) (fp_line (start -0.925 3.315) (end -1.325 2.865) (layer B.SilkS) (width 0.12)) (fp_line (start -1.725 3.315) (end -0.925 3.315) (layer B.SilkS) (width 0.12)) (fp_line (start -1.325 2.865) (end -1.725 3.315) (layer B.SilkS) (width 0.12)) (fp_line (start -3.775 0.865) (end -2.975 1.615) (layer B.Fab) (width 0.12)) (fp_line (start 3.725 -3.335) (end -3.775 -3.335) (layer B.Fab) (width 0.12)) (fp_line (start 3.725 1.615) (end 3.725 -3.335) (layer B.Fab) (width 0.12)) (fp_line (start -2.975 1.615) (end 3.725 1.615) (layer B.Fab) (width 0.12)) (fp_line (start -3.775 -3.335) (end -3.775 0.865) (layer B.Fab) (width 0.12)) (fp_line (start -4.025 -2.835) (end 3.975 -2.835) (layer Dwgs.User) (width 0.1)) (fp_line (start -4.13 2.88) (end 4.14 2.88) (layer B.CrtYd) (width 0.05)) (fp_line (start -4.13 2.88) (end -4.13 -3.58) (layer B.CrtYd) (width 0.05)) (fp_line (start 4.14 -3.58) (end 4.14 2.88) (layer B.CrtYd) (width 0.05)) (fp_line (start 4.14 -3.58) (end -4.13 -3.58) (layer B.CrtYd) (width 0.05)) (fp_text user %R (at -0.025 0.015 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text user "PCB edge" (at -0.025 -2.235 90) (layer Dwgs.User) (effects (font (size 0.5 0.5) (thickness 0.075))) ) (pad 6 smd rect (at 0.935 -1.385) (size 2.5 1.43) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 6 smd rect (at -0.985 -1.385) (size 2.5 1.43) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 6 thru_hole oval (at 2.705 -1.115) (size 1.7 1.35) (drill oval 1.2 0.7) (layers *.Cu *.Mask) (net 1 GND)) (pad 6 thru_hole oval (at -2.755 -1.115) (size 1.7 1.35) (drill oval 1.2 0.7) (layers *.Cu *.Mask) (net 1 GND)) (pad 6 thru_hole oval (at 2.395 1.885) (size 1.5 1.1) (drill oval 1.05 0.65) (layers *.Cu *.Mask) (net 1 GND)) (pad 6 thru_hole oval (at -2.445 1.885) (size 1.5 1.1) (drill oval 1.05 0.65) (layers *.Cu *.Mask) (net 1 GND)) (pad 5 smd rect (at 1.275 1.765) (size 1.65 0.4) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 4 smd rect (at 0.625 1.765) (size 1.65 0.4) (layers B.Cu B.Paste B.Mask) (net 736 "Net-(J10-Pad4)")) (pad 3 smd rect (at -0.025 1.765) (size 1.65 0.4) (layers B.Cu B.Paste B.Mask) (net 125 /USB/USB_D_P)) (pad 2 smd rect (at -0.675 1.765) (size 1.65 0.4) (layers B.Cu B.Paste B.Mask) (net 126 /USB/USB_D_N)) (pad 1 smd rect (at -1.325 1.765) (size 1.65 0.4) (layers B.Cu B.Paste B.Mask) (net 124 "Net-(D13-Pad4)")) (pad 6 smd rect (at 2.875 1.885 90) (size 2 1.5) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 6 smd rect (at -2.875 1.865 90) (size 2 1.5) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 6 smd rect (at 2.975 0.565 90) (size 1.825 0.7) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 6 smd rect (at -2.975 0.565 90) (size 1.825 0.7) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 6 smd rect (at -2.755 -0.185 90) (size 1.35 2) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 6 smd rect (at 2.725 -0.185 90) (size 1.35 2) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (model ${KISYS3DMOD}/Connector_USB.3dshapes/USB_Micro-B_Amphenol_10103594-0001LF_Horizontal.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${KISYS3DMOD}/Connector_USB.3dshapes/USB_Micro-B_Molex_47346-0001.step (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOIC254P665X290-4N" (layer B.Cu) (tedit 0) (tstamp 5CA56DE7) (at 279.43556 189.92088 270) (descr "SOIC, 4-Leads, Body 3.9x4.75mm, Pitch 2.54mm, IPC Medium Density") (path /5C16BF8E/5C35B2DE) (attr smd) (fp_text reference D6 (at 0 3.776 270) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value MB210S-TP (at 0 -3.776 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -0.8 1.6) (end -0.5 1.6) (layer B.SilkS) (width 0.6)) (fp_circle (center -3.5 2.3) (end -3.375 2.3) (layer B.SilkS) (width 0.25)) (fp_line (start -1.7 2.475) (end 1.7 2.475) (layer B.SilkS) (width 0.2)) (fp_line (start 1.7 -2.475) (end 1.7 2.475) (layer B.SilkS) (width 0.2)) (fp_line (start -1.7 -2.475) (end 1.7 -2.475) (layer B.SilkS) (width 0.2)) (fp_line (start -1.7 -2.475) (end -1.7 2.475) (layer B.SilkS) (width 0.2)) (fp_line (start -2.05 2.475) (end 2.05 2.475) (layer B.Fab) (width 0.1)) (fp_line (start 2.05 -2.475) (end 2.05 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 -2.475) (end 2.05 -2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 -2.475) (end -2.05 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 2.375) (end -1.95 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 2.275) (end -1.85 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 2.175) (end -1.75 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 2.075) (end -1.65 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 1.975) (end -1.55 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 1.875) (end -1.45 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 1.775) (end -1.35 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 1.675) (end -1.25 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 1.575) (end -1.15 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 1.475) (end -1.05 2.475) (layer B.Fab) (width 0.1)) (fp_line (start 4 -2.725) (end 4 2.725) (layer B.CrtYd) (width 0.1)) (fp_line (start -4 -2.725) (end 4 -2.725) (layer B.CrtYd) (width 0.1)) (fp_line (start -4 -2.725) (end -4 2.725) (layer B.CrtYd) (width 0.1)) (fp_line (start -4 2.725) (end 4 2.725) (layer B.CrtYd) (width 0.1)) (fp_line (start 0 0) (end 0 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 2.05 1.67) (end 3.75 1.67) (layer Cmts.User) (width 0.1)) (fp_line (start 3.75 0.87) (end 3.75 1.67) (layer Cmts.User) (width 0.1)) (fp_line (start 2.05 0.87) (end 3.75 0.87) (layer Cmts.User) (width 0.1)) (fp_line (start 2.05 0.87) (end 2.05 1.67) (layer Cmts.User) (width 0.1)) (fp_line (start 2.9 1.27) (end 2.9 1.77) (layer Cmts.User) (width 0.1)) (fp_line (start 2.9 0.77) (end 2.9 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 2.4 1.27) (end 2.9 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 2.9 1.27) (end 3.4 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 2.05 -0.87) (end 3.75 -0.87) (layer Cmts.User) (width 0.1)) (fp_line (start 3.75 -1.67) (end 3.75 -0.87) (layer Cmts.User) (width 0.1)) (fp_line (start 2.05 -1.67) (end 3.75 -1.67) (layer Cmts.User) (width 0.1)) (fp_line (start 2.05 -1.67) (end 2.05 -0.87) (layer Cmts.User) (width 0.1)) (fp_line (start 2.9 -1.27) (end 2.9 -0.77) (layer Cmts.User) (width 0.1)) (fp_line (start 2.9 -1.77) (end 2.9 -1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 2.4 -1.27) (end 2.9 -1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 2.9 -1.27) (end 3.4 -1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -3.75 1.67) (end -2.05 1.67) (layer Cmts.User) (width 0.1)) (fp_line (start -3.75 0.87) (end -3.75 1.67) (layer Cmts.User) (width 0.1)) (fp_line (start -3.75 0.87) (end -2.05 0.87) (layer Cmts.User) (width 0.1)) (fp_line (start -2.05 0.87) (end -2.05 1.67) (layer Cmts.User) (width 0.1)) (fp_line (start -2.9 1.27) (end -2.9 1.77) (layer Cmts.User) (width 0.1)) (fp_line (start -2.9 0.77) (end -2.9 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -2.9 1.27) (end -2.4 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -3.4 1.27) (end -2.9 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -3.75 -0.87) (end -2.05 -0.87) (layer Cmts.User) (width 0.1)) (fp_line (start -3.75 -1.67) (end -3.75 -0.87) (layer Cmts.User) (width 0.1)) (fp_line (start -3.75 -1.67) (end -2.05 -1.67) (layer Cmts.User) (width 0.1)) (fp_line (start -2.05 -1.67) (end -2.05 -0.87) (layer Cmts.User) (width 0.1)) (fp_line (start -2.9 -1.27) (end -2.9 -0.77) (layer Cmts.User) (width 0.1)) (fp_line (start -2.9 -1.77) (end -2.9 -1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -2.9 -1.27) (end -2.4 -1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -3.4 -1.27) (end -2.9 -1.27) (layer Cmts.User) (width 0.1)) (pad 4 smd rect (at 2.9 1.27 270) (size 1.75 0.85) (layers B.Cu B.Paste B.Mask) (net 110 "Net-(D6-Pad4)") (solder_mask_margin 0.102)) (pad 3 smd rect (at 2.9 -1.27 270) (size 1.75 0.85) (layers B.Cu B.Paste B.Mask) (net 111 "Net-(D6-Pad3)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.9 -1.27 270) (size 1.75 0.85) (layers B.Cu B.Paste B.Mask) (net 114 /ETH_PHY/POE_VC3) (solder_mask_margin 0.102)) (pad 1 smd rect (at -2.9 1.27 270) (size 1.75 0.85) (layers B.Cu B.Paste B.Mask) (net 112 /ETH_PHY/POE_VC1) (solder_mask_margin 0.102)) (model SOIC254P665X290-4N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/SOIC254P665X290-4N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:SOIC254P665X290-4N" (layer B.Cu) (tedit 0) (tstamp 5C6A1AA7) (at 287.51784 189.69228 270) (descr "SOIC, 4-Leads, Body 3.9x4.75mm, Pitch 2.54mm, IPC Medium Density") (path /5C16BF8E/5C35B47B) (attr smd) (fp_text reference D7 (at 0 3.776 270) (layer B.SilkS) hide (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value MB210S-TP (at 0 -3.776 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -0.8 1.6) (end -0.5 1.6) (layer B.SilkS) (width 0.6)) (fp_circle (center -3.5 2.3) (end -3.375 2.3) (layer B.SilkS) (width 0.25)) (fp_line (start -1.7 2.475) (end 1.7 2.475) (layer B.SilkS) (width 0.2)) (fp_line (start 1.7 -2.475) (end 1.7 2.475) (layer B.SilkS) (width 0.2)) (fp_line (start -1.7 -2.475) (end 1.7 -2.475) (layer B.SilkS) (width 0.2)) (fp_line (start -1.7 -2.475) (end -1.7 2.475) (layer B.SilkS) (width 0.2)) (fp_line (start -2.05 2.475) (end 2.05 2.475) (layer B.Fab) (width 0.1)) (fp_line (start 2.05 -2.475) (end 2.05 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 -2.475) (end 2.05 -2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 -2.475) (end -2.05 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 2.375) (end -1.95 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 2.275) (end -1.85 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 2.175) (end -1.75 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 2.075) (end -1.65 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 1.975) (end -1.55 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 1.875) (end -1.45 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 1.775) (end -1.35 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 1.675) (end -1.25 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 1.575) (end -1.15 2.475) (layer B.Fab) (width 0.1)) (fp_line (start -2.05 1.475) (end -1.05 2.475) (layer B.Fab) (width 0.1)) (fp_line (start 4 -2.725) (end 4 2.725) (layer B.CrtYd) (width 0.1)) (fp_line (start -4 -2.725) (end 4 -2.725) (layer B.CrtYd) (width 0.1)) (fp_line (start -4 -2.725) (end -4 2.725) (layer B.CrtYd) (width 0.1)) (fp_line (start -4 2.725) (end 4 2.725) (layer B.CrtYd) (width 0.1)) (fp_line (start 0 0) (end 0 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 2.05 1.67) (end 3.75 1.67) (layer Cmts.User) (width 0.1)) (fp_line (start 3.75 0.87) (end 3.75 1.67) (layer Cmts.User) (width 0.1)) (fp_line (start 2.05 0.87) (end 3.75 0.87) (layer Cmts.User) (width 0.1)) (fp_line (start 2.05 0.87) (end 2.05 1.67) (layer Cmts.User) (width 0.1)) (fp_line (start 2.9 1.27) (end 2.9 1.77) (layer Cmts.User) (width 0.1)) (fp_line (start 2.9 0.77) (end 2.9 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 2.4 1.27) (end 2.9 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 2.9 1.27) (end 3.4 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 2.05 -0.87) (end 3.75 -0.87) (layer Cmts.User) (width 0.1)) (fp_line (start 3.75 -1.67) (end 3.75 -0.87) (layer Cmts.User) (width 0.1)) (fp_line (start 2.05 -1.67) (end 3.75 -1.67) (layer Cmts.User) (width 0.1)) (fp_line (start 2.05 -1.67) (end 2.05 -0.87) (layer Cmts.User) (width 0.1)) (fp_line (start 2.9 -1.27) (end 2.9 -0.77) (layer Cmts.User) (width 0.1)) (fp_line (start 2.9 -1.77) (end 2.9 -1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 2.4 -1.27) (end 2.9 -1.27) (layer Cmts.User) (width 0.1)) (fp_line (start 2.9 -1.27) (end 3.4 -1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -3.75 1.67) (end -2.05 1.67) (layer Cmts.User) (width 0.1)) (fp_line (start -3.75 0.87) (end -3.75 1.67) (layer Cmts.User) (width 0.1)) (fp_line (start -3.75 0.87) (end -2.05 0.87) (layer Cmts.User) (width 0.1)) (fp_line (start -2.05 0.87) (end -2.05 1.67) (layer Cmts.User) (width 0.1)) (fp_line (start -2.9 1.27) (end -2.9 1.77) (layer Cmts.User) (width 0.1)) (fp_line (start -2.9 0.77) (end -2.9 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -2.9 1.27) (end -2.4 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -3.4 1.27) (end -2.9 1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -3.75 -0.87) (end -2.05 -0.87) (layer Cmts.User) (width 0.1)) (fp_line (start -3.75 -1.67) (end -3.75 -0.87) (layer Cmts.User) (width 0.1)) (fp_line (start -3.75 -1.67) (end -2.05 -1.67) (layer Cmts.User) (width 0.1)) (fp_line (start -2.05 -1.67) (end -2.05 -0.87) (layer Cmts.User) (width 0.1)) (fp_line (start -2.9 -1.27) (end -2.9 -0.77) (layer Cmts.User) (width 0.1)) (fp_line (start -2.9 -1.77) (end -2.9 -1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -2.9 -1.27) (end -2.4 -1.27) (layer Cmts.User) (width 0.1)) (fp_line (start -3.4 -1.27) (end -2.9 -1.27) (layer Cmts.User) (width 0.1)) (pad 4 smd rect (at 2.9 1.27 270) (size 1.75 0.85) (layers B.Cu B.Paste B.Mask) (net 110 "Net-(D6-Pad4)") (solder_mask_margin 0.102)) (pad 3 smd rect (at 2.9 -1.27 270) (size 1.75 0.85) (layers B.Cu B.Paste B.Mask) (net 111 "Net-(D6-Pad3)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -2.9 -1.27 270) (size 1.75 0.85) (layers B.Cu B.Paste B.Mask) (net 115 /ETH_PHY/POE_VC4) (solder_mask_margin 0.102)) (pad 1 smd rect (at -2.9 1.27 270) (size 1.75 0.85) (layers B.Cu B.Paste B.Mask) (net 113 /ETH_PHY/POE_VC2) (solder_mask_margin 0.102)) (model SOIC254P665X290-4N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/SOIC254P665X290-4N.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "Miscellaneous THD:CLIFF_FC68148(DC-10A)" (layer F.Cu) (tedit 0) (tstamp 5ED8FB97) (at 293.9542 205.74 90) (descr "12V / 5A, 2.1mm Diameter Pin, DC Power Socket With Switch. 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1.05) (end 2.225 1.05) (layer F.SilkS) (width 0.2)) (fp_line (start -2.225 1.05) (end -2.225 -1.05) (layer F.SilkS) (width 0.2)) (fp_line (start -2.225 -1.05) (end 2.225 -1.05) (layer F.SilkS) (width 0.2)) (fp_line (start -0.025 1.05) (end -0.025 -1.05) (layer F.SilkS) (width 0.2)) (fp_line (start -1.578 1.05) (end -1.578 -1.05) (layer F.SilkS) (width 0.2)) (fp_line (start -1.378 1.05) (end -1.378 -1.05) (layer F.SilkS) (width 0.2)) (fp_line (start -1.178 1.05) (end -1.178 -1.05) (layer F.SilkS) (width 0.2)) (fp_line (start -0.978 1.05) (end -0.978 -1.05) (layer F.SilkS) (width 0.2)) (fp_line (start -0.778 1.05) (end -0.778 -1.05) (layer F.SilkS) (width 0.2)) (fp_line (start -0.578 1.05) (end -0.578 -1.05) (layer F.SilkS) (width 0.2)) (fp_line (start -0.378 1.05) (end -0.378 -1.05) (layer F.SilkS) (width 0.2)) (fp_line (start -0.178 1.05) (end -0.178 -1.05) (layer F.SilkS) (width 0.2)) (fp_line (start 3.75 2.49) (end 3.75 0.95) (layer F.SilkS) (width 0.2)) (fp_line (start -3.75 -0.95) (end -3.75 -2.49) (layer F.SilkS) (width 0.2)) (fp_text user ON (at 3.04 -0.058) (layer F.Fab) (effects (font (size 1 1) (thickness 0.2))) ) (pad 1 smd rect (at -4.125 0 90) (size 2.15 1.1) (layers F.Cu F.Paste F.Mask) (net 357 /FPGA/FPGA_13_14/CFG_WP) (solder_mask_margin 0.102)) (pad 2 smd rect (at 4.125 0 90) (size 2.15 1.1) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model SW_OMRON_A6SN-1101.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/SW_OMRON_A6SN-1101.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:QFN50P800X800X100-57N-S620" (layer B.Cu) (tedit 0) (tstamp 5C54700F) (at 152.146 115.57) (descr "QFN, 0.50mm Pitch, Square; 56 Pin, 8.00mm L X 8.00mm W X 1.00mm H body (6.1mm X 6.1mm Thermal tab), IPC Medium Density") (path /5C16C03C/5C6C4D5A) (attr smd) (fp_text reference U23 (at 3.683 -5.842) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value FT4232H-56Q (at 0 -5.676) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -3 3) (end -2.5 3) (layer B.Fab) (width 0.1)) (fp_circle (center -4.95 3.25) (end -4.825 3.25) (layer B.SilkS) (width 0.25)) (fp_line (start -4 -4) (end 4 -4) (layer B.Fab) (width 0.1)) (fp_line (start 4 -4) (end 4 4) (layer B.Fab) (width 0.1)) (fp_line (start -4 4) (end 4 4) (layer B.Fab) (width 0.1)) (fp_line (start -4 -4) (end -4 4) (layer B.Fab) (width 0.1)) (fp_line (start 3.75 -4) (end 4 -4) (layer B.SilkS) (width 0.2)) (fp_line (start 4 -4) (end 4 -3.75) (layer B.SilkS) (width 0.2)) (fp_line (start -4 -4) (end -3.75 -4) (layer B.SilkS) (width 0.2)) (fp_line (start -4 -4) (end -4 -3.75) (layer B.SilkS) (width 0.2)) (fp_line (start 3.75 4) (end 4 4) (layer B.SilkS) (width 0.2)) (fp_line (start 4 3.75) (end 4 4) (layer B.SilkS) (width 0.2)) (fp_line (start -3.8 4) (end -3.75 4) (layer B.SilkS) (width 0.2)) (fp_line (start -4 3.8) (end -3.8 4) (layer B.SilkS) (width 0.2)) (fp_line (start -4 3.75) (end -4 3.8) (layer B.SilkS) (width 0.2)) (fp_line (start -4.65 -4.65) (end 4.65 -4.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 4.65 -4.65) (end 4.65 4.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -4.65 4.65) (end 4.65 4.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -4.65 -4.65) (end -4.65 4.65) (layer B.CrtYd) (width 0.05)) (pad 1 smd roundrect (at -3.95 3.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 310 "Net-(R117-Pad2)") (solder_mask_margin 0.102)) (pad 2 smd roundrect (at -3.95 2.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 3 smd roundrect (at -3.95 2.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 53 "Net-(C171-Pad1)") (solder_mask_margin 0.102)) (pad 4 smd roundrect (at -3.95 1.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 50 "Net-(C165-Pad1)") (solder_mask_margin 0.102)) (pad 5 smd roundrect (at -3.95 1.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 51 "Net-(C167-Pad1)") (solder_mask_margin 0.102)) (pad 6 smd roundrect (at -3.95 0.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 312 "Net-(R120-Pad2)") (solder_mask_margin 0.102)) (pad 7 smd roundrect (at -3.95 0.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 126 /USB/USB_D_N) (solder_mask_margin 0.102)) (pad 8 smd roundrect (at -3.95 -0.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 125 /USB/USB_D_P) (solder_mask_margin 0.102)) (pad 9 smd roundrect (at -3.95 -0.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 52 "Net-(C168-Pad1)") (solder_mask_margin 0.102)) (pad 10 smd roundrect (at -3.95 -1.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 11 smd roundrect (at -3.95 -1.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 306 "Net-(R112-Pad2)") (solder_mask_margin 0.102)) (pad 12 smd roundrect (at -3.95 -2.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 314 "Net-(R122-Pad2)") (solder_mask_margin 0.102)) (pad 13 smd roundrect (at -3.95 -2.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 316 "Net-(R124-Pad2)") (solder_mask_margin 0.102)) (pad 14 smd roundrect (at -3.95 -3.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 317 "Net-(R125-Pad2)") (solder_mask_margin 0.102)) (pad 15 smd roundrect (at -3.25 -3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 318 "Net-(R126-Pad2)") (solder_mask_margin 0.102)) (pad 16 smd roundrect (at -2.75 -3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 17 smd roundrect (at -2.25 -3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 354 "Net-(R200-Pad2)") (solder_mask_margin 0.102)) (pad 18 smd roundrect (at -1.75 -3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1065 "Net-(U23-Pad18)") (solder_mask_margin 0.102)) (pad 19 smd roundrect (at -1.25 -3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1066 "Net-(U23-Pad19)") (solder_mask_margin 0.102)) (pad 20 smd roundrect (at -0.75 -3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1067 "Net-(U23-Pad20)") (solder_mask_margin 0.102)) (pad 21 smd roundrect (at -0.25 -3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 22 smd roundrect (at 0.25 -3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1068 "Net-(U23-Pad22)") (solder_mask_margin 0.102)) (pad 23 smd roundrect (at 0.75 -3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1069 "Net-(U23-Pad23)") (solder_mask_margin 0.102)) (pad 24 smd roundrect (at 1.25 -3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 313 "Net-(R121-Pad2)") (solder_mask_margin 0.102)) (pad 25 smd roundrect (at 1.75 -3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1070 "Net-(U23-Pad25)") (solder_mask_margin 0.102)) (pad 26 smd roundrect (at 2.25 -3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 315 "Net-(R123-Pad2)") (solder_mask_margin 0.102)) (pad 27 smd roundrect (at 2.75 -3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1071 "Net-(U23-Pad27)") (solder_mask_margin 0.102)) (pad 28 smd roundrect (at 3.25 -3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1072 "Net-(U23-Pad28)") (solder_mask_margin 0.102)) (pad 29 smd roundrect (at 3.95 -3.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1073 "Net-(U23-Pad29)") (solder_mask_margin 0.102)) (pad 30 smd roundrect (at 3.95 -2.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1074 "Net-(U23-Pad30)") (solder_mask_margin 0.102)) (pad 31 smd roundrect (at 3.95 -2.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 32 smd roundrect (at 3.95 -1.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 406 "Net-(U23-Pad32)") (solder_mask_margin 0.102)) (pad 33 smd roundrect (at 3.95 -1.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 407 "Net-(U23-Pad33)") (solder_mask_margin 0.102)) (pad 34 smd roundrect (at 3.95 -0.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 682 "Net-(U15-Pad8)") (solder_mask_margin 0.102)) (pad 35 smd roundrect (at 3.95 -0.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1075 "Net-(U23-Pad35)") (solder_mask_margin 0.102)) (pad 36 smd roundrect (at 3.95 0.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 37 smd roundrect (at 3.95 0.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1076 "Net-(U23-Pad37)") (solder_mask_margin 0.102)) (pad 38 smd roundrect (at 3.95 1.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1077 "Net-(U23-Pad38)") (solder_mask_margin 0.102)) (pad 39 smd roundrect (at 3.95 1.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1078 "Net-(U23-Pad39)") (solder_mask_margin 0.102)) (pad 40 smd roundrect (at 3.95 2.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1079 "Net-(U23-Pad40)") (solder_mask_margin 0.102)) (pad 41 smd roundrect (at 3.95 2.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 42 smd roundrect (at 3.95 3.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 408 "Net-(U23-Pad42)") (solder_mask_margin 0.102)) (pad 43 smd roundrect (at 3.25 3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 463 +1V8_USB) (solder_mask_margin 0.102)) (pad 44 smd roundrect (at 2.75 3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 45 smd roundrect (at 2.25 3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.102)) (pad 46 smd roundrect (at 1.75 3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 409 "Net-(U23-Pad46)") (solder_mask_margin 0.102)) (pad 47 smd roundrect (at 1.25 3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1123 "Net-(U23-Pad47)") (solder_mask_margin 0.102)) (pad 48 smd roundrect (at 0.75 3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1080 "Net-(U23-Pad48)") (solder_mask_margin 0.102)) (pad 49 smd roundrect (at 0.25 3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1124 "Net-(U23-Pad49)") (solder_mask_margin 0.102)) (pad 50 smd roundrect (at -0.25 3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 663 +3V3_USB) (solder_mask_margin 0.102)) (pad 51 smd roundrect (at -0.75 3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1081 "Net-(U23-Pad51)") (solder_mask_margin 0.102)) (pad 52 smd roundrect (at -1.25 3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1082 "Net-(U23-Pad52)") (solder_mask_margin 0.102)) (pad 53 smd roundrect (at -1.75 3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1083 "Net-(U23-Pad53)") (solder_mask_margin 0.102)) (pad 54 smd roundrect (at -2.25 3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 1084 "Net-(U23-Pad54)") (solder_mask_margin 0.102)) (pad 55 smd roundrect (at -2.75 3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 308 "Net-(R114-Pad2)") (solder_mask_margin 0.102)) (pad 56 smd roundrect (at -3.25 3.95 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5) (net 309 "Net-(R115-Pad2)") (solder_mask_margin 0.102)) (pad 57 smd rect (at 0 0) (size 6.2 6.2) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model QFN50P800X800X100-57N-S620.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (model ${CERN}/QFN50P800X800X100-57N-S620.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Connect:Fan_Pin_Header_Straight_1x03 (layer F.Cu) (tedit 58130A41) (tstamp 5C6AF48E) (at 213.6521 194.3735) (descr "3-pin CPU fan Through hole pin header") (tags "pin header 3-pin CPU fan") (path /5D05A99E/5D543B40) (fp_text reference M1 (at -5.6521 2.6265 270) (layer F.SilkS) (effects (font (size 2 2) (thickness 0.4))) ) (fp_text value Fan_3pin (at 0 7.25 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 3.05 6.85) (end -3.8 6.85) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.05 6.85) (end 3.05 -1.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.8 -1.75) (end -3.8 6.85) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.8 -1.75) (end 3.05 -1.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.29 5.08) (end -3.3 5.08) (layer F.SilkS) (width 0.12)) (fp_line (start -2.29 0) (end -2.29 5.08) (layer F.SilkS) (width 0.12)) (fp_line (start -3.3 0) (end -2.29 0) (layer F.SilkS) (width 0.12)) (fp_line (start -3.3 6.35) (end -3.3 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start 2.55 6.35) (end -3.3 6.35) (layer F.Fab) (width 0.1)) (fp_line (start 2.55 -1.25) (end 2.55 6.35) (layer F.Fab) (width 0.1)) (fp_line (start -3.3 -1.25) (end 2.55 -1.25) (layer F.Fab) (width 0.1)) (fp_line (start -2.3 0) (end -3.3 0) (layer F.Fab) (width 0.1)) (fp_line (start -2.3 5.05) (end -2.3 0) (layer F.Fab) (width 0.1)) (fp_line (start -3.3 5.05) (end -2.3 5.05) (layer F.Fab) (width 0.1)) (fp_line (start -3.4 6.45) (end -3.4 -1.35) (layer F.SilkS) (width 0.12)) (fp_line (start 2.65 6.45) (end -3.4 6.45) (layer F.SilkS) (width 0.12)) (fp_line (start 2.65 -1.35) (end 2.65 6.45) (layer F.SilkS) (width 0.12)) (fp_line (start -3.4 -1.35) (end 2.65 -1.35) (layer F.SilkS) (width 0.12)) (fp_text user %R (at 0 -2.1 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (pad 1 thru_hole rect (at 0 0) (size 2.03 1.73) (drill 1.02) (layers *.Cu *.Mask) (net 211 "Net-(M1-Pad1)")) (pad 2 thru_hole oval (at 0 2.54) (size 2.03 1.73) (drill 1.02) (layers *.Cu *.Mask) (net 2 +12V)) (pad 3 thru_hole oval (at 0 5.08) (size 2.03 1.73) (drill 1.02) (layers *.Cu *.Mask) (net 212 "Net-(M1-Pad3)")) (model ${KISYS3DMOD}/Connector.3dshapes/FanPinHeader_1x03_P2.54mm_Vertical.step (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 90)) ) ) (module "ICs And Semiconductors SMD:OSC_ABRACON_ASEMPC" (layer F.Cu) (tedit 0) (tstamp 5C64732F) (at 230.5558 97.8027) (descr "4 Pins, 3.2x2.5mm, Performance Plastic Package Ultra Miniature Pure Silicon Clock Oscillator, ASEMP Serie CMOS Version") (path /5C16BF13/5C5AB62A) (attr smd) (fp_text reference Y1 (at 0.2032 2.9083 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value OSC_25MHZ_RAKON_IVT3205CR (at 0 2.876) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -2.075 -1.05) (end -1.95 -1.05) (layer F.SilkS) (width 0.25)) (fp_circle (center -0.575 -0.925) (end -0.075 -0.925) (layer F.Fab) (width 0.1)) (fp_line (start -0.354 0.354) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.354 -0.354) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0.354 -0.354) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0.354 0.354) (layer Cmts.User) (width 0.1)) (fp_line (start 0.45 1.5) (end 1.45 1.5) (layer Cmts.User) (width 0.1)) (fp_line (start 1.45 1.5) (end 1.45 0.6) (layer Cmts.User) (width 0.1)) (fp_line (start 0.45 0.6) (end 1.45 0.6) (layer Cmts.User) (width 0.1)) (fp_line (start 0.45 1.5) (end 0.45 0.6) (layer Cmts.User) (width 0.1)) (fp_line (start 0.45 1.05) (end 0.95 1.05) (layer Cmts.User) (width 0.1)) (fp_line (start 0.95 1.05) (end 0.95 0.55) (layer Cmts.User) (width 0.1)) (fp_line (start 0.95 1.05) (end 1.45 1.05) (layer Cmts.User) (width 0.1)) (fp_line (start 0.95 1.55) (end 0.95 1.05) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 1.5) (end -0.45 1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.45 1.5) (end -0.45 0.6) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 0.6) (end -0.45 0.6) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 1.5) (end -1.45 0.6) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 1.05) (end -0.95 1.05) (layer Cmts.User) (width 0.1)) (fp_line (start -0.95 1.05) (end -0.95 0.55) (layer Cmts.User) (width 0.1)) (fp_line (start -0.95 1.05) (end -0.45 1.05) (layer Cmts.User) (width 0.1)) (fp_line (start -0.95 1.55) (end -0.95 1.05) (layer Cmts.User) (width 0.1)) (fp_line (start 1.45 0.25) (end 1.45 -0.25) (layer Cmts.User) (width 0.1)) (fp_line (start 0.45 0) (end 0.95 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.95 0) (end 0.95 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0.95 0) (end 1.45 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.95 0.5) (end 0.95 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0.45 -0.6) (end 1.45 -0.6) (layer Cmts.User) (width 0.1)) (fp_line (start 1.45 -0.6) (end 1.45 -1.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0.45 -1.5) (end 1.45 -1.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0.45 -0.6) (end 0.45 -1.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0.45 -1.05) (end 0.95 -1.05) (layer Cmts.User) (width 0.1)) (fp_line (start 0.95 -1.05) (end 0.95 -1.55) (layer Cmts.User) (width 0.1)) (fp_line (start 0.95 -1.05) (end 1.45 -1.05) (layer Cmts.User) (width 0.1)) (fp_line (start 0.95 -0.55) (end 0.95 -1.05) (layer Cmts.User) (width 0.1)) (fp_line (start 0.45 -0.25) (end 1.45 -0.25) (layer Cmts.User) (width 0.1)) (fp_line (start 0.45 0.25) (end 0.45 -0.25) (layer Cmts.User) (width 0.1)) (fp_line (start 0.45 0.25) (end 1.45 0.25) (layer Cmts.User) (width 0.1)) (fp_line (start -0.45 0.25) (end -0.45 -0.25) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 0) (end -0.95 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.95 0) (end -0.95 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.95 0) (end -0.45 0) (layer Cmts.User) (width 0.1)) (fp_line (start -0.95 0.5) (end -0.95 0) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 -0.6) (end -0.45 -0.6) (layer Cmts.User) (width 0.1)) (fp_line (start -0.45 -0.6) (end -0.45 -1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 -1.5) (end -0.45 -1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 -0.6) (end -1.45 -1.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 -1.05) (end -0.95 -1.05) (layer Cmts.User) (width 0.1)) (fp_line (start -0.95 -1.05) (end -0.95 -1.55) (layer Cmts.User) (width 0.1)) (fp_line (start -0.95 -1.05) (end -0.45 -1.05) (layer Cmts.User) (width 0.1)) (fp_line (start -0.95 -0.55) (end -0.95 -1.05) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 -0.25) (end -0.45 -0.25) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 0.25) (end -1.45 -0.25) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 0.25) (end -0.45 0.25) (layer Cmts.User) (width 0.1)) (fp_line (start 1.25 0.15) (end 1.25 -0.15) (layer F.SilkS) (width 0.2)) (fp_line (start -1.25 0.15) (end -1.25 -0.15) (layer F.SilkS) (width 0.2)) (fp_line (start -0.15 -1.6) (end 0.15 -1.6) (layer F.SilkS) (width 0.2)) (fp_line (start -0.15 1.6) (end 0.15 1.6) (layer F.SilkS) (width 0.2)) (fp_line (start -1.25 1.6) (end 1.25 1.6) (layer F.Fab) (width 0.1)) (fp_line (start 1.25 1.6) (end 1.25 -1.6) (layer F.Fab) (width 0.1)) (fp_line (start -1.25 -1.6) (end 1.25 -1.6) (layer F.Fab) (width 0.1)) (fp_line (start -1.25 1.6) (end -1.25 -1.6) (layer F.Fab) (width 0.1)) (fp_line (start -1.7 1.85) (end -1.7 -1.85) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 1.85) (end 1.7 1.85) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.7 -1.85) (end 1.7 -1.85) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.7 1.85) (end 1.7 -1.85) (layer F.CrtYd) (width 0.05)) (pad 6 smd rect (at 0.95 -1.2532) (size 1 0.9) (layers F.Cu F.Paste F.Mask) (net 447 "Net-(C107-Pad1)") (solder_mask_margin 0.102)) (pad 4 smd rect (at 0.95 1.2532) (size 1 0.9) (layers F.Cu F.Paste F.Mask) (net 450 "Net-(C114-Pad1)") (solder_mask_margin 0.102)) (pad 3 smd rect (at -0.95 1.2532) (size 1 0.9) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 1 smd rect (at -0.95 -1.2532) (size 1 0.9) (layers F.Cu F.Paste F.Mask) (net 29 /WhiteRabbit/WR_DAC_OUT1) (solder_mask_margin 0.102)) (model ${CERN}/OSC_RAKON_IVT3200C.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:XTAL_TXC_7M" (layer B.Cu) (tedit 5C617D64) (tstamp 5C6F8695) (at 141.478 121.412 180) (descr "4 Pins, 2.5x3.2mm, SMD Sealing Crystal, 7M Serie") (path /5C16C03C/5C722B1A) (attr smd) (fp_text reference Y4 (at 2.54 2.667 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value XTAL_12MHZ_TXC_7M-12.000MAAJ-T (at 0 -3.076 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -0.475 0.825) (end 0.025 0.825) (layer B.Fab) (width 0.1)) (fp_circle (center -2 1.2) (end -1.875 1.2) (layer B.SilkS) (width 0.25)) (fp_line (start 0.25 -0.4) (end 1.45 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 1.45 -1.8) (end 1.45 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.25 -1.8) (end 1.45 -1.8) (layer Cmts.User) (width 0.1)) (fp_line (start 0.25 -1.8) (end 0.25 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.35 -1.1) (end 0.85 -1.1) (layer Cmts.User) (width 0.1)) (fp_line (start 0.85 -1.6) (end 0.85 -1.1) (layer Cmts.User) (width 0.1)) (fp_line (start 0.85 -1.1) (end 1.35 -1.1) (layer Cmts.User) (width 0.1)) (fp_line (start 0.85 -1.1) (end 0.85 -0.6) (layer Cmts.User) (width 0.1)) (fp_line (start 0.25 1.8) (end 1.45 1.8) (layer Cmts.User) (width 0.1)) (fp_line (start 1.45 0.4) (end 1.45 1.8) (layer Cmts.User) (width 0.1)) (fp_line (start 0.25 0.4) (end 1.45 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start 0.25 0.4) (end 0.25 1.8) (layer Cmts.User) (width 0.1)) (fp_line (start 0.35 1.1) (end 0.85 1.1) (layer Cmts.User) (width 0.1)) (fp_line (start 0.85 0.6) (end 0.85 1.1) (layer Cmts.User) (width 0.1)) (fp_line (start 0.85 1.1) (end 1.35 1.1) (layer Cmts.User) (width 0.1)) (fp_line (start 0.85 1.1) (end 0.85 1.6) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 -0.4) (end -0.25 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -0.25 -1.8) (end -0.25 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 -1.8) (end -0.25 -1.8) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 -1.8) (end -1.45 -0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.35 -1.1) (end -0.85 -1.1) (layer Cmts.User) (width 0.1)) (fp_line (start -0.85 -1.6) (end -0.85 -1.1) (layer Cmts.User) (width 0.1)) (fp_line (start -0.85 -1.1) (end -0.35 -1.1) (layer Cmts.User) (width 0.1)) (fp_line (start -0.85 -1.1) (end -0.85 -0.6) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 1.8) (end -0.25 1.8) (layer Cmts.User) (width 0.1)) (fp_line (start -0.25 0.4) (end -0.25 1.8) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 0.4) (end -0.25 0.4) (layer Cmts.User) (width 0.1)) (fp_line (start -1.45 0.4) (end -1.45 1.8) (layer Cmts.User) (width 0.1)) (fp_line (start -1.35 1.1) (end -0.85 1.1) (layer Cmts.User) (width 0.1)) (fp_line (start -0.85 0.6) (end -0.85 1.1) (layer Cmts.User) (width 0.1)) (fp_line (start -0.85 1.1) (end -0.35 1.1) (layer Cmts.User) (width 0.1)) (fp_line (start -0.85 1.1) (end -0.85 1.6) (layer Cmts.User) (width 0.1)) (fp_line (start 0 -0.5) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0.5 0) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0) (end 0 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.5 0) (end 0 0) (layer Cmts.User) (width 0.1)) (fp_line (start 1.25 -1.5) (end 1.25 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.15 -1.6) (end 1.15 -1.6) (layer B.Fab) (width 0.1)) (fp_line (start -1.25 -1.5) (end -1.25 1.5) (layer B.Fab) (width 0.1)) (fp_line (start -1.15 1.6) (end 1.15 1.6) (layer B.Fab) (width 0.1)) (fp_line (start -1.7 -2.05) (end 1.7 -2.05) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.7 -2.05) (end 1.7 2.05) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 2.05) (end 1.7 2.05) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.7 -2.05) (end -1.7 2.05) (layer B.CrtYd) (width 0.05)) (fp_arc (start 1.25 -1.6) (end 1.25 -1.5) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start -1.25 -1.6) (end -1.15 -1.6) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start 1.25 1.6) (end 1.15 1.6) (angle 90) (layer B.Fab) (width 0.1)) (fp_arc (start -1.25 1.6) (end -1.25 1.5) (angle 90) (layer B.Fab) (width 0.1)) (pad 1 smd rect (at -0.85 1.1 180) (size 1.2 1.4) (layers B.Cu B.Paste B.Mask) (net 50 "Net-(C165-Pad1)") (solder_mask_margin 0.102)) (pad 2 smd rect (at -0.85 -1.1 180) (size 1.2 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 4 smd rect (at 0.85 1.1 180) (size 1.2 1.4) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.102)) (pad 3 smd rect (at 0.85 -1.1 180) (size 1.2 1.4) (layers B.Cu B.Paste B.Mask) (net 53 "Net-(C171-Pad1)") (solder_mask_margin 0.102)) (model ${CERN}/XTAL_TXC_7M.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module "ICs And Semiconductors SMD:OSC_MICREL_2520" (layer F.Cu) (tedit 5C618103) (tstamp 5C6AF4CB) (at 281.7876 172.0088 180) (descr "MICREL SMD Oscillator, QFN, 4 pins, 2.5mm x 2.0mm") (path /5BCEDA59/5C76AE78) (attr smd) (fp_text reference OSC1 (at -3.9624 0.5334 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 25MHz (at 0 2.526 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -1.7 -0.8) (end -1.575 -0.8) (layer F.SilkS) (width 0.25)) (fp_circle (center -0.35 -0.5) (end 0.15 -0.5) (layer F.Fab) (width 0.1)) (fp_line (start 0.775 -0.825) (end 1.275 -0.825) (layer Cmts.User) (width 0.1)) (fp_line (start 0.775 -0.325) (end 0.775 -0.825) (layer Cmts.User) (width 0.1)) (fp_line (start 0.775 -0.825) (end 0.775 -1.325) (layer Cmts.User) (width 0.1)) (fp_line (start 0.275 -0.825) (end 0.775 -0.825) (layer Cmts.User) (width 0.1)) (fp_line (start 0.35 -0.5) (end 0.35 -1.15) (layer Cmts.User) (width 0.1)) (fp_line (start 0.35 -1.15) (end 1.2 -1.15) (layer Cmts.User) (width 0.1)) (fp_line (start 1.2 -0.5) (end 1.2 -1.15) (layer Cmts.User) (width 0.1)) (fp_line (start 0.35 -0.5) (end 1.2 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.775 -0.825) (end -0.275 -0.825) (layer Cmts.User) (width 0.1)) (fp_line (start -0.775 -0.325) (end -0.775 -0.825) (layer Cmts.User) (width 0.1)) (fp_line (start -0.775 -0.825) (end -0.775 -1.325) (layer Cmts.User) (width 0.1)) (fp_line (start -1.275 -0.825) (end -0.775 -0.825) (layer Cmts.User) (width 0.1)) (fp_line (start -1.2 -0.5) (end -1.2 -1.15) (layer Cmts.User) (width 0.1)) (fp_line (start -1.2 -1.15) (end -0.35 -1.15) (layer Cmts.User) (width 0.1)) (fp_line (start -0.35 -0.5) (end -0.35 -1.15) (layer Cmts.User) (width 0.1)) (fp_line (start -1.2 -0.5) (end -0.35 -0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.775 0.825) (end -0.275 0.825) (layer Cmts.User) (width 0.1)) (fp_line (start -0.775 1.325) (end -0.775 0.825) (layer Cmts.User) (width 0.1)) (fp_line (start -0.775 0.825) (end -0.775 0.325) (layer Cmts.User) (width 0.1)) (fp_line (start -1.275 0.825) (end -0.775 0.825) (layer Cmts.User) (width 0.1)) (fp_line (start -1.2 1.15) (end -1.2 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.2 0.5) (end -0.35 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -0.35 1.15) (end -0.35 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start -1.2 1.15) (end -0.35 1.15) (layer Cmts.User) (width 0.1)) (fp_line (start 0.775 0.825) (end 1.275 0.825) (layer Cmts.User) (width 0.1)) (fp_line (start 0.775 1.325) (end 0.775 0.825) (layer Cmts.User) (width 0.1)) (fp_line (start 0.775 0.825) (end 0.775 0.325) (layer Cmts.User) (width 0.1)) (fp_line (start 0.275 0.825) (end 0.775 0.825) (layer Cmts.User) (width 0.1)) (fp_line (start 0.35 1.15) (end 0.35 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0.35 0.5) (end 1.2 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 1.2 1.15) (end 1.2 0.5) (layer Cmts.User) (width 0.1)) (fp_line (start 0.35 1.15) (end 1.2 1.15) (layer Cmts.User) (width 0.1)) (fp_line (start 0 0.5) (end 0 0) 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(at 4 1) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.102)) (model ${CERN}/MOLEX_87831-1420.stp (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Connectors_Samtec:SDL-112-X-XX_2x06 (layer F.Cu) (tedit 590274CA) (tstamp 5C9D1E50) (at 218.6686 209.1436 270) (descr "Double row, low profile, screw machine socket strip, through hole, 100mil / 2.54mm pitch") (tags "samtec socket strip tht dual") (path /5BCEDA2C/5C9E764A) (fp_text reference J12 (at 2.6924 15.9766 90) (layer F.SilkS) (effects (font (size 2 2) (thickness 0.4))) ) (fp_text value PPTC062LJBN-RC (at 4.81 6.35) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 3.81 13.97) (end 3.61 13.97) (layer F.Fab) (width 0.1)) (fp_line (start -1.27 13.97) (end -1.07 13.97) (layer F.Fab) (width 0.1)) (fp_line (start 3.81 11.43) (end 3.61 11.43) (layer F.Fab) (width 0.1)) (fp_line (start -1.27 11.43) (end -1.07 11.43) (layer F.Fab) (width 0.1)) (fp_line (start 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