(kicad_pcb
	(version 20260206)
	(generator "pcbnew")
	(generator_version "10.0")
	(general
		(thickness 1.6)
		(legacy_teardrops no)
	)
	(paper "A1")
	(layers
		(0 "F.Cu" signal)
		(2 "B.Cu" signal)
		(9 "F.Adhes" user "F.Adhesive")
		(11 "B.Adhes" user "B.Adhesive")
		(13 "F.Paste" user)
		(15 "B.Paste" user)
		(5 "F.SilkS" user "F.Silkscreen")
		(7 "B.SilkS" user "B.Silkscreen")
		(1 "F.Mask" user)
		(3 "B.Mask" user)
		(17 "Dwgs.User" user "User.Drawings")
		(19 "Cmts.User" user "User.Comments")
		(21 "Eco1.User" user "User.Eco1")
		(23 "Eco2.User" user "User.Eco2")
		(25 "Edge.Cuts" user)
		(27 "Margin" user)
		(31 "F.CrtYd" user "F.Courtyard")
		(29 "B.CrtYd" user "B.Courtyard")
		(35 "F.Fab" user)
		(33 "B.Fab" user)
		(39 "User.1" user)
		(41 "User.2" user)
		(43 "User.3" user)
		(45 "User.4" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 1"
				(type "core")
				(thickness 1.51)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(copper_finish "None")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0)
		(allow_soldermask_bridges_in_footprints no)
		(tenting
			(front yes)
			(back yes)
		)
		(covering
			(front no)
			(back no)
		)
		(plugging
			(front no)
			(back no)
		)
		(capping no)
		(filling no)
		(pcbplotparams
			(layerselection 0x00000000_00000000_55555555_5755f5ff)
			(plot_on_all_layers_selection 0x00000000_00000000_00000000_00000000)
			(disableapertmacros no)
			(usegerberextensions no)
			(usegerberattributes yes)
			(usegerberadvancedattributes yes)
			(creategerberjobfile yes)
			(dashed_line_dash_ratio 12)
			(dashed_line_gap_ratio 3)
			(svgprecision 4)
			(plotframeref no)
			(mode 1)
			(useauxorigin no)
			(pdf_front_fp_property_popups yes)
			(pdf_back_fp_property_popups yes)
			(pdf_metadata yes)
			(pdf_single_document no)
			(dxfpolygonmode yes)
			(dxfimperialunits yes)
			(dxfusepcbnewfont yes)
			(psnegative no)
			(psa4output no)
			(plot_black_and_white yes)
			(sketchpadsonfab no)
			(plotpadnumbers no)
			(hidednponfab no)
			(sketchdnponfab yes)
			(crossoutdnponfab yes)
			(subtractmaskfromsilk no)
			(outputformat 1)
			(mirror no)
			(drillshape 1)
			(scaleselection 1)
			(outputdirectory "")
		)
	)
	(footprint "TestPoint:TestPoint_Pad_D1.5mm"
		(layer "F.Cu")
		(uuid "1085d5b5-c954-4468-97ae-4460cfa08206")
		(at 440.84 190.41)
		(descr "SMD pad as test Point, diameter 1.5mm")
		(tags "test point SMD pad")
		(property "Reference" "TP1"
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			(layers "F.Cu" "F.Mask")
			(net "GND")
			(pinfunction "1_1")
			(pintype "passive")
			(uuid "504ac1cc-ae85-4068-9505-782a8ca9bd1c")
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		(embedded_fonts no)
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	(footprint "Custom_Footprints:RES-TH_L12.5-W6.7-P7.50-D1.2"
		(layer "F.Cu")
		(uuid "14777f96-9254-49f5-8c4b-c848ca4d0dcb")
		(at 439.95 217.84 -90)
		(descr "10D471K")
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		(sheetname "/Relay/")
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