(kicad_pcb (version 20211014) (generator pcbnew)

  (general
    (thickness 1.6)
  )

  (paper "A4")
  (title_block
    (title "First_PCB_Design")
    (date "2022-12-03")
    (rev "A")
    (comment 4 "Author: Ethan Santhiyapillai")
  )

  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )

  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0.0508)
    (solder_mask_min_width 0.1016)
    (aux_axis_origin 118.8 144.5)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )

  (net 0 "")
  (net 1 "OutA")
  (net 2 "-INA")
  (net 3 "Net-(D1-Pad1)")
  (net 4 "Net-(D1-Pad2)")
  (net 5 "GND")
  (net 6 "Net-(D3-Pad1)")
  (net 7 "VCC")
  (net 8 "unconnected-(J1-Pad2)")
  (net 9 "unconnected-(J1-Pad3)")
  (net 10 "unconnected-(J1-Pad4)")
  (net 11 "Net-(Q1-Pad2)")
  (net 12 "Net-(R3-Pad2)")
  (net 13 "Net-(R4-Pad1)")
  (net 14 "Net-(R4-Pad2)")
  (net 15 "Net-(R5-Pad2)")

  (footprint "First_PCB_Design_Footprints:RC0603FR-07100KL" (layer "F.Cu")
    (tedit 0) (tstamp 0b9bd98b-7b56-4c6e-be7f-5e94759a17cc)
    (at 140.7853 143.29)
    (property "Sheetfile" "File: First_PCB_Design.kicad_sch")
    (property "Sheetname" "")
    (path "/4c3d856c-471a-494d-9fd9-b92aac6f9d39")
    (attr through_hole)
    (fp_text reference "R4" (at 0.11 -1.6) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 93909da3-a7ea-422c-9302-e92ecb674e35)
    )
    (fp_text value "100k" (at 0 2.1) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 5307bad0-73f7-462c-8504-b9f2deea1fa4)
    )
    (fp_line (start -0.08615 0.5334) (end 0.08615 0.5334) (layer "F.SilkS") (width 0.12) (tstamp 2ac15eda-c80a-4736-8a1e-46453f201e1a))
    (fp_line (start 0.08615 -0.5334) (end -0.08615 -0.5334) (layer "F.SilkS") (width 0.12) (tstamp b72e6de3-d2e9-4968-ac7f-392b74668f28))
    (fp_line (start -1.4097 -0.6604) (end 1.4097 -0.6604) (layer "F.CrtYd") (width 0.05) (tstamp 51afaa4f-0d1d-409a-921d-b331dbbd1ef8))
    (fp_line (start -1.4097 0.6604) (end -1.4097 -0.6604) (layer "F.CrtYd") (width 0.05) (tstamp 6de5b4cb-8cfd-43c5-807a-c96de724524a))
    (fp_line (start 1.4097 -0.6604) (end 1.4097 0.6604) (layer "F.CrtYd") (width 0.05) (tstamp c047acad-bc7f-4e03-99a5-732807f79354))
    (fp_line (start 1.4097 0.6604) (end -1.4097 0.6604) (layer "F.CrtYd") (width 0.05) (tstamp dc7af949-d967-4acf-acd8-7c745d0e998c))
    (fp_line (start 0.8001 0.4064) (end 0.8001 -0.4064) (layer "F.Fab") (width 0.1) (tstamp 048a2072-f77f-40f8-8219-8c75f62386f0))
    (fp_line (start -0.3937 0.4064) (end -0.3937 -0.4064) (layer "F.Fab") (width 0.1) (tstamp 0c1213c4-c944-47c9-abe6-0c46ae466ea5))
    (fp_line (start -0.3937 -0.4064) (end -0.8001 -0.4064) (layer "F.Fab") (width 0.1) (tstamp 15f4661b-5c10-4533-a1c4-c3396f57bee3))
    (fp_line (start -0.8001 0.4064) (end -0.3937 0.4064) (layer "F.Fab") (width 0.1) (tstamp 3250ec4f-9485-400b-9fd1-81d733f460b9))
    (fp_line (start 0.8001 0.4064) (end 0.8001 -0.4064) (layer "F.Fab") (width 0.1) (tstamp 497325e6-bd57-451c-a7fd-1b5d12d15429))
    (fp_line (start -0.8001 -0.4064) (end -0.8001 0.4064) (layer "F.Fab") (width 0.1) (tstamp 6ed3f1dc-c655-4d8b-a3e2-fe7339b5c6bd))
    (fp_line (start 0.3937 -0.4064) (end 0.3937 0.4064) (layer "F.Fab") (width 0.1) (tstamp 8e0137b1-f724-4d7f-89ff-e523193ef101))
    (fp_line (start -0.8001 0.4064) (end 0.8001 0.4064) (layer "F.Fab") (width 0.1) (tstamp 90186311-e094-4ab0-ad25-b9bf329cab35))
    (fp_line (start 0.8001 -0.4064) (end -0.8001 -0.4064) (layer "F.Fab") (width 0.1) (tstamp a136aff7-3697-4855-903e-0320b63d78d2))
    (fp_line (start 0.8001 -0.4064) (end 0.3937 -0.4064) (layer "F.Fab") (width 0.1) (tstamp c155ba5a-434c-4b39-ba38-7fd789af9f33))
    (fp_line (start -0.8001 -0.4064) (end -0.8001 0.4064) (layer "F.Fab") (width 0.1) (tstamp d0b86f74-b08e-4fce-b28d-2bf8b98bf978))
    (fp_line (start 0.3937 0.4064) (end 0.8001 0.4064) (layer "F.Fab") (width 0.1) (tstamp fa4ae9e0-de10-4677-a131-412b9ffea698))
    (pad "1" smd rect (at -0.7747 0) (size 0.762 0.8128) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "Net-(R4-Pad1)") (pintype "passive") (tstamp 2df14dd7-2cc4-485e-a262-08628294e6f0))
    (pad "2" smd rect (at 0.7747 0) (size 0.762 0.8128) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "Net-(R4-Pad2)") (pintype "passive") (tstamp e585f48c-85d7-461f-a458-152c5bc53523))
  )

  (footprint "First_PCB_Design_Footprints:MOLEX_47346-0001" (layer "F.Cu")
    (tedit 638AB859) (tstamp 22270d0a-de71-4dce-804f-bb3c3f3da081)
    (at 120.3 139.55 -90)
    (property "Sheetfile" "File: First_PCB_Design.kicad_sch")
    (property "Sheetname" "")
    (path "/9eb0b23d-9fe4-4955-8a2e-769618337110")
    (attr through_hole)
    (fp_text reference "J1" (at -5.9625 -0.31) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 200bdf92-e3d0-4671-b2ae-2e014905e653)
    )
    (fp_text value "USB_B_Micro" (at 0.025 4.75 90) (layer "F.Fab") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp f7486a6f-2fe9-4553-b6d3-7409d94f0bb3)
    )
    (fp_text user "PCB EDGE" (at 4.5 1.25 90) (layer "F.Fab")
      (effects (font (size 0.32 0.32) (thickness 0.15)))
      (tstamp 8d24a20f-ce73-4b6a-b101-846fc5f002f2)
    )
    (fp_line (start -3.75 -2.85) (end -3.52 -2.85) (layer "F.SilkS") (width 0.127) (tstamp 3b9467b1-0a94-4e98-b1ad-0b29c0f4e977))
    (fp_line (start 3.75 -2.85) (end 3.52 -2.85) (layer "F.SilkS") (width 0.127) (tstamp 423218c6-65fc-4892-888a-bd0601ad07ce))
    (fp_line (start -3.75 -2.85) (end -3.75 -1) (layer "F.SilkS") (width 0.127) (tstamp 54988c01-2943-4109-892f-c8b08f3f1d08))
    (fp_line (start 3.75 -2.85) (end 3.75 -1) (layer "F.SilkS") (width 0.127) (tstamp bd062c87-3545-4c8b-b63b-b5724881da71))
    (fp_circle (center -1.3 -4.1) (end -1.2 -4.1) (layer "F.SilkS") (width 0.2) (fill none) (tstamp 10251e85-a7f9-4b88-9d9a-b14803fb36e3))
    (fp_line (start -4.45 2.83) (end -4.45 -3.6) (layer "F.CrtYd") (width 0.05) (tstamp 245b2b28-15f2-4199-815b-c8f6a5db9eb3))
    (fp_line (start 4.45 -3.6) (end 4.45 2.83) (layer "F.CrtYd") (width 0.05) (tstamp 52990b7e-029b-48a8-84a0-d0aa679b8976))
    (fp_line (start 4.45 2.83) (end -4.45 2.83) (layer "F.CrtYd") (width 0.05) (tstamp 7a9ffba5-b3d8-4d83-82a6-2abc1b871991))
    (fp_line (start -4.45 -3.6) (end 4.45 -3.6) (layer "F.CrtYd") (width 0.05) (tstamp fae2941f-838b-4e1b-9742-5350249f7768))
    (fp_line (start 3.75 -2.85) (end 3.75 2.58) (layer "F.Fab") (width 0.127) (tstamp 0907a58f-d5ce-4397-ae5e-6d2894444df3))
    (fp_line (start -6 1.45) (end 6 1.45) (layer "F.Fab") (width 0.127) (tstamp 3c2d9580-1d7b-4af9-bc44-f820834e9682))
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    (fp_line (start -3.75 2.58) (end -3.75 -2.85) (layer "F.Fab") (width 0.127) (tstamp bc57f4bf-ca82-4ec9-9e18-c3e95457e803))
    (fp_circle (center -1.3 -4.1) (end -1.2 -4.1) (layer "F.Fab") (width 0.2) (fill none) (tstamp 1d3b2cc8-be73-45bf-b864-4f3a3433a6d3))
    (pad "1" smd rect (at -1.3 -2.66 270) (size 0.45 1.38) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 7 "VCC") (pinfunction "VBUS") (pintype "power_out") (tstamp 882f7f6d-405b-4c0c-a0ce-3c89a11856ed))
    (pad "2" smd rect (at -0.65 -2.66 270) (size 0.45 1.38) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 8 "unconnected-(J1-Pad2)") (pinfunction "D-") (pintype "bidirectional+no_connect") (tstamp 06bbf586-4b4e-427c-b781-23d56fb3263f))
    (pad "3" smd rect (at 0 -2.66 270) (size 0.45 1.38) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 9 "unconnected-(J1-Pad3)") (pinfunction "D+") (pintype "bidirectional+no_connect") (tstamp aa366981-de75-4ad4-8178-e5391bd03cf7))
    (pad "4" smd rect (at 0.65 -2.66 270) (size 0.45 1.38) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 10 "unconnected-(J1-Pad4)") (pinfunction "ID") (pintype "passive+no_connect") (tstamp 2be273f9-5ed8-4a55-9711-891808a29b1c))
    (pad "5" smd rect (at 1.3 -2.66 270) (size 0.45 1.38) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 5 "GND") (pinfunction "GND") (pintype "power_out") (tstamp 39da0591-7708-432e-a917-0bdaf371dcdd))
    (pad "S1" smd rect (at -2.4875 -2.575 270) (size 1.425 1.55) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 91879884-80e7-4e73-986d-8dcfbb948533))
    (pad "S2" smd rect (at 2.4875 -2.575 270) (size 1.425 1.55) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 22abd18a-f5d6-459f-8537-6f68c2af52ee))
    (pad "S3" smd rect (at -3.375 0 270) (size 1.65 1.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0e753c49-54bf-4bb2-b047-7d214db53873))
    (pad "S4" smd rect (at -1.15 0 270) (size 1.8 1.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5d2b8bd4-81cc-4a80-b75c-e680ad615fb2))
    (pad "S5" smd rect (at 1.55 0 270) (size 1 1.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4d00a6bc-a8df-4278-a2a4-713379c41593))
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  )

  (footprint "First_PCB_Design_Footprints:RNCP1206FTD100R" (layer "F.Cu")
    (tedit 0) (tstamp 4b60f403-8700-403d-acd8-cd6aa26ab94c)
    (at 136.5 131.25 90)
    (property "Sheetfile" "File: First_PCB_Design.kicad_sch")
    (property "Sheetname" "")
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    (attr through_hole)
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      (tstamp 7069c25a-2c1f-4eb1-a7e3-607f013e82ec)
    )
    (fp_text user "Copyright 2021 Accelerated Designs. All rights reserved." (at 0 0 90) (layer "Cmts.User")
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    (pad "1" smd rect (at -1.2954 0 90) (size 1.1176 1.7018) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "Net-(Q1-Pad2)") (pintype "passive") (tstamp 5315c399-95be-488d-b218-e37475b5d8cf))
    (pad "2" smd rect (at 1.2954 0 90) (size 1.1176 1.7018) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "Net-(D1-Pad2)") (pintype "passive") (tstamp 11af7cdc-eb4d-4483-9653-5bbd0c9c09cd))
  )

  (footprint "First_PCB_Design_Footprints:SS8050-G" (layer "F.Cu")
    (tedit 0) (tstamp 6663fdc8-4a3a-49d6-94e1-c7e1588d1cfa)
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    (property "Sheetname" "")
    (path "/0c05656d-ac24-497f-bddc-25981f4cf2b8")
    (attr smd)
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      (tstamp 7e8aacae-4911-4138-a75c-1fed6b58e564)
    )
    (fp_text value "SS8050-G" (at 0.01 2.68 270 unlocked) (layer "F.Fab") hide
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    (fp_text user "${REFERENCE}" (at 0.01 4.26 90 unlocked) (layer "F.Fab") hide
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