(kicad_pcb
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(general
		(thickness 0.57)
		(legacy_teardrops no)
	)
	(paper "A4")
	(title_block
		(title "Cap Sense Matrix")
		(date "2025-07-18")
		(rev "1")
		(company "Human Computer Integration Lab")
	)
	(layers
		(0 "F.Cu" signal)
		(2 "B.Cu" signal)
		(9 "F.Adhes" user "F.Adhesive")
		(11 "B.Adhes" user "B.Adhesive")
		(13 "F.Paste" user)
		(15 "B.Paste" user)
		(5 "F.SilkS" user "F.Silkscreen")
		(7 "B.SilkS" user "B.Silkscreen")
		(1 "F.Mask" user)
		(3 "B.Mask" user)
		(17 "Dwgs.User" user "User.Drawings")
		(19 "Cmts.User" user "User.Comments")
		(21 "Eco1.User" user "User.Eco1")
		(23 "Eco2.User" user "User.Eco2")
		(25 "Edge.Cuts" user)
		(27 "Margin" user)
		(31 "F.CrtYd" user "F.Courtyard")
		(29 "B.CrtYd" user "B.Courtyard")
		(35 "F.Fab" user)
		(33 "B.Fab" user)
		(39 "User.1" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
				(color "White")
				(material "Liquid Photo")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(color "#80808000")
				(thickness 0.01)
				(material "Epoxy")
				(epsilon_r 3.3)
				(loss_tangent 0)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 1"
				(type "core")
				(thickness 0.48)
				(material "Kapton")
				(epsilon_r 3.2)
				(loss_tangent 0.004)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(color "#80808000")
				(thickness 0.01)
				(material "Epoxy")
				(epsilon_r 3.3)
				(loss_tangent 0)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
				(color "White")
				(material "Liquid Photo")
			)
			(copper_finish "None")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0)
		(allow_soldermask_bridges_in_footprints no)
		(tenting front back)
		(aux_axis_origin 71.2328 93.362)
		(grid_origin 71.2328 93.362)
		(pcbplotparams
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			(plot_on_all_layers_selection 0x00000000_00000000_00000000_00000000)
			(disableapertmacros no)
			(usegerberextensions no)
			(usegerberattributes yes)
			(usegerberadvancedattributes yes)
			(creategerberjobfile yes)
			(dashed_line_dash_ratio 12.000000)
			(dashed_line_gap_ratio 3.000000)
			(svgprecision 6)
			(plotframeref no)
			(mode 1)
			(useauxorigin no)
			(hpglpennumber 1)
			(hpglpenspeed 20)
			(hpglpendiameter 15.000000)
			(pdf_front_fp_property_popups yes)
			(pdf_back_fp_property_popups yes)
			(pdf_metadata yes)
			(pdf_single_document no)
			(dxfpolygonmode yes)
			(dxfimperialunits yes)
			(dxfusepcbnewfont yes)
			(psnegative no)
			(psa4output no)
			(plot_black_and_white yes)
			(sketchpadsonfab no)
			(plotpadnumbers no)
			(hidednponfab no)
			(sketchdnponfab yes)
			(crossoutdnponfab yes)
			(subtractmaskfromsilk no)
			(outputformat 1)
			(mirror no)
			(drillshape 0)
			(scaleselection 1)
			(outputdirectory "production/ca_touch_matrix-${REVISION}")
		)
	)
	(net 0 "")
	(net 1 "/CAP_2")
	(net 2 "/CAP_15")
	(net 3 "/CAP_8")
	(net 4 "/CAP_3")
	(net 5 "/CAP_6")
	(net 6 "/CAP_12")
	(net 7 "/CAP_4")
	(net 8 "/CAP_16")
	(net 9 "/CAP_5")
	(net 10 "/CAP_9")
	(net 11 "/CAP_10")
	(net 12 "/CAP_13")
	(net 13 "/CAP_14")
	(net 14 "/CAP_7")
	(net 15 "/CAP_1")
	(net 16 "/CAP_11")
	(footprint "TestPoint:TestPoint_Pad_D2.0mm"
		(layer "F.Cu")
		(uuid "06fbf5fa-cbfc-46cc-8614-dd69be7ac2f3")
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		(descr "SMD pad as test Point, diameter 2.0mm")
		(tags "test point SMD pad")
		(property "Reference" "TP15"
			(at 0 -1.998 0)
			(layer "F.SilkS")
			(hide yes)
			(uuid "9f26b7a7-064f-4550-9912-2d95044eca36")
			(effects
				(font
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		(attr exclude_from_pos_files)
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		)
		(pad "1" smd circle
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			(layers "F.Cu" "F.Mask")
			(net 1 "/CAP_2")
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			(uuid "07862ad1-2dca-4925-bbcc-7dd84dcdd0a2")
		)
		(embedded_fonts no)
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	(footprint "TestPoint:TestPoint_Pad_D2.0mm"
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		(uuid "165deee3-8b70-4196-95d8-c97d5c14d5e0")
		(at 192.2328 101.862)
		(descr "SMD pad as test Point, diameter 2.0mm")
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		(property "Reference" "TP5"
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			(layer "F.SilkS")
			(hide yes)
			(uuid "a7d0edc6-1034-40f8-b23d-07888e054e0a")
			(effects
				(font
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		(property "Value" "TestPoint"
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		(sheetfile "stim_ring_16ch.kicad_sch")
		(attr exclude_from_pos_files)
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			(end 0 1.2)
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			(layer "F.CrtYd")
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		)
		(pad "1" smd circle
			(at 0 0)
			(size 2 2)
			(layers "F.Cu" "F.Mask")
			(net 6 "/CAP_12")
			(pinfunction "1")
			(pintype "passive")
			(uuid "0b7cd868-9330-497e-9d40-cdc19b941b2b")
		)
		(embedded_fonts no)
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	(footprint "TestPoint:TestPoint_Pad_D2.0mm"
		(layer "F.Cu")
		(uuid "19d6504d-947d-4ce6-869a-1d418487fac2")
		(at 196.2328 101.862)
		(descr "SMD pad as test Point, diameter 2.0mm")
		(tags "test point SMD pad")
		(property "Reference" "TP6"
			(at 0 -1.998 0)
			(layer "F.SilkS")
			(hide yes)
			(uuid "10bf887b-2740-4a9f-bd5a-91684c86f8ad")
			(effects
				(font
					(size 1 1)
					(thickness 0.15)
				)
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		)
		(property "Value" "TestPoint"
			(at 0 2.05 0)
			(layer "F.Fab")
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		(pad "1" smd circle
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		(embedded_fonts no)
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