(kicad_pcb
	(version 20260206)
	(generator "pcbnew")
	(generator_version "10.0")
	(general
		(thickness 1.6)
		(legacy_teardrops no)
	)
	(paper "A4")
	(title_block
		(title "Sensor Package")
		(date "2026-06-25")
		(rev "3")
		(company "Kettering University")
	)
	(layers
		(0 "F.Cu" signal)
		(4 "In1.Cu" signal)
		(6 "In2.Cu" signal)
		(2 "B.Cu" signal)
		(9 "F.Adhes" user "F.Adhesive")
		(11 "B.Adhes" user "B.Adhesive")
		(13 "F.Paste" user)
		(15 "B.Paste" user)
		(5 "F.SilkS" user "F.Silkscreen")
		(7 "B.SilkS" user "B.Silkscreen")
		(1 "F.Mask" user)
		(3 "B.Mask" user)
		(17 "Dwgs.User" user "User.Drawings")
		(19 "Cmts.User" user "User.Comments")
		(21 "Eco1.User" user "User.Eco1")
		(23 "Eco2.User" user "User.Eco2")
		(25 "Edge.Cuts" user)
		(27 "Margin" user)
		(31 "F.CrtYd" user "F.Courtyard")
		(29 "B.CrtYd" user "B.Courtyard")
		(35 "F.Fab" user)
		(33 "B.Fab" user)
		(39 "User.1" user)
		(41 "User.2" user)
		(43 "User.3" user)
		(45 "User.4" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 1"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 2"
				(type "core")
				(thickness 1.24)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 3"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(copper_finish "None")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0)
		(allow_soldermask_bridges_in_footprints no)
		(tenting
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			(back yes)
		)
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			(back no)
		)
		(plugging
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		)
		(capping no)
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		(zone_defaults)
		(pcbplotparams
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			(usegerberadvancedattributes yes)
			(creategerberjobfile yes)
			(dashed_line_dash_ratio 12)
			(dashed_line_gap_ratio 3)
			(svgprecision 4)
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			(mode 1)
			(useauxorigin no)
			(pdf_front_fp_property_popups yes)
			(pdf_back_fp_property_popups yes)
			(pdf_metadata yes)
			(pdf_single_document no)
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			(dxfimperialunits yes)
			(dxfusepcbnewfont yes)
			(psnegative no)
			(psa4output no)
			(plot_black_and_white yes)
			(sketchpadsonfab no)
			(plotpadnumbers no)
			(hidednponfab no)
			(sketchdnponfab yes)
			(crossoutdnponfab yes)
			(subtractmaskfromsilk no)
			(outputformat 1)
			(mirror no)
			(drillshape 1)
			(scaleselection 1)
			(outputdirectory "")
		)
	)
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		(units
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		(pad "1" smd roundrect
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			(layers "F.Cu" "F.Mask")
			(roundrect_rratio 0.25)
			(net "/3V3")
			(pintype "passive")
			(uuid "b364a5ec-3d87-410a-8b95-5a8c7ce80042")
		)
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			(net "Net-(U5-PGOOD)")
			(pintype "passive")
			(uuid "5f338797-eb53-4893-938d-9b21113732c9")
		)
		(embedded_fonts no)
		(model "${KICAD10_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_01005_0402Metric.step"
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			(scale
				(xyz 1 1 1)
			)
			(rotate
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			)
		)
	)
	(footprint "TestPoint:TestPoint_Pad_1.0x1.0mm"
		(layer "F.Cu")
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		(at 168.14 99.45 90)
		(descr "SMD rectangular pad as test Point, square 1.0mm side length")
		(tags "test point SMD pad rectangle square")
		(property "Reference" "TP4"
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