(kicad_pcb
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(general
		(thickness 1.6)
		(legacy_teardrops no)
	)
	(paper "A5")
	(layers
		(0 "F.Cu" signal)
		(2 "B.Cu" signal)
		(9 "F.Adhes" user "F.Adhesive")
		(11 "B.Adhes" user "B.Adhesive")
		(13 "F.Paste" user)
		(15 "B.Paste" user)
		(5 "F.SilkS" user "F.Silkscreen")
		(7 "B.SilkS" user "B.Silkscreen")
		(1 "F.Mask" user)
		(3 "B.Mask" user)
		(17 "Dwgs.User" user "User.Drawings")
		(19 "Cmts.User" user "User.Comments")
		(21 "Eco1.User" user "User.Eco1")
		(23 "Eco2.User" user "User.Eco2")
		(25 "Edge.Cuts" user)
		(27 "Margin" user)
		(31 "F.CrtYd" user "F.Courtyard")
		(29 "B.CrtYd" user "B.Courtyard")
		(35 "F.Fab" user)
		(33 "B.Fab" user)
		(39 "User.1" user)
		(41 "User.2" user)
		(43 "User.3" user)
		(45 "User.4" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 1"
				(type "core")
				(thickness 1.51)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(copper_finish "None")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0)
		(allow_soldermask_bridges_in_footprints no)
		(tenting front back)
		(pcbplotparams
			(layerselection 0x00000000_00000000_55555555_57555551)
			(plot_on_all_layers_selection 0x00000000_00000000_00000000_02000001)
			(disableapertmacros no)
			(usegerberextensions no)
			(usegerberattributes yes)
			(usegerberadvancedattributes yes)
			(creategerberjobfile yes)
			(dashed_line_dash_ratio 12.000000)
			(dashed_line_gap_ratio 3.000000)
			(svgprecision 6)
			(plotframeref no)
			(mode 1)
			(useauxorigin no)
			(hpglpennumber 1)
			(hpglpenspeed 20)
			(hpglpendiameter 15.000000)
			(pdf_front_fp_property_popups yes)
			(pdf_back_fp_property_popups yes)
			(pdf_metadata yes)
			(pdf_single_document no)
			(dxfpolygonmode yes)
			(dxfimperialunits yes)
			(dxfusepcbnewfont yes)
			(psnegative no)
			(psa4output no)
			(plot_black_and_white yes)
			(sketchpadsonfab yes)
			(plotpadnumbers no)
			(hidednponfab no)
			(sketchdnponfab no)
			(crossoutdnponfab no)
			(subtractmaskfromsilk no)
			(outputformat 5)
			(mirror yes)
			(drillshape 2)
			(scaleselection 1)
			(outputdirectory "")
		)
	)
	(net 0 "")
	(net 1 "Net-(J1-Pad3)")
	(net 2 "Net-(J1-Pad5)")
	(net 3 "Net-(J1-Pad1)")
	(net 4 "Net-(J1-Pad4)")
	(net 5 "Net-(J3-Pad2)")
	(net 6 "Net-(J3-Pad1)")
	(net 7 "Net-(J3-Pad4)")
	(net 8 "Net-(J3-Pad3)")
	(net 9 "Net-(J1-Pad6)")
	(net 10 "unconnected-(J1-Pad2)")
	(footprint "VacuumTubes:IV-9-Common-Separated"
		(layer "F.Cu")
		(uuid "535f4d28-0a44-4dda-aa02-7796b8309a7f")
		(at 106.846 48.6)
		(descr "IV-9 Numitron")
		(property "Reference" "U$1"
			(at -0.174 0.048 0)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
			(uuid "090047da-5412-494a-b58d-40072313515c")
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					(thickness 0.127)
				)
			)
		)
		(property "Value" "IV-9"
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			(layer "F.Fab")
			(uuid "982d3d90-f858-42af-90eb-bfb60f0df91f")
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				)
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			(layer "F.Fab")
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			(uuid "74ad4bdb-541f-4daa-833f-89a84360beba")
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			(hide yes)
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		(path "/724e8168-439e-4be4-8021-c139911be367")
		(sheetname "/")
		(sheetfile "external-iv9-socket.kicad_sch")
		(fp_circle
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			(end 3.1544 0)
			(stroke
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				(type solid)
			)
			(fill no)
			(layer "F.Fab")
			(uuid "f378678d-2ddb-4d5d-b7d0-c958f31efa51")
		)
		(fp_circle
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			(end 5.25 0)
			(stroke
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				(type solid)
			)
			(fill no)
			(layer "F.Fab")
			(uuid "ad996e89-4158-480b-9663-598970163f86")
		)
		(pad "1" thru_hole circle
			(at -1.5 4.7)
			(size 1.308 1.308)
			(drill 0.8)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 3 "Net-(J1-Pad1)")
			(pinfunction "1")
			(pintype "bidirectional")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
			(teardrops
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				(max_length 1)
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				(max_width 2)
				(curved_edges no)
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				(enabled yes)
				(allow_two_segments yes)
				(prefer_zone_connections yes)
			)
			(uuid "f1d9cca1-a9a2-40c3-b179-42e518d0629a")
		)
		(pad "1" connect circle
			(at -0.9 2.9)
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			(net 3 "Net-(J1-Pad1)")
			(pinfunction "1")
			(pintype "bidirectional")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
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				(max_length 1)
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				(enabled yes)
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			)
			(uuid "befce4f1-6329-4f16-b7fd-eeca5c37a187")
		)
		(pad "2" connect circle
			(at 1.9 2.5)
			(size 1.308 1.308)
			(layers "F.Cu" "F.Mask")
			(net 1 "Net-(J1-Pad3)")
			(pinfunction "2")
			(pintype "bidirectional")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
			(teardrops
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			)
			(uuid "f82d69b5-6bfc-4f32-b727-68592bd47c61")
		)
		(pad "2" thru_hole circle
			(at 2.9 3.8)
			(size 1.308 1.308)
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			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 1 "Net-(J1-Pad3)")
			(pinfunction "2")
			(pintype "bidirectional")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
			(teardrops
				(best_length_ratio 0.5)
				(max_length 1)
				(best_width_ratio 1)
				(max_width 2)
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				(enabled yes)
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				(prefer_zone_connections yes)
			)
			(uuid "801e0483-79f1-4dbf-9f05-fcbce68575a7")
		)
		(pad "3" connect circle
			(at 3.0459 0.9228)
			(size 1.308 1.308)
			(layers "F.Cu" "F.Mask")
			(net 4 "Net-(J1-Pad4)")
			(pinfunction "3")
			(pintype "bidirectional")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
			(teardrops
				(best_length_ratio 0.5)
				(max_length 1)
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				(enabled yes)
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			)
			(uuid "4695dedc-9dcc-4967-b955-013b6fc8f31b")
		)
		(pad "3" thru_hole circle
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			(size 1.308 1.308)
			(drill 0.8)
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			(remove_unused_layers no)
			(net 4 "Net-(J1-Pad4)")
			(pinfunction "3")
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			(solder_mask_margin 0.1016)
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			(uuid "80bef46c-d7c2-4c56-b2f8-247b7ebaa6f9")
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			(size 1.308 1.308)
			(layers "F.Cu" "F.Mask")
			(net 2 "Net-(J1-Pad5)")
			(pinfunction "4")
			(pintype "bidirectional")
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			(thermal_bridge_angle 0)
			(teardrops
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		(pad "4" thru_hole circle
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			(layers "*.Cu" "*.Mask")
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			(pinfunction "4")
			(pintype "bidirectional")
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			(thermal_bridge_angle 0)
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			(layers "F.Cu" "F.Mask")
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			(pintype "bidirectional")
			(solder_mask_margin 0.1016)
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			(remove_unused_layers no)
			(net 9 "Net-(J1-Pad6)")
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			(net 6 "Net-(J3-Pad1)")
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