(kicad_pcb (version 20240101) (generator pcbnew)
  (general (thickness 1.6))
  (paper "A4")
  (title_block
    (title "SENSORHAT-1") (date "2026") (rev "I")
    (comment_1 "Serenity-Class Tiltrotor UAV — 8-Node Rev I")
    (comment_2 "CC BY 4.0 creativecommons.org/licenses/by/4.0")
    (comment_3 "XIAO RP2350 sensor hat 46x36mm 4L — all buses isolated")
    (comment_4 "Hull: Peter Farell CC BY 4.0 | Nozzle: BamJr CC BY 4.0 | Firefly/Serenity fan-work, not officially licensed")
  )
  (layers
    (0 "F.Cu" signal) (1 "In1.Cu" power) (2 "In2.Cu" power) (31 "B.Cu" signal)
    (34 "B.Paste" user) (35 "F.Paste" user) (36 "B.SilkS" user) (37 "F.SilkS" user)
    (38 "B.Mask" user) (39 "F.Mask" user) (44 "Edge.Cuts" user)
  )
  (setup (pad_to_mask_clearance 0.1))
  (net 0 "")
  (net 1 "+3V3")
  (net 2 "+5V")
  (net 3 "GND")
  (net 4 "SPI0_SCK")
  (net 5 "SPI0_MOSI")
  (net 6 "SPI0_MISO")
  (net 7 "SPI0_CS_IMU")
  (net 8 "SPI0_CS_CAN")
  (net 9 "SPI0_CS_TPM")
  (net 10 "SPI0_CS_1553")
  (net 11 "SPI1_SCK")
  (net 12 "SPI1_MOSI")
  (net 13 "SPI1_MISO")
  (net 14 "SPI1_CS_ETH")
  (net 15 "I2C1_SDA")
  (net 16 "I2C1_SCL")
  (net 17 "UART0_TX")
  (net 18 "UART0_RX")
  (net 19 "UART1_TX")
  (net 20 "UART1_RX")
  (net 21 "RS485_DE")
  (net 22 "DSHOT_L")
  (net 23 "DSHOT_R")
  (net 24 "DSHOT_FWD")
  (net 25 "LED_WS2812")
  (net 26 "CAN_INT")
  (net 27 "ETH_INT")
  (net 28 "TPM_IRQ")
  (net 29 "M1553_IRQ")
  (net 30 "M1553_RST")
  (net 31 "CANH")
  (net 32 "CANL")
  (net 33 "RS485_A")
  (net 34 "RS485_B")
  (net 35 "ETH_TX_P")
  (net 36 "ETH_TX_N")
  (net 37 "ETH_RX_P")
  (net 38 "ETH_RX_N")
  (net 39 "BUS_A_P")
  (net 40 "BUS_A_N")
  (net 41 "GPS_TX")
  (net 42 "GPS_RX")
  (net 43 "ISO_VCC_CAN")
  (net 44 "ISO_VCC_RS4")
  (net 45 "ISO_VCC_1553")
  (gr_line (start 0 0) (end 46 0) (layer "Edge.Cuts") (width 0.05))
  (gr_line (start 46 0) (end 46 36) (layer "Edge.Cuts") (width 0.05))
  (gr_line (start 46 36) (end 0 36) (layer "Edge.Cuts") (width 0.05))
  (gr_line (start 0 36) (end 0 0) (layer "Edge.Cuts") (width 0.05))
  (footprint "MountingHole:MountingHole_2.7mm_M2.5" (layer "F.Cu") (at 3 3)
    (pad "" thru_hole circle (at 0 0) (size 2.7 2.7) (drill 2.7) (layers "*.Cu" "*.Mask")))
  (footprint "MountingHole:MountingHole_2.7mm_M2.5" (layer "F.Cu") (at 43 3)
    (pad "" thru_hole circle (at 0 0) (size 2.7 2.7) (drill 2.7) (layers "*.Cu" "*.Mask")))
  (footprint "MountingHole:MountingHole_2.7mm_M2.5" (layer "F.Cu") (at 3 33)
    (pad "" thru_hole circle (at 0 0) (size 2.7 2.7) (drill 2.7) (layers "*.Cu" "*.Mask")))
  (footprint "MountingHole:MountingHole_2.7mm_M2.5" (layer "F.Cu") (at 43 33)
    (pad "" thru_hole circle (at 0 0) (size 2.7 2.7) (drill 2.7) (layers "*.Cu" "*.Mask")))
  (footprint "XIAO_RP2350_Castellated" (layer "F.Cu") (at 12 10) (property "Description" "Seeed XIAO RP2350 direct solder")
    (fp_text reference "U_XIAO" (at 0 -11) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "XIAO-RP2350" (at 0 11) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -10.5 -8.75) (xy 10.5 -8.75) (xy 10.5 8.75) (xy -10.5 8.75))
     (layer "F.CrtYd") (width 0.05))
    (pad "D0/GP26" smd rect (at -10.5 -7.05) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "D1/GP27" smd rect (at -10.5 -4.85) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "D2/GP28" smd rect (at -10.5 -2.65) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "D3/GP29" smd rect (at -10.5 -0.45) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "D4/GP6" smd rect (at -10.5 1.75) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "D5/GP7" smd rect (at -10.5 3.95) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "D6/GP0" smd rect (at -10.5 6.15) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "D7/GP1" smd rect (at -10.5 8.35) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "D8/GP2" smd rect (at 10.5 7.05) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "D9/GP3" smd rect (at 10.5 4.85) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "D10/GP4" smd rect (at 10.5 2.65) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "D11/GP5" smd rect (at 10.5 0.45) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "D12/GP8" smd rect (at 10.5 -1.75) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "D13/GP9" smd rect (at 10.5 -3.95) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "D14/GP10" smd rect (at 10.5 -6.15) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "D15/GP11" smd rect (at 10.5 -8.35) (size 1.6 1.0) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "USB_C" smd rect (at 0 -9.5) (size 9 2.5) (layers "F.Cu" "F.Paste" "F.Mask"))
  )
  (footprint "Package" (layer "F.Cu") (at 32 8) (property "Description" "16-bit I2C GPIO expander QFN-28")
    (fp_text reference "U_EXP" (at 0 -3.8) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "MCP23017" (at 0 3.8) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -2.25 -2.25) (xy 2.25 -2.25)
              (xy 2.25 2.25) (xy -2.25 2.25))
     (layer "F.CrtYd") (width 0.05))
    (pad "1" smd rect (at -2.25 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "EP" smd rect (at 0 0) (size 2.70 2.70) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "Package" (layer "F.Cu") (at 8 24) (property "Description" "TI ISO1042 5kV CAN FD SOIC-8")
    (fp_text reference "U_ISO_CAN" (at 0 -3.5) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "ISO1042" (at 0 3.5) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -2.50 -2.00) (xy 2.50 -2.00)
              (xy 2.50 2.00) (xy -2.50 2.00))
     (layer "F.CrtYd") (width 0.05))
    (pad "1" smd rect (at -2.50 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "EP" smd rect (at 0 0) (size 3.00 2.40) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "Package" (layer "F.Cu") (at 18 24) (property "Description" "TI ISO3086 3kV RS-485 SOIC-16")
    (fp_text reference "U_ISO_RS4" (at 0 -3.5) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "ISO3086" (at 0 3.5) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -4.95 -1.95) (xy 4.95 -1.95)
              (xy 4.95 1.95) (xy -4.95 1.95))
     (layer "F.CrtYd") (width 0.05))
    (pad "1" smd rect (at -4.95 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "EP" smd rect (at 0 0) (size 5.94 2.34) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "Package" (layer "F.Cu") (at 30 24) (property "Description" "TI ISO1540 3kV I2C FM+ SO-8")
    (fp_text reference "U_ISO_I2C" (at 0 -3.5) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "ISO1540" (at 0 3.5) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -2.50 -2.00) (xy 2.50 -2.00)
              (xy 2.50 2.00) (xy -2.50 2.00))
     (layer "F.CrtYd") (width 0.05))
    (pad "1" smd rect (at -2.50 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "EP" smd rect (at 0 0) (size 3.00 2.40) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "Package" (layer "F.Cu") (at 38 24) (property "Description" "TI ISO7241C 4kV 4ch UART SOIC-16")
    (fp_text reference "U_ISO_UART" (at 0 -3.5) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "ISO7241C" (at 0 3.5) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -4.95 -1.95) (xy 4.95 -1.95)
              (xy 4.95 1.95) (xy -4.95 1.95))
     (layer "F.CrtYd") (width 0.05))
    (pad "1" smd rect (at -4.95 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "EP" smd rect (at 0 0) (size 5.94 2.34) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "Package" (layer "F.Cu") (at 25 10) (property "Description" "Holt HI-6130 SPI 1553B BC/RT/MT TQFP-48")
    (fp_text reference "U_1553" (at 0 -5.0) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "HI-6130" (at 0 5.0) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -3.50 -3.50) (xy 3.50 -3.50)
              (xy 3.50 3.50) (xy -3.50 3.50))
     (layer "F.CrtYd") (width 0.05))
    (pad "1" smd rect (at -3.50 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "EP" smd rect (at 0 0) (size 4.20 4.20) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "Package" (layer "F.Cu") (at 38 10) (property "Description" "Bourns 1553B isolation xfmr 4.8x8mm")
    (fp_text reference "T_1553" (at 0 -3.9) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "SM-1553-11" (at 0 3.9) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -4.00 -2.40) (xy 4.00 -2.40)
              (xy 4.00 2.40) (xy -4.00 2.40))
     (layer "F.CrtYd") (width 0.05))
    (pad "1" smd rect (at -4.00 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "EP" smd rect (at 0 0) (size 4.80 2.88) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "Package" (layer "F.Cu") (at 6 8) (property "Description" "TDK InvenSense 6DOF IMU LGA-14")
    (fp_text reference "U_IMU" (at 0 -3.0) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "ICM-42688-P" (at 0 3.0) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -1.50 -1.50) (xy 1.50 -1.50)
              (xy 1.50 1.50) (xy -1.50 1.50))
     (layer "F.CrtYd") (width 0.05))
    (pad "1" smd rect (at -1.50 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "EP" smd rect (at 0 0) (size 1.80 1.80) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "Package" (layer "F.Cu") (at 6 14) (property "Description" "Bosch BMP388 barometer LGA-8")
    (fp_text reference "U_BARO" (at 0 -2.5) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "BMP388" (at 0 2.5) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -1.00 -1.00) (xy 1.00 -1.00)
              (xy 1.00 1.00) (xy -1.00 1.00))
     (layer "F.CrtYd") (width 0.05))
    (pad "1" smd rect (at -1.00 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "EP" smd rect (at 0 0) (size 1.20 1.20) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "Package" (layer "F.Cu") (at 8 30) (property "Description" "WIZnet W5500 HW TCP/IP LQFP-48")
    (fp_text reference "U_ETH" (at 0 -5.0) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "W5500" (at 0 5.0) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -3.50 -3.50) (xy 3.50 -3.50)
              (xy 3.50 3.50) (xy -3.50 3.50))
     (layer "F.CrtYd") (width 0.05))
    (pad "1" smd rect (at -3.50 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "EP" smd rect (at 0 0) (size 4.20 4.20) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "Package" (layer "F.Cu") (at 18 30) (property "Description" "Ethernet magnetics transformer")
    (fp_text reference "T_ETH" (at 0 -5.0) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "HX1188NL" (at 0 5.0) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -6.00 -3.50) (xy 6.00 -3.50)
              (xy 6.00 3.50) (xy -6.00 3.50))
     (layer "F.CrtYd") (width 0.05))
    (pad "1" smd rect (at -6.00 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "EP" smd rect (at 0 0) (size 7.20 4.20) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "Package" (layer "F.Cu") (at 28 30) (property "Description" "CAN FD controller SPI SOIC-20")
    (fp_text reference "U_CAN" (at 0 -3.5) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "MCP2518FD" (at 0 3.5) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -3.00 -2.00) (xy 3.00 -2.00)
              (xy 3.00 2.00) (xy -3.00 2.00))
     (layer "F.CrtYd") (width 0.05))
    (pad "1" smd rect (at -3.00 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "EP" smd rect (at 0 0) (size 3.60 2.40) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "Package" (layer "F.Cu") (at 38 30) (property "Description" "Dual 4:1 analog mux ESC telem SOIC-16")
    (fp_text reference "U_MUX" (at 0 -3.5) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "74HC4052" (at 0 3.5) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -4.95 -1.95) (xy 4.95 -1.95)
              (xy 4.95 1.95) (xy -4.95 1.95))
     (layer "F.CrtYd") (width 0.05))
    (pad "1" smd rect (at -4.95 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "EP" smd rect (at 0 0) (size 5.94 2.34) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "Package" (layer "F.Cu") (at 40 20) (property "Description" "TPM 2.0 SPI SOP-8")
    (fp_text reference "U_TPM" (at 0 -3.5) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "SLB9670" (at 0 3.5) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -2.00 -2.00) (xy 2.00 -2.00)
              (xy 2.00 2.00) (xy -2.00 2.00))
     (layer "F.CrtYd") (width 0.05))
    (pad "1" smd rect (at -2.00 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "EP" smd rect (at 0 0) (size 2.40 2.40) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "Package" (layer "F.Cu") (at 40 14) (property "Description" "3.3V 600mA LDO SOT-23-5")
    (fp_text reference "U_LDO" (at 0 -2.5) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "AP2112K-3.3" (at 0 2.5) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_poly (pts (xy -1.50 -1.00) (xy 1.50 -1.00)
              (xy 1.50 1.00) (xy -1.50 1.00))
     (layer "F.CrtYd") (width 0.05))
    (pad "1" smd rect (at -1.50 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "EP" smd rect (at 0 0) (size 1.80 1.20) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "JST_GH_4P" (layer "F.Cu") (at 44 5.0) (property "Description" "CAN FD IN — GND +5V CANH CANL")
    (fp_text reference "J_CAN_IN" (at 0 -3) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "JST-GH-4P" (at 0 3) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (pad "1" smd rect (at -1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "2" smd rect (at -0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "3" smd rect (at 0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "4" smd rect (at 1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "JST_GH_4P" (layer "F.Cu") (at 44 7.6) (property "Description" "CAN FD OUT — daisy chain")
    (fp_text reference "J_CAN_OUT" (at 0 -3) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "JST-GH-4P" (at 0 3) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (pad "1" smd rect (at -1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "2" smd rect (at -0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "3" smd rect (at 0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "4" smd rect (at 1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "JST_GH_4P" (layer "F.Cu") (at 44 10.2) (property "Description" "RS-485 IN — GND +5V A+ B-")
    (fp_text reference "J_RS485_IN" (at 0 -3) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "JST-GH-4P" (at 0 3) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (pad "1" smd rect (at -1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "2" smd rect (at -0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "3" smd rect (at 0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "4" smd rect (at 1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "JST_GH_4P" (layer "F.Cu") (at 44 12.8) (property "Description" "RS-485 OUT — daisy chain")
    (fp_text reference "J_RS485_OUT" (at 0 -3) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "JST-GH-4P" (at 0 3) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (pad "1" smd rect (at -1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "2" smd rect (at -0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "3" smd rect (at 0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "4" smd rect (at 1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "JST_GH_4P" (layer "F.Cu") (at 44 15.4) (property "Description" "1553 IN — GND SHLD BUS_A+ BUS_A-")
    (fp_text reference "J_1553_IN" (at 0 -3) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "JST-GH-4P" (at 0 3) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (pad "1" smd rect (at -1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "2" smd rect (at -0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "3" smd rect (at 0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "4" smd rect (at 1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "JST_GH_4P" (layer "F.Cu") (at 44 18.0) (property "Description" "1553 OUT — daisy chain")
    (fp_text reference "J_1553_OUT" (at 0 -3) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "JST-GH-4P" (at 0 3) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (pad "1" smd rect (at -1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "2" smd rect (at -0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "3" smd rect (at 0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "4" smd rect (at 1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "JST_GH_6P" (layer "F.Cu") (at 44 20.6) (property "Description" "Ethernet — to Murex switch")
    (fp_text reference "J_ETH" (at 0 -3) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "JST-GH-6P" (at 0 3) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (pad "1" smd rect (at -3.125 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "2" smd rect (at -1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "3" smd rect (at -0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "4" smd rect (at 0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "5" smd rect (at 1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "6" smd rect (at 3.125 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "JST_GH_4P" (layer "F.Cu") (at 44 23.2) (property "Description" "I2C expansion bus")
    (fp_text reference "J_I2C" (at 0 -3) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "JST-GH-4P" (at 0 3) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (pad "1" smd rect (at -1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "2" smd rect (at -0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "3" smd rect (at 0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "4" smd rect (at 1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "JST_GH_3P" (layer "F.Cu") (at 44 25.8) (property "Description" "ESC-L telem — GND DSHOT_L TELEM_L")
    (fp_text reference "J_ESC_L" (at 0 -3) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "JST-GH-3P" (at 0 3) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (pad "1" smd rect (at -1.250 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "2" smd rect (at 0.000 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "3" smd rect (at 1.250 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "JST_GH_3P" (layer "F.Cu") (at 44 28.400000000000002) (property "Description" "ESC-R telem — GND DSHOT_R TELEM_R")
    (fp_text reference "J_ESC_R" (at 0 -3) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "JST-GH-3P" (at 0 3) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (pad "1" smd rect (at -1.250 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "2" smd rect (at 0.000 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "3" smd rect (at 1.250 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "JST_GH_3P" (layer "F.Cu") (at 44 31.0) (property "Description" "ESC-Fwd telem — GND DSHOT_F TELEM_F")
    (fp_text reference "J_ESC_F" (at 0 -3) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "JST-GH-3P" (at 0 3) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (pad "1" smd rect (at -1.250 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "2" smd rect (at 0.000 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "3" smd rect (at 1.250 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "JST_GH_4P" (layer "F.Cu") (at 44 33.6) (property "Description" "Power — GND GND +5V +5V")
    (fp_text reference "J_PWR" (at 0 -3) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "JST-GH-4P" (at 0 3) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (pad "1" smd rect (at -1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "2" smd rect (at -0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "3" smd rect (at 0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "4" smd rect (at 1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask")))
  (footprint "JST_GH_6P" (layer "F.Cu") (at 2 28) (property "Description" "GPS M10Q — GND +3V3 TX RX PPS NRST")
    (fp_text reference "J_GPS" (at 0 -3) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (fp_text value "JST-GH-6P" (at 0 3) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15))))
    (pad "1" smd rect (at -3.125 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "2" smd rect (at -1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "3" smd rect (at -0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "4" smd rect (at 0.625 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "5" smd rect (at 1.875 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "6" smd rect (at 3.125 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask")))
  (segment (start 22.5 10) (end 28 10) (width 0.15) (layer "F.Cu") (net 4))
  (segment (start 12 18.75) (end 8 24) (width 0.15) (layer "F.Cu") (net 15))
  (segment (start 22.5 10) (end 8 30) (width 0.15) (layer "In1.Cu") (net 1))
  (zone (net 3) (net_name "GND") (layer "In2.Cu") (tstamp 00000001)
    (hatch edge 0.508) (connect_pads (clearance 0.3)) (min_thickness 0.25)
    (fill yes (arc_segments 32) (thermal_gap 0.3) (thermal_bridge_width 0.3))
    (polygon (pts (xy 0 0) (xy 46 0) (xy 46 36) (xy 0 36))))
  (zone (net 1) (net_name "+3V3") (layer "In1.Cu") (tstamp 00000002)
    (hatch edge 0.508) (connect_pads (clearance 0.3)) (min_thickness 0.25)
    (fill yes (arc_segments 32) (thermal_gap 0.3) (thermal_bridge_width 0.3))
    (polygon (pts (xy 1 1) (xy 45 1) (xy 45 35) (xy 1 35))))

)