(kicad_pcb (version 20171130) (host pcbnew "(5.1.2-1)-1") (general (thickness 1.6) (drawings 76) (tracks 0) (zones 0) (modules 275) (nets 273) ) (page A4) (layers (0 Top signal) (1 VDD signal) (2 Route3 signal) (3 Route14 signal) (4 DigitalGND signal) (31 Bottom signal) (32 B.Adhes user) (33 F.Adhes user) (34 B.Paste user) (35 F.Paste user) (36 B.SilkS user) (37 F.SilkS user) (38 B.Mask user) (39 F.Mask user) (40 Dwgs.User user) (41 Cmts.User user) (42 Eco1.User user) (43 Eco2.User user) (44 Edge.Cuts user) (45 Margin user) (46 B.CrtYd user) (47 F.CrtYd user) (48 B.Fab user) (49 F.Fab user) ) (setup (last_trace_width 0.25) (trace_clearance 0.1524) (zone_clearance 0.508) (zone_45_only no) (trace_min 0.2) (via_size 0.8) (via_drill 0.4) (via_min_size 0.4) (via_min_drill 0.3) (uvia_size 0.3) (uvia_drill 0.1) (uvias_allowed no) (uvia_min_size 0.2) (uvia_min_drill 0.1) (edge_width 0.05) (segment_width 0.2) (pcb_text_width 0.3) (pcb_text_size 1.5 1.5) (mod_edge_width 0.12) (mod_text_size 1 1) (mod_text_width 0.15) (pad_size 1.524 1.524) (pad_drill 0.762) (pad_to_mask_clearance 0.051) (solder_mask_min_width 0.25) (aux_axis_origin 0 0) (visible_elements FFFFEF7F) (pcbplotparams (layerselection 0x010fc_ffffffff) (usegerberextensions false) (usegerberattributes false) (usegerberadvancedattributes false) (creategerberjobfile false) (excludeedgelayer true) (linewidth 0.100000) (plotframeref false) (viasonmask false) (mode 1) (useauxorigin false) (hpglpennumber 1) (hpglpenspeed 20) (hpglpendiameter 15.000000) (psnegative false) (psa4output false) (plotreference true) (plotvalue true) (plotinvisibletext false) (padsonsilk false) (subtractmaskfromsilk false) (outputformat 1) (mirror false) (drillshape 1) (scaleselection 1) (outputdirectory "")) ) (net 0 "") (net 1 GND) (net 2 N$6) (net 3 N$7) (net 4 SD.D3) (net 5 SD.D1) (net 6 SD.D0) (net 7 SD.D2) (net 8 SD.CLK) (net 9 SD.CMD) (net 10 N$16) (net 11 N$17) (net 12 N$18) (net 13 LCD.D15.R4--R7) (net 14 LCD.D14.R3--R6) (net 15 LCD.D13.R2--R5) (net 16 LCD.D12.R1--R4) (net 17 LCD.D11.R0--R3) (net 18 LCD.D7.G2--G4) (net 19 LCD.D6.G1--G3) (net 20 LCD.D5.G0--G2) (net 21 LCD.D10.G5--G7) (net 22 LCD.D9.G4--G6) (net 23 LCD.D8.G3--G5) (net 24 LCD.D4.B4--B7) (net 25 LCD.D3.B3--B6) (net 26 LCD.D2.B2--B5) (net 27 LCD.ENABLE) (net 28 LCD.D0.B0--B3) (net 29 LCD.D1.B1--B4) (net 30 LCD.VSYNC) (net 31 LCD.HSYNC) (net 32 LCD.CLOCK) (net 33 N$36) (net 34 N$37) (net 35 N$8) (net 36 AGND) (net 37 VDD_3V3A) (net 38 VDD_CORE) (net 39 VDD_1V8) (net 40 VDD_RTC) (net 41 VDDS_DDR) (net 42 VDDS_PLL) (net 43 VDD_MPU) (net 44 VDD_ADC) (net 45 N$11) (net 46 N$12) (net 47 NC2) (net 48 LS_BUF_OE) (net 49 BT_HCI_TX.SIP) (net 50 BT_HCI_RX.SIP) (net 51 NC4) (net 52 BT_HCI_RTS.SIP) (net 53 BT_HCI_CTS.SIP) (net 54 I2C0_SDA) (net 55 I2C0_SCL) (net 56 USB.CLIENT.D-) (net 57 USB.CLIENT.D+) (net 58 USB.CLIENT.ID) (net 59 USB_DC) (net 60 USB.HOST.D+) (net 61 USB.HOST.D-) (net 62 VDD_5V) (net 63 PWR_BUT) (net 64 VDD_3V3B) (net 65 VIN_BAT) (net 66 BAT_VOLT) (net 67 BAT_TEMP) (net 68 N$22) (net 69 SD.CD) (net 70 PMIC_PGOOD) (net 71 LDO_PGOOD) (net 72 PMIC_INT) (net 73 PMIC_NWAKEUP) (net 74 VDD_3V3AUX) (net 75 AIN0) (net 76 AIN1) (net 77 AIN2) (net 78 AIN3) (net 79 AIN4) (net 80 AIN5) (net 81 AIN6) (net 82 AIN7) (net 83 UART2_RXD) (net 84 UART2_TXD) (net 85 I2C1_SDA) (net 86 I2C1_SCL) (net 87 I2C2_SDA) (net 88 I2C2_SCL) (net 89 UART1_RXD) (net 90 UART1_TXD) (net 91 N$2) (net 92 JTAG_TRSTN) (net 93 JTAG_TMS) (net 94 JTAG_TDI) (net 95 JTAG_TCK) (net 96 JTAG_TDO) (net 97 JTAG_EMU0) (net 98 JTAG_EMU1) (net 99 CLKOUT2) (net 100 N$3) (net 101 XDMA_EVENT_INTRO) (net 102 SYS_RESET#) (net 103 TIMER5) (net 104 TIMER4) (net 105 TIMER7) (net 106 TIMER6) (net 107 UART4_RXD) (net 108 UART4_TXD) (net 109 EHRPWM2B) (net 110 EHRPWM2A) (net 111 EHRPWM1B) (net 112 EHRPWM1A) (net 113 N$28) (net 114 N$29) (net 115 N$30) (net 116 N$31) (net 117 EMMC_RSTN) (net 118 MMC1_DAT0) (net 119 MMC1_DAT1) (net 120 MMC1_DAT2) (net 121 MMC1_DAT3) (net 122 MMC1_DAT4) (net 123 MMC1_DAT5) (net 124 MMC1_DAT6) (net 125 MMC1_DAT7) (net 126 MMC1_CMD) (net 127 MMC1_CLK) (net 128 USR0) (net 129 USR1) (net 130 USR2) (net 131 USR3) (net 132 N$34) (net 133 SYS_5V) (net 134 GPIO1_28) (net 135 GPIO1_29) (net 136 GPIO2_1) (net 137 GPIO0_26) (net 138 GPIO0_27) (net 139 GPIO1_12) (net 140 GPIO1_13) (net 141 GPIO1_14) (net 142 GPIO1_15) (net 143 USB1_OC#) (net 144 GPIO1_16.SIP) (net 145 GPIO1_16) (net 146 GPIO2_0.SIP) (net 147 GPIO1_17) (net 148 HDMICLK_DIS#) (net 149 HDMI_INT) (net 150 N$4) (net 151 GPIO3_21) (net 152 SPI1_SCLK) (net 153 SPI1_D0) (net 154 SPI1_D1) (net 155 SPI1_CS0) (net 156 GPIO3_19) (net 157 N$48) (net 158 N$49) (net 159 GPIO0_7) (net 160 MCU.LCD.CLK) (net 161 MCU.LCD.VS) (net 162 MCU.LCD.HS) (net 163 MCU.LCD.EN) (net 164 N$45) (net 165 N$20) (net 166 USB1_DRVVBUS) (net 167 UART0_TXD) (net 168 UART0_RXD) (net 169 UART0_RST#) (net 170 N$50) (net 171 N$51) (net 172 N$52) (net 173 N$53) (net 174 N$54) (net 175 N$42) (net 176 12M_LOOP) (net 177 N$58) (net 178 12MHZ) (net 179 N$47) (net 180 TX->RX) (net 181 RX<-TX) (net 182 HDMI_1V8) (net 183 TEST) (net 184 DVI_5V) (net 185 HDMI.DSDA) (net 186 HDMI.DSCL) (net 187 EXT_SWING) (net 188 HPD) (net 189 CEC) (net 190 N$66) (net 191 TX2+) (net 192 TX2-) (net 193 TX1+) (net 194 TX1-) (net 195 TX0+) (net 196 TX0-) (net 197 TXC+) (net 198 TXC-) (net 199 VBUS.HOST) (net 200 VBUS.OUT) (net 201 USB1_VBUS) (net 202 N$1) (net 203 32.768KHZ) (net 204 BT_HCI_RTS) (net 205 BT_HCI_CTS) (net 206 BT_HCI_TX) (net 207 BT_HCI_RX) (net 208 WL_SDIO_CMD) (net 209 WL_SDIO_CLK) (net 210 WL_SDIO_D0) (net 211 WL_SDIO_D1) (net 212 WL_SDIO_D2) (net 213 WL_SDIO_D3) (net 214 WL_IRQ) (net 215 WL_EN) (net 216 BT_EN) (net 217 SLOW_CLK) (net 218 N$5) (net 219 N$9) (net 220 5V_IN) (net 221 SELECT_5V) (net 222 N$13) (net 223 N$14) (net 224 N$15) (net 225 N$19) (net 226 N$33) (net 227 N$35) (net 228 N$38) (net 229 N$39) (net 230 N$40) (net 231 N$41) (net 232 N$43) (net 233 N$44) (net 234 WL_SDIO_D0.SIP) (net 235 WL_SDIO_D1.SIP) (net 236 WL_SDIO_D2.SIP) (net 237 WL_SDIO_D3.SIP) (net 238 WL_SDIO_CLK.SIP) (net 239 WL_SDIO_CMD.SIP) (net 240 WL_EN.SIP) (net 241 BT_EN.SIP) (net 242 WL_IRQ.SIP) (net 243 N$25) (net 244 N$57) (net 245 N$59) (net 246 CGND) (net 247 N$24) (net 248 N$56) (net 249 NC1) (net 250 NC3) (net 251 N$62) (net 252 N$63) (net 253 N$64) (net 254 N$65) (net 255 N$67) (net 256 N$69) (net 257 N$70) (net 258 N$93) (net 259 N$94) (net 260 N$95) (net 261 N$96) (net 262 ALT.WL.CMD) (net 263 ALT.BT.EN) (net 264 ALT.BUFF.OE) (net 265 ALT.WL.CLK) (net 266 ALT.WL.EN) (net 267 ALT.WL.IRQ) (net 268 ALT.WL.D0) (net 269 ALT.WL.D1) (net 270 ALT.WL.D2) (net 271 ALT.WL.D3) (net 272 3.3V-WIFI) (net_class Default "This is the default net class." (clearance 0.1524) (trace_width 0.25) (via_dia 0.8) (via_drill 0.4) (uvia_dia 0.3) (uvia_drill 0.1) (add_net 12MHZ) (add_net 12M_LOOP) (add_net 3.3V-WIFI) (add_net 32.768KHZ) (add_net 5V_IN) (add_net AGND) (add_net AIN0) (add_net AIN1) (add_net AIN2) (add_net AIN3) (add_net AIN4) (add_net AIN5) (add_net AIN6) (add_net AIN7) (add_net ALT.BT.EN) (add_net ALT.BUFF.OE) (add_net ALT.WL.CLK) (add_net ALT.WL.CMD) (add_net ALT.WL.D0) (add_net ALT.WL.D1) (add_net ALT.WL.D2) (add_net ALT.WL.D3) (add_net ALT.WL.EN) (add_net ALT.WL.IRQ) (add_net BAT_TEMP) (add_net BAT_VOLT) (add_net BT_EN) (add_net BT_EN.SIP) (add_net BT_HCI_CTS) (add_net BT_HCI_CTS.SIP) (add_net BT_HCI_RTS) (add_net BT_HCI_RTS.SIP) (add_net BT_HCI_RX) (add_net BT_HCI_RX.SIP) (add_net BT_HCI_TX) (add_net BT_HCI_TX.SIP) (add_net CEC) (add_net CGND) (add_net CLKOUT2) (add_net DVI_5V) (add_net EHRPWM1A) (add_net EHRPWM1B) (add_net EHRPWM2A) (add_net EHRPWM2B) (add_net EMMC_RSTN) (add_net EXT_SWING) (add_net GND) (add_net GPIO0_26) (add_net GPIO0_27) (add_net GPIO0_7) (add_net GPIO1_12) (add_net GPIO1_13) (add_net GPIO1_14) (add_net GPIO1_15) (add_net GPIO1_16) (add_net GPIO1_16.SIP) (add_net GPIO1_17) (add_net GPIO1_28) (add_net GPIO1_29) (add_net GPIO2_0.SIP) (add_net GPIO2_1) (add_net GPIO3_19) (add_net GPIO3_21) (add_net HDMI.DSCL) (add_net HDMI.DSDA) (add_net HDMICLK_DIS#) (add_net HDMI_1V8) (add_net HDMI_INT) (add_net HPD) (add_net I2C0_SCL) (add_net I2C0_SDA) (add_net I2C1_SCL) (add_net I2C1_SDA) (add_net I2C2_SCL) (add_net I2C2_SDA) (add_net JTAG_EMU0) (add_net JTAG_EMU1) (add_net JTAG_TCK) (add_net JTAG_TDI) (add_net JTAG_TDO) (add_net JTAG_TMS) (add_net JTAG_TRSTN) (add_net LCD.CLOCK) (add_net LCD.D0.B0--B3) (add_net LCD.D1.B1--B4) (add_net LCD.D10.G5--G7) (add_net LCD.D11.R0--R3) (add_net LCD.D12.R1--R4) (add_net LCD.D13.R2--R5) (add_net LCD.D14.R3--R6) (add_net LCD.D15.R4--R7) (add_net LCD.D2.B2--B5) (add_net LCD.D3.B3--B6) (add_net LCD.D4.B4--B7) (add_net LCD.D5.G0--G2) (add_net LCD.D6.G1--G3) (add_net LCD.D7.G2--G4) (add_net LCD.D8.G3--G5) (add_net LCD.D9.G4--G6) (add_net LCD.ENABLE) (add_net LCD.HSYNC) (add_net LCD.VSYNC) (add_net LDO_PGOOD) (add_net LS_BUF_OE) (add_net MCU.LCD.CLK) (add_net MCU.LCD.EN) (add_net MCU.LCD.HS) (add_net MCU.LCD.VS) (add_net MMC1_CLK) (add_net MMC1_CMD) (add_net MMC1_DAT0) (add_net MMC1_DAT1) (add_net MMC1_DAT2) (add_net MMC1_DAT3) (add_net MMC1_DAT4) (add_net MMC1_DAT5) (add_net MMC1_DAT6) (add_net MMC1_DAT7) (add_net N$1) (add_net N$11) (add_net N$12) (add_net N$13) (add_net N$14) (add_net N$15) (add_net N$16) (add_net N$17) (add_net N$18) (add_net N$19) (add_net N$2) (add_net N$20) (add_net N$22) (add_net N$24) (add_net N$25) (add_net N$28) (add_net N$29) (add_net N$3) (add_net N$30) (add_net N$31) (add_net N$33) (add_net N$34) (add_net N$35) (add_net N$36) (add_net N$37) (add_net N$38) (add_net N$39) (add_net N$4) (add_net N$40) (add_net N$41) (add_net N$42) (add_net N$43) (add_net N$44) (add_net N$45) (add_net N$47) (add_net N$48) (add_net N$49) (add_net N$5) (add_net N$50) (add_net N$51) (add_net N$52) (add_net N$53) (add_net N$54) (add_net N$56) (add_net N$57) (add_net N$58) (add_net N$59) (add_net N$6) (add_net N$62) (add_net N$63) (add_net N$64) (add_net N$65) (add_net N$66) (add_net N$67) (add_net N$69) (add_net N$7) (add_net N$70) (add_net N$8) (add_net N$9) (add_net N$93) (add_net N$94) (add_net N$95) (add_net N$96) (add_net NC1) (add_net NC2) (add_net NC3) (add_net NC4) (add_net PMIC_INT) (add_net PMIC_NWAKEUP) (add_net PMIC_PGOOD) (add_net PWR_BUT) (add_net RX<-TX) (add_net SD.CD) (add_net SD.CLK) (add_net SD.CMD) (add_net SD.D0) (add_net SD.D1) (add_net SD.D2) (add_net SD.D3) (add_net SELECT_5V) (add_net SLOW_CLK) (add_net SPI1_CS0) (add_net SPI1_D0) (add_net SPI1_D1) (add_net SPI1_SCLK) (add_net SYS_5V) (add_net SYS_RESET#) (add_net TEST) (add_net TIMER4) (add_net TIMER5) (add_net TIMER6) (add_net TIMER7) (add_net TX->RX) (add_net TX0+) (add_net TX0-) (add_net TX1+) (add_net TX1-) (add_net TX2+) (add_net TX2-) (add_net TXC+) (add_net TXC-) (add_net UART0_RST#) (add_net UART0_RXD) (add_net UART0_TXD) (add_net UART1_RXD) (add_net UART1_TXD) (add_net UART2_RXD) (add_net UART2_TXD) (add_net UART4_RXD) (add_net UART4_TXD) (add_net USB.CLIENT.D+) (add_net USB.CLIENT.D-) (add_net USB.CLIENT.ID) (add_net USB.HOST.D+) (add_net USB.HOST.D-) (add_net USB1_DRVVBUS) (add_net USB1_OC#) (add_net USB1_VBUS) (add_net USB_DC) (add_net USR0) (add_net USR1) (add_net USR2) (add_net USR3) (add_net VBUS.HOST) (add_net VBUS.OUT) (add_net VDDS_DDR) (add_net VDDS_PLL) (add_net VDD_1V8) (add_net VDD_3V3A) (add_net VDD_3V3AUX) (add_net VDD_3V3B) (add_net VDD_5V) (add_net VDD_ADC) (add_net VDD_CORE) (add_net VDD_MPU) (add_net VDD_RTC) (add_net VIN_BAT) (add_net WL_EN) (add_net WL_EN.SIP) (add_net WL_IRQ) (add_net WL_IRQ.SIP) (add_net WL_SDIO_CLK) (add_net WL_SDIO_CLK.SIP) (add_net WL_SDIO_CMD) (add_net WL_SDIO_CMD.SIP) (add_net WL_SDIO_D0) (add_net WL_SDIO_D0.SIP) (add_net WL_SDIO_D1) (add_net WL_SDIO_D1.SIP) (add_net WL_SDIO_D2) (add_net WL_SDIO_D2.SIP) (add_net WL_SDIO_D3) (add_net WL_SDIO_D3.SIP) (add_net XDMA_EVENT_INTRO) ) (module FIDUCIAL_40MIL (layer Top) (tedit 0) (tstamp 5D7C20BC) (at 178.3461 124.6886) (fp_text reference FUD1 (at 0 0) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15))) ) (fp_text value FIDUCIAL (at 0 0) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15))) ) (fp_circle (center 0 0) (end 1.047268 0) (layer Dwgs.User) (width 0.127)) (fp_circle (center 0 0) (end 0.762 0) (layer F.Mask) (width 0.6096)) (pad P$1 smd roundrect (at 0 0) (size 1.016 1.016) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) ) (module FIDUCIAL_40MIL (layer Top) (tedit 0) (tstamp 5D7C20C2) (at 108.3691 81.1911 270) (fp_text reference FUD2 (at 0 0 270) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15)) (justify right top)) ) (fp_text value FIDUCIAL (at 0 0 270) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15)) (justify right top)) ) (fp_circle (center 0 0) (end 1.047268 0) (layer Dwgs.User) (width 0.127)) (fp_circle (center 0 0) (end 0.762 0) (layer F.Mask) (width 0.6096)) (pad P$1 smd roundrect (at 0 0 270) (size 1.016 1.016) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) ) (module FIDUCIAL_40MIL (layer Top) (tedit 0) (tstamp 5D7C20C8) (at 110.4011 129.4511) (fp_text reference FUD3 (at 0 0) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15))) ) (fp_text value FIDUCIAL (at 0 0) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15))) ) (fp_circle (center 0 0) (end 1.047268 0) (layer Dwgs.User) (width 0.127)) (fp_circle (center 0 0) (end 0.762 0) (layer F.Mask) (width 0.6096)) (pad P$1 smd roundrect (at 0 0) (size 1.016 1.016) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C20CE) (at 142.5321 108.1786 270) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C3 (at -0.5 -0.425) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "18pF, 50V" (at -0.5 1.45 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 45 N$11) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 3 N$7) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C20D7) (at 142.5321 109.9566 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C4 (at -0.5 -0.425) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "18pF, 50V" (at -0.5 1.45 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 45 N$11) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 2 N$6) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C20E0) (at 141.3891 118.0846) (descr "RESISTOR
\nchip") (fp_text reference FB5 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "1k BLM15AG102SN1D" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 101 XDMA_EVENT_INTRO) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 100 N$3) (solder_mask_margin 0.1016)) ) (module 0603-LED (layer Top) (tedit 0) (tstamp 5D7C20EE) (at 108.4961 90.7161 270) (fp_text reference USR3 (at -0.65 0) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value LTST-C191TBKT (at 1.65 2.3) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (fp_line (start 0.35 0.17) (end 0.35 -0.17) (layer F.SilkS) (width 0.1524)) (fp_line (start -0.35 0.17) (end -0.35 -0.17) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.11) (end 0 0.26) (layer F.Fab) (width 0.05)) (fp_line (start 0 -0.11) (end 0 -0.26) (layer F.Fab) (width 0.05)) (fp_line (start 0.15 -0.11) (end 0 0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 -0.11) (end 0.15 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start -0.15 -0.11) (end 0 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.11) (end -0.15 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.11) (end 0.15 0.11) (layer F.Fab) (width 0.05)) (fp_line (start -0.15 0.11) (end 0 0.11) (layer F.Fab) (width 0.05)) (fp_poly (pts (xy 0.3 -0.4) (xy 0.4 -0.4) (xy 0.4 0.4) (xy 0.3 0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.4 -0.4) (xy -0.3 -0.4) (xy -0.3 0.4) (xy -0.4 0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.15 -0.8) (xy -0.4 -0.8) (xy -0.4 -0.4) (xy 0.4 -0.4) (xy 0.4 -0.8) (xy 0.15 -0.8) (xy 0 -0.65)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 0.15 0.8) (xy 0.4 0.8) (xy 0.4 0.4) (xy -0.4 0.4) (xy -0.4 0.8) (xy -0.15 0.8) (xy 0 0.65)) (layer F.Fab) (width 0)) (fp_line (start -0.19 -0.1232) (end 0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.1432) (end -0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.1432) (end 0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (pad K smd rect (at 0 0.75 270) (size 0.8 0.8) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad A smd rect (at 0 -0.75 270) (size 0.8 0.8) (layers Top F.Paste F.Mask) (net 12 N$18) (solder_mask_margin 0.1016)) ) (module 0603-LED (layer Top) (tedit 0) (tstamp 5D7C2104) (at 108.4961 88.8111 270) (fp_text reference USR2 (at -0.65 0) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value LTST-C191TBKT (at 1.65 2.3) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (fp_line (start 0.35 0.17) (end 0.35 -0.17) (layer F.SilkS) (width 0.1524)) (fp_line (start -0.35 0.17) (end -0.35 -0.17) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.11) (end 0 0.26) (layer F.Fab) (width 0.05)) (fp_line (start 0 -0.11) (end 0 -0.26) (layer F.Fab) (width 0.05)) (fp_line (start 0.15 -0.11) (end 0 0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 -0.11) (end 0.15 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start -0.15 -0.11) (end 0 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.11) (end -0.15 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.11) (end 0.15 0.11) (layer F.Fab) (width 0.05)) (fp_line (start -0.15 0.11) (end 0 0.11) (layer F.Fab) (width 0.05)) (fp_poly (pts (xy 0.3 -0.4) (xy 0.4 -0.4) (xy 0.4 0.4) (xy 0.3 0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.4 -0.4) (xy -0.3 -0.4) (xy -0.3 0.4) (xy -0.4 0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.15 -0.8) (xy -0.4 -0.8) (xy -0.4 -0.4) (xy 0.4 -0.4) (xy 0.4 -0.8) (xy 0.15 -0.8) (xy 0 -0.65)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 0.15 0.8) (xy 0.4 0.8) (xy 0.4 0.4) (xy -0.4 0.4) (xy -0.4 0.8) (xy -0.15 0.8) (xy 0 0.65)) (layer F.Fab) (width 0)) (fp_line (start -0.19 -0.1232) (end 0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.1432) (end -0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.1432) (end 0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (pad K smd rect (at 0 0.75 270) (size 0.8 0.8) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad A smd rect (at 0 -0.75 270) (size 0.8 0.8) (layers Top F.Paste F.Mask) (net 11 N$17) (solder_mask_margin 0.1016)) ) (module 0603-LED (layer Top) (tedit 0) (tstamp 5D7C211A) (at 108.4961 86.9061 270) (fp_text reference USR1 (at -0.65 0) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value LTST-C191TBKT (at 1.65 2.3) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (fp_line (start 0.35 0.17) (end 0.35 -0.17) (layer F.SilkS) (width 0.1524)) (fp_line (start -0.35 0.17) (end -0.35 -0.17) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.11) (end 0 0.26) (layer F.Fab) (width 0.05)) (fp_line (start 0 -0.11) (end 0 -0.26) (layer F.Fab) (width 0.05)) (fp_line (start 0.15 -0.11) (end 0 0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 -0.11) (end 0.15 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start -0.15 -0.11) (end 0 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.11) (end -0.15 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.11) (end 0.15 0.11) (layer F.Fab) (width 0.05)) (fp_line (start -0.15 0.11) (end 0 0.11) (layer F.Fab) (width 0.05)) (fp_poly (pts (xy 0.3 -0.4) (xy 0.4 -0.4) (xy 0.4 0.4) (xy 0.3 0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.4 -0.4) (xy -0.3 -0.4) (xy -0.3 0.4) (xy -0.4 0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.15 -0.8) (xy -0.4 -0.8) (xy -0.4 -0.4) (xy 0.4 -0.4) (xy 0.4 -0.8) (xy 0.15 -0.8) (xy 0 -0.65)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 0.15 0.8) (xy 0.4 0.8) (xy 0.4 0.4) (xy -0.4 0.4) (xy -0.4 0.8) (xy -0.15 0.8) (xy 0 0.65)) (layer F.Fab) (width 0)) (fp_line (start -0.19 -0.1232) (end 0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.1432) (end -0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.1432) (end 0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (pad K smd rect (at 0 0.75 270) (size 0.8 0.8) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad A smd rect (at 0 -0.75 270) (size 0.8 0.8) (layers Top F.Paste F.Mask) (net 10 N$16) (solder_mask_margin 0.1016)) ) (module 0603-LED (layer Top) (tedit 0) (tstamp 5D7C2130) (at 109.1311 116.4336 270) (fp_text reference PWR (at -0.65 0 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value LTST-C191TBKT (at 1.65 2.3) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (fp_line (start 0.35 0.17) (end 0.35 -0.17) (layer F.SilkS) (width 0.1524)) (fp_line (start -0.35 0.17) (end -0.35 -0.17) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.11) (end 0 0.26) (layer F.Fab) (width 0.05)) (fp_line (start 0 -0.11) (end 0 -0.26) (layer F.Fab) (width 0.05)) (fp_line (start 0.15 -0.11) (end 0 0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 -0.11) (end 0.15 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start -0.15 -0.11) (end 0 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.11) (end -0.15 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.11) (end 0.15 0.11) (layer F.Fab) (width 0.05)) (fp_line (start -0.15 0.11) (end 0 0.11) (layer F.Fab) (width 0.05)) (fp_poly (pts (xy 0.3 -0.4) (xy 0.4 -0.4) (xy 0.4 0.4) (xy 0.3 0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.4 -0.4) (xy -0.3 -0.4) (xy -0.3 0.4) (xy -0.4 0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.15 -0.8) (xy -0.4 -0.8) (xy -0.4 -0.4) (xy 0.4 -0.4) (xy 0.4 -0.8) (xy 0.15 -0.8) (xy 0 -0.65)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 0.15 0.8) (xy 0.4 0.8) (xy 0.4 0.4) (xy -0.4 0.4) (xy -0.4 0.8) (xy -0.15 0.8) (xy 0 0.65)) (layer F.Fab) (width 0)) (fp_line (start -0.19 -0.1232) (end 0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.1432) (end -0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.1432) (end 0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (pad K smd rect (at 0 0.75 270) (size 0.8 0.8) (layers Top F.Paste F.Mask) (net 150 N$4) (solder_mask_margin 0.1016)) (pad A smd rect (at 0 -0.75 270) (size 0.8 0.8) (layers Top F.Paste F.Mask) (net 74 VDD_3V3AUX) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2146) (at 134.0231 122.9106) (descr "RESISTOR
\nchip") (fp_text reference R32 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "10k, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 102 SYS_RESET#) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2154) (at 115.3541 83.9216 90) (descr "RESISTOR
\nchip") (fp_text reference R92 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value 1k (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 131 USR3) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 12 N$18) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2162) (at 113.9571 83.9216 90) (descr "RESISTOR
\nchip") (fp_text reference R96 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value 1k (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 130 USR2) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 11 N$17) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2170) (at 112.5601 83.9216 90) (descr "RESISTOR
\nchip") (fp_text reference R100 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value 1k (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 129 USR1) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 10 N$16) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C217E) (at 125.3871 120.1166) (descr "RESISTOR
\nchip") (fp_text reference R41 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "1.5k, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 55 I2C0_SCL) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C218C) (at 125.3871 125.7046) (descr "RESISTOR
\nchip") (fp_text reference R42 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "1.5k, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 54 I2C0_SDA) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module CRYSTAL_3.2X1.5 (layer Top) (tedit 0) (tstamp 5D7C219A) (at 138.4681 114.1476 270) (fp_text reference Q2 (at -2.246875 -1.115625 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value 32.768kHz (at -2.48125 2.125 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top)) ) (fp_line (start 0.53125 0.796875) (end -0.53125 0.796875) (layer F.SilkS) (width 0.127)) (fp_line (start 0.53125 -0.796875) (end 0.53125 0.796875) (layer F.SilkS) (width 0.127)) (fp_line (start -0.53125 -0.796875) (end 0.53125 -0.796875) (layer F.SilkS) (width 0.127)) (fp_line (start -0.53125 0.796875) (end -0.53125 -0.796875) (layer F.SilkS) (width 0.127)) (pad P$2 smd rect (at 1.25 0 270) (size 1.1 1.9) (layers Top F.Paste F.Mask) (net 34 N$37) (solder_mask_margin 0.1016)) (pad P$1 smd rect (at -1.25 0 270) (size 1.1 1.9) (layers Top F.Paste F.Mask) (net 33 N$36) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C21A3) (at 142.5321 115.0366 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C6 (at -0.5 -0.425) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "18pF, 50V" (at -0.5 1.45 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 46 N$12) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 34 N$37) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C21AC) (at 142.5321 113.2586 270) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C5 (at -0.5 -0.425) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "18pF, 50V" (at -0.5 1.45 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 46 N$12) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 33 N$36) (solder_mask_margin 0.1016)) ) (module OSD3358 (layer Top) (tedit 0) (tstamp 5D7C21B5) (at 157.1371 109.7026 90) (fp_text reference IC1 (at 0 0 90) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15))) ) (fp_text value OSD3358 (at 0 0 90) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15))) ) (fp_line (start 13.5 13.5) (end 13.5 -13.5) (layer F.SilkS) (width 0.127)) (fp_line (start -13.5 13.5) (end 13.5 13.5) (layer F.SilkS) (width 0.127)) (fp_line (start -13.5 -13.5) (end -13.5 13.5) (layer F.SilkS) (width 0.127)) (fp_line (start 13.5 -13.5) (end -13.5 -13.5) (layer F.SilkS) (width 0.127)) (fp_text user 20 (at -13.7635 -12.065 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.097536)) (justify right)) ) (fp_text user 1 (at -13.7635 12.065 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.097536)) (justify right)) ) (fp_text user Y (at 12.1285 13.8905 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.097536)) (justify top)) ) (fp_text user A (at -12.0015 13.8905 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.097536)) (justify top)) ) (fp_text user Y (at 12.065 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user W (at 10.795 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user V (at 9.525 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user U (at 8.255 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user T (at 6.985 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user R (at 5.715 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user P (at 4.445 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user N (at 3.175 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user M (at 1.905 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user L (at 0.635 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user K (at -0.635 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user J (at -1.905 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user H (at -3.175 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user G (at -4.445 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user F (at -5.715 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user E (at -6.985 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user D (at -8.255 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user C (at -9.525 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user B (at -10.795 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user A (at -12.065 12.827 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify top)) ) (fp_text user 20 (at -12.827 -12.065 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 19 (at -12.827 -10.795 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 18 (at -12.827 -9.525 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 17 (at -12.827 -8.255 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 16 (at -12.827 -6.985 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 15 (at -12.827 -5.715 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 14 (at -12.827 -4.445 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 13 (at -12.827 -3.175 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 12 (at -12.827 -1.905 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 11 (at -12.827 -0.635 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 10 (at -12.827 0.635 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 9 (at -12.827 1.905 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 8 (at -12.827 3.175 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 7 (at -12.827 4.445 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 6 (at -12.827 5.715 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 5 (at -12.827 6.985 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 4 (at -12.827 8.255 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 3 (at -12.827 9.525 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 2 (at -12.827 10.795 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (fp_text user 1 (at -12.827 12.065 90) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.032512)) (justify right)) ) (pad A20 smd roundrect (at -12.065 -12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 70 PMIC_PGOOD) (solder_mask_margin 0.1016)) (pad B20 smd roundrect (at -10.795 -12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 71 LDO_PGOOD) (solder_mask_margin 0.1016)) (pad C20 smd roundrect (at -9.525 -12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 55 I2C0_SCL) (solder_mask_margin 0.1016)) (pad D20 smd roundrect (at -8.255 -12.065 90) (size 0.5 0.5) (layers Top F.Paste 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4.445 8.255 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad R4 smd roundrect (at 5.715 8.255 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 25 LCD.D3.B3--B6) (solder_mask_margin 0.1016)) (pad T4 smd roundrect (at 6.985 8.255 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 18 LCD.D7.G2--G4) (solder_mask_margin 0.1016)) (pad U4 smd roundrect (at 8.255 8.255 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 17 LCD.D11.R0--R3) (solder_mask_margin 0.1016)) (pad V4 smd roundrect (at 9.525 8.255 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 14 LCD.D14.R3--R6) (solder_mask_margin 0.1016)) (pad W4 smd roundrect (at 10.795 8.255 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 133 SYS_5V) (solder_mask_margin 0.1016)) (pad Y4 smd roundrect (at 12.065 8.255 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 133 SYS_5V) (solder_mask_margin 0.1016)) (pad A3 smd roundrect (at -12.065 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad B3 smd roundrect (at -10.795 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad C3 smd roundrect (at -9.525 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad D3 smd roundrect (at -8.255 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad E3 smd roundrect (at -6.985 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad F3 smd roundrect (at -5.715 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad G3 smd roundrect (at -4.445 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad H3 smd roundrect (at -3.175 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad J3 smd roundrect (at -1.905 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad K3 smd roundrect (at -0.635 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad L3 smd roundrect (at 0.635 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad M3 smd roundrect (at 1.905 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad N3 smd roundrect (at 3.175 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad P3 smd roundrect (at 4.445 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad R3 smd roundrect (at 5.715 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 26 LCD.D2.B2--B5) (solder_mask_margin 0.1016)) (pad T3 smd roundrect (at 6.985 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 19 LCD.D6.G1--G3) (solder_mask_margin 0.1016)) (pad U3 smd roundrect (at 8.255 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 21 LCD.D10.G5--G7) (solder_mask_margin 0.1016)) (pad V3 smd roundrect (at 9.525 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 15 LCD.D13.R2--R5) (solder_mask_margin 0.1016)) (pad W3 smd roundrect (at 10.795 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.1016)) (pad Y3 smd roundrect (at 12.065 9.525 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 65 VIN_BAT) (solder_mask_margin 0.1016)) (pad A2 smd roundrect (at -12.065 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad B2 smd roundrect (at -10.795 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad C2 smd roundrect (at -9.525 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad D2 smd roundrect (at -8.255 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad E2 smd roundrect (at -6.985 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad F2 smd roundrect (at -5.715 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad G2 smd roundrect (at -4.445 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad H2 smd roundrect (at -3.175 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad J2 smd roundrect (at -1.905 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad K2 smd roundrect (at -0.635 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad L2 smd roundrect (at 0.635 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad M2 smd roundrect (at 1.905 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad N2 smd roundrect (at 3.175 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad P2 smd roundrect (at 4.445 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad R2 smd roundrect (at 5.715 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 29 LCD.D1.B1--B4) (solder_mask_margin 0.1016)) (pad T2 smd roundrect (at 6.985 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 20 LCD.D5.G0--G2) (solder_mask_margin 0.1016)) (pad U2 smd roundrect (at 8.255 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 22 LCD.D9.G4--G6) (solder_mask_margin 0.1016)) (pad V2 smd roundrect (at 9.525 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 16 LCD.D12.R1--R4) (solder_mask_margin 0.1016)) (pad W2 smd roundrect (at 10.795 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.1016)) (pad Y2 smd roundrect (at 12.065 10.795 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 65 VIN_BAT) (solder_mask_margin 0.1016)) (pad A1 smd roundrect (at -12.065 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.1016)) (pad B1 smd roundrect (at -10.795 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad C1 smd roundrect (at -9.525 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad D1 smd roundrect (at -8.255 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad E1 smd roundrect (at -6.985 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad F1 smd roundrect (at -5.715 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad G1 smd roundrect (at -4.445 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad H1 smd roundrect (at -3.175 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad J1 smd roundrect (at -1.905 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad K1 smd roundrect (at -0.635 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad L1 smd roundrect (at 0.635 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad M1 smd roundrect (at 1.905 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad N1 smd roundrect (at 3.175 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad P1 smd roundrect (at 4.445 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad R1 smd roundrect (at 5.715 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 28 LCD.D0.B0--B3) (solder_mask_margin 0.1016)) (pad T1 smd roundrect (at 6.985 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 24 LCD.D4.B4--B7) (solder_mask_margin 0.1016)) (pad U1 smd roundrect (at 8.255 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 23 LCD.D8.G3--G5) (solder_mask_margin 0.1016)) (pad V1 smd roundrect (at 9.525 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.1016)) (pad W1 smd roundrect (at 10.795 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 67 BAT_TEMP) (solder_mask_margin 0.1016)) (pad Y1 smd roundrect (at 12.065 12.065 90) (size 0.5 0.5) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 66 BAT_VOLT) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C2378) (at 189.2681 89.5096) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C2 (at -0.5 -0.425) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value ".1uF, 6.3V" (at -0.5 1.45) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module C0603K (layer Top) (tedit 0) (tstamp 5D7C2381) (at 186.8551 87.9856 180) (descr "Ceramic Chip Capacitor KEMET 0603 Reflow solder
\nMetric Code Size 1608") (fp_text reference C1 (at -0.8 -0.65) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value 10uF,10V (at -0.8 1.65) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top)) ) (fp_poly (pts (xy 0.45 0.4) (xy 0.8 0.4) (xy 0.8 -0.4) (xy 0.45 -0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.8 0.4) (xy -0.45 0.4) (xy -0.45 -0.4) (xy -0.8 -0.4)) (layer F.Fab) (width 0)) (fp_line (start 0 -0.508) (end 0 0.508) (layer F.SilkS) (width 0.127)) (fp_line (start 0.725 0.35) (end -0.725 0.35) (layer F.Fab) (width 0.1016)) (fp_line (start -0.725 -0.35) (end 0.725 -0.35) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.875 0 180) (size 1.05 1.08) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.875 0 180) (size 1.05 1.08) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C238B) (at 167.2971 121.1326 180) (descr "RESISTOR
\nchip") (fp_text reference R24 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "10k, 1%" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 68 N$22) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2399) (at 141.2621 109.0676 90) (descr "RESISTOR
\nchip") (fp_text reference R8 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "1M, 1%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 3 N$7) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 2 N$6) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C23A7) (at 189.2681 98.3996) (descr "RESISTOR
\nchip") (fp_text reference R1 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "10k, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 5 SD.D1) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C23B5) (at 189.2681 97.1296) (descr "RESISTOR
\nchip") (fp_text reference R2 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "10k, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 6 SD.D0) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C23C3) (at 189.2681 95.8596) (descr "RESISTOR
\nchip") (fp_text reference R3 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "10k, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 8 SD.CLK) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C23D1) (at 189.2681 93.3196) (descr "RESISTOR
\nchip") (fp_text reference R4 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "10k, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 9 SD.CMD) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C23DF) (at 189.2681 92.0496) (descr "RESISTOR
\nchip") (fp_text reference R5 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "10k, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 4 SD.D3) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C23ED) (at 189.2681 90.7796) (descr "RESISTOR
\nchip") (fp_text reference R6 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "10k, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 7 SD.D2) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C23FB) (at 189.2681 94.5896) (descr "RESISTOR
\nchip") (fp_text reference R7 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "10k, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 69 SD.CD) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2409) (at 167.2971 118.5926 180) (descr "RESISTOR
\nchip") (fp_text reference R22 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "4.75k, 1%" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 82 AIN7) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2417) (at 167.2971 119.8626) (descr "RESISTOR
\nchip") (fp_text reference R21 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "4.75k, 1%" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 82 AIN7) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2425) (at 163.7411 84.8106 270) (descr "RESISTOR
\nchip") (fp_text reference R58 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "100k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 14 LCD.D14.R3--R6) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2433) (at 175.1711 84.8106 270) (descr "RESISTOR
\nchip") (fp_text reference R76 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "100k, 1%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 20 LCD.D5.G0--G2) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2441) (at 176.4411 84.8106 270) (descr "RESISTOR
\nchip") (fp_text reference R78 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "100k, 1%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 24 LCD.D4.B4--B7) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C244F) (at 177.7111 84.8106 270) (descr "RESISTOR
\nchip") (fp_text reference R80 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "100k, 1%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 25 LCD.D3.B3--B6) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C245D) (at 178.9811 84.8106 270) (descr "RESISTOR
\nchip") (fp_text reference R82 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "100k, 1%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 26 LCD.D2.B2--B5) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C246B) (at 162.4711 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R57 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "100k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 13 LCD.D15.R4--R7) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2479) (at 166.2811 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R61 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "100k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 15 LCD.D13.R2--R5) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2487) (at 168.8211 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R63 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "100k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 16 LCD.D12.R1--R4) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2495) (at 165.0111 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R65 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "100k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 17 LCD.D11.R0--R3) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C24A3) (at 167.5511 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R67 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "100k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 21 LCD.D10.G5--G7) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C24B1) (at 170.0911 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R69 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "100k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 22 LCD.D9.G4--G6) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C24BF) (at 171.3611 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R71 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "100k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 23 LCD.D8.G3--G5) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C24CD) (at 172.6311 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R73 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "100k, 1%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 18 LCD.D7.G2--G4) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C24DB) (at 173.9011 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R75 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "100k, 1%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 19 LCD.D6.G1--G3) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C24E9) (at 180.2511 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R85 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "100k, 1%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 29 LCD.D1.B1--B4) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C24F7) (at 181.5211 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R87 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "100k, 1%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 28 LCD.D0.B0--B3) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2505) (at 181.5211 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R88 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "100, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 91 N$2) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 26 LCD.D2.B2--B5) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2513) (at 141.3891 119.3546 180) (descr "RESISTOR
\nchip") (fp_text reference R53 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "4.75k, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 98 JTAG_EMU1) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2521) (at 141.3891 125.7046) (descr "RESISTOR
\nchip") (fp_text reference R52 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "4.75k, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 92 JTAG_TRSTN) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C252F) (at 141.3891 124.4346 180) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C22 (at -0.5 -0.425) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value ".1uF, 6.3V" (at -0.5 1.45) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2538) (at 141.3891 120.6246 180) (descr "RESISTOR
\nchip") (fp_text reference R43 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "4.75k, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 97 JTAG_EMU0) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C2546) (at 141.3891 123.1646) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C21 (at -0.5 -0.425) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value ".1uF, 6.3V" (at -0.5 1.45) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 102 SYS_RESET#) (solder_mask_margin 0.1016)) ) (module C0603K (layer Top) (tedit 0) (tstamp 5D7C254F) (at 136.9441 120.6246) (descr "Ceramic Chip Capacitor KEMET 0603 Reflow solder
\nMetric Code Size 1608") (fp_text reference C16 (at -0.8 -0.65) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "2.2uF, 6.3V" (at -0.8 1.65) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom)) ) (fp_poly (pts (xy 0.45 0.4) (xy 0.8 0.4) (xy 0.8 -0.4) (xy 0.45 -0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.8 0.4) (xy -0.45 0.4) (xy -0.45 -0.4) (xy -0.8 -0.4)) (layer F.Fab) (width 0)) (fp_line (start 0 -0.508) (end 0 0.508) (layer F.SilkS) (width 0.127)) (fp_line (start 0.725 0.35) (end -0.725 0.35) (layer F.Fab) (width 0.1016)) (fp_line (start -0.725 -0.35) (end 0.725 -0.35) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.875 0) (size 1.05 1.08) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.875 0) (size 1.05 1.08) (layers Top F.Paste F.Mask) (net 102 SYS_RESET#) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2559) (at 173.9011 125.4506 90) (descr "RESISTOR
\nchip") (fp_text reference R14 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "0, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 113 N$28) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 99 CLKOUT2) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2567) (at 172.6311 125.4506 90) (descr "RESISTOR
\nchip") (fp_text reference FB7 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "1k BLM15AG102SN1D" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 114 N$29) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 99 CLKOUT2) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2575) (at 156.7561 94.8944) (descr "RESISTOR
\nchip") (fp_text reference R29 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "0, 1%" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 116 N$31) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 117 EMMC_RSTN) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C2583) (at 156.7561 93.4466 180) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C15 (at -0.5 0.425) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value ".1uF, 6.3V" (at -0.5 -1.45) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C258C) (at 156.2481 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R12 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "10k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 118 MMC1_DAT0) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C259A) (at 157.5181 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R13 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "10k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 119 MMC1_DAT1) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C25A8) (at 147.9931 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R16 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "10k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 120 MMC1_DAT2) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C25B6) (at 147.4461 92.3711 180) (descr "RESISTOR
\nchip") (fp_text reference R18 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "10k, 1%" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 121 MMC1_DAT3) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C25C4) (at 154.9781 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R20 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "10k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 122 MMC1_DAT4) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C25D2) (at 152.9461 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R23 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "10k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 123 MMC1_DAT5) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C25E0) (at 147.4461 95.0586 180) (descr "RESISTOR
\nchip") (fp_text reference R25 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "10k, 1%" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 124 MMC1_DAT6) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C25EE) (at 146.2151 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R28 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "10k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 125 MMC1_DAT7) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C25FC) (at 151.5491 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R30 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "10k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 126 MMC1_CMD) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C260A) (at 149.7711 84.8106 90) (descr "RESISTOR
\nchip") (fp_text reference R31 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "10k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 127 MMC1_CLK) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2618) (at 156.7561 91.9988) (descr "RESISTOR
\nchip") (fp_text reference R33 (at -0.635 0.762 -90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "10k, 1%" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 117 EMMC_RSTN) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C2626) (at 161.2011 84.8106 270) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C27 (at -0.5 0.425 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 13 LCD.D15.R4--R7) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C262F) (at 161.2011 88.4936 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C28 (at -0.5 0.425 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 14 LCD.D14.R3--R6) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C2638) (at 163.7411 88.4936 270) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C29 (at -0.5 0.425 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 15 LCD.D13.R2--R5) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C2641) (at 165.0111 88.4936 270) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C30 (at -0.5 0.425 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 16 LCD.D12.R1--R4) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C264A) (at 162.4711 88.4936 270) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C31 (at -0.5 0.425 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 17 LCD.D11.R0--R3) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C2653) (at 166.2811 88.4936 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C32 (at -0.5 0.425 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 21 LCD.D10.G5--G7) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C265C) (at 167.5511 88.4936 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C33 (at -0.5 0.425 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 22 LCD.D9.G4--G6) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C2665) (at 168.8211 88.4936 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C34 (at -0.5 0.425 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 23 LCD.D8.G3--G5) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C266E) (at 170.0911 88.4936 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C35 (at -0.5 0.425 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 18 LCD.D7.G2--G4) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C2677) (at 172.6311 84.8106 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C36 (at -0.5 0.425 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 19 LCD.D6.G1--G3) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C2680) (at 173.9011 84.8106 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C37 (at -0.5 0.425 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 20 LCD.D5.G0--G2) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C2689) (at 175.1711 84.8106 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C38 (at -0.5 0.425 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 24 LCD.D4.B4--B7) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C2692) (at 176.4411 84.8106 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C39 (at -0.5 0.425 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 25 LCD.D3.B3--B6) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C269B) (at 180.2511 84.8106 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C40 (at -0.5 0.425 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 26 LCD.D2.B2--B5) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C26A4) (at 178.9811 84.8106 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C41 (at -0.5 0.425 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 29 LCD.D1.B1--B4) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C26AD) (at 177.7111 84.8106 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C42 (at -0.5 0.425 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "47pF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 28 LCD.D0.B0--B3) (solder_mask_margin 0.1016)) ) (module 0603-LED (layer Top) (tedit 0) (tstamp 5D7C26B6) (at 108.4961 85.0011 270) (fp_text reference USR0 (at -0.65 0) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value LTST-C191TBKT (at 1.65 2.3) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (fp_line (start 0.35 0.17) (end 0.35 -0.17) (layer F.SilkS) (width 0.1524)) (fp_line (start -0.35 0.17) (end -0.35 -0.17) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.11) (end 0 0.26) (layer F.Fab) (width 0.05)) (fp_line (start 0 -0.11) (end 0 -0.26) (layer F.Fab) (width 0.05)) (fp_line (start 0.15 -0.11) (end 0 0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 -0.11) (end 0.15 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start -0.15 -0.11) (end 0 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.11) (end -0.15 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.11) (end 0.15 0.11) (layer F.Fab) (width 0.05)) (fp_line (start -0.15 0.11) (end 0 0.11) (layer F.Fab) (width 0.05)) (fp_poly (pts (xy 0.3 -0.4) (xy 0.4 -0.4) (xy 0.4 0.4) (xy 0.3 0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.4 -0.4) (xy -0.3 -0.4) (xy -0.3 0.4) (xy -0.4 0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.15 -0.8) (xy -0.4 -0.8) (xy -0.4 -0.4) (xy 0.4 -0.4) (xy 0.4 -0.8) (xy 0.15 -0.8) (xy 0 -0.65)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 0.15 0.8) (xy 0.4 0.8) (xy 0.4 0.4) (xy -0.4 0.4) (xy -0.4 0.8) (xy -0.15 0.8) (xy 0 0.65)) (layer F.Fab) (width 0)) (fp_line (start -0.19 -0.1232) (end 0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.1432) (end -0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.1432) (end 0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (pad K smd rect (at 0 0.75 270) (size 0.8 0.8) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad A smd rect (at 0 -0.75 270) (size 0.8 0.8) (layers Top F.Paste F.Mask) (net 132 N$34) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C26CC) (at 111.1631 83.9216 90) (descr "RESISTOR
\nchip") (fp_text reference R104 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value 1k (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 128 USR0) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 132 N$34) (solder_mask_margin 0.1016)) ) (module C0805K (layer Bottom) (tedit 0) (tstamp 5D7C26DA) (at 148.5086 90.4336) (descr "Ceramic Chip Capacitor KEMET 0805 Reflow solder
\nMetric Code Size 2012") (fp_text reference C7 (at -1 0.875) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "4.7uF, 6.3V" (at -1 -1.9) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.5 -0.65) (xy 1 -0.65) (xy 1 0.65) (xy 0.5 0.65)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -1 -0.65) (xy -0.5 -0.65) (xy -0.5 0.65) (xy -1 0.65)) (layer B.Fab) (width 0)) (fp_line (start 0 0.762) (end 0 -0.762) (layer B.SilkS) (width 0.127)) (fp_line (start 0.925 -0.6) (end -0.925 -0.6) (layer B.Fab) (width 0.1016)) (fp_line (start -0.925 0.6) (end 0.925 0.6) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 1 0) (size 1.3 1.6) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -1 0) (size 1.3 1.6) (layers Bottom B.Paste B.Mask) (net 179 N$47) (solder_mask_margin 0.1016)) ) (module C0805K (layer Bottom) (tedit 0) (tstamp 5D7C26E4) (at 148.5086 87.9336) (descr "Ceramic Chip Capacitor KEMET 0805 Reflow solder
\nMetric Code Size 2012") (fp_text reference C12 (at -1 0.875) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "2.2uF, 6.3V" (at -1 -1.9) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.5 -0.65) (xy 1 -0.65) (xy 1 0.65) (xy 0.5 0.65)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -1 -0.65) (xy -0.5 -0.65) (xy -0.5 0.65) (xy -1 0.65)) (layer B.Fab) (width 0)) (fp_line (start 0 0.762) (end 0 -0.762) (layer B.SilkS) (width 0.127)) (fp_line (start 0.925 -0.6) (end -0.925 -0.6) (layer B.Fab) (width 0.1016)) (fp_line (start -0.925 0.6) (end 0.925 0.6) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 1 0) (size 1.3 1.6) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -1 0) (size 1.3 1.6) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C26EE) (at 152.9461 95.1211) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C13 (at -0.5 0.425) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value ".1uF, 6.3V" (at -0.5 -1.45) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module C0805K (layer Bottom) (tedit 0) (tstamp 5D7C26F7) (at 152.9461 93.5586) (descr "Ceramic Chip Capacitor KEMET 0805 Reflow solder
\nMetric Code Size 2012") (fp_text reference C14 (at -1 0.875) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "2.2uF, 6.3V" (at -1 -1.9) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.5 -0.65) (xy 1 -0.65) (xy 1 0.65) (xy 0.5 0.65)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -1 -0.65) (xy -0.5 -0.65) (xy -0.5 0.65) (xy -1 0.65)) (layer B.Fab) (width 0)) (fp_line (start 0 0.762) (end 0 -0.762) (layer B.SilkS) (width 0.127)) (fp_line (start 0.925 -0.6) (end -0.925 -0.6) (layer B.Fab) (width 0.1016)) (fp_line (start -0.925 0.6) (end 0.925 0.6) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 1 0) (size 1.3 1.6) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -1 0) (size 1.3 1.6) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C2701) (at 154.8211 87.6836) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C17 (at -0.5 0.425) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value ".1uF, 6.3V" (at -0.5 -1.45) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module C0805K (layer Bottom) (tedit 0) (tstamp 5D7C270A) (at 154.8211 89.1836) (descr "Ceramic Chip Capacitor KEMET 0805 Reflow solder
\nMetric Code Size 2012") (fp_text reference C9 (at -1 0.875) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "2.2uF, 6.3V" (at -1 -1.9) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.5 -0.65) (xy 1 -0.65) (xy 1 0.65) (xy 0.5 0.65)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -1 -0.65) (xy -0.5 -0.65) (xy -0.5 0.65) (xy -1 0.65)) (layer B.Fab) (width 0)) (fp_line (start 0 0.762) (end 0 -0.762) (layer B.SilkS) (width 0.127)) (fp_line (start 0.925 -0.6) (end -0.925 -0.6) (layer B.Fab) (width 0.1016)) (fp_line (start -0.925 0.6) (end 0.925 0.6) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 1 0) (size 1.3 1.6) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -1 0) (size 1.3 1.6) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2714) (at 109.1311 114.6556 180) (descr "RESISTOR
\nchip") (fp_text reference R55 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "4.75k, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 150 N$4) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2722) (at 176.4411 125.4506 90) (descr "RESISTOR
\nchip") (fp_text reference R36 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "0, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 157 N$48) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 159 GPIO0_7) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2730) (at 175.1711 125.4506 90) (descr "RESISTOR
\nchip") (fp_text reference R38 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "0, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 158 N$49) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 159 GPIO0_7) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C273E) (at 160.5661 84.8106 270) (descr "RESISTOR
\nchip") (fp_text reference R34 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value 22 (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 160 MCU.LCD.CLK) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 32 LCD.CLOCK) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C274C) (at 159.2961 84.8106 270) (descr "RESISTOR
\nchip") (fp_text reference R35 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "0, 1%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 161 MCU.LCD.VS) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 30 LCD.VSYNC) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C275A) (at 161.8361 84.8106 270) (descr "RESISTOR
\nchip") (fp_text reference R37 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "0, 1%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 162 MCU.LCD.HS) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 31 LCD.HSYNC) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2768) (at 174.3711 93.5586) (descr "RESISTOR
\nchip") (fp_text reference R39 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "0, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 163 MCU.LCD.EN) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 27 LCD.ENABLE) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2776) (at 115.1001 86.3346) (descr "RESISTOR
\nchip") (fp_text reference R26 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "0, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 59 USB_DC) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 164 N$45) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2784) (at 150.7871 106.7816) (descr "RESISTOR
\nchip") (fp_text reference R27 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "0, 1%" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 165 N$20) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2792) (at 181.0131 113.6396) (descr "RESISTOR
\nchip") (fp_text reference R19 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "10k, 1%" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 166 USB1_DRVVBUS) (solder_mask_margin 0.1016)) ) (module DBZ_R-PDSO-G3 (layer Bottom) (tedit 0) (tstamp 5D7C27A0) (at 160.5661 110.4646) (descr "DBZ (R-PDSO-G3) SOT-23
\nSource: http://focus.ti.com/lit/ds/slcs146e/slcs146e.pdf") (fp_text reference IC5 (at -1.905 1.905 -90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "TLVH431 (SOT-23-3)" (at -1.905 -3.175) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.5001 -0.3) (xy 0.5001 -0.3) (xy 0.5001 0.3) (xy -0.5001 0.3)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -1.1684 -1.2954) (xy -0.7112 -1.2954) (xy -0.7112 -0.7112) (xy -1.1684 -0.7112)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.7112 -1.2954) (xy 1.1684 -1.2954) (xy 1.1684 -0.7112) (xy 0.7112 -0.7112)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.2286 0.7112) (xy 0.2286 0.7112) (xy 0.2286 1.2954) (xy -0.2286 1.2954)) (layer B.Fab) (width 0)) (fp_line (start -1.422 0.66) (end 1.422 0.66) (layer B.Fab) (width 0.1524)) (fp_line (start -1.422 -0.66) (end -1.422 0.66) (layer B.Fab) (width 0.1524)) (fp_line (start 1.422 -0.66) (end -1.422 -0.66) (layer B.Fab) (width 0.1524)) (fp_line (start 1.422 0.66) (end 1.422 -0.66) (layer B.Fab) (width 0.1524)) (fp_line (start 1.973 1.983) (end 1.973 -1.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.973 -1.983) (end -1.973 1.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.973 -1.983) (end -1.973 -1.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.973 1.983) (end 1.973 1.983) (layer Dwgs.User) (width 0.0508)) (pad 1 smd rect (at -0.95 -1.1) (size 0.7 1) (layers Bottom B.Paste B.Mask) (net 171 N$51) (solder_mask_margin 0.1016)) (pad 2 smd rect (at 0.95 -1.1) (size 0.7 1) (layers Bottom B.Paste B.Mask) (net 170 N$50) (solder_mask_margin 0.1016)) (pad 3 smd rect (at 0 1.1) (size 0.7 1) (layers Bottom B.Paste B.Mask) (net 39 VDD_1V8) (solder_mask_margin 0.1016)) ) (module DBZ_R-PDSO-G3 (layer Bottom) (tedit 0) (tstamp 5D7C27B2) (at 165.5191 113.1316 180) (descr "DBZ (R-PDSO-G3) SOT-23
\nSource: http://focus.ti.com/lit/ds/slcs146e/slcs146e.pdf") (fp_text reference IC6 (at -1.905 1.905 270) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "DNP TLVH431 (SOT-23-3)" (at -1.905 -3.175) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.5001 -0.3) (xy 0.5001 -0.3) (xy 0.5001 0.3) (xy -0.5001 0.3)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -1.1684 -1.2954) (xy -0.7112 -1.2954) (xy -0.7112 -0.7112) (xy -1.1684 -0.7112)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.7112 -1.2954) (xy 1.1684 -1.2954) (xy 1.1684 -0.7112) (xy 0.7112 -0.7112)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.2286 0.7112) (xy 0.2286 0.7112) (xy 0.2286 1.2954) (xy -0.2286 1.2954)) (layer B.Fab) (width 0)) (fp_line (start -1.422 0.66) (end 1.422 0.66) (layer B.Fab) (width 0.1524)) (fp_line (start -1.422 -0.66) (end -1.422 0.66) (layer B.Fab) (width 0.1524)) (fp_line (start 1.422 -0.66) (end -1.422 -0.66) (layer B.Fab) (width 0.1524)) (fp_line (start 1.422 0.66) (end 1.422 -0.66) (layer B.Fab) (width 0.1524)) (fp_line (start 1.973 1.983) (end 1.973 -1.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.973 -1.983) (end -1.973 1.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.973 -1.983) (end -1.973 -1.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.973 1.983) (end 1.973 1.983) (layer Dwgs.User) (width 0.0508)) (pad 1 smd rect (at -0.95 -1.1 180) (size 0.7 1) (layers Bottom B.Paste B.Mask) (net 173 N$53) (solder_mask_margin 0.1016)) (pad 2 smd rect (at 0.95 -1.1 180) (size 0.7 1) (layers Bottom B.Paste B.Mask) (net 172 N$52) (solder_mask_margin 0.1016)) (pad 3 smd rect (at 0 1.1 180) (size 0.7 1) (layers Bottom B.Paste B.Mask) (net 39 VDD_1V8) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C27C4) (at 164.3761 108.0516 180) (descr "RESISTOR
\nchip") (fp_text reference R44 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value 499 (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 170 N$50) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 37 VDD_3V3A) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C27D2) (at 161.7091 115.5446) (descr "RESISTOR
\nchip") (fp_text reference R48 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "DNP 499" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 172 N$52) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C27E0) (at 162.4711 108.0516 180) (descr "RESISTOR
\nchip") (fp_text reference R46 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "10k 1%" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 171 N$51) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 37 VDD_3V3A) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C27EE) (at 163.6141 115.5446) (descr "RESISTOR
\nchip") (fp_text reference R50 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "DNP 10k 1%" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 173 N$53) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C27FC) (at 166.7891 110.8456 90) (descr "RESISTOR
\nchip") (fp_text reference R51 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "DNP 40.2k 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 39 VDD_1V8) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 173 N$53) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C280A) (at 159.2961 112.7506 270) (descr "RESISTOR
\nchip") (fp_text reference R47 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "40.2k 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 39 VDD_1V8) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 171 N$51) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2818) (at 160.5661 108.0516 180) (descr "RESISTOR
\nchip") (fp_text reference R45 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value DNP (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 171 N$51) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 170 N$50) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2826) (at 165.5191 115.5446) (descr "RESISTOR
\nchip") (fp_text reference R49 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value DNP (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 173 N$53) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 172 N$52) (solder_mask_margin 0.1016)) ) (module "SOT23-5(MICROCHIP)" (layer Top) (tedit 0) (tstamp 5D7C2834) (at 127.5461 122.9106 270) (fp_text reference IC4 (at -2.413 -2.105) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value 24LC32AT-I/OT (at -2.413 3.121 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top)) ) (fp_line (start 1.5 -0.8) (end 1.5 0.8) (layer F.SilkS) (width 0.127)) (fp_line (start 1.467 -0.8) (end 1.5 -0.8) (layer F.SilkS) (width 0.127)) (fp_line (start -0.4332 -0.8) (end 0.4332 -0.8) (layer F.SilkS) (width 0.127)) (fp_line (start -1.5 -0.8) (end -1.467 -0.8) (layer F.SilkS) (width 0.127)) (fp_line (start -1.5 0.8) (end -1.5 -0.8) (layer F.SilkS) (width 0.127)) (fp_line (start -1.467 0.8) (end -1.5 0.8) (layer F.SilkS) (width 0.127)) (fp_line (start 1.5 0.8) (end 1.467 0.8) (layer F.SilkS) (width 0.127)) (pad 5 smd rect (at -0.95 -1.4 90) (size 0.6 1.1) (layers Top F.Paste F.Mask) (net 174 N$54) (solder_mask_margin 0.1016)) (pad 4 smd rect (at 0.95 -1.4 90) (size 0.6 1.1) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 3 smd rect (at 0.95 1.4 90) (size 0.6 1.1) (layers Top F.Paste F.Mask) (net 54 I2C0_SDA) (solder_mask_margin 0.1016)) (pad 2 smd rect (at 0 1.4 90) (size 0.6 1.1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.95 1.4 90) (size 0.6 1.1) (layers Top F.Paste F.Mask) (net 55 I2C0_SCL) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2843) (at 129.1971 120.1166) (descr "RESISTOR
\nchip") (fp_text reference R40 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "10k, 1%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 174 N$54) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C2851) (at 129.1971 125.7046) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C18 (at -0.5 -0.425) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value ".1uF, 6.3V" (at -0.5 1.45) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module TESTPAD_W_HOLE_1X1 (layer Top) (tedit 0) (tstamp 5D7C285A) (at 131.8641 122.9106 270) (fp_text reference TP1 (at 1.27 0.508 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value TESTPAD/W_HOLE_1X1 (at -1.27 2.54 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top)) ) (pad P$1 thru_hole circle (at 0 0 270) (size 1.6256 1.6256) (drill 0.8128) (layers *.Cu *.Mask) (net 174 N$54) (solder_mask_margin 0.1016)) ) (module SOT23-BEC (layer Bottom) (tedit 0) (tstamp 5D7C285E) (at 164.3761 110.4646) (descr "TO-236 ITT Intermetall") (fp_text reference T1 (at -1.905 1.905) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value MMBT2907 (at -1.905 -3.175) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -1.1684 -1.2954) (xy -0.7112 -1.2954) (xy -0.7112 -0.7112) (xy -1.1684 -0.7112)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.7112 -1.2954) (xy 1.1684 -1.2954) (xy 1.1684 -0.7112) (xy 0.7112 -0.7112)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.2286 0.7112) (xy 0.2286 0.7112) (xy 0.2286 1.2954) (xy -0.2286 1.2954)) (layer B.Fab) (width 0)) (fp_line (start -1.4224 0.6604) (end 1.4224 0.6604) (layer B.Fab) (width 0.127)) (fp_line (start -1.4224 -0.6604) (end -1.4224 0.6604) (layer B.Fab) (width 0.127)) (fp_line (start 1.4224 -0.6604) (end -1.4224 -0.6604) (layer B.Fab) (width 0.127)) (fp_line (start 1.4224 0.6604) (end 1.4224 -0.6604) (layer B.Fab) (width 0.127)) (pad B smd rect (at -0.95 -1.1) (size 1 1.4) (layers Bottom B.Paste B.Mask) (net 170 N$50) (solder_mask_margin 0.1016)) (pad E smd rect (at 0.95 -1.1) (size 1 1.4) (layers Bottom B.Paste B.Mask) (net 37 VDD_3V3A) (solder_mask_margin 0.1016)) (pad C smd rect (at 0 1.1) (size 1 1.4) (layers Bottom B.Paste B.Mask) (net 39 VDD_1V8) (solder_mask_margin 0.1016)) ) (module SOT23-BEC (layer Bottom) (tedit 0) (tstamp 5D7C286B) (at 161.7091 113.1316 180) (descr "TO-236 ITT Intermetall") (fp_text reference T2 (at -1.905 1.905 270) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "DNP MMBT2907" (at -1.905 -3.175) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -1.1684 -1.2954) (xy -0.7112 -1.2954) (xy -0.7112 -0.7112) (xy -1.1684 -0.7112)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.7112 -1.2954) (xy 1.1684 -1.2954) (xy 1.1684 -0.7112) (xy 0.7112 -0.7112)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.2286 0.7112) (xy 0.2286 0.7112) (xy 0.2286 1.2954) (xy -0.2286 1.2954)) (layer B.Fab) (width 0)) (fp_line (start -1.4224 0.6604) (end 1.4224 0.6604) (layer B.Fab) (width 0.127)) (fp_line (start -1.4224 -0.6604) (end -1.4224 0.6604) (layer B.Fab) (width 0.127)) (fp_line (start 1.4224 -0.6604) (end -1.4224 -0.6604) (layer B.Fab) (width 0.127)) (fp_line (start 1.4224 0.6604) (end 1.4224 -0.6604) (layer B.Fab) (width 0.127)) (pad B smd rect (at -0.95 -1.1 180) (size 1 1.4) (layers Bottom B.Paste B.Mask) (net 172 N$52) (solder_mask_margin 0.1016)) (pad E smd rect (at 0.95 -1.1 180) (size 1 1.4) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad C smd rect (at 0 1.1 180) (size 1 1.4) (layers Bottom B.Paste B.Mask) (net 39 VDD_1V8) (solder_mask_margin 0.1016)) ) (module FIDUCIAL_40MIL (layer Bottom) (tedit 0) (tstamp 5D7C2878) (at 178.4731 125.4506 180) (fp_text reference FUD4 (at 0 0 180) (layer B.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15)) (justify mirror)) ) (fp_text value FIDUCIAL (at 0 0 180) (layer B.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 1.047268 0) (layer Dwgs.User) (width 0.127)) (fp_circle (center 0 0) (end 0.762 0) (layer B.Mask) (width 0.6096)) (pad P$1 smd roundrect (at 0 0 180) (size 1.016 1.016) (layers Bottom B.Paste B.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) ) (module FIDUCIAL_40MIL (layer Bottom) (tedit 0) (tstamp 5D7C287E) (at 182.7615 88.4664 180) (fp_text reference FUD5 (at 0 0 180) (layer B.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15)) (justify mirror)) ) (fp_text value FIDUCIAL (at 0 0 180) (layer B.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 1.047268 0) (layer Dwgs.User) (width 0.127)) (fp_circle (center 0 0) (end 0.762 0) (layer B.Mask) (width 0.6096)) (pad P$1 smd roundrect (at 0 0 180) (size 1.016 1.016) (layers Bottom B.Paste B.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) ) (module FIDUCIAL_40MIL (layer Bottom) (tedit 0) (tstamp 5D7C2884) (at 114.2619 124.5616 180) (fp_text reference FUD6 (at 0 0 180) (layer B.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15)) (justify mirror)) ) (fp_text value FIDUCIAL (at 0 0 180) (layer B.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15)) (justify mirror)) ) (fp_circle (center 0 0) (end 1.047268 0) (layer Dwgs.User) (width 0.127)) (fp_circle (center 0 0) (end 0.762 0) (layer B.Mask) (width 0.6096)) (pad P$1 smd roundrect (at 0 0 180) (size 1.016 1.016) (layers Bottom B.Paste B.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) ) (module MINI_PUSHBUTTON (layer Top) (tedit 0) (tstamp 5D7C288A) (at 113.2586 80.8736) (fp_text reference RESET (at -3 -2) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value MINI_PUSHBUTTON (at -3 3) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_line (start -2.35 1.5) (end 2.35 1.5) (layer F.SilkS) (width 0.2032)) (fp_line (start -2.35 -1.5) (end 2.35 -1.5) (layer F.SilkS) (width 0.2032)) (fp_circle (center 0 0) (end 0.694621 0) (layer F.SilkS) (width 0.2032)) (fp_line (start 2.35 0.05) (end 2.35 -0.05) (layer F.SilkS) (width 0.2032)) (fp_line (start -2.35 0.05) (end -2.35 -0.05) (layer F.SilkS) (width 0.2032)) (fp_line (start 2.35 1.5) (end -2.35 1.5) (layer F.Fab) (width 0.127)) (fp_line (start 2.35 -1.5) (end 2.35 1.5) (layer F.Fab) (width 0.127)) (fp_line (start -2.35 -1.5) (end 2.35 -1.5) (layer F.Fab) (width 0.127)) (fp_line (start -2.35 1.5) (end -2.35 -1.5) (layer F.Fab) (width 0.127)) (pad 4 smd rect (at 2 0.75) (size 1.2 0.9) (layers Top F.Paste F.Mask) (net 102 SYS_RESET#) (solder_mask_margin 0.1016)) (pad 2 smd rect (at 2 -0.75) (size 1.2 0.9) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -2 -0.75) (size 1.2 0.9) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 3 smd rect (at -2 0.75) (size 1.2 0.9) (layers Top F.Paste F.Mask) (net 102 SYS_RESET#) (solder_mask_margin 0.1016)) ) (module MINI_PUSHBUTTON (layer Top) (tedit 0) (tstamp 5D7C289A) (at 180.8861 89.1286) (fp_text reference S2 (at -3 -2) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value MINI_PUSHBUTTON (at -3 3) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_line (start -2.35 1.5) (end 2.35 1.5) (layer F.SilkS) (width 0.2032)) (fp_line (start -2.35 -1.5) (end 2.35 -1.5) (layer F.SilkS) (width 0.2032)) (fp_circle (center 0 0) (end 0.694621 0) (layer F.SilkS) (width 0.2032)) (fp_line (start 2.35 0.05) (end 2.35 -0.05) (layer F.SilkS) (width 0.2032)) (fp_line (start -2.35 0.05) (end -2.35 -0.05) (layer F.SilkS) (width 0.2032)) (fp_line (start 2.35 1.5) (end -2.35 1.5) (layer F.Fab) (width 0.127)) (fp_line (start 2.35 -1.5) (end 2.35 1.5) (layer F.Fab) (width 0.127)) (fp_line (start -2.35 -1.5) (end 2.35 -1.5) (layer F.Fab) (width 0.127)) (fp_line (start -2.35 1.5) (end -2.35 -1.5) (layer F.Fab) (width 0.127)) (pad 4 smd rect (at 2 0.75) (size 1.2 0.9) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 2 smd rect (at 2 -0.75) (size 1.2 0.9) (layers Top F.Paste F.Mask) (net 91 N$2) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -2 -0.75) (size 1.2 0.9) (layers Top F.Paste F.Mask) (net 91 N$2) (solder_mask_margin 0.1016)) (pad 3 smd rect (at -2 0.75) (size 1.2 0.9) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module MINI_PUSHBUTTON (layer Top) (tedit 0) (tstamp 5D7C28AA) (at 113.2586 90.3986 180) (fp_text reference POWER (at -3 -2) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value MINI_PUSHBUTTON (at -3 3) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_line (start -2.35 1.5) (end 2.35 1.5) (layer F.SilkS) (width 0.2032)) (fp_line (start -2.35 -1.5) (end 2.35 -1.5) (layer F.SilkS) (width 0.2032)) (fp_circle (center 0 0) (end 0.694621 0) (layer F.SilkS) (width 0.2032)) (fp_line (start 2.35 0.05) (end 2.35 -0.05) (layer F.SilkS) (width 0.2032)) (fp_line (start -2.35 0.05) (end -2.35 -0.05) (layer F.SilkS) (width 0.2032)) (fp_line (start 2.35 1.5) (end -2.35 1.5) (layer F.Fab) (width 0.127)) (fp_line (start 2.35 -1.5) (end 2.35 1.5) (layer F.Fab) (width 0.127)) (fp_line (start -2.35 -1.5) (end 2.35 -1.5) (layer F.Fab) (width 0.127)) (fp_line (start -2.35 1.5) (end -2.35 -1.5) (layer F.Fab) (width 0.127)) (pad 4 smd rect (at 2 0.75 180) (size 1.2 0.9) (layers Top F.Paste F.Mask) (net 63 PWR_BUT) (solder_mask_margin 0.1016)) (pad 2 smd rect (at 2 -0.75 180) (size 1.2 0.9) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -2 -0.75 180) (size 1.2 0.9) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 3 smd rect (at -2 0.75 180) (size 1.2 0.9) (layers Top F.Paste F.Mask) (net 63 PWR_BUT) (solder_mask_margin 0.1016)) ) (module "SOT1176-1(NXP)" (layer Bottom) (tedit 0) (tstamp 5D7C28BA) (at 175.1211 111.6086 270) (fp_text reference IC7 (at 0 0.8 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value IP4283CZ10-TBR (at 0 -0.9 180) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_circle (center -1.4 -0.75) (end -1.35 -0.75) (layer B.SilkS) (width 0.127)) (fp_line (start -1.225 -0.75) (end -1.225 0.75) (layer B.Fab) (width 0.0254)) (fp_line (start 1.225 -0.75) (end -1.225 -0.75) (layer B.Fab) (width 0.0254)) (fp_line (start 1.225 0.75) (end 1.225 -0.75) (layer B.Fab) (width 0.0254)) (fp_line (start -1.225 0.75) (end 1.225 0.75) (layer B.Fab) (width 0.0254)) (pad 10 smd rect (at -1 0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 9 smd rect (at -0.5 0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 8 smd rect (at 0 0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 7 smd rect (at 0.5 0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 6 smd rect (at 1 0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 5 smd rect (at 1 -0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (net 191 TX2+) (solder_mask_margin 0.1016)) (pad 4 smd rect (at 0.5 -0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (net 192 TX2-) (solder_mask_margin 0.1016)) (pad 3 smd rect (at 0 -0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 2 smd rect (at -0.5 -0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (net 193 TX1+) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -1 -0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (net 194 TX1-) (solder_mask_margin 0.1016)) ) (module "SOT1176-1(NXP)" (layer Bottom) (tedit 0) (tstamp 5D7C28CC) (at 175.1211 107.9086 270) (fp_text reference IC8 (at 0 0.8 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value IP4283CZ10-TBR (at 0 -0.9 180) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_circle (center -1.4 -0.75) (end -1.35 -0.75) (layer B.SilkS) (width 0.127)) (fp_line (start -1.225 -0.75) (end -1.225 0.75) (layer B.Fab) (width 0.0254)) (fp_line (start 1.225 -0.75) (end -1.225 -0.75) (layer B.Fab) (width 0.0254)) (fp_line (start 1.225 0.75) (end 1.225 -0.75) (layer B.Fab) (width 0.0254)) (fp_line (start -1.225 0.75) (end 1.225 0.75) (layer B.Fab) (width 0.0254)) (pad 10 smd rect (at -1 0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 9 smd rect (at -0.5 0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 8 smd rect (at 0 0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 7 smd rect (at 0.5 0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 6 smd rect (at 1 0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 5 smd rect (at 1 -0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (net 195 TX0+) (solder_mask_margin 0.1016)) (pad 4 smd rect (at 0.5 -0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (net 196 TX0-) (solder_mask_margin 0.1016)) (pad 3 smd rect (at 0 -0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 2 smd rect (at -0.5 -0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (net 197 TXC+) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -1 -0.3875 270) (size 0.2 0.475) (layers Bottom B.Paste B.Mask) (net 198 TXC-) (solder_mask_margin 0.1016)) ) (module "SOT804-4(NXP)" (layer Top) (tedit 0) (tstamp 5D7C28DE) (at 180.0711 97.0586 270) (fp_text reference IC9 (at -4.55 -5) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value TDA19988BHN/C1,557 (at -4.5 6.07 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top)) ) (fp_circle (center -4.88 -4.29) (end -4.79 -4.29) (layer F.SilkS) (width 0.3048)) (fp_line (start 4.5 4.5) (end 4.5 4.06) (layer F.SilkS) (width 0.127)) (fp_line (start 4.06 4.5) (end 4.5 4.5) (layer F.SilkS) (width 0.127)) (fp_line (start -4.5 4.5) (end -4.06 4.5) (layer F.SilkS) (width 0.127)) (fp_line (start -4.5 4.06) (end -4.5 4.5) (layer F.SilkS) (width 0.127)) (fp_line (start 4.5 -4.5) (end 4.06 -4.5) (layer F.SilkS) (width 0.127)) (fp_line (start 4.5 -4.06) (end 4.5 -4.5) (layer F.SilkS) (width 0.127)) (fp_line (start -4.5 -4.5) (end -4.5 -4.06) (layer F.SilkS) (width 0.127)) (fp_line (start -4.06 -4.5) (end -4.5 -4.5) (layer F.SilkS) (width 0.127)) (pad 64 smd rect (at -3.75 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 21 LCD.D10.G5--G7) (solder_mask_margin 0.1016)) (pad 63 smd rect (at -3.25 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 62 smd rect (at -2.75 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 61 smd rect (at -2.25 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 60 smd rect (at -1.75 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 17 LCD.D11.R0--R3) (solder_mask_margin 0.1016)) (pad 59 smd rect (at -1.25 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 16 LCD.D12.R1--R4) (solder_mask_margin 0.1016)) (pad 58 smd rect (at -0.75 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 15 LCD.D13.R2--R5) (solder_mask_margin 0.1016)) (pad 57 smd rect (at -0.25 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 14 LCD.D14.R3--R6) (solder_mask_margin 0.1016)) (pad 56 smd rect (at 0.25 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 13 LCD.D15.R4--R7) (solder_mask_margin 0.1016)) (pad 55 smd rect (at 0.75 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) (pad 54 smd rect (at 1.25 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 53 smd rect (at 1.75 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 52 smd rect (at 2.25 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 55 I2C0_SCL) (solder_mask_margin 0.1016)) (pad 51 smd rect (at 2.75 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 54 I2C0_SDA) (solder_mask_margin 0.1016)) (pad 50 smd rect (at 3.25 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 149 HDMI_INT) (solder_mask_margin 0.1016)) (pad 49 smd rect (at 3.75 -4.4 180) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 183 TEST) (solder_mask_margin 0.1016)) (pad 48 smd rect (at 4.4 -3.75 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) (pad 47 smd rect (at 4.4 -3.25 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) (pad 46 smd rect (at 4.4 -2.75 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) (pad 45 smd rect (at 4.4 -2.25 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 191 TX2+) (solder_mask_margin 0.1016)) (pad 44 smd rect (at 4.4 -1.75 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 192 TX2-) (solder_mask_margin 0.1016)) (pad 43 smd rect (at 4.4 -1.25 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 193 TX1+) (solder_mask_margin 0.1016)) (pad 42 smd rect (at 4.4 -0.75 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 194 TX1-) (solder_mask_margin 0.1016)) (pad 41 smd rect (at 4.4 -0.25 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) (pad 40 smd rect (at 4.4 0.25 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 195 TX0+) (solder_mask_margin 0.1016)) (pad 39 smd rect (at 4.4 0.75 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 196 TX0-) (solder_mask_margin 0.1016)) (pad 38 smd rect (at 4.4 1.25 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 197 TXC+) (solder_mask_margin 0.1016)) (pad 37 smd rect (at 4.4 1.75 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 198 TXC-) (solder_mask_margin 0.1016)) (pad 36 smd rect (at 4.4 2.25 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) (pad 35 smd rect (at 4.4 2.75 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) (pad 34 smd rect (at 4.4 3.25 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 187 EXT_SWING) (solder_mask_margin 0.1016)) (pad 33 smd rect (at 4.4 3.75 90) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 186 HDMI.DSCL) (solder_mask_margin 0.1016)) (pad 32 smd rect (at 3.75 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 185 HDMI.DSDA) (solder_mask_margin 0.1016)) (pad 31 smd rect (at 3.25 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 188 HPD) (solder_mask_margin 0.1016)) (pad 30 smd rect (at 2.75 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 189 CEC) (solder_mask_margin 0.1016)) (pad 29 smd rect (at 2.25 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) (pad 28 smd rect (at 1.75 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 27 smd rect (at 1.25 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 178 12MHZ) (solder_mask_margin 0.1016)) (pad 26 smd rect (at 0.75 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 25 smd rect (at 0.25 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 155 SPI1_CS0) (solder_mask_margin 0.1016)) (pad 24 smd rect (at -0.25 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 153 SPI1_D0) (solder_mask_margin 0.1016)) (pad 23 smd rect (at -0.75 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 152 SPI1_SCLK) (solder_mask_margin 0.1016)) (pad 22 smd rect (at -1.25 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 31 LCD.HSYNC) (solder_mask_margin 0.1016)) (pad 21 smd rect (at -1.75 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 30 LCD.VSYNC) (solder_mask_margin 0.1016)) (pad 20 smd rect (at -2.25 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 27 LCD.ENABLE) (solder_mask_margin 0.1016)) (pad 19 smd rect (at -2.75 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 18 smd rect (at -3.25 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 17 smd rect (at -3.75 4.4) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 16 smd rect (at -4.4 3.75 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 15 smd rect (at -4.4 3.25 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 28 LCD.D0.B0--B3) (solder_mask_margin 0.1016)) (pad 14 smd rect (at -4.4 2.75 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) (pad 13 smd rect (at -4.4 2.25 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 29 LCD.D1.B1--B4) (solder_mask_margin 0.1016)) (pad 12 smd rect (at -4.4 1.75 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 26 LCD.D2.B2--B5) (solder_mask_margin 0.1016)) (pad 11 smd rect (at -4.4 1.25 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 25 LCD.D3.B3--B6) (solder_mask_margin 0.1016)) (pad 10 smd rect (at -4.4 0.75 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 24 LCD.D4.B4--B7) (solder_mask_margin 0.1016)) (pad 9 smd rect (at -4.4 0.25 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 8 smd rect (at -4.4 -0.25 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 7 smd rect (at -4.4 -0.75 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 20 LCD.D5.G0--G2) (solder_mask_margin 0.1016)) (pad 6 smd rect (at -4.4 -1.25 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 19 LCD.D6.G1--G3) (solder_mask_margin 0.1016)) (pad 5 smd rect (at -4.4 -1.75 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) (pad 4 smd rect (at -4.4 -2.25 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 32 LCD.CLOCK) (solder_mask_margin 0.1016)) (pad 3 smd rect (at -4.4 -2.75 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 18 LCD.D7.G2--G4) (solder_mask_margin 0.1016)) (pad 2 smd rect (at -4.4 -3.25 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 23 LCD.D8.G3--G5) (solder_mask_margin 0.1016)) (pad 65 smd rect (at 0 0 270) (size 5.25 5.25) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -4.4 -3.75 270) (size 0.7 0.275) (layers Top F.Paste F.Mask) (net 22 LCD.D9.G4--G6) (solder_mask_margin 0.1016)) ) (module "MSOP-POWER.PAD-8(TI)" (layer Bottom) (tedit 0) (tstamp 5D7C292B) (at 184.0611 115.4811 90) (fp_text reference IC12 (at -1.95 -1.3 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value TPS2051BDGN (at 2.8 -2.625 180) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top mirror)) ) (fp_circle (center -1.8 -1.8) (end -1.7 -1.8) (layer B.SilkS) (width 0.3048)) (fp_line (start 1.5 1.5) (end 1.35 1.5) (layer B.SilkS) (width 0.127)) (fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer B.SilkS) (width 0.127)) (fp_line (start 1.35 -1.5) (end 1.5 -1.5) (layer B.SilkS) (width 0.127)) (fp_line (start -1.5 -1.5) (end -1.35 -1.5) (layer B.SilkS) (width 0.127)) (fp_line (start -1.5 1.5) (end -1.5 -1.5) (layer B.SilkS) (width 0.127)) (fp_line (start -1.35 1.5) (end -1.5 1.5) (layer B.SilkS) (width 0.127)) (pad 9 smd rect (at 0 0 90) (size 1.89 1.57) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 8 smd rect (at -0.975 2.1 90) (size 0.4 1.6) (layers Bottom B.Paste B.Mask) (net 200 VBUS.OUT) (solder_mask_margin 0.1016)) (pad 7 smd rect (at -0.325 2.1 90) (size 0.4 1.6) (layers Bottom B.Paste B.Mask) (net 200 VBUS.OUT) (solder_mask_margin 0.1016)) (pad 6 smd rect (at 0.325 2.1 90) (size 0.4 1.6) (layers Bottom B.Paste B.Mask) (net 200 VBUS.OUT) (solder_mask_margin 0.1016)) (pad 5 smd rect (at 0.975 2.1 90) (size 0.4 1.6) (layers Bottom B.Paste B.Mask) (net 143 USB1_OC#) (solder_mask_margin 0.1016)) (pad 4 smd rect (at 0.975 -2.1 90) (size 0.4 1.6) (layers Bottom B.Paste B.Mask) (net 166 USB1_DRVVBUS) (solder_mask_margin 0.1016)) (pad 3 smd rect (at 0.325 -2.1 90) (size 0.4 1.6) (layers Bottom B.Paste B.Mask) (net 133 SYS_5V) (solder_mask_margin 0.1016)) (pad 2 smd rect (at -0.325 -2.1 90) (size 0.4 1.6) (layers Bottom B.Paste B.Mask) (net 133 SYS_5V) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.975 -2.1 90) (size 0.4 1.6) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module "SON-6(TI)-DRY" (layer Top) (tedit 0) (tstamp 5D7C293E) (at 113.4491 87.7316 90) (fp_text reference IC14 (at -0.845 -0.825) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value TPD4S012DRY (at -0.88 1.85 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (fp_circle (center -0.945 0.62) (end -0.92 0.62) (layer F.SilkS) (width 0.127)) (fp_line (start -0.82 0.5) (end -0.82 -0.5) (layer F.SilkS) (width 0.127)) (fp_line (start 0.82 -0.5) (end 0.82 0.5) (layer F.SilkS) (width 0.127)) (pad 6 smd rect (at -0.5 -0.375 90) (size 0.3 0.49) (layers Top F.Paste F.Mask) (net 59 USB_DC) (solder_mask_margin 0.1016)) (pad 5 smd rect (at 0 -0.375 90) (size 0.3 0.49) (layers Top F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 4 smd rect (at 0.5 -0.375 90) (size 0.3 0.49) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 3 smd rect (at 0.5 0.375 90) (size 0.3 0.49) (layers Top F.Paste F.Mask) (net 58 USB.CLIENT.ID) (solder_mask_margin 0.1016)) (pad 2 smd rect (at 0 0.375 90) (size 0.3 0.49) (layers Top F.Paste F.Mask) (net 56 USB.CLIENT.D-) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0.38 90) (size 0.3 0.52) (layers Top F.Paste F.Mask) (net 57 USB.CLIENT.D+) (solder_mask_margin 0.1016)) ) (module "SON-6(TI)-DRY" (layer Bottom) (tedit 0) (tstamp 5D7C294A) (at 175.9966 115.7351 270) (fp_text reference IC15 (at -0.845 0.825 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value TPD4S012DRY (at -0.88 -1.85 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top mirror)) ) (fp_circle (center -0.945 -0.62) (end -0.92 -0.62) (layer B.SilkS) (width 0.127)) (fp_line (start -0.82 -0.5) (end -0.82 0.5) (layer B.SilkS) (width 0.127)) (fp_line (start 0.82 0.5) (end 0.82 -0.5) (layer B.SilkS) (width 0.127)) (pad 6 smd rect (at -0.5 0.375 270) (size 0.3 0.49) (layers Bottom B.Paste B.Mask) (net 200 VBUS.OUT) (solder_mask_margin 0.1016)) (pad 5 smd rect (at 0 0.375 270) (size 0.3 0.49) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 4 smd rect (at 0.5 0.375 270) (size 0.3 0.49) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 3 smd rect (at 0.5 -0.375 270) (size 0.3 0.49) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 2 smd rect (at 0 -0.375 270) (size 0.3 0.49) (layers Bottom B.Paste B.Mask) (net 61 USB.HOST.D-) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 -0.38 270) (size 0.3 0.52) (layers Bottom B.Paste B.Mask) (net 60 USB.HOST.D+) (solder_mask_margin 0.1016)) ) (module "VSSOP8(TI)" (layer Bottom) (tedit 0) (tstamp 5D7C2956) (at 153.3271 116.6876 270) (fp_text reference IC17 (at -1.15 -0.86 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value SN74LVC2G241DCUR (at 2.22 -2.08 180) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_circle (center -1.15 -1.13) (end -1.09 -1.13) (layer B.SilkS) (width 0.127)) (fp_line (start -1 -0.98) (end -1 0.98) (layer B.SilkS) (width 0.127)) (fp_line (start 1 -0.98) (end -1 -0.98) (layer B.SilkS) (width 0.127)) (fp_line (start 1 0.98) (end 1 -0.98) (layer B.SilkS) (width 0.127)) (fp_line (start -1 0.98) (end 1 0.98) (layer B.SilkS) (width 0.127)) (pad 8 smd rect (at -0.75 1.55 270) (size 0.3 0.8) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 7 smd rect (at -0.25 1.55 270) (size 0.3 0.8) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 6 smd rect (at 0.25 1.55 270) (size 0.3 0.8) (layers Bottom B.Paste B.Mask) (net 168 UART0_RXD) (solder_mask_margin 0.1016)) (pad 5 smd rect (at 0.75 1.55 270) (size 0.3 0.8) (layers Bottom B.Paste B.Mask) (net 167 UART0_TXD) (solder_mask_margin 0.1016)) (pad 4 smd rect (at 0.75 -1.55 270) (size 0.3 0.8) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 3 smd rect (at 0.25 -1.55 270) (size 0.3 0.8) (layers Bottom B.Paste B.Mask) (net 181 RX<-TX) (solder_mask_margin 0.1016)) (pad 2 smd rect (at -0.25 -1.55 270) (size 0.3 0.8) (layers Bottom B.Paste B.Mask) (net 180 TX->RX) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.75 -1.55 270) (size 0.3 0.8) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module TESTPAD_W_HOLE_1X1 (layer Top) (tedit 0) (tstamp 5D7C2966) (at 120.0531 121.6406) (fp_text reference TP2 (at 1.27 0.508) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value TESTPAD/W_HOLE_1X1 (at -1.27 2.54) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (pad P$1 thru_hole circle (at 0 0) (size 1.6256 1.6256) (drill 0.8128) (layers *.Cu *.Mask) (net 65 VIN_BAT) (solder_mask_margin 0.1016)) ) (module TESTPAD_W_HOLE_1X1 (layer Top) (tedit 0) (tstamp 5D7C296A) (at 120.0531 124.1806) (fp_text reference TP3 (at 1.27 0.508) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value TESTPAD/W_HOLE_1X1 (at -1.27 2.54) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (pad P$1 thru_hole circle (at 0 0) (size 1.6256 1.6256) (drill 0.8128) (layers *.Cu *.Mask) (net 66 BAT_VOLT) (solder_mask_margin 0.1016)) ) (module TESTPAD_W_HOLE_1X1 (layer Top) (tedit 0) (tstamp 5D7C296E) (at 122.5931 121.6406) (fp_text reference TP4 (at 1.27 0.508) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value TESTPAD/W_HOLE_1X1 (at -1.27 2.54) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (pad P$1 thru_hole circle (at 0 0) (size 1.6256 1.6256) (drill 0.8128) (layers *.Cu *.Mask) (net 67 BAT_TEMP) (solder_mask_margin 0.1016)) ) (module TESTPAD_W_HOLE_1X1 (layer Top) (tedit 0) (tstamp 5D7C2972) (at 122.5931 124.1806) (fp_text reference TP5 (at 1.27 0.508) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value TESTPAD/W_HOLE_1X1 (at -1.27 2.54) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (pad P$1 thru_hole circle (at 0 0) (size 1.6256 1.6256) (drill 0.8128) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module "SOD323(NXP)REFLOW" (layer Top) (tedit 0) (tstamp 5D7C2976) (at 174.4091 106.0196 270) (fp_text reference D1 (at -1.1 -1 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value RB751V40,115 (at -1.1 2.3 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top)) ) (fp_line (start -1.05 0.43) (end -1.05 0.65) (layer F.SilkS) (width 0.1524)) (fp_line (start 1.05 0.43) (end 1.05 0.65) (layer F.SilkS) (width 0.1524)) (fp_line (start 1.05 -0.65) (end 1.05 -0.43) (layer F.SilkS) (width 0.1524)) (fp_line (start -1.05 -0.65) (end -1.05 -0.43) (layer F.SilkS) (width 0.1524)) (fp_line (start -0.381 0.65) (end -0.381 -0.65) (layer F.SilkS) (width 0.127)) (fp_line (start -0.4445 -0.65) (end -0.4445 0.65) (layer F.SilkS) (width 0.127)) (fp_line (start -0.4445 0.65) (end -1.05 0.65) (layer F.SilkS) (width 0.1524)) (fp_line (start -0.381 0.65) (end -0.4445 0.65) (layer F.SilkS) (width 0.1524)) (fp_line (start 1.05 0.65) (end -0.381 0.65) (layer F.SilkS) (width 0.1524)) (fp_line (start -0.381 -0.65) (end 1.05 -0.65) (layer F.SilkS) (width 0.1524)) (fp_line (start -0.4445 -0.65) (end -0.381 -0.65) (layer F.SilkS) (width 0.1524)) (fp_line (start -1.05 -0.65) (end -0.4445 -0.65) (layer F.SilkS) (width 0.1524)) (fp_line (start 0.3032 0.4) (end -0.2968 0) (layer F.SilkS) (width 0.1524)) (fp_line (start 0.3032 -0.4) (end 0.3032 0.4) (layer F.SilkS) (width 0.1524)) (fp_line (start -0.2968 0) (end 0.3032 -0.4) (layer F.SilkS) (width 0.1524)) (fp_poly (pts (xy -0.45 0.65) (xy -0.25 0.65) (xy -0.25 -0.65) (xy -0.45 -0.65)) (layer F.Fab) (width 0)) (fp_line (start 0.3032 0.4) (end -0.2968 0) (layer F.Fab) (width 0.1524)) (fp_line (start 0.3032 -0.4) (end 0.3032 0.4) (layer F.Fab) (width 0.1524)) (fp_line (start -0.2968 0) (end 0.3032 -0.4) (layer F.Fab) (width 0.1524)) (fp_line (start -1.05 0.65) (end -1.05 -0.65) (layer F.Fab) (width 0.1524)) (fp_line (start 1.05 0.65) (end -1.05 0.65) (layer F.Fab) (width 0.1524)) (fp_line (start 1.05 -0.65) (end 1.05 0.65) (layer F.Fab) (width 0.1524)) (fp_line (start -1.05 -0.65) (end 1.05 -0.65) (layer F.Fab) (width 0.1524)) (pad A smd rect (at 1.05 0 270) (size 0.5 0.5) (layers Top F.Paste F.Mask) (net 190 N$66) (solder_mask_margin 0.1016)) (pad C smd rect (at -1.05 0 270) (size 0.5 0.5) (layers Top F.Paste F.Mask) (net 189 CEC) (solder_mask_margin 0.1016)) ) (module OSCILLATOR-2.5X2.0-BBB (layer Bottom) (tedit 0) (tstamp 5D7C2992) (at 155.7401 113.0046) (fp_text reference OSC1 (at -1.25 1.38) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value ASDMB-24.576MHZ-LC-T (at -2.29 -2.62) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top mirror)) ) (fp_line (start -0.29 -0.14) (end -1.36 -0.14) (layer B.SilkS) (width 0.2032)) (fp_line (start -0.29 -1.41) (end -0.29 -0.14) (layer B.SilkS) (width 0.2032)) (fp_line (start -1.36 -1.41) (end -0.29 -1.41) (layer B.SilkS) (width 0.2032)) (fp_line (start -1.36 -0.14) (end -1.36 -1.41) (layer B.SilkS) (width 0.2032)) (fp_line (start -0.33 1) (end 0.33 1) (layer B.SilkS) (width 0.127)) (fp_line (start 1.25 -0.18) (end 1.25 0.18) (layer B.SilkS) (width 0.127)) (fp_line (start -1.25 -0.18) (end -1.25 0.18) (layer B.SilkS) (width 0.127)) (fp_line (start -0.33 -1) (end 0.33 -1) (layer B.SilkS) (width 0.127)) (pad 4 smd rect (at -0.825 0.775) (size 0.65 0.85) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 3 smd rect (at 0.825 0.775) (size 0.65 0.85) (layers Bottom B.Paste B.Mask) (net 175 N$42) (solder_mask_margin 0.1016)) (pad 2 smd rect (at 0.825 -0.775) (size 0.65 0.85) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.825 -0.775) (size 0.65 0.85) (layers Bottom B.Paste B.Mask) (net 148 HDMICLK_DIS#) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C29A1) (at 153.3271 113.0046 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C47 (at -0.5 0.425 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value ".1uF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C29AA) (at 155.7401 115.0366) (descr "RESISTOR
\nchip") (fp_text reference R110 (at -0.635 0.762 -90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value 33 (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 151 GPIO3_21) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 175 N$42) (solder_mask_margin 0.1016)) ) (module "SM8-8(TI)" (layer Bottom) (tedit 0) (tstamp 5D7C29B8) (at 170.1661 103.8086 180) (fp_text reference IC13 (at -1.67 -1.35 270) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value SN74AUC1G74 (at 2.735 -1.48 270) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_circle (center -1.635 -1.56) (end -1.595 -1.56) (layer B.SilkS) (width 0.127)) (fp_line (start -1.475 1.4) (end -1.295 1.4) (layer B.SilkS) (width 0.127)) (fp_line (start 1.475 1.4) (end 1.295 1.4) (layer B.SilkS) (width 0.127)) (fp_line (start 1.475 -1.4) (end 1.295 -1.4) (layer B.SilkS) (width 0.127)) (fp_line (start -1.475 -1.4) (end -1.295 -1.4) (layer B.SilkS) (width 0.127)) (fp_line (start -1.475 -1.4) (end -1.475 1.4) (layer B.SilkS) (width 0.127)) (fp_line (start 1.475 1.4) (end 1.475 -1.4) (layer B.SilkS) (width 0.127)) (pad 8 smd rect (at -0.975 1.7 180) (size 0.3 1.6) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 7 smd rect (at -0.325 1.7 180) (size 0.3 1.6) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 6 smd rect (at 0.325 1.7 180) (size 0.3 1.6) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 5 smd rect (at 0.975 1.7 180) (size 0.3 1.6) (layers Bottom B.Paste B.Mask) (net 177 N$58) (solder_mask_margin 0.1016)) (pad 4 smd rect (at 0.975 -1.7 180) (size 0.3 1.6) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 3 smd rect (at 0.325 -1.7 180) (size 0.3 1.6) (layers Bottom B.Paste B.Mask) (net 176 12M_LOOP) (solder_mask_margin 0.1016)) (pad 2 smd rect (at -0.325 -1.7 180) (size 0.3 1.6) (layers Bottom B.Paste B.Mask) (net 176 12M_LOOP) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.975 -1.7 180) (size 0.3 1.6) (layers Bottom B.Paste B.Mask) (net 101 XDMA_EVENT_INTRO) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C29CA) (at 172.8343 103.8098 270) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C48 (at -0.5 0.425 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value ".1uF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C29D3) (at 173.063 101.7524) (descr "RESISTOR
\nchip") (fp_text reference FB6 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "1k BLM15AG102SN1D" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 178 12MHZ) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 177 N$58) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C29E1) (at 153.3271 114.5286) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C49 (at -0.5 0.425) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value ".1uF, 6.3V" (at -0.5 -1.45) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module TH-2X23 (layer Top) (tedit 0) (tstamp 5D7C29EA) (at 152.9461 80.8736) (fp_text reference P8 (at -29.21 -3.175) (layer F.SilkS) (effects (font (size 0.9652 0.9652) (thickness 0.14478)) (justify left bottom)) ) (fp_text value "" (at -29.21 4.445) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (fp_text user 45 (at 30.988 1.27) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.12192)) (justify left mirror)) ) (fp_text user 46 (at 30.988 -1.27) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.12192)) (justify left mirror)) ) (fp_text user 1 (at -29.464 1.27) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.12192)) (justify left mirror)) ) (fp_text user 2 (at -29.464 -1.27) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.12192)) (justify left mirror)) ) (fp_text user 46 (at 29.591 -1.27) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.12192)) (justify left)) ) (fp_text user 45 (at 29.591 1.27) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.12192)) (justify left)) ) (fp_text user 2 (at -29.337 -1.27) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.12192)) (justify right top)) ) (fp_text user 1 (at -29.337 1.27) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.12192)) (justify right top)) ) (fp_poly (pts (xy 27.686 1.524) (xy 28.194 1.524) (xy 28.194 1.016) (xy 27.686 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 27.686 -1.016) (xy 28.194 -1.016) (xy 28.194 -1.524) (xy 27.686 -1.524)) (layer F.Fab) (width 0)) (fp_line (start 29.21 -1.905) (end 29.21 1.905) (layer F.SilkS) (width 0.1524)) (fp_line (start 26.67 1.905) (end 27.305 2.54) (layer F.SilkS) (width 0.1524)) (fp_line (start 28.575 2.54) (end 27.305 2.54) (layer F.SilkS) (width 0.1524)) (fp_line (start 29.21 1.905) (end 28.575 2.54) (layer F.SilkS) (width 0.1524)) (fp_line (start 28.575 -2.54) (end 29.21 -1.905) (layer F.SilkS) (width 0.1524)) (fp_line (start 28.575 -2.54) (end 27.305 -2.54) (layer F.SilkS) (width 0.1524)) (fp_line (start 26.67 -1.905) (end 27.305 -2.54) (layer F.SilkS) (width 0.1524)) (fp_poly (pts (xy 25.146 1.524) (xy 25.654 1.524) (xy 25.654 1.016) (xy 25.146 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 25.146 -1.016) (xy 25.654 -1.016) (xy 25.654 -1.524) (xy 25.146 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 22.606 1.524) (xy 23.114 1.524) (xy 23.114 1.016) (xy 22.606 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 22.606 -1.016) (xy 23.114 -1.016) (xy 23.114 -1.524) (xy 22.606 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 20.066 1.524) (xy 20.574 1.524) (xy 20.574 1.016) (xy 20.066 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 20.066 -1.016) (xy 20.574 -1.016) (xy 20.574 -1.524) (xy 20.066 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 17.526 1.524) (xy 18.034 1.524) (xy 18.034 1.016) (xy 17.526 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 17.526 -1.016) (xy 18.034 -1.016) (xy 18.034 -1.524) (xy 17.526 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 14.986 1.524) (xy 15.494 1.524) (xy 15.494 1.016) (xy 14.986 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 14.986 -1.016) (xy 15.494 -1.016) (xy 15.494 -1.524) (xy 14.986 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 12.446 1.524) (xy 12.954 1.524) (xy 12.954 1.016) (xy 12.446 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 12.446 -1.016) (xy 12.954 -1.016) (xy 12.954 -1.524) (xy 12.446 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 9.906 1.524) (xy 10.414 1.524) (xy 10.414 1.016) (xy 9.906 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 9.906 -1.016) (xy 10.414 -1.016) (xy 10.414 -1.524) (xy 9.906 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 7.366 1.524) (xy 7.874 1.524) (xy 7.874 1.016) (xy 7.366 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 7.366 -1.016) (xy 7.874 -1.016) (xy 7.874 -1.524) (xy 7.366 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 4.826 1.524) (xy 5.334 1.524) (xy 5.334 1.016) (xy 4.826 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 4.826 -1.016) (xy 5.334 -1.016) (xy 5.334 -1.524) (xy 4.826 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 2.286 1.524) (xy 2.794 1.524) (xy 2.794 1.016) (xy 2.286 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 2.286 -1.016) (xy 2.794 -1.016) (xy 2.794 -1.524) (xy 2.286 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.254 1.524) (xy 0.254 1.524) (xy 0.254 1.016) (xy -0.254 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.254 -1.016) (xy 0.254 -1.016) (xy 0.254 -1.524) (xy -0.254 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -2.794 1.524) (xy -2.286 1.524) (xy -2.286 1.016) (xy -2.794 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -2.794 -1.016) (xy -2.286 -1.016) (xy -2.286 -1.524) (xy -2.794 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -5.334 1.524) (xy -4.826 1.524) (xy -4.826 1.016) (xy -5.334 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -5.334 -1.016) (xy -4.826 -1.016) (xy -4.826 -1.524) (xy -5.334 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -7.874 1.524) (xy -7.366 1.524) (xy -7.366 1.016) (xy -7.874 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -7.874 -1.016) (xy -7.366 -1.016) (xy -7.366 -1.524) (xy -7.874 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -10.414 1.524) (xy -9.906 1.524) (xy -9.906 1.016) (xy -10.414 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -10.414 -1.016) (xy -9.906 -1.016) (xy -9.906 -1.524) (xy -10.414 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -12.954 1.524) (xy -12.446 1.524) (xy -12.446 1.016) (xy -12.954 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -12.954 -1.016) (xy -12.446 -1.016) (xy -12.446 -1.524) (xy -12.954 -1.524)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -15.494 1.524) (xy -14.986 1.524) (xy -14.986 1.016) (xy -15.494 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -18.034 1.524) (xy -17.526 1.524) (xy -17.526 1.016) (xy -18.034 1.016)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -20.574 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1.524 1.524) (drill 0.762) (layers *.Cu *.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 3 thru_hole circle (at -25.4 1.27) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 2 thru_hole circle (at -27.94 -1.27) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 thru_hole rect (at -27.94 1.27) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module TH-1X6 (layer Top) (tedit 0) (tstamp 5D7C2BFC) (at 154.2161 124.6886) (fp_text reference X1 (at -6.35 -1.905 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "" (at -6.35 3.175) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (fp_line (start 2.54 0.635) (end 2.54 -0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start 5.08 0.635) (end 5.08 -0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start 0.635 1.27) (end 0 0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start 1.905 1.27) (end 0.635 1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start 2.54 0.635) (end 1.905 1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start 3.175 1.27) (end 2.54 0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start 4.445 1.27) (end 3.175 1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start 5.08 0.635) (end 4.445 1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start 5.715 1.27) (end 5.08 0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start 6.985 1.27) (end 5.715 1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start 7.62 0.635) (end 6.985 1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start 7.62 -0.635) (end 7.62 0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start 0.635 -1.27) (end 0 -0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start 1.905 -1.27) (end 0.635 -1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start 2.54 -0.635) (end 1.905 -1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start 3.175 -1.27) (end 2.54 -0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start 4.445 -1.27) (end 3.175 -1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start 5.08 -0.635) (end 4.445 -1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start 5.715 -1.27) (end 5.08 -0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start 6.985 -1.27) (end 5.715 -1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start 7.62 -0.635) (end 6.985 -1.27) (layer F.SilkS) (width 0.1524)) (fp_poly (pts (xy 3.556 0.254) (xy 4.064 0.254) (xy 4.064 -0.254) (xy 3.556 -0.254)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 6.096 0.254) (xy 6.604 0.254) (xy 6.604 -0.254) (xy 6.096 -0.254)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 1.016 0.254) (xy 1.524 0.254) (xy 1.524 -0.254) (xy 1.016 -0.254)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -1.524 0.254) (xy -1.016 0.254) (xy -1.016 -0.254) (xy -1.524 -0.254)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -6.604 0.254) (xy -6.096 0.254) (xy -6.096 -0.254) (xy -6.604 -0.254)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -4.064 0.254) (xy -3.556 0.254) (xy -3.556 -0.254) (xy -4.064 -0.254)) (layer F.Fab) (width 0)) (fp_line (start 0 -0.635) (end 0 0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start -2.54 -0.635) (end -2.54 0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start -5.08 -0.635) (end -5.08 0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start -0.635 -1.27) (end 0 -0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start -1.905 -1.27) (end -0.635 -1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start -2.54 -0.635) (end -1.905 -1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start -3.175 -1.27) (end -2.54 -0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start -4.445 -1.27) (end -3.175 -1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start -5.08 -0.635) (end -4.445 -1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start -5.715 -1.27) (end -5.08 -0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start -6.985 -1.27) (end -5.715 -1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start -7.62 -0.635) (end -6.985 -1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start -7.62 0.635) (end -7.62 -0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start -0.635 1.27) (end 0 0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start -1.905 1.27) (end -0.635 1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start -2.54 0.635) (end -1.905 1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start -3.175 1.27) (end -2.54 0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start -4.445 1.27) (end -3.175 1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start -5.08 0.635) (end -4.445 1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start -5.715 1.27) (end -5.08 0.635) (layer F.SilkS) (width 0.1524)) (fp_line (start -6.985 1.27) (end -5.715 1.27) (layer F.SilkS) (width 0.1524)) (fp_line (start -7.62 0.635) (end -6.985 1.27) (layer F.SilkS) (width 0.1524)) (pad 6 thru_hole circle (at 6.35 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask) (solder_mask_margin 0.1016)) (pad 5 thru_hole circle (at 3.81 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask) (net 181 RX<-TX) (solder_mask_margin 0.1016)) (pad 4 thru_hole circle (at 1.27 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask) (net 180 TX->RX) (solder_mask_margin 0.1016)) (pad 3 thru_hole circle (at -1.27 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask) (solder_mask_margin 0.1016)) (pad 2 thru_hole circle (at -3.81 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask) (solder_mask_margin 0.1016)) (pad 1 thru_hole rect (at -6.35 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module SM-1206 (layer Bottom) (tedit 0) (tstamp 5D7C2C36) (at 170.4721 113.7666 180) (descr "SMD CHIP INDUCTOR
\nbody 1206") (fp_text reference F1 (at -2.143 0.997) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value 1206L025YR (at -2.208 -2.308) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_line (start -0.9 0.6) (end -1.3 0.6) (layer B.Fab) (width 0.2032)) (fp_line (start 0.9 0.6) (end -0.9 0.6) (layer B.SilkS) (width 0.2032)) (fp_line (start 1.3 0.6) (end 0.9 0.6) (layer B.Fab) (width 0.2032)) (fp_line (start 0.9 -0.6) (end 1.3 -0.6) (layer B.Fab) (width 0.2032)) (fp_line (start -0.9 -0.6) (end 0.9 -0.6) (layer B.SilkS) (width 0.2032)) (fp_line (start -1.3 -0.6) (end -0.9 -0.6) (layer B.Fab) (width 0.2032)) (fp_line (start -1.3 0.7) (end -2.1 0.7) (layer B.Fab) (width 0.2032)) (fp_line (start -1.3 0.6) (end -1.3 0.7) (layer B.Fab) (width 0.2032)) (fp_line (start -1.3 -0.6) (end -1.3 0.6) (layer B.Fab) (width 0.2032)) (fp_line (start -1.3 -0.7) (end -1.3 -0.6) (layer B.Fab) (width 0.2032)) (fp_line (start -2.1 -0.7) (end -1.3 -0.7) (layer B.Fab) (width 0.2032)) (fp_line (start -2.1 0.7) (end -2.1 -0.7) (layer B.Fab) (width 0.2032)) (fp_line (start 2.1 0.7) (end 1.3 0.7) (layer B.Fab) (width 0.2032)) (fp_line (start 2.1 -0.7) (end 2.1 0.7) (layer B.Fab) (width 0.2032)) (fp_line (start 1.3 -0.7) (end 2.1 -0.7) (layer B.Fab) (width 0.2032)) (fp_line (start 1.3 -0.6) (end 1.3 -0.7) (layer B.Fab) (width 0.2032)) (fp_line (start 1.3 0.6) (end 1.3 -0.6) (layer B.Fab) (width 0.2032)) (fp_line (start 1.3 0.7) (end 1.3 0.6) (layer B.Fab) (width 0.2032)) (pad 2 smd rect (at 1.65 0 180) (size 1.2 1.8) (layers Bottom B.Paste B.Mask) (net 133 SYS_5V) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -1.65 0 180) (size 1.2 1.8) (layers Bottom B.Paste B.Mask) (net 184 DVI_5V) (solder_mask_margin 0.1016)) ) (module 0805-RESISTOR (layer Top) (tedit 0) (tstamp 5D7C2C4D) (at 174.1551 115.6716) (fp_text reference FB2 (at -1.905 -1.27 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "2.5k Ohm (BLM18BD252SN1D)" (at -1.905 2.54) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.5001) (xy 0.1999 0.5001) (xy 0.1999 -0.5001) (xy -0.1999 -0.5001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy -1.0668 0.6985) (xy -0.4168 0.6985) (xy -0.4168 -0.7015) (xy -1.0668 -0.7015)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 0.4064 0.6985) (xy 1.0564 0.6985) (xy 1.0564 -0.7015) (xy 0.4064 -0.7015)) (layer F.Fab) (width 0)) (fp_line (start -1.973 0.983) (end -1.973 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.973 0.983) (end -1.973 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.973 -0.983) (end 1.973 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.973 -0.983) (end 1.973 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.41 0.635) (end 0.41 0.635) (layer F.Fab) (width 0.1524)) (fp_line (start -0.41 -0.635) (end 0.41 -0.635) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.95 0) (size 1.3 1.5) (layers Top F.Paste F.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.95 0) (size 1.3 1.5) (layers Top F.Paste F.Mask) (net 39 VDD_1V8) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2C5B) (at 185.7211 103.9086 90) (descr "RESISTOR
\nchip") (fp_text reference R114 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "0, 1%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 183 TEST) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2C69) (at 176.3211 103.5586 90) (descr "RESISTOR
\nchip") (fp_text reference R115 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "1.5k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 186 HDMI.DSCL) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 184 DVI_5V) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2C77) (at 175.0211 103.5586 90) (descr "RESISTOR
\nchip") (fp_text reference R118 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "1.5k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 185 HDMI.DSDA) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 184 DVI_5V) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2C85) (at 178.8711 103.7086) (descr "RESISTOR
\nchip") (fp_text reference R119 (at -0.635 0.762 -90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "10k, 1%" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 187 EXT_SWING) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2C93) (at 172.7581 106.0196 270) (descr "RESISTOR
\nchip") (fp_text reference R120 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "27k, 1%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 190 N$66) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2CA1) (at 185.7211 102.0586 90) (descr "RESISTOR
\nchip") (fp_text reference R121 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "10k, 1%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 149 HDMI_INT) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C2CAF) (at 180.8711 103.7086 180) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C50 (at -0.5 0.425) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value ".1uF, 6.3V" (at -0.5 -1.45) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C2CB8) (at 186.4741 105.8926) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C51 (at -0.5 -0.425) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value ".1uF, 6.3V" (at -0.5 1.45) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C2CC1) (at 173.063 98.7044 180) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C52 (at -0.5 0.425) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value ".1uF, 6.3V" (at -0.5 -1.45) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C2CCA) (at 189.2681 99.6696) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C53 (at -0.5 -0.425) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value ".1uF, 6.3V" (at -0.5 1.45) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) ) (module C0603K (layer Bottom) (tedit 0) (tstamp 5D7C2CD3) (at 173.063 100.2284 180) (descr "Ceramic Chip Capacitor KEMET 0603 Reflow solder
\nMetric Code Size 1608") (fp_text reference C54 (at -0.8 0.65) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "2.2uF, 6.3V" (at -0.8 -1.65) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.45 -0.4) (xy 0.8 -0.4) (xy 0.8 0.4) (xy 0.45 0.4)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.8 -0.4) (xy -0.45 -0.4) (xy -0.45 0.4) (xy -0.8 0.4)) (layer B.Fab) (width 0)) (fp_line (start 0 0.508) (end 0 -0.508) (layer B.SilkS) (width 0.127)) (fp_line (start 0.725 -0.35) (end -0.725 -0.35) (layer B.Fab) (width 0.1016)) (fp_line (start -0.725 0.35) (end 0.725 0.35) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.875 0 180) (size 1.05 1.08) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.875 0 180) (size 1.05 1.08) (layers Bottom B.Paste B.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) ) (module C0603K (layer Top) (tedit 0) (tstamp 5D7C2CDD) (at 186.8551 98.0186 90) (descr "Ceramic Chip Capacitor KEMET 0603 Reflow solder
\nMetric Code Size 1608") (fp_text reference C55 (at -0.8 -0.65 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "2.2uF, 6.3V" (at -0.8 1.65 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom)) ) (fp_poly (pts (xy 0.45 0.4) (xy 0.8 0.4) (xy 0.8 -0.4) (xy 0.45 -0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.8 0.4) (xy -0.45 0.4) (xy -0.45 -0.4) (xy -0.8 -0.4)) (layer F.Fab) (width 0)) (fp_line (start 0 -0.508) (end 0 0.508) (layer F.SilkS) (width 0.127)) (fp_line (start 0.725 0.35) (end -0.725 0.35) (layer F.Fab) (width 0.1016)) (fp_line (start -0.725 -0.35) (end 0.725 -0.35) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.875 0 90) (size 1.05 1.08) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.875 0 90) (size 1.05 1.08) (layers Top F.Paste F.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) ) (module C0603K (layer Top) (tedit 0) (tstamp 5D7C2CE7) (at 184.3151 105.8926 270) (descr "Ceramic Chip Capacitor KEMET 0603 Reflow solder
\nMetric Code Size 1608") (fp_text reference C56 (at -0.8 -0.65 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "2.2uF, 6.3V" (at -0.8 1.65 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top)) ) (fp_poly (pts (xy 0.45 0.4) (xy 0.8 0.4) (xy 0.8 -0.4) (xy 0.45 -0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.8 0.4) (xy -0.45 0.4) (xy -0.45 -0.4) (xy -0.8 -0.4)) (layer F.Fab) (width 0)) (fp_line (start 0 -0.508) (end 0 0.508) (layer F.SilkS) (width 0.127)) (fp_line (start 0.725 0.35) (end -0.725 0.35) (layer F.Fab) (width 0.1016)) (fp_line (start -0.725 -0.35) (end 0.725 -0.35) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.875 0 270) (size 1.05 1.08) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.875 0 270) (size 1.05 1.08) (layers Top F.Paste F.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) ) (module C0603K (layer Bottom) (tedit 0) (tstamp 5D7C2CF1) (at 180.8711 104.9586 180) (descr "Ceramic Chip Capacitor KEMET 0603 Reflow solder
\nMetric Code Size 1608") (fp_text reference C57 (at -0.8 0.65) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "2.2uF, 6.3V" (at -0.8 -1.65) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom mirror)) ) (fp_poly (pts (xy 0.45 -0.4) (xy 0.8 -0.4) (xy 0.8 0.4) (xy 0.45 0.4)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.8 -0.4) (xy -0.45 -0.4) (xy -0.45 0.4) (xy -0.8 0.4)) (layer B.Fab) (width 0)) (fp_line (start 0 0.508) (end 0 -0.508) (layer B.SilkS) (width 0.127)) (fp_line (start 0.725 -0.35) (end -0.725 -0.35) (layer B.Fab) (width 0.1016)) (fp_line (start -0.725 0.35) (end 0.725 0.35) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.875 0 180) (size 1.05 1.08) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.875 0 180) (size 1.05 1.08) (layers Bottom B.Paste B.Mask) (net 182 HDMI_1V8) (solder_mask_margin 0.1016)) ) (module 0805-RESISTOR (layer Bottom) (tedit 0) (tstamp 5D7C2CFB) (at 184.0611 118.9736 180) (fp_text reference FB3 (at -1.905 1.27) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "150 Ohm 800mA" (at -1.905 -2.54) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.5001) (xy 0.1999 -0.5001) (xy 0.1999 0.5001) (xy -0.1999 0.5001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -1.0668 -0.6985) (xy -0.4168 -0.6985) (xy -0.4168 0.7015) (xy -1.0668 0.7015)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.4064 -0.6985) (xy 1.0564 -0.6985) (xy 1.0564 0.7015) (xy 0.4064 0.7015)) (layer B.Fab) (width 0)) (fp_line (start -1.973 -0.983) (end -1.973 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.973 -0.983) (end -1.973 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.973 0.983) (end 1.973 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.973 0.983) (end 1.973 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.41 -0.635) (end 0.41 -0.635) (layer B.Fab) (width 0.1524)) (fp_line (start -0.41 0.635) (end 0.41 0.635) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.95 0 180) (size 1.3 1.5) (layers Bottom B.Paste B.Mask) (net 199 VBUS.HOST) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.95 0 180) (size 1.3 1.5) (layers Bottom B.Paste B.Mask) (net 200 VBUS.OUT) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2D09) (at 186.8551 113.5126 180) (descr "RESISTOR
\nchip") (fp_text reference R122 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "0, 1%" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 143 USB1_OC#) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C2D17) (at 174.3456 115.6716 270) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C58 (at -0.5 0.425 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value ".1uF, 6.3V" (at -0.5 -1.45 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 200 VBUS.OUT) (solder_mask_margin 0.1016)) ) (module 0805-RESISTOR (layer Bottom) (tedit 0) (tstamp 5D7C2D20) (at 188.6331 115.4811 90) (fp_text reference FB4 (at -1.905 1.27 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "0.1 Ohm, 0805" (at -1.905 -2.54 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.5001) (xy 0.1999 -0.5001) (xy 0.1999 0.5001) (xy -0.1999 0.5001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -1.0668 -0.6985) (xy -0.4168 -0.6985) (xy -0.4168 0.7015) (xy -1.0668 0.7015)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.4064 -0.6985) (xy 1.0564 -0.6985) (xy 1.0564 0.7015) (xy 0.4064 0.7015)) (layer B.Fab) (width 0)) (fp_line (start -1.973 -0.983) (end -1.973 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.973 -0.983) (end -1.973 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.973 0.983) (end 1.973 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.973 0.983) (end 1.973 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.41 -0.635) (end 0.41 -0.635) (layer B.Fab) (width 0.1524)) (fp_line (start -0.41 0.635) (end 0.41 0.635) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.95 0 90) (size 1.3 1.5) (layers Bottom B.Paste B.Mask) (net 201 USB1_VBUS) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.95 0 90) (size 1.3 1.5) (layers Bottom B.Paste B.Mask) (net 200 VBUS.OUT) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C2D2E) (at 111.7981 87.7316 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C59 (at -0.5 -0.425 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value ".1uF, 6.3V" (at -0.5 1.45 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 59 USB_DC) (solder_mask_margin 0.1016)) ) (module D_7343-31W (layer Top) (tedit 0) (tstamp 5D7C2D37) (at 174.4091 121.6406 90) (descr "Chip Capacitor Type KEMET D / EIA 7343-21
\nKEMET V / EIA 7343-20, KEMET X / EIA 7343-43 Wafe solder") (fp_text reference C62 (at -3.65 -2.3 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "220uF 6.3V" (at -3.65 3.575 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy 2.675 2.125) (xy 3.15 2.125) (xy 3.15 -2.125) (xy 2.675 -2.125)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 3.5 1.2) (xy 3.65 1.2) (xy 3.65 -1.2) (xy 3.5 -1.2)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -3.65 1.2) (xy -3.5 1.2) (xy -3.5 -1.2) (xy -3.65 -1.2)) (layer F.Fab) (width 0)) (fp_line (start -3.45 2.1) (end -3.45 -2.1) (layer F.Fab) (width 0.1016)) (fp_line (start 3.45 2.1) (end -3.45 2.1) (layer F.Fab) (width 0.1016)) (fp_line (start 3.45 -2.1) (end 3.45 2.1) (layer F.Fab) (width 0.1016)) (fp_line (start -3.45 -2.1) (end 3.45 -2.1) (layer F.Fab) (width 0.1016)) (pad - smd rect (at -3.375 0 90) (size 2.95 2.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad + smd rect (at 3.375 0 90) (size 2.95 2.7) (layers Top F.Paste F.Mask) (net 133 SYS_5V) (solder_mask_margin 0.1016)) ) (module B1,27 (layer Top) (tedit 0) (tstamp 5D7C2D43) (at 143.1925 124.6886 90) (descr "TEST PAD") (fp_text reference TP6 (at -0.635 -1.016 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value PTR1B1,27 (at -0.635 0.762 90) (layer F.Fab) (effects (font (size 0.02413 0.02413) (thickness 0.00193)) (justify left bottom)) ) (fp_text user >TP_SIGNAL_NAME (at -0.635 1.905 90) (layer Dwgs.User) (effects (font (size 0.95 0.95) (thickness 0.08)) (justify left bottom)) ) (fp_line (start 0 -0.635) (end 0 0.635) (layer Dwgs.User) (width 0.0024)) (fp_line (start -0.635 0) (end 0.635 0) (layer Dwgs.User) (width 0.0024)) (pad TP smd roundrect (at 0 0 90) (size 1.27 1.27) (layers Top F.Mask) (roundrect_rratio 0.5) (net 169 UART0_RST#) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2D4A) (at 157.1371 116.6876 90) (descr "RESISTOR
\nchip") (fp_text reference R123 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "100k, 1%" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 180 TX->RX) (solder_mask_margin 0.1016)) ) (module JTAG (layer Bottom) (tedit 0) (tstamp 5D7C2D58) (at 139.3571 119.9896 90) (fp_text reference P2 (at 0 4.2926 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "" (at 0 0 90) (layer B.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15)) (justify mirror)) ) (fp_text user 1 (at -5.6134 -0.9779 90) (layer B.SilkS) (effects (font (size 0.9652 0.9652) (thickness 0.12192)) (justify bottom mirror)) ) (fp_line (start -6.2484 -1.1176) (end -5.1816 -1.1176) (layer B.SilkS) (width 0.127)) (fp_line (start -6.2484 -4.2926) (end -6.2484 -1.1176) (layer B.SilkS) (width 0.127)) (fp_line (start -5.1816 -4.2926) (end -6.2484 -4.2926) (layer B.SilkS) (width 0.127)) (fp_line (start -5.1816 -1.1176) (end -5.1816 -4.2926) (layer B.SilkS) (width 0.127)) (fp_text user 20 (at 6.35 2.7051 90) (layer Cmts.User) (effects (font (size 0.9652 0.9652) (thickness 0.12192)) (justify right)) ) (fp_text user 19 (at 6.35 -2.7051 90) (layer Cmts.User) (effects (font (size 0.9652 0.9652) (thickness 0.12192)) (justify right)) ) (fp_text user 2 (at -6.096 2.7051 90) (layer Cmts.User) (effects (font (size 0.9652 0.9652) (thickness 0.12192)) (justify left top)) ) (fp_text user 1 (at -6.096 -2.7051 90) (layer Cmts.User) (effects (font (size 0.9652 0.9652) (thickness 0.12192)) (justify left top)) ) (pad 20 smd rect (at 5.715 2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 19 smd rect (at 5.715 -2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 69 SD.CD) (solder_mask_margin 0.1016)) (pad 18 smd rect (at 4.445 2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 99 CLKOUT2) (solder_mask_margin 0.1016)) (pad 17 smd rect (at 4.445 -2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 101 XDMA_EVENT_INTRO) (solder_mask_margin 0.1016)) (pad 16 smd rect (at 3.175 2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 15 smd rect (at 3.175 -2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 102 SYS_RESET#) (solder_mask_margin 0.1016)) (pad 14 smd rect (at 1.905 2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 98 JTAG_EMU1) (solder_mask_margin 0.1016)) (pad 13 smd rect (at 1.905 -2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 97 JTAG_EMU0) (solder_mask_margin 0.1016)) (pad 12 smd rect (at 0.635 2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 11 smd rect (at 0.635 -2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 95 JTAG_TCK) (solder_mask_margin 0.1016)) (pad 10 smd rect (at -0.635 2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 9 smd rect (at -0.635 -2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 95 JTAG_TCK) (solder_mask_margin 0.1016)) (pad 8 smd rect (at -1.905 2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 7 smd rect (at -1.905 -2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 96 JTAG_TDO) (solder_mask_margin 0.1016)) (pad 6 smd rect (at -3.175 2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 5 smd rect (at -3.175 -2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 4 smd rect (at -4.445 2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 3 smd rect (at -4.445 -2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 94 JTAG_TDI) (solder_mask_margin 0.1016)) (pad 2 smd rect (at -5.715 2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 92 JTAG_TRSTN) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -5.715 -2.7051 90) (size 0.7112 2.794) (layers Bottom B.Paste B.Mask) (net 93 JTAG_TMS) (solder_mask_margin 0.1016)) ) (module CRYSTAL_5X3.2MM (layer Top) (tedit 0) (tstamp 5D7C2D78) (at 138.4681 109.0676 90) (fp_text reference Q4 (at -2.794 -2.032 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "24 MHz" (at -3.048 2.794 90) (layer F.Fab) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_line (start -2.6 1.37) (end -2.6 1.7) (layer F.SilkS) (width 0.127)) (fp_line (start -2.6 -1.7) (end -2.6 -1.37) (layer F.SilkS) (width 0.127)) (fp_line (start 2.6 -1.7) (end -2.6 -1.7) (layer F.SilkS) (width 0.127)) (fp_line (start 2.6 -1.37) (end 2.6 -1.7) (layer F.SilkS) (width 0.127)) (fp_line (start 2.6 1.7) (end 2.6 1.37) (layer F.SilkS) (width 0.127)) (fp_line (start -2.6 1.7) (end 2.6 1.7) (layer F.SilkS) (width 0.127)) (pad 2 smd rect (at 1.95 0 90) (size 1.9 2.4) (layers Top F.Paste F.Mask) (net 3 N$7) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -1.95 0 90) (size 1.9 2.4) (layers Top F.Paste F.Mask) (net 2 N$6) (solder_mask_margin 0.1016)) ) (module "MOC-100(TI)" (layer Top) (tedit 0) (tstamp 5D7C2D83) (at 120.7211 102.9086 180) (fp_text reference MOD1 (at -6.46 7.93) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value WL1835MODGBMOCT (at -6.68 -6.82) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top)) ) (fp_circle (center -6.93 6.88) (end -6.849379 6.88) (layer F.SilkS) (width 0.3048)) (fp_line (start 6.7 6.65) (end 6.7 5.27) (layer F.SilkS) (width 0.127)) (fp_line (start 5.27 6.65) (end 6.7 6.65) (layer F.SilkS) (width 0.127)) (fp_line (start -6.7 6.65) (end -5.27 6.65) (layer F.SilkS) (width 0.127)) (fp_line (start -6.7 5.27) (end -6.7 6.65) (layer F.SilkS) (width 0.127)) (fp_line (start 6.7 -6.65) (end 6.7 -5.27) (layer F.SilkS) (width 0.127)) (fp_line (start 6.7 -6.65) (end 5.27 -6.65) (layer F.SilkS) (width 0.127)) (fp_line (start -6.7 -6.65) (end -6.7 -5.27) (layer F.SilkS) (width 0.127)) (fp_line (start -6.7 -6.65) (end -5.27 -6.65) (layer F.SilkS) (width 0.127)) (pad G6 smd rect (at 3.85 3.85 90) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G12 smd rect (at 3.85 2.45 90) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G18 smd rect (at 3.85 1.05 90) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G5 smd rect (at 2.45 3.85 90) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G11 smd rect (at 2.45 2.45 90) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G17 smd rect (at 2.45 1.05 90) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G4 smd rect (at 1.05 3.85 90) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G10 smd rect (at 1.05 2.45 90) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G16 smd rect (at 1.05 1.05 90) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G1 smd rect (at -3.85 3.85) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G2 smd rect (at -2.45 3.85) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G3 smd rect (at -1.05 3.85) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G7 smd rect (at -3.85 2.45) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G8 smd rect (at -2.45 2.45) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G9 smd rect (at -1.05 2.45) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G13 smd rect (at -3.85 1.05) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G14 smd rect (at -2.45 1.05) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G15 smd rect (at -1.05 1.05) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G31 smd rect (at -3.85 -3.85 270) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G25 smd rect (at -3.85 -2.45 270) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G19 smd rect (at -3.85 -1.05 270) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G32 smd rect (at -2.45 -3.85 270) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G26 smd rect (at -2.45 -2.45 270) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G20 smd rect (at -2.45 -1.05 270) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G33 smd rect (at -1.05 -3.85 270) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G27 smd rect (at -1.05 -2.45 270) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G21 smd rect (at -1.05 -1.05 270) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G36 smd rect (at 3.85 -3.85 180) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G35 smd rect (at 2.45 -3.85 180) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G34 smd rect (at 1.05 -3.85 180) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G30 smd rect (at 3.85 -2.45 180) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G29 smd rect (at 2.45 -2.45 180) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G28 smd rect (at 1.05 -2.45 180) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G24 smd rect (at 3.85 -1.05 180) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G23 smd rect (at 2.45 -1.05 180) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad G22 smd rect (at 1.05 -1.05 180) (size 1 1) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 64 smd rect (at -6.3 4.9 90) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 63 smd rect (at -6.3 4.2 90) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 62 smd rect (at -6.3 3.5 90) (size 0.4 0.75) (layers Top F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 61 smd rect (at -6.3 2.8 90) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 60 smd rect (at -6.3 2.1 90) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 233 N$44) (solder_mask_margin 0.1016)) (pad 59 smd rect (at -6.3 1.4 90) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 58 smd rect (at -6.3 0.7 90) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 232 N$43) (solder_mask_margin 0.1016)) (pad 57 smd rect (at -6.3 0 90) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 231 N$41) (solder_mask_margin 0.1016)) (pad 56 smd rect (at -6.3 -0.7 90) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 230 N$40) (solder_mask_margin 0.1016)) (pad 55 smd rect (at -6.3 -1.4 90) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 54 smd rect (at -6.3 -2.1 90) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 53 smd rect (at -6.3 -2.8 90) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 260 N$95) (solder_mask_margin 0.1016)) (pad 52 smd rect (at -6.3 -3.5 90) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 259 N$94) (solder_mask_margin 0.1016)) (pad 51 smd rect (at -6.3 -4.2 90) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 258 N$93) (solder_mask_margin 0.1016)) (pad 50 smd rect (at -6.3 -4.9 90) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 257 N$70) (solder_mask_margin 0.1016)) (pad 49 smd rect (at -6.025 -5.975 180) (size 0.75 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 48 smd rect (at -4.9 -6.3) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 47 smd rect (at -4.2 -6.3) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) (pad 46 smd rect (at -3.5 -6.3) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) (pad 45 smd rect (at -2.8 -6.3) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 44 smd rect (at -2.1 -6.3) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 43 smd rect (at -1.4 -6.3) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 229 N$39) (solder_mask_margin 0.1016)) (pad 42 smd rect (at -0.7 -6.3) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 228 N$38) (solder_mask_margin 0.1016)) (pad 41 smd rect (at 0 -6.3) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 216 BT_EN) (solder_mask_margin 0.1016)) (pad 40 smd rect (at 0.7 -6.3) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 215 WL_EN) (solder_mask_margin 0.1016)) (pad 39 smd rect (at 1.4 -6.3) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 38 smd rect (at 2.1 -6.3) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) (pad 37 smd rect (at 2.8 -6.3) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 36 smd rect (at 3.5 -6.3) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 203 32.768KHZ) (solder_mask_margin 0.1016)) (pad 35 smd rect (at 4.2 -6.3) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 34 smd rect (at 4.9 -6.3) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 33 smd rect (at 6.025 -5.975 180) (size 0.75 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 32 smd rect (at 6.3 -4.9 270) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 224 N$15) (solder_mask_margin 0.1016)) (pad 31 smd rect (at 6.3 -4.2 270) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 30 smd rect (at 6.3 -3.5 270) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 29 smd rect (at 6.3 -2.8 270) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 28 smd rect (at 6.3 -2.1 270) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 27 smd rect (at 6.3 -1.4 270) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 227 N$35) (solder_mask_margin 0.1016)) (pad 26 smd rect (at 6.3 -0.7 270) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 226 N$33) (solder_mask_margin 0.1016)) (pad 25 smd rect (at 6.3 0 270) (size 0.4 0.75) (layers Top F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 24 smd rect (at 6.3 0.7 270) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 23 smd rect (at 6.3 1.4 270) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 22 smd rect (at 6.3 2.1 270) (size 0.4 0.75) (layers Top F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 21 smd rect (at 6.3 2.8 270) (size 0.4 0.75) (layers Top F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 20 smd rect (at 6.3 3.5 270) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 19 smd rect (at 6.3 4.2 270) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 18 smd rect (at 6.3 4.9 270) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 225 N$19) (solder_mask_margin 0.1016)) (pad 17 smd rect (at 6.025 5.975 180) (size 0.75 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 16 smd rect (at 4.9 6.3 180) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 15 smd rect (at 4.2 6.3 180) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 14 smd rect (at 3.5 6.3 180) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 250 NC3) (solder_mask_margin 0.1016)) (pad 13 smd rect (at 2.8 6.3 180) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 251 N$62) (solder_mask_margin 0.1016)) (pad 12 smd rect (at 2.1 6.3 180) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 252 N$63) (solder_mask_margin 0.1016)) (pad 11 smd rect (at 1.4 6.3 180) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 253 N$64) (solder_mask_margin 0.1016)) (pad 10 smd rect (at 0.7 6.3 180) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 254 N$65) (solder_mask_margin 0.1016)) (pad 9 smd rect (at 0 6.3 180) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 8 smd rect (at -0.7 6.3 180) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 255 N$67) (solder_mask_margin 0.1016)) (pad 7 smd rect (at -1.4 6.3 180) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 6 smd rect (at -2.1 6.3 180) (size 0.4 0.75) (layers Top F.Paste F.Mask) (net 256 N$69) (solder_mask_margin 0.1016)) (pad 5 smd rect (at -2.8 6.3 180) (size 0.4 0.75) (layers Top F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 4 smd rect (at -3.5 6.3 180) (size 0.4 0.75) (layers Top F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 3 smd rect (at -4.2 6.3 180) (size 0.4 0.75) (layers Top F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -6.025 5.975 180) (size 0.75 0.75) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 2 smd rect (at -4.9 6.3 180) (size 0.4 0.75) (layers Top F.Paste F.Mask) (solder_mask_margin 0.1016)) ) (module SCHA5B0200 (layer Bottom) (tedit 0) (tstamp 5D7C2DF3) (at 190.281306 94.5896 270) (fp_text reference X2 (at -7.239 14.605 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value SCHA5B0200 (at -7.6454 4.0386 180) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_line (start -7.25 3.76) (end -7.25 9.83) (layer B.SilkS) (width 0.127)) (fp_line (start -7.25 -1.4) (end -7.25 -0.92) (layer B.SilkS) (width 0.127)) (fp_line (start 7.25 -1.4) (end -7.25 -1.4) (layer B.SilkS) (width 0.127)) (fp_line (start 7.25 -0.92) (end 7.25 -1.4) (layer B.SilkS) (width 0.127)) (fp_line (start 7.25 8.53) (end 7.25 3.76) (layer B.SilkS) (width 0.127)) (fp_line (start 7.25 13.6) (end 7.25 10.87) (layer B.SilkS) (width 0.127)) (fp_line (start 4.2 13.6) (end 7.25 13.6) (layer B.SilkS) (width 0.127)) (fp_line (start -2.65 13.6) (end 1.8 13.6) (layer B.SilkS) (width 0.127)) (fp_line (start -5.55 13.6) (end -4.2 13.6) (layer B.SilkS) (width 0.127)) (fp_line (start -7.25 13.6) (end -7.25 12.17) (layer B.SilkS) (width 0.127)) (fp_line (start -6.4 13.6) (end -7.25 13.6) (layer B.SilkS) (width 0.127)) (fp_line (start 7.25 13.6) (end -7.25 13.6) (layer B.Fab) (width 0.127)) (fp_line (start 7.25 -1.4) (end 7.25 13.6) (layer B.Fab) (width 0.127)) (fp_line (start -7.25 -1.4) (end 7.25 -1.4) (layer B.Fab) (width 0.127)) (fp_line (start -7.25 13.6) (end -7.25 -1.4) (layer B.Fab) (width 0.127)) (pad CGND5 smd rect (at 2.575 13.9 270) (size 1.2 0.95) (layers Bottom B.Paste B.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad CGND6 smd rect (at -3.425 13.9 270) (size 1.2 0.95) (layers Bottom B.Paste B.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad GND smd rect (at 3.775 13.35 270) (size 0.5 0.9) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad CD smd rect (at -5.975 13.35 270) (size 0.5 0.9) (layers Bottom B.Paste B.Mask) (net 69 SD.CD) (solder_mask_margin 0.1016)) (pad CGND4 smd rect (at 7.25 9.7 270) (size 0.9 2) (layers Bottom B.Paste B.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad CGND1 smd rect (at -7.25 11 270) (size 0.9 2) (layers Bottom B.Paste B.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad 8 smd rect (at 7.25 3.365 270) (size 0.9 0.45) (layers Bottom B.Paste B.Mask) (net 5 SD.D1) (solder_mask_margin 0.1016)) (pad 7 smd rect (at 7.25 2.665 270) (size 0.9 0.45) (layers Bottom B.Paste B.Mask) (net 6 SD.D0) (solder_mask_margin 0.1016)) (pad 6 smd rect (at 7.25 1.965 270) (size 0.9 0.45) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 5 smd rect (at 7.25 1.265 270) (size 0.9 0.45) (layers Bottom B.Paste B.Mask) (net 8 SD.CLK) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -7.25 3.365 270) (size 0.9 0.45) (layers Bottom B.Paste B.Mask) (net 7 SD.D2) (solder_mask_margin 0.1016)) (pad 2 smd rect (at -7.25 2.665 270) (size 0.9 0.45) (layers Bottom B.Paste B.Mask) (net 4 SD.D3) (solder_mask_margin 0.1016)) (pad 3 smd rect (at -7.25 1.965 270) (size 0.9 0.45) (layers Bottom B.Paste B.Mask) (net 9 SD.CMD) (solder_mask_margin 0.1016)) (pad 4 smd rect (at -7.25 1.265 270) (size 0.9 0.45) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad CGND3 smd rect (at 7.1875 0 270) (size 1.1 1.5) (layers Bottom B.Paste B.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad CGND2 smd rect (at -7.1875 0 270) (size 1.1 1.5) (layers Bottom B.Paste B.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) ) (module HDMI-TYPE-D-10118241 (layer Bottom) (tedit 0) (tstamp 5D7C2E15) (at 190.0301 107.1626 270) (fp_text reference X5 (at 0 0 270) (layer B.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15)) (justify mirror)) ) (fp_text value 10118241-001RLF (at 0 0 270) (layer B.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15)) (justify mirror)) ) (fp_line (start -2.909362 -0.4457) (end -2.909362 0.4445) (layer Edge.Cuts) (width 0.05)) (fp_line (start -3.290362 0.4445) (end -3.290362 -0.4457) (layer Edge.Cuts) (width 0.05)) (fp_arc (start -3.099862 -0.4457) (end -2.909362 -0.4457) (angle -180) (layer Edge.Cuts) (width 0.05)) (fp_arc (start -3.099862 0.4445) (end -3.290362 0.4445) (angle -180) (layer Edge.Cuts) (width 0.05)) (fp_line (start 3.2905 -0.4457) (end 3.2905 0.4445) (layer Edge.Cuts) (width 0.05)) (fp_line (start 2.9095 0.4445) (end 2.9095 -0.4457) (layer Edge.Cuts) (width 0.05)) (fp_arc (start 3.1 -0.4457) (end 3.2905 -0.4457) (angle -180) (layer Edge.Cuts) (width 0.05)) (fp_arc (start 3.1 0.4445) (end 2.9095 0.4445) (angle -180) (layer Edge.Cuts) (width 0.05)) (fp_text user 19 (at -2.6 4.5 270) (layer B.SilkS) (effects (font (size 0.38608 0.38608) (thickness 0.048768)) (justify bottom mirror)) ) (fp_text user 1 (at 2.7 4.5 270) (layer B.SilkS) (effects (font (size 0.38608 0.38608) (thickness 0.048768)) (justify bottom mirror)) ) (fp_line (start 3.25 5.2) (end 2.1 5.2) (layer B.SilkS) (width 0.127)) (fp_line (start 3.249 4.2895) (end 3.25 5.2) (layer B.SilkS) (width 0.127)) (fp_line (start -3.25 5.2) (end -2.1 5.2) (layer B.SilkS) (width 0.127)) (fp_line (start -3.25 4.2895) (end -3.25 5.2) (layer B.SilkS) (width 0.127)) (fp_text user "PCB Edge" (at 0 -1.45 270) (layer Cmts.User) (effects (font (size 0.38608 0.38608) (thickness 0.048768)) (justify bottom)) ) (fp_line (start 3.25 1.655) (end 3.25 2.43015) (layer B.SilkS) (width 0.127)) (fp_line (start -3.25 1.655) (end -3.25 2.43015) (layer B.SilkS) (width 0.127)) (fp_line (start 3.25 -1.7) (end 3.25 -1.654) (layer B.SilkS) (width 0.127)) (fp_line (start -3.25 -1.7) (end -3.25 -1.654) (layer B.SilkS) (width 0.127)) (fp_line (start -3.25 -1.7) (end 3.25 -1.7) (layer B.SilkS) (width 0.127)) (pad CG2 thru_hole oval (at -3.1 0 180) (size 3 1.5) (drill 0.381) (layers *.Cu *.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad CG4 smd rect (at -3.450081 3.359912 270) (size 2.413 1.524) (layers Bottom B.Paste B.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad CG3 smd rect (at 3.450081 3.359912 270) (size 2.413 1.524) (layers Bottom B.Paste B.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad CG1 thru_hole oval (at 3.1 0 180) (size 3 1.5) (drill 0.381) (layers *.Cu *.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad 19 smd rect (at -1.800096 4.76504 270) (size 0.230125 0.849884) (layers Bottom B.Paste B.Mask) (net 184 DVI_5V) (solder_mask_margin 0.1016)) (pad 18 smd rect (at -1.599946 3.539996 270) (size 0.230125 0.999743) (layers Bottom B.Paste B.Mask) (net 185 HDMI.DSDA) (solder_mask_margin 0.1016)) (pad 17 smd rect (at -1.400046 4.76504 270) (size 0.230125 0.849884) (layers Bottom B.Paste B.Mask) (net 186 HDMI.DSCL) (solder_mask_margin 0.1016)) (pad 16 smd rect (at -1.199896 3.539996 270) (size 0.230125 0.999743) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 15 smd rect (at -0.999996 4.76504 270) (size 0.230125 0.849884) (layers Bottom B.Paste B.Mask) (net 189 CEC) (solder_mask_margin 0.1016)) (pad 14 smd rect (at -0.8001 3.539996 270) (size 0.230125 0.999743) (layers Bottom B.Paste B.Mask) (net 198 TXC-) (solder_mask_margin 0.1016)) (pad 13 smd rect (at -0.599946 4.76504 270) (size 0.230125 0.849884) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 12 smd rect (at -0.40005 3.539996 270) (size 0.230125 0.999743) (layers Bottom B.Paste B.Mask) (net 197 TXC+) (solder_mask_margin 0.1016)) (pad 11 smd rect (at -0.199896 4.76504 270) (size 0.230125 0.849884) (layers Bottom B.Paste B.Mask) (net 196 TX0-) (solder_mask_margin 0.1016)) (pad 10 smd rect (at 0 3.539996 270) (size 0.230125 0.999743) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 9 smd rect (at 0.199896 4.76504 270) (size 0.230125 0.849884) (layers Bottom B.Paste B.Mask) (net 195 TX0+) (solder_mask_margin 0.1016)) (pad 8 smd rect (at 0.40005 3.539996 270) (size 0.230125 0.999743) (layers Bottom B.Paste B.Mask) (net 194 TX1-) (solder_mask_margin 0.1016)) (pad 7 smd rect (at 0.599946 4.76504 270) (size 0.230125 0.849884) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 6 smd rect (at 0.8001 3.539996 270) (size 0.230125 0.999743) (layers Bottom B.Paste B.Mask) (net 193 TX1+) (solder_mask_margin 0.1016)) (pad 5 smd rect (at 0.999996 4.76504 270) (size 0.230125 0.849884) (layers Bottom B.Paste B.Mask) (net 192 TX2-) (solder_mask_margin 0.1016)) (pad 4 smd rect (at 1.199896 3.539996 270) (size 0.230125 0.999743) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 3 smd rect (at 1.400046 4.76504 270) (size 0.230125 0.849884) (layers Bottom B.Paste B.Mask) (net 191 TX2+) (solder_mask_margin 0.1016)) (pad 2 smd rect (at 1.599946 3.539996 270) (size 0.230125 0.999743) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 1 smd rect (at 1.800096 4.76504 270) (size 0.230125 0.849884) (layers Bottom B.Paste B.Mask) (net 188 HPD) (solder_mask_margin 0.1016)) ) (module "R-PVQFN-N20(TI)" (layer Bottom) (tedit 0) (tstamp 5D7C2E43) (at 135.3211 96.8086 90) (fp_text reference IC10 (at -2.32 -3.36 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value TXS0108ERGYR (at -2.33 2.3 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_line (start -2.25 -1.75) (end -2.25 1.75) (layer B.Fab) (width 0.1524)) (fp_line (start 2.25 -1.75) (end -2.25 -1.75) (layer B.Fab) (width 0.1524)) (fp_line (start 2.25 1.75) (end 2.25 -1.75) (layer B.Fab) (width 0.1524)) (fp_line (start -2.25 1.75) (end 2.25 1.75) (layer B.Fab) (width 0.1524)) (fp_circle (center -2.6 -1.27) (end -2.529291 -1.27) (layer B.SilkS) (width 0.1524)) (fp_line (start -2.25 -0.43) (end -2.25 0.43) (layer B.SilkS) (width 0.1524)) (fp_line (start -2.25 -1.75) (end -2.25 -1.07) (layer B.SilkS) (width 0.1524)) (fp_line (start -2.07 -1.75) (end -2.25 -1.75) (layer B.SilkS) (width 0.1524)) (fp_line (start 2.25 -1.75) (end 2.07 -1.75) (layer B.SilkS) (width 0.1524)) (fp_line (start 2.25 -1.07) (end 2.25 -1.75) (layer B.SilkS) (width 0.1524)) (fp_line (start 2.25 0.43) (end 2.25 -0.43) (layer B.SilkS) (width 0.1524)) (fp_line (start 2.25 1.75) (end 2.25 1.07) (layer B.SilkS) (width 0.1524)) (fp_line (start 2.07 1.75) (end 2.25 1.75) (layer B.SilkS) (width 0.1524)) (fp_line (start -2.25 1.75) (end -2.25 1.07) (layer B.SilkS) (width 0.1524)) (fp_line (start -2.25 1.75) (end -2.07 1.75) (layer B.SilkS) (width 0.1524)) (pad TP smd rect (at 0 0 90) (size 3.05 2.05) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 20 smd rect (at -2.225 0.75) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 267 ALT.WL.IRQ) (solder_mask_margin 0.1016)) (pad 19 smd rect (at -1.75 1.725 90) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) (pad 18 smd rect (at -1.25 1.725 90) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 268 ALT.WL.D0) (solder_mask_margin 0.1016)) (pad 17 smd rect (at -0.75 1.725 90) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 269 ALT.WL.D1) (solder_mask_margin 0.1016)) (pad 16 smd rect (at -0.25 1.725 90) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 270 ALT.WL.D2) (solder_mask_margin 0.1016)) (pad 15 smd rect (at 0.25 1.725 90) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 264 ALT.BUFF.OE) (solder_mask_margin 0.1016)) (pad 14 smd rect (at 0.75 1.725 90) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 261 N$96) (solder_mask_margin 0.1016)) (pad 13 smd rect (at 1.25 1.725 90) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 12 smd rect (at 1.75 1.725 90) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 11 smd rect (at 2.225 0.75 180) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 10 smd rect (at 2.225 -0.75 180) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 263 ALT.BT.EN) (solder_mask_margin 0.1016)) (pad 9 smd rect (at 1.75 -1.725 270) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 8 smd rect (at 1.25 -1.725 270) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 7 smd rect (at 0.75 -1.725 270) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 208 WL_SDIO_CMD) (solder_mask_margin 0.1016)) (pad 6 smd rect (at 0.25 -1.725 270) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 209 WL_SDIO_CLK) (solder_mask_margin 0.1016)) (pad 5 smd rect (at -0.25 -1.725 270) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 213 WL_SDIO_D3) (solder_mask_margin 0.1016)) (pad 4 smd rect (at -0.75 -1.725 270) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 212 WL_SDIO_D2) (solder_mask_margin 0.1016)) (pad 3 smd rect (at -1.25 -1.725 270) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 211 WL_SDIO_D1) (solder_mask_margin 0.1016)) (pad 2 smd rect (at -1.75 -1.725 270) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -2.225 -0.75) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 210 WL_SDIO_D0) (solder_mask_margin 0.1016)) ) (module "R-PVQFN-N20(TI)" (layer Bottom) (tedit 0) (tstamp 5D7C2E6A) (at 132.0711 108.3086 180) (fp_text reference IC11 (at -2.32 -3.36) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value TXS0108ERGYR (at -2.33 2.3) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_line (start -2.25 -1.75) (end -2.25 1.75) (layer B.Fab) (width 0.1524)) (fp_line (start 2.25 -1.75) (end -2.25 -1.75) (layer B.Fab) (width 0.1524)) (fp_line (start 2.25 1.75) (end 2.25 -1.75) (layer B.Fab) (width 0.1524)) (fp_line (start -2.25 1.75) (end 2.25 1.75) (layer B.Fab) (width 0.1524)) (fp_circle (center -2.6 -1.27) (end -2.529291 -1.27) (layer B.SilkS) (width 0.1524)) (fp_line (start -2.25 -0.43) (end -2.25 0.43) (layer B.SilkS) (width 0.1524)) (fp_line (start -2.25 -1.75) (end -2.25 -1.07) (layer B.SilkS) (width 0.1524)) (fp_line (start -2.07 -1.75) (end -2.25 -1.75) (layer B.SilkS) (width 0.1524)) (fp_line (start 2.25 -1.75) (end 2.07 -1.75) (layer B.SilkS) (width 0.1524)) (fp_line (start 2.25 -1.07) (end 2.25 -1.75) (layer B.SilkS) (width 0.1524)) (fp_line (start 2.25 0.43) (end 2.25 -0.43) (layer B.SilkS) (width 0.1524)) (fp_line (start 2.25 1.75) (end 2.25 1.07) (layer B.SilkS) (width 0.1524)) (fp_line (start 2.07 1.75) (end 2.25 1.75) (layer B.SilkS) (width 0.1524)) (fp_line (start -2.25 1.75) (end -2.25 1.07) (layer B.SilkS) (width 0.1524)) (fp_line (start -2.25 1.75) (end -2.07 1.75) (layer B.SilkS) (width 0.1524)) (pad TP smd rect (at 0 0 180) (size 3.05 2.05) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 20 smd rect (at -2.225 0.75 90) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 49 BT_HCI_TX.SIP) (solder_mask_margin 0.1016)) (pad 19 smd rect (at -1.75 1.725 180) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) (pad 18 smd rect (at -1.25 1.725 180) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 265 ALT.WL.CLK) (solder_mask_margin 0.1016)) (pad 17 smd rect (at -0.75 1.725 180) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 262 ALT.WL.CMD) (solder_mask_margin 0.1016)) (pad 16 smd rect (at -0.25 1.725 180) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 99 CLKOUT2) (solder_mask_margin 0.1016)) (pad 15 smd rect (at 0.25 1.725 180) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 53 BT_HCI_CTS.SIP) (solder_mask_margin 0.1016)) (pad 14 smd rect (at 0.75 1.725 180) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 50 BT_HCI_RX.SIP) (solder_mask_margin 0.1016)) (pad 13 smd rect (at 1.25 1.725 180) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 52 BT_HCI_RTS.SIP) (solder_mask_margin 0.1016)) (pad 12 smd rect (at 1.75 1.725 180) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 266 ALT.WL.EN) (solder_mask_margin 0.1016)) (pad 11 smd rect (at 2.225 0.75 270) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 10 smd rect (at 2.225 -0.75 270) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 263 ALT.BT.EN) (solder_mask_margin 0.1016)) (pad 9 smd rect (at 1.75 -1.725) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 214 WL_IRQ) (solder_mask_margin 0.1016)) (pad 8 smd rect (at 1.25 -1.725) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 205 BT_HCI_CTS) (solder_mask_margin 0.1016)) (pad 7 smd rect (at 0.75 -1.725) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 206 BT_HCI_TX) (solder_mask_margin 0.1016)) (pad 6 smd rect (at 0.25 -1.725) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 204 BT_HCI_RTS) (solder_mask_margin 0.1016)) (pad 5 smd rect (at -0.25 -1.725) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 217 SLOW_CLK) (solder_mask_margin 0.1016)) (pad 4 smd rect (at -0.75 -1.725) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 216 BT_EN) (solder_mask_margin 0.1016)) (pad 3 smd rect (at -1.25 -1.725) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 215 WL_EN) (solder_mask_margin 0.1016)) (pad 2 smd rect (at -1.75 -1.725) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -2.225 -0.75 90) (size 0.28 0.85) (layers Bottom B.Paste B.Mask) (net 207 BT_HCI_RX) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2E91) (at 133.0071 92.8116 270) (descr "RESISTOR
\nchip") (fp_text reference R89 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value 1k (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 218 N$5) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2E9F) (at 113.2211 110.1086 90) (descr "RESISTOR
\nchip") (fp_text reference R90 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value 1k (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 202 N$1) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2EAD) (at 118.6211 109.1086 180) (descr "RESISTOR
\nchip") (fp_text reference R91 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "0 DNP" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 203 32.768KHZ) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 217 SLOW_CLK) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2EBB) (at 127.1651 84.1756 180) (descr "RESISTOR
\nchip") (fp_text reference R93 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value 7.15k (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 219 N$9) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2EC9) (at 125.3871 84.1756 180) (descr "RESISTOR
\nchip") (fp_text reference R94 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value 4.12k (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 219 N$9) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2ED7) (at 135.8011 92.0496 270) (descr "RESISTOR
\nchip") (fp_text reference R95 (at -0.635 0.762 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value 1M (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 220 5V_IN) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2EE5) (at 131.8641 92.8116 270) (descr "RESISTOR
\nchip") (fp_text reference R97 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "DNP 1k" (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 218 N$5) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 221 SELECT_5V) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2EF3) (at 120.0211 91.6086 270) (descr "RESISTOR
\nchip") (fp_text reference R98 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value 10k (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 210 WL_SDIO_D0) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2F01) (at 118.8211 91.6086 270) (descr "RESISTOR
\nchip") (fp_text reference R99 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value 10k (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 211 WL_SDIO_D1) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2F0F) (at 117.6211 91.6086 270) (descr "RESISTOR
\nchip") (fp_text reference R101 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value 10k (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 212 WL_SDIO_D2) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2F1D) (at 116.4211 91.6086 270) (descr "RESISTOR
\nchip") (fp_text reference R102 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value 10k (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 213 WL_SDIO_D3) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2F2B) (at 122.1211 92.8086 270) (descr "RESISTOR
\nchip") (fp_text reference R103 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value 10k (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 209 WL_SDIO_CLK) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C2F39) (at 124.0211 92.8086 270) (descr "RESISTOR
\nchip") (fp_text reference R105 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value 10k (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 208 WL_SDIO_CMD) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C2F47) (at 135.3211 92.8086) (descr "RESISTOR
\nchip") (fp_text reference R106 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value 1.5k (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 263 ALT.BT.EN) (solder_mask_margin 0.1016)) ) (module "SOT-223(DCQ_R-PDSO-G6_TI)" (layer Top) (tedit 0) (tstamp 5D7C2F55) (at 122.8471 88.4936 90) (fp_text reference IC18 (at -3.45 1.97) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value TL1963ADCQR (at 4.54 2.61) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top)) ) (fp_line (start -3.25 1.75) (end -3.25 -1.75) (layer F.Fab) (width 0.127)) (fp_line (start 3.25 1.75) (end -3.25 1.75) (layer F.Fab) (width 0.127)) (fp_line (start 3.25 -1.75) (end 3.25 1.75) (layer F.Fab) (width 0.127)) (fp_line (start -3.25 -1.75) (end 3.25 -1.75) (layer F.Fab) (width 0.127)) (fp_line (start 3.25 -1.75) (end 3.25 1.75) (layer F.SilkS) (width 0.127)) (fp_line (start -3.25 -1.75) (end 3.25 -1.75) (layer F.SilkS) (width 0.127)) (fp_line (start -3.25 1.75) (end 3.25 1.75) (layer F.SilkS) (width 0.127)) (fp_line (start -3.25 -1.75) (end -3.25 1.75) (layer F.SilkS) (width 0.127)) (pad 5 smd rect (at 2.54 3.1 90) (size 0.6 2.2) (layers Top F.Paste F.Mask) (net 219 N$9) (solder_mask_margin 0.1016)) (pad 4 smd rect (at 1.27 3.1 90) (size 0.6 2.2) (layers Top F.Paste F.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) (pad 6 smd rect (at 0 -3.1 90) (size 3.5 2.2) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 3 smd rect (at 0 3.1 90) (size 0.6 2.2) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 2 smd rect (at -1.27 3.1 90) (size 0.6 2.2) (layers Top F.Paste F.Mask) (net 220 5V_IN) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -2.54 3.1 90) (size 0.6 2.2) (layers Top F.Paste F.Mask) (net 218 N$5) (solder_mask_margin 0.1016)) ) (module C0603K (layer Top) (tedit 0) (tstamp 5D7C2F66) (at 130.5941 91.5416 270) (descr "Ceramic Chip Capacitor KEMET 0603 Reflow solder
\nMetric Code Size 1608") (fp_text reference C19 (at -0.8 -0.65 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "10uF, 6.3V" (at -0.8 1.65 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top)) ) (fp_poly (pts (xy 0.45 0.4) (xy 0.8 0.4) (xy 0.8 -0.4) (xy 0.45 -0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.8 0.4) (xy -0.45 0.4) (xy -0.45 -0.4) (xy -0.8 -0.4)) (layer F.Fab) (width 0)) (fp_line (start 0 -0.508) (end 0 0.508) (layer F.SilkS) (width 0.127)) (fp_line (start 0.725 0.35) (end -0.725 0.35) (layer F.Fab) (width 0.1016)) (fp_line (start -0.725 -0.35) (end 0.725 -0.35) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.875 0 270) (size 1.05 1.08) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.875 0 270) (size 1.05 1.08) (layers Top F.Paste F.Mask) (net 220 5V_IN) (solder_mask_margin 0.1016)) ) (module C0603K (layer Top) (tedit 0) (tstamp 5D7C2F70) (at 128.6891 87.8586 270) (descr "Ceramic Chip Capacitor KEMET 0603 Reflow solder
\nMetric Code Size 1608") (fp_text reference C20 (at -0.8 -0.65 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "10uF, 6.3V" (at -0.8 1.65 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top)) ) (fp_poly (pts (xy 0.45 0.4) (xy 0.8 0.4) (xy 0.8 -0.4) (xy 0.45 -0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.8 0.4) (xy -0.45 0.4) (xy -0.45 -0.4) (xy -0.8 -0.4)) (layer F.Fab) (width 0)) (fp_line (start 0 -0.508) (end 0 0.508) (layer F.SilkS) (width 0.127)) (fp_line (start 0.725 0.35) (end -0.725 0.35) (layer F.Fab) (width 0.1016)) (fp_line (start -0.725 -0.35) (end 0.725 -0.35) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.875 0 270) (size 1.05 1.08) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.875 0 270) (size 1.05 1.08) (layers Top F.Paste F.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) ) (module NZ2520S (layer Bottom) (tedit 0) (tstamp 5D7C2F7A) (at 115.4211 110.1086) (fp_text reference OSC2 (at -1.8 1.25) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value NZ2520SB-32.768KHZ-NSA3534C (at -2.85 -2.55) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top mirror)) ) (fp_circle (center -1.55 -1.35) (end -1.5 -1.35) (layer B.SilkS) (width 0.127)) (fp_line (start -0.15 -1) (end 0.15 -1) (layer B.SilkS) (width 0.127)) (fp_line (start -0.15 1) (end 0.15 1) (layer B.SilkS) (width 0.127)) (fp_line (start -1.25 -1) (end -1.25 1) (layer B.Fab) (width 0.127)) (fp_line (start 1.25 -1) (end -1.25 -1) (layer B.Fab) (width 0.127)) (fp_line (start 1.25 1) (end 1.25 -1) (layer B.Fab) (width 0.127)) (fp_line (start -1.25 1) (end 1.25 1) (layer B.Fab) (width 0.127)) (pad 4 smd rect (at -0.825 0.625) (size 1 1) (layers Bottom B.Paste B.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) (pad 3 smd rect (at 0.825 0.625) (size 1 1) (layers Bottom B.Paste B.Mask) (net 203 32.768KHZ) (solder_mask_margin 0.1016)) (pad 2 smd rect (at 0.825 -0.625) (size 1 1) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.825 -0.625) (size 1 1) (layers Bottom B.Paste B.Mask) (net 202 N$1) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C2F88) (at 115.4211 112.1086) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C24 (at -0.5 0.425) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value ".1uF, 6.3V" (at -0.5 -1.45) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C2F91) (at 134.4461 97.8086 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C25 (at -0.5 -0.425 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value ".1uF, 6.3V" (at -0.5 1.45 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C2F9A) (at 133.3211 109.1836 180) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C43 (at -0.5 -0.425) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value ".1uF, 6.3V" (at -0.5 1.45) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C2FA3) (at 133.3211 107.4336 180) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C44 (at -0.5 -0.425) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value ".1uF, 6.3V" (at -0.5 1.45) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C2FAC) (at 136.1961 97.8086 90) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C45 (at -0.5 -0.425 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value ".1uF, 6.3V" (at -0.5 1.45 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) ) (module SOT23 (layer Bottom) (tedit 0) (tstamp 5D7C2FB5) (at 138.7221 90.3986 270) (descr DIODE) (fp_text reference D8 (at -1.905 1.905 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value BAT54C (at -1.905 -3.175 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -1.1684 -1.2954) (xy -0.7112 -1.2954) (xy -0.7112 -0.7112) (xy -1.1684 -0.7112)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.7112 -1.2954) (xy 1.1684 -1.2954) (xy 1.1684 -0.7112) (xy 0.7112 -0.7112)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.2286 0.7112) (xy 0.2286 0.7112) (xy 0.2286 1.2954) (xy -0.2286 1.2954)) (layer B.Fab) (width 0)) (fp_line (start 0.8636 0.6604) (end 1.4224 0.6604) (layer B.SilkS) (width 0.1524)) (fp_line (start 1.4224 0.6604) (end 1.4224 -0.1524) (layer B.SilkS) (width 0.1524)) (fp_line (start -1.4224 0.6604) (end -0.8636 0.6604) (layer B.SilkS) (width 0.1524)) (fp_line (start -1.4224 -0.1524) (end -1.4224 0.6604) (layer B.SilkS) (width 0.1524)) (fp_line (start -1.4224 0.6604) (end 1.4224 0.6604) (layer B.Fab) (width 0.1524)) (fp_line (start -1.4224 -0.6604) (end -1.4224 0.6604) (layer B.Fab) (width 0.1524)) (fp_line (start 1.4224 -0.6604) (end -1.4224 -0.6604) (layer B.Fab) (width 0.1524)) (fp_line (start 1.4224 0.6604) (end 1.4224 -0.6604) (layer B.Fab) (width 0.1524)) (pad 1 smd rect (at -0.95 -1.1 270) (size 1 1.4) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 2 smd rect (at 0.95 -1.1 270) (size 1 1.4) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 3 smd rect (at 0 1.1 270) (size 1 1.4) (layers Bottom B.Paste B.Mask) (net 220 5V_IN) (solder_mask_margin 0.1016)) ) (module 0805-RESISTOR (layer Bottom) (tedit 0) (tstamp 5D7C2FC6) (at 133.0071 90.3986) (fp_text reference FB1 (at -1.905 1.27 -90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "220 Ohm 800mA" (at -1.905 -2.54) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.5001) (xy 0.1999 -0.5001) (xy 0.1999 0.5001) (xy -0.1999 0.5001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -1.0668 -0.6985) (xy -0.4168 -0.6985) (xy -0.4168 0.7015) (xy -1.0668 0.7015)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.4064 -0.6985) (xy 1.0564 -0.6985) (xy 1.0564 0.7015) (xy 0.4064 0.7015)) (layer B.Fab) (width 0)) (fp_line (start -1.973 -0.983) (end -1.973 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.973 -0.983) (end -1.973 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.973 0.983) (end 1.973 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.973 0.983) (end 1.973 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.41 -0.635) (end 0.41 -0.635) (layer B.Fab) (width 0.1524)) (fp_line (start -0.41 0.635) (end 0.41 0.635) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.95 0) (size 1.3 1.5) (layers Bottom B.Paste B.Mask) (net 220 5V_IN) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.95 0) (size 1.3 1.5) (layers Bottom B.Paste B.Mask) (net 221 SELECT_5V) (solder_mask_margin 0.1016)) ) (module U.FL-R-SMT-1 (layer Top) (tedit 0) (tstamp 5D7C2FD4) (at 110.2211 110.6086 180) (fp_text reference ANT1 (at -2.09 -1.4 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "U.FL-R-SMT-1(10)" (at -2.59 3.25) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top)) ) (fp_line (start 1.3 -1.3) (end 1.3 -1.27) (layer F.SilkS) (width 0.127)) (fp_line (start -1.3 -1.3) (end 1.3 -1.3) (layer F.SilkS) (width 0.127)) (fp_line (start -1.3 -1.27) (end -1.3 -1.3) (layer F.SilkS) (width 0.127)) (fp_line (start 1.3 1.3) (end 1.3 1.27) (layer F.SilkS) (width 0.127)) (fp_line (start 0.7 1.3) (end 1.3 1.3) (layer F.SilkS) (width 0.127)) (fp_line (start -1.3 1.3) (end -1.3 1.27) (layer F.SilkS) (width 0.127)) (fp_line (start -0.7 1.3) (end -1.3 1.3) (layer F.SilkS) (width 0.127)) (fp_line (start -1.3 1.3) (end -1.3 -1.3) (layer F.Fab) (width 0.127)) (fp_line (start 1.3 1.3) (end -1.3 1.3) (layer F.Fab) (width 0.127)) (fp_line (start 1.3 -1.3) (end 1.3 1.3) (layer F.Fab) (width 0.127)) (fp_line (start -1.3 -1.3) (end 1.3 -1.3) (layer F.Fab) (width 0.127)) (pad GND2 smd rect (at 1.475 0 180) (size 1.05 2.2) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad GND1 smd rect (at -1.475 0 180) (size 1.05 2.2) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad SIG smd rect (at 0 1.525 180) (size 1.05 1) (layers Top F.Paste F.Mask) (net 223 N$14) (solder_mask_margin 0.1016)) ) (module U.FL-R-SMT-1 (layer Top) (tedit 0) (tstamp 5D7C2FE5) (at 110.2211 95.2086) (fp_text reference ANT2 (at -2.09 -1.4 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "U.FL-R-SMT-1(10)" (at -2.59 3.25) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (fp_line (start 1.3 -1.3) (end 1.3 -1.27) (layer F.SilkS) (width 0.127)) (fp_line (start -1.3 -1.3) (end 1.3 -1.3) (layer F.SilkS) (width 0.127)) (fp_line (start -1.3 -1.27) (end -1.3 -1.3) (layer F.SilkS) (width 0.127)) (fp_line (start 1.3 1.3) (end 1.3 1.27) (layer F.SilkS) (width 0.127)) (fp_line (start 0.7 1.3) (end 1.3 1.3) (layer F.SilkS) (width 0.127)) (fp_line (start -1.3 1.3) (end -1.3 1.27) (layer F.SilkS) (width 0.127)) (fp_line (start -0.7 1.3) (end -1.3 1.3) (layer F.SilkS) (width 0.127)) (fp_line (start -1.3 1.3) (end -1.3 -1.3) (layer F.Fab) (width 0.127)) (fp_line (start 1.3 1.3) (end -1.3 1.3) (layer F.Fab) (width 0.127)) (fp_line (start 1.3 -1.3) (end 1.3 1.3) (layer F.Fab) (width 0.127)) (fp_line (start -1.3 -1.3) (end 1.3 -1.3) (layer F.Fab) (width 0.127)) (pad GND2 smd rect (at 1.475 0) (size 1.05 2.2) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad GND1 smd rect (at -1.475 0) (size 1.05 2.2) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad SIG smd rect (at 0 1.525) (size 1.05 1) (layers Top F.Paste F.Mask) (net 222 N$13) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C2FF6) (at 112.3211 107.8086) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C46 (at -0.5 -0.425) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value 10pF (at -0.5 1.45) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 224 N$15) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 223 N$14) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C2FFF) (at 112.3211 98.0086) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C60 (at -0.5 -0.425) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value 10pF (at -0.5 1.45) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 225 N$19) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 222 N$13) (solder_mask_margin 0.1016)) ) (module B1,27 (layer Top) (tedit 0) (tstamp 5D7C3008) (at 111.0961 103.6086) (descr "TEST PAD") (fp_text reference TP12 (at -0.635 -1.016) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value PTR1B1,27 (at -0.635 0.762) (layer F.Fab) (effects (font (size 0.02413 0.02413) (thickness 0.00193)) (justify left bottom)) ) (fp_text user >TP_SIGNAL_NAME (at -0.635 1.905) (layer Dwgs.User) (effects (font (size 0.95 0.95) (thickness 0.08)) (justify left bottom)) ) (fp_line (start 0 -0.635) (end 0 0.635) (layer Dwgs.User) (width 0.0024)) (fp_line (start -0.635 0) (end 0.635 0) (layer Dwgs.User) (width 0.0024)) (pad TP smd roundrect (at 0 0) (size 1.27 1.27) (layers Top F.Mask) (roundrect_rratio 0.5) (net 226 N$33) (solder_mask_margin 0.1016)) ) (module B1,27 (layer Top) (tedit 0) (tstamp 5D7C300F) (at 112.4961 104.4836) (descr "TEST PAD") (fp_text reference TP13 (at -0.635 -1.016) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value PTR1B1,27 (at -0.635 0.762) (layer F.Fab) (effects (font (size 0.02413 0.02413) (thickness 0.00193)) (justify left bottom)) ) (fp_text user >TP_SIGNAL_NAME (at -0.635 1.905) (layer Dwgs.User) (effects (font (size 0.95 0.95) (thickness 0.08)) (justify left bottom)) ) (fp_line (start 0 -0.635) (end 0 0.635) (layer Dwgs.User) (width 0.0024)) (fp_line (start -0.635 0) (end 0.635 0) (layer Dwgs.User) (width 0.0024)) (pad TP smd roundrect (at 0 0) (size 1.27 1.27) (layers Top F.Mask) (roundrect_rratio 0.5) (net 227 N$35) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C3016) (at 121.1211 109.9086 90) (descr "RESISTOR
\nchip") (fp_text reference R10 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value 150k (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 215 WL_EN) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C3024) (at 122.4211 109.9086 90) (descr "RESISTOR
\nchip") (fp_text reference R11 (at -0.635 0.762 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value 150k (at -0.635 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 216 BT_EN) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C3032) (at 135.1661 100.9396 90) (descr "RESISTOR
\nchip") (fp_text reference R108 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "DNP 1k" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 53 BT_HCI_CTS.SIP) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C3040) (at 133.8961 100.9396 90) (descr "RESISTOR
\nchip") (fp_text reference R109 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "DNP 1k" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 52 BT_HCI_RTS.SIP) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C304E) (at 114.0211 94.1086 270) (descr "RESISTOR
\nchip") (fp_text reference R111 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "DNP 10k" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 250 NC3) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) ) (module C0603K (layer Bottom) (tedit 0) (tstamp 5D7C305C) (at 124.5711 111.2086) (descr "Ceramic Chip Capacitor KEMET 0603 Reflow solder
\nMetric Code Size 1608") (fp_text reference C61 (at -0.8 0.65) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "10uF, 6.3V" (at -0.8 -1.65) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.45 -0.4) (xy 0.8 -0.4) (xy 0.8 0.4) (xy 0.45 0.4)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.8 -0.4) (xy -0.45 -0.4) (xy -0.45 0.4) (xy -0.8 0.4)) (layer B.Fab) (width 0)) (fp_line (start 0 0.508) (end 0 -0.508) (layer B.SilkS) (width 0.127)) (fp_line (start 0.725 -0.35) (end -0.725 -0.35) (layer B.Fab) (width 0.1016)) (fp_line (start -0.725 0.35) (end 0.725 0.35) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.875 0) (size 1.05 1.08) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.875 0) (size 1.05 1.08) (layers Bottom B.Paste B.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C3066) (at 124.5711 112.6086) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C63 (at -0.5 0.425) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value ".1uF, 6.3V" (at -0.5 -1.45) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) ) (module B1,27 (layer Top) (tedit 0) (tstamp 5D7C306F) (at 122.0211 112.6086) (descr "TEST PAD") (fp_text reference TP14 (at -0.635 -1.016) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value PTR1B1,27 (at -0.635 0.762) (layer F.Fab) (effects (font (size 0.02413 0.02413) (thickness 0.00193)) (justify left bottom)) ) (fp_text user >TP_SIGNAL_NAME (at -0.635 1.905) (layer Dwgs.User) (effects (font (size 0.95 0.95) (thickness 0.08)) (justify left bottom)) ) (fp_line (start 0 -0.635) (end 0 0.635) (layer Dwgs.User) (width 0.0024)) (fp_line (start -0.635 0) (end 0.635 0) (layer Dwgs.User) (width 0.0024)) (pad TP smd roundrect (at 0 0) (size 1.27 1.27) (layers Top F.Mask) (roundrect_rratio 0.5) (net 228 N$38) (solder_mask_margin 0.1016)) ) (module B1,27 (layer Top) (tedit 0) (tstamp 5D7C3076) (at 123.1211 111.5086) (descr "TEST PAD") (fp_text reference TP15 (at -0.635 -1.016) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value PTR1B1,27 (at -0.635 0.762) (layer F.Fab) (effects (font (size 0.02413 0.02413) (thickness 0.00193)) (justify left bottom)) ) (fp_text user >TP_SIGNAL_NAME (at -0.635 1.905) (layer Dwgs.User) (effects (font (size 0.95 0.95) (thickness 0.08)) (justify left bottom)) ) (fp_line (start 0 -0.635) (end 0 0.635) (layer Dwgs.User) (width 0.0024)) (fp_line (start -0.635 0) (end 0.635 0) (layer Dwgs.User) (width 0.0024)) (pad TP smd roundrect (at 0 0) (size 1.27 1.27) (layers Top F.Mask) (roundrect_rratio 0.5) (net 229 N$39) (solder_mask_margin 0.1016)) ) (module B1,27 (layer Top) (tedit 0) (tstamp 5D7C307D) (at 128.8586 104.0461) (descr "TEST PAD") (fp_text reference TP16 (at -0.635 -1.016) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value PTR1B1,27 (at -0.635 0.762) (layer F.Fab) (effects (font (size 0.02413 0.02413) (thickness 0.00193)) (justify left bottom)) ) (fp_text user >TP_SIGNAL_NAME (at -0.635 1.905) (layer Dwgs.User) (effects (font (size 0.95 0.95) (thickness 0.08)) (justify left bottom)) ) (fp_line (start 0 -0.635) (end 0 0.635) (layer Dwgs.User) (width 0.0024)) (fp_line (start -0.635 0) (end 0.635 0) (layer Dwgs.User) (width 0.0024)) (pad TP smd roundrect (at 0 0) (size 1.27 1.27) (layers Top F.Mask) (roundrect_rratio 0.5) (net 230 N$40) (solder_mask_margin 0.1016)) ) (module B1,27 (layer Top) (tedit 0) (tstamp 5D7C3084) (at 130.1711 103.1711) (descr "TEST PAD") (fp_text reference TP17 (at -0.635 -1.016) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value PTR1B1,27 (at -0.635 0.762) (layer F.Fab) (effects (font (size 0.02413 0.02413) (thickness 0.00193)) (justify left bottom)) ) (fp_text user >TP_SIGNAL_NAME (at -0.635 1.905) (layer Dwgs.User) (effects (font (size 0.95 0.95) (thickness 0.08)) (justify left bottom)) ) (fp_line (start 0 -0.635) (end 0 0.635) (layer Dwgs.User) (width 0.0024)) (fp_line (start -0.635 0) (end 0.635 0) (layer Dwgs.User) (width 0.0024)) (pad TP smd roundrect (at 0 0) (size 1.27 1.27) (layers Top F.Mask) (roundrect_rratio 0.5) (net 231 N$41) (solder_mask_margin 0.1016)) ) (module B1,27 (layer Top) (tedit 0) (tstamp 5D7C308B) (at 128.8586 102.2961) (descr "TEST PAD") (fp_text reference TP18 (at -0.635 -1.016) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value PTR1B1,27 (at -0.635 0.762) (layer F.Fab) (effects (font (size 0.02413 0.02413) (thickness 0.00193)) (justify left bottom)) ) (fp_text user >TP_SIGNAL_NAME (at -0.635 1.905) (layer Dwgs.User) (effects (font (size 0.95 0.95) (thickness 0.08)) (justify left bottom)) ) (fp_line (start 0 -0.635) (end 0 0.635) (layer Dwgs.User) (width 0.0024)) (fp_line (start -0.635 0) (end 0.635 0) (layer Dwgs.User) (width 0.0024)) (pad TP smd roundrect (at 0 0) (size 1.27 1.27) (layers Top F.Mask) (roundrect_rratio 0.5) (net 232 N$43) (solder_mask_margin 0.1016)) ) (module B1,27 (layer Top) (tedit 0) (tstamp 5D7C3092) (at 130.5211 100.8086) (descr "TEST PAD") (fp_text reference TP19 (at -0.635 -1.016) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value PTR1B1,27 (at -0.635 0.762) (layer F.Fab) (effects (font (size 0.02413 0.02413) (thickness 0.00193)) (justify left bottom)) ) (fp_text user >TP_SIGNAL_NAME (at -0.635 1.905) (layer Dwgs.User) (effects (font (size 0.95 0.95) (thickness 0.08)) (justify left bottom)) ) (fp_line (start 0 -0.635) (end 0 0.635) (layer Dwgs.User) (width 0.0024)) (fp_line (start -0.635 0) (end 0.635 0) (layer Dwgs.User) (width 0.0024)) (pad TP smd roundrect (at 0 0) (size 1.27 1.27) (layers Top F.Mask) (roundrect_rratio 0.5) (net 233 N$44) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C3099) (at 118.6211 111.3961 270) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C64 (at -0.5 -0.425 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "1uF, 6.3V" (at -0.5 1.45 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) ) (module R0402 (layer Bottom) (tedit 0) (tstamp 5D7C30A2) (at 156.8831 104.6226 180) (descr "RESISTOR
\nchip") (fp_text reference R54 (at -0.635 0.762) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "0, 1%" (at -0.635 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 -0.3048) (xy 0.5088 -0.3048) (xy 0.5088 0.2951) (xy 0.2088 0.2951)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.504 -0.3048) (xy -0.204 -0.3048) (xy -0.204 0.2951) (xy -0.504 0.2951)) (layer B.Fab) (width 0)) (fp_line (start -0.923 -0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 -0.174) (end -0.245 -0.174) (layer B.Fab) (width 0.1524)) (fp_line (start -0.245 0.174) (end 0.245 0.174) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 144 GPIO1_16.SIP) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 145 GPIO1_16) (solder_mask_margin 0.1016)) ) (module 0603-LED (layer Top) (tedit 0) (tstamp 5D7C30B0) (at 124.3211 115.5086 90) (fp_text reference BT (at -0.65 0) (layer F.SilkS) (effects (font (size 0.9652 0.9652) (thickness 0.14478)) (justify left bottom)) ) (fp_text value LTST-C191TBKT (at 1.65 2.3) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top)) ) (fp_line (start 0.35 0.17) (end 0.35 -0.17) (layer F.SilkS) (width 0.1524)) (fp_line (start -0.35 0.17) (end -0.35 -0.17) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.11) (end 0 0.26) (layer F.Fab) (width 0.05)) (fp_line (start 0 -0.11) (end 0 -0.26) (layer F.Fab) (width 0.05)) (fp_line (start 0.15 -0.11) (end 0 0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 -0.11) (end 0.15 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start -0.15 -0.11) (end 0 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.11) (end -0.15 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.11) (end 0.15 0.11) (layer F.Fab) (width 0.05)) (fp_line (start -0.15 0.11) (end 0 0.11) (layer F.Fab) (width 0.05)) (fp_poly (pts (xy 0.3 -0.4) (xy 0.4 -0.4) (xy 0.4 0.4) (xy 0.3 0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.4 -0.4) (xy -0.3 -0.4) (xy -0.3 0.4) (xy -0.4 0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.15 -0.8) (xy -0.4 -0.8) (xy -0.4 -0.4) (xy 0.4 -0.4) (xy 0.4 -0.8) (xy 0.15 -0.8) (xy 0 -0.65)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 0.15 0.8) (xy 0.4 0.8) (xy 0.4 0.4) (xy -0.4 0.4) (xy -0.4 0.8) (xy -0.15 0.8) (xy 0 0.65)) (layer F.Fab) (width 0)) (fp_line (start -0.19 -0.1232) (end 0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.1432) (end -0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.1432) (end 0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (pad K smd rect (at 0 0.75 90) (size 0.8 0.8) (layers Top F.Paste F.Mask) (net 247 N$24) (solder_mask_margin 0.1016)) (pad A smd rect (at 0 -0.75 90) (size 0.8 0.8) (layers Top F.Paste F.Mask) (net 244 N$57) (solder_mask_margin 0.1016)) ) (module 0603-LED (layer Top) (tedit 0) (tstamp 5D7C30C6) (at 117.1211 115.5086 270) (fp_text reference WL (at -0.65 0) (layer F.SilkS) (effects (font (size 0.9652 0.9652) (thickness 0.14478)) (justify right top)) ) (fp_text value LTST-C191TBKT (at 1.65 2.3) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (fp_line (start 0.35 0.17) (end 0.35 -0.17) (layer F.SilkS) (width 0.1524)) (fp_line (start -0.35 0.17) (end -0.35 -0.17) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.11) (end 0 0.26) (layer F.Fab) (width 0.05)) (fp_line (start 0 -0.11) (end 0 -0.26) (layer F.Fab) (width 0.05)) (fp_line (start 0.15 -0.11) (end 0 0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 -0.11) (end 0.15 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start -0.15 -0.11) (end 0 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.11) (end -0.15 -0.11) (layer F.Fab) (width 0.05)) (fp_line (start 0 0.11) (end 0.15 0.11) (layer F.Fab) (width 0.05)) (fp_line (start -0.15 0.11) (end 0 0.11) (layer F.Fab) (width 0.05)) (fp_poly (pts (xy 0.3 -0.4) (xy 0.4 -0.4) (xy 0.4 0.4) (xy 0.3 0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.4 -0.4) (xy -0.3 -0.4) (xy -0.3 0.4) (xy -0.4 0.4)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.15 -0.8) (xy -0.4 -0.8) (xy -0.4 -0.4) (xy 0.4 -0.4) (xy 0.4 -0.8) (xy 0.15 -0.8) (xy 0 -0.65)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 0.15 0.8) (xy 0.4 0.8) (xy 0.4 0.4) (xy -0.4 0.4) (xy -0.4 0.8) (xy -0.15 0.8) (xy 0 0.65)) (layer F.Fab) (width 0)) (fp_line (start -0.19 -0.1232) (end 0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.1432) (end -0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (fp_line (start 0 0.1432) (end 0.19 -0.1232) (layer F.SilkS) (width 0.1524)) (pad K smd rect (at 0 0.75 270) (size 0.8 0.8) (layers Top F.Paste F.Mask) (net 246 CGND) (solder_mask_margin 0.1016)) (pad A smd rect (at 0 -0.75 270) (size 0.8 0.8) (layers Top F.Paste F.Mask) (net 243 N$25) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C30DC) (at 122.0211 115.5086 180) (descr "RESISTOR
\nchip") (fp_text reference R124 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value 1k (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 244 N$57) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C30EA) (at 119.4211 115.5086) (descr "RESISTOR
\nchip") (fp_text reference R125 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value 1k (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 243 N$25) (solder_mask_margin 0.1016)) ) (module "10118192-0001LF(MICRO-USB-B-AMPHENOL-FCI)" (layer Bottom) (tedit 0) (tstamp 5D7C30F8) (at 106.8451 88.1126 90) (fp_text reference X4 (at -3.75 3.55 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value 10118192-0001LF (at 6.2 -1.45 180) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top mirror)) ) (fp_line (start 1.6 -1.6) (end 1.5 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start 1.6 -1.6) (end 1.7 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start 1.6 -1.85) (end 1.6 -1.6) (layer B.SilkS) (width 0.0381)) (fp_line (start 2 -1.6) (end 1.9 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start 2 -1.6) (end 2.1 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start 2 -1.85) (end 2 -1.6) (layer B.SilkS) (width 0.0381)) (fp_line (start 2.4 -1.6) (end 2.3 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start 2.4 -1.6) (end 2.5 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start 2.4 -1.85) (end 2.4 -1.6) (layer B.SilkS) (width 0.0381)) (fp_line (start 2.8 -1.6) (end 2.7 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start 2.8 -1.6) (end 2.9 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start 2.8 -1.85) (end 2.8 -1.6) (layer B.SilkS) (width 0.0381)) (fp_line (start 3.2 -1.6) (end 3.1 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start 3.2 -1.6) (end 3.3 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start 3.2 -1.85) (end 3.2 -1.6) (layer B.SilkS) (width 0.0381)) (fp_line (start -3.2 -1.6) (end -3.3 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start -3.2 -1.6) (end -3.1 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start -3.2 -1.85) (end -3.2 -1.6) (layer B.SilkS) (width 0.0381)) (fp_line (start -2.8 -1.6) (end -2.9 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start -2.8 -1.6) (end -2.7 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start -2.8 -1.85) (end -2.8 -1.6) (layer B.SilkS) (width 0.0381)) (fp_line (start -2.4 -1.6) (end -2.5 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start -2.4 -1.6) (end -2.3 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start -2.4 -1.85) (end -2.4 -1.6) (layer B.SilkS) (width 0.0381)) (fp_line (start -2 -1.6) (end -2.1 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start -2 -1.6) (end -1.9 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start -2 -1.85) (end -2 -1.6) (layer B.SilkS) (width 0.0381)) (fp_line (start -1.6 -1.6) (end -1.7 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start -1.6 -1.6) (end -1.5 -1.7) (layer B.SilkS) (width 0.0381)) (fp_line (start -1.6 -1.85) (end -1.6 -1.6) (layer B.SilkS) (width 0.0381)) (fp_line (start -3.75 1) (end -3.75 -1) (layer B.Fab) (width 0.127)) (fp_line (start 3.75 1) (end 3.75 -1) (layer B.Fab) (width 0.127)) (fp_line (start 3.75 2.85) (end 3.75 1.7) (layer B.Fab) (width 0.127)) (fp_line (start 2 2.85) (end 3.75 2.85) (layer B.Fab) (width 0.127)) (fp_line (start -3.75 2.85) (end -3.75 1.7) (layer B.Fab) (width 0.127)) (fp_line (start -2 2.85) (end -3.75 2.85) (layer B.Fab) (width 0.127)) (fp_line (start 1.67 2.85) (end 1.88 2.85) (layer B.SilkS) (width 0.127)) (fp_line (start -1.88 2.85) (end -1.67 2.85) (layer B.SilkS) (width 0.127)) (fp_text user "Edge of PCB" (at 0 -1.6 90) (layer B.SilkS) (effects (font (size 0.2413 0.2413) (thickness 0.02032)) (justify top mirror)) ) (fp_line (start 3.75 -2.15) (end 3.75 -1.45) (layer Cmts.User) (width 0.127)) (fp_line (start -3.75 -2.15) (end 3.75 -2.15) (layer Cmts.User) (width 0.127)) (fp_line (start -3.75 -1.45) (end -3.75 -2.15) (layer Cmts.User) (width 0.127)) (fp_line (start -3.75 1.12) (end -3.75 1.58) (layer B.SilkS) (width 0.127)) (fp_line (start 3.75 1.12) (end 3.75 1.58) (layer B.SilkS) (width 0.127)) (fp_line (start 3.75 -1.45) (end 3.75 -1.12) (layer B.SilkS) (width 0.127)) (fp_line (start -3.75 -1.45) (end -3.75 -1.12) (layer B.SilkS) (width 0.127)) (fp_line (start -3.75 -1.45) (end 3.75 -1.45) (layer B.SilkS) (width 0.127)) (pad GND smd rect (at 1.3 2.675 90) (size 0.4 1.35) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad ID smd rect (at 0.65 2.675 90) (size 0.4 1.35) (layers Bottom B.Paste B.Mask) (net 58 USB.CLIENT.ID) (solder_mask_margin 0.1016)) (pad D+ smd rect (at 0 2.675 90) (size 0.4 1.35) (layers Bottom B.Paste B.Mask) (net 57 USB.CLIENT.D+) (solder_mask_margin 0.1016)) (pad D- smd rect (at -0.65 2.675 90) (size 0.4 1.35) (layers Bottom B.Paste B.Mask) (net 56 USB.CLIENT.D-) (solder_mask_margin 0.1016)) (pad VBUS smd rect (at -1.3 2.675 90) (size 0.4 1.35) (layers Bottom B.Paste B.Mask) (net 59 USB_DC) (solder_mask_margin 0.1016)) (pad CGND4 smd rect (at 3.8 0 90) (size 1.8 1.9) (layers Bottom B.Paste B.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad CGND3 smd rect (at 1.2 0 90) (size 1.9 1.9) (layers Bottom B.Paste B.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad CGND2 smd rect (at -1.2 0 90) (size 1.9 1.9) (layers Bottom B.Paste B.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad CGND1 smd rect (at -3.8 0 90) (size 1.8 1.9) (layers Bottom B.Paste B.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad CGND5 smd rect (at 3.1 2.55 90) (size 2.1 1.6) (layers Bottom B.Paste B.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad CGND6 smd rect (at -3.1 2.55 90) (size 2.1 1.6) (layers Bottom B.Paste B.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) ) (module MOUNTING_HOLE (layer Top) (tedit 0) (tstamp 5D7C3135) (at 119.9261 80.8736) (fp_text reference MGT1 (at 0 0) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15))) ) (fp_text value MOUNTING_HOLE (at 0 0) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15))) ) (pad P$1 thru_hole circle (at 0 0) (size 4.445 4.445) (drill 3.175) (layers *.Cu *.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) ) (module MOUNTING_HOLE (layer Top) (tedit 0) (tstamp 5D7C3139) (at 185.9661 84.0486) (fp_text reference MGT2 (at 0 0) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15))) ) (fp_text value MOUNTING_HOLE (at 0 0) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15))) ) (pad P$1 thru_hole circle (at 0 0) (size 4.445 4.445) (drill 3.175) (layers *.Cu *.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) ) (module MOUNTING_HOLE (layer Top) (tedit 0) (tstamp 5D7C313D) (at 185.9661 125.9586) (fp_text reference MGT3 (at 0 0) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15))) ) (fp_text value MOUNTING_HOLE (at 0 0) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15))) ) (pad P$1 thru_hole circle (at 0 0) (size 4.445 4.445) (drill 3.175) (layers *.Cu *.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) ) (module MOUNTING_HOLE (layer Top) (tedit 0) (tstamp 5D7C3141) (at 119.9261 129.1336) (fp_text reference MGT4 (at 0 0) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15))) ) (fp_text value MOUNTING_HOLE (at 0 0) (layer F.SilkS) hide (effects (font (size 1.27 1.27) (thickness 0.15))) ) (pad P$1 thru_hole circle (at 0 0) (size 4.445 4.445) (drill 3.175) (layers *.Cu *.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) ) (module USB_HOST_HORIZONTAL_W_CHASSIS_GND (layer Top) (tedit 0) (tstamp 5D7C3145) (at 191.6811 115.4811 90) (fp_text reference X3 (at -6.5001 -14.5001) (layer F.SilkS) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top)) ) (fp_text value "" (at -4.5001 -10 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (fp_line (start 0.6 -13.9) (end -0.6 -13.9) (layer F.SilkS) (width 0.2032)) (fp_line (start -1.4 -13.9) (end -3.1 -13.9) (layer F.SilkS) (width 0.2032)) (fp_line (start 3.1 -13.9) (end 1.4 -13.9) (layer F.SilkS) (width 0.2032)) (fp_line (start 6.8 0) (end 7 0) (layer F.Fab) (width 0.2032)) (fp_line (start 8 -9.5) (end 6.5 -9) (layer F.Fab) (width 0.2032)) (fp_line (start 8 -11) (end 8 -9.5) (layer F.Fab) (width 0.2032)) (fp_line (start 6.5 -11.5) (end 8 -11) (layer F.Fab) (width 0.2032)) (fp_line (start -8 -9.5) (end -6.5 -9) (layer F.Fab) (width 0.2032)) (fp_line (start -8 -11) (end -8 -9.5) (layer F.Fab) (width 0.2032)) (fp_line (start -6.5 -11.5) (end -8 -11) (layer F.Fab) (width 0.2032)) (fp_line (start 3 -2) (end 2 -8) (layer F.Fab) (width 0.2032)) (fp_line (start 4 -2) (end 3 -2) (layer F.Fab) (width 0.2032)) (fp_line (start 5 -8) (end 4 -2) (layer F.Fab) (width 0.2032)) (fp_line (start -3 -2) (end -2 -8) (layer F.Fab) (width 0.2032)) (fp_line (start -4 -2) (end -3 -2) (layer F.Fab) (width 0.2032)) (fp_line (start -5 -8) (end -4 -2) (layer F.Fab) (width 0.2032)) (fp_arc (start 6.200099 0) (end 5.9 0) (angle 89.980911) (layer F.Fab) (width 0.2032)) (fp_arc (start 6.8 -0.3) (end 6.5 -0.3) (angle -90) (layer F.Fab) (width 0.2032)) (fp_arc (start -6.2 0) (end -6.2 -0.3) (angle 90) (layer F.Fab) (width 0.2032)) (fp_line (start -6.8 0) (end -7 0) (layer F.Fab) (width 0.2032)) (fp_arc (start -6.7999 -0.3) (end -6.7999 0) (angle -90) (layer F.Fab) (width 0.2032)) (fp_line (start -6.5 -9) (end -6.5 -0.3) (layer F.Fab) (width 0.2032)) (fp_line (start -6.5 -11.5) (end -6.5 -9) (layer F.Fab) (width 0.2032)) (fp_line (start -6.5 -13.9) (end -6.5 -11.5) (layer F.Fab) (width 0.2032)) (fp_line (start 6.5 -13.9) (end -6.5 -13.9) (layer F.Fab) (width 0.2032)) (fp_line (start 6.5 -11.5) (end 6.5 -13.9) (layer F.Fab) (width 0.2032)) (fp_line (start 6.5 -9) (end 6.5 -11.5) (layer F.Fab) (width 0.2032)) (fp_line (start 6.5 -0.3) (end 6.5 -9) (layer F.Fab) (width 0.2032)) (fp_line (start 6.2 -0.3) (end 6.5 -0.3) (layer F.Fab) (width 0.2032)) (fp_line (start -5.9 0) (end 5.9 0) (layer F.Fab) (width 0.2032)) (fp_line (start -6.4999 -0.3) (end -6.2 -0.3) (layer F.Fab) (width 0.2032)) (fp_line (start -6.5 -0.3) (end -6.4999 -0.3) (layer F.Fab) (width 0.2032)) (fp_text user "AMP 787616-1" (at -5.08 -0.635 90) (layer F.SilkS) (effects (font (size 0.9652 0.9652) (thickness 0.12192)) (justify left bottom)) ) (fp_line (start 6.8 0) (end 7 0) (layer F.SilkS) (width 0.2032)) (fp_line (start 3 -2) (end 2 -8) (layer F.SilkS) (width 0.2032)) (fp_line (start 4 -2) (end 3 -2) (layer F.SilkS) (width 0.2032)) (fp_line (start 5 -8) (end 4 -2) (layer F.SilkS) (width 0.2032)) (fp_line (start -3 -2) (end -2 -8) (layer F.SilkS) (width 0.2032)) (fp_line (start -4 -2) (end -3 -2) (layer F.SilkS) (width 0.2032)) (fp_line (start -5 -8) (end -4 -2) (layer F.SilkS) (width 0.2032)) (fp_arc (start 6.200099 0) (end 5.9 0) (angle 89.980911) (layer F.SilkS) (width 0.2032)) (fp_arc (start 6.8 -0.3) (end 6.5 -0.3) (angle -90) (layer F.SilkS) (width 0.2032)) (fp_arc (start -6.2 0) (end -6.2 -0.3) (angle 90) (layer F.SilkS) (width 0.2032)) (fp_line (start -6.8 0) (end -7 0) (layer F.SilkS) (width 0.2032)) (fp_arc (start -6.7999 -0.3) (end -6.7999 0) (angle -90) (layer F.SilkS) (width 0.2032)) (fp_line (start -6.5 -8.4) (end -6.5 -0.3) (layer F.SilkS) (width 0.2032)) (fp_line (start -6.5 -13.9) (end -6.5 -12.2) (layer F.SilkS) (width 0.2032)) (fp_line (start -3.9 -13.9) (end -6.5 -13.9) (layer F.SilkS) (width 0.2032)) (fp_line (start 6.5 -13.9) (end 3.9 -13.9) (layer F.SilkS) (width 0.2032)) (fp_line (start 6.5 -12.2) (end 6.5 -13.9) (layer F.SilkS) (width 0.2032)) (fp_line (start 6.5 -0.3) (end 6.5 -8.4) (layer F.SilkS) (width 0.2032)) (fp_line (start 6.2 -0.3) (end 6.5 -0.3) (layer F.SilkS) (width 0.2032)) (fp_line (start -5.9 0) (end 5.9 0) (layer F.SilkS) (width 0.2032)) (fp_line (start -6.4999 -0.3) (end -6.2 -0.3) (layer F.SilkS) (width 0.2032)) (fp_line (start -6.5 -0.3) (end -6.4999 -0.3) (layer F.SilkS) (width 0.2032)) (pad 6 thru_hole circle (at 6.57 -10.2799 90) (size 2.808 2.808) (drill 2.3) (layers *.Cu *.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad 5 thru_hole circle (at -6.57 -10.2799 90) (size 2.808 2.808) (drill 2.3) (layers *.Cu *.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad 4 thru_hole circle (at 3.5 -12.99 90) (size 1.508 1.508) (drill 1) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 3 thru_hole circle (at 1 -12.99 90) (size 1.508 1.508) (drill 1) (layers *.Cu *.Mask) (net 60 USB.HOST.D+) (solder_mask_margin 0.1016)) (pad 2 thru_hole circle (at -1 -12.99 90) (size 1.508 1.508) (drill 1) (layers *.Cu *.Mask) (net 61 USB.HOST.D-) (solder_mask_margin 0.1016)) (pad 1 thru_hole circle (at -3.5 -12.99 90) (size 1.508 1.508) (drill 1) (layers *.Cu *.Mask) (net 199 VBUS.HOST) (solder_mask_margin 0.1016)) ) (module R0805 (layer Bottom) (tedit 0) (tstamp 5D7C3185) (at 108.3691 122.7836 180) (descr "RESISTOR
\nchip") (fp_text reference R17 (at -0.762 1.016) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value ".1, 0805" (at -0.762 -2.286) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.5001) (xy 0.1999 -0.5001) (xy 0.1999 0.5001) (xy -0.1999 0.5001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -1.0668 -0.6985) (xy -0.4168 -0.6985) (xy -0.4168 0.7015) (xy -1.0668 0.7015)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.4064 -0.6985) (xy 1.0564 -0.6985) (xy 1.0564 0.7015) (xy 0.4064 0.7015)) (layer B.Fab) (width 0)) (fp_line (start -1.973 -0.983) (end -1.973 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.973 -0.983) (end -1.973 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.973 0.983) (end 1.973 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.973 0.983) (end 1.973 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.41 -0.635) (end 0.41 -0.635) (layer B.Fab) (width 0.1524)) (fp_line (start -0.41 0.635) (end 0.41 0.635) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.85 0 180) (size 1.3 1.5) (layers Bottom B.Paste B.Mask) (net 245 N$59) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.85 0 180) (size 1.3 1.5) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module SOT23-5 (layer Top) (tedit 0) (tstamp 5D7C3193) (at 135.2931 87.8586 90) (fp_text reference IC19 (at -1.905 -1.905) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "AP2112K-1.8TRG1 3.3V" (at -1.905 3.175 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -1.1684 -0.6546) (xy -0.7112 -0.6546) (xy -0.7112 -1.2388) (xy -1.1684 -1.2388)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 0.7112 -0.6546) (xy 1.1684 -0.6546) (xy 1.1684 -1.2388) (xy 0.7112 -1.2388)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -1.1684 1.2954) (xy -0.7112 1.2954) (xy -0.7112 0.7112) (xy -1.1684 0.7112)) (layer F.Fab) (width 0)) (fp_poly (pts (xy 0.7112 1.2954) (xy 1.1684 1.2954) (xy 1.1684 0.7112) (xy 0.7112 0.7112)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.2286 -0.7112) (xy 0.2286 -0.7112) (xy 0.2286 -1.2954) (xy -0.2286 -1.2954)) (layer F.Fab) (width 0)) (fp_line (start -1.4224 -0.6604) (end 1.4224 -0.6604) (layer F.Fab) (width 0.1524)) (fp_line (start -1.4224 0.6604) (end -1.4224 -0.6604) (layer F.Fab) (width 0.1524)) (fp_line (start 1.4224 0.6604) (end -1.4224 0.6604) (layer F.Fab) (width 0.1524)) (fp_line (start 1.4224 -0.6604) (end 1.4224 0.6604) (layer F.Fab) (width 0.1524)) (pad 3 smd rect (at -0.95 -1.1 90) (size 0.7 1.4) (layers Top F.Paste F.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) (pad 1 smd rect (at 0.95 -1.1 90) (size 0.7 1.4) (layers Top F.Paste F.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) (pad 4 smd rect (at -0.95 1.1 90) (size 0.7 1.4) (layers Top F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 5 smd rect (at 0.95 1.1 90) (size 0.7 1.4) (layers Top F.Paste F.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) (pad 2 smd rect (at 0 -1.1 90) (size 0.7 1.4) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C31A4) (at 138.2141 87.8586 270) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C8 (at -0.5 -0.425 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value 1uF (at -0.5 1.45 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) ) (module C0402K (layer Top) (tedit 0) (tstamp 5D7C31AD) (at 135.2931 84.9376) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C10 (at -0.5 -0.425) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value 1uF (at -0.5 1.45) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify left bottom)) ) (fp_poly (pts (xy 0.225 0.25) (xy 0.5 0.25) (xy 0.5 -0.25) (xy 0.225 -0.25)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.5 0.25) (xy -0.225 0.25) (xy -0.225 -0.25) (xy -0.5 -0.25)) (layer F.Fab) (width 0)) (fp_line (start 0.425 0.2) (end -0.425 0.2) (layer F.Fab) (width 0.1016)) (fp_line (start -0.425 -0.2) (end 0.425 -0.2) (layer F.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) ) (module "SC70(TI-DCK)" (layer Top) (tedit 0) (tstamp 5D7C31B6) (at 136.9441 122.9106 270) (fp_text reference IC2 (at -2.159 -2.032) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value SN74LVC1G07DCK (at -2.159 3.048 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top)) ) (fp_line (start -1 -0.625) (end -1 0.625) (layer F.Fab) (width 0.127)) (fp_line (start 1 -0.625) (end -1 -0.625) (layer F.Fab) (width 0.127)) (fp_line (start 1 0.625) (end 1 -0.625) (layer F.Fab) (width 0.127)) (fp_line (start -1 0.625) (end 1 0.625) (layer F.Fab) (width 0.127)) (fp_line (start -0.28 0.625) (end 0.28 0.625) (layer F.SilkS) (width 0.127)) (fp_circle (center 1.27 -1.143) (end 1.37 -1.143) (layer F.SilkS) (width 0.254)) (fp_line (start 1 -0.5) (end 1 0.5) (layer F.SilkS) (width 0.127)) (fp_line (start -1 -0.5) (end -1 0.625) (layer F.SilkS) (width 0.127)) (pad 5 smd rect (at 0.65 1.1 270) (size 0.4 0.9) (layers Top F.Paste F.Mask) (net 39 VDD_1V8) (solder_mask_margin 0.1016)) (pad 4 smd rect (at -0.65 1.1 270) (size 0.4 0.9) (layers Top F.Paste F.Mask) (net 102 SYS_RESET#) (solder_mask_margin 0.1016)) (pad 1 smd rect (at 0.65 -1.1 270) (size 0.4 0.9) (layers Top F.Paste F.Mask) (solder_mask_margin 0.1016)) (pad 2 smd rect (at 0 -1.1 270) (size 0.4 0.9) (layers Top F.Paste F.Mask) (net 70 PMIC_PGOOD) (solder_mask_margin 0.1016)) (pad 3 smd rect (at -0.65 -1.1 270) (size 0.4 0.9) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module "SC70(TI-DCK)" (layer Bottom) (tedit 0) (tstamp 5D7C31C6) (at 159.2707 93.4466 90) (fp_text reference IC3 (at -2.159 2.032 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value SN74LVC1G06DCK (at -2.159 -3.048 90) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_line (start -1 0.625) (end -1 -0.625) (layer B.Fab) (width 0.127)) (fp_line (start 1 0.625) (end -1 0.625) (layer B.Fab) (width 0.127)) (fp_line (start 1 -0.625) (end 1 0.625) (layer B.Fab) (width 0.127)) (fp_line (start -1 -0.625) (end 1 -0.625) (layer B.Fab) (width 0.127)) (fp_line (start -0.28 -0.625) (end 0.28 -0.625) (layer B.SilkS) (width 0.127)) (fp_circle (center 1.27 1.143) (end 1.37 1.143) (layer B.SilkS) (width 0.254)) (fp_line (start 1 0.5) (end 1 -0.5) (layer B.SilkS) (width 0.127)) (fp_line (start -1 0.5) (end -1 -0.625) (layer B.SilkS) (width 0.127)) (pad 5 smd rect (at 0.65 -1.1 90) (size 0.4 0.9) (layers Bottom B.Paste B.Mask) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad 4 smd rect (at -0.65 -1.1 90) (size 0.4 0.9) (layers Bottom B.Paste B.Mask) (net 116 N$31) (solder_mask_margin 0.1016)) (pad 1 smd rect (at 0.65 1.1 90) (size 0.4 0.9) (layers Bottom B.Paste B.Mask) (solder_mask_margin 0.1016)) (pad 2 smd rect (at 0 1.1 90) (size 0.4 0.9) (layers Bottom B.Paste B.Mask) (net 115 N$30) (solder_mask_margin 0.1016)) (pad 3 smd rect (at -0.65 1.1 90) (size 0.4 0.9) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) ) (module "SOT-323(DIODES)" (layer Bottom) (tedit 0) (tstamp 5D7C31D6) (at 118.8211 117.3086 270) (fp_text reference T3 (at -1.27 -1.524 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value BSS138W-7-F (at 2.286 -1.524 180) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_line (start 1.075 0.65) (end 1.075 -0.33) (layer B.SilkS) (width 0.127)) (fp_line (start 0.52 0.65) (end 1.075 0.65) (layer B.SilkS) (width 0.127)) (fp_line (start -0.13 -0.65) (end 0.13 -0.65) (layer B.SilkS) (width 0.127)) (fp_line (start -1.075 0.65) (end -1.075 -0.33) (layer B.SilkS) (width 0.127)) (fp_line (start -0.52 0.65) (end -1.075 0.65) (layer B.SilkS) (width 0.127)) (fp_line (start 1.075 -0.65) (end 1.075 0.65) (layer B.Fab) (width 0.127)) (fp_line (start -1.075 -0.65) (end 1.075 -0.65) (layer B.Fab) (width 0.127)) (fp_line (start -1.075 0.65) (end -1.075 -0.65) (layer B.Fab) (width 0.127)) (fp_line (start 1.075 0.65) (end -1.075 0.65) (layer B.Fab) (width 0.127)) (pad S smd rect (at 0.65 -0.95 270) (size 0.7 0.9) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad D smd rect (at 0 0.95 270) (size 0.7 0.9) (layers Bottom B.Paste B.Mask) (net 246 CGND) (solder_mask_margin 0.1016)) (pad G smd rect (at -0.65 -0.95 270) (size 0.7 0.9) (layers Bottom B.Paste B.Mask) (net 215 WL_EN) (solder_mask_margin 0.1016)) ) (module "SOT-323(DIODES)" (layer Bottom) (tedit 0) (tstamp 5D7C31E5) (at 122.6211 117.3086 90) (fp_text reference T4 (at -1.27 -1.524 180) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value BSS138W-7-F (at 2.286 -1.524 180) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top mirror)) ) (fp_line (start 1.075 0.65) (end 1.075 -0.33) (layer B.SilkS) (width 0.127)) (fp_line (start 0.52 0.65) (end 1.075 0.65) (layer B.SilkS) (width 0.127)) (fp_line (start -0.13 -0.65) (end 0.13 -0.65) (layer B.SilkS) (width 0.127)) (fp_line (start -1.075 0.65) (end -1.075 -0.33) (layer B.SilkS) (width 0.127)) (fp_line (start -0.52 0.65) (end -1.075 0.65) (layer B.SilkS) (width 0.127)) (fp_line (start 1.075 -0.65) (end 1.075 0.65) (layer B.Fab) (width 0.127)) (fp_line (start -1.075 -0.65) (end 1.075 -0.65) (layer B.Fab) (width 0.127)) (fp_line (start -1.075 0.65) (end -1.075 -0.65) (layer B.Fab) (width 0.127)) (fp_line (start 1.075 0.65) (end -1.075 0.65) (layer B.Fab) (width 0.127)) (pad S smd rect (at 0.65 -0.95 90) (size 0.7 0.9) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad D smd rect (at 0 0.95 90) (size 0.7 0.9) (layers Bottom B.Paste B.Mask) (net 247 N$24) (solder_mask_margin 0.1016)) (pad G smd rect (at -0.65 -0.95 90) (size 0.7 0.9) (layers Bottom B.Paste B.Mask) (net 216 BT_EN) (solder_mask_margin 0.1016)) ) (module MICRON_EMMC_153 (layer Top) (tedit 0) (tstamp 5D7C31F4) (at 151.6336 89.3711 90) (fp_text reference IC22 (at -5.5 -7.25 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "" (at -5.5 7.25 90) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify left bottom)) ) (fp_circle (center -6 -6.75) (end -5.875 -6.75) (layer F.SilkS) (width 0.25)) (fp_line (start -5.75 -5.875) (end -5.125 -6.5) (layer F.SilkS) (width 0.127)) (fp_line (start -5.75 -6) (end -5.25 -6.5) (layer F.SilkS) (width 0.127)) (fp_line (start -5.75 -6.125) (end -5.375 -6.5) (layer F.SilkS) (width 0.127)) (fp_line (start -5.75 -6.25) (end -5.5 -6.5) (layer F.SilkS) (width 0.127)) (fp_line (start -5.75 -6.375) (end -5.625 -6.5) (layer F.SilkS) (width 0.127)) (fp_line (start 5.75 6.5) (end 5.75 -6.5) (layer F.SilkS) (width 0.127)) (fp_line (start -5.75 6.5) (end 5.75 6.5) (layer F.SilkS) (width 0.127)) (fp_line (start -5.75 -5.875) (end -5.75 6.5) (layer F.SilkS) (width 0.127)) (fp_line (start -5.75 -6) (end -5.75 -5.875) (layer F.SilkS) (width 0.127)) (fp_line (start -5.75 -6.125) (end -5.75 -6) (layer F.SilkS) (width 0.127)) (fp_line (start -5.75 -6.25) (end -5.75 -6.125) (layer F.SilkS) (width 0.127)) (fp_line (start -5.75 -6.375) (end -5.75 -6.25) (layer F.SilkS) (width 0.127)) (fp_line (start -5.75 -6.5) (end -5.75 -6.375) (layer F.SilkS) (width 0.127)) (fp_line (start -5.625 -6.5) (end -5.75 -6.5) (layer F.SilkS) (width 0.127)) (fp_line (start -5.5 -6.5) (end -5.625 -6.5) (layer F.SilkS) (width 0.127)) (fp_line (start -5.375 -6.5) (end -5.5 -6.5) (layer F.SilkS) (width 0.127)) (fp_line (start -5.25 -6.5) (end -5.375 -6.5) (layer F.SilkS) (width 0.127)) (fp_line (start -5.125 -6.5) (end -5.25 -6.5) (layer F.SilkS) (width 0.127)) (fp_line (start 5.75 -6.5) (end -5.125 -6.5) (layer F.SilkS) (width 0.127)) (fp_text user P (at -3.5 3.25 90) (layer Cmts.User) (effects (font (size 0.19 0.19) (thickness 0.016)) (justify right)) ) (fp_text user N 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(pad K5 smd roundrect (at -1.25 1.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 117 EMMC_RSTN) (solder_mask_margin 0.1016)) (pad J5 smd roundrect (at -1.25 0.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad H5 smd roundrect (at -1.25 0.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad G5 smd roundrect (at -1.25 -0.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.1016)) (pad F5 smd roundrect (at -1.25 -0.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad E5 smd roundrect (at -1.25 -1.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad C5 smd roundrect (at -1.25 -2.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad B5 smd roundrect (at -1.25 -2.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 124 MMC1_DAT6) (solder_mask_margin 0.1016)) (pad A5 smd roundrect (at -1.25 -3.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 120 MMC1_DAT2) (solder_mask_margin 0.1016)) (pad P4 smd roundrect (at -1.75 3.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.1016)) (pad N4 smd roundrect (at -1.75 2.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad M4 smd roundrect (at -1.75 2.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad D4 smd roundrect (at -1.75 -1.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad C4 smd roundrect (at -1.75 -2.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.1016)) (pad B4 smd roundrect (at -1.75 -2.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 123 MMC1_DAT5) (solder_mask_margin 0.1016)) (pad A4 smd roundrect (at -1.75 -3.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 119 MMC1_DAT1) (solder_mask_margin 0.1016)) (pad P3 smd roundrect (at -2.25 3.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 64 VDD_3V3B) (solder_mask_margin 0.1016)) (pad N3 smd roundrect (at -2.25 2.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad M3 smd roundrect (at -2.25 2.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad L3 smd roundrect (at -2.25 1.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad K3 smd roundrect (at -2.25 1.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad J3 smd roundrect (at -2.25 0.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad H3 smd roundrect (at -2.25 0.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad G3 smd roundrect (at -2.25 -0.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad F3 smd roundrect (at -2.25 -0.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad E3 smd roundrect (at -2.25 -1.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad D3 smd roundrect (at -2.25 -1.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad C3 smd roundrect (at -2.25 -2.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad B3 smd roundrect (at -2.25 -2.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 122 MMC1_DAT4) (solder_mask_margin 0.1016)) (pad A3 smd roundrect (at -2.25 -3.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 118 MMC1_DAT0) (solder_mask_margin 0.1016)) (pad P2 smd roundrect (at -2.75 3.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad N2 smd roundrect (at -2.75 2.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 1 GND) (solder_mask_margin 0.1016)) (pad M2 smd roundrect (at -2.75 2.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad L2 smd roundrect (at -2.75 1.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad K2 smd roundrect (at -2.75 1.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad J2 smd roundrect (at -2.75 0.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad H2 smd roundrect (at -2.75 0.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad G2 smd roundrect (at -2.75 -0.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad F2 smd roundrect (at -2.75 -0.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad E2 smd roundrect (at -2.75 -1.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad D2 smd roundrect (at -2.75 -1.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad C2 smd roundrect (at -2.75 -2.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 179 N$47) (solder_mask_margin 0.1016)) (pad B2 smd roundrect (at -2.75 -2.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (net 121 MMC1_DAT3) (solder_mask_margin 0.1016)) (pad A2 smd roundrect (at -2.75 -3.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad P1 smd roundrect (at -3.25 3.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad N1 smd roundrect (at -3.25 2.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad M1 smd roundrect (at -3.25 2.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad L1 smd roundrect (at -3.25 1.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad K1 smd roundrect (at -3.25 1.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad J1 smd roundrect (at -3.25 0.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad H1 smd roundrect (at -3.25 0.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad G1 smd roundrect (at -3.25 -0.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad F1 smd roundrect (at -3.25 -0.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad E1 smd roundrect (at -3.25 -1.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad D1 smd roundrect (at -3.25 -1.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad C1 smd roundrect (at -3.25 -2.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad B1 smd roundrect (at -3.25 -2.75 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) (pad A1 smd roundrect (at -3.25 -3.25 90) (size 0.245 0.245) (layers Top F.Paste F.Mask) (roundrect_rratio 0.5) (solder_mask_margin 0.1016)) ) (module C0402K (layer Bottom) (tedit 0) (tstamp 5D7C32C0) (at 149.5711 92.3711) (descr "Ceramic Chip Capacitor KEMET 0204 Reflow solder
\nMetric Code Size 1005") (fp_text reference C69 (at -0.5 0.425) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value ".1uF, 6.3V" (at -0.5 -1.45) (layer B.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.077216)) (justify right top mirror)) ) (fp_poly (pts (xy 0.225 -0.25) (xy 0.5 -0.25) (xy 0.5 0.25) (xy 0.225 0.25)) (layer B.Fab) (width 0)) (fp_poly (pts (xy -0.5 -0.25) (xy -0.225 -0.25) (xy -0.225 0.25) (xy -0.5 0.25)) (layer B.Fab) (width 0)) (fp_line (start 0.425 -0.2) (end -0.425 -0.2) (layer B.Fab) (width 0.1016)) (fp_line (start -0.425 0.2) (end 0.425 0.2) (layer B.Fab) (width 0.1016)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Bottom B.Paste B.Mask) (net 179 N$47) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C32C9) (at 115.2211 94.1086 90) (descr "RESISTOR
\nchip") (fp_text reference R60 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "33, 5%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 214 WL_IRQ) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 250 NC3) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C32D7) (at 122.8211 94.1086 90) (descr "RESISTOR
\nchip") (fp_text reference R62 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "33, 5%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 208 WL_SDIO_CMD) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 256 N$69) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C32E5) (at 121.4211 94.1086 90) (descr "RESISTOR
\nchip") (fp_text reference R64 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "33, 5%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 209 WL_SDIO_CLK) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 255 N$67) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C32F3) (at 120.0211 94.1086 90) (descr "RESISTOR
\nchip") (fp_text reference R66 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "33, 5%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 210 WL_SDIO_D0) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 254 N$65) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C3301) (at 118.8211 94.1086 90) (descr "RESISTOR
\nchip") (fp_text reference R68 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "33, 5%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 211 WL_SDIO_D1) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 253 N$64) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C330F) (at 117.6211 94.1086 90) (descr "RESISTOR
\nchip") (fp_text reference R70 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "33, 5%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 212 WL_SDIO_D2) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 252 N$63) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C331D) (at 116.4211 94.1086 90) (descr "RESISTOR
\nchip") (fp_text reference R72 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "33, 5%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 213 WL_SDIO_D3) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 251 N$62) (solder_mask_margin 0.1016)) ) (module R0603 (layer Bottom) (tedit 0) (tstamp 5D7C332B) (at 139.1285 93.8276) (descr "RESISTOR
\nchip") (fp_text reference R86 (at -0.889 0.889) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "33, 5%" (at -0.889 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -0.8382 -0.4318) (xy -0.4318 -0.4318) (xy -0.4318 0.4318) (xy -0.8382 0.4318)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.4318 -0.4318) (xy 0.8382 -0.4318) (xy 0.8382 0.4318) (xy 0.4318 0.4318)) (layer B.Fab) (width 0)) (fp_line (start 0 0.508) (end 0 -0.508) (layer B.SilkS) (width 0.127)) (fp_line (start -1.473 -0.983) (end -1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 -0.983) (end -1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 0.983) (end 1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.473 0.983) (end 1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.432 0.356) (end -0.432 0.356) (layer B.Fab) (width 0.1524)) (fp_line (start -0.432 -0.356) (end 0.432 -0.356) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.85 0) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 261 N$96) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.85 0) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 239 WL_SDIO_CMD.SIP) (solder_mask_margin 0.1016)) ) (module R0603 (layer Bottom) (tedit 0) (tstamp 5D7C333A) (at 151.4221 108.3056 180) (descr "RESISTOR
\nchip") (fp_text reference R126 (at -0.889 0.889) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "33, 5%" (at -0.889 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -0.8382 -0.4318) (xy -0.4318 -0.4318) (xy -0.4318 0.4318) (xy -0.8382 0.4318)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.4318 -0.4318) (xy 0.8382 -0.4318) (xy 0.8382 0.4318) (xy 0.4318 0.4318)) (layer B.Fab) (width 0)) (fp_line (start 0 0.508) (end 0 -0.508) (layer B.SilkS) (width 0.127)) (fp_line (start -1.473 -0.983) (end -1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 -0.983) (end -1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 0.983) (end 1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.473 0.983) (end 1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.432 0.356) (end -0.432 0.356) (layer B.Fab) (width 0.1524)) (fp_line (start -0.432 -0.356) (end 0.432 -0.356) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.85 0 180) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 264 ALT.BUFF.OE) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.85 0 180) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 238 WL_SDIO_CLK.SIP) (solder_mask_margin 0.1016)) ) (module R0603 (layer Bottom) (tedit 0) (tstamp 5D7C3349) (at 140.8811 101.8286 90) (descr "RESISTOR
\nchip") (fp_text reference R127 (at -0.889 0.889 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "33, 5%" (at -0.889 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -0.8382 -0.4318) (xy -0.4318 -0.4318) (xy -0.4318 0.4318) (xy -0.8382 0.4318)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.4318 -0.4318) (xy 0.8382 -0.4318) (xy 0.8382 0.4318) (xy 0.4318 0.4318)) (layer B.Fab) (width 0)) (fp_line (start 0 0.508) (end 0 -0.508) (layer B.SilkS) (width 0.127)) (fp_line (start -1.473 -0.983) (end -1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 -0.983) (end -1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 0.983) (end 1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.473 0.983) (end 1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.432 0.356) (end -0.432 0.356) (layer B.Fab) (width 0.1524)) (fp_line (start -0.432 -0.356) (end 0.432 -0.356) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.85 0 90) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 270 ALT.WL.D2) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.85 0 90) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 237 WL_SDIO_D3.SIP) (solder_mask_margin 0.1016)) ) (module R0603 (layer Bottom) (tedit 0) (tstamp 5D7C3358) (at 138.8491 101.7016 90) (descr "RESISTOR
\nchip") (fp_text reference R128 (at -0.889 0.889 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "33, 5%" (at -0.889 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -0.8382 -0.4318) (xy -0.4318 -0.4318) (xy -0.4318 0.4318) (xy -0.8382 0.4318)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.4318 -0.4318) (xy 0.8382 -0.4318) (xy 0.8382 0.4318) (xy 0.4318 0.4318)) (layer B.Fab) (width 0)) (fp_line (start 0 0.508) (end 0 -0.508) (layer B.SilkS) (width 0.127)) (fp_line (start -1.473 -0.983) (end -1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 -0.983) (end -1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 0.983) (end 1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.473 0.983) (end 1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.432 0.356) (end -0.432 0.356) (layer B.Fab) (width 0.1524)) (fp_line (start -0.432 -0.356) (end 0.432 -0.356) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.85 0 90) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 269 ALT.WL.D1) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.85 0 90) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 236 WL_SDIO_D2.SIP) (solder_mask_margin 0.1016)) ) (module R0603 (layer Bottom) (tedit 0) (tstamp 5D7C3367) (at 136.8171 101.7016 90) (descr "RESISTOR
\nchip") (fp_text reference R129 (at -0.889 0.889 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "33, 5%" (at -0.889 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -0.8382 -0.4318) (xy -0.4318 -0.4318) (xy -0.4318 0.4318) (xy -0.8382 0.4318)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.4318 -0.4318) (xy 0.8382 -0.4318) (xy 0.8382 0.4318) (xy 0.4318 0.4318)) (layer B.Fab) (width 0)) (fp_line (start 0 0.508) (end 0 -0.508) (layer B.SilkS) (width 0.127)) (fp_line (start -1.473 -0.983) (end -1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 -0.983) (end -1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 0.983) (end 1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.473 0.983) (end 1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.432 0.356) (end -0.432 0.356) (layer B.Fab) (width 0.1524)) (fp_line (start -0.432 -0.356) (end 0.432 -0.356) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.85 0 90) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 268 ALT.WL.D0) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.85 0 90) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 235 WL_SDIO_D1.SIP) (solder_mask_margin 0.1016)) ) (module R0603 (layer Bottom) (tedit 0) (tstamp 5D7C3376) (at 134.7851 101.7016 90) (descr "RESISTOR
\nchip") (fp_text reference R130 (at -0.889 0.889 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "33, 5%" (at -0.889 -2.032 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -0.8382 -0.4318) (xy -0.4318 -0.4318) (xy -0.4318 0.4318) (xy -0.8382 0.4318)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.4318 -0.4318) (xy 0.8382 -0.4318) (xy 0.8382 0.4318) (xy 0.4318 0.4318)) (layer B.Fab) (width 0)) (fp_line (start 0 0.508) (end 0 -0.508) (layer B.SilkS) (width 0.127)) (fp_line (start -1.473 -0.983) (end -1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 -0.983) (end -1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 0.983) (end 1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.473 0.983) (end 1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.432 0.356) (end -0.432 0.356) (layer B.Fab) (width 0.1524)) (fp_line (start -0.432 -0.356) (end 0.432 -0.356) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.85 0 90) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 267 ALT.WL.IRQ) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.85 0 90) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 234 WL_SDIO_D0.SIP) (solder_mask_margin 0.1016)) ) (module R0603 (layer Bottom) (tedit 0) (tstamp 5D7C3385) (at 138.8491 107.0356) (descr "RESISTOR
\nchip") (fp_text reference R131 (at -0.889 0.889) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "33, 5%" (at -0.889 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -0.8382 -0.4318) (xy -0.4318 -0.4318) (xy -0.4318 0.4318) (xy -0.8382 0.4318)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.4318 -0.4318) (xy 0.8382 -0.4318) (xy 0.8382 0.4318) (xy 0.4318 0.4318)) (layer B.Fab) (width 0)) (fp_line (start 0 0.508) (end 0 -0.508) (layer B.SilkS) (width 0.127)) (fp_line (start -1.473 -0.983) (end -1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 -0.983) (end -1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 0.983) (end 1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.473 0.983) (end 1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.432 0.356) (end -0.432 0.356) (layer B.Fab) (width 0.1524)) (fp_line (start -0.432 -0.356) (end 0.432 -0.356) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.85 0) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 48 LS_BUF_OE) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.85 0) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 263 ALT.BT.EN) (solder_mask_margin 0.1016)) ) (module R0603 (layer Bottom) (tedit 0) (tstamp 5D7C3394) (at 138.8491 113.1316 180) (descr "RESISTOR
\nchip") (fp_text reference R134 (at -0.889 0.889) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "33, 5%" (at -0.889 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -0.8382 -0.4318) (xy -0.4318 -0.4318) (xy -0.4318 0.4318) (xy -0.8382 0.4318)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.4318 -0.4318) (xy 0.8382 -0.4318) (xy 0.8382 0.4318) (xy 0.4318 0.4318)) (layer B.Fab) (width 0)) (fp_line (start 0 0.508) (end 0 -0.508) (layer B.SilkS) (width 0.127)) (fp_line (start -1.473 -0.983) (end -1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 -0.983) (end -1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 0.983) (end 1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.473 0.983) (end 1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.432 0.356) (end -0.432 0.356) (layer B.Fab) (width 0.1524)) (fp_line (start -0.432 -0.356) (end 0.432 -0.356) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.85 0 180) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 266 ALT.WL.EN) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.85 0 180) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 242 WL_IRQ.SIP) (solder_mask_margin 0.1016)) ) (module R0603 (layer Bottom) (tedit 0) (tstamp 5D7C33A3) (at 138.8491 109.0676 180) (descr "RESISTOR
\nchip") (fp_text reference R135 (at -0.889 0.889) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "33, 5%" (at -0.889 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -0.8382 -0.4318) (xy -0.4318 -0.4318) (xy -0.4318 0.4318) (xy -0.8382 0.4318)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.4318 -0.4318) (xy 0.8382 -0.4318) (xy 0.8382 0.4318) (xy 0.4318 0.4318)) (layer B.Fab) (width 0)) (fp_line (start 0 0.508) (end 0 -0.508) (layer B.SilkS) (width 0.127)) (fp_line (start -1.473 -0.983) (end -1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 -0.983) (end -1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 0.983) (end 1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.473 0.983) (end 1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.432 0.356) (end -0.432 0.356) (layer B.Fab) (width 0.1524)) (fp_line (start -0.432 -0.356) (end 0.432 -0.356) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.85 0 180) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 262 ALT.WL.CMD) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.85 0 180) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 241 BT_EN.SIP) (solder_mask_margin 0.1016)) ) (module R0603 (layer Bottom) (tedit 0) (tstamp 5D7C33B2) (at 138.8491 111.0996 180) (descr "RESISTOR
\nchip") (fp_text reference R136 (at -0.889 0.889) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "33, 5%" (at -0.889 -2.032) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_poly (pts (xy -0.1999 -0.4001) (xy 0.1999 -0.4001) (xy 0.1999 0.4001) (xy -0.1999 0.4001)) (layer B.Adhes) (width 0)) (fp_poly (pts (xy -0.8382 -0.4318) (xy -0.4318 -0.4318) (xy -0.4318 0.4318) (xy -0.8382 0.4318)) (layer B.Fab) (width 0)) (fp_poly (pts (xy 0.4318 -0.4318) (xy 0.8382 -0.4318) (xy 0.8382 0.4318) (xy 0.4318 0.4318)) (layer B.Fab) (width 0)) (fp_line (start 0 0.508) (end 0 -0.508) (layer B.SilkS) (width 0.127)) (fp_line (start -1.473 -0.983) (end -1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 -0.983) (end -1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 1.473 0.983) (end 1.473 -0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -1.473 0.983) (end 1.473 0.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.432 0.356) (end -0.432 0.356) (layer B.Fab) (width 0.1524)) (fp_line (start -0.432 -0.356) (end 0.432 -0.356) (layer B.Fab) (width 0.1524)) (pad 2 smd rect (at 0.85 0 180) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 265 ALT.WL.CLK) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.85 0 180) (size 1 1.1) (layers Bottom B.Paste B.Mask) (net 240 WL_EN.SIP) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C33C1) (at 129.4211 109.2586) (descr "RESISTOR
\nchip") (fp_text reference R140 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "33, 5%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 204 BT_HCI_RTS) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 257 N$70) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C33CF) (at 129.4211 108.2586) (descr "RESISTOR
\nchip") (fp_text reference R141 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "33, 5%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 205 BT_HCI_CTS) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 258 N$93) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C33DD) (at 129.4211 107.2586) (descr "RESISTOR
\nchip") (fp_text reference R142 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "33, 5%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 206 BT_HCI_TX) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 259 N$94) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C33EB) (at 129.4211 106.2586) (descr "RESISTOR
\nchip") (fp_text reference R143 (at -0.635 -0.762) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "33, 5%" (at -0.635 2.032) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 207 BT_HCI_RX) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 260 N$95) (solder_mask_margin 0.1016)) ) (module DIODE_SMA (layer Bottom) (tedit 0) (tstamp 5D7C33F9) (at 127.4191 86.4616) (fp_text reference D4 (at -2.667 1.778) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value STPS140A (at -2.667 -3.048) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_line (start -2.9718 -1.524) (end 0.9398 -1.524) (layer B.SilkS) (width 0.127)) (fp_line (start 3.0988 -1.524) (end 0.9398 -1.524) (layer B.SilkS) (width 0.127)) (fp_line (start 3.0988 1.524) (end 3.0988 -1.524) (layer B.SilkS) (width 0.127)) (fp_line (start 0.9398 1.524) (end 3.0988 1.524) (layer B.SilkS) (width 0.127)) (fp_line (start 0.9398 1.524) (end -2.9718 1.524) (layer B.SilkS) (width 0.127)) (fp_line (start -2.9718 1.524) (end -2.9718 -1.524) (layer B.SilkS) (width 0.127)) (fp_line (start 0.9398 -1.524) (end 0.9398 1.524) (layer B.SilkS) (width 0.127)) (pad K smd rect (at 2.032 0) (size 1.778 1.6764) (layers Bottom B.Paste B.Mask) (net 221 SELECT_5V) (solder_mask_margin 0.1016)) (pad A smd rect (at -1.905 0) (size 1.778 1.6764) (layers Bottom B.Paste B.Mask) (net 59 USB_DC) (solder_mask_margin 0.1016)) ) (module DIODE_SMA (layer Bottom) (tedit 0) (tstamp 5D7C3405) (at 134.2771 86.4616 180) (fp_text reference D2 (at -2.667 1.778) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom mirror)) ) (fp_text value "STPS140A DNP" (at -2.667 -3.048) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom mirror)) ) (fp_line (start -2.9718 -1.524) (end 0.9398 -1.524) (layer B.SilkS) (width 0.127)) (fp_line (start 3.0988 -1.524) (end 0.9398 -1.524) (layer B.SilkS) (width 0.127)) (fp_line (start 3.0988 1.524) (end 3.0988 -1.524) (layer B.SilkS) (width 0.127)) (fp_line (start 0.9398 1.524) (end 3.0988 1.524) (layer B.SilkS) (width 0.127)) (fp_line (start 0.9398 1.524) (end -2.9718 1.524) (layer B.SilkS) (width 0.127)) (fp_line (start -2.9718 1.524) (end -2.9718 -1.524) (layer B.SilkS) (width 0.127)) (fp_line (start 0.9398 -1.524) (end 0.9398 1.524) (layer B.SilkS) (width 0.127)) (pad K smd rect (at 2.032 0 180) (size 1.778 1.6764) (layers Bottom B.Paste B.Mask) (net 221 SELECT_5V) (solder_mask_margin 0.1016)) (pad A smd rect (at -1.905 0 180) (size 1.778 1.6764) (layers Bottom B.Paste B.Mask) (net 133 SYS_5V) (solder_mask_margin 0.1016)) ) (module DIODE_SMA (layer Bottom) (tedit 0) (tstamp 5D7C3411) (at 127.4191 90.3986) (fp_text reference D3 (at -2.667 1.778) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value STPS140A (at -2.667 -3.048) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_line (start -2.9718 -1.524) (end 0.9398 -1.524) (layer B.SilkS) (width 0.127)) (fp_line (start 3.0988 -1.524) (end 0.9398 -1.524) (layer B.SilkS) (width 0.127)) (fp_line (start 3.0988 1.524) (end 3.0988 -1.524) (layer B.SilkS) (width 0.127)) (fp_line (start 0.9398 1.524) (end 3.0988 1.524) (layer B.SilkS) (width 0.127)) (fp_line (start 0.9398 1.524) (end -2.9718 1.524) (layer B.SilkS) (width 0.127)) (fp_line (start -2.9718 1.524) (end -2.9718 -1.524) (layer B.SilkS) (width 0.127)) (fp_line (start 0.9398 -1.524) (end 0.9398 1.524) (layer B.SilkS) (width 0.127)) (pad K smd rect (at 2.032 0) (size 1.778 1.6764) (layers Bottom B.Paste B.Mask) (net 221 SELECT_5V) (solder_mask_margin 0.1016)) (pad A smd rect (at -1.905 0) (size 1.778 1.6764) (layers Bottom B.Paste B.Mask) (net 62 VDD_5V) (solder_mask_margin 0.1016)) ) (module B1,27 (layer Bottom) (tedit 0) (tstamp 5D7C341D) (at 130.8481 88.4936 180) (descr "TEST PAD") (fp_text reference TP23 (at -0.635 1.016) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value PTR1B1,27 (at -0.635 -0.762) (layer B.Fab) (effects (font (size 0.02413 0.02413) (thickness 0.00193)) (justify left bottom mirror)) ) (fp_text user >TP_SIGNAL_NAME (at -0.635 -1.905 180) (layer Dwgs.User) (effects (font (size 0.95 0.95) (thickness 0.08)) (justify right bottom)) ) (fp_line (start 0 0.635) (end 0 -0.635) (layer Dwgs.User) (width 0.0024)) (fp_line (start -0.635 0) (end 0.635 0) (layer Dwgs.User) (width 0.0024)) (pad TP smd roundrect (at 0 0 180) (size 1.27 1.27) (layers Bottom B.Mask) (roundrect_rratio 0.5) (net 221 SELECT_5V) (solder_mask_margin 0.1016)) ) (module CT3528 (layer Bottom) (tedit 0) (tstamp 5D7C3424) (at 118.6211 113.1086 270) (descr "TANTALUM CAPACITOR") (fp_text reference C11 (at -2.54 1.905 90) (layer B.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top mirror)) ) (fp_text value "47uF DNP" (at -2.54 -3.175 90) (layer B.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top mirror)) ) (fp_poly (pts (xy -0.3 -1) (xy 0.3 -1) (xy 0.3 1) (xy -0.3 1)) (layer B.Adhes) (width 0)) (fp_line (start -1 0.3) (end -1 -0.33) (layer B.Fab) (width 0.2032)) (fp_line (start -0.68 0) (end -1.31 0) (layer B.Fab) (width 0.2032)) (fp_line (start 1.637 -1.383) (end 1.637 1.383) (layer B.Fab) (width 0.2032)) (fp_line (start 1.778 1.016) (end 1.778 -1.016) (layer B.Fab) (width 0.1524)) (fp_line (start 1.637 -1.383) (end -1.637 -1.383) (layer B.Fab) (width 0.2032)) (fp_line (start 1.637 1.383) (end -1.637 1.383) (layer B.Fab) (width 0.2032)) (fp_line (start -1.778 1.016) (end -1.778 -1.016) (layer B.Fab) (width 0.1524)) (fp_line (start -1.637 -1.383) (end -1.637 1.383) (layer B.Fab) (width 0.2032)) (fp_line (start 2.973 1.983) (end 2.973 -1.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -2.973 -1.983) (end -2.973 1.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 2.973 -1.983) (end -2.973 -1.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -2.973 1.983) (end 2.973 1.983) (layer Dwgs.User) (width 0.0508)) (pad - smd rect (at 1.5 0 270) (size 2 2.2) (layers Bottom B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad + smd rect (at -1.5 0 270) (size 2 2.2) (layers Bottom B.Paste B.Mask) (net 272 3.3V-WIFI) (solder_mask_margin 0.1016)) ) (module CT3528 (layer Top) (tedit 0) (tstamp 5D7C3436) (at 131.3561 86.8426 270) (descr "TANTALUM CAPACITOR") (fp_text reference C23 (at -2.54 -1.905 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "47uF DNP" (at -2.54 3.175 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify right top)) ) (fp_poly (pts (xy -0.3 1) (xy 0.3 1) (xy 0.3 -1) (xy -0.3 -1)) (layer F.Adhes) (width 0)) (fp_line (start -1 -0.3) (end -1 0.33) (layer F.Fab) (width 0.2032)) (fp_line (start -0.68 0) (end -1.31 0) (layer F.Fab) (width 0.2032)) (fp_line (start 1.637 1.383) (end 1.637 -1.383) (layer F.Fab) (width 0.2032)) (fp_line (start 1.778 -1.016) (end 1.778 1.016) (layer F.Fab) (width 0.1524)) (fp_line (start 1.637 1.383) (end -1.637 1.383) (layer F.Fab) (width 0.2032)) (fp_line (start 1.637 -1.383) (end -1.637 -1.383) (layer F.Fab) (width 0.2032)) (fp_line (start -1.778 -1.016) (end -1.778 1.016) (layer F.Fab) (width 0.1524)) (fp_line (start -1.637 1.383) (end -1.637 -1.383) (layer F.Fab) (width 0.2032)) (fp_line (start 2.973 -1.983) (end 2.973 1.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -2.973 1.983) (end -2.973 -1.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start 2.973 1.983) (end -2.973 1.983) (layer Dwgs.User) (width 0.0508)) (fp_line (start -2.973 -1.983) (end 2.973 -1.983) (layer Dwgs.User) (width 0.0508)) (pad - smd rect (at 1.5 0 270) (size 2 2.2) (layers Top F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad + smd rect (at -1.5 0 270) (size 2 2.2) (layers Top F.Paste F.Mask) (net 271 ALT.WL.D3) (solder_mask_margin 0.1016)) ) (module R0402 (layer Top) (tedit 0) (tstamp 5D7C3448) (at 141.2621 114.1476 90) (descr "RESISTOR
\nchip") (fp_text reference R56 (at -0.635 -0.762 90) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify left bottom)) ) (fp_text value "DNP 1M, 1%" (at -0.635 2.032 90) (layer F.Fab) (effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom)) ) (fp_poly (pts (xy -0.1999 0.4001) (xy 0.1999 0.4001) (xy 0.1999 -0.4001) (xy -0.1999 -0.4001)) (layer F.Adhes) (width 0)) (fp_poly (pts (xy 0.2088 0.3048) (xy 0.5088 0.3048) (xy 0.5088 -0.2951) (xy 0.2088 -0.2951)) (layer F.Fab) (width 0)) (fp_poly (pts (xy -0.504 0.3048) (xy -0.204 0.3048) (xy -0.204 -0.2951) (xy -0.504 -0.2951)) (layer F.Fab) (width 0)) (fp_line (start -0.923 0.483) (end -0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 0.483) (end -0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.923 -0.483) (end 0.923 0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start -0.923 -0.483) (end 0.923 -0.483) (layer Dwgs.User) (width 0.0508)) (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer F.Fab) (width 0.1524)) (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer F.Fab) (width 0.1524)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 33 N$36) (solder_mask_margin 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.7) (layers Top F.Paste F.Mask) (net 34 N$37) (solder_mask_margin 0.1016)) ) (module PJ-102B_POWER_CON (layer Top) (tedit 0) (tstamp 5D7C3456) (at 111.2901 122.7836 180) (fp_text reference X12 (at 1.07 -5.1) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.115824)) (justify right top)) ) (fp_text value "" (at 0.58 5.98) (layer F.Fab) (effects (font (size 0.9652 0.9652) (thickness 0.115824)) (justify right top)) ) (fp_text user "Plated Slot" (at -3 -4.7 180) (layer F.SilkS) (effects (font (size 0.2413 0.2413) (thickness 0.02032))) ) (fp_text user "Plated Slot" (at 0 0 90) (layer F.SilkS) (effects (font (size 0.2413 0.2413) (thickness 0.02032))) ) (fp_text user "Plated Slot" (at -6 0 270) (layer F.SilkS) (effects (font (size 0.2413 0.2413) (thickness 0.02032))) ) (fp_line (start -6 4.7) (end -6 2.57) (layer F.SilkS) (width 0.127)) (fp_line (start 7.7 4.7) (end -6 4.7) (layer F.SilkS) (width 0.127)) (fp_line (start 7.7 -4.7) (end 7.7 4.7) (layer F.SilkS) (width 0.127)) (fp_line (start -0.42 -4.7) (end 7.7 -4.7) (layer F.SilkS) (width 0.127)) (fp_line (start -6 -4.7) (end -6 -2.57) (layer F.SilkS) (width 0.127)) (fp_line (start -5.57 -4.7) (end -6 -4.7) (layer F.SilkS) (width 0.127)) (fp_arc (start -1.984 -4.7) (end -1.984 -4.319) (angle -180) (layer Edge.Cuts) (width 0.05)) (fp_line (start -1.984 -4.319) (end -4.016 -4.319) (layer Edge.Cuts) (width 0.05)) (fp_line (start -4.016 -5.081) (end -1.984 -5.081) (layer Edge.Cuts) (width 0.05)) (fp_arc (start -4.016 -4.7) (end -4.016 -4.319) (angle 180) (layer Edge.Cuts) (width 0.05)) (fp_arc (start -6 1.27) (end -6.381 1.27) (angle -180) (layer Edge.Cuts) (width 0.05)) (fp_line (start -6.381 1.27) (end -6.381 -1.27) (layer Edge.Cuts) (width 0.05)) (fp_line (start -5.619 -1.27) (end -5.619 1.27) (layer Edge.Cuts) (width 0.05)) (fp_arc (start -6 -1.27) (end -6.381 -1.27) (angle 180) (layer Edge.Cuts) (width 0.05)) (fp_arc (start 0 1.016) (end -0.381 1.016) (angle -180) (layer Edge.Cuts) (width 0.05)) (fp_line (start -0.381 1.016) (end -0.381 -1.016) (layer Edge.Cuts) (width 0.05)) (fp_line (start 0.381 -1.016) (end 0.381 1.016) (layer Edge.Cuts) (width 0.05)) (fp_arc (start 0 -1.016) (end -0.381 -1.016) (angle 180) (layer Edge.Cuts) (width 0.05)) (fp_line (start -6 4.7) (end 7.7 4.7) (layer F.Fab) (width 0.127)) (fp_line (start 7.7 -4.7) (end -6 -4.7) (layer F.Fab) (width 0.127)) (fp_line (start 7.7 -4.7) (end 7.7 4.7) (layer F.Fab) (width 0.127)) (fp_line (start -6 -4.7) (end -6 4.7) (layer F.Fab) (width 0.127)) (pad OUT_CON thru_hole oval (at -3 -4.7) (size 4.216 2.108) (drill 1.6) (layers *.Cu *.Mask) (solder_mask_margin 0.1016)) (pad OUT thru_hole oval (at 0 0 270) (size 4.216 2.108) (drill 1.6) (layers *.Cu *.Mask) (net 1 GND) (solder_mask_margin 0.1016)) (pad IN thru_hole oval (at -6 0 270) (size 4.216 2.108) (drill 1.6) (layers *.Cu *.Mask) (net 62 VDD_5V) (solder_mask_margin 0.1016)) ) (gr_line (start 105.3211 125.9586) (end 105.3211 84.0486) (layer Edge.Cuts) (width 0.15) (tstamp 1CA7600)) (gr_arc (start 111.6711 84.0486) (end 105.3211 84.0486) (angle 90) (layer Edge.Cuts) (width 0.15) (tstamp 1CA64C0)) (gr_line (start 111.6711 77.6986) (end 178.9811 77.6986) (layer Edge.Cuts) (width 0.15) (tstamp 1CA58C0)) (gr_arc (start 178.9811 90.3986) (end 178.9811 77.6986) (angle 90) (layer Edge.Cuts) (width 0.15) (tstamp 1CA7A80)) (gr_line (start 191.6811 90.3986) (end 191.6811 119.6086) (layer Edge.Cuts) (width 0.15) (tstamp 1CA6880)) (gr_arc (start 178.9811 119.6086) (end 191.6811 119.6086) (angle 90) (layer Edge.Cuts) (width 0.15) (tstamp 1CA6400)) (gr_line (start 178.9811 132.3086) (end 111.6711 132.3086) (layer Edge.Cuts) (width 0.15) (tstamp 1CA7C00)) (gr_arc (start 111.6711 125.9586) (end 111.6711 132.3086) (angle 90) (layer Edge.Cuts) (width 0.15) (tstamp 1CA6AC0)) (gr_text "BeagleBone Black Wireless" (at 154.8257 98.933) (layer B.SilkS) (tstamp 1CA6640) (effects (font (size 1.2065 1.2065) (thickness 0.1905)) (justify right top mirror)) ) (gr_text A5 (at 143.0909 99.7712) (layer B.SilkS) (tstamp 5C6ADC0) (effects (font (size 0.9652 0.9652) (thickness 0.1524)) (justify left mirror)) ) (gr_text + (at 171.7563 118.1692 90) (layer F.SilkS) (tstamp 5C6AF40) (effects (font (size 0.77216 0.77216) (thickness 0.12192)) (justify right top)) ) (gr_text OSD3358 (at 171.5291 103.8846 90) (layer F.SilkS) (tstamp 5C6B0C0) (effects (font (size 0.77216 0.77216) (thickness 0.12192)) (justify left)) ) (gr_line (start 113.2586 85.6361) (end 112.6871 85.0646) (layer Cmts.User) (width 0.15) (tstamp 5C6B300)) (gr_line (start 113.2586 85.6361) (end 113.8301 85.0646) (layer Cmts.User) (width 0.15) (tstamp 5C6B3C0)) (gr_line (start 113.2586 85.6361) (end 113.8301 86.2076) (layer Cmts.User) (width 0.15) (tstamp 5C6B480)) (gr_line (start 113.2586 85.6361) (end 112.6871 86.2076) (layer Cmts.User) (width 0.15) (tstamp 5C6B540)) (gr_line (start 159.1691 91.6686) (end 157.0355 91.6686) (layer B.SilkS) (width 0.15) (tstamp 5C6B600)) (gr_line (start 157.0355 91.6686) (end 156.7307 91.3638) (layer B.SilkS) (width 0.15) (tstamp 5C6B6C0)) (gr_line (start 156.7307 91.3638) (end 156.7307 86.487) (layer B.SilkS) (width 0.15) (tstamp 5C6B780)) (gr_line (start 156.7307 86.487) (end 156.2227 85.979) (layer B.SilkS) (width 0.15) (tstamp 5C6B840)) (gr_line (start 156.2227 85.979) (end 149.2123 85.979) (layer B.SilkS) (width 0.15) (tstamp 5C6B900)) (gr_line (start 149.2123 85.979) (end 148.8059 85.5726) (layer B.SilkS) (width 0.15) (tstamp 5C6B9C0)) (gr_line (start 128.8161 78.8416) (end 128.8161 82.9056) (layer Cmts.User) (width 0.15) (tstamp 5C6BA80)) (gr_line (start 131.3561 78.8416) (end 131.3561 82.9056) (layer Cmts.User) (width 0.15) (tstamp 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