(kicad_pcb (version 20241229) (generator "pcbnew") (generator_version "9.0") (general (thickness 1.6) (legacy_teardrops no) ) (paper "A4") (layers (0 "F.Cu" signal) (4 "In1.Cu" signal) (6 "In2.Cu" signal) (2 "B.Cu" signal) (9 "F.Adhes" user "F.Adhesive") (11 "B.Adhes" user "B.Adhesive") (13 "F.Paste" user) (15 "B.Paste" user) (5 "F.SilkS" user "F.Silkscreen") (7 "B.SilkS" user "B.Silkscreen") (1 "F.Mask" user) (3 "B.Mask" user) (17 "Dwgs.User" user "User.Drawings") (19 "Cmts.User" user "User.Comments") (21 "Eco1.User" user "User.Eco1") (23 "Eco2.User" user "User.Eco2") (25 "Edge.Cuts" user) (27 "Margin" user) (31 "F.CrtYd" user "F.Courtyard") (29 "B.CrtYd" user "B.Courtyard") (35 "F.Fab" user) (33 "B.Fab" user) (39 "User.1" user) (41 "User.2" user) (43 "User.3" user) (45 "User.4" user) ) (setup (stackup (layer "F.SilkS" (type "Top Silk Screen") ) (layer "F.Paste" (type "Top Solder Paste") ) (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01) ) (layer "F.Cu" (type "copper") (thickness 0.035) ) (layer "dielectric 1" (type "prepreg") (thickness 0.1) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02) ) (layer "In1.Cu" (type "copper") (thickness 0.035) ) (layer "dielectric 2" (type "core") (thickness 1.24) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02) ) (layer "In2.Cu" (type "copper") (thickness 0.035) ) (layer "dielectric 3" (type "prepreg") (thickness 0.1) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02) ) (layer "B.Cu" (type "copper") (thickness 0.035) ) (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01) ) (layer "B.Paste" (type "Bottom Solder Paste") ) (layer "B.SilkS" (type "Bottom Silk Screen") ) (copper_finish "None") (dielectric_constraints no) ) (pad_to_mask_clearance 0) (allow_soldermask_bridges_in_footprints no) (tenting front back) (pcbplotparams (layerselection 0x00000000_00000000_55555555_5755f5ff) (plot_on_all_layers_selection 0x00000000_00000000_00000000_00000000) (disableapertmacros no) (usegerberextensions no) 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(remove_unused_layers no) (solder_mask_margin 0.0508) (thermal_bridge_angle 0) (uuid "4811a5b7-7cfe-4228-aa00-aafdf1b9c3ad") ) (pad "1" thru_hole circle (at 7.39 -10.263) (size 1.6764 1.6764) (drill 1) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (solder_mask_margin 0.0508) (thermal_bridge_angle 0) (uuid "7f30c139-5aff-40af-95cd-8cf429dd62fd") ) (pad "2" thru_hole circle (at -9.12 -13.692) (size 1.778 1.778) (drill 1) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (solder_mask_margin 0.0508) (thermal_bridge_angle 0) (uuid "f8b9e895-d0fc-4b76-8677-daa474cd097d") ) (pad "2" thru_hole circle (at -9.12 11.708) (size 1.778 1.778) (drill 1) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (solder_mask_margin 0.0508) (thermal_bridge_angle 0) (uuid "e0039b3c-5c6a-4446-8f4c-eeadd827dbfc") ) (pad "3" thru_hole circle (at -6.58 -13.692) (size 1.778 1.778) (drill 1) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (solder_mask_margin 0.0508) (thermal_bridge_angle 0) (uuid 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