(kicad_pcb (version 20211101) (generator pcbnew) (general (thickness 1.6)) (page A4) (layers (0 "F.Cu" signal)(31 "B.Cu" signal)(36 "B.SilkS" user)(37 "F.SilkS" user)(38 "B.Mask" user)(39 "F.Mask" user)(44 "Edge.Cuts" user)) (setup (pad_to_mask_clearance 0.05)) (net 0 "") (net 1 "GND") (net 2 "3V3") (net 3 "SPI_CS") (net 4 "SPI_SCK") (net 5 "SPI_MISO") (net 6 "SPI_MOSI") (net 7 "INT1") (net 8 "VBAT") (net 9 "RESET") (net 10 "BOOT") (net 11 "USB_DM") (net 12 "USB_DP") (footprint "RAK:RAK3112" (layer "F.Cu") (tedit 0) (tstamp "22222222-0000-0000-0000-000000000001") (at 150.0 100.0) (descr "RAK3112 WisDuo ESP32-S3+SX1262 stamp, 23x15mm, 1.20mm pitch, 4-sided castellated") (attr smd) (fp_text reference "U1" (at 0 -8.4) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)))) (fp_text value "RAK3112" (at 0 8.4) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15)))) (fp_line (start -11.5 -7.5) (end 11.5 -7.5) (layer "F.SilkS") (width 0.12)) (fp_line (start 11.5 -7.5) (end 11.5 7.5) (layer "F.SilkS") (width 0.12)) (fp_line (start 11.5 7.5) (end -11.5 7.5) (layer "F.SilkS") (width 0.12)) (fp_line (start -11.5 7.5) (end -11.5 -7.5) (layer "F.SilkS") (width 0.12)) (fp_text user "PIN1" (at 7.0 6.3) (layer "F.SilkS") (effects (font (size 0.6 0.6) (thickness 0.1)))) (pad "1" smd rect (at 8.0800 -7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "2" smd rect (at 6.8800 -7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 11 "USB_DM")) (pad "3" smd rect (at 5.6800 -7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 12 "USB_DP")) (pad "4" smd rect (at 4.4800 -7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "5" smd rect (at 3.2800 -7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "6" smd rect (at 2.0800 -7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "7" smd rect (at 0.8900 -7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "8" smd rect (at -0.3100 -7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "9" smd rect (at -1.5100 -7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "10" smd rect (at -2.7000 -7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "11" smd rect (at -3.9100 -7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "12" smd rect (at -5.1000 -7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "13" smd rect (at -6.3000 -7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "14" smd rect (at -11.5000 -5.4200) (size 1.4 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND")) (pad "15" smd rect (at -11.5000 -4.2200) (size 1.4 0.7) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "16" smd rect (at -11.5000 -1.8100) (size 1.4 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND")) (pad "17" smd rect (at -11.5000 -0.6200) (size 1.4 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (net 9 "RESET")) (pad "18" smd rect (at -11.5000 0.5900) (size 1.4 0.7) (layers "F.Cu" "F.Paste" "F.Mask")) (pad 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(size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "30" smd rect (at -0.4100 7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 5 "SPI_MISO")) (pad "31" smd rect (at 0.7900 7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 6 "SPI_MOSI")) (pad "32" smd rect (at 1.9700 7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "SPI_CS")) (pad "33" smd rect (at 3.1700 7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 4 "SPI_SCK")) (pad "34" smd rect (at 4.3700 7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 7 "INT1")) (pad "35" smd rect (at 5.5700 7.4400) (size 0.7 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND")) (pad "36" smd rect (at 11.5000 5.4500) (size 1.4 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND")) (pad "37" smd rect (at 11.5000 4.2400) (size 1.4 0.7) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "38" smd rect (at 11.5000 1.8400) (size 1.4 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND")) (pad "39" smd rect (at 11.5000 0.6500) (size 1.4 0.7) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "40" smd rect (at 11.5000 -0.5600) (size 1.4 0.7) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "41" smd rect (at 11.5000 -1.7200) (size 1.4 0.7) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "42" smd rect (at 11.5000 -2.9600) (size 1.4 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND")) (pad "43" smd rect (at 11.5000 -4.1400) (size 1.4 0.7) (layers "F.Cu" "F.Paste" "F.Mask")) (pad "44" smd rect (at 11.5000 -5.3600) (size 1.4 0.7) (layers "F.Cu" "F.Paste" "F.Mask")) ) (footprint "Package_TO_SOT_SMD:SOT-23-5" (layer "B.Cu") (tedit 0) (tstamp "55550000-0000-0000-0000-000000000001") (at 150.0 108.0) (descr "TPS7A02 LDO") (attr smd) (fp_text reference "U2" (at 0 -2.4) (layer "B.SilkS") (effects (font (size 0.7 0.7) (thickness 0.1)) (justify mirror))) (fp_text value "AP2112K-3.3" (at 0 2.4) (layer "B.Fab") (effects (font (size 0.7 0.7) (thickness 0.1)) (justify mirror))) (pad "1" smd rect (at -0.95 -1.3) (size 0.55 0.8) (layers "B.Cu" "B.Paste" "B.Mask") (net 8 "VBAT")) (pad "2" smd rect (at 0.0 -1.3) (size 0.55 0.8) (layers "B.Cu" "B.Paste" "B.Mask") (net 1 "GND")) (pad "3" smd rect (at 0.95 -1.3) (size 0.55 0.8) (layers "B.Cu" "B.Paste" "B.Mask") (net 8 "VBAT")) (pad "4" smd rect (at 0.95 1.3) (size 0.55 0.8) (layers "B.Cu" "B.Paste" "B.Mask")) (pad "5" smd rect (at -0.95 1.3) (size 0.55 0.8) (layers "B.Cu" "B.Paste" "B.Mask") (net 2 "3V3")) ) (footprint "Capacitor_SMD:C_0603_1608Metric" (layer "B.Cu") (tedit 0) (tstamp "33330000-0000-0000-0000-511304324994") (at 146.0 108.0 0) (descr "LDO input cap") (attr smd) (fp_text reference "C5" (at 0 -1.5 0) (layer "B.SilkS") (effects (font (size 0.7 0.7) (thickness 0.1)) (justify mirror))) (fp_text value "1uF" (at 0 1.5 0) (layer "B.Fab") (effects (font (size 0.7 0.7) (thickness 0.1)) (justify mirror))) (pad "1" smd rect (at -0.8500 0 0) (size 0.95 1.0) (layers "B.Cu" "B.Paste" "B.Mask") (net 8 "VBAT")) (pad "2" smd rect (at 0.8500 0 0) (size 0.95 1.0) (layers "B.Cu" "B.Paste" "B.Mask") (net 1 "GND")) ) (footprint "Capacitor_SMD:C_0603_1608Metric" (layer "B.Cu") (tedit 0) (tstamp "33330000-0000-0000-0000-008210481668") (at 154.0 108.0 0) (descr "LDO output cap") (attr smd) (fp_text reference "C6" (at 0 -1.5 0) (layer "B.SilkS") (effects (font (size 0.7 0.7) (thickness 0.1)) (justify mirror))) (fp_text value "1uF" (at 0 1.5 0) (layer "B.Fab") (effects (font (size 0.7 0.7) (thickness 0.1)) (justify mirror))) (pad "1" smd rect (at -0.8500 0 0) (size 0.95 1.0) (layers "B.Cu" "B.Paste" "B.Mask") (net 2 "3V3")) (pad "2" smd rect (at 0.8500 0 0) (size 0.95 1.0) (layers "B.Cu" "B.Paste" "B.Mask") (net 1 "GND")) ) (footprint "Connector_PinHeader_2.54mm:PinHeader_1x01_P2.54mm_Vertical" (layer "B.Cu") (tedit 0) (tstamp "44440000-0000-0000-0000-156644211517") (at 147.0 111.0) (descr "VBAT pad") (attr smd) (fp_text reference "BATT+" (at 0 -1.6) (layer "B.SilkS") (effects (font (size 0.6 0.6) (thickness 0.1)) (justify mirror))) (fp_text value "VBAT" (at 0 1.6) (layer "B.SilkS") (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))) (pad "1" smd rect (at 0 0) (size 1.5 1.8) (layers "B.Cu" "B.Paste" "B.Mask") (net 8 "VBAT")) ) (footprint "Connector_PinHeader_2.54mm:PinHeader_1x01_P2.54mm_Vertical" (layer "B.Cu") (tedit 0) (tstamp "44440000-0000-0000-0000-290817113389") (at 153.0 111.0) (descr "GND pad") (attr smd) (fp_text reference "BATT-" (at 0 -1.6) (layer "B.SilkS") (effects (font (size 0.6 0.6) (thickness 0.1)) (justify mirror))) (fp_text value "GND" (at 0 1.6) (layer "B.SilkS") (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))) (pad "1" smd rect (at 0 0) (size 1.5 1.8) (layers "B.Cu" "B.Paste" "B.Mask") (net 1 "GND")) ) (footprint "Capacitor_SMD:C_0805_2012Metric" (layer "B.Cu") (tedit 0) (tstamp "33330000-0000-0000-0000-512331317046") (at 143.0 95.5 0) (descr "RAK 3V3 bulk") (attr smd) (fp_text reference "C8" (at 0 -1.5 0) (layer "B.SilkS") (effects (font (size 0.7 0.7) (thickness 0.1)) (justify mirror))) (fp_text value "10uF" (at 0 1.5 0) (layer "B.Fab") (effects (font (size 0.7 0.7) (thickness 0.1)) (justify mirror))) (pad "1" smd rect (at -0.9500 0 0) (size 1.0 1.3) (layers "B.Cu" "B.Paste" "B.Mask") (net 2 "3V3")) (pad "2" smd rect (at 0.9500 0 0) (size 1.0 1.3) (layers "B.Cu" "B.Paste" "B.Mask") (net 1 "GND")) ) (footprint "Capacitor_SMD:C_0603_1608Metric" (layer "B.Cu") (tedit 0) (tstamp "33330000-0000-0000-0000-815298074046") (at 143.0 99.0 0) (descr "RAK 3V3 HF") (attr smd) (fp_text reference "C9" (at 0 -1.5 0) (layer "B.SilkS") (effects (font (size 0.7 0.7) (thickness 0.1)) (justify mirror))) (fp_text value "100nF" (at 0 1.5 0) (layer "B.Fab") (effects (font (size 0.7 0.7) (thickness 0.1)) (justify mirror))) (pad "1" smd rect (at -0.8500 0 0) (size 0.95 1.0) (layers "B.Cu" "B.Paste" "B.Mask") (net 2 "3V3")) (pad "2" smd rect (at 0.8500 0 0) (size 0.95 1.0) (layers "B.Cu" "B.Paste" "B.Mask") (net 1 "GND")) ) (footprint "Resistor_SMD:R_0603_1608Metric" (layer 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reference "TP6" (at 0 -1.6) (layer "B.SilkS") (effects (font (size 0.6 0.6) (thickness 0.1)) (justify mirror))) (fp_text value "RST" (at 0 1.6) (layer "B.SilkS") (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))) (pad "1" smd rect (at 0 0) (size 1.0 1.6) (layers "B.Cu" "B.Paste" "B.Mask") (net 9 "RESET")) ) (footprint "Connector_PinHeader_2.00mm:PinHeader_1x01_P2.00mm_Vertical" (layer "B.Cu") (tedit 0) (tstamp "44440000-0000-0000-0000-675776434990") (at 144.3 91.0) (descr "GND pad") (attr smd) (fp_text reference "PAD1" (at 0 -1.6) (layer "B.SilkS") (effects (font (size 0.6 0.6) (thickness 0.1)) (justify mirror))) (fp_text value "GND" (at 0 1.6) (layer "B.SilkS") (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))) (pad "1" smd rect (at 0 0) (size 1.2 1.6) (layers "B.Cu" "B.Paste" "B.Mask") (net 1 "GND")) ) (footprint "Connector_PinHeader_2.00mm:PinHeader_1x01_P2.00mm_Vertical" (layer "B.Cu") (tedit 0) (tstamp "44440000-0000-0000-0000-121722203315") (at 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0) (tstamp "44440000-0000-0000-0000-988257067743") (at 150.0 91.0) (descr "SPI_SCK pad") (attr smd) (fp_text reference "PAD4" (at 0 -1.6) (layer "B.SilkS") (effects (font (size 0.6 0.6) (thickness 0.1)) (justify mirror))) (fp_text value "SPI_SCK" (at 0 1.6) (layer "B.SilkS") (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))) (pad "1" smd rect (at 0 0) (size 1.2 1.6) (layers "B.Cu" "B.Paste" "B.Mask") (net 4 "SPI_SCK")) ) (footprint "Connector_PinHeader_2.00mm:PinHeader_1x01_P2.00mm_Vertical" (layer "B.Cu") (tedit 0) (tstamp "44440000-0000-0000-0000-715157129875") (at 151.9 91.0) (descr "SPI_MISO pad") (attr smd) (fp_text reference "PAD5" (at 0 -1.6) (layer "B.SilkS") (effects (font (size 0.6 0.6) (thickness 0.1)) (justify mirror))) (fp_text value "SPI_MISO" (at 0 1.6) (layer "B.SilkS") (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))) (pad "1" smd rect (at 0 0) (size 1.2 1.6) (layers "B.Cu" "B.Paste" "B.Mask") (net 5 "SPI_MISO")) ) (footprint "Connector_PinHeader_2.00mm:PinHeader_1x01_P2.00mm_Vertical" (layer "B.Cu") (tedit 0) (tstamp "44440000-0000-0000-0000-197138043008") (at 153.8 91.0) (descr "SPI_MOSI pad") (attr smd) (fp_text reference "PAD6" (at 0 -1.6) (layer "B.SilkS") (effects (font (size 0.6 0.6) (thickness 0.1)) (justify mirror))) (fp_text value "SPI_MOSI" (at 0 1.6) (layer "B.SilkS") (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))) (pad "1" smd rect (at 0 0) (size 1.2 1.6) (layers "B.Cu" "B.Paste" "B.Mask") (net 6 "SPI_MOSI")) ) (footprint "Connector_PinHeader_2.00mm:PinHeader_1x01_P2.00mm_Vertical" (layer "B.Cu") (tedit 0) (tstamp "44440000-0000-0000-0000-095122406653") (at 155.7 91.0) (descr "INT1 pad") (attr smd) (fp_text reference "PAD7" (at 0 -1.6) (layer "B.SilkS") (effects (font (size 0.6 0.6) (thickness 0.1)) (justify mirror))) (fp_text value "INT1" (at 0 1.6) (layer "B.SilkS") (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))) (pad "1" smd rect (at 0 0) (size 1.2 1.6) (layers "B.Cu" "B.Paste" "B.Mask") (net 7 "INT1")) ) (gr_circle (center 150.0 100.0) (end 164.0 100.0) (layer "Edge.Cuts") (width 0.1)) )