(kicad_pcb (version 20211101) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (page A4)
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (44 "Edge.Cuts" user)
  )
  (setup
    (stackup
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "F.SilkS" (type "user"))
      (layer "F.Mask" (type "user"))
      (layer "B.Mask" (type "user"))
      (layer "B.SilkS" (type "user"))
      (layer "B.Cu" (type "copper") (thickness 0.035))
    )
    (pad_to_mask_clearance 0.05)
  )
  (net 0 "")
  (net 1 "GND")
  (net 2 "3.3V")
  (net 3 "SPI_CS")
  (net 4 "SPI_SCK")
  (net 5 "SPI_MISO")
  (net 6 "SPI_MOSI")
  (net 7 "INT1")

  (footprint "Package_LGA:LGA-14_3x2.5mm_P0.5mm" (layer "B.Cu")
    (tedit 0) (tstamp "2765755f-3acb-46e5-8246-ce4a445402de")
    (at 150 100 180)
    (descr "14-lead LGA 3x2.5mm, pitch 0.5mm (MIRRORED for B.Cu placement - V5 fix)")
    (attr smd)
    (fp_text reference "U1" (at 0 2.2 180) (layer "B.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.12)) (justify mirror))
    )
    (fp_text value "IIS3DWB" (at 0 -2.2 180) (layer "B.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.12)) (justify mirror))
    )
    (pad "1" smd rect (at 1.2625 -0.7500) (size 0.475 0.250) (layers "B.Cu" "B.Paste" "B.Mask") (net 5))
    (pad "2" smd rect (at 1.2625 -0.2500) (size 0.475 0.250) (layers "B.Cu" "B.Paste" "B.Mask") (net 1))
    (pad "3" smd rect (at 1.2625 0.2500) (size 0.475 0.250) (layers "B.Cu" "B.Paste" "B.Mask") (net 1))
    (pad "4" smd rect (at 1.2625 0.7500) (size 0.475 0.250) (layers "B.Cu" "B.Paste" "B.Mask") (net 7))
    (pad "5" smd rect (at 0.5000 1.0125) (size 0.250 0.475) (layers "B.Cu" "B.Paste" "B.Mask") (net 2))
    (pad "6" smd rect (at 0.0000 1.0125) (size 0.250 0.475) (layers "B.Cu" "B.Paste" "B.Mask") (net 1))
    (pad "7" smd rect (at -0.5000 1.0125) (size 0.250 0.475) (layers "B.Cu" "B.Paste" "B.Mask") (net 1))
    (pad "8" smd rect (at -1.2625 0.7500) (size 0.475 0.250) (layers "B.Cu" "B.Paste" "B.Mask") (net 2))
    (pad "9" smd rect (at -1.2625 0.2500) (size 0.475 0.250) (layers "B.Cu" "B.Paste" "B.Mask") (net 0))
    (pad "10" smd rect (at -1.2625 -0.2500) (size 0.475 0.250) (layers "B.Cu" "B.Paste" "B.Mask") (net 0))
    (pad "11" smd rect (at -1.2625 -0.7500) (size 0.475 0.250) (layers "B.Cu" "B.Paste" "B.Mask") (net 0))
    (pad "12" smd rect (at -0.5000 -1.0125) (size 0.250 0.475) (layers "B.Cu" "B.Paste" "B.Mask") (net 3))
    (pad "13" smd rect (at 0.0000 -1.0125) (size 0.250 0.475) (layers "B.Cu" "B.Paste" "B.Mask") (net 4))
    (pad "14" smd rect (at 0.5000 -1.0125) (size 0.250 0.475) (layers "B.Cu" "B.Paste" "B.Mask") (net 6))
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric" (layer "F.Cu")
     (tedit 0) (tstamp "17799d94-557f-4729-9b2d-0fdd40561cda")
     (at 145.2 99.0 0)
     (descr "Capacitor SMD 0603 (1608 Metric)")
     (attr smd)
     (fp_text reference "C1" (at 0 -1.43 0) (layer "F.SilkS")
       (effects (font (size 0.8 0.8) (thickness 0.12)))
     )
     (fp_text value "100nF" (at 0 1.43 0) (layer "F.Fab")
       (effects (font (size 0.8 0.8) (thickness 0.12)))
     )
     (pad "1" smd rect (at -0.85 0) (size 0.95 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net 2))
     (pad "2" smd rect (at 0.85 0) (size 0.95 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net 1))
   )
  (footprint "Capacitor_SMD:C_0603_1608Metric" (layer "F.Cu")
     (tedit 0) (tstamp "add4ea33-8161-4572-9d13-53f5d5c967ca")
     (at 145.2 101.0 0)
     (descr "Capacitor SMD 0603 (1608 Metric)")
     (attr smd)
     (fp_text reference "C2" (at 0 -1.43 0) (layer "F.SilkS")
       (effects (font (size 0.8 0.8) (thickness 0.12)))
     )
     (fp_text value "1uF" (at 0 1.43 0) (layer "F.Fab")
       (effects (font (size 0.8 0.8) (thickness 0.12)))
     )
     (pad "1" smd rect (at -0.85 0) (size 0.95 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net 2))
     (pad "2" smd rect (at 0.85 0) (size 0.95 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net 1))
   )
  (footprint "Capacitor_SMD:C_0603_1608Metric" (layer "F.Cu")
     (tedit 0) (tstamp "58ae2b89-b6e8-433a-87a9-ee849cae045d")
     (at 156.0 100.0 0)
     (descr "Capacitor SMD 0603 (1608 Metric)")
     (attr smd)
     (fp_text reference "C3" (at 0 -1.43 0) (layer "F.SilkS")
       (effects (font (size 0.8 0.8) (thickness 0.12)))
     )
     (fp_text value "100nF" (at 0 1.43 0) (layer "F.Fab")
       (effects (font (size 0.8 0.8) (thickness 0.12)))
     )
     (pad "1" smd rect (at -0.85 0) (size 0.95 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net 1))
     (pad "2" smd rect (at 0.85 0) (size 0.95 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net 2))
   )

  (footprint "Connector_PinHeader_2.00mm:PinHeader_1x01_P2.00mm_Vertical" (layer "F.Cu")
     (tedit 0) (tstamp "f3ced170-22cf-4bc2-8841-919f2284a126")
     (at 144.0 91.0)
     (descr "SMD Pad GND")
     (attr smd)
     (fp_text reference "PAD1" (at 0 -1.8) (layer "F.SilkS")
       (effects (font (size 0.6 0.6) (thickness 0.1)))
     )
     (fp_text value "GND" (at 0 1.8) (layer "F.SilkS")
       (effects (font (size 0.5 0.5) (thickness 0.08)))
     )
     (pad "1" smd rect (at 0 0) (size 1.2 2.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 1))
   )
  (footprint "Connector_PinHeader_2.00mm:PinHeader_1x01_P2.00mm_Vertical" (layer "F.Cu")
     (tedit 0) (tstamp "aa6612df-2494-4cdd-91f5-e8dae258b4e8")
     (at 146.0 91.0)
     (descr "SMD Pad 3.3V")
     (attr smd)
     (fp_text reference "PAD2" (at 0 -1.8) (layer "F.SilkS")
       (effects (font (size 0.6 0.6) (thickness 0.1)))
     )
     (fp_text value "3.3V" (at 0 1.8) (layer "F.SilkS")
       (effects (font (size 0.5 0.5) (thickness 0.08)))
     )
     (pad "2" smd rect (at 0 0) (size 1.2 2.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 2))
   )
  (footprint "Connector_PinHeader_2.00mm:PinHeader_1x01_P2.00mm_Vertical" (layer "F.Cu")
     (tedit 0) (tstamp "b1435c64-4278-4c9b-9f91-d32eb8232e75")
     (at 148.0 91.0)
     (descr "SMD Pad SPI_CS")
     (attr smd)
     (fp_text reference "PAD3" (at 0 -1.8) (layer "F.SilkS")
       (effects (font (size 0.6 0.6) (thickness 0.1)))
     )
     (fp_text value "SPI_CS" (at 0 1.8) (layer "F.SilkS")
       (effects (font (size 0.5 0.5) (thickness 0.08)))
     )
     (pad "3" smd rect (at 0 0) (size 1.2 2.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 3))
   )
  (footprint "Connector_PinHeader_2.00mm:PinHeader_1x01_P2.00mm_Vertical" (layer "F.Cu")
     (tedit 0) (tstamp "9ffe43d8-f503-4c0a-b76e-a5da3a60226e")
     (at 150.0 91.0)
     (descr "SMD Pad SPI_SCK")
     (attr smd)
     (fp_text reference "PAD4" (at 0 -1.8) (layer "F.SilkS")
       (effects (font (size 0.6 0.6) (thickness 0.1)))
     )
     (fp_text value "SPI_SCK" (at 0 1.8) (layer "F.SilkS")
       (effects (font (size 0.5 0.5) (thickness 0.08)))
     )
     (pad "4" smd rect (at 0 0) (size 1.2 2.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 4))
   )
  (footprint "Connector_PinHeader_2.00mm:PinHeader_1x01_P2.00mm_Vertical" (layer "F.Cu")
     (tedit 0) (tstamp "7f0068fe-0d15-4f9d-9e00-328c82842620")
     (at 152.0 91.0)
     (descr "SMD Pad SPI_MISO")
     (attr smd)
     (fp_text reference "PAD5" (at 0 -1.8) (layer "F.SilkS")
       (effects (font (size 0.6 0.6) (thickness 0.1)))
     )
     (fp_text value "SPI_MISO" (at 0 1.8) (layer "F.SilkS")
       (effects (font (size 0.5 0.5) (thickness 0.08)))
     )
     (pad "5" smd rect (at 0 0) (size 1.2 2.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 5))
   )
  (footprint "Connector_PinHeader_2.00mm:PinHeader_1x01_P2.00mm_Vertical" (layer "F.Cu")
     (tedit 0) (tstamp "dd958a63-4177-496f-af0d-99d0aa43f385")
     (at 154.0 91.0)
     (descr "SMD Pad SPI_MOSI")
     (attr smd)
     (fp_text reference "PAD6" (at 0 -1.8) (layer "F.SilkS")
       (effects (font (size 0.6 0.6) (thickness 0.1)))
     )
     (fp_text value "SPI_MOSI" (at 0 1.8) (layer "F.SilkS")
       (effects (font (size 0.5 0.5) (thickness 0.08)))
     )
     (pad "6" smd rect (at 0 0) (size 1.2 2.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 6))
   )
  (footprint "Connector_PinHeader_2.00mm:PinHeader_1x01_P2.00mm_Vertical" (layer "F.Cu")
     (tedit 0) (tstamp "5c63597e-7a0a-4376-a9dd-ea935d397533")
     (at 156.0 91.0)
     (descr "SMD Pad INT1")
     (attr smd)
     (fp_text reference "PAD7" (at 0 -1.8) (layer "F.SilkS")
       (effects (font (size 0.6 0.6) (thickness 0.1)))
     )
     (fp_text value "INT1" (at 0 1.8) (layer "F.SilkS")
       (effects (font (size 0.5 0.5) (thickness 0.08)))
     )
     (pad "7" smd rect (at 0 0) (size 1.2 2.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 7))
   )

  (footprint "Resistor_SMD:R_0603_1608Metric" (layer "F.Cu")
    (tedit 0) (tstamp "11111111-aaaa-bbbb-cccc-000000000001")
    (at 147.0 94.0 0)
    (descr "R1 10k CS pull-up")
    (attr smd)
    (fp_text reference "R1" (at 0 -1.43 0) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.12)))
    )
    (fp_text value "10k" (at 0 1.43 0) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.12)))
    )
    (pad "1" smd rect (at -0.85 0) (size 0.95 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net 2))
    (pad "2" smd rect (at 0.85 0) (size 0.95 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net 3))
  )

  (segment (start 148.0 91.0) (end 148.0 92.0) (width 0.2) (layer "F.Cu") (net 3) (tstamp "85b94d80-2e34-4517-a13c-638ed39107d2"))
  (segment (start 148.0 92.0) (end 149.0 93.0) (width 0.2) (layer "F.Cu") (net 3) (tstamp "11f42063-7f89-438e-9cbe-480fcc95fb34"))
  (segment (start 149.0 93.0) (end 149.0 99.5) (width 0.2) (layer "F.Cu") (net 3) (tstamp "7312e76b-cebc-43db-a9f0-14da011e367e"))
  (segment (start 150.0 91.0) (end 150.0 102.2) (width 0.2) (layer "F.Cu") (net 4) (tstamp "838f6fda-4770-4e85-b1df-668b35c8b958"))
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