aid: amkor-technology
url: https://raw.githubusercontent.com/api-evangelist/amkor-technology/refs/heads/main/apis.yml
name: Amkor Technology
description: >-
  Amkor Technology is the world's largest US-based provider of outsourced semiconductor
  packaging and test services (OSAT), serving integrated device manufacturers, fabless
  semiconductor companies, and contract foundries. The company offers advanced packaging
  technologies including flip chip, wafer-level packaging, 2.5D/3D TSV, System-in-Package,
  and chiplet integration solutions for AI, automotive, communications, computing, consumer
  electronics, industrial, IoT, and networking markets.
image: https://kinlane-productions2.s3.amazonaws.com/apis-json/apis-json-logo.jpg
tags:
  - Semiconductor Packaging
  - OSAT
  - Test Services
  - Advanced Packaging
  - Chiplets
  - Automotive
  - Artificial Intelligence
  - Electronics Manufacturing
created: '2024-01-01'
modified: '2026-04-19'
specificationVersion: '0.18'
apis:
  - aid: amkor-technology:website
    name: Amkor Technology Website
    tags:
      - Semiconductor Packaging
      - OSAT
      - Test Services
    image: https://kinlane-productions2.s3.amazonaws.com/apis-json/apis-json-logo.jpg
    baseURL: https://www.amkor.com
    humanURL: https://www.amkor.com
    properties:
      - type: Website
        url: https://www.amkor.com
    description: >-
      Amkor Technology provides outsourced semiconductor packaging and test services
      for chip manufacturers worldwide. The company does not currently publish a public
      developer API.
common:
  - type: Portal
    url: https://www.amkor.com
  - type: PrivacyPolicy
    url: https://www.amkor.com/privacy-policy
  - type: TermsOfService
    url: https://www.amkor.com/terms-of-use
  - type: Support
    url: https://www.amkor.com/contact
  - type: LinkedIn
    url: https://www.linkedin.com/company/amkor-technology
  - type: X
    url: https://twitter.com/AmkorTech
  - type: Features
    data:
      - name: Laminate Packaging
        description: Advanced laminate packages including CABGA, FBGA, fcCSP, FlipStack CSP, and interposer solutions for high-performance semiconductor devices.
      - name: Leadframe Packaging
        description: Leadframe-based packages including LQFP, TQFP, SOIC, SSOP, and fcMLF for cost-optimized semiconductor packaging.
      - name: Wafer-Level Packaging
        description: WLCSP and WL3D wafer-level packaging for compact, high-performance semiconductor packages with minimal form factor.
      - name: Advanced 2.5D and 3D Packaging
        description: Through-silicon via (TSV) technology for 2.5D and 3D stacked die configurations enabling high-bandwidth interconnects for AI and HPC applications.
      - name: System-in-Package
        description: SiP integration combining multiple chips, passives, and sensors into a single package for IoT, wearables, and complex electronic systems.
      - name: Chiplet Integration
        description: Proprietary S-Connect and S-SWIFT technologies for advanced chiplet integration enabling heterogeneous integration of multiple die from different foundries.
      - name: Power Discrete Packaging
        description: Power semiconductor packages including D2PAK, DPAK, PowerCSP, and PQFN for power management and motor control applications.
      - name: Memory and Sensor Packaging
        description: Specialized packaging for MEMS, image sensors, memory modules, and other sensor devices requiring precision assembly.
      - name: Semiconductor Testing
        description: Comprehensive semiconductor test services including wafer test, final test, and burn-in for quality assurance and yield optimization.
  - type: UseCases
    data:
      - name: AI and High-Performance Computing
        description: Advanced 2.5D/3D packaging and chiplet integration for AI accelerators, data center GPUs, and high-performance computing applications.
      - name: Automotive Electronics
        description: Automotive-grade semiconductor packaging for ADAS, electrification, infotainment, and powertrain control modules meeting AEC-Q100 standards.
      - name: 5G Communications
        description: RF and mmWave packaging solutions for 5G base stations, smartphones, and infrastructure equipment requiring high-frequency performance.
      - name: Consumer Electronics
        description: Cost-optimized packaging for smartphones, tablets, wearables, and consumer devices with compact form factors and high integration.
      - name: Industrial and IoT
        description: Robust semiconductor packages for industrial automation, sensors, and IoT devices requiring wide operating temperature ranges.
      - name: Memory Packaging
        description: DRAM, NAND flash, and memory module packaging for storage and memory applications in enterprise and consumer markets.
  - type: Integrations
    data:
      - name: Foundry Partners
        description: Collaboration with leading semiconductor foundries including TSMC, Samsung, and GlobalFoundries for seamless wafer-to-package supply chain integration.
      - name: EDA Tool Providers
        description: Integration with electronic design automation tools for package design, thermal simulation, and signal integrity analysis.
maintainers:
  - FN: API Evangelist
    email: info@apievangelist.com