name: High Tech Domain Vocabulary provider: High Tech providerId: high-tech description: >- Vocabulary for the high-tech electronic component supply chain — covers component data, distribution, ECAD design assets, manufacturer lifecycle status, environmental compliance, and hardware bill-of-materials workflows. sources: - Octopart / Nexar Supply (https://nexar.com/api) - Digi-Key Product Information V4 (https://developer.digikey.com/products) - Mouser Search API (https://www.mouser.com/api-search/) - Arrow Pricing & Availability (https://developers.arrow.com/api/) - SnapEDA (https://www.snapeda.com/) - Ultra Librarian (https://www.ultralibrarian.com/) - JEDEC component lifecycle terminology - EU RoHS / REACH directives terms: # Identity / Provenance - term: MPN aliases: [Manufacturer Part Number] description: >- The canonical identifier assigned by the manufacturer to a specific component. The primary key for cross-distributor lookup. - term: Manufacturer description: The legal entity that manufactures the component. - term: Distributor aliases: [Seller] description: A reseller offering the component (Digi-Key, Mouser, Arrow, Avnet, Newark, etc.). - term: Authorized Distributor description: A distributor with a formal franchise from the manufacturer; pricing and lifecycle data are authoritative. - term: Distributor SKU aliases: [Distributor Part Number] description: The catalog identifier a distributor assigns to its listing of an MPN (DKPN, Mouser P/N, Arrow P/N, etc.). - term: GTIN description: Global Trade Item Number, occasionally provided for packaged components. # Documents - term: Datasheet description: Manufacturer technical document defining electrical characteristics, pinouts, and operating conditions. - term: Application Note aliases: [App Note] description: Manufacturer-published document showing how to apply a part in a specific design. - term: Reference Design description: A full schematic / BoM / layout example provided by the manufacturer for a representative use case. - term: Errata description: Document listing known defects or limitations of a released part. - term: PCN aliases: [Product Change Notification] description: Formal notice from a manufacturer announcing a change to a product (process, package, lifecycle). # Categories / Functions - term: Integrated Circuit aliases: [IC] description: Monolithic semiconductor device combining many transistors on a single die. - term: Microcontroller aliases: [MCU] description: Integrated circuit containing a processor, memory, and peripherals on one chip. - term: Microprocessor aliases: [MPU] description: Integrated circuit containing a processor without on-chip program memory or peripherals. - term: SoC aliases: [System on Chip] description: A chip integrating CPU, memory, I/O, and often graphics or radio on a single die. - term: FPGA description: Field-Programmable Gate Array — reconfigurable logic device. - term: Passive description: Resistors, capacitors, inductors — components that do not introduce gain. - term: Connector description: Mechanical / electrical interconnect component. - term: Sensor description: Component that converts a physical quantity (temperature, pressure, motion, light) to an electrical signal. # Packaging - term: Package description: The physical housing of a component (e.g. LQFP, BGA, SOT-23, 0402). - term: SMD aliases: [Surface Mount Device, SMT] description: Component mounted directly on the surface of a PCB. - term: Through-Hole aliases: [THT] description: Component with leads inserted through PCB holes and soldered on the opposite side. - term: Pin Count description: Number of electrically functional pins on the package. - term: Cut Tape description: Strip of tape-and-reel components in arbitrary quantities, typically sold by distributors. - term: Reel description: Full reel of tape-and-reel components in the manufacturer's standard quantity. - term: Tray description: Anti-static tray packaging for medium-pin-count ICs. - term: Tube description: Anti-static tube packaging for DIP / SOIC parts. # Pricing / Availability - term: Stock aliases: [Inventory, Quantity Available] description: Number of units a distributor currently has in stock for an offer. - term: MOQ aliases: [Minimum Order Quantity] description: Smallest quantity a distributor will sell on a single order line. - term: Multiple Order Quantity aliases: [Order Multiple, Spq] description: Increment in which the part must be ordered above MOQ. - term: Price Break description: Quantity tier at which the unit price changes. - term: Lead Time description: Quoted time from order placement to shipment for non-stock orders. - term: Quote description: Bound, time-limited price for a specific quantity at a specific distributor. # Lifecycle (JEDEC-aligned) - term: Preview description: Part announced but not yet in production. - term: Active aliases: [Production] description: Part in full production and recommended for new designs. - term: NRND aliases: [Not Recommended for New Design] description: Part still in production but discouraged for new designs. - term: Last-Time-Buy aliases: [LTB] description: Manufacturer-set deadline for final orders before discontinuation. - term: Obsolete aliases: [End of Life, EOL] description: Part no longer manufactured. # Compliance - term: RoHS description: EU Restriction of Hazardous Substances directive — restricts lead, mercury, cadmium, chromium VI, PBB, PBDE in electronic products. - term: REACH description: EU Registration, Evaluation, Authorisation and Restriction of Chemicals regulation; reports Substances of Very High Concern (SVHC) above 0.1% by weight. - term: Conflict Minerals description: Disclosure under Dodd-Frank Section 1502 covering tantalum, tin, tungsten, gold (3TG) sourcing. - term: ECCN description: Export Control Classification Number under U.S. EAR. - term: HTS aliases: [Harmonized Tariff Schedule] description: Tariff classification code used in cross-border trade. - term: Halogen-Free description: Component meeting IEC 61249-2-21 limits on chlorine and bromine. - term: Lead-Free description: Solder/terminations meeting Pb-free requirements under RoHS. # ECAD / PCB Design - term: Schematic Symbol aliases: [Symbol] description: Abstract diagrammatic representation of a component used in a schematic. - term: Footprint aliases: [Land Pattern] description: PCB copper / silkscreen / soldermask pattern matching a component package. - term: 3D Model description: STEP / IGES model used in mechanical assembly and clearance checks. - term: ECAD aliases: [Electronic Computer-Aided Design] description: Software for designing schematics and PCBs (Altium, KiCad, Eagle, OrCAD, Cadence, Mentor). - term: MCAD description: Mechanical CAD used to design enclosures and assemblies. - term: Reference Designator aliases: [Ref Des] description: Identifier (R1, C12, U3) marking a component instance on a schematic and PCB. # BoM - term: Bill of Materials aliases: [BoM, BOM] description: Ordered list of every component required to build one unit of a hardware product. - term: Alternate Part aliases: [AML, Approved Manufacturer List, AVL, Approved Vendor List] description: An MPN/manufacturer pair acceptable in place of the preferred part on a BoM line. - term: Do Not Populate aliases: [DNP, DNI, Do Not Install] description: BoM line that should not be populated during assembly. # IoT / Hardware operations - term: Device Registry description: Cloud-side directory of provisioned hardware devices and their metadata. - term: Device Twin aliases: [Device Shadow] description: Mirror of a device's reported and desired state held in the cloud. - term: OTA aliases: [Over the Air] description: Firmware update delivered to deployed hardware without physical access. - term: MQTT description: Lightweight publish-subscribe protocol used for IoT device-to-cloud telemetry. - term: Provisioning description: Initial onboarding of a device into a cloud platform with credentials and identity.