(module footprints:AVR-ISP-6 (layer F.Cu) (tedit 5860A6AE)
  (descr "6-lead dip package, row spacing 7.62 mm (300 mils)")
  (tags "dil dip 2.54 300")
  (fp_text reference CON1 (at 0 -2.54) (layer F.SilkS) hide
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value AVR-ISP-6 (at 0 -3.72) (layer F.Fab) hide
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (pad 1 smd oval (at 0 0) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at 2.54 0) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd oval (at 0 2.54) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd oval (at 2.54 2.54) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd oval (at 0 5.08) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd oval (at 2.54 5.08) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask))
)