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"DDR3_DQ1") (net 445 "DDR3_DQ2") (net 446 "ETH_TXD0") (net 447 "ETH_TXD3") (net 448 "unconnected-(U4-GPIO-Pad20)") (net 449 "unconnected-(U11-BCBUS4-Pad55)") (net 450 "unconnected-(U11-BDBUS6-Pad45)") (net 451 "unconnected-(U11-BCBUS1-Pad52)") (net 452 "unconnected-(U11-BDBUS7-Pad46)") (net 453 "unconnected-(U11-BCBUS6-Pad58)") (net 454 "unconnected-(U11-ACBUS0-Pad26)") (net 455 "unconnected-(U11-BCBUS5-Pad57)") (net 456 "VCC") (net 457 "unconnected-(U11-BCBUS0-Pad48)") (net 458 "unconnected-(U11-BCBUS3-Pad54)") (net 459 "unconnected-(U11-ACBUS3-Pad29)") (net 460 "unconnected-(U11-ADBUS7-Pad24)") (net 461 "unconnected-(U11-ACBUS1-Pad27)") (net 462 "unconnected-(U11-BDBUS2-Pad40)") (net 463 "unconnected-(U11-ADBUS4-Pad21)") (net 464 "unconnected-(U11-BDBUS4-Pad43)") (net 465 "unconnected-(U11-ACBUS6-Pad33)") (net 466 "unconnected-(U11-BDBUS3-Pad41)") (net 467 "unconnected-(U11-ACBUS2-Pad28)") (net 468 "unconnected-(U11-ADBUS6-Pad23)") (net 469 "unconnected-(U11-ACBUS5-Pad32)") (net 470 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"IO_L8N_T1_AD14N_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "622ac12e-b828-41a6-88e4-01598135a187") ) (pad "A4" smd circle (at -5.5 -8.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 64 "AD14_P") (pinfunction "IO_L8P_T1_AD14P_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "3ceae021-522a-402a-9d31-7d5f825bc2dc") ) (pad "A5" smd circle (at -4.5 -8.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 12 "CK_AN1_N") (pinfunction "IO_L3N_T0_DQS_AD5N_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "fada352f-9d7f-4237-a20c-d2eb462e1dc7") ) (pad "A6" smd circle (at -3.5 -8.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 11 "CK_AN1_P") (pinfunction "IO_L3P_T0_DQS_AD5P_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "52145efd-8c2c-4d11-8823-c143d0864ad1") ) (pad "A7" smd circle (at -2.5 -8.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_35") (pintype "power_in") (solder_mask_margin 0.102) (uuid "5f6819ba-2b26-4193-a6a9-6cea8a0ec0a6") ) (pad "A8" smd circle (at -1.5 -8.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 493 "S1") (pinfunction "IO_L12N_T1_MRCC_16") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "a3a1a078-15fd-4881-9aeb-c0e3388e058f") ) (pad "A9" smd circle (at -0.5 -8.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 394 "UART_TXD_IN") (pinfunction "IO_L14N_T2_SRCC_16") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "8abc9937-3c03-4cf8-935e-e79c3b211290") ) (pad "A10" smd circle (at 0.5 -8.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 496 "S4") (pinfunction "IO_L14P_T2_SRCC_16") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "baeb4156-3c7f-4a8a-a2b4-663302475dd1") ) (pad "A11" smd circle (at 1.5 -8.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 338 "JA3") (pinfunction "IO_L4N_T0_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "17321d70-34e5-4b28-8e5d-b4395be2e2b3") ) (pad "A12" smd circle (at 2.5 -8.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "df544130-cc18-4468-a4c5-990e6565bd91") ) (pad "A13" smd circle (at 3.5 -8.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 314 "SDA_PUP") (pinfunction "IO_L9P_T1_DQS_AD3P_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "80fe7fd4-c2db-4d64-8b21-11a41b10c835") ) (pad "A14" smd circle (at 4.5 -8.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 315 "SCL_PUP") (pinfunction "IO_L9N_T1_DQS_AD3N_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "4f2db2ea-386c-420b-8438-ffdd3a8d438b") ) (pad "A15" smd circle (at 5.5 -8.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 58 "AD10_P") (pinfunction "IO_L8P_T1_AD10P_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "57cf701f-c653-4007-abce-025e489491fd") ) (pad "A16" smd circle (at 6.5 -8.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 57 "AD10_N") (pinfunction "IO_L8N_T1_AD10N_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "1de50476-cf5d-42ee-a591-5c17b002e999") ) (pad "A17" smd circle (at 7.5 -8.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_15") (pintype "power_in") (solder_mask_margin 0.102) (uuid "31d381b0-e78a-4b1f-8ce5-aa45d8411f6c") ) (pad "A18" smd circle (at 8.5 -8.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 334 "JA9") (pinfunction "IO_L10N_T1_AD11N_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "0bb59bc1-2fac-4694-8028-ab921e6c3a31") ) (pad "B1" smd circle (at -8.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 15 "CK_AN3_P") (pinfunction "IO_L9P_T1_DQS_AD7P_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "3f6a80e0-44c6-45ab-99ed-3815b069cb63") ) (pad "B2" smd circle (at -7.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 18 "CK_AN4_N") (pinfunction "IO_L10N_T1_AD15N_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "f06d91dc-2254-4224-b6bb-4ea51c7dce05") ) (pad "B3" smd circle (at -6.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 17 "CK_AN4_P") (pinfunction "IO_L10P_T1_AD15P_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "689f858e-3291-4935-b277-7c4866e5a517") ) (pad "B4" smd circle (at -5.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 14 "CK_AN2_N") (pinfunction "IO_L7N_T1_AD6N_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "87a39963-2bd7-4a75-b8ba-52655c7e3699") ) (pad "B5" smd circle (at -4.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "9b377e78-823a-4c11-b1f1-e83cffaec386") ) (pad "B6" smd circle (at -3.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 60 "AD12_N") (pinfunction "IO_L2N_T0_AD12N_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "19e12ceb-c8eb-443e-961d-ba190d847b68") ) (pad "B7" smd circle (at -2.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 59 "AD12_P") (pinfunction "IO_L2P_T0_AD12P_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "6a654b4b-bcdf-4fc8-808b-ded844e85a2b") ) (pad "B8" smd circle (at -1.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 221 "BTN3") (pinfunction "IO_L12P_T1_MRCC_16") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "3e9ce605-b9e4-4ebe-9fa8-b15957c04ba3") ) (pad "B9" smd circle (at -0.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 220 "BTN2") (pinfunction "IO_L11N_T1_SRCC_16") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "36bffdec-83a2-4a33-bc6d-18c522bbb277") ) (pad "B10" smd circle (at 0.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_16") (pintype "power_in") (solder_mask_margin 0.102) (uuid "0014d5eb-9012-4116-a363-a3514a403ffb") ) (pad "B11" smd circle (at 1.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 337 "JA2") (pinfunction "IO_L4P_T0_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "bd458efd-699d-4ae8-9d56-7c00f9151f81") ) (pad "B12" smd circle (at 2.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 52 "AD1_N") (pinfunction "IO_L3N_T0_DQS_AD1N_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "1744f915-fe88-4fa9-a173-8c06574513f7") ) (pad "B13" smd circle (at 3.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 440 "unconnected-(U1C-IO_L2P_T0_AD8P_15-PadB13)") (pinfunction "IO_L2P_T0_AD8P_15") (pintype "bidirectional+no_connect") (solder_mask_margin 0.102) (uuid "4f5cf870-119e-4f93-9afb-b481fe165906") ) (pad "B14" smd circle (at 4.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 427 "unconnected-(U1C-IO_L2N_T0_AD8N_15-PadB14)") (pinfunction "IO_L2N_T0_AD8N_15") (pintype "bidirectional+no_connect") (solder_mask_margin 0.102) (uuid "9f64f67b-e80c-4ad6-8638-77ed77335f9b") ) (pad "B15" smd circle (at 5.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "65520dd8-22d8-4de3-8100-e9b3e35091d2") ) (pad "B16" smd circle (at 6.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 55 "AD2_P") (pinfunction "IO_L7P_T1_AD2P_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "453563d9-0079-4d61-9897-f0ae0c04c68f") ) (pad "B17" smd circle (at 7.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 56 "AD2_N") (pinfunction "IO_L7N_T1_AD2N_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "a754b1f0-fc5e-4674-98af-54e11fd8cfb3") ) (pad "B18" smd circle (at 8.5 -7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 333 "JA8") (pinfunction "IO_L10P_T1_AD11P_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "0bc82941-e545-417b-a416-6824f9be0c5a") ) (pad "C1" smd circle (at -8.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 234 "CK_SS") (pinfunction "IO_L16N_T2_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "588eef3d-aad5-4341-9fcd-314abd07e3d1") ) (pad "C2" smd circle (at -7.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 120 "CK_RST") (pinfunction "IO_L16P_T2_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "d6261f1f-649e-49a8-a528-f1ad55b2967d") ) (pad "C3" smd circle (at -6.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_35") (pintype "power_in") (solder_mask_margin 0.102) (uuid "49aeabc6-d825-40e3-a216-c5744b813ffa") ) (pad "C4" smd circle (at -5.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 13 "CK_AN2_P") (pinfunction "IO_L7P_T1_AD6P_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "8a7f16ac-48a3-4188-a74a-6739820fe7f7") ) (pad "C5" smd circle (at -4.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 10 "CK_AN0_N") (pinfunction "IO_L1N_T0_AD4N_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "33e65bdc-1824-486b-8f01-66a4138f23dc") ) (pad "C6" smd circle (at -3.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 9 "CK_AN0_P") (pinfunction "IO_L1P_T0_AD4P_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "7ddfb9ee-2736-4af6-a897-a35ec2cbf75d") ) (pad "C7" smd circle (at -2.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 84 "CK_A2") (pinfunction "IO_L4N_T0_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "3af652d4-164f-4278-813a-8fd38d077058") ) (pad "C8" smd circle (at -1.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "ba8d08cb-d270-45e4-aa21-4205c144174e") ) (pad "C9" smd circle (at -0.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 219 "BTN1") (pinfunction "IO_L11P_T1_SRCC_16") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "b1595fe2-e8b8-40de-acf2-865b3976229c") ) (pad "C10" smd circle (at 0.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 495 "S3") (pinfunction "IO_L13N_T2_MRCC_16") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "31a20742-1a6e-486a-8e6d-02a3ae39acaa") ) (pad "C11" smd circle (at 1.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 494 "S2") (pinfunction "IO_L13P_T2_MRCC_16") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "01105274-ffcf-4fe2-84f0-445612455c0c") ) (pad "C12" smd circle (at 2.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 51 "AD1_P") (pinfunction "IO_L3P_T0_DQS_AD1P_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "944182b8-9262-4d7e-9bfd-436b323e9431") ) (pad "C13" smd circle (at 3.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_15") (pintype "power_in") (solder_mask_margin 0.102) (uuid "625e63e3-29d6-4b9d-85a9-4be4e78b6452") ) (pad "C14" smd circle (at 4.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 20 "CK_AN5_N") (pinfunction "IO_L1N_T0_AD0N_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "78e49516-f523-4fdf-acd6-1da633821a4f") ) (pad "C15" smd circle (at 5.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 341 "JB2_N") (pinfunction "IO_L12N_T1_MRCC_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "00bc8a12-9f4b-4b89-8c5c-56a7fc7d55c8") ) (pad "C16" smd circle (at 6.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 211 "ETH_RSTN") (pinfunction "IO_L20P_T3_A20_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "2b785891-43e7-4c3e-803b-2966f740346f") ) (pad "C17" smd circle (at 7.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 208 "ETH_RXERR") (pinfunction "IO_L20N_T3_A19_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "ac7ec9f9-5c2b-4483-95cf-f39a08c15e1f") ) (pad "C18" smd circle (at 8.5 -6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "c8f4aa39-7f34-49fe-9abf-2d6c486e514f") ) (pad "D1" smd circle (at -8.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "7c01ecf7-d6df-4178-975b-41f54543e5c1") ) (pad "D2" smd circle (at -7.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 361 "JD8") (pinfunction "IO_L14N_T2_SRCC_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "b4668a61-adf7-4ab8-8a80-331a569d41b1") ) (pad "D3" smd circle (at -6.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 359 "JD2") (pinfunction "IO_L12N_T1_MRCC_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "448d4d33-76a9-40db-bf76-e7cb1a25356e") ) (pad "D4" smd circle (at -5.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 358 "JD1") (pinfunction "IO_L11N_T1_SRCC_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "aac7214c-ea90-48b4-86cb-8aa5f47d9d9b") ) (pad "D5" smd circle (at -4.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 73 "CK_A5") (pinfunction "IO_L11P_T1_SRCC_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "e964683b-fe36-4820-a15e-7deacf0690c7") ) (pad "D6" smd circle (at -3.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_35") (pintype "power_in") (solder_mask_margin 0.102) (uuid "23718bf9-9d37-403d-8630-d9369e78b135") ) (pad "D7" smd circle (at -2.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 78 "CK_A4") (pinfunction "IO_L6N_T0_VREF_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "ecb2f865-6505-49c0-8912-d10d9b52760f") ) (pad "D8" smd circle (at -1.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 83 "CK_A1") (pinfunction "IO_L4P_T0_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "e6d78100-ee31-4a21-b215-d297421334f2") ) (pad "D9" smd circle (at -0.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 218 "BTN0") (pinfunction "IO_L6N_T0_VREF_16") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "fef73ea2-a904-4423-8904-61fcdee12939") ) (pad "D10" smd circle (at 0.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 396 "UART_RXD_OUT") (pinfunction "IO_L19N_T3_VREF_16") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "4099293d-c5bf-4aa3-b4b2-f1157c1f67de") ) (pad "D11" smd circle (at 1.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "4bccf787-1b8a-4cf9-b070-e1612f376020") ) (pad "D12" smd circle (at 2.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 339 "JA4") (pinfunction "IO_L6P_T0_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "a4a44925-6e5f-4e5c-b008-eb7757242baf") ) (pad "D13" smd circle (at 3.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 332 "JA7") (pinfunction "IO_L6N_T0_VREF_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "503980cc-61cd-4363-9b6f-d532cc6ef0f4") ) (pad "D14" smd circle (at 4.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 19 "CK_AN5_P") (pinfunction "IO_L1P_T0_AD0P_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "7906d9d4-ee37-4c0d-a280-dc6bbedce3b5") ) (pad "D15" smd circle (at 5.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 340 "JB2_P") (pinfunction "IO_L12P_T1_MRCC_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "d197dbc5-34e3-46c3-a969-9ba0a2de8706") ) (pad "D16" smd circle (at 6.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_15") (pintype "power_in") (solder_mask_margin 0.102) (uuid "85b2eaf0-1d6e-41aa-b7b2-ea0b09348e66") ) (pad "D17" smd circle (at 7.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 207 "ETH_COL") (pinfunction "IO_L16N_T2_A27_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "c3659d7d-2ab8-44a5-bbc5-ca8c38ee5714") ) (pad "D18" smd circle (at 8.5 -5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 210 "ETH_RXD0") (pinfunction "IO_L21N_T3_DQS_A18_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "f13a04d4-87c1-4b1b-83d1-965bf51aedba") ) (pad "E1" smd circle (at -8.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 320 "LED0_B") (pinfunction "IO_L18N_T2_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "833a88c7-04e3-4890-8a73-9559741fa2ae") ) (pad "E2" smd circle (at -7.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 360 "JD7") (pinfunction "IO_L14P_T2_SRCC_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "f737fa4b-918e-4531-b19b-ade467103e96") ) (pad "E3" smd circle (at -6.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 415 "GCLK100") (pinfunction "IO_L12P_T1_MRCC_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "54d808ec-91f9-4621-8387-350a86f176f8") ) (pad "E4" smd circle (at -5.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "a564133d-a07d-4ee8-90a0-aa3c4a15fb69") ) (pad "E5" smd circle (at -4.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 62 "AD13_N") (pinfunction "IO_L5N_T0_AD13N_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "a1524be3-96e8-4b55-98df-4e3651fd19e5") ) (pad "E6" smd circle (at -3.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 61 "AD13_P") (pinfunction "IO_L5P_T0_AD13P_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "5c5f3b51-68e3-4870-9d3a-684044c513df") ) (pad "E7" smd circle (at -2.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 81 "CK_A3") (pinfunction "IO_L6P_T0_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "57a6e19f-326b-4987-81ae-9012e23b247a") ) (pad "E8" smd circle (at -1.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 26 "+1V8") (pinfunction "VCCBATT_0") (pintype "power_in") (solder_mask_margin 0.102) (uuid "ce3610a3-e39a-4484-b829-1e3ee5465396") ) (pad "E9" smd circle (at -0.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 364 "QSPI_SCK") (pinfunction "CCLK_0") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "ba497fc3-4e2c-45f2-aa8e-a9168bc25f9f") ) (pad "E10" smd circle (at 0.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 146 "TCK") (pinfunction "TCK_0") (pintype "input") (solder_mask_margin 0.102) (uuid "23e883d7-5590-4495-9991-3cb5078a4e7e") ) (pad "E11" smd circle (at 1.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 370 "TDI_FPGA") (pinfunction "TDI_0") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "5665a4e7-9c77-4315-8e18-687eac822f4c") ) (pad "E12" smd circle (at 2.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 145 "TMS") (pinfunction "TMS_0") (pintype "input") (solder_mask_margin 0.102) (uuid "6f6b6f72-4d4e-416c-87e5-872d9e73199f") ) (pad "E13" smd circle (at 3.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 401 "TDO_FPGA") (pinfunction "TDO_0") (pintype "output") (solder_mask_margin 0.102) (uuid "9327c432-5586-4a4e-b8be-304f19318336") ) (pad "E14" smd circle (at 4.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "7da023ad-c4b6-4b8c-90db-0414a026aed8") ) (pad "E15" smd circle (at 5.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 342 "JB1_P") (pinfunction "IO_L11P_T1_SRCC_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "afde1cad-9698-4b65-919c-d8df521a8c5d") ) (pad "E16" smd circle (at 6.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 343 "JB1_N") (pinfunction "IO_L11N_T1_SRCC_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "e4ed4293-5637-469f-9971-4f5e5b5e8fc0") ) (pad "E17" smd circle (at 7.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 209 "ETH_RXD1") (pinfunction "IO_L16P_T2_A28_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "fef3d2f9-4435-44a8-91fe-c885f4b0dc1e") ) (pad "E18" smd circle (at 8.5 -4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 413 "ETH_RXD2") (pinfunction "IO_L21P_T3_DQS_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "beb69c5b-c2e7-4de1-a02e-44ff959e4f44") ) (pad "F1" smd circle (at -8.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 233 "CK_SCK") (pinfunction "IO_L18P_T2_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "ab64de4c-4565-48cd-aa70-4784c00594a6") ) (pad "F2" smd circle (at -7.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_35") (pintype "power_in") (solder_mask_margin 0.102) (uuid "35b690d8-4076-4087-9575-bc017824ae04") ) (pad "F3" smd circle (at -6.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 357 "JD4") (pinfunction "IO_L13N_T2_MRCC_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "d65b579a-f054-4f3b-9ecc-30b5ce4809f0") ) (pad "F4" smd circle (at -5.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 356 "JD3") (pinfunction "IO_L13P_T2_MRCC_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "d20719f6-475e-4044-9d60-7df1d6f21b80") ) (pad "F5" smd circle (at -4.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 82 "CK_A0") (pinfunction "IO_0_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "9cb2e3d9-ac4d-4709-aabb-0c42694624aa") ) (pad "F6" smd circle (at -3.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 322 "LED0_G") (pinfunction "IO_L19N_T3_VREF_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "a2ef7977-e74e-4b88-885b-fe0746b11979") ) (pad "F7" smd circle (at -2.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "ae6b3df1-7d82-4b2b-b16f-ad1388704497") ) (pad "F8" smd circle (at -1.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCINT") (pintype "power_in") (solder_mask_margin 0.102) (uuid "5922289b-21b4-470e-990c-b50b95bb6b79") ) (pad "F9" smd circle (at -0.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "0b1ea66c-da88-4611-8503-4270eb0642f4") ) (pad "F10" smd circle (at 0.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCBRAM") (pintype "power_in") (solder_mask_margin 0.102) (uuid "5a909c4a-cf0d-4d28-b5d9-0b2f983d7d64") ) (pad "F11" smd circle (at 1.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "dc1d9d2e-0a91-471c-b1c9-b910104dcad5") ) (pad "F12" smd circle (at 2.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 26 "+1V8") (pinfunction "VCCAUX") (pintype "power_in") (solder_mask_margin 0.102) (uuid "efd6319b-2040-44a7-a65c-a932da69351b") ) (pad "F13" smd circle (at 3.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 54 "AD9_P") (pinfunction "IO_L5P_T0_AD9P_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "78340ae7-54d0-4882-b310-386a47ac1a6c") ) (pad "F14" smd circle (at 4.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 53 "AD9_N") (pinfunction "IO_L5N_T0_AD9N_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "4821a430-d945-46fa-b521-80d79be15d2b") ) (pad "F15" smd circle (at 5.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 435 "ETH_RX_CLK") (pinfunction "IO_L14P_T2_SRCC_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "8de3b5e5-852f-42c3-929a-ae5437a9ff95") ) (pad "F16" smd circle (at 6.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 429 "ETH_MDC") (pinfunction "IO_L14N_T2_SRCC_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "e1b4bbf9-64c6-43f8-9418-0cd035986257") ) (pad "F17" smd circle (at 7.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "b469ebf6-e206-4ca6-8b1e-33379278beed") ) (pad "F18" smd circle (at 8.5 -3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 410 "unconnected-(U1C-IO_L22N_T3_A16_15-PadF18)") (pinfunction "IO_L22N_T3_A16_15") (pintype "bidirectional+no_connect") (solder_mask_margin 0.102) (uuid "3df398dc-a757-4f5f-8837-24b074500c11") ) (pad "G1" smd circle (at -8.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 232 "CK_MISO") (pinfunction "IO_L17N_T2_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "e6a35979-2b28-45f6-ae7d-505b2b54ca50") ) (pad "G2" smd circle (at -7.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 363 "JD10") (pinfunction "IO_L15N_T2_DQS_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "f9fd20f3-351c-4605-8921-d066e3c02813") ) (pad "G3" smd circle (at -6.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 324 "LED1_R") (pinfunction "IO_L20N_T3_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "ec6e3509-e4c3-4830-a80c-fec8a30ff07c") ) (pad "G4" smd circle (at -5.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 323 "LED1_B") (pinfunction "IO_L20P_T3_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "b21b3b3e-2292-4c81-a04a-c224493fff85") ) (pad "G5" smd circle (at -4.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_35") (pintype "power_in") (solder_mask_margin 0.102) (uuid "e38db782-7b67-4506-b7c0-ea29d4fae2f7") ) (pad "G6" smd circle (at -3.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 321 "LED0_R") (pinfunction "IO_L19P_T3_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "dc323ae6-edf6-4d1c-8695-c4c06be2bfc7") ) (pad "G7" smd circle (at -2.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCINT") (pintype "power_in") (solder_mask_margin 0.102) (uuid "76cb0f22-ba6b-4b35-a825-f2d9543d0d39") ) (pad "G8" smd circle (at -1.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "3496361a-95cc-4b18-bece-464ed5007023") ) (pad "G9" smd circle (at -0.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCINT") (pintype "power_in") (solder_mask_margin 0.102) (uuid "7622118e-cc26-4978-9376-e1297a8c9be4") ) (pad "G10" smd circle (at 0.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "706d11bf-f962-4b0d-8287-7fb4b5eb60a4") ) (pad "G11" smd circle (at 1.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCBRAM") (pintype "power_in") (solder_mask_margin 0.102) (uuid "ae28ba21-ff57-4d5c-9b7d-935b23bf5aa0") ) (pad "G12" smd circle (at 2.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "d0c70367-4348-42e5-9874-907a11d6b6a9") ) (pad "G13" smd circle (at 3.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 336 "JA1") (pinfunction "IO_0_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "a59abc47-c228-45f9-a36c-9ba4f04d3cfa") ) (pad "G14" smd circle (at 4.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 206 "ETH_CRS") (pinfunction "IO_L15N_T2_DQS_ADV_B_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "b41828b9-f15a-401a-8656-6279c3e56ac7") ) (pad "G15" smd circle (at 5.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_15") (pintype "power_in") (solder_mask_margin 0.102) (uuid "02efb052-3422-4c67-a528-4de48a58b764") ) (pad "G16" smd circle (at 6.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 430 "ETH_RX_DV") (pinfunction "IO_L13N_T2_MRCC_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "254d1816-e0d3-4f30-b671-bd9dbd84eb90") ) (pad "G17" smd circle (at 7.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 433 "ETH_RXD3") (pinfunction "IO_L18N_T2_A23_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "58ad0de1-a815-4fd0-b576-ee2b62178a90") ) (pad "G18" smd circle (at 8.5 -2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 44 "ETH_REF_CLK") (pinfunction "IO_L22P_T3_A17_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "03b722e3-730d-43bd-b90a-84a1baa35a9d") ) (pad "H1" smd circle (at -8.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 232 "CK_MISO") (pinfunction "IO_L17P_T2_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "3af0d87b-510d-4ed1-9e43-8ba022d3d90f") ) (pad "H2" smd circle (at -7.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 362 "JD9") (pinfunction "IO_L15P_T2_DQS_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "c9e9ee0a-e69f-44d2-8d1d-59cb417e08cf") ) (pad "H3" smd circle (at -6.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "8b4978ba-d514-49c7-bbc1-3e3900b3993c") ) (pad "H4" smd circle (at -5.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 326 "LED2_B") (pinfunction "IO_L21N_T3_DQS_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "7adf57ec-60ee-4957-9485-718785bfe751") ) (pad "H5" smd circle (at -4.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 319 "LED4") (pinfunction "IO_L24N_T3_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "2a1d6572-86a0-4075-ab87-bb1fed45dc9f") ) (pad "H6" smd circle (at -3.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 327 "LED2_R") (pinfunction "IO_L24P_T3_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "aff57010-acf3-4c63-b97d-7b0114b9e572") ) (pad "H7" smd circle (at -2.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "9e4b610a-6a38-4094-89b1-ef3f2ceed2a7") ) (pad "H8" smd circle (at -1.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCINT") (pintype "power_in") (solder_mask_margin 0.102) (uuid "e972edcb-4e26-4c0a-aaba-dc12fedf85b7") ) (pad "H9" smd circle (at -0.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GNDADC_0") (pintype "passive") (solder_mask_margin 0.102) (uuid "fae7c1c4-d7b9-4952-940b-6cf39fb6e331") ) (pad "H10" smd circle (at 0.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 47 "XADC1V8") (pinfunction "VCCADC_0") (pintype "power_in") (solder_mask_margin 0.102) (uuid "a2142ae9-feb7-404e-bb0a-79c28f994e4d") ) (pad "H11" smd circle (at 1.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "a52bd296-08c2-473c-9028-9c07ed005fc2") ) (pad "H12" smd circle (at 2.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 26 "+1V8") (pinfunction "VCCAUX") (pintype "power_in") (solder_mask_margin 0.102) (uuid "dd22ae86-f053-46f5-be64-a0cff434de59") ) (pad "H13" smd circle (at 3.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "baea6a51-591a-4aad-a375-77f01c5b9fd0") ) (pad "H14" smd circle (at 4.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 446 "ETH_TXD0") (pinfunction "IO_L15P_T2_DQS_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "496828cc-253f-404c-8cfa-61b7b4785fc2") ) (pad "H15" smd circle (at 5.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 408 "ETH_TX_EN") (pinfunction "IO_L19N_T3_A21_VREF_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "a8a1f17e-c746-4652-b6ba-f63f720543d6") ) (pad "H16" smd circle (at 6.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 434 "ETH_TX_CLK") (pinfunction "IO_L13P_T2_MRCC_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "cbe672b0-98b5-4dfc-9544-ab27be914bf0") ) (pad "H17" smd circle (at 7.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 447 "ETH_TXD3") (pinfunction "IO_L18P_T2_A24_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "fd1c3e61-c7d6-42bc-ad6b-af8cf7e21ed1") ) (pad "H18" smd circle (at 8.5 -1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_15") (pintype "power_in") (solder_mask_margin 0.102) (uuid "95976526-44ac-429b-8472-50611b7ea043") ) (pad "J1" smd circle (at -8.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_35") (pintype "power_in") (solder_mask_margin 0.102) (uuid "89c71bc9-b17e-4324-a3cf-8e95cababcb1") ) (pad "J2" smd circle (at -7.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 328 "LED2_G") (pinfunction "IO_L22N_T3_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "b4856bc5-3c22-4707-b314-940463b8fda7") ) (pad "J3" smd circle (at -6.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 327 "LED2_R") (pinfunction "IO_L22P_T3_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "2a92f9c0-da67-47f1-8063-080a498fa051") ) (pad "J4" smd circle (at -5.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 325 "LED1_G") (pinfunction "IO_L21P_T3_DQS_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "ea7caa29-b16f-40f6-bc83-0b2196de7d38") ) (pad "J5" smd circle (at -4.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 318 "LED5") (pinfunction "IO_25_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "138b69e2-1eb7-4893-81c9-76340385a50b") ) (pad "J6" smd circle (at -3.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "b0aa09e9-e51d-4576-9584-75980b9e7748") ) (pad "J7" smd circle (at -2.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCINT") (pintype "power_in") (solder_mask_margin 0.102) (uuid "ded1c8a5-4353-43db-8828-77e557dd5422") ) (pad "J8" smd circle (at -1.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "9d95569e-abea-45a3-973e-380b5fea983e") ) (pad "J9" smd circle (at -0.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 35 "XADCVREF") (pinfunction "VREFN_0") (pintype "power_in") (solder_mask_margin 0.102) (uuid "efacf4fd-1bae-4def-8aae-1af443f23cdb") ) (pad "J10" smd circle (at 0.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 50 "V_P") (pinfunction "VP_0") (pintype "input") (solder_mask_margin 0.102) (uuid "7dffc5bd-93f6-4284-bc8e-404c13ecd38c") ) (pad "J11" smd circle (at 1.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCINT") (pintype "power_in") (solder_mask_margin 0.102) (uuid "dc5559c3-a4e1-4891-bd87-98ac5b2837b4") ) (pad "J12" smd circle (at 2.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "ba3fa162-f070-404f-a98b-0b70f119393b") ) (pad "J13" smd circle (at 3.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 442 "ETH_TXD2") (pinfunction "IO_L17N_T2_A25_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "61e51ace-43d3-47ed-ba91-06f3b7a158cb") ) (pad "J14" smd circle (at 4.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 443 "ETH_TXD1") (pinfunction "IO_L19P_T3_A22_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "e010ebef-0a36-4d73-871f-11e9c11f2d2e") ) (pad "J15" smd circle (at 5.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 347 "JB4_N") (pinfunction "IO_L24N_T3_RS0_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "7d80d990-ecba-410d-b232-62eb848a54c9") ) (pad "J16" smd circle (at 6.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "4e071a3c-43aa-4e4e-9341-0ae5c257c4aa") ) (pad "J17" smd circle (at 7.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 344 "JB3_P") (pinfunction "IO_L23P_T3_FOE_B_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "d8b0944e-3b00-44aa-9ec1-6ec2ac7d1e1b") ) (pad "J18" smd circle (at 8.5 -0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 345 "JB3_N") (pinfunction "IO_L23N_T3_FWE_B_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "588cab4a-5982-4534-abe9-8a71c1178ba9") ) (pad "K1" smd circle (at -8.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 330 "LED3_R") (pinfunction "IO_L23N_T3_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "695b2aee-ca2c-4f91-8d37-d1c3d9bc6e8a") ) (pad "K2" smd circle (at -7.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 329 "LED3_B") (pinfunction "IO_L23P_T3_35") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "3103cfdc-d6e0-441d-a114-a521b27d7de0") ) (pad "K3" smd circle (at -6.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 445 "DDR3_DQ2") (pinfunction "IO_L2P_T0_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "6c385e0d-75fa-4557-b0ee-4702a75c0b5a") ) (pad "K4" smd circle (at -5.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_34") (pintype "power_in") (solder_mask_margin 0.102) (uuid "63883c3f-8ef7-42e7-abab-619f1fa9bfb9") ) (pad "K5" smd circle (at -4.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 424 "DDR3_DQ0") (pinfunction "IO_L5P_T0_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "119c28fd-f292-4db9-ba8c-0b9ddfe366cb") ) (pad "K6" smd circle (at -3.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 270 "DDR3_RESET") (pinfunction "IO_0_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "653bb9f3-0425-4d37-87f0-760247bdd325") ) (pad "K7" smd circle (at -2.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "e88f6157-d3c8-41fa-ac9a-9e9fbcec0e4b") ) (pad "K8" smd circle (at -1.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCINT") (pintype "power_in") (solder_mask_margin 0.102) (uuid "a39f68a9-ee18-4b64-9397-0eaaa361d039") ) (pad "K9" smd circle (at -0.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 49 "V_N") (pinfunction "VN_0") (pintype "input") (solder_mask_margin 0.102) (uuid "77206fa1-2b5b-407d-a9b0-cba9bb8e0250") ) (pad "K10" smd circle (at 0.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 35 "XADCVREF") (pinfunction "VREFP_0") (pintype "power_in") (solder_mask_margin 0.102) (uuid "c192bcae-6d8f-473d-92bc-81b6a72558bb") ) (pad "K11" smd circle (at 1.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "c868c536-244f-4510-aa5c-17e43141f2b9") ) (pad "K12" smd circle (at 2.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 26 "+1V8") (pinfunction "VCCAUX") (pintype "power_in") (solder_mask_margin 0.102) (uuid "a239ad01-4fed-46bc-909b-922810a28be4") ) (pad "K13" smd circle (at 3.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 205 "ETH_MDIO") (pinfunction "IO_L17P_T2_A26_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "1eb3ae86-f52e-4bc1-b5fc-c20f1d98dd82") ) (pad "K14" smd circle (at 4.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_15") (pintype "power_in") (solder_mask_margin 0.102) (uuid "1b1023ef-8ec1-4abc-b363-e19b08e7d489") ) (pad "K15" smd circle (at 5.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 346 "JB4_P") (pinfunction "IO_L24P_T3_RS1_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "7d65f648-a32f-473a-b427-3daae81a4ad1") ) (pad "K16" smd circle (at 6.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 335 "JA10") (pinfunction "IO_25_15") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "3d6c139b-f953-4bb9-bd63-296239933315") ) (pad "K17" smd circle (at 7.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 418 "K17") (pinfunction "IO_L1P_T0_D00_MOSI_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "79537914-c8c4-4b59-acb7-6f029fc1608d") ) (pad "K18" smd circle (at 8.5 0.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 375 "QSPI_DQ1") (pinfunction "IO_L1N_T0_D01_DIN_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "76b86856-0365-4614-9d50-ebbdf9bd198a") ) (pad "L1" smd circle (at -8.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 426 "DDR3_DM0") (pinfunction "IO_L1P_T0_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "ca7a626c-4552-4d5d-acc2-8addd7469ae7") ) (pad "L2" smd circle (at -7.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "08266aaa-65bf-4880-afc0-b41a567d6443") ) (pad "L3" smd circle (at -6.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 444 "DDR3_DQ1") (pinfunction "IO_L2N_T0_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "73aef7c9-fc22-464b-b121-cd497347158e") ) (pad "L4" smd circle (at -5.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 417 "DDR3_DQ6") (pinfunction "IO_L5N_T0_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "77236112-f1ba-42eb-859a-6a846eefce33") ) (pad "L5" smd circle (at -4.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 423 "unconnected-(U1B-IO_L6N_T0_VREF_34-PadL5)") (pinfunction "IO_L6N_T0_VREF_34") (pintype "bidirectional+no_connect") (solder_mask_margin 0.102) (uuid "6f80ec15-d933-4f5e-ae4c-ed8d82998c99") ) (pad "L6" smd circle (at -3.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 438 "DDR3_DQ3") (pinfunction "IO_L6P_T0_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "09da738c-1fcd-48af-baec-71f49cce2fda") ) (pad "L7" smd circle (at -2.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCINT") (pintype "power_in") (solder_mask_margin 0.102) (uuid "1f30898d-8066-4bdf-9699-5cd3d1374c4f") ) (pad "L8" smd circle (at -1.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "41d622aa-5d51-4493-b88c-cb314941276d") ) (pad "L9" smd circle (at -0.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "DXN_0") (pintype "passive") (solder_mask_margin 0.102) (uuid "94fc60be-00f3-4952-9bfe-73359ba94d11") ) (pad "L10" smd circle (at 0.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "DXP_0") (pintype "passive") (solder_mask_margin 0.102) (uuid "162278ad-edc7-44f9-af43-037e8a215001") ) (pad "L11" smd circle (at 1.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCINT") (pintype "power_in") (solder_mask_margin 0.102) (uuid "f09d5077-2a82-4718-910e-e3fcf5347ff9") ) (pad "L12" smd circle (at 2.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "8aac2875-759f-407f-943e-1c6530872506") ) (pad "L13" smd circle (at 3.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 439 "QSPI_CS") (pinfunction "IO_L6P_T0_FCS_B_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "da2e9553-ef85-4fd2-97a9-81f9072d5e0a") ) (pad "L14" smd circle (at 4.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 368 "QSPI_DQ2") (pinfunction "IO_L2P_T0_D02_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "a22c0bac-e7d4-4062-80f4-ad2e2568aea4") ) (pad "L15" smd circle (at 5.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 371 "PUDC_B") (pinfunction "IO_L3P_T0_DQS_PUDC_B_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "5e342575-d46c-4b3d-b588-521003f49085") ) (pad "L16" smd circle (at 6.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 372 "Net-(U1D-IO_L3N_T0_DQS_EMCCLK_14)") (pinfunction "IO_L3N_T0_DQS_EMCCLK_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "9a6a3169-a9c8-4138-a8e4-b8b9baeaacc0") ) (pad "L17" smd circle (at 7.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_14") (pintype "power_in") (solder_mask_margin 0.102) (uuid "5bf77987-1afa-45b3-82a9-b064c34bf94d") ) (pad "L18" smd circle (at 8.5 1.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 99 "CK_SCL") (pinfunction "IO_L4P_T0_D04_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "52e306a7-e8be-48fa-a6d8-6f2f46273d43") ) (pad "M1" smd circle (at -8.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 421 "DDR3_DQ5") (pinfunction "IO_L1N_T0_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "64f2d873-e9d6-4e92-9f25-c846c5f40b9a") ) (pad "M2" smd circle (at -7.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 420 "DDR3_DQ7") (pinfunction "IO_L4N_T0_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "30217ab3-0766-420b-b30f-848d57b30404") ) (pad "M3" smd circle (at -6.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 412 "DDR3_DQ4") (pinfunction "IO_L4P_T0_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "7b93850d-34d6-4dea-88ef-aa4198c61b4d") ) (pad "M4" smd circle (at -5.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 257 "DDR3_CAS") (pinfunction "IO_L16P_T2_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "dbb4e525-3269-4117-b734-647fff3f4af6") ) (pad "M5" smd circle (at -4.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "6e9de540-9afd-4c2a-a8aa-dae68be41771") ) (pad "M6" smd circle (at -3.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 277 "DDR3_A1") (pinfunction "IO_L18P_T2_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "92a4b7b7-d5d6-4992-a96e-a83220c8f785") ) (pad "M7" smd circle (at -2.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "9cc9115f-6364-4b49-bce9-28aee8343e8b") ) (pad "M8" smd circle (at -1.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCINT") (pintype "power_in") (solder_mask_margin 0.102) (uuid "572be2fc-4d55-4218-bba6-add0c6cb96bf") ) (pad "M9" smd circle (at -0.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "c6d59ac4-1229-4dc1-b947-6fd36639f41f") ) (pad "M10" smd circle (at 0.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCINT") (pintype "power_in") (solder_mask_margin 0.102) (uuid "4debf56b-584a-44bf-9576-0f5c1239d77b") ) (pad "M11" smd circle (at 1.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "4f864506-db40-4cd6-8062-7d93fbdce36a") ) (pad "M12" smd circle (at 2.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 26 "+1V8") (pinfunction "VCCAUX") (pintype "power_in") (solder_mask_margin 0.102) (uuid "ac5e637b-a49d-47b5-80e4-2cba19dc584e") ) (pad "M13" smd circle (at 3.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 308 "CK_IO28") (pinfunction "IO_L6N_T0_D08_VREF_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "0584e96a-a5de-4e90-9ad1-abfcff627b34") ) (pad "M14" smd circle (at 4.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 367 "QSPI_DQ3") (pinfunction "IO_L2N_T0_D03_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "a8210150-a289-4f4b-8663-69a8674fdde0") ) (pad "M15" smd circle (at 5.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "33af6df8-2e05-4944-8b42-db6ac8e5dd92") ) (pad "M16" smd circle (at 6.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 236 "CK_IO9") (pinfunction "IO_L10P_T1_D14_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "b2ee8885-55f9-42f1-9e46-d8706bc78683") ) (pad "M17" smd circle (at 7.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 241 "CK_IOA") (pinfunction "IO_L10N_T1_D15_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "57ffa59a-ae75-4de8-9c95-2a9e4c569e97") ) (pad "M18" smd circle (at 8.5 2.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 100 "CK_SDA") (pinfunction "IO_L4N_T0_D05_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "6a88d2d3-f0f8-4889-be88-7f8f03da2fd9") ) (pad "N1" smd circle (at -8.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 432 "DDR3_DQS0_N") (pinfunction "IO_L3N_T0_DQS_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "c9ba7cf4-b254-40b2-97ff-39b8d7ca029a") ) (pad "N2" smd circle (at -7.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 431 "DDR3_DQS0_P") (pinfunction "IO_L3P_T0_DQS_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "4f840929-3b07-41e9-b9f2-f069cea412a7") ) (pad "N3" smd circle (at -6.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_34") (pintype "power_in") (solder_mask_margin 0.102) (uuid "2341c310-a624-4c22-af89-189813a6d635") ) (pad "N4" smd circle (at -5.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 276 "DDR3_A2") (pinfunction "IO_L16N_T2_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "bad9ad9c-7369-4ec0-8f1a-fe27496c6459") ) (pad "N5" smd circle (at -4.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 260 "DDR3_CKE0") (pinfunction "IO_L13P_T2_MRCC_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "7f7a350a-5fbe-4f59-9eee-853187653a82") ) (pad "N6" smd circle (at -3.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 274 "DDR3_A4") (pinfunction "IO_L18N_T2_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "cf30ab49-d4ec-4576-8b7c-a6876671edea") ) (pad "N7" smd circle (at -2.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCINT") (pintype "power_in") (solder_mask_margin 0.102) (uuid "58619b36-9c68-42b0-b2ec-ebf9bb421d26") ) (pad "N8" smd circle (at -1.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "e26dd14c-08c8-4aae-b260-5ee3912102a7") ) (pad "N9" smd circle (at -0.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCINT") (pintype "power_in") (solder_mask_margin 0.102) (uuid "7b136238-ef0d-4a71-ac0f-7ad0d9fbdbad") ) (pad "N10" smd circle (at 0.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "fd984e47-1bd7-4a0f-86a1-b385ca26851d") ) (pad "N11" smd circle (at 1.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 25 "+1V0") (pinfunction "VCCINT") (pintype "power_in") (solder_mask_margin 0.102) (uuid "cbcd9ea4-261a-4c45-bb1f-cfe6027e5b37") ) (pad "N12" smd circle (at 2.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "2e366bf7-969f-49ff-bddd-a26784dc6a60") ) (pad "N13" smd circle (at 3.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_14") (pintype "power_in") (solder_mask_margin 0.102) (uuid "719a93c5-6b8a-4d16-9ef1-2303972ca8ec") ) (pad "N14" smd circle (at 4.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 244 "CK_IO36") (pinfunction "IO_L8P_T1_D11_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "eaa22f42-695b-4a38-82f7-cabe153ddc83") ) (pad "N15" smd circle (at 5.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 235 "CK_IO8") (pinfunction "IO_L11P_T1_SRCC_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "25fc74de-2b22-4181-a483-6eef0c9b02c5") ) (pad "N16" smd circle (at 6.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 243 "CK_IO35") (pinfunction "IO_L11N_T1_SRCC_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "9960d550-6add-4927-9b63-af45947edf27") ) (pad "N17" smd circle (at 7.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 249 "CK_IO41") (pinfunction "IO_L9P_T1_DQS_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "e64079b2-c5e1-4922-95d2-aa15ca582a6f") ) (pad "N18" smd circle (at 8.5 3.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "4803a421-000b-4209-8631-d44ee8043d49") ) (pad "P1" smd circle (at -8.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "2bd048f7-d1c1-45ce-b215-eef0e0b32cfd") ) (pad "P2" smd circle (at -7.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 261 "DDR3_BA2") (pinfunction "IO_L15P_T2_DQS_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "edf4eb2c-c974-42e1-8c06-cda6a7a7c36b") ) (pad "P3" smd circle (at -6.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 258 "DDR3_RAS") (pinfunction "IO_L14N_T2_SRCC_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "d117a6dc-aec8-4509-bdea-941f010fee16") ) (pad "P4" smd circle (at -5.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 262 "DDR3_BA1") (pinfunction "IO_L14P_T2_SRCC_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "e64dea7d-d7a9-4b9d-b37f-20bf50c350e4") ) (pad "P5" smd circle (at -4.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 256 "DDR3_WE") (pinfunction "IO_L13N_T2_MRCC_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "6cdbe374-674c-4a27-b2e9-ba16ad6a65c1") ) (pad "P6" smd circle (at -3.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VCCO_34") (pintype "power_in") (solder_mask_margin 0.102) (uuid "59c30296-6005-4237-b9fc-8d9aac4749f5") ) (pad "P7" smd circle (at -2.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 366 "INIT") (pinfunction "INIT_B_0") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "c779d8da-7c4a-42bc-a5a6-b6087c34ca66") ) (pad "P8" smd circle (at -1.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "CFGBVS_0") (pintype "input") (solder_mask_margin 0.102) (uuid "a35d5c5f-2d20-4113-a8af-3361301e62c2") ) (pad "P9" smd circle (at -0.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 5 "PROG") (pinfunction "PROGRAM_B_0") (pintype "input") (solder_mask_margin 0.102) (uuid "5fa9fe98-42e1-4eb2-b287-f75682239765") ) (pad "P10" smd circle (at 0.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 365 "DONE") (pinfunction "DONE_0") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "fd86bf29-6027-4366-b57a-0a82e038965c") ) (pad "P11" smd circle (at 1.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 179 "MODE2") (pinfunction "M2_0") (pintype "input") (solder_mask_margin 0.102) (uuid "f919946e-e695-4588-ad75-3113684905ad") ) (pad "P12" smd circle (at 2.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 369 "MODE0") (pinfunction "M0_0") (pintype "input") (solder_mask_margin 0.102) (uuid "8b9ab23f-aeb8-45bd-89d5-2e2fea5ab235") ) (pad "P13" smd circle (at 3.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 404 "MODE1") (pinfunction "M1_0") (pintype "input") (solder_mask_margin 0.102) (uuid "def80c1a-4b72-433c-ae3a-09d0c919b3a3") ) (pad "P14" smd circle (at 4.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 300 "CK_IO2") (pinfunction "IO_L8N_T1_D12_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "ee323081-4c55-4108-92a0-6364ffa35e24") ) (pad "P15" smd circle (at 5.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 313 "CK_IO33") (pinfunction "IO_L13P_T2_MRCC_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "bc3de8f7-e6cf-47e7-b3f9-97851e430991") ) (pad "P16" smd circle (at 6.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_14") (pintype "power_in") (solder_mask_margin 0.102) (uuid "b136bf23-ef38-4505-a339-487a4aee634a") ) (pad "P17" smd circle (at 7.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 240 "CK_IO13") (pinfunction "IO_L12P_T1_MRCC_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "5e20755e-d9eb-49a6-9b72-96f72e343bb1") ) (pad "P18" smd circle (at 8.5 4.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 248 "CK_IO40") (pinfunction "IO_L9N_T1_DQS_D13_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "48f381ef-8c43-4d69-84bd-a9a8c3bd97fa") ) (pad "R1" smd circle (at -8.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 263 "DDR3_BA0") (pinfunction "IO_L17P_T2_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "88f2b587-4bc1-47ff-bdad-02a7aef6899a") ) (pad "R2" smd circle (at -7.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 278 "DDR3_A0") (pinfunction "IO_L15N_T2_DQS_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "6f7f6259-c134-45f9-9715-126c25ac9db2") ) (pad "R3" smd circle (at -6.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 437 "DDR3_DQ15") (pinfunction "IO_L11P_T1_SRCC_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "77ebd1b6-6fa7-41ba-8851-f29f8ab19b0c") ) (pad "R4" smd circle (at -5.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "031e846e-b2e6-4099-bd82-c359e76af716") ) (pad "R5" smd circle (at -4.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 280 "DDR3_ODT") (pinfunction "IO_L19N_T3_VREF_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "50758ebc-3083-47b1-abbd-33ad3a8de262") ) (pad "R6" smd circle (at -3.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 267 "DDR3_A10") (pinfunction "IO_L19P_T3_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "e98f790f-bf9a-48e7-a629-cebad8fe9ea4") ) (pad "R7" smd circle (at -2.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 273 "DDR3_A5") (pinfunction "IO_L23P_T3_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "25d6f7a9-6b10-4f4c-9efb-681e0cdcadfe") ) (pad "R8" smd circle (at -1.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 269 "DDR3_A8") (pinfunction "IO_L24P_T3_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "ff7c3edc-1b47-48fb-8a4c-8a43546e6fc9") ) (pad "R9" smd circle (at -0.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_0") (pintype "power_in") (solder_mask_margin 0.102) (uuid "9c41f071-2f99-4695-930a-aad470fc98cf") ) (pad "R10" smd circle (at 0.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 309 "CK_IO29") (pinfunction "IO_25_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "3e920534-c1c0-4186-902b-048a9765d93c") ) (pad "R11" smd circle (at 1.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 310 "CK_IO30") (pinfunction "IO_0_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "38171faa-0656-4571-a2a1-fce72d4625c5") ) (pad "R12" smd circle (at 2.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 302 "CK_IO4") (pinfunction "IO_L5P_T0_D06_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "c877511f-9bfb-4043-a1d3-a0fc1587d044") ) (pad "R13" smd circle (at 3.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 311 "CK_IO31") (pinfunction "IO_L5N_T0_D07_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "10bbc2e3-75f3-4e3b-a416-3ed614526e31") ) (pad "R14" smd circle (at 4.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "2330046b-8f6c-4aee-ae6b-c0c8fa295c0b") ) (pad "R15" smd circle (at 5.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 312 "CK_IO32") (pinfunction "IO_L13N_T2_MRCC_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "a94442e9-2d18-43b6-bf15-da0bbd057170") ) (pad "R16" smd circle (at 6.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 242 "CK_IO34") (pinfunction "IO_L15P_T2_DQS_RDWR_B_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "546d66ab-23bc-4e5c-aad5-43e24f5426ce") ) (pad "R17" smd circle (at 7.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 239 "CK_IO12") (pinfunction "IO_L12N_T1_MRCC_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "aad46771-bb05-47e2-8f89-02064002215c") ) (pad "R18" smd circle (at 8.5 5.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 247 "CK_IO39") (pinfunction "IO_L7P_T1_D09_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "a445c916-577a-4477-b1b7-14aeac6d1a7b") ) (pad "T1" smd circle (at -8.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 275 "DDR3_A3") (pinfunction "IO_L17N_T2_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "4da29dd1-e72b-4434-b8fd-c2ceaebc3285") ) (pad "T2" smd circle (at -7.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VCCO_34") (pintype "power_in") (solder_mask_margin 0.102) (uuid "10be4270-75a7-42c8-8cb9-abec22b13192") ) (pad "T3" smd circle (at -6.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 414 "DDR3_DQ13") (pinfunction "IO_L11N_T1_SRCC_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "486e6764-890c-4547-9561-cf0896cb4e55") ) (pad "T4" smd circle (at -5.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 409 "unconnected-(U1B-IO_L12N_T1_MRCC_34-PadT4)") (pinfunction "IO_L12N_T1_MRCC_34") (pintype "bidirectional+no_connect") (solder_mask_margin 0.102) (uuid "f3a2289f-77e6-4609-a579-b4a1587ff311") ) (pad "T5" smd circle (at -4.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 419 "DDR3_DQ9") (pinfunction "IO_L12P_T1_MRCC_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "23612475-e7d2-411e-b0ba-82474a78630c") ) (pad "T6" smd circle (at -3.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 265 "DDR3_A12") (pinfunction "IO_L23N_T3_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "f656b9ba-4a9e-47e5-980f-25485c0486ea") ) (pad "T7" smd circle (at -2.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "48f96daa-b008-4d75-8cc1-a8aa14a543b9") ) (pad "T8" smd circle (at -1.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 264 "DDR3_A13") (pinfunction "IO_L24N_T3_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "096bab24-c8d0-434f-8f13-2b62de34b008") ) (pad "T9" smd circle (at -0.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 230 "LED6") (pinfunction "IO_L24P_T3_A01_D17_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "148561e5-a6bf-4d5c-9f9d-47ffb8957a02") ) (pad "T10" smd circle (at 0.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 231 "LED7") (pinfunction "IO_L24N_T3_A00_D16_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "7620683a-66af-4e9f-bb69-369afd1cbc64") ) (pad "T11" smd circle (at 1.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 301 "CK_IO3") (pinfunction "IO_L19P_T3_A10_D26_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "e41c54b9-9c97-4d15-8252-cf4fe4ddae0b") ) (pad "T12" smd circle (at 2.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 506 "+3V3") (pinfunction "VCCO_14") (pintype "power_in") (solder_mask_margin 0.102) (uuid "0d4f19dc-51c1-4b28-a2b1-ef6a8c1e3612") ) (pad "T13" smd circle (at 3.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 354 "JC4_P") (pinfunction "IO_L23P_T3_A03_D19_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "8396f65d-80a9-4611-9afc-6c0012fd1fc3") ) (pad "T14" smd circle (at 4.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 303 "CK_IO5") (pinfunction "IO_L14P_T2_SRCC_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "cb140ccb-86df-4dab-92f3-3acdaa4c5246") ) (pad "T15" smd circle (at 5.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 304 "CK_IO6") (pinfunction "IO_L14N_T2_SRCC_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "e84b1c63-6125-4d3b-b2f5-dacfb66d5135") ) (pad "T16" smd circle (at 6.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 305 "CK_IO7") (pinfunction "IO_L15N_T2_DQS_DOUT_CSO_B_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "e6cca83c-d2cf-44e7-9e6d-531f0aa3ee20") ) (pad "T17" smd circle (at 7.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "9384aa9f-3713-466b-9ac2-f1fe4b3e8f52") ) (pad "T18" smd circle (at 8.5 6.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 246 "CK_IO38") (pinfunction "IO_L7N_T1_D10_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "0ae4b6e9-8685-4ffe-a8df-eeec829cb634") ) (pad "U1" smd circle (at -8.5 7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 436 "DDR3_DM1") (pinfunction "IO_L7P_T1_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "6149847a-a65f-492c-a343-b28fa93644ac") ) (pad "U2" smd circle (at -7.5 7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 422 "DDR3_DQS1_P") (pinfunction "IO_L9P_T1_DQS_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "28d7a6f5-21ab-43db-807f-1ad6e5f68498") ) (pad "U3" smd circle (at -6.5 7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 425 "DDR3_DQ14") (pinfunction "IO_L8N_T1_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "8b61e269-9aa5-4c21-97d6-0f1056e66f93") ) (pad "U4" smd circle (at -5.5 7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 411 "DDR3_DQ10") (pinfunction "IO_L8P_T1_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "58647207-4554-4e70-ae22-8b2c741a8b4e") ) (pad "U5" smd circle (at -4.5 7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VCCO_34") (pintype "power_in") (solder_mask_margin 0.102) (uuid "a7f89bcb-13ba-4b65-8cd5-bfe4cc713c34") ) (pad "U6" smd circle (at -3.5 7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 266 "DDR3_A11") (pinfunction "IO_L22N_T3_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "3ad7fdaf-357e-4e22-afdc-764bb5ff42fc") ) (pad "U7" smd circle (at -2.5 7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 271 "DDR3_A7") (pinfunction "IO_L22P_T3_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "e229d41d-7793-4cea-ad0d-d1b3d881b56b") ) (pad "U8" smd circle (at -1.5 7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 259 "DDR3_CS") (pinfunction "IO_25_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "3358188f-9780-401f-ab05-1f1ac6305530") ) (pad "U9" smd circle (at -0.5 7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 316 "DDR3_CLK0_P") (pinfunction "IO_L21P_T3_DQS_34") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "3701a0c4-5eec-4673-a9fd-989e95183e9d") ) (pad "U10" smd circle (at 0.5 7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.102) (uuid "a0b12f41-5eba-4383-a954-e34c4c90a086") ) (pad "U11" smd circle (at 1.5 7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 306 "CK_IO26") (pinfunction "IO_L19N_T3_A09_D25_VREF_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "d4c99551-66f5-40cb-86b8-fe115f56e75c") ) (pad "U12" smd circle (at 2.5 7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 350 "JC1_P") (pinfunction "IO_L20P_T3_A08_D24_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "869b8dec-3776-4683-bceb-aebf8d1de3e8") ) (pad "U13" smd circle (at 3.5 7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 355 "JC4_N") (pinfunction "IO_L23N_T3_A02_D18_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "ba359db6-840c-4f4e-8579-495357c2f08f") ) (pad "U14" smd circle (at 4.5 7.5 180) (size 0.46 0.46) (layers "F.Cu" "F.Mask" "F.Paste") (net 352 "JC3_P") (pinfunction "IO_L22P_T3_A05_D21_14") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid 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"04a16146-36d5-4f63-b913-dc52d47cd3eb") ) (pad "D2" smd circle (at -2.4 -3.6) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VDDQ") (pintype "power_in") (solder_mask_margin 0.102) (uuid "3b866fca-578b-4aa2-b23a-2bee036652f1") ) (pad "D3" smd circle (at -1.6 -3.6) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 436 "DDR3_DM1") (pinfunction "UDM") (pintype "input") (solder_mask_margin 0.102) (uuid "5a49a4d7-592b-49e4-991a-5b176c942316") ) (pad "D7" smd circle (at 1.6 -3.6) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 441 "DDR3_DQ8") (pinfunction "DQ8") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "1e0dc5b9-50ee-4f06-a569-7bae1fd9b623") ) (pad "D8" smd circle (at 2.4 -3.6) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "VSSQ") (pintype "passive") (solder_mask_margin 0.102) (uuid "cc78991b-d685-4375-8cfc-5ac61d19176e") ) (pad "D9" smd circle (at 3.2 -3.6) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VDD") (pintype "power_in") (solder_mask_margin 0.102) (uuid "aef1fc02-abf7-4f09-a093-6526ba9493b1") ) (pad "E1" smd circle (at -3.2 -2.8) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "VSS") (pintype "passive") (solder_mask_margin 0.102) (uuid "da4f12f4-a4c4-4949-8240-db3ddc563f1f") ) (pad "E2" smd circle (at -2.4 -2.8) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "VSSQ") (pintype "passive") (solder_mask_margin 0.102) (uuid "407f7b91-89c1-43a0-a267-2169cc5e7d11") ) (pad "E3" smd circle (at -1.6 -2.8) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 424 "DDR3_DQ0") (pinfunction "DQ0") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "16dfb30c-64bb-4674-ba18-066fb5c46aa3") ) (pad "E7" smd circle (at 1.6 -2.8) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 426 "DDR3_DM0") (pinfunction "LDM") (pintype "input") (solder_mask_margin 0.102) (uuid "fef8e4bf-feb2-49d5-a3db-efa48c0e9410") ) (pad "E8" smd circle (at 2.4 -2.8) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "VSSQ") (pintype "passive") (solder_mask_margin 0.102) (uuid "c5a066b1-ce63-4de6-8347-e7501d09deb0") ) (pad "E9" smd circle (at 3.2 -2.8) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VDDQ") (pintype "power_in") (solder_mask_margin 0.102) (uuid "de5f9479-7fd8-4cb6-93e6-94ec353c5ab3") ) (pad "F1" smd circle (at -3.2 -2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VDDQ") (pintype "power_in") (solder_mask_margin 0.102) (uuid "35b831ea-70a3-4336-a094-bfdfea9cda96") ) (pad "F2" smd circle (at -2.4 -2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 445 "DDR3_DQ2") (pinfunction "DQ2") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "a1328ee2-f2bf-4f06-b0ae-b97f2cdd74cf") ) (pad "F3" smd circle (at -1.6 -2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 431 "DDR3_DQS0_P") (pinfunction "LDQS") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "267c4835-3927-490b-a20b-2916ed032241") ) (pad "F7" smd circle (at 1.6 -2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 444 "DDR3_DQ1") (pinfunction "DQ1") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "bc9f73c5-c949-48ee-8d96-9bb4acc31d11") ) (pad "F8" smd circle (at 2.4 -2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 438 "DDR3_DQ3") (pinfunction "DQ3") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "e3cf1b15-052a-41e5-a817-44eb5ac03708") ) (pad "F9" smd circle (at 3.2 -2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "VSSQ") (pintype "passive") (solder_mask_margin 0.102) (uuid "67953468-596f-4bff-9268-096e1805790e") ) (pad "G1" smd circle (at -3.2 -1.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "VSSQ") (pintype "passive") (solder_mask_margin 0.102) (uuid "effe032e-a517-4f9c-b16e-37c79c67e08f") ) (pad "G2" smd circle (at -2.4 -1.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 417 "DDR3_DQ6") (pinfunction "DQ6") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "5eb72f26-551b-4179-a4ef-99e17726d090") ) (pad "G3" smd circle (at -1.6 -1.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 432 "DDR3_DQS0_N") (pinfunction "~{LDQS}") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "8edc9351-feb5-41aa-9840-642da4d8aaac") ) (pad "G7" smd circle (at 1.6 -1.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VDD") (pintype "power_in") (solder_mask_margin 0.102) (uuid "417667fc-25c7-4a02-966d-e1f217138b96") ) (pad "G8" smd circle (at 2.4 -1.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "VSS") (pintype "passive") (solder_mask_margin 0.102) (uuid "a3916f1a-f97b-4e81-99e2-ce4c79de5759") ) (pad "G9" smd circle (at 3.2 -1.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "VSSQ") (pintype "passive") (solder_mask_margin 0.102) (uuid "97a2d431-dfb0-4c39-ae2b-cb3781e03857") ) (pad "H1" smd circle (at -3.2 -0.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 23 "DDR3VREF") (pinfunction "VREFDQ") (pintype "power_in") (solder_mask_margin 0.102) (uuid "f90e88f6-9346-4117-a7dd-1c257f952700") ) (pad "H2" smd circle (at -2.4 -0.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VDDQ") (pintype "power_in") (solder_mask_margin 0.102) (uuid "5767ac52-c0c3-4a97-8cb3-5d854e17465c") ) (pad "H3" smd circle (at -1.6 -0.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 412 "DDR3_DQ4") (pinfunction "DQ4") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "787e0cc7-73c9-44c7-9347-8ab08e1d39f2") ) (pad "H7" smd circle (at 1.6 -0.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 420 "DDR3_DQ7") (pinfunction "DQ7") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "6569a346-6bc3-4abf-98df-b283410ed820") ) (pad "H8" smd circle (at 2.4 -0.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 421 "DDR3_DQ5") (pinfunction "DQ5") (pintype "bidirectional") (solder_mask_margin 0.102) (uuid "3f9a7a92-d005-4eb5-8a1a-00f495b66809") ) (pad "H9" smd circle (at 3.2 -0.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VDDQ") (pintype "power_in") (solder_mask_margin 0.102) (uuid "19241ba1-784f-430b-868f-28c9ed828ec5") ) (pad "J1" smd circle (at -3.2 0.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (solder_mask_margin 0.102) (uuid "b61a0539-550b-4ddc-a599-be048cca3be4") ) (pad "J2" smd circle (at -2.4 0.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "VSS") (pintype "passive") (solder_mask_margin 0.102) (uuid "06169f10-a8b6-4876-95f4-a5312476e733") ) (pad "J3" smd circle (at -1.6 0.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 258 "DDR3_RAS") (pinfunction "~{RAS}") (pintype "input") (solder_mask_margin 0.102) (uuid "506fa3c7-36c1-47e0-9db6-5f465d2e739b") ) (pad "J7" smd circle (at 1.6 0.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 316 "DDR3_CLK0_P") (pinfunction "CK") (pintype "input") (solder_mask_margin 0.102) (uuid "cc68873d-76f4-43f5-8e80-c3d4e764c5d7") ) (pad "J8" smd circle (at 2.4 0.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "VSS") (pintype "passive") (solder_mask_margin 0.102) (uuid "fc2bdc4f-66f6-439a-ab0f-3872595a14f8") ) (pad "J9" smd circle (at 3.2 0.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (solder_mask_margin 0.102) (uuid "c444a909-79b7-40aa-996a-ff34d4aa11b4") ) (pad "K1" smd circle (at -3.2 1.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 280 "DDR3_ODT") (pinfunction "ODT") (pintype "input") (solder_mask_margin 0.102) (uuid "e48a17e6-5558-4273-b26f-801e8f4b9a81") ) (pad "K2" smd circle (at -2.4 1.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VDD") (pintype "power_in") (solder_mask_margin 0.102) (uuid "6234df4d-0b33-49cb-a831-428d7546921e") ) (pad "K3" smd circle (at -1.6 1.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 257 "DDR3_CAS") (pinfunction "~{CAS}") (pintype "input") (solder_mask_margin 0.102) (uuid "ce3292c1-8b38-4587-bbec-bf295bca1fe0") ) (pad "K7" smd circle (at 1.6 1.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 317 "DDR3_CLK0_N") (pinfunction "~{CK}") (pintype "input") (solder_mask_margin 0.102) (uuid "319178c3-08fe-42c8-89c3-788fb7a59c3e") ) (pad "K8" smd circle (at 2.4 1.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VDD") (pintype "power_in") (solder_mask_margin 0.102) (uuid "b8e496ce-29d4-49f3-ab84-e68a4ee5a53f") ) (pad "K9" smd circle (at 3.2 1.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 260 "DDR3_CKE0") (pinfunction "CKE") (pintype "input") (solder_mask_margin 0.102) (uuid "53c6f12c-8fa3-4fd8-be8a-f53bbe43af5f") ) (pad "L1" smd circle (at -3.2 2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (solder_mask_margin 0.102) (uuid "cd037353-9a38-4186-b732-35a7648dba76") ) (pad "L2" smd circle (at -2.4 2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 259 "DDR3_CS") (pinfunction "~{CS}") (pintype "input") (solder_mask_margin 0.102) (uuid "ccb8490d-43bf-4767-85b3-f353dc8bf54c") ) (pad "L3" smd circle (at -1.6 2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 256 "DDR3_WE") (pinfunction "~{WE}") (pintype "input") (solder_mask_margin 0.102) (uuid "bf5ba6a4-4367-4d60-9d8b-55d2e6968b93") ) (pad "L7" smd circle (at 1.6 2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 267 "DDR3_A10") (pinfunction "A10/AP") (pintype "input") (solder_mask_margin 0.102) (uuid "57e63e05-e74a-4f74-89be-b8aafd7e1834") ) (pad "L8" smd circle (at 2.4 2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 279 "Net-(U3-ZQ)") (pinfunction "ZQ") (pintype "passive") (solder_mask_margin 0.102) (uuid "c5e7ba9b-7faa-4bb5-8c76-20da270025e8") ) (pad "L9" smd circle (at 3.2 2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (solder_mask_margin 0.102) (uuid "12b2a980-12e7-4134-bac0-84aeda94fa9e") ) (pad "M1" smd circle (at -3.2 2.8) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "VSS") (pintype "passive") (solder_mask_margin 0.102) (uuid "be37ecab-b5f1-449c-9c56-3475096af455") ) (pad "M2" smd circle (at -2.4 2.8) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 263 "DDR3_BA0") (pinfunction "BA0") (pintype "input") (solder_mask_margin 0.102) (uuid "06ab8ce2-69dc-4217-bc3c-061cc6c9e478") ) (pad "M3" smd circle (at -1.6 2.8) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 261 "DDR3_BA2") (pinfunction "BA2") (pintype "input") (solder_mask_margin 0.102) (uuid "d301a6fe-4363-45f2-8382-048c0a18a6bd") ) (pad "M7" smd circle (at 1.6 2.8) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (solder_mask_margin 0.102) (uuid "022b8d93-b902-4712-9f84-9cc5999c6a05") ) (pad "M8" smd circle (at 2.4 2.8) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 23 "DDR3VREF") (pinfunction "VREFCA") (pintype "power_in") (solder_mask_margin 0.102) (uuid "5c21f50f-ee43-4207-8b92-85d69e471130") ) (pad "M9" smd circle (at 3.2 2.8) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "VSS") (pintype "passive") (solder_mask_margin 0.102) (uuid "65b0943f-938d-4665-bdd1-4565eca6632e") ) (pad "N1" smd circle (at -3.2 3.6) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VDD") (pintype "power_in") (solder_mask_margin 0.102) (uuid "4eb04a4e-e144-4450-acea-8771be658062") ) (pad "N2" smd circle (at -2.4 3.6) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 275 "DDR3_A3") (pinfunction "A3") (pintype "input") (solder_mask_margin 0.102) (uuid "92d438b0-ae91-4ab4-8c23-72b298844266") ) (pad "N3" smd circle (at -1.6 3.6) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 278 "DDR3_A0") (pinfunction "A0") (pintype "input") (solder_mask_margin 0.102) (uuid "53b9899d-0022-4552-88d4-072c2f99eb28") ) (pad "N7" smd circle (at 1.6 3.6) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 265 "DDR3_A12") (pinfunction "A12/~{BC}") (pintype "input") (solder_mask_margin 0.102) (uuid "1bdc8057-ab8e-498a-bea5-7412400e982e") ) (pad "N8" smd circle (at 2.4 3.6) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 262 "DDR3_BA1") (pinfunction "BA1") (pintype "input") (solder_mask_margin 0.102) (uuid "d09e84ff-1424-49ff-a54b-c709d9d3e47c") ) (pad "N9" smd circle (at 3.2 3.6) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VDD") (pintype "power_in") (solder_mask_margin 0.102) (uuid "6d7d9c41-5cbc-4265-bdab-f72f824b174f") ) (pad "P1" smd circle (at -3.2 4.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "VSS") (pintype "passive") (solder_mask_margin 0.102) (uuid "51aea6ff-2f8a-46e4-8113-1a078ca17438") ) (pad "P2" smd circle (at -2.4 4.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 273 "DDR3_A5") (pinfunction "A5") (pintype "input") (solder_mask_margin 0.102) (uuid "db1b7e59-351b-4b19-bb38-01e5090e0889") ) (pad "P3" smd circle (at -1.6 4.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 276 "DDR3_A2") (pinfunction "A2") (pintype "input") (solder_mask_margin 0.102) (uuid "c061a01a-6edb-4178-b74d-eba5b9e3cecf") ) (pad "P7" smd circle (at 1.6 4.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 277 "DDR3_A1") (pinfunction "A1") (pintype "input") (solder_mask_margin 0.102) (uuid "e687ff35-f800-4d4e-972b-a3ded7675311") ) (pad "P8" smd circle (at 2.4 4.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 274 "DDR3_A4") (pinfunction "A4") (pintype "input") (solder_mask_margin 0.102) (uuid "237bcfaf-124d-4e2c-9ee6-95cdfde15e28") ) (pad "P9" smd circle (at 3.2 4.4) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "VSS") (pintype "passive") (solder_mask_margin 0.102) (uuid "c560b929-c6a9-4465-8173-74a8ff4133d6") ) (pad "R1" smd circle (at -3.2 5.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VDD") (pintype "power_in") (solder_mask_margin 0.102) (uuid "72833fb8-850b-4149-b9c2-12e29507ea9e") ) (pad "R2" smd circle (at -2.4 5.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 271 "DDR3_A7") (pinfunction "A7") (pintype "input") (solder_mask_margin 0.102) (uuid "9c0fdb85-5dde-4489-b68c-1766dbbc6739") ) (pad "R3" smd circle (at -1.6 5.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 268 "DDR3_A9") (pinfunction "A9") (pintype "input") (solder_mask_margin 0.102) (uuid "de4d27dc-8491-4f14-81ee-4104ba357075") ) (pad "R7" smd circle (at 1.6 5.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 266 "DDR3_A11") (pinfunction "A11") (pintype "input") (solder_mask_margin 0.102) (uuid "c01e294c-23e5-465c-818d-c2bcbaf038f8") ) (pad "R8" smd circle (at 2.4 5.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 272 "DDR3_A6") (pinfunction "A6") (pintype "input") (solder_mask_margin 0.102) (uuid "f0b3236a-8fe5-436b-969b-380473a86260") ) (pad "R9" smd circle (at 3.2 5.2) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 21 "DDRVCC") (pinfunction "VDD") (pintype "power_in") (solder_mask_margin 0.102) (uuid "87bd1be3-4547-4801-aa51-35ea82e96243") ) (pad "T1" smd circle (at -3.2 6) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 507 "GND") (pinfunction "VSS") (pintype "passive") (solder_mask_margin 0.102) (uuid "bc51bac1-66aa-4a14-a1bf-506c5b106739") ) (pad "T2" smd circle (at -2.4 6) (size 0.35 0.35) (layers "F.Cu" "F.Mask" "F.Paste") (net 270 "DDR3_RESET") (pinfunction "~{RESET}") (pintype "input") (solder_mask_margin 0.102) (uuid 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