(kicad_pcb (version 20211014) (generator pcbnew)

  (general
    (thickness 1.6)
  )

  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )

  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0.1)
    (solder_mask_min_width 0.035)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )

  (net 0 "")
  (net 1 "CP1")
  (net 2 "CP2")
  (net 3 "Net-(C2-Pad1)")
  (net 4 "GND")
  (net 5 "VCP")
  (net 6 "V3P3OUT")
  (net 7 "Net-(C5-Pad1)")
  (net 8 "Net-(D1-Pad1)")
  (net 9 "Net-(D1-Pad3)")
  (net 10 "VMCU")
  (net 11 "IN1")
  (net 12 "Tx")
  (net 13 "IN2")
  (net 14 "Rx")
  (net 15 "IN3")
  (net 16 "EN1")
  (net 17 "IN4")
  (net 18 "EN2")
  (net 19 "unconnected-(J1-Pad11)")
  (net 20 "EN3")
  (net 21 "unconnected-(J1-Pad13)")
  (net 22 "EN4")
  (net 23 "unconnected-(J1-Pad15)")
  (net 24 "unconnected-(J1-Pad16)")
  (net 25 "unconnected-(J1-Pad17)")
  (net 26 "+5V")
  (net 27 "+3V3")
  (net 28 "Net-(J2-Pad1)")
  (net 29 "Net-(J2-Pad2)")
  (net 30 "Net-(J2-Pad3)")
  (net 31 "Net-(J2-Pad4)")
  (net 32 "unconnected-(J3-Pad1)")
  (net 33 "unconnected-(J3-Pad2)")
  (net 34 "unconnected-(J3-Pad4)")
  (net 35 "unconnected-(J3-Pad6)")
  (net 36 "Net-(J3-Pad7)")
  (net 37 "unconnected-(J3-Pad8)")
  (net 38 "12v")
  (net 39 "Net-(TP6-Pad1)")
  (net 40 "unconnected-(U2-Pad12)")
  (net 41 "unconnected-(U2-Pad13)")
  (net 42 "unconnected-(U3-Pad3)")
  (net 43 "unconnected-(U3-Pad8)")

  (footprint "TestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm" (layer "F.Cu")
    (tedit 5A0F774F) (tstamp 08dc32f3-1c81-4b3c-977b-84274a32100b)
    (at 73.275 25.25)
    (descr "THT pad as test Point, diameter 1.5mm, hole diameter 0.7mm")
    (tags "test point THT pad")
    (property "Sheetfile" "File: temalabor.kicad_sch")
    (property "Sheetname" "")
    (path "/8a03aa4e-4db9-4203-8e99-753847983aaa")
    (attr exclude_from_pos_files)
    (fp_text reference "TP9" (at 0 -1.648) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp b33e95a3-1d25-4f36-99fc-c1fa46d8bfe1)
    )
    (fp_text value "12V" (at 0 1.75) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 627e1b9a-7301-426a-b49b-905ef7eb6601)
    )
    (fp_text user "${REFERENCE}" (at 0 -1.65) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp ee790449-5a6b-4a08-aa8b-c07b9d3a1a3c)
    )
    (fp_circle (center 0 0) (end 0 0.95) (layer "F.SilkS") (width 0.12) (fill none) (tstamp 114fd4c9-9b47-4231-9f26-cfad5d6e304f))
    (fp_circle (center 0 0) (end 1.25 0) (layer "F.CrtYd") (width 0.05) (fill none) (tstamp e44eeb33-b114-458a-86ee-84daa18dbc2b))
    (pad "1" thru_hole circle (at 0 0) (size 1.5 1.5) (drill 0.7) (layers *.Cu *.Mask)
      (net 7 "Net-(C5-Pad1)") (pinfunction "1") (pintype "passive") (tstamp 58a2ec82-c2f7-42f4-aa10-6b2b59a98f90))
  )

  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE) (tstamp 1c7142d1-44b9-4844-93e2-cc809bcb9cd2)
    (at 61.4 51.7 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "File: temalabor.kicad_sch")
    (property "Sheetname" "")
    (path "/564e6f71-fe8f-4332-9cf8-b79b4f628b6e")
    (attr smd)
    (fp_text reference "R2" (at 0 -1.65 90) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp d3cf9101-35cb-4401-af0c-20b3d97c1f57)
    )
    (fp_text value "10k" (at 0 1.65 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp c939443d-ce5e-4da4-8739-e288cc09ea61)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp e8b71742-b703-4a1e-a906-537e3ed974ee)
    )
    (fp_line (start -0.227064 0.735) (end 0.227064 0.735) (layer "F.SilkS") (width 0.12) (tstamp 00f42c2b-1eee-40fa-80a2-c99e7dd3b606))
    (fp_line (start -0.227064 -0.735) (end 0.227064 -0.735) (layer "F.SilkS") (width 0.12) (tstamp 3c358142-af4b-4dc6-86b0-a26860babd95))
    (fp_line (start 1.85 -0.95) (end 1.85 0.95) (layer "F.CrtYd") (width 0.05) (tstamp 45eee663-6656-4d71-9f73-372cc40f57fe))
    (fp_line (start -1.85 0.95) (end -1.85 -0.95) (layer "F.CrtYd") (width 0.05) (tstamp eaed4e98-9b36-4c27-bc42-a51b16e25cc5))
    (fp_line (start 1.85 0.95) (end -1.85 0.95) (layer "F.CrtYd") (width 0.05) (tstamp f61e19e9-5c0f-42fc-96aa-da4b7f4b6e22))
    (fp_line (start -1.85 -0.95) (end 1.85 -0.95) (layer "F.CrtYd") (width 0.05) (tstamp fe2cbbc2-af87-4699-b89c-9286a7b0de46))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp 3fe4996b-2b02-4d54-bad3-49df8e48feb4))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 70cd26e8-9fb6-4224-b99c-de48533974bf))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp e3a0145e-8b34-4705-9950-14f367030293))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp ef59ba41-7554-4c5f-9792-07910d945d17))
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 10 "VMCU") (pintype "passive") (tstamp f8b50984-6dde-44ed-9814-9d7e03e36b06))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 12 "Tx") (pintype "passive") (tstamp c31f2ec0-d912-459d-8034-a9f5e82ff401))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "TestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm" (layer "F.Cu")
    (tedit 5A0F774F) (tstamp 1ccabd0a-0b70-4d21-8948-9c60b3ff4546)
    (at 56.2 47.5)
    (descr "THT pad as test Point, diameter 1.5mm, hole diameter 0.7mm")
    (tags "test point THT pad")
    (property "Sheetfile" "File: temalabor.kicad_sch")
    (property "Sheetname" "")
    (path "/abd810b0-e113-4f2d-8638-a0fc9d4228a4")
    (attr exclude_from_pos_files)
    (fp_text reference "TP8" (at 0 -1.648) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp b6aa16d2-d265-42c2-8442-c90d4466bcab)
    )
    (fp_text value "Tx" (at 0 1.75) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp e2e8958a-fdc0-4f9f-b14a-6cab82cf8d4e)
    )
    (fp_text user "${REFERENCE}" (at 0 -1.65) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 7448d541-5ecc-4bd2-b134-627581f1ceae)
    )
    (fp_circle (center 0 0) (end 0 0.95) (layer "F.SilkS") (width 0.12) (fill none) (tstamp 6b8cce19-41d2-4745-9465-7fa2a4166388))
    (fp_circle (center 0 0) (end 1.25 0) (layer "F.CrtYd") (width 0.05) (fill none) (tstamp 2d7fa667-fc7a-436b-bd48-18887a8e9018))
    (pad "1" thru_hole circle (at 0 0) (size 1.5 1.5) (drill 0.7) (layers *.Cu *.Mask)
      (net 12 "Tx") (pinfunction "1") (pintype "passive") (tstamp e22aefb6-e445-4694-bb02-9ca0c7de5861))
  )

  (footprint "TestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm" (layer "F.Cu")
    (tedit 5A0F774F) (tstamp 3f00ace5-3072-41b1-a96e-783c3df2a8e1)
    (at 64.1 56.025)
    (descr "THT pad as test Point, diameter 1.5mm, hole diameter 0.7mm")
    (tags "test point THT pad")
    (property "Sheetfile" "File: temalabor.kicad_sch")
    (property "Sheetname" "")
    (path "/39808134-53c7-4d1f-bd2f-c327804e6ac3")
    (attr exclude_from_pos_files)
    (fp_text reference "TP5" (at 0 -1.648) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 42d65f27-4319-450d-b80b-61a414559b79)
    )
    (fp_text value "VMCU" (at 0 1.75) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 343f476d-efe9-4768-8e25-442b15417720)
    )
    (fp_text user "${REFERENCE}" (at 0 -1.65) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 96311944-0e85-45d2-88a4-5c9f2725f52d)
    )
    (fp_circle (center 0 0) (end 0 0.95) (layer "F.SilkS") (width 0.12) (fill none) (tstamp c3248d48-1ea9-4b1b-9694-b9c4e4b0e1a5))
    (fp_circle (center 0 0) (end 1.25 0) (layer "F.CrtYd") (width 0.05) (fill none) (tstamp 1fcefb6f-b53c-4932-b50e-0ef54e825778))
    (pad "1" thru_hole circle (at 0 0) (size 1.5 1.5) (drill 0.7) (layers *.Cu *.Mask)
      (net 10 "VMCU") (pinfunction "1") (pintype "passive") (tstamp 912ac7ac-2606-4a2f-b56d-95c22db09ebe))
  )

  (footprint "TestPoint:TestPoint_THTPad_D2.0mm_Drill1.0mm" (layer "F.Cu")
    (tedit 5A0F774F) (tstamp 472cbba1-3f2a-407e-ba09-9c13780f7427)
    (at 76.575 35)
    (descr "THT pad as test Point, diameter 2.0mm, hole diameter 1.0mm")
    (tags "test point THT pad")
    (property "Sheetfile" "File: temalabor.kicad_sch")
    (property "Sheetname" "")
    (path "/0abb65c8-825e-4f1f-9e44-90663afe0085")
    (attr exclude_from_pos_files)
    (fp_text reference "TP1" (at 0 -1.998) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp b3e12276-1e58-43b5-8c44-e7f92bbf8815)
    )
    (fp_text value "GND" (at 0 2.05) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 389cee83-57c5-411d-b8fa-26a88f6d5d63)
    )
    (fp_text user "${REFERENCE}" (at 0 -2) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 2531c4ba-1d76-4688-a2d0-41295ab867c3)
    )
    (fp_circle (center 0 0) (end 0 1.2) (layer "F.SilkS") (width 0.12) (fill none) (tstamp 52416e1e-08f0-4e30-a8fa-3518bac33ebb))
    (fp_circle (center 0 0) (end 1.5 0) (layer "F.CrtYd") (width 0.05) (fill none) (tstamp 71ee06a5-fd8d-4ea4-8fda-7e224032e2b8))
    (pad "1" thru_hole circle (at 0 0) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 4 "GND") (pinfunction "1") (pintype "passive") (tstamp 8e01d579-ed0d-47cc-960f-b784545b4699))
  )

  (footprint "TestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm" (layer "F.Cu")
    (tedit 5A0F774F) (tstamp 4a1f090e-0d05-4b9b-b4c9-1af1b1399b1c)
    (at 33.575 35.25)
    (descr "THT pad as test Point, diameter 1.5mm, hole diameter 0.7mm")
    (tags "test point THT pad")
    (property "Sheetfile" "File: temalabor.kicad_sch")
    (property "Sheetname" "")
    (path "/6d6209f7-ad96-46bf-a1de-3e00e30f69b8")
    (attr exclude_from_pos_files)
    (fp_text reference "TP6" (at 0 -1.648) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 2b0a6e0f-50c6-4277-bdfc-9bc7e3ce07dc)
    )
    (fp_text value "NFAULT " (at 0 1.75) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp e3f79562-350c-49c5-be37-21af76d9efd8)
    )
    (fp_text user "${REFERENCE}" (at 0 -1.65) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp a0bff26c-382d-4af8-a3c5-dfc5c9280b79)
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    (fp_circle (center 0 0) (end 0 0.95) (layer "F.SilkS") (width 0.12) (fill none) (tstamp 77d6c7e5-1d64-4f94-9e76-a7dd6fcdb886))
    (fp_circle (center 0 0) (end 1.25 0) (layer "F.CrtYd") (width 0.05) (fill none) (tstamp b600a16b-a696-4ec4-a0cc-57d1ecead533))
    (pad "1" thru_hole circle (at 0 0) (size 1.5 1.5) (drill 0.7) (layers *.Cu *.Mask)
      (net 39 "Net-(TP6-Pad1)") (pinfunction "1") (pintype "passive") (tstamp 95dad4d4-4f71-466d-9566-22c41472280b))
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 4b584bbb-9fc4-4b02-9ffd-0b3244382b5a)
    (at 40.1875 46 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "File: temalabor.kicad_sch")
    (property "Sheetname" "")
    (path "/28c9647e-de31-4d0d-bd8e-fe9d5fcd7055")
    (attr smd)
    (fp_text reference "C2" (at 0 -1.43) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 68b3d1ad-de73-4a0c-8e64-64b1d5815017)
    )
    (fp_text value "10u" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 875410e0-9493-4ed0-9063-a61c522b0cee)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 0026c4a7-dbb6-4c87-9c14-a27587836ce5)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 14f2c63b-9d98-470f-bd1b-b1424c63f008))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp f100f5db-02c8-468a-97f2-a60e4aad2dc0))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1b281aba-a5d2-4326-ae84-293a44ea05bf))
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    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp dc644978-3697-4b73-9f57-cbf5f6efae98))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 4a6d245f-5234-41c7-9321-7e0425687dd7))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 515eb473-c219-459f-9ba7-0b7ef7b8879d))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 5a65fd4c-be28-4dd1-9e47-93a1e330d6fd))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 6491c024-1bdb-4711-ba4b-8c034f4e7000))
    (pad "1" smd roundrect (at -0.8625 0 180) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "Net-(C2-Pad1)") (pintype "passive") (tstamp 435b8cc6-9162-453a-a455-3768a0c083e0))
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    (property "Sheetfile" "File: temalabor.kicad_sch")
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  (footprint "TestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm" (layer "F.Cu")
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  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
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  (footprint "STK3700_Expansion_board:PinSocket_2x10_P2.54mm_Horizontal_Reversed" (layer "F.Cu")
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