(kicad_pcb (version 20171130) (host pcbnew 5.1.6)

  (general
    (thickness 1.6)
    (drawings 6)
    (tracks 54)
    (zones 0)
    (modules 40)
    (nets 32)
  )

  (page A4)

  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )

  (setup
    (last_trace_width 0.3)
    (trace_clearance 0.2)
    (zone_clearance 0.3)
    (zone_45_only no)
    (trace_min 0.15)
    (segment_width 0.3)
    (edge_width 0.15)
    (via_size 0.6)
    (via_drill 0.3)
    (via_min_size 0.5)
    (via_min_drill 0.2)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.5)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 2.5 2.5)
    (pad_drill 0.8)
    (pad_to_mask_clearance 0.05)
    (aux_axis_origin 0 0)
    (grid_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )

  (net 0 "")
  (net 1 "+5V")
  (net 2 "+3V3")
  (net 3 "GND")
  (net 4 "SDA")
  (net 5 "SCL")
  (net 6 "USB_DP")
  (net 7 "USB_DN")
  (net 8 "nEN")
  (net 9 "/ZERO")
  (net 10 "/REC")
  (net 11 "LED")
  (net 12 "CC1")
  (net 13 "CC2")
  (net 14 "Net-(U1-IO0)")
  (net 15 "Net-(U1-IO1)")
  (net 16 "Net-(U1-IO2)")
  (net 17 "Net-(U1-IO3)")
  (net 18 "Net-(U1-IO4)")
  (net 19 "Net-(U2-INT)")
  (net 20 "Net-(U2-AD0)")

  (net_class Default "Default net class"
    (clearance 0.2)
    (trace_width 0.3)
    (via_dia 0.6)
    (via_drill 0.3)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net "")
  )

  (net_class Power "Power nets"
    (clearance 0.3)
    (trace_width 0.5)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net "+5V")
    (add_net "+3V3")
    (add_net "GND")
  )

  ;; ============================================================
  ;; BOARD OUTLINE — 25mm x 40mm
  ;; ============================================================
  (gr_line (start 0 0) (end 25 0) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 25 0) (end 25 40) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 25 40) (end 0 40) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 0 40) (end 0 0) (layer Edge.Cuts) (width 0.1))

  ;; ============================================================
  ;; MOUNTING HOLES (optional, M2 at corners)
  ;; ============================================================
  ;; (module MountingHole:MountingHole_2.2mm (layer F.Cu) (tedit 0) (tstamp 00000000-0000-0000-0000-000064a8c000)
  ;;   (at 2 2) (descr "Mounting Hole 2.2mm") (tags "mounting hole")
  ;;   (attr virtual)
  ;;   (fp_text reference MH1 (at 0 -3) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))))
  ;;   (pad "" np_thru_hole circle (at 0 0) (size 2.2 2.2) (drill 2.2) (layers *.Cu *.Mask))
  ;; )

  ;; ============================================================
  ;; ESP32-C3-MINI-1 MODULE FOOTPRINT (16.6mm x 13.2mm, 53 pads)
  ;; Placed at center of board area
  ;; ============================================================
  (module imu_midi:ESP32-C3-MINI-1 (layer F.Cu) (tedit 64A8C100) (tstamp 64A8C200)
    (at 7.5 14)
    (descr "ESP32-C3-MINI-1 module, 53 castellated pads")
    (tags "ESP32 C3 MINI wireless")
    (attr smd)
    (fp_text reference U1 (at 0 -10) (layer F.SilkS)
      (effects (font (size 1 1) (thickness 0.15)))
    )
    (fp_text value ESP32-C3-MINI-1 (at 0 10) (layer F.Fab)
      (effects (font (size 1 1) (thickness 0.15)))
    )

    ;; Fab outline
    (fp_line (start -8.3 -6.6) (end 8.3 -6.6) (layer F.Fab) (width 0.1))
    (fp_line (start 8.3 -6.6) (end 8.3 6.6) (layer F.Fab) (width 0.1))
    (fp_line (start 8.3 6.6) (end -8.3 6.6) (layer F.Fab) (width 0.1))
    (fp_line (start -8.3 6.6) (end -8.3 -6.6) (layer F.Fab) (width 0.1))

    ;; Courtyard
    (fp_line (start -8.55 -6.85) (end 8.55 -6.85) (layer F.CrtYd) (width 0.05))
    (fp_line (start 8.55 -6.85) (end 8.55 6.85) (layer F.CrtYd) (width 0.05))
    (fp_line (start 8.55 6.85) (end -8.55 6.85) (layer F.CrtYd) (width 0.05))
    (fp_line (start -8.55 6.85) (end -8.55 -6.85) (layer F.CrtYd) (width 0.05))

    ;; LEFT SIDE PADS (1-14): pitch 0.8mm, starting from bottom
    (pad 1 smd rect (at -9.05 -5.2 180) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad 2 smd rect (at -9.05 -4.4 180) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 2))
    (pad 3 smd rect (at -9.05 -3.6 180) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 8))
    (pad 4 smd rect (at -9.05 -2.8 180) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 14))
    (pad 5 smd rect (at -9.05 -2.0 180) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 15))
    (pad 6 smd rect (at -9.05 -1.2 180) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 16))
    (pad 7 smd rect (at -9.05 -0.4 180) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 17))
    (pad 8 smd rect (at -9.05 0.4 180)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 18))
    (pad 9 smd rect (at -9.05 1.2 180)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 4))
    (pad 10 smd rect (at -9.05 2.0 180) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 5))
    (pad 11 smd rect (at -9.05 2.8 180) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 12 smd rect (at -9.05 3.6 180) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 11))
    (pad 13 smd rect (at -9.05 4.4 180) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 9))
    (pad 14 smd rect (at -9.05 5.2 180) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 10))

    ;; BOTTOM SIDE PADS (15-27): pitch varies
    (pad 15 smd rect (at -5.2 -7.35 90) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad 16 smd rect (at -3.6 -7.35 90) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 2))
    (pad 17 smd rect (at -2.0 -7.35 90) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 18 smd rect (at -0.4 -7.35 90) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 19 smd rect (at 1.2 -7.35 90)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 20 smd rect (at 2.8 -7.35 90)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 21 smd rect (at 4.4 -7.35 90)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 22 smd rect (at 5.2 -7.35 90)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 23 smd rect (at 6.0 -7.35 90)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 24 smd rect (at 6.8 -7.35 90)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad 25 smd rect (at 7.6 -7.35 90)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 2))
    (pad 26 smd rect (at 8.4 -7.35 90)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 7))
    (pad 27 smd rect (at 9.2 -7.35 90)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 6))

    ;; RIGHT SIDE PADS (28-40): pads facing right
    (pad 28 smd rect (at 9.05 6.0 0)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 29 smd rect (at 9.05 5.2 0)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 30 smd rect (at 9.05 4.4 0)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 31 smd rect (at 9.05 3.6 0)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 32 smd rect (at 9.05 2.8 0)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 33 smd rect (at 9.05 2.0 0)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 34 smd rect (at 9.05 1.2 0)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 35 smd rect (at 9.05 0.4 0)  (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 36 smd rect (at 9.05 -0.4 0) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 37 smd rect (at 9.05 -1.2 0) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 38 smd rect (at 9.05 -2.0 0) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad 39 smd rect (at 9.05 -2.8 0) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 40 smd rect (at 9.05 -3.6 0) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))

    ;; TOP SIDE PADS (41-53):
    (pad 41 smd rect (at 7.6 7.35 270) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 42 smd rect (at 6.0 7.35 270) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 43 smd rect (at 4.4 7.35 270) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 44 smd rect (at 2.8 7.35 270) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 45 smd rect (at 1.2 7.35 270) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 46 smd rect (at -0.4 7.35 270) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 47 smd rect (at -2.0 7.35 270) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 48 smd rect (at -3.6 7.35 270) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 49 smd rect (at -5.2 7.35 270) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 50 smd rect (at -6.0 7.35 270) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 51 smd rect (at -6.8 7.35 270) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 2))
    (pad 52 smd rect (at -7.6 7.35 270) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad 53 smd rect (at -8.4 7.35 270) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask) (net 0))

    ;; Keepout zone (antenna area) — no copper under top-right corner
    (fp_line (start 5.6 4.9) (end 8.3 4.9) (layer Dwgs.User) (width 0.12))
    (fp_line (start 8.3 4.9) (end 8.3 6.6) (layer Dwgs.User) (width 0.12))
    (fp_line (start 8.3 6.6) (end 5.6 6.6) (layer Dwgs.User) (width 0.12))
    (fp_line (start 5.6 6.6) (end 5.6 4.9) (layer Dwgs.User) (width 0.12))
  )

  ;; ============================================================
  ;; USB TYPE-C RECEPTACLE (HRO TYPE-C-31-M-12 or compatible)
  ;; ============================================================
  (module imu_midi:USB_C_Receptacle (layer F.Cu) (tedit 64A8C101) (tstamp 64A8C201)
    (at 5.5 3)
    (descr "USB Type-C Receptacle, mid-mount SMT")
    (tags "USB Type-C")
    (attr smd)
    (fp_text reference J1 (at 0 -6.5) (layer F.SilkS)
      (effects (font (size 1 1) (thickness 0.15)))
    )
    (fp_text value USB_Type-C (at 0 6.5) (layer F.Fab)
      (effects (font (size 1 1) (thickness 0.15)))
    )

    ;; Body outline
    (fp_line (start -4.5 -3.25) (end 4.5 -3.25) (layer F.Fab) (width 0.1))
    (fp_line (start 4.5 -3.25) (end 4.5 3.25) (layer F.Fab) (width 0.1))
    (fp_line (start 4.5 3.25) (end -4.5 3.25) (layer F.Fab) (width 0.1))
    (fp_line (start -4.5 3.25) (end -4.5 -3.25) (layer F.Fab) (width 0.1))

    ;; A-row pads (top row, 12 pads: A1-A12)
    (pad A1 smd rect (at -2.75 -2.75 90) (size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad A4 smd rect (at -2.25 -0.75 90) (size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 1))
    (pad A5 smd rect (at -1.75 -0.75 90) (size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 12))
    (pad A6 smd rect (at -1.25 -0.75 90) (size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 6))
    (pad A7 smd rect (at -0.75 -0.75 90) (size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 7))
    (pad A8 smd rect (at -0.25 -0.75 90) (size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad A9 smd rect (at 0.25 -0.75 90)  (size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 1))
    (pad A12 smd rect (at 0.75 -0.75 90) (size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 3))

    ;; B-row pads (bottom row, 12 pads: B1-B12)
    (pad B1 smd rect (at 0.75 0.75 90)  (size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad B4 smd rect (at 0.25 0.75 90)  (size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 1))
    (pad B5 smd rect (at -0.25 0.75 90) (size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 13))
    (pad B6 smd rect (at -0.75 0.75 90) (size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 6))
    (pad B7 smd rect (at -1.25 0.75 90) (size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 7))
    (pad B8 smd rect (at -1.75 0.75 90) (size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad B9 smd rect (at -2.25 0.75 90) (size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 1))
    (pad B12 smd rect (at -2.75 0.75 90)(size 0.3 1.35) (layers F.Cu F.Paste F.Mask) (net 3))

    ;; Shield/Mounting pads
    (pad SH1 smd rect (at -4.25 -3.25) (size 1.8 1.6) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad SH2 smd rect (at 4.25 -3.25) (size 1.8 1.6) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad SH3 smd rect (at -4.25 3.25) (size 1.8 1.6) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad SH4 smd rect (at 4.25 3.25) (size 1.8 1.6) (layers F.Cu F.Paste F.Mask) (net 3))

    ;; Board edge cutout for USB connector (extends beyond board edge)
    (fp_line (start -5 -4.5) (end 5 -4.5) (layer F.CrtYd) (width 0.05))
    (fp_line (start 5 -4.5) (end 5 4.5) (layer F.CrtYd) (width 0.05))
    (fp_line (start 5 4.5) (end -5 4.5) (layer F.CrtYd) (width 0.05))
    (fp_line (start -5 4.5) (end -5 -4.5) (layer F.CrtYd) (width 0.05))
  )

  ;; ============================================================
  ;; ME6211 LDO (SOT-23-5)
  ;; ============================================================
  (module imu_midi:SOT-23-5_LDO (layer F.Cu) (tedit 64A8C102) (tstamp 64A8C202)
    (at 13.5 6)
    (descr "ME6211 LDO, SOT-23-5")
    (tags "LDO SOT-23-5 ME6211")
    (attr smd)
    (fp_text reference U3 (at 0 -2.5) (layer F.SilkS)
      (effects (font (size 1 1) (thickness 0.15)))
    )
    (fp_text value ME6211C33 (at 0 2.5) (layer F.Fab)
      (effects (font (size 1 1) (thickness 0.15)))
    )

    ;; SOT-23-5 body outline
    (fp_line (start -1.5 -0.85) (end 1.5 -0.85) (layer F.Fab) (width 0.1))
    (fp_line (start 1.5 -0.85) (end 1.5 0.85) (layer F.Fab) (width 0.1))
    (fp_line (start 1.5 0.85) (end -1.5 0.85) (layer F.Fab) (width 0.1))
    (fp_line (start -1.5 0.85) (end -1.5 -0.85) (layer F.Fab) (width 0.1))

    ;; Pin 1 marker
    (fp_line (start -1.0 -0.85) (end -1.0 -0.5) (layer F.SilkS) (width 0.12))

    ;; Pads: 1=VIN, 2=GND, 3=CE, 4=NC, 5=VOUT
    (pad 1 smd rect (at -0.95 0.95 0) (size 1.0 0.6) (layers F.Cu F.Paste F.Mask) (net 1))
    (pad 2 smd rect (at -0.95 0 0)   (size 1.0 0.6) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad 3 smd rect (at -0.95 -0.95 0)(size 1.0 0.6) (layers F.Cu F.Paste F.Mask) (net 1))
    (pad 4 smd rect (at 0.95 -0.95 0) (size 1.0 0.6) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 5 smd rect (at 0.95 0.95 0)  (size 1.0 0.6) (layers F.Cu F.Paste F.Mask) (net 2))
  )

  ;; ============================================================
  ;; MPU6050 IMU Sensor (QFN-24, 4mm x 4mm)
  ;; ============================================================
  (module imu_midi:MPU6050_QFN-24 (layer F.Cu) (tedit 64A8C103) (tstamp 64A8C203)
    (at 17 31)
    (descr "MPU6050 IMU, QFN-24 4x4mm")
    (tags "MPU6050 IMU QFN")
    (attr smd)
    (fp_text reference U2 (at 0 -3.5) (layer F.SilkS)
      (effects (font (size 1 1) (thickness 0.15)))
    )
    (fp_text value MPU6050 (at 0 3.5) (layer F.Fab)
      (effects (font (size 1 1) (thickness 0.15)))
    )

    ;; QFN-24 body
    (fp_line (start -2 -2) (end 2 -2) (layer F.Fab) (width 0.1))
    (fp_line (start 2 -2) (end 2 2) (layer F.Fab) (width 0.1))
    (fp_line (start 2 2) (end -2 2) (layer F.Fab) (width 0.1))
    (fp_line (start -2 2) (end -2 -2) (layer F.Fab) (width 0.1))

    ;; Corner mark for pin 1
    (fp_line (start -1.7 -1.7) (end -1.3 -1.3) (layer F.SilkS) (width 0.12))

    ;; Center exposed pad (GND)
    (pad 21 smd rect (at 0 0) (size 2.5 2.5) (layers F.Cu F.Paste F.Mask) (net 3))

    ;; Edge pads (6 per side, 0.5mm pitch) — critical pins labeled
    ;; Left side: pads 1-6
    (pad 1 smd rect (at -2.5 -1.25 90) (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 2 smd rect (at -2.5 -0.75 90) (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 3 smd rect (at -2.5 -0.25 90) (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 4 smd rect (at -2.5 0.25 90)  (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 5 smd rect (at -2.5 0.75 90)  (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 6 smd rect (at -2.5 1.25 90)  (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 0))
    ;; Top side: pads 7-12
    (pad 7 smd rect (at -1.25 2.5 0) (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 8 smd rect (at -0.75 2.5 0) (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 2))
    (pad 9 smd rect (at -0.25 2.5 0) (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 20))
    (pad 10 smd rect (at 0.25 2.5 0) (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 11 smd rect (at 0.75 2.5 0) (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 12 smd rect (at 1.25 2.5 0) (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 19))
    ;; Right side: pads 13-18
    (pad 13 smd rect (at 2.5 1.25 90) (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 2))
    (pad 14 smd rect (at 2.5 0.75 90) (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 15 smd rect (at 2.5 0.25 90) (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 16 smd rect (at 2.5 -0.25 90)(size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 17 smd rect (at 2.5 -0.75 90)(size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 18 smd rect (at 2.5 -1.25 90)(size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 3))
    ;; Bottom side: pads 19-24
    (pad 19 smd rect (at 1.25 -2.5 0) (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad 20 smd rect (at 0.75 -2.5 0) (size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 22 smd rect (at -0.25 -2.5 0)(size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 0))
    (pad 23 smd rect (at -0.75 -2.5 0)(size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 4))
    (pad 24 smd rect (at -1.25 -2.5 0)(size 0.25 0.8) (layers F.Cu F.Paste F.Mask) (net 5))
  )

  ;; ============================================================
  ;; 0805 PASSIVES (Resistors, Capacitors, LED)
  ;; ============================================================

  ;; R1 — I2C SDA Pull-up 4.7k
  (module imu_midi:R_0805 (layer F.Cu) (tedit 64A8C104) (tstamp 64A8C204)
    (at 14 27) (attr smd)
    (fp_text reference R1 (at 0 -1.8) (layer F.SilkS) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_text value 4.7k (at 0 1.8) (layer F.Fab) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_line (start -1.0 -0.625) (end 1.0 -0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 -0.625) (end 1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 0.625) (end -1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start -1.0 0.625) (end -1.0 -0.625) (layer F.Fab) (width 0.1))
    (pad 1 smd rect (at -1.15 0 90) (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 2))
    (pad 2 smd rect (at 1.15 0 90)  (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 4))
  )

  ;; R2 — I2C SCL Pull-up 4.7k
  (module imu_midi:R_0805 (layer F.Cu) (tedit 64A8C105) (tstamp 64A8C205)
    (at 14 25) (attr smd)
    (fp_text reference R2 (at 0 -1.8) (layer F.SilkS) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_text value 4.7k (at 0 1.8) (layer F.Fab) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_line (start -1.0 -0.625) (end 1.0 -0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 -0.625) (end 1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 0.625) (end -1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start -1.0 0.625) (end -1.0 -0.625) (layer F.Fab) (width 0.1))
    (pad 1 smd rect (at -1.15 0 90) (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 2))
    (pad 2 smd rect (at 1.15 0 90)  (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 5))
  )

  ;; R3 — LED current limit 1k
  (module imu_midi:R_0805 (layer F.Cu) (tedit 64A8C106) (tstamp 64A8C206)
    (at 14 35) (attr smd)
    (fp_text reference R3 (at 0 -1.8) (layer F.SilkS) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_text value 1k (at 0 1.8) (layer F.Fab) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_line (start -1.0 -0.625) (end 1.0 -0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 -0.625) (end 1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 0.625) (end -1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start -1.0 0.625) (end -1.0 -0.625) (layer F.Fab) (width 0.1))
    (pad 1 smd rect (at -1.15 0 90) (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 11))
    (pad 2 smd rect (at 1.15 0 90)  (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 0))
  )

  ;; R4 — EN pull-up 10k
  (module imu_midi:R_0805 (layer F.Cu) (tedit 64A8C107) (tstamp 64A8C207)
    (at 3 25) (attr smd)
    (fp_text reference R4 (at 0 -1.8) (layer F.SilkS) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_text value 10k (at 0 1.8) (layer F.Fab) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_line (start -1.0 -0.625) (end 1.0 -0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 -0.625) (end 1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 0.625) (end -1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start -1.0 0.625) (end -1.0 -0.625) (layer F.Fab) (width 0.1))
    (pad 1 smd rect (at -1.15 0 90) (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 2))
    (pad 2 smd rect (at 1.15 0 90)  (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 8))
  )

  ;; R5 — CC1 pull-down 5.1k
  (module imu_midi:R_0805 (layer F.Cu) (tedit 64A8C108) (tstamp 64A8C208)
    (at 12 6.5) (attr smd)
    (fp_text reference R5 (at 0 -1.8) (layer F.SilkS) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_text value 5.1k (at 0 1.8) (layer F.Fab) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_line (start -1.0 -0.625) (end 1.0 -0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 -0.625) (end 1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 0.625) (end -1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start -1.0 0.625) (end -1.0 -0.625) (layer F.Fab) (width 0.1))
    (pad 1 smd rect (at -1.15 0 90) (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 12))
    (pad 2 smd rect (at 1.15 0 90)  (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 3))
  )

  ;; R6 — CC2 pull-down 5.1k
  (module imu_midi:R_0805 (layer F.Cu) (tedit 64A8C109) (tstamp 64A8C209)
    (at 12 4.5) (attr smd)
    (fp_text reference R6 (at 0 -1.8) (layer F.SilkS) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_text value 5.1k (at 0 1.8) (layer F.Fab) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_line (start -1.0 -0.625) (end 1.0 -0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 -0.625) (end 1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 0.625) (end -1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start -1.0 0.625) (end -1.0 -0.625) (layer F.Fab) (width 0.1))
    (pad 1 smd rect (at -1.15 0 90) (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 13))
    (pad 2 smd rect (at 1.15 0 90)  (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 3))
  )

  ;; C1 — LDO input 10uF
  (module imu_midi:C_0805 (layer F.Cu) (tedit 64A8C110) (tstamp 64A8C210)
    (at 15.5 6) (attr smd)
    (fp_text reference C1 (at 0 -1.8) (layer F.SilkS) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_text value 10uF (at 0 1.8) (layer F.Fab) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_line (start -1.0 -0.625) (end 1.0 -0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 -0.625) (end 1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 0.625) (end -1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start -1.0 0.625) (end -1.0 -0.625) (layer F.Fab) (width 0.1))
    (pad 1 smd rect (at -1.15 0 90) (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 1))
    (pad 2 smd rect (at 1.15 0 90)  (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 3))
  )

  ;; C2 — LDO output 10uF
  (module imu_midi:C_0805 (layer F.Cu) (tedit 64A8C111) (tstamp 64A8C211)
    (at 15 8) (attr smd)
    (fp_text reference C2 (at 0 -1.8) (layer F.SilkS) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_text value 10uF (at 0 1.8) (layer F.Fab) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_line (start -1.0 -0.625) (end 1.0 -0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 -0.625) (end 1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 0.625) (end -1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start -1.0 0.625) (end -1.0 -0.625) (layer F.Fab) (width 0.1))
    (pad 1 smd rect (at -1.15 0 90) (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 2))
    (pad 2 smd rect (at 1.15 0 90)  (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 3))
  )

  ;; C3 — LDO output bypass 0.1uF
  (module imu_midi:C_0805 (layer F.Cu) (tedit 64A8C112) (tstamp 64A8C212)
    (at 16.5 8) (attr smd)
    (fp_text reference C3 (at 0 -1.8) (layer F.SilkS) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_text value 0.1uF (at 0 1.8) (layer F.Fab) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_line (start -1.0 -0.625) (end 1.0 -0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 -0.625) (end 1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 0.625) (end -1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start -1.0 0.625) (end -1.0 -0.625) (layer F.Fab) (width 0.1))
    (pad 1 smd rect (at -1.15 0 90) (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 2))
    (pad 2 smd rect (at 1.15 0 90)  (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 3))
  )

  ;; C4 — ESP32 decoupling 0.1uF
  (module imu_midi:C_0805 (layer F.Cu) (tedit 64A8C113) (tstamp 64A8C213)
    (at 4 27) (attr smd)
    (fp_text reference C4 (at 0 -1.8) (layer F.SilkS) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_text value 0.1uF (at 0 1.8) (layer F.Fab) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_line (start -1.0 -0.625) (end 1.0 -0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 -0.625) (end 1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 0.625) (end -1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start -1.0 0.625) (end -1.0 -0.625) (layer F.Fab) (width 0.1))
    (pad 1 smd rect (at -1.15 0 90) (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 2))
    (pad 2 smd rect (at 1.15 0 90)  (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 3))
  )

  ;; C5 — ESP32 decoupling 10uF
  (module imu_midi:C_0805 (layer F.Cu) (tedit 64A8C114) (tstamp 64A8C214)
    (at 6 27) (attr smd)
    (fp_text reference C5 (at 0 -1.8) (layer F.SilkS) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_text value 10uF (at 0 1.8) (layer F.Fab) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_line (start -1.0 -0.625) (end 1.0 -0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 -0.625) (end 1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 0.625) (end -1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start -1.0 0.625) (end -1.0 -0.625) (layer F.Fab) (width 0.1))
    (pad 1 smd rect (at -1.15 0 90) (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 2))
    (pad 2 smd rect (at 1.15 0 90)  (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 3))
  )

  ;; C6 — EN capacitor 1uF
  (module imu_midi:C_0805 (layer F.Cu) (tedit 64A8C115) (tstamp 64A8C215)
    (at 3 22) (attr smd)
    (fp_text reference C6 (at 0 -1.8) (layer F.SilkS) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_text value 1uF (at 0 1.8) (layer F.Fab) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_line (start -1.0 -0.625) (end 1.0 -0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 -0.625) (end 1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 0.625) (end -1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start -1.0 0.625) (end -1.0 -0.625) (layer F.Fab) (width 0.1))
    (pad 1 smd rect (at -1.15 0 90) (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 8))
    (pad 2 smd rect (at 1.15 0 90)  (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 3))
  )

  ;; D1 — LED 0805
  (module imu_midi:LED_0805 (layer F.Cu) (tedit 64A8C116) (tstamp 64A8C216)
    (at 16 35) (attr smd)
    (fp_text reference D1 (at 0 -1.8) (layer F.SilkS) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_text value LED (at 0 1.8) (layer F.Fab) (effects (font (size 0.8 0.8) (thickness 0.12))))
    (fp_line (start -1.0 -0.625) (end 1.0 -0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 -0.625) (end 1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start 1.0 0.625) (end -1.0 0.625) (layer F.Fab) (width 0.1))
    (fp_line (start -1.0 0.625) (end -1.0 -0.625) (layer F.Fab) (width 0.1))
    ;; Cathode marking
    (fp_line (start 0.4 0.625) (end 0.4 0.3) (layer F.SilkS) (width 0.12))
    (fp_line (start -0.4 0.625) (end -0.4 0.3) (layer F.SilkS) (width 0.12))
    (pad 1 smd rect (at -1.15 0 90) (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 11))
    (pad 2 smd rect (at 1.15 0 90)  (size 0.5 1.2) (layers F.Cu F.Paste F.Mask) (net 3))
  )

  ;; ============================================================
  ;; TACTILE SWITCHES 6x6mm
  ;; ============================================================

  ;; SW1 — Zero button
  (module imu_midi:SW_6x6mm (layer F.Cu) (tedit 64A8C117) (tstamp 64A8C217)
    (at 6 36.5)
    (descr "Tactile switch 6x6mm, SPST")
    (tags "tactile switch button")
    (attr smd)
    (fp_text reference SW1 (at 0 -5) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))))
    (fp_text value ZERO (at 0 5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))))
    (fp_line (start -3.5 -3.1) (end 3.5 -3.1) (layer F.Fab) (width 0.1))
    (fp_line (start 3.5 -3.1) (end 3.5 3.1) (layer F.Fab) (width 0.1))
    (fp_line (start 3.5 3.1) (end -3.5 3.1) (layer F.Fab) (width 0.1))
    (fp_line (start -3.5 3.1) (end -3.5 -3.1) (layer F.Fab) (width 0.1))
    (fp_line (start -3 -3.1) (end 3 -3.1) (layer F.SilkS) (width 0.12))
    (fp_line (start 3 -3.1) (end 3 3.1) (layer F.SilkS) (width 0.12))
    (fp_line (start 3 3.1) (end -3 3.1) (layer F.SilkS) (width 0.12))
    (fp_line (start -3 3.1) (end -3 -3.1) (layer F.SilkS) (width 0.12))
    (pad 1 smd rect (at -3.25 -2.25 0) (size 1.2 1.5) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad 2 smd rect (at 3.25 -2.25 0)  (size 1.2 1.5) (layers F.Cu F.Paste F.Mask) (net 9))
    (pad 3 smd rect (at -3.25 2.25 0)  (size 1.2 1.5) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad 4 smd rect (at 3.25 2.25 0)   (size 1.2 1.5) (layers F.Cu F.Paste F.Mask) (net 9))
  )

  ;; SW2 — Record button
  (module imu_midi:SW_6x6mm (layer F.Cu) (tedit 64A8C118) (tstamp 64A8C218)
    (at 17 36.5)
    (descr "Tactile switch 6x6mm, SPST")
    (tags "tactile switch button")
    (attr smd)
    (fp_text reference SW2 (at 0 -5) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))))
    (fp_text value REC (at 0 5) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))))
    (fp_line (start -3.5 -3.1) (end 3.5 -3.1) (layer F.Fab) (width 0.1))
    (fp_line (start 3.5 -3.1) (end 3.5 3.1) (layer F.Fab) (width 0.1))
    (fp_line (start 3.5 3.1) (end -3.5 3.1) (layer F.Fab) (width 0.1))
    (fp_line (start -3.5 3.1) (end -3.5 -3.1) (layer F.Fab) (width 0.1))
    (fp_line (start -3 -3.1) (end 3 -3.1) (layer F.SilkS) (width 0.12))
    (fp_line (start 3 -3.1) (end 3 3.1) (layer F.SilkS) (width 0.12))
    (fp_line (start 3 3.1) (end -3 3.1) (layer F.SilkS) (width 0.12))
    (fp_line (start -3 3.1) (end -3 -3.1) (layer F.SilkS) (width 0.12))
    (pad 1 smd rect (at -3.25 -2.25 0) (size 1.2 1.5) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad 2 smd rect (at 3.25 -2.25 0)  (size 1.2 1.5) (layers F.Cu F.Paste F.Mask) (net 10))
    (pad 3 smd rect (at -3.25 2.25 0)  (size 1.2 1.5) (layers F.Cu F.Paste F.Mask) (net 3))
    (pad 4 smd rect (at 3.25 2.25 0)   (size 1.2 1.5) (layers F.Cu F.Paste F.Mask) (net 10))
  )

  ;; ============================================================
  ;; COPPER TRACKS — Minimum 0.3mm width
  ;; Key traces: power, I2C, USB, buttons, LED
  ;; ============================================================

  ;; +5V power trace: USB J1.VBUS → LDO U3.VIN → C1
  (segment (start 3.0 2.25) (end 13.5 2.25) (width 0.5) (layer F.Cu) (net 1))
  (segment (start 13.5 2.25) (end 13.5 6.95) (width 0.5) (layer F.Cu) (net 1))
  (segment (start 13.5 6.95) (end 15.5 6.95) (width 0.5) (layer F.Cu) (net 1))

  ;; +3V3 power rail: LDO U3.VOUT → main distribution
  (segment (start 14.45 6.95) (end 14.45 8.0) (width 0.5) (layer F.Cu) (net 2))
  (segment (start 14.45 8.0) (end 14.0 8.0) (width 0.5) (layer F.Cu) (net 2))
  (segment (start 14.45 8.0) (end 16.5 8.0) (width 0.5) (layer F.Cu) (net 2))

  ;; +3V3 to ESP32 VDD pads
  (segment (start 1.15 14.0) (end 1.15 20.0) (width 0.5) (layer F.Cu) (net 2))
  (segment (start 0.35 20.0) (end 0.35 14.0) (width 0.5) (layer F.Cu) (net 2))
  (segment (start 1.15 14.0) (end -0.35 14.0) (width 0.5) (layer F.Cu) (net 2))

  ;; +3V3 to I2C pull-ups (R1, R2)
  (segment (start 1.15 20.0) (end 1.15 27.0) (width 0.3) (layer F.Cu) (net 2))
  (segment (start 1.15 27.0) (end 12.85 27.0) (width 0.3) (layer F.Cu) (net 2))
  (segment (start 12.85 27.0) (end 12.85 25.0) (width 0.3) (layer F.Cu) (net 2))

  ;; +3V3 to EN pull-up (R4)
  (segment (start 1.15 27.0) (end 1.15 25.0) (width 0.3) (layer F.Cu) (net 2))
  (segment (start 1.15 25.0) (end 1.85 25.0) (width 0.3) (layer F.Cu) (net 2))

  ;; +3V3 to ESP32 top VDD (pad 51)
  (segment (start 1.15 20.0) (end 1.15 21.35) (width 0.3) (layer F.Cu) (net 2))
  (segment (start 1.15 21.35) (end 0.7 21.35) (width 0.3) (layer F.Cu) (net 2))

  ;; +3V3 to MPU6050 VDD
  (segment (start 12.85 27.0) (end 12.85 32.25) (width 0.3) (layer F.Cu) (net 2))
  (segment (start 12.85 32.25) (end 14.5 32.25) (width 0.3) (layer F.Cu) (net 2))

  ;; SDA net: ESP32.IO5 → MPU6050.SDA → R1 pull-up
  (segment (start -1.55 15.2) (end -1.55 28.5) (width 0.3) (layer F.Cu) (net 4))
  (segment (start -1.55 28.5) (end 12.85 28.5) (width 0.3) (layer F.Cu) (net 4))
  (segment (start 12.85 28.5) (end 12.85 28.15) (width 0.3) (layer F.Cu) (net 4))
  (segment (start 12.85 28.5) (end 16.25 28.5) (width 0.3) (layer F.Cu) (net 4))

  ;; SCL net: ESP32.IO6 → MPU6050.SCL → R2 pull-up
  (segment (start -1.55 16.0) (end -1.55 26.0) (width 0.3) (layer F.Cu) (net 5))
  (segment (start -1.55 26.0) (end 12.85 26.0) (width 0.3) (layer F.Cu) (net 5))
  (segment (start 12.85 26.0) (end 12.85 26.15) (width 0.3) (layer F.Cu) (net 5))
  (segment (start 12.85 26.0) (end 16.25 26.0) (width 0.3) (layer F.Cu) (net 5))

  ;; LED net: ESP32.IO8 → R3
  (segment (start 16.55 17.6) (end 16.55 35.0) (width 0.3) (layer F.Cu) (net 11))
  (segment (start 16.55 35.0) (end 12.85 35.0) (width 0.3) (layer F.Cu) (net 11))

  ;; LED: R3 → D1
  (segment (start 15.15 35.0) (end 14.85 35.0) (width 0.3) (layer F.Cu) (net 11))

  ;; /ZERO: ESP32.IO9 → SW1
  (segment (start 16.55 18.4) (end 16.55 38.0) (width 0.3) (layer F.Cu) (net 9))
  (segment (start 16.55 38.0) (end 9.25 38.0) (width 0.3) (layer F.Cu) (net 9))

  ;; /REC: ESP32.IO10 → SW2
  (segment (start 16.55 19.2) (end 16.55 38.0) (width 0.3) (layer F.Cu) (net 10))
  (segment (start 16.55 38.0) (end 20.25 38.0) (width 0.3) (layer F.Cu) (net 10))

  ;; EN net: ESP32.EN → R4 → C6
  (segment (start -1.55 10.4) (end -1.55 25.0) (width 0.3) (layer F.Cu) (net 8))
  (segment (start -1.55 25.0) (end 4.15 25.0) (width 0.3) (layer F.Cu) (net 8))
  (segment (start -1.55 25.0) (end -1.55 22.0) (width 0.3) (layer F.Cu) (net 8))
  (segment (start -1.55 22.0) (end 1.85 22.0) (width 0.3) (layer F.Cu) (net 8))

  ;; USB D+: J1.D+ → ESP32.IO19
  (segment (start 4.25 2.25) (end 4.25 7.0) (width 0.3) (layer F.Cu) (net 6))
  (segment (start 4.25 7.0) (end 16.95 7.0) (width 0.3) (layer F.Cu) (net 6))
  (segment (start 16.95 7.0) (end 16.95 7.25) (width 0.3) (layer F.Cu) (net 6))

  ;; USB D-: J1.D- → ESP32.IO18
  (segment (start 4.75 2.25) (end 4.75 6.5) (width 0.3) (layer F.Cu) (net 7))
  (segment (start 4.75 6.5) (end 15.95 6.5) (width 0.3) (layer F.Cu) (net 7))
  (segment (start 15.95 6.5) (end 15.95 6.65) (width 0.3) (layer F.Cu) (net 7))

  ;; CC1: J1.CC1 → R5
  (segment (start 3.75 2.25) (end 3.75 6.5) (width 0.3) (layer F.Cu) (net 12))
  (segment (start 3.75 6.5) (end 10.85 6.5) (width 0.3) (layer F.Cu) (net 12))

  ;; CC2: J1.CC2 → R6
  (segment (start 5.25 3.25) (end 5.25 4.5) (width 0.3) (layer F.Cu) (net 13))
  (segment (start 5.25 4.5) (end 10.85 4.5) (width 0.3) (layer F.Cu) (net 13))

  ;; ============================================================
  ;; COPPER ZONES — GND pours on both layers
  ;; ============================================================

  ;; Top layer GND pour
  (zone (net 3) (net_name GND) (layer F.Cu) (tstamp 64A8C300)
    (hatch edge 0.5)
    (connect_pads yes (clearance 0.3))
    (min_thickness 0.25)
    (fill yes (arc_segments 16) (thermal_gap 0.5) (thermal_bridge_width 0.5))
    (polygon
      (pts
        (xy 0.5 0.5)
        (xy 24.5 0.5)
        (xy 24.5 39.5)
        (xy 0.5 39.5)
      )
    )
  )

  ;; Bottom layer GND pour
  (zone (net 3) (net_name GND) (layer B.Cu) (tstamp 64A8C301)
    (hatch edge 0.5)
    (connect_pads yes (clearance 0.3))
    (min_thickness 0.25)
    (fill yes (arc_segments 16) (thermal_gap 0.5) (thermal_bridge_width 0.5))
    (polygon
      (pts
        (xy 0.5 0.5)
        (xy 24.5 0.5)
        (xy 24.5 39.5)
        (xy 0.5 39.5)
      )
    )
  )

  ;; ============================================================
  ;; SILKSCREEN — Board info
  ;; ============================================================
  (gr_text "IMU MIDI Controller v1.0" (at 12.5 38.5) (layer F.SilkS)
    (effects (font (size 1.5 1.5) (thickness 0.2)))
  )
  (gr_text "ESP32-C3-MINI-1 + MPU6050" (at 12.5 37) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (gr_text "2026-07-12" (at 22 1.5) (layer F.SilkS)
    (effects (font (size 0.8 0.8) (thickness 0.12)))
  )

)