provider_name,provider_id,provided_name,provided_id,share_provided,year,source
ACM Research,P313,Etch and clean tools,N55,2.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ACM Research,P313,Wet etching and cleaning tools,N49,9.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ACM Research,P313,ECP tools (adv. pkg.),N113,2.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ACM Research,P313,Electrochemical plating tools,N45,7.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ACM Research,P313,Deposition tools (adv. pkg.),N128,1.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AMEC,P123,Insulator etching tools,N51,12.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AMEC,P123,Dry etching and cleaning tools,N48,6.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AMEC,P123,Conductor etching tools,N50,1.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AMEC,P123,Fabrication tools (for advanced packaging),N109,1.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AMEC,P123,Etch and clean tools,N55,4.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AMEC,P123,Dry etch tools,N103,6.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AMEC,P123,Dry etching tools (adv. pkg.),N101,14.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AMEC,P123,Etch and clean tools (adv. pkg.),N129,8.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AMEC,P123,Low-pressure CVD tools,N39,2.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AP Systems,P120,Rapid thermal processing tools,N43,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM International,P112,Atomic layer deposition tools,N41,54.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM International,P112,Tube-based diffusion and deposition tools,N44,7.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM International,P112,Other deposition tools (non-IC),N138,6.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM International,P112,Plasma CVD tools,N38,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM International,P112,CVD tools (adv. pkg.),N110,2.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM International,P112,Chemical vapor deposition tools,N47,3.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM International,P112,High-temperature CVD tools,N40,18.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM International,P112,Deposition tools,N36,10.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Die attaching tools for non-IC,N132,36.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,PVD tools (adv. pkg.),N111,2.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Fabrication tools (for advanced packaging),N109,1.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Wafer level stud bonders,N137,67.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Auto ball bonders for non-IC,N135,49.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Assembly inspection tools,N70,16.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Wire bonding tools,N74,21.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Auto ball bonders for IC,N134,7.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Other interconnect tools,N75,8.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Packaging tools,N76,3.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Bonding tools,N72,19.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Die attaching tools for IC,N131,16.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Dicing tools,N71,2.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Handlers and probers,N83,1.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Integrated assembly tools,N77,100.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Deposition tools (adv. pkg.),N128,2.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Automatic wedge bonders,N136,24.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,Die attaching tools,N73,20.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASM Pacific,P145,ECP tools (adv. pkg.),N113,4.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASML,P88,KrF (DUV) lithography tools,N105,66.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASML,P88,EUV lithography tools,N20,100.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASML,P88,Overlay metrology tools,N114,47.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASML,P88,Process control tools,N60,5.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASML,P88,ArF immersion (DUV) lithography tools,N22,99.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASML,P88,i-line lithography tools,N106,31.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASML,P88,Lithography tools,N19,81.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASML,P88,E-beam metrology tools,N115,35.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASML,P88,ArF dry (DUV) lithography tools,N21,94.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ASTI,P146,Assembly inspection tools,N70,5.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AUT,P80,Wafer bonding and aligning tools,N10,47.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AUT,P80,Wet etching and cleaning tools,N49,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AUT,P80,Lithography tools,N19,1.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AUT,P80,Mask aligners,N123,7.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AUT,P80,Imprint lithography,N107,90.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AUT,P80,Etch and clean tools,N55,0.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AUT,P80,Fabrication tools (for advanced packaging),N109,5.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AUT,P80,Mask exposure systems - e-beam,N29,46.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AccoTEST,P182,SoC test tools,N80,2.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
AccoTEST,P182,Test tools,N120,1.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Accretech,P60,Dicing tools,N71,8.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Accretech,P60,Crystal machining tools,N9,24.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Accretech,P60,Handlers and probers,N83,17.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Advantest,P175,Memory test tools,N79,63.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Advantest,P175,Test tools,N120,62.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Advantest,P175,SoC test tools,N80,65.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Advantest,P175,Handlers and probers,N83,3.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Advantest,P175,Burn-in test tools,N81,2.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Aehr Test Systems,P314,Burn-in test tools,N81,9.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Aixtron,P405,Other deposition tools (non-IC),N138,22.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Aixtron,P405,Deposition tools,N36,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Low-pressure CVD tools,N39,18.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Plasma CVD tools,N38,49.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Atomic layer deposition tools,N41,3.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,E-beam metrology tools,N115,45.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Etch and clean tools (adv. pkg.),N129,9.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Rapid thermal processing tools,N43,72.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Dry etch tools,N103,17.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Mask exposure systems - laser beam,N30,27.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Ion implanters,N17,62.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,PVD tools (adv. pkg.),N111,72.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Physical vapor deposition tools,N42,82.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Critical dimensions metrology tools,N66,27.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Fabrication tools (for advanced packaging),N109,25.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Chemical vapor deposition tools,N47,47.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Deposition tools (adv. pkg.),N128,43.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,CMP tools (adv. pkg.),N124,71.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,High-temperature CVD tools,N40,73.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Defect review stations,N116,72.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Deposition tools,N36,41.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Dry etching tools (adv. pkg.),N101,15.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Plasma modification tools,N104,87.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,CMP tools,N86,48.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Conductor etching tools,N50,30.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,CVD tools (adv. pkg.),N110,50.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Dry etching and cleaning tools,N48,16.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Lithography tools (adv. pkg.),N127,9.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Defect inspection tools,N67,4.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,ECP tools (adv. pkg.),N113,11.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Process control tools,N60,11.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Etch and clean tools,N55,12.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Applied Materials,P81,Direct write systems (adv. pkg.),N130,100.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Axcelis,P84,Ion implanters,N17,22.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
BLR,P134,Die attaching tools,N73,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
BLR,P134,Automatic wedge bonders,N136,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
BLR,P134,Wire bonding tools,N74,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
BLR,P134,Bonding tools,N72,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
BLR,P134,Die attaching tools for IC,N131,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
BLR,P134,Process control tools,N60,0.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
BLR,P134,Photomask inspection and repair tools,N62,0.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
BLR,P134,Dicing tools,N71,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
BLR,P134,Manual wire bonders,N133,6.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Besi,P156,Packaging tools,N76,16.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Besi,P156,Die attaching tools for non-IC,N132,35.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Besi,P156,Bonding tools,N72,18.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Besi,P156,Die attaching tools,N73,28.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Besi,P156,Die attaching tools for IC,N131,26.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Bruker,P135,"Film, stack, and shape metrology tools",N65,4.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CAMTEK,P141,Process control tools,N60,1.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CAMTEK,P141,Inspection tools (adv. pkg.),N63,14.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CAMTEK,P141,Fabrication tools (for advanced packaging),N109,2.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CAMTEK,P141,Defect inspection tools,N67,3.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CETC,P85,Other deposition tools (non-IC),N138,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CETC,P85,Ion implanters,N17,3.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHE,P79,Deposition tools,N36,0.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHE,P79,Deposition tools (adv. pkg.),N128,0.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHE,P79,Physical vapor deposition tools,N42,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHE,P79,Other deposition tools (non-IC),N138,8.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHE,P79,PVD tools (adv. pkg.),N111,1.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHE,P79,Fabrication tools (for advanced packaging),N109,0.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,SoC test tools,N80,7.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Test tools,N120,6.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Insulator etching tools,N51,13.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Atomic layer deposition tools,N41,2.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Dry etching and cleaning tools,N48,12.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Conductor etching tools,N50,9.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Fabrication tools (for advanced packaging),N109,5.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Deposition tools,N36,9.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Etch and clean tools,N55,10.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Dry etch tools,N103,12.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Dry etching tools (adv. pkg.),N101,21.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Chemical vapor deposition tools,N47,8.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Etch and clean tools (adv. pkg.),N129,13.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Low-pressure CVD tools,N39,5.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Other deposition tools (non-IC),N138,29.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,CMP tools,N86,12.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Plasma CVD tools,N38,10.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Ion implanters,N17,3.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Bonding tools,N72,3.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Packaging tools,N76,2.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Die attaching tools for IC,N131,0.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Die attaching tools,N73,2.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Automatic wedge bonders,N136,0.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Other interconnect tools,N75,15.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Wire bonding tools,N74,0.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Process control tools,N60,0.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,E-beam metrology tools,N115,0.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Critical dimensions metrology tools,N66,0.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Handlers and probers,N83,6.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Burn-in test tools,N81,8.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Die attaching tools for non-IC,N132,13.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Wet etching and cleaning tools,N49,3.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,CMP tools (adv. pkg.),N124,13.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Auto ball bonders for IC,N134,0.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Resist processing tools (adv. pkg.),N122,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Resist processing tools,N32,0.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Lithography tools,N19,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Lithography tools (adv. pkg.),N127,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Rapid thermal processing tools,N43,3.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Dry stripping tools,N53,31.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Tube-based diffusion and deposition tools,N44,14.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,PVD tools (adv. pkg.),N111,7.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Deposition tools (adv. pkg.),N128,5.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Misc. dry etch tools,N54,61.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,CVD tools (adv. pkg.),N110,14.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Physical vapor deposition tools,N42,14.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,High-temperature CVD tools,N40,4.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,"Film, stack, and shape metrology tools",N65,2.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Defect inspection tools,N67,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,i-line lithography tools,N106,4.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Dicing tools,N71,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Canon,P159,Lithography tools,N19,3.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Canon,P159,i-line lithography tools,N106,53.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Canon,P159,KrF (DUV) lithography tools,N105,31.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Canon,P159,Other deposition tools (non-IC),N138,3.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Canon,P159,Die attaching tools for non-IC,N132,2.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Canon,P159,Die attaching tools for IC,N131,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Canon,P159,Die attaching tools,N73,1.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Canon,P159,Bonding tools,N72,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Chroma ATE,P317,Burn-in test tools,N81,4.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Chroma ATE,P317,Handlers and probers,N83,2.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Chroma ATE,P317,Test tools,N120,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Chroma ATE,P317,SoC test tools,N80,1.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Cohu,P148,Assembly inspection tools,N70,4.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Cohu,P148,Handlers and probers,N83,4.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Other deposition tools (non-IC),N138,22.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Deposition tools,N36,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Manual wire bonders,N133,92.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Auto ball bonders for IC,N134,0.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Automatic wedge bonders,N136,14.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Bonding tools,N72,1.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Wire bonding tools,N74,5.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Lithography tools,N19,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Mask exposure systems - laser beam,N30,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Other interconnect tools,N75,2.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Die attaching tools for IC,N131,0.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Handlers and probers,N83,0.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Assembly inspection tools,N70,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Die attaching tools,N73,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Fabrication tools (for advanced packaging),N109,2.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Deposition tools (adv. pkg.),N128,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,PVD tools (adv. pkg.),N111,0.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Wafer bonding and aligning tools,N10,20.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Wet etching and cleaning tools,N49,1.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Etch and clean tools,N55,0.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Resist processing tools,N32,0.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Mask aligners,N123,82.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Resist processing tools (adv. pkg.),N122,1.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Lithography tools (adv. pkg.),N127,1.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Direct write systems,N108,32.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Process control tools,N60,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DEU,P32,Photomask inspection and repair tools,N62,10.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DI,P178,Test tools,N120,2.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
DI,P178,Burn-in test tools,N81,53.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Daifuku,P71,Wafer handlers,N11,49.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Daifuku,P71,Photomask handlers,N12,7.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Daifuku,P71,Wafer and photomask handlers,N59,47.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Disco,P62,Dicing tools,N71,87.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Disco,P62,Crystal machining tools,N9,68.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
E&R Engineering,P396,Other interconnect tools,N75,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
EBARA,P128,CMP tools,N86,36.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
EBARA,P128,Fabrication tools (for advanced packaging),N109,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
EBARA,P128,ECP tools (adv. pkg.),N113,2.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
EBARA,P128,Deposition tools (adv. pkg.),N128,1.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
EBARA,P128,CMP tools (adv. pkg.),N124,14.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ELES Semiconductor Equipment,P318,Burn-in test tools,N81,2.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
EO Technics,P319,Packaging tools,N76,6.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
EV Group,P67,Wafer bonding and aligning tools,N10,47.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
EV Group,P67,Mask aligners,N123,7.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
EV Group,P67,Imprint lithography,N107,90.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
EV Group,P67,Fabrication tools (for advanced packaging),N109,5.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Eugene Technology,P320,Atomic layer deposition tools,N41,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Eugene Technology,P320,Chemical vapor deposition tools,N47,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Eugene Technology,P320,Low-pressure CVD tools,N39,4.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Evatec,P321,Other deposition tools (non-IC),N138,8.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Evatec,P321,PVD tools (adv. pkg.),N111,1.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Exicon,P322,Burn-in test tools,N81,2.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Exicon,P322,Memory test tools,N79,1.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
F&K Delvotec,P360,Manual wire bonders,N133,92.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
F&K Delvotec,P360,Wire bonding tools,N74,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
FRA,P132,Deposition tools,N36,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
FRA,P132,Other deposition tools (non-IC),N138,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
FRA,P132,Process control tools,N60,0.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
FRA,P132,"Film, stack, and shape metrology tools",N65,0.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
FRA,P132,Fabrication tools (for advanced packaging),N109,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
FRA,P132,Inspection tools (adv. pkg.),N63,0.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Fasford Tech,P158,Die attaching tools,N73,2.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Fasford Tech,P158,Bonding tools,N72,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Fasford Tech,P158,Die attaching tools for IC,N131,2.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
FormFactor,P323,Handlers and probers,N83,4.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
GBR,P110,High-temperature CVD tools,N40,1.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
GBR,P110,Chemical vapor deposition tools,N47,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
GBR,P110,Deposition tools,N36,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
GBR,P110,Other deposition tools (non-IC),N138,0.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
GBR,P110,Dry etch tools,N103,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
GBR,P110,Fabrication tools (for advanced packaging),N109,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
GBR,P110,Etch and clean tools,N55,0.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
GBR,P110,Deposition tools (adv. pkg.),N128,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
GBR,P110,Misc. dry etch tools,N54,3.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
GBR,P110,CVD tools (adv. pkg.),N110,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
GBR,P110,Dry etching and cleaning tools,N48,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
GBR,P110,Atomic layer deposition tools,N41,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Genesem,P383,Packaging tools,N76,1.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
GigaLane,P126,Imprint lithography,N107,5.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
GigaLane,P126,Misc. dry etch tools,N54,4.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Graco,P324,Other interconnect tools,N75,2.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Grand Process,P122,Etch and clean tools (adv. pkg.),N129,1.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Grand Process,P122,ECP tools (adv. pkg.),N113,1.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Grand Process,P122,Dry stripping tools,N53,5.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Grand Process,P122,Single wafer spin & spray systems (adv. pkg.),N125,2.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Grand Process,P122,Wet etching and cleaning tools,N49,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Gudeng,P75,Photomask handlers,N12,6.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
HANMI,P170,Die attaching tools for IC,N131,23.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
HANMI,P170,Die attaching tools,N73,19.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
HANMI,P170,Packaging tools,N76,5.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
HANMI,P170,Bonding tools,N72,12.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
HUN,P374,"Film, stack, and shape metrology tools",N65,2.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
HUN,P374,Process control tools,N60,0.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hangzhou Changchuan Technology,P325,Handlers and probers,N83,6.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hangzhou Changchuan Technology,P325,Burn-in test tools,N81,8.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hangzhou Changchuan Technology,P325,Test tools,N120,4.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hangzhou Changchuan Technology,P325,SoC test tools,N80,5.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hanwha Semitech,P326,Bonding tools,N72,3.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hanwha Semitech,P326,Die attaching tools for IC,N131,5.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hanwha Semitech,P326,Die attaching tools,N73,4.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Heidelberg Instruments,P95,Mask exposure systems - laser beam,N30,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hesse,P165,Wire bonding tools,N74,3.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hesse,P165,Automatic wedge bonders,N136,13.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hirata,P413,Wafer handlers,N11,2.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hirata,P413,Wafer and photomask handlers,N59,2.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hitachi,P97,Process control tools,N60,6.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hitachi,P97,Dry etching and cleaning tools,N48,2.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hitachi,P97,Critical dimensions metrology tools,N66,71.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hitachi,P97,Defect inspection tools,N67,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hitachi,P97,Defect review stations,N116,4.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hitachi,P97,Dry etch tools,N103,2.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hitachi,P97,Etch and clean tools,N55,1.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hitachi,P97,Conductor etching tools,N50,4.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hon Technologies,P327,Handlers and probers,N83,13.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hon Technologies,P327,Burn-in test tools,N81,3.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hoson,P160,Die attaching tools,N73,2.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hoson,P160,Bonding tools,N72,1.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hoson,P160,Die attaching tools for non-IC,N132,13.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hwatsing,P129,CMP tools (adv. pkg.),N124,13.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Hwatsing,P129,CMP tools,N86,12.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
IMS Nanofabrication,P328,Lithography tools,N19,1.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
IMS Nanofabrication,P328,Mask exposure systems - e-beam,N29,46.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ISR,P133,Process control tools,N60,6.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ISR,P133,Inspection tools (adv. pkg.),N63,14.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ISR,P133,Fabrication tools (for advanced packaging),N109,2.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ISR,P133,Defect inspection tools,N67,3.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ISR,P133,"Film, stack, and shape metrology tools",N65,24.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ITA,P33,Test tools,N120,0.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ITA,P33,Burn-in test tools,N81,3.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ITA,P33,Handlers and probers,N83,1.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ITA,P33,SoC test tools,N80,0.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Iwashita Engineering,P330,Other interconnect tools,N75,10.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JEOL,P92,Mask exposure systems - e-beam,N29,14.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JEOL,P92,Direct write systems,N108,67.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Fabrication tools (for advanced packaging),N109,15.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,CMP tools,N86,36.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Dicing tools,N71,95.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,CMP tools (adv. pkg.),N124,15.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Crystal machining tools,N9,99.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Handlers and probers,N83,41.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Memory test tools,N79,63.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Test tools,N120,63.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,SoC test tools,N80,65.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Burn-in test tools,N81,3.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Lithography tools,N19,15.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,i-line lithography tools,N106,56.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,KrF (DUV) lithography tools,N105,34.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Physical vapor deposition tools,N42,2.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Deposition tools,N36,14.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Other deposition tools (non-IC),N138,12.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Die attaching tools for non-IC,N132,12.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Die attaching tools for IC,N131,12.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Assembly inspection tools,N70,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Die attaching tools,N73,12.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Bonding tools,N72,12.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Wafer handlers,N11,88.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Photomask handlers,N12,90.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Wafer and photomask handlers,N59,88.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,ECP tools (adv. pkg.),N113,3.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Deposition tools (adv. pkg.),N128,4.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Process control tools,N60,14.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Dry etching and cleaning tools,N48,25.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Critical dimensions metrology tools,N66,72.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Defect inspection tools,N67,2.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Defect review stations,N116,4.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Dry etch tools,N103,26.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Etch and clean tools,N55,32.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Conductor etching tools,N50,6.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Photomask inspection and repair tools,N62,42.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Other interconnect tools,N75,31.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Mask exposure systems - e-beam,N29,53.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Direct write systems,N108,67.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Auto ball bonders for non-IC,N135,10.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Auto ball bonders for IC,N134,7.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Wire bonding tools,N74,6.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,CVD tools (adv. pkg.),N110,6.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Dry stripping tools,N53,45.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Tube-based diffusion and deposition tools,N44,75.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Plasma modification tools,N104,12.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Rapid thermal processing tools,N43,6.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Atomic layer deposition tools,N41,23.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,ArF immersion (DUV) lithography tools,N22,0.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,ArF dry (DUV) lithography tools,N21,5.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Ion implanters,N17,10.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Packaging tools,N76,57.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Wafer level stud bonders,N137,7.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,"Film, stack, and shape metrology tools",N65,7.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Etch and clean tools (adv. pkg.),N129,31.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Resist processing tools,N32,95.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Single wafer spin & spray systems (adv. pkg.),N125,66.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Wet etching and cleaning tools,N49,51.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Misc. dry etch tools,N54,20.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Wafer bonding and aligning tools,N10,25.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Resist processing tools (adv. pkg.),N122,92.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Chemical vapor deposition tools,N47,6.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Insulator etching tools,N51,55.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Lithography tools (adv. pkg.),N127,83.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Plasma CVD tools,N38,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Dry etching tools (adv. pkg.),N101,6.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Low-pressure CVD tools,N39,34.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Inspection tools (adv. pkg.),N63,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Mask aligners,N123,7.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Automatic wedge bonders,N136,0.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,PVD tools (adv. pkg.),N111,4.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Jingsheng Electromechanical,P406,Other deposition tools (non-IC),N138,4.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Jusung Engineering,P332,Atomic layer deposition tools,N41,2.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Jusung Engineering,P332,Other deposition tools (non-IC),N138,1.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KBTEM,P397,Manual wire bonders,N133,6.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KCTech,P130,CMP tools,N86,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KES Systems,P363,Burn-in test tools,N81,1.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,Overlay metrology tools,N114,51.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,Assembly inspection tools,N70,60.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,Conductor etching tools,N50,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,E-beam metrology tools,N115,18.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,Defect review stations,N116,22.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,Other deposition tools (non-IC),N138,5.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,Dry etch tools,N103,1.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,Process control tools,N60,56.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,Inspection tools (adv. pkg.),N63,56.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,CVD tools (adv. pkg.),N110,2.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,PVD tools (adv. pkg.),N111,9.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,Deposition tools (adv. pkg.),N128,4.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,"Film, stack, and shape metrology tools",N65,45.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,Defect inspection tools,N67,85.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,Dry etching tools (adv. pkg.),N101,21.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,Photomask inspection and repair tools,N62,45.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,Fabrication tools (for advanced packaging),N109,14.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,Etch and clean tools (adv. pkg.),N129,12.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KLA,P118,Dry etching and cleaning tools,N48,1.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Rapid thermal processing tools,N43,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Deposition tools,N36,3.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Overlay metrology tools,N114,0.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Process control tools,N60,0.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Test tools,N120,4.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Burn-in test tools,N81,61.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Packaging tools,N76,16.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,High-temperature CVD tools,N40,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Etch and clean tools,N55,2.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Atomic layer deposition tools,N41,4.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Wet etching and cleaning tools,N49,7.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Chemical vapor deposition tools,N47,5.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Low-pressure CVD tools,N39,7.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Plasma modification tools,N104,0.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,SoC test tools,N80,0.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Memory test tools,N79,10.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Dicing tools,N71,0.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Handlers and probers,N83,20.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Imprint lithography,N107,5.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Dry etching and cleaning tools,N48,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Misc. dry etch tools,N54,4.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Lithography tools,N19,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Dry etch tools,N103,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Die attaching tools for IC,N131,38.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Die attaching tools,N73,31.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Bonding tools,N72,21.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Other deposition tools (non-IC),N138,1.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Conductor etching tools,N50,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,CMP tools,N86,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Other interconnect tools,N75,9.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Assembly inspection tools,N70,5.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Defect inspection tools,N67,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Die attaching tools for non-IC,N132,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Dry clean tools,N102,25.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Dry stripping tools,N53,2.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,"Film, stack, and shape metrology tools",N65,1.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Resist processing tools (adv. pkg.),N122,4.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Fabrication tools (for advanced packaging),N109,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Resist processing tools,N32,1.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Wafer and photomask handlers,N59,10.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Wafer handlers,N11,11.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Lithography tools (adv. pkg.),N127,4.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Insulator etching tools,N51,0.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Plasma CVD tools,N38,5.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Tube-based diffusion and deposition tools,N44,2.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
KOSES,P168,Other interconnect tools,N75,3.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Keithley Instruments,P143,Process monitoring tools,N64,31.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Keysight Tech,P142,Process monitoring tools,N64,68.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kingsemi,P107,Resist processing tools (adv. pkg.),N122,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kingsemi,P107,Lithography tools (adv. pkg.),N127,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Koh Young Tech,P147,Assembly inspection tools,N70,2.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kokusai,P116,CVD tools (adv. pkg.),N110,5.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kokusai,P116,Dry stripping tools,N53,35.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kokusai,P116,Tube-based diffusion and deposition tools,N44,24.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kokusai,P116,Plasma modification tools,N104,6.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kokusai,P116,Deposition tools,N36,3.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kokusai,P116,Rapid thermal processing tools,N43,2.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kokusai,P116,Atomic layer deposition tools,N41,7.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kulicke & Soffa,P164,Wire bonding tools,N74,64.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kulicke & Soffa,P164,Die attaching tools for IC,N131,4.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kulicke & Soffa,P164,Other interconnect tools,N75,3.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kulicke & Soffa,P164,Bonding tools,N72,19.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kulicke & Soffa,P164,Auto ball bonders for IC,N134,83.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kulicke & Soffa,P164,Auto ball bonders for non-IC,N135,37.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kulicke & Soffa,P164,Automatic wedge bonders,N136,58.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Kulicke & Soffa,P164,Die attaching tools,N73,3.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Atomic layer deposition tools,N41,10.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Etch and clean tools (adv. pkg.),N129,27.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Deposition tools,N36,16.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Deposition tools (adv. pkg.),N128,35.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Single wafer spin & spray systems (adv. pkg.),N125,17.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Chemical vapor deposition tools,N47,28.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Dry etching tools (adv. pkg.),N101,34.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Insulator etching tools,N51,29.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,CVD tools (adv. pkg.),N110,21.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Dry stripping tools,N53,6.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Dry etch tools,N103,41.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Conductor etching tools,N50,51.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Fabrication tools (for advanced packaging),N109,19.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Etch and clean tools,N55,36.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Electrochemical plating tools,N45,92.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Wet etching and cleaning tools,N49,22.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Plasma CVD tools,N38,33.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Low-pressure CVD tools,N39,33.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,ECP tools (adv. pkg.),N113,77.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Dry clean tools,N102,74.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Dry etching and cleaning tools,N48,41.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lam Research,P111,Resist processing tools,N32,1.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lasertec,P140,Photomask inspection and repair tools,N62,42.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Lasertec,P140,Process control tools,N60,6.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
MIRTEC,P149,Assembly inspection tools,N70,2.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
MYS,P46,SoC test tools,N80,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
MYS,P46,Test tools,N120,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
MYS,P46,Handlers and probers,N83,2.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Mattson Tech,P119,Rapid thermal processing tools,N43,3.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Mattson Tech,P119,Dry stripping tools,N53,22.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Micro Control,P179,Burn-in test tools,N81,3.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
MingSeal,P333,Other interconnect tools,N75,8.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Muehlbauer,P334,Assembly inspection tools,N70,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Muratec,P74,Photomask handlers,N12,83.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Muratec,P74,Wafer handlers,N11,32.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Muratec,P74,Wafer and photomask handlers,N59,35.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Musashi Engineering,P335,Bonding tools,N72,1.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Musashi Engineering,P335,Other interconnect tools,N75,18.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Mycronic,P94,Mask exposure systems - laser beam,N30,70.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Low-pressure CVD tools,N39,3.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Etch and clean tools (adv. pkg.),N129,4.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Tube-based diffusion and deposition tools,N44,14.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Plasma CVD tools,N38,2.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,PVD tools (adv. pkg.),N111,7.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Dry stripping tools,N53,8.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Deposition tools (adv. pkg.),N128,5.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Misc. dry etch tools,N54,61.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Etch and clean tools,N55,5.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Deposition tools,N36,6.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Dry etching tools (adv. pkg.),N101,7.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Other deposition tools (non-IC),N138,21.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,CVD tools (adv. pkg.),N110,13.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Dry etch tools,N103,5.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Wet etching and cleaning tools,N49,3.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Fabrication tools (for advanced packaging),N109,2.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Conductor etching tools,N50,7.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Physical vapor deposition tools,N42,14.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Dry etching and cleaning tools,N48,5.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,Chemical vapor deposition tools,N47,3.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NAURA,P115,High-temperature CVD tools,N40,4.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Fabrication tools (for advanced packaging),N109,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Atomic layer deposition tools,N41,54.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Tube-based diffusion and deposition tools,N44,7.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Other deposition tools (non-IC),N138,6.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Plasma CVD tools,N38,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Deposition tools (adv. pkg.),N128,0.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,CVD tools (adv. pkg.),N110,2.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Chemical vapor deposition tools,N47,3.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,High-temperature CVD tools,N40,18.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Deposition tools,N36,10.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,KrF (DUV) lithography tools,N105,66.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,EUV lithography tools,N20,100.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Overlay metrology tools,N114,47.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Process control tools,N60,5.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,ArF immersion (DUV) lithography tools,N22,99.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,i-line lithography tools,N106,31.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Lithography tools,N19,81.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,E-beam metrology tools,N115,35.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,ArF dry (DUV) lithography tools,N21,94.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Packaging tools,N76,16.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Die attaching tools for non-IC,N132,35.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Bonding tools,N72,18.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Die attaching tools,N73,28.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Die attaching tools for IC,N131,26.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Dry etching and cleaning tools,N48,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Dry stripping tools,N53,9.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NLD,P45,Etch and clean tools,N55,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Nikon,P89,i-line lithography tools,N106,3.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Nikon,P89,ArF dry (DUV) lithography tools,N21,5.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Nikon,P89,KrF (DUV) lithography tools,N105,3.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Nissin Ion,P82,Ion implanters,N17,1.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Nordson,P336,Other interconnect tools,N75,11.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Nova,P337,"Film, stack, and shape metrology tools",N65,24.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Nova,P337,Process control tools,N60,4.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NuFlare,P91,Mask exposure systems - e-beam,N29,39.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NuFlare,P91,Other deposition tools (non-IC),N138,3.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
NuFlare,P91,Lithography tools,N19,1.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Okamoto,P61,Crystal machining tools,N9,6.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Onto Innovation,P139,Defect inspection tools,N67,1.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Onto Innovation,P139,Inspection tools (adv. pkg.),N63,28.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Onto Innovation,P139,Process control tools,N60,2.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Onto Innovation,P139,i-line lithography tools,N106,2.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Onto Innovation,P139,Fabrication tools (for advanced packaging),N109,5.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Onto Innovation,P139,"Film, stack, and shape metrology tools",N65,10.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Oxford Instruments,P338,Misc. dry etch tools,N54,3.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Oxford Instruments,P338,CVD tools (adv. pkg.),N110,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
PROTEC,P161,Other interconnect tools,N75,2.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
PROTEC,P161,Die attaching tools for non-IC,N132,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
PSK,P341,Dry clean tools,N102,22.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
PSK,P341,Dry stripping tools,N53,2.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
PacTech,P410,Wafer level stud bonders,N137,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Palomar Technologies,P409,Auto ball bonders for non-IC,N135,3.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Park Systems,P400,"Film, stack, and shape metrology tools",N65,1.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Pentamaster,P339,Handlers and probers,N83,2.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Piotech,P113,Chemical vapor deposition tools,N47,5.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Piotech,P113,Deposition tools,N36,2.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Piotech,P113,Atomic layer deposition tools,N41,2.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Piotech,P113,CVD tools (adv. pkg.),N110,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Piotech,P113,Plasma CVD tools,N38,7.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Plasma-Therm,P124,Other deposition tools (non-IC),N138,3.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Plasma-Therm,P124,Misc. dry etch tools,N54,10.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Precision Valve & Automation,P340,Other interconnect tools,N75,4.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Raintree Scientific Instruments (RSIC),P137,"Film, stack, and shape metrology tools",N65,2.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Riber,P403,Other deposition tools (non-IC),N138,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Rigaku,P136,"Film, stack, and shape metrology tools",N65,7.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Rigaku,P136,Process control tools,N60,1.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Rorze,P72,Wafer handlers,N11,1.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Rorze,P72,Wafer and photomask handlers,N59,1.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SAMCO,P125,Misc. dry etch tools,N54,6.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SEMES,P73,Conductor etching tools,N50,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SEMES,P73,Die attaching tools for IC,N131,8.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SEMES,P73,Resist processing tools (adv. pkg.),N122,4.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SEMES,P73,Bonding tools,N72,4.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SEMES,P73,Etch and clean tools,N55,2.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SEMES,P73,Resist processing tools,N32,1.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SEMES,P73,Wet etching and cleaning tools,N49,5.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SEMES,P73,Wafer and photomask handlers,N59,10.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SEMES,P73,Dry clean tools,N102,2.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SEMES,P73,Wafer handlers,N11,11.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SEMES,P73,Packaging tools,N76,1.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SEMES,P73,Handlers and probers,N83,6.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SEMES,P73,Lithography tools (adv. pkg.),N127,4.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SEMES,P73,Die attaching tools,N73,7.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Die attaching tools for non-IC,N132,36.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,PVD tools (adv. pkg.),N111,2.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Fabrication tools (for advanced packaging),N109,1.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Wafer level stud bonders,N137,67.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Auto ball bonders for non-IC,N135,86.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Assembly inspection tools,N70,22.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Wire bonding tools,N74,86.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Auto ball bonders for IC,N134,90.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Other interconnect tools,N75,12.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Packaging tools,N76,3.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Bonding tools,N72,38.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Die attaching tools for IC,N131,20.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Dicing tools,N71,2.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Handlers and probers,N83,1.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Integrated assembly tools,N77,100.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Deposition tools (adv. pkg.),N128,2.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Automatic wedge bonders,N136,83.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,Die attaching tools,N73,23.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SGP,P47,ECP tools (adv. pkg.),N113,4.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SMEE,P70,i-line lithography tools,N106,4.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SMIT,P83,Ion implanters,N17,8.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SPEA,P382,Handlers and probers,N83,1.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SSP,P167,Other interconnect tools,N75,3.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SUSS MicroTec,P68,Wafer bonding and aligning tools,N10,20.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SUSS MicroTec,P68,Wet etching and cleaning tools,N49,1.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SUSS MicroTec,P68,Mask aligners,N123,82.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SUSS MicroTec,P68,Fabrication tools (for advanced packaging),N109,2.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SUSS MicroTec,P68,Resist processing tools (adv. pkg.),N122,1.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SUSS MicroTec,P68,Lithography tools (adv. pkg.),N127,1.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SWE,P90,Lithography tools,N19,0.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SWE,P90,Mask exposure systems - laser beam,N30,70.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SWE,P90,Other interconnect tools,N75,8.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
SWE,P90,Bonding tools,N72,0.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Scientech Corporation,P412,Wet etching and cleaning tools,N49,1.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Scientech Corporation,P412,Wafer bonding and aligning tools,N10,4.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Screen,P106,Fabrication tools (for advanced packaging),N109,2.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Screen,P106,Etch and clean tools (adv. pkg.),N129,16.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Screen,P106,Resist processing tools,N32,2.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Screen,P106,Single wafer spin & spray systems (adv. pkg.),N125,40.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Screen,P106,Rapid thermal processing tools,N43,4.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Screen,P106,Wet etching and cleaning tools,N49,32.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Screen,P106,Etch and clean tools,N55,7.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Semics,P342,Handlers and probers,N83,9.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Semilab,P343,"Film, stack, and shape metrology tools",N65,2.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Shenzhen Axxon Automation,P344,Other interconnect tools,N75,8.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Shenzhen Naso Tech Co.,P407,Other deposition tools (non-IC),N138,3.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Shibaura Mechatronics,P347,Single wafer spin & spray systems (adv. pkg.),N125,26.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Shibaura Mechatronics,P347,Die attaching tools for non-IC,N132,7.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Shibaura Mechatronics,P347,Bonding tools,N72,4.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Shibaura Mechatronics,P347,Fabrication tools (for advanced packaging),N109,1.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Shibaura Mechatronics,P347,Misc. dry etch tools,N54,14.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Shibaura Mechatronics,P347,Dry stripping tools,N53,9.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Shibaura Mechatronics,P347,Etch and clean tools (adv. pkg.),N129,10.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Shibaura Mechatronics,P347,Die attaching tools,N73,6.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Shibaura Mechatronics,P347,Die attaching tools for IC,N131,6.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Shibuya Kogyo,P381,Other interconnect tools,N75,1.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Shinko,P299,Wafer and photomask handlers,N59,2.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Shinko,P299,Wafer handlers,N11,2.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TES,P377,Plasma CVD tools,N38,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TES,P377,Chemical vapor deposition tools,N47,1.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TOWA,P169,Packaging tools,N76,39.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Dicing tools,N71,0.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Packaging tools,N76,2.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Die attaching tools for non-IC,N132,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Die attaching tools,N73,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Other interconnect tools,N75,1.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Bonding tools,N72,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Assembly inspection tools,N70,4.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Burn-in test tools,N81,7.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Handlers and probers,N83,16.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Test tools,N120,1.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,SoC test tools,N80,1.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Die attaching tools for IC,N131,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Electrochemical plating tools,N45,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Etch and clean tools,N55,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Fabrication tools (for advanced packaging),N109,0.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Etch and clean tools (adv. pkg.),N129,1.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Deposition tools,N36,0.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,ECP tools (adv. pkg.),N113,1.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Deposition tools (adv. pkg.),N128,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Dry stripping tools,N53,5.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Single wafer spin & spray systems (adv. pkg.),N125,2.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Wet etching and cleaning tools,N49,2.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Dry etching and cleaning tools,N48,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Wafer handlers,N11,0.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Wafer and photomask handlers,N59,0.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Photomask handlers,N12,6.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Ion implanters,N17,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,Wafer bonding and aligning tools,N10,4.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
TechWing,P349,Handlers and probers,N83,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tensun,P345,Other interconnect tools,N75,6.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Teradyne,P176,Memory test tools,N79,25.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Teradyne,P176,Test tools,N120,21.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Teradyne,P176,SoC test tools,N80,22.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Thermco Epitaxy,P357,High-temperature CVD tools,N40,1.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Resist processing tools,N32,92.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Dry etch tools,N103,23.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Dry etching and cleaning tools,N48,22.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Wafer bonding and aligning tools,N10,25.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Etch and clean tools (adv. pkg.),N129,4.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Resist processing tools (adv. pkg.),N122,92.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Chemical vapor deposition tools,N47,6.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Insulator etching tools,N51,55.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Atomic layer deposition tools,N41,15.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Lithography tools,N19,9.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Lithography tools (adv. pkg.),N127,83.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Etch and clean tools,N55,22.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Plasma modification tools,N104,6.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Tube-based diffusion and deposition tools,N44,50.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Wet etching and cleaning tools,N49,19.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Conductor etching tools,N50,2.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Dry etching tools (adv. pkg.),N101,6.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Deposition tools,N36,9.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Handlers and probers,N83,19.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Low-pressure CVD tools,N39,34.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Other deposition tools (non-IC),N138,3.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Tokyo Electron,P105,Fabrication tools (for advanced packaging),N109,8.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Toray,P292,Mask aligners,N123,5.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Trinity Tech,P171,Packaging tools,N76,1.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Trymax,P350,Dry stripping tools,N53,9.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ULVAC,P117,PVD tools (adv. pkg.),N111,4.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ULVAC,P117,Other deposition tools (non-IC),N138,2.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ULVAC,P117,Deposition tools (adv. pkg.),N128,2.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
ULVAC,P117,Physical vapor deposition tools,N42,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Deposition tools,N36,60.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Fabrication tools (for advanced packaging),N109,65.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Etch and clean tools,N55,52.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Wet etching and cleaning tools,N49,32.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,ECP tools (adv. pkg.),N113,91.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Electrochemical plating tools,N45,99.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Tube-based diffusion and deposition tools,N44,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Atomic layer deposition tools,N41,14.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Deposition tools (adv. pkg.),N128,84.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Test tools,N120,23.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Burn-in test tools,N81,15.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Low-pressure CVD tools,N39,52.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Plasma CVD tools,N38,82.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,E-beam metrology tools,N115,63.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Etch and clean tools (adv. pkg.),N129,54.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Rapid thermal processing tools,N43,88.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Dry etch tools,N103,59.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Mask exposure systems - laser beam,N30,27.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Ion implanters,N17,84.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,PVD tools (adv. pkg.),N111,82.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Physical vapor deposition tools,N42,82.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Critical dimensions metrology tools,N66,27.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Lithography tools,N19,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Chemical vapor deposition tools,N47,75.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,CMP tools (adv. pkg.),N124,71.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,High-temperature CVD tools,N40,73.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Defect review stations,N116,95.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Photomask inspection and repair tools,N62,46.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Dry etching tools (adv. pkg.),N101,71.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Plasma modification tools,N104,87.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,CMP tools,N86,49.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Conductor etching tools,N50,82.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,CVD tools (adv. pkg.),N110,74.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Dry etching and cleaning tools,N48,59.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Lithography tools (adv. pkg.),N127,9.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Insulator etching tools,N51,29.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Defect inspection tools,N67,91.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Process control tools,N60,71.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Direct write systems (adv. pkg.),N130,100.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Resist processing tools,N32,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,"Film, stack, and shape metrology tools",N65,61.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Assembly inspection tools,N70,65.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Handlers and probers,N83,8.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,SoC test tools,N80,23.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Other interconnect tools,N75,18.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Bonding tools,N72,1.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Overlay metrology tools,N114,51.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Other deposition tools (non-IC),N138,17.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Inspection tools (adv. pkg.),N63,84.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Process monitoring tools,N64,100.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Dicing tools,N71,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Single wafer spin & spray systems (adv. pkg.),N125,30.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Dry stripping tools,N53,6.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Dry clean tools,N102,74.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Wafer bonding and aligning tools,N10,0.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,i-line lithography tools,N106,7.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Wire bonding tools,N74,0.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Auto ball bonders for IC,N134,0.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Auto ball bonders for non-IC,N135,3.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Misc. dry etch tools,N54,10.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Crystal machining tools,N9,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Memory test tools,N79,25.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
UniTest,P177,Burn-in test tools,N81,4.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
UniTest,P177,Memory test tools,N79,1.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Ushio,P372,Mask aligners,N123,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Deposition tools,N36,5.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Fabrication tools (for advanced packaging),N109,6.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Tube-based diffusion and deposition tools,N44,1.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Atomic layer deposition tools,N41,1.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Chemical vapor deposition tools,N47,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Deposition tools (adv. pkg.),N128,4.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Bonding tools,N72,10.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Die attaching tools for IC,N131,3.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Die attaching tools,N73,3.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,CMP tools,N86,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,CMP tools (adv. pkg.),N124,0.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Test tools,N120,4.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,SoC test tools,N80,3.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Dicing tools,N71,2.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Packaging tools,N76,7.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Die attaching tools for non-IC,N132,1.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Other interconnect tools,N75,3.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Assembly inspection tools,N70,3.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,ECP tools (adv. pkg.),N113,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Wet etching and cleaning tools,N49,4.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Etch and clean tools,N55,4.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Lithography tools,N19,3.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Photomask inspection and repair tools,N62,2.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Insulator etching tools,N51,2.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Overlay metrology tools,N114,0.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Process control tools,N60,3.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Resist processing tools,N32,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Plasma CVD tools,N38,0.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Physical vapor deposition tools,N42,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Automatic wedge bonders,N136,2.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Wire bonding tools,N74,3.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,E-beam metrology tools,N115,0.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Critical dimensions metrology tools,N66,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Burn-in test tools,N81,3.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,High-temperature CVD tools,N40,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Plasma modification tools,N104,0.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Auto ball bonders for IC,N134,2.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Handlers and probers,N83,6.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Dry etching and cleaning tools,N48,4.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Dry etch tools,N103,2.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Electrochemical plating tools,N45,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Wafer handlers,N11,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Wafer and photomask handlers,N59,1.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Ion implanters,N17,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Conductor etching tools,N50,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Auto ball bonders for non-IC,N135,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Wafer level stud bonders,N137,25.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Defect inspection tools,N67,2.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Wafer bonding and aligning tools,N10,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,ArF immersion (DUV) lithography tools,N22,0.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Other deposition tools (non-IC),N138,1.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Rapid thermal processing tools,N43,0.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Etch and clean tools (adv. pkg.),N129,0.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Dry etching tools (adv. pkg.),N101,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Crystal machining tools,N9,0.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Dry stripping tools,N53,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,PVD tools (adv. pkg.),N111,1.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,"Film, stack, and shape metrology tools",N65,1.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Low-pressure CVD tools,N39,0.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Inspection tools (adv. pkg.),N63,1.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Misc. dry etch tools,N54,1.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,CVD tools (adv. pkg.),N110,1.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Memory test tools,N79,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Imprint lithography,N107,3.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Mask aligners,N123,3.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Ion milling tools,N52,100.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Manual wire bonders,N133,0.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Spin-on deposition tools (adv. pkg.),N112,100.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Photomask handlers,N12,3.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Wet etching and cleaning tools,N49,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Etch and clean tools,N55,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Dry etch tools,N103,0.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Conductor etching tools,N50,0.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Dry etching and cleaning tools,N48,0.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Dicing tools,N71,0.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Bonding tools,N72,0.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Die attaching tools for IC,N131,0.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Die attaching tools,N73,0.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Packaging tools,N76,2.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Handlers and probers,N83,1.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Burn-in test tools,N81,0.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Test tools,N120,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Die attaching tools for non-IC,N132,0.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Other interconnect tools,N75,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Memory test tools,N79,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Process control tools,N60,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Defect inspection tools,N67,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Ion implanters,N17,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Wafer handlers,N11,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Wafer and photomask handlers,N59,0.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,SoC test tools,N80,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Deposition tools,N36,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Other deposition tools (non-IC),N138,1.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Dry stripping tools,N53,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Insulator etching tools,N51,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Tube-based diffusion and deposition tools,N44,0.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Fabrication tools (for advanced packaging),N109,0.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Deposition tools (adv. pkg.),N128,0.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,PVD tools (adv. pkg.),N111,0.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Wire bonding tools,N74,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Resist processing tools,N32,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Plasma CVD tools,N38,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Rapid thermal processing tools,N43,0.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Chemical vapor deposition tools,N47,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Imprint lithography,N107,3.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Physical vapor deposition tools,N42,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Wafer bonding and aligning tools,N10,0.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Mask aligners,N123,3.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Lithography tools,N19,0.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Photomask inspection and repair tools,N62,0.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Misc. dry etch tools,N54,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Overlay metrology tools,N114,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,CVD tools (adv. pkg.),N110,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Assembly inspection tools,N70,1.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Wafer level stud bonders,N137,25.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,"Film, stack, and shape metrology tools",N65,0.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Critical dimensions metrology tools,N66,0.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Ion milling tools,N52,100.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Inspection tools (adv. pkg.),N63,0.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Manual wire bonders,N133,0.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Spin-on deposition tools (adv. pkg.),N112,100.0,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Auto ball bonders for IC,N134,0.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Photomask handlers,N12,3.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Crystal machining tools,N9,0.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Auto ball bonders for non-IC,N135,0.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Veeco,P121,Deposition tools,N36,1.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Veeco,P121,Rapid thermal processing tools,N43,15.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Veeco,P121,i-line lithography tools,N106,5.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Veeco,P121,Single wafer spin & spray systems (adv. pkg.),N125,13.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Veeco,P121,Etch and clean tools (adv. pkg.),N129,5.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Veeco,P121,Other deposition tools (non-IC),N138,9.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Vermes,P385,Other interconnect tools,N75,1.5,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Vistec,P93,Direct write systems,N108,32.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Wonik,P263,Tube-based diffusion and deposition tools,N44,2.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Wonik,P263,Chemical vapor deposition tools,N47,2.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Wonik,P263,Low-pressure CVD tools,N39,1.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Wonik,P263,Atomic layer deposition tools,N41,1.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Wonik,P263,Deposition tools,N36,1.6,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Wonik,P263,Plasma CVD tools,N38,3.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
YEST,P352,Burn-in test tools,N81,1.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
YIKC,P353,Test tools,N120,1.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
YIKC,P353,Memory test tools,N79,7.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Yamaha Robotics,P414,Die attaching tools for non-IC,N132,3.2,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Yamaha Robotics,P414,Auto ball bonders for IC,N134,6.3,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Yamaha Robotics,P414,Bonding tools,N72,2.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Yamaha Robotics,P414,Die attaching tools for IC,N131,1.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Yamaha Robotics,P414,Auto ball bonders for non-IC,N135,9.7,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Yamaha Robotics,P414,Wafer level stud bonders,N137,5.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Yamaha Robotics,P414,Wire bonding tools,N74,4.9,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Yamaha Robotics,P414,Die attaching tools,N73,1.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Yamaha Robotics,P414,Packaging tools,N76,17.4,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
YoungTek Electronics (YTEC),P354,Assembly inspection tools,N70,2.8,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
Zeiss,P98,Photomask inspection and repair tools,N62,10.1,2025,"CSET analysis of TechInsights data (2025). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,"Assembly, testing, and packaging (ATP)",S3,30.0,2022,
CHN,P2,Fabrication,S2,24.0,2022,
CHN,P2,Design,S1,6.0,2022,
CHN,P2,Logic chip design,N6,5.0,2022,"Worldwide semiconductor sales for logic and micro (MPU, MCU, and DSP) product [segments](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS)."
CHN,P2,Memory chip design,N5,3.0,2022,Worldwide semiconductor sales for memory product [segment](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS).
CHN,P2,DAO chip design,N13,9.0,2022,"Worldwide semiconductor sales for discrete, analog, sensor, and optoelectronic product [segments](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS)."
DEU,P32,Crystal growing furnaces,N8,100.0,2022,"CSET analysis of TechInsights data (2022). Data used for analysis were published by TechInsights on July 3, 2026."
EUR,P312,"Assembly, testing, and packaging (ATP)",S3,3.0,2022,
EUR,P312,Fabrication,S2,8.0,2022,
EUR,P312,Design,S1,10.0,2022,
EUR,P312,Logic chip design,N6,9.0,2022,"Worldwide semiconductor sales for logic and micro (MPU, MCU, and DSP) product [segments](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS)."
EUR,P312,DAO chip design,N13,17.0,2022,"Worldwide semiconductor sales for discrete, analog, sensor, and optoelectronic product [segments](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS)."
JPN,P7,"Assembly, testing, and packaging (ATP)",S3,6.0,2022,
JPN,P7,Fabrication,S2,17.0,2022,
JPN,P7,Design,S1,9.0,2022,
JPN,P7,Logic chip design,N6,4.0,2022,"Worldwide semiconductor sales for logic and micro (MPU, MCU, and DSP) product [segments](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS)."
JPN,P7,Memory chip design,N5,7.0,2022,Worldwide semiconductor sales for memory product [segment](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS).
JPN,P7,DAO chip design,N13,18.0,2022,"Worldwide semiconductor sales for discrete, analog, sensor, and optoelectronic product [segments](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS)."
KOR,P4,"Assembly, testing, and packaging (ATP)",S3,9.0,2022,
KOR,P4,Fabrication,S2,17.0,2022,
KOR,P4,Design,S1,13.0,2022,
KOR,P4,Logic chip design,N6,3.0,2022,"Worldwide semiconductor sales for logic and micro (MPU, MCU, and DSP) product [segments](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS)."
KOR,P4,Memory chip design,N5,60.0,2022,Worldwide semiconductor sales for memory product [segment](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS).
KOR,P4,DAO chip design,N13,4.0,2022,"Worldwide semiconductor sales for discrete, analog, sensor, and optoelectronic product [segments](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS)."
PVA TePla,P58,Crystal growing furnaces,N8,100.0,2022,"CSET analysis of TechInsights data (2022). Data used for analysis were published by TechInsights on July 3, 2026."
TWN,P8,"Assembly, testing, and packaging (ATP)",S3,28.0,2022,
TWN,P8,Fabrication,S2,18.0,2022,
TWN,P8,Design,S1,8.0,2022,
TWN,P8,Logic chip design,N6,11.0,2022,"Worldwide semiconductor sales for logic and micro (MPU, MCU, and DSP) product [segments](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS)."
TWN,P8,Memory chip design,N5,4.0,2022,Worldwide semiconductor sales for memory product [segment](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS).
TWN,P8,DAO chip design,N13,5.0,2022,"Worldwide semiconductor sales for discrete, analog, sensor, and optoelectronic product [segments](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS)."
USA,P1,"Assembly, testing, and packaging (ATP)",S3,3.0,2022,
USA,P1,Fabrication,S2,10.0,2022,
USA,P1,Design,S1,51.0,2022,
USA,P1,Logic chip design,N6,65.0,2022,"Worldwide semiconductor sales for logic and micro (MPU, MCU, and DSP) product [segments](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS)."
USA,P1,Memory chip design,N5,25.0,2022,Worldwide semiconductor sales for memory product [segment](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS).
USA,P1,DAO chip design,N13,41.0,2022,"Worldwide semiconductor sales for discrete, analog, sensor, and optoelectronic product [segments](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS)."
Various countries,P5,"Assembly, testing, and packaging (ATP)",S3,20.0,2022,
Various countries,P5,Fabrication,S2,7.0,2022,
Various countries,P5,Design,S1,4.0,2022,
Various countries,P5,Logic chip design,N6,4.0,2022,"Worldwide semiconductor sales for logic and micro (MPU, MCU, and DSP) product [segments](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS)."
Various countries,P5,Memory chip design,N5,1.0,2022,Worldwide semiconductor sales for memory product [segment](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS).
Various countries,P5,DAO chip design,N13,6.0,2022,"Worldwide semiconductor sales for discrete, analog, sensor, and optoelectronic product [segments](https://perma.cc/UH5R-G63P). [World Semiconductor Trade Statistics (WSTS)](https://perma.cc/Y773-9T3A) and [Semiconductor Industry Association (SIA)](https://perma.cc/MPN9-W8YS)."
AccoTEST,P182,Linear and discrete testing tools,N82,40.8,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
Aemulus,P315,Linear and discrete testing tools,N82,5.7,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
CHN,P2,Linear and discrete testing tools,N82,59.0,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
Cohu,P148,Linear and discrete testing tools,N82,3.9,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
Hangzhou Changchuan Technology,P325,Linear and discrete testing tools,N82,12.1,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
Hoson,P160,Linear and discrete testing tools,N82,6.1,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
JPN,P7,Linear and discrete testing tools,N82,8.3,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
KOR,P4,Linear and discrete testing tools,N82,1.2,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
MYS,P46,Linear and discrete testing tools,N82,5.7,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
National Instruments,P180,Linear and discrete testing tools,N82,19.3,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
STATEC,P365,Linear and discrete testing tools,N82,1.2,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
ShibaSoku,P346,Linear and discrete testing tools,N82,2.5,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
TESEC,P181,Linear and discrete testing tools,N82,5.8,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
USA,P1,Linear and discrete testing tools,N82,24.1,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
Various companies,P370,Linear and discrete testing tools,N82,2.5,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
Various countries,P5,Linear and discrete testing tools,N82,1.7,2021,"CSET analysis of TechInsights data (2021). Data used for analysis were published by TechInsights on July 3, 2026."
AKM,P302,Substrates,N96,,2019,
AMD,P10,Advanced CPUs,N1,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
AMD,P10,Discrete GPUs,N2,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
AMD,P10,FPGAs,N3,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
ARM,P198,Core intellectual property,N85,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
ASM Pacific,P145,Lead frames,N93,,2019,
Achronix,P20,Core intellectual property,N85,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Achronix,P20,FPGAs,N3,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
Air Liquide,P257,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
Air Products,P256,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
Alent,P286,Ceramic packages,N95,,2019,
Amkor,P49,Ceramic packages,N95,,2019,
Anji,P245,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Ansys,P188,Electronic design automation software,N84,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Arcas-da,P197,Electronic design automation software,N84,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Avantor,P269,Wet chemicals,N92,,2019,
BASF,P260,Wet chemicals,N92,,2019,
BASF,P260,Ceramic packages,N95,,2019,
BASF,P260,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
CHN,P2,AI ASICs,N4,,2019,
CHN,P2,Wet chemicals,N92,,2019,
CHN,P2,Lead frames,N93,,2019,
CHN,P2,Bond wires,N94,,2019,
CHN,P2,Ceramic packages,N95,,2019,
CHN,P2,Substrates,N96,,2019,
CHN,P2,Encapsulation resins,N97,,2019,
CHN,P2,Die attach materials,N98,,2019,
CHN,P2,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
CHN,P2,Photomasks,N33,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
CHN,P2,Deposition materials,N88,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
CHN,P2,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
CHN,P2,Wafer,N26,4.0,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
CHN,P2,Electronic design automation software,N84,1.0,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
CHN,P2,Core intellectual property,N85,2.0,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
CHN,P2,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
CHN,P2,Advanced CPUs,N1,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
CHN,P2,Discrete GPUs,N2,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
CHN,P2,FPGAs,N3,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
CHN,P2,Wafer inspection tools,N61,,2019,
CHN,P2,Packaging materials,N100,,2019,
CMC,P244,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Cadence,P186,Electronic design automation software,N84,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Cadence,P186,Core intellectual property,N85,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Cambricon,P26,AI ASICs,N4,,2019,
Cerebras,P23,AI ASICs,N4,,2019,
Ceva,P201,Core intellectual property,N85,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
DEU,P32,Wet chemicals,N92,,2019,
DEU,P32,Bond wires,N94,,2019,
DEU,P32,Ceramic packages,N95,,2019,
DEU,P32,Encapsulation resins,N97,,2019,
DEU,P32,Die attach materials,N98,,2019,
DEU,P32,Deposition materials,N88,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
DEU,P32,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
DEU,P32,Wafer,N26,14.0,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
DEU,P32,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
DEU,P32,Wafer inspection tools,N61,,2019,
DEU,P32,Packaging materials,N100,,2019,
Dai Nippon,P238,Photomasks,N33,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Darbond,P305,Die attach materials,N98,,2019,
Dongjin,P211,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Doublink,P280,Bond wires,N94,,2019,
DuPont,P222,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
DuPont,P222,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
EMD Performance Materials,P213,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Efinix,P16,FPGAs,N3,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
Entegris,P255,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
FRA,P132,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
FRA,P132,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
FRA,P132,Wafer inspection tools,N61,,2019,
Flex Logic,P21,FPGAs,N3,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
Fujifilm,P209,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Fujifilm,P209,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Fujimi,P219,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
GBR,P110,AI ASICs,N4,,2019,
GBR,P110,Ceramic packages,N95,,2019,
GBR,P110,Core intellectual property,N85,43.0,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
GBR,P110,Packaging materials,N100,,2019,
GBR,P110,Electronic design automation software,N84,1.0,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
GlobalFoundries,P36,Photomasks,N33,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
GlobalWafers,P226,Wafer,N26,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
Google,P22,AI ASICs,N4,,2019,
Gowin,P29,FPGAs,N3,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
Graphcore,P25,AI ASICs,N4,,2019,
Grikin,P253,Deposition materials,N88,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Gritek,P232,Wafer,N26,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
HHCK,P304,Encapsulation resins,N97,,2019,
Haute Gas,P265,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
Henkel,P291,Ceramic packages,N95,,2019,
Henkel,P291,Encapsulation resins,N97,,2019,
Henkel,P291,Die attach materials,N98,,2019,
Heraeus,P277,Bond wires,N94,,2019,
HiSilicon,P17,AI ASICs,N4,,2019,
Hitachi,P97,Ceramic packages,N95,,2019,
Hitachi,P97,Encapsulation resins,N97,,2019,
Hitachi,P97,Die attach materials,N98,,2019,
Hitachi,P97,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Honeywell,P248,Wet chemicals,N92,,2019,
Honeywell,P248,Deposition materials,N88,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Horizon Robotics,P27,AI ASICs,N4,,2019,
Hoya Corporation,P241,Photomasks,N33,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Huada Empyrean,P191,Electronic design automation software,N84,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Hubei Dinglong,P246,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Hysol Huawei,P306,Die attach materials,N98,,2019,
ISR,P133,Wafer inspection tools,N61,,2019,
ISR,P133,Electronic design automation software,N84,1.0,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Ibiden,P297,Substrates,N96,,2019,
Imagination Technologies,P200,Core intellectual property,N85,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Inpria,P214,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Intel,P9,Photomasks,N33,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Intel,P9,Advanced CPUs,N1,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
Intel,P9,FPGAs,N3,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
Intellifusion,P28,AI ASICs,N4,,2019,
JHM,P218,Wet chemicals,N92,,2019,
JHM,P218,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
JPN,P7,Wet chemicals,N92,,2019,
JPN,P7,Lead frames,N93,,2019,
JPN,P7,Bond wires,N94,,2019,
JPN,P7,Ceramic packages,N95,,2019,
JPN,P7,Substrates,N96,,2019,
JPN,P7,Encapsulation resins,N97,,2019,
JPN,P7,Die attach materials,N98,,2019,
JPN,P7,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
JPN,P7,Photomasks,N33,53.0,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
JPN,P7,Deposition materials,N88,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
JPN,P7,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
JPN,P7,Wafer,N26,56.0,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
JPN,P7,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
JPN,P7,Wafer inspection tools,N61,,2019,
JPN,P7,Packaging materials,N100,,2019,
JPN,P7,Electronic design automation software,N84,3.0,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
JRH,P230,Wafer,N26,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
JSR,P206,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
JSR,P206,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
JX Nippon,P247,Deposition materials,N88,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Jingjia Micro,P12,Discrete GPUs,N2,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
Jinhong,P266,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
KFMI,P252,Deposition materials,N88,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
KMG Chemicals,P268,Wet chemicals,N92,,2019,
KOR,P4,Ceramic packages,N95,,2019,
KOR,P4,Substrates,N96,,2019,
KOR,P4,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
KOR,P4,Photomasks,N33,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
KOR,P4,Wafer,N26,10.0,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
KOR,P4,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
KOR,P4,Packaging materials,N100,,2019,
Kangqiang,P281,Lead frames,N93,,2019,
Kangqiang,P281,Bond wires,N94,,2019,
Kanto Chemical,P270,Wet chemicals,N92,,2019,
Kempur,P216,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Kyocera,P287,Ceramic packages,N95,,2019,
LG,P288,Ceramic packages,N95,,2019,
Lattice,P18,FPGAs,N3,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
Linde,P250,Deposition materials,N88,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Linde,P250,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
Loongson,P13,Advanced CPUs,N1,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
MCL,P233,Wafer,N26,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
Mentor Graphics,P187,Electronic design automation software,N84,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Merck Group,P243,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Merck Group,P243,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
Microchip,P19,FPGAs,N3,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
Microscapes,P196,Electronic design automation software,N84,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Mitsui High-Tec,P290,Lead frames,N93,,2019,
Mitsui High-Tec,P290,Ceramic packages,N95,,2019,
NGK,P285,Ceramic packages,N95,,2019,
NLD,P45,Wafer inspection tools,N61,,2019,
NanYa,P298,Substrates,N96,,2019,
Nata Opto-electronic Material,P217,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Nata Opto-electronic Material,P217,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
Ningbo Hualong,P309,Lead frames,N93,,2019,
Nippon Micro,P279,Bond wires,N94,,2019,
Nvidia,P11,Discrete GPUs,N2,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
Okmetic,P229,Wafer,N26,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
PDF Solutions,P190,Electronic design automation software,N84,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
PERIC,P267,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
POSHING,P236,Wafer,N26,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
Photronics,P239,Photomasks,N33,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Phytium,P15,Advanced CPUs,N1,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
Platform-da,P195,Electronic design automation software,N84,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Praxair,P251,Deposition materials,N88,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Praxair,P251,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
Primarius,P192,Electronic design automation software,N84,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Pureon,P310,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Quik-Pak,P284,Ceramic packages,N95,,2019,
Rambus,P203,Core intellectual property,N85,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Ruihong,P215,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Runma,P271,Wet chemicals,N92,,2019,
SGP,P47,Lead frames,N93,,2019,
SH Material,P308,Lead frames,N93,,2019,
SK Materials,P264,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
SK Siltron,P228,Wafer,N26,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
SMIC,P37,Photomasks,N33,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
SST,P199,Core intellectual property,N85,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
SUMCO,P225,Wafer,N26,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
Saint-Gobain,P220,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Samsung,P35,Substrates,N96,,2019,
Samsung,P35,Photomasks,N33,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Semitronix,P194,Electronic design automation software,N84,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Shennan Circuits,P300,Substrates,N96,,2019,
Shenzhen Newway,P205,Photomasks,N33,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Shenzhen Pango,P30,FPGAs,N3,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
Shin-Etsu,P208,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Shin-Etsu,P208,Wafer,N26,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
Shinko,P299,Lead frames,N93,,2019,
Shinko,P299,Substrates,N96,,2019,
Showa Denka,P262,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
Siltronic,P227,Wafer,N26,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
Silvaco,P189,Electronic design automation software,N84,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Simgui,P234,Wafer,N26,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
Sinopaco,P303,Encapsulation resins,N97,,2019,
Sinophorus,P273,Wet chemicals,N92,,2019,
Sinyang,P274,Wet chemicals,N92,,2019,
Sumitomo,P289,Ceramic packages,N95,,2019,
Sumitomo,P289,Encapsulation resins,N97,,2019,
Sumitomo,P289,Die attach materials,N98,,2019,
Sumitomo,P289,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Sunway,P31,Advanced CPUs,N1,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
Synopsys,P185,Electronic design automation software,N84,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Synopsys,P185,Core intellectual property,N85,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
TNSC,P261,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
TSMC,P34,Photomasks,N33,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
TWN,P8,Substrates,N96,,2019,
TWN,P8,Photomasks,N33,7.0,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
TWN,P8,Wafer,N26,16.0,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
TWN,P8,Core intellectual property,N85,1.0,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
TWN,P8,Packaging materials,N100,,2019,
Taiwan Mask Corporation,P242,Photomasks,N33,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Tanaka,P294,Ceramic packages,N95,,2019,
Tanaka Denshi,P278,Bond wires,N94,,2019,
Tesla,P24,AI ASICs,N4,,2019,
Thomas West,P224,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Tokyo Ohka Kogyo,P207,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Toppan Photomasks,P240,Photomasks,N33,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Toray,P292,Ceramic packages,N95,,2019,
Tosoh SMD,P249,Deposition materials,N88,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Trinity Tech,P171,Lead frames,N93,,2019,
USA,P1,AI ASICs,N4,,2019,
USA,P1,Wet chemicals,N92,,2019,
USA,P1,Ceramic packages,N95,,2019,
USA,P1,Photoresists,N31,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
USA,P1,Photomasks,N33,40.0,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
USA,P1,Deposition materials,N88,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
USA,P1,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
USA,P1,Electronic design automation software,N84,96.0,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
USA,P1,Core intellectual property,N85,52.0,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
USA,P1,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
USA,P1,Advanced CPUs,N1,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
USA,P1,Discrete GPUs,N2,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
USA,P1,FPGAs,N3,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
USA,P1,Wafer inspection tools,N61,,2019,
USA,P1,Packaging materials,N100,,2019,
Various,P5,Core intellectual property,N85,2.0,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Verisilicon,P202,Core intellectual property,N85,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
Versum Materials,P221,CMP materials,N90,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/)
Wonik,P263,Electronic gases,N91,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SEMI)
Xpeedic,P193,Electronic design automation software,N84,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"
YesDo,P282,Bond wires,N94,,2019,
Yixing,P296,Ceramic packages,N95,,2019,
Yongzhi,P276,Lead frames,N93,,2019,
Zhaoxin,P14,Advanced CPUs,N1,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing SIA, IC Insights, TrendForce, financial statements)"
Zhonghuan,P231,Wafer,N26,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
Zhongwei,P295,Ceramic packages,N95,,2019,
Zhuhai Yueya,P301,Substrates,N96,,2019,
ZingSEMI,P237,Wafer,N26,,2019,[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing CSET estimates based on financial statements and wafer production capacities)
eMemory Technology,P204,Core intellectual property,N85,,2019,"[CSET](https://cset.georgetown.edu/publication/the-semiconductor-supply-chain/) (citing Mentor Graphics, Journal of Microelectronic Manufacturing, IPNest, BCG)"