(kicad_pcb (version 20211123) (host pcbnew 5.1.12-73d0e3b20d~88~ubuntu21.04.1) (general (thickness 1.6) (drawings 50) (tracks 972) (zones 0) (modules 67) (nets 71) ) (page A4) (title_block (title "Enye mini versión A") (date 2021-11-22) (rev 0.1) (company STOPs) (comment 1 "Revisores: Qitas") (comment 2 "Licence: BSD LICENSE") (comment 3 "Autor: Qitas") ) (layers (0 F.Cu signal) (1 Señal_1 signal) (2 GND power) (3 Power_+3,3V power) (4 Señal_2 signal) (31 B.Cu signal) (32 B.Adhes user) (33 F.Adhes user) (34 B.Paste user) (35 F.Paste user) (36 B.SilkS user hide) (37 F.SilkS user) (38 B.Mask user) (39 F.Mask user hide) (40 Dwgs.User user) (44 Edge.Cuts user) (46 B.CrtYd user) (48 B.Fab user) ) (setup (last_trace_width 0.0889) (user_trace_width 0.0889) (user_trace_width 0.1016) (user_trace_width 0.2032) (user_trace_width 0.254) (user_trace_width 0.3048) (trace_clearance 0.0889) (zone_clearance 0.1016) (zone_45_only no) (trace_min 0.0889) (via_size 0.4064) (via_drill 0.2032) (via_min_size 0.4064) (via_min_drill 0.2032) (user_via 0.4064 0.2032) (user_via 0.8128 0.4064) (user_via 1.016 0.7112) (blind_buried_vias_allowed yes) (uvia_size 0.254) (uvia_drill 0.1016) (uvias_allowed yes) (uvia_min_size 0.254) (uvia_min_drill 0.1016) (edge_width 0.2) (segment_width 0.2) (pcb_text_width 0.3) (pcb_text_size 1.5 1.5) (mod_edge_width 0.15) (mod_text_size 1 1) (mod_text_width 0.15) (pad_size 0.3 0.3) (pad_drill 0) (pad_to_mask_clearance 0.2) (aux_axis_origin 94.819 55.0848) (grid_origin 88.85 75.1) (visible_elements 7FFFFFFF) (pcbplotparams (layerselection 0x151ff_8000001f) (usegerberextensions false) (usegerberattributes true) (usegerberadvancedattributes true) (creategerberjobfile true) (excludeedgelayer true) (linewidth 0.100000) (plotframeref false) (viasonmask false) (mode 1) (useauxorigin false) (hpglpennumber 1) (hpglpenspeed 20) (hpglpendiameter 15.000000) (psnegative false) (psa4output false) (plotreference true) (plotvalue true) (plotinvisibletext false) (padsonsilk false) (subtractmaskfromsilk false) (outputformat 1) (mirror false) (drillshape 0) (scaleselection 1) (outputdirectory "ensamble/")) ) (net 0 "") (net 1 GND) (net 2 +VBAT) (net 3 +3V3) (net 4 /~RESET_b) (net 5 /PTA9) (net 6 /RST_BT) (net 7 /EXT_WAKE_UP) (net 8 /SDA) (net 9 /SCL) (net 10 /SWD_DIO_MCU) (net 11 /SWD_CLK_MCU) (net 12 "Net-(D2-Pad3)") (net 13 "Net-(D2-Pad4)") (net 14 "Net-(D2-Pad2)") (net 15 "Net-(C15-Pad1)") (net 16 "Net-(J1-Pad10)") (net 17 /SWD_CLK_BT) (net 18 /SWD_DIO_BT) (net 19 /Vpp) (net 20 /SPIO_MISO) (net 21 /SPIO_MOSI) (net 22 /SPIO_SCK) (net 23 /SPI0_SS_b) (net 24 "Net-(R1-Pad2)") (net 25 "Net-(R2-Pad1)") (net 26 "Net-(R4-Pad2)") (net 27 "Net-(U2-PadB1)") (net 28 "Net-(U3-Pad7)") (net 29 "Net-(U5-Pad3)") (net 30 "Net-(U6-Pad2)") (net 31 "Net-(U6-Pad3)") (net 32 "Net-(U6-Pad4)") (net 33 "Net-(U6-Pad6)") (net 34 "Net-(U6-Pad7)") (net 35 "Net-(U6-Pad14)") (net 36 "Net-(U6-Pad15)") (net 37 "Net-(U6-Pad16)") (net 38 "Net-(U6-Pad17)") (net 39 "Net-(U6-Pad19)") (net 40 "Net-(U6-Pad5)") (net 41 "Net-(U6-Pad21)") (net 42 "Net-(USB1-Pad2)") (net 43 "Net-(USB1-Pad3)") (net 44 "Net-(USB1-Pad4)") (net 45 "Net-(U5-Pad12)") (net 46 "Net-(U5-Pad11)") (net 47 "Net-(U5-Pad37)") (net 48 "Net-(U5-Pad19)") (net 49 "Net-(U5-Pad30)") (net 50 "Net-(U5-Pad35)") (net 51 "Net-(U5-Pad36)") (net 52 "/Power Supply/VBUS") (net 53 "/Power Supply/VCC") (net 54 /XTAL32KP) (net 55 "Net-(C19-Pad2)") (net 56 /XTAL32KM) (net 57 "Net-(C21-Pad2)") (net 58 "/Power Supply/STAT") (net 59 "Net-(R15-Pad2)") (net 60 "Net-(R16-Pad2)") (net 61 /BT_UART0_RX) (net 62 /BT_UART0_TX) (net 63 "Net-(J2-Pad5)") (net 64 /LED_B_BT) (net 65 /LED_G_BT) (net 66 "Net-(D3-Pad1)") (net 67 /LED_R_BT) (net 68 /LED_R_MCU) (net 69 /LED_B_MCU) (net 70 /LED_G_MCU) (net_class Default "This is the default net class." (clearance 0.0889) (trace_width 0.0889) (via_dia 0.4064) (via_drill 0.2032) (uvia_dia 0.254) (uvia_drill 0.1016) (add_net +3V3) (add_net +VBAT) (add_net /BT_UART0_RX) (add_net /BT_UART0_TX) (add_net /EXT_WAKE_UP) (add_net /LED_B_BT) (add_net /LED_B_MCU) (add_net /LED_G_BT) (add_net /LED_G_MCU) (add_net /LED_R_BT) (add_net /LED_R_MCU) (add_net /PTA9) (add_net "/Power Supply/STAT") (add_net "/Power Supply/VBUS") (add_net "/Power Supply/VCC") (add_net /RST_BT) (add_net /SCL) (add_net /SDA) (add_net /SPI0_SS_b) (add_net /SPIO_MISO) (add_net /SPIO_MOSI) (add_net /SPIO_SCK) (add_net /SWD_CLK_BT) (add_net /SWD_CLK_MCU) (add_net /SWD_DIO_BT) (add_net /SWD_DIO_MCU) (add_net /Vpp) (add_net /XTAL32KM) (add_net /XTAL32KP) (add_net /~RESET_b) (add_net GND) (add_net "Net-(C15-Pad1)") (add_net "Net-(C19-Pad2)") (add_net "Net-(C21-Pad2)") (add_net "Net-(D2-Pad2)") (add_net "Net-(D2-Pad3)") (add_net "Net-(D2-Pad4)") (add_net "Net-(D3-Pad1)") (add_net "Net-(J1-Pad10)") (add_net "Net-(J2-Pad5)") (add_net "Net-(R1-Pad2)") (add_net "Net-(R15-Pad2)") (add_net "Net-(R16-Pad2)") (add_net "Net-(R2-Pad1)") (add_net "Net-(R4-Pad2)") (add_net "Net-(U2-PadB1)") (add_net "Net-(U3-Pad7)") (add_net "Net-(U5-Pad11)") (add_net "Net-(U5-Pad12)") (add_net "Net-(U5-Pad19)") (add_net "Net-(U5-Pad3)") (add_net "Net-(U5-Pad30)") (add_net "Net-(U5-Pad35)") (add_net "Net-(U5-Pad36)") (add_net "Net-(U5-Pad37)") (add_net "Net-(U6-Pad14)") (add_net "Net-(U6-Pad15)") (add_net "Net-(U6-Pad16)") (add_net "Net-(U6-Pad17)") (add_net "Net-(U6-Pad19)") (add_net "Net-(U6-Pad2)") (add_net "Net-(U6-Pad21)") (add_net "Net-(U6-Pad3)") (add_net "Net-(U6-Pad4)") (add_net "Net-(U6-Pad5)") (add_net "Net-(U6-Pad6)") (add_net "Net-(U6-Pad7)") (add_net "Net-(USB1-Pad2)") (add_net "Net-(USB1-Pad3)") (add_net "Net-(USB1-Pad4)") ) (module footprints:r_0201 (layer B.Cu) (tedit 5873FA05) (tstamp 581D0E9E) (at 89.55 68.9 90) (path /581CF6FF) (attr smd) (fp_text reference R7 (at 0 1.651 90) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 10K (at 0 0.7 90) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start -0.5 0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 -0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 0.22) (end -0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.1 0.22) (end 0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 0.22) (end 0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 -0.22) (end 0.1 -0.22) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 9 /SCL) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:GS2 (layer F.Cu) (tedit 584723BE) (tstamp 5810E1D7) (at 79.75 60.1 315) (descr "Pontet Goute de soudure") (path /57E4A0D3) (attr virtual) (fp_text reference GS2 (at 1.778 0 45) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value Rest_MCU (at 1.524 0 45) (layer F.Fab) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.889 -1.27) (end 0.889 -1.27) (layer F.SilkS) (width 0.15)) (fp_line (start 0.889 1.27) (end -0.889 1.27) (layer F.SilkS) (width 0.15)) (fp_line (start 0.889 1.27) (end 0.889 -1.27) (layer F.SilkS) (width 0.15)) (fp_line (start -0.889 -1.27) (end -0.889 1.27) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at 0 -0.635 315) (size 1.27 0.9652) (layers F.Cu F.Paste F.Mask) (net 4 /~RESET_b)) (pad 2 smd rect (at 0 0.635 315) (size 1.27 0.9652) (layers F.Cu F.Paste F.Mask) (net 1 GND)) ) (module footprints:SML-LX0404SIUPGUSB (layer B.Cu) (tedit 58335D6E) (tstamp 5810DF8F) (at 77.65 68 90) (descr "90 pin, 0.4mm pitch Wafer Level Chip Size Package (standard pin numbering)") (path /57C8AC7F) (solder_mask_margin 0.07) (solder_paste_margin -0.05) (clearance 0.1) (attr smd) (fp_text reference D2 (at -0.3 1.432706 90) (layer B.SilkS) hide (effects (font (size 0.5 0.5) (thickness 0.1)) (justify mirror)) ) (fp_text value LED_RABG (at 0.3556 -1.7907 90) (layer B.SilkS) hide (effects (font (size 0.3 0.3) (thickness 0.075)) (justify mirror)) ) (fp_line (start 0.2286 0.8128) (end 0.8128 0.8128) (layer B.SilkS) (width 0.127)) (fp_line (start -0.8382 -0.7874) (end -0.8382 -0.2286) (layer B.SilkS) (width 0.127)) (fp_line (start -0.2032 -0.8128) (end -0.8382 -0.8128) (layer B.SilkS) (width 0.127)) (fp_line (start 0.8128 0.8128) (end 0.8128 0.2286) (layer B.SilkS) (width 0.127)) (fp_circle (center 0.6096 1.045521) (end 0.6858 1.020121) (layer B.SilkS) (width 0.15)) (pad 3 smd rect (at -0.5 -0.5 90) (size 0.45 0.45) (layers B.Cu B.Paste B.Mask) (net 12 "Net-(D2-Pad3)") (solder_mask_margin 0.07) (solder_paste_margin -0.05)) (pad 4 smd rect (at -0.5 0.5 90) (size 0.45 0.45) (layers B.Cu B.Paste B.Mask) (net 13 "Net-(D2-Pad4)")) (pad 1 smd rect (at 0.5 0.5 90) (size 0.45 0.45) (layers B.Cu B.Paste B.Mask) (net 3 +3V3)) (pad 2 smd rect (at 0.5 -0.5 90) (size 0.45 0.45) (layers B.Cu B.Paste B.Mask) (net 14 "Net-(D2-Pad2)")) (model ${KIPRJMOD}/../src/modelos.3dshapes/SML-LX0404SIUPGUSB.step (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 90)) ) ) (module footprints:r_0201 (layer B.Cu) (tedit 58348AEC) (tstamp 5810DFD7) (at 77.8 66.4 90) (path /57A93A03) (attr smd) (fp_text reference R10 (at 1.34 -0.1 90) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 330 (at -0.06 -1 90) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start -0.5 0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 -0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 0.22) (end -0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.1 0.22) (end 0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 0.22) (end 0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 -0.22) (end 0.1 -0.22) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 14 "Net-(D2-Pad2)")) (pad 2 smd rect (at 0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 68 /LED_R_MCU)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:B3U_3000PB (layer B.Cu) (tedit 5818F2E1) (tstamp 5818EFF2) (at 90.352082 59.702082 135) (descr "Plastic QFP, Micrel QFN44-24LD-LP-1") (path /57EE3C6D) (fp_text reference SW1 (at -0.0127 1.2827 135) (layer B.SilkS) hide (effects (font (size 0.39878 0.39878) (thickness 0.07874)) (justify mirror)) ) (fp_text value SIDE_SW (at -0.0635 -1.5494 135) (layer B.SilkS) hide (effects (font (size 0.39878 0.39878) (thickness 0.07874)) (justify mirror)) ) (fp_line (start -2 0.9652) (end -1.3208 0.9652) (layer B.SilkS) (width 0.1)) (fp_line (start -2 -0.9652) (end -1.3462 -0.9652) (layer B.SilkS) (width 0.1)) (fp_line (start 2 -0.9652) (end 1.3335 -0.9652) (layer B.SilkS) (width 0.1)) (fp_line (start 2 0.9652) (end 1.3335 0.9652) (layer B.SilkS) (width 0.1)) (pad 1 smd rect (at -1.7 0 135) (size 0.8 1.7) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07112)) (pad 2 smd rect (at 1.7 0 135) (size 0.8 1.7) (layers B.Cu B.Paste B.Mask) (net 5 /PTA9) (solder_mask_margin 0.07112)) (pad "" np_thru_hole circle (at 0 0 135) (size 0.75 0.75) (drill 0.75) (layers *.Cu *.Mask B.SilkS)) (model ${KIPRJMOD}/../src/modelos.3dshapes/B3U_3000PB.step (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz -90 0 0)) ) ) (module footprints:c_0201 (layer F.Cu) (tedit 5873F9BE) (tstamp 5810DF45) (at 84.825 66.55 180) (path /586FE5CB/5870011F) (attr smd) (fp_text reference C7 (at 0 -1.651 180) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_text value 0.1uF (at 0 -0.7 180) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_line (start 0 -0.15) (end 0 0.15) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 180) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 52 "/Power Supply/VBUS") (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 180) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0201 (layer F.Cu) (tedit 5873F9BE) (tstamp 5810DF21) (at 84.825 66.05 180) (path /586FE5CB/58700EED) (attr smd) (fp_text reference C1 (at 0 -1.651 180) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_text value 4.7uF (at 0 -0.7 180) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_line (start 0 -0.15) (end 0 0.15) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 180) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 52 "/Power Supply/VBUS") (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 180) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:r_0201 (layer F.Cu) (tedit 5873FA05) (tstamp 5810DFA7) (at 82.15 66.35) (path /586FE5CB/58700F0F) (attr smd) (fp_text reference R2 (at 0 -1.651) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_text value 68K (at 0 -0.7) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_line (start -0.5 -0.22) (end -0.5 0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.1 0.22) (end -0.5 0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.1 -0.22) (end -0.5 -0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.1 -0.22) (end 0.5 -0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.5 -0.22) (end 0.5 0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.5 0.22) (end 0.1 0.22) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 25 "Net-(R2-Pad1)") (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:r_0201 (layer F.Cu) (tedit 5873FA05) (tstamp 5810DFA1) (at 79.85 68.8 270) (path /586FE5CB/58700152) (attr smd) (fp_text reference R1 (at 0 -1.651 270) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_text value 49.9 (at 0 -0.7 270) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_line (start -0.5 -0.22) (end -0.5 0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.1 0.22) (end -0.5 0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.1 -0.22) (end -0.5 -0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.1 -0.22) (end 0.5 -0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.5 -0.22) (end 0.5 0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.5 0.22) (end 0.1 0.22) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 270) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 53 "/Power Supply/VCC") (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 270) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 24 "Net-(R1-Pad2)") (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0201 (layer F.Cu) (tedit 5873F9BE) (tstamp 5810DF3F) (at 80.65 70.4) (path /586FE5CB/58700130) (attr smd) (fp_text reference C6 (at 0 -1.651) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_text value 0.1uF (at 0 -0.7) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_line (start 0 -0.15) (end 0 0.15) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 2 +VBAT) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:r_0201 (layer F.Cu) (tedit 5873FA05) (tstamp 5810DFCB) (at 80.75 61.7 270) (path /57E4768E) (attr smd) (fp_text reference R8 (at 0 -1.651 270) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_text value 4.7K (at 0 -0.7 270) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_line (start -0.5 -0.22) (end -0.5 0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.1 0.22) (end -0.5 0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.1 -0.22) (end -0.5 -0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.1 -0.22) (end 0.5 -0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.5 -0.22) (end 0.5 0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.5 0.22) (end 0.1 0.22) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 270) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 4 /~RESET_b) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 270) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0201 (layer F.Cu) (tedit 5873F9BE) (tstamp 5810DF7B) (at 81.35 61.7 270) (path /57E50F6B) (attr smd) (fp_text reference C16 (at 0 -1.651 270) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_text value 0.1uF (at 0 -0.7 270) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_line (start 0 -0.15) (end 0 0.15) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 270) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 4 /~RESET_b) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 270) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:r_0201 (layer F.Cu) (tedit 5873FA05) (tstamp 5810DFAD) (at 78.7 62.65 90) (path /586FE5CB/58700F5C) (attr smd) (fp_text reference R3 (at 0 -1.651 90) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_text value DNP (at 0 -0.7 90) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_line (start -0.5 -0.22) (end -0.5 0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.1 0.22) (end -0.5 0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.1 -0.22) (end -0.5 -0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.1 -0.22) (end 0.5 -0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.5 -0.22) (end 0.5 0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.5 0.22) (end 0.1 0.22) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 90) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 58 "/Power Supply/STAT") (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 90) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:r_0201 (layer B.Cu) (tedit 5873FA05) (tstamp 5810DFD1) (at 88.05 57.5 90) (path /57D9A2B8) (attr smd) (fp_text reference R9 (at 0 1.651 90) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 10K (at 0 0.7 90) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start -0.5 0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 -0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 0.22) (end -0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.1 0.22) (end 0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 0.22) (end 0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 -0.22) (end 0.1 -0.22) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 5 /PTA9) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0201 (layer B.Cu) (tedit 5873F9BE) (tstamp 5810DF81) (at 87.35 57.5 90) (path /57EE26A0) (attr smd) (fp_text reference C17 (at 0 1.651 90) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 0.1uF (at 0 0.7 90) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start 0 0.15) (end 0 -0.15) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 5 /PTA9) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0201 (layer B.Cu) (tedit 5873F9BE) (tstamp 5810DF57) (at 87.15 65.2 270) (path /57B51576) (attr smd) (fp_text reference C10 (at 0 1.651 270) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 1uF (at 0 0.7 270) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start 0 0.15) (end 0 -0.15) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 270) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 270) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0201 (layer B.Cu) (tedit 5873F9BE) (tstamp 5810DF69) (at 86.65 65.2 270) (path /57EAD06B) (attr smd) (fp_text reference C13 (at 0 1.651 270) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 2.2uF (at 0 0.7 270) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start 0 0.15) (end 0 -0.15) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 270) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 270) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0201 (layer B.Cu) (tedit 5873F9BE) (tstamp 5810DF51) (at 88.49 70.3 180) (path /57B51492) (attr smd) (fp_text reference C9 (at 0 1.651 180) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 0.1uF (at 0 0.7 180) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start 0 0.15) (end 0 -0.15) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 180) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 180) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0201 (layer B.Cu) (tedit 5873F9BE) (tstamp 5810DF4B) (at 88.49 70.9 180) (path /57B51499) (attr smd) (fp_text reference C8 (at 0 1.651 180) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 1uF (at 0 0.7 180) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start 0 0.15) (end 0 -0.15) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 180) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 180) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:r_0201 (layer B.Cu) (tedit 5873FA05) (tstamp 581D0E88) (at 90.1 72.4 270) (path /581CF9AB) (attr smd) (fp_text reference R5 (at 0 1.651 270) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 4.7K (at 0 0.7 270) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start -0.5 0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 -0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 0.22) (end -0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.1 0.22) (end 0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 0.22) (end 0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 -0.22) (end 0.1 -0.22) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 270) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 270) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 7 /EXT_WAKE_UP) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:r_0201 (layer B.Cu) (tedit 5873FA05) (tstamp 5810DFE9) (at 78.75 69.5 270) (path /57A93BBC) (attr smd) (fp_text reference R13 (at 0 1.651 270) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 220 (at 0 0.7 270) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start -0.5 0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 -0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 0.22) (end -0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.1 0.22) (end 0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 0.22) (end 0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 -0.22) (end 0.1 -0.22) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 270) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 13 "Net-(D2-Pad4)") (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 270) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 70 /LED_G_MCU) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0201 (layer F.Cu) (tedit 5873F9BE) (tstamp 5810DF27) (at 86.15 64.3 270) (path /586FE5CB/58700EFE) (attr smd) (fp_text reference C2 (at 0 -1.651 270) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_text value 4.7uF (at 0 -0.7 270) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_line (start 0 -0.15) (end 0 0.15) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 270) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 2 +VBAT) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 270) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0201 (layer F.Cu) (tedit 5873F9BE) (tstamp 5810DF39) (at 86.75 68.2 270) (path /586FE5CB/58700F67) (attr smd) (fp_text reference C5 (at 0 -1.651 270) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_text value 0.1uF (at 0 -0.7 270) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_line (start 0 -0.15) (end 0 0.15) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 270) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 52 "/Power Supply/VBUS") (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 270) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:TPS2115A (layer F.Cu) (tedit 5877CD3D) (tstamp 5817BBF5) (at 83.58 68.63 270) (descr "Plastic QFP, Micrel QFN44-24LD-LP-1") (path /586FE5CB/587D5F1C) (attr smd) (fp_text reference U1 (at -0.762 -2.286 270) (layer F.SilkS) hide (effects (font (size 0.39878 0.39878) (thickness 0.07874))) ) (fp_text value TPS2115a (at 0 2.54 270) (layer F.SilkS) hide (effects (font (size 0.39878 0.39878) (thickness 0.07874))) ) (fp_line (start -1.6 -1.475) (end -1.4 -1.475) (layer F.SilkS) (width 0.127)) (fp_line (start 1.6 -1.475) (end 1.4 -1.475) (layer F.SilkS) (width 0.127)) (fp_line (start 1.4 1.475) (end 1.6 1.475) (layer F.SilkS) (width 0.127)) (fp_line (start 1.6 -1.475) (end 1.6 1.475) (layer F.SilkS) (width 0.127)) (fp_line (start -1.6 1.475) (end -1.4 1.475) (layer F.SilkS) (width 0.127)) (fp_line (start -1.6 1.475) (end -1.6 -1.475) (layer F.SilkS) (width 0.127)) (fp_circle (center -1.524 1.778) (end -1.4478 1.778) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.97 1.47 270) (size 0.3 0.8) (layers F.Cu F.Paste F.Mask) (net 24 "Net-(R1-Pad2)") (solder_mask_margin 0.07112)) (pad 2 smd rect (at -0.32 1.47 270) (size 0.3 0.8) (layers F.Cu F.Paste F.Mask) (net 59 "Net-(R15-Pad2)") (solder_mask_margin 0.07112)) (pad 3 smd rect (at 0.32 1.47 270) (size 0.3 0.8) (layers F.Cu F.Paste F.Mask) (net 60 "Net-(R16-Pad2)") (solder_mask_margin 0.07112)) (pad 4 smd rect (at 0.97 1.47 270) (size 0.3 0.8) (layers F.Cu F.Paste F.Mask) (net 26 "Net-(R4-Pad2)") (solder_mask_margin 0.07112)) (pad 6 smd rect (at 0.32 -1.47 270) (size 0.3 0.8) (layers F.Cu F.Paste F.Mask) (net 2 +VBAT) (solder_mask_margin 0.07112)) (pad 7 smd rect (at -0.32 -1.47) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask) (net 53 "/Power Supply/VCC") (solder_mask_margin 0.07112)) (pad 8 smd rect (at -0.97 -1.47) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask) (net 52 "/Power Supply/VBUS") (solder_mask_margin 0.07112)) (pad 9 smd rect (at 0 0 270) (size 2.4 1.65) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07112) (solder_paste_margin -0.09906)) (pad 5 smd rect (at 0.97 -1.47 270) (size 0.3 0.8) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07112)) (model ${KIPRJMOD}/../src/modelos.3dshapes/TPS2115A.step (offset (xyz 0 0 -0.101)) (scale (xyz 1 1 1)) (rotate (xyz -90 0 -90)) ) ) (module footprints:MKL03Z32CAF4R (layer B.Cu) (tedit 58373CBB) (tstamp 587D4CC5) (at 88.5 72.2 90) (path /580FD5C4) (solder_mask_margin 0.025) (attr smd) (fp_text reference U4 (at 0.0254 1.0922 90) (layer B.SilkS) hide (effects (font (size 0.3 0.3) (thickness 0.075)) (justify mirror)) ) (fp_text value MKL03Z32CAF4R (at 0 -1.4224 90) (layer B.SilkS) hide (effects (font (size 0.3 0.3) (thickness 0.075)) (justify mirror)) ) (fp_line (start -1 0.8) (end 1 0.8) (layer B.SilkS) (width 0.1)) (fp_line (start -1 -0.8) (end 1 -0.8) (layer B.SilkS) (width 0.1)) (fp_line (start 1 -0.8) (end 1 0.8) (layer B.SilkS) (width 0.1)) (fp_line (start -1 -0.8) (end -1 0.8) (layer B.SilkS) (width 0.1)) (fp_circle (center 0 0) (end 0.02 -0.02) (layer Dwgs.User) (width 0.01)) (fp_circle (center -0.8382 1.016) (end -0.7874 0.9652) (layer B.SilkS) (width 0.15)) (pad D5 smd circle (at 0.8 -0.6 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 68 /LED_R_MCU)) (pad D3 smd circle (at 0 -0.6 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 23 /SPI0_SS_b)) (pad B3 smd circle (at 0 0.2 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 70 /LED_G_MCU)) (pad C5 smd circle (at 0.8 -0.2 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad D2 smd circle (at -0.4 -0.6 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 21 /SPIO_MOSI)) (pad C2 smd circle (at -0.4 -0.2 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 5 /PTA9)) (pad A2 smd circle (at -0.4 0.6 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 7 /EXT_WAKE_UP)) (pad C4 smd circle (at 0.4 -0.2 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 61 /BT_UART0_RX)) (pad B1 smd circle (at -0.8 0.2 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 6 /RST_BT)) (pad D4 smd circle (at 0.4 -0.6 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 20 /SPIO_MISO)) (pad B5 smd circle (at 0.8 0.2 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 3 +3V3)) (pad C1 smd circle (at -0.8 -0.2 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 22 /SPIO_SCK)) (pad C3 smd circle (at 0 -0.2 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 62 /BT_UART0_TX)) (pad D1 smd circle (at -0.8 -0.6 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 58 "/Power Supply/STAT")) (pad B2 smd circle (at -0.4 0.2 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 8 /SDA)) (pad B4 smd circle (at 0.4 0.2 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 4 /~RESET_b)) (pad A5 smd circle (at 0.8 0.6 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 10 /SWD_DIO_MCU)) (pad A1 smd circle (at -0.8 0.6 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 9 /SCL)) (pad A3 smd circle (at 0 0.6 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 69 /LED_B_MCU)) (pad A4 smd circle (at 0.4 0.6 90) (size 0.26 0.26) (layers B.Cu B.Paste B.Mask) (net 11 /SWD_CLK_MCU)) (model ${KIPRJMOD}/../src/modelos.3dshapes/MKL03Z32CAF4R_20-WLCSP_1.995x1.609.step (at (xyz 0 0 -0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module footprints:ABS05-32.768KHZ-9-T (layer B.Cu) (tedit 58865B66) (tstamp 587FEAEA) (at 84.65 67.2 180) (descr "90 pin, 0.4mm pitch Wafer Level Chip Size Package (standard pin numbering)") (path /58743266) (solder_mask_margin 0.07) (solder_paste_margin -0.05) (clearance 0.1) (attr smd) (fp_text reference Y1 (at 0 1.3 180) (layer B.SilkS) hide (effects (font (size 0.3 0.3) (thickness 0.075)) (justify mirror)) ) (fp_text value "32,768 kHz" (at 0 -1.5 180) (layer B.SilkS) hide (effects (font (size 0.3 0.3) (thickness 0.075)) (justify mirror)) ) (fp_line (start -0.3 0.5) (end 0.3 0.5) (layer B.SilkS) (width 0.1)) (fp_line (start -0.9 -0.4) (end -0.9 0.4) (layer B.SilkS) (width 0.1)) (fp_line (start 0.3 -0.5) (end -0.3 -0.5) (layer B.SilkS) (width 0.1)) (fp_line (start 0.9 0.4) (end 0.9 -0.4) (layer B.SilkS) (width 0.1)) (pad 1 smd rect (at -0.6 0 180) (size 0.5 1) (layers B.Cu B.Paste B.Mask) (net 54 /XTAL32KP) (solder_mask_margin 0.07) (solder_paste_margin -0.05)) (pad 2 smd rect (at 0.6 0 180) (size 0.5 1) (layers B.Cu B.Paste B.Mask) (net 56 /XTAL32KM)) (model ${KIPRJMOD}/../src/modelos.3dshapes/ABS05-32.768KHZ-9-T.step (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz -90 0 0)) ) ) (module footprints:r_0402 (layer F.Cu) (tedit 588907C0) (tstamp 587D4CA0) (at 78.35 69.3) (path /586FE5CB/58793D3D) (attr smd) (fp_text reference R15 (at 0 -0.8) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (fp_text value "0 ohm" (at 0 -0.9) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (fp_line (start -0.2 -0.32) (end -0.82 -0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.82 -0.32) (end -0.82 0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.82 0.32) (end -0.2 0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.2 -0.32) (end 0.82 -0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.82 -0.32) (end 0.82 0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.82 0.32) (end 0.2 0.32) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 2 +VBAT) (solder_mask_margin 0.07112)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 59 "Net-(R15-Pad2)") (solder_mask_margin 0.07112)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0402.wrl (at (xyz 0 0 0)) (scale (xyz 0.625 0.625 0.625)) (rotate (xyz 0 0 0)) ) ) (module footprints:r_0402 (layer F.Cu) (tedit 588907C0) (tstamp 587D4CB8) (at 78.35 70.1 180) (path /586FE5CB/58793DE0) (attr smd) (fp_text reference R17 (at 0 -0.8 180) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (fp_text value DNP (at 0 -0.9 180) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (fp_line (start -0.2 -0.32) (end -0.82 -0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.82 -0.32) (end -0.82 0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.82 0.32) (end -0.2 0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.2 -0.32) (end 0.82 -0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.82 -0.32) (end 0.82 0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.82 0.32) (end 0.2 0.32) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 59 "Net-(R15-Pad2)") (solder_mask_margin 0.07112)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07112)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0402.wrl (at (xyz 0 0 0)) (scale (xyz 0.625 0.625 0.625)) (rotate (xyz 0 0 0)) ) ) (module footprints:r_0402 (layer F.Cu) (tedit 588907C0) (tstamp 587D4CC4) (at 79.45 71.5 270) (path /586FE5CB/58794503) (attr smd) (fp_text reference R18 (at 0 -0.8 270) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (fp_text value "0 ohm" (at 0 -0.9 270) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (fp_line (start -0.2 -0.32) (end -0.82 -0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.82 -0.32) (end -0.82 0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.82 0.32) (end -0.2 0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.2 -0.32) (end 0.82 -0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.82 -0.32) (end 0.82 0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.82 0.32) (end 0.2 0.32) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 60 "Net-(R16-Pad2)") (solder_mask_margin 0.07112)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07112)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0402.wrl (at (xyz 0 0 0)) (scale (xyz 0.625 0.625 0.625)) (rotate (xyz 0 0 0)) ) ) (module footprints:r_0402 (layer F.Cu) (tedit 588907C0) (tstamp 587D4CAC) (at 80.35 71.5 270) (path /586FE5CB/587944FD) (attr smd) (fp_text reference R16 (at 0 -0.8 270) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (fp_text value DNP (at 0 -0.9 270) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (fp_line (start -0.2 -0.32) (end -0.82 -0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.82 -0.32) (end -0.82 0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.82 0.32) (end -0.2 0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.2 -0.32) (end 0.82 -0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.82 -0.32) (end 0.82 0.32) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.82 0.32) (end 0.2 0.32) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.5 0 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 2 +VBAT) (solder_mask_margin 0.07112)) (pad 2 smd rect (at 0.5 0 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask) (net 60 "Net-(R16-Pad2)") (solder_mask_margin 0.07112)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0402.wrl (at (xyz 0 0 0)) (scale (xyz 0.625 0.625 0.625)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0402 (layer B.Cu) (tedit 588907FD) (tstamp 587D4C73) (at 86.45 67.2) (path /58744C32) (attr smd) (fp_text reference C18 (at 0 0.8) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016)) (justify mirror)) ) (fp_text value 22pF (at 0 0.8) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016)) (justify mirror)) ) (fp_line (start 0 0.25) (end 0 -0.25) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.5) (layers B.Cu B.Paste B.Mask) (net 54 /XTAL32KP) (solder_mask_margin 0.07112)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.5) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07112)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0402.wrl (at (xyz 0 0 0)) (scale (xyz 0.625 0.625 0.625)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0402 (layer B.Cu) (tedit 588907FD) (tstamp 587D4C81) (at 82.85 67.2 180) (path /58744EE3) (attr smd) (fp_text reference C20 (at 0 0.8 180) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016)) (justify mirror)) ) (fp_text value 22pF (at 0 0.8 180) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016)) (justify mirror)) ) (fp_line (start 0 0.25) (end 0 -0.25) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.5 0 180) (size 0.5 0.5) (layers B.Cu B.Paste B.Mask) (net 56 /XTAL32KM) (solder_mask_margin 0.07112)) (pad 2 smd rect (at 0.5 0 180) (size 0.5 0.5) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07112)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0402.wrl (at (xyz 0 0 0)) (scale (xyz 0.625 0.625 0.625)) (rotate (xyz 0 0 0)) ) ) (module footprints:r_0402 (layer B.Cu) (tedit 588907C0) (tstamp 587D4C94) (at 80.15 67) (path /58709A0B) (attr smd) (fp_text reference R14 (at 0 0.8) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016)) (justify mirror)) ) (fp_text value "0 ohm" (at 0 0.9) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016)) (justify mirror)) ) (fp_line (start -0.2 0.32) (end -0.82 0.32) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.82 0.32) (end -0.82 -0.32) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.82 -0.32) (end -0.2 -0.32) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.2 0.32) (end 0.82 0.32) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.82 0.32) (end 0.82 -0.32) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.82 -0.32) (end 0.2 -0.32) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.5 0) (size 0.5 0.5) (layers B.Cu B.Paste B.Mask) (net 55 "Net-(C19-Pad2)") (solder_mask_margin 0.07112)) (pad 2 smd rect (at 0.5 0) (size 0.5 0.5) (layers B.Cu B.Paste B.Mask) (net 57 "Net-(C21-Pad2)") (solder_mask_margin 0.07112)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0402.wrl (at (xyz 0 0 0)) (scale (xyz 0.625 0.625 0.625)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0402 (layer B.Cu) (tedit 588907FD) (tstamp 587D4C7A) (at 79.65 68.2 90) (path /58709388) (attr smd) (fp_text reference C19 (at 0 0.8 90) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016)) (justify mirror)) ) (fp_text value DNP (at 0 0.8 90) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016)) (justify mirror)) ) (fp_line (start 0 0.25) (end 0 -0.25) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.5) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07112)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.5) (layers B.Cu B.Paste B.Mask) (net 55 "Net-(C19-Pad2)") (solder_mask_margin 0.07112)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0402.wrl (at (xyz 0 0 0)) (scale (xyz 0.625 0.625 0.625)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0402 (layer B.Cu) (tedit 588907FD) (tstamp 587D4C88) (at 80.65 68.2 90) (path /58709392) (attr smd) (fp_text reference C21 (at 0 0.8 90) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016)) (justify mirror)) ) (fp_text value DNP (at 0 0.8 90) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016)) (justify mirror)) ) (fp_line (start 0 0.25) (end 0 -0.25) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.5 0 90) (size 0.5 0.5) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07112)) (pad 2 smd rect (at 0.5 0 90) (size 0.5 0.5) (layers B.Cu B.Paste B.Mask) (net 57 "Net-(C21-Pad2)") (solder_mask_margin 0.07112)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0402.wrl (at (xyz 0 0 0)) (scale (xyz 0.625 0.625 0.625)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0201 (layer B.Cu) (tedit 5873F9BE) (tstamp 5810DF6F) (at 91.6 63.39 90) (path /57A391F9) (attr smd) (fp_text reference C14 (at 0 1.651 90) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 10nF (at 0 0.7 90) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start 0 0.15) (end 0 -0.15) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0201 (layer B.Cu) (tedit 5873F9BE) (tstamp 5810DF63) (at 89.45 63.6 90) (path /57A39379) (attr smd) (fp_text reference C12 (at 0 1.651 90) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 0.1uF (at 0 0.7 90) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start 0 0.15) (end 0 -0.15) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:SOD-323 (layer F.Cu) (tedit 58891FDA) (tstamp 5810DF87) (at 86.75 66.1 90) (path /586FE5CB/58700F26) (attr smd) (fp_text reference D1 (at 0 -1.27 90) (layer F.SilkS) hide (effects (font (size 0.762 0.4572) (thickness 0.1143))) ) (fp_text value ESD5V0D3-TP (at 0 -1.27 90) (layer F.Fab) hide (effects (font (size 0.762 0.4572) (thickness 0.1143))) ) (fp_line (start -0.85 -0.65) (end 0.85 -0.65) (layer F.SilkS) (width 0.127)) (fp_line (start 0.85 0.65) (end -0.85 0.65) (layer F.SilkS) (width 0.127)) (fp_line (start 0.45 -0.65) (end 0.45 0.65) (layer F.SilkS) (width 0.127)) (fp_line (start 0.85 -0.65) (end 0.85 -0.4) (layer F.SilkS) (width 0.127)) (fp_line (start 0.85 0.65) (end 0.85 0.4) (layer F.SilkS) (width 0.127)) (fp_line (start -0.85 -0.65) (end -0.85 -0.4) (layer F.SilkS) (width 0.127)) (fp_line (start -0.85 0.65) (end -0.85 0.4) (layer F.SilkS) (width 0.127)) (pad 1 smd rect (at -1.05 0 90) (size 0.58 0.68) (layers F.Cu F.Paste F.Mask) (net 52 "/Power Supply/VBUS") (solder_mask_margin 0.07112)) (pad 2 smd rect (at 1.05 0 90) (size 0.58 0.68) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07112)) (model ${KIPRJMOD}/../src/modelos.3dshapes/sod323.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module footprints:conn_usb_B_micro_smd (layer F.Cu) (tedit 588A5532) (tstamp 5818EFF3) (at 91.4 66.14 90) (descr "USB B micro SMD connector, Molex P/N 47346-0001") (path /586FE5CB/58700EDC) (attr smd) (fp_text reference USB1 (at 0 2.60096 90) (layer F.SilkS) hide (effects (font (size 0.50038 0.50038) (thickness 0.09906))) ) (fp_text value USB-MICRO (at 0 -4.0005 90) (layer F.SilkS) hide (effects (font (size 0.50038 0.50038) (thickness 0.09906))) ) (fp_line (start 3.302 -2.921) (end 3.937 -2.921) (layer F.SilkS) (width 0.20066)) (fp_line (start 3.937 -1.0795) (end 3.937 -2.921) (layer F.SilkS) (width 0.20066)) (fp_line (start -3.937 -1.016) (end -3.937 -2.921) (layer F.SilkS) (width 0.20066)) (fp_line (start 3.937 1.143) (end 3.937 2.032) (layer F.SilkS) (width 0.20066)) (fp_line (start -3.937 -2.921) (end -3.302 -2.921) (layer F.SilkS) (width 0.20066)) (fp_line (start -3.937 2.032) (end -3.937 1.143) (layer F.SilkS) (width 0.20066)) (fp_line (start -4.20116 1.89992) (end -4.20116 2.10058) (layer F.SilkS) (width 0.20066)) (fp_line (start 4.20116 1.89992) (end -4.20116 1.89992) (layer F.SilkS) (width 0.20066)) (fp_line (start 4.20116 2.10058) (end 4.20116 1.89992) (layer F.SilkS) (width 0.20066)) (fp_line (start -4.20116 2.10058) (end 4.20116 2.10058) (layer F.SilkS) (width 0.20066)) (fp_line (start -4.20116 1.99898) (end 4.20116 1.99898) (layer F.SilkS) (width 0.20066)) (pad "" smd rect (at -0.84 0 90) (size 1.17 1.9) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.07112)) (pad "" smd rect (at 0.84 0 90) (size 1.17 1.9) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.07112)) (pad "" smd rect (at 2.91 0 90) (size 2.37 1.9) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.07112)) (pad "" smd rect (at -2.91 0 90) (size 2.37 1.9) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.07112)) (pad "" smd rect (at 2.46 -2.3 90) (size 1.47 2.1) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.07112)) (pad "" smd rect (at -2.46 -2.3 90) (size 1.47 2.1) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.07112)) (pad 1 smd rect (at -1.3 -2.66 90) (size 0.45 1.38) (layers F.Cu F.Paste F.Mask) (net 52 "/Power Supply/VBUS") (solder_mask_margin 0.07112)) (pad 2 smd rect (at -0.65 -2.66 90) (size 0.45 1.38) (layers F.Cu F.Paste F.Mask) (net 42 "Net-(USB1-Pad2)") (solder_mask_margin 0.07112)) (pad 3 smd rect (at 0 -2.66 90) (size 0.45 1.38) (layers F.Cu F.Paste F.Mask) (net 43 "Net-(USB1-Pad3)") (solder_mask_margin 0.07112)) (pad 4 smd rect (at 0.65 -2.66 90) (size 0.45 1.38) (layers F.Cu F.Paste F.Mask) (net 44 "Net-(USB1-Pad4)") (solder_mask_margin 0.07112)) (pad 5 smd rect (at 1.3 -2.66 90) (size 0.45 1.38) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07112)) (model ${KIPRJMOD}/../src/modelos.3dshapes/usb_B_micro_smd.step (offset (xyz 3.42 3 0.3)) (scale (xyz 1 1 1)) (rotate (xyz -90 0 90)) ) ) (module footprints:c_0201 (layer F.Cu) (tedit 5873F9BE) (tstamp 5810DF33) (at 77.25 64.6 225) (path /586FE5CB/587000E5) (attr smd) (fp_text reference C4 (at 0 -1.651 225) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_text value 0.1uF (at 0 -0.7 225) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_line (start 0 -0.15) (end 0 0.15) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 225) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 225) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:r_0201 (layer B.Cu) (tedit 5873FA05) (tstamp 581D0E93) (at 88.35 68.9 90) (path /581CF8EC) (attr smd) (fp_text reference R6 (at 0 1.651 90) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 10K (at 0 0.7 90) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start -0.5 0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 -0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 0.22) (end -0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.1 0.22) (end 0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 0.22) (end 0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 -0.22) (end 0.1 -0.22) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 8 /SDA) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0201 (layer B.Cu) (tedit 5873F9BE) (tstamp 5810DF75) (at 90.05 63.6 90) (path /57A392F6) (attr smd) (fp_text reference C15 (at 0 1.651 90) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 0.1uF (at 0 0.7 90) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start 0 0.15) (end 0 -0.15) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 15 "Net-(C15-Pad1)") (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0201 (layer B.Cu) (tedit 5873F9BE) (tstamp 5810DF5D) (at 90.35 68.9 90) (path /57B5156F) (attr smd) (fp_text reference C11 (at 0 1.651 90) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 0.1uF (at 0 0.7 90) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start 0 0.15) (end 0 -0.15) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 90) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:r_0201 (layer F.Cu) (tedit 5873FA05) (tstamp 5810DFB3) (at 81.45 70.5 90) (path /586FE5CB/58700141) (attr smd) (fp_text reference R4 (at 0 -1.651 90) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_text value 1.5K (at 0 -0.7 90) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_line (start -0.5 -0.22) (end -0.5 0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.1 0.22) (end -0.5 0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start -0.1 -0.22) (end -0.5 -0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.1 -0.22) (end 0.5 -0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.5 -0.22) (end 0.5 0.22) (layer F.SilkS) (width 0.1016)) (fp_line (start 0.5 0.22) (end 0.1 0.22) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 90) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 90) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 26 "Net-(R4-Pad2)") (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:c_0201 (layer F.Cu) (tedit 5873F9BE) (tstamp 58B8BBB5) (at 76.95 64.3 225) (path /586FE5CB/58B804E6) (attr smd) (fp_text reference C22 (at 0 -1.651 225) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_text value 4.7uF (at 0 -0.7 225) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_line (start 0 -0.15) (end 0 0.15) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 225) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 225) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:r_0201 (layer B.Cu) (tedit 5873FA05) (tstamp 58B8BBC1) (at 77.95 69.6 270) (path /58B7E561) (attr smd) (fp_text reference R12 (at 0 1.651 270) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 220 (at 0 0.7 270) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start -0.5 0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 -0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 0.22) (end -0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.1 0.22) (end 0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 0.22) (end 0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 -0.22) (end 0.1 -0.22) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 270) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 12 "Net-(D2-Pad3)") (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 270) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 69 /LED_B_MCU) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module "footprints:df12(3.0)-10dp-0.5v" (layer F.Cu) (tedit 58B86F16) (tstamp 5817BBCB) (at 84.79784 60.20422) (descr "Hirose DF12 series connector, DF12(3.0)-10DP-0.5V") (path /5817923E) (fp_text reference J1 (at 0 -3.50012) (layer F.SilkS) hide (effects (font (size 0.49784 0.49784) (thickness 0.09906))) ) (fp_text value DF12D-3.0-10DP-0.5V-81 (at 0 3.49758) (layer F.SilkS) hide (effects (font (size 0.4953 0.4953) (thickness 0.09906))) ) (fp_line (start 1.651 -1.143) (end 1.27 -1.143) (layer F.SilkS) (width 0.19812)) (fp_line (start -1.27 1.143) (end -1.651 1.143) (layer F.SilkS) (width 0.19812)) (fp_line (start 1.651 1.19888) (end 1.27 1.19888) (layer F.SilkS) (width 0.19812)) (fp_line (start 2.413 -1.905) (end 2.413 -1.016) (layer F.SilkS) (width 0.19812)) (fp_line (start 2.413 1.016) (end 2.413 1.905) (layer F.SilkS) (width 0.19812)) (fp_line (start -2.413 1.016) (end -2.413 1.905) (layer F.SilkS) (width 0.19812)) (fp_line (start -1.397 -1.905) (end -2.413 -1.905) (layer F.SilkS) (width 0.19812)) (fp_line (start 2.413 -1.905) (end 1.397 -1.905) (layer F.SilkS) (width 0.19812)) (fp_line (start 2.413 1.905) (end 1.397 1.905) (layer F.SilkS) (width 0.19812)) (fp_line (start -1.651 1.143) (end -1.651 -1.143) (layer F.SilkS) (width 0.19812)) (fp_line (start 1.651 -1.143) (end 1.651 1.19888) (layer F.SilkS) (width 0.19812)) (fp_line (start -1.651 1.016) (end -2.413 1.016) (layer F.SilkS) (width 0.19812)) (fp_line (start -1.651 -1.016) (end -2.413 -1.016) (layer F.SilkS) (width 0.19812)) (fp_line (start 1.651 -1.016) (end 2.413 -1.016) (layer F.SilkS) (width 0.19812)) (fp_line (start 2.413 1.016) (end 1.651 1.016) (layer F.SilkS) (width 0.19812)) (fp_line (start -2.413 -1.905) (end -2.413 -1.016) (layer F.SilkS) (width 0.19812)) (fp_line (start -1.27 -1.143) (end -1.651 -1.143) (layer F.SilkS) (width 0.19812)) (fp_line (start -1.397 1.905) (end -2.413 1.905) (layer F.SilkS) (width 0.19812)) (pad "" np_thru_hole circle (at 2.05 -1.5) (size 0.6 0.6) (drill 0.5969) (layers *.Cu *.Mask F.SilkS)) (pad "" np_thru_hole circle (at -2.05 -1.5) (size 0.6 0.6) (drill 0.5969) (layers *.Cu *.Mask F.SilkS)) (pad 10 smd rect (at 1 -1.8) (size 0.3 1.6) (layers F.Cu F.Paste F.Mask) (net 16 "Net-(J1-Pad10)") (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 9 smd rect (at 0.5 -1.8) (size 0.3 1.6) (layers F.Cu F.Paste F.Mask) (net 4 /~RESET_b) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 8 smd rect (at 0 -1.8) (size 0.3 1.6) (layers F.Cu F.Paste F.Mask) (net 10 /SWD_DIO_MCU) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 7 smd rect (at -0.5 -1.8) (size 0.3 1.6) (layers F.Cu F.Paste F.Mask) (net 11 /SWD_CLK_MCU) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 6 smd rect (at -1 -1.8) (size 0.3 1.6) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 5 smd rect (at -1 1.8) (size 0.3 1.6) (layers F.Cu F.Paste F.Mask) (net 6 /RST_BT) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 4 smd rect (at -0.5 1.8) (size 0.3 1.6) (layers F.Cu F.Paste F.Mask) (net 17 /SWD_CLK_BT) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 3 smd rect (at 0 1.8) (size 0.3 1.6) (layers F.Cu F.Paste F.Mask) (net 18 /SWD_DIO_BT) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 2 smd rect (at 0.5 1.8) (size 0.3 1.6) (layers F.Cu F.Paste F.Mask) (net 19 /Vpp) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 1 smd rect (at 1 1.8) (size 0.3 1.6) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad "" smd rect (at -2.75 0) (size 0.8 1.8) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826)) (pad "" smd rect (at 2.75 0) (size 0.8 1.8) (layers F.Cu F.Paste F.Mask) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826)) (model "${KIPRJMOD}/../src/modelos.3dshapes/df12(3.0)-10dp-0.5v.step" (offset (xyz 2.34 1.9 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 -180)) ) ) (module "footprints:df12(3.0)-10dp-0.5v" (layer B.Cu) (tedit 58B86F16) (tstamp 5817C48B) (at 83.4 71) (descr "Hirose DF12 series connector, DF12(3.0)-10DP-0.5V") (path /581792E1) (fp_text reference J2 (at 0 3.50012) (layer B.SilkS) hide (effects (font (size 0.49784 0.49784) (thickness 0.09906)) (justify mirror)) ) (fp_text value DF12D-3.0-10DP-0.5V-81 (at 0 -3.49758) (layer B.SilkS) hide (effects (font (size 0.4953 0.4953) (thickness 0.09906)) (justify mirror)) ) (fp_line (start 1.651 1.143) (end 1.27 1.143) (layer B.SilkS) (width 0.19812)) (fp_line (start -1.27 -1.143) (end -1.651 -1.143) (layer B.SilkS) (width 0.19812)) (fp_line (start 1.651 -1.19888) (end 1.27 -1.19888) (layer B.SilkS) (width 0.19812)) (fp_line (start 2.413 1.905) (end 2.413 1.016) (layer B.SilkS) (width 0.19812)) (fp_line (start 2.413 -1.016) (end 2.413 -1.905) (layer B.SilkS) (width 0.19812)) (fp_line (start -2.413 -1.016) (end -2.413 -1.905) (layer B.SilkS) (width 0.19812)) (fp_line (start -1.397 1.905) (end -2.413 1.905) (layer B.SilkS) (width 0.19812)) (fp_line (start 2.413 1.905) (end 1.397 1.905) (layer B.SilkS) (width 0.19812)) (fp_line (start 2.413 -1.905) (end 1.397 -1.905) (layer B.SilkS) (width 0.19812)) (fp_line (start -1.651 -1.143) (end -1.651 1.143) (layer B.SilkS) (width 0.19812)) (fp_line (start 1.651 1.143) (end 1.651 -1.19888) (layer B.SilkS) (width 0.19812)) (fp_line (start -1.651 -1.016) (end -2.413 -1.016) (layer B.SilkS) (width 0.19812)) (fp_line (start -1.651 1.016) (end -2.413 1.016) (layer B.SilkS) (width 0.19812)) (fp_line (start 1.651 1.016) (end 2.413 1.016) (layer B.SilkS) (width 0.19812)) (fp_line (start 2.413 -1.016) (end 1.651 -1.016) (layer B.SilkS) (width 0.19812)) (fp_line (start -2.413 1.905) (end -2.413 1.016) (layer B.SilkS) (width 0.19812)) (fp_line (start -1.27 1.143) (end -1.651 1.143) (layer B.SilkS) (width 0.19812)) (fp_line (start -1.397 -1.905) (end -2.413 -1.905) (layer B.SilkS) (width 0.19812)) (pad "" np_thru_hole circle (at 2.05 1.5) (size 0.6 0.6) (drill 0.5969) (layers *.Cu *.Mask B.SilkS)) (pad "" np_thru_hole circle (at -2.05 1.5) (size 0.6 0.6) (drill 0.5969) (layers *.Cu *.Mask B.SilkS)) (pad 10 smd rect (at 1 1.8) (size 0.3 1.6) (layers B.Cu B.Paste B.Mask) (net 20 /SPIO_MISO) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 9 smd rect (at 0.5 1.8) (size 0.3 1.6) (layers B.Cu B.Paste B.Mask) (net 21 /SPIO_MOSI) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 8 smd rect (at 0 1.8) (size 0.3 1.6) (layers B.Cu B.Paste B.Mask) (net 22 /SPIO_SCK) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 7 smd rect (at -0.5 1.8) (size 0.3 1.6) (layers B.Cu B.Paste B.Mask) (net 23 /SPI0_SS_b) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 6 smd rect (at -1 1.8) (size 0.3 1.6) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 5 smd rect (at -1 -1.8) (size 0.3 1.6) (layers B.Cu B.Paste B.Mask) (net 63 "Net-(J2-Pad5)") (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 4 smd rect (at -0.5 -1.8) (size 0.3 1.6) (layers B.Cu B.Paste B.Mask) (net 8 /SDA) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 3 smd rect (at 0 -1.8) (size 0.3 1.6) (layers B.Cu B.Paste B.Mask) (net 9 /SCL) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 2 smd rect (at 0.5 -1.8) (size 0.3 1.6) (layers B.Cu B.Paste B.Mask) (net 4 /~RESET_b) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad 1 smd rect (at 1 -1.8) (size 0.3 1.6) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826) (clearance 0.19558)) (pad "" smd rect (at -2.75 0) (size 0.8 1.8) (layers B.Cu B.Paste B.Mask) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826)) (pad "" smd rect (at 2.75 0) (size 0.8 1.8) (layers B.Cu B.Paste B.Mask) (solder_mask_margin 0.06858) (solder_paste_margin -0.04826)) (model "${KIPRJMOD}/../src/modelos.3dshapes/df12(3.0)-10dp-0.5v.step" (offset (xyz 2.35 1.9 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 -180)) ) ) (module footprints:c_0201 (layer F.Cu) (tedit 5873F9BE) (tstamp 58B9B7F6) (at 77.25 68.2 135) (path /586FE5CB/58B9B9CE) (attr smd) (fp_text reference C3 (at 0 -1.651 135) (layer F.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_text value 4.7uF (at 0 -0.7 135) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143))) ) (fp_line (start 0 -0.15) (end 0 0.15) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 135) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 53 "/Power Supply/VCC") (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 135) (size 0.28 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/c_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:LBCA2A2HNZYZ-711 (layer B.Cu) (tedit 58B86CD3) (tstamp 587D4CE3) (at 84.13 63 270) (descr "90 pin, 0.4mm pitch Wafer Level Chip Size Package (standard pin numbering)") (path /5812513F) (solder_mask_margin 0.07) (solder_paste_margin -0.05) (clearance 0.1) (attr smd) (fp_text reference U5 (at -2.7178 5.6354 270) (layer B.SilkS) hide (effects (font (size 0.5 0.5) (thickness 0.1)) (justify mirror)) ) (fp_text value LBCA2HNZYZ-711 (at 0.0254 -3.2308 270) (layer B.SilkS) hide (effects (font (size 0.5 0.5) (thickness 0.1)) (justify mirror)) ) (fp_line (start -3.5 5.2) (end 3.5 5.2) (layer B.SilkS) (width 0.127)) (fp_line (start -3.5 -2.2) (end -3.5 5.2) (layer B.SilkS) (width 0.127)) (fp_line (start 3.5 -2.2) (end -3.5 -2.2) (layer B.SilkS) (width 0.127)) (fp_line (start 3.5 5.2) (end 3.5 -2.2) (layer B.SilkS) (width 0.127)) (fp_circle (center -3.429 -2.545) (end -3.4036 -2.6212) (layer B.SilkS) (width 0.15)) (pad 16 smd rect (at 0.65 1.6 270) (size 0.35 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 17 smd rect (at 0 1.6 270) (size 0.35 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 18 smd rect (at -0.65 1.6 270) (size 0.35 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 19 smd rect (at -1.3 1.6 270) (size 0.35 0.65) (layers B.Cu B.Paste B.Mask) (net 48 "Net-(U5-Pad19)")) (pad 20 smd rect (at -1.95 1.6 270) (size 0.35 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 21 smd rect (at -2.9 1.63 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 22 smd rect (at -2.9 0.98 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 67 /LED_R_BT)) (pad 23 smd rect (at -2.9 0.33 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 64 /LED_B_BT)) (pad 24 smd rect (at -2.9 -0.32 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 62 /BT_UART0_TX) (solder_mask_margin 0.07) (solder_paste_margin -0.05)) (pad 7 smd rect (at 1.95 -1.6 270) (size 0.35 0.65) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.07) (solder_paste_margin -0.05)) (pad 6 smd rect (at 1.3 -1.6 270) (size 0.35 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 5 smd rect (at 0.65 -1.6 270) (size 0.35 0.65) (layers B.Cu B.Paste B.Mask) (net 18 /SWD_DIO_BT)) (pad 4 smd rect (at 0 -1.6 270) (size 0.35 0.65) (layers B.Cu B.Paste B.Mask) (net 17 /SWD_CLK_BT)) (pad 3 smd rect (at -0.65 -1.6 270) (size 0.35 0.65) (layers B.Cu B.Paste B.Mask) (net 29 "Net-(U5-Pad3)")) (pad 2 smd rect (at -1.3 -1.6 270) (size 0.35 0.65) (layers B.Cu B.Paste B.Mask) (net 65 /LED_G_BT)) (pad 1 smd rect (at -1.95 -1.6 270) (size 0.35 0.65) (layers B.Cu B.Paste B.Mask) (net 61 /BT_UART0_RX)) (pad 26 smd rect (at -2.9 -1.62 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 25 smd rect (at -2.9 -0.97 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 6 /RST_BT)) (pad 36 smd rect (at 2.9 4.63 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 51 "Net-(U5-Pad36)") (solder_mask_margin 0.07) (solder_paste_margin -0.05)) (pad 29 smd rect (at 1 -0.32 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 8 smd rect (at 2.9 -1.62 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 9 smd rect (at 2.9 -0.97 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 54 /XTAL32KP)) (pad 10 smd rect (at 2.9 -0.32 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 56 /XTAL32KM)) (pad 11 smd rect (at 2.9 0.33 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 46 "Net-(U5-Pad11)")) (pad 12 smd rect (at 2.9 0.98 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 45 "Net-(U5-Pad12)")) (pad 13 smd rect (at 2.9 1.63 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 57 "Net-(C21-Pad2)")) (pad 14 smd rect (at 1.95 1.6 270) (size 0.35 0.65) (layers B.Cu B.Paste B.Mask) (net 55 "Net-(C19-Pad2)")) (pad 15 smd rect (at 1.3 1.6 270) (size 0.35 0.65) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05)) (pad 28 smd rect (at 0 -0.32 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05)) (pad 27 smd rect (at -1 -0.32 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 30 smd rect (at 1.95 -0.32 270) (size 0.35 0.35) (layers B.Cu B.Paste B.Mask) (net 49 "Net-(U5-Pad30)")) (pad 35 smd rect (at -1.95 0.33 270) (size 0.35 0.35) (layers B.Cu B.Paste B.Mask) (net 50 "Net-(U5-Pad35)")) (pad 34 smd rect (at -1 0.33 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 33 smd rect (at 0 0.33 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 32 smd rect (at 1 0.33 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 1 GND)) (pad 31 smd rect (at 1.95 0.33 270) (size 0.35 0.35) (layers B.Cu B.Paste B.Mask) (net 19 /Vpp)) (pad 37 smd rect (at -2.9 4.63 270) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask) (net 47 "Net-(U5-Pad37)")) (model ${KIPRJMOD}/../src/modelos.3dshapes/LBCA2HNZYZ-711.wrl (offset (xyz 0 1.498599977493286 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:MPU-9250 (layer B.Cu) (tedit 58B8800E) (tstamp 5817BCCA) (at 89.75 66.24 90) (descr "Plastic QFP, Micrel QFN44-24LD-LP-1") (path /57A51A96) (attr smd) (fp_text reference U6 (at 0 2.90068 90) (layer B.SilkS) hide (effects (font (size 0.39878 0.39878) (thickness 0.07874)) (justify mirror)) ) (fp_text value MPU-9250 (at 0 -3.0988 90) (layer B.SilkS) hide (effects (font (size 0.39878 0.39878) (thickness 0.07874)) (justify mirror)) ) (fp_line (start 1.55 1.55) (end 1.55 1.3) (layer B.SilkS) (width 0.127)) (fp_line (start 1.55 1.55) (end 1.3 1.55) (layer B.SilkS) (width 0.127)) (fp_line (start -1.55 1.55) (end -1.55 1.3) (layer B.SilkS) (width 0.127)) (fp_line (start -1.3 1.55) (end -1.55 1.55) (layer B.SilkS) (width 0.127)) (fp_line (start 1.55 -1.3) (end 1.55 -1.55) (layer B.SilkS) (width 0.127)) (fp_line (start 1.55 -1.55) (end 1.3 -1.55) (layer B.SilkS) (width 0.127)) (fp_line (start -1.3 -1.55) (end -1.55 -1.55) (layer B.SilkS) (width 0.127)) (fp_line (start -1.55 -1.55) (end -1.55 -1.3) (layer B.SilkS) (width 0.127)) (fp_circle (center -1.651 -2.159) (end -1.5748 -2.159) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -1 -1.6 90) (size 0.25 0.55) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.065)) (pad 2 smd rect (at -0.6 -1.6 90) (size 0.25 0.55) (layers B.Cu B.Paste B.Mask) (net 30 "Net-(U6-Pad2)") (solder_mask_margin 0.065)) (pad 3 smd rect (at -0.2 -1.6 90) (size 0.25 0.55) (layers B.Cu B.Paste B.Mask) (net 31 "Net-(U6-Pad3)") (solder_mask_margin 0.065)) (pad 4 smd rect (at 0.2 -1.6 90) (size 0.25 0.55) (layers B.Cu B.Paste B.Mask) (net 32 "Net-(U6-Pad4)") (solder_mask_margin 0.065)) (pad 6 smd rect (at 1 -1.6 90) (size 0.25 0.55) (layers B.Cu B.Paste B.Mask) (net 33 "Net-(U6-Pad6)") (solder_mask_margin 0.065)) (pad 7 smd rect (at 1.6 -1 90) (size 0.55 0.25) (layers B.Cu B.Paste B.Mask) (net 34 "Net-(U6-Pad7)") (solder_mask_margin 0.065)) (pad 8 smd rect (at 1.6 -0.6 90) (size 0.55 0.25) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.065)) (pad 9 smd rect (at 1.6 -0.2 90) (size 0.55 0.25) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.065)) (pad 10 smd rect (at 1.6 0.2 90) (size 0.55 0.25) (layers B.Cu B.Paste B.Mask) (net 15 "Net-(C15-Pad1)") (solder_mask_margin 0.065)) (pad 25 smd rect (at 0.4 -0.4 90) (size 0.85 0.8) (layers B.Cu B.Paste B.Mask) (solder_mask_margin 0.065) (solder_paste_margin -0.09906)) (pad 25 smd rect (at -0.4 -0.4 90) (size 0.85 0.8) (layers B.Cu B.Paste B.Mask) (solder_mask_margin 0.065) (solder_paste_margin -0.09906)) (pad 25 smd rect (at -0.4 0.4 90) (size 0.85 0.8) (layers B.Cu B.Paste B.Mask) (solder_mask_margin 0.065) (solder_paste_margin -0.09906)) (pad 25 smd rect (at 0.4 0.4 90) (size 0.85 0.8) (layers B.Cu B.Paste B.Mask) (solder_mask_margin 0.065) (solder_paste_margin -0.09906)) (pad 11 smd rect (at 1.6 0.6 90) (size 0.55 0.25) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.065)) (pad 12 smd rect (at 1.6 1 90) (size 0.55 0.25) (layers B.Cu B.Paste B.Mask) (net 7 /EXT_WAKE_UP) (solder_mask_margin 0.065)) (pad 13 smd rect (at 1 1.6 90) (size 0.25 0.55) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.065)) (pad 14 smd rect (at 0.6 1.6 90) (size 0.25 0.55) (layers B.Cu B.Paste B.Mask) (net 35 "Net-(U6-Pad14)") (solder_mask_margin 0.065)) (pad 15 smd rect (at 0.2 1.6 90) (size 0.25 0.55) (layers B.Cu B.Paste B.Mask) (net 36 "Net-(U6-Pad15)") (solder_mask_margin 0.065)) (pad 16 smd rect (at -0.2 1.6 90) (size 0.25 0.55) (layers B.Cu B.Paste B.Mask) (net 37 "Net-(U6-Pad16)") (solder_mask_margin 0.065)) (pad 17 smd rect (at -0.6 1.6 90) (size 0.25 0.55) (layers B.Cu B.Paste B.Mask) (net 38 "Net-(U6-Pad17)") (solder_mask_margin 0.065)) (pad 18 smd rect (at -1 1.6 90) (size 0.25 0.55) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.065)) (pad 19 smd rect (at -1.6 1 90) (size 0.55 0.25) (layers B.Cu B.Paste B.Mask) (net 39 "Net-(U6-Pad19)") (solder_mask_margin 0.065)) (pad 20 smd rect (at -1.6 0.6 90) (size 0.55 0.25) (layers B.Cu B.Paste B.Mask) (net 1 GND) (solder_mask_margin 0.065)) (pad 5 smd rect (at 0.6 -1.6 90) (size 0.25 0.55) (layers B.Cu B.Paste B.Mask) (net 40 "Net-(U6-Pad5)") (solder_mask_margin 0.065)) (pad 21 smd rect (at -1.6 0.2 90) (size 0.55 0.25) (layers B.Cu B.Paste B.Mask) (net 41 "Net-(U6-Pad21)") (solder_mask_margin 0.065)) (pad 22 smd rect (at -1.6 -0.2 90) (size 0.55 0.25) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.065)) (pad 23 smd rect (at -1.6 -0.6 90) (size 0.55 0.25) (layers B.Cu B.Paste B.Mask) (net 9 /SCL) (solder_mask_margin 0.065)) (pad 24 smd rect (at -1.6 -1 90) (size 0.55 0.25) (layers B.Cu B.Paste B.Mask) (net 8 /SDA) (solder_mask_margin 0.065)) (model ${KIPRJMOD}/../src/modelos.3dshapes/MPU-9250.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:SML-LX0404SIUPGUSB (layer B.Cu) (tedit 58335D6E) (tstamp 58BDBD19) (at 84.15 58.1 180) (descr "90 pin, 0.4mm pitch Wafer Level Chip Size Package (standard pin numbering)") (path /58BDE472) (solder_mask_margin 0.07) (solder_paste_margin -0.05) (clearance 0.1) (attr smd) (fp_text reference D3 (at -0.4191 1.9812 180) (layer B.SilkS) hide (effects (font (size 0.5 0.5) (thickness 0.1)) (justify mirror)) ) (fp_text value LED_RABG (at 0.3556 -1.7907 180) (layer B.SilkS) hide (effects (font (size 0.3 0.3) (thickness 0.075)) (justify mirror)) ) (fp_line (start 0.2286 0.8128) (end 0.8128 0.8128) (layer B.SilkS) (width 0.127)) (fp_line (start -0.8382 -0.7874) (end -0.8382 -0.2286) (layer B.SilkS) (width 0.127)) (fp_line (start -0.2032 -0.8128) (end -0.8382 -0.8128) (layer B.SilkS) (width 0.127)) (fp_line (start 0.8128 0.8128) (end 0.8128 0.2286) (layer B.SilkS) (width 0.127)) (fp_circle (center 0.6096 1.045521) (end 0.6858 1.020121) (layer B.SilkS) (width 0.15)) (pad 3 smd rect (at -0.5 -0.5 180) (size 0.45 0.45) (layers B.Cu B.Paste B.Mask) (net 64 /LED_B_BT) (solder_mask_margin 0.07) (solder_paste_margin -0.05)) (pad 4 smd rect (at -0.5 0.5 180) (size 0.45 0.45) (layers B.Cu B.Paste B.Mask) (net 65 /LED_G_BT)) (pad 1 smd rect (at 0.5 0.5 180) (size 0.45 0.45) (layers B.Cu B.Paste B.Mask) (net 66 "Net-(D3-Pad1)")) (pad 2 smd rect (at 0.5 -0.5 180) (size 0.45 0.45) (layers B.Cu B.Paste B.Mask) (net 67 /LED_R_BT)) (model ${KIPRJMOD}/../src/modelos.3dshapes/SML-LX0404SIUPGUSB.step (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 90)) ) ) (module footprints:r_0201 (layer B.Cu) (tedit 5873FA05) (tstamp 58BDBD25) (at 82.05 58.1 180) (path /58BE0AEC) (attr smd) (fp_text reference R19 (at 0 1.651 180) (layer B.SilkS) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_text value 330 (at -0.2 0.6 180) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1143)) (justify mirror)) ) (fp_line (start -0.5 0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 -0.22) (end -0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start -0.1 0.22) (end -0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.1 0.22) (end 0.5 0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 0.22) (end 0.5 -0.22) (layer B.SilkS) (width 0.1016)) (fp_line (start 0.5 -0.22) (end 0.1 -0.22) (layer B.SilkS) (width 0.1016)) (pad 1 smd rect (at -0.26 0 180) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 66 "Net-(D3-Pad1)") (solder_mask_margin 0.07)) (pad 2 smd rect (at 0.26 0 180) (size 0.28 0.3) (layers B.Cu B.Paste B.Mask) (net 3 +3V3) (solder_mask_margin 0.07)) (model ${KIPRJMOD}/../src/modelos.3dshapes/r_0201.wrl (at (xyz 0 0 0)) (scale (xyz 0.3937 0.3937 0.3937)) (rotate (xyz 0 0 0)) ) ) (module footprints:FIDUCIAL_65MIL (layer B.Cu) (tedit 0) (tstamp 58BF0758) (at 94.85 55.1) (path /58BDDD35) (solder_mask_margin 3) (attr smd) (fp_text reference F1 (at 0.1 -1.6) (layer B.SilkS) hide (effects (font (size 0.6096 0.6096) (thickness 0.1524)) (justify mirror)) ) (fp_text value CONN_1 (at 0.1 1.4) (layer B.SilkS) hide (effects (font (size 0.6096 0.6096) (thickness 0.1524)) (justify mirror)) ) (pad "" smd circle (at 0 0) (size 1.651 1.651) (layers B.Cu B.Mask) (solder_mask_margin 0.8255) (clearance 1.0795)) ) (module footprints:FIDUCIAL_65MIL (layer B.Cu) (tedit 0) (tstamp 58BF075D) (at 88.45 79.1) (path /58BDDF13) (solder_mask_margin 3) (attr smd) (fp_text reference F2 (at 0 -1.6) (layer B.SilkS) hide (effects (font (size 0.6096 0.6096) (thickness 0.1524)) (justify mirror)) ) (fp_text value CONN_1 (at 0.1 1.5) (layer B.SilkS) hide (effects (font (size 0.6096 0.6096) (thickness 0.1524)) (justify mirror)) ) (pad "" smd circle (at 0 0) (size 1.651 1.651) (layers B.Cu B.Mask) (solder_mask_margin 0.8255) (clearance 1.0795)) ) (module footprints:FIDUCIAL_65MIL (layer B.Cu) (tedit 0) (tstamp 58BF0762) (at 70.85 66.1) (path /58BDDF4D) (solder_mask_margin 3) (attr smd) (fp_text reference F3 (at 0 -2.1) (layer B.SilkS) hide (effects (font (size 0.6096 0.6096) (thickness 0.1524)) (justify mirror)) ) (fp_text value CONN_1 (at 0 1.7) (layer B.SilkS) hide (effects (font (size 0.6096 0.6096) (thickness 0.1524)) (justify mirror)) ) (pad "" smd circle (at 0 0) (size 1.651 1.651) (layers B.Cu B.Mask) (solder_mask_margin 0.8255) (clearance 1.0795)) ) (module footprints:FIDUCIAL_65MIL (layer F.Cu) (tedit 0) (tstamp 58BF0767) (at 70.85 66.1) (path /58BDEAE2) (solder_mask_margin 3) (attr smd) (fp_text reference F4 (at 0.1 1.5) (layer F.SilkS) hide (effects (font (size 0.6096 0.6096) (thickness 0.1524))) ) (fp_text value CONN_1 (at 0.9 -1.6) (layer F.SilkS) hide (effects (font (size 0.6096 0.6096) (thickness 0.1524))) ) (pad "" smd circle (at 0 0) (size 1.651 1.651) (layers F.Cu F.Mask) (solder_mask_margin 0.8255) (clearance 1.0795)) ) (module footprints:FIDUCIAL_65MIL (layer F.Cu) (tedit 0) (tstamp 58BF076C) (at 88.45 79.1) (path /58BDEAE8) (solder_mask_margin 3) (attr smd) (fp_text reference F5 (at 0 1.7) (layer F.SilkS) hide (effects (font (size 0.6096 0.6096) (thickness 0.1524))) ) (fp_text value CONN_1 (at 0.1 -1.4) (layer F.SilkS) hide (effects (font (size 0.6096 0.6096) (thickness 0.1524))) ) (pad "" smd circle (at 0 0) (size 1.651 1.651) (layers F.Cu F.Mask) (solder_mask_margin 0.8255) (clearance 1.0795)) ) (module footprints:FIDUCIAL_65MIL (layer F.Cu) (tedit 0) (tstamp 58BF0771) (at 94.85 55.1) (path /58BDEAEE) (solder_mask_margin 3) (attr smd) (fp_text reference F6 (at 0 2) (layer F.SilkS) hide (effects (font (size 0.6096 0.6096) (thickness 0.1524))) ) (fp_text value CONN_1 (at 0 -1.9) (layer F.SilkS) hide (effects (font (size 0.6096 0.6096) (thickness 0.1524))) ) (pad "" smd circle (at 0 0) (size 1.651 1.651) (layers F.Cu F.Mask) (solder_mask_margin 0.8255) (clearance 1.0795)) ) (module footprints:TESTPOINT (layer F.Cu) (tedit 56E9B22C) (tstamp 58BF0776) (at 87.65 69.7) (path /586FE5CB/58BF3F88) (attr smd) (fp_text reference TP1 (at -1.1 0) (layer F.SilkS) (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (fp_text value TESTPOINT (at 0 -0.9) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (pad 1 smd circle (at 0 0) (size 0.762 0.762) (layers F.Cu F.Paste F.Mask) (net 52 "/Power Supply/VBUS")) ) (module footprints:TESTPOINT (layer F.Cu) (tedit 56E9B22C) (tstamp 58BF077B) (at 83.45 66.1) (path /586FE5CB/58BF4215) (attr smd) (fp_text reference TP2 (at -2.5 0.5 90) (layer F.SilkS) (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (fp_text value TESTPOINT (at 0 -0.9) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (pad 1 smd circle (at 0 0) (size 0.762 0.762) (layers F.Cu F.Paste F.Mask) (net 53 "/Power Supply/VCC")) ) (module footprints:TESTPOINT (layer F.Cu) (tedit 56E9B22C) (tstamp 58BF0780) (at 77.65 62.5) (path /586FE5CB/58BF4354) (attr smd) (fp_text reference TP3 (at 2.1 0.5) (layer F.SilkS) (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (fp_text value TESTPOINT (at 0 -0.9) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (pad 1 smd circle (at 0 0) (size 0.762 0.762) (layers F.Cu F.Paste F.Mask) (net 3 +3V3)) ) (module footprints:TESTPOINT (layer B.Cu) (tedit 58C1B1E5) (tstamp 58BF0785) (at 87.55 60.4) (path /58BF2804) (attr smd) (fp_text reference TP4 (at 0 1.3) (layer B.SilkS) (effects (font (size 0.7112 0.4572) (thickness 0.1016)) (justify mirror)) ) (fp_text value TESTPOINT (at -0.1 1.294826) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016)) (justify mirror)) ) (pad 1 smd circle (at 0 0) (size 0.762 0.762) (layers B.Cu B.Paste B.Mask) (net 61 /BT_UART0_RX)) ) (module footprints:TESTPOINT (layer B.Cu) (tedit 56E9B22C) (tstamp 58BF078A) (at 81.65 59) (path /58BF3276) (attr smd) (fp_text reference TP5 (at -1 0) (layer B.SilkS) (effects (font (size 0.7112 0.4572) (thickness 0.1016)) (justify mirror)) ) (fp_text value TESTPOINT (at 0 0.9) (layer B.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016)) (justify mirror)) ) (pad 1 smd circle (at 0 0) (size 0.762 0.762) (layers B.Cu B.Paste B.Mask) (net 62 /BT_UART0_TX)) ) (module footprints:BAT_CON (layer F.Cu) (tedit 5898DF57) (tstamp 587D4C6C) (at 83.55 72.6) (descr "Pontet Goute de soudure") (path /586FE5CB/58700F51) (attr virtual) (fp_text reference BT1 (at 1.905 -0.889 90) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value DNP (at -1.651 -1.397) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 0.889 1.2065) (end 0.889 0) (layer F.SilkS) (width 0.15)) (fp_line (start -0.889 -0.762) (end -0.889 -2.032) (layer F.SilkS) (width 0.15)) (fp_line (start -0.889 -2.032) (end 0.889 -2.032) (layer F.SilkS) (width 0.15)) (fp_line (start 0.889 1.27) (end -0.889 1.27) (layer F.SilkS) (width 0.15)) (fp_line (start 0.889 -0.762) (end 0.889 -2.032) (layer F.SilkS) (width 0.15)) (fp_line (start -0.889 0) (end -0.889 1.27) (layer F.SilkS) (width 0.15)) (fp_line (start 1.5 -1.8) (end 1.5 -1) (layer F.SilkS) (width 0.15)) (fp_line (start 1.1 -1.4) (end 1.9 -1.4) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at 0 -1.397) (size 1.3 0.95) (layers F.Cu F.Paste F.Mask) (net 2 +VBAT)) (pad 2 smd rect (at 0 0.635) (size 1.3 0.95) (layers F.Cu F.Paste F.Mask) (net 1 GND)) ) (module footprints:TPS82740B (layer F.Cu) (tedit 58CAD780) (tstamp 587FEAD0) (at 78.727676 66.374572 270) (path /586FE5CB/5870016E) (solder_mask_margin 0.025) (attr smd) (fp_text reference U2 (at -0.4826 -2.1082 270) (layer F.SilkS) hide (effects (font (size 0.5 0.5) (thickness 0.125))) ) (fp_text value TPS82740B (at 0 2.1844 270) (layer F.SilkS) hide (effects (font (size 0.5 0.5) (thickness 0.125))) ) (fp_line (start -1.5 -1.2) (end 1.5 -1.2) (layer F.SilkS) (width 0.1)) (fp_line (start -1.5 1.2) (end 1.5 1.2) (layer F.SilkS) (width 0.1)) (fp_line (start 1.5 1.2) (end 1.5 -1.2) (layer F.SilkS) (width 0.1)) (fp_line (start -1.5 1.2) (end -1.5 -1.2) (layer F.SilkS) (width 0.1)) (fp_circle (center -1.27 -1.415029) (end -1.2192 -1.368587) (layer F.SilkS) (width 0.15)) (pad B2 smd circle (at 0 0 270) (size 0.3 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.05)) (pad A2 smd circle (at 0 -0.8 270) (size 0.3 0.3) (layers F.Cu F.Paste F.Mask) (net 53 "/Power Supply/VCC") (solder_mask_margin 0.05)) (pad B1 smd circle (at -1 0 270) (size 0.3 0.3) (layers F.Cu F.Paste F.Mask) (net 27 "Net-(U2-PadB1)") (solder_mask_margin 0.05)) (pad B3 smd circle (at 1 0 270) (size 0.3 0.3) (layers F.Cu F.Paste F.Mask) (net 53 "/Power Supply/VCC") (solder_mask_margin 0.05)) (pad A1 smd circle (at -1 -0.8 270) (size 0.3 0.3) (layers F.Cu F.Paste F.Mask) (net 53 "/Power Supply/VCC") (solder_mask_margin 0.05)) (pad C2 smd circle (at 0 0.8 270) (size 0.3 0.3) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.05)) (pad A3 smd circle (at 1 -0.8 270) (size 0.3 0.3) (layers F.Cu F.Paste F.Mask) (net 53 "/Power Supply/VCC") (solder_mask_margin 0.05)) (pad C1 smd circle (at -1 0.8 270) (size 0.3 0.3) (layers F.Cu F.Paste F.Mask) (net 3 +3V3) (solder_mask_margin 0.05)) (pad C3 smd circle (at 1 0.8 270) (size 0.3 0.3) (layers F.Cu F.Paste F.Mask) (net 53 "/Power Supply/VCC") (solder_mask_margin 0.05)) (model ${KIPRJMOD}/../src/modelos.3dshapes/TPS82740B.step (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz -90 0 0)) ) ) (module footprints:MCP73821 (layer F.Cu) (tedit 58CAD8E4) (tstamp 5817BC27) (at 83.35 64.6 90) (descr "Plastic QFP, Microchip DFN8 2x3") (path /586FE5CB/58700F72) (attr smd) (fp_text reference U3 (at 0.0508 2.7178 270) (layer F.SilkS) hide (effects (font (size 0.3 0.3) (thickness 0.075))) ) (fp_text value MCP73831 (at -0.1778 -2.3622 90) (layer F.SilkS) hide (effects (font (size 0.3 0.3) (thickness 0.075))) ) (fp_line (start -1 2) (end -1 1.5) (layer F.SilkS) (width 0.127)) (fp_line (start 1 -2) (end 1 -1.5) (layer F.SilkS) (width 0.127)) (fp_line (start -1 2) (end -0.5 2) (layer F.SilkS) (width 0.127)) (fp_line (start 0.5 -2) (end 1 -2) (layer F.SilkS) (width 0.127)) (fp_line (start -1 -1.5) (end -1 -2) (layer F.SilkS) (width 0.127)) (fp_line (start -1 -2) (end -0.5 -2) (layer F.SilkS) (width 0.127)) (fp_line (start 1 2) (end 0.5 2) (layer F.SilkS) (width 0.127)) (fp_line (start 1 1.5) (end 1 2) (layer F.SilkS) (width 0.127)) (fp_circle (center -0.762 2.286) (end -0.7112 2.3368) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.75 1.45 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask) (net 52 "/Power Supply/VBUS") (solder_mask_margin 0.05)) (pad 2 smd rect (at -0.25 1.45 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask) (net 52 "/Power Supply/VBUS") (solder_mask_margin 0.05)) (pad 3 smd rect (at 0.25 1.45 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask) (net 2 +VBAT) (solder_mask_margin 0.05)) (pad 4 smd rect (at 0.75 1.45 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask) (net 2 +VBAT) (solder_mask_margin 0.05)) (pad 5 smd rect (at 0.75 -1.45 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask) (net 58 "/Power Supply/STAT") (solder_mask_margin 0.05)) (pad 6 smd rect (at 0.25 -1.45 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.05)) (pad 7 smd rect (at -0.25 -1.45 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask) (net 28 "Net-(U3-Pad7)") (solder_mask_margin 0.05)) (pad 8 smd rect (at -0.75 -1.45 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask) (net 25 "Net-(R2-Pad1)") (solder_mask_margin 0.05)) (pad 9 smd rect (at 0 -0.6 90) (size 0.4 0.45) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.05) (solder_paste_margin_ratio -0.15)) (pad 9 smd rect (at -0.5 -0.6 90) (size 0.4 0.45) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.05) (solder_paste_margin_ratio -0.15)) (pad 9 smd rect (at 0.5 -0.6 90) (size 0.4 0.45) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.05) (solder_paste_margin_ratio -0.15)) (pad 9 smd rect (at 0.5 0.6 90) (size 0.4 0.45) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.05) (solder_paste_margin_ratio -0.15)) (pad 9 smd rect (at 0 0 90) (size 0.4 0.45) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.05) (solder_paste_margin_ratio -0.15)) (pad 9 smd rect (at -0.5 0.6 90) (size 0.4 0.45) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.05) (solder_paste_margin_ratio -0.15)) (pad 9 smd rect (at 0.5 0 90) (size 0.4 0.45) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.05) (solder_paste_margin_ratio -0.15)) (pad 9 smd rect (at -0.5 0 90) (size 0.4 0.45) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.05) (solder_paste_margin_ratio -0.15)) (pad 9 smd rect (at 0 0.6 90) (size 0.4 0.45) (layers F.Cu F.Paste F.Mask) (net 1 GND) (solder_mask_margin 0.05) (solder_paste_margin_ratio -0.15)) (model ${KIPRJMOD}/../src/modelos.3dshapes/MCP73821.step (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 -90)) ) ) (gr_text V1.0 (at 87.85 74.3) (layer B.SilkS) (effects (font (size 0.7 0.7) (thickness 0.175)) (justify mirror)) ) (gr_text "INTI \nEnyetech" (at 87.85 72.1 45) (layer F.SilkS) (effects (font (size 0.9 0.9) (thickness 0.225))) ) (gr_text "Via In PAD\n" (at 98.05 83.1) (layer Dwgs.User) (effects (font (size 1.5 1.5) (thickness 0.3))) ) (gr_line (start 88.45 83.1) (end 91.85 83.1) (layer Dwgs.User) (width 0.2)) (gr_line (start 88.45 73.5) (end 88.45 83.1) (layer Dwgs.User) (width 0.2)) (gr_line (start 87.75 73.5) (end 87.75 71.5) (layer Dwgs.User) (width 0.2)) (gr_line (start 89.25 73.5) (end 87.75 73.5) (layer Dwgs.User) (width 0.2)) (gr_line (start 89.25 71.5) (end 89.25 73.5) (layer Dwgs.User) (width 0.2)) (gr_line (start 87.75 71.5) (end 89.25 71.5) (layer Dwgs.User) (width 0.2)) (gr_text "IND. 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