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to go underneath the 3.3 V power or vice versa to deliver power to the CAN driver\n-> WE COULD AVOID THIS, by routing 3.3 V left around the PCB-trace\n-> we would have to route the USB as well as the I2C on the third \nMy guess: it's better to route power underneath the USB lines and I2C lines than the other way around.\nSince the power signal itself is not sensitive, and it can be made thick there, the USB signals however are very susceptible to the increased inductance\nSo route the signal to 2 sides and avoid routing power underneath USB\n# FETS\nPut the FETS as close to the VBAT line and the R_SMALL as possible.\nThe path to ground should be minimized to minimize the inductance on the power supply line.\n\n# MEASUREMENT SIGNALS\n- The current signals\n- The voltage signals\nAre both measured on the low side of the circuit and will need to go through the 3rd layer.\n\n# USB DP AND DN\nA problem here is appearing because of our shitty choise of ESD protection,\nwhich because of the pad structure doesn't allow to simply route the ESD through the chip.\nWe need to reroute it through a via which might defeat the purpose of the ESD protection here." 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