(kicad_pcb (version 20240101) (generator "AperturePhantom PCB generator") (generator_version "1.0") (general (thickness 1.6) (legacy_teardrops no)) (paper "A4") (title_block (title "AperturePhantom — MIPI CSI-2 Camera Interposer PCB") (date "2026-07-04") (rev "1") (company "jayis1") (comment 1 "Author: jayis1") (comment 2 "License: GPL-2.0") (comment 3 "For authorized security research only")) ; ---- Layers ---- (layers (0 "F.Cu" signal) (1 "In1.Cu" signal "GND") (2 "In2.Cu" signal "PWR") (31 "B.Cu" signal) (32 "B.Adhes" user "B.Adhesive") (33 "F.Adhes" user "F.Adhesive") (34 "B.Paste" user) (35 "F.Paste" user) (36 "B.SilkS" user "B.Silkscreen") (37 "F.SilkS" user "F.Silkscreen") (38 "B.Mask" user) (39 "F.Mask" user) (40 "Dwgs.User" user "User.Drawings") (41 "Cmts.User" user "User.Comments") (42 "Eco1.User" user "User.Eco1") (43 "Eco2.User" user "User.Eco2") (44 "Edge.Cuts" user) (45 "Margin" user) (46 "B.CrtYd" user "B.Courtyard") (47 "F.CrtYd" user "F.Courtyard") (48 "B.Fab" user) (49 "F.Fab" user)) ; ---- Setup / design rules ---- (setup (pad_to_mask_clearance 0.05) (solder_mask_min_width 0.05) (grid_origin 0 0) (outputdir "gerbers/") (pcbplotparams (layerselection 0x00010fc_ffffffff) (plot_on_all_layers_selection 0x0000000_00000000) (usegerberextensions true) (usegerberattributes true) (usegerberadvancedattributes true) (creategerberjobfile true))) (net 0 "") (net 1 "GND") (net 2 "VCC_3V3") (net 3 "VBAT") (net 4 "VANA_SENS") (net 5 "CSI_D0_N") (net 6 "CSI_D0_P") (net 7 "CSI_D1_N") (net 8 "CSI_D1_P") (net 9 "CSI_CLK_N") (net 10 "CSI_CLK_P") (net 11 "CCI_SCL_A") (net 12 "CCI_SDA_A") (net 13 "CCI_SCL_B") (net 14 "CCI_SDA_B") (net 15 "SPI_MOSI") (net 16 "SPI_MISO") (net 17 "SPI_SCK") (net 18 "FPGA_CS_N") (net 19 "FPGA_RST_N") (net 20 "FPGA_IRQ_N") (net 21 "SDMMC_CMD") (net 22 "SDMMC_CK") (net 23 "SDMMC_D0") (net 24 "USB_DM") (net 25 "USB_DP") (net 26 "LED_R") (net 27 "LED_G") (net 28 "LED_B") (net 29 "MOTOR_EN") (net 30 "DS28E07_DQ") (net 31 "INA219_ALERT") (net 32 "TOUCH0") (net 33 "TOUCH1") (net 34 "TOUCH2") (net 35 "SENSOR_MUX") (net 36 "SD_CD") ; ---- Footprints (placements) ---- ; All placements reference real KiCad library footprints. Coordinates in mm ; on the 35x20 mm board. Origin at lower-left. (footprint "Package_QFP:LQFP-100_14x14mm_P0.5mm" (layer "F.Cu") (tedit 0) (tstamp 00000000-0000-0000-0000-000000000001) (at 20 10 0) (property "Reference" "U1" (at 0 -8 0)) (property "Value" "STM32H743VIT6" (at 0 8 0)) (property "Footprint" "Package_QFP:LQFP-100_14x14mm_P0.5mm" (at 0 0 0)) (property "Datasheet" "Author: jayis1") (pad "1" smd rect (at -7.5 -6 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1)) (pad "2" smd rect (at -6.5 -6 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 2)) (pad "3" smd rect (at -5.5 -6 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 15)) (pad "4" smd rect (at -4.5 -6 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 16)) (pad "5" smd rect (at -3.5 -6 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 17)) (pad "6" smd rect (at -2.5 -6 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 18)) (pad "7" smd rect (at -1.5 -6 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 19))) (footprint "Package_BGA:caBGA-256_17x17mm_1.0mm" (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000002) (at 8 10 0) (property "Reference" "U2" (at 0 -10 0)) (property "Value" "LIFMD-25" (at 0 10 0)) (property "Footprint" "Package_BGA:caBGA-256_17x17mm_1.0mm" (at 0 0 0)) (property "Datasheet" "Author: jayis1") (pad "A1" smd circle (at -8 -8 0) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 1)) (pad "A2" smd circle (at -7 -8 0) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 2)) (pad "B1" smd circle (at -8 -7 0) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 5)) (pad "B2" smd circle (at -7 -7 0) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 6)) (pad "C1" smd circle (at -8 -6 0) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 7)) (pad "C2" smd circle (at -7 -6 0) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 8)) (pad "D1" smd circle (at -8 -5 0) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 9)) (pad "D2" smd circle (at -7 -5 0) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 10))) (footprint "Package_SO:TSOP-II-54_10.16x22.22mm_P0.8mm" (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000003) (at 28 10 0) (property "Reference" "U3" (at 0 -12 0)) (property "Value" "IS42S16160J-7BLI" (at 0 12 0)) (property "Footprint" "Package_SO:TSOP-II-54_10.16x22.22mm_P0.8mm" (at 0 0 0)) (property "Datasheet" "Author: jayis1") (pad "1" smd rect (at -5 -11 0) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 2)) (pad "2" smd rect (at -4 -11 0) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 1))) (footprint "Connector_FFC-FPC:Hirose_FH12-22S-0.5SH_1x22_P0.5mm_Vertical" (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000004) (at 4 4 0) (property "Reference" "J1" (at 0 -3 0)) (property "Value" "FPC22_SENSOR" (at 0 3 0)) (property "Footprint" "Connector_FFC-FPC:Hirose_FH12-22S-0.5SH" (at 0 0 0)) (property "Datasheet" "Author: jayis1") (pad "1" smd rect (at -5.25 -1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 4)) (pad "2" smd rect (at -4.75 -1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 1)) (pad "3" smd rect (at -4.25 -1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 9)) (pad "4" smd rect (at -3.75 -1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 10)) (pad "5" smd rect (at -3.25 -1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 5)) (pad "6" smd rect (at -2.75 -1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 6)) (pad "7" smd rect (at -2.25 -1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 7)) (pad "8" smd rect (at -1.75 -1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 8)) (pad "9" smd rect (at -1.25 -1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 11)) (pad "10" smd rect (at -0.75 -1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 12))) (footprint "Connector_FFC-FPC:Hirose_FH12-22S-0.5SH_1x22_P0.5mm_Vertical" (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000005) (at 4 16 0) (property "Reference" "J2" (at 0 -3 0)) (property "Value" "FPC22_HOST" (at 0 3 0)) (property "Footprint" "Connector_FFC-FPC:Hirose_FH12-22S-0.5SH" (at 0 0 0)) (property "Datasheet" "Author: jayis1") (pad "1" smd rect (at -5.25 1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 4)) (pad "2" smd rect (at -4.75 1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 1)) (pad "3" smd rect (at -4.25 1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 9)) (pad "4" smd rect (at -3.75 1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 10)) (pad "5" smd rect (at -3.25 1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 5)) (pad "6" smd rect (at -2.75 1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 6)) (pad "7" smd rect (at -2.25 1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 7)) (pad "8" smd rect (at -1.75 1 0) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 8))) (footprint "Package_DFNQFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm" (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000006) (at 30 4 0) (property "Reference" "U4" (at 0 -4 0)) (property "Value" "EFR32BG22C224" (at 0 4 0)) (property "Footprint" "Package_DFNQFN:QFN-32-1EP_5x5mm_P0.5mm" (at 0 0 0)) (property "Datasheet" "Author: jayis1") (pad "1" smd rect (at -2.25 -2.25 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 2)) (pad "2" smd rect (at -1.75 -2.25 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1))) (footprint "Package_DFNQFN:QFN-12-1EP_3x3mm_P0.5mm_EP1.7x1.7mm" (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000007) (at 4 4 0) (property "Reference" "U5" (at 0 -3 0)) (property "Value" "MP2667" (at 0 3 0)) (property "Footprint" "Package_DFNQFN:QFN-12-1EP_3x3mm" (at 0 0 0)) (property "Datasheet" "Author: jayis1") (pad "1" smd rect (at -1.25 -1.25 0) (size 0.3 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net 3))) (footprint "Package_DFNQFN:VQFN-8-1EP_2x2mm_P0.45mm_EP0.9x0.9mm" (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000008) (at 8 4 0) (property "Reference" "U6" (at 0 -2 0)) (property "Value" "TPS62162" (at 0 2 0)) (property "Footprint" "Package_DFNQFN:VQFN-8" (at 0 0 0)) (property "Datasheet" "Author: jayis1") (pad "1" smd rect (at -1 -1 0) (size 0.3 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net 3)) (pad "2" smd rect (at 0 -1 0) (size 0.3 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net 2))) (footprint "Package_TO_SOT_SMD:SOT-23-8" (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000009) (at 30 16 0) (property "Reference" "U7" (at 0 -3 0)) (property "Value" "INA219AIDC" (at 0 3 0)) (property "Footprint" "Package_TO_SOT_SMD:SOT-23-8" (at 0 0 0)) (property "Datasheet" "Author: jayis1") (pad "1" smd rect (at -1.5 -1.5 0) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 4)) (pad "2" smd rect (at -0.5 -1.5 0) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 31))) (footprint "Package_TO_SOT_SMD:SOT-223-3_TabPin2" (layer "F.Cu") (tstamp 00000000-0000-0000-0000-00000000000a) (at 33 16 0) (property "Reference" "U8" (at 0 -3 0)) (property "Value" "DS28E07-100" (at 0 3 0)) (property "Footprint" "Package_TO_SOT_SMD:SOT-223-3" (at 0 0 0)) (property "Datasheet" "Author: jayis1") (pad "1" smd rect (at -2 3 0) (size 0.6 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 30))) (footprint "Connector_USB:USB_C_Receptacle_GCT_USB4105" (layer "F.Cu") (tstamp 00000000-0000-0000-0000-00000000000b) (at 16 3 0) (property "Reference" "J4" (at 0 -5 0)) (property "Value" "USB-C" (at 0 5 0)) (property "Footprint" "Connector_USB:USB_C_Receptacle_GCT_USB4105" (at 0 0 0)) (property "Datasheet" "Author: jayis1") (pad "A1" smd rect (at -3 -1 0) (size 0.3 1) (layers "F.Cu" "F.Paste" "F.Mask") (net 1)) (pad "A5" smd rect (at -1.5 -1 0) (size 0.3 1) (layers "F.Cu" "F.Paste" "F.Mask") (net 2)) (pad "B12" smd rect (at 1.5 -1 0) (size 0.3 1) (layers "F.Cu" "F.Paste" "F.Mask") (net 1)) (pad "B11" smd rect (at 2.5 -1 0) (size 0.3 1) (layers "F.Cu" "F.Paste" "F.Mask") (net 25)) (pad "A11" smd rect (at -2.5 -1 0) (size 0.3 1) (layers "F.Cu" "F.Paste" "F.Mask") (net 25)) (pad "A10" smd rect (at -3.5 -1 0) (size 0.3 1) (layers "F.Cu" "F.Paste" "F.Mask") (net 24)) (pad "B10" smd rect (at 3.5 -1 0) (size 0.3 1) (layers "F.Cu" "F.Paste" "F.Mask") (net 24))) (footprint "Connector_Card:microSD_HC_Hirose_DM3D" (layer "F.Cu") (tstamp 00000000-0000-0000-0000-00000000000c) (at 24 16 0) (property "Reference" "J5" (at 0 -6 0)) (property "Value" "MicroSD" (at 0 6 0)) (property "Footprint" "Connector_Card:microSD_HC_Hirose_DM3D" (at 0 0 0)) (property "Datasheet" "Author: jayis1") (pad "1" smd rect (at 4 -4 0) (size 0.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 21)) (pad "2" smd rect (at 3 -4 0) (size 0.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 23)) (pad "3" smd rect (at 2 -4 0) (size 0.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 1)) (pad "4" smd rect (at 1 -4 0) (size 0.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 2)) (pad "5" smd rect (at 0 -4 0) (size 0.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 22)) (pad "6" smd rect (at -1 -4 0) (size 0.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 36))) ; ---- Tracks (selected critical nets only; full routing done in editor) ---- (segment (start 4 4) (end 4 10) (width 0.2) (layer "F.Cu") (net 9) (tstamp s0001)) (segment (start 4.5 4) (end 4.5 10) (width 0.2) (layer "F.Cu") (net 10) (tstamp s0002)) (segment (start 5 4) (end 5 10) (width 0.2) (layer "F.Cu") (net 5) (tstamp s0003)) (segment (start 5.5 4) (end 5.5 10) (width 0.2) (layer "F.Cu") (net 6) (tstamp s0004)) (segment (start 6 4) (end 6 10) (width 0.2) (layer "F.Cu") (net 7) (tstamp s0005)) (segment (start 6.5 4) (end 6.5 10) (width 0.2) (layer "F.Cu") (net 8) (tstamp s0006)) (segment (start 7 4) (end 7 10) (width 0.2) (layer "F.Cu") (net 11) (tstamp s0007)) (segment (start 7.5 4) (end 7.5 10) (width 0.2) (layer "F.Cu") (net 12) (tstamp s0008)) (segment (start 12 4) (end 20 4) (width 0.15) (layer "F.Cu") (net 15) (tstamp s0009)) (segment (start 12 4.5) (end 20 4.5) (width 0.15) (layer "F.Cu") (net 16) (tstamp s0010)) (segment (start 12 5) (end 20 5) (width 0.15) (layer "F.Cu") (net 17) (tstamp s0011)) (segment (start 12 5.5) (end 20 5.5) (width 0.15) (layer "F.Cu") (net 18) (tstamp s0012)) (segment (start 12 6) (end 20 6) (width 0.15) (layer "F.Cu") (net 19) (tstamp s0013)) (segment (start 24 16) (end 24 10) (width 0.2) (layer "F.Cu") (net 21) (tstamp s0014)) (segment (start 24.5 16) (end 24.5 10) (width 0.2) (layer "F.Cu") (net 23) (tstamp s0015)) (segment (start 25 16) (end 25 10) (width 0.2) (layer "F.Cu") (net 22) (tstamp s0016)) ; differential pair: CSI_CLK_P/N to FPGA (90-ohm) (segment (start 4 4) (end 8 6) (width 0.18) (layer "In1.Cu") (net 9) (tstamp s0017)) (segment (start 4.5 4) (end 8 6.5) (width 0.18) (layer "In1.Cu") (net 10) (tstamp s0018)) ; LED + motor + touch (segment (start 22 9) (end 22 14) (width 0.15) (layer "F.Cu") (net 26) (tstamp s0019)) (segment (start 22.5 9) (end 22.5 14) (width 0.15) (layer "F.Cu") (net 27) (tstamp s0020)) (segment (start 23 9) (end 23 14) (width 0.15) (layer "F.Cu") (net 28) (tstamp s0021)) (segment (start 23.5 9) (end 23.5 14) (width 0.15) (layer "F.Cu") (net 29) (tstamp s0022)) ; ---- Board outline (35x20 mm) ---- (gr_line (start 0 0) (end 35 0) (layer "Edge.Cuts") (width 0.1) (tstamp e0001)) (gr_line (start 35 0) (end 35 20) (layer "Edge.Cuts") (width 0.1) (tstamp e0002)) (gr_line (start 35 20) (end 0 20) (layer "Edge.Cuts") (width 0.1) (tstamp e0003)) (gr_line (start 0 20) (end 0 0) (layer "Edge.Cuts") (width 0.1) (tstamp e0004)) ; ---- Vias to inner GND plane ---- (via (at 2 2) (size 0.4) (drill 0.2) (layers "F.Cu" "In1.Cu") (net 1) (tstamp v0001)) (via (at 33 2) (size 0.4) (drill 0.2) (layers "F.Cu" "In1.Cu") (net 1) (tstamp v0002)) (via (at 2 18) (size 0.4) (drill 0.2) (layers "F.Cu" "In1.Cu") (net 1) (tstamp v0003)) (via (at 33 18) (size 0.4) (drill 0.2) (layers "F.Cu" "In1.Cu") (net 1) (tstamp v0004)) ; ---- Zone fills ---- (zone (net 1) (layer "In1.Cu") (tstamp z0001) (hatch edge 0.5) (connect_pads (clearance 0.2)) (min_thickness 0.15) (fill yes (thermal_gap 0.2) (thermal_bridge_width 0.25)) (polygon (pts (xy 0 0) (xy 35 0) (xy 35 20) (xy 0 20)))) (zone (net 2) (layer "In2.Cu") (tstamp z0002) (hatch edge 0.5) (connect_pads (clearance 0.2)) (min_thickness 0.15) (fill yes (thermal_gap 0.2) (thermal_bridge_width 0.25)) (polygon (pts (xy 0 0) (xy 35 0) (xy 35 20) (xy 0 20)))) (metadata (pdf_data (title "AperturePhantom PCB") (author "jayis1") (subject "MIPI CSI-2 camera interposer PCB") (keywords "MIPI CSI-2 camera interposer PCB"))) )