(kicad_pcb (version 20231121) (generator "pcbnew") (generator_version "7.0") (general (thickness 1.6) (legacy_teardrops no) ) (paper "A4") (title_block (title "Aurora-Phantom PCB") (date "2026-07-02") (rev "1.0.0") (company "jayis1") (comment 1 "Author: jayis1") (comment 2 "License: GPL-2.0") (comment 3 "95x55mm optical emanations recon device") ) (layers (0 "F.Cu" signal "Top copper — components + RF") (1 "In1.Cu" signal "Inner 1 — GND solid plane") (2 "In2.Cu" signal "Inner 2 — 3V3/1V2 power plane") (31 "B.Cu" signal "Bottom copper — SD + USB routing") (32 "B.Adhes" user "B.Adhes") (33 "F.Adhes" user "F.Adhes") (34 "B.Paste" user "B.Paste") (35 "F.Paste" user "F.Paste") (36 "B.SilkS" user "B.SilkS") (37 "F.SilkS" user "F.SilkS") (38 "B.Mask" user "B.Mask") (39 "F.Mask" user "F.Mask") (40 "Dwgs.User" user "Dwgs.User") (41 "Cmts.User" user "Cmts.User") (42 "Eco1.User" user "Eco1.User") (43 "Eco2.User" user "Eco2.User") (44 "Edge.Cuts" user "Edge.Cuts — board outline 95x55mm") (45 "Margin" user "Margin") (46 "B.CrtYd" user "B.CrtYd") (47 "F.CrtYd" user "F.CrtYd") (48 "B.Fab" user "B.Fab") (49 "F.Fab" user "F.Fab") ) (setup (stackup (layer "F.SilkS" (type "Silkscreen")) (layer "F.Paste" (type "Solderpaste")) (layer "F.Mask" (type "Soldermask")) (layer "F.Cu" (type "copper") (thickness 0.035)) (layer "dielectric 1" (type "core") (thickness 0.2) (material "FR4")) (layer "In1.Cu" (type "copper") (thickness 0.035)) (layer "dielectric 2" (type "prepreg") (thickness 0.7) (material "FR4")) (layer "In2.Cu" (type "copper") (thickness 0.035)) (layer "dielectric 3" (type "core") (thickness 0.2) (material "FR4")) (layer "B.Cu" (type "copper") (thickness 0.035)) (layer "B.Mask" (type "Soldermask")) (layer "B.Paste" (type "Solderpaste")) (layer "B.SilkS" (type "Silkscreen")) (copper_finish "ENIG") (dielectric_constraints no) ) (pad_to_mask_clearance 0.05) (pcbplotparams (layerselection 0x00010fc_ffffffff) (plot_on_all_layers_selection 0x0000000_00000000) (disableapertmacros no) (usegerberextensions no) (usegerberattributes yes) (usegerberadvancedattributes yes) (creategerberjobfile yes) (dashed_line_dash_ratio 12.000000) (dashed_line_gap_ratio 3.000000) (svgprecision 4) (plotframeref no) (mode 1) (useauxorigin no) (hpglpennumber 1) (hpglpenspeed 20) (hpglpendiameter 15.000000) (pdf_front_fp_property_popups yes) (pdf_back_fp_property_popups yes) (dxfpolygonmode yes) (dxfimperialunits yes) (dxfusepcbnewfont yes) (psnegative no) (psa4output yes) (plotreference yes) (plotvalue yes) (plotfptext yes) (plotinvisibletext no) (padsonsilk no) (subtractmaskfromsilk no) (outputformat 1) (mirror no) (drillshape 0) (scaleselection 1) (outputdirectory "gerbers/")) ) (net 0 "") (net 1 "GND") (net 2 "3V3") (net 3 "1V2") (net 4 "5V") (net 5 "VBUS") (net 6 "VBAT") (net 7 "SPI_SCK") (net 8 "SPI_MOSI") (net 9 "SPI_MISO") (net 10 "SPI_CS") (net 11 "SPAD_HIT_A") (net 12 "SPAD_HIT_B") (net 13 "SPAD_GATE") (net 14 "SPAD_VBIAS") (net 15 "CLK_40M") (net 16 "I2C_SDA0") (net 17 "I2C_SCL0") (net 18 "I2C_SDA1") (net 19 "I2C_SCL1") (net 20 "DAC_VOUT") (net 21 "SD_CMD") (net 22 "SD_CLK") (net 23 "SD_D0") (net 24 "SD_D1") (net 25 "SD_D2") (net 26 "SD_D3") (net 27 "USB_DP") (net 28 "USB_DM") (net 29 "IRQ") (net 30 "BTN") (net 31 "RGB_LED") (net 32 "CDONE") (net 33 "CRSTB") ; ===== Board outline 95 x 55 mm ======================================= (gr_line (start 0 0) (end 95 0) (stroke (width 0.15) (type default)) (layer "Edge.Cuts")) (gr_line (start 95 0) (end 95 55) (stroke (width 0.15) (type default)) (layer "Edge.Cuts")) (gr_line (start 95 55) (end 0 55) (stroke (width 0.15) (type default)) (layer "Edge.Cuts")) (gr_line (start 0 55) (end 0 0) (stroke (width 0.15) (type default)) (layer "Edge.Cuts")) ; ===== Optical aperture cutout (30 mm dia, centered at 15,27.5) ======= (gr_circle (center 15 27.5) (end 30 27.5) (stroke (width 0.15) (type default)) (layer "Edge.Cuts")) ; ===== Mounting holes (M3) ============================================ (gr_circle (center 3 3) (end 5.5 3) (stroke (width 0.15) (type default)) (layer "Edge.Cuts")) (gr_circle (center 92 3) (end 94.5 3) (stroke (width 0.15) (type default)) (layer "Edge.Cuts")) (gr_circle (center 3 52) (end 5.5 52) (stroke (width 0.15) (type default)) (layer "Edge.Cuts")) (gr_circle (center 92 52) (end 94.5 52) (stroke (width 0.15) (type default)) (layer "Edge.Cuts")) ; ===== Silkscreen branding ============================================ (gr_text "aurora-phantom v1.0" (at 50 50 0) (layer "F.SilkS") (effects (font (size 1.5 1.5) (thickness 0.2)))) (gr_text "author: jayis1" (at 50 47 0) (layer "F.SilkS") (effects (font (size 1.0 1.0) (thickness 0.15)))) (gr_text "GPL-2.0 authorized use only" (at 50 44 0) (layer "F.SilkS") (effects (font (size 0.8 0.8) (thickness 0.1)))) ; ===== Footprints ===================================================== (footprint "RF_Module:ESP32-WROOM-32" (layer "F.Cu") (tedit 0) (tstamp 00000000-0000-0000-0000-000000000001) (at 55 27.5) (property "Reference" "U1") (property "Value" "ESP32-S3-WROOM-1") (property "Author" "jayis1") (property "Manufacturer" "Espressif") (pad "1" smd roundrect (at -9 0) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1)) (pad "2" smd roundrect (at -9 2.5) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 2)) (pad "3" smd roundrect (at -7.5 0) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 7)) (pad "39" smd roundrect (at 9 0) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 30)) (pad "40" smd roundrect (at 9 2.5) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 31)) ) (footprint "Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm" (layer "F.Cu") (tedit 0) (tstamp 00000000-0000-0000-0000-000000000002) (at 35 27.5) (property "Reference" "U2") (property "Value" "iCE40UP5K-SG48") (property "Author" "jayis1") (property "Manufacturer" "Lattice") (pad "1" smd roundrect (at -3.25 -3) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1)) (pad "2" smd roundrect (at -3.25 -2.5) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 3)) (pad "35" smd roundrect (at 3.25 2) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 15)) (pad "10" smd roundrect (at -2.25 -3) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 10)) ) (footprint "Sensor_Optical:SPAD_BGA_256" (layer "F.Cu") (tedit 0) (tstamp 00000000-0000-0000-0000-000000000003) (at 15 27.5) (property "Reference" "U3") (property "Value" "SPAD-16x16-TDC") (property "Author" "jayis1") (property "Manufacturer" "Hamamatsu") (pad "A1" smd circle (at -2.25 -2.25) (size 0.3 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net 1)) (pad "A2" smd circle (at -1.75 -2.25) (size 0.3 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net 11)) (pad "B1" smd circle (at -2.25 -1.75) (size 0.3 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net 14)) ) (footprint "Package_SO:MSOP-10_3x3mm_P0.5mm" (layer "F.Cu") (tedit 0) (tstamp 00000000-0000-0000-0000-000000000004) (at 75 20) (property "Reference" "U4") (property "Value" "Si5351C-B-GT") (property "Author" "jayis1") (property "Manufacturer" "Silicon Labs") (pad "1" smd rect (at -1.625 -1) (size 0.45 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (net 1)) (pad "2" smd rect (at -1.625 -0.5) (size 0.45 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (net 2)) (pad "7" smd rect (at 1.625 -1) (size 0.45 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (net 15)) ) (footprint "Package_DFN_QFN:QFN-56-1EP_7x7mm_P0.4mm" (layer "F.Cu") (tedit 0) (tstamp 00000000-0000-0000-0000-000000000005) (at 75 40) (property "Reference" "U5") (property "Value" "nPM1300") (property "Author" "jayis1") (property "Manufacturer" "Nordic") (pad "1" smd rect (at -3.2 -3) (size 0.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 1)) (pad "2" smd rect (at -3.2 -2.6) (size 0.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 6)) (pad "3" smd rect (at 3.2 -3) (size 0.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 2)) ) (footprint "Package_TO_SOT_SMD:SOT-23-6" (layer "F.Cu") (tedit 0) (tstamp 00000000-0000-0000-0000-000000000006) (at 30 45) (property "Reference" "U6") (property "Value" "MCP4725") (property "Author" "jayis1") (property "Manufacturer" "Microchip") (pad "1" smd rect (at -1.1 0.95) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 1)) (pad "2" smd rect (at 0 0.95) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 2)) (pad "5" smd rect (at 1.1 -0.95) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 20)) ) (footprint "Connector_Card:microSD_HC_Hirose_DM3D-SF" (layer "F.Cu") (tedit 0) (tstamp 00000000-0000-0000-0000-000000000007) (at 85 27.5) (property "Reference" "J1") (property "Value" "microSD_4-bit") (property "Author" "jayis1") (pad "1" smd rect (at 2 5.5) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 1)) (pad "2" smd rect (at 2 4.3) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 2)) (pad "3" smd rect (at 2 3.1) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 21)) (pad "4" smd rect (at 2 1.9) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 22)) ) (footprint "Connector_USB:USB_C_Receptacle_GCT_USB4135" (layer "F.Cu") (tedit 0) (tstamp 00000000-0000-0000-0000-000000000008) (at 85 45) (property "Reference" "J2") (property "Value" "USB-C-16P") (property "Author" "jayis1") (pad "A1" smd rect (at -4 2.5) (size 0.3 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 1)) (pad "A4" smd rect (at -3.2 2.5) (size 0.3 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 5)) (pad "B6" smd rect (at 1.2 2.5) (size 0.3 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 27)) ) (footprint "Battery:BatteryHolder_Keystone_1042_1x18650" (layer "F.Cu") (tedit 0) (tstamp 00000000-0000-0000-0000-000000000009) (at 60 48) (property "Reference" "BT1") (property "Value" "18650_3.7V") (property "Author" "jayis1") (pad "1" smd rect (at -33 0) (size 3 5) (layers "F.Cu" "F.Paste" "F.Mask") (net 6)) (pad "2" smd rect (at 33 0) (size 3 5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1)) ) ; ===== Vias for GND stitching ========================================= (via (at 5 5) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 1)) (via (at 90 5) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 1)) (via (at 5 50) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 1)) (via (at 90 50) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 1)) (via (at 45 15) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 1)) (via (at 65 15) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 1)) (via (at 45 40) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 1)) (via (at 65 40) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 1)) ; ===== Copper pours (zones) =========================================== (zone (net 1) (net_name "GND") (layer "In1.Cu") (tstamp 0) (hatch edge 0.5) (connect_pads (clearance 0.2)) (min_thickness 0.15) (fill yes (thermal_gap 0.2) (thermal_bridge_width 0.3)) (polygon (pts (xy 0 0) (xy 95 0) (xy 95 55) (xy 0 55))) ) (zone (net 2) (net_name "3V3") (layer "In2.Cu") (tstamp 1) (hatch edge 0.5) (connect_pads (clearance 0.2)) (min_thickness 0.15) (fill yes (thermal_gap 0.2) (thermal_bridge_width 0.3)) (polygon (pts (xy 0 0) (xy 95 0) (xy 95 55) (xy 0 55))) ) ; ===== Routed tracks (selected representative nets) =================== (segment (start 46 27.5) (end 55 27.5) (width 0.2) (layer "F.Cu") (net 7)) (segment (start 55 30) (end 55 27.5) (width 0.2) (layer "F.Cu") (net 2)) (segment (start 31.75 27.5) (end 35 27.5) (width 0.2) (layer "F.Cu") (net 15)) (segment (start 73.375 19) (end 75 20) (width 0.2) (layer "F.Cu") (net 15)) (segment (start 75 37) (end 75 40) (width 0.5) (layer "F.Cu") (net 2)) (segment (start 71.8 40) (end 75 40) (width 0.5) (layer "F.Cu") (net 6)) (segment (start 30 44.05) (end 30 45) (width 0.2) (layer "F.Cu") (net 20)) (segment (start 83 30.6) (end 85 30.8) (width 0.2) (layer "F.Cu") (net 21)) (segment (start 83 48) (end 85 45) (width 0.2) (layer "F.Cu") (net 5)) (group "" (member (uuid 00000000-0000-0000-0000-000000000001) (uuid 00000000-0000-0000-0000-000000000002) ) ) )