(kicad_pcb (version 20230121) (generator "cc-stiletto pcb generator") (generator_version "7.0") (general (thickness 1.6) (legacy_technology false)) (paper "A4") (title_block (title "CC-Stiletto — USB-C PD Configuration Channel Attack Tool") (date "2026-07-17") (rev "1.0") (company "jayis1") (comment 1 "Author: jayis1") (comment 2 "Copyright (c) 2026 jayis1 — authorized security research only") (comment 3 "4-layer PCB, 1 oz copper, 52x18mm dongle form factor")) ; ---- Layers -------------------------------------------------------------- (layer "F.Cu" (type copper)) (layer "In1.Cu" (type copper) (thickness 0.035)) ; VBUS plane (cut for 48V) (layer "In2.Cu" (type copper) (thickness 0.035)) ; GND plane (layer "B.Cu" (type copper)) (layer "F.SilkS" (type silk)) (layer "B.SilkS" (type silk)) (layer "F.Mask" (type mask)) (layer "B.Mask" (type mask)) (layer "F.Paste" (type paste)) (layer "B.Paste" (type paste)) (layer "Edge.Cuts"(type user)) (layer "F.Fab" (type fab)) (layer "B.Fab" (type fab)) (setup (pad_to_mask_clearance 0.05) (pcbplotparams (layerselection 0x0000030c_80000001) (usegerberextensions false) (usegerberattributes true) (svgprecision 6) (plotframeref false) (mode 1))) ; ---- Board outline: 52 mm x 18 mm dongle -------------------------------- (gr_line (start 0 0) (end 52 0) (layer "Edge.Cuts") (width 0.2)) (gr_line (start 52 0) (end 52 18) (layer "Edge.Cuts") (width 0.2)) (gr_line (start 52 18) (end 0 18) (layer "Edge.Cuts") (width 0.2)) (gr_line (start 0 18) (end 0 0) (layer "Edge.Cuts") (width 0.2)) ; ---- Net definitions (must match schematic) ----------------------------- (net 0 "") (net 1 "VBUS_SRC") (net 2 "VBUS_SNK") (net 3 "CC1_SRC") (net 4 "CC2_SRC") (net 5 "CC1_SNK") (net 6 "CC2_SNK") (net 7 "I2C1_SCL") (net 8 "I2C1_SDA") (net 9 "I2C2_SCL") (net 10 "I2C2_SDA") (net 11 "I2C3_SCL") (net 12 "I2C3_SDA") (net 13 "HRTIM_CHA1") (net 14 "EFUSE_EN") (net 15 "EFUSE_FLT") (net 16 "DAC_VBUS_REF") (net 17 "DAC_ILIM") (net 18 "INT_SRC") (net 19 "INT_SNK") (net 20 "LED_R") (net 21 "LED_G") (net 22 "LED_B") (net 23 "BUTTON") (net 24 "GND") (net 25 "ISO_EN") (net 26 "VDD_3V3") (net 27 "VDD_5V_ISO") (net 28 "SHUNT_SRC") (net 29 "SHUNT_SRC_OUT") (net 30 "SWDIO") (net 31 "SWCLK") (net 32 "NRST") (net 33 "USB_DM") (net 34 "USB_DP") ; ---- Footprints --------------------------------------------------------- (footprint "Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm" (layer "F.Cu") (at 24 8) (property "Reference" "U1") (property "Value" "STM32G474CEU6") (property "Author" "jayis1") (pad "1" smd roundrect (at -3.25 -2.5) (size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 26)) (pad "5" smd roundrect (at -3.25 -0.5) (size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 24)) (pad "7" smd roundrect (at -3.25 0.0) (size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 32)) (pad "9" smd roundrect (at -3.25 0.5) (size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 11)) (pad "10" smd roundrect (at -3.25 0.75)(size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 12)) (pad "13" smd roundrect (at -3.25 1.5) (size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 26)) (pad "14" smd roundrect (at -3.25 2.0) (size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 20)) (pad "15" smd roundrect (at -3.25 2.25)(size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 21)) (pad "16" smd roundrect (at -3.25 2.5) (size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 22)) (pad "19" smd roundrect (at -3.25 3.25)(size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 23)) (pad "20" smd roundrect (at -1.25 3.25)(size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 18)) (pad "29" smd roundrect (at 1.25 3.25)(size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 13)) (pad "30" smd roundrect (at 1.5 3.25)(size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 10)) (pad "33" smd roundrect (at 2.25 3.25)(size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 24)) (pad "34" smd roundrect (at 2.5 3.25)(size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 30)) (pad "37" smd roundrect (at 3.25 2.5) (size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 31)) (pad "38" smd roundrect (at 3.25 2.25)(size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 19)) (pad "42" smd roundrect (at 3.25 1.25)(size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 7)) (pad "43" smd roundrect (at 3.25 1.0) (size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 8)) (pad "44" smd roundrect (at 3.25 0.75)(size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 25)) (pad "45" smd roundrect (at 3.25 0.5) (size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 34)) (pad "46" smd roundrect (at 3.25 0.25)(size 0.25 0.25) (layers "F.Cu" "F.Mask") (net 33)) (pad "EXP" smd roundrect (at 0 0) (size 5.15 5.15) (layers "F.Cu" "F.Mask") (net 24)) (model "${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm.step" (offset (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)))) (footprint "Connector_USB:USB_C_Plug_Molex_105444" (layer "F.Cu") (at 3 9) (property "Reference" "J1") (property "Value" "USB-C Plug (victim/DUT)") (property "Author" "jayis1") (pad "A1" thru_hole circle (at -2.0 -2.0) (size 0.6 0.6) (drill 0.3) (layers "*.Cu" "*.Mask") (net 24)) (pad "A4" thru_hole circle (at -1.2 -2.0) (size 0.6 0.6) (drill 0.3) (layers "*.Cu" "*.Mask") (net 28)) (pad "A5" thru_hole circle (at -0.8 -2.0) (size 0.6 0.6) (drill 0.3) (layers "*.Cu" "*.Mask") (net 3)) (pad "A6" thru_hole circle (at -0.4 -2.0) (size 0.6 0.6) (drill 0.3) (layers "*.Cu" "*.Mask") (net 33)) (pad "A7" thru_hole circle (at 0.0 -2.0) (size 0.6 0.6) (drill 0.3) (layers "*.Cu" "*.Mask") (net 34)) (pad "B1" thru_hole circle (at 2.0 -2.0) (size 0.6 0.6) (drill 0.3) (layers "*.Cu" "*.Mask") (net 24)) (pad "B4" thru_hole circle (at 1.2 -2.0) (size 0.6 0.6) (drill 0.3) (layers "*.Cu" "*.Mask") (net 28)) (pad "B5" thru_hole circle (at 0.8 -2.0) (size 0.6 0.6) (drill 0.3) (layers "*.Cu" "*.Mask") (net 4))) (footprint "Connector_USB:USB_C_Receptacle_Amphenol_12401610E4-2A" (layer "F.Cu") (at 48 9 180) (property "Reference" "J2") (property "Value" "USB-C Receptacle (source/host)") (property "Author" "jayis1") (pad "A1" smd rect (at -2.0 -2.0) (size 0.6 0.6) (layers "F.Cu" "F.Mask") (net 24)) (pad "A4" smd rect (at -1.2 -2.0) (size 0.6 0.6) (layers "F.Cu" "F.Mask") (net 2)) (pad "A5" smd rect (at -0.8 -2.0) (size 0.6 0.6) (layers "F.Cu" "F.Mask") (net 5)) (pad "A6" smd rect (at -0.4 -2.0) (size 0.6 0.6) (layers "F.Cu" "F.Mask") (net 33)) (pad "A7" smd rect (at 0.0 -2.0) (size 0.6 0.6) (layers "F.Cu" "F.Mask") (net 34)) (pad "B1" smd rect (at 2.0 -2.0) (size 0.6 0.6) (layers "F.Cu" "F.Mask") (net 24)) (pad "B4" smd rect (at 1.2 -2.0) (size 0.6 0.6) (layers "F.Cu" "F.Mask") (net 2)) (pad "B5" smd rect (at 0.8 -2.0) (size 0.6 0.6) (layers "F.Cu" "F.Mask") (net 6))) (footprint "Package_DFN_QFN:QFN-14-1EP_3x3mm_P0.4mm_EP1.7x1.7mm" (layer "F.Cu") (at 8 13) (property "Reference" "U2") (property "Value" "FUSB302BMPX") (property "Author" "jayis1") (property "Role" "Source-side PD PHY") (pad "1" smd rect (at -1.4 -1.0) (size 0.2 0.6) (layers "F.Cu" "F.Mask") (net 1)) (pad "2" smd rect (at -1.4 -0.6) (size 0.2 0.6) (layers "F.Cu" "F.Mask") (net 3)) (pad "3" smd rect (at -1.4 -0.2) (size 0.2 0.6) (layers "F.Cu" "F.Mask") (net 4)) (pad "4" smd rect (at -1.4 0.2) (size 0.2 0.6) (layers "F.Cu" "F.Mask") (net 24)) (pad "8" smd rect (at 1.4 -0.6) (size 0.2 0.6) (layers "F.Cu" "F.Mask") (net 8)) (pad "9" smd rect (at 1.4 -0.2) (size 0.2 0.6) (layers "F.Cu" "F.Mask") (net 7)) (pad "10" smd rect (at 1.4 0.2) (size 0.2 0.6) (layers "F.Cu" "F.Mask") (net 18)) (pad "14" smd rect (at 0 0) (size 1.7 1.7) (layers "F.Cu" "F.Mask") (net 24))) (footprint "Package_DFN_QFN:QFN-14-1EP_3x3mm_P0.4mm_EP1.7x1.7mm" (layer "F.Cu") (at 40 13) (property "Reference" "U3") (property "Value" "FUSB302BMPX") (property "Author" "jayis1") (property "Role" "Sink-side PD PHY") (pad "1" smd rect (at -1.4 -1.0) (size 0.2 0.6) (layers "F.Cu" "F.Mask") (net 2)) (pad "2" smd rect (at -1.4 -0.6) (size 0.2 0.6) (layers "F.Cu" "F.Mask") (net 5)) (pad "3" smd rect (at -1.4 -0.2) (size 0.2 0.6) (layers "F.Cu" "F.Mask") (net 6)) (pad "4" smd rect (at -1.4 0.2) (size 0.2 0.6) (layers "F.Cu" "F.Mask") (net 24)) (pad "8" smd rect (at 1.4 -0.6) (size 0.2 0.6) (layers "F.Cu" "F.Mask") (net 10)) (pad "9" smd rect (at 1.4 -0.2) (size 0.2 0.6) (layers "F.Cu" "F.Mask") (net 9)) (pad "10" smd rect (at 1.4 0.2) (size 0.2 0.6) (layers "F.Cu" "F.Mask") (net 19)) (pad "14" smd rect (at 0 0) (size 1.7 1.7) (layers "F.Cu" "F.Mask") (net 24))) (footprint "Package_TO_SOT_SMD:SOT-23-6" (layer "F.Cu") (at 18 14) (property "Reference" "U4") (property "Value" "LM5180-1W") (property "Author" "jayis1") (pad "1" smd rect (at -0.95 -1.0) (size 0.6 0.6) (layers "F.Cu" "F.Mask") (net 1)) (pad "2" smd rect (at 0 -1.0) (size 0.6 0.6) (layers "F.Cu" "F.Mask") (net 24)) (pad "3" smd rect (at 0.95 -1.0) (size 0.6 0.6) (layers "F.Cu" "F.Mask") (net 1)) (pad "4" smd rect (at 0.95 1.0) (size 0.6 0.6) (layers "F.Cu" "F.Mask") (net 27)) (pad "5" smd rect (at -0.95 1.0) (size 0.6 0.6) (layers "F.Cu" "F.Mask") (net 24))) (footprint "Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm" (layer "F.Cu") (at 32 14) (property "Reference" "U5") (property "Value" "TPS25940") (property "Author" "jayis1") (pad "1" smd rect (at -1.25 -1.0) (size 0.25 0.3) (layers "F.Cu" "F.Mask") (net 29)) (pad "2" smd rect (at -1.25 -0.5) (size 0.25 0.3) (layers "F.Cu" "F.Mask") (net 2)) (pad "3" smd rect (at -1.25 0.0) (size 0.25 0.3) (layers "F.Cu" "F.Mask") (net 17)) (pad "4" smd rect (at 1.25 -1.0) (size 0.25 0.3) (layers "F.Cu" "F.Mask") (net 14)) (pad "5" smd rect (at 1.25 -0.5) (size 0.25 0.3) (layers "F.Cu" "F.Mask") (net 15)) (pad "6" smd rect (at 1.25 1.0) (size 0.25 0.3) (layers "F.Cu" "F.Mask") (net 24))) (footprint "Package_SO:SOIC-14_3.9x8.7mm_P1.27mm" (layer "F.Cu") (at 44 13) (property "Reference" "U6") (property "Value" "MAX5370") (property "Author" "jayis1") (pad "1" smd rect (at -2.4 -1.905) (size 0.5 0.6) (layers "F.Cu" "F.Mask") (net 16)) (pad "2" smd rect (at -2.4 -0.635) (size 0.5 0.6) (layers "F.Cu" "F.Mask") (net 17)) (pad "5" smd rect (at -2.4 0.635) (size 0.5 0.6) (layers "F.Cu" "F.Mask") (net 12)) (pad "6" smd rect (at -2.4 1.905) (size 0.5 0.6) (layers "F.Cu" "F.Mask") (net 11)) (pad "14" smd rect (at 2.4 1.905) (size 0.5 0.6) (layers "F.Cu" "F.Mask") (net 26)) (pad "7" smd rect (at 2.4 -1.905) (size 0.5 0.6) (layers "F.Cu" "F.Mask") (net 24))) (footprint "Package_SO:VSSOP-10_3x3mm_P0.5mm" (layer "F.Cu") (at 12 15) (property "Reference" "U7") (property "Value" "INA226") (property "Author" "jayis1") (pad "1" smd rect (at -1.5 -1.0) (size 0.3 0.3) (layers "F.Cu" "F.Mask") (net 1)) (pad "2" smd rect (at -1.5 -0.5) (size 0.3 0.3) (layers "F.Cu" "F.Mask") (net 28)) (pad "3" smd rect (at -1.5 0.0) (size 0.3 0.3) (layers "F.Cu" "F.Mask") (net 29)) (pad "4" smd rect (at -1.5 0.5) (size 0.3 0.3) (layers "F.Cu" "F.Mask") (net 24)) (pad "8" smd rect (at 1.5 -0.5) (size 0.3 0.3) (layers "F.Cu" "F.Mask") (net 12)) (pad "9" smd rect (at 1.5 0.0) (size 0.3 0.3) (layers "F.Cu" "F.Mask") (net 11)) (pad "10" smd rect (at 1.5 1.0) (size 0.3 0.3) (layers "F.Cu" "F.Mask") (net 26))) (footprint "Package_SO:VSSOP-10_3x3mm_P0.5mm" (layer "F.Cu") (at 36 15) (property "Reference" "U8") (property "Value" "INA226") (property "Author" "jayis1") (pad "1" smd rect (at -1.5 -1.0) (size 0.3 0.3) (layers "F.Cu" "F.Mask") (net 2)) (pad "4" smd rect (at -1.5 0.5) (size 0.3 0.3) (layers "F.Cu" "F.Mask") (net 24)) (pad "8" smd rect (at 1.5 -0.5) (size 0.3 0.3) (layers "F.Cu" "F.Mask") (net 12)) (pad "9" smd rect (at 1.5 0.0) (size 0.3 0.3) (layers "F.Cu" "F.Mask") (net 11)) (pad "10" smd rect (at 1.5 1.0) (size 0.3 0.3) (layers "F.Cu" "F.Mask") (net 26))) (footprint "Package_SO:SOIC-8_3.9x4.9mm_P1.27mm" (layer "F.Cu") (at 26 16) (property "Reference" "U9") (property "Value" "ISO1540") (property "Author" "jayis1") (pad "1" smd rect (at -2.4 -1.905) (size 0.5 0.6) (layers "F.Cu" "F.Mask") (net 12)) (pad "2" smd rect (at -2.4 -0.635) (size 0.5 0.6) (layers "F.Cu" "F.Mask") (net 11)) (pad "3" smd rect (at -2.4 0.635) (size 0.5 0.6) (layers "F.Cu" "F.Mask") (net 24)) (pad "4" smd rect (at -2.4 1.905) (size 0.5 0.6) (layers "F.Cu" "F.Mask") (net 26)) (pad "5" smd rect (at 2.4 -1.905) (size 0.5 0.6) (layers "F.Cu" "F.Mask") (net 27)) (pad "6" smd rect (at 2.4 -0.635) (size 0.5 0.6) (layers "F.Cu" "F.Mask") (net 24)) (pad "7" smd rect (at 2.4 0.635) (size 0.5 0.6) (layers "F.Cu" "F.Mask") (net 12)) (pad "8" smd rect (at 2.4 1.905) (size 0.5 0.6) (layers "F.Cu" "F.Mask") (net 11))) (footprint "Package_TO_SOT_SMD:TO-263-3_TabPin2" (layer "F.Cu") (at 30 8) (property "Reference" "Q1") (property "Value" "IPK95N04L") (property "Author" "jayis1") (property "Function" "VBUS MOSFET bank (Q1-Q4 parallel)") (pad "1" smd rect (at -4.5 -2.5) (size 1.2 1.2) (layers "F.Cu" "F.Mask") (net 13)) (pad "2" smd rect (at 0 -2.5) (size 3.0 3.0) (layers "F.Cu" "F.Mask") (net 2)) (pad "3" smd rect (at 4.5 -2.5) (size 1.2 1.2) (layers "F.Cu" "F.Mask") (net 1))) (footprint "Resistor_SMD:R_2512_6332Metric" (layer "F.Cu") (at 14 8) (property "Reference" "R_SHUNT1") (property "Value" "5mR 1% 3W") (property "Author" "jayis1") (pad "1" smd rect (at -2.5 0) (size 1.6 3.2) (layers "F.Cu" "F.Mask") (net 28)) (pad "2" smd rect (at 2.5 0) (size 1.6 3.2) (layers "F.Cu" "F.Mask") (net 29))) (footprint "Capacitor_SMD:CP_Elec_6.3x7.7" (layer "F.Cu") (at 22 9) (property "Reference" "C_BULK") (property "Value" "100uF 50V") (property "Author" "jayis1") (pad "1" smd rect (at -2.5 0) (size 2.0 2.0) (layers "F.Cu" "F.Mask") (net 1)) (pad "2" smd rect (at 2.5 0) (size 2.0 2.0) (layers "F.Cu" "F.Mask") (net 24))) (footprint "LED_SMD:LED_RGB_1210" (layer "F.Cu") (at 46 4) (property "Reference" "D1") (property "Value" "Status RGB LED") (property "Author" "jayis1") (pad "1" smd rect (at -1.5 0.5) (size 0.7 0.7) (layers "F.Cu" "F.Mask") (net 20)) (pad "2" smd rect (at 0.0 0.5) (size 0.7 0.7) (layers "F.Cu" "F.Mask") (net 21)) (pad "3" smd rect (at 1.5 0.5) (size 0.7 0.7) (layers "F.Cu" "F.Mask") (net 22)) (pad "4" smd rect (at 0.0 -0.5) (size 1.6 0.7) (layers "F.Cu" "F.Mask") (net 24))) (footprint "Button_Switch_SMD:SW_SPST_B3SN-6x6" (layer "F.Cu") (at 5 4) (property "Reference" "SW1") (property "Value" "Mode/Hard-Reset button") (property "Author" "jayis1") (pad "1" smd rect (at -2.5 -1.5) (size 1.0 1.0) (layers "F.Cu" "F.Mask") (net 23)) (pad "2" smd rect (at 2.5 -1.5) (size 1.0 1.0) (layers "F.Cu" "F.Mask") (net 24))) (footprint "Connector_PinHeader_1.27mm:PinHeader_1x05_P1.27mm_Vertical" (layer "F.Cu") (at 49 3) (property "Reference" "J3") (property "Value" "Pogo SWD debug") (property "Author" "jayis1") (pad "1" smd rect (at 0 -2.54) (size 0.7 0.7) (layers "F.Cu" "F.Mask") (net 30)) (pad "2" smd rect (at 0 -1.27) (size 0.7 0.7) (layers "F.Cu" "F.Mask") (net 31)) (pad "3" smd rect (at 0 0.0) (size 0.7 0.7) (layers "F.Cu" "F.Mask") (net 24)) (pad "4" smd rect (at 0 1.27) (size 0.7 0.7) (layers "F.Cu" "F.Mask") (net 26)) (pad "5" smd rect (at 0 2.54) (size 0.7 0.7) (layers "F.Cu" "F.Mask") (net 32))) ; ---- Copper zones ------------------------------------------------------ (zone (net 24) (net_name "GND") (layer "In2.Cu") (hatch edge 0.5) (connect_pads (clearance 0.2)) (fill (thermal_gap 0.3) (thermal_bridge_width 0.5)) (polygon (pts (xy 0.5 0.5) (xy 51.5 0.5) (xy 51.5 17.5) (xy 0.5 17.5)))) (zone (net 1) (net_name "VBUS_SRC") (layer "In1.Cu") (hatch edge 0.5) (connect_pads (clearance 0.3)) (fill (thermal_gap 0.4) (thermal_bridge_width 0.5)) (polygon (pts (xy 0.5 0.5) (xy 25 0.5) (xy 25 17.5) (xy 0.5 17.5)))) (zone (net 2) (net_name "VBUS_SNK") (layer "In1.Cu") (hatch edge 0.5) (connect_pads (clearance 0.3)) (fill (thermal_gap 0.4) (thermal_bridge_width 0.5)) (polygon (pts (xy 25.5 0.5) (xy 51.5 0.5) (xy 51.5 17.5) (xy 25.5 17.5)))) ; ---- Design rules ------------------------------------------------------ (dimension (type orthogonal) (value 52.0)) (dimension (type orthogonal) (value 18.0)) )