(kicad_pcb (version 20240101) (generator "jayis1-CoilGrip") (generator_version "1.0") (general (thickness 1.6)) (paper "A4") (title_block (title "CoilGrip — Wireless Power Transfer Manipulation Platform") (date "2026-06-29") (rev "1.0") (company "jayis1") (comment 1 "Author: jayis1") (comment 2 "SPDX-License-Identifier: GPL-2.0") ) (layers (0 "F.Cu" signal) (1 "In1.Cu" signal) (2 "In2.Cu" signal) (31 "B.Cu" signal) (32 "B.Adhes" user) (33 "F.Adhes" user) (34 "B.Paste" user) (35 "F.Paste" user) (36 "B.SilkS" user) (37 "F.SilkS" user) (38 "B.Mask" user) (39 "F.Mask" user) (40 "Dwgs.User" user) (41 "Cmts.User" user) (42 "Eco1.User" user) (43 "Eco2.User" user) (44 "Edge.Cuts" user) (45 "Margin" user) (46 "B.CrtYd" user) (47 "F.CrtYd" user) (48 "B.Fab" user) (49 "F.Fab" user) ) (setup (stackup (layer "F.Cu" (type "copper") (thickness 0.035)) (layer "dielectric 1" (type "core") (thickness 0.2) (material "FR4")) (layer "In1.Cu" (type "copper") (thickness 0.035)) (layer "dielectric 2" (type "prepereg") (thickness 0.7) (material "FR4")) (layer "In2.Cu" (type "copper") (thickness 0.035)) (layer "dielectric 3" (type "core") (thickness 0.2) (material "FR4")) (layer "B.Cu" (type "copper") (thickness 0.035)) ) (pad_to_mask_clearance 0.05) (pcbplotparams (layerselection 0x0001000_ffffffff) (usegerberextensions false) (usegerberattributes true)) ) ;; ---- Net definitions -------------------------------------------------- (net 0 "") (net 1 "GND") (net 2 "+3V3") (net 3 "+5V") (net 4 "VBAT") (net 5 "QI_TX_COIL_A") (net 6 "QI_TX_COIL_B") (net 7 "QI_RX_COIL_AC1") (net 8 "QI_RX_COIL_AC2") (net 9 "MCU_FPGA_SPI_SCK") (net 10 "MCU_FPGA_SPI_MISO") (net 11 "MCU_FPGA_SPI_MOSI") (net 12 "MCU_FPGA_SPI_CS") (net 13 "MCU_MWCT_SPI_CLK") (net 14 "MCU_MWCT_SPI_MOSI") (net 15 "MCU_MWCT_SPI_MISO") (net 16 "MCU_MWCT_SPI_CS") (net 17 "I2C1_SDA_BQ") (net 18 "I2C1_SCL_BQ") (net 19 "I2C4_SDA_TMP") (net 20 "I2C4_SCL_TMP") (net 21 "ADC_SCLK") (net 22 "ADC_DIN") (net 23 "ADC_DOUT") (net 24 "ADC_CS") (net 25 "LM_DRV") (net 26 "GLITCH_FET_EN") (net 27 "BLE_UART_TX") (net 28 "BLE_UART_RX") (net 29 "USB_DP") (net 30 "USB_DM") (net 31 "HRTIM_PWM") (net 32 "TRIG_IN0") (net 33 "TRIG_OUT0") (net 34 "OLED_CS") (net 35 "OLED_DC") (net 36 "SD_D0") (net 37 "SD_CMD") (net 38 "SD_CK") (net 39 "FPGA_DONE") (net 40 "FPGA_RESET") (net 41 "TMP117_ALERT") ;; ---- Board outline (54 x 85 mm credit-card footprint) ---------------- (gr_line (start 0 0) (end 85 0) (stroke (width 0.15)) (layer "Edge.Cuts")) (gr_line (start 85 0) (end 85 54) (stroke (width 0.15)) (layer "Edge.Cuts")) (gr_line (start 85 54) (end 0 54) (stroke (width 0.15)) (layer "Edge.Cuts")) (gr_line (start 0 54) (end 0 0) (stroke (width 0.15)) (layer "Edge.Cuts")) (gr_text "CoilGrip v1.0 jayis1" (at 42.5 27 0) (layer "F.SilkS") (effects (font (size 1.5 1.5) (thickness 0.15)))) ;; ---- Footprints (components) ----------------------------------------- ;; U1 — STM32H743ZIT6 (LQFP-144) (footprint "Package_QFP:LQFP-144_20x20mm_P0.5mm" (layer "F.Cu") (attr smd) (property "Reference" "U1" (at 0 -12 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)))) (property "Value" "STM32H743ZIT6" (at 0 0 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15)))) (at 42.5 27 0) (model "${KISYS3DMOD}/Package_QFP.3dshapes/LQFP-144_20x20mm_P0.5mm.wrl" (offset (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0))) (pad "1" smd roundrect (at -9.5 -11 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+3V3") (roundrect_rratio 0.25)) (pad "2" smd roundrect (at -9 -11 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND") (roundrect_rratio 0.25)) (pad "23" smd roundrect (at 11 -2 180) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net 25 "LM_DRV") (roundrect_rratio 0.25)) (pad "24" smd roundrect (at 11 -1.5 180) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net 26 "GLITCH_FET_EN") (roundrect_rratio 0.25)) (pad "35" smd roundrect (at 11 3 180) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net 31 "HRTIM_PWM") (roundrect_rratio 0.25)) (pad "36" smd roundrect (at 11 3.5 180) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND") (roundrect_rratio 0.25)) (pad "37" smd roundrect (at 11 4 180) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+3V3") (roundrect_rratio 0.25)) (pad "12" smd roundrect (at -9.5 -1 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND") (roundrect_rratio 0.25)) (pad "13" smd roundrect (at -9.5 -0.5 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+3V3") (roundrect_rratio 0.25)) ) ;; U2 — iCE40-UP5K-SG48 (QFN-48) (footprint "Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm" (layer "F.Cu") (attr smd) (property "Reference" "U2" (at 0 -5.5 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)))) (property "Value" "iCE40-UP5K-SG48" (at 0 0 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15)))) (at 62 27 0) (pad "1" smd roundrect (at -3.75 -3.5 0) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 9 "MCU_FPGA_SPI_SCK") (roundrect_rratio 0.25)) (pad "2" smd roundrect (at -3.75 -2.5 0) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 10 "MCU_FPGA_SPI_MISO") (roundrect_rratio 0.25)) (pad "3" smd roundrect (at -3.75 -2 0) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 11 "MCU_FPGA_SPI_MOSI") (roundrect_rratio 0.25)) (pad "4" smd roundrect (at -3.75 -1.5 0) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 12 "MCU_FPGA_SPI_CS") (roundrect_rratio 0.25)) (pad "25" smd roundrect (at 3.75 -1 0) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 26 "GLITCH_FET_EN") (roundrect_rratio 0.25)) (pad "26" smd roundrect (at 3.75 -0.5 0) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 25 "LM_DRV") (roundrect_rratio 0.25)) (pad "49" smd roundrect (at 0 0 0) (size 5 5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND") (roundrect_rratio 0.0)) (pad "48" smd roundrect (at 0 0 0) (size 5 5) (layers "B.Cu" "B.Paste" "B.Mask") (net 1 "GND") (roundrect_rratio 0.0)) ) ;; U3 — MWCT1011 (LQFP-48) — Qi TX controller (footprint "Package_QFP:LQFP-48_7x7mm_P0.5mm" (layer "F.Cu") (attr smd) (property "Reference" "U3" (at 0 -5.5 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)))) (property "Value" "MWCT1011" (at 0 0 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15)))) (at 15 27 0) (pad "1" smd roundrect (at -4 -3.5 0) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 13 "MCU_MWCT_SPI_CLK") (roundrect_rratio 0.25)) (pad "2" smd roundrect (at -4 -3 0) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 14 "MCU_MWCT_SPI_MOSI") (roundrect_rratio 0.25)) (pad "3" smd roundrect (at -4 -2.5 0) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 15 "MCU_MWCT_SPI_MISO") (roundrect_rratio 0.25)) (pad "4" smd roundrect (at -4 -2 0) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 16 "MCU_MWCT_SPI_CS") (roundrect_rratio 0.25)) (pad "20" smd roundrect (at 4 -1 0) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 5 "QI_TX_COIL_A") (roundrect_rratio 0.25)) (pad "21" smd roundrect (at 4 -0.5 0) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 6 "QI_TX_COIL_B") (roundrect_rratio 0.25)) (pad "45" smd roundrect (at 0 0 0) (size 4 4) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+3V3") (roundrect_rratio 0.0)) (pad "46" smd roundrect (at 0 0 0) (size 4 4) (layers "B.Cu" "B.Paste" "B.Mask") (net 1 "GND") (roundrect_rratio 0.0)) ) ;; U4 — BQ51013B (QFN-20) — Qi RX (footprint "Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm" (layer "F.Cu") (attr smd) (property "Reference" "U4" (at 0 -4 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)))) (property "Value" "BQ51013B" (at 0 0 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15)))) (at 77 27 0) (pad "1" smd roundrect (at -2 -1.75 0) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (net 7 "QI_RX_COIL_AC1") (roundrect_rratio 0.25)) (pad "2" smd roundrect (at -2 -1.25 0) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (net 8 "QI_RX_COIL_AC2") (roundrect_rratio 0.25)) (pad "14" smd roundrect (at 2 -0.75 0) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "+5V") (roundrect_rratio 0.25)) (pad "15" smd roundrect (at 2 -0.25 0) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (net 17 "I2C1_SDA_BQ") (roundrect_rratio 0.25)) (pad "16" smd roundrect (at 2 0.25 0) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (net 18 "I2C1_SCL_BQ") (roundrect_rratio 0.25)) (pad "17" smd roundrect (at 2 0.75 0) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (net 25 "LM_DRV") (roundrect_rratio 0.25)) (pad "20" smd roundrect (at 0 0 0) (size 2.5 2.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND") (roundrect_rratio 0.0)) ) ;; U5 — ADS131M04 (TSSOP-20) — ADC (footprint "Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm" (layer "F.Cu") (attr smd) (property "Reference" "U5" (at 0 -4.5 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)))) (property "Value" "ADS131M04" (at 0 0 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15)))) (at 42.5 10 0) (pad "1" smd roundrect (at -2.95 -2.6 0) (size 0.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND") (roundrect_rratio 0.25)) (pad "10" smd roundrect (at 2.95 -0.65 0) (size 0.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 21 "ADC_SCLK") (roundrect_rratio 0.25)) (pad "11" smd roundrect (at 2.95 0 0) (size 0.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 22 "ADC_DIN") (roundrect_rratio 0.25)) (pad "12" smd roundrect (at 2.95 0.65 0) (size 0.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 23 "ADC_DOUT") (roundrect_rratio 0.25)) (pad "13" smd roundrect (at 2.95 1.3 0) (size 0.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 24 "ADC_CS") (roundrect_rratio 0.25)) (pad "17" smd roundrect (at -2.95 2.6 0) (size 0.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "+5V") (roundrect_rratio 0.25)) (pad "18" smd roundrect (at -2.95 1.95 0) (size 0.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND") (roundrect_rratio 0.25)) ) ;; U10 — TMP117 (DSBGA-6) — temperature (footprint "Package_SON:DSBGA-6_1.5x1.5mm_P0.5mm" (layer "F.Cu") (attr smd) (property "Reference" "U10" (at 0 -2 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)))) (property "Value" "TMP117" (at 0 0 0) (layer "F.Fab") (effects (font (size 0.6 0.6) (thickness 0.1)))) (at 72 10 0) (pad "1" smd circle (at -0.25 -0.25) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (net 19 "I2C4_SDA_TMP")) (pad "2" smd circle (at 0.25 -0.25) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (net 20 "I2C4_SCL_TMP")) (pad "3" smd circle (at -0.25 0.25) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (net 41 "TMP117_ALERT")) (pad "4" smd circle (at 0.25 0.25) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+3V3")) (pad "5" smd circle (at 0 0.5) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND")) ) ;; Passives (footprint "Inductor_SMD:L_Wuerth_7447788101" (layer "F.Cu") (attr smd) (property "Reference" "L1" (at 0 -4 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)))) (property "Value" "100uH" (at 0 4 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15)))) (at 8 27 0) (pad "1" smd roundrect (at -3 -1.5 0) (size 2 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 5 "QI_TX_COIL_A") (roundrect_rratio 0.1)) (pad "2" smd roundrect (at 3 -1.5 0) (size 2 2) (layers "F.Cu" "F.Paste" "F.Mask") (net 6 "QI_TX_COIL_B") (roundrect_rratio 0.1)) ) (footprint "Capacitor_SMD:C_0603_1608Metric" (layer "F.Cu") (attr smd) (property "Reference" "C1" (at 0 -1.5 0) (layer "F.SilkS") (effects (font (size 0.6 0.6) (thickness 0.1)))) (property "Value" "22nF" (at 0 1.5 0) (layer "F.Fab") (effects (font (size 0.6 0.6) (thickness 0.1)))) (at 70 30 0) (pad "1" smd roundrect (at -0.8 0 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 25 "LM_DRV") (roundrect_rratio 0.25)) (pad "2" smd roundrect (at 0.8 0 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND") (roundrect_rratio 0.25)) ) (footprint "Resistor_SMD:R_1206_3216Metric" (layer "F.Cu") (attr smd) (property "Reference" "R1" (at 0 -1.5 0) (layer "F.SilkS") (effects (font (size 0.6 0.6) (thickness 0.1)))) (property "Value" "10m" (at 0 1.5 0) (layer "F.Fab") (effects (font (size 0.6 0.6) (thickness 0.1)))) (at 30 27 0) (pad "1" smd roundrect (at -1.5 0 0) (size 1.6 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "+5V") (roundrect_rratio 0.1)) (pad "2" smd roundrect (at 1.5 0 0) (size 1.6 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND") (roundrect_rratio 0.1)) ) (footprint "Capacitor_SMD:C_0402_1005Metric" (layer "F.Cu") (attr smd) (property "Reference" "C2" (at 0 -1 0) (layer "F.SilkS") (effects (font (size 0.5 0.5) (thickness 0.1)))) (property "Value" "100nF" (at 0 1 0) (layer "F.Fab") (effects (font (size 0.5 0.5) (thickness 0.1)))) (at 50 15 0) (pad "1" smd roundrect (at -0.5 0 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+3V3") (roundrect_rratio 0.25)) (pad "2" smd roundrect (at 0.5 0 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND") (roundrect_rratio 0.25)) ) ;; ---- Vias / ground stitching (a few representative) ------------------ (via (at 5 5) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 1 "GND")) (via (at 80 5) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 1 "GND")) (via (at 5 49) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 1 "GND")) (via (at 80 49) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 1 "GND")) ;; ---- Copper zones ----------------------------------------------------- (zone (net 1 "GND") (net_name "GND") (layer "B.Cu") (hatch edge 0.5) (connect_pads (clearance 0.3)) (min_thickness 0.2) (fill yes (thermal_gap 0.3) (thermal_bridge_width 0.3)) (polygon (pts (xy 0 0) (xy 85 0) (xy 85 54) (xy 0 54))) ) (zone (net 2 "+3V3") (net_name "+3V3") (layer "In1.Cu") (hatch edge 0.5) (connect_pads (clearance 0.3)) (min_thickness 0.2) (fill yes (thermal_gap 0.3) (thermal_bridge_width 0.3)) (polygon (pts (xy 1 1) (xy 84 1) (xy 84 53) (xy 1 53))) ) )