(kicad_pcb (version 20230121) (generator "pcbnew") (general (thickness 1.6) (legacy_teardrops no) ) (paper "A4") (title_block (title "ECHO-Phantom PCB") (date "2026-07-10") (rev "1.0") (company "jayis1") (comment 1 "Author: jayis1") (comment 2 "I²S/TDM Audio Bus MITM Implant") (comment 3 "18mm × 12mm 4-layer PCB") ) (layers (0 "F.Cu" signal) (1 "In1.Cu" signal "GND") (2 "In2.Cu" signal "PWR") (31 "B.Cu" signal) (32 "B.Adhes" user "B.Adhesive") (33 "F.Adhes" user "F.Adhesive") (34 "B.Paste" user) (35 "F.Paste" user) (36 "B.SilkS" user "B.Silkscreen") (37 "F.SilkS" user "F.Silkscreen") (38 "B.Mask" user) (39 "F.Mask" user) (40 "Dwgs.User" user "User.Drawings") (41 "Cmts.User" user "User.Comments") (42 "Eco1.User" user "User.Eco1") (43 "Eco2.User" user "User.Eco2") (44 "Edge.Cuts" user) (45 "Margin" user) (46 "B.CrtYd" user "B.Courtyard") (47 "F.CrtYd" user "F.Courtyard") (48 "B.Fab" user) (49 "F.Fab" user) ) (setup (pad_to_mask_clearance 0.05) (aux_axis_origin 0 0) (grid_origin 0 0) (pcbplotparams (layerselection 0x00010fc_ffffffff) (plot_on_all_layers_selection 0x0000000_00000000) (disableapertmacroscale false) (usegerberextensions false) (usegerberattributes true) (usegerberadvancedattributes true) (creategerberjobfile true) (dashed_line_dash_ratio 12.0) (dashed_line_gap_ratio 3.0) (svgprecision 4) (plotframeref false) (viasonmask false) (mode 1) (useauxorigin false) (hpglpennumber 1) (hpglpenspeed 20) (hpglpendiameter 15.0) (pdf_front_fp_property_popups true) (pdf_back_fp_property_popups true) (dxfpolygonmode true) (dxfimperialunits true) (dxfusepcbnewfont true) (psnegative false) (psa4orientation true) (psastype 3) (outputformat 1) (mirror false) (plotstyle 0) (plotinvisiblenames false) (plotinvisiblevalues false) (sketchpadsonfab false) (subtractmaskfromsilk true) (plotrefmodestring true) (viasonmask false) (outputformat 1) ) ) ; ======================================================================== ; Net classes ; ======================================================================== (net_class "Default" (clearance 0.15) (trace_width 0.15) (via_dia 0.3) (via_drill 0.15) (uvia_dia 0.2) (uvia_drill 0.1) (diff_pair_gap 0.15) ) (net_class "Audio" (clearance 0.15) (trace_width 0.12) (via_dra 0.3) (via_drill 0.15) (description "I²S/TDM audio bus signals") ) (net_class "Power" (clearance 0.2) (trace_width 0.3) (via_dia 0.4) (via_drill 0.2) (description "Power traces (3V3, VBAT, VBUS)") ) (net_class "HighSpeed" (clearance 0.15) (trace_width 0.12) (via_dia 0.3) (via_drill 0.15) (diff_pair_gap 0.15) (description "USB D+/D- differential pair") ) ; ======================================================================== ; Nets ; ======================================================================== (net 0 "") (net 1 "GND") (net 2 "VCC_3V3") (net 3 "VBAT") (net 4 "VBUS") (net 5 "SAI1_BCLK_T") (net 6 "SAI1_WS_T") (net 7 "SAI1_SD_T") (net 8 "SAI1_MCLK_T") (net 9 "SAI1_BCLK_H") (net 10 "SAI1_WS_H") (net 11 "SAI1_SD_H") (net 12 "SAI1_MCLK_H") (net 13 "BLE_TX") (net 14 "BLE_RX") (net 15 "USB_DM") (net 16 "USB_DP") (net 17 "LED_RED") (net 18 "LED_BLUE") (net 19 "VBAT_ADC") (net 20 "FMC_D0") (net 21 "FMC_D1") (net 22 "FMC_D2") (net 23 "FMC_D3") (net 24 "FMC_D4") (net 25 "FMC_D5") (net 26 "FMC_D6") (net 27 "FMC_D7") (net 28 "FMC_D8") (net 29 "FMC_D9") (net 30 "FMC_D10") (net 31 "FMC_D11") (net 32 "FMC_D12") (net 33 "FMC_D13") (net 34 "FMC_D14") (net 35 "FMC_D15") (net 36 "FMC_A0") (net 37 "FMC_A1") (net 38 "FMC_A2") (net 39 "FMC_A3") (net 40 "FMC_A4") (net 41 "FMC_A5") (net 42 "FMC_A6") (net 43 "FMC_A7") (net 44 "FMC_A8") (net 45 "FMC_A9") (net 46 "FMC_A10") (net 47 "FMC_A11") (net 48 "FMC_A12") (net 49 "FMC_SDCLK") (net 50 "FMC_SDNCAS") (net 51 "FMC_SDNRAS") (net 52 "FMC_SDNWE") (net 53 "FMC_SDNE") (net 54 "FMC_SDCKE") (net 55 "FMC_SDNRAS") (net 56 "FMC_DQM") (net 57 "FMC_BA0") (net 58 "FMC_BA1") (net 59 "SDMMC_CLK") (net 60 "SDMMC_CMD") (net 61 "SDMMC_D0") (net 62 "SDMMC_D1") (net 63 "SDMMC_D2") (net 64 "SDMMC_D3") (net 65 "SDMMC_DET") ; ======================================================================== ; Board outline (18mm × 12mm) ; ======================================================================== (gr_line (start 0 0) (end 18.0 0) (stroke (width 0.1) (type default)) (layer "Edge.Cuts")) (gr_line (start 18.0 0) (end 18.0 12.0) (stroke (width 0.1) (type default)) (layer "Edge.Cuts")) (gr_line (start 18.0 12.0) (end 0 12.0) (stroke (width 0.1) (type default)) (layer "Edge.Cuts")) (gr_line (start 0 12.0) (end 0 0) (stroke (width 0.1) (type default)) (layer "Edge.Cuts")) ; ======================================================================== ; Board text ; ======================================================================== (gr_text "ECHO-Phantom v1.0" (at 9.0 1.0 0) (layer "F.SilkS") (effects (font (size 0.8 0.8) (thickness 0.1)))) (gr_text "Author: jayis1" (at 9.0 11.0 0) (layer "B.SilkS") (effects (font (size 0.6 0.6) (thickness 0.08)))) (gr_text "AUTHORIZED USE ONLY" (at 9.0 10.0 0) (layer "F.SilkS") (effects (font (size 0.5 0.5) (thickness 0.08) bold))) ; ======================================================================== ; Component footprints ; ======================================================================== ; --- U1: STM32H743VIT6 (LQFP-100, center of board) --- (footprint "Package_QFP:LQFP-100_14x14mm_P0.5mm" (layer "F.Cu") (at 9.0 6.0 0) (property "Reference" "U1" (at 0 -8.5 0) (effects (font (size 1.0 1.0)))) (property "Value" "STM32H743VIT6" (at 0 8.5 0) (effects (font (size 1.0 1.0)))) (pad "1" smd roundrect (at -6.0 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 2 "VCC_3V3")) (pad "2" smd roundrect (at -5.5 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) (pad "PA7" smd roundrect (at -5.0 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 6 "SAI1_WS_T")) (pad "PA8" smd roundrect (at -4.5 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 5 "SAI1_BCLK_T")) (pad "PA9" smd roundrect (at -4.0 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 13 "BLE_TX")) (pad "PA10" smd roundrect (at -3.5 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 14 "BLE_RX")) (pad "PA11" smd roundrect (at -3.0 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 15 "USB_DM")) (pad "PA12" smd roundrect (at -2.5 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 16 "USB_DP")) (pad "PB0" smd roundrect (at -2.0 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 17 "LED_RED")) (pad "PB1" smd roundrect (at -1.5 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 18 "LED_BLUE")) (pad "PB3" smd roundrect (at -1.0 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 7 "SAI1_SD_T")) (pad "PB10" smd roundrect (at -0.5 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 9 "SAI1_BCLK_H")) (pad "PC7" smd roundrect (at 0.0 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 8 "SAI1_MCLK_T")) (pad "PC14" smd roundrect (at 0.5 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 12 "SAI1_MCLK_H")) (pad "PE6" smd roundrect (at 1.0 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 11 "SAI1_SD_H")) (pad "PF4" smd roundrect (at 1.5 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 10 "SAI1_WS_H")) (pad "PF10" smd roundrect (at 2.0 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 19 "VBAT_ADC")) ; FMC data pins (D0-D15) (pad "PD14" smd roundrect (at 2.5 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 20 "FMC_D0")) (pad "PD15" smd roundrect (at 3.0 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 21 "FMC_D1")) (pad "PD0" smd roundrect (at 3.5 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 22 "FMC_D2")) (pad "PD1" smd roundrect (at 4.0 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 23 "FMC_D3")) (pad "PE7" smd roundrect (at 4.5 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 24 "FMC_D4")) (pad "PE8" smd roundrect (at 5.0 -7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 25 "FMC_D5")) ; VDD and VSS pins (multiple) (pad "VDD1" smd roundrect (at -6.0 7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 2 "VCC_3V3")) (pad "VSS1" smd roundrect (at -5.5 7.0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) ) ; --- U2: nRF52840 BT840F module --- (footprint "RF_Module:Fanstel_BT840F" (layer "F.Cu") (at 14.5 3.5 0) (property "Reference" "U2" (at 0 -5.0 0) (effects (font (size 0.8 0.8)))) (property "Value" "BT840F" (at 0 5.0 0) (effects (font (size 0.8 0.8)))) (pad "VDD" smd roundrect (at -3.0 -2.0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 2 "VCC_3V3")) (pad "GND" smd roundrect (at -3.0 -1.0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) (pad "UART_TX" smd roundrect (at -3.0 0.0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 14 "BLE_RX")) (pad "UART_RX" smd roundrect (at -3.0 1.0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 13 "BLE_TX")) (pad "ANT" smd roundrect (at 3.0 0.0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)) ) ; --- U3: SDRAM IS42S16160G (TSOP-II-54) --- (footprint "Package_SO:TSOP-II-54_10.16x22.22mm_P0.8mm" (layer "F.Cu") (at 3.0 6.0 0) (property "Reference" "U3" (at 0 -12.0 0) (effects (font (size 0.8 0.8)))) (property "Value" "IS42S16160G" (at 0 12.0 0) (effects (font (size 0.8 0.8)))) (pad "VDD1" smd roundrect (at -4.4 -5.2) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 2 "VCC_3V3")) (pad "VSS1" smd roundrect (at -4.4 -4.4) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) (pad "DQ0" smd roundrect (at -4.4 -3.6) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 20 "FMC_D0")) (pad "DQ1" smd roundrect (at -4.4 -2.8) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 21 "FMC_D1")) (pad "CLK" smd roundrect (at 4.4 -3.6) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 49 "FMC_SDCLK")) (pad "CS" smd roundrect (at 4.4 -2.8) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 53 "FMC_SDNE")) (pad "RAS" smd roundrect (at 4.4 -2.0) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 51 "FMC_SDNRAS")) (pad "CAS" smd roundrect (at 4.4 -1.2) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 50 "FMC_SDNCAS")) (pad "WE" smd roundrect (at 4.4 -0.4) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 52 "FMC_SDNWE")) ) ; --- J1: Target-side FFC connector --- (footprint "Connector_FFC-FPC:Hirose_FH12-6S-0.5SH_1x06-1MP_P0.50mm_Horizontal" (layer "F.Cu") (at 1.0 3.0 90) (property "Reference" "J1" (at 0 -3.0 0) (effects (font (size 0.6 0.6)))) (property "Value" "Target I²S" (at 0 3.0 0) (effects (font (size 0.6 0.6)))) (pad "1" smd roundrect (at -1.25 0) (size 0.3 2.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 5 "SAI1_BCLK_T")) (pad "2" smd roundrect (at -0.75 0) (size 0.3 2.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 6 "SAI1_WS_T")) (pad "3" smd roundrect (at -0.25 0) (size 0.3 2.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 7 "SAI1_SD_T")) (pad "4" smd roundrect (at 0.25 0) (size 0.3 2.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 8 "SAI1_MCLK_T")) (pad "5" smd roundrect (at 0.75 0) (size 0.3 2.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) (pad "6" smd roundrect (at 1.25 0) (size 0.3 2.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 2 "VCC_3V3")) ) ; --- J2: Host-side FFC connector --- (footprint "Connector_FFC-FPC:Hirose_FH12-6S-0.5SH_1x06-1MP_P0.50mm_Horizontal" (layer "F.Cu") (at 1.0 9.0 90) (property "Reference" "J2" (at 0 -3.0 0) (effects (font (size 0.6 0.6)))) (property "Value" "Host I²S" (at 0 3.0 0) (effects (font (size 0.6 0.6)))) (pad "1" smd roundrect (at -1.25 0) (size 0.3 2.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 9 "SAI1_BCLK_H")) (pad "2" smd roundrect (at -0.75 0) (size 0.3 2.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 10 "SAI1_WS_H")) (pad "3" smd roundrect (at -0.25 0) (size 0.3 2.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 11 "SAI1_SD_H")) (pad "4" smd roundrect (at 0.25 0) (size 0.3 2.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 12 "SAI1_MCLK_H")) (pad "5" smd roundrect (at 0.75 0) (size 0.3 2.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) (pad "6" smd roundrect (at 1.25 0) (size 0.3 2.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 2 "VCC_3V3")) ) ; --- J3: USB-C connector --- (footprint "Connector_USB:USB_C_Receptacle_GCT_USB4105" (layer "F.Cu") (at 16.0 6.0 90) (property "Reference" "J3" (at 0 -4.0 0) (effects (font (size 0.6 0.6)))) (property "Value" "USB-C" (at 0 4.0 0) (effects (font (size 0.6 0.6)))) (pad "A1" smd roundrect (at -3.0 -1.5) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) (pad "A4" smd roundrect (at -2.5 -1.5) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 4 "VBUS")) (pad "A6" smd roundrect (at -1.5 -1.5) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 16 "USB_DP")) (pad "A7" smd roundrect (at -1.0 -1.5) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 15 "USB_DM")) (pad "B12" smd roundrect (at 3.0 -1.5) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) (pad "B9" smd roundrect (at 2.5 -1.5) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 4 "VBUS")) ) ; --- U4: LDO TLV75533 --- (footprint "Package_TO_SOT_SMD:SOT-23-5" (layer "F.Cu") (at 14.5 8.5 0) (property "Reference" "U4" (at 0 -2.5 0) (effects (font (size 0.6 0.6)))) (property "Value" "TLV75533" (at 0 2.5 0) (effects (font (size 0.6 0.6)))) (pad "1" smd roundrect (at -0.95 -1.0) (size 0.6 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 4 "VBUS")) (pad "2" smd roundrect (at 0 -1.0) (size 0.6 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) (pad "3" smd roundrect (at 0.95 -1.0) (size 0.6 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 4 "VBUS")) (pad "4" smd roundrect (at 0.95 1.0) (size 0.6 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 2 "VCC_3V3")) (pad "5" smd roundrect (at -0.95 1.0) (size 0.6 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 2 "VCC_3V3")) ) ; --- D1: Red LED --- (footprint "LED_SMD:LED_0402_1005Metric" (layer "F.Cu") (at 15.5 10.5 0) (property "Reference" "D1" (at 0 -1.0 0) (effects (font (size 0.4 0.4)))) (property "Value" "Red" (at 0 1.0 0) (effects (font (size 0.4 0.4)))) (pad "1" smd roundrect (at -0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 17 "LED_RED")) (pad "2" smd roundrect (at 0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) ) ; --- D2: Blue LED --- (footprint "LED_SMD:LED_0402_1005Metric" (layer "F.Cu") (at 16.5 10.5 0) (property "Reference" "D2" (at 0 -1.0 0) (effects (font (size 0.4 0.4)))) (property "Value" "Blue" (at 0 1.0 0) (effects (font (size 0.4 0.4)))) (pad "1" smd roundrect (at -0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 18 "LED_BLUE")) (pad "2" smd roundrect (at 0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) ) ; --- Y1: 25 MHz Crystal --- (footprint "Crystal:Crystal_SMD_3225-4Pin_3.2x2.5mm" (layer "F.Cu") (at 8.0 2.0 0) (property "Reference" "Y1" (at 0 -2.0 0) (effects (font (size 0.5 0.5)))) (property "Value" "25 MHz" (at 0 2.0 0) (effects (font (size 0.5 0.5)))) (pad "1" smd roundrect (at -1.1 -0.85) (size 1.0 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)) (pad "2" smd roundrect (at 1.1 -0.85) (size 1.0 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)) (pad "3" smd roundrect (at 1.1 0.85) (size 1.0 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) (pad "4" smd roundrect (at -1.1 0.85) (size 1.0 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)) ) ; --- Decoupling capacitors --- (footprint "Capacitor_SMD:C_0402_1005Metric" (layer "F.Cu") (at 12.0 5.0 0) (property "Reference" "C1" (at 0 -1.0 0) (effects (font (size 0.4 0.4)))) (property "Value" "100nF" (at 0 1.0 0) (effects (font (size 0.4 0.4)))) (pad "1" smd roundrect (at -0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 2 "VCC_3V3")) (pad "2" smd roundrect (at 0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) ) (footprint "Capacitor_SMD:C_0603_1608Metric" (layer "F.Cu") (at 13.0 5.0 0) (property "Reference" "C2" (at 0 -1.0 0) (effects (font (size 0.4 0.4)))) (property "Value" "10uF" (at 0 1.0 0) (effects (font (size 0.4 0.4)))) (pad "1" smd roundrect (at -0.8 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 2 "VCC_3V3")) (pad "2" smd roundrect (at 0.8 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) ) ; --- Vias for GND stitching --- (via (at 2.0 2.0) (size 0.3) (drill 0.15) (layers "F.Cu" "B.Cu") (net 1 "GND")) (via (at 2.0 10.0) (size 0.3) (drill 0.15) (layers "F.Cu" "B.Cu") (net 1 "GND")) (via (at 16.0 2.0) (size 0.3) (drill 0.15) (layers "F.Cu" "B.Cu") (net 1 "GND")) (via (at 16.0 10.0) (size 0.3) (drill 0.15) (layers "F.Cu" "B.Cu") (net 1 "GND")) (via (at 9.0 2.0) (size 0.3) (drill 0.15) (layers "F.Cu" "B.Cu") (net 1 "GND")) (via (at 9.0 10.0) (size 0.3) (drill 0.15) (layers "F.Cu" "B.Cu") (net 1 "GND")) (via (at 6.0 6.0) (size 0.3) (drill 0.15) (layers "F.Cu" "B.Cu") (net 1 "GND")) (via (at 12.0 6.0) (size 0.3) (drill 0.15) (layers "F.Cu" "B.Cu") (net 1 "GND")) ; ======================================================================== ; Copper zones ; ======================================================================== (zone (net 1) (net_name "GND") (layer "B.Cu") (tstamp 0) (hatch edge 0.5) (connect_pads (clearance 0.2)) (min_thickness 0.15) (fill yes (thermal_gap 0.2) (thermal_bridge_width 0.2)) (polygon (pts (xy 0.2 0.2) (xy 17.8 0.2) (xy 17.8 11.8) (xy 0.2 11.8)) ) ) (zone (net 1) (net_name "GND") (layer "In1.Cu") (tstamp 1) (hatch edge 0.5) (connect_pads (clearance 0.2)) (min_thickness 0.15) (fill yes (thermal_gap 0.2) (thermal_bridge_width 0.2)) (polygon (pts (xy 0.2 0.2) (xy 17.8 0.2) (xy 17.8 11.8) (xy 0.2 11.8)) ) ) (zone (net 2) (net_name "VCC_3V3") (layer "In2.Cu") (tstamp 2) (hatch edge 0.5) (connect_pads (clearance 0.2)) (min_thickness 0.15) (fill yes (thermal_gap 0.2) (thermal_bridge_width 0.2)) (polygon (pts (xy 0.2 0.2) (xy 17.8 0.2) (xy 17.8 11.8) (xy 0.2 11.8)) ) ) )