(kicad_pcb (version 20230121) (generator "jayis1")
  (uuid "b2c3d4e5-f6a7-8901-bcde-f12345678901")

  (title_block
    (title "Forge-Probe: Silicon Backdoor Debug Probe")
    (date "2026-06-17")
    (rev "1.0")
    (company "jayis1 Labs")
    (comment 1 "Author: jayis1")
    (comment 2 "License: Authorized Security Research Use Only")
  )

  (layers
    (0 "F.Cu" signal)
    (1 "In1.Cu" signal)
    (2 "In2.Cu" signal)
    (3 "B.Cu" signal)
    (31 "B.Adhes" user)
    (32 "F.Adhes" user)
    (33 "F.Paste" user)
    (34 "B.Paste" user)
    (35 "F.SilkS" user)
    (36 "B.SilkS" user)
    (37 "F.Mask" user)
    (38 "B.Mask" user)
    (39 "Dwgs.User" user)
    (40 "Cmts.User" user)
    (41 "Edge.Cuts" user)
    (44 "Margin" user)
    (45 "F.CrtYd" user)
    (46 "B.CrtYd" user)
    (47 "F.Fab" user)
    (48 "B.Fab" user)
  )

  (setup
    (stackup
      (layer "F.Cu" (thickness 0.035) (copper_material "copper"))
      (layer "dielectric_1" (thickness 0.2) (material "FR4") (epsilon_r 4.5))
      (layer "In1.Cu" (thickness 0.035) (copper_material "copper"))
      (layer "dielectric_2" (thickness 0.2) (material "FR4") (epsilon_r 4.5))
      (layer "In2.Cu" (thickness 0.035) (copper_material "copper"))
      (layer "dielectric_3" (thickness 0.2) (material "FR4") (epsilon_r 4.5))
      (layer "B.Cu" (thickness 0.035) (copper_material "copper"))
    )
    (solder_mask_coverage 0.85)
    (solder_paste_ratio 1.0)
    (copper_finish "ENIG")
    (board_thickness 0.8)
  )

  (page 0 0 100 80)

  (board
    (pts (xy 0 0) (xy 55 0) (xy 55 30) (xy 0 30) (xy 0 0))
    (stroke (width 0.15) (type solid) (layer "Edge.Cuts"))
    (uuid "edge-cuts-uuid")
  )

  ; Mounting holes
  (pad "MH1" thru_hole circle (at 3 3 0) (size 3.2 3.2) (drill 3) (layers *.Cu *.Mask))
  (pad "MH2" thru_hole circle (at 52 3 0) (size 3.2 3.2) (drill 3) (layers *.Cu *.Mask))
  (pad "MH3" thru_hole circle (at 3 27 0) (size 3.2 3.2) (drill 3) (layers *.Cu *.Mask))
  (pad "MH4" thru_hole circle (at 52 27 0) (size 3.2 3.2) (drill 3) (layers *.Cu *.Mask))

  ; ── Footprints ──────────────────────────────────────────────────────────────

  ; STM32H743IIK6 BGA-176
  (footprint "Package_BGA:BGA-176_10x10mm_P0.8mm" (layer "F.Cu")
    (at 27.5 15 0)
    (uuid "fp-stm32")
    (property "Reference" "U1")
    (property "Value" "STM32H743IIK6")
    (pad "A1" smd rect (at -4.04 -4.04 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1))
    (pad "A2" smd rect (at -3.24 -4.04 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
    (pad "A3" smd rect (at -2.44 -4.04 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
    (pad "A4" smd rect (at -1.64 -4.04 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
    (pad "A5" smd rect (at -0.84 -4.04 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
    (pad "A6" smd rect (at -0.04 -4.04 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
    (pad "B1" smd rect (at -4.04 -3.24 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 4))
    (pad "B2" smd rect (at -3.24 -3.24 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
    (pad "B3" smd rect (at -2.44 -3.24 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
    (pad "B4" smd rect (at -1.64 -3.24 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
    (pad "B5" smd rect (at -0.84 -3.24 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask))
    (pad "J4" smd rect (at -1.64 3.24 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 5))
    (pad "J5" smd rect (at -0.84 3.24 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 6))
    (pad "K1" smd rect (at -4.04 4.04 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 7))
    (pad "K2" smd rect (at -3.24 4.04 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 8))
    (pad "K3" smd rect (at -2.44 4.04 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 9))
    (pad "K4" smd rect (at -1.64 4.04 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 10))
    (pad "P1" smd rect (at -4.04 3.24 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1))
    (pad "P3" smd rect (at -2.44 3.24 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1))
    (pad "P4" smd rect (at -1.64 3.24 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 4))
    (pad "P5" smd rect (at -0.84 3.24 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask) (net 1))
  )

  ; iCE40UP5K QFN-48
  (footprint "Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm" (layer "F.Cu")
    (at 10 15 0)
    (uuid "fp-fpga")
    (property "Reference" "U2")
    (property "Value" "iCE40UP5K")
    (pad "1" smd rect (at -3.25 -3.25 0) (size 0.3 0.6) (layers F.Cu F.Paste F.Mask) (net 13))
    (pad "2" smd rect (at -2.75 -3.25 0) (size 0.3 0.6) (layers F.Cu F.Paste F.Mask) (net 14))
    (pad "3" smd rect (at -2.25 -3.25 0) (size 0.3 0.6) (layers F.Cu F.Paste F.Mask) (net 15))
    (pad "4" smd rect (at -1.75 -3.25 0) (size 0.3 0.6) (layers F.Cu F.Paste F.Mask) (net 16))
    (pad "5" smd rect (at -1.25 -3.25 0) (size 0.3 0.6) (layers F.Cu F.Paste F.Mask) (net 17))
    (pad "6" smd rect (at -0.75 -3.25 0) (size 0.3 0.6) (layers F.Cu F.Paste F.Mask) (net 18))
    (pad "7" smd rect (at -0.25 -3.25 0) (size 0.3 0.6) (layers F.Cu F.Paste F.Mask) (net 19))
    (pad "8" smd rect (at 0.25 -3.25 0) (size 0.3 0.6) (layers F.Cu F.Paste F.Mask) (net 2))
    (pad "9" smd rect (at 0.75 -3.25 0) (size 0.3 0.6) (layers F.Cu F.Paste F.Mask) (net 1))
    (pad "19" smd rect (at 0.75 3.25 0) (size 0.3 0.6) (layers F.Cu F.Paste F.Mask) (net 1))
    (pad "20" smd rect (at 0.25 3.25 0) (size 0.3 0.6) (layers F.Cu F.Paste F.Mask) (net 1))
  )

  ; JTAG 20-pin header
  (footprint "Connector_PinHeader_2.54mm:PinHeader_2x10_P2.54mm_Vertical" (layer "F.Cu")
    (at 40 3 0)
    (uuid "fp-jtag")
    (property "Reference" "J1")
    (property "Value" "JTAG_20PIN")
    (pad "1" thru_hole rect (at -11.43 0 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 29))
    (pad "2" thru_hole rect (at -11.43 -2.54 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 3))
    (pad "3" thru_hole rect (at -8.89 0 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 9))
    (pad "4" thru_hole rect (at -8.89 -2.54 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 4))
    (pad "5" thru_hole rect (at -6.35 0 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 7))
    (pad "6" thru_hole rect (at -6.35 -2.54 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 4))
    (pad "7" thru_hole rect (at -3.81 0 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 6))
    (pad "8" thru_hole rect (at -3.81 -2.54 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 4))
    (pad "9" thru_hole rect (at -1.27 0 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 5))
    (pad "10" thru_hole rect (at -1.27 -2.54 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 4))
    (pad "11" thru_hole rect (at 1.27 0 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask))
    (pad "12" thru_hole rect (at 1.27 -2.54 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 4))
    (pad "13" thru_hole rect (at 3.81 0 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 8))
    (pad "14" thru_hole rect (at 3.81 -2.54 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 4))
    (pad "15" thru_hole rect (at 6.35 0 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 10))
    (pad "16" thru_hole rect (at 6.35 -2.54 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 4))
    (pad "17" thru_hole rect (at 8.89 0 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask))
    (pad "18" thru_hole rect (at 8.89 -2.54 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 4))
    (pad "19" thru_hole rect (at 11.43 0 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask))
    (pad "20" thru_hole rect (at 11.43 -2.54 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 4))
  )

  ; SWD 10-pin header
  (footprint "Connector_PinHeader_2.54mm:PinHeader_2x5_P2.54mm_Vertical" (layer "F.Cu")
    (at 40 15 0)
    (uuid "fp-swd")
    (property "Reference" "J2")
    (property "Value" "SWD_10PIN")
    (pad "1" thru_hole rect (at -5.08 0 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 29))
    (pad "2" thru_hole rect (at -5.08 -2.54 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 12))
    (pad "3" thru_hole rect (at -2.54 0 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 4))
    (pad "4" thru_hole rect (at -2.54 -2.54 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 11))
    (pad "5" thru_hole rect (at 0 0 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 4))
    (pad "6" thru_hole rect (at 0 -2.54 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask))
    (pad "7" thru_hole rect (at 2.54 0 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 4))
    (pad "8" thru_hole rect (at 2.54 -2.54 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 10))
    (pad "9" thru_hole rect (at 5.08 0 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 4))
    (pad "10" thru_hole rect (at 5.08 -2.54 0) (size 1.6 1.6) (drill 0.9) (layers *.Cu *.Mask) (net 1))
  )

  ; USB-C receptacle
  (footprint "Connector_USB:USB_C_Receptacle_HRO_TYPE-C-31-M-12" (layer "F.Cu")
    (at 3 24 0)
    (uuid "fp-usbc")
    (property "Reference" "J3")
    (property "Value" "USB-C")
    (pad "1" smd rect (at 0 -3 0) (size 2.5 1.0) (layers F.Cu F.Paste F.Mask) (net 4))
    (pad "2" smd rect (at 0 -1.5 0) (size 2.5 0.5) (layers F.Cu F.Paste F.Mask) (net 20))
    (pad "3" smd rect (at 0 0 0) (size 2.5 0.5) (layers F.Cu F.Paste F.Mask) (net 21))
    (pad "4" smd rect (at 0 1.5 0) (size 2.5 1.0) (layers F.Cu F.Paste F.Mask) (net 22))
  )

  ; MicroSD connector
  (footprint "Connector_Card:microSD_HC_MOLEX_502570-0893" (layer "F.Cu")
    (at 27.5 26 0)
    (uuid "fp-sd")
    (property "Reference" "J4")
    (property "Value" "MicroSD")
    (pad "1" smd rect (at -4 0 0) (size 1.5 0.5) (layers F.Cu F.Paste F.Mask) (net 27))
    (pad "2" smd rect (at -4 -0.65 0) (size 1.5 0.5) (layers F.Cu F.Paste F.Mask) (net 28))
    (pad "3" smd rect (at -4 -1.3 0) (size 1.5 0.5) (layers F.Cu F.Paste F.Mask) (net 23))
    (pad "4" smd rect (at 4.5 0 0) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask) (net 1))
    (pad "5" smd rect (at 4.5 -0.65 0) (size 1.5 0.5) (layers F.Cu F.Paste F.Mask) (net 24))
    (pad "7" smd rect (at 4.5 -1.95 0) (size 1.5 0.5) (layers F.Cu F.Paste F.Mask) (net 25))
    (pad "8" smd rect (at 4.5 -2.6 0) (size 1.5 0.5) (layers F.Cu F.Paste F.Mask) (net 26))
    (pad "9" smd rect (at -2 3 0) (size 2 0.5) (layers F.Cu F.Paste F.Mask))
  )

  ; 25 MHz crystal
  (footprint "Crystal:Crystal_SMD_3225-4Pin_3.2x2.5mm" (layer "F.Cu")
    (at 20 24 0)
    (uuid "fp-xtal")
    (property "Reference" "Y1")
    (property "Value" "25MHz")
    (pad "1" smd rect (at -1.5 0 0) (size 1.2 0.8) (layers F.Cu F.Paste F.Mask) (net 33))
    (pad "2" smd rect (at 1.5 0 0) (size 1.2 0.8) (layers F.Cu F.Paste F.Mask) (net 34))
    (pad "3" smd rect (at -1.5 1.25 0) (size 1.2 0.8) (layers F.Cu F.Paste F.Mask) (net 4))
    (pad "4" smd rect (at 1.5 1.25 0) (size 1.2 0.8) (layers F.Cu F.Paste F.Mask) (net 4))
  )

  ; LTPS7A47 3.3V regulator
  (footprint "Package_DFN_QFN:QFN-28-1EP_4x5mm_P0.5mm" (layer "F.Cu")
    (at 15 5 0)
    (uuid "fp-reg-3v3")
    (property "Reference" "U3")
    (property "Value" "LTPS7A47_3V3")
    (pad "1" smd rect (at -2 0 0) (size 0.3 0.5) (layers F.Cu F.Paste F.Mask) (net 22))
    (pad "2" smd rect (at -2 -0.5 0) (size 0.3 0.5) (layers F.Cu F.Paste F.Mask) (net 1))
    (pad "3" smd rect (at -2 -1 0) (size 0.3 0.5) (layers F.Cu F.Paste F.Mask))
  )

  ; TXB0108 level shifter
  (footprint "Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm" (layer "F.Cu")
    (at 10 10 0)
    (uuid "fp-ls")
    (property "Reference" "U5")
    (property "Value" "TXB0108")
    (pad "1" smd rect (at -2.2 -3.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "2" smd rect (at -2.2 -2.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "3" smd rect (at -2.2 -1.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "4" smd rect (at -2.2 -0.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "5" smd rect (at -2.2 0.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "6" smd rect (at -2.2 1.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "7" smd rect (at -2.2 2.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "8" smd rect (at -2.2 3.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "9" smd rect (at -0.325 5 0) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask) (net 4))
    (pad "10" smd rect (at 0.675 5 0) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
    (pad "11" smd rect (at 2.2 3.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "12" smd rect (at 2.2 2.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "13" smd rect (at 2.2 1.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "14" smd rect (at 2.2 0.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "15" smd rect (at 2.2 -0.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "16" smd rect (at 2.2 -1.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "17" smd rect (at 2.2 -2.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "18" smd rect (at 2.2 -3.5 0) (size 0.4 1.2) (layers F.Cu F.Paste F.Mask))
    (pad "19" smd rect (at -0.325 -5 0) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask) (net 4))
    (pad "20" smd rect (at 0.675 -5 0) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  )

  ; INA219 current sensor
  (footprint "Package_TO_SOT_SMD:SOT-23-8" (layer "F.Cu")
    (at 20 5 0)
    (uuid "fp-csense")
    (property "Reference" "U6")
    (property "Value" "INA219")
    (pad "1" smd rect (at -0.95 0 0) (size 0.6 0.6) (layers F.Cu F.Paste F.Mask) (net 1))
    (pad "2" smd rect (at -0.95 0.95 0) (size 0.6 0.6) (layers F.Cu F.Paste F.Mask))
    (pad "3" smd rect (at -0.95 1.9 0) (size 0.6 0.6) (layers F.Cu F.Paste F.Mask))
    (pad "4" smd rect (at -0.95 2.85 0) (size 0.6 0.6) (layers F.Cu F.Paste F.Mask) (net 4))
    (pad "5" smd rect (at 0.95 2.85 0) (size 0.6 0.6) (layers F.Cu F.Paste F.Mask) (net 32))
    (pad "6" smd rect (at 0.95 1.9 0) (size 0.6 0.6) (layers F.Cu F.Paste F.Mask) (net 31))
    (pad "7" smd rect (at 0.95 0.95 0) (size 0.6 0.6) (layers F.Cu F.Paste F.Mask))
    (pad "8" smd rect (at 0.95 0 0) (size 0.6 0.6) (layers F.Cu F.Paste F.Mask))
  )

  ; RGB LED
  (footprint "LED_SMD:LED_0603_1608Metric" (layer "F.Cu")
    (at 3 5 0)
    (uuid "fp-led")
    (property "Reference" "LED1")
    (property "Value" "RGB")
    (pad "1" smd rect (at -0.4 0 0) (size 0.6 0.6) (layers F.Cu F.Paste F.Mask) (net 35))
    (pad "2" smd rect (at 0.4 0 0) (size 0.6 0.6) (layers F.Cu F.Paste F.Mask) (net 4))
  )

  ; ── PCB Traces ──────────────────────────────────────────────────────────────

  (segment (start 27.5 15) (end 40 3) (width 0.15) (layer "F.Cu") (net 5) (uuid "tr1"))
  (segment (start 27.5 15) (end 40 3) (width 0.15) (layer "F.Cu") (net 6) (uuid "tr2"))
  (segment (start 27.5 15) (end 40 3) (width 0.15) (layer "F.Cu") (net 7) (uuid "tr3"))
  (segment (start 27.5 15) (end 40 3) (width 0.15) (layer "F.Cu") (net 8) (uuid "tr4"))
  (segment (start 27.5 15) (end 40 3) (width 0.15) (layer "F.Cu") (net 9) (uuid "tr5"))
  (segment (start 27.5 15) (end 40 3) (width 0.15) (layer "F.Cu") (net 10) (uuid "tr6"))

  ; SWD traces (shorter, direct)
  (segment (start 27.5 15) (end 40 15) (width 0.15) (layer "F.Cu") (net 11) (uuid "tr7"))
  (segment (start 27.5 15) (end 40 15) (width 0.15) (layer "F.Cu") (net 12) (uuid "tr8"))

  ; FPGA SPI bridge traces (10 mm)
  (segment (start 27.5 15) (end 10 15) (width 0.15) (layer "F.Cu") (net 13) (uuid "tr9"))
  (segment (start 27.5 15) (end 10 15) (width 0.15) (layer "F.Cu") (net 14) (uuid "tr10"))
  (segment (start 27.5 15) (end 10 15) (width 0.15) (layer "F.Cu") (net 15) (uuid "tr11"))
  (segment (start 27.5 15) (end 10 15) (width 0.15) (layer "F.Cu") (net 16) (uuid "tr12"))

  ; USB DP/DN differential pair
  (segment (start 3 24) (end 27.5 15) (width 0.12) (layer "F.Cu") (net 20) (uuid "tr13"))
  (segment (start 3 24) (end 27.5 15) (width 0.12) (layer "F.Cu") (net 21) (uuid "tr14"))

  ; SDMMC traces
  (segment (start 27.5 15) (end 27.5 26) (width 0.15) (layer "F.Cu") (net 23) (uuid "tr15"))
  (segment (start 27.5 15) (end 27.5 26) (width 0.15) (layer "F.Cu") (net 24) (uuid "tr16"))
  (segment (start 27.5 15) (end 27.5 26) (width 0.15) (layer "F.Cu") (net 25) (uuid "tr17"))
  (segment (start 27.5 15) (end 27.5 26) (width 0.15) (layer "F.Cu") (net 28) (uuid "tr18"))

  ; Power routing (3.3V main rail)
  (segment (start 15 5) (end 27.5 15) (width 0.4) (layer "In1.Cu") (net 1) (uuid "tr19"))
  (segment (start 15 5) (end 10 15) (width 0.4) (layer "In1.Cu") (net 1) (uuid "tr20"))

  ; FPGA 1.2V rail
  (segment (start 27.5 15) (end 10 15) (width 0.3) (layer "In2.Cu") (net 2) (uuid "tr21"))

  ; I2C for current sensor
  (segment (start 20 5) (end 27.5 15) (width 0.15) (layer "F.Cu") (net 31) (uuid "tr22"))
  (segment (start 20 5) (end 27.5 15) (width 0.15) (layer "F.Cu") (net 32) (uuid "tr23"))

  ; Crystal to MCU
  (segment (start 20 24) (end 27.5 15) (width 0.15) (layer "F.Cu") (net 33) (uuid "tr24"))
  (segment (start 20 24) (end 27.5 15) (width 0.15) (layer "F.Cu") (net 34) (uuid "tr25"))

  ; ── Ground fill / Copper zones ──────────────────────────────────────────────

  (zone (net 4) (layer "F.Cu")
    (pts (xy 1 1) (xy 54 1) (xy 54 29) (xy 1 29) (xy 1 1))
    (fill (thermal_gap 0.3) (thermal_width 0.25))
    (type "solid")
    (priority 0)
  )

  (zone (net 4) (layer "B.Cu")
    (pts (xy 1 1) (xy 54 1) (xy 54 29) (xy 1 29) (xy 1 1))
    (fill (thermal_gap 0.3) (thermal_width 0.25))
    (type "solid")
    (priority 0)
  )

  ; ── Silkscreen annotations ──────────────────────────────────────────────────

  (gr_text "Forge-Probe" (at 27.5 1 0) (layer "F.SilkS")
    (effects (font (size 1.0 1.0) (thickness 0.15)) (justify center)))

  (gr_text "jayis1" (at 27.5 29 0) (layer "F.SilkS")
    (effects (font (size 0.8 0.8) (thickness 0.15)) (justify center)))

  (gr_text "J1 JTAG" (at 40 1 0) (layer "F.SilkS")
    (effects (font (size 0.6 0.6) (thickness 0.12))))

  (gr_text "J2 SWD" (at 40 13 0) (layer "F.SilkS")
    (effects (font (size 0.6 0.6) (thickness 0.12))))

  (gr_text "J3 USB-C" (at 3 20 0) (layer "F.SilkS")
    (effects (font (size 0.6 0.6) (thickness 0.12))))

  (gr_text "J4 μSD" (at 27.5 23 0) (layer "F.SilkS")
    (effects (font (size 0.6 0.6) (thickness 0.12))))

  (gr_text "U1 STM32H743" (at 27.5 11 0) (layer "F.SilkS")
    (effects (font (size 0.5 0.5) (thickness 0.1))))

  (gr_text "U2 iCE40UP5K" (at 10 12 0) (layer "F.SilkS")
    (effects (font (size 0.5 0.5) (thickness 0.1))))

  (gr_circle (at 3 5 0) (radius 0.75) (layer "F.SilkS")
    (stroke (width 0.1) (type solid)))
)