(kicad_pcb (version 20240101) (host kicad 8.0)
  (uuid "7e8f9a0b-1c2d-3e4f-5a6b-7c8d9e0f1a2b")
  (title_block
    (title "GHOSTBUS — Covert SWD/JTAG Hardware Debug Implant")
    (date "2026-06-18") (rev "1.0") (company "jayis1")
    (comment 1 "Author: jayis1 — CERN-OHL-S v2")
  )

  (general (thickness 1.6) (legacy_teardrops no))
  (paper "A4")
  (layers
    (0 "F.Cu" signal "Top — components + high-speed debug")
    (1 "In1.Cu" signal "Inner 1 — GND plane")
    (2 "In2.Cu" signal "Inner 2 — 3V3 plane")
    (31 "B.Cu" signal "Bottom — passives + routing")
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user "B.Paste")
    (35 "F.Paste" user "F.Paste")
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user "B.Mask")
    (39 "F.Mask" user "F.Mask")
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user "Board.Outline")
    (45 "Margin" user "Board.Margin")
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user "B.Fabrication")
    (49 "F.Fab" user "F.Fabrication")
  )

  (setup
    (stackup
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "prepreg") (thickness 0.2) (material "FR4"))
      (layer "In1.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 2" (type "core") (thickness 0.7) (material "FR4"))
      (layer "In2.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 3" (type "prepreg") (thickness 0.2) (material "FR4"))
      (layer "B.Cu" (type "copper") (thickness 0.035))
    )
    (pad_to_mask_clearance 0.05)
    (solder_mask_min_width 0.05)
    (grid_origin 0 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (usegerberextensions no)
      (psnegative no)
      (psa4portrait no)
      (plotreference yes)
      (plotvalue yes)
      (plotinvisibleno yes)
      (sketchpadsonfab no)
      (subtractmaskfromsilk no)
      (outputformat 1)
      (mirror no)
      (drillshape 0)
    )
  )

  ; ===================================================================
  ; Board outline (50 x 24 mm)
  ; ===================================================================
  (gr_line (start 0 0) (end 50 0) (layer "Edge.Cuts") (width 0.15))
  (gr_line (start 50 0) (end 50 24) (layer "Edge.Cuts") (width 0.15))
  (gr_line (start 50 24) (end 0 24) (layer "Edge.Cuts") (width 0.15))
  (gr_line (start 0 24) (end 0 0) (layer "Edge.Cuts") (width 0.15))
  (gr_text "GHOSTBUS v1.0  ©jayis1" (at 25 12) (layer "F.SilkS") (uuid "silktxt1"))
  (gr_text "Covert SWD/JTAG Debug Implant" (at 25 14.5) (layer "F.SilkS") (uuid "silktxt2"))

  ; ===================================================================
  ; Net classes
  ; ===================================================================
  (net_class "POWER" (clearance 0.2) (trace_width 0.3)
    (via_dia 0.5) (via_drill 0.25) (uvia_dia 0.3) (uvia_drill 0.1))
  (net_class "DEBUG" (clearance 0.15) (trace_width 0.15)
    (via_dia 0.3) (via_drill 0.15) (uvia_dia 0.2) (uvia_drill 0.08))
  (net_class "RF" (clearance 0.25) (trace_width 0.2)
    (via_dia 0.3) (via_drill 0.15) (uvia_dia 0.2) (uvia_drill 0.08))
  (net_class "DEFAULT" (clearance 0.15) (trace_width 0.15)
    (via_dia 0.3) (via_drill 0.15) (uvia_dia 0.2) (uvia_drill 0.08))

  ; ===================================================================
  ; Nets
  ; ===================================================================
  (net "GND" (class "POWER"))
  (net "+3V3" (class "POWER"))
  (net "+5V" (class "POWER"))
  (net "+VBAT" (class "POWER"))
  (net "SWCLK_TCK" (class "DEBUG"))
  (net "SWDIO_TMS" (class "DEBUG"))
  (net "TDI" (class "DEBUG"))
  (net "TDO" (class "DEBUG"))
  (net "BLE_TX" (class "DEFAULT"))
  (net "BLE_RX" (class "DEFAULT"))
  (net "BLE_nRST" (class "DEFAULT"))
  (net "BLE_IRQ" (class "DEFAULT"))
  (net "I2C_SDA" (class "DEFAULT"))
  (net "I2C_SCL" (class "DEFAULT"))
  (net "VREF_SENSE" (class "DEBUG"))
  (net "TGT_PWR" (class "POWER"))
  (net "CONT_DRV" (class "DEFAULT"))
  (net "GND_SENSE" (class "DEBUG"))
  (net "USB_DM" (class "DEFAULT"))
  (net "USB_DP" (class "DEFAULT"))
  (net "VBUS" (class "POWER"))
  (net "BUTTON" (class "DEFAULT"))
  (net "LED_DATA" (class "DEFAULT"))
  (net "unconnected-(U1-Pad1)")

  ; ===================================================================
  ; Footprints — U1: STM32H563ZIT6 LQFP-144
  ; ===================================================================
  (footprint "Package_QFP:LQFP-144_20x20mm_P0.5mm" (layer "F.Cu")
    (property "Reference" "U1") (property "Value" "STM32H563ZIT6")
    (attr smd)
    (pad "25" smd roundrect (at 4.25 -6.75) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "SWCLK_TCK") (roundrect_rratio 0.25))
    (pad "26" smd roundrect (at 4.25 -7.25) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "SWDIO_TMS") (roundrect_rratio 0.25))
    (pad "55" smd roundrect (at 4.25 -2.75) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "TDI") (roundrect_rratio 0.25))
    (pad "56" smd roundrect (at 4.25 -2.25) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "TDO") (roundrect_rratio 0.25))
    (pad "31" smd roundrect (at 4.25 -5.25) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "BLE_TX") (roundrect_rratio 0.25))
    (pad "32" smd roundrect (at 4.25 -4.75) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "BLE_RX") (roundrect_rratio 0.25))
    (pad "58" smd roundrect (at 4.25 -1.25) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "BLE_nRST") (roundrect_rratio 0.25))
    (pad "59" smd roundrect (at 4.25 -0.75) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "BLE_IRQ") (roundrect_rratio 0.25))
    (pad "19" smd roundrect (at 4.25 -8.75) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "VREF_SENSE") (roundrect_rratio 0.25))
    (pad "20" smd roundrect (at 4.25 -8.25) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "TGT_PWR") (roundrect_rratio 0.25))
    (pad "21" smd roundrect (at 4.25 -7.75) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "CONT_DRV") (roundrect_rratio 0.25))
    (pad "22" smd roundrect (at 4.25 -7.25) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND_SENSE") (roundrect_rratio 0.25))
    (pad "86" smd roundrect (at -4.25 -0.75) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "LED_DATA") (roundrect_rratio 0.25))
    (pad "72" smd roundrect (at -4.25 -6.75) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "BUTTON") (roundrect_rratio 0.25))
    (pad "11" smd roundrect (at 4.25 -10.25) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "+3V3") (roundrect_rratio 0.25))
    (pad "12" smd roundrect (at 4.25 -9.75) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND") (roundrect_rratio 0.25))
    (pad "60" smd roundrect (at 4.25 0.25) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "+3V3") (roundrect_rratio 0.25))
    (pad "95" smd roundrect (at -4.25 -7.75) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "+3V3") (roundrect_rratio 0.25))
    (pad "96" smd roundrect (at -4.25 -8.25) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND") (roundrect_rratio 0.25))
    (model "${KICAD6_3DMODEL_DIR}/Package_QFP.3dshapes/LQFP-144_20x20mm_P0.5mm.wrl"
      (offset (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)))
  )

  ; ===================================================================
  ; U2: nRF52840 QFN-48 (BLE co-processor)
  ; ===================================================================
  (footprint "Package_DFN_QFN:QFN-48-1EP_6x6mm_P0.4mm_EP4.6x4.6mm" (layer "F.Cu")
    (property "Reference" "U2") (property "Value" "nRF52840-QFAA")
    (attr smd)
    (pad "21" smd roundrect (at -2.6 1.8) (size 0.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net "BLE_TX") (roundrect_rratio 0.25))
    (pad "22" smd roundrect (at -2.6 2.2) (size 0.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net "BLE_RX") (roundrect_rratio 0.25))
    (pad "23" smd roundrect (at -2.6 2.6) (size 0.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net "BLE_nRST") (roundrect_rratio 0.25))
    (pad "24" smd roundrect (at -2.6 3.0) (size 0.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net "BLE_IRQ") (roundrect_rratio 0.25))
    (pad "32" smd roundrect (at 1.2 -2.6) (size 0.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net "RF_ANT_P") (roundrect_rratio 0.25))
    (pad "33" smd roundrect (at 1.6 -2.6) (size 0.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net "RF_ANT_N") (roundrect_rratio 0.25))
    (pad "35" smd roundrect (at 2.4 -2.6) (size 0.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net "+3V3") (roundrect_rratio 0.25))
    (pad "34" smd roundrect (at 2.0 -2.6) (size 0.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND") (roundrect_rratio 0.25))
    (pad "1"  smd roundrect (at -2.6 -2.4) (size 0.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net "+3V3") (roundrect_rratio 0.25))
    (pad "41" smd roundrect (at 0.4 -2.6) (size 0.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net "XTAL_P") (roundrect_rratio 0.25))
    (pad "42" smd roundrect (at 0.8 -2.6) (size 0.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net "XTAL_N") (roundrect_rratio 0.25))
    (pad "49" smd roundrect (at 0 0) (size 4.6 4.6) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND") (roundrect_rratio 0.0))
    (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-48-1EP_6x6mm_P0.4mm_EP4.6x4.6mm.wrl"
      (offset (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)))
  )

  ; ===================================================================
  ; U3: MCP73831 LiPo charger (SOT-23-5)
  ; ===================================================================
  (footprint "Package_TO_SOT_SMD:SOT-23-5" (layer "F.Cu")
    (property "Reference" "U3") (property "Value" "MCP73831T-2ACI/OT")
    (attr smd)
    (pad "1" smd roundrect (at -1.3 -1.0) (size 1.0 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net "+5V") (roundrect_rratio 0.25))
    (pad "2" smd roundrect (at -1.3 0) (size 1.0 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND") (roundrect_rratio 0.25))
    (pad "3" smd roundrect (at -1.3 1.0) (size 1.0 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net "+VBAT") (roundrect_rratio 0.25))
    (pad "4" smd roundrect (at 1.3 1.0) (size 1.0 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net "unconnected-(U3-Pad4)") (roundrect_rratio 0.25))
    (pad "5" smd roundrect (at 1.3 -1.0) (size 1.0 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net "+5V") (roundrect_rratio 0.25))
  )

  ; ===================================================================
  ; U4: MAX17048 fuel gauge (TDFN-8)
  ; ===================================================================
  (footprint "Package_DFN_QFN:TDFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm" (layer "F.Cu")
    (property "Reference" "U4") (property "Value" "MAX17048G+T10")
    (attr smd)
    (pad "1" smd roundrect (at -0.75 -0.75) (size 0.3 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net "+VBAT") (roundrect_rratio 0.25))
    (pad "2" smd roundrect (at -0.75 -0.25) (size 0.3 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND") (roundrect_rratio 0.25))
    (pad "3" smd roundrect (at -0.75 0.25) (size 0.3 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net "I2C_SDA") (roundrect_rratio 0.25))
    (pad "4" smd roundrect (at -0.75 0.75) (size 0.3 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net "I2C_SCL") (roundrect_rratio 0.25))
    (pad "5" smd roundrect (at 0.75 0.75) (size 0.3 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net "+3V3") (roundrect_rratio 0.25))
    (pad "6" smd roundrect (at 0.75 0.25) (size 0.3 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND") (roundrect_rratio 0.25))
    (pad "7" smd roundrect (at 0.75 -0.25) (size 0.3 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net "unconnected-(U4-Pad7)") (roundrect_rratio 0.25))
    (pad "8" smd roundrect (at 0.75 -0.75) (size 0.3 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net "+3V3") (roundrect_rratio 0.25))
    (pad "9" smd roundrect (at 0 0) (size 0.9 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND") (roundrect_rratio 0.0))
  )

  ; ===================================================================
  ; U5: TXU0104 level shifter (TSSOP-16)
  ; ===================================================================
  (footprint "Package_SO:TSSOP-16_4.4x5mm_P0.65mm" (layer "F.Cu")
    (property "Reference" "U5") (property "Value" "TXU0104PWR")
    (attr smd)
    (pad "1" smd roundrect (at -2.925 -1.95) (size 0.45 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (net "+3V3") (roundrect_rratio 0.25))
    (pad "2" smd roundrect (at -2.925 -1.3) (size 0.45 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (net "SWCLK_TCK") (roundrect_rratio 0.25))
    (pad "3" smd roundrect (at -2.925 -0.65) (size 0.45 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (net "SWDIO_TMS") (roundrect_rratio 0.25))
    (pad "4" smd roundrect (at -2.925 0) (size 0.45 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (net "TDI") (roundrect_rratio 0.25))
    (pad "5" smd roundrect (at -2.925 0.65) (size 0.45 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (net "TDO") (roundrect_rratio 0.25))
    (pad "8" smd roundrect (at -2.925 1.95) (size 0.45 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND") (roundrect_rratio 0.25))
    (pad "9" smd roundrect (at 2.925 1.95) (size 0.45 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (net "TGT_TDO") (roundrect_rratio 0.25))
    (pad "10" smd roundrect (at 2.925 0.65) (size 0.45 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (net "TGT_TDI") (roundrect_rratio 0.25))
    (pad "11" smd roundrect (at 2.925 0) (size 0.45 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (net "TGT_TMS") (roundrect_rratio 0.25))
    (pad "12" smd roundrect (at 2.925 -0.65) (size 0.45 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (net "TGT_TCK") (roundrect_rratio 0.25))
    (pad "15" smd roundrect (at 2.925 -1.3) (size 0.45 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (net "+3V3") (roundrect_rratio 0.25))
    (pad "16" smd roundrect (at 2.925 -1.95) (size 0.45 1.1) (layers "F.Cu" "F.Paste" "F.Mask") (net "TGT_VREF") (roundrect_rratio 0.25))
  )

  ; ===================================================================
  ; J2: Probe head (8-pin header, 1.0mm pitch pogo pins)
  ; ===================================================================
  (footprint "Connector_PinHeader_1.00mm:PinHeader_1x08_P1.00mm_Vertical" (layer "F.Cu")
    (property "Reference" "J2") (property "Value" "PROBE_HEAD_8P")
    (attr through_hole)
    (pad "1" thru_hole circle (at 0 -3.5) (size 0.6 0.6) (drill 0.4) (layers "*.Cu" "*.Mask") (net "TGT_TCK"))
    (pad "2" thru_hole circle (at 0 -2.5) (size 0.6 0.6) (drill 0.4) (layers "*.Cu" "*.Mask") (net "TGT_TMS"))
    (pad "3" thru_hole circle (at 0 -1.5) (size 0.6 0.6) (drill 0.4) (layers "*.Cu" "*.Mask") (net "TGT_TDI"))
    (pad "4" thru_hole circle (at 0 -0.5) (size 0.6 0.6) (drill 0.4) (layers "*.Cu" "*.Mask") (net "TGT_TDO"))
    (pad "5" thru_hole circle (at 0 0.5) (size 0.6 0.6) (drill 0.4) (layers "*.Cu" "*.Mask") (net "TGT_VREF"))
    (pad "6" thru_hole circle (at 0 1.5) (size 0.6 0.6) (drill 0.4) (layers "*.Cu" "*.Mask") (net "TGT_PWR"))
    (pad "7" thru_hole circle (at 0 2.5) (size 0.6 0.6) (drill 0.4) (layers "*.Cu" "*.Mask") (net "TGT_CONT"))
    (pad "8" thru_hole circle (at 0 3.5) (size 0.6 0.6) (drill 0.4) (layers "*.Cu" "*.Mask") (net "GND"))
  )

  ; ===================================================================
  ; J1: USB-C connector (simplified 16-pin)
  ; ===================================================================
  (footprint "Connector_USB:USB_C_Receptacle_HRO_TYPE-C-31-M-12" (layer "F.Cu")
    (property "Reference" "J1") (property "Value" "USB_C 16P")
    (attr smd)
    (pad "A1" smd rect (at -3.6 -3.8) (size 0.4 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND"))
    (pad "A4" smd rect (at -2.6 -3.8) (size 0.4 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net "VBUS"))
    (pad "A5" smd rect (at -1.8 -3.8) (size 0.4 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net "unconnected-(J1-PadA5)"))
    (pad "A6" smd rect (at -0.6 -3.8) (size 0.4 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net "USB_DP"))
    (pad "A7" smd rect (at 0.6 -3.8) (size 0.4 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net "USB_DM"))
    (pad "B5" smd rect (at 1.8 -3.8) (size 0.4 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net "unconnected-(J1-PadB5)"))
    (pad "B12" smd rect (at 3.6 -3.8) (size 0.4 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND"))
    (pad "B9" smd rect (at 2.6 -3.8) (size 0.4 1.0) (layers "F.Cu" "F.Paste" "F.Mask") (net "VBUS"))
  )

  ; ===================================================================
  ; J3: Battery connector (JST-PH 2-pin)
  ; ===================================================================
  (footprint "Connector_JST:JST_PH_S2B-PH-SM4-TB_1x02_P2.00mm" (layer "F.Cu")
    (property "Reference" "J3") (property "Value" "BATTERY_1200mAh")
    (attr smd)
    (pad "1" smd rect (at -1.0 0) (size 1.0 3.2) (layers "F.Cu" "F.Paste" "F.Mask") (net "+VBAT"))
    (pad "2" smd rect (at 1.0 0) (size 1.0 3.2) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND"))
  )

  ; ===================================================================
  ; SW1: Tactile button
  ; ===================================================================
  (footprint "Button_Switch_SMD:SW_TS-1187A" (layer "F.Cu")
    (property "Reference" "SW1") (property "Value" "TS-1187A")
    (attr smd)
    (pad "1" smd rect (at -3.0 -1.5) (size 1.5 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND"))
    (pad "2" smd rect (at 3.0 -1.5) (size 1.5 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net "BUTTON"))
  )

  ; ===================================================================
  ; D1: WS2812B RGB LED
  ; ===================================================================
  (footprint "LED_SMD:LED_WS2812B-2020" (layer "F.Cu")
    (property "Reference" "D1") (property "Value" "WS2812B-Mini")
    (attr smd)
    (pad "1" smd rect (at -0.8 -0.5) (size 0.4 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net "+3V3"))
    (pad "3" smd rect (at 0.8 -0.5) (size 0.4 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND"))
    (pad "4" smd rect (at -0.8 0.5) (size 0.4 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net "LED_DATA"))
  )

  ; ===================================================================
  ; Y1: 32 MHz crystal for nRF52840
  ; ===================================================================
  (footprint "Crystal:Crystal_SMD_2016-2Pin_2.0x1.6mm" (layer "F.Cu")
    (property "Reference" "Y1") (property "Value" "32MHz")
    (attr smd)
    (pad "1" smd rect (at -0.7 0) (size 0.9 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net "XTAL_P"))
    (pad "2" smd rect (at 0.7 0) (size 0.9 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net "XTAL_N"))
  )

  ; ===================================================================
  ; Decoupling caps (0402)
  ; ===================================================================
  (footprint "Capacitor_SMD:C_0402_1005Metric" (layer "F.Cu")
    (property "Reference" "C3") (property "Value" "100nF")
    (attr smd)
    (pad "1" smd roundrect (at -0.5 0) (size 0.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net "+3V3") (roundrect_rratio 0.25))
    (pad "2" smd roundrect (at 0.5 0) (size 0.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND") (roundrect_rratio 0.25))
  )
  (footprint "Capacitor_SMD:C_0603_1608Metric" (layer "F.Cu")
    (property "Reference" "C5") (property "Value" "10uF")
    (attr smd)
    (pad "1" smd roundrect (at -0.8 0) (size 0.8 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (net "+3V3") (roundrect_rratio 0.25))
    (pad "2" smd roundrect (at 0.8 0) (size 0.8 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND") (roundrect_rratio 0.25))
  )

  ; ===================================================================
  ; BLE antenna matching (C1, C2, L1)
  ; ===================================================================
  (footprint "Capacitor_SMD:C_0402_1005Metric" (layer "F.Cu")
    (property "Reference" "C1") (property "Value" "2.2pF")
    (attr smd)
    (pad "1" smd roundrect (at -0.5 0) (size 0.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net "RF_ANT_P") (roundrect_rratio 0.25))
    (pad "2" smd roundrect (at 0.5 0) (size 0.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND") (roundrect_rratio 0.25))
  )
  (footprint "Capacitor_SMD:C_0402_1005Metric" (layer "F.Cu")
    (property "Reference" "C2") (property "Value" "0.8pF")
    (attr smd)
    (pad "1" smd roundrect (at -0.5 0) (size 0.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net "RF_ANT_P") (roundrect_rratio 0.25))
    (pad "2" smd roundrect (at 0.5 0) (size 0.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND") (roundrect_rratio 0.25))
  )
  (footprint "Inductor_SMD:L_0402_1005Metric" (layer "F.Cu")
    (property "Reference" "L1") (property "Value" "3.9nH")
    (attr smd)
    (pad "1" smd roundrect (at -0.5 0) (size 0.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net "RF_ANT_P") (roundrect_rratio 0.25))
    (pad "2" smd roundrect (at 0.5 0) (size 0.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net "ANT_FEED") (roundrect_rratio 0.25))
  )

  ; ===================================================================
  ; R1 (USB CC pull-down), R2 (button pull-up), R3 (LED series)
  ; ===================================================================
  (footprint "Resistor_SMD:R_0402_1005Metric" (layer "F.Cu")
    (property "Reference" "R1") (property "Value" "5.1k")
    (attr smd)
    (pad "1" smd roundrect (at -0.5 0) (size 0.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net "unconnected-(J1-PadA5)") (roundrect_rratio 0.25))
    (pad "2" smd roundrect (at 0.5 0) (size 0.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net "GND") (roundrect_rratio 0.25))
  )
  (footprint "Resistor_SMD:R_0402_1005Metric" (layer "F.Cu")
    (property "Reference" "R2") (property "Value" "10k")
    (attr smd)
    (pad "1" smd roundrect (at -0.5 0) (size 0.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net "+3V3") (roundrect_rratio 0.25))
    (pad "2" smd roundrect (at 0.5 0) (size 0.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net "BUTTON") (roundrect_rratio 0.25))
  )

  ; ===================================================================
  ; Zones: GND plane on In1.Cu, 3V3 plane on In2.Cu
  ; ===================================================================
  (zone (net "GND") (net_name "GND") (layer "In1.Cu") (tstamp 0)
    (hatch edge 0.5)
    (connect_pads (clearance 0.2))
    (min_thickness 0.2) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.3) (thermal_bridge_width 0.5))
    (polygon (pts (xy 0 0) (xy 50 0) (xy 50 24) (xy 0 24)))
  )
  (zone (net "+3V3") (net_name "+3V3") (layer "In2.Cu") (tstamp 1)
    (hatch edge 0.5)
    (connect_pads (clearance 0.2))
    (min_thickness 0.2) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.3) (thermal_bridge_width 0.5))
    (polygon (pts (xy 0 0) (xy 50 0) (xy 50 24) (xy 0 24)))
  )

  ; ===================================================================
  ; Traces (sample routing for key debug signals)
  ; ===================================================================
  (segment (start 25.0 8.0) (end 28.0 8.0) (width 0.15) (layer "F.Cu") (net "SWCLK_TCK"))
  (segment (start 28.0 8.0) (end 30.0 6.0) (width 0.15) (layer "F.Cu") (net "SWCLK_TCK"))
  (segment (start 25.0 8.5) (end 28.0 8.5) (width 0.15) (layer "F.Cu") (net "SWDIO_TMS"))
  (segment (start 25.0 9.0) (end 28.0 9.0) (width 0.15) (layer "F.Cu") (net "TDI"))
  (segment (start 25.0 9.5) (end 28.0 9.5) (width 0.15) (layer "F.Cu") (net "TDO"))
  (segment (start 15.0 12.0) (end 18.0 12.0) (width 0.15) (layer "F.Cu") (net "BLE_TX"))
  (segment (start 15.0 12.5) (end 18.0 12.5) (width 0.15) (layer "F.Cu") (net "BLE_RX"))
  (segment (start 5.0 2.0) (end 5.0 5.0) (width 0.3) (layer "F.Cu") (net "VBUS"))
  (segment (start 5.0 5.0) (end 8.0 5.0) (width 0.3) (layer "F.Cu") (net "+5V"))
  (segment (start 45.0 12.0) (end 48.0 12.0) (width 0.15) (layer "F.Cu") (net "BUTTON"))
  (via (at 25 12) (size 0.3) (drill 0.15) (layers "F.Cu" "B.Cu") (net "GND"))

  ; ===================================================================
  ; Dimensions
  ; ===================================================================
  (dimension (type orthogonal) (layer "Dwgs.User")
    (pts (xy 0 0) (xy 50 0)) (height -2)
    (format (units millimeter) (precision 2))
    (style (thickness 0.1) (arrow_length 1.0) (text_position_mode 0))
  )
  (dimension (type orthogonal) (layer "Dwgs.User")
    (pts (xy 0 0) (xy 0 24)) (height -2)
    (format (units millimeter) (precision 2))
    (style (thickness 0.1) (arrow_length 1.0) (text_position_mode 0))
  )

)