(kicad_pcb (version 20230121) (generator "kicad_pcb_new") (general (thickness 1.6) (legacy_teardrops no) ) (paper "A4") (title_block (title "Harmonic Reaper — Non-Linear Junction Detector") (date "2026-08-19") (rev "1.0") (company "Open Hardware — jayis1") (comment 1 "TSCM bug-sweeping NLJD, 2.4 GHz fundamental") (comment 2 "Author: jayis1") (comment 3 "License: GPL-2.0") ) (layers (0 "F.Cu" signal) (1 "In1.Cu" signal "GND plane") (2 "In2.Cu" signal "PWR plane") (31 "B.Cu" signal) (32 "B.Adhes" user "B.Adhesive") (33 "F.Adhes" user "F.Adhesive") (34 "B.Paste" user) (35 "F.Paste" user) (36 "B.SilkS" user "B.Silkscreen") (37 "F.SilkS" user "F.Silkscreen") (38 "B.Mask" user) (39 "F.Mask" user) (40 "Dwgs.User" user "User.Drawings") (41 "Cmts.User" user "User.Comments") (42 "Eco1.User" user "User.Eco1") (43 "Eco2.User" user "User.Eco2") (44 "Edge.Cuts" user) (45 "Margin" user) (46 "B.CrtYd" user "B.Courtyard") (47 "F.CrtYd" user "F.Courtyard") (48 "B.Fab" user) (49 "F.Fab" user) ) (setup (stackup (layer "F.Cu" (copper F.Cu) (type copper) (thickness 0.035)) (layer "dielectric 1" (type core) (thickness 0.2) (material "FR4")) (layer "In1.Cu" (copper In1.Cu) (type copper) (thickness 0.035)) (layer "dielectric 2" (type core) (thickness 0.7) (material "FR4")) (layer "In2.Cu" (copper In2.Cu) (type copper) (thickness 0.035)) (layer "dielectric 3" (type prepreg) (thickness 0.2) (material "FR4")) (layer "B.Cu" (copper B.Cu) (type copper) (thickness 0.035)) (layer "F.Mask" (type soldermask)) (layer "B.Mask" (type soldermask)) (layer "F.SilkS" (type silkscreen)) (layer "B.SilkS" (type silkscreen)) (copper_finish "ENIG") (dielectric_constraints no) ) (pad_to_mask_clearance 0.05) (pcbplotparams (layerselection 0x00010fc_ffffffff) (plot_on_all_layers_selection 0x0000000_00000000) (disableapertmacros no) (usegerberextensions no) (usegerberattributes yes) (usegerberadvancedattributes yes) (creategerberjobfile yes) (gerberprecision 4) (dashed_line_dash_ratio 12.000000) (dashed_line_gap_ratio 3.000000) (svgprecision 4) (excludeedgelayer yes) (plotframeref no) (plotinvisibletext no) (skippadnopause no) (skippadmecro no) (subtractmaskfromsilk no) (mode 1) (symmetric no) (outputformat 1) (mirror no) (drillshape 0) (scaleselection 1) (outputdirectory "gerber/") ) ) (net 0 "") (net 1 "VDD_3V3") (net 2 "VDD_1V8") (net 3 "VDD_9V") (net 4 "GND") (net 5 "VBAT") (net 6 "VBUS") (net 7 "SPI0_SCK") (net 8 "SPI0_MOSI") (net 9 "SPI0_MISO") (net 10 "SPI1_SCK") (net 11 "SPI1_MOSI") (net 12 "SPI1_MISO") (net 13 "SPI2_SCK") (net 14 "SPI2_MOSI") (net 15 "SPI3_SCK") (net 16 "SPI3_MOSI") (net 17 "SPI3_MISO") (net 18 "ADF4159_LE") (net 19 "ADF4159_CE") (net 20 "QPL9547_CS") (net 21 "QPL9547_TX_EN") (net 22 "AD9361_CS") (net 23 "AD9361_RESET") (net 24 "FPGA_CS") (net 25 "FPGA_PROG_B") (net 26 "FPGA_DONE") (net 27 "FPGA_IRQ") (net 28 "AD9226_PD") (net 29 "ADL5802_EN") (net 30 "OLED_DC") (net 31 "OLED_CS") (net 32 "OLED_RST") (net 33 "IMU_CS") (net 34 "IMU_INT1") (net 35 "SD_CS") (net 36 "SD_DETECT") (net 37 "LED_R") (net 38 "LED_G") (net 39 "LED_B") (net 40 "AGC_DAC[5:0]") (net 41 "RF_TX_2G4") (net 42 "RF_RX_2F0") (net 43 "RF_RX_3F0") (net 44 "I2C_SDA") (net 45 "I2C_SCL") (net 46 "USB_D+") (net 47 "USB_D-") (net 48 "CHG_STAT") (footprint "Package_DFNQFN:QFN-73-1EP_7x7mm_P0.5mm" (layer "F.Cu") (tedit 0) (tstamp 00000000-0000-0000-0000-000000000001) (at 100 100) (descr "nRF52840 QFN-73") (attr smd) (model "${KISYS3DMOD}/Package_DFNQFN.3dshapes/QFN-73-1EP_7x7mm_P0.5mm.wrl" (offset (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) (pad "1" smd roundrect (at -3.75 -3.25) (size 0.3 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 7 "SPI0_SCK") (solder_mask_margin 0.05)) (pad "2" smd roundrect (at -3.75 -2.75) (size 0.3 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 8 "SPI0_MOSI") (solder_mask_margin 0.05)) (pad "3" smd roundrect (at -3.75 -2.25) (size 0.3 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 9 "SPI0_MISO") (solder_mask_margin 0.05)) (pad "14" smd roundrect (at -3.75 0.75) (size 0.3 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 37 "LED_R") (solder_mask_margin 0.05)) (pad "15" smd roundrect (at -3.75 1.25) (size 0.3 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 38 "LED_G") (solder_mask_margin 0.05)) (pad "16" smd roundrect (at -3.75 1.75) (size 0.3 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 39 "LED_B") (solder_mask_margin 0.05)) (pad "61" smd roundrect (at 0 -3.75) (size 0.85 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "VDD_3V3") (solder_mask_margin 0.05)) (pad "64" smd roundrect (at -1 -3.75) (size 0.85 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 4 "GND") (solder_mask_margin 0.05)) (pad "73" smd roundrect (at 0 3.75) (size 1.5 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 4 "GND") (solder_mask_margin 0.05)) ) (footprint "Package_CSP:LFCSP-24-1EP_4x4mm_P0.5mm" (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000002) (at 130 80) (descr "ADF4159 LFCSP-24") (attr smd) (pad "1" smd roundrect (at -1.75 -1.5) (size 0.3 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 7 "SPI0_SCK")) (pad "2" smd roundrect (at -1.75 -0.75) (size 0.3 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 8 "SPI0_MOSI")) (pad "3" smd roundrect (at -1.75 0) (size 0.3 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 18 "ADF4159_LE")) (pad "4" smd roundrect (at -1.75 0.75) (size 0.3 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 19 "ADF4159_CE")) (pad "9" smd roundrect (at 1.75 -1.5) (size 0.3 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 41 "RF_TX_2G4")) (pad "16" smd roundrect (at 1.75 0.75) (size 0.3 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "VDD_3V3")) (pad "15" smd roundrect (at 0.75 1.75) (size 0.6 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net 4 "GND")) (pad "EP" smd roundrect (at 0 0) (size 1.6 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 4 "GND")) ) (footprint "Package_DFNQFN:DFN-12-1EP_3x3mm_P0.5mm" (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000003) (at 140 80) (descr "QPL9547 PA DFN-12") (attr smd) (pad "1" smd roundrect (at -1.25 -1) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 41 "RF_TX_2G4")) (pad "3" smd roundrect (at 1.25 -1) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 42 "RF_RX_2F0")) (pad "4" smd roundrect (at -1.25 -0.5) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 7 "SPI0_SCK")) (pad "5" smd roundrect (at -1.25 0) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 8 "SPI0_MOSI")) (pad "6" smd roundrect (at -1.25 0.5) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 20 "QPL9547_CS")) (pad "7" smd roundrect (at -1.25 1) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 21 "QPL9547_TX_EN")) (pad "8" smd roundrect (at 0 -1.25) (size 0.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "VDD_9V")) (pad "9" smd roundrect (at 0 1.25) (size 0.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net 4 "GND")) ) (footprint "Package_BGA:BGA-144_12x12_9.0x9.0mm" (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000004) (at 80 80) (descr "AD9361 BGA-144") (attr smd) (pad "C1" smd circle (at -4.5 -4.5) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 10 "SPI1_SCK")) (pad "C2" smd circle (at -3.5 -4.5) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 11 "SPI1_MOSI")) (pad "C3" smd circle (at -2.5 -4.5) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 12 "SPI1_MISO")) (pad "C4" smd circle (at -1.5 -4.5) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 22 "AD9361_CS")) (pad "A1" smd circle (at -4.5 -3.5) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "VDD_3V3")) (pad "B1" smd circle (at -4.5 -2.5) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 4 "GND")) ) (footprint "Package_BGA:BGA-132_10x10_8.0x8.0mm" (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000005) (at 60 60) (descr "Spartan-7 XC7S6 BGA-132") (attr smd) (pad "A1" smd circle (at -3.6 -3.6) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 10 "SPI1_SCK")) (pad "A2" smd circle (at -2.8 -3.6) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 11 "SPI1_MOSI")) (pad "A4" smd circle (at -1.2 -3.6) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 24 "FPGA_CS")) (pad "B1" smd circle (at -3.6 -2.8) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 25 "FPGA_PROG_B")) (pad "B2" smd circle (at -2.8 -2.8) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 26 "FPGA_DONE")) (pad "B3" smd circle (at -2 -2.8) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 27 "FPGA_IRQ")) (pad "D1" smd circle (at -3.6 -1.2) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "VDD_1V8")) (pad "E1" smd circle (at -3.6 -0.4) (size 0.4 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (net 4 "GND")) ) (gr_line (start 0 0) (end 280 0) (stroke (width 0.1) (type default)) (layer "Edge.Cuts") ) (gr_line (start 280 0) (end 280 56) (stroke (width 0.1) (type default)) (layer "Edge.Cuts") ) (gr_line (start 280 56) (end 0 56) (stroke (width 0.1) (type default)) (layer "Edge.Cuts") ) (gr_line (start 0 56) (end 0 0) (stroke (width 0.1) (type default)) (layer "Edge.Cuts") ) (gr_text "Harmonic Reaper NLJD — jayis1" (at 10 5) (layer "F.SilkS") (effects (font (size 1.5 1.5) (thickness 0.15))) ) (gr_text "Rev 1.0 — GPL-2.0" (at 10 8) (layer "F.SilkS") (effects (font (size 1 0.8) (thickness 0.1))) ) (via (at 20 20) (size 0.4) (drill 0.25) (layers "F.Cu" "B.Cu") (net 4)) (via (at 40 20) (size 0.4) (drill 0.25) (layers "F.Cu" "B.Cu") (net 4)) (via (at 60 20) (size 0.4) (drill 0.25) (layers "F.Cu" "B.Cu") (net 4)) (via (at 80 20) (size 0.4) (drill 0.25) (layers "F.Cu" "B.Cu") (net 4)) (via (at 100 20) (size 0.4) (drill 0.25) (layers "F.Cu" "B.Cu") (net 4)) (via (at 120 20) (size 0.4) (drill 0.25) (layers "F.Cu" "B.Cu") (net 4)) (via (at 140 20) (size 0.4) (drill 0.25) (layers "F.Cu" "B.Cu") (net 4)) (via (at 160 20) (size 0.4) (drill 0.25) (layers "F.Cu" "B.Cu") (net 4)) (via (at 20 40) (size 0.4) (drill 0.25) (layers "F.Cu" "B.Cu") (net 4)) (via (at 40 40) (size 0.4) (drill 0.25) (layers "F.Cu" "B.Cu") (net 4)) (via (at 60 40) (size 0.4) (drill 0.25) (layers "F.Cu" "B.Cu") (net 4)) (via (at 80 40) (size 0.4) (drill 0.25) (layers "F.Cu" "B.Cu") (net 4)) (via (at 100 40) (size 0.4) (drill 0.25) (layers "F.Cu" "B.Cu") (net 4)) (via (at 120 40) (size 0.4) (drill 0.25) (layers "F.Cu" "B.Cu") (net 4)) (via (at 140 40) (size 0.4) (drill 0.25) (layers "F.Cu" "B.Cu") (net 4)) (zone (net 4) (net_name "GND") (layer "In1.Cu") (tstamp 0) (hatch edge 0.508) (connect_pads (clearance 0.2)) (min_thickness 0.2) (fill yes (thermal_gap 0.3) (thermal_bridge_width 0.3)) (polygon (pts (xy 0 0) (xy 280 0) (xy 280 56) (xy 0 56))) ) (segment (start 96.25 96.75) (end 128.25 78.5) (width 0.2) (layer "F.Cu") (net 7) (tstamp 1)) (segment (start 96.25 97.25) (end 128.25 79.25) (width 0.2) (layer "F.Cu") (net 8) (tstamp 2)) (segment (start 96.25 97.75) (end 128.25 80) (width 0.2) (layer "F.Cu") (net 9) (tstamp 3)) (segment (start 131.75 78.5) (end 138.75 79) (width 0.5) (layer "F.Cu") (net 41) (tstamp 4)) (segment (start 75.5 75.5) (at 58.4 56.4) (width 0.2) (layer "F.Cu") (net 10) (tstamp 5)) ) ;; EOF — device.kicad_pcb — jayis1