(kicad_pcb (version 20231007) (generator "pcbnew") (general (thickness 1.6) (legacy_teardrops no) ) (paper "A4") (title_block (title "LumenTap - Laser-Doppler Acoustic Eavesdropping Tool") (date "2026-07-06") (rev "1.0") (company "Hacker Devices / jayis1") (comment 1 "STM32H743VIT6 + OPA380 + PLT5 510R + S1223") (comment 2 "4-Layer PCB, 1.6mm FR4, 110x60mm") (comment 3 "Author: jayis1 - MIT License") ) (layers (0 "F.Cu" signal) (1 "In1.Cu" signal "GND") (2 "In2.Cu" signal "PWR") (31 "B.Cu" signal) (32 "B.Adhes" user) (33 "F.Adhes" user) (34 "B.Paste" user) (35 "F.Paste" user) (36 "B.SilkS" user) (37 "F.SilkS" user) (38 "B.Mask" user) (39 "F.Mask" user) (40 "Dwgs.User" user) (41 "Cmts.User" user) (42 "Eco1.User" user) (43 "Eco2.User" user) (44 "Edge.Cuts" user) (45 "Margin" user) (46 "B.CrtYd" user) (47 "F.CrtYd" user) (48 "B.Fab" user) (49 "F.Fab" user) ) (setup (stackup (layer "F.Cu" (type copper) (thickness 0.035)) (layer "dielectric 1" (type core) (thickness 0.210) (material "FR4")) (layer "In1.Cu" (type copper) (thickness 0.035)) (layer "dielectric 2" (type prepreg) (thickness 1.065) (material "FR4")) (layer "In2.Cu" (type copper) (thickness 0.035)) (layer "dielectric 3" (type core) (thickness 0.210) (material "FR4")) (layer "B.Cu" (type copper) (thickness 0.035)) (copper_finish "ENIG") (dielectric_constraints no) ) (pad_to_mask_clearance 0.05) (solder_mask_min_width 0.04) (pcbplotparams (layerselection 0x00010fc_ffffffff) (plot_on_all_layers_selection 0x0000000_00000000) (disableapertmacros false) (usegerberextensions true) (usegerberattributes true) (usegerberadvancedattributes false) (creategerberjobfile true) (svgprecision 6) (excludeedgelayer true) (plotframeref false) (viasonmask false) (mode 1) (useauxorigin false) (hpglpennumber 1) (hpglpenspeed 20) (hpglpendiameter 15.000001) (dxfpolygonmode true) (dxfimperialunits true) (dxfusepcbnewfont true) (psnegative false) (psa4output false) (plotreference true) (plotvalue true) (plotinvisibletext false) (sketchpadsonfab false) (subtractmaskfromsilk true) (outputformat 1) (mirror false) (drillshape 0) (scaleselection 1) (outputdirectory "gerbers/")) ) (net 0 "") (net 1 "GND") (net 2 "VCC_5V") (net 3 "VCC_3V3") (net 4 "VCC_1V8") (net 5 "VCC_5V_CLEAN") (net 6 "VBUS") (net 7 "LASER_PWM") (net 8 "LASER_EN") (net 9 "LASER_A") (net 10 "LASER_K") (net 11 "PD_CATHODE") (net 12 "PD_ANODE") (net 13 "TIA_OUT") (net 14 "FDA_OUT_P") (net 15 "FDA_OUT_N") (net 16 "ADC_INP0") (net 17 "ADC_INN0") (net 18 "I2C_SCL") (net 19 "I2C_SDA") (net 20 "USB_DP") (net 21 "USB_DM") (net 22 "SD_D0") (net 23 "SD_D1") (net 24 "SD_D2") (net 25 "SD_D3") (net 26 "SD_CMD") (net 27 "SD_CLK") (net 28 "ARM_KEY") (net 29 "AMBIENT_IRQ") (net 30 "LED_STATUS") (net 31 "LED_FAULT") (footprint "Package_QFP:LQFP-100_14x14mm_P0.5mm" (layer "F.Cu") (tedit 0) (at 55 40) (attr smd) (fp_text reference "U1" (at 0 -9) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)))) (fp_text value "STM32H743VIT6" (at 0 9) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15)))) (fp_line (start -7.5 -7.5) (end 7.5 -7.5) (layer "F.CrtYd") (width 0.05)) (fp_line (start 7.5 -7.5) (end 7.5 7.5) (layer "F.CrtYd") (width 0.05)) (fp_line (start 7.5 7.5) (end -7.5 7.5) (layer "F.CrtYd") (width 0.05)) (fp_line (start -7.5 7.5) (end -7.5 -7.5) (layer "F.CrtYd") (width 0.05)) (pad "14" smd roundrect (at -6 4.5) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 16 "ADC_INP0")) (pad "15" smd roundrect (at -6 4) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 17 "ADC_INN0")) (pad "26" smd roundrect (at -6 -0.5) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 7 "LASER_PWM")) (pad "27" smd roundrect (at -6 -1) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 6 "VBUS")) (pad "33" smd roundrect (at -6 -4) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 18 "I2C_SCL")) (pad "35" smd roundrect (at 6 4.5) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 30 "LED_STATUS")) (pad "36" smd roundrect (at 6 4) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 31 "LED_FAULT")) (pad "39" smd roundrect (at 6 2.5) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 28 "ARM_KEY")) (pad "40" smd roundrect (at 6 2) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 8 "LASER_EN")) (pad "43" smd roundrect (at 6 0.5) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 19 "I2C_SDA")) (pad "51" smd roundrect (at 6 -3.5) (size 1.5 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 27 "SD_CLK")) (pad "11" smd roundrect (at 0 -6) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 3 "VCC_3V3")) (pad "10" smd roundrect (at -0.5 -6) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) (pad "22" smd roundrect (at 2 -6) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 4 "VCC_1V8")) ) (footprint "Package_SO:SOIC-8_3.9x4.9mm_P1.27mm" (layer "F.Cu") (tedit 0) (at 80 40) (attr smd) (fp_text reference "U3" (at 0 -3.5) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)))) (fp_text value "OPA380" (at 0 3.5) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15)))) (pad "2" smd roundrect (at -2.7 1.905) (size 1.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 13 "TIA_OUT")) (pad "3" smd roundrect (at -2.7 0.635) (size 1.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 12 "PD_ANODE")) (pad "4" smd roundrect (at -2.7 -0.635) (size 1.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) (pad "6" smd roundrect (at 2.7 0.635) (size 1.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 13 "TIA_OUT")) (pad "7" smd roundrect (at 2.7 1.905) (size 1.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 5 "VCC_5V_CLEAN")) ) (footprint "Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm" (layer "F.Cu") (tedit 0) (at 80 25) (attr smd) (fp_text reference "U2" (at 0 -3) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)))) (fp_text value "iC-HK" (at 0 3) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15)))) (pad "1" smd roundrect (at -1.25 0.75) (size 0.3 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 5 "VCC_5V_CLEAN")) (pad "2" smd roundrect (at -1.25 0.25) (size 0.3 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 7 "LASER_PWM")) (pad "3" smd roundrect (at -1.25 -0.25) (size 0.3 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 8 "LASER_EN")) (pad "5" smd roundrect (at 0.25 0.75) (size 0.3 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 9 "LASER_A")) (pad "6" smd roundrect (at 0.25 0.25) (size 0.3 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 10 "LASER_K")) (pad "16" smd roundrect (at 0 -0.75) (size 0.3 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "GND")) ) (footprint "Package_TO_SOT_THT:TO-5-2_Window" (layer "F.Cu") (tedit 0) (at 80 55) (attr through_hole) (fp_text reference "D2" (at 0 -5) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)))) (fp_text value "S1223" (at 0 5) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15)))) (pad "1" thru_hole circle (at -1.27 0) (size 1.5 1.5) (drill 0.8) (layers "*.Cu" "*.Mask") (net 11 "PD_CATHODE")) (pad "2" thru_hole circle (at 1.27 0) (size 1.5 1.5) (drill 0.8) (layers "*.Cu" "*.Mask") (net 12 "PD_ANODE")) ) (footprint "Connector_USB:USB_C_Receptacle_HRO_TYPE-C-31-M-12" (layer "F.Cu") (tedit 0) (at 25 40) (attr smd) (fp_text reference "J1" (at 0 -5) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)))) (fp_text value "USB_C" (at 0 5) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15)))) (pad "A1" smd roundrect (at -3.5 0) (size 0.3 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND")) (pad "A4" smd roundrect (at -2.5 0) (size 0.3 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 6 "VBUS")) (pad "A6" smd roundrect (at 0.5 0) (size 0.3 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 20 "USB_DP")) (pad "A7" smd roundrect (at 1.5 0) (size 0.3 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 21 "USB_DM")) ) (footprint "Connector_Card:microSD_HC_Hirose_DM3D-SF" (layer "F.Cu") (tedit 0) (at 100 40) (attr smd) (fp_text reference "J2" (at 0 -7) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)))) (fp_text value "Micro_SD_Card" (at 0 7) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15)))) (pad "1" smd roundrect (at 4 3.5) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 23 "SD_D1")) (pad "2" smd roundrect (at 3 3.5) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 22 "SD_D0")) (pad "3" smd roundrect (at 2 3.5) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 26 "SD_CMD")) (pad "4" smd roundrect (at 1 3.5) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "VCC_3V3")) (pad "5" smd roundrect (at 0 3.5) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 27 "SD_CLK")) (pad "6" smd roundrect (at -1 3.5) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "GND")) (pad "8" smd roundrect (at -2 3.5) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 25 "SD_D3")) (pad "9" smd roundrect (at -3 3.5) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 24 "SD_D2")) ) (footprint "Package_DFN_QFN:DFN-12-1EP_3x3mm_P0.45mm" (layer "F.Cu") (tedit 0) (at 40 25) (attr smd) (fp_text reference "U5" (at 0 -3) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)))) (fp_text value "LT3045IDE" (at 0 3) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15)))) (pad "1" smd roundrect (at -1.3 0.675) (size 0.3 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "VCC_5V")) (pad "2" smd roundrect (at 1.3 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