(kicad_pcb
  (version 20240108)
  (generator "pcbnew")
  (generator_version "8.0")
  (general
    (thickness 1.6)
    (legacy_teardrops no)
  )
  (paper "A4")
  (title_block
    (title "MagLance — Targeted Magnetic Field Injection Platform")
    (date "2026-07-31")
    (rev "1.0")
    (company "Author: jayis1")
    (comment 1 "Open-source magnetic field injection tool")
    (comment 2 "MCU: STM32G474VET6 | BLE: nRF52840 | Mag: RM3100 x3")
    (comment 3 "License: GPL-2.0 / CERN-OHL-S v2")
  )
  (layers
    (0 "F.Cu" signal)
    (1 "In1.Cu" signal "GND")
    (2 "In2.Cu" signal "PWR")
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Silk Screen") (color "White"))
      (layer "F.Paste" (type "Solder Paste"))
      (layer "F.Mask" (type "Solder Mask") (color "Black") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5))
      (layer "In1.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 2" (type "prepreg") (thickness 0.36) (material "FR4") (epsilon_r 4.5))
      (layer "In2.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 3" (type "core") (thickness 0.71) (material "FR4") (epsilon_r 4.5))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Solder Mask") (color "Black") (thickness 0.01))
      (layer "B.Paste" (type "Solder Paste"))
      (layer "B.SilkS" (type "Silk Screen") (color "White"))
      (copper_finish "ENIG")
    )
    (pad_to_mask_clearance 0.05)
    (allow_soldermask_bridges_in_footprints no)
    (pcbplotparams
      (layerselection 0x00010ff_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros no)
      (usegerberextensions no)
      (usegerberattributes yes)
      (usegerberadvancedattributes yes)
      (creategerberjobfile yes)
      (dashed_line_dash_ratio 12.0)
      (dashed_line_gap_ratio 3.0)
      (svgprecision 4)
      (plotframeref no)
      (viasonmask no)
      (mode 1)
      (useauxorigin no)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.0)
      (pdf_front_fp_property_popups yes)
      (pdf_back_fp_property_popups yes)
      (dxfpolygonmode yes)
      (dxfimperialunits yes)
      (dxfusepcbnewfont yes)
      (psnegative no)
      (psa4output1 no)
      (plotreference yes)
      (plotvalue yes)
      (plotfptext yes)
      (plotinvisibletext no)
      (sketchpadsonfab no)
      (subtractmaskfromsilk no)
      (outputformat 1)
      (mirror no)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "gerbers/")
    )
  )
  (net 0 "")
  (net 1 "VBAT")
  (net 2 "+5V")
  (net 3 "GND")
  (net 4 "COIL+")
  (net 5 "COIL-")
  (net 6 "HRTIM_CHA1")
  (net 7 "HRTIM_CHA2")
  (net 8 "HRTIM_CHC1")
  (net 9 "HRTIM_CHC2")
  (net 10 "SPI2_SCK")
  (net 11 "SPI2_MISO")
  (net 12 "SPI2_MOSI")
  (net 13 "MAG_CS0")
  (net 14 "MAG_CS1")
  (net 15 "MAG_CS2")
  (net 16 "I2C1_SCL")
  (net 17 "I2C1_SDA")
  (net 18 "USART1_TX")
  (net 19 "USART1_RX")
  (net 20 "ADC_CURRENT")
  (net 21 "BTN_FIRE")
  (net 22 "BTN_MODE")
  (net 23 "BTN_SELECT")
  (net 24 "SAFETY_EN")
  (net 25 "GATE_Q1")
  (net 26 "GATE_Q2")
  (net 27 "GATE_Q3")
  (net 28 "GATE_Q4")

  ;; ============== FOOTPRINTS ==============

  ;; U1: STM32G474VET6 — Main MCU (center of board)
  (footprint "Package_QFP:LQFP-100_14x14mm_P0.5mm"
    (layer "F.Cu")
    (tedit 0)
    (tstamp a1b2c3d4-0001-0001-0001-000000000001)
    (at 100 80)
    (descr "LQFP-100, 14x14mm, 0.5mm pitch")
    (attr smd)
    (property "Reference" "U1" (at 0 -9 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Value" "STM32G474VET6" (at 0 9 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Author" "jayis1" (at 0 -11 0) (layer "F.Fab") (effects (font (size 0.5 0.5))))
    ;; Pin 1 marker
    (fp_circle (center -6.5 -6.5) (end -6.2 -6.2) (layer "F.SilkS") (width 0.15))
    ;; Outline
    (fp_rect (start -7 -7) (end 7 7) (layer "F.SilkS") (width 0.12))
    (fp_rect (start -6.5 -6.5) (end 6.5 6.5) (layer "F.Fab") (width 0.1))
    ;; Pads (simplified — 100 pads, 25 per side)
    (pad "1" smd roundrect (at -6 -7.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "VBAT"))
    (pad "2" smd roundrect (at -5.5 -7.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "GND"))
    (pad "11" smd roundrect (at -1 -7.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+5V"))
    (pad "27" smd roundrect (at 6 -7.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "GND"))
    (pad "41" smd roundrect (at 7.75 -3 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 6 "HRTIM_CHA1"))
    (pad "42" smd roundrect (at 7.75 -2.5 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 7 "HRTIM_CHA2"))
    (pad "43" smd roundrect (at 7.75 -2 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 8 "HRTIM_CHC1"))
    (pad "44" smd roundrect (at 7.75 -1.5 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 9 "HRTIM_CHC2"))
    (pad "53" smd roundrect (at -7.75 -2 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 10 "SPI2_SCK"))
    (pad "54" smd roundrect (at -7.75 -1.5 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 11 "SPI2_MISO"))
    (pad "55" smd roundrect (at -7.75 -1 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 12 "SPI2_MOSI"))
    (pad "56" smd roundrect (at -7.75 -0.5 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 13 "MAG_CS0"))
    (pad "57" smd roundrect (at -7.75 0 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 14 "MAG_CS1"))
    (pad "58" smd roundrect (at -7.75 0.5 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 15 "MAG_CS2"))
    (pad "59" smd roundrect (at -7.75 1 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 16 "I2C1_SCL"))
    (pad "60" smd roundrect (at -7.75 1.5 0) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 17 "I2C1_SDA"))
    (pad "78" smd roundrect (at 2 7.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 21 "BTN_FIRE"))
    (pad "79" smd roundrect (at 2.5 7.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 22 "BTN_MODE"))
    (pad "80" smd roundrect (at 3 7.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 23 "BTN_SELECT"))
    (pad "86" smd roundrect (at 6 7.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 24 "SAFETY_EN"))
    (pad "14" smd roundrect (at -4 7.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 20 "ADC_CURRENT"))
    (model "${KICAD6_3DMODEL_DIR}/Package_QFP.3dshapes/LQFP-100_14x14mm_P0.5mm.wrl"
      (offset (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)))
  )

  ;; U2: nRF52840 BLE Module (top right)
  (footprint "RF_Module:Nordic_nRF52840_M2"
    (layer "F.Cu")
    (tstamp a1b2c3d4-0001-0001-0001-000000000002)
    (at 140 50)
    (property "Reference" "U2" (at 0 -10 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Value" "nRF52840-M.2" (at 0 10 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Author" "jayis1" (at 0 -12 0) (layer "F.Fab") (effects (font (size 0.5 0.5))))
    (fp_rect (start -10 -7.5) (end 10 7.5) (layer "F.SilkS") (width 0.12))
    (pad "1" smd rect (at -8 -6 0) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+5V"))
    (pad "2" smd rect (at -8 6 0) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "GND"))
    (pad "3" smd rect (at -8 2 0) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 19 "USART1_RX"))
    (pad "4" smd rect (at -8 4 0) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 18 "USART1_TX"))
    (pad "5" smd rect (at 8 0 0) (size 2 4) (layers "F.Cu" "F.Paste" "F.Mask"))  ;; ANT
  )

  ;; U3, U4, U5: RM3100 Magnetometers (left side, at 0mm, 15mm, 30mm positions)
  (footprint "Sensor_Magnetic:PNI_RM3100"
    (layer "F.Cu")
    (tstamp a1b2c3d4-0001-0001-0001-000000000003)
    (at 40 30)
    (property "Reference" "U3" (at 0 -6 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Value" "RM3100" (at 0 6 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Author" "jayis1" (at 0 -8 0) (layer "F.Fab") (effects (font (size 0.5 0.5))))
    (fp_rect (start -5 -4) (end 5 4) (layer "F.SilkS") (width 0.12))
    (pad "1" smd rect (at -3.81 -3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+5V"))
    (pad "2" smd rect (at -3.81 3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "GND"))
    (pad "3" smd rect (at -1.27 -3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 10 "SPI2_SCK"))
    (pad "4" smd rect (at 1.27 -3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 11 "SPI2_MISO"))
    (pad "5" smd rect (at 1.27 3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 12 "SPI2_MOSI"))
    (pad "6" smd rect (at -1.27 3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 13 "MAG_CS0"))
  )

  (footprint "Sensor_Magnetic:PNI_RM3100"
    (layer "F.Cu")
    (tstamp a1b2c3d4-0001-0001-0001-000000000004)
    (at 40 60)
    (property "Reference" "U4" (at 0 -6 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Value" "RM3100" (at 0 6 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Author" "jayis1" (at 0 -8 0) (layer "F.Fab") (effects (font (size 0.5 0.5))))
    (fp_rect (start -5 -4) (end 5 4) (layer "F.SilkS") (width 0.12))
    (pad "1" smd rect (at -3.81 -3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+5V"))
    (pad "2" smd rect (at -3.81 3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "GND"))
    (pad "3" smd rect (at -1.27 -3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 10 "SPI2_SCK"))
    (pad "4" smd rect (at 1.27 -3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 11 "SPI2_MISO"))
    (pad "5" smd rect (at 1.27 3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 12 "SPI2_MOSI"))
    (pad "6" smd rect (at -1.27 3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 14 "MAG_CS1"))
  )

  (footprint "Sensor_Magnetic:PNI_RM3100"
    (layer "F.Cu")
    (tstamp a1b2c3d4-0001-0001-0001-000000000005)
    (at 40 90)
    (property "Reference" "U5" (at 0 -6 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Value" "RM3100" (at 0 6 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Author" "jayis1" (at 0 -8 0) (layer "F.Fab") (effects (font (size 0.5 0.5))))
    (fp_rect (start -5 -4) (end 5 4) (layer "F.SilkS") (width 0.12))
    (pad "1" smd rect (at -3.81 -3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+5V"))
    (pad "2" smd rect (at -3.81 3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "GND"))
    (pad "3" smd rect (at -1.27 -3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 10 "SPI2_SCK"))
    (pad "4" smd rect (at 1.27 -3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 11 "SPI2_MISO"))
    (pad "5" smd rect (at 1.27 3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 12 "SPI2_MOSI"))
    (pad "6" smd rect (at -1.27 3 0) (size 1 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 15 "MAG_CS2"))
  )

  ;; U6: UCC21520 Gate Driver #1 (H-bridge left)
  (footprint "Package_SO:SOIC-16W_7.5x10.3mm_P1.27mm"
    (layer "F.Cu")
    (tstamp a1b2c3d4-0001-0001-0001-000000000006)
    (at 140 110)
    (property "Reference" "U6" (at 0 -7 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Value" "UCC21520" (at 0 7 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Author" "jayis1" (at 0 -9 0) (layer "F.Fab") (effects (font (size 0.5 0.5))))
    (fp_rect (start -3.75 -5.15) (end 3.75 5.15) (layer "F.SilkS") (width 0.12))
    (pad "1" smd rect (at -4.57 -4.445 0) (size 1.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+5V"))
    (pad "2" smd rect (at -4.57 -3.175 0) (size 1.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "GND"))
    (pad "3" smd rect (at -4.57 -1.905 0) (size 1.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 6 "HRTIM_CHA1"))
    (pad "4" smd rect (at -4.57 -0.635 0) (size 1.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 7 "HRTIM_CHA2"))
    (pad "5" smd rect (at 4.57 -1.905 0) (size 1.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 25 "GATE_Q1"))
    (pad "6" smd rect (at 4.57 -0.635 0) (size 1.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 26 "GATE_Q2"))
  )

  ;; U7: UCC21520 Gate Driver #2 (H-bridge right)
  (footprint "Package_SO:SOIC-16W_7.5x10.3mm_P1.27mm"
    (layer "F.Cu")
    (tstamp a1b2c3d4-0001-0001-0001-000000000007)
    (at 170 110)
    (property "Reference" "U7" (at 0 -7 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Value" "UCC21520" (at 0 7 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Author" "jayis1" (at 0 -9 0) (layer "F.Fab") (effects (font (size 0.5 0.5))))
    (fp_rect (start -3.75 -5.15) (end 3.75 5.15) (layer "F.SilkS") (width 0.12))
    (pad "1" smd rect (at -4.57 -4.445 0) (size 1.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+5V"))
    (pad "2" smd rect (at -4.57 -3.175 0) (size 1.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "GND"))
    (pad "3" smd rect (at -4.57 -1.905 0) (size 1.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 8 "HRTIM_CHC1"))
    (pad "4" smd rect (at -4.57 -0.635 0) (size 1.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 9 "HRTIM_CHC2"))
    (pad "5" smd rect (at 4.57 -1.905 0) (size 1.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 27 "GATE_Q3"))
    (pad "6" smd rect (at 4.57 -0.635 0) (size 1.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 28 "GATE_Q4"))
  )

  ;; Q1-Q4: H-bridge MOSFETs (TO-263/D2PAK)
  (footprint "Package_TO_SOT_SMD:TO-263-3_TabPin2"
    (layer "F.Cu")
    (tstamp a1b2c3d4-0001-0001-0001-000000000008)
    (at 150 140)
    (property "Reference" "Q1" (at 0 -8 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Value" "IPB019N08N3" (at 0 8 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Author" "jayis1" (at 0 -10 0) (layer "F.Fab") (effects (font (size 0.5 0.5))))
    (pad "1" smd rect (at -5.4 -2.54 0) (size 3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 25 "GATE_Q1"))
    (pad "2" smd rect (at 0 0 0) (size 10 10) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+5V"))  ;; Tab=Drain
    (pad "3" smd rect (at -5.4 2.54 0) (size 3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 4 "COIL+"))
  )

  (footprint "Package_TO_SOT_SMD:TO-263-3_TabPin2"
    (layer "F.Cu")
    (tstamp a1b2c3d4-0001-0001-0001-000000000009)
    (at 162 140)
    (property "Reference" "Q2" (at 0 -8 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Value" "IPB019N08N3" (at 0 8 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (pad "1" smd rect (at -5.4 -2.54 0) (size 3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 26 "GATE_Q2"))
    (pad "2" smd rect (at 0 0 0) (size 10 10) (layers "F.Cu" "F.Paste" "F.Mask") (net 4 "COIL+"))
    (pad "3" smd rect (at -5.4 2.54 0) (size 3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "GND"))
  )

  (footprint "Package_TO_SOT_SMD:TO-263-3_TabPin2"
    (layer "F.Cu")
    (tstamp a1b2c3d4-0001-0001-0001-00000000000a)
    (at 178 140)
    (property "Reference" "Q3" (at 0 -8 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Value" "IPB019N08N3" (at 0 8 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (pad "1" smd rect (at -5.4 -2.54 0) (size 3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 27 "GATE_Q3"))
    (pad "2" smd rect (at 0 0 0) (size 10 10) (layers "F.Cu" "F.Paste" "F.Mask") (net 5 "COIL-"))
    (pad "3" smd rect (at -5.4 2.54 0) (size 3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "GND"))
  )

  (footprint "Package_TO_SOT_SMD:TO-263-3_TabPin2"
    (layer "F.Cu")
    (tstamp a1b2c3d4-0001-0001-0001-00000000000b)
    (at 190 140)
    (property "Reference" "Q4" (at 0 -8 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Value" "IPB019N08N3" (at 0 8 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (pad "1" smd rect (at -5.4 -2.54 0) (size 3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 28 "GATE_Q4"))
    (pad "2" smd rect (at 0 0 0) (size 10 10) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+5V"))
    (pad "3" smd rect (at -5.4 2.54 0) (size 3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 5 "COIL-"))
  )

  ;; U8: ACS724 Current Sensor
  (footprint "Package_SO:SOIC-8_3.9x4.9mm_P1.27mm"
    (layer "F.Cu")
    (tstamp a1b2c3d4-0001-0001-0001-00000000000c)
    (at 150 165)
    (property "Reference" "U8" (at 0 -5 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Value" "ACS724ELCTR-30AB" (at 0 5 0) (layer "F.SilkS") (effects (font (size 0.8 0.8))))
    (property "Author" "jayis1" (at 0 -7 0) (layer "F.Fab") (effects (font (size 0.5 0.5))))
    (fp_rect (start -1.95 -2.45) (end 1.95 2.45) (layer "F.SilkS") (width 0.12))
    (pad "1" smd rect (at -2.7 -1.905 0) (size 1.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+5V"))
    (pad "2" smd rect (at -2.7 -0.635 0) (size 1.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "GND"))
    (pad "3" smd rect (at 2.7 -0.635 0) (size 1.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 20 "ADC_CURRENT"))
    (pad "4" smd rect (at -2.7 0.635 0) (size 1.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 4 "COIL+"))
    (pad "5" smd rect (at -2.7 1.905 0) (size 1.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 5 "COIL-"))
  )

  ;; U9: 24LC256 EEPROM
  (footprint "Package_SO:SOIC-8_3.9x4.9mm_P1.27mm"
    (layer "F.Cu")
    (tstamp a1b2c3d4-0001-0001-0001-00000000000d)
    (at 70 30)
    (property "Reference" "U9" (at 0 -5 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Value" "24LC256" (at 0 5 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Author" "jayis1" (at 0 -7 0) (layer "F.Fab") (effects (font (size 0.5 0.5))))
    (fp_rect (start -1.95 -2.45) (end 1.95 2.45) (layer "F.SilkS") (width 0.12))
    (pad "8" smd rect (at -2.7 -1.905 0) (size 1.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+5V"))
    (pad "4" smd rect (at -2.7 1.905 0) (size 1.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "GND"))
    (pad "5" smd rect (at 2.7 1.905 0) (size 1.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 17 "I2C1_SDA"))
    (pad "6" smd rect (at 2.7 0.635 0) (size 1.5 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (net 16 "I2C1_SCL"))
  )

  ;; U10: SSD1306 OLED Display
  (footprint "Display:OLED_0.96in_128x64"
    (layer "F.Cu")
    (tstamp a1b2c3d4-0001-0001-0001-00000000000e)
    (at 70 60)
    (property "Reference" "U10" (at 0 -12 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Value" "SSD1306_0.96in" (at 0 12 0) (layer "F.SilkS") (effects (font (size 1 1))))
    (property "Author" "jayis1" (at 0 -14 0) (layer "F.Fab") (effects (font (size 0.5 0.5))))
    (fp_rect (start -15 -10) (end 15 10) (layer "F.SilkS") (width 0.12))
    (pad "1" smd rect (at -10 -10 0) (size 1.5 1) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+5V"))
    (pad "2" smd rect (at -8 -10 0) (size 1.5 1) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "GND"))
    (pad "3" smd rect (at -6 -10 0) (size 1.5 1) (layers "F.Cu" "F.Paste" "F.Mask") (net 16 "I2C1_SCL"))
    (pad "4" smd rect (at -4 -10 0) (size 1.5 1) (layers "F.Cu" "F.Paste" "F.Mask") (net 17 "I2C1_SDA"))
  )

  ;; Decoupling capacitors
  (footprint "Capacitor_SMD:C_0603_1608Metric"
    (layer "F.Cu")
    (tstamp a1b2c3d4-0001-0001-0001-00000000000f)
    (at 115 55)
    (property "Reference" "C1" (at 0 -1.5 0) (layer "F.SilkS") (effects (font (size 0.5 0.5))))
    (property "Value" "100nF" (at 0 1.5 0) (layer "F.SilkS") (effects (font (size 0.5 0.5))))
    (pad "1" smd roundrect (at -0.75 0 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+5V"))
    (pad "2" smd roundrect (at 0.75 0 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "GND"))
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric"
    (layer "F.Cu")
    (tstamp a1b2c3d4-0001-0001-0001-000000000010)
    (at 120 55)
    (property "Reference" "C2" (at 0 -1.5 0) (layer "F.SilkS") (effects (font (size 0.5 0.5))))
    (property "Value" "10uF" (at 0 1.5 0) (layer "F.SilkS") (effects (font (size 0.5 0.5))))
    (pad "1" smd roundrect (at -1 0 0) (size 1 1) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "+5V"))
    (pad "2" smd roundrect (at 1 0 0) (size 1 1) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "GND"))
  )

  ;; Board outline
  (gr_line (start 10 10) (end 210 10)
    (layer "Edge.Cuts") (width 0.1))
  (gr_line (start 210 10) (end 210 190)
    (layer "Edge.Cuts") (width 0.1))
  (gr_line (start 210 190) (end 10 190)
    (layer "Edge.Cuts") (width 0.1))
  (gr_line (start 10 190) (end 10 10)
    (layer "Edge.Cuts") (width 0.1))

  ;; Silkscreen text
  (gr_text "MagLance v1.0 PCB"
    (at 20 15 0) (layer "F.SilkS") (effects (font (size 2 2) (thickness 0.3))))
  (gr_text "Author: jayis1"
    (at 20 180 0) (layer "F.SilkS") (effects (font (size 1.5 1.5) (thickness 0.2))))
  (gr_text "WARNING: High current H-bridge"
    (at 150 160 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15)) (justify center)))
  (gr_text "2oz copper recommended for H-bridge section"
    (at 150 155 0) (layer "F.SilkS") (effects (font (size 0.8 0.8) (thickness 0.1)) (justify center)))

  ;; Via for GND stitching
  (via (at 50 50) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 3 "GND"))
  (via (at 60 50) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 3 "GND"))
  (via (at 110 50) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 3 "GND"))
  (via (at 130 100) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 3 "GND"))
  (via (at 160 130) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 3 "GND"))

  ;; Zone fills
  (zone (net 3) (net_name "GND") (layer "B.Cu") (tstamp z1)
    (hatch edge 0.5)
    (connect_pads (clearance 0.3))
    (min_thickness 0.2)
    (fill yes (thermal_gap 0.3) (thermal_bridge_width 0.5))
    (polygon (pts (xy 10 10) (xy 210 10) (xy 210 190) (xy 10 190)))
  )
  (zone (net 2) (net_name "+5V") (layer "In2.Cu") (tstamp z2)
    (hatch edge 0.5)
    (connect_pads (clearance 0.3))
    (min_thickness 0.2)
    (fill yes (thermal_gap 0.3) (thermal_bridge_width 0.5))
    (polygon (pts (xy 10 10) (xy 210 10) (xy 210 190) (xy 10 190)))
  )
)