(kicad_pcb (version 20230121) (generator "plasmareaper")
  (general
    (thickness 1.6)
    (legacy_teardrops no)
  )
  (paper "A4")
  (title_block
    (title "PlasmaReaper — Multi-Vector Fault Injection Toolkit")
    (date "2026-08-05")
    (rev "1.0.0")
    (company "jayis1")
    (comment 1 "Author: jayis1")
    (comment 2 "License: CERN-OHL-S v2")
  )

  (layers
    (0 "F.Cu" signal "Top copper — signals and glitch power tracks")
    (31 "B.Cu" signal "Bottom copper — ground plane and routing")
    (32 "B.Adhes" user "Bottom adhesive")
    (33 "F.Adhes" user "Top adhesive")
    (34 "B.Paste" user "Bottom solder paste")
    (35 "F.Paste" user "Top solder paste")
    (36 "B.SilkS" user "Bottom silkscreen")
    (37 "F.SilkS" user "Top silkscreen")
    (38 "B.Mask" user "Bottom solder mask")
    (39 "F.Mask" user "Top solder mask")
    (40 "Dwgs.User" user "User drawings")
    (41 "Cmts.User" user "User comments")
    (42 "Eco1.User" user "Eco1")
    (43 "Eco2.User" user "Eco2")
    (44 "Edge.Cuts" user "Board outline")
    (45 "Margin" user "Margin")
    (46 "B.CrtYd" user "Bottom courtyard")
    (47 "F.CrtYd" user "Top courtyard")
    (48 "B.Fab" user "Bottom fabrication")
    (49 "F.Fab" user "Top fabrication")
  )

  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 0.2) (material "FR4"))
      (layer "In1.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 2" (type "prepreg") (thickness 0.7) (material "FR4"))
      (layer "In2.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 3" (type "core") (thickness 0.2) (material "FR4"))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "ENIG")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0.05)
    (solder_mask_min_width 0.04)
    (grid_origin 0 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros no)
      (usegerberextensions no)
      (usegerberattributes yes)
      (usegerberadvancedattributes yes)
      (creategerberjobfile yes)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 6)
      (plotframeref no)
      (viasonmask no)
      (mode 1)
      (useauxorigin no)
      (hpglpdiamiter 15.000000)
      (hpglpnsegspeed 40.000000)
      (hpglpnsegaccel 40.000000)
      (hpglpnsegpeller 0.200000)
      (psnegative no)
      (psa4output no)
      (plotreference yes)
      (plotvalue yes)
      (plotinvisibletext no)
      (sketchpadsonfax no)
      (subtractmaskfromsilk no)
      (outputformat 1)
      (mirror no)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "gerbers/")
    )
  )

  (net 0 "")
  (net 1 "+3V3")
  (net 2 "GND")
  (net 3 "+5V")
  (net 4 "VBUS")
  (net 5 "VCC_TARGET")
  (net 6 "GND_TARGET")
  (net 7 "CLK_TARGET")
  (net 8 "SPI1_SCK")
  (net 9 "SPI1_MISO")
  (net 10 "SPI1_MOSI")
  (net 11 "FPGA_NSS")
  (net 12 "FPGA_CDONE")
  (net 13 "FPGA_CRESET")
  (net 14 "DAC_NSS")
  (net 15 "SHUNT_GATE")
  (net 16 "PASS_GATE")
  (net 17 "EM_GATE")
  (net 18 "TRIG_IN")
  (net 19 "EXT_SYNC")
  (net 20 "UART_TX")
  (net 21 "UART_RX")
  (net 22 "VCC_MONITOR")
  (net 23 "USB_DM")
  (net 24 "USB_DP")
  (net 25 "DAC_VOUT")
  (net 26 "CLK_MUX_OUT")
  (net 27 "CLK_PASS")
  (net 28 "CLK_FORCE_H")
  (net 29 "CLK_FORCE_L")
  (net 30 "CLK_INT_100M")
  (net 31 "MUX_SEL0")
  (net 32 "MUX_SEL1")
  (net 33 "SERIES_R_SEL0")
  (net 34 "SERIES_R_SEL1")
  (net 35 "SERIES_R_SEL2")
  (net 36 "BOOST_EN")
  (net 37 "BOOST_SW")
  (net 38 "EM_COIL+")
  (net 39 "EM_COIL-")
  (net 40 "I2C_SCL")
  (net 41 "I2C_SDA")
  (net 42 "OLED_RST")
  (net 43 "STATUS_LED")
  (net 44 "HRTIM_POWER")
  (net 45 "HRTIM_CLOCK")
  (net 46 "HRTIM_EM")

  ; --- Footprints ---

  (footprint "Package_QFP:LQFP-144_20x20mm_P0.5mm" (layer "F.Cu")
    (tedit 0) (tstamp 00000000-0000-0000-0000-000000000001)
    (attr smd)
    (property "Reference" "U1" (at 0 12 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))))
    (property "Value" "STM32H723ZGT6" (at 0 -12 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))))
    (property "Footprint" "Package_QFP:LQFP-144_20x20mm_P0.5mm" (at 0 0 0) (effects (font (size 1.27 1.27)) hide))
    (property "Datasheet" "" (at 0 0 0) (effects (font (size 1.27 1.27)) hide))
    (property "Author" "jayis1" (at 0 0 0) (effects (font (size 1.27 1.27)) hide))
    (pad "11" smd rect (at -9.75 10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "+3V3"))
    (pad "19" smd rect (at -9.25 10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "+3V3"))
    (pad "28" smd rect (at -8.75 10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "+3V3"))
    (pad "35" smd rect (at -9.75 -10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 22 "VCC_MONITOR"))
    (pad "40" smd rect (at -7.25 -10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 8 "SPI1_SCK"))
    (pad "41" smd rect (at -6.75 -10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 9 "SPI1_MISO"))
    (pad "42" smd rect (at -6.25 -10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 10 "SPI1_MOSI"))
    (pad "39" smd rect (at -7.75 -10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 11 "FPGA_NSS"))
    (pad "44" smd rect (at -5.25 -10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 20 "UART_TX"))
    (pad "45" smd rect (at -4.75 -10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 21 "UART_RX"))
    (pad "46" smd rect (at -4.25 -10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 23 "USB_DM"))
    (pad "47" smd rect (at -3.75 -10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 24 "USB_DP"))
    (pad "10" smd rect (at -10.25 10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "GND"))
    (pad "27" smd rect (at -8.25 10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "GND"))
    (pad "49" smd rect (at -7.75 10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "GND"))
    (pad "30" smd rect (at -8.75 10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "+3V3"))
    (pad "29" smd rect (at -8.25 10.75 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "GND"))
    (model "${KICAD6_3DMODEL_DIR}/Package_QFP.3dshapes/LQFP-144_20x20mm_P0.5mm.wrl"
      (offset (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)))
  )

  (footprint "Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.6x5.6mm" (layer "F.Cu")
    (tedit 0) (tstamp 00000000-0000-0000-0000-000000000002)
    (attr smd)
    (property "Reference" "U2" (at 0 5 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))))
    (property "Value" "iCE40UP5K-SG48" (at 0 -5 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))))
    (property "Author" "jayis1" (at 0 0 0) (effects (font (size 1.27 1.27)) hide))
    (pad "1" smd rect (at -3.25 -3 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "+3V3"))
    (pad "24" smd rect (at 3.25 3 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "GND"))
    (pad "25" smd rect (at 3.25 -3 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 9 "SPI1_MISO"))
    (pad "26" smd rect (at 2.75 -3 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 10 "SPI1_MOSI"))
    (pad "27" smd rect (at 2.25 -3 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 8 "SPI1_SCK"))
    (pad "28" smd rect (at 1.75 -3 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 11 "FPGA_NSS"))
    (pad "29" smd rect (at 1.25 -3 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 12 "FPGA_CDONE"))
    (pad "30" smd rect (at 0.75 -3 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 13 "FPGA_CRESET"))
    (pad "2" smd rect (at -3.25 -2.5 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 18 "TRIG_IN"))
    (pad "3" smd rect (at -3.25 -2 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 19 "EXT_SYNC"))
    (pad "4" smd rect (at -3.25 -1.5 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 15 "SHUNT_GATE"))
    (pad "5" smd rect (at -3.25 -1 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 17 "EM_GATE"))
    (pad "6" smd rect (at -3.25 -0.5 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 31 "MUX_SEL0"))
    (pad "7" smd rect (at -3.25 0 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 32 "MUX_SEL1"))
    (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-48-1EP_7x7mm_P0.5mm.wrl"
      (offset (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)))
  )

  (footprint "Package_SO:PowerPAK_1212-8_Single" (layer "F.Cu")
    (tedit 0) (tstamp 00000000-0000-0000-0000-000000000003)
    (attr smd)
    (property "Reference" "Q1" (at 0 3 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))))
    (property "Value" "SiS413DN" (at 0 -3 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))))
    (property "Author" "jayis1" (at 0 0 0) (effects (font (size 1.27 1.27)) hide))
    (pad "1" smd rect (at -1.5 -0.9) (size 0.8 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 15 "SHUNT_GATE"))
    (pad "2" smd rect (at 1.5 -0.9) (size 0.8 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "GND"))
    (pad "3" smd rect (at 1.5 0.9) (size 0.8 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 5 "VCC_TARGET"))
  )

  (footprint "Package_TO_SOT_SMD:TDSON-8-1" (layer "F.Cu")
    (tedit 0) (tstamp 00000000-0000-0000-0000-000000000004)
    (attr smd)
    (property "Reference" "Q2" (at 0 3 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))))
    (property "Value" "BSC060N10NS3G" (at 0 -3 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))))
    (property "Author" "jayis1" (at 0 0 0) (effects (font (size 1.27 1.27)) hide))
    (pad "1" smd rect (at -2.65 1.9) (size 1.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 16 "PASS_GATE"))
    (pad "2" smd rect (at 2.65 1.9) (size 1.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "+5V"))
    (pad "3" smd rect (at 2.65 -1.9) (size 1.2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 5 "VCC_TARGET"))
  )

  (footprint "Package_TO_SOT_SMD:SOT-23-6" (layer "F.Cu")
    (tedit 0) (tstamp 00000000-0000-0000-0000-000000000005)
    (attr smd)
    (property "Reference" "U8" (at 0 2.5 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))))
    (property "Value" "DAC5311" (at 0 -2.5 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))))
    (property "Author" "jayis1" (at 0 0 0) (effects (font (size 1.27 1.27)) hide))
    (pad "1" smd rect (at -0.95 1.2) (size 0.6 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 8 "SPI1_SCK"))
    (pad "2" smd rect (at 0 1.2) (size 0.6 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 10 "SPI1_MOSI"))
    (pad "3" smd rect (at 0.95 1.2) (size 0.6 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "+3V3"))
    (pad "4" smd rect (at 0.95 -1.2) (size 0.6 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "GND"))
    (pad "5" smd rect (at -0.95 -1.2) (size 0.6 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 14 "DAC_NSS"))
    (pad "6" smd rect (at 0 -1.2) (size 0.6 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (net 25 "DAC_VOUT"))
  )

  (footprint "Package_SO:SOIC-16_3.9x9.9mm_P1.27mm" (layer "F.Cu")
    (tedit 0) (tstamp 00000000-0000-0000-0000-000000000006)
    (attr smd)
    (property "Reference" "U9" (at 0 6 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))))
    (property "Value" "TS3A5018" (at 0 -6 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))))
    (property "Author" "jayis1" (at 0 0 0) (effects (font (size 1.27 1.27)) hide))
    (pad "1" smd rect (at -3.75 2.54) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 27 "CLK_PASS"))
    (pad "2" smd rect (at -3.75 1.27) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 28 "CLK_FORCE_H"))
    (pad "3" smd rect (at -3.75 0) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 29 "CLK_FORCE_L"))
    (pad "4" smd rect (at -3.75 -1.27) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 30 "CLK_INT_100M"))
    (pad "5" smd rect (at 3.75 -1.27) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 26 "CLK_MUX_OUT"))
    (pad "13" smd rect (at 3.75 1.27) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 32 "MUX_SEL1"))
    (pad "14" smd rect (at 3.75 2.54) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 31 "MUX_SEL0"))
    (pad "16" smd rect (at 3.75 3.81) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "+3V3"))
    (pad "8" smd rect (at -3.75 -3.81) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "GND"))
  )

  (footprint "Package_SO:SOIC-8_3.9x9.9mm_P1.27mm" (layer "F.Cu")
    (tedit 0) (tstamp 00000000-0000-0000-0000-000000000007)
    (attr smd)
    (property "Reference" "U7" (at 0 4 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))))
    (property "Value" "ZXGD3004E1" (at 0 -4 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))))
    (property "Author" "jayis1" (at 0 0 0) (effects (font (size 1.27 1.27)) hide))
    (pad "1" smd rect (at -2.7 2.54) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "+5V"))
    (pad "2" smd rect (at -2.7 1.27) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 17 "EM_GATE"))
    (pad "3" smd rect (at -2.7 0) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "GND"))
    (pad "4" smd rect (at -2.7 -1.27) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 39 "EM_COIL-"))
    (pad "6" smd rect (at 2.7 1.27) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 38 "EM_COIL+"))
  )

  (footprint "Connector_USB:USB_C_Receptacle_HRO_TYPE-C-31-M-12" (layer "F.Cu")
    (tedit 0) (tstamp 00000000-0000-0000-0000-000000000008)
    (attr smd)
    (property "Reference" "J1" (at 0 5 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))))
    (property "Value" "USB_C_Receptacle" (at 0 -5 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))))
    (property "Author" "jayis1" (at 0 0 0) (effects (font (size 1.27 1.27)) hide))
    (pad "A1" smd rect (at -3.5 3.7) (size 0.3 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "GND"))
    (pad "A4" smd rect (at -2.5 3.7) (size 0.3 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 4 "VBUS"))
    (pad "A6" smd rect (at -0.5 3.7) (size 0.3 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 24 "USB_DP"))
    (pad "A7" smd rect (at 0.5 3.7) (size 0.3 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 23 "USB_DM"))
    (pad "B1" smd rect (at 3.5 3.7) (size 0.3 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "GND"))
    (pad "B4" smd rect (at 2.5 3.7) (size 0.3 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (net 4 "VBUS"))
  )

  (footprint "Connector_Coaxial:BNC_Amphenol_031-6535_Horizontal" (layer "F.Cu")
    (tedit 0) (tstamp 00000000-0000-0000-0000-000000000009)
    (attr through_hole)
    (property "Reference" "J5" (at 0 5 0) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))))
    (property "Value" "BNC" (at 0 -5 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))))
    (property "Author" "jayis1" (at 0 0 0) (effects (font (size 1.27 1.27)) hide))
    (pad "1" thru_hole circle (at 0 0) (size 2 2) (drill 1) (layers "*.Cu" "*.Mask") (net 38 "EM_COIL+"))
    (pad "2" thru_hole circle (at 2.54 0) (size 2 2) (drill 1) (layers "*.Cu" "*.Mask") (net 39 "EM_COIL-"))
  )

  ; --- Bypass capacitors (0603) ---
  (footprint "Capacitor_SMD:C_0603_1608Metric" (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000010)
    (property "Reference" "C1" (at 0 1.5 0) (layer "F.SilkS") (effects (font (size 0.5 0.5))))
    (property "Value" "100nF" (at 0 -1.5 0) (layer "F.Fab") (effects (font (size 0.5 0.5))))
    (property "Author" "jayis1" (at 0 0 0) (effects (font (size 1.27 1.27)) hide))
    (pad "1" smd roundrect (at -0.78 0) (size 0.7 0.92) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 1 "+3V3"))
    (pad "2" smd roundrect (at 0.78 0) (size 0.7 0.92) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 2 "GND"))
  )

  ; --- Series resistors (0805) ---
  (footprint "Resistor_SMD:R_0805_2012Metric" (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000020)
    (property "Reference" "R1" (at 0 1.5 0) (layer "F.SilkS") (effects (font (size 0.5 0.5))))
    (property "Value" "0R5" (at 0 -1.5 0) (layer "F.Fab") (effects (font (size 0.5 0.5))))
    (property "Author" "jayis1" (at 0 0 0) (effects (font (size 1.27 1.27)) hide))
    (pad "1" smd roundrect (at -0.95 0) (size 0.9 1.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 5 "VCC_TARGET"))
    (pad "2" smd roundrect (at 0.95 0) (size 0.9 1.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (net 6 "GND_TARGET"))
  )

  ; --- Board outline (100mm x 60mm) ---
  (gr_line (start 0 0) (end 100 0) (stroke (width 0.15) (type solid)) (layer "Edge.Cuts"))
  (gr_line (start 100 0) (end 100 60) (stroke (width 0.15) (type solid)) (layer "Edge.Cuts"))
  (gr_line (start 100 60) (end 0 60) (stroke (width 0.15) (type solid)) (layer "Edge.Cuts"))
  (gr_line (start 0 60) (end 0 0) (stroke (width 0.15) (type solid)) (layer "Edge.Cuts"))

  ; --- Silk text ---
  (gr_text "PlasmaReaper v1.0" (at 50 3) (layer "F.SilkS") (effects (font (size 2 2) (thickness 0.3))))
  (gr_text "jayis1" (at 50 57) (layer "F.SilkS") (effects (font (size 1.5 1.5) (thickness 0.2))))
  (gr_text "CERN-OHL-S v2" (at 85 57) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))))

  ; --- Via ---
  (via (at 10 10) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 2 "GND"))
  (via (at 20 10) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 2 "GND"))
  (via (at 30 10) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 2 "GND"))
  (via (at 90 10) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 2 "GND"))
  (via (at 90 50) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 2 "GND"))
  (via (at 10 50) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 2 "GND"))

  ; --- Track: SPI1_SCK from U1 pin 40 to U2 pin 27 ---
  (segment (start 40 70) (end 42 70) (width 0.15) (layer "F.Cu") (net 8))
  (segment (start 42 70) (end 42 78) (width 0.15) (layer "F.Cu") (net 8))
  (segment (start 42 78) (end 55 78) (width 0.15) (layer "F.Cu") (net 8))

  ; --- Track: SHUNT_GATE from U2 to Q1 ---
  (segment (start 60 78) (end 62 80) (width 0.3) (layer "F.Cu") (net 15))
  (segment (start 62 80) (end 62 88) (width 0.3) (layer "F.Cu") (net 15))
  (segment (start 62 88) (end 70 88) (width 0.3) (layer "F.Cu") (net 15))

  ; --- Track: VCC_TARGET (GlitchPower class, 2.0mm) ---
  (segment (start 75 90) (end 78 90) (width 2.0) (layer "F.Cu") (net 5))
  (segment (start 78 90) (end 78 95) (width 2.0) (layer "F.Cu") (net 5))
  (segment (start 78 95) (end 95 95) (width 2.0) (layer "F.Cu") (net 5))

  ; --- Zone: ground plane on B.Cu ---
  (zone (net 2) (net_name "GND") (layer "B.Cu") (tstamp 0)
    (hatch edge 0.5)
    (connect_pads (clearance 0.3))
    (min_thickness 0.2)
    (fill yes (thermal_gap 0.3) (thermal_bridge_width 0.3))
    (polygon
      (pts (xy 1 1) (xy 99 1) (xy 99 59) (xy 1 59))
    )
  )

  ; --- Dimension ---
  (dimension (type orthogonal) (layer "Dwgs.User")
    (pts (xy 0 0) (xy 100 0))
    (height 5)
    (gr_text "100.000 mm" (at 50 -5 0) (effects (font (size 1 1) (thickness 0.15))))
  )
  (dimension (type orthogonal) (layer "Dwgs.User")
    (pts (xy 0 0) (xy 0 60))
    (height -5)
    (gr_text "60.000 mm" (at -5 30 90) (effects (font (size 1 1) (thickness 0.15))))
  )

)