(kicad_pcb (version 20231120) (generator "Hermes Agent")
  (general (thickness 1.6))
  (paper "A4")
  (title_block
    (title "SmartPack Phantom")
    (company "jayis1")
    (comment 1 "Author: jayis1")
    (comment 2 "SMBus smart battery interposer")
  )
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user)
    (33 "F.Adhes" user)
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user)
    (37 "F.SilkS" user)
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (44 "Edge.Cuts" user)
  )
  (setup
    (pad_to_mask_clearance 0)
    (pcbplotparams (layerselection 0x00010fc_ffffffff) (plot_on_all_layers_selection 0x0000000_00000000))
  )
  (net 0 "")
  (net 1 "+3V3")
  (net 2 "GND")
  (net 3 "SMBUS_SCL_HOST")
  (net 4 "SMBUS_SDA_HOST")
  (net 5 "SMBUS_SCL_PACK")
  (net 6 "SMBUS_SDA_PACK")
  (net 7 "ALERT_HOST")
  (net 8 "ALERT_PACK")
  (net 9 "PACK_CURRENT_SENSE")
  (net 10 "USB_D+")
  (net 11 "USB_D-")
  (footprint "Package_QFP:LQFP-100_14x14mm_P0.5mm" (layer "F.Cu")
    (at 111.76 78.74)
    (property "Reference" "U1" (at 0 -9.5 0) (layer "F.SilkS"))
    (property "Value" "STM32H743VIT6" (at 0 9.5 0) (layer "F.Fab"))
    (pad "1" smd rect (at -6.75 -4.75) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "SMBUS_SCL_HOST"))
    (pad "2" smd rect (at -6.75 -4.25) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 4 "SMBUS_SDA_HOST"))
    (pad "3" smd rect (at -6.75 -3.75) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 5 "SMBUS_SCL_PACK"))
    (pad "4" smd rect (at -6.75 -3.25) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 6 "SMBUS_SDA_PACK"))
    (pad "5" smd rect (at -6.75 -2.75) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "+3V3"))
    (pad "6" smd rect (at -6.75 -2.25) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "GND"))
  )
  (footprint "Package_QFP:TQFP-100_14x14mm_P0.5mm" (layer "F.Cu")
    (at 147.32 78.74)
    (property "Reference" "U2" (at 0 -9.5 0) (layer "F.SilkS"))
    (property "Value" "MachXO3LF-4300" (at 0 9.5 0) (layer "F.Fab"))
    (pad "1" smd rect (at -6.75 -4.75) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "SMBUS_SCL_HOST"))
    (pad "2" smd rect (at -6.75 -4.25) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 4 "SMBUS_SDA_HOST"))
    (pad "3" smd rect (at -6.75 -3.75) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 7 "ALERT_HOST"))
    (pad "4" smd rect (at -6.75 -3.25) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 8 "ALERT_PACK"))
    (pad "5" smd rect (at -6.75 -2.75) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "+3V3"))
    (pad "6" smd rect (at -6.75 -2.25) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "GND"))
  )
  (footprint "Package_SO:SOIC-8_3.9x4.9mm_P1.27mm" (layer "F.Cu")
    (at 147.32 111.76)
    (property "Reference" "U4" (at 0 -3.6 0) (layer "F.SilkS"))
    (property "Value" "INA219" (at 0 3.6 0) (layer "F.Fab"))
    (pad "1" smd rect (at -2.7 -1.905) (size 0.6 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 1 "+3V3"))
    (pad "2" smd rect (at -2.7 -0.635) (size 0.6 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 3 "SMBUS_SCL_HOST"))
    (pad "3" smd rect (at -2.7 0.635) (size 0.6 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 4 "SMBUS_SDA_HOST"))
    (pad "4" smd rect (at -2.7 1.905) (size 0.6 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "GND"))
    (pad "5" smd rect (at 2.7 1.905) (size 0.6 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (net 9 "PACK_CURRENT_SENSE"))
  )
  (footprint "Connector_USB:USB_C_Receptacle_HRO_TYPE-C-31-M-12" (layer "F.Cu")
    (at 76.2 119.38)
    (property "Reference" "J3" (at 0 -5.5 0) (layer "F.SilkS"))
    (property "Value" "USB_C_MGMT" (at 0 6 0) (layer "F.Fab"))
    (pad "A6" smd rect (at -1.25 -3.2) (size 0.3 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (net 10 "USB_D+"))
    (pad "A7" smd rect (at -0.75 -3.2) (size 0.3 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (net 11 "USB_D-"))
    (pad "A1" smd rect (at -3.2 -3.2) (size 0.3 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (net 2 "GND"))
  )
  (footprint "Connector_PinHeader_2.54mm:PinHeader_1x08_P2.54mm_Vertical" (layer "F.Cu")
    (at 20.32 48.26)
    (property "Reference" "J1" (at 0 -2.33 0) (layer "F.SilkS"))
    (property "Value" "HOST_BATTERY_CONN" (at 0 20.11 0) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask") (net 3 "SMBUS_SCL_HOST"))
    (pad "2" thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask") (net 4 "SMBUS_SDA_HOST"))
    (pad "3" thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask") (net 7 "ALERT_HOST"))
    (pad "4" thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask") (net 1 "+3V3"))
    (pad "5" thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask") (net 2 "GND"))
  )
  (footprint "Connector_PinHeader_2.54mm:PinHeader_1x08_P2.54mm_Vertical" (layer "F.Cu")
    (at 203.2 48.26)
    (property "Reference" "J2" (at 0 -2.33 0) (layer "F.SilkS"))
    (property "Value" "PACK_SIDE_CONN" (at 0 20.11 0) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask") (net 5 "SMBUS_SCL_PACK"))
    (pad "2" thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask") (net 6 "SMBUS_SDA_PACK"))
    (pad "3" thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask") (net 8 "ALERT_PACK"))
    (pad "4" thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask") (net 9 "PACK_CURRENT_SENSE"))
    (pad "5" thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask") (net 2 "GND"))
  )
  (gr_rect (start 10 10) (end 215 140) (stroke (width 0.1) (type default)) (fill none) (layer "Edge.Cuts"))
  (segment (start 20.32 48.26) (end 97.79 48.26) (width 0.25) (layer "F.Cu") (net 3))
  (segment (start 20.32 50.8) (end 97.79 50.8) (width 0.25) (layer "F.Cu") (net 4))
  (segment (start 125.73 48.26) (end 203.2 48.26) (width 0.25) (layer "F.Cu") (net 5))
  (segment (start 125.73 50.8) (end 203.2 50.8) (width 0.25) (layer "F.Cu") (net 6))
)