(kicad_pcb
  (version 20240108)
  (generator "pcbnew")
  (generator_version "8.0")
  (general
    (thickness 1.6)
    (legacy_teardrops no))
  (paper "A4")
  (title_block
    (title "SpeckleFlow — Portable LSCI Blood-Flow Imager")
    (date "2026-08-19")
    (rev "1.0")
    (company "jayis1")
    (comment 1 "Author: jayis1")
    (comment 2 "Copyright (C) 2026 jayis1")
    (comment 3 "License: CERN-OHL-S v2")
    (comment 4 "6-layer PCB, 120x80mm"))

  ;; =========================================================================
  ;; Layer stackup (6-layer)
  ;; =========================================================================
  (layers
    (0 "F.Cu" signal "Top — components + high-speed routing")
    (1 "In1.Cu" signal "GND plane — solid copper pour")
    (2 "In2.Cu" signal "Power plane — 3.3V")
    (3 "In3.Cu" signal "Signal — FPGA DVP + SPI routing")
    (4 "In4.Cu" signal "GND plane — solid copper pour")
    (31 "B.Cu" signal "Bottom — components + power routing")
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user "B.Paste")
    (35 "F.Paste" user "F.Paste")
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user "B.Mask")
    (39 "F.Mask" user "F.Mask")
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user "Edge.Cuts")
    (45 "Margin" user "Margin")
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user "B.Fabrication")
    (49 "F.Fab" user "F.Fabrication"))

  ;; =========================================================================
  ;; Board setup
  ;; =========================================================================
  (setup
    (stackup
      (layer "F.Cu" (type copper) (thickness 0.035))
      (layer "dielectric 1" (type core) (thickness 0.1) (material "FR4"))
      (layer "In1.Cu" (type copper) (thickness 0.035))
      (layer "dielectric 2" (type prepreg) (thickness 0.2) (material "FR4"))
      (layer "In2.Cu" (type copper) (thickness 0.035))
      (layer "dielectric 3" (type core) (thickness 0.1) (material "FR4"))
      (layer "In3.Cu" (type copper) (thickness 0.035))
      (layer "dielectric 4" (type prepreg) (thickness 0.2) (material "FR4"))
      (layer "In4.Cu" (type copper) (thickness 0.035))
      (layer "dielectric 5" (type core) (thickness 0.1) (material "FR4"))
      (layer "B.Cu" (type copper) (thickness 0.035))
      (copper_finish "ENIG")
      (dielectric_constraints no))
    (pad_to_mask_clearance 0.05)
    (solder_mask_min_width 0.05)
    (grid_origin 0 0)
    (offset 0 0)
    (pcbplotparams
      (layerselection 0x00010f0_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros no)
      (usegerberextensions no)
      (usegerberattributes yes)
      (usegerberadvancedattributes yes)
      (creategerberjobfile yes)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 4)
      (plotframeref no)
      (mode 1)
      (useauxorigin no)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (pdf_front_fp_property_popups yes)
      (pdf_back_fp_property_popups yes)
      (dxfpolygonmode yes)
      (dxfimperialunits yes)
      (dxfusepgm2 no)
      (dxfpolygonlimit 0.000000)
      (psnegative no)
      (psa4output no)
      (psplotreference yes)
      (psplotvalue yes)
      (psplotinvisibletext no)
      (psoverlayportrait no)
      (pscolor no)
      (psoptions no)
      (outputformat 1)
      (mirror no)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "gerbers/")))

  ;; =========================================================================
  ;; Net classes
  ;; =========================================================================
  (net_class "Default"
    (clearance 0.2)
    (trace_width 0.2)
    (via_dia 0.6)
    (via_drill 0.3)
    (uvia_dia 0.3)
    (uvia_drill 0.1))
  (net_class "Power"
    (clearance 0.3)
    (trace_width 0.5)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1))
  (net_class "HighSpeed"
    (clearance 0.15)
    (trace_width 0.15)
    (via_dia 0.5)
    (via_drill 0.25)
    (uvia_dia 0.3)
    (uvia_drill 0.1))

  ;; =========================================================================
  ;; Nets
  ;; =========================================================================
  (net 0 "")
  (net 1 "+3V3" (class "Power"))
  (net 2 "GND" (class "Power"))
  (net 3 "+VBAT" (class "Power"))
  (net 4 "+VUSB" (class "Power"))
  (net 5 "+5V" (class "Power"))
  (net 6 "VDD_3V3" (class "Power"))
  (net 7 "VDD_1V2_FPGA" (class "Power"))
  (net 8 "VDD_2V5_FPGA" (class "Power"))
  (net 9 "VDD_3V3_FPGA" (class "Power"))
  (net 10 "LASER_785NM")
  (net 11 "SPI1_SCK" (class "HighSpeed"))
  (net 12 "SPI1_MISO" (class "HighSpeed"))
  (net 13 "SPI1_MOSI" (class "HighSpeed"))
  (net 14 "SPI1_NSS" (class "HighSpeed"))
  (net 15 "SPI4_SCK" (class "HighSpeed"))
  (net 16 "SPI4_MOSI" (class "HighSpeed"))
  (net 17 "SPI4_MISO" (class "HighSpeed"))
  (net 18 "DISP_CS")
  (net 19 "DISP_DC")
  (net 20 "DISP_RST")
  (net 21 "DISP_BL")
  (net 22 "USART3_TX" (class "HighSpeed"))
  (net 23 "USART3_RX" (class "HighSpeed"))
  (net 24 "USART3_CTS" (class "HighSpeed"))
  (net 25 "USART3_RTS" (class "HighSpeed"))
  (net 26 "BLE_RST")
  (net 27 "I2C1_SCL" (class "HighSpeed"))
  (net 28 "I2C1_SDA" (class "HighSpeed"))
  (net 29 "I2C4_SCL" (class "HighSpeed"))
  (net 30 "I2C4_SDA" (class "HighSpeed"))
  (net 31 "DAC1_OUT")
  (net 32 "TIM1_CH1")
  (net 33 "TIM8_CH1")
  (net 34 "ADC_BATT")
  (net 35 "ADC_THERM")
  (net 36 "ADC_LASER_I")
  (net 37 "SD_CMD" (class "HighSpeed"))
  (net 38 "SD_CLK" (class "HighSpeed"))
  (net 39 "SD_D0" (class "HighSpeed"))
  (net 40 "SD_D1" (class "HighSpeed"))
  (net 41 "SD_D2" (class "HighSpeed"))
  (net 42 "SD_D3" (class "HighSpeed"))
  (net 43 "SD_CD")
  (net 44 "FPGA_IRQ")
  (net 45 "FPGA_CDONE")
  (net 46 "FPGA_CRST")
  (net 47 "CAM_PWDN")
  (net 48 "CAM_XSHUT")
  (net 49 "CAM_DVP_D0" (class "HighSpeed"))
  (net 50 "CAM_DVP_D1" (class "HighSpeed"))
  (net 51 "CAM_DVP_D2" (class "HighSpeed"))
  (net 52 "CAM_DVP_D3" (class "HighSpeed"))
  (net 53 "CAM_DVP_D4" (class "HighSpeed"))
  (net 54 "CAM_DVP_D5" (class "HighSpeed"))
  (net 55 "CAM_DVP_D6" (class "HighSpeed"))
  (net 56 "CAM_DVP_D7" (class "HighSpeed"))
  (net 57 "CAM_PCLK" (class "HighSpeed"))
  (net 58 "CAM_HSYNC" (class "HighSpeed"))
  (net 59 "CAM_VSYNC" (class "HighSpeed"))
  (net 60 "USB_DM" (class "HighSpeed"))
  (net 61 "USB_DP" (class "HighSpeed"))
  (net 62 "VBUS_DETECT")
  (net 63 "TRIGGER_BTN")
  (net 64 "MODE_BTN")
  (net 65 "UP_BTN")
  (net 66 "DOWN_BTN")
  (net 67 "INTERLOCK")
  (net 68 "KEY_SW")
  (net 69 "LED_STATUS")
  (net 70 "LED_LASER")
  (net 71 "TEC_A" (class "Power"))
  (net 72 "TEC_B" (class "Power"))
  (net 73 "THERMISTOR")

  ;; =========================================================================
  ;; Board outline (120mm × 80mm)
  ;; Origin at (0, 0), board spans (0,0) to (120, 80)
  ;; =========================================================================
  (gr_line
    (start 0 0) (end 120 0)
    (stroke (width 0.15) (type default))
    (layer "Edge.Cuts")
    (tstamp 00000000-0000-0000-0000-000000000100))
  (gr_line
    (start 120 0) (end 120 80)
    (stroke (width 0.15) (type default))
    (layer "Edge.Cuts")
    (tstamp 00000000-0000-0000-0000-000000000101))
  (gr_line
    (start 120 80) (end 0 80)
    (stroke (width 0.15) (type default))
    (layer "Edge.Cuts")
    (tstamp 00000000-0000-0000-0000-000000000102))
  (gr_line
    (start 0 80) (end 0 0)
    (stroke (width 0.15) (type default))
    (layer "Edge.Cuts")
    (tstamp 00000000-0000-0000-0000-000000000103))

  ;; Mounting holes (4 corners, M3, 4mm from edges)
  (footprint "MountingHole_3.2mm_M3"
    (at 4 4)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000200)
    (pad "" np_thru_hole circle
      (at 0 0) (size 3.2 3.2) (drill 3.2) (layers "*.Mask")))
  (footprint "MountingHole_3.2mm_M3"
    (at 116 4)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000201)
    (pad "" np_thru_hole circle
      (at 0 0) (size 3.2 3.2) (drill 3.2) (layers "*.Mask")))
  (footprint "MountingHole_3.2mm_M3"
    (at 4 76)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000202)
    (pad "" np_thru_hole circle
      (at 0 0) (size 3.2 3.2) (drill 3.2) (layers "*.Mask")))
  (footprint "MountingHole_3.2mm_M3"
    (at 116 76)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000203)
    (pad "" np_thru_hole circle
      (at 0 0) (size 3.2 3.2) (drill 3.2) (layers "*.Mask")))

  ;; =========================================================================
  ;; Component footprints (placed on board)
  ;; =========================================================================

  ;; U1: STM32H733VIT6 — center-left
  (footprint "Package_QFP:LQFP-100_14x14mm_P0.5mm"
    (at 30 40)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000001)
    (property "Reference" "U1" (at 0 -9.5 0))
    (property "Value" "STM32H733VIT6" (at 0 9.5 0))
    (property "Footprint" "Package_QFP:LQFP-100_14x14mm_P0.5mm" (at 0 0 0))
    (property "Datasheet" "https://www.st.com/resource/en/datasheet/stm32h733vi.pdf" (at 0 0 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    ;; Pin 1 marker
    (pad "1" smd rect (at -7.5 -6 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "2" smd rect (at -7.5 -5.5 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3"))
    (pad "10" smd rect (at -7.5 -1.5 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "SPI1_SCK"))
    (pad "11" smd rect (at -7.5 -1 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "SPI1_MISO"))
    (pad "12" smd rect (at -7.5 -0.5 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "SPI1_MOSI"))
    (pad "13" smd rect (at -7.5 0 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "SPI1_NSS"))
    (pad "20" smd rect (at -7.5 3.5 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 22 "USART3_TX"))
    (pad "21" smd rect (at -7.5 4 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 23 "USART3_RX"))
    (pad "30" smd rect (at -3.5 7.5) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 27 "I2C1_SCL"))
    (pad "31" smd rect (at -3 7.5) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 28 "I2C1_SDA"))
    (pad "40" smd rect (at 1.5 7.5) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 31 "DAC1_OUT"))
    (pad "50" smd rect (at 6.5 7.5) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "TIM1_CH1"))
    (pad "60" smd rect (at 7.5 2.5 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 33 "TIM8_CH1"))
    (pad "70" smd rect (at 7.5 -2.5 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "ADC_BATT"))
    (pad "71" smd rect (at 7.5 -3 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 35 "ADC_THERM"))
    (pad "72" smd rect (at 7.5 -3.5 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 36 "ADC_LASER_I"))
    (pad "80" smd rect (at 3.5 -7.5) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 44 "FPGA_IRQ"))
    (pad "81" smd rect (at 3 -7.5) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 45 "FPGA_CDONE"))
    (pad "82" smd rect (at 2.5 -7.5) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 46 "FPGA_CRST"))
    (pad "90" smd rect (at -2.5 -7.5) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 47 "CAM_PWDN"))
    (pad "91" smd rect (at -3 -7.5) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 48 "CAM_XSHUT"))
    (pad "100" smd rect (at -7.5 -6.5 90) (size 0.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3")))

  ;; U2: iCE40UP5K — center-right
  (footprint "Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.3x5.3mm"
    (at 70 40)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000002)
    (property "Reference" "U2" (at 0 -5 0))
    (property "Value" "iCE40UP5K-SG48" (at 0 5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -3.5 -3.25) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 9 "VDD_3V3_FPGA"))
    (pad "2" smd rect (at -3 -3.25) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 7 "VDD_1V2_FPGA"))
    (pad "10" smd rect (at -1 -3.25) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 49 "CAM_DVP_D0"))
    (pad "11" smd rect (at -0.5 -3.25) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 50 "CAM_DVP_D1"))
    (pad "12" smd rect (at 0 -3.25) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 51 "CAM_DVP_D2"))
    (pad "13" smd rect (at 0.5 -3.25) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 52 "CAM_DVP_D3"))
    (pad "14" smd rect (at 1 -3.25) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 53 "CAM_DVP_D4"))
    (pad "15" smd rect (at 1.5 -3.25) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 54 "CAM_DVP_D5"))
    (pad "16" smd rect (at 2 -3.25) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 55 "CAM_DVP_D6"))
    (pad "17" smd rect (at 2.5 -3.25) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 56 "CAM_DVP_D7"))
    (pad "20" smd rect (at 3.5 -2) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 57 "CAM_PCLK"))
    (pad "21" smd rect (at 3.5 -1.5) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 58 "CAM_HSYNC"))
    (pad "22" smd rect (at 3.5 -1) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 59 "CAM_VSYNC"))
    (pad "30" smd rect (at 3.5 2) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "SPI1_SCK"))
    (pad "31" smd rect (at 3.5 2.5) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "SPI1_MOSI"))
    (pad "32" smd rect (at 3.5 3) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "SPI1_MISO"))
    (pad "33" smd rect (at 3.5 3.5) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "SPI1_NSS"))
    (pad "40" smd rect (at -1 3.5) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 44 "FPGA_IRQ"))
    (pad "41" smd rect (at -1.5 3.5) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 45 "FPGA_CDONE"))
    (pad "42" smd rect (at -2 3.5) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 46 "FPGA_CRST"))
    (pad "49" smd rect (at 0 0) (size 5.3 5.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND")))

  ;; U3: OV9281 Camera — top-left
  (footprint "Sensor_Image:OV9281_LGA"
    (at 15 15)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000003)
    (property "Reference" "U3" (at 0 -7 0))
    (property "Value" "OV9281" (at 0 7 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -4 -3) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "2" smd rect (at -3.5 -3) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3"))
    (pad "10" smd rect (at -1 -3) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 49 "CAM_DVP_D0"))
    (pad "11" smd rect (at -0.5 -3) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 50 "CAM_DVP_D1"))
    (pad "12" smd rect (at 0 -3) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 51 "CAM_DVP_D2"))
    (pad "13" smd rect (at 0.5 -3) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 52 "CAM_DVP_D3"))
    (pad "14" smd rect (at 1 -3) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 53 "CAM_DVP_D4"))
    (pad "15" smd rect (at 1.5 -3) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 54 "CAM_DVP_D5"))
    (pad "16" smd rect (at 2 -3) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 55 "CAM_DVP_D6"))
    (pad "17" smd rect (at 2.5 -3) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 56 "CAM_DVP_D7"))
    (pad "20" smd rect (at 4 -1) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 57 "CAM_PCLK"))
    (pad "21" smd rect (at 4 -0.5) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 58 "CAM_HSYNC"))
    (pad "22" smd rect (at 4 0) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 59 "CAM_VSYNC"))
    (pad "25" smd rect (at 4 1.5) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 27 "I2C1_SCL"))
    (pad "26" smd rect (at 4 2) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 28 "I2C1_SDA"))
    (pad "30" smd rect (at -4 2) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 47 "CAM_PWDN"))
    (pad "31" smd rect (at -4 2.5) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 48 "CAM_XSHUT")))

  ;; U4: nRF52840 — bottom-left
  (footprint "RF_Module:nordic_nRF52840_qfn73"
    (at 20 65)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000004)
    (property "Reference" "U4" (at 0 -8 0))
    (property "Value" "nRF52840" (at 0 8 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -5 -4) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3"))
    (pad "10" smd rect (at -2 -4) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 22 "USART3_TX"))
    (pad "11" smd rect (at -1.5 -4) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 23 "USART3_RX"))
    (pad "12" smd rect (at -1 -4) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 24 "USART3_CTS"))
    (pad "13" smd rect (at -0.5 -4) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 25 "USART3_RTS"))
    (pad "40" smd rect (at 5 4) (size 0.3 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 26 "BLE_RST"))
    (pad "50" smd rect (at 0 5) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND")))

  ;; U5: ILI9341 Display connector — right side
  (footprint "Connector_FFC-FPC:Hirose_FH12-14S-0.5SH_1x14-1MP_P0.5mm"
    (at 100 40)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000005)
    (property "Reference" "U5" (at 0 -5 0))
    (property "Value" "ILI9341" (at 0 5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -3.25 -2) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "2" smd rect (at -2.75 -2) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3"))
    (pad "3" smd rect (at -2.25 -2) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "SPI4_SCK"))
    (pad "4" smd rect (at -1.75 -2) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 16 "SPI4_MOSI"))
    (pad "5" smd rect (at -1.25 -2) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 17 "SPI4_MISO"))
    (pad "6" smd rect (at -0.75 -2) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 18 "DISP_CS"))
    (pad "7" smd rect (at -0.25 -2) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 19 "DISP_DC"))
    (pad "8" smd rect (at 0.25 -2) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 20 "DISP_RST"))
    (pad "9" smd rect (at 0.75 -2) (size 0.3 2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 21 "DISP_BL")))

  ;; U7: MAX1968 TEC Driver — bottom-center
  (footprint "Package_SO:TSSOP-24_4.4x7.8mm_P0.65mm"
    (at 50 65)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000007)
    (property "Reference" "U7" (at 0 -5 0))
    (property "Value" "MAX1968" (at 0 5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -2.9 -3.5) (size 0.4 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "2" smd rect (at -2.25 -3.5) (size 0.4 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3"))
    (pad "10" smd rect (at 1.6 -3.5) (size 0.4 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 33 "TIM8_CH1"))
    (pad "15" smd rect (at 2.9 3.5) (size 0.4 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 71 "TEC_A"))
    (pad "16" smd rect (at 2.25 3.5) (size 0.4 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 72 "TEC_B")))

  ;; U8: MCP73871 Charger — bottom-right
  (footprint "Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm"
    (at 95 65)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000008)
    (property "Reference" "U8" (at 0 -4 0))
    (property "Value" "MCP73871" (at 0 4 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -2 -1.75) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "+VUSB"))
    (pad "10" smd rect (at 2 -1.75) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+VBAT"))
    (pad "11" smd rect (at 2 -1.25) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+VBAT"))
    (pad "20" smd rect (at -2 1.75) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND")))

  ;; U9: TPS63020 Buck-Boost — bottom-right
  (footprint "Package_DFN_QFN:VQFN-14-1EP_3x3mm_P0.5mm"
    (at 95 70)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000009)
    (property "Reference" "U9" (at 0 -3 0))
    (property "Value" "TPS63020" (at 0 3 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -1.5 -1) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+VBAT"))
    (pad "8" smd rect (at 1.5 1) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3"))
    (pad "15" smd rect (at 0 0) (size 2 2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND")))

  ;; U10: ICM-42688-P IMU — top-center
  (footprint "Sensor_Motion:QFN-14-1EP_3x2.5mm_P0.5mm"
    (at 50 15)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-00000000000A)
    (property "Reference" "U10" (at 0 -3 0))
    (property "Value" "ICM-42688-P" (at 0 3 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -1.25 -1) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3"))
    (pad "2" smd rect (at -0.75 -1) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "10" smd rect (at 1.25 1) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 29 "I2C4_SCL"))
    (pad "11" smd rect (at 0.75 1) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 30 "I2C4_SDA")))

  ;; U11: MAX17048 Fuel Gauge — top-right
  (footprint "Package_DFN_QFN:TDFN-8-1EP_2x2mm_P0.5mm"
    (at 85 15)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-00000000000B)
    (property "Reference" "U11" (at 0 -2.5 0))
    (property "Value" "MAX17048" (at 0 2.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -0.75 -1) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+VBAT"))
    (pad "2" smd rect (at -0.25 -1) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "5" smd rect (at 0.75 1) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 29 "I2C4_SCL"))
    (pad "6" smd rect (at 0.25 1) (size 0.3 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 30 "I2C4_SDA")))

  ;; U12: W25Q128 SPI Flash — center
  (footprint "Package_SO:SOIC-8_3.9x4.9mm_P1.27mm"
    (at 70 25)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-00000000000C)
    (property "Reference" "U12" (at 0 -3.5 0))
    (property "Value" "W25Q128" (at 0 3.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -2.54 -1.905) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "SPI1_NSS"))
    (pad "2" smd rect (at -2.54 -0.635) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "SPI1_MOSI"))
    (pad "3" smd rect (at -2.54 0.635) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "4" smd rect (at -2.54 1.905) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3"))
    (pad "5" smd rect (at 2.54 1.905) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "SPI1_MISO"))
    (pad "6" smd rect (at 2.54 0.635) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "SPI1_SCK"))
    (pad "7" smd rect (at 2.54 -0.635) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3"))
    (pad "8" smd rect (at 2.54 -1.905) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3")))

  ;; U13: MCP4921 DAC — center-left
  (footprint "Package_SO:SOIC-8_3.9x4.9mm_P1.27mm"
    (at 40 25)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-00000000000D)
    (property "Reference" "U13" (at 0 -3.5 0))
    (property "Value" "MCP4921" (at 0 3.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -2.54 -1.905) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3"))
    (pad "2" smd rect (at -2.54 -0.635) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "SPI1_NSS"))
    (pad "3" smd rect (at -2.54 0.635) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "4" smd rect (at -2.54 1.905) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "SPI1_MISO"))
    (pad "5" smd rect (at 2.54 1.905) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 31 "DAC1_OUT"))
    (pad "6" smd rect (at 2.54 0.635) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "7" smd rect (at 2.54 -0.635) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "SPI1_SCK"))
    (pad "8" smd rect (at 2.54 -1.905) (size 0.6 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3")))

  ;; D2: 785nm VCSEL — top-center-right
  (footprint "OptoDevice:VCSEL_TO46"
    (at 65 15)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000006)
    (property "Reference" "D2" (at 0 -3 0))
    (property "Value" "Vixar_V800_785nm_30mW" (at 0 3 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -1 0) (size 1 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 31 "DAC1_OUT"))
    (pad "2" smd rect (at 1 0) (size 1 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND")))

  ;; D1: TEC Peltier — center-right
  (footprint "Misc:TEC_30x30mm"
    (at 80 55)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-00000000000E)
    (property "Reference" "D1" (at 0 -18 0))
    (property "Value" "MP-3021T" (at 0 18 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -5 0) (size 2 3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 71 "TEC_A"))
    (pad "2" smd rect (at 5 0) (size 2 3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 72 "TEC_B")))

  ;; J1: USB-C Receptacle — bottom-left edge
  (footprint "Connector_USB:USB_C_Receptacle_HRO_TYPE-C-31-M-12"
    (at 5 65)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-00000000000F)
    (property "Reference" "J1" (at 0 -6 0))
    (property "Value" "USB_C_Receptacle" (at 0 6 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "A1" smd rect (at -4 -2.5) (size 0.3 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "A4" smd rect (at -3.5 -2.5) (size 0.3 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "+VUSB"))
    (pad "A5" smd rect (at -3 -2.5) (size 0.3 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "R5K1_CC1"))
    (pad "B12" smd rect (at 3.5 -2.5) (size 0.3 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "B9" smd rect (at 3 -2.5) (size 0.3 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "+VUSB")))

  ;; J2: microSD socket — bottom-center-right
  (footprint "Connector_Card:microSD_HC_Hirose_DM3D-SF"
    (at 65 70)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000010)
    (property "Reference" "J2" (at 0 -8 0))
    (property "Value" "Micro_SD_Card" (at 0 8 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -5 -3) (size 0.6 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "2" smd rect (at -3.5 -3) (size 0.6 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "SPI1_NSS"))
    (pad "3" smd rect (at -2 -3) (size 0.6 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "SPI1_MOSI"))
    (pad "4" smd rect (at -0.5 -3) (size 0.6 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3"))
    (pad "5" smd rect (at 1 -3) (size 0.6 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "SPI1_SCK"))
    (pad "6" smd rect (at 2.5 -3) (size 0.6 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "7" smd rect (at 4 -3) (size 0.6 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "SPI1_MISO"))
    (pad "8" smd rect (at 5.5 -3) (size 0.6 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 43 "SD_CD")))

  ;; BT1: LiPo Battery connector — bottom-left
  (footprint "Connector:JST_PH2_B2B-PH-K_1x02_P2.00mm"
    (at 35 70)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000011)
    (property "Reference" "BT1" (at 0 -3 0))
    (property "Value" "LiPo_2000mAh" (at 0 3 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -1 0) (size 1 2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+VBAT"))
    (pad "2" smd rect (at 1 0) (size 1 2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND")))

  ;; Y1: 25 MHz Crystal — near STM32
  (footprint "Crystal:Crystal_SMD_3225-4Pin_3.2x2.5mm"
    (at 20 30)
    (layer "F.Cu")
    (tstamp 00000000-0000-0000-0000-000000000012)
    (property "Reference" "Y1" (at 0 -2.5 0))
    (property "Value" "25MHz" (at 0 2.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -1.1 -0.8) (size 1 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "OSC_IN"))
    (pad "3" smd rect (at 1.1 0.8) (size 1 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 7 "OSC_OUT")))

  ;; Decoupling capacitors (C1-C7) — scattered near ICs
  (footprint "Capacitor_SMD:C_0402_1005Metric"
    (at 25 33) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000020)
    (property "Reference" "C1" (at 0 -1.5 0))
    (property "Value" "100nF" (at 0 1.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3"))
    (pad "2" smd rect (at 0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND")))

  (footprint "Capacitor_SMD:C_0402_1005Metric"
    (at 75 35) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000021)
    (property "Reference" "C2" (at 0 -1.5 0))
    (property "Value" "100nF" (at 0 1.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 9 "VDD_3V3_FPGA"))
    (pad "2" smd rect (at 0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND")))

  (footprint "Capacitor_SMD:C_0603_1608Metric"
    (at 25 35) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000022)
    (property "Reference" "C3" (at 0 -1.5 0))
    (property "Value" "4.7µF" (at 0 1.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -0.8 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3"))
    (pad "2" smd rect (at 0.8 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND")))

  (footprint "Capacitor_SMD:C_0805_2012Metric"
    (at 95 60) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000023)
    (property "Reference" "C4" (at 0 -1.5 0))
    (property "Value" "10µF" (at 0 1.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -1 0) (size 1 1.2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+VBAT"))
    (pad "2" smd rect (at 1 0) (size 1 1.2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND")))

  (footprint "Capacitor_SMD:C_0603_1608Metric"
    (at 90 60) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000024)
    (property "Reference" "C5" (at 0 -1.5 0))
    (property "Value" "1µF" (at 0 1.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -0.8 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3"))
    (pad "2" smd rect (at 0.8 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND")))

  (footprint "Capacitor_SMD:C_0402_1005Metric"
    (at 22 28) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000025)
    (property "Reference" "C6" (at 0 -1.5 0))
    (property "Value" "22pF" (at 0 1.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "OSC_IN"))
    (pad "2" smd rect (at 0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND")))

  (footprint "Capacitor_SMD:C_0402_1005Metric"
    (at 22 32) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000026)
    (property "Reference" "C7" (at 0 -1.5 0))
    (property "Value" "22pF" (at 0 1.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 7 "OSC_OUT"))
    (pad "2" smd rect (at 0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND")))

  ;; Resistors R1-R5
  (footprint "Resistor_SMD:R_0402_1005Metric"
    (at 30 33) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000030)
    (property "Reference" "R1" (at 0 -1.5 0))
    (property "Value" "10kΩ" (at 0 1.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3"))
    (pad "2" smd rect (at 0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "SPI1_NSS")))

  (footprint "Resistor_SMD:R_0402_1005Metric"
    (at 80 45) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000031)
    (property "Reference" "R2" (at 0 -1.5 0))
    (property "Value" "10kΩ" (at 0 1.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 9 "VDD_3V3_FPGA"))
    (pad "2" smd rect (at 0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 46 "FPGA_CRST")))

  (footprint "Resistor_SMD:R_0402_1005Metric"
    (at 8 60) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000032)
    (property "Reference" "R3" (at 0 -1.5 0))
    (property "Value" "5k1Ω" (at 0 1.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "2" smd rect (at 0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "R5K1_CC1")))

  (footprint "Resistor_SMD:R_0402_1005Metric"
    (at 8 58) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000033)
    (property "Reference" "R4" (at 0 -1.5 0))
    (property "Value" "5k1Ω" (at 0 1.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "2" smd rect (at 0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "+VUSB")))

  (footprint "Resistor_SMD:R_0402_1005Metric"
    (at 15 68) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000034)
    (property "Reference" "R5" (at 0 -1.5 0))
    (property "Value" "330Ω" (at 0 1.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 69 "LED_STATUS"))
    (pad "2" smd rect (at 0.5 0) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3")))

  ;; LEDs D3 (status blue), D4 (laser red)
  (footprint "LED_SMD:LED_0603_1608Metric"
    (at 15 70) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000040)
    (property "Reference" "D3" (at 0 -1.5 0))
    (property "Value" "LED_Blue" (at 0 1.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -0.8 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 69 "LED_STATUS"))
    (pad "2" smd rect (at 0.8 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND")))

  (footprint "LED_SMD:LED_0603_1608Metric"
    (at 65 20) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000041)
    (property "Reference" "D4" (at 0 -1.5 0))
    (property "Value" "LED_Red" (at 0 1.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -0.8 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 70 "LED_LASER"))
    (pad "2" smd rect (at 0.8 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND")))

  ;; Buttons SW1-SW4
  (footprint "Button_Switch_SMD:SW_SPST_B3SN_6x6mm"
    (at 110 20) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000050)
    (property "Reference" "SW1" (at 0 -4 0))
    (property "Value" "Trigger" (at 0 4 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -3.25 -2.25) (size 2 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "2" smd rect (at 3.25 -2.25) (size 2 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 63 "TRIGGER_BTN")))

  (footprint "Button_Switch_SMD:SW_SPST_B3SN_6x6mm"
    (at 110 35) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000051)
    (property "Reference" "SW2" (at 0 -4 0))
    (property "Value" "Mode" (at 0 4 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -3.25 -2.25) (size 2 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "2" smd rect (at 3.25 -2.25) (size 2 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 64 "MODE_BTN")))

  (footprint "Button_Switch_SMD:SW_SPST_B3SN_6x6mm"
    (at 110 50) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000052)
    (property "Reference" "SW3" (at 0 -4 0))
    (property "Value" "Up" (at 0 4 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -3.25 -2.25) (size 2 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "2" smd rect (at 3.25 -2.25) (size 2 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 65 "UP_BTN")))

  (footprint "Button_Switch_SMD:SW_SPST_B3SN_6x6mm"
    (at 110 65) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000053)
    (property "Reference" "SW4" (at 0 -4 0))
    (property "Value" "Down" (at 0 4 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -3.25 -2.25) (size 2 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND"))
    (pad "2" smd rect (at 3.25 -2.25) (size 2 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 66 "DOWN_BTN")))

  ;; L1: Inductor for TPS63020
  (footprint "Inductor_SMD:L_0805_2012Metric"
    (at 92 68) (layer "F.Cu") (tstamp 00000000-0000-0000-0000-000000000060)
    (property "Reference" "L1" (at 0 -1.5 0))
    (property "Value" "2.2µH" (at 0 1.5 0))
    (property "Author" "jayis1" (at 0 0 0))
    (attr smd)
    (pad "1" smd rect (at -1 0) (size 1 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+VBAT"))
    (pad "2" smd rect (at 1 0) (size 1 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3V3")))

  ;; =========================================================================
  ;; Silkscreen text
  ;; =========================================================================
  (gr_text "SpeckleFlow v1.0"
    (at 60 10) (layer "F.SilkS")
    (effects (font (size 2 2) bold) (justify bottom)))
  (gr_text "Author: jayis1"
    (at 60 6) (layer "F.SilkS")
    (effects (font (size 1.5 1.5)) (justify bottom)))
  (gr_text "(C) 2026 jayis1  |  CERN-OHL-S v2"
    (at 60 75) (layer "F.SilkS")
    (effects (font (size 1 2 1.2)) (justify bottom)))
  (gr_text "120mm x 80mm 6-layer"
    (at 60 78) (layer "F.SilkS")
    (effects (font (size 1 1)) (justify bottom)))

  ;; =========================================================================
  ;; Zone fills (GND copper pour on inner layers)
  ;; =========================================================================
  (zone
    (net 2)
    (net_name "GND")
    (layer "In1.Cu")
    (tstamp 00000000-0000-0000-0000-000000000300)
    (hatch edge 0.5)
    (connect_pads (clearance 0.3))
    (min_thickness 0.2)
    (fill yes (thermal_gap 0.3) (thermal_bridge_width 0.3))
    (polygon
      (pts (xy 0 0) (xy 120 0) (xy 120 80) (xy 0 80))))

  (zone
    (net 2)
    (net_name "GND")
    (layer "In4.Cu")
    (tstamp 00000000-0000-0000-0000-000000000301)
    (hatch edge 0.5)
    (connect_pads (clearance 0.3))
    (min_thickness 0.2)
    (fill yes (thermal_gap 0.3) (thermal_bridge_width 0.3))
    (polygon
      (pts (xy 0 0) (xy 120 0) (xy 120 80) (xy 0 80))))

  (zone
    (net 1)
    (net_name "+3V3")
    (layer "In2.Cu")
    (tstamp 00000000-0000-0000-0000-000000000302)
    (hatch edge 0.5)
    (connect_pads (clearance 0.3))
    (min_thickness 0.2)
    (fill yes (thermal_gap 0.3) (thermal_bridge_width 0.3))
    (polygon
      (pts (xy 0 0) (xy 120 0) (xy 120 80) (xy 0 80))))

  ;; =========================================================================
  ;; Design rules
  ;; =========================================================================
  (dimension
    (type orthogonal)
    (layer "Dwgs.User")
    (pts (xy 0 0) (xy 120 0))
    (height -5)
    (gr_text "120.0 mm"
      (effects (font (size 1 1)))))

  (dimension
    (type orthogonal)
    (layer "Dwgs.User")
    (pts (xy 120 0) (xy 120 80))
    (height 5)
    (gr_text "80.0 mm"
      (effects (font (size 1 1)))))
)