(kicad_pcb (version 4) (host pcbnew 0.201508230901+6112~28~ubuntu15.04.1-product) (general (links 418) (no_connects 382) (area 27.949999 61.449999 86.450001 111.550001) (thickness 1.6) (drawings 24) (tracks 0) (zones 0) (modules 111) (nets 109) ) (page A4) (layers (0 F.Cu signal) (31 B.Cu signal) (32 B.Adhes user) (33 F.Adhes user) (34 B.Paste user) (35 F.Paste user) (36 B.SilkS user) (37 F.SilkS user) (38 B.Mask user) (39 F.Mask user) (40 Dwgs.User user) (41 Cmts.User user) (42 Eco1.User user) (43 Eco2.User user) (44 Edge.Cuts user) (45 Margin user) (46 B.CrtYd user) (47 F.CrtYd user) (48 B.Fab user) (49 F.Fab user) ) (setup (last_trace_width 0.25) (trace_clearance 0.2) (zone_clearance 0.508) (zone_45_only no) (trace_min 0.2) (segment_width 0.2) (edge_width 0.1) (via_size 0.6) (via_drill 0.4) (via_min_size 0.4) (via_min_drill 0.3) (uvia_size 0.3) (uvia_drill 0.1) (uvias_allowed no) (uvia_min_size 0.2) (uvia_min_drill 0.1) (pcb_text_width 0.3) (pcb_text_size 1.5 1.5) (mod_edge_width 0.15) (mod_text_size 1 1) (mod_text_width 0.15) (pad_size 1.5 1.5) (pad_drill 0.6) (pad_to_mask_clearance 0) (aux_axis_origin 0 0) (visible_elements FFFCF77F) (pcbplotparams (layerselection 0x00030_80000001) (usegerberextensions false) (excludeedgelayer true) (linewidth 0.100000) (plotframeref false) (viasonmask false) (mode 1) (useauxorigin false) (hpglpennumber 1) (hpglpenspeed 20) (hpglpendiameter 15) (hpglpenoverlay 2) (psnegative false) (psa4output false) (plotreference true) (plotvalue true) (plotinvisibletext false) (padsonsilk false) (subtractmaskfromsilk false) (outputformat 1) (mirror false) (drillshape 1) (scaleselection 1) (outputdirectory "")) ) (net 0 "") (net 1 "Net-(C1-Pad1)") (net 2 "Net-(C1-Pad2)") (net 3 +36V) (net 4 GND) (net 5 +3V3) (net 6 +15V) (net 7 "Net-(C7-Pad1)") (net 8 "Net-(C8-Pad1)") (net 9 +1V8) (net 10 +5V) (net 11 "Net-(C11-Pad2)") (net 12 "Net-(C25-Pad1)") (net 13 "Net-(C26-Pad1)") (net 14 VPLL) (net 15 VPHY) (net 16 VDDDIG) (net 17 "/PinPoint Splitter/REF_OUT0") (net 18 "/PinPoint Bus Switch/I2C0_SDA") (net 19 "/PinPoint Bus Switch/CFG0_OUT1") (net 20 "/PinPoint Bus Switch/I2C0_SCL") (net 21 "/PinPoint Serial/MISO1_D+") (net 22 "/PinPoint Serial/MISO1_D-") (net 23 "/PinPoint Serial/MOSI1_D+") (net 24 "/PinPoint Serial/MOSI1_D-") (net 25 "/PinPoint Splitter/REF_OUT1") (net 26 "/PinPoint Bus Switch/I2C1_SDA") (net 27 "/PinPoint Bus Switch/CFG1_OUT0") (net 28 "/PinPoint Bus Switch/CFG1_OUT1") (net 29 "/PinPoint Bus Switch/I2C1_SCL") (net 30 "/PinPoint Serial/MISO2_D+") (net 31 "/PinPoint Serial/MISO2_D-") (net 32 "/PinPoint Serial/MOSI2_D+") (net 33 "/PinPoint Serial/MOSI2_D-") (net 34 "/PinPoint Splitter/REF_OUT2") (net 35 "/PinPoint Bus Switch/I2C2_SDA") (net 36 "/PinPoint Bus Switch/CFG2_OUT0") (net 37 "/PinPoint Bus Switch/CFG2_OUT1") (net 38 "/PinPoint Bus Switch/I2C2_SCL") (net 39 "/PinPoint Serial/MISO3_D+") (net 40 "/PinPoint Serial/MISO3_D-") (net 41 "/PinPoint Serial/MOSI3_D+") (net 42 "/PinPoint Serial/MOSI3_D-") (net 43 "Net-(R1-Pad2)") (net 44 "Net-(R2-Pad2)") (net 45 "Net-(R7-Pad1)") (net 46 "Net-(R9-Pad1)") (net 47 "Net-(R10-Pad1)") (net 48 "Net-(R10-Pad2)") (net 49 "Net-(R11-Pad1)") (net 50 "Net-(R11-Pad2)") (net 51 "Net-(R12-Pad2)") (net 52 "Net-(R13-Pad2)") (net 53 "/PinPoint Serial/MOSI0_D+") (net 54 "/PinPoint Serial/MOSI0_D-") (net 55 "/PinPoint Serial/MISO0_D+") (net 56 "/PinPoint Serial/MISO0_D-") (net 57 "Net-(R17-Pad1)") (net 58 "/PinPoint Edison/USB_D-") (net 59 "Net-(R18-Pad1)") (net 60 "/PinPoint Edison/USB_D+") (net 61 "Net-(R20-Pad1)") (net 62 "Net-(R21-Pad1)") (net 63 "Net-(R24-Pad1)") (net 64 "Net-(R26-Pad1)") (net 65 "Net-(R28-Pad1)") (net 66 "Net-(R29-Pad2)") (net 67 "Net-(R30-Pad2)") (net 68 "/PinPoint Bus Switch/I2C_IN_SCL") (net 69 "/PinPoint Bus Switch/I2C_IN_SDA") (net 70 "Net-(R33-Pad2)") (net 71 "Net-(R34-Pad2)") (net 72 "Net-(R35-Pad2)") (net 73 "Net-(R36-Pad2)") (net 74 "Net-(R37-Pad2)") (net 75 "Net-(R38-Pad2)") (net 76 "Net-(R39-Pad2)") (net 77 "Net-(R40-Pad2)") (net 78 "Net-(R41-Pad2)") (net 79 "Net-(R42-Pad2)") (net 80 "Net-(R43-Pad2)") (net 81 "Net-(R44-Pad2)") (net 82 "/PinPoint Edison/CFG0") (net 83 "/PinPoint Bus Switch/CFG0_IN1") (net 84 "/PinPoint Bus Switch/CFG1_IN0") (net 85 "/PinPoint Bus Switch/CFG1_IN1") (net 86 "/PinPoint Bus Switch/CFG2_IN0") (net 87 "/PinPoint Bus Switch/CFG2_IN1") (net 88 "Net-(U5-Pad2)") (net 89 "Net-(U5-Pad5)") (net 90 "Net-(U6-Pad2)") (net 91 "Net-(U6-Pad5)") (net 92 "Net-(U7-Pad38)") (net 93 "Net-(U7-Pad39)") (net 94 "Net-(U10-Pad5)") (net 95 "Net-(U10-Pad2)") (net 96 "Net-(U7-Pad62)") (net 97 "Net-(U7-Pad63)") (net 98 "Net-(C38-Pad2)") (net 99 "/PinPoint Splitter/REF_IN") (net 100 "/PinPoint Splitter/SYNC_IN") (net 101 "/PinPoint Bus Switch/CFG0_IN0") (net 102 "/PinPoint Bus Switch/I2C3_SDA") (net 103 "/PinPoint Bus Switch/CFG3_OUT0") (net 104 "/PinPoint Bus Switch/CFG3_OUT1") (net 105 "/PinPoint Bus Switch/I2C3_SCL") (net 106 "/PinPoint Bus Switch/CFG3_IN0") (net 107 "/PinPoint Bus Switch/CFG3_IN1") (net 108 "Net-(R4-Pad1)") (net_class Default "This is the default net class." (clearance 0.2) (trace_width 0.25) (via_dia 0.6) (via_drill 0.4) (uvia_dia 0.3) (uvia_drill 0.1) (add_net +15V) (add_net +1V8) (add_net +36V) (add_net +3V3) (add_net +5V) (add_net "/PinPoint Bus Switch/CFG0_IN0") (add_net "/PinPoint Bus Switch/CFG0_IN1") (add_net "/PinPoint Bus Switch/CFG0_OUT1") (add_net "/PinPoint Bus Switch/CFG1_IN0") (add_net "/PinPoint Bus Switch/CFG1_IN1") (add_net "/PinPoint Bus Switch/CFG1_OUT0") (add_net "/PinPoint Bus Switch/CFG1_OUT1") (add_net "/PinPoint Bus Switch/CFG2_IN0") (add_net "/PinPoint Bus Switch/CFG2_IN1") (add_net "/PinPoint Bus Switch/CFG2_OUT0") (add_net "/PinPoint Bus Switch/CFG2_OUT1") (add_net "/PinPoint Bus Switch/CFG3_IN0") (add_net "/PinPoint Bus Switch/CFG3_IN1") (add_net "/PinPoint Bus Switch/CFG3_OUT0") (add_net "/PinPoint Bus Switch/CFG3_OUT1") (add_net "/PinPoint Bus Switch/I2C0_SCL") (add_net "/PinPoint Bus Switch/I2C0_SDA") (add_net "/PinPoint Bus Switch/I2C1_SCL") (add_net "/PinPoint Bus Switch/I2C1_SDA") (add_net "/PinPoint Bus Switch/I2C2_SCL") (add_net "/PinPoint Bus Switch/I2C2_SDA") (add_net "/PinPoint Bus Switch/I2C3_SCL") (add_net "/PinPoint Bus Switch/I2C3_SDA") (add_net "/PinPoint Bus Switch/I2C_IN_SCL") (add_net "/PinPoint Bus Switch/I2C_IN_SDA") (add_net "/PinPoint Edison/CFG0") (add_net "/PinPoint Edison/USB_D+") (add_net "/PinPoint Edison/USB_D-") (add_net "/PinPoint Serial/MISO0_D+") (add_net "/PinPoint Serial/MISO0_D-") (add_net "/PinPoint Serial/MISO1_D+") (add_net "/PinPoint Serial/MISO1_D-") (add_net "/PinPoint Serial/MISO2_D+") (add_net "/PinPoint Serial/MISO2_D-") (add_net "/PinPoint Serial/MISO3_D+") (add_net "/PinPoint Serial/MISO3_D-") (add_net "/PinPoint Serial/MOSI0_D+") (add_net "/PinPoint Serial/MOSI0_D-") (add_net "/PinPoint Serial/MOSI1_D+") (add_net "/PinPoint Serial/MOSI1_D-") (add_net "/PinPoint Serial/MOSI2_D+") (add_net "/PinPoint Serial/MOSI2_D-") (add_net "/PinPoint Serial/MOSI3_D+") (add_net "/PinPoint Serial/MOSI3_D-") (add_net "/PinPoint Splitter/REF_IN") (add_net "/PinPoint Splitter/REF_OUT0") (add_net "/PinPoint Splitter/REF_OUT1") (add_net "/PinPoint Splitter/REF_OUT2") (add_net "/PinPoint Splitter/SYNC_IN") (add_net GND) (add_net "Net-(C1-Pad1)") (add_net "Net-(C1-Pad2)") (add_net "Net-(C11-Pad2)") (add_net "Net-(C25-Pad1)") (add_net "Net-(C26-Pad1)") (add_net "Net-(C38-Pad2)") (add_net "Net-(C7-Pad1)") (add_net "Net-(C8-Pad1)") (add_net "Net-(R1-Pad2)") (add_net "Net-(R10-Pad1)") (add_net "Net-(R10-Pad2)") (add_net "Net-(R11-Pad1)") (add_net "Net-(R11-Pad2)") (add_net "Net-(R12-Pad2)") (add_net "Net-(R13-Pad2)") (add_net "Net-(R17-Pad1)") (add_net "Net-(R18-Pad1)") (add_net "Net-(R2-Pad2)") (add_net "Net-(R20-Pad1)") (add_net "Net-(R21-Pad1)") (add_net "Net-(R24-Pad1)") (add_net "Net-(R26-Pad1)") (add_net "Net-(R28-Pad1)") (add_net "Net-(R29-Pad2)") (add_net "Net-(R30-Pad2)") (add_net "Net-(R33-Pad2)") (add_net "Net-(R34-Pad2)") (add_net "Net-(R35-Pad2)") (add_net "Net-(R36-Pad2)") (add_net "Net-(R37-Pad2)") (add_net "Net-(R38-Pad2)") (add_net "Net-(R39-Pad2)") (add_net "Net-(R4-Pad1)") (add_net "Net-(R40-Pad2)") (add_net "Net-(R41-Pad2)") (add_net "Net-(R42-Pad2)") (add_net "Net-(R43-Pad2)") (add_net "Net-(R44-Pad2)") (add_net "Net-(R7-Pad1)") (add_net "Net-(R9-Pad1)") (add_net "Net-(U10-Pad2)") (add_net "Net-(U10-Pad5)") (add_net "Net-(U5-Pad2)") (add_net "Net-(U5-Pad5)") (add_net "Net-(U6-Pad2)") (add_net "Net-(U6-Pad5)") (add_net "Net-(U7-Pad38)") (add_net "Net-(U7-Pad39)") (add_net "Net-(U7-Pad62)") (add_net "Net-(U7-Pad63)") (add_net VDDDIG) (add_net VPHY) (add_net VPLL) ) (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 5415D6EA) (tstamp 55DB1781) (at 44.1 97.6 180) (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0805") (path /55D74702/55D9D59B) (attr smd) (fp_text reference C1 (at 0 -2.1 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 4.7uF (at 0 2.1 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.8 -1) (end 1.8 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.8 1) (end 1.8 1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.8 -1) (end -1.8 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.8 -1) (end 1.8 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.5 -0.85) (end -0.5 -0.85) (layer F.SilkS) (width 0.15)) (fp_line (start -0.5 0.85) (end 0.5 0.85) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -1 0 180) (size 1 1.25) (layers F.Cu F.Paste F.Mask) (net 1 "Net-(C1-Pad1)")) (pad 2 smd rect (at 1 0 180) (size 1 1.25) (layers F.Cu F.Paste F.Mask) (net 2 "Net-(C1-Pad2)")) (model Capacitors_SMD.3dshapes/C_0805.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 5415D6EA) (tstamp 55DB178D) (at 44.1 103.2 180) (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0805") (path /55D74702/55D9D450) (attr smd) (fp_text reference C2 (at 0 -2.1 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 4.7uF (at 0 2.1 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.8 -1) (end 1.8 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.8 1) (end 1.8 1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.8 -1) (end -1.8 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.8 -1) (end 1.8 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.5 -0.85) (end -0.5 -0.85) (layer F.SilkS) (width 0.15)) (fp_line (start -0.5 0.85) (end 0.5 0.85) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -1 0 180) (size 1 1.25) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 2 smd rect (at 1 0 180) (size 1 1.25) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0805.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 5415D6EA) (tstamp 55DB1799) (at 55.6 99.1) (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0805") (path /55D74702/55D9D90B) (attr smd) (fp_text reference C3 (at 0 -2.1) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 10uF (at 0 2.1) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.8 -1) (end 1.8 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.8 1) (end 1.8 1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.8 -1) (end -1.8 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.8 -1) (end 1.8 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.5 -0.85) (end -0.5 -0.85) (layer F.SilkS) (width 0.15)) (fp_line (start -0.5 0.85) (end 0.5 0.85) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 2 smd rect (at 1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0805.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599) (tstamp 55DB17C9) (at 76.5 79.5 90) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D74741/55D8D5A1) (attr smd) (fp_text reference C7 (at 0 -1.7 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 47pF (at 0 1.7 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end -1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.15 -0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.475) (end -0.25 -0.475) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.475) (end 0.25 0.475) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 90) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 7 "Net-(C7-Pad1)")) (pad 2 smd rect (at 0.55 0 90) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599) (tstamp 55DB17D5) (at 76.5 81.6 270) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D74741/55D8D7FC) (attr smd) (fp_text reference C8 (at 0 -1.7 270) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 47pF (at 0 1.7 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end -1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.15 -0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.475) (end -0.25 -0.475) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.475) (end 0.25 0.475) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 8 "Net-(C8-Pad1)")) (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599) (tstamp 55DB17E1) (at 71.2 70.2 180) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D74741/55D91051) (attr smd) (fp_text reference C9 (at 0 -1.7 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 0.1uF (at 0 1.7 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end -1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.15 -0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.475) (end -0.25 -0.475) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.475) (end 0.25 0.475) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 9 +1V8)) (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB17ED) (at 76.9 72.5 180) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D74741/55D9112A) (attr smd) (fp_text reference C10 (at 0 1.7 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 0.1uF (at 0 -1.7 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 10 +5V)) (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599) (tstamp 55DB17F9) (at 46.4 71.25 90) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D8BE57) (attr smd) (fp_text reference C11 (at 0 -1.7 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 0.1uF (at 0 1.7 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end -1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.15 -0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.475) (end -0.25 -0.475) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.475) (end 0.25 0.475) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 90) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 2 smd rect (at 0.55 0 90) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 11 "Net-(C11-Pad2)")) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB1805) (at 41.4 77.75) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D82E84) (attr smd) (fp_text reference C12 (at 0 1.7) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 0.1uF (at 0 -1.7) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB1811) (at 41.4 72.25 180) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D82E16) (attr smd) (fp_text reference C13 (at 0 1.7 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 0.1uF (at 0 -1.7 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB181D) (at 47.4 84.25 90) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D8BBF8) (attr smd) (fp_text reference C14 (at 0 1.7 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 0.1uF (at 0 -1.7 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 2 smd rect (at 0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 11 "Net-(C11-Pad2)")) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB1829) (at 55.65 81 90) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D8BC77) (attr smd) (fp_text reference C15 (at 0 1.7 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 0.1uF (at 0 -1.7 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 2 smd rect (at 0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 11 "Net-(C11-Pad2)")) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599) (tstamp 55DB1835) (at 49.9 70.25 90) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D82DA7) (attr smd) (fp_text reference C16 (at 0 -1.7 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 0.1uF (at 0 1.7 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end -1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.15 -0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.475) (end -0.25 -0.475) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.475) (end 0.25 0.475) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 90) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 2 smd rect (at 0.55 0 90) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB1841) (at 56.9 75.25 180) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D82D23) (attr smd) (fp_text reference C17 (at 0 1.7 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 0.1uF (at 0 -1.7 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599) (tstamp 55DB184D) (at 58.15 94.4 270) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D96723) (attr smd) (fp_text reference C18 (at 0 -1.7 270) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 0.1uF (at 0 1.7 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end -1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.15 -0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.475) (end -0.25 -0.475) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.475) (end 0.25 0.475) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 5415D6EA) (tstamp 55DB1859) (at 57.4 70) (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0805") (path /55D7B8EE/55D8B37F) (attr smd) (fp_text reference C19 (at 0 2.1) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 4.7uF (at 0 -2.1) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.8 1) (end 1.8 1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.8 -1) (end 1.8 -1) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.8 1) (end -1.8 -1) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.8 1) (end 1.8 -1) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.5 0.85) (end -0.5 0.85) (layer B.SilkS) (width 0.15)) (fp_line (start -0.5 -0.85) (end 0.5 -0.85) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask) (net 11 "Net-(C11-Pad2)")) (pad 2 smd rect (at 1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0805.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB1865) (at 56.9 71.5) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D8B336) (attr smd) (fp_text reference C20 (at 0 1.7) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 0.1uF (at 0 -1.7) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 11 "Net-(C11-Pad2)")) (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB1871) (at 56.9 72.5) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D8B2D1) (attr smd) (fp_text reference C21 (at 0 1.7) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 0.1uF (at 0 -1.7) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599) (tstamp 55DB187D) (at 48.65 94.4 270) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D96AED) (attr smd) (fp_text reference C22 (at 0 -1.7 270) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 0.1uF (at 0 1.7 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end -1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.15 -0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.475) (end -0.25 -0.475) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.475) (end 0.25 0.475) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599) (tstamp 55DB1889) (at 69.4 82 180) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D96B94) (attr smd) (fp_text reference C23 (at 0 -1.7 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 0.1uF (at 0 1.7 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end -1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.15 -0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.475) (end -0.25 -0.475) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.475) (end 0.25 0.475) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599) (tstamp 55DB1895) (at 69.4 72.5) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D971A2) (attr smd) (fp_text reference C24 (at 0 -1.7) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 0.1uF (at 0 1.7) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end -1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.15 -0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.475) (end -0.25 -0.475) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.475) (end 0.25 0.475) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB18A1) (at 56.4 86.25) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D8A1CB) (attr smd) (fp_text reference C25 (at 0 1.7) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 30pF (at 0 -1.7) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 12 "Net-(C25-Pad1)")) (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB18AD) (at 53.9 86.25) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D8A365) (attr smd) (fp_text reference C26 (at 0 1.7) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 30pF (at 0 -1.7) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 13 "Net-(C26-Pad1)")) (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 5415D6EA) (tstamp 55DB18B9) (at 51.15 80.75) (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0805") (path /55D7B8EE/55D7FB7E) (attr smd) (fp_text reference C27 (at 0 -2.1) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 4.7uF (at 0 2.1) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.8 -1) (end 1.8 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.8 1) (end 1.8 1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.8 -1) (end -1.8 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.8 -1) (end 1.8 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.5 -0.85) (end -0.5 -0.85) (layer F.SilkS) (width 0.15)) (fp_line (start -0.5 0.85) (end 0.5 0.85) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask) (net 14 VPLL)) (pad 2 smd rect (at 1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0805.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599) (tstamp 55DB18C5) (at 51.15 79.25) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D7FC05) (attr smd) (fp_text reference C28 (at 0 -1.7) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 0.1uF (at 0 1.7) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end -1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.15 -0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.475) (end -0.25 -0.475) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.475) (end 0.25 0.475) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 14 VPLL)) (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 5415D6EA) (tstamp 55DB18D1) (at 54.9 80.75) (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0805") (path /55D7B8EE/55D803E0) (attr smd) (fp_text reference C29 (at 0 -2.1) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 4.7uF (at 0 2.1) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.8 -1) (end 1.8 -1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.8 1) (end 1.8 1) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.8 -1) (end -1.8 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.8 -1) (end 1.8 1) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.5 -0.85) (end -0.5 -0.85) (layer F.SilkS) (width 0.15)) (fp_line (start -0.5 0.85) (end 0.5 0.85) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask) (net 15 VPHY)) (pad 2 smd rect (at 1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0805.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599) (tstamp 55DB18DD) (at 54.9 79.25) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D803E6) (attr smd) (fp_text reference C30 (at 0 -1.7) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 0.1uF (at 0 1.7) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end -1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.15 -0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.475) (end -0.25 -0.475) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.475) (end 0.25 0.475) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 15 VPHY)) (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599) (tstamp 55DB18E9) (at 73.65 91.5 270) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D854B1/55DA316C) (attr smd) (fp_text reference C31 (at 0 -1.7 270) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 0.1uF (at 0 1.7 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end -1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.15 -0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.475) (end -0.25 -0.475) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.475) (end 0.25 0.475) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB18F5) (at 68.7 90.8 180) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D9334F/55DA5155) (attr smd) (fp_text reference C32 (at 0 1.7 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value C_Small (at 0 -1.7 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 6 +15V)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB1901) (at 45.7 93.45 270) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D9334F/55D7AA10) (attr smd) (fp_text reference C33 (at 0 1.7 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value C_Small (at 0 -1.7 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB190D) (at 68.7 95.85 180) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D9334F/55DA4E24) (attr smd) (fp_text reference C34 (at 0 1.7 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value C_Small (at 0 -1.7 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 6 +15V)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB1919) (at 68.7 100.8 180) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D9334F/55DA519E) (attr smd) (fp_text reference C35 (at 0 1.7 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value C_Small (at 0 -1.7 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 6 +15V)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB1925) (at 47.2 93.45 90) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D9334F/55D80390) (attr smd) (fp_text reference C36 (at 0 1.7 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value C_Small (at 0 -1.7 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 16 VDDDIG)) (pad 2 smd rect (at 0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB1931) (at 47.45 103.95 90) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D9334F/55D79604) (attr smd) (fp_text reference C37 (at 0 1.7 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value C_Small (at 0 -1.7 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 2 smd rect (at 0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 55DB193D) (at 68.7 86.1 180) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D9334F/55DBAB28) (attr smd) (fp_text reference C38 (at 0 1.7 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value C_Small (at 0 -1.7 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask) (net 98 "Net-(C38-Pad2)")) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Diodes_SMD:SOD-323 (layer F.Cu) (tedit 5530FC5E) (tstamp 55DB19A3) (at 49.1 103.5) (descr SOD-323) (tags SOD-323) (path /55D74702/55D9D70A) (attr smd) (fp_text reference D1 (at 0 -1.85) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value D_Schottky_Small (at 0.1 1.9) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 0.25 0) (end 0.5 0) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0) (end -0.5 0) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0) (end 0.25 -0.35) (layer F.SilkS) (width 0.15)) (fp_line (start 0.25 -0.35) (end 0.25 0.35) (layer F.SilkS) (width 0.15)) (fp_line (start 0.25 0.35) (end -0.25 0) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 -0.35) (end -0.25 0.35) (layer F.SilkS) (width 0.15)) (fp_line (start -1.5 -0.95) (end 1.5 -0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.5 -0.95) (end 1.5 0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 0.95) (end 1.5 0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.5 -0.95) (end -1.5 0.95) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.3 0.8) (end 1.1 0.8) (layer F.SilkS) (width 0.15)) (fp_line (start -1.3 -0.8) (end 1.1 -0.8) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -1.055 0) (size 0.59 0.45) (layers F.Cu F.Paste F.Mask) (net 1 "Net-(C1-Pad1)")) (pad 2 smd rect (at 1.055 0) (size 0.59 0.45) (layers F.Cu F.Paste F.Mask) (net 4 GND)) ) (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599) (tstamp 55DB19C1) (at 51.15 78.25 180) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D7EBB0) (attr smd) (fp_text reference FB1 (at 0 -1.7 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value FILTER (at 0 1.7 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end -1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.15 -0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.475) (end -0.25 -0.475) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.475) (end 0.25 0.475) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 14 VPLL)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599) (tstamp 55DB19CD) (at 54.9 78.25 180) (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)") (tags "capacitor 0402") (path /55D7B8EE/55D803D4) (attr smd) (fp_text reference FB2 (at 0 -1.7 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value FILTER (at 0 1.7 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.15 -0.6) (end -1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.15 -0.6) (end 1.15 0.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.475) (end -0.25 -0.475) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.475) (end 0.25 0.475) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask) (net 15 VPHY)) (model Capacitors_SMD.3dshapes/C_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module polypoint:INDUCTOR_6.0mm_6.0mm (layer F.Cu) (tedit 55D9D174) (tstamp 55DB19E2) (at 50.3 99.3) (path /55D74702/55D9D6A6) (fp_text reference L1 (at 0 -4.064) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 22uH (at 0 4.064) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.5 3) (end 1.5 3) (layer F.SilkS) (width 0.15)) (fp_line (start -1.5 -3) (end 1.5 -3) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -2.35 0) (size 1.6 5.7) (layers F.Cu F.Paste F.Mask) (net 1 "Net-(C1-Pad1)")) (pad 2 smd rect (at 2.35 0) (size 1.6 5.7) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) ) (module polypoint:PCIx_36pos_Card_Edge (layer F.Cu) (tedit 55DA3E11) (tstamp 55DB1A1B) (at 31 96 90) (path /55DC367E) (fp_text reference P1 (at 5.08 5.08 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CONN_02X18 (at 11.176 8.128 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 19.65 5.4) (end 22 5.4) (layer F.Fab) (width 0.15)) (fp_line (start -0.65 5.4) (end -3 5.4) (layer F.Fab) (width 0.15)) (fp_line (start 19.65 -3) (end 19.65 5.4) (layer F.Fab) (width 0.15)) (fp_line (start -0.65 -3) (end -0.65 5.4) (layer F.Fab) (width 0.15)) (fp_line (start 12.45 -3) (end 19.65 -3) (layer F.Fab) (width 0.15)) (fp_line (start 10.55 5.4) (end 10.55 -3) (layer F.Fab) (width 0.15)) (fp_line (start 10.55 5.4) (end 12.45 5.4) (layer F.Fab) (width 0.15)) (fp_line (start 12.45 -3) (end 12.45 5.4) (layer F.Fab) (width 0.15)) (fp_line (start -0.65 -3) (end 10.55 -3) (layer F.Fab) (width 0.15)) (pad 1 smd rect (at 0 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 3 smd rect (at 1 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 5 smd rect (at 2 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 7 smd rect (at 3 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 9 smd rect (at 4 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 11 smd rect (at 5 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 6 +15V)) (pad 13 smd rect (at 6 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 15 smd rect (at 7 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 17 smd rect (at 8 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 19 smd rect (at 9 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 21 smd rect (at 10 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 2 smd rect (at 0 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 4 smd rect (at 1 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 6 smd rect (at 2 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 8 smd rect (at 3 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 10 smd rect (at 4 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 12 smd rect (at 5 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 6 +15V)) (pad 14 smd rect (at 6 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 4 GND)) (pad 16 smd rect (at 7 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 99 "/PinPoint Splitter/REF_IN")) (pad 18 smd rect (at 8 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 4 GND)) (pad 20 smd rect (at 9 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 100 "/PinPoint Splitter/SYNC_IN")) (pad 22 smd rect (at 10 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 4 GND)) (pad 23 smd rect (at 13 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 18 "/PinPoint Bus Switch/I2C0_SDA")) (pad 25 smd rect (at 14 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 101 "/PinPoint Bus Switch/CFG0_IN0")) (pad 27 smd rect (at 15 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 83 "/PinPoint Bus Switch/CFG0_IN1")) (pad 29 smd rect (at 16 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 20 "/PinPoint Bus Switch/I2C0_SCL")) (pad 31 smd rect (at 17 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask)) (pad 33 smd rect (at 18 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask)) (pad 35 smd rect (at 19 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask)) (pad 24 smd rect (at 13 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 54 "/PinPoint Serial/MOSI0_D-")) (pad 26 smd rect (at 14 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 53 "/PinPoint Serial/MOSI0_D+")) (pad 28 smd rect (at 15 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 55 "/PinPoint Serial/MISO0_D+")) (pad 30 smd rect (at 16 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 56 "/PinPoint Serial/MISO0_D-")) (pad 32 smd rect (at 17 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask)) (pad 34 smd rect (at 18 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask)) (pad 36 smd rect (at 19 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask)) ) (module polypoint:PCIx_36pos (layer F.Cu) (tedit 55DA0CD1) (tstamp 55DB1A50) (at 70.88 64.5 180) (path /55DC97C4) (fp_text reference P2 (at 23.876 -4.572 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CONN_02X18 (at -2.54 -5.588 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 26.9 -3.3) (end 20.4 -3.3) (layer F.SilkS) (width 0.15)) (fp_line (start 20.4 -3.3) (end 20.4 3) (layer F.SilkS) (width 0.15)) (fp_line (start -7.9 -3.3) (end -1.4 -3.3) (layer F.SilkS) (width 0.15)) (fp_line (start -1.4 -3.3) (end -1.4 3) (layer F.SilkS) (width 0.15)) (fp_line (start 12.45 3) (end 26.9 3) (layer F.Fab) (width 0.15)) (fp_line (start 10.55 3) (end 10.55 -3) (layer F.Fab) (width 0.15)) (fp_line (start 10.55 -3) (end 12.45 -3) (layer F.Fab) (width 0.15)) (fp_line (start 12.45 -3) (end 12.45 3) (layer F.Fab) (width 0.15)) (fp_line (start -7.9 -3.3) (end -7.9 3) (layer F.SilkS) (width 0.15)) (fp_line (start -7.9 3) (end 10.55 3) (layer F.Fab) (width 0.15)) (fp_line (start 26.9 3) (end 26.9 -3.3) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at 0 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 3 smd rect (at 1 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 5 smd rect (at 2 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 7 smd rect (at 3 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 9 smd rect (at 4 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 11 smd rect (at 5 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 6 +15V)) (pad 13 smd rect (at 6 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 15 smd rect (at 7 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 17 smd rect (at 8 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 19 smd rect (at 9 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 21 smd rect (at 10 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 2 smd rect (at 0 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 4 smd rect (at 1 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 6 smd rect (at 2 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 8 smd rect (at 3 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 10 smd rect (at 4 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 12 smd rect (at 5 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 6 +15V)) (pad 14 smd rect (at 6 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 4 GND)) (pad 16 smd rect (at 7 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 17 "/PinPoint Splitter/REF_OUT0")) (pad 18 smd rect (at 8 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 4 GND)) (pad 20 smd rect (at 9 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 100 "/PinPoint Splitter/SYNC_IN")) (pad 22 smd rect (at 10 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 4 GND)) (pad 23 smd rect (at 13 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 26 "/PinPoint Bus Switch/I2C1_SDA")) (pad 25 smd rect (at 14 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 27 "/PinPoint Bus Switch/CFG1_OUT0")) (pad 27 smd rect (at 15 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 28 "/PinPoint Bus Switch/CFG1_OUT1")) (pad 29 smd rect (at 16 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 29 "/PinPoint Bus Switch/I2C1_SCL")) (pad 31 smd rect (at 17 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask)) (pad 33 smd rect (at 18 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask)) (pad 35 smd rect (at 19 0 180) (size 0.7 4) (layers F.Cu F.Paste F.Mask)) (pad 24 smd rect (at 13 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 21 "/PinPoint Serial/MISO1_D+")) (pad 26 smd rect (at 14 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 22 "/PinPoint Serial/MISO1_D-")) (pad 28 smd rect (at 15 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 23 "/PinPoint Serial/MOSI1_D+")) (pad 30 smd rect (at 16 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 24 "/PinPoint Serial/MOSI1_D-")) (pad 32 smd rect (at 17 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask)) (pad 34 smd rect (at 18 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask)) (pad 36 smd rect (at 19 0 180) (size 0.7 4) (layers B.Cu F.Paste F.Mask)) (pad "" np_thru_hole circle (at -4.8 0.49 180) (size 2 2) (drill 2) (layers *.Cu *.Mask F.SilkS)) (pad "" np_thru_hole circle (at 23.8 0.49 180) (size 2 2) (drill 2) (layers *.Cu *.Mask F.SilkS)) ) (module polypoint:PCIx_36pos (layer F.Cu) (tedit 55DA0CD1) (tstamp 55DB1A85) (at 83.4 96 90) (path /55DCA510) (fp_text reference P3 (at 23.876 -4.572 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CONN_02X18 (at -2.54 -5.588 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 26.9 -3.3) (end 20.4 -3.3) (layer F.SilkS) (width 0.15)) (fp_line (start 20.4 -3.3) (end 20.4 3) (layer F.SilkS) (width 0.15)) (fp_line (start -7.9 -3.3) (end -1.4 -3.3) (layer F.SilkS) (width 0.15)) (fp_line (start -1.4 -3.3) (end -1.4 3) (layer F.SilkS) (width 0.15)) (fp_line (start 12.45 3) (end 26.9 3) (layer F.Fab) (width 0.15)) (fp_line (start 10.55 3) (end 10.55 -3) (layer F.Fab) (width 0.15)) (fp_line (start 10.55 -3) (end 12.45 -3) (layer F.Fab) (width 0.15)) (fp_line (start 12.45 -3) (end 12.45 3) (layer F.Fab) (width 0.15)) (fp_line (start -7.9 -3.3) (end -7.9 3) (layer F.SilkS) (width 0.15)) (fp_line (start -7.9 3) (end 10.55 3) (layer F.Fab) (width 0.15)) (fp_line (start 26.9 3) (end 26.9 -3.3) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at 0 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 3 smd rect (at 1 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 5 smd rect (at 2 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 7 smd rect (at 3 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 9 smd rect (at 4 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 11 smd rect (at 5 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 6 +15V)) (pad 13 smd rect (at 6 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 15 smd rect (at 7 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 17 smd rect (at 8 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 19 smd rect (at 9 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 21 smd rect (at 10 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 2 smd rect (at 0 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 4 smd rect (at 1 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 6 smd rect (at 2 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 8 smd rect (at 3 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 10 smd rect (at 4 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 12 smd rect (at 5 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 6 +15V)) (pad 14 smd rect (at 6 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 4 GND)) (pad 16 smd rect (at 7 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 25 "/PinPoint Splitter/REF_OUT1")) (pad 18 smd rect (at 8 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 4 GND)) (pad 20 smd rect (at 9 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 100 "/PinPoint Splitter/SYNC_IN")) (pad 22 smd rect (at 10 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 4 GND)) (pad 23 smd rect (at 13 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 35 "/PinPoint Bus Switch/I2C2_SDA")) (pad 25 smd rect (at 14 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 36 "/PinPoint Bus Switch/CFG2_OUT0")) (pad 27 smd rect (at 15 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 37 "/PinPoint Bus Switch/CFG2_OUT1")) (pad 29 smd rect (at 16 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 38 "/PinPoint Bus Switch/I2C2_SCL")) (pad 31 smd rect (at 17 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask)) (pad 33 smd rect (at 18 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask)) (pad 35 smd rect (at 19 0 90) (size 0.7 4) (layers F.Cu F.Paste F.Mask)) (pad 24 smd rect (at 13 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 30 "/PinPoint Serial/MISO2_D+")) (pad 26 smd rect (at 14 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 31 "/PinPoint Serial/MISO2_D-")) (pad 28 smd rect (at 15 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 32 "/PinPoint Serial/MOSI2_D+")) (pad 30 smd rect (at 16 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 33 "/PinPoint Serial/MOSI2_D-")) (pad 32 smd rect (at 17 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask)) (pad 34 smd rect (at 18 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask)) (pad 36 smd rect (at 19 0 90) (size 0.7 4) (layers B.Cu F.Paste F.Mask)) (pad "" np_thru_hole circle (at -4.8 0.49 90) (size 2 2) (drill 2) (layers *.Cu *.Mask F.SilkS)) (pad "" np_thru_hole circle (at 23.8 0.49 90) (size 2 2) (drill 2) (layers *.Cu *.Mask F.SilkS)) ) (module polypoint:PCIx_36pos (layer F.Cu) (tedit 55DA0CD1) (tstamp 55DB1ABA) (at 51.88 108.5) (path /55DCA6F3) (fp_text reference P4 (at 23.876 -4.572) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value CONN_02X18 (at -2.54 -5.588) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 26.9 -3.3) (end 20.4 -3.3) (layer F.SilkS) (width 0.15)) (fp_line (start 20.4 -3.3) (end 20.4 3) (layer F.SilkS) (width 0.15)) (fp_line (start -7.9 -3.3) (end -1.4 -3.3) (layer F.SilkS) (width 0.15)) (fp_line (start -1.4 -3.3) (end -1.4 3) (layer F.SilkS) (width 0.15)) (fp_line (start 12.45 3) (end 26.9 3) (layer F.Fab) (width 0.15)) (fp_line (start 10.55 3) (end 10.55 -3) (layer F.Fab) (width 0.15)) (fp_line (start 10.55 -3) (end 12.45 -3) (layer F.Fab) (width 0.15)) (fp_line (start 12.45 -3) (end 12.45 3) (layer F.Fab) (width 0.15)) (fp_line (start -7.9 -3.3) (end -7.9 3) (layer F.SilkS) (width 0.15)) (fp_line (start -7.9 3) (end 10.55 3) (layer F.Fab) (width 0.15)) (fp_line (start 26.9 3) (end 26.9 -3.3) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at 0 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 3 smd rect (at 1 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 5 smd rect (at 2 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 7 smd rect (at 3 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 9 smd rect (at 4 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 11 smd rect (at 5 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 6 +15V)) (pad 13 smd rect (at 6 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 15 smd rect (at 7 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 17 smd rect (at 8 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 19 smd rect (at 9 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 21 smd rect (at 10 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 2 smd rect (at 0 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 4 smd rect (at 1 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 6 smd rect (at 2 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 8 smd rect (at 3 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 10 smd rect (at 4 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 3 +36V)) (pad 12 smd rect (at 5 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 6 +15V)) (pad 14 smd rect (at 6 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 4 GND)) (pad 16 smd rect (at 7 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 34 "/PinPoint Splitter/REF_OUT2")) (pad 18 smd rect (at 8 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 4 GND)) (pad 20 smd rect (at 9 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 100 "/PinPoint Splitter/SYNC_IN")) (pad 22 smd rect (at 10 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 4 GND)) (pad 23 smd rect (at 13 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 102 "/PinPoint Bus Switch/I2C3_SDA")) (pad 25 smd rect (at 14 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 103 "/PinPoint Bus Switch/CFG3_OUT0")) (pad 27 smd rect (at 15 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 104 "/PinPoint Bus Switch/CFG3_OUT1")) (pad 29 smd rect (at 16 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask) (net 105 "/PinPoint Bus Switch/I2C3_SCL")) (pad 31 smd rect (at 17 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask)) (pad 33 smd rect (at 18 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask)) (pad 35 smd rect (at 19 0) (size 0.7 4) (layers F.Cu F.Paste F.Mask)) (pad 24 smd rect (at 13 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 39 "/PinPoint Serial/MISO3_D+")) (pad 26 smd rect (at 14 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 40 "/PinPoint Serial/MISO3_D-")) (pad 28 smd rect (at 15 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 41 "/PinPoint Serial/MOSI3_D+")) (pad 30 smd rect (at 16 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask) (net 42 "/PinPoint Serial/MOSI3_D-")) (pad 32 smd rect (at 17 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask)) (pad 34 smd rect (at 18 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask)) (pad 36 smd rect (at 19 0) (size 0.7 4) (layers B.Cu F.Paste F.Mask)) (pad "" np_thru_hole circle (at -4.8 0.49) (size 2 2) (drill 2) (layers *.Cu *.Mask F.SilkS)) (pad "" np_thru_hole circle (at 23.8 0.49) (size 2 2) (drill 2) (layers *.Cu *.Mask F.SilkS)) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1AC6) (at 46.5 102.8 90) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D74702/55D9D4F2) (attr smd) (fp_text reference R1 (at 0 -1.8 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 0 (at 0 1.8 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (pad 2 smd rect (at 0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 43 "Net-(R1-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1AD2) (at 43.1 95.4) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D74702/55D9D81D) (attr smd) (fp_text reference R2 (at 0 -1.8) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 49.9K (at 0 1.8) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.45 0) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 44 "Net-(R2-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1ADE) (at 41.1 101.2 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D74702/55D9D89E) (attr smd) (fp_text reference R3 (at 0 -1.8 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 15.8K (at 0 1.8 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 44 "Net-(R2-Pad2)")) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1B0E) (at 53 92.6 270) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D74741/55D9169E) (attr smd) (fp_text reference R7 (at 0 1.8 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 10K (at 0 -1.8 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 45 "Net-(R7-Pad1)")) (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 9 +1V8)) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1B1A) (at 54 92.6 270) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D74741/55D9163C) (attr smd) (fp_text reference R8 (at 0 1.8 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 10K (at 0 -1.8 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 45 "Net-(R7-Pad1)")) (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1B26) (at 52 92.6 270) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D74741/55D8C4C2) (attr smd) (fp_text reference R9 (at 0 1.8 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 10K (at 0 -1.8 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 46 "Net-(R9-Pad1)")) (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 9 +1V8)) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1B32) (at 71.2 68.5 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D74741/55D8F54B) (attr smd) (fp_text reference R10 (at 0 -1.8 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 100 (at 0 1.8 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 47 "Net-(R10-Pad1)")) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 48 "Net-(R10-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1B3E) (at 71.2 71.2 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D74741/55D8F5C4) (attr smd) (fp_text reference R11 (at 0 -1.8 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 100 (at 0 1.8 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 49 "Net-(R11-Pad1)")) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 50 "Net-(R11-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1B4A) (at 78.1 80) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D74741/55D8DAC4) (attr smd) (fp_text reference R12 (at 0 -1.8) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 27 (at 0 1.8) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 7 "Net-(C7-Pad1)")) (pad 2 smd rect (at 0.45 0) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 51 "Net-(R12-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1B56) (at 78.1 81.2) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D74741/55D8DC48) (attr smd) (fp_text reference R13 (at 0 -1.8) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value 27 (at 0 1.8) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 8 "Net-(C8-Pad1)")) (pad 2 smd rect (at 0.45 0) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 52 "Net-(R13-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1B62) (at 52.5 93.95) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D7B8EE/55DC83AE) (attr smd) (fp_text reference R14 (at 0 -1.8) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value DNP (at 0 1.8) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 53 "/PinPoint Serial/MOSI0_D+")) (pad 2 smd rect (at 0.45 0) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 54 "/PinPoint Serial/MOSI0_D-")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1B6E) (at 55.05 93.95 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D7B8EE/55DC886D) (attr smd) (fp_text reference R15 (at 0 -1.8 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value DNP (at 0 1.8 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 55 "/PinPoint Serial/MISO0_D+")) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 56 "/PinPoint Serial/MISO0_D-")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1B7A) (at 42.9 93.95) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D7B8EE/55DC9BDC) (attr smd) (fp_text reference R16 (at 0 -1.8) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value DNP (at 0 1.8) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 23 "/PinPoint Serial/MOSI1_D+")) (pad 2 smd rect (at 0.45 0) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 24 "/PinPoint Serial/MOSI1_D-")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1B86) (at 50.4 84.25 270) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D7B8EE/55D8ABAF) (attr smd) (fp_text reference R17 (at 0 1.8 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 10 (at 0 -1.8 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 57 "Net-(R17-Pad1)")) (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 58 "/PinPoint Edison/USB_D-")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1B92) (at 49.4 84.25 270) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D7B8EE/55D8AB63) (attr smd) (fp_text reference R18 (at 0 1.8 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 10 (at 0 -1.8 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 59 "Net-(R18-Pad1)")) (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 60 "/PinPoint Edison/USB_D+")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1B9E) (at 45.4 93.9 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D7B8EE/55DCA36E) (attr smd) (fp_text reference R19 (at 0 -1.8 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value DNP (at 0 1.8 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 21 "/PinPoint Serial/MISO1_D+")) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 22 "/PinPoint Serial/MISO1_D-")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1BAA) (at 51.4 84.25 270) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D7B8EE/55D8A5F1) (attr smd) (fp_text reference R20 (at 0 1.8 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 12K/1% (at 0 -1.8 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 61 "Net-(R20-Pad1)")) (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1BB6) (at 46.4 84.25 270) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D7B8EE/55D8A8CE) (attr smd) (fp_text reference R21 (at 0 1.8 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 10K (at 0 -1.8 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 62 "Net-(R21-Pad1)")) (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1BC2) (at 69.15 87.75 90) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D7B8EE/55DCDCBA) (attr smd) (fp_text reference R22 (at 0 -1.8 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value DNP (at 0 1.8 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 32 "/PinPoint Serial/MOSI2_D+")) (pad 2 smd rect (at 0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 33 "/PinPoint Serial/MOSI2_D-")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1BCE) (at 69.15 85.25 270) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D7B8EE/55DCDD74) (attr smd) (fp_text reference R23 (at 0 -1.8 270) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value DNP (at 0 1.8 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 30 "/PinPoint Serial/MISO2_D+")) (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 31 "/PinPoint Serial/MISO2_D-")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1BDA) (at 59.4 73.75 90) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D7B8EE/55D89C0E) (attr smd) (fp_text reference R24 (at 0 1.8 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value R_Small (at 0 -1.8 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 90) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 63 "Net-(R24-Pad1)")) (pad 2 smd rect (at 0.45 0 90) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1BE6) (at 69.15 78.2 90) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D7B8EE/55DCB803) (attr smd) (fp_text reference R25 (at 0 -1.8 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value DNP (at 0 1.8 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 41 "/PinPoint Serial/MOSI3_D+")) (pad 2 smd rect (at 0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 42 "/PinPoint Serial/MOSI3_D-")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1BF2) (at 59.9 75.75 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D7B8EE/55D89BD0) (attr smd) (fp_text reference R26 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 2K (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 64 "Net-(R26-Pad1)")) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 63 "Net-(R24-Pad1)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1BFE) (at 69.15 75.65 270) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D7B8EE/55DCB8A9) (attr smd) (fp_text reference R27 (at 0 -1.8 270) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value DNP (at 0 1.8 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 39 "/PinPoint Serial/MISO3_D+")) (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 40 "/PinPoint Serial/MISO3_D-")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8) (tstamp 55DB1C0A) (at 70.9 91.5 90) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D854B1/55DA00E3) (attr smd) (fp_text reference R28 (at 0 -1.8 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value R_Small (at 0 1.8 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end -0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.95 -0.65) (end 0.95 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 0.25 -0.525) (end -0.25 -0.525) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 0.525) (end 0.25 0.525) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 65 "Net-(R28-Pad1)")) (pad 2 smd rect (at 0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1C16) (at 44.7 103.95 90) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D7B046) (attr smd) (fp_text reference R29 (at 0 1.8 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 90) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 16 VDDDIG)) (pad 2 smd rect (at 0.45 0 90) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 66 "Net-(R29-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1C22) (at 36.9 94.25) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D7AFDD) (attr smd) (fp_text reference R30 (at 0 1.8) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 16 VDDDIG)) (pad 2 smd rect (at 0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 67 "Net-(R30-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1C2E) (at 45.4 93.75 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D7AF77) (attr smd) (fp_text reference R31 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 16 VDDDIG)) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 68 "/PinPoint Bus Switch/I2C_IN_SCL")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1C3A) (at 36.9 93.25) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D7AEEA) (attr smd) (fp_text reference R32 (at 0 1.8) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 16 VDDDIG)) (pad 2 smd rect (at 0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 69 "/PinPoint Bus Switch/I2C_IN_SDA")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1C46) (at 37.7 94.95) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D79733) (attr smd) (fp_text reference R33 (at 0 1.8) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 70 "Net-(R33-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1C52) (at 68.7 84.1 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D796D9) (attr smd) (fp_text reference R34 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 71 "Net-(R34-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1C5E) (at 37.7 93.95) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D79682) (attr smd) (fp_text reference R35 (at 0 1.8) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 72 "Net-(R35-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1C6A) (at 37.7 95.95) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D7962A) (attr smd) (fp_text reference R36 (at 0 1.8) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 73 "Net-(R36-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1C76) (at 68.7 98.8 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D79435) (attr smd) (fp_text reference R37 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 74 "Net-(R37-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1C82) (at 62.7 97.3 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D793E7) (attr smd) (fp_text reference R38 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 75 "Net-(R38-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1C8E) (at 41.7 103.95 90) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D79398) (attr smd) (fp_text reference R39 (at 0 1.8 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 90) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.45 0 90) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 76 "Net-(R39-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1C9A) (at 68.7 93.8 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D79350) (attr smd) (fp_text reference R40 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 77 "Net-(R40-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1CA6) (at 62.7 92.3 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D79303) (attr smd) (fp_text reference R41 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 78 "Net-(R41-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1CB2) (at 43.7 103.95 90) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D792C1) (attr smd) (fp_text reference R42 (at 0 1.8 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 90) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.45 0 90) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 79 "Net-(R42-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1CBE) (at 68.7 88.8 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D79282) (attr smd) (fp_text reference R43 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 80 "Net-(R43-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1CCA) (at 62.7 87.3 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D791B9) (attr smd) (fp_text reference R44 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 1K (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 81 "Net-(R44-Pad2)")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1CD6) (at 68.7 99.8 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D783FA) (attr smd) (fp_text reference R45 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 290 (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 6 +15V)) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 38 "/PinPoint Bus Switch/I2C2_SCL")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1CE2) (at 64.7 97.3 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D78678) (attr smd) (fp_text reference R46 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 290 (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 6 +15V)) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 35 "/PinPoint Bus Switch/I2C2_SDA")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1CEE) (at 68.7 94.8 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D786A5) (attr smd) (fp_text reference R47 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 290 (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 6 +15V)) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 29 "/PinPoint Bus Switch/I2C1_SCL")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1CFA) (at 64.7 92.3 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D786D5) (attr smd) (fp_text reference R48 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 290 (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 6 +15V)) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 26 "/PinPoint Bus Switch/I2C1_SDA")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1D06) (at 68.7 89.8 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D78708) (attr smd) (fp_text reference R49 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 290 (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 6 +15V)) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 20 "/PinPoint Bus Switch/I2C0_SCL")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1D12) (at 64.7 87.3 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55D7873E) (attr smd) (fp_text reference R50 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 290 (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 6 +15V)) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 18 "/PinPoint Bus Switch/I2C0_SDA")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1D1E) (at 68.7 85.1 180) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55DBC6D3) (attr smd) (fp_text reference R51 (at 0 1.8 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 290 (at 0 -1.8 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 6 +15V)) (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 105 "/PinPoint Bus Switch/I2C3_SCL")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DB1D2A) (at 64.7 82.3) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D9334F/55DBC653) (attr smd) (fp_text reference R52 (at 0 1.8) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 290 (at 0 -1.8) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 6 +15V)) (pad 2 smd rect (at 0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 102 "/PinPoint Bus Switch/I2C3_SDA")) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Housings_SOT-23_SOT-143_TSOT-6:SOT-23-6 (layer F.Cu) (tedit 53DE8DE3) (tstamp 55DB1D98) (at 44.1 100.2) (descr "6-pin SOT-23 package") (tags SOT-23-6) (path /55D74702/55D9D3FF) (attr smd) (fp_text reference U1 (at 0 -2.9) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value AOZ1282CI (at 0 2.9) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_circle (center -0.4 -1.7) (end -0.3 -1.7) (layer F.SilkS) (width 0.15)) (fp_line (start 0.25 -1.45) (end -0.25 -1.45) (layer F.SilkS) (width 0.15)) (fp_line (start 0.25 1.45) (end 0.25 -1.45) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 1.45) (end 0.25 1.45) (layer F.SilkS) (width 0.15)) (fp_line (start -0.25 -1.45) (end -0.25 1.45) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask) (net 2 "Net-(C1-Pad2)")) (pad 2 smd rect (at -1.1 0) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 3 smd rect (at -1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask) (net 44 "Net-(R2-Pad2)")) (pad 4 smd rect (at 1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask) (net 43 "Net-(R1-Pad2)")) (pad 6 smd rect (at 1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask) (net 1 "Net-(C1-Pad1)")) (pad 5 smd rect (at 1.1 0) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask) (net 3 +36V)) (model Housings_SOT-23_SOT-143_TSOT-6.3dshapes/SOT-23-6.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module polypoint:INTEL_EDISON (layer B.Cu) (tedit 55D93F61) (tstamp 55DB1DFD) (at 48.8 89.64 90) (path /55D74741/55D8B6A1) (fp_text reference U3 (at 0 9.652 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value INTEL_EDISON (at 9.144 21.844 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -3.3 23.13) (end 21.7 23.13) (layer B.SilkS) (width 0.15)) (fp_line (start 21.7 23.13) (end 21.7 -12.37) (layer B.SilkS) (width 0.15)) (fp_line (start 21.7 -12.37) (end -3.3 -12.37) (layer B.SilkS) (width 0.15)) (fp_line (start -3.3 -12.37) (end -3.3 23.13) (layer B.SilkS) (width 0.15)) (fp_line (start 1.47 -7.112) (end 1.47 -8.3) (layer B.SilkS) (width 0.15)) (fp_line (start 1.47 -8.3) (end -1.47 -8.3) (layer B.SilkS) (width 0.15)) (fp_line (start -1.47 -8.3) (end -1.47 -7.112) (layer B.SilkS) (width 0.15)) (fp_line (start -1.47 7.112) (end -1.47 8.3) (layer B.SilkS) (width 0.15)) (fp_line (start -1.47 8.3) (end 1.47 8.3) (layer B.SilkS) (width 0.15)) (fp_line (start 1.47 8.3) (end 1.47 7.112) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -1.54 6.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 2 smd rect (at 1.54 6.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 3 smd rect (at -1.54 6.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 108 "Net-(R4-Pad1)")) (pad 4 smd rect (at 1.54 6.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 5 smd rect (at -1.54 6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 6 smd rect (at 1.54 6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 7 smd rect (at -1.54 5.6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 8 smd rect (at 1.54 5.6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 9 smd rect (at -1.54 5.2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 10 smd rect (at 1.54 5.2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 11 smd rect (at -1.54 4.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 12 smd rect (at 1.54 4.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 9 +1V8)) (pad 13 smd rect (at -1.54 4.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 14 smd rect (at 1.54 4.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 15 smd rect (at -1.54 4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 16 smd rect (at 1.54 4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 60 "/PinPoint Edison/USB_D+")) (pad 17 smd rect (at -1.54 3.6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 45 "Net-(R7-Pad1)")) (pad 18 smd rect (at 1.54 3.6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 58 "/PinPoint Edison/USB_D-")) (pad 19 smd rect (at -1.54 3.2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 46 "Net-(R9-Pad1)")) (pad 20 smd rect (at 1.54 3.2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 21 smd rect (at -1.54 2.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 22 smd rect (at 1.54 2.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 48 "Net-(R10-Pad2)")) (pad 23 smd rect (at -1.54 2.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 24 smd rect (at 1.54 2.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 82 "/PinPoint Edison/CFG0")) (pad 25 smd rect (at -1.54 2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 19 "/PinPoint Bus Switch/CFG0_OUT1")) (pad 26 smd rect (at 1.54 2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 84 "/PinPoint Bus Switch/CFG1_IN0")) (pad 27 smd rect (at -1.54 1.6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 50 "Net-(R11-Pad2)")) (pad 28 smd rect (at 1.54 1.6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 85 "/PinPoint Bus Switch/CFG1_IN1")) (pad 29 smd rect (at -1.54 1.2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 30 smd rect (at 1.54 1.2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 86 "/PinPoint Bus Switch/CFG2_IN0")) (pad 31 smd rect (at -1.54 0.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 32 smd rect (at 1.54 0.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 87 "/PinPoint Bus Switch/CFG2_IN1")) (pad 33 smd rect (at -1.54 0.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 34 smd rect (at 1.54 0.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 106 "/PinPoint Bus Switch/CFG3_IN0")) (pad 35 smd rect (at -1.54 0 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 36 smd rect (at 1.54 0 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 37 smd rect (at -1.54 -0.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 38 smd rect (at 1.54 -0.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 39 smd rect (at -1.54 -0.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 40 smd rect (at 1.54 -0.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 41 smd rect (at -1.54 -1.2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 42 smd rect (at 1.54 -1.2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 107 "/PinPoint Bus Switch/CFG3_IN1")) (pad 43 smd rect (at -1.54 -1.6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 44 smd rect (at 1.54 -1.6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 45 smd rect (at -1.54 -2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 68 "/PinPoint Bus Switch/I2C_IN_SCL")) (pad 46 smd rect (at 1.54 -2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 47 smd rect (at -1.54 -2.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask) (net 69 "/PinPoint Bus Switch/I2C_IN_SDA")) (pad 48 smd rect (at 1.54 -2.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 49 smd rect (at -1.54 -2.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 50 smd rect (at 1.54 -2.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 51 smd rect (at -1.54 -3.2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 52 smd rect (at 1.54 -3.2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 53 smd rect (at -1.54 -3.6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 54 smd rect (at 1.54 -3.6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 55 smd rect (at -1.54 -4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 56 smd rect (at 1.54 -4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 57 smd rect (at -1.54 -4.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 58 smd rect (at 1.54 -4.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 59 smd rect (at -1.54 -4.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 60 smd rect (at 1.54 -4.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 61 smd rect (at -1.54 -5.2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 62 smd rect (at 1.54 -5.2 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 63 smd rect (at -1.54 -5.6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 64 smd rect (at 1.54 -5.6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 65 smd rect (at -1.54 -6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 66 smd rect (at 1.54 -6 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 67 smd rect (at -1.54 -6.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 68 smd rect (at 1.54 -6.4 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 69 smd rect (at -1.54 -6.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad 70 smd rect (at 1.54 -6.8 90) (size 0.7 0.2) (layers B.Cu B.Paste B.Mask)) (pad "" np_thru_hole circle (at -0.37 -10.39 90) (size 2 2) (drill 2) (layers *.Cu *.Mask B.SilkS)) (pad "" np_thru_hole circle (at 20.23 18.3 90) (size 2 2) (drill 2) (layers *.Cu *.Mask B.SilkS)) ) (module polypoint:SSOP-20_6.0x8.7mm_Pitch0.65mm (layer F.Cu) (tedit 55D8C749) (tstamp 55DB1E20) (at 75.8 72.2) (descr "SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)") (tags "SSOP 0.65") (path /55D74741/55D8D3D2) (attr smd) (fp_text reference U4 (at 0 -5.08) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value FT231XS (at 0 5.08) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -3.65 -3.55) (end -3.65 3.55) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.65 -3.55) (end 3.65 3.55) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.65 -3.55) (end 3.65 -3.55) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.65 3.55) (end 3.65 3.55) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.325 -4.3307) (end -2.325 -3.35) (layer F.SilkS) (width 0.15)) (fp_line (start 2.325 -4.3307) (end 2.325 -3.35) (layer F.SilkS) (width 0.15)) (fp_line (start 2.325 4.3307) (end 2.325 3.35) (layer F.SilkS) (width 0.15)) (fp_line (start -2.325 4.3307) (end -2.325 3.35) (layer F.SilkS) (width 0.15)) (fp_line (start -2.325 -4.3307) (end 2.325 -4.3307) (layer F.SilkS) (width 0.15)) (fp_line (start -2.325 4.3307) (end 2.325 4.3307) (layer F.SilkS) (width 0.15)) (fp_line (start -2.325 -3.35) (end -3.4 -3.35) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -2.9 -2.925) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 2 smd rect (at -2.9 -2.275) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 3 smd rect (at -2.9 -1.625) (size 1 0.4) (layers F.Cu F.Paste F.Mask) (net 9 +1V8)) (pad 4 smd rect (at -2.9 -0.975) (size 1 0.4) (layers F.Cu F.Paste F.Mask) (net 49 "Net-(R11-Pad1)")) (pad 5 smd rect (at -2.9 -0.325) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 6 smd rect (at -2.9 0.325) (size 1 0.4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 7 smd rect (at -2.9 0.975) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 8 smd rect (at -2.9 1.625) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 9 smd rect (at -2.9 2.275) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 10 smd rect (at -2.9 2.925) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 11 smd rect (at 2.9 2.925) (size 1 0.4) (layers F.Cu F.Paste F.Mask) (net 52 "Net-(R13-Pad2)")) (pad 12 smd rect (at 2.9 2.275) (size 1 0.4) (layers F.Cu F.Paste F.Mask) (net 51 "Net-(R12-Pad2)")) (pad 13 smd rect (at 2.9 1.625) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 14 smd rect (at 2.9 0.975) (size 1 0.4) (layers F.Cu F.Paste F.Mask) (net 9 +1V8)) (pad 15 smd rect (at 2.9 0.325) (size 1 0.4) (layers F.Cu F.Paste F.Mask) (net 10 +5V)) (pad 16 smd rect (at 2.9 -0.325) (size 1 0.4) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 17 smd rect (at 2.9 -0.975) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 18 smd rect (at 2.9 -1.625) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 19 smd rect (at 2.9 -2.275) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 20 smd rect (at 2.9 -2.925) (size 1 0.4) (layers F.Cu F.Paste F.Mask) (net 47 "Net-(R10-Pad1)")) (model Housings_SSOP.3dshapes/SSOP-20_4.4x6.5mm_Pitch0.65mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Housings_SOIC:SOIC-14_3.9x8.7mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 55DB1E3D) (at 54.4 89.65 270) (descr "14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)") (tags "SOIC 1.27") (path /55D7B8EE/55D88867) (attr smd) (fp_text reference U5 (at 0 -5.375 270) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value SN65MLVD207D (at 0 5.375 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -3.7 -4.65) (end -3.7 4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.7 -4.65) (end 3.7 4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.7 -4.65) (end 3.7 -4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.7 4.65) (end 3.7 4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.075 -4.45) (end -2.075 -4.335) (layer F.SilkS) (width 0.15)) (fp_line (start 2.075 -4.45) (end 2.075 -4.335) (layer F.SilkS) (width 0.15)) (fp_line (start 2.075 4.45) (end 2.075 4.335) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 4.45) (end -2.075 4.335) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 -4.45) (end 2.075 -4.45) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 4.45) (end 2.075 4.45) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 -4.335) (end -3.45 -4.335) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -2.7 -3.81 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)) (pad 2 smd rect (at -2.7 -2.54 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 88 "Net-(U5-Pad2)")) (pad 3 smd rect (at -2.7 -1.27 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 4 smd rect (at -2.7 0 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 5 smd rect (at -2.7 1.27 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 89 "Net-(U5-Pad5)")) (pad 6 smd rect (at -2.7 2.54 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 7 smd rect (at -2.7 3.81 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 8 smd rect (at 2.7 3.81 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)) (pad 9 smd rect (at 2.7 2.54 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 53 "/PinPoint Serial/MOSI0_D+")) (pad 10 smd rect (at 2.7 1.27 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 54 "/PinPoint Serial/MOSI0_D-")) (pad 11 smd rect (at 2.7 0 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 56 "/PinPoint Serial/MISO0_D-")) (pad 12 smd rect (at 2.7 -1.27 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 55 "/PinPoint Serial/MISO0_D+")) (pad 13 smd rect (at 2.7 -2.54 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 14 smd rect (at 2.7 -3.81 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (model Housings_SOIC.3dshapes/SOIC-14_3.9x8.7mm_Pitch1.27mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Housings_SOIC:SOIC-14_3.9x8.7mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 55DB1E5A) (at 44.9 89.65 270) (descr "14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)") (tags "SOIC 1.27") (path /55D7B8EE/55D88C13) (attr smd) (fp_text reference U6 (at 0 -5.375 270) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value SN65MLVD207D (at 0 5.375 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -3.7 -4.65) (end -3.7 4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.7 -4.65) (end 3.7 4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.7 -4.65) (end 3.7 -4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.7 4.65) (end 3.7 4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.075 -4.45) (end -2.075 -4.335) (layer F.SilkS) (width 0.15)) (fp_line (start 2.075 -4.45) (end 2.075 -4.335) (layer F.SilkS) (width 0.15)) (fp_line (start 2.075 4.45) (end 2.075 4.335) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 4.45) (end -2.075 4.335) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 -4.45) (end 2.075 -4.45) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 4.45) (end 2.075 4.45) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 -4.335) (end -3.45 -4.335) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -2.7 -3.81 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)) (pad 2 smd rect (at -2.7 -2.54 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 90 "Net-(U6-Pad2)")) (pad 3 smd rect (at -2.7 -1.27 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 4 smd rect (at -2.7 0 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 5 smd rect (at -2.7 1.27 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 91 "Net-(U6-Pad5)")) (pad 6 smd rect (at -2.7 2.54 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 7 smd rect (at -2.7 3.81 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 8 smd rect (at 2.7 3.81 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)) (pad 9 smd rect (at 2.7 2.54 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 23 "/PinPoint Serial/MOSI1_D+")) (pad 10 smd rect (at 2.7 1.27 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 24 "/PinPoint Serial/MOSI1_D-")) (pad 11 smd rect (at 2.7 0 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 22 "/PinPoint Serial/MISO1_D-")) (pad 12 smd rect (at 2.7 -1.27 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 21 "/PinPoint Serial/MISO1_D+")) (pad 13 smd rect (at 2.7 -2.54 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 14 smd rect (at 2.7 -3.81 270) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (model Housings_SOIC.3dshapes/SOIC-14_3.9x8.7mm_Pitch1.27mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Housings_QFP:LQFP-64_10x10mm_Pitch0.5mm (layer B.Cu) (tedit 54130A77) (tstamp 55DB1EAB) (at 49.15 75.5 90) (descr "64 LEAD LQFP 10x10mm (see MICREL LQFP10x10-64LD-PL-1.pdf)") (tags "QFP 0.5") (path /55D7B8EE/55D88836) (attr smd) (fp_text reference U7 (at 0 7.2 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value FT4232 (at 0 -7.2 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -6.45 6.45) (end -6.45 -6.45) (layer B.CrtYd) (width 0.05)) (fp_line (start 6.45 6.45) (end 6.45 -6.45) (layer B.CrtYd) (width 0.05)) (fp_line (start -6.45 6.45) (end 6.45 6.45) (layer B.CrtYd) (width 0.05)) (fp_line (start -6.45 -6.45) (end 6.45 -6.45) (layer B.CrtYd) (width 0.05)) (fp_line (start -5.175 5.175) (end -5.175 4.1) (layer B.SilkS) (width 0.15)) (fp_line (start 5.175 5.175) (end 5.175 4.1) (layer B.SilkS) (width 0.15)) (fp_line (start 5.175 -5.175) (end 5.175 -4.1) (layer B.SilkS) (width 0.15)) (fp_line (start -5.175 -5.175) (end -5.175 -4.1) (layer B.SilkS) (width 0.15)) (fp_line (start -5.175 5.175) (end -4.1 5.175) (layer B.SilkS) (width 0.15)) (fp_line (start -5.175 -5.175) (end -4.1 -5.175) (layer B.SilkS) (width 0.15)) (fp_line (start 5.175 -5.175) (end 4.1 -5.175) (layer B.SilkS) (width 0.15)) (fp_line (start 5.175 5.175) (end 4.1 5.175) (layer B.SilkS) (width 0.15)) (fp_line (start -5.175 4.1) (end -6.2 4.1) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -5.7 3.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 2 smd rect (at -5.7 3.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 12 "Net-(C25-Pad1)")) (pad 3 smd rect (at -5.7 2.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 13 "Net-(C26-Pad1)")) (pad 4 smd rect (at -5.7 2.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 15 VPHY)) (pad 5 smd rect (at -5.7 1.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 6 smd rect (at -5.7 1.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 61 "Net-(R20-Pad1)")) (pad 7 smd rect (at -5.7 0.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 57 "Net-(R17-Pad1)")) (pad 8 smd rect (at -5.7 0.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 59 "Net-(R18-Pad1)")) (pad 9 smd rect (at -5.7 -0.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 14 VPLL)) (pad 10 smd rect (at -5.7 -0.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 11 smd rect (at -5.7 -1.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 12 smd rect (at -5.7 -1.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 11 "Net-(C11-Pad2)")) (pad 13 smd rect (at -5.7 -2.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 14 smd rect (at -5.7 -2.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 62 "Net-(R21-Pad1)")) (pad 15 smd rect (at -5.7 -3.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 16 smd rect (at -5.7 -3.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 89 "Net-(U5-Pad5)")) (pad 17 smd rect (at -3.75 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 88 "Net-(U5-Pad2)")) (pad 18 smd rect (at -3.25 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 19 smd rect (at -2.75 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 20 smd rect (at -2.25 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 21 smd rect (at -1.75 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 22 smd rect (at -1.25 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 23 smd rect (at -0.75 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 24 smd rect (at -0.25 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 25 smd rect (at 0.25 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 26 smd rect (at 0.75 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 91 "Net-(U6-Pad5)")) (pad 27 smd rect (at 1.25 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 90 "Net-(U6-Pad2)")) (pad 28 smd rect (at 1.75 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 29 smd rect (at 2.25 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 30 smd rect (at 2.75 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 31 smd rect (at 3.25 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 32 smd rect (at 3.75 -5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 33 smd rect (at 5.7 -3.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 34 smd rect (at 5.7 -3.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 35 smd rect (at 5.7 -2.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 36 smd rect (at 5.7 -2.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 37 smd rect (at 5.7 -1.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 11 "Net-(C11-Pad2)")) (pad 38 smd rect (at 5.7 -1.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 92 "Net-(U7-Pad38)")) (pad 39 smd rect (at 5.7 -0.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 93 "Net-(U7-Pad39)")) (pad 40 smd rect (at 5.7 -0.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 41 smd rect (at 5.7 0.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 42 smd rect (at 5.7 0.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 43 smd rect (at 5.7 1.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 44 smd rect (at 5.7 1.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 45 smd rect (at 5.7 2.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 46 smd rect (at 5.7 2.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 47 smd rect (at 5.7 3.25 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 48 smd rect (at 5.7 3.75 90) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 94 "Net-(U10-Pad5)")) (pad 49 smd rect (at 3.75 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 11 "Net-(C11-Pad2)")) (pad 50 smd rect (at 3.25 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 51 smd rect (at 2.75 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 52 smd rect (at 2.25 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 95 "Net-(U10-Pad2)")) (pad 53 smd rect (at 1.75 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 54 smd rect (at 1.25 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 55 smd rect (at 0.75 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 56 smd rect (at 0.25 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 57 smd rect (at -0.25 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 58 smd rect (at -0.75 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 59 smd rect (at -1.25 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 60 smd rect (at -1.75 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask)) (pad 61 smd rect (at -2.25 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 64 "Net-(R26-Pad1)")) (pad 62 smd rect (at -2.75 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 96 "Net-(U7-Pad62)")) (pad 63 smd rect (at -3.25 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 97 "Net-(U7-Pad63)")) (pad 64 smd rect (at -3.75 5.7) (size 1 0.25) (layers B.Cu B.Paste B.Mask) (net 11 "Net-(C11-Pad2)")) (model Housings_QFP.3dshapes/LQFP-64_10x10mm_Pitch0.5mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Housings_SOIC:SOIC-14_3.9x8.7mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 55DB1EC8) (at 64.4 85.75) (descr "14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)") (tags "SOIC 1.27") (path /55D7B8EE/55D88D24) (attr smd) (fp_text reference U8 (at 0 -5.375) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value SN65MLVD207D (at 0 5.375) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -3.7 -4.65) (end -3.7 4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.7 -4.65) (end 3.7 4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.7 -4.65) (end 3.7 -4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.7 4.65) (end 3.7 4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.075 -4.45) (end -2.075 -4.335) (layer F.SilkS) (width 0.15)) (fp_line (start 2.075 -4.45) (end 2.075 -4.335) (layer F.SilkS) (width 0.15)) (fp_line (start 2.075 4.45) (end 2.075 4.335) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 4.45) (end -2.075 4.335) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 -4.45) (end 2.075 -4.45) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 4.45) (end 2.075 4.45) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 -4.335) (end -3.45 -4.335) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -2.7 -3.81) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)) (pad 2 smd rect (at -2.7 -2.54) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 93 "Net-(U7-Pad39)")) (pad 3 smd rect (at -2.7 -1.27) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 4 smd rect (at -2.7 0) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 5 smd rect (at -2.7 1.27) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 92 "Net-(U7-Pad38)")) (pad 6 smd rect (at -2.7 2.54) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 7 smd rect (at -2.7 3.81) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 8 smd rect (at 2.7 3.81) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)) (pad 9 smd rect (at 2.7 2.54) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 32 "/PinPoint Serial/MOSI2_D+")) (pad 10 smd rect (at 2.7 1.27) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 33 "/PinPoint Serial/MOSI2_D-")) (pad 11 smd rect (at 2.7 0) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 31 "/PinPoint Serial/MISO2_D-")) (pad 12 smd rect (at 2.7 -1.27) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 30 "/PinPoint Serial/MISO2_D+")) (pad 13 smd rect (at 2.7 -2.54) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 14 smd rect (at 2.7 -3.81) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (model Housings_SOIC.3dshapes/SOIC-14_3.9x8.7mm_Pitch1.27mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Housings_SOT-23_SOT-143_TSOT-6:SOT-23-6 (layer B.Cu) (tedit 53DE8DE3) (tstamp 55DB1ED7) (at 59.9 78.25 270) (descr "6-pin SOT-23 package") (tags SOT-23-6) (path /55D7B8EE/55D89A41) (attr smd) (fp_text reference U9 (at 0 2.9 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 93LC56B (at 0 -2.9 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -0.4 1.7) (end -0.3 1.7) (layer B.SilkS) (width 0.15)) (fp_line (start 0.25 1.45) (end -0.25 1.45) (layer B.SilkS) (width 0.15)) (fp_line (start 0.25 -1.45) (end 0.25 1.45) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -1.45) (end 0.25 -1.45) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 1.45) (end -0.25 -1.45) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -1.1 0.95 270) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask) (net 63 "Net-(R24-Pad1)")) (pad 2 smd rect (at -1.1 0 270) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 3 smd rect (at -1.1 -0.95 270) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask) (net 64 "Net-(R26-Pad1)")) (pad 4 smd rect (at 1.1 -0.95 270) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask) (net 96 "Net-(U7-Pad62)")) (pad 6 smd rect (at 1.1 0.95 270) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 5 smd rect (at 1.1 0 270) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask) (net 97 "Net-(U7-Pad63)")) (model Housings_SOT-23_SOT-143_TSOT-6.3dshapes/SOT-23-6.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Housings_SOIC:SOIC-14_3.9x8.7mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 55DB1EF4) (at 64.4 76.25) (descr "14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)") (tags "SOIC 1.27") (path /55D7B8EE/55D88DD0) (attr smd) (fp_text reference U10 (at 0 -5.375) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value SN65MLVD207D (at 0 5.375) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -3.7 -4.65) (end -3.7 4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.7 -4.65) (end 3.7 4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.7 -4.65) (end 3.7 -4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.7 4.65) (end 3.7 4.65) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.075 -4.45) (end -2.075 -4.335) (layer F.SilkS) (width 0.15)) (fp_line (start 2.075 -4.45) (end 2.075 -4.335) (layer F.SilkS) (width 0.15)) (fp_line (start 2.075 4.45) (end 2.075 4.335) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 4.45) (end -2.075 4.335) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 -4.45) (end 2.075 -4.45) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 4.45) (end 2.075 4.45) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 -4.335) (end -3.45 -4.335) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -2.7 -3.81) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)) (pad 2 smd rect (at -2.7 -2.54) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 95 "Net-(U10-Pad2)")) (pad 3 smd rect (at -2.7 -1.27) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 4 smd rect (at -2.7 0) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 5 smd rect (at -2.7 1.27) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 94 "Net-(U10-Pad5)")) (pad 6 smd rect (at -2.7 2.54) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 7 smd rect (at -2.7 3.81) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 8 smd rect (at 2.7 3.81) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)) (pad 9 smd rect (at 2.7 2.54) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 41 "/PinPoint Serial/MOSI3_D+")) (pad 10 smd rect (at 2.7 1.27) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 42 "/PinPoint Serial/MOSI3_D-")) (pad 11 smd rect (at 2.7 0) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 40 "/PinPoint Serial/MISO3_D-")) (pad 12 smd rect (at 2.7 -1.27) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 39 "/PinPoint Serial/MISO3_D+")) (pad 13 smd rect (at 2.7 -2.54) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 14 smd rect (at 2.7 -3.81) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (model Housings_SOIC.3dshapes/SOIC-14_3.9x8.7mm_Pitch1.27mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 55DB1F0B) (at 71.65 96.25 90) (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)") (tags "SOIC 1.27") (path /55D854B1/55D9F692) (attr smd) (fp_text reference U11 (at 0 -3.5 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value ICS574 (at 0 3.5 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15)) (fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15)) (fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15)) (fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask) (net 99 "/PinPoint Splitter/REF_IN")) (pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask) (net 17 "/PinPoint Splitter/REF_OUT0")) (pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask) (net 25 "/PinPoint Splitter/REF_OUT1")) (pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask) (net 5 +3V3)) (pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask) (net 34 "/PinPoint Splitter/REF_OUT2")) (pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask) (net 65 "Net-(R28-Pad1)")) (pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask) (net 17 "/PinPoint Splitter/REF_OUT0")) (model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Housings_SSOP:TSSOP-8_3x3mm_Pitch0.65mm (layer B.Cu) (tedit 54130A77) (tstamp 55DB1F22) (at 64.7 89.8) (descr "TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)") (tags "SSOP 0.65") (path /55D9334F/55DA435E) (attr smd) (fp_text reference U12 (at 0 2.55) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value P82B96-PP (at 0 -2.55) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -2.95 1.8) (end -2.95 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.95 1.8) (end 2.95 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.95 1.8) (end 2.95 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.95 -1.8) (end 2.95 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.625 1.625) (end -1.625 1.4) (layer B.SilkS) (width 0.15)) (fp_line (start 1.625 1.625) (end 1.625 1.4) (layer B.SilkS) (width 0.15)) (fp_line (start 1.625 -1.625) (end 1.625 -1.4) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 -1.625) (end -1.625 -1.4) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 1.625) (end 1.625 1.625) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 1.4) (end -2.7 1.4) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -2.15 0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 18 "/PinPoint Bus Switch/I2C0_SDA")) (pad 2 smd rect (at -2.15 0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 81 "Net-(R44-Pad2)")) (pad 3 smd rect (at -2.15 -0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 81 "Net-(R44-Pad2)")) (pad 4 smd rect (at -2.15 -0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 5 smd rect (at 2.15 -0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 80 "Net-(R43-Pad2)")) (pad 6 smd rect (at 2.15 -0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 80 "Net-(R43-Pad2)")) (pad 7 smd rect (at 2.15 0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 20 "/PinPoint Bus Switch/I2C0_SCL")) (pad 8 smd rect (at 2.15 0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +15V)) (model Housings_SSOP.3dshapes/TSSOP-8_3x3mm_Pitch0.65mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Housings_SSOP:TSSOP-8_3x3mm_Pitch0.65mm (layer B.Cu) (tedit 54130A77) (tstamp 55DB1F39) (at 64.7 94.8) (descr "TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)") (tags "SSOP 0.65") (path /55D9334F/55DA447D) (attr smd) (fp_text reference U13 (at 0 2.55) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value P82B96-PP (at 0 -2.55) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -2.95 1.8) (end -2.95 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.95 1.8) (end 2.95 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.95 1.8) (end 2.95 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.95 -1.8) (end 2.95 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.625 1.625) (end -1.625 1.4) (layer B.SilkS) (width 0.15)) (fp_line (start 1.625 1.625) (end 1.625 1.4) (layer B.SilkS) (width 0.15)) (fp_line (start 1.625 -1.625) (end 1.625 -1.4) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 -1.625) (end -1.625 -1.4) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 1.625) (end 1.625 1.625) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 1.4) (end -2.7 1.4) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -2.15 0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 26 "/PinPoint Bus Switch/I2C1_SDA")) (pad 2 smd rect (at -2.15 0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 78 "Net-(R41-Pad2)")) (pad 3 smd rect (at -2.15 -0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 78 "Net-(R41-Pad2)")) (pad 4 smd rect (at -2.15 -0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 5 smd rect (at 2.15 -0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 77 "Net-(R40-Pad2)")) (pad 6 smd rect (at 2.15 -0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 77 "Net-(R40-Pad2)")) (pad 7 smd rect (at 2.15 0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 29 "/PinPoint Bus Switch/I2C1_SCL")) (pad 8 smd rect (at 2.15 0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +15V)) (model Housings_SSOP.3dshapes/TSSOP-8_3x3mm_Pitch0.65mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Housings_SSOP:TSSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 54130A77) (tstamp 55DB1F57) (at 42.7 98.95 90) (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)") (tags "SSOP 0.65") (path /55D9334F/55DA400E) (attr smd) (fp_text reference U14 (at 0 4.3 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value PCA9545A (at 0 -4.3 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -3.95 3.55) (end -3.95 -3.55) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.95 3.55) (end 3.95 -3.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.95 3.55) (end 3.95 3.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.95 -3.55) (end 3.95 -3.55) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.225 -3.375) (end 2.225 -3.375) (layer B.SilkS) (width 0.15)) (fp_line (start -3.75 3.375) (end 2.225 3.375) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -2.95 2.925 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 2 smd rect (at -2.95 2.275 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 3 smd rect (at -2.95 1.625 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 66 "Net-(R29-Pad2)")) (pad 4 smd rect (at -2.95 0.975 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 79 "Net-(R42-Pad2)")) (pad 5 smd rect (at -2.95 0.325 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 81 "Net-(R44-Pad2)")) (pad 6 smd rect (at -2.95 -0.325 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 80 "Net-(R43-Pad2)")) (pad 7 smd rect (at -2.95 -0.975 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 76 "Net-(R39-Pad2)")) (pad 8 smd rect (at -2.95 -1.625 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 78 "Net-(R41-Pad2)")) (pad 9 smd rect (at -2.95 -2.275 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 77 "Net-(R40-Pad2)")) (pad 10 smd rect (at -2.95 -2.925 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 11 smd rect (at 2.95 -2.925 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 73 "Net-(R36-Pad2)")) (pad 12 smd rect (at 2.95 -2.275 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 75 "Net-(R38-Pad2)")) (pad 13 smd rect (at 2.95 -1.625 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 74 "Net-(R37-Pad2)")) (pad 14 smd rect (at 2.95 -0.975 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 70 "Net-(R33-Pad2)")) (pad 15 smd rect (at 2.95 -0.325 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 72 "Net-(R35-Pad2)")) (pad 16 smd rect (at 2.95 0.325 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 71 "Net-(R34-Pad2)")) (pad 17 smd rect (at 2.95 0.975 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 67 "Net-(R30-Pad2)")) (pad 18 smd rect (at 2.95 1.625 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 68 "/PinPoint Bus Switch/I2C_IN_SCL")) (pad 19 smd rect (at 2.95 2.275 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 69 "/PinPoint Bus Switch/I2C_IN_SDA")) (pad 20 smd rect (at 2.95 2.925 90) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (model Housings_SSOP.3dshapes/TSSOP-20_4.4x6.5mm_Pitch0.65mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Housings_SSOP:TSSOP-8_3x3mm_Pitch0.65mm (layer B.Cu) (tedit 54130A77) (tstamp 55DB1F6E) (at 64.7 99.8) (descr "TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)") (tags "SSOP 0.65") (path /55D9334F/55DA44B6) (attr smd) (fp_text reference U15 (at 0 2.55) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value P82B96-PP (at 0 -2.55) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -2.95 1.8) (end -2.95 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.95 1.8) (end 2.95 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.95 1.8) (end 2.95 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.95 -1.8) (end 2.95 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.625 1.625) (end -1.625 1.4) (layer B.SilkS) (width 0.15)) (fp_line (start 1.625 1.625) (end 1.625 1.4) (layer B.SilkS) (width 0.15)) (fp_line (start 1.625 -1.625) (end 1.625 -1.4) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 -1.625) (end -1.625 -1.4) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 1.625) (end 1.625 1.625) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 1.4) (end -2.7 1.4) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -2.15 0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 35 "/PinPoint Bus Switch/I2C2_SDA")) (pad 2 smd rect (at -2.15 0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 75 "Net-(R38-Pad2)")) (pad 3 smd rect (at -2.15 -0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 75 "Net-(R38-Pad2)")) (pad 4 smd rect (at -2.15 -0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 5 smd rect (at 2.15 -0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 74 "Net-(R37-Pad2)")) (pad 6 smd rect (at 2.15 -0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 74 "Net-(R37-Pad2)")) (pad 7 smd rect (at 2.15 0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 38 "/PinPoint Bus Switch/I2C2_SCL")) (pad 8 smd rect (at 2.15 0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 6 +15V)) (model Housings_SSOP.3dshapes/TSSOP-8_3x3mm_Pitch0.65mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Housings_SSOP:TSSOP-24_4.4x7.8mm_Pitch0.65mm (layer B.Cu) (tedit 54130A77) (tstamp 55DB1F95) (at 51.075 98.8 270) (descr "TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot355-1_po.pdf)") (tags "SSOP 0.65") (path /55D9334F/55D7F074) (attr smd) (fp_text reference U16 (at 0 4.95 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value SN74AVCH8T245 (at 0 -4.95 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -3.65 4.2) (end -3.65 -4.2) (layer B.CrtYd) (width 0.05)) (fp_line (start 3.65 4.2) (end 3.65 -4.2) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.65 4.2) (end 3.65 4.2) (layer B.CrtYd) (width 0.05)) (fp_line (start -3.65 -4.2) (end 3.65 -4.2) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.325 4.025) (end -2.325 4) (layer B.SilkS) (width 0.15)) (fp_line (start 2.325 4.025) (end 2.325 4) (layer B.SilkS) (width 0.15)) (fp_line (start 2.325 -4.025) (end 2.325 -4) (layer B.SilkS) (width 0.15)) (fp_line (start -2.325 -4.025) (end -2.325 -4) (layer B.SilkS) (width 0.15)) (fp_line (start -2.325 4.025) (end 2.325 4.025) (layer B.SilkS) (width 0.15)) (fp_line (start -2.325 -4.025) (end 2.325 -4.025) (layer B.SilkS) (width 0.15)) (fp_line (start -2.325 4) (end -3.4 4) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -2.85 3.575 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 16 VDDDIG)) (pad 2 smd rect (at -2.85 2.925 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 16 VDDDIG)) (pad 3 smd rect (at -2.85 2.275 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 101 "/PinPoint Bus Switch/CFG0_IN0")) (pad 4 smd rect (at -2.85 1.625 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 83 "/PinPoint Bus Switch/CFG0_IN1")) (pad 5 smd rect (at -2.85 0.975 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 84 "/PinPoint Bus Switch/CFG1_IN0")) (pad 6 smd rect (at -2.85 0.325 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 85 "/PinPoint Bus Switch/CFG1_IN1")) (pad 7 smd rect (at -2.85 -0.325 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 86 "/PinPoint Bus Switch/CFG2_IN0")) (pad 8 smd rect (at -2.85 -0.975 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 87 "/PinPoint Bus Switch/CFG2_IN1")) (pad 9 smd rect (at -2.85 -1.625 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 106 "/PinPoint Bus Switch/CFG3_IN0")) (pad 10 smd rect (at -2.85 -2.275 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 107 "/PinPoint Bus Switch/CFG3_IN1")) (pad 11 smd rect (at -2.85 -2.925 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 12 smd rect (at -2.85 -3.575 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 13 smd rect (at 2.85 -3.575 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 14 smd rect (at 2.85 -2.925 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 104 "/PinPoint Bus Switch/CFG3_OUT1")) (pad 15 smd rect (at 2.85 -2.275 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 103 "/PinPoint Bus Switch/CFG3_OUT0")) (pad 16 smd rect (at 2.85 -1.625 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 37 "/PinPoint Bus Switch/CFG2_OUT1")) (pad 17 smd rect (at 2.85 -0.975 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 36 "/PinPoint Bus Switch/CFG2_OUT0")) (pad 18 smd rect (at 2.85 -0.325 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 28 "/PinPoint Bus Switch/CFG1_OUT1")) (pad 19 smd rect (at 2.85 0.325 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 27 "/PinPoint Bus Switch/CFG1_OUT0")) (pad 20 smd rect (at 2.85 0.975 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 19 "/PinPoint Bus Switch/CFG0_OUT1")) (pad 21 smd rect (at 2.85 1.625 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 82 "/PinPoint Edison/CFG0")) (pad 22 smd rect (at 2.85 2.275 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 23 smd rect (at 2.85 2.925 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (pad 24 smd rect (at 2.85 3.575 270) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 5 +3V3)) (model Housings_SSOP.3dshapes/TSSOP-24_4.4x7.8mm_Pitch0.65mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module polypoint:XTAL_2.50mm_2.00mm_4PAD (layer B.Cu) (tedit 55DB1C0F) (tstamp 55DB4642) (at 54.4 83.75 90) (path /55D7B8EE/55D95D9F) (fp_text reference X1 (at 0 2.54 90) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value CRYSTAL_SMD_4 (at 0 -2.54 90) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_circle (center -1.651 1.016) (end -1.524 1.016) (layer B.SilkS) (width 0.15)) (fp_line (start -0.3 -1.25) (end 0.3 -1.25) (layer B.SilkS) (width 0.15)) (fp_line (start -0.3 1.25) (end 0.3 1.25) (layer B.SilkS) (width 0.15)) (fp_line (start 1 0.4) (end 1 -0.4) (layer B.SilkS) (width 0.15)) (fp_line (start -1 0.4) (end -1 -0.4) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.775 0.925 90) (size 0.9 1) (layers B.Cu B.Paste B.Mask) (net 12 "Net-(C25-Pad1)")) (pad 2 smd rect (at -0.775 -0.925 90) (size 0.9 1) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 4 smd rect (at 0.775 0.925 90) (size 0.9 1) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 3 smd rect (at 0.775 -0.925 90) (size 0.9 1) (layers B.Cu B.Paste B.Mask) (net 13 "Net-(C26-Pad1)")) ) (module Housings_SSOP:TSSOP-8_3x3mm_Pitch0.65mm (layer B.Cu) (tedit 54130A77) (tstamp 55DB856F) (at 64.7 84.8) (descr "TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)") (tags "SSOP 0.65") (path /55D9334F/55DBAB16) (attr smd) (fp_text reference U17 (at 0 2.55) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value P82B96-PP (at 0 -2.55) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -2.95 1.8) (end -2.95 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start 2.95 1.8) (end 2.95 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.95 1.8) (end 2.95 1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -2.95 -1.8) (end 2.95 -1.8) (layer B.CrtYd) (width 0.05)) (fp_line (start -1.625 1.625) (end -1.625 1.4) (layer B.SilkS) (width 0.15)) (fp_line (start 1.625 1.625) (end 1.625 1.4) (layer B.SilkS) (width 0.15)) (fp_line (start 1.625 -1.625) (end 1.625 -1.4) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 -1.625) (end -1.625 -1.4) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 1.625) (end 1.625 1.625) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer B.SilkS) (width 0.15)) (fp_line (start -1.625 1.4) (end -2.7 1.4) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -2.15 0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 102 "/PinPoint Bus Switch/I2C3_SDA")) (pad 2 smd rect (at -2.15 0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 72 "Net-(R35-Pad2)")) (pad 3 smd rect (at -2.15 -0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 72 "Net-(R35-Pad2)")) (pad 4 smd rect (at -2.15 -0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (pad 5 smd rect (at 2.15 -0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 71 "Net-(R34-Pad2)")) (pad 6 smd rect (at 2.15 -0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 71 "Net-(R34-Pad2)")) (pad 7 smd rect (at 2.15 0.325) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 105 "/PinPoint Bus Switch/I2C3_SCL")) (pad 8 smd rect (at 2.15 0.975) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask) (net 98 "Net-(C38-Pad2)")) (model Housings_SSOP.3dshapes/TSSOP-8_3x3mm_Pitch0.65mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5415CBB8) (tstamp 55DBA740) (at 55.2 92.6 270) (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)") (tags "resistor 0402") (path /55D74741/55DCEDD0) (attr smd) (fp_text reference R4 (at 0 1.8 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 10K (at 0 -1.8 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 0.65) (end 0.95 0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 -0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start -0.95 0.65) (end -0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.95 0.65) (end 0.95 -0.65) (layer B.CrtYd) (width 0.05)) (fp_line (start 0.25 0.525) (end -0.25 0.525) (layer B.SilkS) (width 0.15)) (fp_line (start -0.25 -0.525) (end 0.25 -0.525) (layer B.SilkS) (width 0.15)) (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 108 "Net-(R4-Pad1)")) (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask) (net 4 GND)) (model Resistors_SMD.3dshapes/R_0402.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (module polypoint:USB_Micro-B_Vert (layer F.Cu) (tedit 55DB5BE0) (tstamp 55DB672C) (at 74.75 80.9009 270) (descr "Micro USB Type B Receptacle") (tags "USB USB_B USB_micro USB_OTG") (path /55D74741/55D8C924) (attr smd) (fp_text reference P13 (at 0 -2.032 270) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value USB_B (at 0 3.556 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -4 2.15) (end 4 2.15) (layer F.SilkS) (width 0.15)) (fp_line (start -4 -0.75) (end 4 -0.75) (layer F.SilkS) (width 0.15)) (fp_line (start 4 -0.75) (end 4 2.15) (layer F.SilkS) (width 0.15)) (fp_line (start -4 2.15) (end -4 -0.75) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -1.3009 0.25) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 10 +5V)) (pad 2 smd rect (at -0.6509 0.25) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 7 "Net-(C7-Pad1)")) (pad 3 smd rect (at -0.0009 0.25) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 8 "Net-(C8-Pad1)")) (pad 4 smd rect (at 0.6491 0.25) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 5 smd rect (at 1.2991 0.25) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (net 4 GND)) (pad 6 thru_hole oval (at 0 2.15) (size 1.1 2.2) (drill oval 0.5 1.6) (layers *.Cu *.Mask F.SilkS)) (pad 6 thru_hole oval (at -2.8 0 270) (size 1.8 1.1) (drill oval 1.2 0.5) (layers *.Cu *.Mask F.SilkS)) (pad 6 thru_hole oval (at 2.8 0 270) (size 1.8 1.1) (drill oval 1.2 0.5) (layers *.Cu *.Mask F.SilkS)) ) (gr_line (start 58.43 61.5) (end 36.4 61.5) (layer Edge.Cuts) (width 0.1)) (gr_line (start 58.43 67.5) (end 58.43 61.5) (layer Edge.Cuts) (width 0.1)) (gr_line (start 60.33 67.5) (end 58.43 67.5) (layer Edge.Cuts) (width 0.1)) (gr_line (start 60.33 61.5) (end 60.33 67.5) (layer Edge.Cuts) (width 0.1)) (gr_line (start 86.4 61.5) (end 60.33 61.5) (layer Edge.Cuts) (width 0.1)) (gr_line (start 86.4 83.55) (end 86.4 61.5) (layer Edge.Cuts) (width 0.1)) (gr_line (start 80.4 83.55) (end 86.4 83.55) (layer Edge.Cuts) (width 0.1)) (gr_line (start 80.4 85.45) (end 80.4 83.55) (layer Edge.Cuts) (width 0.1)) (gr_line (start 86.4 85.45) (end 80.4 85.45) (layer Edge.Cuts) (width 0.1)) (gr_line (start 86.4 111.5) (end 86.4 85.45) (layer Edge.Cuts) (width 0.1)) (gr_line (start 64.33 111.5) (end 86.4 111.5) (layer Edge.Cuts) (width 0.1)) (gr_line (start 64.33 105.5) (end 64.33 111.5) (layer Edge.Cuts) (width 0.1)) (gr_line (start 62.43 105.5) (end 64.33 105.5) (layer Edge.Cuts) (width 0.1)) (gr_line (start 62.43 111.5) (end 62.43 105.5) (layer Edge.Cuts) (width 0.1)) (gr_line (start 36.4 111.5) (end 62.43 111.5) (layer Edge.Cuts) (width 0.1)) (gr_line (start 36.4 96.65) (end 36.4 111.5) (layer Edge.Cuts) (width 0.1)) (gr_line (start 28 96.65) (end 36.4 96.65) (layer Edge.Cuts) (width 0.1)) (gr_line (start 28 85.45) (end 28 96.65) (layer Edge.Cuts) (width 0.1)) (gr_line (start 36.4 85.45) (end 28 85.45) (layer Edge.Cuts) (width 0.1)) (gr_line (start 36.4 83.55) (end 36.4 85.45) (layer Edge.Cuts) (width 0.1)) (gr_line (start 28 83.55) (end 36.4 83.55) (layer Edge.Cuts) (width 0.1)) (gr_line (start 28 76.35) (end 28 83.55) (layer Edge.Cuts) (width 0.1)) (gr_line (start 36.4 76.35) (end 28 76.35) (layer Edge.Cuts) (width 0.1)) (gr_line (start 36.4 61.5) (end 36.4 76.35) (layer Edge.Cuts) (width 0.1)) )