(kicad_pcb
	(version 20260206)
	(generator "pcbnew")
	(generator_version "10.0")
	(general
		(thickness 1.6)
		(legacy_teardrops no)
	)
	(paper "A4")
	(title_block
		(title "Via Exerciser - all via types on one daisy-chain net")
		(rev "A")
		(comment 1 "CHAIN net: F.Cu > uvia > In1 > blind > In2 > buried > In4 > uvia > B.Cu > through > F.Cu")
	)
	(layers
		(0 "F.Cu" signal)
		(4 "In1.Cu" signal)
		(6 "In2.Cu" signal)
		(8 "In3.Cu" signal)
		(10 "In4.Cu" signal)
		(2 "B.Cu" signal)
		(5 "F.SilkS" user "F.Silkscreen")
		(7 "B.SilkS" user "B.Silkscreen")
		(1 "F.Mask" user)
		(3 "B.Mask" user)
		(17 "Dwgs.User" user "User.Drawings")
		(19 "Cmts.User" user "User.Comments")
		(25 "Edge.Cuts" user)
		(27 "Margin" user)
		(31 "F.CrtYd" user "F.Courtyard")
		(29 "B.CrtYd" user "B.Courtyard")
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 1"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.0175)
			)
			(layer "dielectric 2"
				(type "core")
				(thickness 0.24)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.0175)
			)
			(layer "dielectric 3"
				(type "prepreg")
				(thickness 0.71)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In3.Cu"
				(type "copper")
				(thickness 0.0175)
			)
			(layer "dielectric 4"
				(type "core")
				(thickness 0.24)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In4.Cu"
				(type "copper")
				(thickness 0.0175)
			)
			(layer "dielectric 5"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(copper_finish "ENIG")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0)
		(allow_soldermask_bridges_in_footprints no)
		(tenting
			(front yes)
			(back yes)
		)
		(covering
			(front no)
			(back no)
		)
		(plugging
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			(back no)
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		(capping no)
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		(pcbplotparams
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			(disableapertmacros no)
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			(usegerberattributes yes)
			(usegerberadvancedattributes yes)
			(creategerberjobfile yes)
			(dashed_line_dash_ratio 12)
			(dashed_line_gap_ratio 3)
			(svgprecision 4)
			(plotframeref no)
			(mode 1)
			(useauxorigin no)
			(pdf_front_fp_property_popups yes)
			(pdf_back_fp_property_popups yes)
			(pdf_metadata yes)
			(pdf_single_document no)
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			(dxfimperialunits yes)
			(dxfusepcbnewfont yes)
			(psnegative no)
			(psa4output no)
			(plot_black_and_white yes)
			(sketchpadsonfab no)
			(plotpadnumbers no)
			(hidednponfab no)
			(sketchdnponfab yes)
			(crossoutdnponfab yes)
			(subtractmaskfromsilk no)
			(outputformat 1)
			(mirror no)
			(drillshape 1)
			(scaleselection 1)
			(outputdirectory "")
		)
	)
	(footprint "TestPoint:TP_START"
		(layer "F.Cu")
		(uuid "10000000-0000-0000-0000-000000000001")
		(at 100 100)
		(property "Reference" "TP1"
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	(footprint "TestPoint:TP_END"
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	(footprint "TestPoint:TP_GND"
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		(uuid "30000000-0000-0000-0000-000000000001")
		(at 100 105)
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			(layer "F.SilkS")
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	(footprint "TestPoint:TP_GND_B"
		(layer "B.Cu")
		(uuid "70000000-0000-0000-0000-000000000001")
		(at 130 105)
		(property "Reference" "TP4"
			(at 0 -1.5 0)
			(layer "B.SilkS")
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		)
		(embedded_fonts no)
	)
	(gr_rect
		(start 92 90)
		(end 138 112)
		(stroke
			(width 0.1)
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		)
		(fill no)
		(layer "Edge.Cuts")
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	(gr_text "VIA EXERCISER"
		(at 115 92.5 0)
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	(gr_text "uvia In4-B"
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	(segment
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	(segment
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		(size 0.2)
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		(size 0.45)
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	(via
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