(kicad_pcb
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(general
		(thickness 0.19)
		(legacy_teardrops no)
	)
	(paper "A4")
	(layers
		(0 "F.Cu" signal)
		(2 "B.Cu" signal)
		(9 "F.Adhes" user "F.Adhesive")
		(11 "B.Adhes" user "B.Adhesive")
		(13 "F.Paste" user)
		(15 "B.Paste" user)
		(5 "F.SilkS" user "F.Silkscreen")
		(7 "B.SilkS" user "B.Silkscreen")
		(1 "F.Mask" user)
		(3 "B.Mask" user)
		(17 "Dwgs.User" user "User.Drawings")
		(19 "Cmts.User" user "User.Comments")
		(21 "Eco1.User" user "User.Eco1")
		(23 "Eco2.User" user "User.Eco2")
		(25 "Edge.Cuts" user)
		(27 "Margin" user)
		(31 "F.CrtYd" user "F.Courtyard")
		(29 "B.CrtYd" user "B.Courtyard")
		(35 "F.Fab" user)
		(33 "B.Fab" user)
		(39 "User.1" user)
		(41 "User.2" user)
		(43 "User.3" user)
		(45 "User.4" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 1"
				(type "core")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(copper_finish "None")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0)
		(allow_soldermask_bridges_in_footprints no)
		(tenting front back)
		(pcbplotparams
			(layerselection 0x00000000_00000000_55555555_57557573)
			(plot_on_all_layers_selection 0x00000000_00000000_00000000_00000000)
			(disableapertmacros no)
			(usegerberextensions no)
			(usegerberattributes yes)
			(usegerberadvancedattributes yes)
			(creategerberjobfile yes)
			(dashed_line_dash_ratio 12.000000)
			(dashed_line_gap_ratio 3.000000)
			(svgprecision 4)
			(plotframeref no)
			(mode 1)
			(useauxorigin no)
			(hpglpennumber 1)
			(hpglpenspeed 20)
			(hpglpendiameter 15.000000)
			(pdf_front_fp_property_popups yes)
			(pdf_back_fp_property_popups yes)
			(pdf_metadata yes)
			(pdf_single_document no)
			(dxfpolygonmode yes)
			(dxfimperialunits yes)
			(dxfusepcbnewfont yes)
			(psnegative no)
			(psa4output no)
			(plot_black_and_white yes)
			(sketchpadsonfab no)
			(plotpadnumbers no)
			(hidednponfab no)
			(sketchdnponfab yes)
			(crossoutdnponfab yes)
			(subtractmaskfromsilk no)
			(outputformat 1)
			(mirror no)
			(drillshape 0)
			(scaleselection 1)
			(outputdirectory "/production")
		)
	)
	(net 0 "")
	(net 1 "GND")
	(net 2 "Net-(U1-V+)")
	(net 3 "Net-(U1-ALERT)")
	(net 4 "Net-(U1-SCL)")
	(net 5 "Net-(U1-SDA)")
	(net 6 "unconnected-(U2-MTDI-Pad17)")
	(net 7 "unconnected-(U2-MTMS-Pad21)")
	(net 8 "unconnected-(U2-GND-Pad16)")
	(net 9 "unconnected-(U2-MTCK-Pad22)")
	(net 10 "unconnected-(U2-5V-Pad14)")
	(net 11 "unconnected-(U2-BAT-Pad15)")
	(net 12 "unconnected-(U2-MTDO-Pad18)")
	(net 13 "unconnected-(U2-CHIP_EN-Pad19)")
	(net 14 "unconnected-(U2-GND-Pad20)")
	(net 15 "Net-(U2-PA02_A0_D0)")
	(net 16 "Net-(U2-PA9_A5_D5_SCL)")
	(net 17 "Net-(U2-PB08_A6_D6_TX)")
	(net 18 "unconnected-(U2-PA5_A9_D9_MISO-Pad10)")
	(net 19 "unconnected-(U2-PA7_A8_D8_SCK-Pad9)")
	(net 20 "unconnected-(U2-PA6_A10_D10_MOSI-Pad11)")
	(net 21 "unconnected-(U2-PB09_A7_D7_RX-Pad8)")
	(net 22 "unconnected-(U2-PA11_A3_D3-Pad4)")
	(net 23 "unconnected-(U2-PA4_A1_D1-Pad2)")
	(net 24 "unconnected-(U2-PA10_A2_D2-Pad3)")
	(footprint "xiao:XIAO-ESP32-C3-SMD"
		(layer "F.Cu")
		(uuid "03a0fc05-2c6b-43b1-9199-e830ef474091")
		(at 216 78.5802 -90)
		(property "Reference" "U2"
			(at 7.112 -21.336 90)
			(layer "F.SilkS")
			(uuid "415d0ecc-624b-4189-a417-110a9d9ede43")
			(effects
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				)
				(justify right top)
			)
		)
		(property "Value" "XIAO-ESP32-C3-SMD"
			(at 8.89 -10.795 90)
			(layer "F.Fab")
			(uuid "b95ed0db-0565-44e4-94d7-a00081099050")
			(effects
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		)
		(property "Datasheet" ""
			(at 0 0 270)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
			(uuid "3da080ac-71f5-42ff-b8ad-fd37651b21ea")
			(effects
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					(thickness 0.15)
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		)
		(property "Description" ""
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			(layer "F.Fab")
			(hide yes)
			(uuid "d92ab58f-7ca0-4ddd-b280-ec3b5f1ad58c")
			(effects
				(font
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		)
		(path "/4fb3b93f-3a80-401e-85da-5623c6f77988")
		(sheetname "/")
		(sheetfile "tmp119_stick.kicad_sch")
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			(layer "F.SilkS")
			(uuid "e54ac727-3164-43f3-b980-4d263a449695")
		)
		(fp_circle
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			(stroke
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			(fill yes)
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			(stroke
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		(pad "1" smd roundrect
			(at 0.835 -18.12 270)
			(size 2.75 2)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.25)
			(net 15 "Net-(U2-PA02_A0_D0)")
			(pinfunction "PA02_A0_D0")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 45)
			(teardrops
				(best_length_ratio 0.5)
				(max_length 1)
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			(roundrect_rratio 0.25)
			(net 23 "unconnected-(U2-PA4_A1_D1-Pad2)")
			(pinfunction "PA4_A1_D1")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 45)
			(teardrops
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			(roundrect_rratio 0.25)
			(net 24 "unconnected-(U2-PA10_A2_D2-Pad3)")
			(pinfunction "PA10_A2_D2")
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			(net 22 "unconnected-(U2-PA11_A3_D3-Pad4)")
			(pinfunction "PA11_A3_D3")
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			(net 5 "Net-(U1-SDA)")
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