{ "meta": { "index_name": "newtype AI Index", "index_ticker": "NTAI", "as_of": "2026-07-19", "effective_date": "2026-07-17", "effective_date_note": "2026-07-19 is a Sunday. Index uses 2026-07-17 (the last trading day before the baseline as_of date) as the inception NAV reference.", "framework": "newtype AI Stack seven-layer", "source_baseline": "https://github.com/newtype-01/ai-signal-system/blob/main/reports/baseline-2026-07-19.md", "source_universe": "https://github.com/newtype-01/ai-signal-system/blob/main/config/universe.json", "disclaimer": "Research-only. Not personalized investment advice. Not a buy or sell signal. Weights are model targets, not actual holdings." }, "constituents": [ { "ticker": "NVDA", "name": "NVIDIA Corporation", "primary_layer": 4, "layer_name": "Compute Hardware", "tier": "Core", "weight": 0.22, "scarcity": "core_scarcity", "shovel_vs_gold": "shovel", "endgame_view": "endgame_candidate", "role": "GPU算力硬件核心,定义加速计算与互联架构", "watch_reason": "数据中心收入、毛利率、下一季度指引是算力层最直接温度计", "stack_layers": [ 4, 3, 5 ], "latest_price": 206.64, "day_change_pct": 2.93 }, { "ticker": "MU", "name": "Micron Technology, Inc.", "primary_layer": 3, "layer_name": "Interconnect & Memory", "tier": "Core", "weight": 0.22, "scarcity": "secondary_scarcity", "shovel_vs_gold": "shovel", "endgame_view": "cyclical_bridge", "role": "HBM / DRAM存储,AI内存瓶颈环节", "watch_reason": "HBM供需是核心假设;最大风险是市场发现HBM不再稀缺,估值从AI基建股回落到存储周期股", "stack_layers": [ 3 ], "latest_price": 829.5, "day_change_pct": 0.79 }, { "ticker": "VRT", "name": "Vertiv Holdings Co", "primary_layer": 2, "layer_name": "Infrastructure", "tier": "Core", "weight": 0.22, "scarcity": "secondary_scarcity", "shovel_vs_gold": "shovel", "endgame_view": "endgame_candidate", "role": "数据中心供配电与液冷基础设施", "watch_reason": "订单积压与book-to-bill反映数据中心落地节奏", "stack_layers": [ 2 ], "latest_price": 263.05, "day_change_pct": 8.89 }, { "ticker": "CEG", "name": "Constellation Energy Corporation", "primary_layer": 1, "layer_name": "Energy", "tier": "N-Stack", "weight": 0.12, "scarcity": "secondary_scarcity", "shovel_vs_gold": "shovel", "endgame_view": "endgame_candidate", "role": "核电与电力供应,数据中心PPA对手方", "watch_reason": "电力是最长扩产周期(5-15年)的物理瓶颈,过渡期红利与并网约束并存", "stack_layers": [ 1 ], "latest_price": 273.71, "day_change_pct": 4.17 }, { "ticker": "TSM", "name": "Taiwan Semiconductor Manufacturing Company", "primary_layer": 4, "layer_name": "Compute Hardware", "tier": "Bridge", "weight": 0.1, "scarcity": "core_scarcity", "shovel_vs_gold": "shovel", "endgame_view": "endgame_candidate", "note": "Baseline universe marks TSM as Watch tier with 0-8% range; Index includes it as a Bridge position (10%) to reflect its core scarcity as the physical manufacturing base for AI compute.", "role": "先进制程与先进封装(CoWoS/SoIC)制造底座", "watch_reason": "AI芯片能否继续放量的物理约束;HPC收入占比与CoWoS供需是先行信号(本次未取finance基线,需补研)", "stack_layers": [ 4, 3 ], "latest_price": 406.11, "day_change_pct": 0.46 }, { "ticker": "MRVL", "name": "Marvell Technology, Inc.", "primary_layer": 4, "layer_name": "Compute Hardware", "tier": "N-Stack", "weight": 0.06, "scarcity": "secondary_scarcity", "shovel_vs_gold": "shovel", "endgame_view": "uncertain", "role": "定制ASIC与光互联/DSP,云厂商自研芯片合作方", "watch_reason": "自研ASIC与CPO/光互联路线切换的直接受益或受损方", "stack_layers": [ 4, 3 ], "latest_price": 193.77, "day_change_pct": 3.31 }, { "ticker": "NBIS", "name": "Nebius Group N.V.", "primary_layer": 5, "layer_name": "Cloud / IaaS", "tier": "N-Stack", "weight": 0.06, "scarcity": "replaceable", "shovel_vs_gold": "between", "endgame_view": "bridge", "role": "Neo-cloud算力租赁,高弹性算力服务", "watch_reason": "高弹性过渡期资产,商业模式可能被Hyperscaler收回;核心逻辑是算力短缺与大客户长期合同", "stack_layers": [ 5 ], "latest_price": 212.58, "day_change_pct": 11.64 } ], "totals": { "constituent_count": 7, "total_weight": 1.0, "layer_coverage": [ 1, 2, 3, 4, 5 ], "core_weight": 0.66, "n_stack_weight": 0.24, "bridge_weight": 0.1 }, "price_snapshot": { "latest_date": "2026-08-03", "prev_date": "2026-07-31" } }