(kicad_pcb (version 20221018) (generator pcbnew)
(general
(thickness 1.6)
)
(paper "A4")
(layers
(0 "F.Cu" signal)
(31 "B.Cu" signal)
(32 "B.Adhes" user "B.Adhesive")
(33 "F.Adhes" user "F.Adhesive")
(34 "B.Paste" user)
(35 "F.Paste" user)
(36 "B.SilkS" user "B.Silkscreen")
(37 "F.SilkS" user "F.Silkscreen")
(38 "B.Mask" user)
(39 "F.Mask" user)
(40 "Dwgs.User" user "User.Drawings")
(41 "Cmts.User" user "User.Comments")
(42 "Eco1.User" user "User.Eco1")
(43 "Eco2.User" user "User.Eco2")
(44 "Edge.Cuts" user)
(45 "Margin" user)
(46 "B.CrtYd" user "B.Courtyard")
(47 "F.CrtYd" user "F.Courtyard")
(48 "B.Fab" user)
(49 "F.Fab" user)
(50 "User.1" user)
(51 "User.2" user)
(52 "User.3" user)
(53 "User.4" user)
(54 "User.5" user)
(55 "User.6" user)
(56 "User.7" user)
(57 "User.8" user)
(58 "User.9" user)
)
(setup
(pad_to_mask_clearance 0)
(pcbplotparams
(layerselection 0x00010fc_ffffffff)
(plot_on_all_layers_selection 0x0000000_00000000)
(disableapertmacros false)
(usegerberextensions false)
(usegerberattributes true)
(usegerberadvancedattributes true)
(creategerberjobfile true)
(dashed_line_dash_ratio 12.000000)
(dashed_line_gap_ratio 3.000000)
(svgprecision 4)
(plotframeref false)
(viasonmask false)
(mode 1)
(useauxorigin false)
(hpglpennumber 1)
(hpglpenspeed 20)
(hpglpendiameter 15.000000)
(dxfpolygonmode true)
(dxfimperialunits true)
(dxfusepcbnewfont true)
(psnegative false)
(psa4output false)
(plotreference true)
(plotvalue true)
(plotinvisibletext false)
(sketchpadsonfab false)
(subtractmaskfromsilk false)
(outputformat 1)
(mirror false)
(drillshape 1)
(scaleselection 1)
(outputdirectory "")
)
)
(net 0 "")
(net 1 "+5V")
(net 2 "+3V3")
(net 3 "GND")
(net 4 "SDA")
(net 5 "SCL")
(net 6 "SCL_5V")
(net 7 "SDA_5V")
(net 8 "MISO")
(net 9 "CS#")
(net 10 "I²C_SDA")
(net 11 "ANALOG_IN1")
(net 12 "ANALOG_IN3")
(net 13 "ANALOG_OUT1")
(net 14 "ANALOG_OUT3")
(net 15 "MOSI")
(net 16 "SCK")
(net 17 "I²C_SCL")
(net 18 "N$15")
(net 19 "ANALOG_IN0")
(net 20 "ANALOG_IN2")
(net 21 "ANALOG_OUT0")
(net 22 "ANALOG_OUT2")
(net 23 "KOHERON-DO-PL_DIO0_N")
(net 24 "KOHERON-XX-PL_DIO1_N")
(net 25 "PL_DIO2_N")
(net 26 "PL_DIO0_P")
(net 27 "PL_DIO1_P-KOHERON-XX")
(net 28 "PL_DIO2_P-KOHERON-XX")
(net 29 "PL_DIO4_N")
(net 30 "KOHERON-XX-PL_DIO7_N")
(net 31 "PL_DIO7_P-KOHERON-XX")
(net 32 "PL_DIO6_P-CLK")
(net 33 "PL_DIO5_P-MOSI")
(net 34 "PL_DIO4_P-MISO")
(net 35 "MOSI2")
(net 36 "MISO2")
(net 37 "CLK2")
(net 38 "PL_DIO6_N_CS2")
(net 39 "PL_DIO3_P_CS3")
(net 40 "CS1")
(net 41 "CS2")
(net 42 "CS3")
(net 43 "PL_DIO3_N_CS1")
(net 44 "CS4")
(net 45 "MOSI1")
(net 46 "MISO1")
(net 47 "CLK1")
(net 48 "CS#'")
(net 49 "TEC_ON/OFF")
(net 50 "SDSYNC")
(footprint "RedpiLite:SOT23-3" (layer "F.Cu")
(tstamp 0ed203ea-762e-431a-8145-a87f30d1e43c)
(at 145.473077 95.645462 90)
(fp_text reference "T4" (at -1.0795 1.0795) (layer "F.SilkS") hide
(effects (font (size 0.3048 0.3048) (thickness 0.1016)) (justify left))
(tstamp dc2061c1-b341-4e01-bb98-e0f7e4f6de51)
)
(fp_text value "BSS138" (at 0.762 0.889) (layer "BAD INDEX!") hide
(effects (font (size 0.3048 0.3048) (thickness 0.1016)) (justify left))
(tstamp 2abee109-2d82-45b3-ad1b-4d3344c236c8)
)
(pad "1" smd rect (at -0.95 1 90) (size 0.8 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
(net 2 "+3V3") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 43fcc84c-251c-4a74-8381-840d2b045e03))
(pad "2" smd rect (at 0.95 1 90) (size 0.8 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
(net 5 "SCL") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e4eaa2ed-bcb6-4b68-a4f1-e7100ad07ac5))
(pad "3" smd rect (at 0 -1.1 90) (size 0.8 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
(net 6 "SCL_5V") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9e353ede-e4db-423a-95ec-4c25699e8a47))
)
(footprint "RedpiLite:SOT23-3" (layer "F.Cu")
(tstamp 14edc876-5670-4ac2-bcdd-f77f24835d37)
(at 145.473077 89.295462 90)
(fp_text reference "T6" (at -1.0795 1.0795) (layer "F.SilkS") hide
(effects (font (size 0.3048 0.3048) (thickness 0.1016)) (justify left))
(tstamp bd51ed52-b564-480b-b019-e03871d37b74)
)
(fp_text value "BSS138" (at 0.762 0.889) (layer "BAD INDEX!") hide
(effects (font (size 0.3048 0.3048) (thickness 0.1016)) (justify left))
(tstamp 1607fb8a-f7e4-4d0a-88be-27429cd7bd3c)
)
(pad "1" smd rect (at -0.95 1 90) (size 0.8 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
(net 2 "+3V3") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f3313f5b-c8fe-4a0a-b1d8-9300c67c0403))
(pad "2" smd rect (at 0.95 1 90) (size 0.8 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
(net 43 "PL_DIO3_N_CS1") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ffe64540-f3a0-4573-822b-79a1d8a8fb04))
(pad "3" smd rect (at 0 -1.1 90) (size 0.8 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
(net 40 "CS1") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8c76e5a7-fccd-461a-800f-a229c40118a6))
)
(footprint "RedpiLite:2X13" (layer "F.Cu")
(tstamp 155c089b-05ae-4b9c-940b-73e925464fca)
(at 174.683077 110.885462 90)
(descr "PIN HEADER")
(fp_text reference "E2" (at 18.415 1.27) (layer "F.SilkS") hide
(effects (font (size 1.143 1.143) (thickness 0.127)) (justify right))
(tstamp 0de610d8-58a5-430c-8533-6f2809370527)
)
(fp_text value "" (at -16.51 4.445 90) (layer "BAD INDEX!") hide
(effects (font (size 1.1684 1.1684) (thickness 0.1016)) (justify left))
(tstamp 7cf560d5-71be-4786-ae00-e5fabcd5c289)
)
(pad "1" thru_hole roundrect (at -15.24 1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 1 "+5V") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 21c12ad2-f31c-4ba7-8548-405f660571a4))
(pad "2" thru_hole roundrect (at -15.24 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 81caabfe-bdc3-4fb5-9ff9-c6e90f590ae6))
(pad "3" thru_hole roundrect (at -12.7 1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 15 "MOSI") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4af6d9dc-ebf8-4e0d-b972-461e3f5940ec))
(pad "4" thru_hole roundrect (at -12.7 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 8 "MISO") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d7c3334a-a57a-4d70-b515-ccfc356aee48))
(pad "5" thru_hole roundrect (at -10.16 1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 16 "SCK") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 27571747-e864-4df8-abd3-08ed6f5479f4))
(pad "6" thru_hole roundrect (at -10.16 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 9 "CS#") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8091f2fd-d4f2-4af5-a0e9-806789df2a1d))
(pad "7" thru_hole roundrect (at -7.62 1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp add4f457-afa0-4b45-90cd-f9e31fe8c648))
(pad "8" thru_hole roundrect (at -7.62 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 15a07454-54f0-4a34-85a7-2962cd677a63))
(pad "9" thru_hole roundrect (at -5.08 1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 17 "I²C_SCL") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6b11c62c-dc55-4369-9307-c2ecd2f79dc6))
(pad "10" thru_hole roundrect (at -5.08 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 10 "I²C_SDA") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f5e03872-c12a-4318-96eb-a5673519ff01))
(pad "11" thru_hole roundrect (at -2.54 1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 18 "N$15") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 66cafcbf-55fa-46e6-9dca-edf891145c12))
(pad "12" thru_hole roundrect (at -2.54 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 3 "GND") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c7937285-a8ca-4234-8a34-970f7d7f2db8))
(pad "13" thru_hole roundrect (at 0 1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 19 "ANALOG_IN0") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a9826ee3-660b-49e7-a9c8-7f181745dd71))
(pad "14" thru_hole roundrect (at 0 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 11 "ANALOG_IN1") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 31a7a633-d776-42b7-9e90-03a89812c798))
(pad "15" thru_hole roundrect (at 2.54 1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 20 "ANALOG_IN2") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5f815a22-6aa4-4fe7-aa3f-7ea4c349aa09))
(pad "16" thru_hole roundrect (at 2.54 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 12 "ANALOG_IN3") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4b7f832e-1d8a-40b5-8262-30bce99e98c6))
(pad "17" thru_hole roundrect (at 5.08 1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 21 "ANALOG_OUT0") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 924fc882-c350-45dc-a14c-4dd2fd7a1bb4))
(pad "18" thru_hole roundrect (at 5.08 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 13 "ANALOG_OUT1") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp da89f5a5-b98f-44c7-a2c5-0dbc207a0815))
(pad "19" thru_hole roundrect (at 7.62 1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 22 "ANALOG_OUT2") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b990fc8d-8c34-4cde-bc42-955c2d6616bf))
(pad "20" thru_hole roundrect (at 7.62 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 14 "ANALOG_OUT3") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8696d595-7c1e-4a0f-9d35-4864a7b4edbf))
(pad "21" thru_hole roundrect (at 10.16 1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 3 "GND") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 06b7860c-834f-4763-acce-4f1aaedd12dd))
(pad "22" thru_hole roundrect (at 10.16 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 3 "GND") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b78aa3aa-8d23-4949-9315-315e06c1396a))
(pad "23" thru_hole roundrect (at 12.7 1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 492b7272-7605-417d-8e25-1e6c70d17bbd))
(pad "24" thru_hole roundrect (at 12.7 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f11a67fd-ba57-42d1-8a2c-9de04f371f1d))
(pad "25" thru_hole roundrect (at 15.24 1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 3 "GND") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp fdbc1f7f-52b6-41f4-9b77-6923b343b879))
(pad "26" thru_hole roundrect (at 15.24 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
(net 3 "GND") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp af7d2691-bc46-4812-b1a1-49f09f64339a))
)
(footprint "RedpiLite:1X02" (layer "F.Cu")
(tstamp 26f48a51-cf9b-4089-8849-6a653a8967a7)
(at 116.263077 124.855462)
(descr "PIN HEADER")
(fp_text reference "UNK3V3" (at -1.3462 3.5687) (layer "F.SilkS") hide
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(net 2 "+3V3") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 02b5fba5-e3fa-4187-92b5-aad56709b60b))
(pad "2" thru_hole oval (at 1.27 0 90) (size 3.048 1.524) (drill 1.016) (layers "*.Cu" "*.Mask")
(net 3 "GND") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 498dbecc-e579-48fe-af65-ad66e8673707))
)
(footprint "RedpiLite:SOT23-3" (layer "F.Cu")
(tstamp 28b0c50d-6ecb-4451-be79-2601f228ac4c)
(at 145.473077 98.820462 90)
(fp_text reference "T3" (at -1.0795 1.0795) (layer "F.SilkS") hide
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(fp_text value "BSS138" (at 0.762 0.889) (layer "BAD INDEX!") hide
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(pad "1" smd rect (at -0.95 1 90) (size 0.8 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
(net 2 "+3V3") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9b7e2828-6263-4879-b91f-f1996fffde89))
(pad "2" smd rect (at 0.95 1 90) (size 0.8 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
(net 33 "PL_DIO5_P-MOSI") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 27f3dad5-8b26-48f8-86e9-963477c9b0e2))
(pad "3" smd rect (at 0 -1.1 90) (size 0.8 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
(net 35 "MOSI2") (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 1c7866da-e4e7-473d-810f-24ed9ce185fe))
)
(footprint "RedpiLite:1X02" (layer "F.Cu")
(tstamp 338ca0c4-6236-444a-9fed-54144da5ec7f)
(at 117.533077 105.805462 180)
(descr "PIN HEADER")
(fp_text reference "JUMP0" (at 4.5212 1.6637 90) (layer "F.SilkS") hide
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(fp_text value "" (at -2.54 3.175) (layer "BAD INDEX!") hide
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(pad "1" thru_hole oval (at -1.27 0 270) (size 3.048 1.524) (drill 1.016) (layers "*.Cu" "*.Mask")
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