(kicad_pcb (version 20211014) (generator pcbnew)

  (general
    (thickness 1.6)
  )

  (paper "A4")
  (layers
    (0 "F.Cu" signal "Top Layer")
    (31 "B.Cu" signal "Bottom Layer")
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user "Bottom Paste")
    (35 "F.Paste" user "Top Paste")
    (36 "B.SilkS" user "Bottom Overlay")
    (37 "F.SilkS" user "Top Overlay")
    (38 "B.Mask" user "Bottom Solder")
    (39 "F.Mask" user "Top Solder")
    (40 "Dwgs.User" user "Mechanical 10")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "Mechanical 11")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user "Mechanical 13")
    (49 "F.Fab" user "Mechanical 12")
    (50 "User.1" user "Mechanical 1")
    (51 "User.2" user "Top 3D Body")
    (52 "User.3" user "Top Courtyard")
    (53 "User.4" user "Mechanical 4")
    (54 "User.5" user "Top Assembly")
    (55 "User.6" user "Mechanical 6")
    (56 "User.7" user "Mechanical 7")
    (57 "User.8" user "Mechanical 8")
    (58 "User.9" user "Mechanical 9")
  )

  (setup
    (pad_to_mask_clearance 0)
    (aux_axis_origin 68.3641 174.2186)
    (grid_origin 68.3641 174.2186)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )

  (net 0 "")
  (net 1 "VCC_3V3_PCB_LS")
  (net 2 "SDA_PCB")
  (net 3 "SCL_PCB")
  (net 4 "GND_PCB_LS")

  (footprint "Vault:AMS-FN-6-2400X2000DE_V" (layer "F.Cu")
    (tedit 0) (tstamp 9f293d53-b715-4371-a4ec-01eb3471f65c)
    (at 148.5011 105.0036)
    (fp_text reference "U1" (at -0.900671 -1.666248 unlocked) (layer "F.SilkS") hide
      (effects (font (size 1.524 1.524) (thickness 0.254)) (justify left bottom))
      (tstamp 4f5b702f-df66-4934-ae58-87d9cb3c318d)
    )
    (fp_text value "TSL25911FN" (at -1.8923 3.6703 unlocked) (layer "F.SilkS") hide
      (effects (font (size 1.524 1.524) (thickness 0.254)) (justify left bottom))
      (tstamp 7c4feb89-0205-45b4-b9f3-216a382475fa)
    )
    (fp_line (start 1.049998 1.249997) (end 1.049998 1.225) (layer "F.SilkS") (width 0.2) (tstamp 2992f41d-f374-410c-8e48-784bb8ce27f3))
    (fp_line (start -1.05 -1.225) (end -1.05 -1.25) (layer "F.SilkS") (width 0.2) (tstamp 429b4794-157c-434a-adbb-ef5a89e52a5e))
    (fp_line (start -1.05 -1.25) (end 1.049998 -1.25) (layer "F.SilkS") (width 0.2) (tstamp 485ad817-20d8-4cf7-8bc0-71fc0f7b533c))
    (fp_line (start -1.05 1.249997) (end 1.049998 1.249997) (layer "F.SilkS") (width 0.2) (tstamp 54bb8fe1-ebdc-4b41-b726-a7b914e230fc))
    (fp_line (start 1.049998 -1.225) (end 1.049998 -1.25) (layer "F.SilkS") (width 0.2) (tstamp 8a802606-23dd-441c-b638-497944f7e579))
    (fp_line (start -1.05 1.249997) (end -1.05 1.225) (layer "F.SilkS") (width 0.2) (tstamp b0f5800e-3998-4a40-b46b-fdcbf105c541))
    (fp_circle (center -1.9 -0.65) (end -1.9 -0.775) (layer "F.SilkS") (width 0.25) (fill none) (tstamp 13d5f6cd-e37f-4325-898a-6a50450b481d))
    (fp_line (start 0 0.5) (end 0 -0.500002) (layer "Eco1.User") (width 0.1) (tstamp 0b9c9b57-e18f-45c0-8559-ba078d9cb850))
    (fp_line (start -1.450002 1.35) (end -1.450002 -1.350002) (layer "Eco1.User") (width 0.05) (tstamp 2379b41f-e368-4063-adc6-7c4d7cd73018))
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    (fp_line (start 1.45 1.35) (end 1.45 -1.350002) (layer "Eco1.User") (width 0.05) (tstamp d2ef756d-8454-4e65-b3c6-7f1443997f97))
    (fp_line (start -1.450002 1.35) (end 1.45 1.35) (layer "Eco1.User") (width 0.05) (tstamp d84e1a3b-b596-47e9-8e4d-6dbba4e7f03b))
    (fp_line (start 0.999998 1.199998) (end 0.999998 -1.2) (layer "B.Fab") (width 0.1) (tstamp 60728102-d6f0-4393-9e8a-6ba8e239cf98))
    (fp_line (start -1 -1.2) (end 0.999998 -1.2) (layer "B.Fab") (width 0.1) (tstamp 7800817d-66bd-42d6-9095-3bdb9ac7fa03))
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    (fp_line (start -1 1.199998) (end 0.999998 1.199998) (layer "B.Fab") (width 0.1) (tstamp f34914d0-3607-4f52-9a72-dbc966470394))
    (fp_circle (center -0.200002 -0.400002) (end -0.200002 -0.800002) (layer "B.Fab") (width 0.1) (fill none) (tstamp 03171234-f14d-4f11-a6f4-5c2d8f6cfbfb))
    (pad "1" smd rect (at -0.75 -0.65 90) (size 0.35 1.2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "SCL_PCB") (solder_mask_margin 0.1016) (tstamp 93997f7d-17a3-4d29-bdca-33ac9d68e920))
    (pad "2" smd rect (at -0.75 0 90) (size 0.35 1.2) (layers "F.Cu" "F.Paste" "F.Mask")
      (solder_mask_margin 0.1016) (tstamp 41971a6b-1216-4a8b-b265-a55062c9c10e))
    (pad "3" smd rect (at -0.75 0.65 90) (size 0.35 1.2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "GND_PCB_LS") (solder_mask_margin 0.1016) (tstamp 0f2a06b2-629b-4ccf-b01e-a45d9acf52be))
    (pad "4" smd rect (at 0.75 0.65 90) (size 0.35 1.2) (layers "F.Cu" "F.Paste" "F.Mask")
      (solder_mask_margin 0.1016) (tstamp 016e4fc4-a18f-4df8-9104-1a26d217a107))
    (pad "5" smd rect (at 0.75 0 90) (size 0.35 1.2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "VCC_3V3_PCB_LS") (solder_mask_margin 0.1016) (tstamp 7c140f25-604c-4407-a9d1-195448eb6b74))
    (pad "6" smd rect (at 0.75 -0.65 90) (size 0.35 1.2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "SDA_PCB") (solder_mask_margin 0.1016) (tstamp 6e8ff37e-b440-4898-a306-290d0884467e))
  )

  (footprint "Vault:CAPC2013X135X45LL10T25" (layer "B.Cu")
    (tedit 0) (tstamp 204fccfe-5fc3-45aa-93e9-bf9470f5c9ca)
    (at 148.3741 108.6866)
    (fp_text reference "C1" (at 6.349751 -0.380667 90 unlocked) (layer "B.SilkS") hide
      (effects (font (size 1.524 1.524) (thickness 0.254)) (justify left bottom mirror))
      (tstamp 394d25bd-d3ef-42e9-8d16-4f0fca293569)
    )
    (fp_text value "1uF" (at 2.071497 5.170297 unlocked) (layer "B.SilkS") hide
      (effects (font (size 1.524 1.524) (thickness 0.254)) (justify left bottom mirror))
      (tstamp 0bcc0667-1bc0-4a12-91d3-47372bdfd6c1)
    )
    (fp_line (start -0.500002 0) (end 0.5 0) (layer "Eco1.User") (width 0.1) (tstamp 205cb822-aa85-4b91-98ba-1e53f82370d7))
    (fp_line (start 0 0.500002) (end 0 -0.5) (layer "Eco1.User") (width 0.1) (tstamp 4ab36a8f-9e85-40aa-9c87-e7b53d2e1a0a))
    (fp_line (start 1.35 0.8) (end 1.35 -0.799998) (layer "Eco1.User") (width 0.05) (tstamp 59f41d1d-13bc-4490-be52-81d8fbabe2ac))
    (fp_line (start -1.35 0.8) (end -1.35 -0.799998) (layer "Eco1.User") (width 0.05) (tstamp 5ca67ab5-a1d7-47c3-9471-6b0664437974))
    (fp_line (start -1.35 -0.799998) (end 1.35 -0.799998) (layer "Eco1.User") (width 0.05) (tstamp 712d7d89-b094-47a0-80c4-3cec97f90c7e))
    (fp_line (start -1.35 0.8) (end 1.35 0.8) (layer "Eco1.User") (width 0.05) (tstamp aa880f7b-2dce-47e0-be9a-2003f997337a))
    (fp_line (start -1.05 0.675002) (end -1.05 -0.675) (layer "B.Fab") (width 0.1) (tstamp 09c58fa0-a573-4b76-87b1-d8d530755bfa))
    (fp_line (start -1.05 -0.675) (end 1.049998 -0.675) (layer "B.Fab") (width 0.1) (tstamp ae1d28ab-e393-48d2-8bda-3f9e1076403c))
    (fp_line (start 1.049998 0.675002) (end 1.049998 -0.675) (layer "B.Fab") (width 0.1) (tstamp cb28a0e3-ff83-4e4c-b952-d43525636bbd))
    (fp_line (start -1.05 0.675002) (end 1.049998 0.675002) (layer "B.Fab") (width 0.1) (tstamp f9e7251f-0bc4-40d7-8bce-835fca224cf5))
    (pad "1" smd rect (at -0.75 0 270) (size 1.3 1) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 1 "VCC_3V3_PCB_LS") (tstamp b6e10756-2224-421f-893d-a79851f466de))
    (pad "2" smd rect (at 0.75 0 270) (size 1.3 1) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 4 "GND_PCB_LS") (tstamp febf7a1e-f6be-4756-96c4-d53d8a288f64))
  )

  (footprint "5-146130-1.PcbLib:TE_5-146130-1" (layer "B.Cu")
    (tedit 0) (tstamp 813485f8-a326-4130-a98e-c5ff1af46263)
    (at 148.5011 105.0036 180)
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    (pad "1" smd rect (at -2.605 1.27) (size 3.555 1.27) (layers "B.Cu" "B.Paste" "B.Mask")
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    (pad "2" smd rect (at 2.605 1.27) (size 3.555 1.27) (layers "B.Cu" "B.Paste" "B.Mask")
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    (pad "3" smd rect (at -2.605 -1.27) (size 3.555 1.27) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 3 "SCL_PCB") (tstamp 86c10143-56af-4e37-877e-14679fc4be22))
    (pad "4" smd rect (at 2.605 -1.27) (size 3.555 1.27) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 1 "VCC_3V3_PCB_LS") (tstamp a07ae0b8-e7d4-43a1-b192-49ae9da7983c))
    (model "${KIPRJMOD}/ALTIUM_EMBEDDED_MODELS/step_temp.STEP"
      (offset (xyz -0 -0 3.81))
      (scale (xyz 1 1 1))
      (rotate (xyz -3 -0 -90))
    )
  )

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