(kicad_pcb (version 20221018) (generator pcbnew) (general (thickness 1.6) ) (paper "A4") (layers (0 "F.Cu" signal) (31 "B.Cu" signal) (32 "B.Adhes" user "B.Adhesive") (33 "F.Adhes" user "F.Adhesive") (34 "B.Paste" user) (35 "F.Paste" user) (36 "B.SilkS" user "B.Silkscreen") (37 "F.SilkS" user "F.Silkscreen") (38 "B.Mask" user) (39 "F.Mask" user) (40 "Dwgs.User" user "User.Drawings") (41 "Cmts.User" user "User.Comments") (42 "Eco1.User" user "User.Eco1") (43 "Eco2.User" user "User.Eco2") (44 "Edge.Cuts" user) (45 "Margin" user) (46 "B.CrtYd" user "B.Courtyard") (47 "F.CrtYd" user "F.Courtyard") (48 "B.Fab" user) (49 "F.Fab" user) ) (setup (stackup (layer "F.SilkS" (type "Top Silk Screen")) (layer "F.Paste" (type "Top Solder Paste")) (layer "F.Mask" (type "Top Solder Mask") (color "Green") (thickness 0.01)) (layer "F.Cu" (type "copper") (thickness 0.035)) (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02)) (layer "B.Cu" (type "copper") (thickness 0.035)) (layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.01)) (layer "B.Paste" (type "Bottom Solder Paste")) (layer "B.SilkS" (type "Bottom Silk Screen")) (copper_finish "None") (dielectric_constraints no) ) (pad_to_mask_clearance 0) (grid_origin 84.419194 0) (pcbplotparams (layerselection 0x00010fc_ffffffff) (plot_on_all_layers_selection 0x0000000_00000000) (disableapertmacros false) (usegerberextensions false) (usegerberattributes false) (usegerberadvancedattributes false) (creategerberjobfile false) (dashed_line_dash_ratio 12.000000) (dashed_line_gap_ratio 3.000000) (svgprecision 6) (plotframeref false) (viasonmask false) (mode 1) (useauxorigin true) (hpglpennumber 1) (hpglpenspeed 20) (hpglpendiameter 15.000000) (dxfpolygonmode true) (dxfimperialunits true) (dxfusepcbnewfont true) (psnegative false) (psa4output false) (plotreference true) (plotvalue true) (plotinvisibletext false) (sketchpadsonfab false) (subtractmaskfromsilk false) 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