(kicad_pcb (version 20221018) (generator pcbnew)

  (general
    (thickness 1.6)
  )

  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )

  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 4)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )

  (net 0 "")
  (net 1 "+3.3V")
  (net 2 "GND")
  (net 3 "/SCL")
  (net 4 "Net-(IC1-SDO{slash}SA1)")
  (net 5 "unconnected-(IC1-INT-Pad7)")
  (net 6 "unconnected-(IC1-DRDY-Pad8)")
  (net 7 "/SDA")
  (net 8 "Net-(IC2-SDO{slash}SA0)")
  (net 9 "Net-(IC1-C1)")
  (net 10 "unconnected-(IC2-SDX-Pad2)")
  (net 11 "unconnected-(IC2-SCX-Pad3)")
  (net 12 "unconnected-(IC2-INT1-Pad4)")
  (net 13 "unconnected-(IC2-INT2-Pad9)")
  (net 14 "unconnected-(IC2-OCS_AUX-Pad10)")
  (net 15 "unconnected-(IC2-SDO_AUX-Pad11)")

  (footprint "Capacitor_SMD:C_0402_1005Metric_Pad0.74x0.62mm_HandSolder" (layer "F.Cu")
    (tstamp 0a86b711-927e-4db5-873c-efaef77c1fac)
    (at 129.21 80.54 -90)
    (descr "Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "LCSC" "C15684")
    (property "Sheetfile" "IMU6.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Unpolarized capacitor")
    (property "ki_keywords" "cap capacitor")
    (path "/9d403993-0bed-4d67-b867-a55916cd3538")
    (attr smd)
    (fp_text reference "C3" (at 0 0.77 90) (layer "F.SilkS")
        (effects (font (size 0.5 0.5) (thickness 0.0625)))
      (tstamp b70a97dc-21de-4fa4-940a-c10f181295d4)
    )
    (fp_text value "1 uF" (at 0 1.16 90) (layer "F.Fab")
        (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 1ac32382-29ac-447d-86b7-6d5e45d4676f)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
        (effects (font (size 0.25 0.25) (thickness 0.04)))
      (tstamp 0b6a7154-94b8-4704-a9f9-3f018f11113d)
    )
    (fp_line (start -1.08 -0.46) (end 1.08 -0.46)
      (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp badc48b6-7b43-4984-ab67-3bf44293e5a0))
    (fp_line (start -1.08 0.46) (end -1.08 -0.46)
      (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp d6987988-e307-465b-8715-1bf5c610dc17))
    (fp_line (start 1.08 -0.46) (end 1.08 0.46)
      (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp e21a6622-4ee8-46e8-a306-e7fa9e2ce685))
    (fp_line (start 1.08 0.46) (end -1.08 0.46)
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    (fp_line (start -0.5 -0.25) (end 0.5 -0.25)
      (stroke (width 0.1) (type solid)) (layer "F.Fab") (tstamp 559fe2da-ece9-4451-b685-c8c3f8f594e2))
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      (stroke (width 0.1) (type solid)) (layer "F.Fab") (tstamp 41d92375-6dce-4400-8039-b043c2d83c8b))
    (fp_line (start 0.5 -0.25) (end 0.5 0.25)
      (stroke (width 0.1) (type solid)) (layer "F.Fab") (tstamp 86def106-df36-4af9-885d-1bffa5397179))
    (fp_line (start 0.5 0.25) (end -0.5 0.25)
      (stroke (width 0.1) (type solid)) (layer "F.Fab") (tstamp a5e741d3-1abe-4475-b1c4-9b0d9d5e4f46))
    (pad "1" smd roundrect (at -0.5675 0 270) (size 0.735 0.62) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "+3.3V") (pintype "passive") (tstamp 388325a1-3823-40f5-a827-0ba905795d91))
    (pad "2" smd roundrect (at 0.5675 0 270) (size 0.735 0.62) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND") (pintype "passive") (tstamp ad6a900b-a1d7-4d91-825b-9ea5cf39a0c1))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0402_1005Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "MasterThesis_library:THT_Small" (layer "F.Cu")
    (tstamp 0ce09445-8537-4b99-83ce-b2470db4101d)
    (at 131.67 82.11 65)
    (property "Sheetfile" "IMU6.kicad_sch")
    (property "Sheetname" "")
    (path "/5206fe0e-c7a0-4700-a0b3-338e8ee25e2f")
    (attr through_hole)
    (fp_text reference "SDA1" (at 0 -1.7 65 unlocked) (layer "F.SilkS") hide
        (effects (font (size 1 1) (thickness 0.1)))
      (tstamp 311fee3c-4d61-49a1-86ce-20f0e5206f95)
    )
    (fp_text value "~" (at 0 2.4 65 unlocked) (layer "F.Fab")
        (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 4999514b-a983-4c51-a969-631417dc68a8)
    )
    (fp_text user "${REFERENCE}" (at 0 3.9 65 unlocked) (layer "F.Fab")
        (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 6d8a629b-3d68-4a8b-a13c-c0fc22df8d3e)
    )
    (pad "1" thru_hole oval (at 0 0 65) (size 2 1.53) (drill 1.02) (layers "*.Cu" "*.Mask")
      (net 7 "/SDA") (pinfunction "1") (pintype "bidirectional") (solder_mask_margin 0.102) (tstamp 4710eef4-8504-4396-a03e-6ce010a2da99))
  )

  (footprint "MasterThesis_library:THT_Small" (layer "F.Cu")
    (tstamp 2275317e-8d83-4342-9014-e6b79f5b7180)
    (at 131.57 78.71 115)
    (property "Sheetfile" "IMU6.kicad_sch")
    (property "Sheetname" "")
    (path "/e126d7af-234c-4a24-a051-a0631d6d7fdc")
    (attr through_hole)
    (fp_text reference "SCL1" (at 0 -1.7 115 unlocked) (layer "F.SilkS") hide
        (effects (font (size 1 1) (thickness 0.1)))
      (tstamp f5e8517b-4e97-41fb-b652-05bf152adc6e)
    )
    (fp_text value "~" (at 0 2.4 115 unlocked) (layer "F.Fab")
        (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 7e105c87-fa34-447d-816e-06f8a3b1836e)
    )
    (fp_text user "${REFERENCE}" (at 0 3.9 115 unlocked) (layer "F.Fab")
        (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 1b417493-69b4-4353-89fa-e8bc63e05b06)
    )
    (pad "1" thru_hole oval (at 0 0 115) (size 2 1.53) (drill 1.02) (layers "*.Cu" "*.Mask")
      (net 3 "/SCL") (pinfunction "1") (pintype "bidirectional") (solder_mask_margin 0.102) (tstamp d2816dfb-63e5-4eba-aeb3-7c2b7fdc9ed1))
  )

  (footprint "MasterThesis_library:LSM6DSOXTR" (layer "F.Cu")
    (tstamp 4ef29388-af66-4a85-9b53-302832dfe965)
    (at 128.67 77.91)
    (property "LCSC" "C481766")
    (property "MANUFACTURER" "ST Microelectronics")
    (property "PARTREV" "3.0")
    (property "STANDARD" "IPC7351B")
    (property "Sheetfile" "IMU6.kicad_sch")
    (property "Sheetname" "")
    (path "/d53f0e18-b2f3-491f-aeb7-9db12cc77e2e")
    (attr smd)
    (fp_text reference "IC2" (at -0.01 -1.93) (layer "F.SilkS")
        (effects (font (size 0.6 0.6) (thickness 0.075)))
      (tstamp eb2551e2-aaf2-4387-9efc-98025fb3ed03)
    )
    (fp_text value "LSM6DSOXTR" (at -0.05 2.25) (layer "F.Fab") hide
        (effects (font (size 0.64 0.64) (thickness 0.15)))
      (tstamp d47e944a-0c72-45c7-b0d7-9f5d1c99cbc5)
    )
    (fp_text user "." (at -2.4 -0.45) (layer "F.SilkS")
        (effects (font (size 1.63576 1.63576) (thickness 0.14224)) (justify left bottom))
      (tstamp e1629b53-6eb5-419f-a917-705c8525f610)
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    (fp_line (start -1.652 -1.394) (end -1.652 -0.759)
      (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp de91f619-4f32-401b-827a-bea0354e3c95))
    (fp_line (start -1.652 0.765) (end -1.652 1.4)
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    (fp_line (start 1.499 -1.247) (end 1.499 1.253)
      (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp dcd9d51c-dd59-4543-bfef-1a3690845e88))
    (fp_line (start 1.499 1.253) (end -1.501 1.253)
      (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 5fcf5a04-0b0d-47f6-b523-28cffef9f530))
    (pad "1" smd rect (at -1.1635 -0.747) (size 0.475 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 8 "Net-(IC2-SDO{slash}SA0)") (pinfunction "SDO/SA0") (pintype "bidirectional") (solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp cb712dbb-3c9d-4559-bcc8-c8c87047f451))
    (pad "2" smd rect (at -1.1635 -0.247) (size 0.475 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 10 "unconnected-(IC2-SDX-Pad2)") (pinfunction "SDX") (pintype "bidirectional+no_connect") (solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp c4d2d64a-5474-4f01-9ea3-05ce436dda3c))
    (pad "3" smd rect (at -1.1635 0.253) (size 0.475 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "unconnected-(IC2-SCX-Pad3)") (pinfunction "SCX") (pintype "bidirectional+no_connect") (solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp f1e4fbad-9146-4736-aded-04077c3661a2))
    (pad "4" smd rect (at -1.1635 0.753) (size 0.475 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "unconnected-(IC2-INT1-Pad4)") (pinfunction "INT1") (pintype "output+no_connect") (solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp 5f1d11be-c445-48a8-9156-340ea2083e63))
    (pad "5" smd rect (at -0.501 0.9155 90) (size 0.475 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3.3V") (pinfunction "VDDIO") (pintype "power_in") (solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp 19151fe0-9165-4c3f-81be-3e19de2e0b0c))
    (pad "6" smd rect (at -0.001 0.9155 90) (size 0.475 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "GND") (pintype "power_in") (solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp 6e27c028-fa59-494f-9641-e6f65f2ada9c))
    (pad "7" smd rect (at 0.499 0.9155 90) (size 0.475 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "GND__1") (pintype "power_in") (solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp 8b6c9466-23bd-43c5-96e4-2680b233977c))
    (pad "8" smd rect (at 1.1615 0.753 180) (size 0.475 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3.3V") (pinfunction "VDD") (pintype "power_in") (solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp 8e7ada47-b5dd-4be2-b3b0-1c2716f23c30))
    (pad "9" smd rect (at 1.1615 0.253 180) (size 0.475 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "unconnected-(IC2-INT2-Pad9)") (pinfunction "INT2") (pintype "output+no_connect") (solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp ffdc387a-a813-4be1-80cf-bca5f4d675d6))
    (pad "10" smd rect (at 1.1615 -0.247 180) (size 0.475 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "unconnected-(IC2-OCS_AUX-Pad10)") (pinfunction "OCS_AUX") (pintype "bidirectional+no_connect") (solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp 03d0410e-25a3-4887-bf25-bf541c48cf60))
    (pad "11" smd rect (at 1.1615 -0.747 180) (size 0.475 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "unconnected-(IC2-SDO_AUX-Pad11)") (pinfunction "SDO_AUX") (pintype "bidirectional+no_connect") (solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp 9f389f28-d599-4488-94c7-2e7e4bdfd3bc))
    (pad "12" smd rect (at 0.499 -0.9095 270) (size 0.475 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+3.3V") (pinfunction "CS") (pintype "input") (solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp bce488dd-a8f0-4b84-b3a5-193699be5e5d))
    (pad "13" smd rect (at -0.001 -0.9095 270) (size 0.475 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "/SCL") (pinfunction "SCL") (pintype "input") (solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp c87a2570-c9e2-48ff-a1ca-8ac43b8548ea))
    (pad "14" smd rect (at -0.501 -0.9095 270) (size 0.475 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 7 "/SDA") (pinfunction "SDA") (pintype "bidirectional") (solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp d370a60c-710b-4e39-97c2-4f84bdddeb33))
    (model ":KICAD_THESIS_DIR:PCB/PCB library/3Dmodels/LSM6DSOXTR.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0402_1005Metric_Pad0.74x0.62mm_HandSolder" (layer "F.Cu")
    (tstamp 92f04abd-c857-43f3-9c38-6384749ceebe)
    (at 130.35 80.54 90)
    (descr "Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "LCSC" "C60474")
    (property "Sheetfile" "IMU6.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Unpolarized capacitor")
    (property "ki_keywords" "cap capacitor")
    (path "/50d03f3d-38e5-4f68-aadd-f03e0d53cd4e")
    (attr smd)
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