(kicad_pcb (version 20260206) (generator "pcbnew") (generator_version "10.0") (general (thickness 0.11) (legacy_teardrops no) ) (paper "A4") (title_block (title "OpenBikeComputer - USB flex interconnect") (rev "A") (company "OpenBikeComputer") ) (layers (0 "F.Cu" signal) (2 "B.Cu" signal) (9 "F.Adhes" user "F.Adhesive") (11 "B.Adhes" user "B.Adhesive") (13 "F.Paste" user) (15 "B.Paste" user) (5 "F.SilkS" user "F.Silkscreen") (7 "B.SilkS" user "B.Silkscreen") (1 "F.Mask" user) (3 "B.Mask" user) (17 "Dwgs.User" user "User.Drawings") (19 "Cmts.User" user "User.Comments") (21 "Eco1.User" user "User.Eco1") (23 "Eco2.User" user "User.Eco2") (25 "Edge.Cuts" user) (27 "Margin" user) (31 "F.CrtYd" user "F.Courtyard") (29 "B.CrtYd" user "B.Courtyard") (35 "F.Fab" user) (33 "B.Fab" user) (39 "User.1" user) (41 "User.2" user) (43 "User.3" user) (45 "User.4" user) ) (setup (stackup (layer "F.SilkS" (type "Top Silk Screen") (color "White") ) (layer "F.Paste" (type "Top Solder Paste") ) (layer "F.Mask" (type "Top Solder Mask") (color "Yellow") (thickness 0.0275) ) (layer "F.Cu" (type "copper") (thickness 0.012) ) (layer "dielectric 1" (type "core") (thickness 0.025) (material "Polyimide - supplier confirmation pending") (epsilon_r 3.4) (loss_tangent 0.002) ) (layer "B.Cu" (type "copper") (thickness 0.012) ) (layer "B.Mask" (type "Bottom Solder Mask") (color "Yellow") (thickness 0.0275) ) (layer "B.Paste" (type "Bottom Solder Paste") ) (layer "B.SilkS" (type "Bottom Silk Screen") (color "White") ) (copper_finish "ENIG") (dielectric_constraints no) (edge_connector yes) (castellated_pads no) (edge_plating no) ) (pad_to_mask_clearance 0) (allow_soldermask_bridges_in_footprints no) (tenting (front yes) (back yes) ) (covering (front no) (back no) ) (plugging (front no) (back no) ) (capping no) (filling no) (aux_axis_origin 100 100) (pcbplotparams (layerselection 0x00000000_00000000_55555555_5755f5ff) (plot_on_all_layers_selection 0x00000000_00000000_00000000_00000000) (disableapertmacros no) (usegerberextensions no) (usegerberattributes yes) (usegerberadvancedattributes yes) (creategerberjobfile yes) (dashed_line_dash_ratio 12) (dashed_line_gap_ratio 3) (svgprecision 4) (plotframeref no) (mode 1) (useauxorigin no) (pdf_front_fp_property_popups yes) (pdf_back_fp_property_popups yes) (pdf_metadata yes) (pdf_single_document no) (dxfpolygonmode yes) (dxfimperialunits yes) (dxfusepcbnewfont yes) (psnegative no) (psa4output no) (plot_black_and_white yes) (sketchpadsonfab no) (plotpadnumbers no) (hidednponfab no) (sketchdnponfab yes) (crossoutdnponfab yes) (subtractmaskfromsilk no) (outputformat 1) (mirror no) (drillshape 1) (scaleselection 1) (outputdirectory "") ) ) (footprint "obc:FPC_12_P0.5_FH12_Tail" (layer "F.Cu") (uuid "278f8679-6377-4558-913a-4d5afe5bb744") (at 129.043619 100 -90) (descr "FH12-12S contact-side pattern: pin 1 at +X; 6.5mm tail; 0.35mm fingers at 0.5mm pitch; contacts start 0.5mm from tip; 3.5mm exposed length; 4.5mm B-side stiffener; finished mating thickness 0.30 +/-0.05mm.") 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No paste stencil.") (attr smd exclude_from_pos_files exclude_from_bom allow_soldermask_bridges) (duplicate_pad_numbers_are_jumpers no) (fp_rect (start -1.2 2.25) (end 1.2 -2.25) (stroke (width 0) (type default) ) (fill yes) (layer "B.Mask") (uuid "bd77214f-88fb-4fbc-bec2-2eb475210756") ) (pad "1" smd rect (at 0 1.75 180) (size 2.2 0.8) (layers "B.Cu" "B.Mask") (solder_mask_margin 0) (uuid "def198a3-91aa-43d3-9260-71b18ccd91d6") (net "/GND") ) (pad "2" smd rect (at 0 0.95 180) (size 2.2 0.4) (layers "B.Cu" "B.Mask") (solder_mask_margin 0) (uuid "7a91a48d-baac-47c7-bd4e-b57de698d35d") (net "/CC1") ) (pad "3" smd rect (at 0 0.3 180) (size 2.2 0.35) (layers "B.Cu" "B.Mask") (solder_mask_margin 0) (uuid "7b4eea7f-3a16-4088-b6ed-68550f4dd208") (net "/USB_DP") ) (pad "4" smd rect (at 0 -0.3 180) (size 2.2 0.35) (layers "B.Cu" "B.Mask") (solder_mask_margin 0) (uuid "8ccdae07-6226-4c8b-b718-d10e1b9eece5") (net "/USB_DM") ) (pad "5" smd rect (at 0 -0.95 180) (size 2.2 0.4) (layers "B.Cu" "B.Mask") (solder_mask_margin 0) (uuid "1faa355a-5bbe-4f04-aeee-f5c8f5007f45") (net "/CC2") ) (pad "6" smd rect (at 0 -1.75 180) (size 2.2 0.8) (layers "B.Cu" "B.Mask") (solder_mask_margin 0) (uuid "4f6d22f3-b6eb-4b6a-bd7f-412138def586") (net "/VBUS") ) (embedded_fonts no) (uuid "3fd8989f-f457-48f9-8097-b103b810eee9") (property "Reference" "J1" (at 0 4.5 180) (layer "B.Fab") (hide yes) (uuid "22354323-4219-4795-8160-2fc7767a3932") (effects (font (size 0.6 0.6) (thickness 0.1) ) (justify mirror) ) ) (property "Value" "FROM USB DAUGHTERBOARD" (at 0 -5.5 180) (layer "B.Fab") (hide yes) (uuid "a9b389ee-5289-4370-8e8b-dd5c50eb99f2") (effects (font (size 0.6 0.6) (thickness 0.1) ) (justify mirror) ) ) (property "Datasheet" "" (at 0 0 180) (layer "B.Fab") (hide yes) (uuid "8de4705f-f62e-4ab9-827a-cc0801ed1b07") (effects (font (size 1.27 1.27) ) (justify mirror) ) ) (property "Description" "Six-net solder overlap between the rigid USB board and the separate flex" (at 0 0 180) (layer "B.Fab") (hide yes) 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B-side stiffener: 4.5mm long.\nFinished mating end: 0.30 +/-0.05mm; width 6.50 +/-0.07mm.\nJ1 B.Cu solder overlap / J2 F.Cu contacts.\nBend regions: R1.4mm neutral axis; R1.345mm inside.\nRouting and supplier stackup approval are pending." (at 114 109 0) (layer "Dwgs.User") (uuid "0d8cec19-2983-407c-bffa-b83ddf30ec07") (effects (font (size 0.7 0.7) (thickness 0.1) ) ) ) (zone (layers "F.Cu" "B.Cu") (uuid "1467cc16-a373-41b7-b42e-2be4dfd6e512") (name "Bend 1 - R1.4 neutral; no vias or pads") (hatch edge 0.5) (connect_pads (clearance 0) ) (min_thickness 0.25) (keepout (tracks allowed) (vias not_allowed) (pads not_allowed) (copperpour allowed) (footprints not_allowed) ) (placement (enabled no) (sheetname "") ) (fill (thermal_gap 0.5) (thermal_bridge_width 0.5) (island_removal_mode 0) ) (polygon (pts (xy 106.35 99.95) (xy 108.549114 99.95) (xy 108.549114 95.55) (xy 106.35 95.55) ) ) ) (zone (layers "F.Cu" "B.Cu") (uuid "d57a07cd-fcd1-4747-8c33-1d7e6bfb67c0") (name "Bend 2 - R1.4 neutral; no vias or pads") (hatch edge 0.5) (connect_pads (clearance 0) ) (min_thickness 0.25) (keepout (tracks allowed) (vias not_allowed) (pads not_allowed) (copperpour allowed) (footprints not_allowed) ) (placement (enabled no) (sheetname "") ) (fill (thermal_gap 0.5) (thermal_bridge_width 0.5) (island_removal_mode 0) ) (polygon (pts (xy 112.944504 99.95) (xy 115.143619 99.95) (xy 115.143619 95.55) (xy 112.944504 95.55) ) ) ) (embedded_fonts no) )