(kicad_pcb (version 20211014) (generator pcbnew)

  (general
    (thickness 1.6)
  )

  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )

  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask true)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "gerber/")
    )
  )

  (net 0 "")
  (net 1 "VCC")
  (net 2 "A18")
  (net 3 "A17")
  (net 4 "A14")
  (net 5 "A13")
  (net 6 "A8")
  (net 7 "A9")
  (net 8 "A11")
  (net 9 "/OE")
  (net 10 "A10")
  (net 11 "CE")
  (net 12 "D7")
  (net 13 "D6")
  (net 14 "D5")
  (net 15 "D4")
  (net 16 "D3")
  (net 17 "GND")
  (net 18 "D2")
  (net 19 "D1")
  (net 20 "D0")
  (net 21 "A0")
  (net 22 "A1")
  (net 23 "A2")
  (net 24 "A3")
  (net 25 "A4")
  (net 26 "A5")
  (net 27 "A6")
  (net 28 "A7")
  (net 29 "A12")
  (net 30 "A15")
  (net 31 "A16")
  (net 32 "WE")
  (net 33 "VPP")

  (footprint "TestPoint:TestPoint_Pad_1.0x1.0mm" (layer "F.Cu")
    (tedit 6213B07A) (tstamp 66be11ae-87a1-49e8-9658-2e28226d318e)
    (at 108.13 58.83)
    (descr "SMD rectangular pad as test Point, square 1.0mm side length")
    (tags "test point SMD pad rectangle square")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 -1.448) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp a54357be-14d7-412a-bddc-d4823b0b7f94)
    )
    (fp_text value "TestPoint_Pad_1.0x1.0mm" (at 0 1.55) (layer "F.Fab") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp a3f7018e-e0b7-4600-af57-ddc299628b49)
    )
    (fp_text user "${REFERENCE}" (at 0 -1.45) (layer "F.Fab") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 38fe07ef-e16d-4c2a-9382-c56da4e5e045)
    )
    (fp_line (start -0.7 -0.7) (end 0.7 -0.7) (layer "F.SilkS") (width 0.12) (tstamp 68ab11e8-b6f0-40fd-9b9f-0b2f7a31ba79))
    (fp_line (start 0.7 -0.7) (end 0.7 0.7) (layer "F.SilkS") (width 0.12) (tstamp 8fcb54fc-0b34-4c20-98ce-9d3cb15b738c))
    (fp_line (start 0.7 0.7) (end -0.7 0.7) (layer "F.SilkS") (width 0.12) (tstamp 976b21da-cc31-4cc0-b69b-5f44d316adf8))
    (fp_line (start -0.7 0.7) (end -0.7 -0.7) (layer "F.SilkS") (width 0.12) (tstamp fd71566f-fee0-4039-8f01-60725d7b7dc8))
    (fp_line (start -1 -1) (end -1 1) (layer "F.CrtYd") (width 0.05) (tstamp 248a12d4-0aab-405b-a118-bff423d35aa5))
    (fp_line (start -1 -1) (end 1 -1) (layer "F.CrtYd") (width 0.05) (tstamp 553dc39d-05cf-404a-8bd9-de8410794297))
    (fp_line (start 1 1) (end -1 1) (layer "F.CrtYd") (width 0.05) (tstamp 7aa68e38-42b7-44c8-9f86-6f50a7874c1c))
    (fp_line (start 1 1) (end 1 -1) (layer "F.CrtYd") (width 0.05) (tstamp 7fc7f9e6-93a7-45e6-8450-6d461d913b69))
    (pad "" smd rect (at 0 0) (size 1 1) (layers "F.Cu" "F.Mask")
      (net 32 "WE") (tstamp 7b5bcc39-14b6-4cce-8ac4-9ba41a9c2b00))
  )

  (footprint "Package_SO:TSOP-I-32_18.4x8mm_P0.5mm" (layer "F.Cu")
    (tedit 62144712) (tstamp a1c9fa32-fbce-4a57-8a6d-fc0ca4274e1d)
    (at 113.925 58.9 -90)
    (descr "TSOP I, 32 pins, 18.4x8mm body (https://www.micron.com/~/media/documents/products/technical-note/nor-flash/tn1225_land_pad_design.pdf, http://www.fujitsu.com/downloads/MICRO/fma/pdfmcu/f32pm25.pdf)")
    (tags "TSOP I 32")
    (attr smd)
    (fp_text reference "REF**" (at 0 -5 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp b0edb420-1663-47ed-a30f-84c5ba70e2a6)
    )
    (fp_text value "TSOP-I-32_18.4x8mm_P0.5mm" (at 0 5 90) (layer "F.Fab") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp aaff3d66-9581-454b-926f-c57b76005e74)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 15d55e6d-9060-4642-89d1-d07ea430320e)
    )
    (fp_line (start 9.2 -4.12) (end -10.2 -4.12) (layer "F.SilkS") (width 0.1) (tstamp 1a41d2d8-eb97-42d6-99b9-202ebcfcdbc8))
    (fp_line (start -9.2 4.12) (end 9.2 4.12) (layer "F.SilkS") (width 0.12) (tstamp 430f6ad1-bb05-4532-8456-e0d8f5563b8e))
    (fp_line (start 10.55 -4.25) (end 10.55 4.25) (layer "F.CrtYd") (width 0.05) (tstamp 35f44a91-dd47-43b8-b2e1-f3f92239bc97))
    (fp_line (start 10.55 4.25) (end -10.55 4.25) (layer "F.CrtYd") (width 0.05) (tstamp 5d9bb233-d754-4293-9e4b-1295338b10e0))
    (fp_line (start -10.55 -4.25) (end 10.55 -4.25) (layer "F.CrtYd") (width 0.05) (tstamp 8c665d66-7043-4f24-b591-3787c78902e2))
    (fp_line (start -10.55 4.25) (end -10.55 -4.25) (layer "F.CrtYd") (width 0.05) (tstamp a58d02b5-9eb1-4260-9399-2f667e87473a))
    (fp_line (start 9.2 -4) (end 9.2 4) (layer "F.Fab") (width 0.1) (tstamp 41389701-49f8-41d7-a3df-362cef1be994))
    (fp_line (start -8.2 -4) (end 9.2 -4) (layer "F.Fab") (width 0.1) (tstamp 449ea357-1663-4f56-bb1b-d1c41499837e))
    (fp_line (start -8.2 -4) (end -9.2 -3) (layer "F.Fab") (width 0.1) (tstamp d3cc8bab-1088-45d3-9c44-36bfa5df921f))
    (fp_line (start 9.2 4) (end -9.2 4) (layer "F.Fab") (width 0.1) (tstamp d6dba6ae-d838-4f62-a9da-a0ad16ee06ec))
    (fp_line (start -9.2 4) (end -9.2 -3) (layer "F.Fab") (width 0.1) (tstamp f139fe69-369a-4a56-969c-b0699ff1607e))
    (pad "1" smd rect (at -9.75 -3.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 8 "A11") (tstamp 8c9c7577-9bfb-4875-b7fa-22140af2a7ec))
    (pad "2" smd rect (at -9.75 -3.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 7 "A9") (tstamp b90b0d3d-1a47-4a43-8c79-a20c3ff9ddfc))
    (pad "3" smd rect (at -9.75 -2.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "A8") (tstamp e03e67d6-96e2-4311-a0fa-3770a2e1f36e))
    (pad "4" smd rect (at -9.75 -2.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 5 "A13") (tstamp e40566bd-358a-4046-964c-78b8551728c2))
    (pad "5" smd rect (at -9.75 -1.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "A14") (tstamp b4d14dcb-56f6-45e3-a696-8c7767c8ef0b))
    (pad "6" smd rect (at -9.75 -1.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "A17") (tstamp a2974a54-1774-400a-ad36-fab9e3fc4a3c))
    (pad "7" smd rect (at -9.75 -0.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "WE") (tstamp 5df557e3-2e80-42c8-819e-a7277dc2b7b3))
    (pad "8" smd rect (at -9.75 -0.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "VCC") (tstamp e562c733-c1d8-47c1-aaca-052a54a75eb3))
    (pad "9" smd rect (at -9.75 0.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "A18") (tstamp 6d37dea3-75e1-49c0-9514-44253aa2cfd4))
    (pad "10" smd rect (at -9.75 0.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 31 "A16") (tstamp 63c9ea16-05bc-4e8d-ba60-aeafdba32ab6))
    (pad "11" smd rect (at -9.75 1.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 30 "A15") (tstamp 1acf5582-352f-43bc-bd42-0be9bf2fcd51))
    (pad "12" smd rect (at -9.75 1.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 29 "A12") (tstamp 88747afb-3e37-4fb3-9c46-f7475d5129cb))
    (pad "13" smd rect (at -9.75 2.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 28 "A7") (tstamp b1faaa2d-9964-4a12-89f1-7f814303252c))
    (pad "14" smd rect (at -9.75 2.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 27 "A6") (tstamp 3e48d2f8-4ac5-4ebf-8b04-642e7535ea4a))
    (pad "15" smd rect (at -9.75 3.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 26 "A5") (tstamp 731ff715-89d6-4666-bbf7-9018090166ee))
    (pad "16" smd rect (at -9.75 3.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 25 "A4") (tstamp b7ede69c-719d-4a3e-977e-6b4e4c5e39dd))
    (pad "17" smd rect (at 9.75 3.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 24 "A3") (tstamp 898c4d08-c194-43c4-9c9e-92e0e53b4af8))
    (pad "18" smd rect (at 9.75 3.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 23 "A2") (tstamp 98817988-30cf-4546-ba90-45637ce861a8))
    (pad "19" smd rect (at 9.75 2.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 22 "A1") (tstamp b6fe169d-eb34-410a-a680-0bde0a0fda56))
    (pad "20" smd rect (at 9.75 2.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 21 "A0") (tstamp f541095d-d65b-4abf-ba68-80de8d9b64d5))
    (pad "21" smd rect (at 9.75 1.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 20 "D0") (tstamp 25dfea08-65cf-48ec-a05b-031a8296520e))
    (pad "22" smd rect (at 9.75 1.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 19 "D1") (tstamp d9d8f8c4-8a03-48cf-9c7b-4e44ccc5f886))
    (pad "23" smd rect (at 9.75 0.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 18 "D2") (tstamp 8aacf44c-adc3-439a-9fc2-c9487d14a838))
    (pad "24" smd rect (at 9.75 0.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 17 "GND") (tstamp 0763925c-1837-4b94-b36f-97e7fa7caca5))
    (pad "25" smd rect (at 9.75 -0.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 16 "D3") (tstamp d5b7172d-a298-4cca-9717-93dfaa4b99e7))
    (pad "26" smd rect (at 9.75 -0.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "D4") (tstamp b308e671-8cad-4ee0-912a-81d2dd16b66b))
    (pad "27" smd rect (at 9.75 -1.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "D5") (tstamp 65d0f0fa-4a0b-4735-90ae-7d709ab09aad))
    (pad "28" smd rect (at 9.75 -1.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "D6") (tstamp 602b97ac-bc3a-4031-8e17-a80b0917954f))
    (pad "29" smd rect (at 9.75 -2.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "D7") (tstamp 947c73dd-e03d-48bc-8500-0055e465b7f0))
    (pad "30" smd rect (at 9.75 -2.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "CE") (tstamp ef69be87-edc4-4a06-b197-816c48550f72))
    (pad "31" smd rect (at 9.75 -3.25 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 10 "A10") (tstamp dc34ec03-d3ab-47cd-9571-1e5ae9ab6b97))
    (pad "32" smd rect (at 9.75 -3.75 270) (size 1.1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 9 "/OE") (tstamp 639c605a-b57b-4caf-8ac7-10b500771d8f))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TSOP-I-32_18.4x8mm_P0.5mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 621F9DCB) (tstamp ebc4415c-8d4a-421a-8be3-ffc1aa524126)
    (at 108.05 54.94 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference "REF**" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 193e919a-c460-4fb7-9c3e-fd639131023b)
    )
    (fp_text value "R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (at 0 1.43 90) (layer "F.Fab") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 0ce9cc78-df9b-4060-98e7-f7490b8e9cd0)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab") hide
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 68f4e72b-a890-47b0-8f3f-e8d32a954350)
    )
    (fp_line (start -0.254724 -0.5225) (end 0.254724 -0.5225) (layer "F.SilkS") (width 0.12) (tstamp ae02a797-fc2f-41d1-bd99-a9d040fc5b6e))
    (fp_line (start -0.254724 0.5225) (end 0.254724 0.5225) (layer "F.SilkS") (width 0.12) (tstamp ae8e6a57-da88-4fc2-a435-e3e6aa3bc05e))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 0c2735a5-d0a3-4460-89e2-7c0f8b7b8eb7))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 52343ac2-4969-42df-af1e-ed7deb794aea))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp e23133d0-f8d3-4954-9ba7-66f5ffe9589f))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp ffc4c81d-43da-4c7e-9e8a-6d97b9020ba5))
    (fp_line (start -0.8 0.4125) (end -0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 04d90da3-abb8-4261-a30e-0573c14c30cb))
    (fp_line (start 0.8 0.4125) (end -0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp 099ecb97-3df4-4f7a-ae82-6f5f72579f60))
    (fp_line (start 0.8 -0.4125) (end 0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp 1538e725-d385-4b5a-8db8-b54abefda181))
    (fp_line (start -0.8 -0.4125) (end 0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp aea8ebdd-24cc-48f6-a569-93b1b6a74142))
    (pad "" smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "WE") (tstamp 09a932de-1c91-4c68-b7e2-a313cdf52b1c))
    (pad "" smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "VCC") (tstamp 76610d91-facf-4235-900b-9058d28275cf))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Package_SO:TSOP-I-32_11.8x8mm_P0.5mm" (layer "F.Cu")
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