(kicad_pcb (version 20221018) (generator pcbnew)

  (general
    (thickness 1.6)
  )

  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )

  (setup
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 4)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )

  (net 0 "")
  (net 1 "3.3V")
  (net 2 "CHIP_PU")
  (net 3 "GND")
  (net 4 "LNA_IN")
  (net 5 "32K_XP")
  (net 6 "32K_XN")
  (net 7 "34")
  (net 8 "35")
  (net 9 "39")
  (net 10 "38")
  (net 11 "36")
  (net 12 "37")
  (net 13 "CAP_10N")
  (net 14 "15")
  (net 15 "14")
  (net 16 "13")
  (net 17 "12")
  (net 18 "FLASH_SWP")
  (net 19 "FLASH_SHD")
  (net 20 "FLASH_SDI")
  (net 21 "FLASH_SDO")
  (net 22 "FLASH_SCK")
  (net 23 "FLASH_SCS")
  (net 24 "N$11")
  (net 25 "FLASH_VDD")
  (net 26 "27")
  (net 27 "26")
  (net 28 "22")
  (net 29 "21")
  (net 30 "19")
  (net 31 "18")
  (net 32 "16")
  (net 33 "5")
  (net 34 "4")
  (net 35 "2")
  (net 36 "U0RXD")
  (net 37 "U0TXD")
  (net 38 "25")
  (net 39 "TRACE_ANT")
  (net 40 "DTR")
  (net 41 "V_USB")
  (net 42 "D-")
  (net 43 "D+")
  (net 44 "VUSB-RAW")
  (net 45 "N$7")
  (net 46 "N$8")
  (net 47 "3.3V_F")
  (net 48 "VIN")
  (net 49 "RTS")
  (net 50 "SHIELD")
  (net 51 "N$9")
  (net 52 "N$14")
  (net 53 "V_BATT")
  (net 54 "N$16")
  (net 55 "N$10")
  (net 56 "N$12")
  (net 57 "N$13")
  (net 58 "N$15")
  (net 59 "0")
  (net 60 "17")
  (net 61 "N$2")
  (net 62 "N$3")
  (net 63 "N$17")
  (net 64 "23")
  (net 65 "N$1")
  (net 66 "N$4")

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    )
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    (fp_line (start -1.6 -0.7) (end 1.6 -0.7)
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    (pad "1" smd rect (at -0.85 0 270) (size 1.1 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 41 "V_USB") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8072a7f9-5638-4cab-b0aa-c0611e215dcb))
    (pad "2" smd rect (at 0.85 0 270) (size 1.1 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "GND") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5a1fa530-01a1-4596-8906-d1ca1771b688))
  )

  (footprint "esp32-thing:0603" (layer "F.Cu")
    (tstamp 0bea767f-cdba-41a8-8a12-609ba3ca654f)
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    (descr "<p><b>Generic 1608 (0603) package</b></p>\n<p>0.2mm courtyard excess rounded to nearest 0.05mm.</p>")
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      (stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp 44accdc1-461d-4ecc-b598-f73c551f2aac))
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      (stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp e50390e3-130c-4466-a448-ec5cd7f059f2))
    (pad "1" smd rect (at -0.85 0 180) (size 1.1 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "GND") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7af0b8cb-c49f-4bbb-99ff-12ec5b1bcc06))
    (pad "2" smd rect (at 0.85 0 180) (size 1.1 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 57 "N$13") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 592cefaa-8486-4810-ad2f-6d68985bb269))
  )

  (footprint "esp32-thing:SC70-6" (layer "F.Cu")
    (tstamp 0eb41b23-bc97-4234-b926-e5379131ba6f)
    (at 152.3111 115.4176 180)
    (descr "<h3>SC-88/SC70-6/SOT-363 6-pin Package</h3>\n<p><a href=\"http://www.onsemi.com/pub_link/Collateral/MBT3904DW1T1-D.PDF\">Example Datasheet</a></p>")
    (fp_text reference "Q2" (at 0 -1.397 180) (layer "F.SilkS")
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